IS7981A - Aðferð til að framleiða örkerfi - Google Patents

Aðferð til að framleiða örkerfi

Info

Publication number: IS7981A
Authority: IS; Iceland
Prior art keywords: microsystems; producing; producing microsystems
Prior art date: 2003-01-17

Application number

IS7981A

Other languages

English (en)

Inventor

Götzen Reiner

Original Assignee

Götzen Reiner

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2003-01-17

Filing date

2005-08-15

Publication date

2005-08-15

2005-08-15 Application filed by Götzen Reiner filed Critical Götzen Reiner

2005-08-15 Publication of IS7981A publication Critical patent/IS7981A/is

Classifications

- H10W90/00—
- H10W70/05—
- H10W70/09—
- H10W70/093—
- H10W70/60—
- H10W70/614—
- H10W70/098—
- H10W70/682—
- H10W72/07173—
- H10W72/241—
- H10W72/874—
- H10W72/9413—
- H10W90/722—
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49158—Manufacturing circuit on or in base with molding of insulated base

IS7981A 2003-01-17 2005-08-15 Aðferð til að framleiða örkerfi IS7981A (is)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
DE10301612		2003-01-17
PCT/DE2003/000419 WO2004070835A1 (de)	2003-01-17	2003-02-13	Verfahren zur herstellung von mikrosystemen

Publications (1)

Publication Number	Publication Date
IS7981A true IS7981A (is)	2005-08-15

Family

ID=32841572

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IS7981A IS7981A (is)	2003-01-17	2005-08-15	Aðferð til að framleiða örkerfi

Country Status (13)

Country	Link
US (1)	US8042267B2 (is)
EP (1)	EP1586117B1 (is)
JP (1)	JP4567466B2 (is)
KR (1)	KR100756104B1 (is)
CN (1)	CN100435331C (is)
AU (1)	AU2003214001B2 (is)
CA (1)	CA2513127C (is)
DE (1)	DE10394193D2 (is)
IS (1)	IS7981A (is)
NO (1)	NO20053151L (is)
RU (1)	RU2323504C2 (is)
TW (1)	TWI221827B (is)
WO (1)	WO2004070835A1 (is)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102006008332B4 (de) *	2005-07-11	2009-06-04	Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.	Verfahren zur Herstellung einer funktionellen Baueinheit und funktionelle Baueinheit
WO2008153674A1 (en) *	2007-06-09	2008-12-18	Boris Kobrin	Method and apparatus for anisotropic etching
US8518633B2 (en)	2008-01-22	2013-08-27	Rolith Inc.	Large area nanopatterning method and apparatus
JP5102879B2 (ja) *	2008-01-22	2012-12-19	ローイスインコーポレイテッド	大面積ナノパターン形成方法および装置
US8182982B2 (en)	2008-04-19	2012-05-22	Rolith Inc	Method and device for patterning a disk
US8192920B2 (en) *	2008-04-26	2012-06-05	Rolith Inc.	Lithography method
US20110210480A1 (en) *	2008-11-18	2011-09-01	Rolith, Inc	Nanostructures with anti-counterefeiting features and methods of fabricating the same
CN103097953A (zh)	2010-08-23	2013-05-08	罗利诗公司	近场平版印刷掩模及其制造
US9398694B2 (en)	2011-01-18	2016-07-19	Sony Corporation	Method of manufacturing a package for embedding one or more electronic components
US9763370B2 (en) *	2013-03-15	2017-09-12	National Technology & Engineering Solutions Of Sandia, Llc	Apparatus for assembly of microelectronic devices
RU2602835C9 (ru) *	2015-05-13	2017-02-02	Акционерное общество "Концерн радиостроения "Вега"	Способ экранирования в электронном модуле

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US3712735A (en) *	1970-09-25	1973-01-23	Amp Inc	Apparatus for photo etching
US4069916A (en) *	1976-06-01	1978-01-24	Western Electric Co., Inc.	Tape for holding electronic articles
US4383363A (en) *	1977-09-01	1983-05-17	Sharp Kabushiki Kaisha	Method of making a through-hole connector
DE3925455A1 (de) *	1989-08-01	1991-02-14	Robert Hanus	Belichtungsvorrichtung zum belichten eines metallkaschierten basismaterials
RU2012090C1 (ru) *	1991-05-22	1994-04-30	Научно-исследовательский институт физических проблем им.Ф.В.Лукина	Способ формирования межсоединений в матрице трехмерных полупроводниковых элементов
DE4223371A1 (de)	1992-07-16	1994-01-20	Thomson Brandt Gmbh	Verfahren und Platine zur Montage von Bauelementen
JPH06140461A (ja) *	1992-10-29	1994-05-20	Fujitsu Ltd	半導体チップの実装方法および実装構造体
DE4420996C2 (de)	1994-06-16	1998-04-09	Reiner Dipl Ing Goetzen	Verfahren und Vorrichtung zur Herstellung von mikromechanischen und mikrooptischen Bauelementen
JP3726985B2 (ja) *	1996-12-09	2005-12-14	ソニー株式会社	電子部品の製造方法
US5869395A (en) *	1997-01-22	1999-02-09	Lsi Logic Corporation	Simplified hole interconnect process
DE19721170A1 (de) *	1997-05-21	1998-11-26	Emtec Magnetics Gmbh	Verfahren und Vorrichtung zum Herstellen eines Films oder einer Schicht mit beidseitiger Oberflächenstruktur
US6833613B1 (en) *	1997-12-18	2004-12-21	Micron Technology, Inc.	Stacked semiconductor package having laser machined contacts
US6160714A (en) *	1997-12-31	2000-12-12	Elpac (Usa), Inc.	Molded electronic package and method of preparation
EP1051745B1 (en) *	1998-01-28	2007-11-07	Thin Film Electronics ASA	A method for generating electrical conducting or semiconducting structures in two or three dimensions, a method for erasing the same structures and an electric field generator/modulator for use with the method for generating
DE19826971C2 (de)	1998-06-18	2002-03-14	Reiner Goetzen	Verfahren zum mechanischen und elektrischen Verbinden von Systembauteilen
DE19847088A1 (de) *	1998-10-13	2000-05-18	Ksw Microtec Ges Fuer Angewand	Flächig ausgebildeter Träger für Halbleiter-Chips und Verfahren zu seiner Herstellung
FI990862L (fi) *	1999-04-16	2000-10-17	Jorma Kalevi Kivilahti	Uusi elektroniikan juotteeton valmistusmenetelmä
JP2001237512A (ja) *	1999-12-14	2001-08-31	Nitto Denko Corp	両面回路基板およびこれを用いた多層配線基板ならびに両面回路基板の製造方法
JP3553043B2 (ja) *	2001-01-19	2004-08-11	松下電器産業株式会社	部品内蔵モジュールとその製造方法
DE10144579C2 (de)	2001-08-07	2003-12-04	Reiner Goetzen	Verfahren und Vorrichtung zur Herstellung von Fein- bis Mikrostrukturen und/oder komplexen Mikrosystemen
WO2010144579A2 (en)	2009-06-10	2010-12-16	Baker Hughes Incorporated	Source compensated formation density measurement method by using a pulsed neutron generator

2003
- 2003-02-13 WO PCT/DE2003/000419 patent/WO2004070835A1/de not_active Ceased
- 2003-02-13 KR KR1020057013225A patent/KR100756104B1/ko not_active Expired - Fee Related
- 2003-02-13 JP JP2004567691A patent/JP4567466B2/ja not_active Expired - Fee Related
- 2003-02-13 DE DE10394193T patent/DE10394193D2/de not_active Expired - Fee Related
- 2003-02-13 RU RU2005126055/28A patent/RU2323504C2/ru not_active IP Right Cessation
- 2003-02-13 CA CA2513127A patent/CA2513127C/en not_active Expired - Fee Related
- 2003-02-13 US US10/542,237 patent/US8042267B2/en not_active Expired - Fee Related
- 2003-02-13 AU AU2003214001A patent/AU2003214001B2/en not_active Ceased
- 2003-02-13 EP EP03709608.8A patent/EP1586117B1/de not_active Expired - Lifetime
- 2003-02-13 CN CNB038258293A patent/CN100435331C/zh not_active Expired - Fee Related
- 2003-04-22 TW TW092109309A patent/TWI221827B/zh not_active IP Right Cessation
2005
- 2005-06-28 NO NO20053151A patent/NO20053151L/no not_active Application Discontinuation
- 2005-08-15 IS IS7981A patent/IS7981A/is unknown

Also Published As

Publication number	Publication date
RU2323504C2 (ru)	2008-04-27
TW200413245A (en)	2004-08-01
JP2006513581A (ja)	2006-04-20
EP1586117B1 (de)	2014-06-18
CA2513127C (en)	2010-03-30
KR20050091785A (ko)	2005-09-15
NO20053151L (no)	2005-10-14
CA2513127A1 (en)	2004-08-19
TWI221827B (en)	2004-10-11
EP1586117A1 (de)	2005-10-19
NO20053151D0 (no)	2005-06-28
AU2003214001A1 (en)	2004-08-30
WO2004070835A1 (de)	2004-08-19
KR100756104B1 (ko)	2007-09-05
US8042267B2 (en)	2011-10-25
RU2005126055A (ru)	2006-01-10
US20060072295A1 (en)	2006-04-06
CN1735965A (zh)	2006-02-15
JP4567466B2 (ja)	2010-10-20
AU2003214001B2 (en)	2007-08-02
DE10394193D2 (de)	2005-12-01
CN100435331C (zh)	2008-11-19

Publication	Publication Date	Title
BRPI0313238A2 (pt)	2016-06-21	método
CR8241A (es)	2008-10-08	Metodo para fabricar bloque de muro
FI20030241L (fi)	2004-08-18	Menetelmä synteesikaasun tuottamiseksi
NO20055459D0 (no)	2005-11-18	Prosesser
IS2979B (is)	2017-09-15	Aðferð til að framleiða N-útskipt 2-sýanópýrrólídín
IS7981A (is)	2005-08-15	Aðferð til að framleiða örkerfi
FI20030963A0 (fi)	2003-06-27	Erotusmenetelmä
FI20031433L (fi)	2005-04-04	Menetelmä valikkojen muodostamiseksi
FI20030380L (fi)	2004-09-15	Menetelmä prosessin säätämiseksi
NO20035626D0 (no)	2003-12-17	Metode
NO20035401D0 (no)	2003-12-04	Metode
NO20023358D0 (no)	2002-07-11	Metode
DE602004024308D1 (de)	2010-01-07	Immunchromatographisches verfahren
IS7339A (is)	2004-06-28	Aðferð til framleiðslu á 7alfa-metýlsterum
DE10394362D2 (de)	2006-09-21	Method for the operation of a technical system
FI20030381L (fi)	2004-09-15	Menetelmä prosessin säätämiseksi
DE112004002270D2 (de)	2006-10-19	Pupillometrisches Verfahren
IS8369A (is)	2006-03-23	Aðferð til að hreinsa terbínafín
IS8088A (is)	2005-10-24	Aðferð til að framleiða imídasópýridín-8-ón
PL359838A1 (pl)	2004-11-02	Sposób wytwarzania nano-ścieżek
EP1694837A4 (en)	2008-07-23	Method
ITMI20042151A1 (it)	2005-02-10	Procedimento per produrre acquavite
NO20035692D0 (no)	2003-12-19	Produksjonsmetode
SE0302781D0 (sv)	2003-10-21	Method
SE0300045D0 (sv)	2003-01-10	Method