IN2014DN03101A - - Google Patents
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- Publication number
- IN2014DN03101A IN2014DN03101A IN3101DEN2014A IN2014DN03101A IN 2014DN03101 A IN2014DN03101 A IN 2014DN03101A IN 3101DEN2014 A IN3101DEN2014 A IN 3101DEN2014A IN 2014DN03101 A IN2014DN03101 A IN 2014DN03101A
- Authority
- IN
- India
- Prior art keywords
- piece
- sacrificial substrate
- wafers
- mpa
- cutting
- Prior art date
Links
- 239000000463 material Substances 0.000 abstract 6
- 239000000758 substrate Substances 0.000 abstract 4
- 238000005520 cutting process Methods 0.000 abstract 3
- 235000012431 wafers Nutrition 0.000 abstract 3
- 239000011449 brick Substances 0.000 abstract 2
- 238000004026 adhesive bonding Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to a sacrificial substrate (1) having a mounting surface (2) for holding a piece of material (3) such as an ingot brick or core for cutting a plurality of wafers from the piece of material (3) wherein the sacrificial substrate (1) has an E modulus smaller than 6000 MPa more preferably smaller than 5000 MPa most preferably smaller than 4000 MPa. The invention also relates to a method of making a plurality of wafers of a piece of material (3) such as an ingot brick or core comprising the steps of: mounting the piece of material (3) to a sacrificial substrate (1) preferably by gluing; mounting the sacrificial substrate (1) with the piece of material (3) in a cutting device; and cutting the piece of material (3) into a plurality of wafers.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP11182589 | 2011-09-23 | ||
| EP11190570A EP2572850A1 (en) | 2011-09-23 | 2011-11-24 | Sacrificial substrate for use in wafer cutting |
| PCT/IB2012/054972 WO2013042055A1 (en) | 2011-09-23 | 2012-09-19 | Wafer cutting sacrificial substrate for use in wafer cutting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2014DN03101A true IN2014DN03101A (en) | 2015-05-15 |
Family
ID=45421834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN3101DEN2014 IN2014DN03101A (en) | 2011-09-23 | 2012-09-19 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP2572850A1 (en) |
| CN (1) | CN103958140B (en) |
| IN (1) | IN2014DN03101A (en) |
| WO (1) | WO2013042055A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103522428A (en) * | 2013-10-16 | 2014-01-22 | 内蒙古中环光伏材料有限公司 | Solar silicon wafer processing method and device |
| CN208374353U (en) * | 2016-10-26 | 2019-01-15 | 梅耶博格（瑞士）公司 | Scroll saw |
| CN108927908B (en) * | 2018-07-12 | 2021-01-05 | 阜宁协鑫光伏科技有限公司 | Cutting method for wire cutting machine |
| CN109808271A (en) * | 2018-12-30 | 2019-05-28 | 苏州润德新材料有限公司 | A kind of silicon wafer cutting plastic support board and preparation method thereof |
| CN110076919A (en) * | 2019-05-31 | 2019-08-02 | 江苏吉星新材料有限公司 | A kind of sapphire ingot immersion Multi-wire cutting device and method |
| CN114932636B (en) * | 2022-04-28 | 2023-10-24 | 广东先导微电子科技有限公司 | Automatic sheet taking machine |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2044482C3 (en) * | 1970-09-08 | 1979-04-12 | Cremer, Gottfried, Dr., 5000 Koeln | Process for cutting ceramic panels, especially large format panels |
| JPH1052816A (en) * | 1996-08-13 | 1998-02-24 | M Ii M C Kk | Wire-type cutting method |
| DE102007045455A1 (en) * | 2007-09-24 | 2009-04-09 | Schott Ag | Process for producing wafers from ingots |
| JP2011512036A (en) * | 2008-02-11 | 2011-04-14 | エムイーエムシー・エレクトロニック・マテリアルズ・インコーポレイテッド | Wire saw beam part reinforced with carbon nanotubes used when slicing an ingot with a wire saw into a wafer |
| ATE500940T1 (en) | 2008-04-23 | 2011-03-15 | Applied Materials Switzerland Sa | MOUNTING DISC FOR A WIRE SAW APPARATUS, WIRE SAW APPARATUS THEREFOR, AND WIRE SAWING METHOD PERFORMED WITH THE APPARATUS |
| KR20120013426A (en) | 2009-05-04 | 2012-02-14 | 마이어 부르거 아게 | Wire saw |
| MY155758A (en) * | 2010-01-06 | 2015-11-30 | Shinetsu Chemical Co | Rare earth magnet holding jig and cutting machine |
-
2011
- 2011-11-24 EP EP11190570A patent/EP2572850A1/en not_active Withdrawn
-
2012
- 2012-09-19 IN IN3101DEN2014 patent/IN2014DN03101A/en unknown
- 2012-09-19 WO PCT/IB2012/054972 patent/WO2013042055A1/en not_active Ceased
- 2012-09-19 CN CN201280057521.XA patent/CN103958140B/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013042055A1 (en) | 2013-03-28 |
| CN103958140B (en) | 2020-06-09 |
| EP2572850A1 (en) | 2013-03-27 |
| CN103958140A (en) | 2014-07-30 |
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