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IN2014DE02938A - - Google Patents

Info

Publication number
IN2014DE02938A
IN2014DE02938A IN2938DE2014A IN2014DE02938A IN 2014DE02938 A IN2014DE02938 A IN 2014DE02938A IN 2938DE2014 A IN2938DE2014 A IN 2938DE2014A IN 2014DE02938 A IN2014DE02938 A IN 2014DE02938A
Authority
IN
India
Prior art keywords
layer
alloy
larger
base material
based surface
Prior art date
Application number
Inventor
Yuki Inoue
Naoki Kato
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of IN2014DE02938A publication Critical patent/IN2014DE02938A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
    • C23C2/08—Tin or alloys based thereon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/26—After-treatment
    • C23C2/28—Thermal after-treatment, e.g. treatment in oil bath
    • C23C2/29—Cooling or quenching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/04—4 layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Thermal Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Tin-plated copper-alloy terminal material including a base material made of Cu alloy; a Sn-based surface layer formed on a surface of the base material and having an average thickness of 0.2 µm or larger and 0.6 µm or smaller; a Cu-Sn alloy layer generated between the Sn-based surface layer and the base material; and a Ni-based coating layer at an uppermost surface, formed of Ni or Ni-Sn alloy having a coating thickness of 0.005 µm or larger and 0.05 µm or smaller, in which an oil-sump depth Rvk of the Cu-Sn alloy layer measured when the Cu-Sn alloy layer is appeared on a surface by fusing and removing the Sn-based surface layer is 0.2 µm or larger; a part of the Cu-Sn alloy layer is exposed from the Sn-based surface layer; the Ni-based coating layer is formed on the exposed Cu-Sn alloy layer from the Sn-based surface layer; and dynamic friction coefficient of the surface is 0.3 or less.
IN2938DE2014 2013-10-30 2014-10-14 IN2014DE02938A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013225843 2013-10-30
JP2014171316A JP2015110829A (en) 2013-10-30 2014-08-26 Tin-plated copper alloy terminal material

Publications (1)

Publication Number Publication Date
IN2014DE02938A true IN2014DE02938A (en) 2015-07-03

Family

ID=51786858

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2938DE2014 IN2014DE02938A (en) 2013-10-30 2014-10-14

Country Status (7)

Country Link
US (1) US20150118515A1 (en)
EP (1) EP2874239A1 (en)
JP (1) JP2015110829A (en)
KR (1) KR20150050397A (en)
CN (1) CN104600459A (en)
IN (1) IN2014DE02938A (en)
TW (1) TW201527557A (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015143385A (en) * 2013-12-27 2015-08-06 三菱マテリアル株式会社 tin-plated copper alloy terminal material
MX2019006540A (en) * 2016-12-06 2019-08-01 Dowa Metaltech Co Ltd Sn plating material and production method therefor.
KR102385215B1 (en) * 2016-12-06 2022-04-08 도와 메탈테크 가부시키가이샤 Sn plating material and manufacturing method thereof
CN108155154A (en) * 2017-11-29 2018-06-12 苏州诺纳可电子科技有限公司 A kind of triode
CN108172614A (en) * 2017-11-29 2018-06-15 苏州诺纳可电子科技有限公司 A kind of electronic triode
JP7211075B2 (en) * 2018-12-27 2023-01-24 三菱マテリアル株式会社 Anti-corrosion terminal material, terminal, and wire end structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3279955A (en) * 1963-01-08 1966-10-18 Gen Motors Corp Method of forming electroplated thermoelectric junction and resultant article
JP3998731B2 (en) * 1994-08-10 2007-10-31 三菱伸銅株式会社 Manufacturing method of current-carrying member
JP2005154819A (en) 2003-11-25 2005-06-16 Kobe Steel Ltd Fitting type connection terminal
JP4503620B2 (en) 2007-01-25 2010-07-14 株式会社神戸製鋼所 Conductive material for connecting parts and method for manufacturing the same
JP2008210584A (en) * 2007-02-23 2008-09-11 Fujikura Ltd Flexible flat cable terminal
JP2010061842A (en) 2008-09-01 2010-03-18 Nisshin Steel Co Ltd Material for electrical contact component and component
US8574722B2 (en) * 2011-05-09 2013-11-05 Tyco Electronics Corporation Corrosion resistant electrical conductor
TW201311944A (en) * 2011-08-12 2013-03-16 Mitsubishi Materials Corp Tin-plated copper alloy terminal member with outstanding insertion and removal characteristics

Also Published As

Publication number Publication date
CN104600459A (en) 2015-05-06
US20150118515A1 (en) 2015-04-30
KR20150050397A (en) 2015-05-08
TW201527557A (en) 2015-07-16
JP2015110829A (en) 2015-06-18
EP2874239A1 (en) 2015-05-20

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