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IN2014DE00839A - - Google Patents

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Publication number
IN2014DE00839A
IN2014DE00839A IN839DE2014A IN2014DE00839A IN 2014DE00839 A IN2014DE00839 A IN 2014DE00839A IN 839DE2014 A IN839DE2014 A IN 839DE2014A IN 2014DE00839 A IN2014DE00839 A IN 2014DE00839A
Authority
IN
India
Prior art keywords
forming
fastener hole
cavity
circuit board
resin material
Prior art date
Application number
Inventor
Yoshida Akikazu
Echigo Masashi
Original Assignee
Denso Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denso Corp filed Critical Denso Corp
Publication of IN2014DE00839A publication Critical patent/IN2014DE00839A/en

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

In a method for manufacturing an electronic control unit, a circuit board (2) is made by forming an electronic circuit pattern (23) on a base plate member (20) and forming a.wall pattern (24, 27, 28) enclosing a planned forming region .. (211) of a fastener hole (210) on the surface (22). Moreover, the fastener hole (210) is formed in the planned forming region (211) after the making of the circuit board (2). Additionally, a resin seal member (3) is molded after the forming of the fastener hole (210) by charging a resin material (30) into a cavity (50) of a metallic mold (5) with keeping contact between the metallic mold (5) and the wall pattern(24,27, 28) and by hardening-the resin material(30) in the cavity (50).
IN839DE2014 2013-03-28 2014-03-24 IN2014DE00839A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013068411A JP6032096B2 (en) 2013-03-28 2013-03-28 Electronic control unit and manufacturing method thereof

Publications (1)

Publication Number Publication Date
IN2014DE00839A true IN2014DE00839A (en) 2015-06-19

Family

ID=51601283

Family Applications (1)

Application Number Title Priority Date Filing Date
IN839DE2014 IN2014DE00839A (en) 2013-03-28 2014-03-24

Country Status (3)

Country Link
JP (1) JP6032096B2 (en)
CN (1) CN104080306B (en)
IN (1) IN2014DE00839A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6323303B2 (en) * 2014-11-10 2018-05-16 株式会社デンソー Electronic component unit
JP6668973B2 (en) * 2016-06-28 2020-03-18 株式会社デンソー Electronic device and method of manufacturing electronic device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5433665A (en) * 1977-08-22 1979-03-12 Hitachi Ltd Manufacture for resin sealed type semiconductor device and resin sealed metal mold
JP3193194B2 (en) * 1993-07-09 2001-07-30 三菱電線工業株式会社 Method of molding lens coating layer on LED chip mounted on substrate and substrate structure for molding the same
JP3461073B2 (en) * 1995-12-08 2003-10-27 株式会社デンソー Bare chip sealing method
JP4540884B2 (en) * 2001-06-19 2010-09-08 三菱電機株式会社 Semiconductor device
JP2003100957A (en) * 2001-09-26 2003-04-04 Nec Corp Semiconductor package
JP2003179093A (en) * 2001-12-12 2003-06-27 Nissan Motor Co Ltd Semiconductor module manufacturing method and semiconductor module
JP2003283144A (en) * 2002-03-27 2003-10-03 Minolta Co Ltd Heat radiating structure of circuit board
US7166906B2 (en) * 2004-05-21 2007-01-23 Samsung Electronics Co., Ltd. Package with barrier wall and method for manufacturing the same
JP4741324B2 (en) * 2005-09-06 2011-08-03 ユニチカ株式会社 Printed board
JP2009200416A (en) * 2008-02-25 2009-09-03 Mitsubishi Electric Corp Semiconductor apparatus and method of manufacturing the same
JP5187065B2 (en) * 2008-08-18 2013-04-24 株式会社デンソー Electronic control device manufacturing method and electronic control device
JP5208099B2 (en) * 2009-12-11 2013-06-12 日立オートモティブシステムズ株式会社 Flow sensor, method for manufacturing the same, and flow sensor module
WO2012049742A1 (en) * 2010-10-13 2012-04-19 日立オートモティブシステムズ株式会社 Flow sensor and production method therefor, and flow sensor module and production method therefor
US8387457B2 (en) * 2011-01-11 2013-03-05 Delphi Technologies, Inc. Collision sensor housing and module

Also Published As

Publication number Publication date
CN104080306B (en) 2018-10-12
JP6032096B2 (en) 2016-11-24
JP2014192447A (en) 2014-10-06
CN104080306A (en) 2014-10-01

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