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IN2012DN02727A - - Google Patents

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Publication number
IN2012DN02727A
IN2012DN02727A IN2727DEN2012A IN2012DN02727A IN 2012DN02727 A IN2012DN02727 A IN 2012DN02727A IN 2727DEN2012 A IN2727DEN2012 A IN 2727DEN2012A IN 2012DN02727 A IN2012DN02727 A IN 2012DN02727A
Authority
IN
India
Prior art keywords
heat sink
metal plate
layer
bonding
solidifying
Prior art date
Application number
Other languages
English (en)
Inventor
Hiroshi Tonomura
Yoshiyuki Nagatomo
Yoshirou Kuromitsu
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of IN2012DN02727A publication Critical patent/IN2012DN02727A/en

Links

Classifications

    • H10W40/255—
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H10W40/43—
    • H10W40/47—
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/124—Metallic interlayers based on copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/36—Non-oxidic
    • C04B2237/366—Aluminium nitride
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/402—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/70—Forming laminates or joined articles comprising layers of a specific, unusual thickness
    • C04B2237/704—Forming laminates or joined articles comprising layers of a specific, unusual thickness of one or more of the ceramic layers or articles
    • H10W72/352—
    • H10W90/734—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
IN2727DEN2012 2009-09-09 2010-09-07 IN2012DN02727A (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2009208438 2009-09-09
JP2009208439 2009-09-09
JP2009252114 2009-11-02
JP2009252115 2009-11-02
PCT/JP2010/065316 WO2011030754A1 (fr) 2009-09-09 2010-09-07 Procédé de production de substrat pour module de puissance à dissipateur thermique, substrat pour module de puissance à dissipateur thermique et module de puissance

Publications (1)

Publication Number Publication Date
IN2012DN02727A true IN2012DN02727A (fr) 2015-09-11

Family

ID=43732426

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2727DEN2012 IN2012DN02727A (fr) 2009-09-09 2010-09-07

Country Status (7)

Country Link
US (1) US9076755B2 (fr)
EP (1) EP2477217B1 (fr)
KR (1) KR101690820B1 (fr)
CN (1) CN102498564B (fr)
IN (1) IN2012DN02727A (fr)
TW (1) TWI521651B (fr)
WO (1) WO2011030754A1 (fr)

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JP5918008B2 (ja) * 2012-05-08 2016-05-18 昭和電工株式会社 冷却器の製造方法
KR102051697B1 (ko) 2012-09-21 2019-12-03 미쓰비시 마테리알 가부시키가이샤 알루미늄 부재와 구리 부재의 접합 구조
CN104718616B (zh) * 2012-10-16 2017-11-14 三菱综合材料株式会社 自带散热器的功率模块用基板、自带散热器的功率模块及自带散热器的功率模块用基板的制造方法
JP6307832B2 (ja) * 2013-01-22 2018-04-11 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール
JP2014165456A (ja) * 2013-02-27 2014-09-08 Fujitsu Mobile Communications Ltd 電子機器及び電子機器のリアケース
JP6621076B2 (ja) * 2013-03-29 2019-12-18 三菱マテリアル株式会社 パワーモジュール用基板、ヒートシンク付パワーモジュール用基板及びパワーモジュール
US11574889B2 (en) * 2013-06-04 2023-02-07 Infineon Technologies Ag Power module comprising two substrates and method of manufacturing the same
JP6079505B2 (ja) * 2013-08-26 2017-02-15 三菱マテリアル株式会社 接合体及びパワーモジュール用基板
KR102232098B1 (ko) * 2013-10-10 2021-03-24 미쓰비시 마테리알 가부시키가이샤 히트 싱크가 부착된 파워 모듈용 기판 및 그 제조 방법
JP6341822B2 (ja) * 2014-09-26 2018-06-13 三菱電機株式会社 半導体装置
JP6048558B2 (ja) * 2014-10-16 2016-12-21 三菱マテリアル株式会社 冷却器付パワーモジュール用基板及びその製造方法
CN105742252B (zh) * 2014-12-09 2019-05-07 台达电子工业股份有限公司 一种功率模块及其制造方法
US9693488B2 (en) * 2015-02-13 2017-06-27 Deere & Company Electronic assembly with one or more heat sinks
JP6332108B2 (ja) * 2015-03-30 2018-05-30 三菱マテリアル株式会社 ヒートシンク付パワーモジュール用基板の製造方法
CN104779228B (zh) * 2015-04-14 2018-09-28 天津大学 一种功率半导体模块三维封装的结构和方法
DE102018111406A1 (de) * 2017-05-17 2018-11-22 Johnson Electric S.A. Motor, Leiterplatte und Motorkühlmodul mit dem Motor
KR102505443B1 (ko) * 2017-11-16 2023-03-03 삼성전기주식회사 인쇄회로기판
CN113133264B (zh) * 2019-12-30 2023-06-23 惠州视维新技术有限公司 一种散热结构、散热结构的制作方法及显示装置
EP3852138B1 (fr) 2020-01-20 2023-11-08 Infineon Technologies Austria AG Module électronique comprenant un boîtier à semi-conducteur connecté à un dissipateur thermique fluide
JP7363613B2 (ja) * 2020-03-13 2023-10-18 三菱マテリアル株式会社 ヒートシンク一体型絶縁回路基板
WO2021187464A1 (fr) * 2020-03-18 2021-09-23 三菱マテリアル株式会社 Carte de circuit isolée
TWI759199B (zh) * 2021-05-07 2022-03-21 艾姆勒車電股份有限公司 具有非矩形散熱層的散熱基材結構
KR102593733B1 (ko) * 2021-05-27 2023-10-25 주식회사 아모그린텍 히트싱크 일체형 세라믹 기판 및 그 제조방법
KR102645303B1 (ko) * 2021-07-09 2024-03-08 주식회사 아모센스 세라믹 기판 및 그 제조방법
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Also Published As

Publication number Publication date
EP2477217B1 (fr) 2019-05-08
EP2477217A1 (fr) 2012-07-18
KR20120062751A (ko) 2012-06-14
CN102498564B (zh) 2015-08-26
US9076755B2 (en) 2015-07-07
WO2011030754A1 (fr) 2011-03-17
CN102498564A (zh) 2012-06-13
TWI521651B (zh) 2016-02-11
EP2477217A4 (fr) 2018-01-24
TW201140764A (en) 2011-11-16
KR101690820B1 (ko) 2016-12-28
US20130010429A1 (en) 2013-01-10

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