[go: up one dir, main page]

IN2012DN01784A - - Google Patents

Download PDF

Info

Publication number
IN2012DN01784A
IN2012DN01784A IN1784DEN2012A IN2012DN01784A IN 2012DN01784 A IN2012DN01784 A IN 2012DN01784A IN 1784DEN2012 A IN1784DEN2012 A IN 1784DEN2012A IN 2012DN01784 A IN2012DN01784 A IN 2012DN01784A
Authority
IN
India
Prior art keywords
shielding
electrically conductive
electronic component
conductive shielding
circuit board
Prior art date
Application number
Inventor
Volker Weeber
Heinrich Barth
Ralph Schertlen
Original Assignee
Bosch Gmbh Robert
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert filed Critical Bosch Gmbh Robert
Publication of IN2012DN01784A publication Critical patent/IN2012DN01784A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H10W42/20—
    • H10W90/00—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)

Abstract

Described herein is an electronic control unit (10) comprising a housing (100, 200), wherein at least one electronic component (150, 160, 162, 164, 192, 194) is arranged on a circuit board (110, 112). The electronic control unit (10) has a unit for shielding of electrical and/or magnetic fields having an electrically conductive shielding (170, 176, 178 , 270, 278, 300, 310, 320). The shielding is arranged so that at least the electrically conductive shielding and the circuit board form a Faraday cage for at least an associated electronic component (160, 162, 164, 192, 194). Further, the electrically conductive shielding (176, 178, 278) is connected to a ground potential. In an embodiment, at least the electronic component (164, 192, 292) with its rear side, which particularly has a rear side metallization (168, 268), stands in conductive contact with at least the electrically conductive shielding (176, 178, 278).
IN1784DEN2012 2009-12-10 2010-11-25 IN2012DN01784A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102009054517A DE102009054517B4 (en) 2009-12-10 2009-12-10 Electronic control unit
PCT/EP2010/068171 WO2011069828A1 (en) 2009-12-10 2010-11-25 Electronic control device

Publications (1)

Publication Number Publication Date
IN2012DN01784A true IN2012DN01784A (en) 2015-06-05

Family

ID=43607705

Family Applications (1)

Application Number Title Priority Date Filing Date
IN1784DEN2012 IN2012DN01784A (en) 2009-12-10 2010-11-25

Country Status (6)

Country Link
US (1) US8929078B2 (en)
EP (1) EP2510765B1 (en)
CN (1) CN102656961B (en)
DE (1) DE102009054517B4 (en)
IN (1) IN2012DN01784A (en)
WO (1) WO2011069828A1 (en)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8451600B1 (en) * 2010-03-04 2013-05-28 Amazon Technologies, Inc. Heat spreading chassis for rack-mounted computer system
US9119327B2 (en) * 2010-10-26 2015-08-25 Tdk-Lambda Corporation Thermal management system and method
DE102011075308A1 (en) 2011-05-05 2012-11-08 Robert Bosch Gmbh Electronic circuit arrangement for control device in motor car, has electronic components arranged on circuit boards, where regions around components are filled with material, which has heat conductivity larger than heat conductivity of air
US9606590B2 (en) * 2011-12-22 2017-03-28 Hewlett-Packard Development Company, L.P. Heat sink base and shield
EP2820929A4 (en) 2012-03-01 2015-09-30 Autoliv Dev ELECTRONIC UNIT WITH PCB AND TWO PARTS OF HOUSING
JP5733260B2 (en) * 2012-04-09 2015-06-10 株式会社村田製作所 Power module
JP5897765B2 (en) * 2012-05-04 2016-03-30 モレックス エルエルシー Linked connector system
TW201410127A (en) * 2012-08-30 2014-03-01 鴻海精密工業股份有限公司 Electronic equipment
US9215833B2 (en) * 2013-03-15 2015-12-15 Apple Inc. Electronic device with heat dissipating electromagnetic interference shielding structures
DE102013212446A1 (en) * 2013-06-27 2015-01-15 Zf Friedrichshafen Ag Electric circuit and method for producing an electrical circuit for driving a load
EP3031309B1 (en) * 2013-08-07 2018-12-05 ABB S.p.A. Cooling apparatus for an electrical or electronic device, and electrical or electronic device, in particular a circuit breaker, comprising such cooling apparatus
JP6075267B2 (en) * 2013-10-29 2017-02-08 日立金属株式会社 Optical amplifier module
JP6278695B2 (en) * 2013-12-26 2018-02-14 株式会社デンソー Electronic control unit and electric power steering apparatus using the same
JP2016012720A (en) * 2014-06-03 2016-01-21 住友ベークライト株式会社 Metal-based mounting board and member provided with metal-based mounting board
CN105321898A (en) * 2014-06-03 2016-02-10 住友电木株式会社 Metal-based mounting board and member provided with metal-based mounting board
DE102014212540A1 (en) * 2014-06-30 2015-12-31 Robert Bosch Gmbh Vehicle with improved battery shield
DE102014217552A1 (en) * 2014-09-03 2016-03-03 Conti Temic Microelectronic Gmbh Control device for a motor vehicle and method for producing such
US20160135282A1 (en) * 2014-11-07 2016-05-12 Kabushiki Kaisha Toshiba Electronic apparatus
JP6328044B2 (en) * 2014-12-09 2018-05-23 カルソニックカンセイ株式会社 Electronic unit
DE102015001148B4 (en) 2015-01-30 2019-04-11 e.solutions GmbH Arrangement and method for electromagnetic shielding
JP6398849B2 (en) * 2015-04-06 2018-10-03 株式会社デンソー Electronic control unit
DE102015206480A1 (en) * 2015-04-10 2016-10-13 Robert Bosch Gmbh control unit
US10061363B2 (en) 2015-09-04 2018-08-28 Apple Inc. Combination parallel path heatsink and EMI shield
JP6528620B2 (en) * 2015-09-15 2019-06-12 株式会社オートネットワーク技術研究所 Circuit structure and electrical connection box
KR101998343B1 (en) * 2016-02-26 2019-07-09 삼성전자주식회사 Electronic Device having Cooling Structure
US10624240B2 (en) * 2016-04-29 2020-04-14 Hewlett Packard Enterprise Development Lp First and second shields for thermal isolation
US20180042144A1 (en) * 2016-08-03 2018-02-08 Kuei-Piao Lee Method of Cooling Electric-Vehicle Controller
DE102017212968B4 (en) * 2016-08-05 2024-02-01 Robert Bosch Gmbh HOUSING STRUCTURE FOR AN ELECTRONIC CONTROL UNIT AND PRODUCTION METHOD
DE102016115453B4 (en) * 2016-08-19 2023-10-19 Krohne Ag Measuring device with heat-conducting device, heat-conducting device and method
TWM541686U (en) * 2016-12-27 2017-05-11 微星科技股份有限公司 Electronic device
JP2019003965A (en) * 2017-06-09 2019-01-10 富士通株式会社 Electronics
EP3416467B1 (en) * 2017-06-13 2022-05-04 ABB Schweiz AG Heat exchanger structure for a rack assembly
US10299405B2 (en) * 2017-10-02 2019-05-21 Plume Design, Inc. Mid-spreader for stacked circuit boards in an electronic device
US10631438B2 (en) 2017-12-23 2020-04-21 International Business Machines Corporation Mechanically flexible cold plates for low power components
JP7016054B2 (en) * 2018-01-12 2022-02-04 パナソニックＩｐマネジメント株式会社 Power supplies, headlights, and mobiles
US10999957B2 (en) * 2018-02-12 2021-05-04 Samsung Electro-Mechanics Co., Ltd. Communication module and mounting structure thereof
WO2019159014A1 (en) * 2018-02-19 2019-08-22 Interdigital Ce Patent Holdings Heatsink assembly for an electronic device
DE102018103713A1 (en) * 2018-02-20 2019-08-22 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Mechanical and thermal system for a modular battery with power electronics components
US11122707B2 (en) * 2018-07-12 2021-09-14 Arris Enterprises Llc Raised pathway heat sink
US10496137B1 (en) * 2018-09-13 2019-12-03 Fujifilm Sonosite, Inc. Electronics board mounting system
JP6945514B2 (en) * 2018-09-20 2021-10-06 日立Astemo株式会社 Electronic control device
US20220195373A1 (en) * 2020-12-17 2022-06-23 NearField Atomics Inc. Incubator with a magnetically-quiet incubator chamber and methods of making and using
DE102021117920A1 (en) 2021-07-12 2023-01-12 Valeo Schalter Und Sensoren Gmbh Detection device for monitoring at least one monitoring area, housing for a detection device, vehicle with at least one detection device and method for producing a detection device
DE102022113505A1 (en) 2022-05-30 2023-11-30 Bayerische Motoren Werke Aktiengesellschaft Shielding plate for an assembly of a power electronics module with a support function
DE102022207567A1 (en) 2022-07-25 2024-01-25 Robert Bosch Gesellschaft mit beschränkter Haftung Electrical device, in particular control device
DE102023101875B4 (en) 2023-01-26 2026-01-15 Bayerische Motoren Werke Aktiengesellschaft Cooling device for cooling an electronic computing device for a motor vehicle as well as motor vehicles
DE102023102548A1 (en) 2023-02-02 2024-08-08 Bayerische Motoren Werke Aktiengesellschaft Guide device for guiding a temperature control medium, in particular of a motor vehicle, and motor vehicle
CN117119777B (en) * 2023-07-27 2024-09-13 重庆天概电源科技有限公司 Electromagnetic shielding device
DE102024200131A1 (en) * 2024-01-05 2025-07-10 Schaeffler Technologies AG & Co. KG Electronic control unit with molded sealing element

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4317469A1 (en) * 1993-05-26 1994-12-01 Bosch Gmbh Robert Assembly for electronic apparatuses
US5815371A (en) * 1996-09-26 1998-09-29 Dell U.S.A., L.P. Multi-function heat dissipator
EP0866648B1 (en) * 1997-03-19 2005-01-05 Telefonaktiebolaget LM Ericsson (publ) A two-part electromagnetic radiation shielding device for mounting on a printed circuit board
US6049469A (en) * 1997-08-20 2000-04-11 Dell Usa, L.P. Combination electromagnetic shield and heat spreader
US7082033B1 (en) * 1998-02-13 2006-07-25 Micron Technology, Inc. Removing heat from integrated circuit devices mounted on a support structure
US5973923A (en) * 1998-05-28 1999-10-26 Jitaru; Ionel Packaging power converters
US6367263B1 (en) * 2000-05-31 2002-04-09 Intel Corporation Integrated circuit refrigeration device
CN1976571A (en) * 2000-06-06 2007-06-06 三菱电机株式会社 Radiating structure for communicating machine
US6562655B1 (en) * 2001-04-20 2003-05-13 Amkor Technology, Inc. Heat spreader with spring IC package fabrication method
US6740959B2 (en) * 2001-08-01 2004-05-25 International Business Machines Corporation EMI shielding for semiconductor chip carriers
US6881077B2 (en) * 2002-07-22 2005-04-19 Siemens Vdo Automotive Corporation Automotive control module housing
JP4469563B2 (en) * 2003-06-05 2010-05-26 株式会社ソニー・コンピュータエンタテインメント Electronic equipment, electromagnetic wave radiation suppression member
CN100508714C (en) 2004-09-27 2009-07-01 株式会社村田制作所 Shield case
JP2006190707A (en) * 2004-12-28 2006-07-20 Toshiba Corp Electronic device and television receiver to which the electronic device is applied
JP4555119B2 (en) * 2005-02-22 2010-09-29 アルプス電気株式会社 Surface mount electronic circuit unit
CN1845666A (en) * 2005-04-07 2006-10-11 华硕电脑股份有限公司 shelter structure
KR100703090B1 (en) * 2005-08-30 2007-04-06 삼성전기주식회사 Back Ground Flip Chip Semiconductor Packages
US7651938B2 (en) * 2006-06-07 2010-01-26 Advanced Micro Devices, Inc. Void reduction in indium thermal interface material
US20080310114A1 (en) * 2007-06-18 2008-12-18 Lucent Technologies Inc. Heat-transfer device for an electromagnetic interference (emi) shield using conductive bristles
US20090002949A1 (en) 2007-06-29 2009-01-01 Lucent Technologies Inc. Heat transfer for electronic component via an electromagnetic interference (emi) shield having shield deformation
CN101150123B (en) * 2007-10-31 2010-06-02 日月光半导体制造股份有限公司 Semiconductor packaging structure with electromagnetic shielding cover
US8507319B2 (en) * 2007-12-07 2013-08-13 Stats Chippac Ltd. Integrated circuit package system with shield
TWI370722B (en) * 2008-12-22 2012-08-11 Unihan Corp Electromagnetic shielding device with heat dissipating

Also Published As

Publication number Publication date
DE102009054517B4 (en) 2011-12-29
WO2011069828A1 (en) 2011-06-16
CN102656961B (en) 2015-11-25
EP2510765A1 (en) 2012-10-17
US8929078B2 (en) 2015-01-06
US20120300405A1 (en) 2012-11-29
DE102009054517A1 (en) 2011-06-16
EP2510765B1 (en) 2013-11-06
CN102656961A (en) 2012-09-05

Similar Documents

Publication Publication Date Title
IN2012DN01784A (en)
EP3389348A3 (en) Support structure including conductive paths and electronic device having the same
PH12017501058A1 (en) Monolithic plane with electrical contacts
TW200733475A (en) Module with a built-in antenna, card-formed information device and manufacturing methods thereof
MY194783A (en) Protective circuit module case of battery and electronic device including the same
WO2011059872A3 (en) Attachment system for electrical connector
WO2010019332A3 (en) Electrical connector assembly
WO2013128297A3 (en) Watch with improved ground plane
MY190645A (en) Antenna and electronic device including the same
MY166129A (en) Electronic card having an external connector
MX2014004169A (en) Electrical terminals.
ZA202310015B (en) Electronic device including heat dissipation structure
EP2028722A3 (en) Anisotropic conductive connector and anisotropic conductive connector connection structure
WO2012085367A3 (en) Electronic circuit comprising electrical connections resistant to a severe environment
MX2016006890A (en) Metering apparatus for load centers.
TW200733843A (en) Filter and its coils connecting frame
WO2014015103A3 (en) Neurophysiological dry sensor
WO2017021008A8 (en) Electrical contact-making arrangement
ATE454731T1 (en) ELECTRICAL CONNECTOR WITH EDS PROTECTION
JP2020024962A5 (en)
WO2012007348A3 (en) Housing for an electronic circuit for a fuel pump
MX2018006070A (en) Lug assemblies and related electrical apparatus and methods.
ATE516188T1 (en) CONNECTION UNIT FOR A PRESSURE MEASUREMENT CELL
ATE556465T1 (en) ANTENNA
WO2013021119A3 (en) Electrical connection device, assembly including such a device and an electronic board, and method for electrically connecting an electronic board