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IN2013DN02549A - - Google Patents

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Publication number
IN2013DN02549A
IN2013DN02549A IN2549DEN2013A IN2013DN02549A IN 2013DN02549 A IN2013DN02549 A IN 2013DN02549A IN 2549DEN2013 A IN2549DEN2013 A IN 2549DEN2013A IN 2013DN02549 A IN2013DN02549 A IN 2013DN02549A
Authority
IN
India
Prior art keywords
semiconductor chip
trench
gap
insulating layer
polymeric filler
Prior art date
Application number
Inventor
Michael Z Su
Ahmed Gamal Refai
Bryan Black
Original Assignee
Advanced Micro Devices Inc
Ati Technologies Ulc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc, Ati Technologies Ulc filed Critical Advanced Micro Devices Inc
Publication of IN2013DN02549A publication Critical patent/IN2013DN02549A/en

Links

Classifications

    • H10W70/60—
    • H10W74/012—
    • H10W76/47—
    • H10W40/22—
    • H10W74/01—
    • H10W74/114—
    • H10W74/117—
    • H10W74/15—
    • H10W74/47—
    • H10W74/473—
    • H10W90/00—
    • H10W90/401—
    • H10W90/811—
    • H10W70/635—
    • H10W70/685—
    • H10W70/698—
    • H10W72/072—
    • H10W72/073—
    • H10W72/07311—
    • H10W72/251—
    • H10W72/856—
    • H10W72/877—
    • H10W76/17—
    • H10W90/26—
    • H10W90/28—
    • H10W90/288—
    • H10W90/297—
    • H10W90/722—
    • H10W90/724—
    • H10W90/734—

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Wire Bonding (AREA)
  • Dispersion Chemistry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Element Separation (AREA)
  • Dicing (AREA)

Abstract

A method of manufacturing is provided that includes providing a semiconductor chip (105) with an insulating layer (185). The insulating layer includes a trench (190). A second semiconductor chip (110) is stacked on the first semiconductor chip to leave a gap. A polymeric filler (187) is placed in the gap wherein a portion of the polymeric filler is drawn into the trench.
IN2549DEN2013 2010-09-09 2011-09-09 IN2013DN02549A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/878,795 US8617926B2 (en) 2010-09-09 2010-09-09 Semiconductor chip device with polymeric filler trench
PCT/US2011/051058 WO2012034052A1 (en) 2010-09-09 2011-09-09 Semiconductor chip device with polymeric filler trench

Publications (1)

Publication Number Publication Date
IN2013DN02549A true IN2013DN02549A (en) 2015-08-07

Family

ID=44654508

Family Applications (1)

Application Number Title Priority Date Filing Date
IN2549DEN2013 IN2013DN02549A (en) 2010-09-09 2011-09-09

Country Status (7)

Country Link
US (2) US8617926B2 (en)
EP (1) EP2614522B1 (en)
JP (1) JP2013537365A (en)
KR (1) KR20130140643A (en)
CN (1) CN103119702A (en)
IN (1) IN2013DN02549A (en)
WO (1) WO2012034052A1 (en)

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US20150262902A1 (en) 2014-03-12 2015-09-17 Invensas Corporation Integrated circuits protected by substrates with cavities, and methods of manufacture
US9355997B2 (en) 2014-03-12 2016-05-31 Invensas Corporation Integrated circuit assemblies with reinforcement frames, and methods of manufacture
US10020236B2 (en) * 2014-03-14 2018-07-10 Taiwan Semiconductar Manufacturing Campany Dam for three-dimensional integrated circuit
US9165793B1 (en) 2014-05-02 2015-10-20 Invensas Corporation Making electrical components in handle wafers of integrated circuit packages
US9741649B2 (en) 2014-06-04 2017-08-22 Invensas Corporation Integrated interposer solutions for 2D and 3D IC packaging
US9412806B2 (en) 2014-06-13 2016-08-09 Invensas Corporation Making multilayer 3D capacitors using arrays of upstanding rods or ridges
US9252127B1 (en) 2014-07-10 2016-02-02 Invensas Corporation Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture
US9478504B1 (en) 2015-06-19 2016-10-25 Invensas Corporation Microelectronic assemblies with cavities, and methods of fabrication
CN111586972A (en) * 2015-07-31 2020-08-25 惠普发展公司，有限责任合伙企业 Printed circuit board to mold compound joint
WO2017142817A1 (en) 2016-02-18 2017-08-24 Sxaymiq Technologies Llc Backplane structure and process for microdriver and micro led
US20180005916A1 (en) * 2016-06-30 2018-01-04 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor structure and manufacturing method thereof
US9837333B1 (en) * 2016-09-21 2017-12-05 International Business Machines Corporation Electronic package cover having underside rib
CN108022845B (en) * 2016-11-02 2020-06-26 中芯国际集成电路制造(上海)有限公司 Chip packaging method and packaging structure
US11676880B2 (en) 2016-11-26 2023-06-13 Texas Instruments Incorporated High thermal conductivity vias by additive processing
US10256188B2 (en) 2016-11-26 2019-04-09 Texas Instruments Incorporated Interconnect via with grown graphitic material
US10811334B2 (en) 2016-11-26 2020-10-20 Texas Instruments Incorporated Integrated circuit nanoparticle thermal routing structure in interconnect region
US10861763B2 (en) 2016-11-26 2020-12-08 Texas Instruments Incorporated Thermal routing trench by additive processing
US10529641B2 (en) 2016-11-26 2020-01-07 Texas Instruments Incorporated Integrated circuit nanoparticle thermal routing structure over interconnect region
US11004680B2 (en) 2016-11-26 2021-05-11 Texas Instruments Incorporated Semiconductor device package thermal conduit
US10607857B2 (en) * 2017-12-06 2020-03-31 Indium Corporation Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger
US11031317B2 (en) * 2019-10-09 2021-06-08 Toyota Motor Engineering & Manufacturing North America, Inc. Direct bonded metal substrates with encapsulated phase change materials and electronic assemblies incorporating the same
JP2024516742A (en) * 2021-05-07 2024-04-16 マテリオン コーポレイション Microelectronic package assembly and fabrication method - Patents.com
US12482719B2 (en) * 2022-12-27 2025-11-25 Nxp Usa, Inc. Low-stress thermal interface

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Also Published As

Publication number Publication date
JP2013537365A (en) 2013-09-30
EP2614522B1 (en) 2018-08-01
US8617926B2 (en) 2013-12-31
CN103119702A (en) 2013-05-22
KR20130140643A (en) 2013-12-24
US20120061852A1 (en) 2012-03-15
WO2012034052A1 (en) 2012-03-15
US20140103506A1 (en) 2014-04-17
US8866276B2 (en) 2014-10-21
EP2614522A1 (en) 2013-07-17

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