IL70632A0 - Electroless copper plating bath comprising ethylenedinitrilotetra-2-propanol(edtp)as complexer - Google Patents

Electroless copper plating bath comprising ethylenedinitrilotetra-2-propanol(edtp)as complexer

Info

Publication number: IL70632A0
Authority: IL; Israel
Prior art keywords: ethylenedinitrilotetra; complexer; edtp; propanol; plating bath
Prior art date: 1983-01-17

Application number

IL70632A

Other languages

English (en)

Original Assignee

Kollmorgen Tech Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1983-01-17

Filing date

1984-01-06

Publication date

1984-04-30

1984-01-06 Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp

1984-04-30 Publication of IL70632A0 publication Critical patent/IL70632A0/xx

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K31/00—Medicinal preparations containing organic active ingredients
- A61K31/33—Heterocyclic compounds
- A61K31/395—Heterocyclic compounds having nitrogen as a ring hetero atom, e.g. guanethidine or rifamycins
- A61K31/53—Heterocyclic compounds having nitrogen as a ring hetero atom, e.g. guanethidine or rifamycins having six-membered rings with three nitrogens as the only ring hetero atoms, e.g. chlorazanil, melamine
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61K—PREPARATIONS FOR MEDICAL, DENTAL OR TOILETRY PURPOSES
- A61K47/00—Medicinal preparations characterised by the non-active ingredients used, e.g. carriers or inert additives; Targeting or modifying agents chemically bound to the active ingredient
- A61K47/06—Organic compounds, e.g. natural or synthetic hydrocarbons, polyolefins, mineral oil, petrolatum or ozokerite
- A61K47/16—Organic compounds, e.g. natural or synthetic hydrocarbons, polyolefins, mineral oil, petrolatum or ozokerite containing nitrogen, e.g. nitro-, nitroso-, azo-compounds, nitriles, cyanates
- A61K47/18—Amines; Amides; Ureas; Quaternary ammonium compounds; Amino acids; Oligopeptides having up to five amino acids
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61P—SPECIFIC THERAPEUTIC ACTIVITY OF CHEMICAL COMPOUNDS OR MEDICINAL PREPARATIONS
- A61P33/00—Antiparasitic agents
- A61P33/02—Antiprotozoals, e.g. for leishmaniasis, trichomoniasis, toxoplasmosis

Landscapes

Chemical & Material Sciences (AREA)
Health & Medical Sciences (AREA)
Life Sciences & Earth Sciences (AREA)
Veterinary Medicine (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
General Health & Medical Sciences (AREA)
Engineering & Computer Science (AREA)
Organic Chemistry (AREA)
Pharmacology & Pharmacy (AREA)
Medicinal Chemistry (AREA)
Animal Behavior & Ethology (AREA)
Public Health (AREA)
Epidemiology (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Tropical Medicine & Parasitology (AREA)
Proteomics, Peptides & Aminoacids (AREA)
Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
Oil, Petroleum & Natural Gas (AREA)
Chemically Coating (AREA)
Electroplating Methods And Accessories (AREA)
Heat Treatment Of Water, Waste Water Or Sewage (AREA)

IL70632A 1983-01-17 1984-01-06 Electroless copper plating bath comprising ethylenedinitrilotetra-2-propanol(edtp)as complexer IL70632A0 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US45819683A	1983-01-17	1983-01-17

Publications (1)

Publication Number	Publication Date
IL70632A0 true IL70632A0 (en)	1984-04-30

Family

ID=23819761

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
IL70632A IL70632A0 (en)	1983-01-17	1984-01-06	Electroless copper plating bath comprising ethylenedinitrilotetra-2-propanol(edtp)as complexer

Country Status (13)

Country	Link
EP (1)	EP0116283A1 (de)
JP (1)	JPS59129767A (de)
KR (1)	KR840007447A (de)
AU (1)	AU1722383A (de)
BR (1)	BR8400185A (de)
CA (1)	CA1203051A (de)
CH (1)	CH660377A5 (de)
DE (1)	DE3401681C2 (de)
FR (1)	FR2539429B1 (de)
GB (1)	GB2135699A (de)
IL (1)	IL70632A0 (de)
PH (1)	PH20974A (de)
ZA (1)	ZA834937B (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
EP2305856A1 (de) *	2009-09-28	2011-04-06	ATOTECH Deutschland GmbH	Verfahren zum Aufbringen einer Metallbeschichtung auf ein nichtleitfähiges Substrat

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US2697118A (en) *	1953-07-28	1954-12-14	Wyandotte Chemicals Corp	Totally hydroxypropylated alkylene diamines
US3119709A (en) *	1956-09-28	1964-01-28	Atkinson Lab Inc	Material and method for electroless deposition of metal
US4138267A (en) *	1976-12-28	1979-02-06	Okuno Chemical Industry Company, Limited	Compositions for chemical copper plating

1983
- 1983-07-06 ZA ZA834937A patent/ZA834937B/xx unknown
- 1983-07-22 AU AU17223/83A patent/AU1722383A/en not_active Abandoned
- 1983-09-12 CA CA000436539A patent/CA1203051A/en not_active Expired
- 1983-11-14 JP JP58215904A patent/JPS59129767A/ja active Pending
1984
- 1984-01-06 IL IL70632A patent/IL70632A0/xx unknown
- 1984-01-09 PH PH301111A patent/PH20974A/en unknown
- 1984-01-10 EP EP84100181A patent/EP0116283A1/de not_active Withdrawn
- 1984-01-13 GB GB08400866A patent/GB2135699A/en not_active Withdrawn
- 1984-01-16 FR FR8400583A patent/FR2539429B1/fr not_active Expired
- 1984-01-16 KR KR1019840000148A patent/KR840007447A/ko not_active Ceased
- 1984-01-16 BR BR8400185A patent/BR8400185A/pt unknown
- 1984-01-16 DE DE3401681A patent/DE3401681C2/de not_active Expired
- 1984-01-16 CH CH181/84A patent/CH660377A5/de not_active IP Right Cessation

Also Published As

Publication number	Publication date
KR840007447A (ko)	1984-12-07
GB8400866D0 (en)	1984-02-15
BR8400185A (pt)	1984-08-21
FR2539429A1 (fr)	1984-07-20
GB2135699A (en)	1984-09-05
DE3401681C2 (de)	1985-09-19
CA1203051A (en)	1986-04-15
AU1722383A (en)	1984-07-19
FR2539429B1 (fr)	1987-03-20
EP0116283A1 (de)	1984-08-22
JPS59129767A (ja)	1984-07-26
CH660377A5 (de)	1987-04-15
DE3401681A1 (de)	1984-07-19
ZA834937B (en)	1984-03-28
PH20974A (en)	1987-06-15

Publication	Publication Date	Title
DE3473890D1 (en)	1988-10-13	Electroless copper plating solution
GB2169924B (en)	1988-07-13	Formaldehyde-free autocatalytic electroless copper plating
JPS54121233A (en)	1979-09-20	Electroless copper plating method
SG83490G (en)	1990-11-23	Improved electroless plating process
DE3474043D1 (en)	1988-10-20	Electroless copper plating bath and method
DE3570701D1 (en)	1989-07-06	Process for plating copper from electroless plating compositions
DE3367940D1 (en)	1987-01-15	Electroless copper deposition solution
EP0113395A3 (en)	1987-09-23	Monitoring electroless plating
DE3467187D1 (en)	1987-12-10	Electroless copper plating solution
DE3066952D1 (en)	1984-04-19	Electroless copper plating solution
DE3474165D1 (en)	1988-10-27	Process for activating substrates for electroless plating
GB2150948B (en)	1987-05-07	Substrate processed for electroless plating for printed-wiring pattern
GB2121444B (en)	1986-03-12	Electroless gold plating
DE3476683D1 (en)	1989-03-16	Process for electroless plating
GB2160897B (en)	1987-03-25	Electroless plating solution
GB8323183D0 (en)	1983-09-28	Electroless copper plating rate controller
DE3573139D1 (en)	1989-10-26	Electroless copper plating bath and plating method using such bath
GB2167447B (en)	1987-03-04	Cyanide free copper plating process
AU544591B2 (en)	1985-06-06	Electroless copper plating
GB8725398D0 (en)	1987-12-02	Electrolessly depositing high quality copper
GB8332205D0 (en)	1984-01-11	Non-electrolytic copper plating
IL70632A0 (en)	1984-04-30	Electroless copper plating bath comprising ethylenedinitrilotetra-2-propanol(edtp)as complexer
GB2133041B (en)	1986-01-22	Palladium electroplating bath
GB8324060D0 (en)	1983-10-12	Apparatus for electroless plating
GB2154250B (en)	1987-06-03	Complexing agent for electroless copper plating