[go: up one dir, main page]

IL268216B2 - Post etch residue cleaning compositions and methods of using the same - Google Patents

Post etch residue cleaning compositions and methods of using the same

Info

Publication number
IL268216B2
IL268216B2 IL268216A IL26821619A IL268216B2 IL 268216 B2 IL268216 B2 IL 268216B2 IL 268216 A IL268216 A IL 268216A IL 26821619 A IL26821619 A IL 26821619A IL 268216 B2 IL268216 B2 IL 268216B2
Authority
IL
Israel
Prior art keywords
type
corrosion inhibitors
ascorbic acid
cleaning composition
acid
Prior art date
Application number
IL268216A
Other languages
Hebrew (he)
Other versions
IL268216A (en
IL268216B (en
Original Assignee
Versum Mat Us Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/457,119 external-priority patent/US11091727B2/en
Application filed by Versum Mat Us Llc filed Critical Versum Mat Us Llc
Publication of IL268216A publication Critical patent/IL268216A/en
Publication of IL268216B publication Critical patent/IL268216B/en
Publication of IL268216B2 publication Critical patent/IL268216B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
    • C11D17/0008—Detergent materials or soaps characterised by their shape or physical properties aqueous liquid non soap compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/0005—Other compounding ingredients characterised by their effect
    • C11D3/0073—Anticorrosion compositions
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/20—Organic compounds containing oxygen
    • C11D3/2075—Carboxylic acids-salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
    • C11D3/16—Organic compounds
    • C11D3/26—Organic compounds containing nitrogen
    • C11D3/33—Amino carboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/261—Alcohols; Phenols
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/26—Organic compounds containing oxygen
    • C11D7/265—Carboxylic acids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3218—Alkanolamines or alkanolimines
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
    • C11D7/22—Organic compounds
    • C11D7/32—Organic compounds containing nitrogen
    • C11D7/3245—Aminoacids
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H10P70/00—
    • H10P70/20—
    • H10P70/234—
    • C—CHEMISTRY; METALLURGY
    • C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
    • C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
    • C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
    • C11D2111/10—Objects to be cleaned
    • C11D2111/14—Hard surfaces
    • C11D2111/22—Electronic devices, e.g. PCBs or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Emergency Medicine (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)

Claims (8)

1. /2 Claims: We claim: 1. A semiconductor substrate cleaning composition comprising 20 to 99.5 % by weight of water; 0.1 to 10 % by weight of oxalic acid, and 1.1 to 15 % by weight of two or three types of corrosion inhibitors selected from the following three types of corrosion inhibitors: (a) from 1 to 10 % by weight of one or more amino acids selected from the group consisting of histidine and glycine; (b) 1 to 10 % by weight of one or more non-phenolic-type organic acids, non- phenolic-type organic acid salts or other derivatives of non-phenolic-type organic acids, selected from the group consisting of ascorbic acid, 2-O-alkyl ascorbic acid ether, 3-O-alkyl ascorbic acid ether, 5-6-O-alkylidene-ascorbic acid, 2-O-alkanoyl- ascorbic acid, 3-O-alkanoyl-ascorbic acid and 6-O-alkanoyl-ascorbic acid, and (c) 0.1 to 10 % by weight of one or more of phenol and derivatives of phenol, selected from the group consisting of gallic acid, gallic acid methyl gallate, phenyl gallate, 3,4,5 triacetoxygallic acid, trimethyl gallic acid methyl ester, ethyl gallate, or gallic acid anhydride.
2. The cleaning composition of claim 1 comprising one or more of said type (a) corrosion inhibitors and one or more of said type (b) corrosion inhibitors.
3. The cleaning composition of claim 2 wherein one or more of said type (b) corrosion inhibitors comprises ascorbic acid.
4. The cleaning composition of claim 1 comprising one or more of said type (a) corrosion inhibitors and one or more of said type (c) corrosion inhibitors.
5. The cleaning composition of claim 1 comprising one or more of said type (b) corrosion inhibitors and one or more of said type (c) corrosion inhibitors. 28 268216/2
6. The cleaning composition of claim 5 wherein said one or more of said type (b) corrosion inhibitors comprises ascorbic acid.
7. The cleaning composition of claim 2 further comprising one or more of said type (c) corrosion inhibitors.
8. A method of cleaning a microelectronic device or semiconductor substrate comprising the step of: contacting one or more microelectronic device or semiconductor substrates with a composition of claim 1. 29
IL268216A 2018-07-24 2019-07-22 Post etch residue cleaning compositions and methods of using the same IL268216B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862702663P 2018-07-24 2018-07-24
US16/457,119 US11091727B2 (en) 2018-07-24 2019-06-28 Post etch residue cleaning compositions and methods of using the same

Publications (3)

Publication Number Publication Date
IL268216A IL268216A (en) 2019-11-28
IL268216B IL268216B (en) 2022-10-01
IL268216B2 true IL268216B2 (en) 2023-02-01

Family

ID=68728629

Family Applications (1)

Application Number Title Priority Date Filing Date
IL268216A IL268216B2 (en) 2018-07-24 2019-07-22 Post etch residue cleaning compositions and methods of using the same

Country Status (2)

Country Link
KR (1) KR102321217B1 (en)
IL (1) IL268216B2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015165562A (en) * 2014-02-06 2015-09-17 三菱化学株式会社 Semiconductor device substrate cleaning liquid and semiconductor device substrate cleaning method
US20150307818A1 (en) * 2010-07-16 2015-10-29 Advanced Technology Materials, Inc. Aqueous cleaner for the removal of post-etch residues
WO2016111990A1 (en) * 2015-01-05 2016-07-14 Entegris, Inc. Post chemical mechanical polishing formulations and method of use

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150307818A1 (en) * 2010-07-16 2015-10-29 Advanced Technology Materials, Inc. Aqueous cleaner for the removal of post-etch residues
JP2015165562A (en) * 2014-02-06 2015-09-17 三菱化学株式会社 Semiconductor device substrate cleaning liquid and semiconductor device substrate cleaning method
WO2016111990A1 (en) * 2015-01-05 2016-07-14 Entegris, Inc. Post chemical mechanical polishing formulations and method of use

Also Published As

Publication number Publication date
IL268216A (en) 2019-11-28
KR102321217B1 (en) 2021-11-03
IL268216B (en) 2022-10-01
KR20200011385A (en) 2020-02-03

Similar Documents

Publication Publication Date Title
MY162416A (en) Cleaning formulations and method of using the cleaning formulations
SG168509A1 (en) Semi-aqueous stripping and cleaning formulation for metal substrate and methods for using same
US10859917B2 (en) Photoresist stripper composition for manufacturing liquid crystal display
DE60028962D1 (en) COMPOSITIONS FOR CLEANING AND REMOVING ORGANIC AND PLASMA RETENTION RESIDUES ON SEMICONDUCTOR DEVICES
SG164385A1 (en) Composition useful for removal of post-etch photoresist and bottom anti- reflection coatings
AU2012242671A8 (en) Method of dissolving and/or inhibiting the deposition of scale on a surface of a system
TW200940706A (en) Methods of cleaning semiconductor devices at the back end of line using amidoxime compositions
PH12016000330A1 (en) Cleaning formulations
NO20071196L (en) Cleaning compositions for microelectronic substrates
WO2010091045A2 (en) Non-fluoride containing composition for the removal of polymers and other organic material from a surface
CN101286016A (en) Low etching photoresist cleaning agent
IL159359A (en) Aqueous buffered fluoride-containing etch residue removers and cleaners
CN104317172B (en) A kind of stripper for photoresist lift off
JP2008509554A5 (en)
PH12014500719B1 (en) Microelectronic substrate cleaning compositions having copper/azole polymer inhibition
JP2011186432A5 (en)
KR20210062762A (en) Composition of stripping solution for liquid crystal display process photoresist
JP5302334B2 (en) Anticorrosive photoresist stripper composition
WO2010099017A3 (en) Stripping compositions for cleaning ion implanted photoresist from semiconductor device wafers
JP2013091677A (en) Agent and method for releasing ship bottom-coating film
TW200502381A (en) Cleaning liquid composition for semiconductor substrate
SG152961A1 (en) Flouride-containing photoresist stripper or residue removing cleaning compositions containing conjugate oligomeric or polymeric material of alpha-hydroxycarbonyl compound/amine or ammonia reaction
CN104974589A (en) Paint remover and preparation method thereof
JP2011227448A5 (en)
IL268216B2 (en) Post etch residue cleaning compositions and methods of using the same