IL203461A - Polishing pad - Google Patents
Polishing padInfo
- Publication number
- IL203461A IL203461A IL203461A IL20346110A IL203461A IL 203461 A IL203461 A IL 203461A IL 203461 A IL203461 A IL 203461A IL 20346110 A IL20346110 A IL 20346110A IL 203461 A IL203461 A IL 203461A
- Authority
- IL
- Israel
- Prior art keywords
- polishing pad
- polishing
- grooves
- barrier region
- pad
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Description
203461/2 12 CLAIMS: 1. A polishing pad comprising: (a) a polishing layer having a polishing surface, wherein the polishing surface comprises: (1) a plurality of grooves disposed into the polishing layer a measurable depth from the polishing surface, and (2) a barrier region free of grooves, and (b) a transparent window disposed in and surrounded by the barrier region, wherein one or more of the concentric grooves are discontinuous and have a first end and a second end;, and wherein the barrier region is disposed between the first and second ends, and wherein the transparent window has an upper most window surface substantially co-planar with the polishing surface. 2. The polishing pad of claim 1, wherein the depth transitions from a maximum value to zero proximate to the barrier region. 3. The polishing pad of claim 2, wherein the depth transition is gradual. 4. The polishing pad of claim 3, wherein the polishing pad is circular and the grooves are concentric.
· The polishing pad of claim 1 , wherein the polishing layer comprises polyurethane. 6. The polishing pad of claim 1, wherein the transparent window comprises thermoplastic polyurethane. 7. The polishing pad of claim 1 , wherein the polishing pad further comprises a sub-layer. 8. A method of polishing a substrate comprising (i) providing a workpiece to be polished,
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US95629307P | 2007-08-16 | 2007-08-16 | |
| PCT/US2008/009687 WO2009025748A1 (en) | 2007-08-16 | 2008-08-13 | Polishing pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IL203461A true IL203461A (en) | 2014-11-30 |
Family
ID=40378437
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL203461A IL203461A (en) | 2007-08-16 | 2010-01-24 | Polishing pad |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20110183579A1 (en) |
| EP (1) | EP2193010B1 (en) |
| JP (1) | JP5307815B2 (en) |
| KR (1) | KR101203789B1 (en) |
| CN (1) | CN101778701B (en) |
| IL (1) | IL203461A (en) |
| MY (1) | MY154071A (en) |
| SG (1) | SG183738A1 (en) |
| TW (1) | TWI411495B (en) |
| WO (1) | WO2009025748A1 (en) |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8047899B2 (en) * | 2007-07-26 | 2011-11-01 | Macronix International Co., Ltd. | Pad and method for chemical mechanical polishing |
| US8662957B2 (en) * | 2009-06-30 | 2014-03-04 | Applied Materials, Inc. | Leak proof pad for CMP endpoint detection |
| JP5426469B2 (en) * | 2010-05-10 | 2014-02-26 | 東洋ゴム工業株式会社 | Polishing pad and glass substrate manufacturing method |
| US8657653B2 (en) | 2010-09-30 | 2014-02-25 | Nexplanar Corporation | Homogeneous polishing pad for eddy current end-point detection |
| US8628384B2 (en) * | 2010-09-30 | 2014-01-14 | Nexplanar Corporation | Polishing pad for eddy current end-point detection |
| CN102501187A (en) * | 2011-11-04 | 2012-06-20 | 厦门大学 | Polishing disk capable of adjusting regional pressure |
| US9067299B2 (en) | 2012-04-25 | 2015-06-30 | Applied Materials, Inc. | Printed chemical mechanical polishing pad |
| JP2014104521A (en) * | 2012-11-26 | 2014-06-09 | Toyo Tire & Rubber Co Ltd | Polishing pad |
| US9649742B2 (en) | 2013-01-22 | 2017-05-16 | Nexplanar Corporation | Polishing pad having polishing surface with continuous protrusions |
| CN104044087B (en) * | 2014-06-18 | 2016-09-07 | 蓝思科技股份有限公司 | A kind of sapphire polishing copper dish and repair dish method |
| CN106607749B (en) * | 2015-10-22 | 2019-01-22 | 中芯国际集成电路制造(上海)有限公司 | A kind of barrier type chemical and mechanical grinding cushion and grinding device |
| US10618141B2 (en) * | 2015-10-30 | 2020-04-14 | Applied Materials, Inc. | Apparatus for forming a polishing article that has a desired zeta potential |
| US9925637B2 (en) * | 2016-08-04 | 2018-03-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Tapered poromeric polishing pad |
| TWI595968B (en) * | 2016-08-11 | 2017-08-21 | 宋建宏 | Polishing pad and method for manufacturing the same |
| TWI650202B (en) * | 2017-08-22 | 2019-02-11 | 智勝科技股份有限公司 | Polishing pad, manufacturing method of a polishing pad and polishing method |
| US11685013B2 (en) * | 2018-01-24 | 2023-06-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing pad for chemical mechanical planarization |
| WO2020109947A1 (en) * | 2018-11-27 | 2020-06-04 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
| WO2022202008A1 (en) * | 2021-03-26 | 2022-09-29 | 富士紡ホールディングス株式会社 | Polishing pad |
| JP7659172B2 (en) * | 2021-03-26 | 2025-04-09 | 富士紡ホールディングス株式会社 | Polishing Pad |
| JP7659171B2 (en) * | 2021-03-26 | 2025-04-09 | 富士紡ホールディングス株式会社 | Polishing Pad |
| CN113246015B (en) * | 2021-05-25 | 2022-09-20 | 万华化学集团电子材料有限公司 | Polishing pad with end point detection window and application thereof |
| CN115837633A (en) * | 2022-12-08 | 2023-03-24 | 上海芯谦集成电路有限公司 | Processing method, polishing layer and polishing pad groove of detection window polishing pad |
| CN120588104B (en) * | 2025-08-08 | 2025-10-10 | 万华化学集团电子材料有限公司 | Polishing pad and wafer polishing device |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6171181B1 (en) * | 1999-08-17 | 2001-01-09 | Rodel Holdings, Inc. | Molded polishing pad having integral window |
| US8485862B2 (en) * | 2000-05-19 | 2013-07-16 | Applied Materials, Inc. | Polishing pad for endpoint detection and related methods |
| JP2002001652A (en) * | 2000-06-22 | 2002-01-08 | Nikon Corp | Polishing pad, polishing apparatus and element manufacturing method |
| EP1252973B1 (en) * | 2001-04-25 | 2008-09-10 | JSR Corporation | Polishing pad for a semiconductor wafer which has light transmitting properties |
| JP2005538571A (en) * | 2002-09-25 | 2005-12-15 | ピーピージー インダストリーズ オハイオ， インコーポレイテッド | Polishing pad with window for planarization |
| US6884156B2 (en) * | 2003-06-17 | 2005-04-26 | Cabot Microelectronics Corporation | Multi-layer polishing pad material for CMP |
| US7195539B2 (en) * | 2003-09-19 | 2007-03-27 | Cabot Microelectronics Coporation | Polishing pad with recessed window |
| US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
| JP4877448B2 (en) * | 2003-11-04 | 2012-02-15 | Ｊｓｒ株式会社 | Chemical mechanical polishing pad |
| US7442116B2 (en) * | 2003-11-04 | 2008-10-28 | Jsr Corporation | Chemical mechanical polishing pad |
| US7204742B2 (en) * | 2004-03-25 | 2007-04-17 | Cabot Microelectronics Corporation | Polishing pad comprising hydrophobic region and endpoint detection port |
| KR20060051345A (en) * | 2004-09-22 | 2006-05-19 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 | CMP pad with streamlined sight glass |
| US7182670B2 (en) * | 2004-09-22 | 2007-02-27 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | CMP pad having a streamlined windowpane |
| JP4620501B2 (en) * | 2005-03-04 | 2011-01-26 | ニッタ・ハース株式会社 | Polishing pad |
| KR20070018711A (en) * | 2005-08-10 | 2007-02-14 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | Polishing pads with windows with reduced surface irregularities |
| JP2007118106A (en) * | 2005-10-26 | 2007-05-17 | Toyo Tire & Rubber Co Ltd | Polishing pad and manufacturing method thereof |
-
2008
- 2008-07-22 TW TW097127831A patent/TWI411495B/en active
- 2008-08-13 WO PCT/US2008/009687 patent/WO2009025748A1/en not_active Ceased
- 2008-08-13 US US12/673,057 patent/US20110183579A1/en not_active Abandoned
- 2008-08-13 KR KR1020107005681A patent/KR101203789B1/en active Active
- 2008-08-13 CN CN2008801027610A patent/CN101778701B/en active Active
- 2008-08-13 SG SG2012060802A patent/SG183738A1/en unknown
- 2008-08-13 JP JP2010521026A patent/JP5307815B2/en active Active
- 2008-08-13 EP EP08795288.3A patent/EP2193010B1/en active Active
- 2008-08-13 MY MYPI2010000193A patent/MY154071A/en unknown
-
2010
- 2010-01-24 IL IL203461A patent/IL203461A/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| MY154071A (en) | 2015-04-30 |
| KR20100068255A (en) | 2010-06-22 |
| EP2193010A1 (en) | 2010-06-09 |
| WO2009025748A1 (en) | 2009-02-26 |
| EP2193010A4 (en) | 2013-10-16 |
| KR101203789B1 (en) | 2012-11-21 |
| TWI411495B (en) | 2013-10-11 |
| TW200922748A (en) | 2009-06-01 |
| CN101778701A (en) | 2010-07-14 |
| JP5307815B2 (en) | 2013-10-02 |
| SG183738A1 (en) | 2012-09-27 |
| CN101778701B (en) | 2012-06-27 |
| US20110183579A1 (en) | 2011-07-28 |
| JP2010536583A (en) | 2010-12-02 |
| EP2193010B1 (en) | 2020-01-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| KB | Patent renewed | ||
| KB | Patent renewed |