IL145808A - Slicing of single-crystal films using ion implantation - Google Patents
Slicing of single-crystal films using ion implantationInfo
- Publication number
- IL145808A IL145808A IL14580800A IL14580800A IL145808A IL 145808 A IL145808 A IL 145808A IL 14580800 A IL14580800 A IL 14580800A IL 14580800 A IL14580800 A IL 14580800A IL 145808 A IL145808 A IL 145808A
- Authority
- IL
- Israel
- Prior art keywords
- slicing
- ion implantation
- crystal films
- films
- crystal
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/08—Etching
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
- C30B29/22—Complex oxides
- C30B29/28—Complex oxides with formula A3Me5O12 wherein A is a rare earth metal and Me is Fe, Ga, Sc, Cr, Co or Al, e.g. garnets
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
- C30B29/22—Complex oxides
- C30B29/30—Niobates; Vanadates; Tantalates
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/60—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape characterised by shape
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B31/00—Diffusion or doping processes for single crystals or homogeneous polycrystalline material with defined structure; Apparatus therefor
- C30B31/20—Doping by irradiation with electromagnetic waves or by particle radiation
- C30B31/22—Doping by irradiation with electromagnetic waves or by particle radiation by ion-implantation
-
- H10P50/642—
-
- H10P90/1914—
-
- H10P90/1916—
-
- H10W10/181—
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10S117/915—Separating from substrate
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Physical Vapour Deposition (AREA)
- Weting (AREA)
- Optical Integrated Circuits (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/289,169 US6503321B2 (en) | 1998-02-17 | 1999-04-09 | Slicing of single-crystal films using ion implantation |
| PCT/US2000/009442 WO2000061841A1 (en) | 1999-04-09 | 2000-04-07 | Slicing of single-crystal films using ion implantation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IL145808A0 IL145808A0 (en) | 2002-07-25 |
| IL145808A true IL145808A (en) | 2005-03-20 |
Family
ID=23110347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IL14580800A IL145808A (en) | 1999-04-09 | 2000-04-07 | Slicing of single-crystal films using ion implantation |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US6503321B2 (xx) |
| EP (1) | EP1171653A1 (xx) |
| JP (1) | JP2002541673A (xx) |
| KR (1) | KR20010105417A (xx) |
| CN (1) | CN1371434A (xx) |
| AU (1) | AU5122600A (xx) |
| CA (1) | CA2365992A1 (xx) |
| IL (1) | IL145808A (xx) |
| MX (1) | MXPA01010112A (xx) |
| WO (1) | WO2000061841A1 (xx) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6540827B1 (en) * | 1998-02-17 | 2003-04-01 | Trustees Of Columbia University In The City Of New York | Slicing of single-crystal films using ion implantation |
| KR100796249B1 (ko) * | 1999-12-24 | 2008-01-21 | 신에쯔 한도타이 가부시키가이샤 | 접합 웨이퍼의 제조방법 |
| FR2807074B1 (fr) | 2000-04-03 | 2002-12-06 | Soitec Silicon On Insulator | Procede et dispositif de fabrication de substrats |
| EP1273035B1 (fr) | 2000-04-14 | 2012-09-12 | Soitec | Procede pour la decoupe d'au moins une couche mince dans un substrat ou lingot, notamment en materiau(x) semi-conducteur(s) |
| JP4749584B2 (ja) * | 2001-03-30 | 2011-08-17 | 株式会社豊田中央研究所 | 半導体基板の製造方法 |
| FR2842650B1 (fr) * | 2002-07-17 | 2005-09-02 | Soitec Silicon On Insulator | Procede de fabrication de substrats notamment pour l'optique, l'electronique ou l'opto-electronique |
| DE60315670T2 (de) * | 2002-07-17 | 2008-06-05 | S.O.I.Tec Silicon On Insulator Technologies | Verfahren zur herstellung von substraten, insbesondere für die optik, elektronik und optoelektronik |
| US6638872B1 (en) | 2002-09-26 | 2003-10-28 | Motorola, Inc. | Integration of monocrystalline oxide devices with fully depleted CMOS on non-silicon substrates |
| JP4653391B2 (ja) * | 2003-09-08 | 2011-03-16 | 株式会社リコー | 光制御素子の製造方法 |
| US7312092B2 (en) * | 2003-12-17 | 2007-12-25 | The Trustees Of Columbia University In The City Of New York | Methods for fabrication of localized membranes on single crystal substrate surfaces |
| KR100632460B1 (ko) * | 2005-02-03 | 2006-10-11 | 삼성전자주식회사 | 반도체 소자의 제조 방법 |
| US8124499B2 (en) * | 2006-11-06 | 2012-02-28 | Silicon Genesis Corporation | Method and structure for thick layer transfer using a linear accelerator |
| US20080188011A1 (en) * | 2007-01-26 | 2008-08-07 | Silicon Genesis Corporation | Apparatus and method of temperature conrol during cleaving processes of thick film materials |
| CN102592977B (zh) * | 2007-06-20 | 2015-03-25 | 株式会社半导体能源研究所 | 半导体装置的制造方法 |
| US20090060411A1 (en) * | 2007-09-05 | 2009-03-05 | Michigan Technological University | Planar magnetization latching in magneto-optic films |
| FR2924272B1 (fr) * | 2007-11-28 | 2010-06-11 | Commissariat Energie Atomique | Procede de transfert de films |
| DE102010030358B4 (de) * | 2010-06-22 | 2014-05-22 | Osram Opto Semiconductors Gmbh | Verfahren zum Abtrennen einer Substratscheibe |
| US9250178B2 (en) * | 2011-10-07 | 2016-02-02 | Kla-Tencor Corporation | Passivation of nonlinear optical crystals |
| CN103696022B (zh) * | 2013-12-27 | 2016-04-13 | 贵州蓝科睿思技术研发中心 | 一种离子注入分离蓝宝石的方法 |
| CN105734518B (zh) * | 2016-03-14 | 2018-04-10 | 云南科威液态金属谷研发有限公司 | 一种液态金属材料基因编辑方法 |
| US10302864B2 (en) | 2016-06-02 | 2019-05-28 | Ohio State Innovation Foundation | Method of forming a deterministic thin film from a crystal substrate by etching a bilayer bonding interface to create a channel |
| CN106222754A (zh) * | 2016-07-29 | 2016-12-14 | 成都立威讯科技有限公司 | 一种工艺精湛的蓝宝石分离方法 |
| EP3373052A1 (de) * | 2017-03-06 | 2018-09-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Halbzeug, verfahren zu dessen herstellung und damit hergestellte komponente |
| JP7127472B2 (ja) * | 2018-10-15 | 2022-08-30 | 日本電信電話株式会社 | 波長変換素子の作製方法 |
| CN109468683A (zh) * | 2018-12-19 | 2019-03-15 | 山东建筑大学 | 一种基于He离子辐照的石榴石晶体薄膜的制备方法 |
| FR3091619B1 (fr) * | 2019-01-07 | 2021-01-29 | Commissariat Energie Atomique | Procédé de guérison avant transfert d’une couche semi-conductrice |
| CN111257995A (zh) * | 2020-02-12 | 2020-06-09 | 深圳技术大学 | 一种高折射率差yag单晶异质结构薄膜波导及其制备方法 |
| CN112542379B (zh) * | 2020-12-09 | 2022-11-08 | 济南晶正电子科技有限公司 | 一种薄膜图形化工艺方法、复合薄膜及电子元器件 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3808068A (en) * | 1972-12-11 | 1974-04-30 | Bell Telephone Labor Inc | Differential etching of garnet materials |
| US5198371A (en) * | 1990-09-24 | 1993-03-30 | Biota Corp. | Method of making silicon material with enhanced surface mobility by hydrogen ion implantation |
| JP2560251B2 (ja) * | 1994-03-18 | 1996-12-04 | 工業技術院長 | シリコン単結晶自己支持薄膜の製造法 |
| US5587210A (en) * | 1994-06-28 | 1996-12-24 | The United States Of America As Represented By The Secretary Of The Navy | Growing and releasing diamonds |
| JPH1093122A (ja) * | 1996-09-10 | 1998-04-10 | Nippon Telegr & Teleph Corp <Ntt> | 薄膜太陽電池の製造方法 |
| FR2756847B1 (fr) * | 1996-12-09 | 1999-01-08 | Commissariat Energie Atomique | Procede de separation d'au moins deux elements d'une structure en contact entre eux par implantation ionique |
| US5877070A (en) * | 1997-05-31 | 1999-03-02 | Max-Planck Society | Method for the transfer of thin layers of monocrystalline material to a desirable substrate |
| TW422826B (en) * | 1997-09-25 | 2001-02-21 | Tdk Corp | Radio wave absorbent |
| US6120597A (en) * | 1998-02-17 | 2000-09-19 | The Trustees Of Columbia University In The City Of New York | Crystal ion-slicing of single-crystal films |
-
1999
- 1999-04-09 US US09/289,169 patent/US6503321B2/en not_active Expired - Lifetime
-
2000
- 2000-04-07 EP EP00935825A patent/EP1171653A1/en not_active Withdrawn
- 2000-04-07 CN CN00807479A patent/CN1371434A/zh active Pending
- 2000-04-07 CA CA002365992A patent/CA2365992A1/en not_active Abandoned
- 2000-04-07 KR KR1020017012907A patent/KR20010105417A/ko not_active Ceased
- 2000-04-07 WO PCT/US2000/009442 patent/WO2000061841A1/en not_active Ceased
- 2000-04-07 AU AU51226/00A patent/AU5122600A/en not_active Abandoned
- 2000-04-07 JP JP2000610886A patent/JP2002541673A/ja active Pending
- 2000-04-07 MX MXPA01010112A patent/MXPA01010112A/es not_active Application Discontinuation
- 2000-04-07 IL IL14580800A patent/IL145808A/xx active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| MXPA01010112A (es) | 2003-07-14 |
| CA2365992A1 (en) | 2000-10-19 |
| CN1371434A (zh) | 2002-09-25 |
| US20020053318A1 (en) | 2002-05-09 |
| JP2002541673A (ja) | 2002-12-03 |
| KR20010105417A (ko) | 2001-11-28 |
| AU5122600A (en) | 2000-11-14 |
| WO2000061841A1 (en) | 2000-10-19 |
| IL145808A0 (en) | 2002-07-25 |
| EP1171653A1 (en) | 2002-01-16 |
| US6503321B2 (en) | 2003-01-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FF | Patent granted | ||
| KB | Patent renewed | ||
| KB | Patent renewed |