IE39796B1 - A cured epoxy polymer - Google Patents
A cured epoxy polymerInfo
- Publication number
- IE39796B1 IE39796B1 IE1207/74A IE120774A IE39796B1 IE 39796 B1 IE39796 B1 IE 39796B1 IE 1207/74 A IE1207/74 A IE 1207/74A IE 120774 A IE120774 A IE 120774A IE 39796 B1 IE39796 B1 IE 39796B1
- Authority
- IE
- Ireland
- Prior art keywords
- bisphenol
- parts
- resin
- mixture
- acid
- Prior art date
Links
- 239000004593 Epoxy Substances 0.000 title 1
- 229920000642 polymer Polymers 0.000 title 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 abstract 4
- 239000000203 mixture Substances 0.000 abstract 4
- 229920005989 resin Polymers 0.000 abstract 4
- 239000011347 resin Substances 0.000 abstract 4
- 239000002253 acid Substances 0.000 abstract 3
- 239000000539 dimer Substances 0.000 abstract 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 abstract 2
- 150000008065 acid anhydrides Chemical class 0.000 abstract 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 229920000768 polyamine Polymers 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- CFQZKFWQLAHGSL-FNTYJUCDSA-N (3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e,17e)-18-[(3e,5e,7e,9e,11e,13e,15e)-octadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoyl]oxyoctadeca-3,5,7,9,11,13,15,17-octaenoic acid Chemical compound OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\OC(=O)C\C=C\C=C\C=C\C=C\C=C\C=C\C=C\C=C CFQZKFWQLAHGSL-FNTYJUCDSA-N 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 229920001577 copolymer Polymers 0.000 abstract 1
- 150000002148 esters Chemical class 0.000 abstract 1
- 239000004744 fabric Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
- H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
- C08L2666/08—Homopolymers or copolymers according to C08L7/00 - C08L21/00; Derivatives thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
1448415 Epoxy resins WESTERN ELECTRIC CO Inc 10 June 1974 [11 June 1973 19 Feb 1974 1 May 1974] 25627/74 Heading C3B A cured epoxy resin comprises: (A) an adduct of two moles of the diclygidyl ether of bisphenol A and one mole of linoleic dimer acid, a diglycidyl ester of linoleic dimer acid or a mixture thereof; (B) up to 50% by wt. based on (A) of an elastomerically modified resin obtained by reacting a diglycidyl ether of bisphenol A or of bisphenol F (or mixture thereof) with a carboxyl terminated butadiene/acrylonitrile copolymer; and (C) a minor amount of a diglycidyl ether of bisphenol A or of bisphenol F (or mixture thereof). As curing agent is employed 16-60 parts by wt. of an acid anhydride per 100 parts by wt. of resin together with 0-30 parts by wt. of a dimer acid R(COOH) 2 where R is CH 2 (CH 2 ) 5 CH 2 , or a trimer acid of stoichiometric formula C 54 H 96 O 6 , (E) a polyamine in an equimolar ratio with the resin or (F) a polyamine in an equal mole ratio combined with the acid anhydride in an amount of at least 5 parts by wt. per 100 parts by wt. of the resin component. In examples compositions according to the invention are coated on epoxy-glass cloth laminates which are subsequently sensitized and further coated with an electroless copper coating and finally electroplated with copper.
[GB1448415A]
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US36903873A | 1973-06-11 | 1973-06-11 | |
| US44364874A | 1974-02-19 | 1974-02-19 | |
| US05465376 USB465376I5 (en) | 1974-02-19 | 1974-05-01 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IE39796L IE39796L (en) | 1974-12-11 |
| IE39796B1 true IE39796B1 (en) | 1979-01-03 |
Family
ID=27408900
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IE1207/74A IE39796B1 (en) | 1973-06-11 | 1974-06-07 | A cured epoxy polymer |
Country Status (15)
| Country | Link |
|---|---|
| JP (1) | JPS544398B2 (en) |
| BR (1) | BR7404745A (en) |
| CA (1) | CA1060136A (en) |
| CH (1) | CH603725A5 (en) |
| DE (1) | DE2427030C3 (en) |
| ES (1) | ES427131A1 (en) |
| FR (1) | FR2232614B1 (en) |
| GB (1) | GB1448415A (en) |
| HK (1) | HK45977A (en) |
| IE (1) | IE39796B1 (en) |
| IL (1) | IL44997A (en) |
| IT (1) | IT1011946B (en) |
| MY (1) | MY7700290A (en) |
| NL (1) | NL162118C (en) |
| SE (1) | SE413774B (en) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS53109922A (en) * | 1977-01-29 | 1978-09-26 | Kureha Chem Ind Co Ltd | Preparation of anti-tumor polysaccharides |
| JPS53109914A (en) * | 1977-01-29 | 1978-09-26 | Kureha Chem Ind Co Ltd | Preparation of anti-tumor polysaccharides |
| JPS53109920A (en) * | 1977-01-29 | 1978-09-26 | Kureha Chem Ind Co Ltd | Preparation of anti-tumor polysaccharides |
| JPS53109918A (en) * | 1977-01-29 | 1978-09-26 | Kureha Chem Ind Co Ltd | Preparation of anti-tumor polysaccharides |
| JPS53109921A (en) * | 1977-01-29 | 1978-09-26 | Kureha Chem Ind Co Ltd | Preparation of anti-tumor polysaccharides |
| JPS53109919A (en) * | 1977-01-29 | 1978-09-26 | Kureha Chem Ind Co Ltd | Preparation of anti-tumor polysaccharides |
| JPS53109915A (en) * | 1977-01-29 | 1978-09-26 | Kureha Chem Ind Co Ltd | Preparation of anti-tumor polysaccharides |
| US4602053A (en) * | 1984-05-24 | 1986-07-22 | E. I. Du Pont De Nemours And Company | Chip-resistant paint containing epoxyester linear block oligomer |
| EP0561048B1 (en) * | 1992-03-16 | 1999-05-26 | Raytheon Company | Superior thermal transfer adhesive |
| JP2005054145A (en) | 2003-08-07 | 2005-03-03 | Mitsubishi Gas Chem Co Inc | Gas barrier (meth) acrylate resin cured product and paint, adhesive, film |
| JP4336955B2 (en) * | 2003-08-07 | 2009-09-30 | 三菱瓦斯化学株式会社 | Cyclohexanetricarboxylic acid monoester and use thereof |
| JP5670048B2 (en) * | 2009-12-21 | 2015-02-18 | 株式会社Ｄｎｐファインケミカル | Adhesive composition and method for producing curable adhesive sheet |
| JP2012256872A (en) * | 2011-05-12 | 2012-12-27 | Rohm & Haas Electronic Materials Llc | Adhesion promotion of metal to dielectric |
| CN115926110A (en) * | 2022-12-29 | 2023-04-07 | 江苏扬农锦湖化工有限公司 | A kind of modified epoxy resin and its preparation method and application |
-
1974
- 1974-05-28 CA CA201,055A patent/CA1060136A/en not_active Expired
- 1974-06-05 DE DE2427030A patent/DE2427030C3/en not_active Expired
- 1974-06-07 IE IE1207/74A patent/IE39796B1/en unknown
- 1974-06-07 SE SE7407533A patent/SE413774B/en not_active IP Right Cessation
- 1974-06-10 CH CH791074A patent/CH603725A5/xx not_active IP Right Cessation
- 1974-06-10 BR BR4745/74A patent/BR7404745A/en unknown
- 1974-06-10 ES ES427131A patent/ES427131A1/en not_active Expired
- 1974-06-10 IL IL44997A patent/IL44997A/en unknown
- 1974-06-10 IT IT68825/74A patent/IT1011946B/en active
- 1974-06-10 GB GB2562774A patent/GB1448415A/en not_active Expired
- 1974-06-10 FR FR7419964A patent/FR2232614B1/fr not_active Expired
- 1974-06-10 NL NL7407729.A patent/NL162118C/en not_active IP Right Cessation
- 1974-06-11 JP JP6565874A patent/JPS544398B2/ja not_active Expired
-
1977
- 1977-09-08 HK HK459/77A patent/HK45977A/en unknown
- 1977-12-30 MY MY290/77A patent/MY7700290A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5034094A (en) | 1975-04-02 |
| IL44997A0 (en) | 1974-09-10 |
| IL44997A (en) | 1977-05-31 |
| IE39796L (en) | 1974-12-11 |
| NL162118B (en) | 1979-11-15 |
| BR7404745A (en) | 1976-02-17 |
| HK45977A (en) | 1977-09-16 |
| FR2232614B1 (en) | 1977-09-30 |
| JPS544398B2 (en) | 1979-03-06 |
| CH603725A5 (en) | 1978-08-31 |
| SE7407533L (en) | 1974-12-12 |
| GB1448415A (en) | 1976-09-08 |
| CA1060136A (en) | 1979-08-07 |
| DE2427030C3 (en) | 1980-08-28 |
| IT1011946B (en) | 1977-02-10 |
| ES427131A1 (en) | 1976-09-01 |
| NL162118C (en) | 1980-04-15 |
| DE2427030A1 (en) | 1975-01-02 |
| SE413774B (en) | 1980-06-23 |
| MY7700290A (en) | 1977-12-31 |
| NL7407729A (en) | 1974-12-13 |
| DE2427030B2 (en) | 1979-12-20 |
| FR2232614A1 (en) | 1975-01-03 |
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