[go: up one dir, main page]

HK1235608B - Integrated circuit to control a power supply that supplies power to plurality of light-emitting diode strings - Google Patents

Integrated circuit to control a power supply that supplies power to plurality of light-emitting diode strings Download PDF

Info

Publication number
HK1235608B
HK1235608B HK17108968.2A HK17108968A HK1235608B HK 1235608 B HK1235608 B HK 1235608B HK 17108968 A HK17108968 A HK 17108968A HK 1235608 B HK1235608 B HK 1235608B
Authority
HK
Hong Kong
Prior art keywords
data
led
register
csfb
voltage
Prior art date
Application number
HK17108968.2A
Other languages
Chinese (zh)
Other versions
HK1235608A1 (en
Inventor
R‧K‧威廉斯
K‧迪安杰罗
D‧A‧布朗
Original Assignee
先进模拟科技公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 先进模拟科技公司 filed Critical 先进模拟科技公司
Publication of HK1235608A1 publication Critical patent/HK1235608A1/en
Publication of HK1235608B publication Critical patent/HK1235608B/en

Links

Description

控制向多个发光二极管串供电的电源的集成电路Integrated circuit for controlling power supply to multiple light-emitting diode strings

本申请是申请日为2012年12月6日、申请号为201280069410.0、发明名称为“具有嵌入式反馈的串行照明接口”的发明专利申请的分案申请。This application is a divisional application of the invention patent application with application date of December 6, 2012, application number 201280069410.0, and invention name “Serial Lighting Interface with Embedded Feedback”.

相关申请的交叉引用CROSS-REFERENCE TO RELATED APPLICATIONS

本申请要求于2011年12月8日提交的临时申请No.61/568,545的优先权,通过全部引用将其合并于此。This application claims priority to Provisional Application No. 61/568,545, filed December 8, 2011, which is incorporated herein by reference in its entirety.

本申请涉及以下申请,其每个通过全部引用合并于此:申请No.13/346,625,提交于2012年1月9日,题为Low Cost LED Driver with Integral Dimming Capability;申请No.13/346,647,提交于2012年1月9日,题为Low Cost LED Driver with Improved SerialBus。This application is related to the following applications, each of which is incorporated herein by reference in its entirety: Application No. 13/346,625, filed January 9, 2012, entitled Low Cost LED Driver with Integral Dimming Capability; and Application No. 13/346,647, filed January 9, 2012, entitled Low Cost LED Driver with Improved SerialBus.

技术领域Technical Field

本发明涉及半导体器件以及用于驱动照明和显示应用中的LED的电路和方法。The present invention relates to semiconductor devices and circuits and methods for driving LEDs in lighting and display applications.

背景技术Background Art

LED越来越多地用于替换照明应用中的灯和灯泡,其包括在彩色液晶显示器(LCD)和高清晰度电视(HDTV)中提供白光作为背光。为了对彩色LCD面板进行背光照明,LED串可以包括白色LED或者以可控的色温来调整以产生白光的红色、绿色以及蓝色LED的组合。尽管可以使用这些LED均匀地照明整个显示器,但是通过采用LED的多个串,其中每串被驱动到不同的电流和与该特定LED串所照射的显示器的该部分对应的亮度水平,改进了显示器的性能、对比度、可靠性和电源效率。术语“局部调光(dimming)”涉及有这样的非均匀背光亮度的背光系统。相比于采用均匀背光的LCD,功率节省可以高达50%。使用局部调光,LCD对比率(contrast ratio)可以接近等离子体TV的对比率。LEDs are increasingly being used to replace lamps and bulbs in lighting applications, including providing white light as backlighting in color liquid crystal displays (LCDs) and high-definition televisions (HDTVs). To backlight color LCD panels, LED strings can include white LEDs or a combination of red, green, and blue LEDs tuned with a controllable color temperature to produce white light. While these LEDs can be used to uniformly illuminate an entire display, the performance, contrast, reliability, and power efficiency of the display are improved by using multiple strings of LEDs, each driven to a different current and brightness level corresponding to the portion of the display illuminated by that particular LED string. The term "local dimming" refers to backlight systems with such non-uniform backlight brightness. Compared to LCDs using uniform backlighting, power savings can be as high as 50%. Using local dimming, LCD contrast ratios can approach those of plasma TVs.

为了控制从每个LED串发射的光的亮度和均匀性,必须采用特殊的电子驱动器电路来精确地控制LED电流和电压。例如,串联连接的一串“m”个白色LED需要等于近似“m”的3.1到3.5(通常是3.3)倍的电压来一致地操作。向LED串提供此所需电压通常需要称为DC到DC转换器或者开关模式电源(SMPS)的步升或者步降电压转换器和调压器(regulator)。当从单个SMPS对多个LED串供电时,电源的输出电压必须超过任何一个LED串所需的最高电压。因为所需的最高正向电压不能先验地已知,LED驱动器IC必须足够智能以使用反馈来动态地调整电源电压。如果需要两个或多个电源电压,则需要多于一个反馈信号。In order to control the brightness and uniformity of the light emitted from each LED string, special electronic driver circuits must be used to precisely control the LED current and voltage. For example, a string of "m" white LEDs connected in series requires a voltage equal to approximately 3.1 to 3.5 (usually 3.3) times "m" to operate consistently. Providing this required voltage to the LED string typically requires a step-up or step-down voltage converter and a regulator called a DC-to-DC converter or switch mode power supply (SMPS). When powering multiple LED strings from a single SMPS, the output voltage of the power supply must exceed the highest voltage required by any one LED string. Because the required highest forward voltage cannot be known a priori, the LED driver IC must be smart enough to use feedback to dynamically adjust the supply voltage. If two or more supply voltages are required, more than one feedback signal is required.

在RGB背光照明的情况下,电压反馈要求甚至更复杂,因为红色、绿色和蓝色LED具有显著不同的正向电压,并且不能够共享公共电源轨(rail)。而是,RGB LED串需要三个不同的电源电压,分别是+VRLED、+VGLED和+VBLED,其每个具有单独的反馈信号以将其相应的电源电压动态地调整到适当的电平。例如,串联的一串30个红色LED需要超过66V的电源电压来恰当地操作,而30个蓝色LED可能需要超过96V的电源电压,并且30个绿色LED需要多于108V的电源电压。In the case of RGB backlighting, voltage feedback requirements are even more complex because red, green, and blue LEDs have significantly different forward voltages and cannot share a common power rail. Instead, an RGB LED string requires three different supply voltages: + VRLED , + VGLED , and + VBLED , each with a separate feedback signal to dynamically adjust its respective supply voltage to the appropriate level. For example, a string of 30 red LEDs in series requires a supply voltage exceeding 66V to operate properly, while 30 blue LEDs may require a supply voltage exceeding 96V, and 30 green LEDs may require a supply voltage exceeding 108V.

除了向LED串提供适当的电压之外,背光驱动器还必须将每个串中传导的电流ILED精确地控制到±2%的容限。准确的电流控制是必须的,因为LED的亮度与流经其的电流成比例,并且任何实质的串与串电流不匹配将表现作为LCD的亮度的变化。除了控制电流之外,局部调光需要对LED照射在定时和持续时间两方面的精确脉冲控制,以便将每个背光区域、区带(zone)或区块(tile)的亮度与LCD屏幕中的相应图像同步。In addition to providing the proper voltage to the LED strings, the backlight driver must also precisely control the current ILED conducted in each string to a tolerance of ±2%. Accurate current control is necessary because the brightness of an LED is proportional to the current flowing through it, and any substantial string-to-string current mismatch will manifest as variations in the LCD's brightness. In addition to controlling current, local dimming requires precise pulse control of the LED illumination, both in terms of timing and duration, to synchronize the brightness of each backlight area, zone, or tile with the corresponding image on the LCD screen.

另一复杂性在于,白色LED的色温随着电流而变化。作为例子,对于100%时间传导30mA的一串白色LED在亮度上理想地等同于以50%占空比而启动(pulse on)和关闭(pulseoff)的运载60mA的相同LED串。但是,即使处于相同的亮度,色温将不相同。因此准确地设置和维持每个串中的电流对于实现对彩色LCD面板实现均匀的白色背光是至关重要的。Another complication is that the color temperature of white LEDs varies with current. As an example, a string of white LEDs conducting 30mA 100% of the time would ideally be equivalent in brightness to the same string carrying 60mA pulsed on and off at a 50% duty cycle. However, even at the same brightness, the color temperature will not be the same. Therefore, accurately setting and maintaining the current in each string is crucial to achieving uniform white backlighting for color LCD panels.

在RGB背光照射的情况下,平衡电流甚至更复杂,因为红色、蓝色和和绿色LED的光度(luminosity)即光输出或者亮度非常不同。例如,红色LED对于相同的LED电流产生比蓝色LED更少的光。差别是可理解的,因为用于制造不同颜色的LED的半导体材料和制造工艺实质上不同。In the case of RGB backlighting, balancing current is even more complex because the luminosity, or light output, or brightness, of red, blue, and green LEDs is very different. For example, a red LED produces less light than a blue LED for the same LED current. This difference is understandable because the semiconductor materials and manufacturing processes used to make LEDs of different colors are substantially different.

如在此背景技术部分中将示出的,对于局部调光的已知解决方案限制了显示亮度并且承受着高的方案成本。例如,将LED驱动器控制电路与多通道的高电压电流宿(currentsink)晶体管集成的早期尝试是有问题的,因为LED串的正向电压中的不匹配导致过量的功耗以及过热。通过降低LED电流以及限制串中的LED的数量(为了更好的通道与通道电压匹配)而最小化功耗的尝试证明是不经济的,其需要更多的LED以及更大数量的LED驱动器的通道。因此,对于LED背光驱动器的完全集成的方法已被限于小的显示器面板或者非常昂贵的“高端”HDTV。As will be shown in this background section, known solutions for local dimming limit display brightness and suffer from high solution costs. For example, early attempts to integrate LED driver control circuitry with multiple channels of high-voltage current sink transistors were problematic because mismatches in the forward voltages of the LED strings resulted in excessive power dissipation and overheating. Attempts to minimize power dissipation by reducing the LED current and limiting the number of LEDs in the string (for better channel-to-channel voltage matching) proved uneconomical, requiring more LEDs and a greater number of LED driver channels. Consequently, fully integrated approaches to LED backlight drivers have been limited to small display panels or very expensive "high-end" HDTVs.

使用多芯片方法降低整体显示背光成本的随后的尝试已经牺牲了必要的特征、功能甚至安全性。Subsequent attempts to reduce overall display backlight costs using a multi-chip approach have sacrificed necessary features, functionality, and even safety.

例如,图1所示的用于驱动LED的多芯片方案包括驱动多个离散的电流宿DMOSFET4和高电压保护设备3的接口IC 6。背光系统包括十六个LED串2A-2Q(统称为LED串2),其中,每个LED串2A-2Q包含“m”个串联的LED,其长度范围是从2到16个LED。(注意,在串2A-2Q中字母“O”已省略以避免与数字0混淆。)每个LED串具有分别由离散的电流宿DMOSFET 4A-4Q之一控制的电流。响应于经高速、昂贵的SPI总线接口11传送的来自背光微控制器(μC)7的指令,接口IC 6设置每个LED串中的电流。微控制器μC 7接收来自缩放器(scalar)IC 8的视频和图像信息以便确定每个LED串所需的适当的照明水平。For example, the multi-chip solution for driving LEDs shown in FIG1 includes an interface IC 6 that drives multiple discrete current sinks, DMOSFETs 4, and a high-voltage protection device 3. The backlight system includes sixteen LED strings 2A-2Q (collectively, LED strings 2), where each LED string 2A-2Q contains "m" series-connected LEDs, ranging in length from 2 to 16 LEDs. (Note that the letter "O" has been omitted from strings 2A-2Q to avoid confusion with the number 0.) Each LED string has a current controlled by one of the discrete current sinks, DMOSFETs 4A-4Q. Interface IC 6 sets the current in each LED string in response to commands from a backlight microcontroller (μC) 7, transmitted via a high-speed, expensive SPI bus interface 11. Microcontroller μC 7 receives video and image information from a scaler IC 8 to determine the appropriate lighting level required for each LED string.

如所示,每个LED串2A-2Q由公共LED电源轨12供电,该公共LED电源轨12由开关模式电源(SMPS)9产生,具有响应于来自接口IC 6的经反馈的电流感应反馈(CSFB)信号1而产生的电压+VLED。电源电压随着串联的LED的数量“m”而变化,并且范围可以是从用于10个LED的35伏到高达用于40个LED的串的150伏。SMPS 9可以从AC干线或者替换地从诸如+24V输入的另一输入供电。As shown, each LED string 2A-2Q is powered by a common LED power rail 12 generated by a switch mode power supply (SMPS) 9 having a voltage + VLED generated in response to a fed-back current sense feedback (CSFB) signal 1 from an interface IC 6. The supply voltage varies with the number of LEDs in series, "m", and can range from 35 volts for 10 LEDs up to 150 volts for a string of 40 LEDs. The SMPS 9 can be powered from the AC mains or, alternatively, from another input such as a +24V input.

SMPS 9通常包括以硬切换或者以准谐振模式操作的回扫式(flyback)转换器。正向转换器和Cuk转换器尽管是可应用的,但是对于服务于成本敏感的显示器和TV市场而言通常太昂贵并且不必要地复杂。在SMPS 9从+24V输入供电的情况下,其操作取决于串联连接的LED的数量。如果LED串的正向电压小于24V,例如少于7个LED的串联连接,则可以使用降压型(buck)切换调压器来实现SMPS 9。相反,如果LED串的正向电压大于24V,例如多于8个LED的串联连接,则可以使用升压型切换调压器来实现SMPS 9。The SMPS 9 typically includes a flyback converter operating in hard switching or quasi-resonant mode. Forward and Cuk converters, while applicable, are generally too expensive and unnecessarily complex to serve the cost-sensitive display and TV markets. In the case where the SMPS 9 is powered from a +24V input, its operation depends on the number of LEDs connected in series. If the forward voltage of the LED string is less than 24V, for example, if fewer than 7 LEDs are connected in series, a step-down (buck) switching regulator can be used to implement the SMPS 9. Conversely, if the forward voltage of the LED string is greater than 24V, for example, if more than 8 LEDs are connected in series, a step-up switching regulator can be used to implement the SMPS 9.

不管其输入电压如何,适当产生CSFB信号10对于实现对显示器的LED背光的可靠操作是至关重要的。如果反馈信号不正确,则LED电源电压+VLED可能太高或太低。如果LED电源电压太高,则在电流宿DMOSFET4A-4Q中将发生过度的功耗。如果LED电源电压太低,则需要最高电流的LED串就算能照明也将不能以指定的水平来照明。Proper generation of the CSFB signal 10 is crucial for achieving reliable operation of the display's LED backlight, regardless of its input voltage. If the feedback signal is incorrect, the LED supply voltage +VLED may be too high or too low. If the LED supply voltage is too high, excessive power dissipation will occur in the current sink DMOSFETs 4A-4Q. If the LED supply voltage is too low, the LED string requiring the highest current may not illuminate at the specified level, if at all.

为了实现CSFB功能,对LED串的正向电压的准确监视需要对电流宿DMOSFET 4A-4Q的漏极的电访问,这对于多芯片实现方式可能是特别有问题的,其会导致额外的封装管脚和添加的组件成本。To implement the CSFB functionality, accurate monitoring of the LED string forward voltage requires electrical access to the drains of the current sink DMOSFETs 4A-4Q, which can be particularly problematic for multi-chip implementations, resulting in additional package pins and added component cost.

使用离散的DMOSFET来实现电流宿DMOSFET 4A-4Q以避免过热。可选地采用通常是高电压离散DMOSFET的额外的离散的DMOSFET 3A-3Q以箝位跨电流宿DMOSFET 4出现的最大电压,尤其是对于较高电压、例如超过100V的操作。Current sinks DMOSFETs 4A-4Q are implemented using discrete DMOSFETs to avoid overheating. Additional discrete DMOSFETs 3A-3Q, typically high voltage discrete DMOSFETs, are optionally employed to clamp the maximum voltage appearing across current sink DMOSFET 4, especially for higher voltage operation, eg, over 100V.

组件3A-3Q的每个是单独的封装中的离散的器件,需要其唯一的拾取-放置操作以将其定位并安装在其印刷电路板上。电流宿DMOSFET、箝位MOSFET(如果有的话)以及其相关联的LED串共同被称为“通道(channel)”。Each of the components 3A-3Q is a discrete device in a separate package, requiring its own unique pick-and-place operation to position and mount it on its printed circuit board. The current sink DMOSFET, clamp MOSFET (if any), and its associated LED string are collectively referred to as a "channel."

每组离散的MOSFET 3A-3Q和DMOSFET 4A-4Q与其相应的白色LED串对于n通道LED驱动器系统重复“n”次。例如,除了SMPS模块9之外,16通道背光系统需要34个组件,即,微控制器、高管脚计数(high-pin-count)LED接口IC以及32个离散的MOSFET,以促进响应于从缩放器IC 8产生的视频信息的局部调光。该方案是复杂且昂贵的。Each set of discrete MOSFETs 3A-3Q and DMOSFETs 4A-4Q and its corresponding white LED string is repeated "n" times for an n-channel LED driver system. For example, a 16-channel backlight system requires 34 components, in addition to the SMPS module 9, namely, a microcontroller, a high-pin-count LED interface IC, and 32 discrete MOSFETs to facilitate local dimming in response to video information generated from the scaler IC 8. This solution is complex and expensive.

在某些情况下,期望将LED电力划分为多于一个电源,例如以降低任意一个电源及其组件中的功耗,但是现有技术的LED接口IC不能支持多个独立的反馈信号。在RGB背光照明显示器的情况下,解决方案甚至更复杂且昂贵。因为现在的以及现有技术的LED驱动器和控制器仅包括每个集成电路的单个CSFB信号,因此独立地调节三个不同的电源需要三个单独的LED接口IC以及三个单独的电源,使得如今的RGB背光照明解决方案惊人地昂贵。In some cases, it's desirable to split LED power across more than one power supply, for example to reduce power consumption in any one power supply and its components. However, existing LED interface ICs cannot support multiple independent feedback signals. In the case of RGB backlighting displays, the solution is even more complex and expensive. Because current and prior art LED drivers and controllers include only a single CSFB signal per integrated circuit, independently regulating three different power supplies requires three separate LED interface ICs and three separate power supplies, making today's RGB backlighting solutions prohibitively expensive.

在任一情况下,大量离散的组件的组装,即,高构建材料(BOM)数量导致昂贵的PCB组装,由高管脚数封装6的高封装成本进一步加剧这一现象。对于这样的大量的管脚的需要例示在图2A中,其例示了对于LED驱动系统的各个通道的更多电路细节。如所示,每个通道包括“m”个串联连接的LED21的串、具有集成的高电压二极管23的共源共栅箝位(cascode-clamp)MOSFET 22、电流宿MOSFET 24以及电流感应I-精确栅极驱动器电路25。In either case, the assembly of a large number of discrete components, i.e., a high bill of materials (BOM) count, results in expensive PCB assembly, further exacerbated by the high packaging cost of the high pin count package 6. The need for such a large number of pins is illustrated in FIG2A , which illustrates further circuit details for each channel of the LED driver system. As shown, each channel includes a string of "m" series-connected LEDs 21, a cascode-clamp MOSFET 22 with an integrated high-voltage diode 23, a current sink MOSFET 24, and a current-sensing, I-accurate gate driver circuit 25.

有源电流宿MOSFET 24是离散功率MOSFET,优选是垂直的DMOSFET,其具有栅极、源极和漏极连接。I-精确栅极驱动器电路25感应电流宿MOSFET24中的电流并为其提供所需的栅极驱动电压以传导精确量的电流。在正常操作中,电流宿MOSFET24在其饱和操作模式中运行,其独立于其漏极到源极电压而控制恒定水平的电流。由于漏极电压和电流的同时存在,在MOSFET24中消耗功率。Active current sink MOSFET 24 is a discrete power MOSFET, preferably a vertical DMOSFET, having gate, source, and drain connections. An I-precision gate driver circuit 25 senses the current in current sink MOSFET 24 and provides the required gate drive voltage to conduct a precise amount of current. In normal operation, current sink MOSFET 24 operates in its saturation mode, controlling a constant level of current independent of its drain-to-source voltage. Due to the simultaneous presence of drain voltage and current, power is dissipated in MOSFET 24.

出于两个目的而需要持续测量电流宿MOSFET 24的漏极电压——为了检测LED故障电路27中的短路的LED的发生,以及为了促进经过CSFB电路26向系统的SMPS的反馈。由CSFB电流26产生的信号对于将+VLED动态地调整到适当的电压是至关重要的,其足够高以保证每个LED串被点亮并且足够低以避免施加在电流宿DMOSFET 24上的导致不希望的功耗的过量电压。利用仅一个CSFB信号,不能从多于一个电源对LED供电,即不能将电力需要一分为二以降低SMPS中的尺寸、成本和发热。The drain voltage of current sink MOSFET 24 needs to be continuously measured for two purposes—to detect the occurrence of a shorted LED in LED fault circuit 27, and to facilitate feedback to the system's SMPS via CSFB circuit 26. The signal generated by CSFB current 26 is crucial for dynamically adjusting +VLED to an appropriate voltage, high enough to ensure that each LED string is illuminated and low enough to avoid excessive voltage across current sink DMOSFET 24, which would cause undesirable power dissipation. With only one CSFB signal, the LEDs cannot be powered from more than one source, i.e., the power requirement cannot be split in two to reduce size, cost, and heat generation in the SMPS.

电流宿MOSFET 24需要到控制IC、特别是到用于电流测量的源极、用于对器件偏压的栅极以及用于故障和反馈感应的漏极的三个连接。每个通道的这三个连接被绘出为与离散到IC接口28相交。甚至在图2B中,其中共源共栅箝位MOSFET 22被删除并且电流宿MOSFET24必须维持高电压,其由HV集成二极管23所示,每个通道仍需要每个通道相交接口28的三个管脚。此每通道三个接口的需求说明了对于图1所示的高管脚数接口IC 6的需要。对于十六个通道的驱动器,每通道三个管脚的需要使用48个管脚来用于输出。包括SPI总线接口、模拟功能、电源以及更多,需要高代价的64或72管脚封装。更严重的是,许多TV印刷电路板组装车间不能以小于0.8或1.27mm的任何管脚间距来焊接封装。具有0.8mm管脚间距的72管脚封装需要14x14mm的塑料主体,以容纳配合所有管脚所需的外围线性边缘。The current sink MOSFET 24 requires three connections to the control IC, specifically to the source for current measurement, the gate for device bias, and the drain for fault and feedback sensing. These three connections for each channel are depicted intersecting a discrete to-IC interface 28. Even in FIG2B , where the cascode clamp MOSFET 22 is removed and the current sink MOSFET 24 must maintain a high voltage, as illustrated by the HV integrated diode 23, each channel still requires three pins per channel to intersect the interface 28. This requirement for three interfaces per channel explains the need for the high pin count interface IC 6 shown in FIG1 . For a sixteen-channel driver, the need for three pins per channel uses 48 pins for outputs. Including the SPI bus interface, analog functions, power supplies, and more, requires a costly 64- or 72-pin package. Furthermore, many TV printed circuit board assembly shops cannot solder packages with any pin pitch less than 0.8 or 1.27 mm. A 72-pin package with a 0.8mm pin pitch requires a 14x14mm plastic body to accommodate the peripheral linear edges required to fit all the pins.

图1所示的多芯片结构的一个显著问题是,接口IC 6中的温度感应电路仅可以检测接口IC本身的温度,其中不发生显著的功耗。不幸地,在离散的电流宿DMOSFET 4中正产生极高的热量,其中温度感应是不可能的。不进行温度感应,电流宿MOSFET 4A-4Q的任意一个可能过热,而系统不能检测或修复此情况。A significant problem with the multi-chip architecture shown in FIG1 is that the temperature sensing circuitry in interface IC 6 can only detect the temperature of the interface IC itself, where no significant power consumption occurs. Unfortunately, extremely high heat is generated in discrete current sink DMOSFET 4, where temperature sensing is impossible. Without temperature sensing, any of current sink MOSFETs 4A-4Q could overheat without the system being able to detect or remedy the situation.

总言之,如今的对于LCD面板的LED背光照明的具有局部调光能力的实现方式承受着在成本、性能、特性和安全性方面的许多基本限制。In summary, today's implementations of LED backlighting for LCD panels with local dimming capabilities suffer from a number of fundamental limitations in terms of cost, performance, features, and safety.

高度集成的LED驱动器解决方案需要以昂贵的高管脚数封装来进行封装的昂贵的大面积的管芯,并且将热量集中于单个封装中,由于电流宿MOSFET的线性操作导致的功耗而将驱动器限制到较低电流,并且由于LED正向电压不匹配导致的功耗而造成较低电压,对于更大数量的串联LED其进一步加剧。Highly integrated LED driver solutions require expensive, large die packaged in expensive, high pin count packages, and concentrate the heat in a single package, limiting the driver to lower currents due to power dissipation caused by linear operation of the current sink MOSFETs, and lower voltages due to power dissipation caused by LED forward voltage mismatch, which is further exacerbated for larger numbers of LEDs in series.

将LED控制器与离散功率MOSFET组合的多芯片解决方案要求BOM数,以及甚至更高管脚数的封装。几乎是完全集成的LED驱动器的管脚数量的三倍,十六通道解决方案可能需要33到49个组件以及72管脚封装,其有14mmx14mm的大小。此外,离散MOSFET不提供热感应或者针对过热的保护。仅利用一个反馈信号,这些LED驱动器在没有包括另外的接口IC的情况下不能对两个或更多LED电源供电,这添加了成本和复杂性。Multi-chip solutions that combine LED controllers with discrete power MOSFETs require a BOM and an even higher pin-count package. Almost three times the pin count of a fully integrated LED driver, a sixteen-channel solution may require 33 to 49 components and a 72-pin package measuring 14mm x 14mm. Furthermore, discrete MOSFETs do not provide thermal sensing or protection against overheating. Using only one feedback signal, these LED drivers cannot power two or more LEDs without including an additional interface IC, which adds cost and complexity.

类似地,将这些现有LED驱动器和接口IC的使用扩展到RGB背光照明需要甚至更高的BOM数,包括三个大的高管脚数封装以及所有相关联的离散MOSFET。Similarly, extending the use of these existing LED driver and interface ICs to RGB backlighting requires an even higher BOM count, including three large high-pin-count packages and all the associated discrete MOSFETs.

具有局部调光的用于TV的成本有效且可靠的背光系统所需的是新的半导体芯片组,其去除了离散的MOSFET,提供低的整体封装成本,最小化热量在任何组件内的集中,促进过温度检测和热保护,保护低电压组件不受到高电压的影响并针对短路LED进行保护,灵活地缩放以容纳不同尺寸的显示器,并且维持对LED电流和亮度的精确控制。What is needed for a cost-effective and reliable backlight system for TVs with local dimming is a new semiconductor chipset that eliminates discrete MOSFETs, provides low overall packaging cost, minimizes heat concentration within any component, facilitates over-temperature detection and thermal protection, protects low-voltage components from high voltages and protects against shorted LEDs, flexibly scales to accommodate different sized displays, and maintains precise control of LED current and brightness.

理想地,灵活的解决方案将是可缩放的,以容纳变化数量的通道、反馈信号、电源、和不同尺寸的显示面板,而不需要定制的集成电路。Ideally, a flexible solution would be scalable to accommodate varying numbers of channels, feedback signals, power supplies, and display panels of varying sizes without the need for custom integrated circuits.

发明内容Summary of the Invention

根据本发明的系统包括接口集成电路(IC),其将电流感应反馈(CSFB)信号传输到用于设置对于多个发光二级管(LED)串的单个电源电压的开关模式电源(SMPS)。多个LED驱动器IC控制LED串中的电流并且提供对于LED串的其他功能。The system according to the present invention includes an interface integrated circuit (IC) that transmits a current sense feedback (CSFB) signal to a switch mode power supply (SMPS) for setting a single supply voltage for multiple light-emitting diode (LED) strings. Multiple LED driver ICs control the current in the LED strings and provide other functions for the LED strings.

每个LED驱动器IC控制至少两个LED串(通道)并且包括功能上链接到该LED驱动器IC中的锁存器的串行照明接口(SLI)总线移位寄存器。锁存器用于存储控制LED串中的电流的并且可以用于控制或监视关于LED串的,诸如检测LED串中的短路和开路以及LED驱动器IC中的过高温度的其他功能的数字数据。Each LED driver IC controls at least two LED strings (channels) and includes a serial lighting interface (SLI) bus shift register functionally linked to a latch in the LED driver IC. The latch is used to store digital data that controls the current in the LED string and can be used to control or monitor other functions related to the LED string, such as detecting short circuits and open circuits in the LED string and excessive temperature in the LED driver IC.

根据本发明,每个LED驱动器IC包括周期性地对跨过每个受控的LED串的正向电压降采样的电路,以及用于存储这样的采样的数字表示的CSFB采样锁存器。CSFB锁存器可以存储由LED驱动器IC控制的任意的LED串中的最高正向电压降的数字表示。每个CSFB锁存器耦合到LED驱动器IC的SLI总线移位寄存器内的寄存器。在一些实施例中,通过感应在控制经过LED串的电流的电流宿MOSFET处的电压来检测跨过LED串的正向电压降。According to the present invention, each LED driver IC includes circuitry for periodically sampling the forward voltage drop across each controlled LED string, and a CSFB sampling latch for storing a digital representation of such samples. The CSFB latch can store a digital representation of the highest forward voltage drop in any LED string controlled by the LED driver IC. Each CSFB latch is coupled to a register within the LED driver IC's SLI bus shift register. In some embodiments, the forward voltage drop across the LED string is detected by sensing the voltage at a current sink MOSFET that controls the current through the LED string.

LED驱动器IC中的各个SLI总线移位寄存器以“菊链”布置通过SLI总线串联连接在一起,由此形成起源于并且终止于接口IC的SLI总线。因此,在以串行方式将先前存储在SLI总线寄存器中的数据位推回到接口IC的处理中,从接口IC移除的数据位串行地移动经过SLI总线移位寄存器以及连接它们的SLI总线并返回到接口IC。The individual SLI bus shift registers in the LED driver IC are connected together in series via the SLI bus in a "daisy-chain" arrangement, thereby forming an SLI bus that originates at and terminates at the interface IC. Thus, in the process of serially pushing data bits previously stored in the SLI bus registers back to the interface IC, data bits removed from the interface IC are serially shifted through the SLI bus shift registers and the SLI bus connecting them and back to the interface IC.

在一些实施例中,SLI总线移位寄存器包含存储从LED驱动器IC内的CSFB锁存器接收的CSFB数据的专用CSFB寄存器。类似地,SLI总线移位寄存器可以包含以一对一关系与LED驱动器IC内的其他功能和采样锁存器链接的其他专用寄存器。In some embodiments, the SLI bus shift register includes a dedicated CSFB register that stores CSFB data received from the CSFB latch within the LED driver IC. Similarly, the SLI bus shift register may include other dedicated registers that are linked in a one-to-one relationship with other functions and sampling latches within the LED driver IC.

可替换地,在一个优选实施例中,每个LED驱动器IC中的SLI总线移位寄存器包括前缀(prefix)寄存器和数据寄存器,即,在SLI总线寄存器和LED驱动器IC中的锁存器之间是一对一关系。CSFB锁存器和LED驱动器IC中的其他锁存器由前缀寄存器中的数字字(地址)标识,允许存储在CSFB锁存器中的数据被复制到数据寄存器中。此结构节省了LED驱动器IC上有价值的半导体“实际资源(real estate)”,从而极大地减小了成本。Alternatively, in a preferred embodiment, the SLI bus shift register in each LED driver IC includes a prefix register and a data register. That is, there is a one-to-one relationship between the SLI bus registers and the latches in the LED driver IC. The CSFB latch and other latches in the LED driver IC are identified by a digital word (address) in the prefix register, allowing data stored in the CSFB latch to be copied to the data register. This structure conserves valuable semiconductor "real estate" on the LED driver IC, significantly reducing costs.

在任一实施例中,表示由LED驱动器IC控制的任意LED串的最高正向电压的数字字可以被读取并存储到驱动器IC的SLI总线移位寄存器内的寄存器中。In either embodiment, a digital word representing the highest forward voltage of any LED string controlled by an LED driver IC can be read and stored into a register within the driver IC's SLI bus shift register.

接口IC包含能够接收存储在SLI总线移位寄存器中的CSFB数据,并从其中选择表示由该LED控制的任意LED串的最高正向电压降的CSFB字的电路。然后由接口IC使用该字以产生SMPS模块使用来设置用于所有受控的LED串的适当的电源电压的CSFB信号。The interface IC contains circuitry that receives the CSFB data stored in the SLI bus shift register and selects the CSFB word representing the highest forward voltage drop of any LED string controlled by that LED. This word is then used by the interface IC to generate the CSFB signal that the SMPS module uses to set the appropriate supply voltage for all controlled LED strings.

以预定间隔实行对LED驱动器IC中的CSFB数据的采样,在每个间隔之后数据再次被移位到接口IC,该接口IC然后将新的SCFB信号发送到SMPS模块,允许基于在受控的LED串之间的新的最高正向电压降来适当地调整电源电压。Sampling of the CSFB data in the LED driver IC is performed at predetermined intervals, after each interval the data is again shifted to the interface IC which then sends a new SCFB signal to the SMPS module, allowing the supply voltage to be adjusted appropriately based on the new highest forward voltage drop between the controlled LED strings.

此布置允许对于包含不同数量的LED串及其它参数的系统的灵活性和可缩放性。This arrangement allows flexibility and scalability to systems including different numbers of LED strings and other parameters.

此布置该允许LED驱动系统容易地被划分为由处于不同的电源电压的不同SMPS模块供电的不同组的LED串。例如,这在显示包含通常需要不同的电源电压的红色、绿色和蓝色LED的单独的串时是有用的。在此情况下,接口IC包含能够分离分别与红色、绿色和蓝色LED串有关的CSFB字,并将适当的CSFB信号发送到提供用于不同LED串的电源电压的单独的SMPS模块的电路。在其中SLI总线移位寄存器包含专用SCFB寄存器的实施例中,可以通过对接收的位的数量计数来进行分离处理,以标识该CSFB数据与哪个LED串有关。在其中SLI移位寄存器包含前缀和数据寄存器的实施例中,前缀可以用于标识该CSFB数据与哪个LED串有关。This arrangement allows the LED drive system to be easily divided into different groups of LED strings powered by different SMPS modules at different supply voltages. For example, this is useful when displaying separate strings of red, green, and blue LEDs, which typically require different supply voltages. In this case, the interface IC includes circuitry capable of separating the CSFB words associated with the red, green, and blue LED strings, respectively, and sending the appropriate CSFB signals to the separate SMPS modules providing the supply voltages for the different LED strings. In embodiments where the SLI bus shift register includes a dedicated SCFB register, separation processing can be performed by counting the number of bits received to identify which LED string the CSFB data is associated with. In embodiments where the SLI shift register includes a prefix and data register, the prefix can be used to identify which LED string the CSFB data is associated with.

根据本发明的一方面,提供了一种用来控制向多个LED串供电的电源的集成电路,所述集成电路包括:与菊链式耦合的多个串行移位寄存器耦合的接口电路,所述接口电路被配置为从所述多个串行移位寄存器接收多个数字值,并且从所述多个数字值中识别出最低数字值,多个数字值的每个与所述多个LED串的一个LED串的一端处的电压电平对应;以及,与所述接口电路耦合的转换器,所述转换器被配置为将所述最低数字值转换成控制信号并且将所述控制信号提供给所述电源以调整所述电源的输出电压,所述转换器包含数字到模拟转换器(DAC)和运算跨导放大器,所述DAC被配置为将所述最低数字值转换成模拟电压信号,所述运算跨导放大器耦合到所述DAC并且被配置为将所述模拟电压信号转换成模拟电流信号并将所述模拟电流信号提供给所述电源。According to one aspect of the present invention, an integrated circuit for controlling a power supply that supplies power to a plurality of LED strings is provided, the integrated circuit comprising: an interface circuit coupled to a plurality of serial shift registers coupled in a daisy-chain manner, the interface circuit being configured to receive a plurality of digital values from the plurality of serial shift registers and identify a lowest digital value from the plurality of digital values, each of the plurality of digital values corresponding to a voltage level at one end of one of the plurality of LED strings; and a converter coupled to the interface circuit, the converter being configured to convert the lowest digital value into a control signal and provide the control signal to the power supply to adjust an output voltage of the power supply, the converter comprising a digital-to-analog converter (DAC) and an operational transconductance amplifier, the DAC being configured to convert the lowest digital value into an analog voltage signal, the operational transconductance amplifier being coupled to the DAC and configured to convert the analog voltage signal into an analog current signal and provide the analog current signal to the power supply.

根据本发明的另一方面,提供了一种用来控制向多个LED串供电的电源的集成电路,所述集成电路包括:与菊链式耦合的多个串行移位寄存器耦合的接口电路,所述接口电路被配置为从所述多个串行移位寄存器接收多个数字值,并且从所述多个数字值中识别出最低数字值,多个数字值的每个与所述多个LED串的一个LED串的一端处的电压电平对应,所述接口电路包含存储数字值的寄存器和比较器,所述比较器与所述寄存器耦合并且被配置为比较来自所述多个串行移位寄存器的传入数字值和存储在所述寄存器中的数字值以识别出较低数字值;以及,与所述接口电路耦合的转换器,所述转换器被配置为将所述最低数字值转换成控制信号并且将所述控制信号提供给所述电源以调整所述电源的输出电压。According to another aspect of the present invention, an integrated circuit for controlling a power supply for supplying power to a plurality of LED strings is provided, the integrated circuit comprising: an interface circuit coupled to a plurality of serial shift registers coupled in a daisy-chain manner, the interface circuit being configured to receive a plurality of digital values from the plurality of serial shift registers and identify a lowest digital value from the plurality of digital values, each of the plurality of digital values corresponding to a voltage level at one end of one of the plurality of LED strings, the interface circuit comprising a register storing digital values and a comparator coupled to the register and configured to compare the incoming digital values from the plurality of serial shift registers with the digital values stored in the register to identify a lower digital value; and a converter coupled to the interface circuit, the converter being configured to convert the lowest digital value into a control signal and provide the control signal to the power supply to adjust the output voltage of the power supply.

根据本发明的另一方面,提供了一种用来控制分别向第一多个LED串和第二多个LED串供电的第一电源和第二电源的集成电路,所述集成电路包括:与菊链式耦合的多个串行移位寄存器耦合的接口电路,所述接口电路被配置为从所述多个串行移位寄存器接收第一多个数字值,从所述多个串行移位寄存器接收第二多个数字值,从所述第一多个数字值中识别出第一最低数字值,并且从所述第二多个数字值中识别出第二最低数字值,所述第一多个数字值的每个与所述第一多个LED串的一个LED串的一端处的电压电平对应,所述第二多个数字值的每个与所述第二多个LED串的一个LED串的一端处的电压电平对应,所述接口电路包含被配置为存储第一数字值的第一寄存器和存储第二数字值的第二寄存器,所述接口电路被配置为比较所述第一多个数字值的第一传入数字值和存储在所述第一寄存器中的第一数字值,以识别第一较低数字值,并且比较所述第二多个数字值的第二传入数字值和存储在所述第二寄存器中的第二数字值,以识别第二较低数字值;以及,与所述接口电路耦合的转换器,所述转换器被配置为将所述第一最低数字值转换成第一控制信号,将所述第二最低数字值转换成第二控制信号,将所述第一控制信号提供给所述第一电源以调整所述第一电源的输出电压,并且将所述第二控制信号提供给所述第二电源以调整所述第二电源的输出电压。According to another aspect of the present invention, an integrated circuit for controlling a first power source and a second power source for supplying power to a first plurality of LED strings and a second plurality of LED strings, respectively, is provided. The integrated circuit includes: an interface circuit coupled to a plurality of serial shift registers coupled in a daisy-chain manner, the interface circuit being configured to receive a first plurality of digital values from the plurality of serial shift registers, receive a second plurality of digital values from the plurality of serial shift registers, identify a first lowest digital value from the first plurality of digital values, and identify a second lowest digital value from the second plurality of digital values, each of the first plurality of digital values corresponding to a voltage level at one end of one of the first plurality of LED strings, each of the second plurality of digital values corresponding to a voltage level at one end of one of the second plurality of LED strings, and the interface circuit being configured to receive a first plurality of digital values from the plurality of serial shift registers, receive a second plurality of digital values from the plurality of serial shift registers, identify a first lowest digital value from the first plurality of digital values, and identify a second lowest digital value from the second plurality of digital values, wherein each of the first plurality of digital values corresponds to a voltage level at one end of one of the first plurality of LED strings, and each of the second plurality of digital values corresponds to a voltage level at one end of one of the second plurality of LED strings. The circuit includes a first register configured to store a first digital value and a second register configured to store a second digital value, the interface circuit configured to compare a first incoming digital value of the first plurality of digital values with the first digital value stored in the first register to identify a first lower digital value, and to compare a second incoming digital value of the second plurality of digital values with the second digital value stored in the second register to identify a second lower digital value; and a converter coupled to the interface circuit, the converter configured to convert the first lowest digital value into a first control signal, convert the second lowest digital value into a second control signal, provide the first control signal to the first power supply to adjust the output voltage of the first power supply, and provide the second control signal to the second power supply to adjust the output voltage of the second power supply.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

图1是使用离散的DMOSFET作为集成电路信宿和保护电压箝位电路的用于LCD背光照明的现有技术多通道LED驱动系统的图。1 is a diagram of a prior art multi-channel LED driving system for LCD backlighting using discrete DMOSFETs as integrated circuit sinks and protection voltage clamps.

图2A是使用离散的电流宿DMOSFET和保护高电压共源共栅箝位DMOSFET的单独的LED驱动通道的示意图。FIG2A is a schematic diagram of a separate LED driver channel using discrete current sink DMOSFETs and a protective high voltage cascode clamp DMOSFET.

图2B是使用离散的高电压电流宿DMOSFET而没有共源共栅箝位MOSFET的单独的LED驱动通道的示意图。FIG2B is a schematic diagram of a separate LED driver channel using discrete high voltage current sink DMOSFETs without a cascode clamp MOSFET.

图3A是具有保护高电压共源共栅箝位DMOSFET和宽(fat)SLI总线接口的、具有串行总线控制的双通道高电压智能LED驱动器的示意图。3A is a schematic diagram of a dual-channel high-voltage smart LED driver with serial bus control having protective high-voltage cascode clamped DMOSFETs and a wide (fat) SLI bus interface.

图3B是使用高电压电流宿MOSFET而没有共源共栅箝位MOSFET和宽SLI总线接口的、具有串行总线控制的双通道高电压智能LED驱动器的示意图。3B is a schematic diagram of a dual-channel high-voltage intelligent LED driver with serial bus control using high-voltage current sink MOSFETs without cascode clamp MOSFETs and a wide SLI bus interface.

图3C是使用高电压电流宿MOSFET而没有共源共栅箝位MOSFET并且包括前缀复用的SLI总线接口的、具有串行总线控制的双通道高电压智能LED驱动器的示意图。3C is a schematic diagram of a dual-channel high voltage intelligent LED driver with serial bus control using high voltage current sink MOSFETs without cascode clamp MOSFETs and including a prefix multiplexed SLI bus interface.

图4A和4B例示使用智能LED驱动器而没有共源共栅箝位MOSFET并且包括SLI串行总线控制的多通道LED背光系统的图。4A and 4B illustrate diagrams of a multi-channel LED backlight system using a smart LED driver without cascode clamped MOSFETs and including SLI serial bus control.

图5是图4所示的系统的简化示意图,其例示了明显减少的构件材料。FIG. 5 is a simplified schematic diagram of the system shown in FIG. 4 illustrating the significant reduction in component material.

图6是例示具有嵌入式SLI总线控制的智能背光系统的、基于SLI总线的控制的示意图。FIG. 6 is a schematic diagram illustrating SLI bus-based control of an intelligent backlight system with embedded SLI bus control.

图7A是具有嵌入式CSFB反馈并且使用宽SLI总线接口和协议的、具有相应的数字控制和定时(DC&T)以及模拟控制和感应(AC&S)电路的双通道LED驱动器的框图。7A is a block diagram of a dual-channel LED driver with embedded CSFB feedback and using a wide SLI bus interface and protocol, with corresponding digital control and timing (DC&T) and analog control and sensing (AC&S) circuits.

图7B是具有嵌入式CSFB反馈并且使用前缀复用的SLI总线的、具有相应的数字控制和定时(DC&T)以及模拟控制和感应(AC&S)电路的双通道LED驱动器的框图。7B is a block diagram of a dual-channel LED driver with embedded CSFB feedback and using a prefix-multiplexed SLI bus with corresponding digital control and timing (DC&T) and analog control and sensing (AC&S) circuits.

图8是例示具有包括预加载和有效锁存器以及嵌入式CSFB能力的相应的三层(three-tiered)寄存器-锁存器架构的多功能前缀复用SLI总线寄存器的框图。8 is a block diagram illustrating a multi-function prefix multiplexed SLI bus register with a corresponding three-tiered register-latch architecture including preload and valid latches and embedded CSFB capability.

图9是例示SLI总线嵌入的CSFB信号从LED驱动器IC到接口IC的通信路径的简化图。FIG. 9 is a simplified diagram illustrating the communication path of the SLI bus embedded CSFB signal from the LED driver IC to the interface IC.

图10A是具有保护高电压共源共栅箝位DMOSFET和宽SLI总线的、具有SLI总线嵌入式CSFB和串行总线控制的双通道高电压智能LED驱动器的示意图。10A is a schematic diagram of a dual-channel high voltage smart LED driver with SLI bus embedded CSFB and serial bus control with protective high voltage cascode clamped DMOSFETs and a wide SLI bus.

图10B是使用高电压电流宿MOSFET而没有共源共栅箝位MOSFET并且包括宽SLI总线的、具有SLI嵌入式CSFB和串行总线控制的双通道高电压智能LED驱动器的示意图。10B is a schematic diagram of a dual-channel high voltage smart LED driver with SLI embedded CSFB and serial bus control using high voltage current sink MOSFETs without cascode clamp MOSFETs and including a wide SLI bus.

图10C是使用高电压电流宿MOSFET而没有共源共栅箝位MOSFET并且包括前缀复用的SLI总线的、具有SLI总线嵌入式CSFB和串行总线控制的双通道高电压智能LED驱动器的示意图。10C is a schematic diagram of a dual-channel high voltage smart LED driver with SLI bus embedded CSFB and serial bus control using high voltage current sink MOSFETs without cascode clamp MOSFETs and including a prefix multiplexed SLI bus.

图11A和11B例示了使用具有共源共栅箝位MOSFET和SLI总线嵌入式CSFB信号的智能LED驱动器的多通道LED背光系统。11A and 11B illustrate a multi-channel LED backlight system using an intelligent LED driver with cascode clamped MOSFETs and an SLI bus embedded CSFB signal.

图12例示了模拟CSFB电路的实施例。FIG12 illustrates an embodiment of an analog CSFB circuit.

图13例示了模拟到数字CSFB转换器的实施例。FIG13 illustrates an embodiment of an analog-to-digital CSFB converter.

图14例示了数字到模拟CSFB转换器的实施例。FIG14 illustrates an embodiment of a digital-to-analog CSFB converter.

图15是例示了对具有用于双电源的嵌入式SLI总线控制的智能背光系统的基于SLI总线的控制的示意图。15 is a schematic diagram illustrating SLI bus-based control of an intelligent backlight system with embedded SLI bus control for dual power supplies.

图16是用于使用宽SLI总线协议来控制双电源的接口IC的框图。16 is a block diagram of an interface IC for controlling dual power supplies using the wide SLI bus protocol.

图17是用于使用前缀复用的SLI总线协议和前缀特定的CSFB信号来控制双电源的接口IC的框图。17 is a block diagram of an interface IC for controlling dual power supplies using prefix-multiplexed SLI bus protocol and prefix-specific CSFB signals.

图18是四倍CSFB SLI总线协议和使用单个SLI总线前缀的解码系统的框图。18 is a block diagram of a quad CSFB SLI bus protocol and decoding system using a single SLI bus prefix.

图19是用于使用替换的四倍CSFB编码的前缀复用的SLI总线协议来控制多个电源的接口IC的框图。19 is a block diagram of an interface IC for controlling multiple power supplies using an alternative quadruple CSFB encoded prefix multiplexed SLI bus protocol.

图20是例示了具有对于每个驱动器IC划分有一个颜色的三电源的嵌入式SLI总线控制的智能RGB背光系统的基于SLI总线的控制的示意图。FIG. 20 is a schematic diagram illustrating SLI bus-based control of an intelligent RGB backlight system with embedded SLI bus control of three power supplies divided into one color for each driver IC.

图21是例示了具有对于每个驱动器IC划分有三颜色的三电源的嵌入式SLI总线控制的智能RGB背光系统的基于SLI总线的控制的示意图。FIG. 21 is a schematic diagram illustrating SLI bus-based control of an intelligent RGB backlight system with embedded SLI bus control of three power supplies divided into three colors for each driver IC.

图22例示了集成八个电流宿DMOSFET和四个独立的CSFB检测电路以用于提供独立的反馈控制从而产生四个不同的电源电压的八通道LED驱动器。FIG22 illustrates an eight-channel LED driver that integrates eight current sink DMOSFETs and four independent CSFB detection circuits for providing independent feedback control to generate four different supply voltages.

具体实施方式DETAILED DESCRIPTION

如在背景技术部分中所述,对于TV和大屏幕LCD的现有背光解决方案是复杂、昂贵且不灵活的。为了降低对于具有局部调光的LCD的背光系统的成本而不牺牲安全可靠的操作,明显需要全新的架构,其至少去除了离散的MOSFET,最小化热在任何组件内的集中,促进过温度检测和热保护,并且保护低电压组件不受到高电压影响。尽管仅仅达到这些目标可能不足以实现能够达到家用消费电子市场的需求成本目标的真正成本有效的方案,但是这样的改进是朝向为了实现低成本局部调光这样的目标所需的第一步骤。As described in the Background section, existing backlighting solutions for TVs and large-screen LCDs are complex, expensive, and inflexible. To reduce the cost of backlighting systems for LCDs with local dimming without sacrificing safe and reliable operation, a completely new architecture is clearly needed that at least eliminates the discrete MOSFETs, minimizes heat concentration within any component, facilitates over-temperature detection and thermal protection, and protects low-voltage components from high voltages. While achieving these goals alone may not be enough to achieve a truly cost-effective solution that can meet the demanding cost targets of the home consumer electronics market, such improvements are the first steps toward achieving such goals in order to achieve low-cost local dimming.

在此所述的本发明使能用于实现对于具有能量高效的局部调光能力的大屏幕LCD和TV的安全和经济上可行的LED背光照明系统的新的成本有效且可缩放的架构。在此公开的新的LED驱动系统、功能划分和架构完全消除了在成本、功能和对于高管脚数封装的需要方面的上述问题。该新的架构基于某些基础前提,包括:The invention described herein enables a new cost-effective and scalable architecture for implementing a safe and economically viable LED backlighting system for large-screen LCDs and TVs with energy-efficient local dimming capabilities. The new LED driver system, functional partitioning, and architecture disclosed herein completely eliminate the aforementioned problems in terms of cost, functionality, and the need for high pin count packages. The new architecture is based on certain fundamental premises, including:

1.对电流宿MOSFET的模拟控制、感应、和保护应该在功能上与其相关联的电流宿MOSFET集成在一起,而不是分离到另一IC中。1. Analog control, sensing, and protection of current sink MOSFETs should be functionally integrated with their associated current sink MOSFETs rather than separated into another IC.

2.基本的调光、相位延迟功能、LED电流控制和通道特定功能应该在功能上与它们控制的电流宿MOSFET集成在一起,而不是分离到另一IC中。2. Basic dimming, phase delay functions, LED current control and channel-specific functions should be functionally integrated with the current sink MOSFETs they control, rather than separated into another IC.

3.系统定时、系统μC主机协商和其他全局参数以及对于特定通道不唯一的功能不应该在功能上与电流宿MOSFET集成在一起。3. System timing, system μC host negotiation and other global parameters and functions that are not unique to a specific channel should not be functionally integrated with the current sink MOSFET.

4.每个封装的设备的集成的通道,即,电流宿MOSFET的数量应该对于热管理而优化以避免过热,同时满足指定的LED电流、电源电压和LED正向电压不匹配要求。4. The number of integrated channels, ie, current sink MOSFETs, per packaged device should be optimized for thermal management to avoid overheating while meeting the specified LED current, supply voltage, and LED forward voltage mismatch requirements.

5.与多通道LED驱动器的通信以及对多通道LED驱动器的控制应该采用低管脚数方法,理想地需要在某个接口IC上以及在每个LED驱动器IC上的总共不多于三个封装管脚。该通信方法应该仅构成驱动器IC的管芯面积和成本的一小部分。5. Communication with and control of multi-channel LED drivers should employ a low-pin-count approach, ideally requiring no more than three package pins total on an interface IC and on each LED driver IC. This communication approach should only constitute a small fraction of the driver IC’s die area and cost.

6.接口和驱动器IC中的功能集成的水平应该被平衡以促进与单层PCB组装兼容的低成本和低管脚数封装。6. The level of functional integration in the interface and driver ICs should be balanced to facilitate low-cost and low-pin-count packaging compatible with single-layer PCB assembly.

7.理想地,系统应该灵活地缩放到任意数量的通道,而不需要对IC的重大重新设计。7. Ideally, the system should be flexible enough to scale to any number of channels without requiring a major redesign of the IC.

图1的传统架构,即,用于驱动多个离散功率MOSFET的集中的控制器不能满足甚至上述目标中的一个,主要是因为其需要对于所有数字和模拟信息处理的控制的中心点或“命令中心”。必要地,命令中心IC必须与其μC主机进行通信,并且直接感应和驱动每个电流宿MOSFET。此高度的组件连接性要求大量的输入和输出线,使高管脚数封装成为必需。The traditional architecture of Figure 1, a centralized controller for driving multiple discrete power MOSFETs, fails to meet even one of these goals, primarily because it requires a central point of control, or "command center," for all digital and analog information processing. Essentially, the command center IC must communicate with its μC host and directly sense and drive each current sink MOSFET. This high degree of component connectivity requires a large number of input and output lines, necessitating a high-pin-count package.

分布式LED驱动器架构概况Overview of Distributed LED Driver Architecture

县现有技术形成鲜明对比,以上设计标准(如果不是命令)描述了“分布式”系统,即没有对于中央控制的需要的系统。在所公开的分布式系统中,接口IC将从主机μC获得的信息翻译为简单的串行通信协议,向连接到串行总线的任意数量的智能LED驱动器“卫星”IC来数字地发送指令。In stark contrast to the prior art, the above design criteria (if not commands) describe a "distributed" system, i.e., a system without the need for central control. In the disclosed distributed system, an interface IC translates information received from a host μC into a simple serial communication protocol, digitally sending instructions to any number of intelligent LED driver "satellite" ICs connected to the serial bus.

促进上述标准的LED驱动器的实现方式在Williams等人的题为“Low Cost LEDDriver with Integral Dimming Capability”的申请No.13/346,625中描述,通过引用将其全部内容合并于此。在Williams等人的题为“Low Cost LED Driver with ImprovedSerial Bus”的申请No.13/346,647中描述了LED驱动器的替换版本,也通过引用将其全部内容合并于此。An implementation of an LED driver that facilitates the above standards is described in Williams et al., application Ser. No. 13/346,625, entitled “Low Cost LED Driver with Integral Dimming Capability,” which is incorporated herein by reference in its entirety. An alternative version of the LED driver is described in Williams et al., application Ser. No. 13/346,647, entitled “Low Cost LED Driver with Improved Serial Bus,” which is also incorporated herein by reference in its entirety.

在此重申这些申请的主要概念,其包括接口和LED驱动器IC的硬件描述以及发明的“串行照明接口”或SLI总线的几个版本的操作——包含与控制LED照明特别相关的参数的串行通信协议。每个驱动器ID响应于其SLI总线数字指令,在没有接口IC的帮助的情况下,本地地进行诸如动态精确LED电流控制、PWM亮度控制、相位延迟和故障检测的所有所需的LED驱动器功能。当以“菊链”连接回到接口IC时,还可以将在任意的驱动器IC中发生的诸如开路LED、短路LED或过温度故障的故障情况传送回到接口IC,并最终传送回到主机μC。The key concepts of these applications are reiterated here, including a hardware description of the interface and LED driver ICs, as well as the operation of several versions of the invented "Serial Lighting Interface," or SLI bus—a serial communication protocol containing parameters specifically related to controlling LED lighting. Each driver ID, in response to its SLI bus digital instructions, locally performs all required LED driver functions, such as dynamic precision LED current control, PWM brightness control, phase delay, and fault detection, without assistance from the interface IC. When "daisy-chained" back to the interface IC, fault conditions such as open LEDs, shorted LEDs, or over-temperature faults occurring in any driver IC can also be communicated back to the interface IC, and ultimately to the host μC.

尽管在以上两个引用的申请中公开的基本架构是类似的,但是它们的SLI总线协议和物理接口的实现不同。在第一个申请中所述的“宽(fat)”SLI总线协议中,采用长的数字字来在单个SLI总线广播中将所有的控制参数加载到每个LED驱动器中,即,用于每个驱动器IC的每个寄存器的所有数据一次(at once)从接口IC移除到SLI总线上。在第二个申请中所述的替换版本中,即,发明“前缀复用的”SLI总线协议中,使用多个SLI总线广播向特定功能锁存器引导较小的数字字。While the basic architectures disclosed in the two referenced applications are similar, their implementations of the SLI bus protocols and physical interfaces differ. In the "fat" SLI bus protocol described in the first application, long digital words are used to load all control parameters into each LED driver in a single SLI bus broadcast, i.e., all data for each register of each driver IC is removed from the interface IC onto the SLI bus at once. In an alternative version described in the second application, the inventive "prefix-multiplexed" SLI bus protocol, multiple SLI bus broadcasts are used to direct smaller digital words to specific function latches.

不管采用的SLI总线协议如何,每个LED驱动器IC包括模拟电流感应反馈(CSFB)输入和输出管脚(CSFBI和CSFBO),它们以菊链与其他驱动器IC的CSFBI和CSFBO以及接口IC连接,以向高电压开关模式电源(SMPS)提供反馈,动态地调整为LED串供电的电压。模拟CSFB信号需要在每个LED驱动器IC上的两个封装管脚。不管集成通道的数量如何,每个LED驱动器IC仅输出单个CSFB信号。Regardless of the SLI bus protocol used, each LED driver IC includes analog current sense feedback (CSFB) input and output pins (CSFBI and CSFBO). These are daisy-chained with the CSFBI and CSFBO of other driver ICs and interface ICs to provide feedback to the high-voltage switch-mode power supply (SMPS), dynamically adjusting the voltage supplying the LED string. The analog CSFB signal requires two package pins on each LED driver IC. Regardless of the number of integrated channels, each LED driver IC outputs only a single CSFB signal.

通过SLI总线,每个卫星LED驱动器-IC与中央配对(companion)接口IC通信,解释来自视频/图形处理器或缩放器IC的SPI总线命令,并将其接收到的SPI总线信息翻译为SLI总线命令。与其翻译响应一样,此接口IC将参考电压提供给确保良好的电流匹配所需的所有LED驱动器IC,产生Vsync和灰度时钟(GSC)脉冲以同步其操作,并监视每个LED驱动器IC的潜在故障。其还使用芯片上运算跨导放大器(OTA)促进模拟电压CSFB信号到模拟电流CSFB信号的电压到电流转化。模拟CSFB信号需要在接口IC上的两个封装管脚(CSFBI和ICSFB),CSFBI管脚用于接收来自LED驱动器IC的电压CSFB信号,并且ICSFB管脚用于将电流CSFB信号传输到SMPS。Each satellite LED driver IC communicates with a central companion interface IC via the SLI bus, interpreting SPI bus commands from the video/graphics processor or scaler IC and translating the SPI bus messages it receives into SLI bus commands. Along with its translated responses, this interface IC provides reference voltages to all LED driver ICs required to ensure good current matching, generates Vsync and grayscale clock (GSC) pulses to synchronize their operation, and monitors each LED driver IC for potential faults. It also facilitates the voltage-to-current conversion of the analog voltage CSFB signal to an analog current CSFB signal using an on-chip operational transconductance amplifier (OTA). The analog CSFB signal requires two package pins on the interface IC (CSFBI and ICSFB): the CSFBI pin is used to receive the voltage CSFB signal from the LED driver IC, and the ICSFB pin is used to transmit the current CSFB signal to the SMPS.

因此,通过重新划分LED背光系统的功能使得精确电流控制和调光、故障检测和CSFB感应和反馈与高电压电流宿MOSFET集成,而不是集成在系统接口IC中,从而可以去除高管脚数封装,并且实现可缩放的分布式系统。Therefore, by redistributing the functions of the LED backlight system so that precise current control and dimming, fault detection and CSFB sensing and feedback are integrated with the high-voltage current sink MOSFET instead of in the system interface IC, high pin count packages can be eliminated and a scalable distributed system can be achieved.

具有集成的调光、故障检测和CSFB反馈的LED驱动器LED driver with integrated dimming, fault detection and CSFB feedback

具有SLI总线通信的本发明的LED驱动器IC 51的实现方式示出在图3A中,其包括:具有集成的电流宿DMOSFET 55A和55B的双通道驱动器、具有集成的高电压二极管58A和58B的共源共栅箝位DMOSFET 57A和57B、用于准确的电流控制的I精确栅极驱动器电路56A和56B、模拟控制和感应电路60、以及数字控制和定时电路59。芯片上偏压电源和调解器62对IC供电。An implementation of the present invention's LED driver IC 51 with SLI bus communication is shown in FIG3A and includes a dual-channel driver with integrated current sink DMOSFETs 55A and 55B, cascode clamp DMOSFETs 57A and 57B with integrated high-voltage diodes 58A and 58B, I-accurate gate driver circuits 56A and 56B for accurate current control, analog control and sensing circuitry 60, and digital control and timing circuitry 59. An on-chip bias supply and regulator 62 provides power to the IC.

LED驱动器IC 51提供对250mA LED驱动器的两个通道的完整控制,其具有150V阻挡能力和±2%的绝对电流准确度,12位的PWM亮度控制、12位的PWM相位控制,8位的电流控制,对于LED开路和LED短路情况的故障检测、以及过温度检测,所有通过高速SLI总线而控制,并且通过公共Vsync和灰度时钟(GSC)信号与其他驱动器同步。尽管所示的特定例子例示了额定在150V阻挡能力的共源共栅箝位DMOSFET 57A和57B,但是根据需要这些器件可以针对操作而从100V到300V来定大小。驱动器IC的250mA额定电流通过两个LED串52A和52B中的封装的功耗和正向电压的不匹配而设置。LED driver IC 51 provides complete control of two channels of 250mA LED drivers with 150V blocking capability and ±2% absolute current accuracy, 12-bit PWM brightness control, 12-bit PWM phase control, 8-bit current control, fault detection for open LED and short LED conditions, and over-temperature detection, all controlled via a high-speed SLI bus and synchronized with other drivers via common Vsync and grayscale clock (GSC) signals. While the specific example shown illustrates cascode clamped DMOSFETs 57A and 57B rated at 150V blocking capability, these devices can be sized for operation from 100V to 300V as needed. The driver IC's 250mA current rating is set by the power dissipation and forward voltage mismatch of the packages in the two LED strings 52A and 52B.

在操作中,LED驱动器IC 51在其串行输入SI管脚上接收数据流,其被馈送到SLI总线移位寄存器61的输入。数据被以由接口IC(未示出)提供的串行时钟SCK信号设置的速率来设定时钟。该数据的最大时钟速率取决于用于实现移位寄存器61的CMOS技术,但是甚至使用0.5μm线宽工艺和晶圆制造也可实现以10MHz进行的操作。只要SCK信号继续运行,数据将移位到移位寄存器61中并且最终在其到串行菊链中的下一LED驱动器IC的路径上退出串行输出管脚SO。In operation, the LED driver IC 51 receives a data stream on its serial input SI pin, which is fed to the input of the SLI bus shift register 61. The data is clocked at a rate set by the serial clock SCK signal provided by the interface IC (not shown). The maximum clock rate of this data depends on the CMOS technology used to implement the shift register 61, but operation at 10 MHz is achievable even using 0.5 μm linewidth processes and wafer fabrication. As long as the SCK signal continues to run, the data will shift into the shift register 61 and eventually exit the serial output pin SO on its way to the next LED driver IC in the serial daisy chain.

在意图用于驱动器IC 51的数据到达移位寄存器61中之后,SCK信号暂时被发送该数据的接口IC停止。使用“宽”SLI总线协议,用于控制LED驱动器IC参数的所有串行数据一次被移位到SLI总线移位寄存器61中,即,数据被移位到菊链中的每个驱动器IC中的移位寄存器61中。即使必须改变仅一个参数,所有数据也被重写到移位寄存器61中。其后,Vsync脉冲将来自移位寄存器61的数据锁存到该数字定时和控制(DC&T)电路59内所包含的锁存器中,以及模拟控制和感应AC&S电路60内包含的锁存器中,这些锁存器包括触发器(flipflop)或静态RAM。同样在Vsync脉冲时,先前被写到AC&S电路60内的故障锁存器中的任何数据将被复制到SLI总线移位寄存器61的适当的位中。After the data intended for the driver IC 51 arrives in the shift register 61, the SCK signal is temporarily stopped by the interface IC sending the data. Using the "wide" SLI bus protocol, all serial data used to control the parameters of the LED driver ICs is shifted into the SLI bus shift register 61 at once, that is, the data is shifted into the shift register 61 in each driver IC in the daisy chain. Even if only one parameter must be changed, all the data is rewritten to the shift register 61. Thereafter, a Vsync pulse latches the data from the shift register 61 into the latches contained within the digital timing and control (DC&T) circuit 59 and the latches contained within the analog control and sensing AC&S circuit 60, which may include flip-flops or static RAM. Also at the time of the Vsync pulse, any data previously written to the fault latch within the AC&S circuit 60 is copied to the appropriate bit of the SLI bus shift register 61.

串行时钟SCK信号的恢复将移动移位寄存器61内的读取和写入位通过菊链而进入下一IC中。在一个优选实施例中,菊链形成连接回到接口IC的环路。将新数据发送到菊链中最终推动存在于移位寄存器中的现有数据经过环路并最终回到接口IC。以此方式,接口IC可以与设置LED串亮度和定时的各个LED驱动器IC通信,并且各个驱动器IC可以将各自的故障情况传送回到接口IC。Restoration of the serial clock SCK signal shifts the read and write bits within shift register 61 through the daisy chain to the next IC. In a preferred embodiment, the daisy chain forms a loop that connects back to the interface IC. Sending new data into the daisy chain ultimately pushes the existing data in the shift register through the loop and ultimately back to the interface IC. In this way, the interface IC can communicate with the individual LED driver ICs that set the brightness and timing of the LED string, and the individual driver ICs can communicate their respective fault conditions back to the interface IC.

使用此定时钟方案,可以以高速移位数据经过大量驱动器IC而不影响LED电流或引起闪烁,因为对电流宿DMOSFET 55A和55B的电流和定时控制仅在每个新的Vsync脉冲时改变。Vsync可以从60Hz到960Hz变化,灰度时钟频率成比例地缩放,通常是Vsync频率的4096倍。因为当与SLI总线时钟SCK频率相比时Vsync较低,在1kHz以下,所以接口IC具有修改和重新发送数据,后者在给定的垂直同步脉冲持续时间内多次询问故障锁存器的灵活性。Using this clocking scheme, data can be shifted at high speed through a large number of driver ICs without affecting LED current or causing flicker, because the current and timing control of current sink DMOSFETs 55A and 55B only change with each new Vsync pulse. Vsync can be varied from 60Hz to 960Hz, with the grayscale clock frequency scaling proportionally, typically 4096 times the Vsync frequency. Because Vsync is low, below 1kHz, when compared to the SLI bus clock SCK frequency, the interface IC has the flexibility to modify and resend data, interrogating the fault latch multiple times within a given vertical sync pulse duration.

以Vysnc脉冲开始,DC&T电路59产生两个PWM脉冲以切换I精确栅极驱动器电路56A和56B的输出,从而在适当的相位延迟之后开启和关闭,以及对于适当的脉冲宽度持续时间或者占空因子D开启和关闭。I精确栅极驱动器电路56A和56B分别感应电流宿MOSFET 55A和55B中的电流,并提供适当的栅极驱动电压以在每个电流宿MOSFET被每个I精确栅极驱动器电路提供的PWM脉冲使能的时间期间维持目标电流。I精确栅极驱动器电路的操作因此是“选通”放大器的操作,该选通放大器被数字地脉冲开启和关闭,但是将LED中的电流控制为模拟参数。Starting with the Vysnc pulse, DC&T circuit 59 generates two PWM pulses to switch the outputs of I precision gate driver circuits 56A and 56B, turning them on and off after the appropriate phase delay and for the appropriate pulse width duration, or duty cycle, D. I precision gate driver circuits 56A and 56B sense the current in current sink MOSFETs 55A and 55B, respectively, and provide the appropriate gate drive voltage to maintain the target current during the time that each current sink MOSFET is enabled by the PWM pulse provided by each I precision gate driver circuit. The operation of the I precision gate driver circuit is thus that of a "gated" amplifier that is digitally pulsed on and off, but controls the current in the LED to an analog parameter.

由Vref信号以及由Iset电阻器54的值对所有LED驱动器IC全局地设置峰值电流。在一个优选实施例中,Vref信号由接口IC产生,或者其可以作为来自SMPS的辅助输出而被提供。The peak current is set globally for all LED driver ICs by the Vref signal and by the value of the Iset resistor 54. In a preferred embodiment, the Vref signal is generated by the interface IC, or it can be provided as an auxiliary output from the SMPS.

任何一个LED串中的具体电流可以由包括8到12位的字的Dot锁存器通过SLI总线进一步控制,该Dot锁存器在256到4096个不同的步骤中分别将电流宿MOSFET的电流调整到峰值电流值的从0%到100%的百分比。以此方式,使用新公开的架构,模拟电流模式数字到模拟转换器或者“电流DAC”的功能的、对LED电流的精确数字控制是可能的。在LCD背光照明应用中,此特征可以用于校准背光亮度,用于改进背光均匀性或者用于操作在3D模式下。The specific current in any one LED string can be further controlled via the SLI bus using an 8- to 12-bit word-based Dot latch, which adjusts the current in the current sink MOSFET to a percentage of the peak current value in 256 to 4096 distinct steps, from 0% to 100%. In this way, using the newly disclosed architecture, precise digital control of LED current is possible, emulating the functionality of a current-mode digital-to-analog converter, or "current DAC." In LCD backlighting applications, this feature can be used to calibrate backlight brightness, improve backlight uniformity, or operate in 3D mode.

如所示,流经LED串52A的电流由电流宿DMOSFET 55A和相应的I精确栅极驱动器电路56A控制。类似地,流经LED串52B的电流由电流宿DMOSFET 55B以及相应的I精确栅极驱动器电路56B控制。施加在电流宿DMOSFET 55A和55B上的最大电压由共源共栅箝位DMOSFET57A和57B限制。只要LED的数量“m”不是太大,电压+VLED就不会超过PN二极管58A和58B的击穿电压,并且电流宿MOSFET上的最大电压将被限制到大约10V,即,在由偏压电路62施加在共源共栅箝位DMOSFET 57A和58B上的栅极偏压以下的一个阈值电压。偏压电路62还产生5伏的Vcc电源,以使用线性电压调压器和滤波电容器53从24V VIN输入操作其内部电路。As shown, the current flowing through LED string 52A is controlled by current sink DMOSFET 55A and corresponding I-accurate gate driver circuit 56A. Similarly, the current flowing through LED string 52B is controlled by current sink DMOSFET 55B and corresponding I-accurate gate driver circuit 56B. The maximum voltage applied to current sink DMOSFETs 55A and 55B is limited by cascode clamp DMOSFETs 57A and 57B. As long as the number of LEDs "m" is not too large, the voltage +VLED will not exceed the breakdown voltage of PN diodes 58A and 58B, and the maximum voltage across the current sink MOSFETs will be limited to approximately 10V, a threshold voltage below the gate bias applied to cascode clamp DMOSFETs 57A and 58B by bias circuit 62. Bias circuit 62 also generates a 5V Vcc supply to operate its internal circuitry from a 24V VIN input using a linear voltage regulator and filter capacitor 53.

电流宿DMOSFET 55A和55B上的漏极电压也由AC&S电路60监视,并且与来自SLI总线移位寄存器61的存储在其SLED寄存器中的过电压值比较。如果该漏极电压在编程的值以下,则LED串正在正常操作。但是,如果电压升高在规定值以上,则一个或多个LED短路,并且检测并记录对于该特定通道的故障。同样,如果I精确栅极驱动器电路不能维持所需的电流,即,LED串正运行在“欠流(undercurrent)”下,这意味着LED故障为开路(fail open),并且电路连续性丢失。然后该通道关断,其CSFB信号被忽略,并且报告故障。可以通过针对饱和情况来监视电流宿DMOSFET来进行感应此“欠流”,其意味着I精确栅极驱动器电路正在尽可能“以全导通”来驱动电流宿DMOSFET的栅极,或者可替换地通过监视跨过I精确栅极驱动器电路的输入端的电压降来进行感应此“欠流”。当在I精确栅极驱动器电路的输入端处的电压下降得太低时,发生欠流情况,由此指示开路LED故障。The drain voltage on current sink DMOSFETs 55A and 55B is also monitored by AC&S circuit 60 and compared to the overvoltage value stored in its SLED register from SLI bus shift register 61. If the drain voltage is below the programmed value, the LED string is operating normally. However, if the voltage rises above the specified value, one or more LEDs are shorted, and a fault is detected and recorded for that particular channel. Similarly, if the I Precision gate driver circuit cannot maintain the required current, that is, the LED string is operating in "undercurrent," this means that the LED has failed open and circuit continuity is lost. The channel is then turned off, its CSFB signal is ignored, and a fault is reported. This "undercurrent" can be sensed by monitoring the current sink DMOSFET for a saturated condition, meaning that the I Precision gate driver circuit is driving the gate of the current sink DMOSFET as "fully on" as possible, or alternatively by monitoring the voltage drop across the input terminals of the I Precision gate driver circuit. When the voltage at the input of the I precision gate driver circuit drops too low, an undercurrent condition occurs, thereby indicating an open LED fault.

如果检测到过温度情况,则报告故障,并且该通道被留下继续导通并且导电,直到接口IC发送关断该通道的命令。但是,如果温度继续升高到危险水平,AC&S电路60将独立地禁用该通道,并且报告该故障。不管故障性质如何、是短路LED、开路LED还是过温度,只要发生故障,AC&S电路60内的开路漏极MOSFET将激活并拉低FLT管脚,用信号通知主机μC已经发生故障情况。If an overtemperature condition is detected, a fault is reported, and the channel is left on and conducting until the interface IC sends a command to shut down the channel. However, if the temperature continues to rise to a dangerous level, the AC&S circuit 60 will independently disable the channel and report the fault. Regardless of the nature of the fault—a shorted LED, an open LED, or overtemperature—as soon as a fault occurs, the open-drain MOSFET within the AC&S circuit 60 will activate and pull the FLT pin low, signaling to the host μC that a fault condition has occurred.

AC&S电路60还包括模拟电流感应反馈(CSFB)信号,其反映在两个电流宿DMOSFET55A和55B的漏极处以及在CSFBI输入管脚处的电压,以确定这三个电压中的哪个最低,并将该电压传递到CSFBO输出管脚。以此方式,最低的电流宿MOSFET源电压以及因此的具有最高正向电压降的LED串被传递到下一驱动器IC的输入并最终回到接口IC,该接口IC响应地产生CSFB信号,SMPS使用该CSFB信号向该LED串的电源轨提供正确的+VLED。集成的电流感应反馈功能使用每个LED驱动器IC上的两个管脚(CSFBI和CSFBO),并且不管LED驱动器IC 51中集成的通道数量如何,在CSFBO管脚上仅输出一个模拟信号。AC&S circuit 60 also includes an analog current sense feedback (CSFB) signal, which reflects the voltages at the drains of the two current sink DMOSFETs 55A and 55B and at the CSFBI input pin to determine which of the three voltages is lowest and pass that voltage to the CSFBO output pin. In this way, the lowest current sink MOSFET source voltage, and therefore the LED string with the highest forward voltage drop, is passed to the input of the next driver IC and ultimately back to the interface IC, which responsively generates the CSFB signal used by the SMPS to provide the correct +V LED to the power rail for that LED string. The integrated current sense feedback function uses two pins (CSFBI and CSFBO) on each LED driver IC and outputs only one analog signal on the CSFBO pin, regardless of the number of channels integrated into LED driver IC 51.

以上述方式,可以实现具有集成的调光和故障检测能力的LED驱动器IC51,而不需要中央接口IC。In the manner described above, an LED driver IC 51 with integrated dimming and fault detection capabilities can be implemented without the need for a central interface IC.

满足以上准则的LED驱动器65的替换实现方式示出在图3B中。被集成在LED驱动器IC 66中的LED驱动器65是具有集成的电流宿DMOSFET但是没有共源共栅箝位OSFET的双通道驱动器。替代地,电流宿DMOSFET 72A和72B包含集成的高电压二极管73A和73B,它们被设计为当DMOSFET 72A和72B处于截止条件时维持高电压。通常,这样的设计最适合于在100V以下的操作,但是根据需要其可以扩展到150V。如在图3A的LED驱动器IC 51中那样,I精确栅极驱动器电路71A和71B促进由模拟控制和感应电路70以及数字控制和定时电路74控制的准确的电流控制。芯片上偏压电源和调压器69对LED驱动器IC 66供电,在此情况下,从Vcc而不是像在驱动器IC 51中那样的从24V输入。除了缺少共源共栅箝位DMOSFET之外,驱动器IC 66与驱动器IC 50类似地操作,通过其的SLI总线75而被控制。An alternative implementation of an LED driver 65 that meets the above criteria is shown in FIG3B . Integrated into LED driver IC 66, LED driver 65 is a dual-channel driver with integrated current sink DMOSFETs but no cascode clamping OSFETs. Instead, current sink DMOSFETs 72A and 72B include integrated high-voltage diodes 73A and 73B, designed to maintain a high voltage when DMOSFETs 72A and 72B are in the off condition. Typically, such a design is best suited for operation below 100V, but can be extended to 150V if needed. As in LED driver IC 51 of FIG3A , I-accurate gate driver circuits 71A and 71B facilitate accurate current control, controlled by analog control and sensing circuitry 70 and digital control and timing circuitry 74. An on-chip bias supply and voltage regulator 69 powers LED driver IC 66, in this case from Vcc rather than the 24V input as in driver IC 51. Driver IC 66 operates similarly to driver IC 50 , except for the lack of the cascode clamp DMOSFET, being controlled via its SLI bus 75 .

LED驱动器IC 66包括使用两个管脚的集成的电流感应反馈功能,并且不管集成的通道数量如何,仅输出一个模拟信号CSFBO。The LED driver IC 66 includes an integrated current sensing feedback function using two pins and outputs only one analog signal CSFBO regardless of the number of integrated channels.

使用前缀复用的SLI总线的发明的LED驱动器80的实现方式示出在图3C中。LED驱动器80是双通道驱动器并且形成在LED驱动器IC 81上。LED驱动器包括:具有集成的高电压二极管88A和88B的电流宿DMOSFET 87A和87B、I精确栅极驱动器电路86A和86B、模拟控制和感应(AC&S)电路85、以及数字控制和定时(DC&T)电路89。芯片上偏压电源和调压器84从Vcc输入对LED驱动器IC 81供电。An implementation of the inventive LED driver 80 using a prefix-multiplexed SLI bus is shown in FIG3C . LED driver 80 is a dual-channel driver and is implemented on an LED driver IC 81. The LED driver includes current sink DMOSFETs 87A and 87B with integrated high-voltage diodes 88A and 88B, I-accurate gate driver circuits 86A and 86B, analog control and sensing (AC&S) circuitry 85, and digital control and timing (DC&T) circuitry 89. An on-chip bias supply and voltage regulator 84 powers LED driver IC 81 from the Vcc input.

LED驱动器80提供对250mA LED驱动器的两个通道的完整控制,其具有150V阻挡能力和±2%的绝对电流准确度,12位的PWM亮度控制,12位的PWM相位控制,8位的电流控制,对于LED开路和LED短路情况的故障检测,以及过温度检测,所有都通过高速SLI总线而被控制,并且通过公共Vsync和灰度时钟(GSC)信号与其他驱动器同步。尽管所示的特定例子例示了额定在150V阻挡能力的电流宿DMOSFET,但是根据需要这些器件可以针对操作而从100V到300V来定大小。器件的250mA额定电流通过在被驱动的两个LED串中的封装的功耗和正向电压的不匹配而设置。在100V额定以上,将高电压共源共栅箝位DMOSFET(未示出)与电流宿DMOSFET 87A和87B串联地集成是有利的,由此电流宿MOSFET 87A和87B不需要在箝位电压以上,即,在12V以上的操作。The LED driver 80 provides complete control of two channels of 250mA LED drivers with 150V blocking capability and ±2% absolute current accuracy, 12-bit PWM brightness control, 12-bit PWM phase control, 8-bit current control, fault detection for open LED and short LED conditions, and over-temperature detection, all controlled via a high-speed SLI bus and synchronized with other drivers via common Vsync and grayscale clock (GSC) signals. While the specific example shown illustrates current sink DMOSFETs rated for 150V blocking capability, these devices can be sized for operation from 100V to 300V as needed. The device's 250mA current rating is set by the package's power dissipation and forward voltage mismatch in the two LED strings being driven. Above the 100V rating, it is advantageous to integrate a high voltage cascode clamp DMOSFET (not shown) in series with current sink DMOSFETs 87A and 87B, whereby current sink MOSFETs 87A and 87B do not need to operate above the clamp voltage, ie, above 12V.

在操作中,LED驱动器IC 81接收在其串行输入SI管脚上的数据流,并将其馈送到前缀复用的SLI总线移位寄存器90的输入。该数据以由未示出的接口IC提供的串行时钟SCK信号设置的速率来设定时钟。该数据的最大时钟速率取决于用于实现移位寄存器90的CMOS技术,但是甚至使用0.5μm线宽工艺和晶圆制造也可实现以10MHz的操作。只要SCK信号继续运行,数据将移位到移位寄存器90中并且最终在其到串行菊链中的下一器件的路径上退出到串行输出管脚SO。In operation, LED driver IC 81 receives a stream of data on its serial input SI pin and feeds it to the input of prefix-multiplexed SLI bus shift register 90. This data is clocked at a rate set by a serial clock SCK signal provided by an interface IC (not shown). The maximum clock rate of this data depends on the CMOS technology used to implement shift register 90, but operation at 10 MHz is achievable even using 0.5 μm linewidth processes and wafer fabrication. As long as the SCK signal continues to operate, the data will shift into shift register 90 and eventually exit to serial output pin SO on its way to the next device in the serial daisy chain.

在对应于特定驱动器IC的数据到达移位寄存器90中之后,SCK信号暂时被发送数据的接口IC停止。解码器91解释要控制的功能锁存器和通道,并指导复用器92将SLI总线接口90内的数据寄存器连接到数字控制和定时(DC&T)电路89或模拟控制和感应(AC&S)电路85内的适当的功能锁存器。After the data corresponding to a particular driver IC arrives in shift register 90, the SCK signal is temporarily deasserted by the interface IC sending the data. Decoder 91 interprets the function latch and channel to be controlled and directs multiplexer 92 to connect the data registers within SLI bus interface 90 to the appropriate function latches within digital control and timing (DC&T) circuitry 89 or analog control and sensing (AC&S) circuitry 85.

其后,Vsync脉冲将来自SLI总线90中的数据移位寄存器的数据锁存到DC&T电路89或AC&S电路85内所包含的锁存器中,这些锁存器包括触发器或静态RAM。在解码器指示SLI总线询问AC&S电路85内的故障锁存器的情况下,则在Vsyn脉冲时,先前被写到AC&S电路85内的故障锁存器中的任何数据将被复制到SLI总线移位寄存器90的适当的位中。Thereafter, the Vsync pulse latches the data from the data shift register in the SLI bus 90 into latches, which may comprise flip-flops or static RAM, contained within the DC&T circuit 89 or the AC&S circuit 85. In the event that the decoder instructs the SLI bus to interrogate the fault latch within the AC&S circuit 85, then any data previously written to the fault latch within the AC&S circuit 85 will be copied to the appropriate bits of the SLI bus shift register 90 at the time of the Vsync pulse.

串行时钟SCK信号的恢复将移动移位寄存器90内的读取和写入位通过菊链而进入下一IC中。在一个优选实施例中,菊链形成连接回到发送数据的接口IC的环路。将新数据发送到菊链中最终推动存在于移位寄存器中的现有数据经过环路并最终回到接口IC。以此方式,接口IC可以与各个LED驱动器IC通信,用于设置LED串亮度和定时,并且各个驱动器IC可以将各自的故障情况传送回到接口IC。The restoration of the serial clock SCK signal shifts the read and write bits within the shift register 90 through the daisy chain to the next IC. In a preferred embodiment, the daisy chain forms a loop that connects back to the interface IC that sent the data. Sending new data into the daisy chain ultimately pushes the existing data in the shift register through the loop and ultimately back to the interface IC. In this way, the interface IC can communicate with each LED driver IC to set the LED string brightness and timing, and each driver IC can communicate its own fault conditions back to the interface IC.

使用此定时钟方案,可以以高速移位数据经过大量驱动器IC,而不影响LED电流或引起闪烁,因为对电流宿DMOSFET 87A和87B的电流和定时控制仅在每个新的Vsync脉冲时改变。Vsync可以从60Hz到960Hz变化,灰度时钟频率成比例地缩放,其通常是Vsync频率的4096倍。因为当与串行时钟SCK信号的频率相比时Vsync较低,在1kHz以下,所以接口IC具有修改和重新发送数据,以及在连续的Vsync脉冲之间的间隔内多次询问故障锁存器的灵活性。Using this clocking scheme, data can be shifted through a large number of driver ICs at high speed without affecting the LED current or causing flicker, because the current and timing control of the current sink DMOSFETs 87A and 87B only change with each new Vsync pulse. Vsync can be varied from 60Hz to 960Hz, with the grayscale clock frequency scaling proportionally, which is typically 4096 times the Vsync frequency. Because Vsync is low, below 1kHz, when compared to the frequency of the serial clock SCK signal, the interface IC has the flexibility to modify and resend data, as well as to interrogate the fault latch multiple times in the interval between consecutive Vsync pulses.

因为在前缀复用的或者“窄的”SLI总线协议中,SLI数据总线90内的数据寄存器不足够大到从单个SLI总线字或数据分组写到DC&T电路89和AC&S电路85内的所有功能锁存器,所以接口IC必须发送多个SLI总线分组到驱动器IC,以加载所有锁存器。当所有功能锁存器第一次初始化时的启动时,或者当必须同时改变多于一个功能锁存器中的数据时,出现此情况。如果允许控制I精确栅极驱动器电路86A和86B的数据经过几个Vsync时段在多个步骤中逐渐改变,例如,首先改变Φ锁存器,然后改变D锁存器,等等,则观看者可能能够分辨出步骤改变作为视频图像中的闪烁或者噪声。围绕此潜在问题的几个发明的解决方案在上述的Williams等人的题为“Low Cost LED Driver with Improved Serial Bus”的申请No.13/346,647中的部分“Simultaneously Loading Multiple Functional Latches”中公开。Because the data registers within the SLI data bus 90 are not large enough to write to all the functional latches within the DC&T circuit 89 and AC&S circuit 85 from a single SLI bus word or data packet in the prefix-multiplexed or "narrow" SLI bus protocol, the interface IC must send multiple SLI bus packets to the driver IC to load all the latches. This situation arises at startup when all the functional latches are first initialized, or when the data in more than one functional latch must be changed simultaneously. If the data controlling the I-precision gate driver circuits 86A and 86B were allowed to change gradually in multiple steps over several Vsync periods—for example, first changing the Φ latch, then the D latch, and so on—a viewer might be able to discern the step changes as flicker or noise in the video image. Several inventive solutions to this potential problem are disclosed in the aforementioned application Ser. No. 13/346,647 to Williams et al., entitled "Low Cost LED Driver with Improved Serial Bus," in the section "Simultaneously Loading Multiple Functional Latches."

在已经加载了功能锁存器数据之后,以下一Vysnc脉冲开始,DC&T电路89产生两个PWM脉冲以切换I精确栅极驱动器电路86A和86B的输出在适当的相位延迟之后开启和关闭,以及对于适当的脉冲宽度持续时间或者占空因子D开启和关闭。I精确栅极驱动器电路86A和86B分别感应电流宿MOSFET 87A和87B中的电流,并提供适当的栅极驱动电压以在电流宿MOSFET 87A和87B被来自I精确栅极驱动器电路86A和86B的PWM脉冲使能的时间期间维持目标电流。I精确栅极驱动器电路的操作因此类似于“选通”放大器的操作,该选通放大器数字地脉冲开启和关闭,但是将LED中的电流控制为模拟参数。After the function latch data has been loaded, starting with the next Vysnc pulse, DC&T circuit 89 generates two PWM pulses to switch the outputs of I precision gate driver circuits 86A and 86B on and off after the appropriate phase delay and for the appropriate pulse width duration, or duty cycle, D. I precision gate driver circuits 86A and 86B sense the current in current sink MOSFETs 87A and 87B, respectively, and provide the appropriate gate drive voltage to maintain the target current during the time that current sink MOSFETs 87A and 87B are enabled by the PWM pulses from I precision gate driver circuits 86A and 86B. The operation of the I precision gate driver circuit is thus similar to that of a "gated" amplifier, which pulses on and off digitally, but controls the current in the LED as an analog parameter.

由Vref信号以及由Iset电阻器82的值而全局地设置所有LED驱动器电路中的峰值电流。在一个优选实施例中,Vref信号由接口IC产生,或者其可以作为来自SMPS的辅助输出而被提供。在一个替换实施例中,可以去除通道特定的Dot校正,并且可以调制Vref以促进对LED电流的全局电流控制。The peak current in all LED driver circuits is set globally by the Vref signal and by the value of the Iset resistor 82. In a preferred embodiment, the Vref signal is generated by the interface IC, or it can be provided as an auxiliary output from the SMPS. In an alternative embodiment, the channel-specific Dot correction can be removed, and Vref can be modulated to facilitate global current control of the LED current.

在能够进行通道特定的Dot校正的驱动器中,任何一个LED串中的电流可以由优选包括8到12位的字的Dot锁存器通过SLI总线而控制,该Dot锁存器在256到4096个不同的步骤中分别将电流宿MOSFET的电流调整到峰值电流值的从0%到100%的百分比。以此方式,使用新公开的架构,模拟电流模式数字到模拟转换器或者“电流DAC”的功能的、对LED电流的精确数字控制是可能的。在LCD背光照明应用中,此特征可以用于校准背光亮度,用于改进背光均匀性,或者用于操作在3D模式下。In a driver capable of channel-specific Dot correction, the current in any one LED string can be controlled via the SLI bus by a Dot latch, preferably consisting of an 8- to 12-bit word. This Dot latch adjusts the current in the current sink MOSFET to a percentage of the peak current value in 256 to 4096 distinct steps, from 0% to 100%. In this way, using the newly disclosed architecture, precise digital control of the LED current is possible, emulating the functionality of a current-mode digital-to-analog converter, or "current DAC." In LCD backlighting applications, this feature can be used to calibrate backlight brightness, improve backlight uniformity, or operate in 3D mode.

在以上引用的Williams等人的题为“Low Cost LED Driver with IntegralDimming Capability”的申请No.13/346,625中详细讨论了I精确栅极驱动器电路86A和86B以及AC&S电路85的结构和操作。The structure and operation of I-accurate gate driver circuits 86A and 86B and AC&S circuit 85 are discussed in detail in the above-referenced application Ser. No. 13/346,625 to Williams et al., entitled “Low Cost LED Driver with Integral Dimming Capability.”

如所示,流经LED串83A的电流由电流宿DMOSFET 87A和相应的I精确栅极驱动器电路86A控制。类似地,流经LED串83B的电流由电流宿DMOSFET87B以及相应的I精确栅极驱动器电路86B控制。没有共源共栅箝位MOSFET,施加在电流宿DMOSFET 87A和87V上的最大电压被限制到在高电压二极管88A和88B的击穿电压以下来操作。偏压电路84从5V Vcc输入产生内部芯片偏压。As shown, the current flowing through LED string 83A is controlled by current sink DMOSFET 87A and corresponding I-accurate gate driver circuit 86A. Similarly, the current flowing through LED string 83B is controlled by current sink DMOSFET 87B and corresponding I-accurate gate driver circuit 86B. Without the cascode clamping MOSFET, the maximum voltage applied to current sink DMOSFETs 87A and 87V is limited to operate below the breakdown voltage of high voltage diodes 88A and 88B. Bias circuit 84 generates internal chip bias from the 5V Vcc input.

电流宿DMOSFET 87A和87B上的漏极电压也由AC&S电路85监视并且与来自SLI总线90的存储在其SLED寄存器中的过电压值比较。如果该漏极电压在编程的值以下,则LED串正在正常操作。但是,如果电压升高在规定值以上,则一个或多个LED短路,并且检测并记录对于该特定通道的故障。同样,如果I精确栅极驱动器电路不能维持所需的电流,即,LED串正运行在“欠流”下,这意味着LED故障开路,并且电路连续性丢失。然后该通道关断,其CSFB信号被忽略,并且报告故障。可以通过针对饱和情况来监视电流宿DMOSFET来进行感应此“欠流”,其意味着I精确栅极驱动器电路正在尽可能“以全导通”来驱动电流宿DMOSFET的栅极,或者可替换地通过监视跨过I精确栅极驱动器电路的输入端的电压降来进行感应此“欠流”。当在I精确栅极驱动器电路的输入端处的电压下降得太低时,发生欠流情况,由此检测开路LED故障。The drain voltage on current sink DMOSFETs 87A and 87B is also monitored by AC&S circuit 85 and compared to the overvoltage value stored in its SLED register from SLI bus 90. If the drain voltage is below the programmed value, the LED string is operating normally. However, if the voltage rises above the specified value, one or more LEDs are shorted, and a fault is detected and recorded for that particular channel. Similarly, if the I Precision gate driver circuit cannot maintain the required current, that is, the LED string is operating in "undercurrent," this means that the LED has failed open and circuit continuity has been lost. The channel is then shut down, its CSFB signal is ignored, and a fault is reported. This "undercurrent" can be sensed by monitoring the current sink DMOSFET for a saturated condition, meaning that the I Precision gate driver circuit is driving the gate of the current sink DMOSFET as "fully on" as possible, or alternatively by monitoring the voltage drop across the input of the I Precision gate driver circuit. When the voltage at the input of the I Precision gate driver circuit drops too low, an undercurrent condition occurs, thereby detecting an open LED fault.

如果检测到过温度情况,则报告故障,并且该通道被留下继续导通并导电,直到接口IC发送关断该通道的命令。但是,如果温度继续升高到危险水平,则AC&S电路85将独立地禁用通道并且报告该故障。不管故障性质如何、是短路LED、开路LED还是过温度,只要发生故障,AC&S电路85内的开路漏极MOSFET将激活并拉低FLT管脚,用信号通知主机μC已经发生故障情况。If an overtemperature condition is detected, a fault is reported, and the channel is left on and conducting until the interface IC sends a command to shut down the channel. However, if the temperature continues to rise to a dangerous level, the AC&S circuit 85 will independently disable the channel and report the fault. Regardless of the nature of the fault—a shorted LED, an open LED, or overtemperature—as soon as a fault occurs, the open-drain MOSFET within the AC&S circuit 85 will activate and pull the FLT pin low, signaling to the host μC that a fault condition has occurred.

AC&S电路85还包括模拟电流感应反馈(CSFB)信号,其反映在两个电流宿DMOSFET87A和87B的漏极处以及在CSFBI输入管脚处的电压,以确定这三个电压中的哪个最低,并将该电压传递到CSFBO输出管脚。以此方式,最低的电流源电压以及因此具有最高正向电压降的LED串被传递到下一LED驱动器的输入并最终回到SMPS以向电源轨供电+VLED。集成在LED驱动器IC 81中的集成的电流感应反馈功能使用两个管脚,并且不管集成的通道数量如何,仅输出一个模拟信号CSFBO。AC&S circuit 85 also includes an analog current sense feedback (CSFB) signal, which reflects the voltages at the drains of the two current sink DMOSFETs 87A and 87B and at the CSFBI input pin to determine which of the three voltages is lowest and pass that voltage to the CSFBO output pin. In this way, the LED string with the lowest current source voltage, and therefore the highest forward voltage drop, is passed to the input of the next LED driver and ultimately back to the SMPS to power the +V LED rail. The integrated current sense feedback function within LED driver IC 81 uses two pins and outputs only one analog signal, CSFBO, regardless of the number of integrated channels.

以上述方式,可以实现具有集成的调光和故障检测能力的两通道LED驱动器81,而不需要中央接口IC。In the manner described above, a two-channel LED driver 81 with integrated dimming and fault detection capabilities can be implemented without the need for a central interface IC.

SLI总线接口IC和系统应用SLI bus interface IC and system applications

图4中的系统100例示了以本公开指定的方式实现的具有局部调光的用于LED背光照明的分布式系统的应用。该图例示了接口IC101,其驱动由公共SMPS 108供电的具有集成的调光和故障检测的一系列LED驱动器IC81A-81H。The system 100 in Figure 4 illustrates an application of a distributed system for LED backlighting with local dimming implemented in the manner specified in this disclosure. The figure illustrates an interface IC 101 driving a series of LED driver ICs 81A-81H with integrated dimming and fault detection powered by a common SMPS 108.

LED驱动器IC 81A-81H的每个(有时在此单独称为LED驱动器IC 81)可以包括图3所示的采用前缀复用的SLI总线协议的设备,或者替换地可以包括诸如图3A和3B所示的设备的采用宽总线协议的设备。每个驱动器IC 81可以类似地并入如图3B和3C所示的高电压电流宿DMOSFET,或者替换地可以集成诸如图3A所示的共源共栅箝位保护的电流宿DMOSFET。在系统10中,例示了LED驱动器IC 81而没有复用器92和解码器91(图3C所示),其中,应该理解,这样的功能在需要时,即,只要利用了前缀复用的SLI总线协议时则被嵌入在SLI总线接口90内。Each of the LED driver ICs 81A-81H (sometimes individually referred to herein as LED driver IC 81) can include a device utilizing the prefix-multiplexed SLI bus protocol as shown in FIG3 , or alternatively, can include a device utilizing a wide bus protocol such as the device shown in FIG3A and 3B . Each driver IC 81 can similarly incorporate a high-voltage current sink DMOSFET as shown in FIG3B and 3C , or alternatively can integrate a current sink DMOSFET with cascode clamp protection such as that shown in FIG3A . In system 10 , LED driver IC 81 is illustrated without multiplexer 92 and decoder 91 (shown in FIG3C ), with the understanding that such functionality is embedded within SLI bus interface 90 when desired, i.e., whenever the prefix-multiplexed SLI bus protocol is utilized.

包括三个数字时钟信号、一个数字故障信号、以及一个模拟参考电压的五个公共信号线107将接口IC 90连接到每个驱动器IC 81。定时和控制电路124产生与经过SPI总线接口122接收的来自A主机μC(未示出)的数据同步的Vsync和GSC信号。定时和控制电路124还监视FLT中断线以立即检测潜在的问题。参考电压源125全局地向系统提供参考电压以便确保良好的通道与通道电流匹配。偏压供应电路126从由SMPS 108产生的固定的+24V电源轨110所供应的VIN电压对接口IC 101供电。偏压供应电路126还产生调压的电源电压Vcc以对LED驱动器81A-81H供电,该电源电压Vcc优选是5V。Vcc电源电压通过电容器102滤波。Five common signal lines 107, including three digital clock signals, a digital fault signal, and an analog reference voltage, connect the interface IC 90 to each driver IC 81. A timing and control circuit 124 generates Vsync and GSC signals synchronized with data received from the A-host μC (not shown) via the SPI bus interface 122. The timing and control circuit 124 also monitors the FLT interrupt line to immediately detect potential problems. A reference voltage source 125 provides a global reference voltage to the system to ensure good channel-to-channel current matching. A bias supply circuit 126 powers the interface IC 101 from the VIN voltage supplied by the fixed +24V power rail 110 generated by the SMPS 108. The bias supply circuit 126 also generates a regulated supply voltage, Vcc, to power the LED drivers 81A-81H. The Vcc supply voltage is filtered by a capacitor 102.

在此例子中,每个LED驱动器81A-81H包括:包含电流宿MOSFET87A-87Q的高电压电流控制的两个通道,其具有集成的HV二极管88A-88Q、I精确栅极驱动器电路86A-86Q、DC&T电路89A-89H、AC&S电路85A-85H、以及串行SLI总线接口移位寄存器90A-90H。尽管LED驱动器IC 81类似于图3B所示的驱动器IC 66而缺少共源共栅箝位电路,但是除了24VVIN电源而不是Vcc被用于对LED驱动器IC供电以及对共源共栅箝位DMOSFET的栅极偏压之外,该系统配置与图3A所示的LED驱动器IC 51同样好地工作。In this example, each LED driver 81A-81H includes two channels of high voltage current control including current sink MOSFETs 87A-87Q with integrated HV diodes 88A-88Q, I-accurate gate driver circuits 86A-86Q, DC&T circuits 89A-89H, AC&S circuits 85A-85H, and serial SLI bus interface shift registers 90A-90H. Although LED driver IC 81 is similar to driver IC 66 shown in FIG3B and lacks the cascode clamp circuit, this system configuration works just as well as LED driver IC 51 shown in FIG3A, except that the 24V VIN supply is used to power the LED driver IC and bias the gates of the cascode clamp DMOSFETs instead of Vcc.

在所示的例子中,包括连接LED驱动器81的线113A-113I的SLI总线113包括菊链,其中接口IC 101内的SLI电路123的SO串行输出经由线113A连接到LED驱动器81A的SI输入,LED驱动器81A的SO输出经由线113B连接到LED驱动器81B(未示出)的SI输入,等等。SLI总线113H连接到系统100中所示的最后的LED驱动器81H的SI输入。LED驱动器81H的SO输出转而经由线113I连接到接口IC 101内的SLI电路123的SI输入。以此方式,SLI总线113A-113I(统称为SLI总线113)形成从接口IC 101发源、行进经过每个LED驱动器IC 81A-81H(统称为LED驱动器IC 81)并回到其自身的完整环路。将数据移出接口IC 101的SO管脚同时将相等长度的位串返回到接口IC 101的SI管脚。In the example shown, the SLI bus 113, including lines 113A-113I connecting LED drivers 81, comprises a daisy chain in which the SO serial output of SLI circuitry 123 within interface IC 101 is connected via line 113A to the SI input of LED driver 81A, the SO output of LED driver 81A is connected via line 113B to the SI input of LED driver 81B (not shown), etc. SLI bus 113H is connected to the SI input of the last LED driver 81H shown in system 100. The SO output of LED driver 81H is in turn connected via line 113I to the SI input of SLI circuitry 123 within interface IC 101. In this manner, SLI buses 113A-113I (collectively, SLI bus 113) form a complete loop originating from interface IC 101, traveling through each of LED driver ICs 81A-81H (collectively, LED driver ICs 81), and back to itself. Data is shifted out of the SO pin of interface IC 101 while a bit string of equal length is returned to the SI pin of interface IC 101 .

SLI电路123产生需要的SLI总线串行时钟SCK信号。因为LED驱动器IC 81没有芯片地址,所以通过SLI总线113定时钟的位的数量必须恰当地与被驱动的器件的数量相关。被驱动的器件的数量以及因此的通过SLI总线113定时钟的位的数量可以通过对SPI总线接口112中的数据交换进行编程的软件或者通过对接口IC 101的硬件修改而调整。以此方式,系统100内的通道的数量可以灵活的变化以匹配显示器的大小。经过SLI总线113移位的、即,在总线113上广播的位的数量取决于所采用的SLI总线协议以及SLI总线移位寄存器90A-90H中的位的总数。例如,“宽”SLI总线协议需要每个双通道LED驱动器的72到88位,而前缀复用的SLI总线明显更小,例如需要每个LED驱动器IC的固定的32位,而不管集成到每个驱动器IC中的通道的数量如何。SLI circuitry 123 generates the required SLI bus serial clock SCK signal. Because LED driver IC 81 does not have a chip address, the number of bits clocked via SLI bus 113 must be appropriately correlated to the number of devices being driven. The number of devices being driven, and therefore the number of bits clocked via SLI bus 113, can be adjusted via software programming the data exchange within SPI bus interface 112 or via hardware modifications to interface IC 101. In this way, the number of channels within system 100 can be flexibly varied to match the size of the display. The number of bits shifted across SLI bus 113, i.e., broadcasted on bus 113, depends on the SLI bus protocol employed and the total number of bits in SLI bus shift registers 90A-90H. For example, a "wide" SLI bus protocol requires 72 to 88 bits per two-channel LED driver, while a prefix-multiplexed SLI bus requires significantly less, for example, a fixed 32 bits per LED driver IC, regardless of the number of channels integrated into each driver IC.

当使用硬件接口IC 101来控制SLI总线通信时,修改SLI总线电路123中的寄存器以移出更少或更多的位需要在接口IC 101的制造或设计中的修改。替换的方法涉及用使用软件来调整驱动器以在菊链中容纳更少或更多的LED驱动器的可编程接口IC替代接口IC101。When a hardware interface IC 101 is used to control SLI bus communications, modifying registers in the SLI bus circuitry 123 to shift out fewer or more bits requires modifications in the manufacture or design of the interface IC 101. An alternative approach involves replacing the interface IC 101 with a programmable interface IC that uses software to adjust the drivers to accommodate fewer or more LED drivers in the daisy chain.

被传递到SMPS 108的电流感应反馈(CSFB)信号由模拟菊链产生,LED驱动器IC81H上的CSFBI输入管脚经由线112I联系于Vcc,LED驱动器IC 112H的CSFBO输出管脚经由线113H连接到LED驱动器81G的CSFBI输入管脚,等等,每个驱动器IC包括一个CSFBI输入管脚和一个CSFBO输出管脚。最后,线112B将LED驱动器IC 81B的CSFBO输出管脚连接到LED驱动器IC 81A的CSFBI输入管脚,进而将其CSFBO输出管脚经过线112A连接到接口IC 101的CSFBI输入管脚。CSFB信号只要经过驱动具有比先前的串更高的正向电压降Vf的LED串的驱动器IC,其电压就下降。The current sense feedback (CSFB) signal delivered to SMPS 108 is generated by analog daisy chaining. The CSFBI input pin on LED driver IC 81H is connected to Vcc via line 112I. The CSFBO output pin of LED driver IC 112H is connected to the CSFBI input pin of LED driver 81G via line 113H, and so on. Each driver IC includes one CSFBI input pin and one CSFBO output pin. Finally, line 112B connects the CSFBO output pin of LED driver IC 81B to the CSFBI input pin of LED driver IC 81A, which in turn connects its CSFBO output pin to the CSFBI input pin of interface IC 101 via line 112A. The CSFB signal drops in voltage whenever it passes through a driver IC driving an LED string with a higher forward voltage drop, Vf, than the previous string.

作为菊链,没有一条具有一个特定电压的公共线,而是CSFB电压在该链中从第一个LED驱动器IC级联到最后一个LED驱动器IC,最后的线112A上的CSFB电压表示在整个LED阵列中具有最高Vf的LED串。运算跨导放大器OTA 127将线112A上的最终的CSFB信号转换为在接口IC 101的ICSFB管脚处的电流感应反馈(CSFB)信号,其经由线111被传递到SMPS108。响应于该CSFB信号,SMPS 108将电源轨109上的+VLED电压驱动到用于无闪烁照明的最佳电压,而没有过多的功耗。As a daisy chain, there is no common line with a specific voltage. Instead, the CSFB voltage cascades from the first LED driver IC to the last LED driver IC in the chain, with the final CSFB voltage on line 112A representing the LED string with the highest Vf in the entire LED array. Operational transconductance amplifier OTA 127 converts the final CSFB signal on line 112A into a current sense feedback (CSFB) signal at the ICSFB pin of interface IC 101, which is passed to SMPS 108 via line 111. In response to this CSFB signal, SMPS 108 drives the +V LED voltage on power rail 109 to the optimal voltage for flicker-free lighting without excessive power consumption.

在系统100中,由接口IC 101和CSFB菊链112A-112I生成CSFB信号111的仅仅单个值以驱动SMPS 108。在需要多于一个+VLED电源电压的系统中,例如,在较大的较高电流照明的显示器或者具有RGB背光照明的显示器中,需要多于一个接口IC 101来对多于一个SMPS供电。例如,通过对于不同颜色的LED重复整个系统100,即,一个系统用于红色LED,一个系统用于蓝色LED,并且第三系统用于绿色LED,本架构可以扩展到多个SMPS解决方案,尽管成本相对较高。这样,接口IC 101的三个实例将共同经由共享的SPI总线与公共背光μC和缩放器IC通信,否则将独立地操作。不幸的是,这样的方法也将互联导线的数量加为三倍,使PCB设计极大地复杂化。In system 100, only a single value of CSFB signal 111 is generated by interface IC 101 and CSFB daisy chains 112A-112I to drive SMPS 108. In systems requiring more than one +V LED supply voltage, such as in larger displays with higher current illumination or displays with RGB backlighting, more than one interface IC 101 is needed to power more than one SMPS. For example, by duplicating the entire system 100 for different LED colors—i.e., one system for red LEDs, one for blue LEDs, and a third for green LEDs—this architecture can be expanded to multiple SMPS solutions, albeit at a relatively higher cost. Thus, three instances of interface IC 101 would collectively communicate with a common backlight μC and scaler IC via a shared SPI bus, which would otherwise operate independently. Unfortunately, this approach also triples the number of interconnect wires, significantly complicating the PCB design.

图5是系统100的简化框图,其例示了使用具有SLI串行总线控制的智能LED驱动器并且去除了高管脚数封装接口IC的明显减少的构建材料。如所示,十六个串的LED 83A-83Q仅由八个小的LED驱动器81A-81H驱动,其所有都响应于主机μC7和缩放器IC 8而由接口IC101-SLI总线113A-113I控制。与包括32个离散的MOSFET和72管脚接口IC的图1相比,新架构的系统成本极大地降低。利用明显更少的组件,也增强了系统可靠性。FIG5 is a simplified block diagram of system 100, illustrating the significantly reduced construction materials achieved by using intelligent LED drivers with SLI serial bus control and eliminating high-pin-count interface ICs. As shown, sixteen strings of LEDs 83A-83Q are driven by only eight small LED drivers 81A-81H, all of which are controlled by interface IC 101 and SLI bus 113A-113I in response to host μC 7 and scaler IC 8. Compared to FIG1 , which includes 32 discrete MOSFETs and a 72-pin interface IC, the new architecture significantly reduces system cost. Utilizing significantly fewer components also enhances system reliability.

系统100还容易部署,因为仅在接口IC 101和卫星LED驱动器81A-81H之间使用SLI总线协议。μC7和接口IC 101或缩放器IC 8之间的通信仍使用更复杂的较高开销SPI总线来通信。在一些系统中,接口IC 101、微控制器7和中间SPI总线接口可以去除,替代地可以将算法控制移入缩放器8中以促进完全在软件控制下的完全可缩放的系统。System 100 is also easy to deploy because the SLI bus protocol is used only between interface IC 101 and satellite LED drivers 81A-81H. Communication between μC 7 and interface IC 101 or scaler IC 8 still uses the more complex, higher-overhead SPI bus. In some systems, interface IC 101, microcontroller 7, and the intermediate SPI bus interface can be eliminated, and algorithm control can instead be moved into scaler 8 to facilitate a fully scalable system under complete software control.

如所示,系统100中仅存在两个模拟信号,在线107之一上的公共Vref,以及在线113A-113I上的菊链链接的CSFB信号,其中,模拟反馈电压CSFB或者可选的模拟反馈电流ICSFB信号控制SMPS 108的+VLED。在SMPS 108需要模拟电流而不是电压以用于其反馈输入的情况下,需要接口IC 101将在其CSFBI管脚处的模拟反馈电压转换为线111上的模拟反馈电流ICSFB信号。运算跨导放大器或OTA——集成在混合信号接口IC 101内的专门的精确模拟电路进行此功能。利用少的模拟信号并且没有具有高阻抗输入的离散DMOSFET,系统100相对不受噪声影响。As shown, only two analog signals are present in system 100: a common Vref on one of lines 107, and a daisy-chained CSFB signal on lines 113A-113I. The analog feedback voltage CSFB, or optionally the analog feedback current ICSFB signal, controls + VLED of SMPS 108. In cases where SMPS 108 requires an analog current rather than a voltage for its feedback input, interface IC 101 is required to convert the analog feedback voltage at its CSFBI pin into the analog feedback current ICSFB signal on line 111. An operational transconductance amplifier, or OTA,—a specialized precision analog circuit integrated within mixed-signal interface IC 101—performs this function. With few analog signals and no discrete DMOSFETs with high-impedance inputs, system 100 is relatively immune to noise.

采用源自线112A-112I上的CSFB信号的经由接口IC 101提供的单个CSFB信号来控制系统100中的SMPS 108,接口IC 101被限于与单个SMPS 108一起来操作。仅具有单个电源和反馈信号,背光模块的最大功率被限于处理SMPS 108的能力的功率。在高功率水平,变得期望将电源“划分”为多个电源以便维持较高的转换器效率以及更为冷却的操作。在所示的配置中,不能在没有增加接口IC 101的数量到等于所使用的开关模式电源的数量的情况下,提供多个ICSFB信号。The SMPS 108 in the system 100 is controlled using a single CSFB signal provided via the interface IC 101, derived from the CSFB signals on lines 112A-112I, which is limited to operating with a single SMPS 108. With only a single power supply and feedback signal, the maximum power of the backlight module is limited to the power handling capabilities of the SMPS 108. At high power levels, it becomes desirable to "split" the power supply into multiple supplies in order to maintain higher converter efficiency and cooler operation. In the configuration shown, multiple CSFB signals cannot be provided without increasing the number of interface ICs 101 to equal the number of switch-mode power supplies used.

此外,限于单个+VLED电源,LED串的电压不匹配的统计范围随着串的数量而增加,导致LED驱动器IC 81A-81H中的较高功耗、SMPS 108所需的较高的传递的功率、较高的发热、以及较低的整体背光系统效率。Furthermore, limited to a single +V LED supply, the statistical range of LED string voltage mismatch increases with the number of strings, resulting in higher power dissipation in the LED driver ICs 81A-81H, higher delivered power required by the SMPS 108, higher heat generation, and lower overall backlight system efficiency.

系统100中的单个CSFB信号还阻止其在RGB背光模块中的应用,除非整个系统增加三倍,一个系统用于驱动红色LED的串,另一个系统用于驱动绿色LED的串,并且第三系统用于蓝色LED。The single CSFB signal in system 100 also prevents its application in an RGB backlight module unless the entire system is tripled, with one system for driving strings of red LEDs, another system for driving strings of green LEDs, and a third system for blue LEDs.

即使具有到SMPS 108的单个CSFB线11,每个LED驱动器IC 81A-81H仍必须将其十六个管脚中的两个专用于模拟CSFBI和CSFBO信号,其减少了否则可用于增加LED驱动器通道的数量、用于并入新的特征或者可用于使用来降低封装的热电阻的封装管脚的数量。Even with a single CSFB line 11 to the SMPS 108, each LED driver IC 81A-81H must still dedicate two of its sixteen pins to the analog CSFBI and CSFBO signals, which reduces the number of package pins that could otherwise be used to increase the number of LED driver channels, to incorporate new features, or to use to reduce the thermal resistance of the package.

需要的是去除专用于每个LED驱动器IC上的CSFB功能的两个管脚所需的,并且对于去除这两个管脚有益的支持多个CSFB信号的手段。What is needed is a means of supporting multiple CSFB signals that eliminates the need for, and benefits from, the two pins dedicated to the CSFB function on each LED driver IC.

具有SLI总线嵌入式CSFB的LED背光照明系统LED backlighting system with SLI bus embedded CSFB

为了重申,图5所示的系统100例示了线112A-112I上的电流感应反馈信号将LED驱动器IC 81连接到接口IC 101,并最终经过线111到SMPS 108。电流感应反馈或CSFB的功能是测量跨过每个LED串82的电压,确定哪个串具有最高的正向电压,并控制+VLED输出对所有LED串供电的一个电源轨109以确保+VLED足够用于每个串操作在指定的并且恒定水平的电流。To reiterate, the system 100 shown in Figure 5 illustrates current sense feedback signals on lines 112A-112I connecting the LED driver IC 81 to the interface IC 101 and ultimately to the SMPS 108 via line 111. The function of the current sense feedback or CSFB is to measure the voltage across each LED string 82, determine which string has the highest forward voltage, and control the + VLED output of one power rail 109 that powers all of the LED strings to ensure that + VLED is sufficient for each string to operate at a specified and constant level of current.

此方法的一个缺点是模拟CSFB信号需要每个LED驱动器IC上的两个管脚,这在16管脚的封装上浪费了管脚的八分之一——这些管脚可以投入于改进热电阻、添加功能、或者增加驱动器中的通道的数量。使用模拟CSFB信号的另一个缺点是没有促进支持对于RGB和多个SMPS背光系统的几个CSFB信号的便利的手段。One disadvantage of this approach is that the analog CSFB signal requires two pins on each LED driver IC, which wastes one-eighth of the pins on a 16-pin package—pins that could be invested in improving thermal resistance, adding functionality, or increasing the number of channels in the driver. Another disadvantage of using analog CSFB signals is that there is no convenient means to facilitate support for several CSFB signals for RGB and multiple SMPS backlight systems.

因为SLI总线113上的信号还将相同的LED驱动器IC互连到接口IC 101,所以CSFB信号可以数字地嵌入在SLI总线信号中,去除了对于线112A-112H上的模拟CSFB信号的需要。在此公开这样做的益处。Because the signals on SLI bus 113 also interconnect the same LED driver IC to interface IC 101, the CSFB signal can be digitally embedded in the SLI bus signal, eliminating the need for analog CSFB signals on lines 112A-112H. The benefits of doing so are disclosed herein.

图6例示了具有嵌入的CSFB的LED背光系统170。与先前所述的系统100相比,需要改变以将CSFB信号嵌入到SLI总线中的仅有的组件是LED驱动器IC 174H-174H(有时在此称为驱动器IC 174)和接口IC 171。这样,LED驱动器IC 174包括模拟到数字转换器,以将电压反馈转换为数字等效物并将该信息嵌入在SLI总线数据流161内。数字SLI总线协议内的此嵌入的CSFB信号随后被接口IC 171内包含的DAC或者数字到模拟转换器转换回到模拟信号。这样,嵌入在SLI总线协议和接口内的CSFB功能有益地消除了对于模拟CSFB信号和专用的封装管脚的需要。FIG6 illustrates an LED backlight system 170 with embedded CSFB. Compared to the previously described system 100, the only components that need to be changed to embed the CSFB signal into the SLI bus are the LED driver ICs 174H-174H (sometimes referred to herein as driver ICs 174) and the interface IC 171. Thus, the LED driver ICs 174 include analog-to-digital converters to convert the voltage feedback into a digital equivalent and embed this information within the SLI bus data stream 161. This embedded CSFB signal within the digital SLI bus protocol is then converted back to an analog signal by a DAC, or digital-to-analog converter, contained within the interface IC 171. Thus, the CSFB functionality embedded within the SLI bus protocol and interface advantageously eliminates the need for an analog CSFB signal and dedicated package pins.

如所述,嵌入的CSFB功能被实施以控制单个SMPS和+VLED电源轨。发明的嵌入的CSFB方法可以容易地被修改以控制用于较高功率背光系统或者用于RGB背光照明应用的多个电源。稍后在本申请中描述本发明的此替换实施例。As described, the embedded CSFB function is implemented to control a single SMPS and +V LED power rail. The invented embedded CSFB method can be easily modified to control multiple power supplies for higher power backlight systems or for RGB backlighting applications. This alternative embodiment of the invention is described later in this application.

应该注意到,在本发明的其他实施例中,接口IC 171可以去除,并且其功能可以重新分布到系统内的其他组件中。例如,调光、相位控制、点校正和故障管理的数字功能可以在μC7内或者在缩放器IC8内进行,而模拟Vref可以在SMPS 108内产生,添加到μC7中或者由小的离散IC提供。同样,在SLI总线161上的CSFB信号的数字表示到线160上的模拟CSFB反馈信号的转换可以集成到SMPS 108中,添加到μC7中或者由小的离散IC提供,可能还在同一小IC内,例如在8管脚封装内集成了运算跨导放大器和Vref。It should be noted that in other embodiments of the present invention, interface IC 171 can be eliminated and its functionality redistributed to other components within the system. For example, the digital functions of dimming, phase control, dot correction, and fault management can be performed within μC 7 or within scaler IC 8, while the analog Vref can be generated within SMPS 108, added to μC 7, or provided by a small discrete IC. Similarly, the conversion of the digital representation of the CSFB signal on SLI bus 161 to the analog CSFB feedback signal on line 160 can be integrated into SMPS 108, added to μC 7, or provided by a small discrete IC, possibly within the same small IC, such as an operational transconductance amplifier and Vref integrated into an 8-pin package.

为了将CSFB信号嵌入到SLI总线161中,可以采用不同的SLI总线协议。一个这样的协议、所谓的“宽”SLI总线协议和硬件涉及包含用于每个通道和每个SLI总线传输中的每个功能的所有参数信息的相对长的数字字。在此称为“前缀复用的”SLI总线的第二协议将SLI总线命令的大小降低到固定程度,落日32位,并促进仅更新那些改变的参数而不需要在每次需要特定更新时重新广播用于每个通道和功能的所有参数数据。在以下部分中描述这两个SLI总线协议和每个版本中的SLI总线嵌入的CSFB功能的实现方式。To embed CSFB signals into the SLI bus 161, various SLI bus protocols can be employed. One such protocol, the so-called "wide" SLI bus protocol and hardware, involves relatively long digital words containing all parameter information for each channel and each function in the SLI bus transmission. A second SLI bus protocol, referred to herein as "prefix multiplexed," reduces the size of SLI bus commands to a fixed size of 32 bits and facilitates updating only those parameters that change without rebroadcasting all parameter data for each channel and function each time a specific update is required. The following sections describe these two SLI bus protocols and the implementation of the SLI bus-embedded CSFB functionality in each version.

将嵌入的CSFB实现到宽SLI总线协议&接口中Implementing embedded CSFB into wide SLI bus protocols & interfaces

具有SLI总线嵌入的CSFB功能的LED驱动器的一个实现方式示出在图7A中。包括在LED驱动器IC 200中的是包含移位寄存器220A、221A、222A、220B、221B、222B、223、224和225的SLI总线移位寄存器201、数字控制和定时(DC&T)电路202、和模拟控制和感应(AC&S)电路203。所示的例子是双通道驱动器,但是可以以类似的方式实现其他数量的通道。One implementation of an LED driver with SLI bus embedded CSFB functionality is shown in FIG7A . Included in LED driver IC 200 is an SLI bus shift register 201 comprising shift registers 220A, 221A, 222A, 220B, 221B, 222B, 223, 224, and 225, a digital control and timing (DC&T) circuit 202, and an analog control and sensing (AC&S) circuit 203. The example shown is a two-channel driver, but other numbers of channels can be implemented in a similar manner.

LED驱动器IC 200是混合信号,其组合了数字和模拟信号,包括数字SLI移位寄存器201,其通过几个通常是12位宽的并行的数据总线连接到数字DC&T电路202,并且还通过范围从4位到12位宽的各种并行数据总线连接到模拟AC&S电路203。The LED driver IC 200 is mixed signal, combining digital and analog signals, and includes a digital SLI shift register 201 connected to a digital DC&T circuit 202 via several parallel data buses, typically 12 bits wide, and also connected to an analog AC&S circuit 203 via various parallel data buses ranging from 4 bits to 12 bits wide.

DC&T电路202的输出以通过Vsync和GSK灰度时钟信号同步的精确的定时数字地切换I精确栅极驱动器电路206A和206B以及电流宿DMOSFET205A和205B开启和关闭。电流宿DMOSFET 205A和205B响应于来自AC&S电路203的模拟信号而控制未示出的两个LED串中的电流ILEDA和ILEDB,其进而控制由I精确栅极驱动器电路206A和206B输出的栅极驱动信号。栅极驱动信号是模拟的,使用具有反馈的放大器以确保电流宿DMOSFET 205A和205B的每个中的导电电流是也由AC&T电路203提供的参考电流Iref的固定倍数。The output of DC&T circuit 202 digitally switches I-accurate gate driver circuits 206A and 206B and current sink DMOSFETs 205A and 205B on and off with precise timing synchronized by Vsync and the GSK grayscale clock signal. Current sink DMOSFETs 205A and 205B control the currents I LEDA and I LEDB in two LED strings (not shown) in response to analog signals from AC&S circuit 203, which in turn control the gate drive signals output by I-accurate gate driver circuits 206A and 206B. The gate drive signals are analog, using amplifiers with feedback to ensure that the conduction current in each of current sink DMOSFETs 205A and 205B is a fixed multiple of a reference current I ref , also provided by AC&T circuit 203.

尽管LED驱动器IC系统200仅包括电流宿DMOSFET 205A和205B,但是该电路与如图3A所示的共源共栅箝位的LED驱动器输出或者如图3B和图3C例示的高电压电流宿版本兼容。为了实现共源共栅箝位的版本,两个高电压N沟道DMOSFET与电流宿DMOSFET 205A和205B串联,其源极端联系于电流宿DMOSFET的漏极端,并且起漏极端联系于相应的被驱动的LED串的阳极。Although the LED driver IC system 200 includes only current sink DMOSFETs 205A and 205B, the circuit is compatible with either a cascode-clamped LED driver output as shown in FIG3A or a high-voltage current sink version as illustrated in FIG3B and FIG3C . To implement the cascode-clamped version, two high-voltage N-channel DMOSFETs are connected in series with the current sink DMOSFETs 205A and 205B, with their source terminals connected to the drain terminals of the current sink DMOSFETs and their drain terminals connected to the anodes of the corresponding driven LED strings.

电流宿DMOSFET 205A和205B的漏极电压和源极电压两者被用于通过LED检测电路215监视LED串的状态,特别是源极电压被用于检测开路LED串,而漏极电压用于检测短路LED。故障设置锁存器224可以用于编程用于检测短路LED的电压水平。Both the drain and source voltages of current sink DMOSFETs 205A and 205B are used to monitor the status of the LED string via LED detection circuit 215. Specifically, the source voltage is used to detect an open LED string, while the drain voltage is used to detect a shorted LED. A fault-set latch 224 can be used to program the voltage level for detecting a shorted LED.

电流宿DMOSFET 205A和205B的漏极电压还通过CSFB电路218A使用来确定具有最高LED电压降的通道,即,具有最低的漏极电压的DMOSFET。CSFB电路218A向模拟到数字(A/D)转换器218B输出等于电流宿DMOSFET 205A和205B的漏极电压中的较低者的电压,并且A/D转换器218B将此较低漏极电压转换为其等效的数字值,将其存储在SLI总线移位寄存器201中的CSFB移位寄存器223中。尽管可以持续地更新CSFB电压,但是正常地,对于控制对LED串供电的相对低带宽的SMPS来说这是不是必须的。在许多情况下每个Vsync脉冲一个采样是足够的。The drain voltages of current sink DMOSFETs 205A and 205B are also used by CSFB circuit 218A to determine the channel with the highest LED voltage drop, i.e., the DMOSFET with the lowest drain voltage. CSFB circuit 218A outputs a voltage equal to the lower of the drain voltages of current sink DMOSFETs 205A and 205B to analog-to-digital (A/D) converter 218B, and A/D converter 218B converts this lower drain voltage to its equivalent digital value, which is stored in CSFB shift register 223 within SLI bus shift register 201. While the CSFB voltage can be continuously updated, this is not normally necessary for controlling the relatively low-bandwidth SMPS powering the LED strings. In many cases, one sample per Vsync pulse is sufficient.

在操作中,数据以时钟速率SCK通过串行输入管脚SI被按时钟输入(clock in)到SI移位寄存器201中。这包括将数据移位到用于通道A和通道B的PWM准时数据的12位数据寄存器220A和220B中、用于通道A和通道B的相位延迟数据的12位数据寄存器221A和221B中、用于通道A和通道B的“点”当前数据的12位数据寄存器222A和222B中、以及包括用于Flt设置的8位寄存器224和用于Flt状态的4位寄存器225的用于故障信息的12位中。另外,对于具有嵌入的CSFB的驱动器,SLI总线移位寄存器201还包括包含A/D转换器218A输出的字的4位寄存器223,其表示LED驱动器IC200的CSFB电压输出。在新数据按时钟输入时,在这些寄存期内的数据从SO管脚按时钟输出。暂停SCK信号将数据静态地保持在移位寄存器内。术语“通道A”和“通道B”是任意的,并且仅用于标识输出以及其在SLI数据流中的相应数据。In operation, data is clocked into the SI shift register 201 at a clock rate of SCK via the serial input pin SI. This includes shifting data into 12-bit data registers 220A and 220B for PWM on-time data for channels A and B, 12-bit data registers 221A and 221B for phase-delayed data for channels A and B, 12-bit data registers 222A and 222B for "dot" current data for channels A and B, and 12 bits for fault information, including an 8-bit register 224 for Flt setting and a 4-bit register 225 for Flt status. Additionally, for drivers with embedded CSFB, the SLI bus shift register 201 also includes a 4-bit register 223 containing the word output by the A/D converter 218A, representing the CSFB voltage output of the LED driver IC 200. Data within these register periods is clocked out of the SO pin as new data is clocked in. Pausing the SCK signal holds the data statically within the shift register.The terms "channel A" and "channel B" are arbitrary and are used only to identify the outputs and their corresponding data in the SLI data stream.

在接收到Vsync脉冲之后,来自PWM A寄存器220A的数据被加载到D锁存器211A中,并且来自相位A寄存器221A的数据被加载到锁存器&计数器A电路210A的Φ锁存器212A中。同时,来自PWM B寄存器220B的数据被加载到D锁存器211B中,并且来自相位B寄存器221B的数据被加载到锁存器&计数器B电路210B的Φ锁存器212B中。在接收到在GSC灰度时钟上的随后的时钟信号之后,两个计数器对其Φ锁存器212A和212B中的脉冲的数量计数,其后分别使电流能够在I精确栅极驱动器电路206A和206V中流动,使连接到该特定通道的LED串照明。在D锁存器220A和220B中存储的脉冲数量的持续时间中,通道保持使能并导电。其后,输出被切换为关闭并且等待下一Vsync脉冲以重复此过程。DC&T电路202因此根据SLI总线数据将两个PWM脉冲同步。After receiving a Vsync pulse, data from PWM A register 220A is loaded into D latch 211A, and data from Phase A register 221A is loaded into Φ latch 212A of Latch & Counter A circuit 210A. Simultaneously, data from PWM B register 220B is loaded into D latch 211B, and data from Phase B register 221B is loaded into Φ latch 212B of Latch & Counter B circuit 210B. After receiving a subsequent clock signal on the GSC grayscale clock, both counters count the number of pulses in their Φ latches 212A and 212B, respectively, and then enable current to flow in I-accurate gate driver circuits 206A and 206V, respectively, illuminating the LED string connected to that particular channel. The channel remains enabled and conductive for the duration of the number of pulses stored in D latches 220A and 220B. The output is then switched off and awaits the next Vsync pulse to repeat the process. The DC&T circuit 202 thus synchronizes the two PWM pulses according to the SLI bus data.

还与Vsync脉冲同步,存储在Dot A和Dot B锁存器222A和222B中的数据被复制到D/A转换器213A和213B中,设置DMOSFET 205A和205B中的电流。如所示,D/A转换器213A和213B是提供Iref的精确分数部分以设置LED串中的电路的离散电路。可替换地,在优选实施例中,I精确栅极驱动器电路213A和213B并入使用二进制加权的可调电流镜,并且能够设置所希望的最大电流的分数部分。表示最大通道电流的参考电流Iref由Rset电阻器204和偏压电路217中的Vref输入而设置。Also synchronized with the Vsync pulse, the data stored in Dot A and Dot B latches 222A and 222B is copied to D/A converters 213A and 213B, setting the current in DMOSFETs 205A and 205B. As shown, D/A converters 213A and 213B are discrete circuits that provide an accurate fractional portion of Iref to set the current in the LED string. Alternatively, in a preferred embodiment, Iaccurate gate driver circuits 213A and 213B incorporate adjustable current mirrors using binary weighting and are capable of setting a fractional portion of the desired maximum current. The reference current Iref, representing the maximum channel current, is set by Rset resistor 204 and the Vref input in bias circuit 217.

故障检测包括LED集成电路215比较电流宿DMOSFET 205A和205B的源极和漏极电压与存储在故障锁存器214中的值,这些值在每个Vsync脉冲处从Flt设置寄存器224复制。温度检测电路216监视LED驱动器IC的温度。任何故障立即触发开路漏极MOSFET 219,以导通并且拉低FLT线,产生中断。该故障信息还在接下来的Vsync脉冲时从故障锁存器214被写到Flt状态寄存器225中。Fault detection involves the LED integrated circuit 215 comparing the source and drain voltages of current sink DMOSFETs 205A and 205B with the values stored in the fault latch 214. These values are copied from the Flt setting register 224 at each Vsync pulse. The temperature detection circuit 216 monitors the temperature of the LED driver IC. Any fault immediately triggers the open-drain MOSFET 219 to turn on and pull the Flt line low, generating an interrupt. This fault information is also written from the fault latch 214 to the Flt status register 225 at the next Vsync pulse.

对于具有嵌入的SCFB的LED驱动器,表示对于LED驱动器IC 200的CSFB值的数字数据从A/D转换器218的输出被复制到SLI总线移位寄存器201中的CSFB寄存器223,与Vsync脉冲同步。尽管能够比每个Vsync脉冲一次更经常第刷新CSFB数据,但是对使用宽SLI总线协议而言,没有特定的方便的定时脉冲指示将数据从A/D转换器218B复制到CSFB寄存器223中。没有另外的专用的控制管脚,必须使用定时器进行CSFB写入操作,但是因为GSC和SCK时钟信号可以在正常操作中开始和停止,所以没有简单的方式来执行CSFB值的重复采样(oversampling)For LED drivers with embedded SCFB, digital data representing the CSFB value for the LED driver IC 200 is copied from the output of the A/D converter 218 to the CSFB register 223 in the SLI bus shift register 201, synchronized with the Vsync pulse. Although the CSFB data can be refreshed more frequently than once per Vsync pulse, there is no specific convenient timing pulse for using the wide SLI bus protocol to indicate the copying of data from the A/D converter 218B to the CSFB register 223. Without an additional dedicated control pin, a timer must be used for CSFB write operations, but because the GSC and SCK clock signals can start and stop during normal operation, there is no simple way to perform oversampling of the CSFB value.

在以上引用的Williams等人的题为“Low Cost LED Driver with IntegralDimming Capability”的申请No.13/346,625中进一步详述了点功能和数字到模拟转换的实现方式。该申请还包括故障和LED集成电路214和215、参考电流源217和电流感应反馈(CSFB)电路218的详细的电路实现方式示例。因而,在此不重复这些组件的细节。The implementation of the dimming function and digital-to-analog conversion is further detailed in the above-referenced application Ser. No. 13/346,625 to Williams et al., entitled “Low Cost LED Driver with Integral Dimming Capability.” This application also includes detailed circuit implementation examples for the fault and LED integrated circuits 214 and 215, the reference current source 217, and the current sense feedback (CSFB) circuit 218. Therefore, the details of these components will not be repeated here.

以所述的方式,使用串行数据总线来控制多个LED串中的电流的幅度、定时和持续时间,以及控制LED串中的故障情况的检测以及报告故障情况的发生,并且使用嵌入的CSFB信息控制+VLED电源电压。SLI协议是灵活的,仅需要经过串行总线发送的数据匹配于所控制的硬件,特别是发送到每个LED驱动器IC的位的数量匹配于该LED驱动器IC所需要的位(通常给定的LED驱动器系统中的每个LED驱动器IC需要相同数量的位),并且在每个Vsync时段期间发送的位的总数等于每个LED驱动器IC需要的位的数量乘以LED驱动器IC的数量。In the manner described, a serial data bus is used to control the amplitude, timing, and duration of current in multiple LED strings, as well as to control the detection of fault conditions in the LED strings and report the occurrence of fault conditions, and to control the +V LED supply voltage using embedded CSFB information. The SLI protocol is flexible, requiring only that the data sent over the serial bus match the hardware being controlled, specifically that the number of bits sent to each LED driver IC match the bits required by that LED driver IC (typically, each LED driver IC in a given LED driver system requires the same number of bits), and that the total number of bits sent during each Vsync period equals the number of bits required by each LED driver IC multiplied by the number of LED driver ICs.

例如,在图7A中,包括点校正、故障设置和故障报告以及CSFB信息的一个通道的宽SLI总线协议包括每个双通道驱动器IC的88位,即,每个通道或LED串44位。如果控制16串LED的八个双通道驱动器IC通过单个SLI总线环路连接,则在每个Vsync时段期间移出接口IC并经过SLI总线的位的总数等于8乘以88,或704位,其少于千位。如果SLI总线被定时钟在10MHz,则可以经过每个驱动器IC并且到每个通道地,将整个数据流定时钟在70.4微秒或者每通道4.4微秒内。For example, in FIG7A , a wide SLI bus protocol for one channel, including dot correction, fault setting and fault reporting, and CSFB information, includes 88 bits per dual-channel driver IC, or 44 bits per channel or LED string. If eight dual-channel driver ICs controlling 16 strings of LEDs are connected via a single SLI bus loop, the total number of bits shifted out of the interface IC and across the SLI bus during each Vsync period equals 8 times 88, or 704 bits, which is less than a thousand bits. If the SLI bus is clocked at 10 MHz, the entire data stream can be clocked through each driver IC and to each channel ground in 70.4 microseconds, or 4.4 microseconds per channel.

尽管串行数据总线以“电子”数据速率,即,使用MHz时钟和每秒兆位数据的速率而通信,但是用于控制改变LCD显示器面板上的图像的Vsync或者“帧”速率以慢得多的步伐而出现,因为人眼不能感知以接近电子数据速率的任何速率改变图像。尽管大多数人意识不到以60Hz帧速率,即,每秒16图像帧的闪烁,然而仅仅是使用直接比较,在A与B比较的情况下,对于许多人来说,120Hz的TV图像看起来比60HZ的TV更“清晰”。以甚至更高的Vsync速率,例如240Hz和更高的速率,仅“玩家”和视频显示器“专家”声称看到任何改进,主要表明为降低的运动模糊。在电子数据速率和相对慢的视频帧速率之间存在这样大的差别,这使得串行总线通信对于背光驱动器是可能的。Although the serial data bus communicates at an "electronic" data rate, i.e., a rate using a MHz clock and megabits of data per second, the Vsync or "frame" rate used to control changes in the image on the LCD display panel occurs at a much slower pace because the human eye cannot perceive changes in the image at any rate approaching the electronic data rate. Although most people are unaware of flicker at a 60Hz frame rate, i.e., 16 image frames per second, a 120Hz TV image looks "clearer" to many people than a 60HZ TV, simply using a direct comparison, in the case of A vs. B comparison. At even higher Vsync rates, such as 240Hz and higher, only "gamers" and video display "experts" claim to see any improvement, primarily in the form of reduced motion blur. There is such a large difference between the electronic data rate and the relatively slow video frame rate that makes serial bus communication possible for backlight drivers.

例如,在60Hz的情况下,每个Vsync时段消耗16.7毫秒,这是比将所有数据发送到所有驱动器IC所需的时间更长的量值量级。即使在以8X扫描速率且以960Hz的3D模式运行的大多数高级TV中,每个Vsync/时段消耗1.04毫秒,意味着可以实时地控制达236个通道。该通道数量极大地超过了对于即使最大的HDTV的LED驱动器系统需求。For example, at 60Hz, each Vsync period consumes 16.7 milliseconds, which is orders of magnitude longer than the time required to send all data to all driver ICs. Even in most advanced TVs running at 8X scan rate and in 960Hz 3D mode, each Vsync/period consumes 1.04 milliseconds, meaning up to 236 channels can be controlled in real time. This number of channels far exceeds the LED driver system requirements for even the largest HDTVs.

在图7A的移位寄存器201中所示的每个双通道“宽”协议88位使得接口IC能够在每个Vsync时段期间一次写入或读取每个通道的每个寄存器中的所有数据。术语“宽”指用于控制每个通道的数据字的内容。宽协议要求对于给定的LED驱动器IC中的每个变量和每个寄存器的数据被包括在从接口IC传输到该LED驱动器IC的数据的每个分组中,即使与对于该LED驱动器IC的先前数据分组相比什么都未改变也是如此。The 88-bit "wide" protocol for each dual channel, shown in shift register 201 of FIG7A , enables the interface IC to write or read all the data in each register of each channel at once during each Vsync period. The term "wide" refers to the content of the data word used to control each channel. The wide protocol requires that the data for every variable and every register in a given LED driver IC be included in every packet of data transmitted from the interface IC to that LED driver IC, even if nothing has changed from the previous data packet for that LED driver IC.

如果使用减少的数据协议,即每通道需要更少位的协议,则向每个通道发送数据花费甚至更少的时间。因为宽协议由于相对慢的Vsync刷新速率而没有定时限制,所以不存在数据速率的益处。然而,在串形通信协议中使用更少的位确实减小LED驱动器IC中的数字移位寄存器和数据锁存器的大小,减小LED驱动器IC的面积以及降低整体系统成本。If a reduced data protocol is used, that is, one requiring fewer bits per channel, sending data to each channel takes even less time. Because the wide protocol has no timing constraints due to the relatively slow Vsync refresh rate, there is no data rate benefit. However, using fewer bits in the serial communication protocol does reduce the size of the digital shift register and data latch in the LED driver IC, reducing the area of the LED driver IC and lowering the overall system cost.

例如,使用64位而不是对于图7A中的LED驱动器IC 200所示的88位数据集的具有嵌入的CSFB的SLI总线的替代的双通道数据协议也是可能的。这样的数据集可以包括用于PWM亮度占空因子的12位、用于相位延迟的12位、用于故障设置的8位、以及用于故障状态的4位和用于CSFB数据的一个通道的4位,由此未包括12位点校正数据。这样,在此实现方式中,对每个LED串的单独的通道电流设置和亮度校准是不可用的。For example, an alternative two-channel data protocol for the SLI bus with embedded CSFB using a 64-bit data set rather than the 88-bit data set shown for the LED driver IC 200 in FIG7A is also possible. Such a data set may include 12 bits for PWM brightness duty cycle, 12 bits for phase delay, 8 bits for fault settings, 4 bits for fault status, and 4 bits for one channel of CSFB data, thereby not including 12 bit point correction data. Thus, in this implementation, individual channel current settings and brightness calibration for each LED string are not available.

在LCD面板制造中,许多制造商认为电子地校准显示器的均匀亮度太昂贵并且因此在商业上不实际。仍可以通过调整面板的电流设置电阻器、比如在LED驱动器IC 200中示出的设置电阻器204的值来校准全局显示器亮度,但是通过微控制器或接口IC不能控制背光亮度中的亮度均匀性。替代地,面板制造商人工地将其LED供应品“分类”为具有类似亮度和色温的LED库(bin)。In LCD panel manufacturing, many manufacturers believe that electronically calibrating the display for uniform brightness is too expensive and therefore commercially impractical. Global display brightness can still be calibrated by adjusting the panel's current setting resistors, such as the value of setting resistor 204 shown in LED driver IC 200, but brightness uniformity in backlight brightness cannot be controlled by the microcontroller or interface IC. Instead, panel manufacturers manually "sort" their LED supply into bins of LEDs with similar brightness and color temperature.

应该注意到,从SLI总线协议移除Dot数据不阻止显示整体的显示亮度控制或校准。调整系统的全局参考电压Vref仍可以进行全局调光或者全局电流控制。例如,在LED驱动器IC 200中,调整Vref的值影响由Iref产生器217产生的参考电流Iref。如果Vref电压由所有LED驱动器IC共享,则调整此电压将独立于PWM调光控制而均匀地影响每个驱动器IC以及面板的整体亮度。It should be noted that removing Dot data from the SLI bus protocol does not prevent overall display brightness control or calibration. Adjusting the system's global reference voltage, Vref, still allows for global dimming or global current control. For example, in LED driver IC 200, adjusting the value of Vref affects the reference current Iref generated by Iref generator 217. If the Vref voltage is shared by all LED driver ICs, adjusting this voltage will uniformly affect each driver IC and the overall brightness of the panel, independent of PWM dimming control.

将CSFB功能嵌入到SLI总线中不限于宽SLI总线协议。相反,使用前缀复用的SLI总线协议和接口更方便实现更大灵活性和更高CSFB反馈样本速率。Embedding CSFB functionality into the SLI bus is not limited to the wide SLI bus protocol. Instead, using prefix-multiplexed SLI bus protocols and interfaces facilitates greater flexibility and higher CSFB feedback sample rates.

这样,经过串行总线发送长的数字字或指令的限制和缺点可以通过使用被添加到串行照明接口总线协议中并嵌入在每个SLI总线通信中的“寄存器地址”或“前缀”而克服。当与用于解码和复用SLI总线数据的电路组合时,嵌入的前缀信息使得数据能够仅被路由到特定目标的功能锁存器。Thus, the limitations and drawbacks of sending long digital words or instructions over a serial bus can be overcome by using a "register address" or "prefix" that is added to the Serial Lighting Interface bus protocol and embedded in each SLI bus communication. When combined with circuitry for decoding and multiplexing SLI bus data, the embedded prefix information enables data to be routed only to the function latch of a specific destination.

在前缀复用的SLI总线协议和接口中实现嵌入的CSFBImplementing embedded CSFB in prefix-multiplexed SLI bus protocols and interfaces

通过特别将数据仅发送到需要更新的锁存器,“前缀复用的”或者“窄”SLI总线架构避免了重复且不必要地重新发送数字数据、尤其是重新发送保持恒定或不经常改变的冗余数据的需要。在操作中,在初始设置之后,仅正改变的锁存器被重写。By specifically sending data only to the latches that need to be updated, the "prefix multiplexed" or "narrow" SLI bus architecture avoids the need to repeatedly and unnecessarily resend digital data, especially redundant data that remains constant or changes infrequently. In operation, after an initial setup, only the latches that are changing are overwritten.

包含固定数据的寄存器仅在系统第一次被初始化时被写入一次,其后不需要从接口IC经过SLI总线的随后的通信。因为仅更新正改变的锁存器,所以跨过SLI总线发送的数据量极大地降低。此发明方法提供了相比于宽SLI总线方法不同的几个优点,即:Registers containing fixed data are written only once when the system is first initialized, and no subsequent communication from the interface IC over the SLI bus is required. Because only the latches that are changing are updated, the amount of data sent across the SLI bus is greatly reduced. This inventive method offers several advantages over the wide SLI bus approach, namely:

·集成SLI总线移位寄存器所需的位的数量极大地降低,节省了管芯面积并降低了成本,尤其是在较小的(例如两个通道)LED驱动器IC中。The number of bits required to integrate the SLI bus shift register is greatly reduced, saving die area and reducing cost, especially in smaller (e.g., two channel) LED driver ICs.

·以任何给定的时钟速率的SLI总线的有效带宽增加,因为不重复地发送冗余数据。• The effective bandwidth of the SLI bus at any given clock rate is increased because redundant data is not sent repeatedly.

·可以用固定字长度和功能来标准化SLI总线协议而不损失通用性。• The SLI bus protocol can be standardized with fixed word lengths and functions without loss of commonality.

前缀复用的SLI总线的例子示出在图7B的示意电路图中所示的LED驱动器IC 230的实施例中。除了可替换的LED驱动器IC 230之外,图7B还示出了包含16位前缀寄存器232和16位数据寄存器233的SLI总线移位寄存器231、以及前缀解码器和复用器(mux)电路234。数据寄存器231中的数据被路由到分别在锁存器&计数器A 210A和锁存器&计数器B 210B中的D锁存器211A和211B以及Φ锁存器212A和212B、数字控制和定时(DC&T)电路203中的D/A转换器213A和213B之一、或者在模拟控制和感应(AC&S)电路203中的故障锁存器电路214。根据前缀寄存器232中包含的路由方向,通过前缀解码器和复用器电路234进行这些数据传送。因此前缀解码器&复用器电路234解码前缀寄存器232中存储的16位数据字并将数据寄存器233中存储的16位数据223复用到适当的D、Φ或Dot锁存器DC&T电路202或AC&S电路203中。An example of a prefix-multiplexed SLI bus is shown in the embodiment of an LED driver IC 230 shown in the schematic circuit diagram of FIG7B . In addition to the alternative LED driver IC 230, FIG7B also shows an SLI bus shift register 231 containing a 16-bit prefix register 232 and a 16-bit data register 233, as well as a prefix decoder and multiplexer (mux) circuit 234. The data in the data register 231 is routed to D latches 211A and 211B and Φ latches 212A and 212B in latch & counter A 210A and latch & counter B 210B, respectively; one of the D/A converters 213A and 213B in the digital control and timing (DC&T) circuit 203; or the fault latch circuit 214 in the analog control and sensing (AC&S) circuit 203. These data transfers are made through the prefix decoder and multiplexer circuit 234, depending on the routing direction contained in the prefix register 232. The prefix decoder & multiplexer circuit 234 therefore decodes the 16-bit data word stored in the prefix register 232 and multiplexes the 16-bit data 223 stored in the data register 233 into the appropriate D, Φ or Dot latch DC&T circuit 202 or AC&S circuit 203.

在故障锁存器电路214的情况下,复用器234双向操作,允许存储在数据寄存器233中的数据被写到故障锁存器电路214中,或者相反,允许存储在故障锁存器电路214中的数据被写到数据寄存器233中。类似地,取决于存储在前缀寄存器232中的前缀码,包含在A/D转换器218B内的CSFB数据由复用器234引导被写到数据寄存器233中。In the case of the fault latch circuit 214, the multiplexer 234 operates bidirectionally, allowing the data stored in the data register 233 to be written to the fault latch circuit 214, or conversely, allowing the data stored in the fault latch circuit 214 to be written to the data register 233. Similarly, the CSFB data contained in the A/D converter 218B is directed by the multiplexer 234 to be written to the data register 233, depending on the prefix code stored in the prefix register 232.

尽管在宽SLI总线协议的情况下,与Vysnc脉冲同步地在功能锁存器和SLI总线寄存器之间复制数据,但是在前缀复用的SLI总线中,一些功能不需要与Vsync脉冲同步,尤其是在从故障锁存器214读回故障信息和从A/D转换器218B读回CSFB数据的情况下。替代地,数据可以根据需要从LED驱动器IC被“拉”到SLI总线中并且由接口IC检查,即使是在比每个Vsync脉冲一次更高的数据速率下也是如此。Although data is copied between the function latches and the SLI bus registers in synchronization with the Vsync pulse in the case of the wide SLI bus protocol, in a prefix-multiplexed SLI bus, some functions do not need to be synchronized with the Vsync pulse, particularly when reading back fault information from the fault latch 214 and CSFB data from the A/D converter 218B. Instead, data can be "pulled" from the LED driver IC into the SLI bus as needed and checked by the interface IC, even at data rates higher than once per Vsync pulse.

在一个优选实施例中,前缀复用的SLI总线协议包括32位字,即,长度上是4字节,其提供在寻址大量功能锁存器的灵活性以及维持短的字线长度和小的SLI总线移位寄存器大小之间的良好平衡的折衷。在所示的例子中,SLI总线前缀寄存器232是16位长度,SLI总线数据寄存器233也是16位长度,其促进了具有高达65536种组合的变量被唯一地写入或从65536个不同的功能锁存器之一读取。In a preferred embodiment, the prefix-multiplexed SLI bus protocol comprises 32-bit words, i.e., 4 bytes in length, which provides a well-balanced compromise between the flexibility of addressing a large number of function latches and maintaining a short wordline length and a small SLI bus shift register size. In the example shown, the SLI bus prefix register 232 is 16 bits in length and the SLI bus data register 233 is also 16 bits in length, which facilitates variables having up to 65,536 combinations to be uniquely written to or read from one of the 65,536 different function latches.

为了灵活性和可扩展性,以32位设计前缀复用的SLI总线协议。尽管促进了大量的组合,但是不需要使用所有存储在SLI总线寄存器中的数据。如果需要更少的锁存器和通道,则仅需要解码前缀的少量位以寻址所需数量的功能锁存器。同样,如果要求少于16位的精度,则在SLI总线中的数据寄存器中可以使用更小数量的位,并且将其复用到目标功能锁存器。例如,如果SLI总线数据寄存器233中包含的数据PWM亮度占空因子,则12位的数据可以比复用并且被加载的到D锁存器211A中,同时如果在SLI总线数据寄存器233中包含的数据表示LED电流“Dot”设置,则D/A转换器213A内的Dot锁存器仅需要8位。从A/D转换器和锁存器218B读取并被写到SLI总线数据寄存器233中的CSFB数据可以仅由4位的字构成。For flexibility and scalability, the SLI bus protocol is designed with a 32-bit prefix multiplexing. While this facilitates a large number of combinations, not all data stored in the SLI bus registers needs to be used. If fewer latches and channels are needed, only a few bits of the prefix need to be decoded to address the required number of function latches. Similarly, if less than 16 bits of precision are required, a smaller number of bits can be used in the data registers within the SLI bus and multiplexed to the target function latches. For example, if the data contained in SLI bus data register 233 represents the PWM brightness duty cycle, 12 bits of data can be multiplexed and loaded into D latch 211A. Meanwhile, if the data contained in SLI bus data register 233 represents the LED current "Dot" setting, the Dot latch within D/A converter 213A only requires 8 bits. The CSFB data read from the A/D converter and latch 218B and written to SLI bus data register 233 can consist of only 4-bit words.

因此,在前缀复用的SLI总线中,数据由接口IC重复地写到SLI总线移位寄存器231中,然后以顺序的方式一次一个字地被复用到几个功能锁存器211-214之一。同样,只要接口IC请求时,从锁存器214和218B复制数据,并以顺序的方式经过菊链中的移位寄存器移位并回到接口IC。在图7B所示的LED驱动器IC 200中,一个SLI总线数据寄存器233扇出到七个不同的功能锁存器中,并且从两个功能锁存器读回数据。Thus, in a prefix-multiplexed SLI bus, data is repeatedly written by the interface IC into the SLI bus shift register 231 and then multiplexed into one of several function latches 211-214 in a sequential manner, one word at a time. Similarly, data is copied from latches 214 and 218B whenever requested by the interface IC, shifted sequentially through the shift registers in the daisy chain, and returned to the interface IC. In the LED driver IC 200 shown in FIG7B , one SLI bus data register 233 fans out to seven different function latches, and data is read back from two function latches.

前缀复用的SLI总线230与图7A所示的宽SLI总线是鲜明的对比,其中,SLI总线移位寄存器201中的每个寄存器具有与LED驱动器IC中的功能锁存器的一对一的对应性,例如,SLI总线PWM A寄存器220A对应于D锁存器211A,SLI总线相位A寄存器221A对应于Φ锁存器212A,等等。此一对一对应性使得将宽SLI字线架构缩放到具有更多通道的LED驱动器IC是有问题并且成本高的。The prefix-multiplexed SLI bus 230 is in stark contrast to the wide SLI bus shown in FIG7A , where each register in the SLI bus shift register 201 has a one-to-one correspondence with a functional latch in the LED driver IC, e.g., the SLI bus PWM A register 220A corresponds to the D latch 211A, the SLI bus Phase A register 221A corresponds to the Φ latch 212A, etc. This one-to-one correspondence makes scaling the wide SLI wordline architecture to LED driver ICs with more channels problematic and costly.

前缀复用的SLI总线的扇出能力因此提供了用于实现多通道LED驱动器的、比宽SLI总线协议更通用的更低成本的方法。出于此以及本公开中稍后将考虑的其他原因,发明的前缀复用的SLI总线表示改进的串行照明接口总线协议、架构和物理接口。The fan-out capability of the prefix-multiplexed SLI bus thus provides a more versatile, lower-cost approach to implementing multi-channel LED drivers than the wide SLI bus protocol. For this and other reasons that will be considered later in this disclosure, the invented prefix-multiplexed SLI bus represents an improved serial lighting interface bus protocol, architecture, and physical interface.

前缀解码器和复用器234可以以各种方式实现,如在以上引用的Williams等人的题为“Low Cost LED Driver with Improved Serial Bus”的申请No.13/346,647中所述。一个实现方式示出在图8的框图中,其中SLI总线移位寄存器231中的16位前缀寄存器被细分为两个8位寄存器,即,通道寄存器232C和功能寄存器232F。数据寄存器233保持不改变。如所示,前缀解码器251具有两个输出线,其包括用于选择正控制哪个LED通道255的通道选择输出线254,以及用于控制正询问哪个功能锁存器,即,正向其写入或从其读取的功能锁存器的功能选择输出线252。The prefix decoder and multiplexer 234 can be implemented in various ways, as described in the above-referenced application Ser. No. 13/346,647 to Williams et al., entitled "Low Cost LED Driver with Improved Serial Bus." One implementation is shown in the block diagram of FIG8 , in which the 16-bit prefix register in the SLI bus shift register 231 is subdivided into two 8-bit registers, namely, a channel register 232C and a function register 232F. The data register 233 remains unchanged. As shown, the prefix decoder 251 has two output lines, including a channel select output line 254 for selecting which LED channel 255 is being controlled, and a function select output line 252 for controlling which function latch is being interrogated, i.e., written to or read from.

在所示的例子中,前缀解码器251用线254上的通道选择信号来选择多个通道255之一,然后用线252上的功能选择信号来选取要控制的功能。为了改变功能256的操作,复用器253然后将来自数据寄存器233的数据写到预加载锁存器258中。该数据被保留在该预加载锁存器258中,直到出现Vsync脉冲,在此时数据从该预加载锁存器258被复制到有效锁存器257中,由此改变模拟或数字功能258的操作条件,例如,D、Φ、Dot等等。有效锁存器257中的数据保持不改变直到出现下一Vsync脉冲。In the example shown, the prefix decoder 251 uses the channel select signal on line 254 to select one of the multiple channels 255, and then uses the function select signal on line 252 to select the function to be controlled. To change the operation of function 256, the multiplexer 253 then writes data from the data register 233 to the preload latch 258. The data is retained in the preload latch 258 until a Vsync pulse occurs, at which time the data is copied from the preload latch 258 to the valid latch 257, thereby changing the operating condition of the analog or digital function 258, such as D, Φ, Dot, etc. The data in the valid latch 257 remains unchanged until the next Vsync pulse occurs.

可以通过将数据写到预加载锁存器261中,与Vsync脉冲同步地将数据复制到有效锁存器260中,由此改变所选通道的操作条件,从而以类似的方式改变控制功能259。可替换地,锁存器260中的数据可以从控制功能259写入并以规则的间隔被加载,即,采样到预加载锁存器216中。随着解码器251选择相应的通道和功能,在该预加载锁存器261中包含的数据然后被复制到SLI总线移位寄存器231的数据寄存器233中。The operating conditions of the selected channel can be changed in a similar manner by writing data to the preload latch 261 and copying the data to the valid latch 260 in synchronization with the Vsync pulse. Alternatively, the data in the latch 260 can be written from the control function 259 and loaded, i.e., sampled, into the preload latch 216 at regular intervals. The data contained in the preload latch 261 is then copied into the data register 233 of the SLI bus shift register 231 as the decoder 251 selects the corresponding channel and function.

以此方式,可以实时地独立地控制LED驱动器IC内的任意数量的通道,即,任意数量的LED串,其促进经过共享的SLI总线移位寄存器231对每个控制功能256、259以及其他的功能进行精确调整,而不需要大的移位寄存器或长的数字字。In this way, any number of channels within the LED driver IC, i.e., any number of LED strings, can be independently controlled in real time, which facilitates precise adjustment of each control function 256, 259, as well as other functions, via the shared SLI bus shift register 231 without the need for large shift registers or long digital words.

如图8所示,可以采用相同的SLI总线移位寄存器231和前缀复用的SLI总线协议来嵌入CSFB功能。CSFB信号262,即,A/D转换器的数字输出以规则的间隔被采样并写入到采样锁存器263中。在一些实施例中,A/D转换器和采样锁存器是相同的单元的部分,如同图7B所示的A/D转换器218B那样。以此方式,对于给定通道和LED驱动器IC的CSFB的最当前的值不断存在(ever-present)于采样锁存器263中。只要解码器251选择了相应的通道并且选择了CSFB功能时,包含在采样锁存器263中的数据然后就被复制到SLI总线移位寄存器231的数据寄存器233中。像任何其他功能那样,通过适当的并且相应的前缀码来选择CSFB数据。包括表1中的前缀码作为用于解码的例子:As shown in FIG8 , the CSFB function can be embedded using the same SLI bus shift register 231 and prefix-multiplexed SLI bus protocol. The CSFB signal 262, i.e., the digital output of the A/D converter, is sampled at regular intervals and written to a sampling latch 263. In some embodiments, the A/D converter and the sampling latch are part of the same unit, as in the case of A/D converter 218B shown in FIG7B . In this way, the most current value of CSFB for a given channel and LED driver IC is always present in the sampling latch 263. Whenever the decoder 251 selects the corresponding channel and the CSFB function is selected, the data contained in the sampling latch 263 is then copied to the data register 233 of the SLI bus shift register 231. Like any other function, the CSFB data is selected by an appropriate and corresponding prefix code. The prefix codes in Table 1 are included as examples for decoding:

表1Table 1

在数据被写到SLI总线移位寄存器231中之后,必须通过相应数量的SCK脉冲将该数据移位到接口IC中。将数据全部移位经过SLI总线所需的SCK脉冲的数量等于每个SLI总线移位寄存器中的位的数量乘以SLI总线中的SLI总线移位寄存器的数量。假设图8所示的固定长度32位协议,以及每个LED驱动器IC一个SLI总线移位寄存器,则将数据从该菊链中的距离接口IC最远的驱动器IC移位到该接口IC的CSFBI输入中所需的SCK脉冲的总数等于LED驱动器IC的数量的32倍。After data is written to the SLI bus shift register 231, it must be shifted into the interface IC using a corresponding number of SCK pulses. The number of SCK pulses required to shift the data completely through the SLI bus is equal to the number of bits in each SLI bus shift register multiplied by the number of SLI bus shift registers in the SLI bus. Assuming the fixed-length 32-bit protocol shown in Figure 8, and one SLI bus shift register per LED driver IC, the total number of SCK pulses required to shift data from the driver IC furthest from the interface IC in the daisy chain to the CSFBI input of that interface IC is 32 times the number of LED driver ICs.

在移位期间,选择前缀码以防止数据在SLI总线移位寄存器233中的过写入。在一个优选实施例中,可以通过使用专用的前缀功能码251、例如十六进制的0E而实现此保护,以用于从其相应的CSFB采样锁存器263加载SLI总线数据寄存器233。在随后的广播上,随着来自采样锁存器263的数据移位经过SLI总线菊链,并进入接口IC中以更新控制SMPS的反馈信号,使用不同的前缀码,例如,十六进制0F来防止向或从SLI总线移位寄存器233的任何读取或写入(此步骤被称为以上表1中的“执行CSFB”)。During shifting, a prefix code is selected to prevent overwriting of data in the SLI bus shift register 233. In a preferred embodiment, this protection can be achieved by using a dedicated prefix function code 251, such as hexadecimal 0E, for loading the SLI bus data register 233 from its corresponding CSFB sampling latch 263. On subsequent broadcasts, as the data from the sampling latch 263 is shifted through the SLI bus daisy chain and into the interface IC to update the feedback signals that control the SMPS, a different prefix code, such as hexadecimal 0F, is used to prevent any reads or writes to or from the SLI bus shift register 233 (this step is referred to as "Execute CSFB" in Table 1 above).

通过图9所示的LED驱动器系统270的示意框图来进一步说明将CSFB功能嵌入在SLI总线内。示出了LED驱动器IC 272A和272H、接口IC 273、LED串274A、274B、274P和274Q、以及开关模式电源(SMPS)293。与嵌入的CSFB操作有关,LED驱动器IC 272A包含分别驱动LED串274A和274B的电流宿MOSFET 275A和275B、CSFB电路291A、模拟到数字(A/D)转换器275A、采样锁存器277A、以及使用包括前缀寄存器281A和数据寄存器280A的SLI总线移位寄存器282A、解码器279A及其相关联的复用器278A的SLI总线通信。为了清楚,未包括LED驱动器IC 272A内的诸如PWM调光控制、点校正和故障检测的其他功能。Embedding CSFB functionality within the SLI bus is further illustrated by the schematic block diagram of LED driver system 270 shown in FIG9 . LED driver ICs 272A and 272H, an interface IC 273, LED strings 274A, 274B, 274P, and 274Q, and a switch-mode power supply (SMPS) 293 are shown. In connection with embedded CSFB operation, LED driver IC 272A includes current sink MOSFETs 275A and 275B driving LED strings 274A and 274B, respectively, a CSFB circuit 291A, an analog-to-digital (A/D) converter 275A, a sampling latch 277A, and SLI bus communication using an SLI bus shift register 282A including a prefix register 281A and a data register 280A, a decoder 279A, and its associated multiplexer 278A. For clarity, other functionality within LED driver IC 272A, such as PWM dimming control, dot correction, and fault detection, is not included.

类似地,LED驱动器IC 272H包含分别驱动LED串274P和274Q的电流宿MOSFET 275P和275Q、CSFB电路291H、A/D转换器275H、采样锁存器277H、以及使用包括前缀寄存器281H和数据寄存器280H的SLI总线移位寄存器282H、解码器279H及其相关联的复用器278H的SLI总线通信。未示出的其他LED驱动器IC 272B-272G具有相同的构造。接口IC 273以菊链方式连线经过SIL总线294而数字地连接到LED驱动器IC 272A-272H,每个SLI总线输出SO连线到菊链中的下一IC的SLI总线输入SI。该链中的最后的LED驱动器IC 272H使其SO输出连接到接口IC 273的SLI输入。该链中的第一LED驱动器IC 272A使其输入连接到接口IC 273的SO输出(未示出接口IC 273的输出部分),或者可替换地,连接到用于控制LED驱动器IC的SLI总线数据的任何其他源。Similarly, LED driver IC 272H includes current sink MOSFETs 275P and 275Q that drive LED strings 274P and 274Q, respectively, a CSFB circuit 291H, an A/D converter 275H, a sampling latch 277H, and SLI bus communication using an SLI bus shift register 282H comprising a prefix register 281H and a data register 280H, a decoder 279H, and its associated multiplexer 278H. Other LED driver ICs 272B-272G (not shown) have the same configuration. Interface IC 273 digitally connects to LED driver ICs 272A-272H in a daisy-chain fashion via SIL bus 294, with each SLI bus output SO connected to the SLI bus input SI of the next IC in the daisy chain. The last LED driver IC 272H in the chain has its SO output connected to the SLI input SI of interface IC 273. The first LED driver IC 272A in the chain has its input connected to the SO output of the interface IC 273 (the output portion of the interface IC 273 is not shown), or alternatively, to any other source of SLI bus data for controlling LED driver ICs.

接口IC 273包括包含前缀寄存器285和数据寄存器284的SLI总线移位寄存器283、解码器287及其相关联的复用器286、数字幅度比较器288、用于存储数字DCSFB信号的寄存器289、数字到模拟(D/A)转换器290以及使用ICSFB信号在图9中所示的LED驱动系统270中连接到SMPS 293的反馈输入的运算跨导放大器291,其中,数字DCSFB信号是从LED驱动器IC272A-272H获得的电流最低的CSFB采样。接口IC 273能够提供两个模拟输出:OTA 291输出的电流反馈信号ICSFB,或者可替换地由D/A转换器290输出的用于连接到需要电压而不是电流反馈信号的SMPS模块的电压反馈信号CSFBO。Interface IC 273 includes an SLI bus shift register 283 including a prefix register 285 and a data register 284, a decoder 287 and its associated multiplexer 286, a digital amplitude comparator 288, a register 289 for storing a digital DCSFB signal, a digital-to-analog (D/A) converter 290, and an operational transconductance amplifier 291 connected to the feedback input of an SMPS 293 in the LED driver system 270 shown in FIG9 using the ICSFB signal, which is a sample of the lowest current CSFB obtained from the LED driver ICs 272A-272H. Interface IC 273 can provide two analog outputs: a current feedback signal ICSFB output by OTA 291, or alternatively, a voltage feedback signal CSFBO output by D/A converter 290 for connection to an SMPS module that requires a voltage rather than a current feedback signal.

ICSFB信号和CSFBO信号两者表示数字电流感应反馈信号DCSFB的模拟等效物。以规则的间隔采样的此数字DCSFB信号表示电流宿MOSFET275A-275Q上的最低电流感应(漏极)电压,并且其用于检测具有最高正向电压降的LED串274A-274Q。CSFB信号(无论是ICSFB还是CSFBO的形式)转而控制电源线271上的SMPS 293的电压+VLED以产生足以对包括具有最高正向电压降的任意串的所有LED串274供电的电压+VLEDBoth the ICSFB signal and the CSFBO signal represent the analog equivalent of the digital current sense feedback signal DCSFB. This digital DCSFB signal, sampled at regular intervals, represents the lowest current sense (drain) voltage across the current sink MOSFETs 275A-275Q and is used to detect the LED string 274A-274Q with the highest forward voltage drop. The CSFB signal (whether in the form of ICSFB or CSFBO) in turn controls the voltage + VLED of the SMPS 293 on power line 271 to generate a voltage + VLED sufficient to power all LED strings 274, including any string with the highest forward voltage drop.

在操作中,接口IC 273将前缀命令经由到八个LED驱动器IC 272-272H的每个的SLI总线菊链,来按时钟输入到前缀寄存器281中,指令每个驱动器IC的复用器278将采样锁存器277的电流采样内容复制到其SLI总线移位寄存器282的数据寄存器280中,作为例子,在驱动器IC 272A中,由解码器279A解释的前缀寄存器281A中的前缀命令指示复用器278A将采样锁存器277A的电流采样内容复制到SLI总线移位寄存器282A的数据寄存器280A中。在其他LED驱动器IC中发生相同的处理和过程。In operation, interface IC 273 clocks a prefix command into prefix register 281 via the SLI bus daisy chain to each of the eight LED driver ICs 272-272H, instructing each driver IC's multiplexer 278 to copy the current sample contents of sampling latch 277 to data register 280 of its SLI bus shift register 282. For example, in driver IC 272A, the prefix command in prefix register 281A, interpreted by decoder 279A, instructs multiplexer 278A to copy the current sample contents of sampling latch 277A to data register 280A of SLI bus shift register 282A. The same processing and procedures occur in the other LED driver ICs.

在从采样锁存器277A到SLI总线数据寄存器280A的数据传送之前或与之同时,CSFB电路291A测量电流宿MOSFET 275A和275B上的漏极电压,确定哪个MOSFET具有较低的漏极电压,并将该较低漏极电压传递到A/D转换器276A,A/D转换器276A将该电压转换为其数字等效物。结果暂时存储在采样锁存器277A中。可以在通过前缀寄存器281A中的前缀码来请求数据时采样CSFB电压,或者可以比SLI总线通信更频繁地以规则的间隔采样。因此,采样锁存器277A内包含的数据表示与在LED驱动器IC 272A内集成的两个通道的最低电流宿电压有关的最当前的信息。Prior to or concurrently with data transfer from sampling latch 277A to SLI bus data register 280A, CSFB circuit 291A measures the drain voltages across current sink MOSFETs 275A and 275B, determines which MOSFET has the lower drain voltage, and passes the lower drain voltage to A/D converter 276A, which converts the voltage to its digital equivalent. The result is temporarily stored in sampling latch 277A. The CSFB voltage can be sampled when data is requested via a prefix code in prefix register 281A, or it can be sampled at regular intervals more frequently than SLI bus communication. Therefore, the data contained in sampling latch 277A represents the most current information regarding the lowest current sink voltage for the two channels integrated within LED driver IC 272A.

电压采样应该每个Vsync时段至少一次地发生,并且可以以更高速率发生。优选地,每个Vsync时段应该发生两到三次以改进SMPS 293的准确性和瞬时响应。在每个Vsync时段三次以上的采样提供了减少的返回,并且例如Vsync时段十次的过多的采样占据了进行非必要的任务的接口IC。一旦LED驱动器272A-272H的A/D转换器277A-277H提供的CSFB数据已经被加载到其相应的SLI总线数据寄存器280A-280H,CSFB数据必须按时钟移出数据寄存器并移入接口IC 273。完成此所需的SCK脉冲的数量等于菊链中的LED驱动器IC 272的数量乘以协议中每个SLI总线移位寄存器282的位的数量,在此情况下是32位乘以8个驱动器IC,或256个时钟脉冲。Voltage sampling should occur at least once per Vsync period, and can occur at a higher rate. Preferably, it should occur two to three times per Vsync period to improve the accuracy and transient response of the SMPS 293. Sampling more than three times per Vsync period provides reduced return, and excessive sampling, such as ten times per Vsync period, occupies the interface IC with unnecessary tasks. Once the CSFB data provided by the A/D converters 277A-277H of the LED drivers 272A-272H has been loaded into their corresponding SLI bus data registers 280A-280H, the CSFB data must be clocked out of the data registers and into the interface IC 273. The number of SCK pulses required to accomplish this is equal to the number of LED driver ICs 272 in the daisy chain multiplied by the number of bits in each SLI bus shift register 282 in the protocol, which in this case is 32 bits multiplied by 8 driver ICs, or 256 clock pulses.

在将驱动器IC CSFB数据移位到接口IC 273内的SLI总线283中期间或之后,接口IC 273进行确定哪个CSFB值最低的任务,然后使用该数据将CSFBO或ICSFB信号传递到SMPS293,SMPS 293转而使用该信号设置电源轨271上的电压+VLED。虽然可以在SLI总线移位寄存器数据传送的结束时存储并分析该数据,但是也可以实时地进行。在本发明的一个实施例中,由幅度比较器288将被移位到接口IC 273的SLI总线数据移位寄存器284中的每个CSFB值与先前的值比较,并且仅当其表示比在其之前的数据更低的电压时才将其盖写到寄存器289中。在一个SLI广播周期内已经比较了来自所有驱动器IC的所有CSFB数据之后,寄存器289内的数字数据DCSFB表示系统270中的最低CSFB值。During or after shifting driver IC CSFB data into SLI bus 283 within interface IC 273, interface IC 273 performs the task of determining which CSFB value is the lowest. It then uses this data to pass a CSFBO or ICSFB signal to SMPS 293, which in turn uses this signal to set the voltage + VLED on power rail 271. While this data can be stored and analyzed at the end of the SLI bus shift register data transfer, it can also be performed in real time. In one embodiment of the present invention, each CSFB value shifted into SLI bus data shift register 284 by interface IC 273 is compared to the previous value by amplitude comparator 288 and overwritten to register 289 only if it represents a lower voltage than the data preceding it. After all CSFB data from all driver ICs has been compared within one SLI broadcast cycle, the digital data DCSFB within register 289 represents the lowest CSFB value in system 270.

在本发明的另一方面,在SLI总线移位操作期间可以使用前缀寄存器285中的专用前缀码,例如,十六进制码“0F”(二进制“00001111”)以防止在经过SLI总线菊链移位数据时LED驱动器IC 272对CSFB数据的盖写。可以选取相同的前缀码以指示接口IC 273进行在移位期间,即,在顺序的SCK时钟脉冲期间到来的数据的顺序比较,以确定数据流中的最低CSFB信号。在此比较操作中,解码器287引导复用器286到数字幅度比较器288的输入。此电路将SLI总线寄存器284中的数据与寄存器289中的数据比较,并且仅在新数据较低时盖写寄存器289。重复此处理直到来自每个LED驱动器IC的CSFB数据已经被移位到接口IC 273中。换句话说,在本发明的一个实施例中,可以分配特殊的前缀码,该特殊的前缀码在移位期间从不允许复用器盖写已经存在于SLI总线数据流中的CSFB数据。In another aspect of the present invention, a special prefix code in prefix register 285, for example, hexadecimal code "0F" (binary "00001111"), can be used during the SLI bus shift operation to prevent LED driver IC 272 from overwriting CSFB data while shifting data through the SLI bus daisy chain. The same prefix code can be chosen to instruct interface IC 273 to perform a sequential comparison of data arriving during the shift, i.e., during sequential SCK clock pulses, to determine the lowest CSFB signal in the data stream. During this comparison operation, decoder 287 directs multiplexer 286 to the input of digital amplitude comparator 288. This circuit compares the data in SLI bus register 284 with the data in register 289 and overwrites register 289 only if the new data is lower. This process is repeated until CSFB data from each LED driver IC has been shifted into interface IC 273. In other words, in one embodiment of the present invention, a special prefix code can be assigned that never allows the multiplexer to overwrite CSFB data already present in the SLI bus data stream during the shift.

接口IC 273然后将最低CSFB电压的此数字表示转换为控制SMPS 293的模拟电压CSFBO或者模拟电流ICSFB,其统称为反馈信号292。模拟反馈信号的特性取决于SMPS 293所需的反馈的类型。如果需要模拟电压,则可以使用D/A转换器290的CSFBO电压输出,其具有或者不具有缓冲器,以直接驱动SMPS 293。如果需要电流反馈信号,则使用运算放大器OTA291以将CSFBO电压信号转换为电流信号ICSFB。Interface IC 273 then converts this digital representation of the lowest CSFB voltage into an analog voltage CSFBO or an analog current ICSFB, collectively referred to as feedback signal 292, which controls SMPS 293. The characteristics of the analog feedback signal depend on the type of feedback required by SMPS 293. If an analog voltage is required, the CSFBO voltage output of D/A converter 290 can be used, with or without a buffer, to directly drive SMPS 293. If a current feedback signal is required, operational amplifier OTA 291 is used to convert the CSFBO voltage signal into a current signal ICSFB.

不管到SMPS 293的反馈包括电流还是电压,在闭合环路操作中,D/A转换器290的输出电压对数字幅度比较器288提供的数字CSFB信号DCSFB做出反应,即,其变为DCSFB信号的动态函数。以此方式,可以以SLI总线294数字地向SMPS 293提供实时反馈,促进对LED电源输出电压+VLED的控制以保证用于处于所需水平的LED电流的LED串274A-274Q的适当照明的适合的电压。Regardless of whether the feedback to the SMPS 293 includes current or voltage, in closed-loop operation, the output voltage of the D/A converter 290 reacts to, i.e., becomes a dynamic function of, the digital CSFB signal DCSFB provided by the digital amplitude comparator 288. In this manner, real-time feedback can be provided digitally to the SMPS 293 via the SLI bus 294, facilitating control of the LED power supply output voltage + VLED to ensure a suitable voltage for proper illumination of the LED strings 274A-274Q at the desired level of LED current.

具有SLI总线嵌入的CSFB的LED驱动器ICLED driver IC with SLI bus embedded CSFB

根据本发明的具有SLI总线通信和嵌入的CSFB控制的LED驱动系统300示出在图10A中。其类似于图3A所示的LED驱动器IC 51,LED驱动系统300包括双通道驱动器IC 301,该双通道驱动器IC 301具有集成的电流宿DMOSFET 55A和55B、具有集成的高电压二极管58A和58B的共源共栅箝位DMOSFET 57A和57B、用于准确的电流控制的I精确栅极驱动器电路56A和56B、数字控制和定时(DC&T)电流59、以及芯片上偏压电源和调压器62。但是,不同于先前所述的驱动器IC 51,已经修改了模拟控制和感应(AC&S)电流310以及宽SLI总线移位寄存器311,以将电流感应反馈CSFB信息嵌入在SLI总线协议内。因为SLI总线移位寄存器是“宽的”,所以其包含专用于接收来自AC&S电流310内的采样锁存器(等同于图9中的锁存器277)的CSFB数据的CSFB寄存器(等同于图7A中的寄存器223)。FIG10A shows an LED driver system 300 with SLI bus communication and embedded CSFB control according to the present invention. Similar to the LED driver IC 51 shown in FIG3A, the LED driver system 300 includes a dual-channel driver IC 301 with integrated current sink DMOSFETs 55A and 55B, cascode clamp DMOSFETs 57A and 57B with integrated high-voltage diodes 58A and 58B, I-accurate gate driver circuits 56A and 56B for accurate current control, digital control and timing (DC&T) circuits 59, and an on-chip bias supply and voltage regulator 62. However, unlike the previously described driver IC 51, the analog control and sense (AC&S) circuits 310 and the wide SLI bus shift register 311 have been modified to embed current sense feedback CSFB information within the SLI bus protocol. Because the SLI bus shift register is "wide," it contains a CSFB register (equivalent to register 223 in FIG. 7A ) dedicated to receiving CSFB data from a sampling latch within AC&S current 310 (equivalent to latch 277 in FIG. 9 ).

这样,LED驱动器IC 301提供对250mA LED驱动器的两个通道的完整控制,其具有150V阻挡能力和±2%的绝对电流准确度,12位的PWM亮度控制,12位的PWM相位控制,8位的电流控制,对于LED开路和LED短路情况的故障检测,以及过温度检测,所有都通过高速SLI总线而控制,并且通过公共Vsync和灰度时钟(GSC)信号与其他驱动器同步。尽管所示的特定例子例示了额定在150V阻挡能力的共源共栅箝位DMOSFET,但是根据需要这些器件可以针对操作而从100V到300V来定大小。器件的250mA额定电流通过被驱动的两个LED串中的封装的功耗和正向电压的不匹配而设置。Thus, LED driver IC 301 provides complete control of two channels of 250mA LED drivers with 150V blocking capability and ±2% absolute current accuracy, 12-bit PWM brightness control, 12-bit PWM phase control, 8-bit current control, fault detection for open LED and short LED conditions, and over-temperature detection, all controlled via a high-speed SLI bus and synchronized with other drivers via common Vsync and grayscale clock (GSC) signals. While the specific example shown illustrates cascode clamped DMOSFETs rated at 150V blocking capability, these devices can be sized for operation from 100V to 300V as needed. The 250mA current rating of the device is set by the power dissipation and forward voltage mismatch of the package in the two LED strings being driven.

LED驱动器IC 301内的AC&S电路310还包括模拟电流感应反馈或CSFB,监视两个电流宿DMOSFET 55A和55B的信号,其由集成的模拟到数字A/D转换器转换为CSFB电压的数字版本,优选长度是4位或更多位。该数字CSFB信号或DCSFB表示驱动器IC 301中的最低电流源电压,因此表示具有最高正向电压降的LED串。此信号被复制到SLI总线移位寄存器311中的CSFB寄存器,并且经过SLI总线传递到接口IC,并最终回到系统SMPS,供应+VLED电源轨。AC&S circuitry 310 within LED driver IC 301 also includes analog current sense feedback, or CSFB, which monitors the signals of the two current sink DMOSFETs 55A and 55B. This signal is converted by an integrated analog-to-digital A/D converter into a digital version of the CSFB voltage, preferably four or more bits in length. This digital CSFB signal, or DCSFB, represents the lowest current source voltage within driver IC 301 and, therefore, the LED string with the highest forward voltage drop. This signal is copied to the CSFB register within the SLI bus shift register 311 and passed across the SLI bus to the interface IC and ultimately back to the system SMPS, supplying the +V LED power rail.

不同于需要CSFBO和CSFBI管脚以分别用于输出和输入CSFB信号的先前所述的LED驱动器IC 51,LED驱动器IC 301将其CSFB数据嵌入到SLI总线数据流中,并且不需要额外的管脚来促进电流感应反馈,而不管驱动器中集成的通道的数量如何。因此包含LED驱动器IC301的封装中不存在CSFBO和CSFBI管脚。因而,已经修改模拟控制和感应电路310以及宽SLI总线接口311,以将电流感应反馈CSFB信息嵌入在SLI总线协议内。Unlike the previously described LED driver IC 51, which requires CSFBO and CSFBI pins for outputting and inputting CSFB signals, respectively, LED driver IC 301 embeds its CSFB data within the SLI bus data stream and does not require additional pins to facilitate current sense feedback, regardless of the number of channels integrated into the driver. Consequently, the CSFBO and CSFBI pins are not present in the package containing LED driver IC 301. Consequently, the analog control and sensing circuitry 310 and the wide SLI bus interface 311 have been modified to embed the current sense feedback CSFB information within the SLI bus protocol.

根据本发明的具有SLI总线通信和嵌入的CSFB控制的替换的LED驱动器315示出在图10B中。双通道LED驱动器IC 316包含电流宿DMOSFET72A和72B,但是省略了共源共栅箝位MOFET。替代地,DMOSFET 72A和72B包含被设计为在截止条件下维持高电压的集成的高电压二极管73A和73B。通常,这样的设计最适用于在100V以下的操作,但是如果需要也可以扩展到150V。如在LED驱动器301中那样,I精确栅极驱动器电路71A和71B促进由模拟控制和感应电路320和数字控制和定时电路74控制的准确的电流控制。芯片上偏压电源和调压器69对LED驱动器IC 316供电,在此情况下从Vcc而不是向在LED驱动器IC 301中那样从24V供电。除了缺少共源共栅箝位DMOSFET之外,LED驱动器IC 316与LED驱动器IC 301类似的操作,通过包括嵌入在SLI总线接口和协议内的数字CSFB信号的其SLI总线移位寄存器325而控制。An alternative LED driver 315 with SLI bus communication and embedded CSFB control according to the present invention is shown in FIG10B . Dual-channel LED driver IC 316 includes current sink DMOSFETs 72A and 72B, but omits the cascode clamp MOSFETs. Instead, DMOSFETs 72A and 72B include integrated high-voltage diodes 73A and 73B designed to maintain a high voltage in the off-state condition. Typically, this design is best suited for operation below 100V, but can be extended to 150V if necessary. As in LED driver 301, I-accurate gate driver circuits 71A and 71B facilitate accurate current control controlled by analog control and sensing circuitry 320 and digital control and timing circuitry 74. An on-chip bias supply and voltage regulator 69 powers LED driver IC 316, in this case from Vcc rather than 24V as in LED driver IC 301. LED driver IC 316 operates similarly to LED driver IC 301, except for the lack of a cascode clamp DMOSFET, controlled through its SLI bus shift register 325 which includes a digital CSFB signal embedded within the SLI bus interface and protocol.

不同于先前所述的LED驱动器IC 66(图3B),该LED驱动器IC 66需要CSFBO和CSFBI管脚分别用于输出和输入CSFB信号,LED驱动器IC 316将其CSFB数据嵌入到SLI总线数据流中,并且不需要额外的管脚来促进电流感应反馈,而不管该驱动器中集成的通道的数量如何。因此包含LED驱动器IC 316的封装中不存在CSFBO和CSFBI管脚。因而,已经修改模拟控制和感应电路320以及宽SLI总线接口325,以将电流感应反馈CSFB信息嵌入在SLI总线协议内。Unlike the previously described LED driver IC 66 ( FIG. 3B ), which required CSFBO and CSFBI pins for output and input CSFB signals, respectively, LED driver IC 316 embeds its CSFB data within the SLI bus data stream and does not require additional pins to facilitate current sense feedback, regardless of the number of channels integrated into the driver. Consequently, the CSFBO and CSFBI pins are not present in the package containing LED driver IC 316. Consequently, the analog control and sense circuitry 320 and the wide SLI bus interface 325 have been modified to embed the current sense feedback CSFB information within the SLI bus protocol.

根据本发明做出的使用前缀复用的SLI总线通信的具有嵌入的CSFB的LED驱动器330示出在图10C中。双通道LED驱动器IC 331包括:具有集成的高电压二极管88A和88B的集成的电流宿DMOSFET 87A和87B、用于准确的电流控制的I精确栅极驱动器电路86A和86B、模拟控制和感应电路335、以及数字控制和定时电路89。芯片上偏压电源和调压器84从Vcc输入对IC供电。An LED driver 330 with embedded CSFB using prefix-multiplexed SLI bus communication, made in accordance with the present invention, is shown in FIG10C . A dual-channel LED driver IC 331 includes integrated current sink DMOSFETs 87A and 87B with integrated high-voltage diodes 88A and 88B, I-accurate gate driver circuits 86A and 86B for accurate current control, analog control and sensing circuitry 335, and digital control and timing circuitry 89. An on-chip bias supply and voltage regulator 84 powers the IC from the Vcc input.

不同于先前所述的LED驱动器IC 80(图3C),该LED驱动器IC 80需要CSFBO和CSFBI管脚分别用于输出和输入CSFB信号,LED驱动器IC 331将其CSFB数据嵌入到SLI总线数据流中,并且不需要额外的管脚来促进电流感应反馈,而不管该驱动器中集成的通道的数量如何。因此包含LED驱动器IC 80的封装中不存在CSFBO和CSFBI管脚。因而,已经修改模拟控制和感应电路335以及前缀复用的SLI总线接口340,以将电流感应反馈CSFB信息嵌入在SLI总线协议内。Unlike the previously described LED driver IC 80 ( FIG. 3C ), which required CSFBO and CSFBI pins for output and input CSFB signals, respectively, LED driver IC 331 embeds its CSFB data within the SLI bus data stream and does not require additional pins to facilitate current sense feedback, regardless of the number of channels integrated into the driver. Consequently, the CSFBO and CSFBI pins are not present in the package containing LED driver IC 80. Consequently, the analog control and sense circuitry 335 and the prefix-multiplexed SLI bus interface 340 have been modified to embed the current sense feedback CSFB information within the SLI bus protocol.

否则,LED驱动器IC 331提供对250mA LED驱动器的两个通道的完整控制,其具有150V阻挡能力和±2%的绝对电流准确度,12位的PWM亮度控制、12位的PWM相位控制、8位的电流控制、对于LED开路和LED短路情况的故障检测、以及过温度检测,所有都通过高速SLI总线而控制,并且通过公共Vsync和灰度时钟(GSC)信号与其他驱动器同步。尽管所示的特定例子例示了额定在150V阻挡能力的电流宿DMOSFET,但是根据需要这些器件可以针对操作而从100V到300V来定大小。器件的250mA额定电流通过被驱动的两个LED串中的封装的功耗和正向电压的不匹配而设置。在额定的100V以上,将高电压共源共栅箝位DMOSFET(未示出)与电流宿DMOSFET 87A和87B串联地集成是有利的,由此电流宿MOSFET 87A和87B不需要在箝位电压以上,即,在12V以上的操作。Otherwise, the LED driver IC 331 provides complete control of two channels of 250mA LED drivers with 150V blocking capability and ±2% absolute current accuracy, 12-bit PWM brightness control, 12-bit PWM phase control, 8-bit current control, fault detection for open LED and short LED conditions, and over-temperature detection, all controlled via the high-speed SLI bus and synchronized with other drivers via common Vsync and grayscale clock (GSC) signals. While the specific example shown illustrates current sink DMOSFETs rated at 150V blocking capability, these devices can be sized for operation from 100V to 300V as needed. The device's 250mA current rating is set by the power dissipation and forward voltage mismatch of the package in the two LED strings being driven. Above a nominal 100V, it is advantageous to integrate a high voltage cascode clamp DMOSFET (not shown) in series with current sink DMOSFETs 87A and 87B, whereby current sink MOSFETs 87A and 87B do not need to operate above the clamp voltage, ie, above 12V.

具有SLI总线嵌入的CSFB的LED驱动系统和接口LED driver system and interface with SLI bus embedded CSFB

图11中的系统350例示了根据本发明做出的包括SLI总线嵌入的电流感应反馈的、用于具有局部调光的LED背光照明的分布使系统的应用。该图例示了驱动由公共的SMPS353供电的、具有集成的调光和故障检测的一些列LED驱动器316A-316H的接口IC 351。除了已经完全去除了模拟CSFB菊链并且在功能上被嵌入在SLI总线协议和网络接口内的DCSFB信号替代之外,该图类似于图4中的系统100。尽管未在LED驱动器IC 316A-316H中明确示出模拟到数字转换,但是接口IC 315确实例示了从SLI总线嵌入的DCSFB数字字重构模拟反馈信号所需的D/A转换器3665的添加。System 350 in FIG11 illustrates the application of a distributed power system for LED backlighting with local dimming, including SLI bus-embedded current sensing feedback, according to the present invention. The figure illustrates interface IC 351 driving a series of LED drivers 316A-316H with integrated dimming and fault detection, powered by a common SMPS 353. This figure is similar to system 100 in FIG4 , except that the analog CSFB daisy chain has been completely eliminated and functionally replaced by DCSFB signals embedded within the SLI bus protocol and network interface. While analog-to-digital conversion is not explicitly shown in LED driver ICs 316A-316H, interface IC 315 does illustrate the addition of D/A converters 3665 required to reconstruct the analog feedback signals from the SLI bus-embedded DCSFB digital words.

LED驱动器IC 316A-316H的每个可以采用前缀复用的SLI总线协议,如图10C的LED驱动器IC 331中所示,或者可替换地可以采用如图10A和10B的LED驱动器IC 301和316中所示的宽总线协议。驱动器IC 316A-316H的每个可以与图10B和10C所示类似地并入高电压电流宿MOSFET,或者可替换地可以集成共源共栅箝位MOSFET以保护电流宿MOSFET,如图10A所示。在系统350中,例示了LED驱动器IC 316A-316H,而没有复用器92和解码器91,应该理解的是这样的器件可以根据需要,即,只要利用了前缀复用的SLI总线协议时而被包括在驱动器IC 316A-316H内。包括三个数字时钟线、一个数字故障线以及一个模拟参考电压线的五个公共信号线357将接口IC 351连接到每个驱动器IC。定时和控制电路363产生与经过SPI总线接口360接收的来自主机μC(未示出)的数据同步的Vsync和GSC信号。定时和控制电路363还监视FLT中断线,以立即检测潜在的问题。参考电压源362全局地向系统提供参考电压Vref,以便确保良好的通道与通道电流匹配。偏压电源361从由SMPS 353产生的固定的+24V电源轨354上的电源电压VIN对接口IC 351供电。偏压电路361还产生调压的电源电压Vcc以对LED驱动器316A-316H供电,该电源电压Vcc优选是5V。Vcc电源电压由电容器362滤波。Each of the LED driver ICs 316A-316H can utilize a prefix-multiplexed SLI bus protocol, as shown in LED driver IC 331 of FIG. 10C , or alternatively, can utilize a wide-bus protocol, as shown in LED driver ICs 301 and 316 of FIG. 10A and 10B . Each of the driver ICs 316A-316H can incorporate a high-voltage current sink MOSFET, similar to that shown in FIG. 10B and 10C , or alternatively, can integrate a cascode clamp MOSFET to protect the current sink MOSFET, as shown in FIG. 10A . In system 350 , the LED driver ICs 316A-316H are illustrated without multiplexer 92 and decoder 91 , though it should be understood that such devices can be included within the driver ICs 316A-316H as needed, i.e., whenever a prefix-multiplexed SLI bus protocol is utilized. Five common signal lines 357, including three digital clock lines, one digital fault line, and one analog reference voltage line, connect the interface IC 351 to each driver IC. Timing and control circuitry 363 generates Vsync and GSC signals synchronized with data received from a host μC (not shown) via SPI bus interface 360. Timing and control circuitry 363 also monitors the FLT interrupt line to immediately detect potential problems. Reference voltage source 362 provides a global reference voltage, Vref, to the system to ensure good channel-to-channel current matching. Bias supply 361 powers interface IC 351 from supply voltage VIN on a fixed +24V power rail 354 generated by SMPS 353. Bias circuitry 361 also generates a regulated supply voltage, Vcc, to power LED drivers 316A-316H. This supply voltage, Vcc, is preferably 5V. The Vcc supply voltage is filtered by capacitor 362.

在此例子中,LED驱动器IC 316A-316H的每个包括两个通道,这两个通道包括:具有集成的HV二极管73A-73Q的高电压电流宿DMOSFET 72A-72Q、I精确栅极驱动器电路71A-71Q、DC&T电路74A-74H、包括电流感应反馈检测和到数字DCSFB的A/D转换的AC&S电路320A-320H、以及SLI总线移位寄存器325A-325H。尽管图11所示的LED驱动器IC 316A-316H缺少共源共栅箝位MOSFET,但是除了可以使用24V VIN电源而不是Vcc来对LED驱动器IC供电以及对共源共栅箝位DMOSFET的栅极偏压之外,系统350也可以以图10A所示的LED驱动器IC 300的方式构建。In this example, each of the LED driver ICs 316A-316H includes two channels, including: high voltage current sink DMOSFETs 72A-72Q with integrated HV diodes 73A-73Q, I-accurate gate driver circuits 71A-71Q, DC&T circuits 74A-74H, AC&S circuits 320A-320H including current sense feedback detection and A/D conversion to digital DCSFB, and SLI bus shift registers 325A-325H. Although the LED driver ICs 316A-316H shown in FIG11 lack cascode clamp MOSFETs, the system 350 can also be constructed in the manner of the LED driver IC 300 shown in FIG10A, except that the 24V VIN supply can be used instead of Vcc to power the LED driver IC and bias the gates of the cascode clamp DMOSFETs.

三个版本10A、10B或10C的任意一个可以被插入到图11在的驱动器IC框316中。Any of the three versions 10A, 10B, or 10C may be inserted into the driver IC block 316 of FIG. 11 .

连接LED驱动器IC 316A-316H的SLI总线356包括通过SLI总线356A-356I以菊链连接在一起的SLI总线移位寄存器325A-325H,其中接口IC 351内的SLI电路364的SO串行输出经由SLI总线356A连接到LED驱动器316A的SI输入,LED驱动器316A的SO输出经由SLI总线356B连接到LED驱动器316B(未示出)的SI输入,等等。SLI总线356H连接到系统350中所示的最后的LED驱动器316H的SI输入。LED驱动器316H的SO输出又经由SLI总线356I连接到接口IC 351内的SLI电路364的SI输入。以此方式,SLI总线356形成起源于接口IC 351、行经每个LED驱动器IC 316A-316H(有时统称为LED驱动器IC 316)、并回到其自身的完整环路。将数据移出接口IC 350的SO管脚,同时将相等长度的位串返回到接口IC350的SI管脚中。The SLI bus 356 connecting the LED driver ICs 316A-316H includes SLI bus shift registers 325A-325H connected together in a daisy chain via SLI buses 356A-356I, wherein the SO serial output of the SLI circuit 364 within the interface IC 351 is connected via SLI bus 356A to the SI input of LED driver 316A, the SO output of LED driver 316A is connected via SLI bus 356B to the SI input of LED driver 316B (not shown), and so on. SLI bus 356H is connected to the SI input of the last LED driver 316H shown in the system 350. The SO output of LED driver 316H is in turn connected via SLI bus 356I to the SI input of the SLI circuit 364 within the interface IC 351. In this manner, the SLI bus 356 forms a complete loop originating at the interface IC 351, passing through each of the LED driver ICs 316A-316H (sometimes collectively referred to as LED driver ICs 316), and back to itself. Data is shifted out of the SO pin of interface IC 350 , while a bit string of equal length is returned to the SI pin of interface IC 350 .

SLI电路364根据需要产生SLI总线时钟信号SCK。因为LED驱动器IC 316A-316H没有芯片地址,所以通过SLI总线356定时钟的位的数量与被驱动的LED驱动器IC的数量相关。可以通过修改控制SPI接口360中的数据交换的软件,或者通过对接口IC 351的硬件修改而调整通过SLI总线356定时钟的位的数量。以此方式,系统350内的通道的数量可以灵活的变化以匹配显示器的大小。经过SLI总线356移位的,即,在总线356上广播的位的数量取决于所采用的SLI总线协议以及SLI总线移位寄存器中的位的总数。例如,宽SLI总线协议需要每个双通道LED驱动器的72到88位,而前缀复用的SLI总线明显更小,例如,需要每个LED驱动器IC的固定的32位,而不管集成到每个驱动器IC中的通道的数量如何。SLI circuitry 364 generates the SLI bus clock signal SCK as needed. Because LED driver ICs 316A-316H do not have chip addresses, the number of bits clocked through SLI bus 356 is related to the number of LED driver ICs being driven. The number of bits clocked through SLI bus 356 can be adjusted by modifying the software controlling data exchange in SPI interface 360 or by hardware modifications to interface IC 351. In this way, the number of channels within system 350 can be flexibly varied to match the size of the display. The number of bits shifted through SLI bus 356, i.e., broadcast on bus 356, depends on the SLI bus protocol used and the total number of bits in the SLI bus shift register. For example, the wide SLI bus protocol requires 72 to 88 bits per two-channel LED driver, while the prefix-multiplexed SLI bus is significantly smaller, requiring, for example, a fixed 32 bits per LED driver IC, regardless of the number of channels integrated into each driver IC.

当使用接口IC 351内的硬件控制器来控制SLI总线通信时,修改SLI总线电路364中的寄存器以移出更少或更多的位需要在接口IC 351的制造或设计中的修改。替换的方法涉及用使用软件来调整驱动器以在菊链中容纳更少或更多的LED驱动器的可编程接口IC替代接口IC 351。When a hardware controller within interface IC 351 is used to control SLI bus communications, modifying registers in SLI bus circuitry 364 to shift out fewer or more bits requires modifications in the manufacture or design of interface IC 351. An alternative approach involves replacing interface IC 351 with a programmable interface IC that uses software to adjust the drivers to accommodate fewer or more LED drivers in the daisy chain.

到SMPS 353的电流感应反馈包括嵌入在SLI总线356内的数字电流感应反馈或DCSFB信号。经过SLI总线356移位数据最终将此嵌入的DCSFB信号返回到接口IC 351的SLI总线电路364。以先前所述的方式,SLI总线电路364进而输出表示SLI总线356中的最低CSFB字的DCSFB字,并且D/A转换器365将该DCSFB字转换为模拟CSFB反馈电压。运算跨导放大器366然后将该CSFB反馈电压转换为线358上的电流反馈ICSFB信号,以控制SMPS 353的+VLED输出。可替换地,CSFB反馈电压本身可以被用作控制SMPS 353的反馈信号。数字地嵌入CSFB数据使系统350与图4的系统100形成对比,在该系统100中,通过模拟菊链将每个LED驱动器IC连接到接口IC需要每个驱动器IC两个专用的管脚。The current sense feedback to SMPS 353 comprises a digital current sense feedback, or DCSFB, signal embedded within SLI bus 356. Data is shifted through SLI bus 356, ultimately returning this embedded DCSFB signal to SLI bus circuitry 364 of interface IC 351. In the manner previously described, SLI bus circuitry 364 in turn outputs the DCSFB word representing the lowest CSFB word in SLI bus 356, and D/A converter 365 converts this DCSFB word into an analog CSFB feedback voltage. Operational transconductance amplifier 366 then converts this CSFB feedback voltage into a current feedback ICSFB signal on line 358 to control the +V LED output of SMPS 353. Alternatively, the CSFB feedback voltage itself can be used as the feedback signal to control SMPS 353. Digitally embedding the CSFB data contrasts system 350 with system 100 of FIG. 4 , where connecting each LED driver IC to the interface IC via an analog daisy chain requires two dedicated pins per driver IC.

在系统350中,不同于系统100中,接口IC 351仅仅生成CSFB反馈信号CSFBO或ICSFB的单个值。在需要多于一个SMPS的应用中,例如,在较大的更高电流背光照明的显示器或者具有RGB背光照明的显示器中,可以修改接口IC以输出多于一个CSFB输出电压来控制多个SMPS单元。SLI总线数据流本身携带用于独立地控制多个LED电源电压导轨所需的信息,但是接口IC需要被配置为将通道信息适当地分离以利用这样的特征。以下描述本发明的多反馈多输出实施例。In system 350, unlike system 100, interface IC 351 generates only a single value for CSFB feedback signal CSFBO or ICSFB. In applications requiring more than one SMPS, such as in larger displays with higher current backlighting or displays with RGB backlighting, the interface IC can be modified to output more than one CSFB output voltage to control multiple SMPS units. The SLI bus data stream itself carries the information necessary to independently control multiple LED supply voltage rails, but the interface IC needs to be configured to appropriately separate the channel information to take advantage of this feature. A multi-feedback, multi-output embodiment of the present invention is described below.

模拟和数字数据转换Analog and digital data conversion

再次参考图9,动态地测量跨过电流宿MOSFET 275而存在的电压并且将其用于控制SMPS 293的输出电压。尽管测量的电压和反馈信号两者包括模拟信号,但是根据本发明的SLI总线嵌入的CSFB方法包括从LED驱动器IC 272到接口IC 273的数字编码的反馈路径。这样的系统需要在LED驱动器IC 272内的模拟到数字转换以感应跨过电流宿MOSFET 275的电压,以及在接口IC 273内的数字到模拟转换以产生用于SMPS 293的反馈信号。9 , the voltage present across current sink MOSFET 275 is dynamically measured and used to control the output voltage of SMPS 293. Although both the measured voltage and the feedback signal comprise analog signals, the SLI bus embedded CSFB method according to the present invention includes a digitally encoded feedback path from LED driver IC 272 to interface IC 273. Such a system requires analog-to-digital conversion within LED driver IC 272 to sense the voltage across current sink MOSFET 275, and digital-to-analog conversion within interface IC 273 to generate the feedback signal for SMPS 293.

将模拟信号改变为数字字以及其相反情况依赖于数据转换。尽管A/D和D/A转换器的设计对于本领域技术人员是公知的,但是存在大量各种转换器,并且必须选择以达到但是基本不超过数字CSFB功能的性能需求。对负载瞬变响应太慢或者受不稳定性影响和受长稳定时间影响的数据转换器设计可能导致闪烁和不一致的显示图像,并且在极端情况下甚至可能会损坏显示器中的电子组件。相反,准确的高性能转换器对于TV市场而言通常太大并且太昂贵。Converting analog signals to digital words, and vice versa, relies on data conversion. While the design of A/D and D/A converters is well known to those skilled in the art, a wide variety of converters exist and must be selected to meet, but not exceed, the performance requirements of the digital CSFB function. Data converter designs that respond too slowly to load transients or suffer from instabilities and long settling times can result in flickering and inconsistent displayed images and, in extreme cases, can even damage electronic components in the display. Conversely, accurate, high-performance converters are often too large and expensive for the TV market.

图12例示了用于在LED驱动器IC内进行的感应和数字编码的电路,其中,驱动LED串274A和274B的MOSFET 275A和275B的漏极连接上的电压被连接到CSFB电路275的正输入VinA+和VinB+,该CSFB电路275包括运算放大器。该运算放大器的输出连接到其负输入VinB-,该运算放大器用作统一增益放大器或者电压跟随器,放大器正输入VinA+和VinB+中的最负者。CSFB电路275的输出还馈送A/D转换器276的输入。注意,为了清楚,用于电流宿MOSFET275A和275B的I精确栅极驱动器电路未在图12中示出。FIG12 illustrates a circuit for sensing and digital encoding within an LED driver IC, in which the voltage at the drain connections of MOSFETs 275A and 275B driving LED strings 274A and 274B is connected to the positive inputs, V inA + and V inB +, of a CSFB circuit 275, which includes an operational amplifier. The output of the operational amplifier is connected to its negative input, V inB− , which operates as a unity-gain amplifier or voltage follower, with the most negative of the amplifier's positive inputs, V inA + and V inB +. The output of CSFB circuit 275 also feeds the input of an A/D converter 276. Note that for clarity, the I-accurate gate driver circuit for current sink MOSFETs 275A and 275B is not shown in FIG12 .

在CSFB电路275的一个实施例中,该运算放大器包括具有匹配的输入P-沟道MOSFET 401A、401B和401C和电流源403的差分输入。包括匹配的N沟道MOSFET 402A和402B的电流镜反映了负输入P-沟道MOSFET 401A中的电流。N沟道MOSFET 402B中的电流与P沟道MOSFET 401B和401C中的电流一起被求和,驱动包括N沟道MOSFET 404的第二放大器级以及包括电流源的有效负载405。与从其输出到负输入MOSFET 401A的负反馈一起,包括电容器406和电阻器407的补偿网络以设置放大器的零极点响应并维持在操作的整个范围的稳定性。In one embodiment of CSFB circuit 275, the operational amplifier includes a differential input with matched input P-channel MOSFETs 401A, 401B, and 401C and a current source 403. A current mirror comprising matched N-channel MOSFETs 402A and 402B reflects the current in the negative input P-channel MOSFET 401A. The current in N-channel MOSFET 402B is summed with the currents in P-channel MOSFETs 401B and 401C, driving a second amplifier stage comprising N-channel MOSFET 404 and an active load 405 comprising a current source. Along with negative feedback from its output to the negative input MOSFET 401A, a compensation network comprising capacitor 406 and resistor 407 is provided to set the pole-zero response of the amplifier and maintain stability over the entire range of operation.

在操作中,存在于放大器的VinA+和VinB+输入上的最负输入比其并行的相对方更多地导通P沟道MOSFET 401B或401C,并使得放大器的输出变到MOSFET 401B和401C的两个漏极电压中的较低者。然后该输出由A/D转换器276数字化,并且在请求时被加载到SLI总线移位寄存器中。In operation, the most negative input present at the amplifier's VinA + and VinB + inputs turns on P-channel MOSFET 401B or 401C more than its parallel counterpart and causes the amplifier's output to go to the lower of the two drain voltages of MOSFETs 401B and 401C. This output is then digitized by A/D converter 276 and loaded into the SLI bus shift register when requested.

尽管示出图12中的CSFB电路275用于双通道LED驱动器IC,但是简单地通过添加连接到匹配于MOSFET 401B和401C的P沟道MOSFET的正输入,可以集成任意数量的通道。例如,如果第三正输入连接到了P沟道MOSFET401D,则CSFB电路275将输出其三个输入值的最低者,通道A、通道B或通道C任一个。以此方式,CSFB电路275检测并输出特定LED驱动器IC中的任意电流宿MOSFET的最低漏极电压。Although CSFB circuit 275 in FIG12 is shown for a two-channel LED driver IC, any number of channels can be integrated simply by adding a positive input connected to a P-channel MOSFET matched to MOSFETs 401B and 401C. For example, if the third positive input is connected to P-channel MOSFET 401D, CSFB circuit 275 will output the lowest of its three input values, either Channel A, Channel B, or Channel C. In this way, CSFB circuit 275 detects and outputs the lowest drain voltage of any current sink MOSFET in a particular LED driver IC.

如之前所述,CSFB电路275确定跨过给定的LED驱动器IC内的电流宿MOSFET而存在的最低电压。此模拟电压被输入到模拟到数字转换器276。使用本领域技术人员公知的方法可以容易地实现模拟到数字转换器276。在图13中示出了4位D/A转换器276,其包括包含电阻器417A-417P(统称为电阻器417)的分压器、相应数量的模拟比较器418A-418P、稳定的参考电压源Vref 416、以及二—十进制编码BCD数字编码器420。As previously described, the CSFB circuit 275 determines the lowest voltage present across the current sink MOSFET within a given LED driver IC. This analog voltage is input to the analog-to-digital converter 276. The analog-to-digital converter 276 can be readily implemented using methods well known to those skilled in the art. A 4-bit D/A converter 276 is shown in FIG13 and includes a voltage divider comprising resistors 417A-417P (collectively, resistors 417), a corresponding number of analog comparators 418A-418P, a stable reference voltage source Vref 416, and a binary-to-decimal (BCD) digital encoder 420.

如所示,参考电压Vref被划分为十六个线性均匀的步长,范围从Vref的十六分之一到Vref。这十六个参考电压连接到模拟比较器418A-418P的负输入。例如,电阻器417A的更加正的端子,即,不连接到地的一侧连接到比较器418A的负输入。类似地,电阻器417G的更加正的端子连接到比较器418G的负输入,等等。到比较器418P的输入直接联系到参考电压Vref。模拟比较器418A-418P的正输入连接到A/D转换器276的输入端,该A/D转换器276又连接到CSFB电路475的输出。因为比较器418A测量串行电阻器链417的最低电压,所以其输出可以被认为是转换器的最低有效位或LSB。相反,因为比较器418P测量最高电压,即,高于Vref的输入,所以其可以被认为是A/D转换器276的最高有效位或MSB。As shown, the reference voltage Vref is divided into sixteen linearly uniform steps, ranging from one-sixteenth of Vref to Vref. These sixteen reference voltages are connected to the negative inputs of analog comparators 418A-418P. For example, the more positive terminal of resistor 417A, i.e., the side not connected to ground, is connected to the negative input of comparator 418A. Similarly, the more positive terminal of resistor 417G is connected to the negative input of comparator 418G, and so on. The input to comparator 418P is directly connected to the reference voltage Vref. The positive inputs of analog comparators 418A-418P are connected to the input of A/D converter 276, which is in turn connected to the output of CSFB circuit 475. Because comparator 418A measures the lowest voltage of serial resistor chain 417, its output can be considered the least significant bit, or LSB, of the converter. Conversely, because comparator 418P measures the highest voltage, ie, the input above Vref, it can be considered the most significant bit, or MSB, of A/D converter 276 .

在操作中,由CSFB电路275输出的模拟电压与在到模拟比较器418A-418P的负输入处的十六个参考电压比较。由Vref 416供电,使用一系列电阻器417的串联串来生成各个参考电压。对于任何给定的输入电压,A/D转换器输入可能超过某些比较器上的参考电压,并且落在其他比较器上的参考电压以下。对于其中CSFB输入超过参考电压的那些比较器,相应的比较器的输出将呈现出逻辑“高”状态。对于其中参考电压超过CSFB输入的那些比较器,相应的比较器的输出将呈现出逻辑“低”状态。例如,当到A/D转换器276的输入电压仅稍微超过输入到比较器418G的参考电压时,则比较器418A-418G的所有输出将为高,并且比较器418H-418P的所有输出将仍为低。In operation, the analog voltage output by CSFB circuit 275 is compared to sixteen reference voltages at the negative inputs to analog comparators 418A-418P. Powered by Vref 416, each reference voltage is generated using a series string of resistors 417. For any given input voltage, the A/D converter input may exceed the reference voltage on some comparators and fall below the reference voltage on others. For those comparators where the CSFB input exceeds the reference voltage, the output of the corresponding comparator will assume a logic "high" state. For those comparators where the reference voltage exceeds the CSFB input, the output of the corresponding comparator will assume a logic "low" state. For example, when the input voltage to A/D converter 276 only slightly exceeds the reference voltage input to comparator 418G, all outputs of comparators 418A-418G will be high, while all outputs of comparators 418H-418P will remain low.

以此方式,十六个比较器418A-418P的输出产生位的,即,“1”和“0”的唯一数字组合,其表示CSFB电路275的模拟CSFB电压输出的数字近似。比较器418A-418P的十六个输出被馈送到BCD解码器420中,BCD解码器420又输出四位二—十进制编码或BCD码,该BCD码随后被存储在采样锁存器277中以作为数字CSFB数据。BCD编码器420将比较器418输出的十六个可能的组合以一对一的对应性转换为十六个4位字。以下在表2中示出了一个可能的转换:In this manner, the outputs of the sixteen comparators 418A-418P generate bits, i.e., unique digital combinations of "1's" and "0's," that represent a digital approximation of the analog CSFB voltage output of the CSFB circuit 275. The sixteen outputs of the comparators 418A-418P are fed into a BCD decoder 420, which in turn outputs a four-bit binary-to-decimal encoding or BCD code that is subsequently stored in the sampling latch 277 as digital CSFB data. The BCD encoder 420 converts the sixteen possible combinations of the comparator 418 outputs into sixteen four-bit words in a one-to-one correspondence. One possible conversion is shown below in Table 2:

表2Table 2

根据需要,采样锁存器277中的4位DCSFB数据被传递到SLI总线寄存器280,随后以先前所述的方式经过SLI总线移位并进入接口IC中。包含DCSFB数据的采样锁存器277被称为“采样锁存器”,因为将模拟数据转换为数字数据的处理花费了有限的时间量,即,A/D转换不是瞬时的,使得电压数据仅以某个周期基础被“采样”。此外,如上所述,正常地不存在以明显高于帧速率的频率,即,以比Vsync频率的五倍更快的速率采样视频背光系统中的CSFB反馈电压的强制需要或益处。As needed, the 4-bit DCSFB data in sampling latch 277 is passed to SLI bus register 280, where it is subsequently shifted across the SLI bus and into the interface IC in the manner previously described. Sampling latch 277, which contains the DCSFB data, is referred to as a "sampling latch" because the process of converting analog data to digital data takes a finite amount of time, i.e., the A/D conversion is not instantaneous, such that the voltage data is only "sampled" on a periodic basis. Furthermore, as described above, there is normally no compelling need or benefit to sampling the CSFB feedback voltage in a video backlight system at a frequency significantly higher than the frame rate, i.e., at a rate faster than five times the Vsync frequency.

在前缀复用的SLI总线的情况下,响应于用于读取DCSFB数据的相应前缀码,采样锁存器277中的DCSFB数据经过复用器278被传递到SLI总线数据寄存器280中,其中该前缀被解码并且该数据从采样锁存器被复制到SLI总线移位寄存器的数据字段中。在前缀复用的SLI总线的一个优选实施例中,其中SLI总线数据寄存器是16位宽,从LED驱动器IC产生的4位DCSFB字优选被加载到表3中所示的数据寄存器的4个最低有效位中:In the case of a prefix-multiplexed SLI bus, in response to the corresponding prefix code for reading the DCSFB data, the DCSFB data in the sampling latch 277 is passed through the multiplexer 278 to the SLI bus data register 280, where the prefix is decoded and the data is copied from the sampling latch to the data field of the SLI bus shift register. In a preferred embodiment of a prefix-multiplexed SLI bus, where the SLI bus data register is 16 bits wide, the 4-bit DCSFB word generated from the LED driver IC is preferably loaded into the 4 least significant bits of the data register as shown in Table 3:

表3Table 3

DCSFB采样锁存器DCSFB sampling latch SLI总线数据寄存器SLI bus data register wxyzwxyz 0000 0000 0000wxyz0000 0000 0000wxyz

相对照,在宽SLI总线协议中,采样锁存器277中的数据直接映射到SLI总线协议中的相应的4位字,而不需要中间的复用器278。这样,每个LED驱动器IC规则地产生每个IC至少一个DCSFB字,并基于规则的周期或在请求时将该信息加载到SLI总线数据寄存器中。In contrast, in the wide SLI bus protocol, the data in the sampling latch 277 is directly mapped to the corresponding 4-bit word in the SLI bus protocol without the need for an intermediate multiplexer 278. In this way, each LED driver IC regularly generates at least one DCSFB word per IC and loads this information into the SLI bus data register on a regular basis or upon request.

因为每个驱动器IC产生其自己的表示该特定IC中的电流宿MOSFET的最低漏极电压的DCSFB信号,该接口IC必须通过数字码而分类以标识对于所有通道和驱动器IC的最低CSFB电压的值。如图14所示,存储在数字寄存器289中的此最低CSFB电压然后被D/A转换器290转换回到模拟反馈信号并且作为模拟反馈信号292而输出。D/A转换器290的电压输出,即,CSFBO可以直接用于驱动SMPS的反馈输入,或者可替换地,运算跨导放大器OAT291可以用于将此电压转换为反馈电流ICSFB。Because each driver IC generates its own DCSFB signal, which represents the lowest drain voltage of the current sink MOSFET in that particular IC, the interface IC must be sorted by a digital code to identify the value of the lowest CSFB voltage for all channels and driver ICs. As shown in Figure 14, this lowest CSFB voltage, stored in digital register 289, is then converted back to an analog feedback signal by D/A converter 290 and output as analog feedback signal 292. The voltage output of D/A converter 290, CSFBO, can be used directly to drive the feedback input of the SMPS, or alternatively, an operational transconductance amplifier OAT 291 can be used to convert this voltage into a feedback current ICSFB.

可以使用本领域技术人员公知的方法容易地实现四位数字到模拟转换器290。图14所示的一个这样的方法是采用包括电阻器431-438的R/2R阶梯设计。每个数字输入DO-D3被偏压在处于Vcc的逻辑“高”状态,或者处于接地的逻辑“低”状态。这些输入连接到电阻器“阶梯”,产生跨过电阻器网络的电压VR。通过改变寄存器289中的二进制位组合,电阻器阶梯电压VR可以动态地变化。具体地,如果寄存器289包括4位的字,十六个可能的数字组合创建十六个唯一的等效电路,每个具有不同且唯一的VR电压。为了避免与变化的负载阻抗的相互作用,电压跟随器439缓冲阶梯输出电压。通过使用电阻器二进制加权,D/A转换器290产生数字码到模拟电压的线性单调转换。The four-bit digital-to-analog converter 290 can be readily implemented using methods well known to those skilled in the art. One such method, shown in FIG14 , employs an R/2R ladder design comprising resistors 431-438. Each digital input D0-D3 is biased in a logic "high" state at Vcc or in a logic "low" state at ground. These inputs are connected to a resistor "ladder," generating a voltage VR across the resistor network. By changing the binary bit combinations in register 289, the resistor ladder voltage VR can be dynamically varied. Specifically, if register 289 comprises a 4-bit word, the sixteen possible digital combinations create sixteen unique equivalent circuits, each with a different and unique VR voltage. To avoid interaction with varying load impedances, voltage follower 439 buffers the ladder output voltage. By using binary weighting of the resistors, D/A converter 290 produces a linear, monotonic conversion of the digital code to an analog voltage.

支持多个SLI总线嵌入的CSFB信号Supports multiple SLI buses embedded with CSFB signals

如之前所述,模拟电流感应反馈的限制之一是其支持多个独立的反馈信号的不灵活性。当每个系统需要多于一个SMPS时,需要多个反馈信号以支持较高的功率水平或者驱动具有不同颜色的多串LED。例如,在其中单个电源过大并且能量低效的较大的较亮的显示器中,需要产生独立的+VLED电源的两个SMPS模块。在RGB背光照明中,需要至少三个单独的电源,一个用于对红色LED串供电,一个用于对绿色LED串供电,并且另一个用于对蓝色LED串供电。在某些情况下,在RGBG背光中,采用四个电源,因为需要关于绿色LED需要两串而不是一串以实现最佳颜色平衡。不管怎样,在如今的系统中,支持具有不同的输出电压的多个电源需要将整个LED背光系统加倍或翻三倍,使得解决方案成本高、复杂且对于耦合到多个模拟反馈信号中的噪声敏感。As mentioned previously, one of the limitations of analog current sensing feedback is its inflexibility to support multiple independent feedback signals. When more than one SMPS is required per system, multiple feedback signals are needed to support higher power levels or to drive multiple strings of LEDs with different colors. For example, in larger, brighter displays where a single power supply is too large and energy inefficient, two SMPS modules are needed to generate independent +V LED supplies. In RGB backlighting, at least three separate power supplies are required, one for powering the red LED string, one for powering the green LED string, and another for powering the blue LED string. In some cases, in RGBG backlighting, four power supplies are employed because two strings of green LEDs are required instead of one to achieve optimal color balance. Regardless, in today's systems, supporting multiple power supplies with different output voltages requires doubling or tripling the entire LED backlight system, making the solution costly, complex, and sensitive to noise coupling into the multiple analog feedback signals.

将SLI总线嵌入的CSFB方法修改为支持多个DCSFB信号解决了多个模拟电流感应反馈信号的有问题的方面,而除了额外的SMPS模块之外不改变BOM系统成本,不改变SLI总线架构,不改变LED驱动器IC,并且对接口IC进行最小的改变。这样,根据本发明而做出的单个背光系统能够适配为以直接的方式支持多个电源。Modifying the SLI bus embedded CSFB approach to support multiple DCSFB signals addresses the problematic aspects of multiple analog current sense feedback signals without changing the BOM system cost beyond the additional SMPS module, without changing the SLI bus architecture, without changing the LED driver IC, and with minimal changes to the interface IC. Thus, a single backlight system made in accordance with the present invention can be adapted to support multiple power supplies in a straightforward manner.

如图15所示,根据本发明而做出的多电源LED驱动系统450包括单个接口IC 451以及单个SLI总线菊链161,其使用对于多个DCSFB信号而适配的所公开的SLI总线嵌入的CSFB方法,利用用于每个SMPS模块的独立的反馈线452和455来控制八个LED驱动器IC 174的阵列以及两个SMPS模块453和456。以此方式,单个缩放器视频处理器IC 153和微控制器152可以从两个高电压电源而驱动分离的LED背光阵列,SMPS模块453和456的每个以对于其正驱动的LED串的最佳电压来操作。为了精确的电流匹配,所有LED驱动器IC 174A-174H共享线155上的公共Vref模拟参考电压。As shown in FIG15 , a multi-power LED driver system 450 according to the present invention includes a single interface IC 451 and a single SLI bus daisy chain 161. It uses the disclosed SLI bus embedded CSFB method adapted for multiple DCSFB signals to control an array of eight LED driver ICs 174 and two SMPS modules 453 and 456, utilizing independent feedback lines 452 and 455 for each SMPS module. In this way, a single scaler video processor IC 153 and microcontroller 152 can drive separate LED backlight arrays from two high-voltage power supplies, with each SMPS module 453 and 456 operating at the optimal voltage for the LED string it is driving. For precise current matching, all LED driver ICs 174A-174H share a common Vref analog reference voltage on line 155.

在如所示的双电源背光系统450中,从被动态地调压到作为数字反馈信号DCSFB1的函数的电压的+VLED1的公共高电压电源轨454对LED串156A-156H供电。接口IC 451通过询问从LED驱动器IC 174A-174D取回的SLI总线嵌入的CSFB数据并且选择该数据流中的最低值而确定DCSFB1的值。此数字值然后被作为电压反馈信号CSFBO1或者作为电流反馈信号ICSFB1而被转换为用于控制SMPS1模块453的线452上的模拟反馈信号。类似地,被动态地调压到作为数字反馈信号DCSFB2的函数的电压的+VLED2的公共高电压电源轨457对LED串156I-156Q供电。接口IC 457通过询问从LED驱动器IC 174E-174H取回的SLI总线嵌入的CSFB数据并选择该数据流中的最低值而确定DCSFB2的值。此数字值然后被作为电压反馈信号CSFBO2或者作为电流反馈信号ICSFB2而被转换为用于控制SMPS2模块456的线455上的模拟反馈信号。In the dual-power backlight system 450 shown, LED strings 156A-156H are powered from a common high-voltage rail 454, +V LED1 , which is dynamically regulated to a voltage as a function of digital feedback signal DCSFB1. Interface IC 451 determines the value of DCSFB1 by interrogating the SLI bus embedded CSFB data retrieved from LED driver ICs 174A-174D and selecting the lowest value in the data stream. This digital value is then converted into an analog feedback signal on line 452 for controlling SMPS1 module 453, either as voltage feedback signal CSFBO1 or as current feedback signal ICSFB1. Similarly, LED strings 156I-156Q are powered from a common high-voltage rail 457, +V LED2 , which is dynamically regulated to a voltage as a function of digital feedback signal DCSFB2. The interface IC 457 determines the value of DCSFB2 by interrogating the SLI bus embedded CSFB data retrieved from the LED driver ICs 174E-174H and selecting the lowest value in the data stream. This digital value is then converted to an analog feedback signal on line 455 for controlling the SMPS2 module 456 as either a voltage feedback signal CSFBO2 or a current feedback signal ICSFB2.

从询问经由SLI总线161I被移位到接口IC 451中的SLI总线161上的数据流,并通过到来的数据位而分类来确定构成CSFB数据的每个字的部分的接口IC 451,以及其来自于的驱动器IC而得到DCSFB1和DCSFB2数据这两者。在宽SLI总线协议的情况下,可以使用计数器或者利用可编程逻辑以确定哪个LED驱动器IC与正到达于线161I的数据有关而实现此分类功能。用于将CSFB数据编码为SLI总线协议的此方法促进控制来自每个驱动器IC嵌入一个单个的CSFB反馈信号的LED驱动器IC的多个电源。尽管驱动器IC 174不需要从先前所述并在单个电源应用中使用的诸如图6所示的系统170的那些进行修改,但是必须修改图15中的接口IC 451以询问其到来的CSFB数据,并将其解析为两个通道的反馈以便独立地控制多个电源。Both DCSFB1 and DCSFB2 data are derived from interrogating the data stream on SLI bus 161, which is shifted into interface IC 451 via SLI bus 161I, and sorting the incoming data bits to determine which LED driver IC constitutes each word of CSFB data, as well as the driver IC from which it originates. In the case of a wide SLI bus protocol, this sorting function can be implemented using counters or programmable logic to determine which LED driver IC is associated with the data arriving on line 161I. This method of encoding CSFB data into the SLI bus protocol facilitates controlling multiple power supplies from LED driver ICs, each embedding a single CSFB feedback signal. While driver IC 174 does not need to be modified from those previously described and used in single-power supply applications, such as system 170 shown in FIG6 , interface IC 451 in FIG15 must be modified to interrogate its incoming CSFB data and parse it into two channels of feedback for independent control of multiple power supplies.

将LED驱动器IC 174A-174D有关的CSFB数据与LED驱动器IC 174E-174H有关的CSFB数据分离的方法被功能性地例示在图16中。进入SLI总线移位寄存器474的SLI总线数据流473包括从八个单独的LED驱动器IC(未示出)中并且在该八个单独的LED驱动器IC内产生的八个CSFB信号473A-473H,每个驱动器IC将其自己唯一的CSFB反馈值发送到接口IC用于处理。解释到来的CSFB反馈数据的SLI总线移位寄存器474存在于如所示输出反馈信号487和488以控制两个电源的上述的接口IC内,例如,在接口IC或其等效物内。The method for separating the CSFB data associated with LED driver ICs 174A-174D from the CSFB data associated with LED driver ICs 174E-174H is functionally illustrated in FIG16. The SLI bus data stream 473 entering the SLI bus shift register 474 includes eight CSFB signals 473A-473H generated from and within eight individual LED driver ICs (not shown), each of which sends its own unique CSFB feedback value to the interface IC for processing. The SLI bus shift register 474 that interprets the incoming CSFB feedback data resides within the aforementioned interface IC, which outputs feedback signals 487 and 488 as shown to control the two power supplies, for example, within the interface IC or its equivalent.

因为包含CSFB数据472的宽SLI总线协议471不包含关于哪个驱动器IC产生了特定CSFB信号的信息,所以必须使用计数器或可编程逻辑来在数据被移位到SLI总线移位寄存器474中时标识该数据的源。在所示的例子中,从LED驱动器IC 174A-174D产生的CSFB数据字473A-473D控制电源电压SMPS1的输出电压,而从LED驱动器IC 174E-174H产生的CSFB数据字473E-473H控制电源电压SMPS2的输出电压。在结构上表示字473A-473H的每个的数据字471包括嵌入在构成非CSFB数据的位内的、表示CSFB数据的CSFB分组472。在所示的例子中,用于控制SMPS2的数据字473E到473H首先被移位到SLI总线移位寄存器474中,跟着是控制SMPS1的字。此序列是任意的并且可以在不同系统之间变化。事实上,对于控制SMPS1和SMPS2的数据的可以想到的散布,将进一步使分类处理复杂化。Because the wide SLI bus protocol 471, which contains CSFB data 472, does not contain information about which driver IC generated a particular CSFB signal, counters or programmable logic must be used to identify the source of the data as it is shifted into the SLI bus shift register 474. In the example shown, CSFB data words 473A-473D generated by LED driver ICs 174A-174D control the output voltage of voltage supply SMPS1, while CSFB data words 473E-473H generated by LED driver ICs 174E-174H control the output voltage of voltage supply SMPS2. Structurally, data word 471 representing each of words 473A-473H includes CSFB packets 472 representing CSFB data embedded within bits that constitute non-CSFB data. In the example shown, data words 473E through 473H for controlling SMPS2 are shifted into the SLI bus shift register 474 first, followed by the words for controlling SMPS1. This sequence is arbitrary and may vary between different systems. In fact, the conceivable scattering of the data for controlling SMPS1 and SMPS2 would further complicate the classification process.

为了将到来的SLI总线数据解析为不同的字473A-473H,隔离每个字中的CSFB数据分组472,并标识哪个LED驱动器IC通道发送了数据,计数器477对SCK脉冲的数量计数,并且解码器478解释对相应的数据做什么,将其从SLI总线寄存器加载到有效锁存器作为CSFB1数据、CSFB2数据或者将其丢弃。具体地,复用器475将用于通道A、B、C和D的SLI总线数据引导到比较1寄存器478,并且将用于通道E、F、G和H的数据引导到比较2寄存器479。尽管SLI总线移位寄存器474包含长度是66或88位的整个宽SLI总线协议字,但是仅4位宽的CSFB分组472被加载到比较寄存器478或479中。所有其他位被丢弃或者由接口IC内的其他寄存器和功能使用。To parse the incoming SLI bus data into the different words 473A-473H, isolate the CSFB data packet 472 within each word, and identify which LED driver IC channel sent the data, a counter 477 counts the number of SCK pulses, and a decoder 478 interprets what to do with the corresponding data, loading it from the SLI bus registers into the valid latch as CSFB1 data, CSFB2 data, or discarding it. Specifically, a multiplexer 475 directs the SLI bus data for channels A, B, C, and D to a compare 1 register 478, and the data for channels E, F, G, and H to a compare 2 register 479. Although the SLI bus shift register 474 contains the entire wide SLI bus protocol word, which is either 66 or 88 bits in length, only the 4-bit wide CSFB packet 472 is loaded into the compare register 478 or 479. All other bits are discarded or used by other registers and functions within the interface IC.

当通道1CSFB数据分组472已经被加载到比较1寄存器478中时,到来的数据与“最低CSFB1”寄存器480中的数据比较,仅在新数据具有在数字上较低的幅度值时盖写寄存器480数据。否则,“最低CSFB1”中的数据保持不更改。在SLI总线移位操作的完成时或者在下一Vsync脉冲时,DCSFB1数据然后被加载到有效锁存器和D/A转换器482中,并且SMPS1的输出电压改变。模拟反馈信号487可以包括电压输出CSFBO1或者电流ICSFB1,其中运算跨导放大器OTA 484将CSFBO1反馈电压转换为ICSFB1反馈电流。以类似的方式,当通道2CSFB数据472被加载到比较器2寄存器479中时,到来的数据与“最低CSFB2”寄存器481中的数据比较,并且仅在新数据具有在数字上较低的幅度值时盖写寄存器481数据。否则,“最低CSFB2”中的数据保持不更改。在SLI总线移位操作的完成时或者在下一Vsync脉冲时,DCSFB2数据然后被加载到有效锁存器和D/A转换器483中,并且SMPS2的输出电压改变。模拟反馈信号488可以包括电压输出CSFBO2或者电流ICSFB2,其中运算跨导放大器OTA 486将CSFBO2反馈电压转换为ICSFB2反馈电流。When Channel 1 CSFB data packet 472 has been loaded into Compare 1 register 478, the incoming data is compared with the data in "Lowest CSFB1" register 480, overwriting register 480 only if the new data has a numerically lower magnitude. Otherwise, the data in "Lowest CSFB1" remains unchanged. Upon completion of the SLI bus shift operation or upon the next Vsync pulse, the DCSFB1 data is then loaded into the valid latch and D/A converter 482, and the output voltage of SMPS 1 changes. Analog feedback signal 487 may include a voltage output CSFB1 or a current ICSFB1, where operational transconductance amplifier OTA 484 converts the CSFB1 feedback voltage into the ICSFB1 feedback current. Similarly, when Channel 2 CSFB data 472 is loaded into Comparator 2 register 479, the incoming data is compared with the data in "Lowest CSFB2" register 481, overwriting register 481 only if the new data has a numerically lower magnitude. Otherwise, the data in "Lowest CSFB2" remains unchanged. Upon completion of the SLI bus shift operation or upon the next Vsync pulse, the DCSFB2 data is then loaded into the valid latch and D/A converter 483, and the output voltage of SMPS 2 changes. The analog feedback signal 488 may include a voltage output CSFBO2 or a current ICSFB2, where the operational transconductance amplifier OTA 486 converts the CSFBO2 feedback voltage into the ICSFB2 feedback current.

以此方式,计数器477、解码器476、和复用器475能够解释并分类SLI总线数据流473,从每个LED驱动器IC提取SLI总线嵌入的数字CSFB信号472以经由模拟CSFB信号487和488动态地控制两个SMPS输出。通过改变解码器476并且添加额外的比较寄存器和D/A转换器,此概念可以扩展到三个或更多电源。如所示,数据流473将控制SMPS2的所有LED驱动器IC数据分组为连续的字473H-473E,跟着是控制SMPS1的所有LED驱动器IC数据,其包括顺序的SLI总线字473D-473A。在本发明的其他实施例中,用于两个或更多个SMPS模块的CSFB反馈数据可以以交替或者随机的方式散布。因此,解码器476可以包括可重配置的逻辑、场可编程门阵列或者小型微控制器核心,以便对于变化的序列灵活地适配分类过程。注意,在启动时,CSFB寄存器最初被加载有最高值。在那之后,在SLI总线数据中更新最新近的CSFB数据,永久动态地调整电源电压。In this manner, counter 477, decoder 476, and multiplexer 475 are able to interpret and classify SLI bus data stream 473, extracting the SLI bus-embedded digital CSFB signal 472 from each LED driver IC to dynamically control both SMPS outputs via analog CSFB signals 487 and 488. This concept can be extended to three or more power supplies by modifying decoder 476 and adding additional compare registers and D/A converters. As shown, data stream 473 groups all LED driver IC data controlling SMPS2 into sequential words 473H-473E, followed by all LED driver IC data controlling SMPS1, which comprises sequential SLI bus words 473D-473A. In other embodiments of the present invention, the CSFB feedback data for two or more SMPS modules can be interspersed in an alternating or random manner. Therefore, decoder 476 can comprise reconfigurable logic, a field programmable gate array, or a small microcontroller core to flexibly adapt the classification process to varying sequences. Note that at startup, the CSFB register is initially loaded with the highest value. After that, the most recent CSFB data is updated in the SLI bus data, permanently and dynamically adjusting the power supply voltage.

在根据本发明的一个替换实施例中,分离SLI总线嵌入的CSFB数据并将其分配到几个电源电压之一所需的信息可以被内置到协议本身。在前缀复用的SLI总线协议和硬件接口中,使用分离的前缀码提取和分配嵌入的CSFB数据的一个方法如图17所示。在此例子中,用于标识要被数字CSFB数据控制的SMPS的前缀码及其相关联的CSFB数据被嵌入在由每个LED驱动器IC产生的SLI总线数据流中。通过读取并解码该前缀码,然后接口IC能够容易地将反馈数据分配到适当的SMPS。In an alternative embodiment according to the present invention, the information required to separate the SLI bus's embedded CSFB data and distribute it to one of several supply voltages can be built into the protocol itself. One method for extracting and distributing embedded CSFB data using separate prefix codes within a prefix-multiplexed SLI bus protocol and hardware interface is shown in Figure 17. In this example, a prefix code identifying the SMPS to be controlled by the digital CSFB data and its associated CSFB data are embedded in the SLI bus data stream generated by each LED driver IC. By reading and decoding this prefix code, the interface IC can then easily distribute the feedback data to the appropriate SMPS.

作为示例,SLI总线数据流493嵌入两种类型的CSFB信号,具体地,包括具有用于控制SMPS1的相应数据CSFB1的前缀码“前缀1”的SLI总线字491,以及包括对应于用于控制SMPS2的CSFB2数据的“前缀2”的SLI总线字492。在此实施例中,SLI总线数据流493包括控制SMPS2的四个字493H-493E以及控制SMPS1的四个字493D-493A。SLI总线数据流493在SCK信号的控制下顺序地被移位到SLI总线串行移位寄存器494中,由此前缀码由前缀解码器495解释,并且复用器496引导该数据到适当的功能锁存器。As an example, SLI bus data stream 493 embeds two types of CSFB signals, specifically, an SLI bus word 491 having a prefix code "Prefix 1" corresponding to data CSFB1 for controlling SMPS1, and an SLI bus word 492 including "Prefix 2" corresponding to CSFB2 data for controlling SMPS2. In this embodiment, SLI bus data stream 493 includes four words 493H-493E for controlling SMPS2 and four words 493D-493A for controlling SMPS1. SLI bus data stream 493 is sequentially shifted into SLI bus serial shift register 494 under the control of the SCK signal, whereby the prefix code is interpreted by prefix decoder 495, and multiplexer 496 directs the data to the appropriate function latch.

在前缀码标识CSFB1数据的情况下,前缀解码器495指导复用器496将CSFB数据从SLI总线寄存器494的数据字段加载到“比较1”寄存器478,如所示包括用于LED驱动器IC A、B、C和D的CSFB数据。比较1功能478然后仅在SLI总线494中的到来的数据具有比当前存在于“最低CSFB1”寄存器480中的数据更低的数字幅度时才盖写最低CSFB1锁存器480中的数据,否则寄存器480中的数据保持不改变。在SLI总线数据流493中的所有字被移位到SLI总线移位寄存器494中并且被解释之后,“最低CSFB1”寄存器480中的数据表示CSFB1数据的当前数字表示,即,DCSFB1。此时或者与下一Vsync脉冲同步地,DCSFB1数据被复制到有效锁存器和D/A转换器482中,产生包括电压输出CSFBO1的模拟反馈输出486或者在被OTA484转换后的电流输出ICSFB1。In the event that the prefix code identifies CSFB1 data, prefix decoder 495 directs multiplexer 496 to load the CSFB data from the data field of SLI bus register 494 into "Compare 1" register 478, including CSFB data for LED driver ICs A, B, C, and D as shown. Compare 1 function 478 then overwrites the data in lowest CSFB1 latch 480 only if the incoming data in SLI bus 494 has a lower digital magnitude than the data currently present in "Lowest CSFB1" register 480; otherwise, the data in register 480 remains unchanged. After all words in SLI bus data stream 493 have been shifted into SLI bus shift register 494 and interpreted, the data in "Lowest CSFB1" register 480 represents the current digital representation of the CSFB1 data, i.e., DCSFB1. At this time or in synchronization with the next Vsync pulse, the DCSFB1 data is copied into the valid latch and D/A converter 482, generating analog feedback outputs 486 including voltage output CSFBO1 or current output ICSFB1 after conversion by OTA 484.

以类似的方式,当前缀码标识CSFB2数据的情况下,前缀解码器495指导复用器496将CSFB数据从SLI总线寄存器494的数据字段加载到比较2寄存器479,如所示包括用于LED驱动器IC E、F、G和H的CSFB数据。比较功能479然后仅在SLI总线494中的到来的数据具有比当前存在于“最低CSFB2”寄存器481中的数据更低的数字幅度时才盖写“最低CSFB2”锁存器481中的数据,否则寄存器481中的数据保持不改变。在SLI总线数据流493中的所有字被移位到SLI总线移位寄存器494中并且被解释之后,最低CSFB2寄存器481中的数据表示CSFB2数据的当前数字表示,即,DCSFB2。此时或者与下一Vsync脉冲同步地,DCSFB2数据被复制到有效锁存器和D/A转换器483中,产生包括电压输出CSFBO2的模拟反馈输出487或者在被OTA485转换后的电流输出ICSFB2。In a similar manner, when the prefix code identifies CSFB2 data, prefix decoder 495 directs multiplexer 496 to load the CSFB data from the data field of SLI bus register 494 into compare 2 register 479, including the CSFB data for LED driver ICs E, F, G, and H as shown. Compare function 479 then overwrites the data in "Lowest CSFB2" latch 481 only if the incoming data in SLI bus 494 has a lower digital magnitude than the data currently present in "Lowest CSFB2" register 481; otherwise, the data in register 481 remains unchanged. After all words in SLI bus data stream 493 have been shifted into SLI bus shift register 494 and interpreted, the data in lowest CSFB2 register 481 represents the current digital representation of the CSFB2 data, i.e., DCSFB2. At this time or in synchronization with the next Vsync pulse, the DCSFB2 data is copied into the valid latch and D/A converter 483, generating analog feedback output 487 including voltage output CSFBO2 or current output ICSFB2 after conversion by OTA485.

在所示的例子中,被移位到SLI总线移位寄存器494中的前四个字是与SMPS2的控制相关联的字,即,LED驱动器IC H、G、F和E,跟着是控制SMPS1的四个字,按照如同LED驱动器IC D、C、B和A那样的顺序。但是,利用前缀复用的SLI总线,数据流不限于特定序列。而是,数据序列可以在任何交替的或随机的序列中混合用于SMPS1和SMPS2的反馈数据。此外,使用对于每个CSFB信号不同的前缀码,可以将任意数量的CSFB信号嵌入到SLI总线数据流中。In the example shown, the first four words shifted into the SLI bus shift register 494 are those associated with the control of SMPS2, i.e., LED driver ICs H, G, F, and E. These are followed by the four words controlling SMPS1, in the same order as LED driver ICs D, C, B, and A. However, with a prefix-multiplexed SLI bus, the data stream is not limited to a specific sequence. Rather, the data sequence can be any alternating or random sequence, mixing the feedback data for SMPS1 and SMPS2. Furthermore, any number of CSFB signals can be embedded into the SLI bus data stream using a different prefix code for each CSFB signal.

例如,格式可以容易地适配为支持符合驱动RGB背光照明系统的三个电源,或者支持在RGBG或RGBY背光照明方法中有用的四个单独的反馈信号。RGBG背光照明解决方案采用由一个SMPS供电的红色LED串、由另一个SMPS供电的蓝色LED串、以及由两个SMPS模块供电的两倍数量的绿色LED串,以便补偿当今的绿色LED的较低亮度。在RGBY背光照明中,包括黄色LED,以扩展色温的范围。在其中使用RGB、RGBG或RGBY来产生实际图像而不是产生白色背光的标志图样应用中也可以使用相同的系统。For example, the format can be easily adapted to support three power supplies that are compatible with driving an RGB backlighting system, or to support four separate feedback signals useful in RGBG or RGBY backlighting methods. An RGBG backlighting solution uses a red LED string powered by one SMPS, a blue LED string powered by another SMPS, and twice the number of green LED strings powered by two SMPS modules to compensate for the lower brightness of today's green LEDs. In RGBY backlighting, yellow LEDs are included to extend the range of color temperatures. The same system can also be used in logo pattern applications where RGB, RGBG, or RGBY are used to generate actual images rather than white backlight.

总言之,图17示出的是,可以使用单独的前缀码来将多个不同的CSFB信号嵌入到SLI总线数据流中以产生对于管理多个电源而不需要模拟反馈网络的灵活解决方案。替换的方法是将高达四个CSFB信号嵌入到单个前缀复用的SLI总线字的数据字段中,将一个16位的SLI总线数据字段划分为四个CSFB4位“元组”。将CSFB数据嵌入到SLI总线协议中的这种替换方法例示在图18中,其中使用32位前缀复用的或者“窄的”ZLI总线协议的一个SLI总线字501包括16位前缀码502E以及四个4位CSFB信号502A-502D。In summary, FIG17 illustrates that a single prefix code can be used to embed multiple different CSFB signals into the SLI bus data stream to create a flexible solution for managing multiple power supplies without the need for an analog feedback network. An alternative approach is to embed up to four CSFB signals into the data field of a single prefix-multiplexed SLI bus word, dividing a 16-bit SLI bus data field into four CSFB 4-bit "tuples." This alternative method of embedding CSFB data into the SLI bus protocol is illustrated in FIG18 , where an SLI bus word 501 using a 32-bit prefix-multiplexed or "narrow" ZLI bus protocol includes a 16-bit prefix code 502E and four 4-bit CSFB signals 502A-502D.

在SLI总线字501的数据字段中,CSFB1字502A包括:在SLI总线数据字段中的四个最低有效位,位0到3;CSFB2字502B包括:在SLI总线数据字段中的接下来四个较高有效位,位4到7;CSFB3字502C包括:SLI总线数据字段中的接下来四个更高有效位,位8到11;以及CSFB4字502D包括:SLI总线数据字段中的四个最高有效位,位12到15。In the data field of SLI bus word 501, CSFB1 word 502A includes: the four least significant bits in the SLI bus data field, bits 0 to 3; CSFB2 word 502B includes: the next four more significant bits in the SLI bus data field, bits 4 to 7; CSFB3 word 502C includes: the next four more significant bits in the SLI bus data field, bits 8 to 11; and CSFB4 word 502D includes: the four most significant bits in the SLI bus data field, bits 12 to 15.

前缀解码器502解码前缀502E,其指示复用器504以将所有四个CSFB字502A-502D传输到比较寄存器505中。比较寄存器505然后将SLI总线中的4位CSFB数据502A与最低CSFB寄存器506中的CSFB1数据比较,仅在502A中的新数据较低时才盖写寄存器506中的数据。比较寄存器505同时比较SLI总线中的4位CSFB2数据502B与最低CSFB寄存器560中的CSFB2数据,并且仅在502B中的新数据较低时才盖写寄存器506中的数据。同时期地,比较功能505比较502C中的数据与“最低CSFB”寄存器506中的CSFB3数据,并且比较502D中的数据与“最低CSFB”寄存器506中的CSFB4数据。在数据被移位到串行移位寄存器501中之后,“最低CSFB”寄存器506包含最当前的CSFB值。Prefix decoder 502 decodes prefix 502E, which instructs multiplexer 504 to transfer all four CSFB words 502A-502D into compare register 505. Compare register 505 then compares the 4-bit CSFB data 502A from the SLI bus with the CSFB1 data in the lowest CSFB register 506, overwriting the data in register 506 only if the new data in 502A is lower. Compare register 505 simultaneously compares the 4-bit CSFB2 data 502B from the SLI bus with the CSFB2 data in the lowest CSFB register 560, overwriting the data in register 506 only if the new data in 502B is lower. Concurrently, compare function 505 compares the data in 502C with the CSFB3 data in the "lowest CSFB" register 506, and compares the data in 502D with the CSFB4 data in the "lowest CSFB" register 506. After the data is shifted into serial shift register 501, the "lowest CSFB" register 506 contains the most current CSFB value.

寄存器506内的数据然后被用于实时地或者与下一Vsync脉冲同步地使用D/A转换器507A-510以及跨导放大器511-514来产生CSFB反馈输出511-518。寄存器506中的四个最低有效位表示由D/A转换器507和OTA 511处理以产生用于控制SMPS1的CSFB01和ICSFB1输出的DCSFB1数据。类似地,在连续的4位组合中,寄存器506包含用于控制SMPS2的DCSFB2数据、用于控制SMPS3的DCSFB3数据、以及用于控制SMPS4的DCSFB4数据。如以根据本发明做出的方式所述,SLI总线501中的一个多CSFB指令独立地动态实时控制高达四个SMPS输出电压。The data within register 506 is then used to generate CSFB feedback outputs 511-518 using D/A converters 507A-510 and transconductance amplifiers 511-514, either in real time or synchronously with the next Vsync pulse. The four least significant bits in register 506 represent DCSFB1 data, which is processed by D/A converter 507 and OTA 511 to generate the CSFB01 and ICSFB1 outputs for controlling SMPS1. Similarly, in consecutive 4-bit combinations, register 506 contains DCSFB2 data for controlling SMPS2, DCSFB3 data for controlling SMPS3, and DCSFB4 data for controlling SMPS4. As described in accordance with the present invention, one multi-CSFB instruction on SLI bus 501 independently and dynamically controls up to four SMPS output voltages in real time.

独立地控制三个SMPS输出的多CSFB嵌入的SLI总线的应用例示在图19中,由此SLI总线数据流523包括九个SLI总线字523I-523A的序列,每个遵循由前缀复用的SLI总线字521表示的四倍CSFB协议,其具有相应的数据字段“wxyz”。用于CSFB1的数据被编码在SLI总线字523G、523D和523A的四个最低有效位中,而剩余的位表示可能的最高数字值,即,二进制的1111或十六进制的“F”。SLI总线字523G、523D和523A中的数据因此包括以格式[11111111 1111wxyz]的16位二进制字。An example of an SLI bus application with multiple CSFB embedded to independently control three SMPS outputs is shown in FIG19 , whereby an SLI bus data stream 523 comprises a sequence of nine SLI bus words 523I-523A, each following a quadruple CSFB protocol represented by prefix-multiplexed SLI bus word 521, with a corresponding data field "wxyz". The data for CSFB1 is encoded in the four least significant bits of SLI bus words 523G, 523D, and 523A, while the remaining bits represent the highest possible digital value, i.e., 1111 in binary or "F" in hexadecimal. The data in SLI bus words 523G, 523D, and 523A thus comprises 16-bit binary words in the format [11111111 1111wxyz].

以类似的方式,用于CSFB2的数据被编码在SLI总线字523H、523E和523B的接下来四个较高有效位中,而剩余的位表示可能的最高数字值,即,二进制的1111。SLI总线字523H、523E和523B中的数据因此包括以格式[11111111wxyz 1111]的16位二进制字。用于CSFB3的数据被编码在SLI总线字523I、523F和523C的接下来四个较高有效位中,而剩余的位表示可能的最高数字值,即,二进制的1111。SLI总线字523I、523F和523C中的数据因此包括以格式[1111wxyz 1111 1111]的16位二进制字。如所示,SLI总线数据流523中的字不包含CSFB4数据,因此其仍然处于最高电压DCSFB值1111。In a similar manner, data for CSFB2 is encoded in the next four more significant bits of SLI bus words 523H, 523E, and 523B, with the remaining bits representing the highest possible digital value, i.e., binary 1111. The data in SLI bus words 523H, 523E, and 523B thus comprises a 16-bit binary word in the format [11111111wxyz 1111]. Data for CSFB3 is encoded in the next four more significant bits of SLI bus words 523I, 523F, and 523C, with the remaining bits representing the highest possible digital value, i.e., binary 1111. The data in SLI bus words 523I, 523F, and 523C thus comprises a 16-bit binary word in the format [1111wxyz 1111 1111]. As shown, the words in the SLI bus data stream 523 do not contain CSFB4 data, so it remains at the highest voltage DCSFB value 1111.

SLI总线数据523串行地被移位到SLI总线移位寄存器524中,一旦被四倍解码器525解码,就指示复用器526将适当的4位元组从SLI总线数据521分别写到“比较”寄存器527、528和529中,其中,CSFB1被加载到比较1寄存器527中,CSFB2数据被加载到比较2寄存器528中,CSFB3数据被加载到比较1寄存器529中,以用于随后在模拟反馈信号539-541中的转换。如所示,CSFB4数据不被加载到任何比较寄存器中,因此不影响任何SMPS输出。这样的三个输出解码可应用于RGB背光照明应用。SLI bus data 523 is serially shifted into SLI bus shift register 524. Once decoded by quad decoder 525, it instructs multiplexer 526 to write the appropriate 4-byte group from SLI bus data 521 into "compare" registers 527, 528, and 529, respectively. CSFB1 is loaded into Compare 1 register 527, CSFB2 data is loaded into Compare 2 register 528, and CSFB3 data is loaded into Compare 1 register 529 for subsequent conversion into analog feedback signals 539-541. As shown, CSFB4 data is not loaded into any compare register and therefore does not affect any SMPS output. This three-output decoding can be applied to RGB backlighting applications.

一个可能的RGB背光示出在图20中,其中LED驱动器IC 562A、562D和562G控制和提供用于SMPS1 554的CSFB反馈信号564之一,以电源轨557上的电压+VLED1对红色LED串560A、560B、560G、560H、560M和560N供电;其中LED驱动器IC 562B、562E和562H控制和提供用于SMPS2 555的CSFB反馈信号564之一,以电源轨558上的电压+VLED2对绿色LED串560C、560D、560I、560J、560P和560Q供电;以及其中LED驱动器IC 562C、562F和562I控制和提供用于SMPS3 556的CSFB反馈信号564之一,以电源轨559上的电压+VLED3对蓝色LED串560E、560F、560K、560L、560R和560S供电。One possible RGB backlight is shown in FIG. 20 , where LED driver ICs 562A, 562D, and 562G control and provide one of the CSFB feedback signals 564 for SMPS1 554 to power red LED strings 560A, 560B, 560G, 560H, 560M, and 560N at a voltage of +V LED1 on power rail 557; where LED driver ICs 562B, 562E, and 562H control and provide one of the CSFB feedback signals 564 for SMPS2 555 to power green LED strings 560C, 560D, 560I, 560J, 560P, and 560Q at a voltage of +V LED2 on power rail 558; and where LED driver ICs 562C, 562F, and 562I control and provide one of the CSFB feedback signals 564 for SMPS3 556 to power green LED strings 560C, 560D, 560I, 560J, 560P, and 560Q at a voltage of +V LED2 on power rail 559. LED3 powers blue LED strings 560E, 560F, 560K, 560L, 560R, and 560S.

所有三个CSFB信号被数字地嵌入到包括SLI总线563A-563J的单个SLI总线菊链中,并且被接口IC 551转换为单独的模拟反馈信号564,促进响应于来自μC552和缩放器IC553的指令对红色、绿色和蓝色LED电源电压+VLED1、+VLED2和+VLED3的动态控制。All three CSFB signals are digitally embedded into a single SLI bus daisy chain comprising SLI buses 563A-563J and converted by interface IC 551 into individual analog feedback signals 564, facilitating dynamic control of the red, green, and blue LED supply voltages + VLED1 , + VLED2 , and + VLED3 in response to instructions from μC 552 and scaler IC 553.

在系统550中,每个LED驱动器IC驱动具有相同颜色的两串LED,并且输出单个CSFB值。在图21所示的替换实施例中,每个LED驱动器IC 612控制三个不同的LED串,即,一个红色、一个绿色和一个蓝色LED串,并且输出三个不同的CSFB信号。具体地,LED驱动器IC 612A分别控制红色、绿色和蓝色LED串610A、610B和610C,LED驱动器IC 612B分别控制红色、绿色和蓝色LED串610D、610E和610F,等等。此菊链中的最后的LED驱动器IC,即,驱动器612F分别控制红色、绿色和蓝色LED串610Q、610R和610S。每个驱动器IC 612输出用于红色、绿色和蓝色反馈和数字地嵌入在SLI总线613中的电源控制的其自己的CSFB3、CSFB2和CSFB1反馈值。In system 550, each LED driver IC drives two strings of the same color LEDs and outputs a single CSFB value. In an alternative embodiment shown in FIG21, each LED driver IC 612 controls three different LED strings—one red, one green, and one blue—and outputs three different CSFB signals. Specifically, LED driver IC 612A controls red, green, and blue LED strings 610A, 610B, and 610C, respectively; LED driver IC 612B controls red, green, and blue LED strings 610D, 610E, and 610F, respectively; and so on. The last LED driver IC in this daisy chain, driver 612F, controls red, green, and blue LED strings 610Q, 610R, and 610S, respectively. Each driver IC 612 outputs its own CSFB3, CSFB2, and CSFB1 feedback values for red, green, and blue feedback and power supply control digitally embedded in SLI bus 613.

接口IC 601解释由SLI总线菊链613携带的嵌入的CSFB数据,并且输出三个单独的模拟反馈信号614以动态地控制SMPS1模块604、SMPS2模块605、和SMPS3模块606,以产生具有相应的电压+VLED1、+VLED2和+VLED3的动态调整的输出607、608和609。以此方式,缩放器IC603、μC602、接口IC 601以及六个驱动器IC 612形成具有使用SLI总线控制对十八个LED串的独立的动态控制而不需要多个模拟反馈环路的动态可调的背光系统。Interface IC 601 interprets the embedded CSFB data carried by SLI bus daisy chain 613 and outputs three separate analog feedback signals 614 to dynamically control SMPS1 module 604, SMPS2 module 605, and SMPS3 module 606 to produce dynamically adjusted outputs 607, 608, and 609 with corresponding voltages + VLED1 , + VLED2 , and + VLED3 . In this way, scaler IC 603, μC 602, interface IC 601, and six driver ICs 612 form a dynamically adjustable backlight system with independent dynamic control of eighteen LED strings using SLI bus control without the need for multiple analog feedback loops.

对于要嵌入在驱动器IC内的多于一个CSFB信号,必须在LED驱动器IC内产生多于一个CSFB信号。图22例示了八通道LED驱动器IC651,其集成了:八个电流宿DMOSFET 653A-653H、四个独立的CSFB检测电路654A-654D、四个单独的A/D转换器,其导致嵌入四个单独的CSFB信号CSFB1-CSFB4的16位SPI总线字670,其中,所述四个单独的CSFB信号CSFB1-CSFB4提供对四个不同的SMPS输出电压+VLED1-+VLED4的独立的反馈控制。For more than one CSFB signal to be embedded in the driver IC, more than one CSFB signal must be generated within the LED driver IC. FIG22 illustrates an eight-channel LED driver IC 651 that integrates eight current sink DMOSFETs 653A-653H, four independent CSFB detection circuits 654A-654D, and four independent A/D converters, resulting in a 16-bit SPI bus word 670 that embeds four independent CSFB signals CSFB1-CSFB4, wherein the four independent CSFB signals CSFB1-CSFB4 provide independent feedback control of four different SMPS output voltages + VLED1- + VLED4 .

在操作中,LED串652A和652B中的电流产生跨过电流宿DMOSFET653A和653B的感应电压。CSFB电路654A然后确定这两个电压中的哪个较低,并将较低的电压输出到A/D转换器655A,将模拟反馈数据转换为4位数字字CSFB4。类似地,LED串652C和652D中的电流产生跨过电流宿DMOSFET 653C和653D的感应电压。CSFB电路654B然后确定这两个电压中的哪个较低,并将较低的电压输出到A/D转换器655B,将模拟反馈数据转换为4位数字字CSFB3。同样,来自LED串652E和652F的电压反馈确定由A/D转换器655C输出的CSFB2的数字值,并且来自LED串652G和652H的电压反馈确定由A/D转换器655D输出的CSFB1的数字值。In operation, the currents in LED strings 652A and 652B generate induced voltages across current sink DMOSFETs 653A and 653B. CSFB circuit 654A then determines which of these two voltages is lower and outputs the lower voltage to A/D converter 655A, which converts the analog feedback data into a 4-bit digital word, CSFB4. Similarly, the currents in LED strings 652C and 652D generate induced voltages across current sink DMOSFETs 653C and 653D. CSFB circuit 654B then determines which of these two voltages is lower and outputs the lower voltage to A/D converter 655B, which converts the analog feedback data into a 4-bit digital word, CSFB3. Similarly, voltage feedback from LED strings 652E and 652F determines the digital value of CSFB2 output by A/D converter 655C, and voltage feedback from LED strings 652G and 652H determines the digital value of CSFB1 output by A/D converter 655D.

CSFB4数据被存储在采样锁存器666的四个最高有效位中,CSFB3占据接下来四个较低有效位,CSFB2占据接下来四个较低有效位,CSFB1填充采样锁存器666的四个最低有效位。当由前缀解码器667A和前缀码669P指示这样做时,来自预加载锁存器666的所有16位数据经过复用器667B被复制到SLI总线移位寄存器5658的数据字段669D中。此数据字段由此不包含一个而是包含四个独立的4位CSFB字CSFB4到CSFB1,如数据集670所示。CSFB4 data is stored in the four most significant bits of sampling latch 666, CSFB3 occupies the next four less significant bits, CSFB2 occupies the next four less significant bits, and CSFB1 fills the four least significant bits of sampling latch 666. When instructed to do so by prefix decoder 667A and prefix code 669P, all 16 bits of data from preload latch 666 are copied through multiplexer 667B into data field 669D of SLI bus shift register 5658. This data field thus contains not one but four separate 4-bit CSFB words, CSFB4 through CSFB1, as shown in data set 670.

这些CSFB信号在被移位到接口IC中之后最终以图18所述的方式设置+VLED4到+VLED1电源的相应电压输出。四个CSFB信号在其中两组绿色LED串由分离的SMPS电压供电的RGBG背光中是有用的。可替换地,不需要使用所有16位。例如,在RGB应用中,可以去除A/D转换器655A,并且可以使用采样锁存器666的12个最低有效位来控制三个单独的电源,例如用于红色LED串的+VLED3、用于绿色LED串的+VLED2、以及用于蓝色LED串的+VLED1。通过删除具有电流宿MOSFET 652A和652B的未使用的CSFB 654A,并且还删除不需要的MOSFET电流宿652D、652F和652H以实现三个CSFB、三通道LED驱动器IC,这样的方法与图21所示的系统示例一致。After being shifted into the interface IC, these CSFB signals ultimately set the corresponding voltage outputs of the + VLED4 to + VLED1 power supplies in the manner described in FIG18 . Four CSFB signals are useful in RGBG backlights where two sets of green LED strings are powered by separate SMPS voltages. Alternatively, not all 16 bits need to be used. For example, in an RGB application, A/D converter 655A can be eliminated, and the 12 least significant bits of sampling latch 666 can be used to control three separate power supplies, such as + VLED3 for the red LED string, + VLED2 for the green LED string, and + VLED1 for the blue LED string. By removing the unused CSFB 654A with current sink MOSFETs 652A and 652B, and also removing the unneeded MOSFET current sinks 652D, 652F, and 652H to implement a three-CSFB, three-channel LED driver IC, such an approach is consistent with the system example shown in FIG21 .

Claims (16)

1.一种用来控制向多个发光二极管串供电的电源的集成电路,所述集成电路包括:1. An integrated circuit for controlling a power supply to a plurality of light-emitting diode strings, the integrated circuit comprising: 与菊链式耦合的多个串行移位寄存器耦合的接口电路,所述接口电路被配置为从所述多个串行移位寄存器接收多个数字值,并且从所述多个数字值中识别出最低数字值,多个数字值的每个与所述多个发光二极管串的一个发光二极管串的一端处的电压电平对应;以及An interface circuit coupled to a plurality of daisy-chained serial shift registers, the interface circuit being configured to receive a plurality of digital values from the plurality of serial shift registers and identify the lowest digital value from the plurality of digital values, each of the plurality of digital values corresponding to a voltage level at one end of one of the plurality of LED strings; and 与所述接口电路耦合的转换器,所述转换器被配置为将所述最低数字值转换成控制信号并且将所述控制信号提供给所述电源以调整所述电源的输出电压,所述转换器包含数字到模拟转换器和运算跨导放大器,所述模拟转换器被配置为将所述最低数字值转换成模拟电压信号,所述运算跨导放大器耦合到所述模拟转换器并且被配置为将所述模拟电压信号转换成模拟电流信号并将所述模拟电流信号提供给所述电源。A converter coupled to the interface circuit, the converter being configured to convert the lowest digital value into a control signal and provide the control signal to the power supply to adjust the output voltage of the power supply, the converter comprising a digital-to-analog converter and an operational transconductance amplifier, the analog converter being configured to convert the lowest digital value into an analog voltage signal, the operational transconductance amplifier being coupled to the analog converter and configured to convert the analog voltage signal into an analog current signal and provide the analog current signal to the power supply. 2.如权利要求1所述的集成电路,其中所述接口电路包含输出端子,其与菊链式耦合的所述多个串行移位寄存器的第一串行移位寄存器的输入耦合。2. The integrated circuit of claim 1, wherein the interface circuit includes an output terminal coupled to the input of a first serial shift register of the plurality of serial shift registers in a daisy-chain configuration. 3.如权利要求2所述的集成电路,其中所述接口电路进一步包含输入端子,其与菊链式耦合的所述多个串行移位寄存器的最后一个串行移位寄存器的输出耦合。3. The integrated circuit of claim 2, wherein the interface circuit further includes an input terminal coupled to the output of the last serial shift register of the plurality of serial shift registers in a daisy-chain configuration. 4.如权利要求1所述的集成电路,其中所述接口电路进一步被配置为生成时钟信号来控制所述多个串行移位寄存器的操作。4. The integrated circuit of claim 1, wherein the interface circuit is further configured to generate a clock signal to control the operation of the plurality of serial shift registers. 5.如权利要求1所述的集成电路,进一步包括用来与主机微控制器通信的串行外围接口。5. The integrated circuit of claim 1, further comprising a serial peripheral interface for communicating with a host microcontroller. 6.一种用来控制向多个发光二极管串供电的电源的集成电路,所述集成电路包括:6. An integrated circuit for controlling a power supply to a plurality of light-emitting diode strings, the integrated circuit comprising: 与菊链式耦合的多个串行移位寄存器耦合的接口电路,所述接口电路被配置为从所述多个串行移位寄存器接收多个数字值,并且从所述多个数字值中识别出最低数字值,多个数字值的每个与所述多个发光二极管串的一个发光二极管串的一端处的电压电平对应,所述接口电路包含存储数字值的寄存器和比较器,所述比较器与所述存储数字值的寄存器耦合并且被配置为比较来自所述多个串行移位寄存器的传入数字值和存储在所述存储数字值的寄存器中的数字值以识别出较低数字值;以及An interface circuit coupled to a plurality of daisy-chained serial shift registers, the interface circuit being configured to receive a plurality of digital values from the plurality of serial shift registers and identify the lowest digital value from the plurality of digital values, each of the plurality of digital values corresponding to a voltage level at one end of one of the plurality of LED strings, the interface circuit including a register for storing the digital values and a comparator, the comparator being coupled to the register for storing the digital values and configured to compare the incoming digital values from the plurality of serial shift registers with the digital values stored in the register for storing the digital values to identify the lower digital value; and 与所述接口电路耦合的转换器,所述转换器被配置为将所述最低数字值转换成控制信号并且将所述控制信号提供给所述电源以调整所述电源的输出电压。A converter coupled to the interface circuit is configured to convert the lowest digital value into a control signal and provide the control signal to the power supply to adjust the output voltage of the power supply. 7.如权利要求6所述的集成电路,其中所述接口电路进一步被配置为响应于所述传入数字值低于存储在所述存储数字值的寄存器中的数字值,用所述传入数字值替换存储在所述存储数字值的寄存器中的数字值。7. The integrated circuit of claim 6, wherein the interface circuit is further configured to replace the digital value stored in the register of the stored digital value with the incoming digital value in response to the incoming digital value being lower than the digital value stored in the register of the stored digital value. 8.如权利要求6所述的集成电路,其中所述转换器包括数字到模拟转换器,其被配置为将所述最低数字值转换成模拟电压信号。8. The integrated circuit of claim 6, wherein the converter includes a digital-to-analog converter configured to convert the lowest digital value into an analog voltage signal. 9.如权利要求8所述的集成电路,进一步包含运算跨导放大器,其耦合到所述模拟转换器并且被配置为将所述模拟电压信号转换成模拟电流信号并且将所述模拟电流信号提供给所述电源。9. The integrated circuit of claim 8, further comprising an operational transconductance amplifier coupled to the analog converter and configured to convert the analog voltage signal into an analog current signal and provide the analog current signal to the power supply. 10.如权利要求6所述的集成电路,其中所述接口电路进一步包括输出端子,其与菊链式耦合的所述多个串行移位寄存器的第一串行移位寄存器的输入耦合。10. The integrated circuit of claim 6, wherein the interface circuit further includes an output terminal coupled to the input of a first serial shift register of the plurality of serial shift registers in a daisy-chain configuration. 11.如权利要求10所述的集成电路,其中所述接口电路进一步包括输入端子,其与菊链式耦合的所述多个串行移位寄存器的最后一个串行移位寄存器的输出耦合。11. The integrated circuit of claim 10, wherein the interface circuit further includes an input terminal coupled to the output of the last serial shift register of the plurality of serial shift registers in a daisy-chain configuration. 12.如权利要求6所述的集成电路,进一步包括用来与主机微控制器通信的串行外围接口。12. The integrated circuit of claim 6, further comprising a serial peripheral interface for communicating with a host microcontroller. 13.一种用来控制分别向第一多个发光二极管串和第二多个发光二极管串供电的第一电源和第二电源的集成电路,所述集成电路包括:13. An integrated circuit for controlling a first power supply and a second power supply respectively supplying power to a first plurality of light-emitting diode strings and a second plurality of light-emitting diode strings, the integrated circuit comprising: 与菊链式耦合的多个串行移位寄存器耦合的接口电路,所述接口电路被配置为从所述多个串行移位寄存器接收第一多个数字值,从所述多个串行移位寄存器接收第二多个数字值,从所述第一多个数字值中识别出第一最低数字值,并且从所述第二多个数字值中识别出第二最低数字值,所述第一多个数字值的每个与所述第一多个发光二极管串的一个发光二极管串的一端处的电压电平对应,所述第二多个数字值的每个与所述第二多个发光二极管串的一个发光二极管串的一端处的电压电平对应,所述接口电路包含被配置为存储第一数字值的第一寄存器和存储第二数字值的第二寄存器,所述接口电路被配置为比较所述第一多个数字值的第一传入数字值和存储在所述第一寄存器中的第一数字值,以识别第一较低数字值,并且比较所述第二多个数字值的第二传入数字值和存储在所述第二寄存器中的第二数字值,以识别第二较低数字值;以及An interface circuit coupled to a plurality of daisy-chained serial shift registers, the interface circuit being configured to receive a first plurality of digital values from the plurality of serial shift registers, receive a second plurality of digital values from the plurality of serial shift registers, identify a first lowest digital value from the first plurality of digital values, and identify a second lowest digital value from the second plurality of digital values, each of the first plurality of digital values corresponding to a voltage level at one end of one of the first plurality of LED strings, each of the second plurality of digital values corresponding to a voltage level at one end of one of the second plurality of LED strings, the interface circuit including a first register configured to store the first digital value and a second register configured to store the second digital value, the interface circuit being configured to compare a first incoming digital value of the first plurality of digital values with the first digital value stored in the first register to identify a first lower digital value, and to compare a second incoming digital value of the second plurality of digital values with the second digital value stored in the second register to identify a second lower digital value; and 与所述接口电路耦合的转换器,所述转换器被配置为将所述第一最低数字值转换成第一控制信号,将所述第二最低数字值转换成第二控制信号,将所述第一控制信号提供给所述第一电源以调整所述第一电源的输出电压,并且将所述第二控制信号提供给所述第二电源以调整所述第二电源的输出电压。A converter coupled to the interface circuit is configured to convert the first lowest digital value into a first control signal, convert the second lowest digital value into a second control signal, provide the first control signal to the first power supply to adjust the output voltage of the first power supply, and provide the second control signal to the second power supply to adjust the output voltage of the second power supply. 14.如权利要求13所述的集成电路,其中所述接口电路进一步被配置为响应于所述第一传入数字值低于存储在所述第一寄存器中的第一数字值,用所述第一传入数字值替换存储在所述第一寄存器中的第一数字值。14. The integrated circuit of claim 13, wherein the interface circuit is further configured to replace the first digital value stored in the first register with the first digital value in response to the first incoming digital value being lower than the first digital value stored in the first register. 15.如权利要求13所述的集成电路,其中所述接口电路进一步被配置为响应于所述第二传入数字值低于存储在所述第二寄存器中的第二数字值,用所述第二传入数字值替换存储在所述第二寄存器中的第二数字值。15. The integrated circuit of claim 13, wherein the interface circuit is further configured to replace the second digital value stored in the second register with the second digital value in response to the second incoming digital value being lower than the second digital value stored in the second register. 16.如权利要求13所述的集成电路,其中所述第一多个发光二极管串具有第一颜色并且所述第二多个发光二极管串具有不同于所述第一颜色的第二颜色。16. The integrated circuit of claim 13, wherein the first plurality of light-emitting diode strings have a first color and the second plurality of light-emitting diode strings have a second color different from the first color.
HK17108968.2A 2011-12-08 2014-11-25 Integrated circuit to control a power supply that supplies power to plurality of light-emitting diode strings HK1235608B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US61/568,545 2011-12-08
US13/346,659 2012-01-09

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
HK14111902.8A Addition HK1198407B (en) 2011-12-08 2012-12-06 Serial lighting interface with embedded feedback

Related Child Applications (1)

Application Number Title Priority Date Filing Date
HK14111902.8A Division HK1198407B (en) 2011-12-08 2012-12-06 Serial lighting interface with embedded feedback

Publications (2)

Publication Number Publication Date
HK1235608A1 HK1235608A1 (en) 2018-03-09
HK1235608B true HK1235608B (en) 2019-10-18

Family

ID=

Similar Documents

Publication Publication Date Title
CN104115564B (en) serial lighting interface with embedded feedback
US9723244B2 (en) Low cost LED driver with improved serial bus
US7923943B2 (en) Secondary side post regulation for LED backlighting
TWI477187B (en) Adaptive switch mode led system
US8305005B2 (en) Integrated circuit for driving high-voltage LED lamp
CN215773647U (en) Light and color adjusting circuit, driving device and lamp
TW201311031A (en) Lighting module with a sampling and integrating circuit for PWM dimming apparatus
HK1235608B (en) Integrated circuit to control a power supply that supplies power to plurality of light-emitting diode strings
HK1235608A1 (en) Integrated circuit to control a power supply that supplies power to plurality of light-emitting diode strings
HK1198407B (en) Serial lighting interface with embedded feedback
CN219351944U (en) Dimming and toning control circuit and LED lamp