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HK1234526A1 - Coin processing device - Google Patents

Coin processing device

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Publication number
HK1234526A1
HK1234526A1 HK17108184.0A HK17108184A HK1234526A1 HK 1234526 A1 HK1234526 A1 HK 1234526A1 HK 17108184 A HK17108184 A HK 17108184A HK 1234526 A1 HK1234526 A1 HK 1234526A1
Authority
HK
Hong Kong
Prior art keywords
coin
coil
detection sensor
oscillation signal
connection state
Prior art date
Application number
HK17108184.0A
Other languages
Chinese (zh)
Other versions
HK1234526B (en
Inventor
康行 木村
Original Assignee
日本功勒克斯股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本功勒克斯股份有限公司 filed Critical 日本功勒克斯股份有限公司
Publication of HK1234526A1 publication Critical patent/HK1234526A1/en
Publication of HK1234526B publication Critical patent/HK1234526B/en

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Abstract

To improve detection accuracy of each outer diameter of plural types of coins. A coin processing device 1 including: a material detection sensor 4a which includes a first coil L1 and a second coil L2 facing each other with a coin passage 3 interposed therebetween; an outer diameter detection sensor 4b which includes a ring-shaped third coil L3 that surrounds the first coil and a ring-shaped fourth coil L4 that surrounds the second coil, the third coil and the fourth coil facing each other with the coin passage interposed therebetween; a first oscillation circuit 11 which is connected to the material detection sensor and oscillates a first oscillation signal in an individual connection state and is connected to the material detection sensor and the outer diameter detection sensor that are connected in series and oscillates the first oscillation signal in a series connection state; a second oscillation circuit 12 which is connected to the outer diameter detection sensor and oscillates a second oscillation signal in the individual connection state; a switching unit 15 which switches the individual connection state and the series connection state; and a coin identification unit 16 which detects an outer diameter of a coin using the second oscillation signal in the individual connection state or the first oscillation signal in the series connection state.

Description

Coin processing device
Technical Field
The present invention relates to a coin handling apparatus mounted in a vending machine, a changer, a calculator, a ticket vending machine, a service device, and the like (hereinafter referred to as "vending machine and the like"), and more particularly to a coin handling apparatus including an outer diameter detection sensor for detecting an outer diameter of a coin.
Background
A coin handling apparatus is mounted inside a vending machine or the like, and discriminates whether or not an inserted coin is genuine, and stores inserted coins regarded as genuine according to the denomination of the coin. This coin handling apparatus includes a coin sorting unit that discriminates whether or not an inserted coin is genuine and sorts coins according to denomination.
The coin sorting unit includes an outer diameter detection sensor for mainly detecting the outer diameter of a coin and a material detection sensor for mainly detecting the material of the coin. The outer diameter detection sensor has a coil provided on a coin passage through which the inserted coin passes and connected to an oscillation circuit. The same applies to the material detection sensor. The oscillation circuit oscillates at an oscillation frequency corresponding to the inductance of the coil. The oscillation frequency is set to a frequency at which the electromagnetic field generated by the oscillation is susceptible to the coin. The amplitude of the oscillating signal will also vary as the electromagnetic field is affected by the coin. Thus, the outer diameter and material of the coin can be detected based on the oscillation frequency and voltage. Thereby, the authenticity and the type of the coin can be judged.
However, the coin handling apparatus may determine the authenticity of a plurality of types of coins including bimetallic coins. The bimetal coin is a coin in which the material of the central core portion is different from the material of the ring portion surrounding the core portion. As the bimetallic coin, for example, a binary coin in canada is known. In order to accurately detect the outer diameter of such a bimetal coin, a technique using an annular outer diameter detection sensor having a space at the center is known (see patent document 1).
In the annular outer diameter detection sensor, since the core of the bimetal coin overlaps with the outer diameter detection sensor in space, the electromagnetic field (magnetic flux density) of the core of the bimetal coin at this time is significantly smaller than that of the annular portion. Thus, the outer diameter of the bimetal coin can be detected with high accuracy by reflecting the annular portion mainly on the outer periphery of the bimetal coin.
Patent document 1: japanese patent No. 4126668
However, when the conventional outer diameter detection sensor is used, as shown in fig. 13, the vicinity of the outer periphery of a small coin (e.g., a ten-cent coin in canada) CO other than the bimetallic coin overlaps with the space OP1 of the outer diameter detection sensor 4X. Therefore, as shown in fig. 14, in the range RX where the coin outer diameter is small, the relationship between the oscillation frequency and the outer diameter is not proportional. This may not accurately detect the outer diameter of the small coin, and may misjudge the authenticity and type of the coin.
Disclosure of Invention
The present invention has been made to solve the above-described problems, and an object thereof is to provide a coin handling apparatus capable of improving the detection accuracy of the outer diameters of a plurality of types of coins.
A coin processing device according to one embodiment of the present invention includes:
a coin passage through which the inserted coins pass;
a material detection sensor having a first coil and a second coil opposed to each other so as to sandwich the coin passage;
an outer diameter detection sensor having an annular third coil surrounding the first coil and an annular fourth coil surrounding the second coil, the third coil and the fourth coil being opposed to each other so as to sandwich the coin passage,
a first oscillation circuit connected to the material detection sensor and oscillating a first oscillation signal in an individual connection state, and connected to the material detection sensor and the outer diameter detection sensor connected in series and oscillating the first oscillation signal in a series connection state;
a second oscillation circuit that is connected to the outer diameter detection sensor and oscillates a second oscillation signal in an individually connected state;
a switching unit configured to switch the individual connection state and the series connection state; and
a coin discriminating unit that detects an outer diameter of the coin using the second oscillation signal in the individual connection state or the first oscillation signal in the series connection state, and discriminates the coin based on the outer diameter.
According to the invention, the detection precision of the outer diameters of various coins can be improved.
Drawings
Fig. 1 is a partial schematic configuration diagram showing a coin handling apparatus according to an embodiment.
Fig. 2(a) is a side view showing one side surface of the discrimination sensor, fig. 2(b) is a side view showing the other side surface of the discrimination sensor, and fig. 2(c) is a cross-sectional view showing the coin path and the discrimination sensor.
Fig. 3 is a block diagram showing a structure relating to the authentication judgment and the denomination judgment of the coin handling apparatus of fig. 1.
Fig. 4 is a circuit diagram showing the connection of the switching unit in the individual connection state.
Fig. 5 is a circuit diagram showing the connection of the switching units in the series connection state.
Fig. 6(a) is a diagram showing a positional relationship between the bimetal coin and the identifying sensor, fig. 6(b) is a diagram showing a temporal change in frequency and voltage of the outer diameter detecting sensor corresponding to fig. 6(a), fig. 6(c) is a diagram showing a positional relationship between coins other than the bimetal coin and the identifying sensor, and fig. 6(d) is a diagram showing a temporal change in frequency and voltage of the outer diameter detecting sensor corresponding to fig. 6 (c).
Fig. 7(a) is a diagram showing a positional relationship between the bimetal coin and the identifying sensor, fig. 7(b) is a diagram showing a temporal change in frequency and voltage of the material detecting sensor corresponding to fig. 7(a), fig. 7(c) is a diagram showing a positional relationship between a coin other than the bimetal coin and the identifying sensor, and fig. 7(d) is a diagram showing a temporal change in frequency and voltage of the material detecting sensor corresponding to fig. 7 (c).
Fig. 8(a) is a diagram showing a positional relationship between the bimetal coin and the identifying sensor, fig. 8(b) is a diagram showing a temporal change in frequency and voltage of the outer diameter and material detecting sensor corresponding to fig. 8(a), fig. 8(c) is a diagram showing a positional relationship between the coin other than the bimetal coin and the identifying sensor, and fig. 8(d) is a diagram showing a temporal change in frequency and voltage of the outer diameter and material detecting sensor corresponding to fig. 8 (c).
Fig. 9 is a flowchart showing the authentication judgment process and the denomination judgment process of the coin processing apparatus.
Fig. 10 is a diagram showing a data collection period.
Fig. 11 is a diagram showing the relationship between the outer diameter of coins other than the bimetallic coin and the frequency detected by the coin discriminating portion in the serial connection state according to one embodiment.
Fig. 12 is a graph showing a relationship between a frequency and a voltage of a clad structure coin according to an embodiment.
Fig. 13 is a diagram showing a positional relationship between a conventional outer diameter detection sensor and a small coin.
Fig. 14 is a graph showing the relationship between the frequency and the outer diameter of coins other than the conventional bimetal coin.
Detailed Description
An embodiment of the present invention will be described below with reference to the drawings. The present invention is not limited to this embodiment.
Fig. 1 is a partial schematic configuration diagram showing a coin handling machine 1 according to an embodiment. As shown in fig. 1, the coin handling apparatus 1 includes an inlet 2 into which coins are inserted, a coin passage 3 provided obliquely below the inlet 2 and through which the inserted coins pass, and a discrimination sensor 4 provided on a side wall of the coin passage 3. In this case, the side wall of the coin path 3 is not shown.
The coin inserted from the insertion port 2 rolls in the coin passage 3 by its own weight and passes through the discrimination sensor 4. This makes it possible to perform the authenticity determination and the denomination determination of the coin as described below.
Fig. 2(a) is a side view showing one side surface of the recognition sensor 4, and fig. 2(b) is a side view showing the other side surface of the recognition sensor 4. Fig. 2(c) is a sectional view of the coin passage 3 and the discrimination sensor 4 of fig. 1 taken along a plane perpendicular to the passing direction of the coin CO.
The identification sensor 4 includes a material detection sensor 4a and an outer diameter detection sensor 4 b.
The material detection sensor 4a includes a first coil L1 and a second coil L2 facing each other so as to sandwich the coin path 3. The first coil L1 and the second coil L2 are circular and planar coils. That is, the coin can pass through the material detection sensor 4 a.
The outer diameter detection sensor 4b has an annular third coil L3 surrounding the first coil L1 and an annular fourth coil L4 surrounding the second coil L2. The third coil L3 and the fourth coil L4 are opposed in such a manner as to sandwich the coin path 3. That is, the coin can pass through the outer diameter detection sensor 4 b.
In this way, the outer diameter detection sensor 4b is annularly provided so as to surround the material detection sensor 4 a.
The first coil L1 and the third coil L3 are spiral coils provided in a planar shape on the first printed substrate. The second coil L2 and the fourth coil L4 are spiral coils arranged in a planar shape on the second printed substrate. By using the spiral coil, the relative positions of the material detection sensor 4a and the outer diameter detection sensor 4b can be easily and accurately determined.
Fig. 3 is a block diagram showing a configuration related to the authentication judgment and the denomination judgment of the coin processing apparatus 1 of fig. 1. The coin processing apparatus 1 includes a first oscillation circuit 11 that oscillates a first oscillation signal OSC1, a second oscillation circuit 12 that oscillates a second oscillation signal OSC2, envelope detection circuits 13 and 14, a switching unit 15, a coin discriminating unit 16, and a storage unit (memory) 17.
The first oscillation circuit 11 has capacitors C1, C2, and an amplifier IC 1. One end of the capacitor C1 is connected to one end of the first coil L1 and the input terminal of the amplifier IC 1. The other end of the capacitor C1 is connected to one end of the capacitor C2 and to ground. The other end of the capacitor C2 is connected to one end of the second coil L2 and the output terminal of the amplifier IC 1. The signal at the input terminal of the amplifier IC1 is the first oscillation signal OSC 1. In the case where no coin is present, the frequency of the first oscillation signal OSC1 is determined by the inductance connected between the input and output terminals of the amplifier IC1 and the capacitance values of the capacitors C1 and C2.
The other end of the first coil L1 is connected to the switch S1 of the switching unit 15. The other end of the second coil L2 is connected to the switch S2 of the switching unit 15.
The second oscillation circuit 12 has capacitors C3, C4, and an amplifier IC 2. One end of the capacitor C3 is connected to the switch S4 of the switching unit 15 and the input terminal of the amplifier IC 2. The other end of the capacitor C3 is connected to one end of the capacitor C4 and to ground. The other end of the capacitor C4 is connected to the switch S3 of the switching unit 15 and the output terminal of the amplifier IC 2. The other end of the third coil L3 is connected to the other end of the fourth coil L4. The signal at the input terminal of the amplifier IC2 is the second oscillation signal OSC 2. In the case where no coin is present, the frequency of the second oscillation signal OSC2 is determined by the inductance connected between the input and output terminals of the amplifier IC2 and the capacitance values of the capacitors C3 and C4.
The first oscillation signal OSC1 is supplied to the envelope detection circuit 13 and the coin discriminating portion 16. The envelope detection circuit 13 envelope-detects the first oscillation signal OSC1 and outputs the voltage of the first oscillation signal OSC 1.
The second oscillation signal OSC2 is supplied to the envelope detection circuit 14 and the coin discriminating portion 16. The envelope detection circuit 14 envelope-detects the second oscillation signal OSC2 and outputs the voltage of the second oscillation signal OSC 2.
The switching unit 15 has switches S1 to S4, and can be switched to an individual connection state or a series connection state. In the individual connection state, the first oscillation circuit 11 is connected to the material detection sensor 4a, and the second oscillation circuit 12 is connected to the outer diameter detection sensor 4 b. In the series connection state, the first oscillation circuit 11 is connected to the material detection sensor 4a and the outer diameter detection sensor 4b connected in series, and the second oscillation circuit 12 is not connected to the material detection sensor 4a or the outer diameter detection sensor 4 b.
The coin discriminating unit 16 includes, for example, an AD converter and a cpu (central Processing unit), and detects the frequencies of the first oscillation signal OSC1 and the second oscillation signal OSC 2. Further, the coin discriminating unit 16 controls the switching unit 15.
The storage unit 17 includes, for example, a ram (random Access memory), a nonvolatile memory, and the like, and stores the voltage and frequency of the first oscillation signal OSC1 and the voltage and frequency of the second oscillation signal OSC2 supplied from the coin discriminating unit 16.
The coin discriminating unit 16 detects the characteristic amount (outer diameter and material) of the coin based on the first oscillation signal OSC1 and the second oscillation signal OSC2 using the value stored in the storage unit 17, and discriminates the coin based on the detected characteristic amount. The specific processing is described later.
Fig. 4 is a circuit diagram showing the connection of the switching unit 15 in the individual connection state. As shown in fig. 4, in the single connection state, the switches S1, S2 connect the other end of the first coil L1 and the other end of the second coil L2. The switch S3 connects one end of the third coil L3 to the output terminal of the amplifier IC 2. The switch S4 connects one end of the fourth coil L4 to the input terminal of the amplifier IC 2. Thus, the first coil L1 and the second coil L2 are connected in series between the input and output terminals of the amplifier IC1, and the third coil L3 and the fourth coil L4 are connected in series between the input and output terminals of the amplifier IC 2.
In this way, the first oscillation circuit 11 is connected to the material detection sensor 4a in the single connection state, and oscillates the first oscillation signal OSC 1. The second oscillation circuit 12 is connected to the outer diameter detection sensor 4b in the single connection state, and oscillates the second oscillation signal OSC 2.
Fig. 5 is a circuit diagram showing the connection of the switching unit 15 in the series connection state. In the series connected state, switches S1 and S3 connect the other end of the first coil L1 and one end of the third coil L3, as shown in fig. 5. The switches S2, S4 connect the other end of the second coil L2 and one end of the fourth coil L4. Thus, the first coil L1, the third coil L3, the fourth coil L4, and the second coil L2 are connected in series between the input/output terminals of the amplifier IC 1.
In this way, the first oscillation circuit 11 is connected to the material detection sensor 4a and the outer diameter detection sensor 4b connected in series in the series connection state, and oscillates the first oscillation signal OSC 1.
Next, an example of the frequency and voltage of each sensor when the coin passes through the discrimination sensor 4 will be described.
(outer diameter detection sensor 4b in the individually connected state)
Fig. 6(a) is a diagram showing a positional relationship between the bimetal coin BCO and the discrimination sensor 4, and fig. 6(b) is a time-varying diagram showing a frequency and a voltage of the outer diameter detection sensor 4b corresponding to fig. 6 (a). The frequency and voltage of the outer diameter detection sensor 4b indicate the frequency and voltage of the second oscillation signal OSC2 in the individual connection state.
Fig. 6(c) is a diagram showing a positional relationship between the coin CO other than the bimetal coin and the discrimination sensor 4, and fig. 6(d) is a diagram showing temporal changes in frequency and voltage of the outer diameter detection sensor 4b corresponding to fig. 6 (c).
As shown in fig. 6(a), when the bimetal coin BCO is located at the point P1, the bimetal coin BCO does not reach the outer diameter detection sensor 4 b. Thus, as shown in fig. 6(b), the frequency and voltage values of the outer diameter detection sensor 4b are substantially the same as those in the standby state in which no coin is inserted.
At the next point P2, the end of the bimetal coin BCO reaches the end of the outer diameter detection sensor 4 b. Thereby, the frequency and voltage of the outer diameter detection sensor 4b are reduced from the values in the standby state.
At the next point P3, the bimetal coin BCO overlaps the entire outer diameter detection sensor 4 b. The frequency and voltage of the outer diameter detection sensor 4b at this time are minimum values.
Thereafter, the overlapping area of the bimetal coin BCO and the outer diameter detection sensor 4b decreases, and the frequency and voltage of the outer diameter detection sensor 4b increase to the values of the standby state.
As shown in fig. 6(c) and (d), when coins CO other than the bimetal coin are located at points P1a, P2a, and P3a, respectively, the frequency and voltage of the outer diameter detection sensor 4b change in the same manner as the bimetal coin BCO.
(Material detection sensor 4a in Single connection State)
Fig. 7(a) is a diagram showing a positional relationship between the bimetal coin BCO and the discrimination sensor 4, and fig. 7(b) is a time-varying diagram showing a frequency and a voltage of the material quality detection sensor 4a corresponding to fig. 7 (a). The frequency and voltage of the material detection sensor 4a indicate the frequency and voltage of the first oscillation signal OSC1 in the individual connection state.
Fig. 7(c) is a diagram showing a positional relationship between the coin CO other than the bimetal coin and the discrimination sensor 4, and fig. 7(d) is a diagram showing temporal changes in frequency and voltage of the material quality detection sensor 4a corresponding to fig. 7 (c).
As shown in fig. 7(a), when the bimetallic coin BCO is located at the point P1, the bimetallic coin BCO does not reach the material quality detection sensor 4 a. Thus, as shown in fig. 7(b), the frequency and voltage values of the material quality detection sensor 4a are substantially the same as those in the standby state.
At the next point P2, the annular part BCO1 of the bimetal coin BCO reaches the end of the material quality detection sensor 4 a. This causes the frequency of the material detection sensor 4a to change compared with the value in the standby state, and the voltage to decrease.
At the next point P3, the core BCO2 of the bimetal coin BCO reaches the end of the material quality detection sensor 4 a. Thus, the frequency of the material quality detection sensor 4a changes from the value at the point P2, and the voltage increases from the value at the point P2 and then decreases. That is, the voltage waveform has a peak (unevenness) 20 in the vicinity of the point P3.
This is because the core BCO2 of the bimetallic coin BCO and the annular BCO1 are different in material, and therefore the electromagnetic field is affected to a different degree between the case where the annular BCO1 reaches the material quality detection sensor 4a and the case where the core BCO2 reaches the material quality detection sensor 4 a.
At the next point P4, the entire material quality detection sensor 4a overlaps the core portion BCO2 of the bimetallic coin BCO. Before and after the point P4, the overlapping area of the bimetallic coin BCO and the material detection sensor 4a is substantially constant. The frequency and voltage of the material detection sensor 4a are substantially constant.
Thereafter, the overlapping area of the bimetal coin BCO and the material detection sensor 4a decreases, and the frequency and voltage of the material detection sensor 4a increase to the values of the standby state as the area decreases. At this time, the voltage waveform also has a peak.
On the other hand, when the coin CO other than the bimetal coin reaches the point P2a, the end of the coin CO reaches the end of the material quality detection sensor 4 a. This causes the frequency of the material detection sensor 4a to change compared with the value in the standby state, and the voltage to decrease.
At the next point P3a, the area of the coin CO overlapping the material quality detection sensor 4a increases. Thereby, the frequency of the material quality detection sensor 4a changes from the value at the point P2a, and the voltage decreases from the value at the point P2 a.
Thereafter, the frequency and voltage of the material quality detection sensor 4a are substantially constant within a range in which the overlapping area of the coin CO and the material quality detection sensor 4a before and after the point P4a is substantially constant.
Thereafter, the overlapping area of the coin CO and the material quality detection sensor 4a decreases, and the frequency and voltage of the material quality detection sensor 4a increase to the values of the standby state as the area decreases.
As described above, since the coin CO other than the bimetal coin is made of only one material, the voltage waveform of the material detection sensor 4a does not have a peak.
(series connection state)
Fig. 8(a) is a diagram showing a positional relationship between the bimetal coin BCO and the discrimination sensor 4, and fig. 8(b) is a time-varying diagram showing the frequency and voltage of the outer diameter and material detection sensor corresponding to fig. 8 (a). The outer diameter and material detection sensors indicate an outer diameter detection sensor 4b and a material detection sensor 4a connected in series. The frequency and voltage of the outer diameter and material detection sensor indicate the frequency and voltage of the first oscillation signal OSC1 in the series connection state.
Fig. 8(c) is a diagram showing a positional relationship between the coin CO other than the bimetal coin and the discrimination sensor 4, and fig. 8(d) is a diagram showing temporal changes in frequency and voltage of the outer diameter and material detection sensor corresponding to fig. 8 (c).
When the bimetallic coin BCO is at the point P1 as shown in fig. 8(a), the values of the frequency and the voltage of the outer diameter and material quality detection sensor are substantially the same as those in the standby state where no coin is inserted as shown in fig. 8 (b).
At the next point P2, the end of the bimetal coin BCO reaches the end of the outer diameter detection sensor 4 b. This causes the frequency and voltage of the outer diameter and material detection sensor to decrease from the values in the standby state.
At the next point P3, the core BCO2 of the bimetal coin BCO reaches the end of the material quality detection sensor 4 a. This reduces the frequency and voltage of the outer diameter and material detection sensor from the value at point P2.
At the next point P4, the entire material quality detection sensor 4a overlaps the core portion BCO2 of the bimetallic coin BCO. The frequency and voltage of the outer diameter detection sensor 4b at this time are minimum values.
Thereafter, the overlapping area of the bimetal coin BCO and the outer diameter and material detection sensor is reduced, and the frequency and voltage of the outer diameter and material detection sensor are increased to the standby state values.
As shown in fig. 8(c) and (d), if the position of the coin CO other than the bimetal coin changes from the point P1a to the points P2a and P3a, the frequency of the outer diameter and material detection sensor changes, and the voltage decreases. At points P3a and P4a, the area of overlap between the coin CO and the outer diameter and material detection sensor is fixed, and the frequency and voltage of the outer diameter and material detection sensor are fixed.
Next, the authentication determination and the type determination process will be described with reference to fig. 9 and 10.
Fig. 9 is a flowchart showing the authentication judgment and denomination judgment processing of the coin processing device 1. The process of fig. 9 is performed by the control of the coin discriminating unit 16. Fig. 10 is a diagram showing a data collection period corresponding to fig. 6(b) and (d).
First, after the power supply is turned on, the individual connection state is set (step S1).
Then, the voltage of the outer diameter detection sensor 4b (the standby voltage Vs in fig. 10) is stored in the storage unit 17 (step S2).
Then, the voltage of the outer diameter detection sensor 4b is measured (step S3).
Then, when the voltage of the outer diameter detection sensor 4b does not become 80% of the standby voltage Vs (no at step S4), the coin does not reach the vicinity of the outer diameter detection sensor 4b, and the process returns to step S3.
When the voltage of the outer diameter detection sensor 4b becomes 80% of the standby voltage Vs (yes at step S4, time t1 in fig. 10), the coin reaches the vicinity of the outer diameter detection sensor 4b, and therefore the voltage and frequency of the outer diameter detection sensor 4b are stored in the storage unit 17 (step S5). This time t1 is the data collection start point.
Then, the voltage and frequency of the material quality detection sensor 4a are stored in the storage unit 17 (step S6).
Then, the serial connection state is switched (step S7).
Then, the voltage and frequency of the outer diameter and material detection sensor are stored in the storage unit 17 (step S8).
Then, the connection state is switched to the individual connection state (step S9).
Then, if the voltage of the outer diameter detection sensor 4b has not returned to 85% of the standby voltage Vs (no at step S10), the process returns to step S5. Thus, the switching unit 15 alternately switches the individual connection state and the series connection state.
When the voltage of the outer diameter detection sensor 4b returns to 85% of the standby voltage Vs (yes at step S10, time t2 in fig. 7), it is determined whether or not the coin is a bimetal coin based on the voltage waveform of the material detection sensor 4a stored in the storage 17 (step S11). That is, time t2 in fig. 7 is a data collection end point, and a data collection period is between time t1 and t 2.
In the present embodiment, as an example, the coin discriminating portion 16 determines whether or not the coin is a bimetal coin based on the voltage of the first oscillation signal OSC1 in the single connection state while the coin passes between the first coil L1 and the second coil L2 (the material quality detection sensor 4a), and selects the second oscillation signal OSC2 in the single connection state or the first oscillation signal OSC1 in the series connection state. That is, whether or not the coin is a bimetal coin is determined based on the difference in voltage waveform of the material detection sensor 4a (fig. 7(b) and (d)).
Specifically, the coin discriminating unit 16 discriminates that the coin is a bimetal coin and selects the second oscillation signal OSC2 in the single connection state when the voltage waveform of the first oscillation signal OSC1 has a peak value in a predetermined discrimination period during which the coin passes through the gap between the first coil L1 and the second coil L2.
In the above determination period, when the voltage waveform of the first oscillation signal OSC1 does not have a peak value, the coin discriminating unit 16 determines that coins other than the bimetallic coin are present and selects the first oscillation signal OSC1 in the series connection state.
The determination period may be, for example, a period from point P1 to point P3 in fig. 7(b) and a corresponding period in fig. 7 (d).
In the case of a double-metal coin (yes in step S11), the outer diameter is detected using the frequency of the outer diameter detection sensor 4b (the selected second oscillation signal OSC2) stored in the storage unit 17, and the coin is identified based on the outer diameter (step S12). For example, the minimum value of the frequency may be compared with a frequency determination threshold value, and the outer diameter may be detected based on the comparison result.
Then, the material is detected using the voltage of the outer diameter detection sensor 4b, the frequency and voltage of the material detection sensor 4a, and the outer diameter and material detection sensor voltage stored in the storage unit 17, and the coin is identified based on the material (step S13). For example, the minimum value of the voltage may be compared with a voltage determination threshold, the minimum value of the frequency may be compared with a frequency determination threshold, and the material may be detected based on the comparison result. The voltage determination threshold and the frequency determination threshold may be stored in the storage section 17 in advance.
In step S13, the material may be detected using at least one of the voltage of the outer diameter detection sensor 4b, the frequency of the material detection sensor 4a, the voltage of the material detection sensor 4a, the outer diameter, and the voltage of the material detection sensor.
On the other hand, if the coin is not a bimetal coin (no in step S11), the outer diameter is detected using the outer diameter stored in the storage unit 17 and the frequency of the material detection sensor (the selected first oscillation signal OSC1), and the coin is identified based on the outer diameter (step S14). For example, the minimum value of the frequency may be compared with a determination threshold value, and the outer diameter may be detected based on the comparison result.
Then, the material is detected using the voltage of the outer diameter detection sensor 4b, the frequency and voltage of the material detection sensor 4a, and the outer diameter and material detection sensor voltage stored in the storage unit 17, and the coin is identified based on the material (step S15). For example, the minimum value of the voltage may be compared with a voltage determination threshold, the minimum value of the frequency may be compared with a frequency determination threshold, and the material may be detected based on the comparison result.
In step S15, the material may be detected using at least one of the voltage of the outer diameter detection sensor 4b, the frequency of the material detection sensor 4a, the voltage of the material detection sensor 4a, the outer diameter, and the voltage of the material detection sensor.
In this way, the coin discriminating section 16 detects the outer diameter of the coin based on the second oscillation signal OSC2 in the individual connection state or the first oscillation signal OSC1 in the series connection state.
The coin discriminating unit 16 can detect the material of the coin using at least one of the first oscillation signal OSC1 in the individual connection state, the second oscillation signal OSC2 in the individual connection state, and the first oscillation signal OSC1 in the series connection state.
Fig. 11 is a diagram showing the relationship between the outer diameter of coins other than the bimetallic coin and the frequency detected by the coin discriminating unit 16 in the serial connection state according to one embodiment. In the series connected state, the electromagnetic field reaches the entire coin regardless of the outer diameter, and therefore, as shown in fig. 11, the frequency detected by the coin discriminating portion 16 becomes lower in proportion to the outer diameter. Thus, even a small coin can detect the outer diameter with high accuracy.
FIG. 12 shows a cladding structure according to an embodimentThe frequency of the coin versus voltage. F represents the frequency of the material detection sensor 4a in the single connection stateInitialFrequency of the series connection state is set to FIs low in. Since the inductance in the series connection state is larger than the inductance of the material detection sensor 4a, the frequency F is set to be lower than the frequency F in the absence of coinsIs low inSpecific frequency FInitialLow.
Thus, by using two frequencies FInitial、FIs low inThe material can be detected at two skin depths. Thus, the material of each layer can be detected for coins such as plated coins or clad coins made of a multilayer material other than bimetallic coins. This can improve the detection accuracy of the material quality.
In the example of fig. 12, the material of the test coin having the clad structure of the core material and the cladding material covering the core material was detected. At a frequency of FInitialIn the case of (2), the electromagnetic field is mainly affected by the skin material, and therefore the skin material can be detected. At a frequency of FIs low inIn the case of (3), the electromagnetic field is mainly affected by the core material, and therefore the core material can be detected. In this example, frequency F is due to the influence of coinsIs low inAnd frequency FInitialAre approximately equal.
As shown, the frequency F in the state of individual connectionInitialIn the case of (3), the voltage becomes high and the frequency F in the series connection state becomes highIs low inIn the case of (2), the voltage becomes low. In this way, since different voltages can be obtained in the two connected states, it is possible to detect that the coin has the core material and the surface layer material which are different from each other.
Although not shown, by using the voltage of the outer diameter detection sensor 4b, the frequency and voltage of the material detection sensor 4a, and the voltage of the outer diameter and material detection sensor, as described above, the material of each layer of the multilayer material can be detected with higher accuracy at three frequencies.
As described above, in the present embodiment, the material detection sensor 4a and the annular outer diameter detection sensor 4b surrounding the material detection sensor 4a are provided, and when the coin to be inspected passes through, whether or not the coin is a bimetal coin is determined by determining whether or not the voltage waveform of the material detection sensor 4a has a peak.
When it is determined that the coin is not a bimetal coin, the outer diameter is detected using the outer diameter of the material detection sensor 4a and the outer diameter detection sensor 4b connected in series and the frequency of the material detection sensor. Thus, even in the case of a coin having a small outer diameter, the electromagnetic field can reach the entire surface of the coin by the material detection sensor 4a and the outer diameter detection sensor 4 b. Thus, the outer diameter is proportional to the frequency regardless of the outer diameter of the coin, and the outer diameter can be detected with high accuracy.
On the other hand, when it is determined that the coin is a bimetal coin, the outer diameter is detected using the frequency of the annular outer diameter detection sensor 4b, and therefore, the annular portion of the outer periphery of the bimetal coin is reflected, and the outer diameter can be detected with high accuracy.
Therefore, the detection precision of the outer diameters of various coins can be improved.
Regardless of the type of coin, the material can be detected using the voltage of the outer diameter detection sensor 4b, the frequency and voltage of the material detection sensor 4a, and the voltage of the outer diameter and material detection sensor.
Thus, since three frequencies can be used, the obtained information increases. That is, since the depth to which the electromagnetic field reaches varies depending on the frequency, even in the case of a plated coin or a clad coin made of a multilayer material, the surface material and the internal material can be discriminated depending on the frequency and detected.
Therefore, the detection precision of various coin materials can be improved.
The first coil L1 to the fourth coil L4 may be formed by winding a wire around a core made of ferrite or the like.
In addition, an example in which the voltage and the frequency are stored while alternately switching the individual connection state and the series connection state, and whether or not the coin is a double-metal coin is determined after the data collection period is completed has been described, but the present invention is not limited thereto. For example, it is possible to determine whether or not the coin is a bimetal coin at substantially the same timing as the point P3 in fig. 7(b), determine whether the coin is fixed in the single connection state or the series connection state based on the determination result, and determine the outer diameter and the material using the obtained voltage and frequency.
Several embodiments of the present invention have been described above, but these embodiments are merely examples, and the scope of the present invention is not limited thereto. These embodiments may be implemented in other various ways, and various omissions, substitutions, and changes may be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are also included in the invention described in the claims and the same scope.
Description of the symbols
1 coin handling device
2 inlet
3 coin passage
4 identification sensor
4a material quality detection sensor
4b outer diameter detection sensor
L1 first coil
L2 second coil
L3 third coil
L4 fourth coil
11 first oscillation circuit
12 second oscillating circuit
13. 14 envelope detection circuit
15 switching part
16 coin discriminating part
17 storage unit

Claims (7)

1. A coin processing device is characterized by comprising:
a coin passage through which the inserted coins pass;
a material detection sensor having a first coil and a second coil opposed to each other so as to sandwich the coin passage;
an outer diameter detection sensor having an annular third coil surrounding the first coil and an annular fourth coil surrounding the second coil, the third coil and the fourth coil being opposed to each other so as to sandwich the coin passage,
a first oscillation circuit connected to the material detection sensor and oscillating a first oscillation signal in an individual connection state, and connected to the material detection sensor and the outer diameter detection sensor connected in series and oscillating the first oscillation signal in a series connection state;
a second oscillation circuit that is connected to the outer diameter detection sensor and oscillates a second oscillation signal in the single connection state;
a switching unit configured to switch the individual connection state and the series connection state; and
a coin discriminating portion that detects an outer diameter of the coin using the second oscillation signal in the individual connection state or the first oscillation signal in the series connection state, and discriminates the coin based on the outer diameter.
2. The coin handling apparatus of claim 1,
the coin discriminating portion selects the second oscillation signal in the individual connection state or the first oscillation signal in the series connection state in accordance with the first oscillation signal in the individual connection state in a process in which the coin passes between the first coil and the second coil, and detects the outer diameter of the coin using the selected first oscillation signal or the selected second oscillation signal.
3. The coin handling apparatus of claim 2,
the coin discriminating unit selects the second oscillation signal in the individual connection state when the voltage waveform of the first oscillation signal has a peak value during a predetermined determination period in a process in which the coin passes between the first coil and the second coil, and selects the first oscillation signal in the series connection state when the voltage waveform of the first oscillation signal has no peak value during the determination period.
4. Coin handling apparatus according to any one of claims 1 to 3,
the coin discriminating unit detects a material of the coin using the first oscillation signal in the individually connected state, and discriminates the coin based on the material and the outer diameter.
5. The coin handling apparatus of claim 4,
the coin discriminating unit detects the material of the coin using the first oscillation signal in the individual connection state and the first oscillation signal in the series connection state.
6. Coin handling apparatus according to any one of claims 1 to 5,
the coin processing device further includes a storage unit for storing the voltage and frequency of the first oscillation signal and the voltage and frequency of the second oscillation signal,
the switching section alternately switches the individual connection state and the series connection state,
the coin discriminating portion discriminates the coin using the value stored in the storage portion.
7. Coin handling apparatus according to any one of claims 1 to 6,
the first coil and the third coil are spiral coils arranged in a planar shape on the first substrate,
the second coil and the fourth coil are spiral coils arranged in a planar shape on a second substrate.
HK17108184.0A 2014-09-16 2015-06-01 Coin processing device HK1234526B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014-188047 2014-09-16

Publications (2)

Publication Number Publication Date
HK1234526A1 true HK1234526A1 (en) 2018-02-15
HK1234526B HK1234526B (en) 2020-02-07

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