HK1224991B - Bonding member making device and method for making bonding members - Google Patents

Abstract

This invention provides a bonding member making device and method for making bonding members, the device and method being capable of avoiding a member held by a fixture for bonding from shifting from the fixture even when the environment around the member is under a reduced pressure. The bonding member making device (1) comprises: a first fixture (10) for holding a first member (D) in the state that the back side (Db) of the first member is in contact with the contact surface (11f); a second fixture (20) for holding a second member (E); a chamber (30) that can be sealed; a pressure reducing device 50; a moving device (40) for moving the first fixture (10) and/or the second fixture (20); and a control device (60). The control device (60) controls the moving device (40) and the pressure reducing device (50) such that after a space (S) between a resin (G) applied to the first bonding surface (Df) or a second bonding surface (Ef) and a bonding surface on which no resin (G) is applied has become a predetermined space, the pressure in chamber (30) is reduced from a pressure exceeding a predetermined pressure to a bonding pressure. The predetermined space is smaller than the increment of the thickness of the expanded first member (D) when the pressure is reduced to the bonding pressure in a state that a deformation is not restricted.

Description

Apparatus for manufacturing joint member and method for manufacturing joint member

Technical Field

The present invention relates to a joining member manufacturing apparatus and a joining member manufacturing method, and more particularly to a joining member manufacturing apparatus and a joining member manufacturing method for bonding two members together in a reduced pressure environment.

Background

For example, in the step of manufacturing a liquid crystal panel, the liquid crystal substrate and the cover glass are bonded to each other through an adhesive. When two members of this kind are bonded together through a resin such as an adhesive, the members are held by suction under a vacuum environment so that air bubbles are not trapped between the two members as much as possible, and the two members are brought into relatively close proximity to each other and bonded together (see, for example, patent document 1).

[ Prior art documents ]

[ patent document ]

Patent document 1: japanese patent laid-open publication No. 2002-357841

Disclosure of Invention

[ problems to be solved by the invention ]

However, in the bonded member, for example, a liquid crystal substrate may be placed in a vacuum environment, and the inner space may expand to bend the surface of the member. When the surface of the member is curved, the holding by suction may become insufficient, and the holding position may be deviated.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a device and a method for manufacturing a joined member, which can prevent the joined member from deviating from a holder even when the surrounding of the held member is depressurized.

[ means for solving problems ]

In order to achieve the above object, a joining member manufacturing apparatus according to a first embodiment of the present invention, as shown in fig. 1 and 2, manufactures an apparatus for manufacturing a joining member C in which a first member D and a second member E are joined together through resin, the first member D being configured to start expanding so that a back surface Db of a first joining surface Df protrudes when an ambient pressure becomes a predetermined pressure lower than an atmospheric pressure or less in a state where deformation is not restricted, the second member E having a second joining surface Ef opposed to the first joining surface Df; the joint member manufacturing apparatus includes: a first holder 10 having a contact surface 11f that contacts the back surface Db of the first bonding surface Df, and holding the first member D in a state where the back surface Db contacts the contact surface 11 f; a second holder 20 for holding the second member E in a state where the second joint face Ef is opposed to the first joint face Df of the first member D held by the first holder 10; a sealable chamber 30 for accommodating the first component D held by the first holder 10 and the second component E held by the second holder 20; a decompression device 50 for decompressing the inside of the chamber 30; a moving device 40 for moving at least one of the first holder 10 and the second holder 20 so that a first joint surface Df of the first member D held by the first holder 10 and a second joint surface Ef of the second member E held by the second holder 20 are relatively close to each other; and a control device 60 for controlling the moving device 40 and the depressurizing device 50 so that the space S between the resin G coated on one Ef of the first bonding surface Df of the first member D held by the first holder 10 and the second bonding surface Ef of the second member E held by the second holder 20 and the bonding surface Df on the side not coated with the resin G becomes a predetermined space, and thereafter the pressure in the chamber 30 is depressurized from a pressure exceeding the predetermined pressure to a bonding-time pressure; wherein the bonding pressure is lower than the predetermined pressure and is a pressure suitable for bonding the first member D and the second member E through the resin G; the predetermined interval is set to an interval smaller than an increase in thickness by which the first member D expands when the pressure is reduced from the pressure exceeding the predetermined pressure to the joining-time pressure in a state where the deformation is not restricted.

In the case of the above configuration, since the distance between the resin applied to one of the first bonding surface and the second bonding surface and the bonding surface on the side not coated with the resin is set to a predetermined distance in the chamber, expansion of the first member can be suppressed when the pressure in the chamber is reduced to the bonding pressure after that, and the first member can be prevented from being displaced from the first holder.

In addition, as shown in fig. 1, for example, the joining member manufacturing apparatus according to the second embodiment of the present invention is the joining member manufacturing apparatus 1 according to the first embodiment of the present invention described above, in which the control device 60 is configured to control the moving device 40 so as to relatively press the second member E held by the second holder 20 against the first member D held by the first holder 10 after the pressure in the chamber 30 is reduced to the joining-time pressure.

With the above configuration, the cavity does not remain in the resin when the joint member is formed.

A bonding member manufacturing apparatus according to a third embodiment of the present invention is, for example, as shown in fig. 1, and in the bonding member manufacturing apparatus 1 according to the second embodiment of the present invention, the second holder 20 includes the following components: a spacing adjuster 23 for adjusting a spacing S between the resin G coated on one Ef of the first bonding surface Df and the second bonding surface Ef and the bonding surface Df on the side not coated with the resin G; and a presser 25 that presses the second member E against the first member D held by the first holder 10 independently of the interval adjuster 23; the moving device 40 includes a spacer moving device 43 for moving the spacer 23 close to the first holder 10 and a presser moving device 45 for moving the presser 25 close to the first holder 10.

In the case of the above configuration, since the interval adjuster and the pressing device are operated independently, the predetermined interval can be adjusted with high accuracy, and the second member can be sufficiently pressed against the first member.

In order to achieve the above object, a method of manufacturing a joined member according to a fourth embodiment of the present invention is a method of manufacturing a joined member C (see, for example, fig. 2(a)) in which a first member D and a second member E are joined together through a resin G, as shown in, for example, fig. 1 and 3, the first member D being configured to start expanding so that a back surface Db of a first joined surface Df protrudes when a surrounding pressure becomes a predetermined pressure lower than an atmospheric pressure or less in a state where deformation is not restricted, the second member E having a second joined surface Ef opposed to the first joined surface Df; the manufacturing method of the joint member includes the steps of: an approaching arrangement step (S4) of approaching the first joint surface Df and the second joint surface Ef of the first member D and the second member E held by the first holder 10 so that the distance S between the resin G applied to one of the first joint surface Df and the second joint surface Ef of the second member E is a predetermined distance and the joint surface Df on the side not coated with the resin G in a state where the back surface Db of the first joint surface Df is in contact with the contact surface 11f of the first holder 10; and a depressurizing step (S5) of depressurizing the inside of the chamber 30 from a pressure exceeding a predetermined pressure to a bonding-time pressure after the approaching arrangement step (S4); a pressure lower than a predetermined pressure at the time of joining and suitable for joining the first member D and the second member E through the resin G; the predetermined interval is set to an interval smaller than an increase in thickness by which the first member D expands when the pressure is reduced from the pressure exceeding the predetermined pressure to the joining-time pressure in a state where the deformation is not restricted.

In the case of the above configuration, since the distance between the resin applied to one of the first bonding surface and the second bonding surface and the bonding surface on the side not coated with the resin is set to a predetermined distance in the chamber, expansion of the first member can be suppressed and the first member can be prevented from deviating from the first holder when the chamber is depressurized to the bonding pressure in the subsequent depressurizing step.

[ Effect of the invention ]

According to the present invention, since the interval between the resin applied to one of the first bonding surface and the second bonding surface and the bonding surface on the side not coated with the resin is set to a predetermined interval in the chamber, expansion of the first member can be suppressed and the first member can be prevented from deviating from the first holder when the chamber is depressurized to the bonding-time pressure thereafter.

Drawings

FIG. 1 is a vertical sectional view showing a schematic configuration of a joined member manufacturing apparatus according to an embodiment of the present invention.

Fig. 2(a) is a side view showing the configuration of the joining member, and fig. 2(B) is a side view showing a state in which the first member constituting the joining member is deformed.

Fig. 3 is a flowchart illustrating the manufacturing steps of the joining member.

Description of the main elements

1 apparatus for manufacturing joined member

10 first holder

11 first stage

11f contact surface

12 suction hole

18 tubes

19 first suction machine

20 second holder

23 space adjusting machine

24 suction tube

25 pushing and pressing machine

26 second stage

26f pressing surface

26h through hole

27 support arm

30 chamber

Space inside 30r

31 stop door

31a opening and closing device

32 suction hole

34 pipe hole

35 exhaust hole

37 arm hole

40 moving device

43 moving device of interval adjusting machine

45 pusher moving device

50 pressure reducing device

51 vacuum piping

52 vacuum pump

60 control device

C joint member

D first Member (lower Member)

Db first back surface

Df first bonding surface

E second component (Upper component)

Ef second joint surface

G adhesive (resin)

GL adhesive layer

And (5) S interval.

Detailed Description

Embodiments of the present invention will be described below with reference to the drawings. In the drawings, the same or similar reference numerals are used for the same or corresponding members, and redundant description is omitted.

First, a joined member manufacturing apparatus 1 according to an embodiment of the present invention will be described with reference to fig. 1. Fig. 1 is a vertical sectional view showing a schematic configuration of a joined member manufacturing apparatus 1. The joining member manufacturing apparatus 1 includes: a first holder (hereinafter referred to as "first holder 10") that holds a first member (hereinafter referred to as "first member D"); a second holder (hereinafter referred to as "second holder 20") for holding a second member (hereinafter referred to as "second member E"); a chamber 30; a mobile device 40; a pressure reducing device 50; and a control device 60. Here, before the detailed description of the joining member manufacturing apparatus 1, the structure of the joining member manufactured by the joining member manufacturing apparatus 1 is exemplified.

Fig. 2(a) is a side view illustrating a structure of the joining member C, and fig. 2(B) is a side view showing a state in which the first member is deformed. The joining member C is a component in which a layer of an adhesive G (adhesive layer GL) as a resin is sandwiched between the first member D and the second member E. In this embodiment, an example will be described in which the first member D is a liquid crystal module with a backlight formed in a plate shape, and the second member E is a cover glass for holding liquid crystal. The surface of the plate-like component including liquid crystal of the first member D is a first bonding surface Df to be bonded to the second member E through the adhesive G. The surface of the first member D opposite to the first bonding surface Df is a first back surface Db. The first rear surface Db of the first member D is a component including a driving circuit for supplying an electric signal to the liquid crystal and a backlight (light source). In the present embodiment, the first bonding surface Df and the first back surface Db are both formed in a flat shape. The first member D has a space (not shown) formed between the liquid crystal on the first bonding surface Df and the component on the first back surface Db. Since the first member D is typically manufactured under atmospheric pressure, air is sealed in a space formed therein. When the pressure of the surroundings is reduced, the air enclosed inside expands due to the difference between the internal pressure and the external pressure. The first member D is deformed so that the rear surface Db having a strength smaller than that of the liquid crystal protrudes as shown in fig. 2(B) in an environment where deformation is not hindered when the air inside expands due to pressure reduction. When the pressure around the first member D is reduced to less than the atmospheric pressure in a state where the deformation of the first member D is not restricted, the pressure at which the expansion is started so that the rear surface Db protrudes is set to a predetermined pressure.

The second member E is typically formed in a plate shape, and one surface thereof is a second bonding surface Ef that is bonded to the first bonding surface Df through the adhesive G. The second bonding surface Ef is formed flat in the present embodiment. The adhesive G is in the form of a liquid having a predetermined viscosity and being flowable when applied to the first member D or the second member E in the present embodiment, and is an optical resin exhibiting adhesive properties when cured by irradiation with ultraviolet rays, and is a form of a resin. The adhesive layer GL is formed by the adhesive G which has fluidity before the first member D and the second member E are bonded, losing its fluidity due to the increase in viscosity. The adhesive layer GL serves as an intermediate layer for bonding the first member D and the second member E together and for maintaining the distance between the first member D and the second member E at an appropriate distance during curing.

Returning to fig. 1, the joining member manufacturing apparatus 1 is explained continuously. The first holder 10 is typically a device that holds the first member D, and has a first stage (stage) 11. The first stage 11 has a contact surface 11f that contacts the first member D. The contact surface 11f is intended to be in contact with the back surface Db of the first member D when the joining member C (see fig. 2 a) is manufactured. The contact surface 11f has a shape including the rear surface Db (or the first bonding surface Df) and is formed to have a larger area than the rear surface Db. The contact surface 11f is formed flat so that the entire rear surface Db is in contact with it. The first stage 11 is arranged so that the contact surface 11f is vertically upward in the present embodiment. The contact surface 11f is formed with a suction hole 12 for sucking and holding the first member D placed thereon. The suction hole 12 penetrates the first stage 11 to reach the back side of the contact surface 11 f. The suction holes 12 are formed in plural on the contact surface 11f so that the first holder 10 stably holds the first member D.

The second holder 20 is provided above the first holder 10 in the present embodiment, and includes a gap adjuster 23 and a presser 25. The interval adjuster 23 typically includes a suction pipe (pipe)24 that suctions and holds the second member E. The suction pipe 24 is disposed to extend in the vertical direction. The suction pipe 24 is provided in plurality to stably hold the second member E. The presser 25 is a device for pressing the second member E against the first member D held by the first holder 10. The presser 25 includes a second table 26 for pressing the second member E, and a support arm 27 for supporting the second table 26. The second table 26 has a pressing surface 26f that contacts the second member E. The pressing surface 26f has a shape including the second bonding surface Ef, and is formed to have a larger area than the second bonding surface Ef. The pressing surface 26f is formed so as to contact the entire surface of the second member E opposite to the second bonding surface Ef, and is formed flat in the present embodiment. The second table 26 is formed to a thickness that can ensure sufficient rigidity required for pushing the second member E. The second stage 26 is formed with a through hole 26h through which the suction pipe 24 passes. The through holes 26h are formed in the same number as the number of the suction pipes 24. The through hole 26h is a surface through which the second stage 26 passes from the pressing surface 26f to the back side thereof. The suction pipe 24 inserted through the through hole 26h is configured to be slidable with respect to the second stage 26. The support arm 27 extends in the vertical direction in the present embodiment.

The chamber 30 provides a depressurized space suitable for the environment when joining the first and second members D, E. The first stage 11 and the second stage 26 are housed in the chamber 30. The chamber 30 is formed to have a size capable of accommodating the first member D gripped by the robot arm (not shown) and the second member E gripped by the robot arm (not shown) in a gap separating the first stage 11 and the second stage 26 in the vertical direction. The chamber 30 is typically formed in a rectangular parallelepiped shape. The chamber 30 is provided with a shutter 31 having an opening through which the first member D and the second member E can be inserted and removed. The shutter 31 is provided at the side of the chamber 30. The shutter 31 is opened and closed by an opening and closing device 31 a. The chamber 30 is configured to seal the internal space 30r when the shutter 31 is closed. The chamber 30 is formed with an air discharge hole 35 for discharging air existing in the space 30 r. The exhaust hole 35 is typically formed at the side opposite to the shutter 31.

A first table 11 is provided at the bottom of the chamber 30. A locking mechanism (not shown) for fixing the first stage 11 to the bottom of the chamber 30 is provided at the bottom of the chamber 30 and/or the first stage 11. In the bottom surface of the chamber 30, a suction hole 32 is formed in an embodiment communicating with the suction hole 12 of the first stage 11. The suction hole 32 is constituted by: a first suction machine 19 is connected to the pipe 18 or the like, and the first member D placed on the contact surface 11f of the first step 11 can be sucked and held on the first table 11 by the operation of the first suction machine 19. An orifice 34 through which the suction pipe 24 passes and an arm orifice 37 through which the support arm 27 passes are formed in the upper portion of the chamber 30. The number of the tube holes 34 is the same as the number of the suction tubes 24. The arm holes 37 are formed in the same number as the support arms 27. The suction tube 24 extending through the tube aperture 34 is configured to slide relative to the chamber 30. A second suction device 29 is connected to an end portion of the suction pipe 24 located outside the chamber 30 through a tube (tube)28 or the like, and the second member E is configured to be sucked and held by the suction pipe 24 by the operation of the second suction device 29. The support arm 27 penetrating the arm hole 37 is configured to be slidable with respect to the chamber 30. In the chamber 30, a sealing structure capable of maintaining the sealing property of the space 30r is applied to the pipe hole 34 through which the suction pipe 24 is inserted and the arm hole 37 through which the support arm 27 is inserted.

The moving device 40 is a device for moving the second holder 20 in the present embodiment, and includes a spacer moving device 43 and a pusher moving device 45. The spacer moving device 43 is a device for reciprocating the spacer 23 in the direction of approaching and separating from the first table 11. The spacer moving device 43 is configured to reciprocate the spacer 23 (the suction pipe 24) in the vertical direction in the present embodiment. The interval adjuster moving device 43 is typically a robot-driven moving device that moves the interval adjuster 23 by a robot. The pusher moving device 45 is a device that reciprocates the pusher 25 in the direction of approaching and separating from the first table 11. In the present embodiment, the presser moving device 45 is configured to reciprocate the presser 25 (the second stage 26 and the support arm 27) in the vertical direction. The pusher moving device 45 typically has a mechanism for reciprocating the pusher 25 in the vertical direction by air pressure. The reciprocating movement of the spacer 23 by the spacer moving device 43 and the reciprocating movement of the presser 25 by the presser moving device 45 are independently performed.

The pressure reducing device 50 is a device for reducing the pressure in the sealed chamber 30, and includes a vacuum pipe 51 and a vacuum pump 52. The vacuum pipe 51 is a flow path for guiding air in the chamber 30 to the outside of the chamber 30, and one end thereof is connected to the exhaust hole 35 formed in the chamber 30. The vacuum pump 52 is disposed in the vacuum pipe 51, and is configured to discharge air in the chamber 30 to the outside of the chamber 30 through the vacuum pipe 51. The vacuum pump 52 has a capability of reducing the pressure in the chamber 30 to a pressure suitable for bonding the first member D and the second member E through the adhesive G (bonding pressure). The pressure is negative when the joint is jointed.

The control device 60 controls the operation of the joining member manufacturing apparatus 1. The control device 60 is configured to: a robot arm (not shown) for gripping the first component D and a robot arm (not shown) for gripping the second component E are connected to each other by signal lines, and the first component D and the second component E can be conveyed into and out of the chamber 30. Further, the controller 60 is configured to: the first suction machine 19 communicating with the suction hole 12 of the first table 11 and the second suction machine 29 communicating with the suction pipe 24 are connected by signal lines, and the presence or absence of vacuum suction of the lower member D and the upper member E can be controlled. Further, the control device 60 is configured to: an opening and closing device 31a of the shutter 31 for opening and closing the chamber 30 is connected by a signal line to control the opening and closing of the shutter 31. Further, the controller 60 is configured to: the spacer moving device 43 and the presser moving device 45 are connected by signal lines, respectively, and move the spacer 23 and the presser 25, respectively. Further, the control device 60 is connected to the vacuum pump 52 via a signal line, and controls the start and stop of the vacuum pump 52.

Next, a method for manufacturing a joined member according to an embodiment of the present invention will be described with reference to fig. 3. Fig. 3 is a flowchart illustrating a manufacturing step of the joining member C (see fig. 2 a). The method for manufacturing the joined member C described below is performed by the joined member manufacturing apparatus 1 described above. That is, the following description will be given together with the operation of the joined member manufacturing apparatus 1. The joining member C can be produced by a method other than the operation of the joining member production apparatus 1. In the following description of the method for manufacturing a joined member, when referring to the detailed configurations of the joined member manufacturing apparatus 1 and the joined member C, reference is appropriately made to fig. 1 and 2.

When manufacturing the joining member C is started, the controller 60 opens the shutter 31 of the chamber 30, and carries the first member D held by a robot arm (not shown) and the second member E held by the robot arm (not shown) into the chamber 30 (S1). In the present embodiment, the first bonding surface Df is directed upward to carry the first member D into the chamber 30, and the second bonding surface Ef is directed downward to carry the second member E into the chamber above the first member D. In the present embodiment, a predetermined amount of the adhesive G is applied to the second bonding surface Ef before the second member E is carried into the chamber 30. The predetermined amount of the adhesive G is an amount of the adhesive G at which the adhesive layer GL becomes an appropriate thickness when the first member D and the second member E are bonded through the adhesive G. In the present embodiment, the thickness of the adhesive G applied to the second bonding surface Ef is approximately 50 μm to 300 μm. In the present embodiment, since the second bonding surface Ef to which the adhesive G is applied faces downward, the adhesive G has a viscosity that does not sag.

After the first member D and the second member E are carried into the chamber 30, the control device 60 causes the first suction machine 19 to operate after the first back surface Db of the first member D held by a robot arm (not shown) is brought into contact with the contact surface 11f of the first table 11. Thereby, the first member D is held by suction by the first holder 10. After the first member D is held by suction by the first holder 10, the control device 60 is configured to retract the robot arm (not shown) out of the chamber 30. The control device 60 causes the second suction device 29 to operate after bringing a surface of the second member E held by the robot arm (not shown) opposite to the second bonding surface Ef into contact with the front end of the suction pipe 24. Thereby, the second member E is sucked and held by the interval adjuster 23. After the second member E is sucked and held by the gap adjuster 23, the controller 60 causes the robot arm (not shown) to retract to the outside of the chamber 30.

When the robot arm (not shown) retracts out of the chamber 30, the first member D sucked and held by the first holder 10 and the second member E sucked and held by the gap adjuster 23 are arranged such that the first bonding surface Df faces the adhesive G coated on the second bonding surface Ef, and is spaced apart from the adhesive G by a relatively large distance (facing arrangement step: S2). Here, the first bonding surface Df is spaced apart from the adhesive G applied to the second bonding surface Ef by a relatively large distance, and means that the robot arm (not shown) can be smoothly moved in and out, and if the chamber 30 is in a negative pressure state and the first back surface Db of the first member D is expanded and protruded in this state, the first back surface Db is spaced apart by a distance that allows the first back surface Db to be separated from the suction hole 12.

After the first member D and the second member E are arranged to face each other, the controller 60 closes the shutter 31 to seal the chamber 30 (S3). Then, the controller 60 operates the spacing adjuster moving device 43 to bring the second member E close to the first member D so that the spacing between the first bonding surface Df of the first member D sucked and held by the first holder 10 and the adhesive G applied to the second bonding surface Ef of the second member E sucked and held by the spacing adjuster 23 becomes a predetermined spacing (approaching arrangement step: S4). Here, the predetermined interval is smaller than the increase in thickness due to the expansion of the first member D when the interior of the chamber 30 is set to the engagement-time pressure in a state where the deformation of the first member D is not restricted (there is no object that interferes with the deformation) and the first back surface Db of the first member D is expanded so as to protrude. The bonding pressure is a negative pressure (a pressure lower than atmospheric pressure) and is a pressure suitable for bonding the first member D and the second member E through the adhesive G, and typically refers to a pressure at which voids exceeding an allowable range are prevented from being mixed in the adhesive layer GL when the bonding member C is used. In the present embodiment, the predetermined interval is set to approximately 0.1mm to 0.5 mm. When the outer periphery of the range to which the adhesive G is applied is lowered (in some cases, the outer periphery is lowered by the viscosity of the adhesive G), the interval between the first bonding surface Df and the portion of the adhesive G inside the outer periphery that is not lowered is set to a predetermined interval. Further, when the first stage 11 is not fixed to the bottom of the chamber 30, a locking mechanism (not shown) is locked and fixed before the approach arrangement step (S4) is completed.

After the first member and the second member E are disposed close to each other, the control device 60 operates the vacuum pump 52 to reduce the pressure in the chamber 30 (pressure reducing step: S5). The control device 60 activates the vacuum pump 52 with a target of reducing the pressure in the chamber 30 to the pressure at the time of bonding. When the pressure in the chamber 30 is reduced to a predetermined pressure, the first member D starts to expand so that the first back surface Db protrudes. The predetermined pressure is typically higher than the engagement pressure, thus continuously depressurizing the chamber 30. When the pressure in the chamber 30 is reduced to be lower than the predetermined pressure, the protruding amount of the first back surface Db of the first member D becomes large. However, in the present embodiment, in the approach arrangement step (S4), since the interval between the adhesives G applied to the first bonding surface Df and the second bonding surface Ef is set to a predetermined interval, even when the first back surface Db bulges and the thickness of the first member D is to be increased, the first member D contacts the second member E, and further expansion of the first member D is inhibited. Thus, the first back surface Db can be prevented from being separated from the suction hole 12 due to the first back surface Db being bent by the expansion of the internal space of the first member D, and the first member D can be prevented from being displaced from the first holder 10 which holds the first member D by suction. In this way, the pressure in the chamber 30 can be reduced to the bonding pressure without shifting the holding positions of the first member D held by suction by the first holder 10 and the second member E held by suction by the gap adjuster 23.

After the pressure in the chamber 30 is reduced to the joining-time pressure, the control device 60 operates the pusher moving device 45, and the second member E is pushed toward the first member D by the pusher 25 (pushing step: S6). The presser 25 is a pressing surface 26f that presses the entire surface on the back side of the second joint surface Ef of the second member E. In a state where the pressure in the chamber 30 is reduced to the bonding-time pressure, the second member E coated with the adhesive G is pressed toward the first member D by the pressing machine 25, whereby the hollow in the interior of the adhesive G is crushed and mixed. The gas components contained in the adhesive G leak out almost under vacuum (in a state of pressure at the time of bonding). Even if the gas remains in the cavity after the gas leakage, the absolute amount is very small because the gas is in a vacuum. Therefore, after the cavity is crushed, the cavity having a size that may be a problem is not regenerated under normal pressure. In the present embodiment, the press moving device 45 presses the second member E against the first member D with a force of approximately 50 to 300kPa, but may press with a force of 1MPa or more. When the pressing step (S6) is completed, it becomes the joining member C joining the first member D and the second member E through the adhesive layer GL of a predetermined thickness (S7). After the joining member C is completed, the controller 60 raises the pressure in the chamber 30 to a pressure that is the same as the pressure outside the chamber 30, opens the shutter 31, and takes out the joining member C from the chamber 30 by a robot arm (not shown), thereby completing the manufacture of the joining member C.

As described above, according to the joining member manufacturing apparatus 1 and the joining member manufacturing method of the present embodiment, in the sealed chamber 30, after the first member D and the second member are brought close to each other so that the interval between the first bonding surface Df and the adhesive G applied to the second bonding surface Ef becomes a predetermined interval, the pressure in the chamber 30 is reduced to the bonding pressure, and therefore, the expansion of the first member D can be suppressed, and the first member D can be prevented from falling off the first holder 10 due to the bending of the first back surface Db. Further, since the expansion of the first member D is suppressed in the process of depressurizing the inside of the chamber 30 to the bonding-time pressure, it is possible to suppress the adverse effect on the product (the first member D, the bonding member C).

In the above description, the first member D is a liquid crystal module, but may be a member other than a liquid crystal module whose back surface expands when pressure is reduced. The second member E is a cover glass, but may be a member other than a cover glass suitable for being bonded to the first member D.

In the above description, the first bonding surface Df and the first back surface Db of the first member D are formed in a flat shape, but either one or both of them may be formed in a convex shape or a concave shape. When the first bonding surface Df is not flat, the second bonding surface Ef is formed so as to correspond to the first bonding surface Df (the bonding can be appropriately performed by the adhesive G), and when the first back surface Db is not flat, the contact surface 11f is formed so as to correspond to the first back surface Db.

In the above description, the second holder 20 is divided into the interval adjuster 23 for adjusting the interval of the second member E with respect to the first member D and the pressing machine 25 for pressing the second member E against the first member D, but may be configured so that the functions of the interval adjuster 23 and the pressing machine 25 are integrated to allow the suction holding of the second member E, the adjustment of the interval of the first member D, and the pressing against the first member D to be performed on one table.

In the above description, the members holding the first holder 10 and the second holder 20 are both configured to suck and hold the members, but both or either of them may be configured as a chuck structure for gripping the outer peripheral edge of the members. However, in the case of the configuration in which the surface for sucking and holding the member is provided, even when the size (outer circumference, area, shape) of the member is changed, the member can be held without providing a special device, and the pressing is easily performed in the pressing step (S6), which is preferable.

In the above description, the moving device 40 is a device that moves the second holder 20, but may be a device that moves the first holder instead of the second holder 20, or may be a device that moves both the second holder 20 and the first holder 10.

In the above description, the adhesive G is applied to the second bonding surface Ef of the second member E before the first member D and the second member E are bonded, but may be applied to the first bonding surface Df of the first member D without being applied to the second bonding surface Ef.

Claims (4)

1. A joint member manufacturing apparatus for manufacturing a joint member in which a first member and a second member are joined to each other by resin, the first member being configured to start expanding so that a back surface of the first joint surface protrudes when a surrounding pressure becomes a predetermined pressure lower than an atmospheric pressure or less in a state in which deformation is not restricted, the second member having a second joint surface facing the first joint surface;

the joint member manufacturing apparatus includes:

a first holder having a contact surface that contacts a back surface of the first bonding surface, and holding the first member in a state where the back surface is in contact with the contact surface;

a second holder for holding the second member in a state where the second bonding surface faces the first bonding surface of the first member held by the first holder;

a sealable chamber for accommodating the first member held by the first holder and the second member held by the second holder;

a decompression device for decompressing the chamber;

a moving device for moving at least one of the first holder and the second holder so that the first joint surface of the first member held by the first holder and the second joint surface of the second member held by the second holder are relatively close to each other; and

a control device for controlling the moving device and the depressurizing device to depressurize the inside of the chamber from a pressure exceeding the predetermined pressure to a bonding-time pressure after an interval between the resin applied to one of the first bonding surface of the first member held by the first holder and the second bonding surface of the second member held by the second holder and the bonding surface on the side not coated with the resin is a predetermined interval; wherein the content of the first and second substances,

the joining pressure is lower than the predetermined pressure and is a pressure suitable for joining the first member and the second member by the resin;

the predetermined interval is set to be smaller than an increase in thickness by which the first member expands when the pressure is reduced from a pressure exceeding the predetermined pressure to the bonding-time pressure in a state where the deformation is not restricted.

2. The joined member manufacturing apparatus according to claim 1, wherein the control device is configured to control the moving device to relatively press the second member held by the second holder to the first member held by the first holder after depressurizing the inside of the chamber to the joining-time pressure.

3. The joint member manufacturing apparatus according to claim 2, wherein the second holder is constituted by including: a gap adjuster for adjusting a gap between the resin coated on one of the first bonding surface and the second bonding surface and a bonding surface on a side not coated with the resin; and a pushing machine that pushes the second member to the first member held by the first holder independently of the interval adjuster;

the moving means includes a spacer moving means for moving the spacer closer to the first holder and a presser moving means for moving the presser closer to the first holder.

4. A method for manufacturing a joint member in which a first member and a second member are joined together with a resin, the first member being expanded so as to protrude from a back surface of a first joint surface when a surrounding pressure is equal to or lower than a predetermined pressure lower than an atmospheric pressure in a state in which deformation is not restricted, the second member having a second joint surface facing the first joint surface;

the manufacturing method of the joint member includes the steps of:

an approaching arrangement step of approaching the resin coated on one of the first joint surface of the first member and the second joint surface of the second member held by the first holder and the joint surface on the side not coated with the resin in a state where the back surface of the first joint surface is in contact with the contact surface of the first holder in a sealable chamber at a predetermined interval; and

a pressure reduction step of reducing the pressure in the chamber from a pressure exceeding the predetermined pressure to a bonding pressure after the approach arrangement step; wherein the content of the first and second substances,

the joining pressure is lower than the predetermined pressure and is a pressure suitable for joining the first member and the second member by the resin;

the predetermined interval is set to be smaller than an increase in thickness by which the first member expands when the pressure is reduced from a pressure exceeding the predetermined pressure to the bonding-time pressure in a state where the deformation is not restricted.