HK1218025B - Variable load power amplifier supporting dual-mode envelope tracking and average power tracking performance - Google Patents
Variable load power amplifier supporting dual-mode envelope tracking and average power tracking performanceInfo
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Description
有关申请的相互引用Cross-references of related applications
本申请要求2015年9月25日提交的标题为“VARIABLE LOAD POWER AMPLIFIERSUPPORTING DUAL-MODE ENVELOPE TRACKING AND AVERAGE POWER TRACKINGPERFORMANCE”的美国临时专利申请No.62/055,614和2015年8月12日提交的标题为“VARIABLE LOAD POWER AMPLIFIER SUPPORTING DUAL-MODE ENVELOPE TRACKING ANDAVERAGE POWER TRACKING PERFORMANCE”的美国申请No.14/824,679,在此兹通过引用特分别合并这两个美国申请的全部公开内容。This application claims the entire disclosures of U.S. Provisional Patent Application No. 62/055,614, filed on September 25, 2015, entitled “VARIABLE LOAD POWER AMPLIFIER SUPPORTING DUAL-MODE ENVELOPE TRACKING AND AVERAGE POWER TRACKING PERFORMANCE,” and U.S. Application No. 14/824,679, filed on August 12, 2015, entitled “VARIABLE LOAD POWER AMPLIFIER SUPPORTING DUAL-MODE ENVELOPE TRACKING AND AVERAGE POWER TRACKING PERFORMANCE,” each of which is hereby incorporated by reference herein.
技术领域Technical Field
本公开一般地涉及无线通信系统,并且更具体地说,本公开涉及改善内部功率放大器的功能和效率。The present disclosure relates generally to wireless communication systems, and more particularly to improving the functionality and efficiency of internal power amplifiers.
背景技术Background Art
为了设定信息承载信号的传输功率电平,网络中广泛使用功率放大器(PA)。例如,利用PA设定光网络中的激光的脉冲发射能量。PA还包含在诸如基站和移动设备的各种无线网络设备中,以设定射频(RF)信号的传输功率电平。PA还用于局域网中,使得各种设备能有线或者无线连通。Power amplifiers (PAs) are widely used in networks to set the transmission power level of information-carrying signals. For example, PAs are used to set the pulsed energy of lasers in optical networks. PAs are also included in various wireless network devices, such as base stations and mobile devices, to set the transmission power level of radio frequency (RF) signals. PAs are also used in local area networks to enable various devices to connect, either wired or wirelessly.
因为PA操作通常特性化移动设备的信号传输,所以管理PA操作在移动设备中受到关注。因此,设计PA,以满足其预期用途倾向的性能目标。然而,满足某些性能目标的设计选择可能对其他方面有害。例如,效率和输出功率通常是竞争性性能目标。相应地,以前可用的PA设计往往优先满足输出功率和效率中的一个。优先满足效率非PA常常基于包络跟踪(ET),而优先满足输出功率的PA常常基于平均功率跟踪(APT)。ET包含根据PA放大的输入RF信号的包络调节PA的电压供给,而APT包含根据PA的平均输出功率调节电压供给。为使用ET设计的PA通常为了以较高的效率操作而具有较高的负载线。为使用APT设计的PA通常为了传送更饱和的功率而具有较低的负载线。Because PA operation often characterizes the signal transmission of mobile devices, managing PA operation is a concern in mobile devices. Therefore, PAs are designed to meet performance targets dictated by their intended use. However, design choices that meet certain performance targets may be detrimental to other aspects. For example, efficiency and output power are often competing performance targets. Accordingly, previously available PA designs often prioritize meeting one of output power and efficiency. Non-PAs that prioritize efficiency are often based on envelope tracking (ET), while PAs that prioritize output power are often based on average power tracking (APT). ET involves adjusting the voltage supply of the PA based on the envelope of the input RF signal amplified by the PA, while APT involves adjusting the voltage supply based on the average output power of the PA. PAs designed for use with ET typically have a higher load line in order to operate at higher efficiency. PAs designed for use with APT typically have a lower load line in order to deliver more saturated power.
ET和APT分别对相应信令配置具有优势。因此,使得能响应实时信令配置的改变在ET与APT之间切换可能会有益。利用先前公知的技术,这种切换涉及两个不同的PA模块,这两个不同PA模块昂贵并且增加了部件数量和设备尺寸。因此,常常对仅选择基于ET或者APT的PA中的一个进行折衷。如果选择基于ET的PA,则PA将对于某些信令配置呈现不理想的输出功率性能。如果选择基于APT的PA,则PA通常将对其他信令配置呈现不理想的信令性能。在这两种情况下,选择的PA未满足各种相应信令条件的相应性能措施。ET and APT each have advantages for corresponding signaling configurations. Therefore, enabling switching between ET and APT in response to real-time signaling configuration changes may be beneficial. Using previously known techniques, such switching involves two different PA modules, which are expensive and increase the number of components and device size. Therefore, a compromise is often made between selecting only one PA based on ET or APT. If an ET-based PA is selected, the PA will exhibit suboptimal output power performance for certain signaling configurations. If an APT-based PA is selected, the PA will generally exhibit suboptimal signaling performance for other signaling configurations. In both cases, the selected PA fails to meet the corresponding performance measures for various corresponding signaling conditions.
发明内容Summary of the Invention
在此描述的各种实现包含用于改善既提供包络跟踪(ET)又提供平均功率跟踪(APT)的功率放大器的性能的设备、排列和方法。为了有助于透彻理解附图所示的典型实现,在此描述了许多细节。在没有在此描述的特定细节的情况下,也可以实施本发明。此外,为了防止不必要地妨碍理解在此描述的实现的更有关方案,未彻底描述众所周知的方法、部件和电路。Various implementations described herein include apparatus, arrangements, and methods for improving the performance of power amplifiers that provide both envelope tracking (ET) and average power tracking (APT). Numerous details are described herein to facilitate a thorough understanding of the exemplary implementations shown in the accompanying drawings. The present invention may be practiced without the specific details described herein. Furthermore, well-known methods, components, and circuits have not been fully described to avoid unnecessarily obscuring an understanding of the more relevant aspects of the implementations described herein.
例如,一种实现包含一种可变负载功率放大器,该可变负载功率放大器包含:多个放大器,多个放大器中的每个能选择性地连接到多个并联组合中的一个,多个并联组合中的每个由相应负载线表征。可变负载功率放大器还包含多个控制元件,排列多个控制元件,以选择性地将多个放大器中的一个或者多个连接到多个并联组合中的一个,多个控制元件中的每个具有为了接收相应控制信号而提供的相应输入端子,多个控制元件中的每个响应于相应控制信号。For example, one implementation includes a variable-load power amplifier comprising: a plurality of amplifiers, each of the plurality of amplifiers selectively connectable to one of a plurality of parallel combinations, each of the plurality of parallel combinations being characterized by a respective load line. The variable-load power amplifier further comprises a plurality of control elements arranged to selectively connect one or more of the plurality of amplifiers to one of the plurality of parallel combinations, each of the plurality of control elements having a respective input terminal provided for receiving a respective control signal, each of the plurality of control elements being responsive to the respective control signal.
在一些实现中,可变负载功率放大器还包含控制总线,该控制总线耦合到多个控制元件的相应输入端子,以提供用于影响多个放大器的选择的相应控制信号。In some implementations, the variable load power amplifier further includes a control bus coupled to respective input terminals of the plurality of control elements to provide respective control signals for influencing selection of the plurality of amplifiers.
在一些实现中,多个放大器中的每个能连接到公共输入节点,以接收为了选择多个放大器中的一个或者多个而提供的公共输入信号。In some implementations, each of the plurality of amplifiers can be connected to a common input node to receive a common input signal provided for selecting one or more of the plurality of amplifiers.
在一些实现中,可变负载功率放大器还包含级间阻抗匹配,提供级间阻抗匹配,以将公共输入信号传送到多个放大器的公共输入节点。In some implementations, the variable load power amplifier further includes inter-stage impedance matching, providing inter-stage impedance matching to transmit a common input signal to a common input node of the plurality of amplifiers.
在一些实现中,可变负载功率放大器还包含驱动级,其中级间阻抗匹配耦合在驱动级与多个放大器的公共输入节点之间。In some implementations, the variable load power amplifier further includes a driver stage, wherein an inter-stage impedance match is coupled between the driver stage and a common input node of the plurality of amplifiers.
在一些实现中,多个放大器中的每个能连接到公共输出节点,以发射通过选择多个放大器中的一个或者多个而产生的输出信号。In some implementations, each of the plurality of amplifiers can be connected to a common output node to transmit an output signal generated by selecting one or more of the plurality of amplifiers.
在一些实现中,多个控制元件中的至少一个包含差动放大器,耦合差动放大器,以接收相应控制信号,并且响应于接收响应控制信号,使多个放大器中的一个连接到特定并联组合或者从特定并联组合断开。In some implementations, at least one of the plurality of control elements includes a differential amplifier, the differential amplifier is coupled to receive the corresponding control signal, and in response to receiving the response control signal, one of the plurality of amplifiers is connected to or disconnected from the specific parallel combination.
在一些实现中,多个并联组合中的至少一个具有适合用在包络跟踪模块上的较高负载线,包络跟踪模块耦合在到多个放大器的输入与多个放大器的电压供给之间。In some implementations, at least one of the plurality of parallel combinations has a higher load line suitable for use on an envelope tracking module coupled between inputs to the plurality of amplifiers and a voltage supply for the plurality of amplifiers.
在一些实现中,多个并联组合中的至少一个具有适合用在平均功率跟踪模块上的较低负载线,平均功率跟踪模块耦合在多个放大器的公共输出与多个放大器的电压供给之间。In some implementations, at least one of the plurality of parallel combinations has a lower load line suitable for use on an average power tracking module coupled between a common output of the plurality of amplifiers and a voltage supply of the plurality of amplifiers.
在一些实现中,本公开涉及一种可变负载功率放大器模块,该可变负载功率放大器模块包含封装衬底,配置该封装衬底,以容纳多个部件。该可变负载功率放大器模块还包含可变负载功率放大器,该可变负载功率放大器排列于封装衬底上,可变负载功率放大器包含多个放大器,多个放大器中的每个能选择性地连接到多个并联组合中的一个,多个并联组合中的每个呈现相应负载线。该可变负载功率放大器模块还包含性能模式控制器,该性能模式控制器耦合到可变负载功率放大器,配置该性能模式控制器,以将一个或者多个控制信号提供到可变负载功率放大器,从而产生相应性能模式的特定负载线。In some implementations, the present disclosure relates to a variable-load power amplifier module, comprising a packaging substrate configured to house a plurality of components. The variable-load power amplifier module further comprises a variable-load power amplifier arranged on the packaging substrate, the variable-load power amplifier comprising a plurality of amplifiers, each of the plurality of amplifiers being selectively connectable to one of a plurality of parallel combinations, each of the plurality of parallel combinations presenting a corresponding load line. The variable-load power amplifier module further comprises a performance mode controller coupled to the variable-load power amplifier and configured to provide one or more control signals to the variable-load power amplifier to generate a specific load line corresponding to a performance mode.
在一些实现中,该可变负载功率放大器模块还包含:多个控制元件,提供多个控制元件,以响应于接收一个或者多个控制信号影响多个放大器中的一个或者多个的选择;以及控制总线,该控制总线耦合在性能模式控制器与多个控制元件之间。In some implementations, the variable load power amplifier module further includes: a plurality of control elements, the plurality of control elements being provided to affect selection of one or more of the plurality of amplifiers in response to receiving one or more control signals; and a control bus coupled between the performance mode controller and the plurality of control elements.
在一些实现中,可变负载功率放大器模块还包含包络跟踪模块,该包络跟踪模块耦合在多个放大器的公共输入与多个放大器的公共电压供给节点之间,并且配置该包络跟踪模块,以将包络信号提供到公共电压供给节点。In some implementations, the variable load power amplifier module further includes an envelope tracking module coupled between a common input of the plurality of amplifiers and a common voltage supply node of the plurality of amplifiers, and configured to provide an envelope signal to the common voltage supply node.
在一些实现中,进一步配置性能模式控制器,以支持包络跟踪模块处于相应运行模式,并且将一个或者多个控制信号的组合提供到可变负载功率放大器,以影响多个放大器中的一个或者多个的选择,多个放大器组合具有适合用在包络跟踪模块上的较高负载线。In some implementations, the performance mode controller is further configured to support the envelope tracking module in a corresponding operating mode and provide a combination of one or more control signals to the variable load power amplifier to affect selection of one or more of the plurality of amplifiers, the plurality of amplifier combinations having a higher load line suitable for use with the envelope tracking module.
在一些实现中,可变负载功率放大器模块还包含平均功率跟踪模块,该平均功率跟踪模块耦合在多个放大器的公共输出与多个放大器的公共电压供给节点之间,并且配置该平均功率跟踪模块,以调节公共电压供给节点上的DC电压电平。In some implementations, the variable load power amplifier module further includes an average power tracking module coupled between a common output of the plurality of amplifiers and a common voltage supply node of the plurality of amplifiers, and configured to adjust a DC voltage level on the common voltage supply node.
在一些实现中,进一步配置性能模式控制器,以支持平均功率跟踪模块处于相应运行模式,并且将一个或者多个控制信号的组合提供到可变负载功率放大器,以执行选择多个放大器中的一个或者多个,多个放大器组合具有适合用在平均功率跟踪模块上的较低负载线。In some implementations, the performance mode controller is further configured to support the average power tracking module in a corresponding operating mode and provide a combination of one or more control signals to the variable load power amplifier to perform selection of one or more of the plurality of amplifiers, the plurality of amplifier combinations having a lower load line suitable for use on the average power tracking module.
在一些实现中,多个放大器中的每个能连接到公共输入节点,以接收为选择多个放大器中的一个或者多个而提供的公共输入信号;并且/或者多个放大器中的每个能连接到公共输出节点,以发射通过选择多个放大器中的一个或者多个而产生的输出信号。In some implementations, each of the plurality of amplifiers can be connected to a common input node to receive a common input signal provided to select one or more of the plurality of amplifiers; and/or each of the plurality of amplifiers can be connected to a common output node to transmit an output signal generated by selecting one or more of the plurality of amplifiers.
根据一些教导,本公开涉及一种射频(RF)设备,该射频(RF)设备包含收发器,配置该收发器,以处理RF信号。该RF设备还包含天线,该天线与收发器通信,配置该天线,从而有助于发射放大的RF信号。该RF设备还包含可变负载功率放大器模块,该可变负载功率放大器模块连接到收发器,并且配置该可变负载功率放大器模块,以产生放大的RF信号,该可变负载功率放大器模块包含多个放大器,多个放大器中的每个能连接到多个并联组合中的一个,多个并联组合中的每个呈现相应负载线。According to some teachings, the present disclosure relates to a radio frequency (RF) device comprising a transceiver configured to process an RF signal. The RF device further comprises an antenna in communication with the transceiver and configured to facilitate transmission of an amplified RF signal. The RF device further comprises a variable load power amplifier module coupled to the transceiver and configured to generate an amplified RF signal, the variable load power amplifier module comprising a plurality of amplifiers, each of the plurality of amplifiers being connectable to one of a plurality of parallel combinations, each of the plurality of parallel combinations presenting a corresponding load line.
在一些实现中,该RF设备是无线设备。In some implementations, the RF device is a wireless device.
在一些实现中,该无线设备包含基站、中继器、蜂窝电话、智能电话、计算机、膝上型计算机、平板电脑以及外部设备中的至少一个。In some implementations, the wireless device includes at least one of a base station, a repeater, a cellular phone, a smart phone, a computer, a laptop, a tablet, and an external device.
在一些实现中,该RF设备还包含性能模式控制器,该性能模式控制器耦合到可变负载功率放大器,配置该性能模式控制器,以将控制信号提供到可变负载功率放大器,从而产生相应性能模式的特定负载线。In some implementations, the RF device further includes a performance mode controller coupled to the variable load power amplifier, the performance mode controller being configured to provide a control signal to the variable load power amplifier to generate a specific load line of the corresponding performance mode.
在一些实现中,进一步配置性能模式控制器,以支持:包络跟踪模块处于第一运行模式,并且将控制信号的组合提供到可变负载功率放大器,以执行选择多个放大器中的一个或者多个,多个放大器组合具有适合用在包络跟踪模块上的较高负载线;以及平均功率跟踪模块处于第二运行模式,并且将控制信号的组合提供到可变负载功率放大器,以执行选择多个放大器中的一个或者多个,多个放大器组合具有适合用在平均功率跟踪模块上的较低负载线。In some implementations, the performance mode controller is further configured to support: the envelope tracking module being in a first operating mode and providing a combination of control signals to the variable load power amplifier to perform selection of one or more of the plurality of amplifiers, the plurality of amplifier combinations having a higher load line suitable for use on the envelope tracking module; and the average power tracking module being in a second operating mode and providing a combination of control signals to the variable load power amplifier to perform selection of one or more of the plurality of amplifiers, the plurality of amplifier combinations having a lower load line suitable for use on the average power tracking module.
在一些实现中,多个放大器中的每个能连接到公共输入节点,以接收为选择多个放大器中的一个或者多个而提供的公共输入信号;并且/或者多个放大器中的每个能连接到公共输出节点,以发射通过选择多个放大器中的一个或者多个而产生的输出信号。In some implementations, each of the plurality of amplifiers can be connected to a common input node to receive a common input signal provided to select one or more of the plurality of amplifiers; and/or each of the plurality of amplifiers can be connected to a common output node to transmit an output signal generated by selecting one or more of the plurality of amplifiers.
在一些实现中,本公开涉及操作可变负载放大器的方法。该方法能够包含:接收模式选择信号,该模式选择信号指出优先满足包络跟踪性能和平均功率跟踪性能中的一个。该方法还能够包含响应于接收模式选择信号产生控制信号的组合,产生的控制信号的组合表示根据模式选择信号选择多个放大器中的一个或者多个的特定并联组合,该多个放大器具有适合包络跟踪性能和平均功率跟踪性能中的一个的特性负载线值。该方法还能够包含将控制信号的组合提供到相应多个控制元件,以执行选择多个放大器中的一个或者多个。In some implementations, the present disclosure relates to a method for operating a variable load amplifier. The method can include receiving a mode selection signal indicating that one of envelope tracking performance and average power tracking performance is prioritized. The method can also include generating a combination of control signals in response to receiving the mode selection signal, the generated combination of control signals indicating selection of a specific parallel combination of one or more of a plurality of amplifiers having characteristic load line values suitable for one of envelope tracking performance and average power tracking performance, based on the mode selection signal. The method can also include providing the combination of control signals to a corresponding plurality of control elements to select the one or more of the plurality of amplifiers.
出于概括本公开的目的,在此描述了本发明的特定方案、优点以及新颖方案。应当明白,根据本发明的任意特定实施例,不一定可以实现所有这些优点。因此,以实现或者优化在此讲述的一个优点或者一组优点,而不一定实现在此讲述或者建议的其他优点的方式实施或者执行本发明。For the purpose of summarizing this disclosure, specific aspects, advantages, and novel aspects of the present invention are described herein. It should be understood that not all of these advantages may be achieved according to any specific embodiment of the present invention. Therefore, the present invention may be implemented or carried out in a manner that achieves or optimizes one or a group of advantages described herein without necessarily achieving the other advantages described or suggested herein.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
为了能够更详细理解本公开,将参考各种实现的特征做更具体描述,附图中示出一些实现。然而,附图仅说明与本公开关系更密切的特征,并且因此,不将其理解为是限制特征,因为该描述可以承认其他有效特征。In order to enable a more detailed understanding of the present disclosure, a more particular description will be given with reference to the features of various implementations, some of which are shown in the accompanying drawings. However, the accompanying drawings only illustrate features that are more closely related to the present disclosure and, therefore, are not to be understood as limiting, as the description may admit of other effective features.
图1是根据一些实现包含功率放大器模块的无线设备的一部分的方框图。1 is a block diagram of a portion of a wireless device including a power amplifier module according to some implementations.
图2是根据一些实现的可变负载功率放大器操作配置的原理图。2 is a schematic diagram of a variable load power amplifier operating configuration according to some implementations.
图3A是根据一些实现的图2所示可变负载功率放大器的更详细原理图。3A is a more detailed schematic diagram of the variable load power amplifier shown in FIG. 2 , according to some implementations.
图3B是根据一些实现的图2所示可变负载功率放大器的另一个更详细原理图。3B is another more detailed schematic diagram of the variable load power amplifier shown in FIG. 2 , according to some implementations.
图4是根据一些实现的操作图2所示可变负载功率放大器的方法的实现的流程图。4 is a flow chart of an implementation of a method of operating the variable load power amplifier shown in FIG. 2 , according to some implementations.
图5是根据一些实现的可变负载功率放大器操作配置的方框图。5 is a block diagram of a variable load power amplifier operating configuration according to some implementations.
图6是示出根据一些实现的可变负载功率放大器的增益压缩的性能图。6 is a performance graph illustrating gain compression of a variable load power amplifier according to some implementations.
图7是示出根据一些实现的可变负载功率放大器的输出功率性能的性能图。7 is a performance graph illustrating output power performance of a variable load power amplifier according to some implementations.
图8是示出根据一些实现的可变负载功率放大器的功率附加效率性能的性能图。8 is a performance graph illustrating power added efficiency performance of a variable load power amplifier according to some implementations.
图9A-9C是图2和3A-3B的可变负载功率放大器的不同集成电路实现的原理图。9A-9C are schematic diagrams of different integrated circuit implementations of the variable load power amplifiers of Figs. 2 and 3A-3B.
图10是包含图2和3A-3B的可变负载功率放大器的模块的实现的原理图。10 is a schematic diagram of an implementation of a module comprising the variable load power amplifier of FIGS. 2 and 3A-3B .
图11是包含图2和3A-3B的可变负载功率放大器的无线设备的实现的原理图。11 is a schematic diagram of an implementation of a wireless device incorporating the variable load power amplifier of FIGS. 2 and 3A-3B .
根据惯例,可以不按比例示出附图所示的各种特征。因此,为了清楚起见,可用于任意放大或者缩小各种特征的尺寸。此外,一些附图可以不示出给定系统、方法或者设备的所有部件。最后,在整个说明书和附图中,可以利用相同的符号表示相同的特征。As is customary, various features shown in the accompanying drawings may not be shown to scale. Therefore, for the sake of clarity, the dimensions of various features may be arbitrarily enlarged or reduced. Furthermore, some of the accompanying drawings may not show all components of a given system, method, or apparatus. Finally, throughout the specification and accompanying drawings, the same symbols may be used to represent the same features.
具体实施方式DETAILED DESCRIPTION
在此即使有也很少给出的小节标题仅是为了方便,并且不一定影响要求保护的本发明的范围或者意义。The few, if any, section headings given herein are for convenience only and do not necessarily affect the scope or meaning of the claimed invention.
功率放大器(PA)在通信网中用于设定数据信号的传输电平。例如,功率放大器用于设定光通信网中的传输脉冲激光能量。功率放大器在例如基站和移动设备的无线设备的射频(RF)部件中用于设定通过天线发射的功率电平。功率放大器还在局域网中用于支持服务器、计算机、膝上型计算机和外围设备的连通性。Power amplifiers (PAs) are used in communications networks to set the transmission level of data signals. For example, PAs are used to set the energy of transmitted pulsed lasers in optical communications networks. PAs are used in the radio frequency (RF) components of wireless devices, such as base stations and mobile devices, to set the power level transmitted by the antenna. PAs are also used in local area networks to support connectivity for servers, computers, laptops, and peripheral devices.
图1是根据一些实现包含功率放大器模块的无线设备100的一部分的方框图。尽管示出了有关特征,但是本技术领域内的技术人员根据本公开明白,为了简洁起见并且为了不妨碍理解在此公开的典型实现的更有关方案,未示出各种其他特征。为此,无线设备100包含:基带子系统110、RF收发器120、双工器130、PA模块140、低噪声放大器(LNA)151、调谐电路160、以及天线170。FIG1 is a block diagram of a portion of a wireless device 100 including a power amplifier module according to some implementations. Although relevant features are shown, those skilled in the art will appreciate from this disclosure that various other features are not shown for the sake of brevity and to not obscure the understanding of the more relevant aspects of the exemplary implementations disclosed herein. To this end, the wireless device 100 includes a baseband subsystem 110, an RF transceiver 120, a duplexer 130, a PA module 140, a low noise amplifier (LNA) 151, a tuning circuit 160, and an antenna 170.
调谐电路160耦合在天线170与双工器130之间。RF收发器120串联耦合在子系统110与PA模块140和LNA151提供的并联通路之间。RF收发器120包含发射信号链路122和接收信号链路121。LNA151通过双工器130将天线调谐器160耦合到接收信号链路121。同样,PA模块140通过双工器130将发射信号链路122耦合到天线调谐器160。PA模块140包含PA141,该PA141用于设定发射信号链路122提供的数据信号的功率电平,并且通过天线170发射该数据信号。Tuning circuit 160 is coupled between antenna 170 and duplexer 130. RF transceiver 120 is coupled in series between subsystem 110 and the parallel path provided by PA module 140 and LNA 151. RF transceiver 120 includes a transmit signal chain 122 and a receive signal chain 121. LNA 151 couples antenna tuner 160 to receive signal chain 121 via duplexer 130. Similarly, PA module 140 couples transmit signal chain 122 to antenna tuner 160 via duplexer 130. PA module 140 includes PA 141, which is used to set the power level of the data signal provided by transmit signal chain 122 and transmit the data signal via antenna 170.
在一些实现中,配置调谐电路160,使得能够调节天线170与无线设备100的其余部之间匹配的阻抗。换句话说,调谐电路160可以操作,以对无线设备100的其余部设定并且呈现天线负载阻抗(Zantenna)。In some implementations, the tuning circuit 160 is configured to adjust the impedance matching between the antenna 170 and the rest of the wireless device 100. In other words, the tuning circuit 160 can operate to set and present an antenna load impedance ( Zantenna ) to the rest of the wireless device 100.
在一些实现中,配置发射信号链路122,以将从基带子系统110收到的调制信号上变频为载波频率。在一些实现中,配置接收信号链路121,以下变频调制信号,并且将下变频信号提供到基带子系统110。配置双工器130,以在发射RF信号与接收RF信号之间提供频域隔离,使得能够同时使用发射信号链路122和接收信号链路121。In some implementations, transmit signal chain 122 is configured to up-convert a modulated signal received from baseband subsystem 110 to a carrier frequency. In some implementations, receive signal chain 121 is configured to down-convert the modulated signal and provide the down-converted signal to baseband subsystem 110. Duplexer 130 is configured to provide frequency domain isolation between transmit RF signals and receive RF signals, enabling simultaneous use of transmit signal chain 122 and receive signal chain 121.
通常,设计PA141,以满足无线设备100的预期使用倾向的性能目标。例如,对于各种信令配置,效率和输出功率常常是竞争性性能明白,并且以前可用的PA设计往往优先满足一个或者另一个。优先满足效率的PA设计常常基于包络跟踪(ET),而优先满足输出功率的PA设计常常基于平均功率跟踪(APT)。为了以较高的效率操作,基于ET的PA通常具有较高的负载线,而基于APT的PA通常为了传送较饱和功率而具有较低的负载线。ET和APT分别对相应信令配置具有优势。因此,响应实时信令配置变化,使得能在ET与APT性能之间切换是有益的。然而,利用以前可用的PA设计,这种切换涉及两个不同的PA模块,PA模块昂贵并且增加了部件数量和设备尺寸。因此,常常对仅选择基于ET或者APT的PA中的一个进行折衷。如果选择具有ET的PA,则该PA对于一些信令配置呈现不理想的输出功率性能。相反,如果选择基于APT的PA,则该PA对于其他信令配置通常呈现不理想的效率性能。Typically, the PA 141 is designed to meet performance targets tailored to the expected usage profile of the wireless device 100. For example, efficiency and output power are often competing performance criteria for various signaling configurations, and previously available PA designs often prioritize one or the other. PA designs prioritizing efficiency are often based on envelope tracking (ET), while PA designs prioritizing output power are often based on average power tracking (APT). To operate at higher efficiency, ET-based PAs typically have a higher load line, while APT-based PAs typically have a lower load line to deliver higher saturation power. ET and APT each have advantages for their respective signaling configurations. Therefore, it would be beneficial to be able to switch between ET and APT performance in response to real-time signaling configuration changes. However, with previously available PA designs, this switching involves two different PA modules, which are expensive and increase the number of components and device size. Consequently, a compromise is often made between selecting only one PA based on ET or APT. If a PA with ET is selected, it may exhibit suboptimal output power performance for some signaling configurations. In contrast, if an APT-based PA is selected, the PA typically exhibits suboptimal efficiency performance for other signaling configurations.
通过对比,在此描述的各种实现包含系统、方法和设备,配置该系统、方法和设备,以提供可变负载功率放大器,该可变负载功率放大器可操作,以支持双模ET和APT性能,而没有随之而来的两个不同PT模块的成本、复杂性和部件数量问题。更具体地说,一些实现包含可变负载功率放大器(VLPA),该可变负载功率放大器包含许多分别选择性地连接到许多并联组合中的一个的放大器。每个并联组合的特征在于适合特定性能模式的负载线。By contrast, various implementations described herein include systems, methods, and apparatus configured to provide a variable load power amplifier (VLPA) operable to support dual-mode ET and APT performance without the attendant cost, complexity, and component count of two different PT modules. More specifically, some implementations include a variable load power amplifier (VLPA) comprising a plurality of amplifiers selectively connected to one of a plurality of parallel combinations. Each parallel combination is characterized by a load line suitable for a particular performance mode.
为达到这些目的,图2是根据一些实现的VLPA操作配置200的原理图。尽管示出了有关特征,但是本技术领域内的技术人员明白,为了简洁起见并且不妨碍理解所公开的例子的更密切方案,未示出各种其他特征。作为非限制性例子,VLPA操作配置200包含:VLPA210、性能模式控制器250、ET模式220、APT控制模块230和DC-DC转换器240。To achieve these objectives, FIG2 is a schematic diagram of a VLPA operating configuration 200 according to some implementations. While relevant features are shown, those skilled in the art will appreciate that various other features are not shown for the sake of brevity and to not obscure the broader understanding of the disclosed examples. As a non-limiting example, VLPA operating configuration 200 includes: a VLPA 210, a performance mode controller 250, an ET mode 220, an APT control module 230, and a DC-DC converter 240.
排列VLPA210,以通过耦合电容器213(C1)从输入节点211接收RF输入信号(RFin),并在输出节点214上提供放大的RF输出信号(RFout)。在各种实现中,将电容器213(C1)实现为单电容器或者多部件电容性电路排列。VLPA102还具有为了接收电压供给电平而提供的电压供给节点201。The VLPA 210 is arranged to receive an RF input signal ( RFin ) from an input node 211 through a coupling capacitor 213 ( C1 ) and to provide an amplified RF output signal ( RFout ) at an output node 214. In various implementations, the capacitor 213 ( C1 ) is implemented as a single capacitor or a multi-component capacitive circuit arrangement. The VLPA 102 also has a voltage supply node 201 provided for receiving a voltage supply level.
性能模式控制器250通过控制线252耦合到VLPA210。在一些实现中,控制线252包含控制总线,该控制总线耦合到包含在VLPA210中的控制元件的相应输入端子(图3A和3B示出)。配置性能模式控制器250,以将一个或者多个控制信号提供到VLPA210,从而对相应性能模式产生特定负载线。性能模式控制器250还通过控制线254耦合到ET模块220,并且通过控制线256耦合到APT控制模块230。提供相应控制线254、256上的控制信号,使得能操作相应ET和APT模块220、230。性能模式控制器250还包含模式控制输入节点251。在模式控制输入节点251上收到的输入信号使VLPA操作配置200在各种性能模式之间切换。正如参考图3A和3B做出的更详细描述,在一种性能模式下,VLPA210操作,以具有适合供ET模块220使用的较高负载线。在另一种性能模式下,VLPA210操作,以具有适合供APT控制模式230和DC-DC转换器240的组合使用的较低负载线。Performance mode controller 250 is coupled to VLPA 210 via control line 252. In some implementations, control line 252 comprises a control bus that is coupled to respective input terminals of control elements included in VLPA 210 (shown in Figures 3A and 3B). Performance mode controller 250 is configured to provide one or more control signals to VLPA 210 to generate a specific load line for a respective performance mode. Performance mode controller 250 is also coupled to ET module 220 via control line 254 and to APT control module 230 via control line 256. Control signals provided on respective control lines 254, 256 enable operation of respective ET and APT modules 220, 230. Performance mode controller 250 also includes a mode control input node 251. Input signals received on mode control input node 251 cause VLPA operating configuration 200 to switch between various performance modes. 3A and 3B , in one performance mode, the VLPA 210 operates to have a higher load line suitable for use with the ET module 220. In another performance mode, the VLPA 210 operates to have a lower load line suitable for use with the combination of the APT control mode 230 and the DC-DC converter 240.
ET模块220通过电容器223(C2)耦合到电压供给节点201。ET模块220还包含为了接收RF输入信号(RFin)的电压包络(即,包络信号Venv)而提供的输入节点221。The ET module 220 is coupled to the voltage supply node 201 via a capacitor 223 (C 2 ). The ET module 220 also includes an input node 221 provided for receiving the voltage envelope of the RF input signal (RF in ) (ie, the envelope signal V env ).
配置APT控制模块230,以利用控制线235上提供的至少一个控制信号控制DC-DC转换器240的操作。还耦合APT控制模块230,以通过输入线233接收VLPA210的平均输出功率的指示,该输入线233耦合到VLPA210的输出节点214。DC-DC转换器240通过电感器241(L1)耦合到VLPA210的电压供给节点201。提供DC-DC转换器240,以响应来自APT控制模块230的控制信号,将可调DC电压电平提供到VLPA210的电压供给节点201。在一些实现中,通过在提供到输入242的DC电压电平之间切换,DC-DC转换器240供给可调DC电压电平。APT control module 230 is configured to control the operation of DC-DC converter 240 using at least one control signal provided on control line 235. APT control module 230 is also coupled to receive an indication of the average output power of VLPA 210 via input line 233, which is coupled to output node 214 of VLPA 210. DC-DC converter 240 is coupled to voltage supply node 201 of VLPA 210 via inductor 241 ( L1 ). DC-DC converter 240 is provided to provide an adjustable DC voltage level to voltage supply node 201 of VLPA 210 in response to a control signal from APT control module 230. In some implementations, DC-DC converter 240 supplies the adjustable DC voltage level by switching between DC voltage levels provided to input 242.
图3A是根据使用CMOS晶体管的一些实现的VLPA210a的原理图。对图2和3A相同的元件包含相同的参考编号。并且此外,尽管示出了特定具体特征,但是本技术领域内的技术人员由本公开明白,为了简洁起见并且为了不妨碍理解在此公开的例子的更有关方案,未示出各种其他特征。FIG3A is a schematic diagram of a VLPA 210a according to some implementations using CMOS transistors. Identical elements in FIG2 and FIG3A include the same reference numbers. Furthermore, while certain specific features are shown, it will be apparent to those skilled in the art from this disclosure that various other features are not shown for the sake of brevity and to not obscure the understanding of the more relevant aspects of the examples disclosed herein.
在一些实现中,VLPA210a包含:驱动级310、级间匹配网络340以及大量放大器,这些大量放大器中的每个分别利用相应控制元件选择性地连接到大量并联组合中的一个。排列该控制元件,从而选择性地将一个或者多个放大器连接到其中一个并联组合中。每个控制元件都具有为了接收相应控制信号而提供的相应输入端子。In some implementations, VLPA 210a includes a driver stage 310, an interstage matching network 340, and a plurality of amplifiers, each of which is selectively connected to one of a plurality of parallel combinations using a corresponding control element. The control elements are arranged to selectively connect one or more amplifiers to one of the parallel combinations. Each control element has a corresponding input terminal for receiving a corresponding control signal.
驱动级310包含第一和第二NMOS晶体管311、312,该第一和第二NMOS晶体管311、312源极与漏极相接耦合于电压供给节点201与地之间。电感器317(L2)设置于电压供给节点201与第二NMOS晶体管312的漏极之间,第二NMOS晶体管312的漏极还被标记为节点319。耦合第二NMOS晶体管312的栅极,以接收通过电容器316(C3)与电阻器315(R1)的串联组合提供的偏压(Vbias2)。耦合第一NMOS晶体管311的栅极,以从节点211接收RF输入信号(RFin)(请参见图2),并且通过电阻器313(R2)从节点311接收偏压(Vbias1)。Driver stage 310 includes first and second NMOS transistors 311 and 312, whose sources and drains are coupled between voltage supply node 201 and ground. An inductor 317 (L 2 ) is disposed between voltage supply node 201 and the drain of second NMOS transistor 312, also labeled as node 319. The gate of second NMOS transistor 312 is coupled to receive a bias voltage (V bias2 ) provided by a series combination of capacitor 316 (C 3 ) and resistor 315 (R 1 ). The gate of first NMOS transistor 311 is coupled to receive an RF input signal (RF in ) from node 211 (see FIG. 2 ) and a bias voltage (V bias1 ) from node 311 via resistor 313 (R 2 ).
将驱动级310的输出从节点319提供到级间匹配网络340。级间匹配网络340的输出耦合到多个放大器的公共输入节点341。尽管本技术领域内的普通技术人员明白,许多放大器包含两个或者两个以上放大器的任何数量的放大器,但是仅作为简要例子,图3A中的多个放大器仅包含第一可变级放大器320和第二可变级放大器330,该第一可变级放大器320和第二可变级放大器330可选择以并联组合方式操作。同样,仅提供了两个与第一和第二可变级放大器320、330关联的相应控制元件326、336。The output of the driver stage 310 is provided from node 319 to an interstage matching network 340. The output of the interstage matching network 340 is coupled to a common input node 341 of the plurality of amplifiers. While it will be appreciated by those skilled in the art that many amplifiers include any number of amplifiers, including two or more, for simplified purposes only, the plurality of amplifiers in FIG3A includes only a first variable stage amplifier 320 and a second variable stage amplifier 330, which are selectively operable in a parallel combination. Similarly, only two respective control elements 326, 336 are provided, associated with the first and second variable stage amplifiers 320, 330.
第一可变级放大器320包含第三和第四NMOS晶体管321、322,该第三和第四NMOS晶体管321、322源极与漏极相接耦合于电压供给节点201与地之间。电感器327(L3)设置于电压供给节点201与第四NMOS晶体管322的漏极之间,第四NMOS晶体管322的漏极还被标记为公共节点329。第四NMOS晶体管322的栅极耦合到相应控制元件326。耦合第三NMOS晶体管321的栅极,以在公共输入节点341上接收来自级间匹配网络340的RF输入,并且通过电阻器323(R2)接收来自节点324的偏压(Vbias3)。同样,第二可变级放大器330包含第五和第六NMOS晶体管331、332,该第五和第六NMOS晶体管331、332源极与漏极相接耦合于电压供给节点201与地之间。电感器327(L3)设置于电压供给节点201与第六NMOS晶体管332的漏极之间,第六NMOS晶体管332的漏极还被标记为公共节点329。第六NMOS晶体管322的栅极耦合到相应控制元件336。耦合第五NMOS晶体管331的栅极,以在公共输入节点341上接收来自级间匹配网络340的RF输入,并且通过电阻器333(R2)接收来自节点334的偏压(Vbias3)。The first variable-stage amplifier 320 includes third and fourth NMOS transistors 321 and 322, each having its source and drain connected between the voltage supply node 201 and ground. An inductor 327 (L 3 ) is disposed between the voltage supply node 201 and the drain of the fourth NMOS transistor 322, also labeled as a common node 329. The gate of the fourth NMOS transistor 322 is coupled to a corresponding control element 326. The gate of the third NMOS transistor 321 is coupled to receive the RF input from the interstage matching network 340 at a common input node 341 and a bias voltage (V bias3 ) from a node 324 via a resistor 323 (R 2 ). Similarly, the second variable-stage amplifier 330 includes fifth and sixth NMOS transistors 331 and 332, whose sources and drains are coupled between the voltage supply node 201 and ground. An inductor 327 (L 3 ) is disposed between the voltage supply node 201 and the drain of the sixth NMOS transistor 332, which is also labeled as a common node 329. The gate of the sixth NMOS transistor 322 is coupled to a corresponding control element 336. The gate of the fifth NMOS transistor 331 is coupled to receive the RF input from the interstage matching network 340 at a common input node 341 and a bias voltage (V bias3 ) from a node 334 via a resistor 333 (R 2 ).
如图3A所示,在一些实现中,控制元件326、336分别包含相应差动放大器。为此,控制元件326、336分别包含为了接收来自性能模式控制器250的相应控制信号(VCTRL1、VCTRL2)而提供的相应控制输入326a、336a。控制元件326、336还分别包含为了接收基准电压电平(Vref)而提供的相应基准输入326b、336b。在一些实现中,VLPA210a包含控制总线,该控制总线耦合到多个控制元件(例如,326、336)的相应输入端子,以提供执行选择多个放大器的相应控制信号。As shown in FIG3A , in some implementations, control elements 326 and 336 each comprise a respective differential amplifier. To this end, control elements 326 and 336 each comprise a respective control input 326 a and 336 a provided to receive a respective control signal (V CTRL1 , V CTRL2 ) from performance mode controller 250. Control elements 326 and 336 also each comprise a respective reference input 326 b and 336 b provided to receive a reference voltage level (V ref ). In some implementations, VLPA 210 a comprises a control bus coupled to respective input terminals of a plurality of control elements (e.g., 326 and 336 ) to provide respective control signals for selecting the plurality of amplifiers.
在操作中,控制信号(VCTRL1、VCTRL2)用于启动或者关闭第一和第二可变级放大器320、330中的每个。换句话说,排列多个控制元件,以选择性地将多个放大器中的一个或者多个耦合到多个并联组合中的一个,多个控制元件中的每个具有为了接收相应控制信号而提供的相应输入端子,多个控制元件中的每个响应于相应控制信号。因此,多个放大器中的每个可连接到公共输出节点329,以发射通过选择多个放大器中的一个或者多个而产生的输出信号。In operation, control signals (V CTRL1 , V CTRL2 ) are used to activate or deactivate each of the first and second variable-stage amplifiers 320 and 330. In other words, a plurality of control elements are arranged to selectively couple one or more of the plurality of amplifiers to one of a plurality of parallel combinations, each of the plurality of control elements having a corresponding input terminal provided for receiving a corresponding control signal, and each of the plurality of control elements is responsive to the corresponding control signal. Thus, each of the plurality of amplifiers can be connected to a common output node 329 to transmit an output signal generated by selecting one or more of the plurality of amplifiers.
参考图2和3A,在一些实现中,进一步配置性能模式控制器250,以支持ET模块220处于相应运行模式。为此,性能模式控制器250将一个或者多个控制信号的组合提供到VLPA210a,用于执行选择多个放大器中的一个或者多个,该多个放大器组合具有适合用在ET模块220上的较高负载线。同样,在一些实现中,进一步配置性能模式控制器250,以支持APT控制模块230处于相应运行模式。为此,性能模式控制器250将一个或者多个控制信号的组合提供到VLPA210a,用于执行选择多个放大器中的一个或者多个,该多个放大器组合具有适合用在APT控制模块230上的较低负载线。2 and 3A , in some implementations, the performance mode controller 250 is further configured to enable the ET module 220 to operate in a corresponding operating mode. To this end, the performance mode controller 250 provides a combination of one or more control signals to the VLPA 210 a to select one or more of the plurality of amplifiers, the plurality of amplifiers having a higher load line suitable for use with the ET module 220. Similarly, in some implementations, the performance mode controller 250 is further configured to enable the APT control module 230 to operate in a corresponding operating mode. To this end, the performance mode controller 250 provides a combination of one or more control signals to the VLPA 210 a to select one or more of the plurality of amplifiers, the plurality of amplifiers having a lower load line suitable for use with the APT control module 230.
图3B是根据一些实现采用异质结双极型晶体管(HBT)的VLPA210b的原理图。对图3A和3B相同的元件包含相同的参考编号,并且为了简洁起见,在此仅描述不同处。为此,与图3A的VLPA210a相比,图3b的VLPA210b包含6个HBT411、412、421、422、431、433,代替图3A的VLPA210a中使用的6个NMOS晶体管311、312、321、322、331、333。FIG3B is a schematic diagram of a VLPA 210 b employing heterojunction bipolar transistors (HBTs) according to some implementations. Identical elements in FIG3A and FIG3B include the same reference numbers, and for the sake of brevity, only the differences are described herein. To this end, compared to the VLPA 210 a of FIG3A , the VLPA 210 b of FIG3 b includes six HBTs 411, 412, 421, 422, 431, and 433, replacing the six NMOS transistors 311, 312, 321, 322, 331, and 333 used in the VLPA 210 a of FIG3A .
如上所述,在操作中,控制信号(VCTRL1、VCTRL2)用于启动或者关闭第一和第二可变级放大器320、330中的每个。换句话说,排列多高控制元件,以选择性地将多高放大器中的一个或者多个连接到多个并联组合中的一个,多个控制元件中的每个具有为了接收相应控制信号而提供的相应输入端子,多个控制元件中的每个响应于相应控制信号。因此,多个放大器中的每个能连接到公共输出节点329,以发射通过选择多个放大器中的一个或者多个而产生的输出信号。As described above, in operation, control signals (VCTRL1, VCTRL2) are used to activate or deactivate each of the first and second variable-stage amplifiers 320, 330. In other words, multiple control elements are arranged to selectively connect one or more of the multiple amplifiers to one of a plurality of parallel combinations. Each of the plurality of control elements has a corresponding input terminal provided for receiving a corresponding control signal, and each of the plurality of control elements is responsive to the corresponding control signal. Consequently, each of the plurality of amplifiers can be connected to a common output node 329 to transmit an output signal generated by selecting one or more of the plurality of amplifiers.
图4是根据一些实现的操作VLPA的方法400的实现的流程图。在一些实现中,方法400由性能管理系统或者与VLPA关联的控制器执行。总之,方法400包含:接收模式选择信号;以及相应地选择适合相应性能模式的特性负载线值。FIG4 is a flow chart illustrating an implementation of a method 400 for operating a VLPA according to some implementations. In some implementations, the method 400 is performed by a performance management system or a controller associated with the VLPA. In summary, the method 400 includes receiving a mode selection signal and selecting a characteristic load line value appropriate for a corresponding performance mode.
为此,正如方框4-1所示,方法400包含接收模式选择信号。例如,如方框4-1a所示,在一些实现中,模式选择信号指出选择ET性能模式,在该ET性能模式中,调节VLPA,以具有适合用在ET模块上的较高负载线。同样,如方框4-1b所示,在一些实现中,模式选择信号指出选择APT性能模式,在该APT性能模式中,调节VLPA,以具有适合用在APT模块上的较低负载线。To this end, as represented by block 4-1, method 400 includes receiving a mode selection signal. For example, as represented by block 4-1a, in some implementations, the mode selection signal indicates selection of an ET performance mode, in which the VLPA is adjusted to have a higher load line suitable for use with an ET module. Similarly, as represented by block 4-1b, in some implementations, the mode selection signal indicates selection of an APT performance mode, in which the VLPA is adjusted to have a lower load line suitable for use with an APT module.
正如方框4-2所示,方法400包含响应于接收模式选择信号产生控制信号的组合。例如,正如方框4-2a所示,在一些实现中,产生控制信号的组合包含产生一个或者多个控制信号,该一个或者多个控制信号表示选择具有适合ET性能模式的特性负载线值的多个放大器中的一个或者多个的特定并联组合。同样,如方框4-2b所示,在一些实现中,产生控制信号的组合包含产生一个或者多个控制信号,该一个或者多个控制信号表示选择具有适合APT性能模式的特性负载线值的多个放大器中的一个或者多个的特定并联组合。As represented by block 4-2, method 400 includes generating a combination of control signals in response to receiving a mode selection signal. For example, as represented by block 4-2a, in some implementations, generating a combination of control signals includes generating one or more control signals indicating selection of a particular parallel combination of one or more amplifiers having characteristic load line values suitable for an ET performance mode. Similarly, as represented by block 4-2b, in some implementations, generating a combination of control signals includes generating one or more control signals indicating selection of a particular parallel combination of one or more amplifiers having characteristic load line values suitable for an APT performance mode.
正如方框4-3所示,方法400包含将控制信号提供给VLPA。例如,正如方框4-3a所示,在一些实现中,提供控制信号包含将一个或者多个控制信号的组合提供给相应多个控制元件,以执行选择多个放大器中的一个或者多个。此外,正如方框4-3b所示,在一些实现中,提供控制信号包含将至少一个控制信号提供给ET模块。同样,正如方框4-3b所示,在一些实现中,提供控制信号包含将至少一个控制信号提供给APT模块。As indicated by block 4-3, method 400 includes providing control signals to the VLPA. For example, as indicated by block 4-3a, in some implementations, providing control signals includes providing a combination of one or more control signals to a corresponding plurality of control elements to select one or more of the plurality of amplifiers. Furthermore, as indicated by block 4-3b, in some implementations, providing control signals includes providing at least one control signal to an ET module. Similarly, as indicated by block 4-3b, in some implementations, providing control signals includes providing at least one control signal to an APT module.
图5是根据一些实现的VLPA系统500的方框图。图5所示的VLPA系统500与图2所示的VLPA操作配置200类似,并且由图2所示的VLPA操作配置200修改获得。对图2和图5相同的元件包含相同的参考编号,并且为了简洁起见,在此仅描述图2与图5之间的不同处。此外,尽管示出了特定具体特征,但是本技术领域内的技术人员由本公开明白,为了简洁起见并且为了不妨碍理解在此公开的典型实现的更有关方案,未示出各种其他特征。FIG5 is a block diagram of a VLPA system 500 according to some implementations. The VLPA system 500 shown in FIG5 is similar to, and is derived from, the VLPA operating configuration 200 shown in FIG2 . Identical elements in FIG2 and FIG5 are provided with the same reference numerals, and for the sake of brevity, only the differences between FIG2 and FIG5 are described herein. Furthermore, while certain specific features are shown, it will be apparent to those skilled in the art from this disclosure that various other features are not shown for the sake of brevity and to avoid obscuring the understanding of the more relevant aspects of the exemplary implementations disclosed herein.
为此,VLPA系统500包含VLPA210、DC-DC变换器240和ET模块220的实现。此外,VLPA系统500还包含:一个或者多个处理单元(CPU)502;一个或者多个输出接口503;存储器506;编程接口508;以及一个或者多个通信总线504,该一个或者多个通信总线504用于使这些部件与各种其他部件互连。To this end, VLPA system 500 includes an implementation of VLPA 210, DC-DC converter 240, and ET module 220. Furthermore, VLPA system 500 includes: one or more processing units (CPUs) 502; one or more output interfaces 503; a memory 506; a programming interface 508; and one or more communication buses 504 for interconnecting these components with various other components.
在一些实现中,通信总线504包含使系统部件互连并且控制系统部件之间的通信的电路系统。存储器506包含高速随机存取存储器,诸如DRAM、SRAM、DDR RAM或者其他随机存取固态存储设备;并且可以包含非易失性存储器,诸如一个或者多个磁盘储存设备、光谱储存设备、闪速储存设备或者其他非易失性固态储存设备。存储器506任选地包含一个或者多个远离(各)CPU 502布置的储存设备。存储器506包括非临时计算机可读储存介质。在一些实现中,存储器506或者存储器506的非临时计算机可读储存介质存储后面的程序、模块和数据指令,或者其包含任选操作系统530、性能模式控制器550、APT控制模块540和ET控制模块520的一个子组。In some implementations, the communication bus 504 includes circuitry that interconnects and controls communications between system components. Memory 506 includes high-speed random access memory, such as DRAM, SRAM, DDR RAM, or other random access solid-state storage devices; and may include non-volatile memory, such as one or more magnetic disk storage devices, optical disk storage devices, flash memory devices, or other non-volatile solid-state storage devices. Memory 506 optionally includes one or more storage devices located remotely from the CPU(s) 502. Memory 506 includes non-transitory computer-readable storage media. In some implementations, memory 506 or its non-transitory computer-readable storage media stores subsequent programs, modules, and data instructions, or includes a subset of the optional operating system 530, performance mode controller 550, APT control module 540, and ET control module 520.
操作系统530包含用于处理各种基本系统服务和用于执行与硬件有关的任务的过程。The operating system 530 includes processes for handling various basic system services and for performing hardware-related tasks.
在一些实现中,性能模式控制器550包含APT控制子模块551和ET控制子模块553。In some implementations, the performance mode controller 550 includes an APT control submodule 551 and an ET control submodule 553 .
在一些实现中,配置APT控制子模块551,以支持与VLPA210的操作关联的APT性能模式。在一些实现中,配置APT控制子模块551,产生一个或者多个控制信号,从而执行选择VLPA210的多个放大器中的一个或者多个,该多个放大器组合具有适合用在APT控制模块540上的较低负载线。在一些实现中,配置APT控制子模块551,以产生至少一个控制信号,从而影响APT控制模块540的操作。因为这些目的,在一些实现中,APT控制子模块551包含一组指令551a和试探程序与元数据551b。In some implementations, the APT control submodule 551 is configured to support an APT performance mode associated with the operation of the VLPA 210. In some implementations, the APT control submodule 551 is configured to generate one or more control signals to select one or more of the plurality of amplifiers of the VLPA 210 that, in combination, have a lower load line suitable for use with the APT control module 540. In some implementations, the APT control submodule 551 is configured to generate at least one control signal to affect the operation of the APT control module 540. For these purposes, in some implementations, the APT control submodule 551 includes a set of instructions 551a and heuristics and metadata 551b.
在一些实现中,配置ET控制子模块553,以支持与VLPA210的操作关联的ET性能模式。在一些实现中,配置ET控制子模块553,以产生一个或者多个控制信号,从而执行选择VLPA210的多个放大器中的一个或者多个,该多个放大器组合具有适合用在ET控制模块520上的较高负载线。在一些实现中,配置ET控制子模块553,以产生至少一个控制信号,从而执行ET控制模块520的操作。为实现这些目的,在一些实现中,ET控制子模块553包含一组指令553a和试探程序与元数据553b。In some implementations, the ET control submodule 553 is configured to support an ET performance mode associated with the operation of the VLPA 210. In some implementations, the ET control submodule 553 is configured to generate one or more control signals to select one or more of the plurality of amplifiers of the VLPA 210 that, in combination, have a higher load line suitable for use with the ET control module 520. In some implementations, the ET control submodule 553 is configured to generate at least one control signal to perform the operation of the ET control module 520. To achieve these objectives, in some implementations, the ET control submodule 553 includes a set of instructions 553a and heuristics and metadata 553b.
在一些实现中,配置APT控制模块540,以控制DC-DC转换器240的操作。为此,在一些实现中,APT控制模块540包含一组指令541a和试探程序与元数据541b。In some implementations, the APT control module 540 is configured to control the operation of the DC-DC converter 240. To this end, in some implementations, the APT control module 540 includes a set of instructions 541a and heuristics and metadata 541b.
在一些实现中,配置ET控制模块520,以控制ET模块220的操作。为此,在一些实现中,ET控制模块520包含一组指令521a和试探程序与元数据521b。In some implementations, the ET control module 520 is configured to control the operation of the ET module 220. To this end, in some implementations, the ET control module 520 includes a set of instructions 521a and heuristics and metadata 521b.
图6是示出根据一些实现的VLPA的增益压缩的性能图600。在一些实现中,随着VLPA中的放大器数量(N)的增大,振幅-振幅增益增大,增益开始降低处的输出功率电平也降低。图7是示出根据一些实现的可变负载功率放大器的输出功率性能的性能图700。在一些实现中,随着VLPA中的放大器的数量(N)增大,作为功率的函数的输出功率增大。图8是示出根据一些实现的可变负载功率放大器的功率附加效率性能的性能图800。在一些实现中,随着VLPA中的放大器数量(N)的增大,在输出功率值的较大范围上,总功率附加效率是线性的。FIG6 is a performance graph 600 illustrating gain compression of a VLPA according to some implementations. In some implementations, as the number of amplifiers (N) in the VLPA increases, the amplitude-to-amplitude gain increases, and the output power level at which the gain begins to decrease also decreases. FIG7 is a performance graph 700 illustrating output power performance of a variable load power amplifier according to some implementations. In some implementations, as the number of amplifiers (N) in the VLPA increases, the output power as a function of power increases. FIG8 is a performance graph 800 illustrating power added efficiency performance of a variable load power amplifier according to some implementations. In some implementations, as the number of amplifiers (N) in the VLPA increases, the overall power added efficiency is linear over a large range of output power values.
图9A-9C是根据一些实现的图2的VLPA210的各种集成电路实现的方框图。尽管示出一些典型特征,但是本技术领域内的技术人员根据本公开明白,为了简洁起见并且为了不妨碍理解在此公开的典型实现的更有关方案,未示出各种其他特征。为此,例如,图9A示出在一些实现中,VLPA210的一些部或者所有部能够是半导体芯片900的一部分。作为例子,VLPA210能够形成于芯片900的衬底902上。多个连接片904也能够形成于衬底902上,从而有助于实现与VLPA210的一些部或者所有部关联的功能。Figures 9A-9C are block diagrams of various integrated circuit implementations of the VLPA 210 of Figure 2, according to some implementations. While some typical features are shown, those skilled in the art will appreciate, based on this disclosure, that various other features are not shown for the sake of brevity and to avoid obstructing understanding of the more relevant aspects of the typical implementations disclosed herein. To this end, for example, Figure 9A illustrates that, in some implementations, some or all of the VLPA 210 can be part of a semiconductor chip 900. As an example, the VLPA 210 can be formed on a substrate 902 of the chip 900. A plurality of connectors 904 can also be formed on the substrate 902 to facilitate functionality associated with some or all of the VLPA 210.
图9B示出在一些实现中,具有衬底902的半导体芯片900能够包含性能模式控制器250的一些部或者所有部和VLPA210的一些部或者所有部。多个连接片904也能够形成于衬底902上,从而有助于实现与性能模式控制器250的一些部或者所有部以及VLPA210的一些部或者所有部关联的功能。9B shows that in some implementations, a semiconductor chip 900 having a substrate 902 can include some or all of the performance mode controller 250 and some or all of the VLPA 210. A plurality of connection pads 904 can also be formed on the substrate 902 to facilitate functionality associated with some or all of the performance mode controller 250 and some or all of the VLPA 210.
图9C示出在一些实现中,具有衬底902的半导体芯片900能够包含VLPA210的一些部或者所有部、性能模式控制器250的一些部或者所有部、APT控制模块230的一些部或者所有部、以及ET模块220的一些部或者所有部。多个连接片904也能够形成于衬底902上,从而有助于实现与VLPA210的一些部或者所有部、性能模式控制器250的一些部或者所有部、APT控制模块230的一些部或者所有部、以及ET模块220的一些部或者所有部关联的功能。9C shows that in some implementations, a semiconductor chip 900 having a substrate 902 can include some or all of the VLPA 210, some or all of the performance mode controller 250, some or all of the APT control module 230, and some or all of the ET module 220. A plurality of connectors 904 can also be formed on the substrate 902 to facilitate functionality associated with some or all of the VLPA 210, some or all of the performance mode controller 250, some or all of the APT control module 230, and some or all of the ET module 220.
在一些实现中,在此描述的一个或者多个特征能够包含于模块中。图10是包含图2和3A-3B的可变负载功率放大器的模块的实现的原理图。尽管示出一些典型特征,但是本技术领域内的技术人员根据本公开明白,为了简洁起见并且为了不妨碍理解在此公开的典型实现的更有关方案,未示出各种其他特征。模块1000包含:封装衬底1052、连接片1056、CMOS(互补金属氧化物半导体)芯片900、HBT(异质结双极型晶体管)芯片1010、匹配网络1008、以及一个或者多个表面安装设备1060。In some implementations, one or more of the features described herein can be included in a module. FIG10 is a schematic diagram of an implementation of a module including the variable load power amplifier of FIG2 and 3A-3B. Although some typical features are shown, it will be apparent to those skilled in the art, based on this disclosure, that various other features are not shown for the sake of brevity and to not obscure the understanding of the more relevant aspects of the typical implementation disclosed herein. Module 1000 includes: a package substrate 1052, a connection pad 1056, a CMOS (complementary metal oxide semiconductor) chip 900, an HBT (heterojunction bipolar transistor) chip 1010, a matching network 1008, and one or more surface mount devices 1060.
CMOS芯片900包含衬底902,该衬底902包含:性能模式控制器250、APT控制模块230、以及ET模块220中的至少一个的一些部或者所有部。多个连接片904形成于衬底902上,从而有助于实现与性能模式控制器250、APT控制模块230、以及ET模块220中的至少一个的一些部或者所有部关联的功能。同样,HBT芯片1010包含衬底1002,该衬底1002包含VLPA210的一些部或者所有部以及为了设定VLPA210的静态条件而提供的偏置电路系统1003的一些部或者所有部。HBT芯片1010还包含多个连接片1004,该连接片1004形成于衬底1002上,从而有助于实现与VLPA210的一些部或者所有部以及偏置电路系统1003的一些部或者所有部关联的功能。CMOS chip 900 includes a substrate 902 that includes some or all of at least one of performance mode controller 250, APT control module 230, and ET module 220. Multiple connectors 904 are formed on substrate 902 to facilitate functionality associated with some or all of at least one of performance mode controller 250, APT control module 230, and ET module 220. Similarly, HBT chip 1010 includes a substrate 1002 that includes some or all of VLPA 210 and some or all of bias circuitry 1003 for setting static conditions for VLPA 210. HBT chip 1010 also includes multiple connectors 1004 formed on substrate 1002 to facilitate functionality associated with some or all of VLPA 210 and some or all of bias circuitry 1003.
封装衬底1052上的连接片1056有助于电连接到CMOS芯片900和HBT芯片1010中的每个和从CMOS芯片900和HBT芯片1010中的每个每个连接。例如,连接片1056有助于利用引线接合器1054将各种信号和供给电流和/或者电压传送到CMOS芯片900和HBT芯片1010。Connector pads 1056 on package substrate 1052 facilitate electrical connections to and from each of CMOS chip 900 and HBT chip 1010. For example, connector pads 1056 facilitate routing various signals and supply currents and/or voltages to CMOS chip 900 and HBT chip 1010 using wire bonds 1054.
在一些实现中,安装于封装衬底1052上的或者形成于封装衬底1052上或者中的部件还能够包含例如一个或者多个表面安装设备(SMD)(例如,1060)和一个或者多个匹配网络(例如,1008)。在一些实现中,封装衬底1052能够包含叠层衬底。In some implementations, components mounted on or formed on or in the package substrate 1052 can also include, for example, one or more surface mount devices (SMDs) (e.g., 1060) and one or more matching networks (e.g., 1008). In some implementations, the package substrate 1052 can include a laminate substrate.
在一些实现中,模块1000还能够包含一个或者多个封装结构,以例如提供保护,并且有助于模块1000更容易地处理。这种封装结构能够包含形成于封装衬底1052上面并且其尺寸基本上密封其上的各种电路和部件的塑封(overmold)。In some implementations, module 1000 can also include one or more packaging structures to, for example, provide protection and facilitate easier handling of module 1000. Such packaging structures can include an overmold formed on packaging substrate 1052 and sized to substantially seal the various circuits and components thereon.
尽管在基于引线接合器的电连接的上下文中描述了模块1000,但是应当明白,在包含倒装片构造的其他封装构造中,也能够实现本公开的一个或者多个特征。Although module 1000 is described in the context of wire bond-based electrical connections, it should be understood that one or more features of the present disclosure can be implemented in other packaging configurations, including flip-chip configurations.
在一些实现中,具有在此公开的一个或者多个特征的设备和/或者电路能够包含于诸如无线设备的RF设备中。这种设备和/或者电路能够在无线设备中、以在此描述的模块方式或者以其一些组合的方式直接实现。在一些实现中,这种无线设备能够包含例如蜂窝式电话、智能电话、具有或者不具有电话功能的手持无线设备、无线平板电脑、无线路由器、无线接入点、无线基站、等等。即,本技术领域内的技术人员根据本公开还将明白,在各种实现中,低频损失校正模块可以包含在各种设备中,诸如计算机、膝上型计算机、平板电脑设备、网络、上网亭、个人数字助理、光学调制解调器、基站、中继器、无线路由器、移动电话、智能电话、游戏设备、计算机服务器或者任何其他计算设备。在各种实现中,这种设备包含:一个或者多个处理器;一种或者多种存储器;显示器;和/或者其他用户接口部件,诸如键盘、触摸屏显示器、鼠标、轨迹板、数码相机和/或者用于增加功能的任何数量的辅助设备。In some implementations, a device and/or circuitry having one or more features disclosed herein can be included in an RF device, such as a wireless device. Such a device and/or circuitry can be implemented directly in the wireless device, in a modular fashion as described herein, or in some combination thereof. In some implementations, such a wireless device can include, for example, a cellular phone, a smartphone, a handheld wireless device with or without phone functionality, a wireless tablet, a wireless router, a wireless access point, a wireless base station, and the like. That is, as will be apparent to those skilled in the art from this disclosure, in various implementations, the low-frequency loss correction module can be included in various devices, such as a computer, a laptop, a tablet device, a network, a kiosk, a personal digital assistant, an optical modem, a base station, a repeater, a wireless router, a mobile phone, a smartphone, a gaming device, a computer server, or any other computing device. In various implementations, such a device includes: one or more processors; one or more memory devices; a display; and/or other user interface components, such as a keyboard, a touchscreen display, a mouse, a trackpad, a digital camera, and/or any number of auxiliary devices for increased functionality.
图11是根据一些实现包含一个或者多个在此描述的诸如图2的VLPA210的特征的无线设备1100的实现的原理图。尽管示出了一些典型特征,但是本技术领域内的技术人员根据本公开明白,为了简洁起见并且为了不妨碍理解在此公开的典型实现的更有关方案,未示出各种其他特征。FIG11 is a schematic diagram of an implementation of a wireless device 1100 that, according to some implementations, includes one or more features described herein, such as the VLPA 210 of FIG2 . While some typical features are shown, those skilled in the art will appreciate from this disclosure that various other features are not shown for the sake of brevity and to not obscure the more relevant aspects of the typical implementations disclosed herein.
在此示出的一个或者多个VLPA210由(各)相应偏置电路(未示出)偏置并且由(各)相应补偿电路(未示出)补偿。在一些实现中,VLPA210封装在包含匹配电路1118的模块中。VLPA210能够接收来自收发器1114的相应RF信号,能够以公知的方式配置并且操作该收发器1114,从而产生要被放大和发射的RF信号,并且处理收到的信号。所示的收发器1114与基带子系统1110交互,配置该基带子系统1110,以在适合用户的数据和/或者语音信号与适合收发器1114的RF信号之间提供转换。还示出VLPA210连接到性能模式控制器250。性能模式控制器250耦合到ET模块220和APT模块230。The one or more VLPAs 210 shown here are biased by corresponding bias circuit(s) (not shown) and compensated by corresponding compensation circuit(s) (not shown). In some implementations, the VLPAs 210 are packaged in a module that includes a matching circuit 1118. The VLPAs 210 are capable of receiving corresponding RF signals from a transceiver 1114, configuring and operating the transceiver 1114 in a known manner to generate RF signals to be amplified and transmitted, and processing received signals. The transceiver 1114 shown interacts with a baseband subsystem 1110, configuring the baseband subsystem 1110 to provide conversion between data and/or voice signals suitable for a user and RF signals suitable for the transceiver 1114. The VLPAs 210 are also shown connected to a performance mode controller 250. The performance mode controller 250 is coupled to the ET module 220 and the APT module 230.
示出基带子系统1110连接到用户接口1102,从而有助于从用户接收语音和/或者数据的各种输入和将语音和/或者数据的各种输出提供到用户。基带子系统1110还能够连接到存储器1104,配置存储器1104,以存储数据和/或者指令,从而有助于无线设备的操作并且/或者对用户的信息提供存储。The baseband subsystem 1110 is shown connected to the user interface 1102 to facilitate receiving various inputs of voice and/or data from the user and providing various outputs of voice and/or data to the user. The baseband subsystem 1110 can also be connected to the memory 1104 to configure the memory 1104 to store data and/or instructions to facilitate the operation of the wireless device and/or provide storage for user information.
在典型无线设备1100中,示出VLPA210的输出与天线匹配,并且通过相应双工器1120和频带选择开关1122,示出VLPA210的输出路由到天线1124。频带选择开关1122能够包含例如单刀多掷(例如,SP4T)开关,以允许选择工作频带(例如,频带2)。在一些实现中,每个双工器1120能够允许同时利用公共天线执行发射操作和接收操作。In the exemplary wireless device 1100, the output of the VLPA 210 is shown matched to the antenna and routed to the antenna 1124 via a corresponding duplexer 1120 and a band select switch 1122. The band select switch 1122 can include, for example, a single-pole, multiple-throw (e.g., SP4T) switch to allow selection of an operating band (e.g., Band 2). In some implementations, each duplexer 1120 can allow simultaneous transmit and receive operations using a common antenna.
许多其他无线设备配置能够采用在此描述的一个或者多个特征。例如,无线设备不需要是多频带设备。在另一个例子中,无线设备能够包含诸如分集式天线的附加天线和诸如Wi-Fi、蓝牙和GPS的附加连通性特征。Many other wireless device configurations can employ one or more of the features described herein. For example, a wireless device need not be a multi-band device. In another example, a wireless device can include additional antennas such as a diversity antenna and additional connectivity features such as Wi-Fi, Bluetooth, and GPS.
尽管上面描述了落入所附权利要求书的范围内的各种实现方案,但是应当明白,上面描述的各种实现特征可以以大量不同的形式实施,并且上面描述的任何特定结构和/或者功能仅是说明性的。根据本公开,本技术领域内的技术人员应当明白,在此描述的方案可以独立于任何其他方案实现,并且可以以各种方式组合这些方案中的两个或者两个以上的方案。例如,利用在此阐述的任何数量的方案,可以实现一种装置并且/或者可以实施一种方法。此外,除了在此阐述的一个或者多个方案,或者在此阐述的一个或者多个方案除外,利用其他结构和/或者功能也可以实现这种装置并且/或者实施这种方法。Although various implementation schemes falling within the scope of the appended claims have been described above, it should be understood that the various implementation features described above can be implemented in a large number of different forms, and any specific structure and/or function described above is merely illustrative. In light of this disclosure, it should be understood by those skilled in the art that the schemes described herein can be implemented independently of any other schemes, and two or more of these schemes can be combined in various ways. For example, a device can be implemented and/or a method can be implemented using any number of schemes set forth herein. In addition, in addition to one or more schemes set forth herein, or in addition to one or more schemes set forth herein, such a device and/or such method can also be implemented using other structures and/or functions.
还应当明白,尽管在此可以利用术语“第一”、“第二”等描述各种元件,但是这些元件不应当受这些术语的限制。这些术语仅用于将一个元件与另一个元件区别开。例如,只要出现的所有“第一功率放大器”都被一致地重新命名,并且出现的所有“第二功率放大器”被被一致地出现命名,则第一功率放大器可以被称为第二功率放大器,并且同样地,第二功率放大器也可以被称为第一功率放大器,这改变描述的意义。第一功率放大器和第二功率放大器二者都是功率放大器,但是它们不是相同的功率放大器。It should also be understood that although the terms "first," "second," etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used solely to distinguish one element from another. For example, as long as all occurrences of "first power amplifier" are consistently renamed and all occurrences of "second power amplifier" are consistently named, then a first power amplifier can be referred to as a second power amplifier, and similarly, a second power amplifier can be referred to as a first power amplifier, which changes the meaning of the description. The first power amplifier and the second power amplifier are both power amplifiers, but they are not the same power amplifier.
在此使用的技术术语仅出于描述特定实施例的目的,并且不旨在限制权利要求书。如在实施例的描述中和所附权利要求书中使用的,单数形式“一个”、“一”和“该”旨在也包含复数形式,除非上下文清楚地指出。还应当明白,如在此使用的术语“和/或者”指的是并且涵盖一个或者多个所列关联项目中的任何一个和所有可能的组合。还应当明白,术语“包括”和/或者“含括”当在本说明书中使用时指明存在陈述的特征、整数、步骤、操作、元件和/或者部件,但是并不排除存在或者附加一个或者多个特征、整数、步骤、操作、元件、部件和/或者其组。The technical terms used herein are for the purpose of describing specific embodiments only and are not intended to limit the claims. As used in the description of the embodiments and in the appended claims, the singular forms "a", "an" and "the" are intended to also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and/or" as used herein refers to and encompasses any one and all possible combinations of one or more listed associated items. It should also be understood that the terms "include" and/or "comprise" when used in this specification indicate the presence of stated features, integers, steps, operations, elements and/or parts, but do not exclude the presence or addition of one or more features, integers, steps, operations, elements, parts and/or groups thereof.
如在此使用的术语“如果”可以根据上下文被理解为指“当”陈述的先决条件成立时或者“在”陈述的先决条件成立“后”或者“响应确定”陈述的先决条件成立或者“根据确定”陈述的先决条件成立或者“响应检测到”陈述的先决条件成立。同样,可以根据上下文将用语“如果确定[陈述的先决条件成立]”或者“如果[陈述的先决条件成立]”或者“当[陈述的先决条件成立]时”理解为指“在确定”陈述的先决条件成立“后”或者“响应确定”陈述的先决条件成立或者“根据确定”陈述的先决条件成立或者“在”检测到陈述的先决条件成立“后”或者“响应检测到”陈述的先决条件成立。The term "if" as used herein may be understood, depending on the context, to mean "when" the stated precondition holds true or "after" the stated precondition holds true or "in response to determining" that the stated precondition holds true or "upon determining" that the stated precondition holds true or "in response to detecting" that the stated precondition holds true. Likewise, the phrases "if it is determined that [the stated precondition holds true]" or "if [the stated precondition holds true]" or "when [the stated precondition holds true]" may be understood, depending on the context, to mean "after determining" that the stated precondition holds true or "in response to determining" that the stated precondition holds true or "upon determining" that the stated precondition holds true or "upon detecting" that the stated precondition holds true or "in response to detecting" that the stated precondition holds true.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462055614P | 2014-09-25 | 2014-09-25 | |
| US62/055,614 | 2014-09-25 | ||
| US14/824,679 | 2015-08-12 | ||
| US14/824,679 US9991856B2 (en) | 2014-09-25 | 2015-08-12 | Variable load power amplifier supporting dual-mode envelope tracking and average power tracking performance |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| HK1218025A1 HK1218025A1 (en) | 2017-01-27 |
| HK1218025B true HK1218025B (en) | 2022-04-22 |
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