HK1208748B - Information carrying card comprising a cross-linked polymer composition, and method of making the same - Google Patents

Description

Information bearing card comprising a crosslinked polymer composition and method of making the same

The present application claims the benefits of u.s. provisional application No. 61/619,700 filed 4/3/2012, u.s. patent application No. 13/647,982 filed 10/9/2012, u.s. patent application No. 13/648,805 filed 10/2012, and u.s. patent application No. 13/649,663 filed 11/10/2012, which applications are expressly incorporated herein by reference in their entirety.

Technical Field

The disclosure relates to information bearing cards such as smart cards. More particularly, the disclosed subject matter relates to a polymer composition, an information bearing card comprising the composition, and a method of making the card.

Background

The information bearing card provides identification, authentication, data storage, and application processing. Such cards or parts include key cards, identification cards, phone cards, credit cards, bank cards, badge cards, bar code strips, other smart cards, and the like. With the counterfeiting and information fraud of traditional plastic cards, billions of dollars are lost each year. In response, information bearing cards are becoming "smarter" to improve security. Smart card technology provides a solution to prevent fraud and reduce the resulting loss.

Information-bearing cards typically include an Integrated Circuit (IC) embedded in a thermoplastic material, such as polyvinyl chloride (PVC). Information is already entered and stored in the integrated circuit prior to the transaction. In use, the information bearing card operates in either a "contact" or "contactless" mode. In the contact mode, electronic components on the card directly contact the card reader or other information receiving device to establish electromagnetic coupling. In the contactless mode, the electromagnetic coupling between the card and the card reading device is established by remote electromagnetic action, without physical contact. The process of inputting information into the IC of an information bearing card also operates in one of these two modes.

As information bearing cards become "smarter," the amount of information stored in each card typically increases and the complexity of the embedded IC increases. The card also needs to withstand flexing to protect sensitive electronic components from damage and to provide good durability during use. A relatively easy and fully commercial process with increased productivity at low cost is also desirable.

Disclosure of Invention

The invention provides a crosslinkable polymer composition, a core layer for an information-bearing card comprising the crosslinked composition, an information-bearing card formed of the core layer for an information-bearing card comprising the crosslinked composition, and a method for manufacturing the same.

In some embodiments, the crosslinkable polymer composition comprises a curable base polymer resin in liquid or paste form and a thermoplastic filler in particulate form. The base polymer resin is selected from the group consisting of urethane acrylates, silicone acrylates, epoxy acrylates, and urethanes. Examples of acrylates include, but are not limited to, methacrylates. The particulate thermoplastic filler may be a polyolefin, polyvinyl chloride (PVC), a compound or blend comprising PVC or a copolymer of vinyl chloride, a copolymer of vinyl chloride with at least another monomer or a polyester such as polyethylene terephthalate (PET). In some embodiments, the at least another monomer in the vinyl chloride copolymer may be a vinyl ester, vinyl acetate, or vinyl ether. The crosslinkable polymer composition may further comprise at least one curing agent.

In other embodiments, the crosslinkable polymer composition comprises a liquid or paste-like curable base polymer resin and a particulate thermoplastic filler comprising a copolymer of vinyl chloride and at least another monomer. The at least another monomer may be a vinyl ester, vinyl acetate or vinyl ether. The curable base polymer is selected from the group consisting of urethane acrylates, ester acrylates, silicone acrylates, epoxy acrylates, silicones, urethanes, and epoxies. Examples of acrylates include, but are not limited to, methacrylates. The crosslinkable polymer composition may further comprise at least one curing agent. Such compositions are converted into crosslinked polymer compositions after the curing reaction.

In yet another embodiment, a core layer for an information bearing card comprises a crosslinked polymer composition comprising a base polymer resin and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylates, silicone acrylates, epoxy acrylates, silicones, urethanes, and epoxies. The particulate thermoplastic filler may be a polyolefin, polyvinyl chloride (PVC), a compound or blend comprising PVC or a copolymer of vinyl chloride, a copolymer of vinyl chloride with at least another monomer or a polyester such as polyethylene terephthalate (PET). The core layer for an information bearing card may further comprise an embedding layer having at least one active or passive electronic component, such as an Integrated Circuit (IC). In some embodiments, the crosslinked polymer composition is in direct contact with the at least one IC on the intercalating layer. In further embodiments, the information bearing card comprises a core layer and a crosslinked polymer composition as described above.

The present invention provides a method for forming a core layer of an information bearing card. In one embodiment, the method comprises the steps of: the method includes the steps of forming a first thermoplastic layer having at least one hole, partially or completely depositing an inlay layer of a Printed Circuit Board (PCB) into the at least one hole, and dispensing a crosslinkable polymer composition on the inlay layer within the at least one hole. In some embodiments, the crosslinkable polymer composition used in the method comprises a liquid or paste-like curable base polymer resin and a particulate thermoplastic filler. In other embodiments, the method of making the core layer further comprises securing the inlay layer to the first thermoplastic layer with an instant adhesive. In a further embodiment, the method of manufacturing a core layer further comprises the step of heating the layer structure under pressure at a predetermined temperature.

The invention also provides a method for manufacturing an information bearing card comprising forming a core layer of the information bearing card of the invention. The method may further comprise thermally laminating a printable thermoplastic film and a transparent thermoplastic film on each side of the core layer of the card.

Drawings

The disclosure of the present invention is best understood from the following detailed description when read in connection with the accompanying drawings. It is to be emphasized that: in accordance with common practice, the various features of the drawings are not necessarily to scale. In some instances, the dimensions of the various features are arbitrarily expanded or reduced for clarity. Like numbers refer to like features throughout the specification and drawings.

Fig. 1-6 illustrate cross-sectional views of a layered structure at various steps in an exemplary method of forming a core layer of an information bearing card, in accordance with some embodiments.

FIG. 1 illustrates a cross-sectional view of a first separator film.

Fig. 2 illustrates a cross-sectional view of a second separator film disposed over the first separator film of fig. 1.

Fig. 3 illustrates a cross-sectional view of a first thermoplastic layer having at least one hole disposed over two of the separator films of fig. 2.

FIG. 4 is a cross-sectional view of the layers after an insert layer is partially or completely disposed within the first thermoplastic layer of FIG. 3.

Fig. 5 is a cross-sectional view of the layers of fig. 4 after a cross-linkable polymer composition is dispensed on the embedding layer within the hole.

Fig. 6 is a cross-sectional view of the layers of fig. 5 after placing third and fourth release films thereon.

Fig. 7 is a flow chart illustrating an exemplary method of forming a core layer of an information bearing card according to some embodiments.

Fig. 8 is a cross-sectional view of an exemplary core layer of an information bearing card, the card being fabricated according to the structure of fig. 1-6 and the steps of fig. 7.

Fig. 9 is a cross-sectional view of an exemplary core layer of an information bearing card having a fully open hole for an inlay, according to some embodiments.

Fig. 10 is a top view of an exemplary core layer of the information bearing card of fig. 9.

Fig. 11 is a cross-sectional view of an exemplary core layer of an information bearing card having an open inlay hole approximating an inlay size, according to some embodiments.

Fig. 12 is a top view of an exemplary core layer of the information bearing card of fig. 11.

Fig. 13 is a cross-sectional view of an exemplary core layer of an information bearing card having a window aperture partially for an inlay, according to some embodiments.

Fig. 14 is a top view of an exemplary core layer of the information bearing card of fig. 13.

Fig. 15-18 illustrate exemplary methods for securing an exemplary inlay layer to a thermoplastic layer using an instant adhesive according to some embodiments.

FIG. 15 is a top view of an exemplary embedding layer according to some embodiments.

Fig. 16 illustrates a top view of the exemplary embedding layer of fig. 15 with holes in its backing layer after cutting.

Fig. 17 illustrates a top view of the exemplary embedding layer of fig. 16 disposed on a thermoplastic layer.

FIG. 18 illustrates a top view of the exemplary inlay layer of FIG. 17 secured to the thermoplastic layer using an instant adhesive, in accordance with some embodiments.

FIG. 19 is a flow chart illustrating an exemplary method for securing an inlay layer to a thermoplastic layer in accordance with some embodiments.

Fig. 20-24 illustrate cross-sectional views of layer structures at various steps of an exemplary method of manufacturing an exemplary information bearing card, in accordance with some embodiments.

Fig. 20 is a cross-sectional view of a transparent film.

Fig. 21 is a cross-sectional view of a printable film disposed on the transparent film of fig. 20.

Fig. 22 is a cross-sectional view of the layer structure after an exemplary core layer is disposed on the two films of fig. 21.

FIG. 23 is a cross-sectional view of the resulting layer structure after a second printable film is disposed on the layer structure of FIG. 22.

Fig. 24 is a cross-sectional view of the resulting layer structure after a second transparent film is disposed on the layer structure of fig. 23.

Fig. 25 is a flow chart illustrating an exemplary method of manufacturing an exemplary information bearing card.

Fig. 26 is a schematic diagram illustrating an exemplary core structure for use with a plurality of information bearing cards during an exemplary method of manufacture in accordance with some embodiments.

Detailed Description

The description of the exemplary embodiments is intended to be read in connection with the accompanying drawings, which are to be considered part of the entire written description. In the description, relative terms such as "lower," "upper," "horizontal," "vertical," "above," "below," "upper," "lower," "top" and "bottom" as well as derivatives thereof (e.g., "horizontally," "downwardly," "upwardly," etc.) should be construed to refer to the orientation as then described or as shown in the drawing under discussion. These relative terms are for convenience of description and do not require that any device be constructed or operated in a particular orientation. Terms concerning connections, couplings, and the like, such as "connected" and "interconnected," refer to structures wherein the structures are secured or interconnected either directly or indirectly through intervening structures, as well as both movable or rigid connections or associations, unless expressly described otherwise.

For the sake of brevity, unless explicitly stated otherwise, reference throughout this specification to "information bearing card" or "smart card" is intended to include at least key cards, identification cards, phone cards, credit cards, bank cards, power cards, token cards, bar code strips, and any part containing an Integrated Circuit (IC), and the like. "information bearing card" or "smart card" also includes various shapes including, but not limited to, rectangular sheets, circular sheets, strips, rods, and rings. "information bearing card" or "smart card" also includes any information bearing card in "contact" and "non-contact" modes. "information bearing card" or "smart card" also includes any information bearing card with or without an on-board power supply. Information bearing cards that contain a power source are also referred to as "power cards".

1. Crosslinkable polymer composition:

the crosslinkable polymer compositions formed in accordance with the present invention generally comprise a curable base polymer resin in liquid or paste form and a thermoplastic filler in particulate form. The base polymer resin may be selected from the group consisting of urethane acrylates, ester acrylates, silicone acrylates, epoxy acrylates, and urethanes. The acrylate may be a methacrylate. The particulate thermoplastic filler may be a polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride with at least one other monomer or a polyester such as polyethylene terephthalate (PET). The particulate thermoplastic filler may be a compound or blend comprising a thermoplastic resin, for example a compound or blend comprising PVC or a vinyl chloride copolymer. The at least another monomer in the vinyl chloride copolymer may be a vinyl ester, vinyl acetate, or vinyl ether.

The base polymer resin may be an oligomer or prepolymer having a functional group. The base polymer may be crosslinkable under conventional curing conditions including, but not limited to, heat, radiation such as Ultraviolet (UV) light, moisture, and other suitable conditions. The base polymer may be liquid or pasty. The viscosity may be in the range of 1-100,000 cps. In some embodiments, the base polymer resin is a urethane acrylate. These polymer resins are readily available from specialty chemical suppliers. Examples of such suppliers include, but are not limited to, Dymax Corporation of Torrington, CT and Sartomer USA, LLC, PA.

The particulate thermoplastic filler suitable for the present invention may be any polymer which will melt upon heating. Examples of thermoplastic fillers include, but are not limited to, polyolefins, PVC, polyesters, copolymers, terpolymers, and the like. The powdered polymer providing suitable results may be a compound or blend comprising PVC or modified PVC. One suitable example of the particulate thermoplastic filler comprises a copolymer of vinyl chloride and at least another monomer which may be a vinyl ester, vinyl acetate or vinyl ether. The ratio of vinyl chloride to the at least one other monomer may be any ratio. An example of such a copolymer is available under the trade name UCAR from the Dow Chemical Company^TMAnd by BASF of Ludwigshafen, Germany under the trade name Laroflex^TMCan be obtained. UCARTM is a copolymer of vinyl chloride and vinyl acetate. The grades include YNS-3, VYHH and VYHD. Laroflex^TMIs a copolymer of vinyl chloride and vinyl isobutyl ether. The grades include MP25, MP 35, MP45, and MP60. All of these polymer resins are usually supplied in the form of fine powders. One example of a thermoplastic filler is PVC modified with a copolymer of vinyl chloride and at least another monomer such as vinyl ester, vinyl acetate or vinyl ether. In this example, the ratio of PVC to the copolymer can be in the range of from 99:1 to 1:99, and in some embodiments in the range of from 95:5 to 80: 20.

The particulate thermoplastic filler may be obtained by suspension polymerization or emulsion polymerization of one or more of the corresponding monomers or by comminution of solid plastics. The comminution of the solid polymer may be accomplished by mechanical means, freeze-milling, solution processes, or any other suitable method. The particulate form may be any size by way of example and not limitation; the particles may be in the range of 0.5 to 200 microns. In some embodiments, the particles are in the range of 1-1000 nm.

The crosslinkable polymer composition may further comprise at least one curing agent, based on the general principles of polymer chemistry. In some embodiments, the composition comprises a dual cure mechanism. For example, the crosslinkable composition comprises a first curing agent for thermal curing and a second curing agent for radiation curing. During said curing or crosslinking reaction, the crosslinkable composition is transformed into a solid crosslinked polymer composition. The crosslinked polymer compositions are also referred to in the art as "thermoset" polymers or "thermoset" to distinguish them from thermoplastic polymers. In some embodiments, the crosslinkable polymer composition comprises a base polymer in the range of about 20 wt.% to about 99.5 wt.%, and preferably in the range of about 50 wt.% to about 95 wt.%. The crosslinkable polymer composition generally comprises particulate thermoplastic filler in the range of about 0.5 wt.% to about 80 wt.%, and preferably in the range of about 5 wt.% to about 50 wt.%. In some embodiments, the crosslinkable polymer composition comprises a base polymer in the range of about 65 wt.% to about 99.5 wt.%, and preferably in the range of about 80 wt.% to about 95 wt.%. The crosslinkable polymer composition generally comprises particulate thermoplastic filler in the range of about 0.5 wt.% to about 35 wt.%, and preferably in the range of about 5 wt.% to about 20 wt.%.

In some embodiments, the crosslinkable polymer composition comprises a liquid or paste-like curable base polymer resin and a particulate thermoplastic filler comprising a copolymer of vinyl chloride and at least another monomer. The at least another monomer may be a vinyl ester, vinyl acetate or vinyl ether. One example of a thermoplastic filler is PVC modified with a copolymer of vinyl chloride and at least another monomer such as vinyl ester, vinyl acetate or vinyl ether. The ratio of PVC to the copolymer may be in the range of from 99:1 to 1:99, and in some embodiments in the range of from 95:5 to 80: 20. The curable base polymer is selected from the group consisting of urethane acrylates, ester acrylates, silicone acrylates, epoxy acrylates, silicones, acrylates, urethanes, and epoxies. The base polymer resin may be an oligomer or prepolymer having a functional group. The base polymer may be crosslinkable under conventional curing conditions including, but not limited to, heat, radiation such as Ultraviolet (UV) light, moisture, and other suitable conditions. The base polymer may be liquid or pasty. The viscosity may be in the range of 1-100,000 cps. In some embodiments, functional acrylates such as urethane acrylates are preferred. In other embodiments, the base polymer resin may be an epoxy, a silicone, and a urethane. In some embodiments, formulations for flexibilized or flexible epoxy resins are preferred over rigid epoxy resins. Such polymeric resins are readily available from specialty chemical suppliers.

Example (b):

the following examples are intended only to illustrate embodiments according to the present invention and as such should not be construed as limiting the scope of the claims.

The following examples include a thermoplastic filler (powder 1) and a formulation comprising a base polymer resin. Powder 1 was made from 14mil thickPoly (vinyl chloride) (PVC) film mechanically pulverized fine powder. An example of a PVC film providing a suitable powder 1 is from GermanyPentaplast GmbH&Kg is obtained under the trade name Pentacard PVC (vinyl) film, which is PVC modified with a copolymer of vinyl chloride and vinyl acetate. The powder is sieved using a 1.0-0.05mm sieve before use. The formulation containing the base polymer resin was from Dymax Corporation, CT, Torrington. Examples of such formulations comprising a base polymer resin include Multi-9-20676, 9-20557 and 6-625-SV 01. Multi-9-20676 is a visible or UV-curable urethane acrylate formulation comprising isobornyl acrylate, urethane methacrylate oligomer, acrylate oligomer, 2- (2-ethoxyethoxy) ethyl acrylate, 2-hydroxyethyl methacrylate, acrylic acid, t-butyl peroxybenzoate, and a photoinitiator. Its viscosity was 400cP and its boiling point was 205 ℃.

Multi-9-20557 is a urethane acrylate or acrylated urethane formulation comprising isobornyl acrylate, urethane methacrylate oligomer, 2- (2-ethoxyethoxy) ethyl acrylate, 2-hydroxyethyl methacrylate, acrylic acid, t-butyl peroxybenzoate, and a photoinitiator. Its viscosity is 2300cP and its boiling point is 120 ℃. Which is UV/visible curable with a second thermal curing characteristic.

Multi-6-625-SV01 is a urethane acrylate or acrylated urethane formulationComprising isobornyl acrylate, urethane methacrylate oligomer, 2-hydroxyethyl methacrylate, acrylic acid, maleic acid, tert-butyl peroxybenzoate, photoinitiator and epoxy resin(s) ((R))<1%). Its viscosity was 10,000 cP. Which is UV/visible curable with a second thermal curing characteristic.

Exemplary formulation examples 1-4 are shown in table 1.

TABLE 1

Each of the formulations was prepared by mixing powder 1 with the corresponding base polymer in the ratios specified in table 1. The formulation is degassed and then placed in a syringe for easy metered dispensing prior to use. These formulations (examples 1-4) were used in the preparation of a core layer for an information carrying card and the tests were successful. The structure of the core layer of an information bearing card and its method of manufacture are described in detail below. An embedded layer of a Printed Circuit Board (PCB) was partially or completely disposed in at least one hole of a first thermoplastic layer, which in these experiments was PVC or PVC modified with a Vinyl Chloride (VC) copolymer. One of these crosslinkable polymer compositions (examples 1-4) was dispensed on an embedding layer and then cured at an elevated temperature of less than 150 ℃ at a pressure of less than 2 MPa. The resulting core layer is used in the manufacture of information bearing cards. In some experiments, the information bearing card was a power smart card.

By way of comparison, the base polymer, multil-9-20676 or 9-20557, but the tests were not successful in preparing information bearing cards.

Exemplary formulation examples 5-6 are shown in table 1. Formulation examples 5-6 were prepared using the same method as described. These formulations (examples 5-6) were used in the preparation of a core layer for an information carrying card and the tests were successful.

TABLE 2

2. Core layer for information carrying card

In some embodiments, the core layer for the information bearing card comprises a crosslinked polymer composition. The crosslinking composition is prepared by curing the crosslinkable polymer composition described above. The crosslinked polymer composition comprises a base polymer resin and a particulate thermoplastic filler. The base polymer resin is urethane acrylate, ester acrylate, silicone acrylate, epoxy acrylate, silicone, urethane, epoxy resin, or the like. The particulate thermoplastic filler may be a polyolefin, polyvinyl chloride (PVC), a compound or blend comprising PVC or a copolymer of vinyl chloride, a copolymer of vinyl chloride with at least another monomer or a polyester such as polyethylene terephthalate (PET). In some embodiments, the at least another monomer in the vinyl chloride copolymer may be a vinyl ester, vinyl acetate, or vinyl ether. An example of such a thermoplastic filler is PVC modified with a copolymer of vinyl chloride and at least another monomer.

The core layer for an information bearing card further comprises an embedded layer having at least one active or passive electronic component, such as an Integrated Circuit (IC). In some embodiments, the embedding layer may comprise a sheet of metal, ceramic, or plastic. In some embodiments, the crosslinked polymer composition is in direct contact with the at least one IC on the intercalation layer. The core layer for an information bearing card further comprises at least one thermoplastic layer having at least one hole. An inlay layer with at least one integrated IC is partially or completely disposed within the hole on the at least one thermoplastic layer. Disposing the crosslinked polymer composition in a hole on the at least one thermoplastic layer in direct contact with the at least one active or passive electronic component, such as an Integrated Circuit (IC), on the embedding layer. The present invention also provides a method for forming a core layer of an information bearing card.

Referring to fig. 1 and 2, the first separator 2 may be under the trade name ofA polytetrafluoroethylene sheet, any other fluoropolymer, silicone, fluoropolymer, or silicone-coated membrane. The second separation film 4 is disposed over the first separation film 2. The second separation film 4 may be formed of the same material and method as the first separation film 2. In some embodiments, a breathable barrier film is preferred. An example of a breathable barrier film as the second barrier film 4 is silicone-coated paper. For example, the second separator 4 may be a silicone-coated unbleached parchment paper available under the trade name "If you care" from Regency Wraps company.

Referring to fig. 3, the first thermoplastic layer 6 has at least one hole 7, which is provided on the separation films 2 and 4. Examples of materials suitable for use in forming first thermoplastic layer 6 include polyvinyl chloride (PVC), copolymers of vinyl chloride, polyolefins, polycarbonates, polyesters, polyamides, Acrylonitrile Butadiene Styrene (ABS), and the like. The first thermoplastic layer 6 may be PVC, a copolymer of vinyl chloride and another monomer such as vinyl ether, vinyl ester or vinyl acetate, or PVC modified with a vinyl chloride copolymer. Examples of PVC membranes suitable for use in the present invention are available from suppliers such as Klockner pentaprolast, inc. Examples of the vinyl chloride copolymer resin are sold under the trade name Dow Chemical CompanyAnd BASF by Ludwigshafen, Germany under the trade nameAnd (4) obtaining.Is a copolymer of vinyl chloride and vinyl acetate. The grades include YNS-3, VYHH and VYHD.Is a copolymer of vinyl chloride and vinyl isobutyl ether. The grades include MP25, MP 35, MP45, and MP 60. All of these polymer resins can be supplied as fine powders. Powders of these copolymers can be added to modify the PVC resin used for the film. The first thermoplastic layer 6 having at least one hole may be formed by die cutting one or more thermoplastic films and then laminating and heating the one or more thermoplastic films. For example, a 0.35 micron thick film is die cut to have at least one hole and then laminated to a 0.025 micron thick film to form the first thermoplastic layer 6 having at least one hole.

Referring to fig. 4, the embedding layer 8 may be partially or completely disposed within the holes 7 of the first thermoplastic layer 6. The embedding layer 8 comprises at least one Printed Circuit Board (PCB) having at least one active or passive electronic component 10 embedded or surface mounted on a carrier film 12. Examples of carrier film 12 include, but are not limited to, polyimide, polyester such as PET, glass filled epoxy board such as FR-4. A Printed Circuit Board (PCB) with all components is abbreviated PCBa. For simplicity, references to PCBs in the present invention should be understood to include PCBs comprising PCBa. Examples of electronic components 10 embedded within layer 8 include, but are not limited to, active or passive electronic components, such as Integrated Circuits (ICs), batteries for "power cards", antennas, and functional components such as Light Emitting Diodes (LEDs). The electronic components are connected to each other by wires or traces 14. The carrier film 12 may be a polymer based dielectric material. In some embodiments, the embedding layer 8 may comprise a sheet of metal, ceramic, or plastic. For example, a piece of metal or ceramic may comprise platinum, copper, tungsten, metal powder, ceramic, or ceramic powder. The embedding layer 8 may have any size related to the size of the holes in the first thermoplastic layer 6. The embedding layer 8 may be partially or completely arranged in the hole. In some embodiments, the size of the pores in the first thermoplastic layer 6 is greater than the size of the embedding layer 8. The embedding layer 8 may be completely arranged in said hole. In some embodiments, the size of the hole in the first thermoplastic layer 6 is the same as or slightly larger than the size of the embedded layer 6 of the PCB. The shape of the holes generally matches the shape of the embedding layer 8. In some embodiments, the size of the at least one hole in the first thermoplastic layer 6 is smaller than the size of the embedding layer 8. The at least one hole is the same size or slightly larger than a portion of the embedding layer 8 of the PCB. For example, a hole may be shaped and sized to match an electronic assembly 10. Examples of electronic components 10 include, but are not limited to, a battery or active or passive electronic components, such as an Integrated Circuit (IC) embedded in layer 8.

Referring to fig. 5, the resulting layer after the cross-linkable polymer composition 16 is dispensed on the embedding layer in the hole. The crosslinkable polymer composition 16 comprises a curable base polymer resin in liquid or paste form and a particulate thermoplastic filler. The base polymer resin may be a urethane acrylate, silicone acrylate, epoxy acrylate, urethane, epoxy, or silicone. The particulate thermoplastic filler may be a polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride with at least one other monomer or a polyester such as polyethylene terephthalate (PET). In some embodiments, the at least another monomer in the vinyl chloride copolymer filler may be a vinyl ester, vinyl acetate, or vinyl ether. The particulate thermoplastic filler may be a compound or blend comprising a thermoplastic such as PVC or a PVC copolymer. An example of such a thermoplastic filler is PVC modified with a copolymer of vinyl chloride and at least another monomer. The crosslinkable polymer composition 16 may further comprise at least one curing agent. The crosslinkable polymer composition 16 becomes a solid state crosslinked composition upon curing. Preferably, in some embodiments, the crosslinked composition is more flexible than the first thermoplastic layer 6.

The cross-linkable polymer composition 16 contained in the syringe may be dispensed using standard dispensing equipment or equipment for adhesives, encapsulants, sealants, and potting compounds. The amount of crosslinkable composition 16 to be dispensed can be calculated and controlled based on the volume of the pores and the embedded layer 8.

Referring to fig. 6, the resulting layer after the third and fourth separation films are placed on the layer shown in fig. 5 forms a sandwich structure. The third and fourth separation films may be any kind of separation film, and in some embodiments, the second and third separation films 4 are formed of the same material. The first and fourth separation films 2 may also be formed of the same material. For example, in some embodiments, the second and third release films 2 may be formed from breathable silicone-coated paper. The first and fourth separation films 4 are typically formed of a fluoropolymer, such as is commonly known by the trade nameProvided is polytetrafluoroethylene. The resulting sandwich or layered structure of fig. 6 is placed under pressure and heated to form a core layer for an information bearing card, as illustrated by the exemplary method of fig. 7.

Referring to fig. 7, a method 70 of forming a core layer of an information bearing card, according to some embodiments, includes the following steps. At step 22, a second separator 4 is placed over the first separator 2. At step 24, a first thermoplastic layer 6 having at least one hole is formed. In some embodiments, the first thermoplastic layer 6 is formed by the step of die cutting one or more thermoplastic films; and then heat laminated with one or more uncut thermoplastic films. At step 26, a first thermoplastic layer 6 having at least one hole is placed over the first and second release films (4 and 6). At step 28, an embedding layer 8 having a printed wiring board (PCB) is placed at least partially in the at least one hole on the first thermoplastic layer 6. In some embodiments, the size of the at least one hole in the first thermoplastic layer 6 is larger than the size of the embedded layer 8 of the PCB. In some embodiments, the size of the at least one hole in the first thermoplastic layer 6 is substantially the same as the size of the embedded layer 8 of the PCB. In other embodiments, the size of the at least one hole on the first thermoplastic layer 6 is substantially the same as the size of a portion of the embedded layer 8 of the PCB.

After step 28, the method optionally comprises a step 30 of "fixing" the inlay layer 8 on the first thermoplastic layer 6 using a quick-drying glue. A plurality of holes are formed in the embedding layer by cutting portions of carrier film 12 without any electronic components 10 and connectors 14. Step 28 is followed by applying a quick-drying glue to the wells. Examples of quick-drying glues include, but are not limited to, cyanoacrylates. In some embodiments, the embedding layer 8 is secured to the first thermoplastic layer 6 in as little as a few seconds.

At step 32 (fig. 7), a cross-linkable polymer composition 16 is dispensed on the embedding layer 8 and within the holes. The crosslinkable polymer composition may be in direct contact with the electronic component 10, such as an Integrated Circuit (IC), including active or passive electronic components. The amount of the crosslinkable polymer composition is predetermined and controlled. Any excess material beyond the top surface of the first thermoplastic layer 6 may be removed. In some embodiments, the curable base polymer resin in the crosslinkable polymer composition is a urethane acrylate and the particulate thermoplastic filler in the crosslinkable polymer composition is PVC, a compound or blend comprising PVC or a copolymer of vinyl chloride and at least another monomer such as a vinyl ester or vinyl ether.

At step 34, a third and fourth separator film 4 are placed on the layered structure to form a sandwich structure (fig. 6). And placing a fourth isolating film after the third isolating film is placed. In some embodiments, the third separator is formed of the same material as the fourth separator 4, which is preferably a breathable separator. The fourth separation film may be formed of the same material as the first separation film 2. In some embodiments, the first and fourth release films are polytetrafluoroethylene (trade name)) A sheet. In the step of36, the layered structure described above is placed under pressure, for example a pressure of less than about 2 MPa.

At step 38, the layered structure is heated under pressure. Suitable temperatures are those high enough to partially or completely cure the crosslinkable polymer composition 16 or to thermally laminate the first thermoplastic film 6, or both. After heat treatment, the crosslinkable polymer composition 16 forms a solid. The crosslinked polymer composition has good adhesion to the first thermoplastic layer 6 and the embedding layer 8 including the electronic component 10 and the carrier film 12. In some embodiments, the crosslinked composition is more flexible than the first thermoplastic film 6. In some embodiments, the temperature is from 65 to 232 ℃. In some embodiments, the temperature is less than 150 ℃.

The method 70 may further comprise cooling the layer structure and peeling the first, second, third, and fourth release films. The method 70 may further comprise the step of curing the crosslinkable polymer composition 16 with visible light, UV, or other radiation curing. It may also include a step of curing via the introduction of moisture or other chemical reaction to facilitate curing. Following the method 70, the crosslinkable polymer composition 16 is cured to produce a solid. After the release film is peeled off, a core layer for the information carrying card is formed. The core layer comprises a first thermoplastic layer 6, an inlay layer 8 and a crosslinked polymer composition 16. The exemplary core layer for an information bearing card from method 70 is shown in fig. 8-14.

Referring to fig. 8, an exemplary core layer 80 of an information bearing card is fabricated according to the structure depicted in fig. 1-6 and the steps in fig. 7. More specifically, the exemplary core layer 80 comprises a first thermoplastic layer 6, an inlay layer 8, and a crosslinked polymer composition 16. The first thermoplastic layer 6 is polyvinyl chloride (PVC), copolymers of vinyl chloride, polyolefins, polycarbonates, polyesters, polyamides, Acrylonitrile Butadiene Styrene (ABS), and the like. The crosslinked polymer composition 16 is formed from the crosslinkable composition described in the related section above. The embedding layer 8 contains electronic components 10, such as at least one Printed Circuit Board (PCB), a carrier film 12 and connectors 14. The electronic components, such as the battery and the active or passive electronic component 10, are connected to the connection 14. Electronic assembly 10 is embedded on carrier film 14. The crosslinked polymer composition fills the remaining space within the cavities and pores on the first thermoplastic layer 6 and the embedding layer 8. In some embodiments, the crosslinked polymer composition directly contacts the exterior surface of electronic assembly 10. Referring again to fig. 4, the embedding layer 8 may have any size related to the size of the holes in the first thermoplastic layer 6. The embedding layer 8 may be partially or completely arranged in the hole.

Referring to fig. 9-14, the different structures of the core layer for the information bearing card can also be utilized with good effect. Referring to fig. 9, an exemplary core 82 of an information bearing card includes a fully open hole for an inlay. In fig. 9 and 10, the size of the holes in the first thermoplastic layer 6 is larger than the size of the embedding layer 8. In some embodiments, the aperture is close to, but slightly smaller than, the size of the information bearing card. The embedding layer 8 is completely arranged in said hole. The shape of the holes may be different from the shape of the embedding layer 8.

Referring to fig. 11 and 12, an exemplary core layer 86 of an information bearing card includes an open inlay hole that approximates the size of inlay layer 8. In fig. 11 and 12, the size of the holes in the first thermoplastic layer 6 is the same as or slightly larger than the size of the embedding layer 8. The shape of the hole matches the shape of the embedding layer 8. In this configuration, the embedding layer 8 may be disposed entirely within the holes in the first thermoplastic layer 6. The gap between the edges of the first thermoplastic layer 6 and the embedding layer 8 may be smaller than the gap shown in fig. 9 and 10.

Referring to fig. 13 and 14, an exemplary core 90 of an information bearing card includes a window hole partially for an inlay. In fig. 13 and 14, the size of the at least one hole in the first thermoplastic layer 6 is smaller than the size of the embedding layer 8. The size of the at least one hole is the same as or slightly larger than a portion of the embedding layer 8. In some embodiments, a portion of the embedding layer is cut away to form one or more holes so that the electronic component 10 can be mounted in one of the holes. Examples of such electronic components 10 include, but are not limited to, a battery or a chip embedded in the layer 8. In some embodiments, the electronic component 10 embedded in layer 8 is inserted from one side of the first thermoplastic layer 6. During the manufacturing process, a crosslinkable composition for crosslinking the polymer composition 16 may be applied from the other side of the first thermoplastic layer 6.

Referring to fig. 15-19, an exemplary method 120 for securing an exemplary inlay layer 8 to a thermoplastic layer 6 using an instant adhesive, according to some embodiments, includes the following steps listed in fig. 19. An embedding layer is first provided. Referring to fig. 15, an exemplary embedding layer 8 is used as a model for demonstration purposes. The electronic components used in the core layer of the information bearing card are not limited to those shown in fig. 15. The embedding layer 8 comprises a carrier film 12, a battery 102, a chip 104 with at least one Integrated Circuit (IC), a metal structure 106, metal connection lines 108 and functional components such as LEDs 109. In some embodiments, the carrier film 12 is a polymer based dielectric material. This embedded layer is suitable for "power cards".

At step 122 (fig. 19), a plurality of holes are formed by cutting the embedding layer 8 through portions of the carrier film 12 devoid of any electronic components and connecting wires. Referring to fig. 16, after cutting, exemplary embedding layer 8 includes a plurality of holes in its carrier layer 12. The apertures may be of any shape and size. Examples of the shape of the aperture include, but are not limited to, circular, rectangular, square, or any other shape.

In step 124, the resulting inlay layer 8 with holes is placed partially or completely into the holes of the first thermoplastic layer 6. The exemplary embedding layer 8 may have any size related to the size of the holes in the first thermoplastic layer 6. The exemplary embedding layer 8 may be partially or completely disposed in the hole. Referring to fig. 17, an exemplary embedding layer 8 having a plurality of holes is disposed over the first thermoplastic layer 6 having open embedding holes. The exemplary first thermoplastic layer has holes that are larger than the embedding layer so that the embedding layer is completely disposed in the holes on the first thermoplastic layer 6.

In step 126 of fig. 19, a small amount of quick-dry glue is applied to each well 112. Referring to fig. 18, according to some embodiments, the exemplary embedding layer 8 is secured to the thermoplastic layer 6 using a quick-drying adhesive 115 to form a resulting structure 116. Examples of the quick drying glue 115 include, but are not limited to, cyanoacrylate. In some embodiments, the quick drying glue 115 cures quickly within a few seconds. This curing method used in the present invention should be understood to include any method of fixing the embedding layer 8 to said first thermoplastic layer 6 using any other adhesive.

3. Information bearing card

In some embodiments, the information bearing card comprises a core layer as described above and a crosslinked polymer composition. In some embodiments, the information bearing card further comprises at least one printable thermoplastic film laminated to a surface of the at least one thermoplastic layer and the crosslinked polymer composition. The information bearing card further comprises at least one transparent film laminated to a surface of the printable thermoplastic film. In some embodiments, the information bearing card comprises at least one battery connected to at least one Integrated Circuit (IC) on an embedded layer in the core layer. In some information bearing cards, the information bearing card may also comprise a sheet of metal, ceramic, or plastic in the core layer.

In some embodiments, the present invention also provides methods for manufacturing information bearing cards. In the present disclosure, the method includes forming a core layer of the information bearing card. The method may further comprise thermally laminating a printable thermoplastic film and a transparent thermoplastic film on each side of the core layer of information (carrier card).

Referring to fig. 20-25, an exemplary method 150 of manufacturing an exemplary information bearing card includes the following steps as shown in fig. 25. The layer structure at various steps of exemplary method 150 is illustrated in fig. 20-24. Referring to fig. 20, a transparent film 132 is first provided. The transparent film 132 may be used as an outer layer of an information-bearing card. Examples of transparent film 132 include, but are not limited to, PVC, modified PVC, and PET. In step 152 of fig. 25, referring to the structure shown in fig. 21, a printable thermoplastic film layer 134 is disposed on the transparent film 132. The printable thermoplastic film 134 is the image receiving layer. Words or images may be printed onto the printable thermoplastic film 134 prior to or during the method of making the information card. In some embodiments, the film is opaque and contains some pigment, such as white pigment.

In step 154 of fig. 25, core layer 80 is disposed over the printable thermoplastic layer 134 and transparent film 132. An example of the resulting layer structure is shown in fig. 22. Referring again to fig. 8, in some embodiments, an exemplary core layer 80 comprises a first thermoplastic layer 6, an inlay layer 8, and a crosslinked polymer composition 16. The embedding layer 8 contains electronic components 10, such as at least one Printed Circuit Board (PCB), a carrier film 12 and connectors 14. The electronic components, such as the battery and the active or passive electronic component 10, are connected to the connection 14. Electronic assembly 10 is embedded on carrier film 14. The crosslinked polymer composition 16 fills the remaining space within the cavities and pores on the first thermoplastic layer 6 and the embedded layer. In some embodiments, the crosslinked polymer composition 16 directly contacts the exterior surface of the electronic component 10.

At step 156 (fig. 25), a second printable thermoplastic layer 134 is disposed over the layered structure of fig. 22, followed by a second transparent film 132. Exemplary resulting layer structures are shown in fig. 23 and 24. In some embodiments, at least one barrier film is used on each side of the layer structure of fig. 24. Referring to fig. 1 and 2, examples of a separator include a polytetrafluoroethylene sheet, any other fluoropolymer, silicone, fluoropolymer, or silicone-coated membrane. In some embodiments, a breathable barrier film is used.

At step 158 (fig. 25), the exemplary layer structure after step 156 is laminated under pressure at an elevated temperature. The layered structure after step 156 is pressed under pressure. In some embodiments, the pressure is less than 2 MPa. The layered sandwich structure is then heated under pressure at an elevated temperature. A suitable temperature is high enough that all films are laminated with good adhesion. In some embodiments, the temperature is from 65 to 232 ℃. In some embodiments, the temperature is less than 150 ℃. The information bearing cards may have different sizes. In some embodiments, the information bearing card may have a size in accordance with the ISO/IEC7810 standard. For example, the type ID-1 smart card used for most bank cards and ID cards has a size of 85.6x 53.98 mm.

In some embodiments, exemplary method 150 comprises a method such as a surface treatment to improve adhesion between two layers. Examples of surface treatments include, but are not limited to, plasma treatment or corona treatment prior to thermal lamination at step 158.

According to some embodiments, exemplary methods 70 and 150 may be used to produce a plurality of information bearing cards on a sheet. Referring to fig. 26, in this method, the first thermoplastic layer 6 comprises a plurality of holes, wherein the embedding layer 8 is partially or completely disposed in each hole. Referring to fig. 26, like components are designated by like reference numerals and the structural description provided above is also described above.

An exemplary core structure 180 comprising a plurality of embedded layers 8 may be fabricated using the method 70 as described above. In some embodiments, each inlay layer 8 is secured to the first thermoplastic layer 6 with a quick-drying adhesive 115 using an exemplary method 120 (fig. 19). Each inlay layer 8 is cut with a plurality of holes before the quick drying glue 115 is applied. Referring again to fig. 8, in some embodiments, the exemplary core layer 80 further comprises a crosslinked polymer composition 16. The embedding layer 8 contains electronic components 10, such as at least one Printed Circuit Board (PCB), a carrier film 12 and connectors 14. The crosslinked polymer composition 16 fills the remaining space within the cavities and pores on the first thermoplastic layer 6 and the embedded layer. In some embodiments, the crosslinked polymer composition 16 directly contacts the exterior surface of the electronic component 10.

Referring again to fig. 5, a cross-linkable polymer composition 16 is disposed on the embedding layer in each hole to form a cross-linked polymer composition. The crosslinkable polymer composition 16 comprises a crosslinkable polymer resin and a thermoplastic filler. Exemplary crosslinkable compositions comprise a base polymer resin and a particulate thermoplastic filler. The base polymer resin is urethane acrylate, ester acrylate, silicone acrylate, epoxy acrylate, acrylates including methacrylates, silicone, urethane, epoxy resin, or the like. The particulate thermoplastic filler may be a polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride with at least one other monomer or a polyester such as polyethylene terephthalate (PET). The particulate thermoplastic filler may be a compound or blend comprising a thermoplastic polymer such as PVC or a vinyl chloride copolymer. For example, an exemplary composition may comprise a urethane acrylate as the base polymer resin and a PVC filler modified with a copolymer of vinyl chloride and at least another monomer such as a vinyl ester or vinyl ether. The crosslinkable composition 16 cures to form a crosslinked composition. Examples of curing methods include, but are not limited to, thermal curing and radiation curing. In some embodiments, thermal curing occurs during the thermal lamination process.

In some embodiments, exemplary core layer structure 180 is further laminated with at least one printable thermoplastic layer and a transparent film. The resulting laminate is then cut to form a plurality of information bearing cards. In some embodiments, the pressure is preferably less than 2 MPa. In the lamination process, the temperature is in some embodiments 65 to 232 ℃ and in some embodiments preferably less than 150 ℃.

In the present disclosure, a rectangular information-bearing card or smart card is used for illustration only. The disclosed structures and methods of manufacture are also applicable to any information bearing card or any shape or size part. Examples of such parts include, but are not limited to, rectangular sheets, circular sheets, bars, rods, and rings. Including, but not limited to, any size according to ISO/IEC7810 standards.

Although the subject matter has been described with reference to exemplary embodiments, it is not limited thereto. Rather, the appended claims should be construed broadly, to include other variants and embodiments, which may be made by those skilled in the art.

Claims (25)

1. A method for forming a core layer of an information bearing card, comprising:

forming a first thermoplastic layer having at least one hole, each hole having a continuous surface profile defined by and interior to the first thermoplastic layer, the first thermoplastic layer comprising at least one thermoplastic material;

disposing an inlay layer of a Printed Circuit Board (PCB) partially or completely in the at least one hole, the inlay layer of the PCB comprising at least one integrated circuit, at least one wire, and a carrier film; and

dispensing a crosslinkable polymer composition on said embedding layer in said at least one hole and in direct contact with said embedding layer to form a core layer of an information-bearing card, said crosslinkable polymer composition comprising:

a liquid or paste-like curable base polymer resin selected from the group consisting of urethane acrylates, silicone acrylates, epoxy acrylates, methacrylates, silicones, urethanes, and epoxy resins; and

a particulate thermoplastic filler.

2. The method for forming a core layer of an information bearing card of claim 1, further comprising:

providing a first isolation film;

placing a second isolation film over the first isolation film;

and placing the first thermoplastic layer having at least one hole on the second release film prior to dispensing the embedding layer into the at least one hole.

3. The method for forming a core layer of an information bearing card of claim 2, further comprising:

after dispensing the crosslinkable polymer composition into the at least one hole, placing a third release film on the embedding layer; and

a fourth isolation film is placed over the third isolation film and a sandwich structure is formed.

4. A method for forming a core layer for an information bearing card as recited in claim 3, wherein said first and fourth release films are the same and said second and third release films are the same.

5. A method for forming a core layer for an information bearing card according to claim 3 wherein said second and said third release films are breathable release films.

6. A method for forming a core layer for an information bearing card as recited in claim 3, further comprising: compressing the sandwich structure under pressure.

7. A method for forming a core layer for an information bearing card as claimed in claim 6 wherein said pressure is less than 2 MPa.

8. The method for forming a core layer of an information bearing card of claim 6, further comprising:

heating the sandwich structure under pressure at an elevated temperature;

cooling the sandwich structure; and

peeling the first, second, third and fourth release films.

9. The method for forming the core layer of an information bearing card of claim 8 wherein said elevated temperature is less than 150 ℃.

10. The method for forming a core layer of an information bearing card of claim 1, further comprising:

forming a plurality of holes by cutting portions of the carrier film that do not damage any of the at least one conductive line and the at least one integrated circuit on the embedding layer prior to dispensing the embedding layer of the PCB into the at least one hole on the first thermoplastic layer.

11. The method for forming a core layer of an information bearing card of claim 10, further comprising:

fixing the embedding layer on the first thermoplastic layer by applying an instant glue to a plurality of pores of the embedding layer, followed by dispensing the crosslinkable polymer composition onto the embedding layer.

12. A method for forming a core layer of an information bearing card according to claim 11 wherein said quick drying glue comprises cyanoacrylate.

13. The method for forming a core layer of an information bearing card of claim 1, wherein forming the first thermoplastic layer having at least one hole comprises:

die cutting one or more thermoplastic films; and

laminating the one or more thermoplastic films under heated conditions.

14. The method for forming a core layer of an information bearing card of claim 1 wherein the size of said at least one hole in said first thermoplastic layer is greater than the embedded layer size of a PCB.

15. The method for forming the core layer of an information bearing card of claim 1 wherein the size of the at least one hole in the first thermoplastic layer is substantially the same as the size of the embedded layer of the PCB.

16. The method for forming a core layer of an information bearing card of claim 1 wherein the size of said at least one hole in said first thermoplastic layer is substantially the same as the size of a portion of the embedding layer of the PCB.

17. The method for forming a core layer of an information bearing card according to claim 3, wherein said first thermoplastic layer having at least one hole comprises a thermoplastic material selected from the group consisting of polyvinyl chloride, vinyl chloride copolymers, polyolefins, polycarbonates, polyesters, polyamides, and Acrylonitrile Butadiene Styrene (ABS).

18. The method for forming a core layer of an information bearing card of claim 3 wherein said curable base polymer in said crosslinkable polymer composition is a urethane acrylate.

19. A method for forming a core layer of an information carrying card according to claim 3 wherein the particulate thermoplastic filler in the cross-linkable polymer composition comprises PVC or a copolymer of vinyl chloride and at least another monomer.

20. The process for forming a core layer of an information bearing card according to claim 19 wherein said particulate thermoplastic filler in said crosslinkable polymeric composition comprises a copolymer of vinyl chloride and at least another monomer selected from the group consisting of vinyl esters, vinyl acetate, and vinyl ethers.

21. A method for forming a core layer of an information carrying card according to claim 20 wherein the particulate thermoplastic filler in the cross-linkable polymer composition is PVC modified with a copolymer of vinyl chloride and at least another monomer selected from the group consisting of vinyl esters, vinyl acetate and vinyl ethers.

22. The method for forming a core layer of an information bearing card of claim 6, further comprising curing the crosslinkable polymer under UV light.

23. A method for manufacturing an information bearing card comprising forming a core layer of an information bearing card according to claim 1.

24. A method for making an information bearing card according to claim 23, further comprising laminating a printable thermoplastic film on each side of a core layer of said information bearing card.

25. A method for making an information bearing card according to claim 24, further comprising laminating a transparent thermoplastic film on said printable thermoplastic film on each side of a core layer of said information bearing card.