HK1208110B - Imaging device having efficient heat transfer, and associated systems - Google Patents
Imaging device having efficient heat transfer, and associated systems Download PDFInfo
- Publication number
- HK1208110B HK1208110B HK15108739.2A HK15108739A HK1208110B HK 1208110 B HK1208110 B HK 1208110B HK 15108739 A HK15108739 A HK 15108739A HK 1208110 B HK1208110 B HK 1208110B
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- Hong Kong
- Prior art keywords
- imaging
- heat sink
- memory device
- housing
- chip
- Prior art date
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Abstract
An imaging device provides efficient heat transfer by orienting components of the imaging device such that heat is transferred out of the imaging device instead of within the imaging device assembly. Heat is transferred out of the imaging device assembly through a printed circuit board to which the assembly housing is mounted thereon and/or through the housing itself.
Description
Technical Field
The present invention relates to an imaging sensor module, and more particularly to a heat transfer system and method for an image sensor module having multiple high power devices.
Background
Imaging systems are becoming more and more advanced. These systems are used in a wider variety of applications than ever before. For example, imaging systems are being used in automobiles, smart phones, stand-alone cameras, and numerous other applications. Advances in imaging system technology have resulted in modules that require much more power and produce large amounts of image data.
Fig. 1 shows a prior art imaging module 100. Imaging module 100 includes a housing 102, at least one lens 104, and an image sensor 106 in a stacked configuration, a memory device 108, and an application circuit 110. Each of the memory module 108 and the application circuit 110 is shown with a metal heat sink 112 disposed on top of the assembly. Each of the image sensor 106, the memory module 108, and the application circuit 110 is coupled to a respective printed circuit board 114, wherein the printed circuit boards 114 are coupled to each other via the connectors 116.
As shown in fig. 1, heat generated by any of the image sensor 106, the memory device 108, and/or the application circuitry 110 is dissipated directly within the housing 102 (i.e., within the module 100 components). This heat is concentrated within the housing 102 and results in a significant reduction in performance of the imaging module 100.
There is a need to reduce the amount of heat within the imaging module assembly, thereby substantially increasing the performance of the imaging module.
Disclosure of Invention
An image forming apparatus with high efficiency heat transfer includes a housing defining a space therein; an image sensor disposed in the space and oriented in a first direction for generating image data from light imaged on the image sensor through one or more lenses; the memory device is arranged in the space and used for storing the image data; and an imaging circuit disposed within the space for manipulating the image data, the imaging circuit being oriented in a second direction opposite the first direction such that heat is transferred out of the space without being concentrated within the imaging device assembly.
Drawings
Figure 1 shows a prior art imaging module with inefficient heat transfer.
FIG. 2 depicts an exemplary imaging module having a plurality of high power devices and utilizing efficient heat transfer in one embodiment.
FIG. 3 depicts an imaging module with high efficiency heat transfer in another embodiment.
FIG. 4 depicts an imaging module with high efficiency heat transfer in another embodiment.
FIG. 5 depicts an imaging module with high efficiency heat transfer in another embodiment.
FIG. 6 depicts an imaging module with high efficiency heat transfer in another embodiment.
FIG. 7 depicts an imaging module with high efficiency heat transfer in another embodiment.
FIG. 8 depicts an imaging module with high efficiency heat transfer in another embodiment.
Description of reference numerals:
200. 300, 400, 500, 600, 700, 800: imaging module
202. 802: outer casing
204: lens
206: image sensor
208. 508, 608: memory device
210. 310, 510, 610: imaging circuit
212. 512, 612: heat sink
214(1) - (4), 514(1) - (2): printed circuit board
216: connecting piece
218. 818: space(s)
220. 520, the method comprises the following steps: lower surface
260: y axis
262: x axis
322: imaging circuit chip
324: imaging circuit radiating fin
622: imaging circuit chip
624: imaging circuit radiating fin
626: flip chip configuration chip
628: a heat sink for a memory device.
Detailed Description
The following description details a new invention for substantially reducing heat in an imaging module, and more particularly, for reducing heat in an imaging module having a plurality of high power devices.
Fig. 2 depicts an exemplary imaging module 200 having a plurality of high power devices and employing high efficiency heat transfer in one embodiment. The imaging module 200 includes a housing 202, at least one imaging lens 204, an image sensor 206, a memory device 208, and an imaging circuit 210. The image sensor 206, the memory device 208, and the imaging circuitry 210 are stacked on respective Printed Circuit Boards (PCBs) 214 to reduce the space required by the housing 202, thereby enabling a smaller imaging module. Each PCB214 may be connected to one or more other PCBs 214 by connectors 216.
Housing 202 protects the internal components disposed within interior space 218 of imaging module 200 from other components. The housing 202 is shown not completely surrounding the PCB214 (4). Thus, imaging module 200 may be directly attached to any external PCB (i.e., an original manufacturer (OEM) directly purchases imaging module 200 and attaches imaging module 200 to its own PCB 214) within which space 218 is formed. The space 218 is defined by the inner surface of the housing 202 and the upper (or inner) surface of the PCB214 (4). However, those skilled in the art will appreciate that the housing may completely enclose the components of imaging module 202 and separately form a sealed region 218 therein (as described below with respect to FIG. 8).
The image sensor 206 may be a Charge Coupled Device (CCD), Complementary Metal Oxide Semiconductor (CMOS) device, or any other type of sensor for generating image data. The image sensor 206 generates image data from light imaged on the image sensor through one or more lenses 204. It should be understood that although fig. 2 shows 3 lenses 204, the scope of the present invention is not so limited. There may be more or fewer lenses 204 without departing from the scope of the invention.
Memory device 208 may be a non-transitory memory such as RAM, DRAM, semiconductor memory, or any other memory device known in the art. Memory device 208 is shown without a heat sink on top of it. However, it should be understood that the memory device 208 may contain heat sinks to dissipate the heat emitted therefrom.
An example of the imaging device 210 may be a flip-chip Application Specific Integrated Circuit (ASIC). As shown in FIG. 1, PCB214(4) includes a heat sink 212 embedded directly within the PCB. The heat sink 212 is disposed on the package of the imaging circuit 210. Thus, a significant amount of heat is not transferred by the imaging circuitry 210 into the space 218 within the housing 202. Instead, heat is transferred out of the lower surface 220 of the PCB214(4) through the PCB214(4) and through the heat sink 212. In other words, heat is distributed out of the housing and not concentrated within the housing, thereby potentially increasing the performance of the imaging module 200 and reducing the likelihood of heat induced failures.
The imaging circuitry 210 is located in an opposite direction from the image sensor 206 and the memory device 208. In other words, the image sensor 206 is mounted on the upper surface of the PCB214 (1); the memory device 208 is mounted on the upper surface of the PCB214 (2) and the imaging circuitry 210 is mounted on the lower surface of the PCB214 (3). It should be understood that "up" and "down" refer to positions in FIG. 2 about the y-axis 260; any horizontal change in direction related to the x-axis 262 in fig. 3. Thus transferring heat from the imaging circuitry 210 out of the imaging module 200.
Fig. 3 depicts an imaging module 300 with high efficiency heat transfer in another embodiment. The imaging module 300 is similar in all respects to the imaging module 200, except for the imaging circuitry. The imaging module 300 instead contains an imaging circuit 310. The imaging circuit 310 includes an imaging circuit chip 322 in a flip chip configuration. An imaging circuitry heat sink 324 is integrated directly into the imaging circuitry 310. Thus, the imaging circuit heat sink 324 is disposed on the imaging circuit chip 322 within the imaging circuit 310. The outer surface of the imaging circuit heat sink 324 is in contact with the PCB214(4) to provide efficient heat transfer through the lower surface 220 of the PCB214(4) through the imaging circuit heat sink 324. The contact may be made directly or through a thermally conductive glue, thermally conductive silicone grease, thermally conductive pad, or other such contact layer.
The imaging circuitry 310 is located in an opposite direction from the image sensor 206 and the memory device 208. In other words, the image sensor 206 is mounted on the upper surface of the PCB214 (1); memory device 208 is mounted on the upper surface of PCB214 (2) and imaging circuitry 310 is mounted on the lower surface of PCB214 (3). It should be understood that "up" and "down" refer to positions in FIG. 3 about the y-axis 260; any horizontal change in direction related to the x-axis 262 in fig. 3. Thus, heat from the imaging circuit 310 is transferred out of the imaging module 300.
FIG. 4 depicts an imaging module 400 with high efficiency heat transfer in another embodiment. Fig. 4 depicts a combination of imaging module 300 and imaging module 200. Accordingly, the imaging module 400 includes a housing 202, at least one lens 204, an image sensor 206, a memory device 208, imaging circuitry 310, a heat sink 212, PCBs 214(1) -214(4), and a connector 216. Within the imager module 400, heat is transferred directly from the imager circuit chip 322 through the heat sink 324 and the heat sink 212 to the PCB214 (4). This configuration enables efficient heat transfer from the imaging circuit chip 322 out of the imaging module 400 without heat concentration in the space 218.
Imaging circuitry 310 is located in an opposite direction from image sensor 206 and memory device 208. In other words, the image sensor 206 is mounted on the upper surface of the PCB214 (1); memory device 208 is mounted on the upper surface of PCB214 (2) and imaging circuitry 310 is mounted on the lower surface of PCB214 (3). It should be understood that "up" and "down" refer to positions in FIG. 4 about the y-axis 260; any horizontal change in direction related to the x-axis 262 in fig. 4. Thus, heat from the imaging circuit 310 is transferred out of the imaging module 400.
FIG. 5 depicts an imaging module 500 with high efficiency heat transfer in another embodiment. The imaging module 500 is similar to that described above with reference to fig. 2-4, and includes a housing 202, at least one lens 204, and an image sensor 206. However, the imaging module 500 includes the memory device 508 (similar to the memory device 208) and the imaging circuitry 510 (similar to the imaging circuitry 210, 310) disposed on a single PCB 514 (1). Each of the memory device 508 and the imaging circuit 510 is a flip chip device. The imaging module 500 further includes a heat sink 512. The package for each of the memory device 508 and the imaging circuitry 510 is in contact with a heat sink 512. The contact may be made directly or through a thermally conductive paste, thermally conductive silicone grease, thermally conductive pad, or other such contact layer. The heat sink 512 may be a single heat sink or separate heat sinks for the memory device 508 and the imaging circuitry 510.
The memory device 508 and the imaging circuitry 510 are located in an opposite direction from the image sensor 206. In other words, the image sensor 206 is mounted on the upper surface of the PCB214 (1); the memory device 508 is mounted on the lower surface of the PCB 514(1), and the imaging circuitry 510 is mounted on the lower surface of the PCB 514(1) proximate to the memory device 508 along the x-axis 262. It should be understood that "up" and "down" refer to positions in FIG. 5 about the y-axis 260; any horizontal change in direction related to the x-axis 262 in fig. 5. Thus, heat from the memory device 508 and the imaging circuitry 510 is transferred out of the imaging module 500.
FIG. 6 depicts an imaging module 600 with high efficiency heat transfer in another embodiment. The imaging module 600 is similar to the imaging module described above with reference to fig. 2 to 5, and includes a housing 202, at least one lens 204, and an image sensor 206. However, the imaging module 600 includes a memory device 608, the memory device 608 including a flip-chip configured chip 626 and a memory device heat sink 628 directly integrated with the chip 626. The outer surface of the heat sink 628 is in contact with the PCB 514(2) to provide efficient heat transfer through the lower surface 520 of the PCB 514(2) through the memory device heat sink 628.
The imager module 600 further comprises an imager circuit 610, wherein the imager circuit 610 comprises an imager circuit chip 622 in a flip-chip configuration and an imager circuit heat sink 624 directly integrated with the imager circuit chip 622. The outer surface of heat sink 628 is in contact with PCB 514(2) to provide efficient heat transfer through lower surface 520 of PCB 514(2) by imaging circuitry heat sink 624.
The memory device 608 and the imaging circuitry 610 are located in an opposite direction from the image sensor 206. In other words, the image sensor 206 is mounted on the upper surface of the PCB214 (1); the memory device 608 is mounted on the lower surface of the PCB 514(1), and the imaging circuitry 610 is mounted on the lower surface of the PCB 514(1) proximate to the memory device 608 along the x-axis 262. It should be understood that "up" and "down" refer to positions in FIG. 6 about the y-axis 260; any horizontal change in direction related to the x-axis 262 in fig. 6. Thus, heat from the memory device 608 and the imaging circuitry 610 is transferred out of the imaging module 600.
Fig. 7 depicts an imaging module 700 with high efficiency heat transfer in another embodiment. Fig. 7 depicts a combination of imaging module 500 and imaging module 600. Accordingly, the imaging module 700 includes a housing 202, at least one lens 204, an image sensor 206, a memory device 608, imaging circuitry 610, a heat sink 512, PCBs 214(1) and 514(2), and a connector 216. Within imager module 700, heat is transferred from imager circuit chip 622 directly to lower surface 520 through imager circuit heat sink 624, directly through heat sink 512, and directly through PCB 514 (2). Thus, within the imager module 700, heat is transferred out of the lower surface 520 directly from the memory device chip 626, directly through the memory device heat sink 628, directly through the heat sink 612, and directly through the PCB 514 (2). This configuration enables efficient heat transfer from the imaging circuit chip 622 and the memory device chip 626 out of the imaging module 700 without heat concentration in the space 218.
The memory device 608 and the imaging circuitry 610 are located in an opposite direction from the image sensor 206. In other words, the image sensor 206 is mounted on the upper surface of the PCB214 (1); the memory device 608 is mounted on the lower surface of the PCB 514(1), and the imaging circuitry 610 is mounted on the lower surface of the PCB 514(1) proximate to the memory device 608 along the x-axis 262. It should be understood that "up" and "down" refer to positions in FIG. 7 about the y-axis 260; any horizontal change in direction related to the x-axis 262 in fig. 7. Thus, heat from the memory device 608 and the imaging circuitry 610 is transferred out of the imaging module 700.
FIG. 8 depicts an imaging module 800 with high efficiency heat transfer in another embodiment. As described above, the housing 202 may completely enclose its internal components. The imaging module 800 includes a housing 802, at least one lens 204, an image sensor 206, a memory device 608, and imaging circuitry 610. The housing 802 completely encloses all internal components of the imaging module 800 within the space 818. The space 818 is defined by the inner surface of the housing 802. Although not shown in fig. 8, electrical connectors may enable one or more of the internal components (i.e., 206, 214, 216, 608, 610) of the imaging module 800 to be externally connected.
The imaging circuitry 608 contacts the housing 802, thereby allowing the housing 802 to function as a heat sink. In other words, the image sensor 206 is mounted on the upper surface of the PCB214 (1); the memory device 608 is mounted on the lower surface of the PCB 514(1), and the imaging circuitry 610 is mounted on the lower surface of the PCB 514(1) proximate to the memory device 608 along the x-axis 262. It should be understood that "up" and "down" refer to positions in FIG. 8 about the y-axis 260; any horizontal change in direction related to the x-axis 262 in fig. 8. In other words, within the imaging module 800, heat is transferred directly from the memory device chip 626, directly through the memory device heat sink 628, directly through the housing 802.
In addition, imaging circuitry 610 is in contact with housing 802, thereby allowing housing 802 to function as a heat sink. In other words, within the imager module 800, heat is transferred directly from the imager circuit chip 622, directly through the imager circuit heat sink 624, and directly through the housing 802.
The memory device 608 and the imaging circuitry 610 are located in an opposite direction from the image sensor 206. Thus, heat from the memory device 608 and the imager circuit 610 is transferred out of the imager module 800 and not into the space 818.
Modifications may be made to the above-described methods and systems without departing from the scope of the invention. It is therefore to be noted that, as noted in the foregoing description or shown in the accompanying drawings, the description is intended to be illustrative, and not restrictive. The purpose of the appended claims is to cover all generic and specific features described herein, as well as all statements of the scope of the invention which, as a matter of language, might be said to fall there between.
Claims (15)
1. An image forming apparatus with high efficiency heat transfer, the image forming apparatus comprising:
a housing forming a space therein;
an image sensor disposed in the space and oriented in a first direction for generating image data from light imaged on the image sensor through one or more lenses;
the memory device is arranged in the space and used for storing the image data; and
an imaging circuit disposed in the space for manipulating the image data,
the imaging circuitry is oriented in a second direction opposite the first direction and is thermally coupled to a heat sink, transferring heat out of the space;
the space is defined by an inner surface of the housing and a printed circuit board on which the housing is mounted; and
the heat sink is embedded in the printed circuit board on which the shell is arranged.
2. The imaging apparatus according to claim 1, characterized in that:
the imaging circuit is a flip-chip imaging circuit having an imaging circuit chip and an imaging circuit heat sink coupled to the imaging circuit chip, an
The imaging circuit heat sink contacts a printed circuit board on which the housing is mounted.
3. The imaging apparatus of claim 2 wherein said imaging circuit heat sink contacts a printed circuit board heat sink embedded in a printed circuit board on which said housing is mounted.
4. The imaging apparatus according to claim 1, characterized in that:
the memory device is oriented in the second direction,
the memory device and the imaging circuit are embedded in the heat sink of the printed circuit board on the housing.
5. The imaging apparatus of claim 4 wherein each of said memory device and said imaging circuitry contacts a separate heat sink embedded in a printed circuit board mounted on said housing.
6. The imaging apparatus according to claim 1, characterized in that:
the memory device is oriented in the second direction,
the memory device is a flip-chip memory device having a memory device chip and a memory device heat sink coupled to the memory device chip,
the imaging circuit is a flip-chip imaging circuit having an imaging circuit chip and an imaging circuit heat sink coupled to the imaging circuit chip, an
The memory device heat sink and the imaging circuit heat sink contact a printed circuit board mounted on the housing.
7. The imaging apparatus of claim 6 wherein said memory device heat sink and said imaging circuitry heat sink contact a printed circuit board heat sink embedded in a printed circuit board mounted on said housing.
8. The imaging apparatus of claim 7 wherein said memory device heat sink and said imaging circuit heat sink contact separate printed circuit board heat sinks embedded in printed circuit boards mounted on said housing.
9. An image forming apparatus with high efficiency heat transfer, the image forming apparatus comprising:
a housing forming a space therein;
an image sensor disposed in the space and oriented in a first direction for generating image data from light imaged on the image sensor through one or more lenses;
the memory device is arranged in the space and used for storing the image data; and
an imaging circuit disposed in the space for manipulating the image data,
the imaging circuitry is oriented in a second direction opposite the first direction, contacting the heat sink, and transferring heat out of the space;
the space is defined entirely by an inner surface of the housing; and
the heat sink is embedded along the inner surface of the housing.
10. The imaging apparatus according to claim 9, characterized in that:
the imaging circuit is a flip-chip imaging circuit having an imaging circuit chip and an imaging circuit heat sink coupled to the imaging circuit chip, an
The imaging circuit heat sink contacts an inner surface of the housing.
11. The imaging apparatus according to claim 9, characterized in that:
the memory device is oriented in the second direction,
the memory device and the imaging circuit contact a heat sink embedded along an inner surface of the housing.
12. The imaging apparatus of claim 11, wherein each of said memory device and said imaging circuitry contacts a separate heat sink embedded along an inner surface of said housing.
13. The imaging apparatus according to claim 9, characterized in that:
the memory device is oriented in the second direction,
the memory device is a flip-chip memory device having a memory device chip and a memory device heat sink coupled to the memory device chip,
the imaging circuit is a flip-chip imaging circuit having an imaging circuit chip and an imaging circuit heat sink coupled to the imaging circuit chip, an
The memory device heat sink and the imaging circuit heat sink contact an inner surface of the housing.
14. The imaging apparatus of claim 13, wherein said memory device heat sink and said imaging circuitry heat sink contact heat sinks embedded along an inner surface of said housing.
15. The imaging apparatus of claim 14, wherein said memory device heat sink and said imaging circuitry heat sink contact separate heat sinks embedded along an inner surface of said housing.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/151,406 US9258465B2 (en) | 2014-01-09 | 2014-01-09 | Image device having efficient heat transfer, and associated systems |
| US14/151,406 | 2014-01-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| HK1208110A1 HK1208110A1 (en) | 2016-02-19 |
| HK1208110B true HK1208110B (en) | 2018-07-13 |
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