HK1205771B - A method of producing an aperture plate for a nebulizer - Google Patents
A method of producing an aperture plate for a nebulizer Download PDFInfo
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引言introduction
本发明涉及用于气雾剂(或“喷雾器”)装置的孔板的制造。使孔板振动用于各种各样的气雾剂装置中,并且典型地通过振动支撑物绕其边缘支撑,所述振动支撑物通过压电元件而振动。此外,气雾剂装置可以具有被动或静电孔板,其例如通过来自喇叭的声音信号而操作,导致药物流过滤通过孔板。The present invention relates to the manufacture of orifice plates for aerosol (or "nebulizer") devices. Vibrating orifice plates are used in a variety of aerosol devices and are typically supported around their edges by a vibrating support that is vibrated by a piezoelectric element. In addition, aerosol devices can have passive or electrostatic orifice plates that are operated, for example, by an acoustic signal from a speaker, causing the drug flow to filter through the orifice plate.
孔板用于气雾剂传递液体配制品,传递适用于肺部药物传递的受控小液滴大小。理想喷雾器是确保一致并且精确的粒度以及可以改变以尽可能高效地将药物传递到目标区域的输出率的喷雾器。气雾剂向深肺(诸如支气管和细支气管区域)的传递需要典型地在2-4μm范围内的小并且可重复的粒度。一般说来,需要大于1ml/min的输出。Orifice plates are used for aerosol delivery of liquid formulations, delivering controlled small droplet sizes suitable for pulmonary drug delivery. An ideal nebulizer is one that ensures consistent and precise particle size and an output rate that can be varied to deliver the drug to the target area as efficiently as possible. Delivery of aerosols to the deep lung (such as the bronchi and bronchiolar regions) requires a small and repeatable particle size typically within the range of 2-4 μm. Generally speaking, an output greater than 1 ml/min is required.
当前,通过各种不同手段(包括电镀和激光打孔)制造孔板。从技术和经济立场出发,电镀一般来说是最有利的制造方法。US 6,235,177(Aerogen)描述一种基于电镀的方法,其中将薄片材料通过电沉积过程构建到芯轴上,其中电镀浴中的液化金属(典型地钯和镍)在薄片上从液体形式转化为固体形式。材料转移到芯轴上的导电表面并且不转移到不导电的光致抗蚀剂区域。区域经不导电光致抗蚀剂遮蔽,其中不需要金属积累,参看图1。在电镀过程结束之后,将芯轴/薄片组合件从浴中移出,并且将薄片从芯轴剥落以用于后续加工为孔板。At present, orifice plates are manufactured by various means (including electroplating and laser drilling). From a technical and economic standpoint, electroplating is generally the most advantageous manufacturing method. US 6,235,177 (Aerogen) describes a method based on electroplating, wherein a thin sheet material is built onto a mandrel by an electrodeposition process, wherein the liquefied metal (typically palladium and nickel) in the electroplating bath is converted from a liquid form to a solid form on the thin sheet. The material is transferred to the conductive surface on the mandrel and is not transferred to the non-conductive photoresist area. The area is shielded by the non-conductive photoresist, wherein no metal accumulation is required, see Figure 1. After the electroplating process ends, the mandrel/thin sheet assembly is removed from the bath, and the thin sheet is peeled off from the mandrel for subsequent processing as an orifice plate.
然而,此方法的一个问题是孔洞大小取决于电镀时间和所得薄片的厚度。所述过程可能难以控制,并且如果不完美地控制,那么一些孔洞可能如图2中所示近乎闭合或阻塞或如图3中所示过大,并且在孔洞的大小方面可能存在超差变化。此外,每单位面积的孔洞数目存在限制。此外,在此技术的情况下,输出率增加通常需要粒度增加,这一般来说可能不是所要的。更希望在不增加粒度的情况下增加输出率。However, a problem with this method is that the hole size depends on the plating time and the thickness of the resulting thin slice. The process can be difficult to control, and if not perfectly controlled, some holes may become nearly closed or blocked as shown in Figure 2 or too large as shown in Figure 3, and there may be excessive variation in the size of the holes. In addition, there are limitations on the number of holes per unit area. Furthermore, in the case of this technology, an increase in output rate generally requires an increase in particle size, which may not be desirable in general. It would be more desirable to increase output rate without increasing particle size.
孔洞大小精确性与每单位面积的孔洞数目的组合可以是喷雾器输出率和所得粒度分布的重要决定因素。The combination of hole size accuracy and the number of holes per unit area can be an important determinant of the nebulizer output rate and the resulting particle size distribution.
WO2011/139233(Agency for Science,Technology and Research)描述一种使用SU8材料通过光遮蔽制造的微筛。WO 2011/139233 (Agency for Science, Technology and Research) describes a microsieve fabricated using SU8 material by light shielding.
US4844778(Stork Veco)描述用于分离介质的膜的制造,和并入这种膜的分离装置。所述制造方法包括两步的光刻程序。US4844778 (Stork Veco) describes the fabrication of membranes for separation media, and separation devices incorporating such membranes. The fabrication method comprises a two-step photolithographic procedure.
EP1199382(Citizen watch Co.Ltd.)描述一种用于孔洞结构的制造方法,其中在多个循环中暴露于感光材料以提供朝顶部逐渐缩小的较深孔洞,因为存在通过最前面的孔洞的暴露。EP1199382 (Citizen Watch Co. Ltd.) describes a manufacturing method for a hole structure in which exposure to a photosensitive material is performed in multiple cycles to provide deeper holes that taper towards the top as there is exposure through the foremost hole.
本发明是针对提供一种制造用于喷雾器的孔板的改进方法,以便解决以上问题。The present invention is directed to providing an improved method of manufacturing an orifice plate for a sprayer in order to solve the above problems.
发明内容Summary of the Invention
根据本发明,提供一种制造形成气雾剂的孔板薄片的方法,所述方法包括:According to the present invention, there is provided a method for manufacturing an orifice sheet for forming an aerosol, the method comprising:
提供导电材料的芯轴,Provide a mandrel of conductive material,
以柱图案在所述芯轴上涂覆遮罩,applying a mask on the mandrel in a pillar pattern,
电镀所述柱周围的空间,Plating the space around the column,
去除所述遮罩,以提供具有形成气雾剂的孔洞的电镀材料薄片,所述遮罩柱处于所述形成气雾剂的孔洞中,removing the mask to provide a sheet of electroplating material having aerosol-forming holes, the mask post being located in the aerosol-forming holes,
其中所述遮蔽和电镀步骤之后是至少一个后续的遮蔽和电镀循环,以增加薄片厚度,wherein the masking and plating steps are followed by at least one subsequent masking and plating cycle to increase the thickness of the sheet,
其中所述至少一个后续循环使整体薄片厚度达到根据从所述芯轴移出所述薄片的准则所要的水平,和/或所述孔板的所要操作频率,和/或雾化驱动器的物理约束,wherein the at least one subsequent cycle brings the overall sheet thickness to a desired level based on criteria for removing the sheet from the mandrel, and/or a desired frequency of operation of the orifice plate, and/or physical constraints of an atomizing drive,
其中所述至少一个后续循环提供:wherein the at least one subsequent loop provides:
空间,其中至少一些覆于多个形成气雾剂的孔上,和spaces, at least some of which overlie the plurality of aerosol-forming apertures, and
封闭一些所述形成气雾剂的孔的电镀材料,并且an electroplated material that blocks some of the aerosol-forming apertures, and
其中所述至少一个后续循环根据通过所述孔板的所要流速来执行。Wherein the at least one subsequent cycle is performed according to a desired flow rate through the orifice plate.
在一些实施方案中,所有循环的所有遮罩可以一起去除,然而在其它实施方案中,一个循环的遮罩可以在后续的遮蔽和电镀循环之前去除,并且如果这样的话,那么后续电镀更可能至少部分地内填一些下部孔洞。In some embodiments, all masks for all cycles may be removed together, however in other embodiments, the masks for one cycle may be removed before a subsequent masking and plating cycle, and if so, the subsequent plating is more likely to at least partially fill some of the underlying holes.
在一个实施方案中,所述柱的深度在5μm到40μm并且优选地15μm到25μm范围内。在一些实施方案中,所述柱在所述芯轴的平面中的宽度尺寸在1μm到10μm、优选地2μm到6μm范围内。In one embodiment, the depth of the pillars ranges from 5 μm to 40 μm and preferably from 15 μm to 25 μm.In some embodiments, the width dimension of the pillars in the plane of the mandrel ranges from 1 μm to 10 μm, preferably from 2 μm to 6 μm.
在一个实施方案中,继续所述电镀直到所述电镀材料与所述柱的顶部基本上齐平。In one embodiment, the electroplating is continued until the plated material is substantially flush with the tops of the posts.
在一个实施方案中,所述电镀材料与所述遮罩材料之间基本上不重叠。在一个实施方案中,所述至少一个后续循环使所述整体薄片厚度达到超过50μm并且优选地大于58μm。在一个实施方案中,所述或每个后续循环中的封闭程度根据所述孔板的所要机械性质进行选择。In one embodiment, there is substantially no overlap between the electroplated material and the mask material. In one embodiment, the at least one subsequent cycle achieves an overall sheet thickness exceeding 50 μm and preferably greater than 58 μm. In one embodiment, the degree of sealing in the or each subsequent cycle is selected based on the desired mechanical properties of the aperture plate.
在一个实施方案中,执行所述第一遮蔽和电镀以便所述形成气雾剂的孔洞以漏斗形逐渐缩小。In one embodiment, the first masking and electroplating are performed so that the aerosol-forming holes taper in a funnel shape.
在一个实施方案中,执行所述后续遮蔽和电镀以便所述上覆空间以漏斗形逐渐缩小。In one embodiment, the subsequent masking and electroplating are performed so that the overlying space tapers in a funnel shape.
在一个实施方案中,所述电镀金属包括Ni和/或Pd。在一个实施方案中,所述Ni和/或Pd以根据抗腐蚀性质进行选择的浓度存在于表面处。在一个实施方案中,Pd的比例在85重量%与93重量%范围内并且优选地是约89%,其余基本上是Ni。在一个实施方案中,所述电镀材料在表面处以根据抗细菌性质进行选择的浓度包括Ag和/或Cu。In one embodiment, the electroplating metal comprises Ni and/or Pd. In one embodiment, the Ni and/or Pd are present at the surface in concentrations selected based on their anti-corrosion properties. In one embodiment, the proportion of Pd is between 85% and 93% by weight and is preferably approximately 89%, with the remainder being essentially Ni. In one embodiment, the electroplating material comprises Ag and/or Cu at the surface in concentrations selected based on their antibacterial properties.
在一个实施方案中,所述方法包括进一步加工所述薄片以提供准备好安装到形成气雾剂的装置中的孔板的其它步骤。在一个实施方案中,所述薄片形成为非平面形状的孔板。在一个实施方案中,所述薄片形成为具有根据所要雾化喷雾角进行选择的配置的形状。在一个实施方案中,所述薄片形成为具有操作凸圆形状的部分和用于啮合驱动器的凸缘的形状。在一个实施方案中,所述薄片在形成之前进行退火。In one embodiment, described method comprises further processing described thin slice to provide the other step of being ready to be installed in the orifice plate of the device that forms aerosol.In one embodiment, described thin slice is formed into the orifice plate of non-planar shape.In one embodiment, described thin slice is formed into the shape of the configuration that has selected according to the atomizing spray angle that wants.In one embodiment, described thin slice is formed into the shape of the part with operation cam shape and the flange that is used to engage driver.In one embodiment, described thin slice is annealed before forming.
在另一个方面,本发明提供一种孔板薄片,其包含无论何时以如上文在任何实施方案中定义的方法形成的金属主体。In another aspect, the present invention provides an orifice plate sheet comprising a metal body whenever formed by a method as defined above in any embodiment.
在另一个方面,本发明提供一种孔板,其无论何时通过如上文在任何实施方案中定义的方法形成。In another aspect, the present invention provides an orifice plate, whenever formed by a method as defined above in any embodiment.
在另一个方面,本发明提供一种孔板薄片,其包含具有形成气雾剂的通孔的光刻电镀金属的底层和至少一个具有空间的光刻电镀金属的顶层,其中所述空间覆于多个形成气雾剂的通孔上,其中形成气雾剂的孔洞中每一大孔洞的大小和数目与所要气雾剂流速有关。In another aspect, the present invention provides an apertured sheet comprising a bottom layer of photolithographically plated metal having aerosol-forming through-holes and at least one top layer of photolithographically plated metal having spaces overlying a plurality of aerosol-forming through-holes, wherein the size and number of each macrohole in the aerosol-forming holes are related to a desired aerosol flow rate.
在一个实施方案中,所述顶层封闭所述底层中的一些所述孔洞。In one embodiment, said top layer closes some of said holes in said bottom layer.
在一个实施方案中,所有层的所述金属都相同。In one embodiment, the metal is the same for all layers.
在一个实施方案中,所述电镀金属包括Ni和/或Pd。在一个实施方案中,所述Ni和/或Pd以根据抗腐蚀性质进行选择的浓度存在于表面处。In one embodiment, the electroplated metal comprises Ni and/or Pd. In one embodiment, the Ni and/or Pd are present at the surface in a concentration selected based on anti-corrosion properties.
在一个实施方案中,Pd的比例在85重量%与93重量%范围内并且优选地是约89%,其余基本上是Ni。在一个实施方案中,所述电镀金属在表面处以根据抗细菌性质进行选择的浓度包括Ag和/或Cu。In one embodiment, the proportion of Pd is in the range of 85 wt% to 93 wt% and is preferably about 89%, the remainder being essentially Ni. In one embodiment, the electroplated metal comprises Ag and/or Cu at the surface in concentrations selected for antibacterial properties.
在另一个方面,本发明提供一种孔板,其包括如上文在任何实施方案中定义的薄片。In another aspect, the present invention provides an orifice plate comprising a sheet as defined above in any embodiment.
在另一个方面,本发明提供一种形成气雾剂的装置,其包含如上文在任何实施方案中定义的孔板,和啮合所述板以使其以所要频率振动以便形成气雾剂的驱动器。In another aspect, the present invention provides an aerosol-forming device comprising an orifice plate as defined above in any embodiment, and a driver engaging the plate to vibrate it at a desired frequency in order to form an aerosol.
在另一个方面,本发明提供一种形成气雾剂的装置,其包含如上文在任何实施方案中定义的孔板,用于所述孔板以用于被动孔板用途的支撑物,和经布置以迫使液体波通过所述孔板的喇叭。In another aspect, the present invention provides an aerosol-forming device comprising an orifice plate as defined above in any embodiment, a support for said orifice plate for passive orifice plate use, and a horn arranged to force a liquid wave through said orifice plate.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
本发明将由以下对其一些实施方案的描述而得到更清楚理解,所述实施方案仅参考附图以实例的方式给出,其中:The present invention will be more clearly understood from the following description of some embodiments thereof, given by way of example only with reference to the accompanying drawings, in which:
图1到3是概述如上所述的现有技术方法的截面图;1 to 3 are cross-sectional views outlining the prior art method as described above;
图4(a)和4(b)是展示所述方法的第一阶段的遮蔽和电镀步骤的截面视图,并且图5是用于此阶段的薄片的局部平面视图;Figures 4(a) and 4(b) are cross-sectional views showing the masking and plating steps of the first stage of the method, and Figure 5 is a partial plan view of a wafer used in this stage;
图6(a)和6(b)是展示第二遮蔽和电镀阶段的截面视图,并且图7是平面视图;6( a ) and 6 ( b ) are cross-sectional views showing the second masking and plating stages, and FIG. 7 is a plan view;
图8是在抗蚀剂去除之后的截面视图;FIG8 is a cross-sectional view after resist removal;
图9展示在冲压以形成最终孔板形状之后的薄片;FIG9 shows the sheet after being punched to form the final orifice plate shape;
图10是用以说明孔板的操作的粒度相较于流速的图;FIG10 is a graph of particle size versus flow rate to illustrate the operation of an orifice plate;
图11(a)、11(b)和12是第二实施方案的相当于图4(a)、4(b)和5的视图,其中孔洞逐渐缩小;并且Figures 11(a), 11(b) and 12 are views corresponding to Figures 4(a), 4(b) and 5 of the second embodiment, in which the holes are gradually reduced in size; and
图13(a)和13(b)是相当于图6(a)和6(b)并且用于第二实施方案的视图,并且图14是在去除光致抗蚀剂遮罩之后在一个大上部孔洞的区域中的平面视图。13(a) and 13(b) are views corresponding to FIGs. 6(a) and 6(b) and for the second embodiment, and FIG. 14 is a plan view in the region of a large upper hole after removing the photoresist mask.
具体实施方式DETAILED DESCRIPTION
参考图4(a),芯轴20使得光致抗蚀剂21以垂直柱图案涂覆,所述柱具有待制造的孔板的孔洞或孔隙的尺寸。柱高度优选地在5μm到40μm并且更优选地5μm到30μm并且最优选地15μm到25μm高度范围内。直径优选地在1μm到10μm并且最优选地约2μm到6μm直径范围内。此遮罩图案提供了界定气雾剂粒度的孔。当与现有技术相比时,其每单位面积的数目大得多;二十倍增加是可能的,因此每平方毫米具有多达2500个孔洞。Referring to Figure 4 (a), a mandrel 20 coats a photoresist 21 with a pattern of vertical columns having the dimensions of the holes or pores of the orifice plate to be manufactured. The column height is preferably in the range of 5 μm to 40 μm, more preferably 5 μm to 30 μm, and most preferably 15 μm to 25 μm in height. The diameter is preferably in the range of 1 μm to 10 μm, and most preferably about 2 μm to 6 μm in diameter. This mask pattern provides holes that define the size of the aerosol particles. When compared to the prior art, the number per unit area is much greater; a twenty-fold increase is possible, thus having up to 2,500 holes per square millimeter.
参考图4(b)和5,将金属22电沉积到柱21周围的空间中。4( b ) and 5 , metal 22 is electrodeposited into the space around pillars 21 .
如图6(a)中所示,进一步涂覆大(宽并且高)得多的柱的第二光致抗蚀剂遮罩25,包围许多第一柱21的区域。第二电镀层中的孔洞直径在20μm与400μm之间并且更优选地在40μm与150μm之间。为确保较高流速,将此直径制得在所述范围的上端,并且为保证较低流速,将其制得在所述范围的下端以使第一层上的更多较小开口闭合。As shown in FIG6 (a), a second photoresist mask 25 of much larger (wider and taller) pillars is further applied, surrounding the area of many first pillars 21. The diameter of the holes in the second electroplated layer is between 20 μm and 400 μm, and more preferably between 40 μm and 150 μm. To ensure a higher flow rate, this diameter is made at the upper end of the range, and to ensure a lower flow rate, it is made at the lower end of the range to close more of the smaller openings in the first layer.
参考图6(b)和7,电镀光致抗蚀剂25周围的空间以在芯轴20上提供薄片主体26。当光致抗蚀剂21和25用抗蚀剂去除剂清洁并且冲洗掉时,电镀材料22和26呈孔板坯件或遮罩30形式,如图8中所示,具有大顶孔32和小底孔33。在此实施方案中,所有抗蚀剂21和25一起被去除,然而,设想抗蚀剂21可以在后续的遮蔽和电镀循环之前被去除。在此情况下,后续电镀更可能至少部分地内填一些形成气雾剂的孔。6 (b) and 7, the space around the photoresist 25 is plated to provide a sheet body 26 on the mandrel 20. When the photoresists 21 and 25 are cleaned with a resist remover and rinsed away, the plated materials 22 and 26 are in the form of an aperture plate blank or mask 30, as shown in FIG8, with a large top hole 32 and a small bottom hole 33. In this embodiment, all of the resists 21 and 25 are removed together, however, it is envisioned that the resist 21 can be removed before subsequent masking and plating cycles. In this case, subsequent plating is more likely to at least partially fill in some of the aerosol-forming holes.
如图9中所示,薄片30冲压为圆盘并且形成为凸圆形状以提供最终产品孔板40。As shown in FIG. 9 , the sheet 30 is punched into a disk and formed into a convex shape to provide the final product, the orifice plate 40 .
在此阶段,凸圆化直径可以经选择以提供所要喷雾角和/或设定驱动控制器的最优固有频率。凸圆形状提供漏斗作用,并且凸圆化板的具体形状影响喷雾特征。At this stage, the cambering diameter can be selected to provide the desired spray angle and/or to set the optimum natural frequency of the drive controller.The cambered shape provides a funneling effect, and the specific shape of the cambering plate affects the spray characteristics.
在一个替代性实施方案中,孔板不经凸圆化,而是维持平面,适用于诸如被动板喷雾器的装置中。在此类型的喷雾器中,声极或喇叭放置得与板上的药物接触。压电元件导致换能器喇叭快速运动,其迫使药物波抵着孔板,导致药物流过滤通过板从而以气雾剂形式离开侧面。In an alternative embodiment, the orifice plate is not convex but rather remains flat, suitable for use in devices such as passive plate nebulizers. In this type of nebulizer, a sonotrode or horn is placed in contact with the drug on the plate. A piezoelectric element causes rapid motion of the transducer horn, which forces a wave of drug against the orifice plate, causing the drug flow to filter through the plate and exit the side in the form of an aerosol.
本发明的孔板制造的大多数益处适用于振动或被动装置。Most of the benefits of orifice plate fabrication of the present invention apply to vibrating or passive devices.
更详细地,芯轴20涂布有光致抗蚀剂21,其柱高度和宽度等于目标孔洞尺寸。此涂布和后续紫外线(UV)显影使得光致抗蚀剂的柱21保持直立于芯轴20上。这些柱具有所需直径并且高达其刚性所能支撑。由于柱直径仅是小于10μm并且优选地小于6μm,因此与现有技术中相比有可能得到更多的柱和每单位面积的所得孔洞。预期,与现有技术电镀方法相比可能多出多达二十倍孔洞。这创造了开口面积比例和所得喷雾器输出大幅度增加的可能性。In more detail, the mandrel 20 is coated with a photoresist 21 having a column height and width equal to the target hole size. This coating and subsequent ultraviolet (UV) development keep the photoresist columns 21 upright on the mandrel 20. These columns have the desired diameter and are as high as their rigidity can support. Since the column diameter is only less than 10 μm and preferably less than 6 μm, it is possible to obtain more columns and resulting holes per unit area than in the prior art. It is expected that up to twenty times more holes may be possible compared to prior art electroplating methods. This creates the possibility of a significant increase in the open area ratio and the resulting sprayer output.
然后将其中选择性显影的光致抗蚀剂呈直立柱21形式的芯轴20放入电镀浴中,并且通过电沉积过程,含有液体形式的金属钯镍(PdNi)典型地然后提供到表面。当达到柱高度时,停止电镀活动。不允许过度电镀,因为正当达到光致抗蚀剂的柱高度时停止电镀。电镀溶液经选择以适合所要孔板尺寸和操作参数,诸如振动频率。Pd比例可以在约85%到93重量%范围内,并且在一个实施方案中,是约89重量%,其余基本上都是Ni。电镀结构优选地具有精细无规各向等大的颗粒微观结构,颗粒度是例如0.2μm到2.0μm。电沉积领域的技术人员将了解两个电镀阶段的电镀条件可以如何进行选择以适合所述情况,并且以下文献的全部内含以引用的方式并入本文中:US4628165、US6235117、US2007023547、US2001013554、WO2009/042187和Lu S.Y.,Li J.F.,Zhou Y.H.,“Grain refinement inthe solidification of undercooled Ni-Pd alloys”.Journal of Crystal Growth 309(2007)103-111,2007年9月14日。一般来说,大多数包括钯和镍的电镀溶液将起作用,或仅镍或甚至磷的与镍(14:86)或铂。有可能非钯薄片可以在表面上(0.5到5.0μm厚,优选地1.0到3.0μm厚)在PdNi中电镀以赋予更大抗腐蚀性。这在较小开口为所要时还将减小孔洞大小。The mandrel 20 in which the selectively developed photoresist is in the form of upright columns 21 is then placed in an electroplating bath and, through an electrodeposition process, a metallic palladium nickel (PdNi) containing liquid form is typically then provided to the surface. When the column height is reached, the electroplating activity is stopped. Excessive electroplating is not allowed because electroplating is stopped just when the column height of the photoresist is reached. The electroplating solution is selected to suit the desired orifice plate size and operating parameters, such as vibration frequency. The Pd ratio can be in the range of about 85% to 93% by weight, and in one embodiment, is about 89% by weight, with the remainder being essentially Ni. The electroplated structure preferably has a fine random isotropic granular microstructure with a particle size of, for example, 0.2 μm to 2.0 μm. Those skilled in the art of electrodeposition will understand how the plating conditions for the two plating stages can be selected to suit the circumstances, and the entire contents of the following documents are incorporated herein by reference: US4628165, US6235117, US2007023547, US2001013554, WO2009/042187, and Lu S.Y., Li J.F., Zhou Y.H., "Grain refinement in the solidification of undercooled Ni-Pd alloys". Journal of Crystal Growth 309 (2007) 103-111, September 14, 2007. In general, most plating solutions comprising palladium and nickel will work, or nickel alone or even phosphorus with nickel (14:86) or platinum. Possibly a non-palladium flake could be plated in PdNi on the surface (0.5 to 5.0 μm thick, preferably 1.0 to 3.0 μm thick) to impart greater corrosion resistance. This would also reduce the hole size when smaller openings are desired.
当从电镀浴移出时,薄片厚度典型地是5-40μm,取决于柱高度。此时将薄片剥离将产生与现有技术的标准60μm厚度相比极薄的薄片。此厚度的薄片将缺乏刚性,极难以加工,并且将需要对喷雾器核心的机械制造进行复杂并且昂贵的改变以实现相当于目前发展水平的固有频率以使得现有电子控制驱动器将是可用的,所述电子控制驱动器在一些情况下集成到通风设备中。不同驱动控制器的使用由于所涉及的成本而将是市场接受度的重大经济障碍。When removed from the plating bath, the sheet thickness is typically 5-40 μm, depending on the column height. Peeling the sheet off at this point will produce a sheet that is extremely thin compared to the standard 60 μm thickness of the prior art. A sheet of this thickness would lack rigidity, be extremely difficult to process, and would require complex and expensive changes to the mechanical fabrication of the atomizer core to achieve a natural frequency equivalent to the current state of the art so that existing electronically controlled drives, which are in some cases integrated into ventilation equipment, would be usable. The use of different drive controllers would be a significant economic barrier to market acceptance due to the costs involved.
此问题通过向第二光致抗蚀剂沉积过程提供电镀芯轴而克服。在一个实施方案中,使得光致抗蚀剂厚度达到一个深度,其等于使整体薄片厚度达到约60μm(类似于现有技术薄片厚度)所需的深度。对于许多应用来说,第二遮罩高度优选地在40-50μm范围内。然后使其显影以允许较大柱直立于电镀表面上。其直径典型地在40-100μm之间但可以是更大或更小。来自第二电镀的额外高度帮助从芯轴移出,但重要地是其还实现相当于现有技术孔板厚度的具体厚度以允许最终产品孔板40由市场上的现有控制器电驱动。这产生了实现用以产生气雾剂的恰当振动相配的固有频率。一般说来,第二电镀阶段提供了针对刚性、柔性和弯曲强度更适于喷雾器应用的厚度。另一个方面在于,其封闭一些较小孔洞,从而实现改进的对于流速的控制。因此,第二遮蔽和电镀阶段可以用以根据所要流速“调整”最终产品孔板。同时,小批次之间可能快速地变化,使各种各样的不同地调整的板成为可能。This problem is overcome by providing the plating mandrel to the second photoresist deposition process. In one embodiment, the photoresist thickness is made to reach a depth that is equal to the depth required for the overall thin sheet thickness to reach about 60 μm (similar to the thickness of the prior art thin sheet). For many applications, the second mask height is preferably within the range of 40-50 μm. It is then developed to allow larger columns to stand upright on the plating surface. Its diameter is typically between 40-100 μm but can be larger or smaller. The extra height from the second plating helps to move out from the mandrel, but importantly, it also achieves a specific thickness equivalent to the thickness of the prior art orifice plate to allow the final product orifice plate 40 to be electrically driven by an existing controller on the market. This has produced a natural frequency that is matched to achieve the appropriate vibration of the aerosol. Generally speaking, the second plating stage provides a thickness that is more suitable for sprayer applications for rigidity, flexibility and bending strength. Another aspect is that it closes some smaller holes, thereby achieving improved control of flow rate. Therefore, the second shielding and plating stage can be used to "adjust" the final product orifice plate according to the desired flow rate. At the same time, small batches can be changed quickly between each other, making a wide variety of differently tuned boards possible.
然后在不借助于任何后续过程(诸如蚀刻或激光切割)的情况下将薄片小心地从衬底剥落。此剥落便利性具有不向已经易碎的薄片赋予额外机械应力的优势。然后将薄片在光致抗蚀剂去除剂中洗涤并且冲洗,随后进行度量衡检查。The flakes are then carefully peeled from the substrate without resorting to any subsequent processes such as etching or laser cutting. This ease of peeling has the advantage of not imparting additional mechanical stress to the already fragile flakes. The flakes are then washed and rinsed in a photoresist remover before undergoing metrological inspection.
在孔板坯件或遮罩30中,孔洞33的深度等于第一电镀层,并且最终薄片厚度将等于两个电镀层的总和,参看图8和9。然后将其准备好退火、冲压和凸圆化以形成图9中所示的振动板40。In the aperture plate blank or mask 30, the depth of the holes 33 is equal to the first electroplated layer and the final sheet thickness will be equal to the sum of the two electroplated layers, see Figures 8 and 9. It is then ready for annealing, stamping and embossing to form the vibrating plate 40 shown in Figure 9.
对于某些应用来说,可能有用以改进膜性质的额外步骤。举例来说,膜可以具有经抗腐蚀性材料过度电镀的电铸Ni衬底材料,所述抗腐蚀性材料诸如铜、银、钯、铂和/或PdNi合金。铜和银有利地具有抗细菌性质。For some applications, additional steps may be useful to improve the film properties. For example, the film may have an electroformed Ni substrate material that is over-plated with a corrosion-resistant material such as copper, silver, palladium, platinum, and/or a PdNi alloy. Copper and silver advantageously have antibacterial properties.
应了解,本发明提供一种孔板,其具备具有多个形成气雾剂的通孔(其界定所喷射的小滴大小)的电铸金属的第一层,和在形成气雾剂的孔洞上具有较大直径孔洞或空间并且其电镀材料封闭一些第一层孔洞的类似或不同电铸材料的第二顶层。It will be appreciated that the present invention provides an aperture plate having a first layer of electroformed metal having a plurality of aerosol-forming through-holes that define the size of the ejected droplets, and a second top layer of similar or different electroformed material having larger diameter holes or spaces above the aerosol-forming holes and whose electroplated material closes some of the first layer holes.
在各种实施方案中,第二层具有许多孔洞或空间,其直径经选择以使得预定数目的形成小滴大小的第一层孔洞暴露,这决定了能起作用的孔洞的数目并且因此界定了每单位时间所雾化的液体的量。In various embodiments, the second layer has a plurality of holes or spaces whose diameters are selected to expose a predetermined number of the first layer holes that form droplet sizes, which determines the number of holes that can function and therefore defines the amount of liquid atomized per unit time.
两个层中的孔洞的大小和数目可以独立地改变以实现小滴大小和流速分布的所要范围,这在现有技术电镀界定技术情况下是不可能的。The size and number of holes in the two layers can be varied independently to achieve a desired range of droplet sizes and flow rate distributions, which is not possible with prior art electroplating definition techniques.
还应了解,本发明提供了当与现有技术相比时每单位面积的孔洞数目大得多的可能性。举例来说,二十倍增加是可能的,因此每平方毫米具有多达2500个孔洞。It will also be appreciated that the present invention offers the possibility of a much greater number of holes per unit area when compared to the prior art. For example, a twenty-fold increase is possible, thus having up to 2500 holes per square millimeter.
此外,在各种实施方案中,第二层至少完全或部分地内填第一层中的一些形成气雾剂的孔洞,因此形成两个层的机械锚固以帮助实现耐久寿命需求。Furthermore, in various embodiments, the second layer at least completely or partially fills some of the aerosol-forming pores in the first layer, thereby forming a mechanical anchor for the two layers to help achieve the longevity requirements.
以下是5mm直径的孔板(“AP”)的不同孔洞配置的实例的表:The following is a table of examples of different hole configurations for a 5 mm diameter aperture plate ("AP"):
本发明的有利方面包括:Advantageous aspects of the present invention include:
(i)每单位面积的较大孔洞数目是可能的。(i) A larger number of holes per unit area is possible.
(ii)较小并且在直径方面较精确的孔洞大小是可能。(ii) Smaller and more precise hole sizes in diameter are possible.
(iii)与现有市售薄片类似的厚度,其减轻再设计喷雾器以匹配现有控制器的恰当频率以启动气雾剂产生器的繁重需要。(iii) A thickness similar to existing commercially available sheets, which alleviates the onerous need to redesign the nebulizer to match the proper frequency of existing controllers to activate the aerosol generator.
(iv)仅需要两个电镀层或电镀步骤。(iv) Only two plating layers or plating steps are required.
(v)仍容易小心地将薄片从芯轴衬底剥落。(v) The flakes are still easy to carefully peel off the mandrel substrate.
(vi)可能使用现有电子控制器来驱动孔板,因为固有频率匹配,已经获得了类似孔板厚度。(vi) It is possible to use existing electronic controllers to drive the orifice plates because the natural frequencies are matched and similar orifice thicknesses are already achieved.
(vii)可能得到较小并且可控制性较大的粒度(2-4μm)。(vii) Smaller and more controllable particle sizes (2-4 μm) are possible.
(viii)可能获得较高流速(0.5到2.5ml/min,更典型地0.75-1.5ml/min)。(viii) Higher flow rates may be achieved (0.5 to 2.5 ml/min, more typically 0.75-1.5 ml/min).
(ix)可能获得当与如所述的现有技术相比时更独立于彼此的流速和粒度。(典型地在现有技术中,增加流速通常需要增加粒度,并且反之亦然)。这些优势说明于图10的图中。(ix) It is possible to obtain flow rate and particle size that are more independent of each other when compared to the prior art as described. (Typically in the prior art, increasing flow rate usually requires increasing particle size, and vice versa). These advantages are illustrated in the graph of Figure 10.
参考图11到14,在第二实施方案中,加工与以上实施方案几乎相同。然而,在此情况下,两组光致抗蚀剂柱都逐渐缩小,以便所得孔洞逐渐缩小以实现改进的气雾剂液体流动。存在芯轴50、第一遮罩柱51和中间的电镀物52。第二遮罩包含逐渐缩小的柱55,并且中间的空间经金属56电镀。对于电镀步骤需要非常小心,以便确保在遮罩悬垂部分下存在充足电镀。图14展示在此情况下在去除光致抗蚀剂之后的平面视图。将可见,对于PdNi主体56/52中的每个大顶部孔洞65存在几个小孔洞61。顶部孔洞65具有漏斗的作用向下到小孔洞61,其自身是漏斗形。With reference to Figures 11 to 14, in a second embodiment, processing is almost the same as in the above embodiment. However, in this case, both sets of photoresist columns are tapered so that the resulting holes are tapered to achieve improved aerosol liquid flow. There is a mandrel 50, a first mask column 51, and an electroplated object 52 in the middle. The second mask comprises a tapered column 55, and the space in the middle is electroplated with metal 56. It is necessary to be very careful for the electroplating step to ensure that there is sufficient electroplating under the mask overhang. Figure 14 shows a plan view after removing the photoresist in this case. It will be seen that there are several small holes 61 for each large top hole 65 in the PdNi body 56/52. The top hole 65 has the effect of a funnel down to the small hole 61, which itself is funnel-shaped.
本发明并不限于所述实施方案,而是可以在构造和细节方面有所改变。举例来说,设想如果薄片可以从芯轴移出,那么可能不需要第二遮蔽和电镀循环,或者是由于所需薄片深度在第一阶段中获得或者是由于改进的薄片移出技术是可用的。另外,可以应用第三层以向孔板提供更大机械刚性。此外,在上述实施方案中,各层具有相同金属。然而,设想其可能不同,并且甚至每个形成孔洞的层内的金属可以包括不同金属的子层。举例来说,一个或两个表面处的组成可能不同以获得较大抗腐蚀性和/或一定的亲水性或疏水性性质。此外,对于顶部1到5μm或1到3μm的表面层来说,可能存在另一个电镀步骤。The present invention is not limited to the described embodiments, but can be varied in configuration and detail. For example, it is envisioned that if the thin slice can be removed from the mandrel, a second shielding and plating cycle may not be needed, either because the required thin slice depth is obtained in the first stage or because an improved thin slice removal technology is available. In addition, a third layer can be applied to provide greater mechanical rigidity to the orifice plate. In addition, in the above-described embodiments, each layer has the same metal. However, it is envisioned that it may be different, and even the metal in each layer forming the hole may include sublayers of different metals. For example, the composition at one or both surfaces may be different to obtain greater corrosion resistance and/or certain hydrophilicity or hydrophobicity properties. In addition, for the surface layer of the top 1 to 5 μm or 1 to 3 μm, there may be another plating step.
Claims (25)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261658054P | 2012-06-11 | 2012-06-11 | |
| US61/658,054 | 2012-06-11 | ||
| PCT/EP2013/060803 WO2013186031A2 (en) | 2012-06-11 | 2013-05-24 | A method of producing an aperture plate for a nebulizer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| HK1205771A1 HK1205771A1 (en) | 2015-12-24 |
| HK1205771B true HK1205771B (en) | 2021-01-08 |
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