HK1261106B - Device carrier comprising contact chambers for an optoelectronic apparatus - Google Patents

Description

The present invention relates to an optoelectronic device comprising a carrier device. The carrier device is intended to accommodate and electrically contact the electronic components or units required for the application-specific operation of the device, in particular an optoelectronic transmitter and/or receiver.

Above the carrier device, i.e., vertically above an optoelectronic transmitter and/or receiver, a lens element can be provided, which has at least one lens section for an optoelectronic transmitter and/or optoelectronic receiver. For this purpose, the respective lens section can have beam-shaping and/or beam-deflecting properties.

Such optoelectronic devices are particularly designed as optoelectronic sensor devices for optically scanning and electronically detecting properties of objects. One application for such sensor devices lies in the field of commercially available printer devices, i.e., devices for computer-assisted printing on paper using known printing technologies, e.g., laser printing or inkjet printing technology. To enable the most fully automated and user-friendly operation of a printer (or a multifunction device comprising a printer), various operating parameters of the printer, such as the quantity or type of paper inserted into a printer tray, a designated paper format, the relative position of a paper edge, and the like, must be determined and, if necessary, monitored. Furthermore, there is a need for an automatic analysis of a respective print result or paper to be scanned, for example, to check the content type (image vs. text) of the paper to be scanned or the correct configuration (e.g., mechanical alignment of a printer's printing unit) based on a print result.

Typically, an individually adapted optoelectronic device is provided for each operating parameter to be measured. This device is designed to compare an emitted optical signal with a detected, e.g., reflected, optical signal in order to determine the relevant operating parameter from the difference between these optical signals. The optical signals are generally electromagnetic radiation of a visible or invisible wavelength, particularly infrared. The device often comprises both an optoelectronic transmitter and (at least) one optoelectronic receiver. For example, the device can function as a proximity sensor. However, variants are also possible in which an optoelectronic device has only one optoelectronic transmitter or only one optoelectronic receiver (for passive detection). Furthermore, devices with multiple transmitters and receivers are possible, whereby one device can, for example, determine multiple operating parameters, particularly simultaneously (e.g., distinguishing between diffuse and specular reflection).

Due to the large number of operating parameters to be measured, a corresponding variety of optoelectronic devices is required, which is associated with undesirable costs in manufacturing and storage. Furthermore, an optoelectronic device for measuring a respective operating parameter must have a specific carrier device, which can vary greatly depending on the operating parameter in question and therefore requires considerable development effort. For example, the carrier device must be adapted to the optoelectronic components. For example, the geometric design of the carrier device and the distribution of its contact surfaces must be determined depending on the required position of the components in question relative to a lens element arranged above the carrier device. The components to be installed, and in particular the number of components, are often very different, which further increases the adaptation effort with regard to the carrier device.

The printed matter EP 2 381 474 A2 shows a lead frame which has reflective cavities applied by injection molding to accommodate light-emitting semiconductor chips.

The printed matter JP 2004 200593 A shows a plastic-overmolded lead frame with openings, wherein a light-emitting element is mounted in one opening and a light-receiving component is mounted in another opening on the lead frame.

The printed matter EP 2 829 918 A1 shows a sensor with a circuit board. A light emitter and a light receiver are surface-mounted on the circuit board. A sensor cover is connected to the circuit board, and a light-shielding wall is located between the transmitter and receiver.

The printed matter DE 102 41 934 A1 shows an optical sensor with a circuit board. The circuit board contains photodiodes and light-emitting diodes, with the semiconductor chips for the photodiodes and diodes soldered and wire-bonded directly onto the board.

It is an object of the invention to provide a carrier device which can be easily and variably equipped with different optoelectronic components in order to be able to produce an optoelectronic device adapted to an individual application, without, however, the carrier device having to be modified for this purpose.

The object is achieved by a carrier device for an optoelectronic device having the features of claim 1.

A support device for an optoelectronic device has a longitudinal extension and a transverse extension, wherein the support device has a plurality of electrically conductive contact tracks aligned parallel to the longitudinal extension, wherein the support device has a plurality of contact chambers aligned parallel to the transverse extension on an upper side. Each of the contact tracks can be electrically contacted in each of the contact chambers, so that at least one optoelectronic transmitter and/or at least one optoelectronic receiver can be installed in the respective contact chamber in a variable configuration.

The support device of the optoelectronic device is divided into several electrically conductive contact tracks and several contact chambers in mutually different directions to enable the support device to be individually equipped with optoelectronic components or units and to enable the optoelectronic components to be individually electrically contacted. The contact tracks are separated from one another along the transverse extent of the support device and are thus electrically insulated from one another. Each of the contact tracks is exposed at least in sections in each of the contact chambers or is otherwise accessible to enable electrical contact.

The division into several contact chambers enables optical isolation of the optoelectronic components to prevent optical crosstalk. The contact chambers are separated or delimited from one another along the longitudinal extent of the carrier device and are preferably circumferentially delimited, but open at the top. Each of the contact chambers represents an at least functionally uniform installation area of the carrier device, so that the carrier device can be easily and flexibly equipped with several optoelectronic components, which can in particular be operated independently of one another. A particular advantage of the invention lies in the fact that in each of the said several contact chambers, each of the said several contact tracks can be electrically contacted. This makes the assembly particularly flexible. On the one hand, a component to be installed in a respective contact chamber can be flexibly connected locally to one or more of the contact tracks, whereby no large distances, in particular between adjacent contact chambers, have to be bridged for this purpose. Furthermore, the position of a component to be installed can be flexibly selected, since the component can, in principle, be installed equally well in any contact chamber. This makes the carrier device suitable for virtually any assembly topology and thus universally applicable. Adapting the carrier device to a desired assembly topology is not necessary. The same carrier device can therefore be used to adapt the optoelectronic device to a wide variety of individual applications.

In the context of the invention, an optoelectronic component or an optoelectronic unit is to be understood in particular as an optoelectronic transmitter and/or an optoelectronic receiver.

The number of contact chambers can be adapted to the applications intended for the optoelectronic device. Preferably, several similarly designed contact chambers are arranged one behind the other, particularly in the longitudinal direction of the optoelectronic device. However, individual or multiple contact chambers can also be designed differently. For example, one contact chamber can be larger than the others to allow for the installation of multiple or larger electronic components in the enlarged contact chamber.

The carrier device has three, four, five or six contact tracks.

Accordingly, the carrier device can have, for example, three, four, five, or six contact chambers. In special applications, more than six contact tracks and/or contact chambers per carrier device are also possible. In this case, the number of contact tracks can correspond to the number of contact chambers or differ by a maximum of one or a maximum of two. A number of contact chambers corresponding to the number of contact tracks is generally advantageous, as this allows the carrier device to be equipped particularly variably, i.e., flexibly. Different numbers of contact tracks on the one hand and contact chambers on the other can be particularly useful when the same contact track is used to contact several optoelectronic components in different contact chambers, for example, as a ground contact or when the optoelectronic components in question are connected in parallel. Different numbers of contact tracks on the one hand and contact chambers on the other can also be particularly useful when contact tracks are required for electronic components that are not optoelectronic components and can therefore be installed within the same contact chamber as one of the optoelectronic components.

The contact chambers are optically isolated from each other, so that an optoelectronic component installed in a respective contact chamber can be operated at least optically independently of a component installed in an adjacent contact chamber. The contact chambers are separated from each other by separating webs that run parallel to the transverse extent of the optoelectronic device.

The separators can therefore also be referred to as partition walls. The separators can form elevations relative to a plane of extension of the electrically conductive contact tracks. The separators are made of an opaque material or, at least in sections, are covered with an opaque coating. The separators are injection-molded from plastic.

Optical crosstalk between adjacent contact chambers can thus be effectively prevented. The contact chambers can be filled with a potting material, in particular with an epoxy resin, silicone, or the like. This allows the optical refractive index to be changed or adjusted; spectral filtering can be performed; and/or the optoelectronic component provided in the respective contact chamber can be protected from environmental influences. The various contact chambers can be filled or unfilled with a potting material in different ways.

According to the invention, the carrier device has an overmolded leadframe. Such a leadframe is also referred to as a "pre-molded leadframe." The overmolded leadframe comprises a segmented (i.e., partially interrupted) and at least partially electrically conductive metal conductor strip. This conductor strip can be a stamped part or a stamped-bent part that has been segmented, i.e., provided with recesses, by a stamping process (in particular before overmolding with plastic). This allows several separate parts to be formed from a single conductor strip, which in particular comprise the aforementioned contact tracks and/or additional elements. These separate parts can be arranged within a common extension plane or within mutually offset extension planes. The separate parts of the conductor strip, or electronic components installed thereon, can be electrically connected to one another, for example, by bonding wires.

The metal conductor strip is partially surrounded by a plastic frame section, wherein the frame section defines the plurality of contact chambers on an upper side of the conductor strip. The frame section comprises the aforementioned separating webs and, like these, is formed from an opaque material or is at least partially coated with an opaque layer.

Furthermore, the frame section can form an outer frame that surrounds the upper side of the conductor strip in sections or completely.

The metal conductor strip can form at least one electrical connection for a respective contact track in order to be able to electrically contact the respective contact track or a component electrically connected thereto from outside the optoelectronic device. The electrical connection can in particular be formed by a segmented part of the conductor strip. Preferably, at least one electrical connection is provided for each contact track. In particular, a plurality of differently designed and/or spaced-apart electrical connections can be provided. Using parts of a conductor strip not only as contact tracks but also as electrical connections has the advantage of a particularly simple and compact design, in particular compared to a carrier device based on a printed circuit board (PCB) or a ceramic substrate.

The respective electrical connection can form an elastic contact tongue to ensure reliable contact with an electrical connector that interacts with the contact tongue and is connected externally to the optoelectronic device. The contact tongue can be curved. The contact tongue is preferably aligned parallel to the longitudinal extent of the carrier device. The respective contact tongue can, in particular, extend away from a narrow side of a rectangular basic shape of the carrier device. Arranging the electrical connection on the narrow side is advantageous in order to design the carrier device and the optoelectronic device in a compact manner, with the slimmest possible external shape.

The metal or a coating thereof used for the conductor strip and in particular the electrical connection can comprise a nickel-palladium alloy. This has the advantage, on the one hand, that an optoelectronic component to be installed in a contact chamber can be easily electrically connected to a contact track of the conductor strip (using conventional bonding methods). At the same time, the electrical connection, particularly when designed as a contact tongue, has optimal flexibility thanks to the use of the nickel-palladium alloy, so that the aforementioned contactability by an associated connector is particularly well ensured and the fragility of the electrical connection is minimal. Furthermore, a respective electrical connection or contact track can be contacted/decontacted multiple times without compromising the reliability of the respective electrical contact.

It is understood that the conductor strip can form multiple electrical connections, wherein the multiple connections can be of the same or different design. In particular, multiple elastic contact tongues of the type described can be provided.

According to one embodiment, the multiple electrical connections of the conductor strip together form a contact zone for an electrical connector, which is connected externally to the optoelectronic device. The optoelectronic device can, for example, have a free space above the contact zone, through which a socket for inserting and securing the electrical connector is formed. The multiple electrical connections are preferably arranged parallel to one another, enabling contact in the manner of a flexible flat cable. A separate socket is not necessary. The carrier device can thus be connected to an external microcontroller in a particularly simple and compact manner in order to operate the optoelectronic device.

According to one embodiment, at least one of the plurality of electrical connections is electrically insulated from the plurality of contact tracks. This can be achieved, in particular, by the electrical connections and the contact tracks forming separate parts of a segmented conductor strip. However, the respective electrical connection can optionally be connected directly to a respective contact track (for example, by means of a bonding wire), which further increases the flexibility of equipping the carrier device, e.g., with optoelectronic transmitters and/or receivers. Alternatively or additionally, an indirect electrical connection can be provided, in particular via an electronic component, such as an application-specific integrated circuit (ASIC) installed in a contact chamber of the carrier device.

According to a further embodiment, at least one of the plurality of electrical connections is integrally formed (i.e., in one piece) with one of the plurality of contact tracks and is thereby also electrically connected. In particular, one of the plurality of electrical connections can be directly connected to an installation contact track of the carrier device and preferably be integrally formed.

This installation contact track can, in particular, be a contact track arranged centrally along the transverse extension. The installation contact track can, for example, be connected to a predetermined electrical potential, in particular to ground (zero potential), via the electrical connection. Preferably, all electronic components installed on the carrier device (optoelectronic transmitters and/or receivers, as well as ASICs) are attached to the installation contact track, with at least some of the installed components also being able to electrically contact the installation contact track. Additionally, each installed component can be electrically connected to one or more of the other contact tracks by means of bonding wires.

According to a further embodiment, the installation contact track is widened relative to the other contact tracks, i.e., it has a greater extension along the aforementioned transverse extent of the support device. This allows even larger electronic units to be reliably installed on the installation contact track. If all electronic units are installed on the installation contact track, the other contact tracks can be comparatively narrow, allowing the optoelectronic device to be compact overall.

The contact tracks can each have a substantially uniform width, in particular one that remains constant over their length. However, the geometry can vary in certain sections. In particular, the installation contact track, which is preferably arranged centrally, can have an enlarged, in particular widened, area where, for example, an ASIC can be installed. Preferably, all other contact tracks run locally along the enlarged area of the installation contact track, so that an ASIC installed in this area can be connected to each of the other contact tracks with only minimal wiring effort. The distance to be bridged by a respective bond wire is comparatively small, so that the respective bond connection can be reliably and easily produced and is comparatively durable, and so that electromagnetic interference is not easily coupled in.

It is understood that, in addition to the aforementioned electronic components, other electronic components can also be installed on the carrier device. For example, a temperature sensor can be provided to detect excessive heating of the optoelectronic device. The temperature sensor can, in particular, be integrated into an ASIC on the carrier device.

At least one contacting region can be provided on an underside of the carrier device, in which a respective one of the plurality of contact tracks is exposed for electrical contacting. As a result, simple electrical contacting of the respective contact track can be carried out as part of a manufacturing process for the carrier device or the optoelectronic device, independently of the aforementioned electrical connector, which is provided for electrical contacting during normal operation of the optoelectronic device. This can be desirable, for example, whether the carrier device or the optoelectronic device is to be tested, calibrated, or finally programmed. In particular, one of the underside contacting regions can form a so-called fuse pad in order to specifically destroy electrical connections within the optoelectronic device, and in particular an ASIC installed thereon, by applying a predetermined increased voltage.

Furthermore, the conductor strip can have at least one lateral contacting area in which each of the multiple contact tracks is exposed for electrical contacting. In particular, a contact track can be led out of the frame section at two spaced-apart lateral sections of the carrier device. For example, a respective end section of a contact track can be formed by a lateral contacting area. Thus, for example, the conductivity of the contact track can be easily tested within the framework of a mechanical test cycle.

According to a preferred embodiment, the optoelectronic device comprises a lens element and a holding device, wherein the lens element is provided above the carrier device and has at least one lens section for the at least one optoelectronic transmitter and/or the at least one optoelectronic receiver, and wherein the holding device holds the carrier device and the lens element relative to one another. In the context of the invention, a lens element is understood to mean an imaging element that can, in particular, have refractive (i.e., light-refracting) properties. The respective lens section can have beam-shaping properties, in particular by having a curvature on one side or on two sides (e.g., as a converging lens, diverging lens, or Fresnel lens). Alternatively or additionally, the respective lens section can deflect a beam, i.e., change the propagation direction of an emitted or received beam. In particular, the respective lens section can have a wedge shape (e.g., a wedge lens with two planar surfaces aligned at an acute angle to one another). The respective lens section can be aligned parallel or obliquely to a plane of extension of the support device. The lens element can be plate-shaped outside the respective lens section. The respective lens section can be integrally formed and/or arranged above the optoelectronic transmitter or receiver.

The optoelectronic device is characterized by a modular design in which the device is assembled from various separate components in the manner of a modular system. These separate components comprise at least the carrier device, the lens element, and the holding device. The individual components are preferably detachably connected to one another or held together. In particular, the components can be held together in a force-fitting and/or form-fitting manner. The components can be arranged essentially one behind the other along the aforementioned vertical direction (e.g., in a sandwich structure). This allows different variants of the carrier device and the lens element, as well as optional components, to be easily combined with one another on the basis of a universal module platform in order to produce different optoelectronic devices. Some components of the different optoelectronic devices can be similar (e.g., the holding device).

The holding device serves to hold at least the carrier device and the lens element relative to one another, maintaining an alignment of the lens element with respect to the carrier device, which is equipped with the at least one optoelectronic transmitter and/or receiver. The holding device can secure and/or fix the lens element directly or indirectly to the carrier device. For this purpose, the holding device can, for example, comprise a clamp or at least one clamp-like element that encompasses or engages behind at least the carrier device and the lens element. Additionally or alternatively, the holding device can be designed in the manner of a housing or cage, although such a holding device does not have to completely enclose the carrier device and the lens element, in particular not over its entire surface and not on each side of the device. The holding device can thus at least functionally serve as a housing for the device or even be a true, at least predominantly closed housing, ensuring at least a mechanical encapsulation of the components of the device.

The holding device can, in particular, comprise a base plate with multiple side walls and/or with multiple, in particular two, four, or six pairs of opposing holding arms or holding sections. The base plate can have a uniform plate size, which is adapted, for example, to the shape and size of the carrier device and/or the lens element. This allows the device to be designed to be robust and compact, while preventing dirt and the like from adhering to or penetrating the device. The base plate is preferably arranged on an underside of the carrier device and forms a base section. The holding device can have a cross-section that is at least partially stepped and/or U-shaped and/or has a plurality of openings, so that a component of the device inserted into the holding device, which component is designed at least partially to be complementary to the holding device, is captured laterally and/or vertically in the holding device without the need for separate fastening means.

Furthermore, the optoelectronic device can comprise at least one aperture element provided above the support device and having at least one aperture section for the at least one optoelectronic transmitter and/or the at least one optoelectronic receiver. The aperture element can, in particular, provide a geometric delimitation of a beam of rays detected by the optoelectronic receiver.

The holding device can, in particular, be designed in two parts, with the holding device comprising a lower part and an upper part. In this case, the carrier device and the lens element can, for example, be trapped between the lower part and the upper part of the holding device. The lower part and the upper part of the holding device are fastened to one another, in particular, by means of a snap-in connection.

The upper part of the holding device can form at least one aperture section for the at least one optoelectronic transmitter and/or the at least one optoelectronic receiver.

As an alternative to a two-part holding device, it can also be designed in one piece and have an open upper side, wherein the lens element or the aperture element is arranged on the upper side of the holding device.

The invention further relates to a system comprising a plurality of optoelectronic devices according to one of the above-described embodiments, wherein the contact chambers of at least some of the plurality of optoelectronic devices are each equipped with at least one optoelectronic transmitter and/or at least one optoelectronic receiver in different configurations. This allows the aforementioned modular system to be implemented.

Each of the plurality of optoelectronic devices may comprise a respective lens element provided above the carrier device and comprising at least one lens section for the at least one optoelectronic transmitter and/or the at least one optoelectronic receiver, wherein the lens elements of at least some of the plurality of optoelectronic devices differ in their respective shape from the lens elements of other of the plurality of optoelectronic devices.

The plurality of optoelectronic devices may further each have a holding device that holds the carrier device and the lens element of the respective optoelectronic device relative to one another.

The system can be configured such that each of the plurality of optoelectronic devices has at least one aperture element provided above the carrier device and has at least one aperture section for the at least one optoelectronic transmitter and/or the at least one optoelectronic receiver, wherein the aperture elements of at least some of the plurality of optoelectronic devices differ from the aperture elements of other of the plurality of optoelectronic devices with regard to their respective arrangement and/or shape.

Fig. 1

eine Explosionsdarstellung einer Ausführungsform einer optoelektronischen Vorrichtung ist;

Fig. 2

eine Perspektivansicht von Komponenten der Vorrichtung von Fig. 1 ist;

Fig. 3

eine Perspektivansicht der Vorrichtung von Fig. 1 in einem zusammengesetzten Zustand ist;

Fig. 4

eine Draufsicht von oben auf ein Linsenelement der Vorrichtung von Fig. 1 ist;

Fig. 5

zwei Perspektivansichten eines Montageorts für eine Vorrichtung gemäß Fig. 1, (a) ohne montierte Vorrichtung und (b) mit montierter Vorrichtung, umfasst;

Fig. 6

zwei Perspektivansichten eines weiteren Montageorts für eine Vorrichtung gemäß Fig. 1, (a) ohne montierte Vorrichtung und (b) mit montierter Vorrichtung, umfasst;

Fig. 7

eine Perspektivansicht von schräg oben auf eine Trägereinrichtung gemäß der Erfindung für die Vorrichtung von Fig. 1 ist.

Fig. 8

eine Draufsicht von oben auf eine Trägereinrichtung 2. gemäß der Erfindung für die Vorrichtung von Fig. 1 ist.

Fig. 9

eine Draufsicht von unten auf die Trägereinrichtung von Fig. 1, Fig. 7 und Fig. 8 ist.

The invention is described below purely by way of example with reference to the drawings in which:

Fig. 1

is an exploded view of an embodiment of an optoelectronic device;

Fig. 2

is a perspective view of components of the device of Fig. 1;

Fig. 3

is a perspective view of the device of Figure 1 in an assembled state;

Fig. 4

is a top plan view of a lens element of the device of Fig. 1;

Fig. 5

two perspective views of a mounting location for a device according to Fig. 1, (a) without the device mounted and (b) with the device mounted;

Fig. 6

two perspective views of another mounting location for a device according to Fig. 1, (a) without the device mounted and (b) with the device mounted;

Fig. 7

a perspective view obliquely from above of a support device according to the invention for the device of Fig. 1.

Fig. 8

a top plan view of a support device 2 according to the invention for the device of Fig. 1.

Fig. 9

a bottom plan view of the support device of Fig. 1, Fig. 7 and Fig. 8.

In the drawings, identical or similar elements are identified by the same reference numerals.

An optoelectronic device 10 comprises a substantially plate-shaped carrier device 12, a first aperture element 14, a lens element 16, and a holding device comprising a lower part 18 and an upper part 20. In the embodiment shown here, the upper part 20 of the holding device simultaneously forms a second aperture element of the optoelectronic device 10. All of these components are in Fig. 1 shown from an angle above, ie the perspective is directed obliquely towards the respective top side of the components.

The following describes how the device 10 is assembled, with the individual components of the optoelectronic device 10 being explained in more detail.

First, the carrier device 12 is inserted into the lower part 18. The lower part 18 with the inserted carrier device 12 is in Fig. 2 shown, the scale being Fig. 2 opposite Fig. 1 is enlarged. The lower part 18 has a base section 22 with a plurality of connecting sections projecting upwards therefrom. In detail, two side parts 24', 24" which are mirror-symmetrical with respect to the longitudinal extent of the lower part 18 extend upwards away from the base section 22, wherein the side parts 24', 24" are aligned substantially perpendicular to the base section 22. Furthermore, the base section 22 has a front-side latch 26 and a comb section 28. The lower part 18, thus U-shaped, has a receiving space 30 which is completely open upwards and partially open laterally for receiving the carrier device 12, the first aperture element 14 and the lens element 16. The size and shape of the receiving space 30 correspond in sections essentially to the size and shape of the carrier device 12, the aperture element 14 and the lens element 16. The components 12, 14 and 16 can thus be inserted into the lower part 18 with a precise fit.

The side parts 24', 24" each have two rectangular openings 32' and 32" as well as two spaced-apart, external locking lugs 34. Furthermore, the side parts 24', 24" each have a centrally arranged, external locking bar 36. The receiving space 30 is widened in the area of the comb section 28 compared to the central area.

According to the invention, the carrier device 12 is designed as a lead frame, which has a segmented conductor strip 93 made of metal overmolded with plastic (so-called "pre-molded lead frame") and which can be variably equipped. The circumference of the carrier device 12 is designed to complement the receiving space 30 of the lower part 18, so that the carrier device 12, as shown in Fig. 2 shown can be inserted into the lower part 18, wherein the carrier device 12 is laterally captured in the plane of the bottom section 22 between the latch 26, the comb section 28 and the side parts 24', 24". The upper side of the carrier device 12 is divided longitudinally into several contact chambers 38, wherein in principle an optoelectronic transmitter or an optoelectronic receiver can be mounted and electrically contacted in each contact chamber 38. The Fig. 1 illustrated inventive

Carrier device 12 has an optoelectronic transmitter 40, two optoelectronic receivers 42, and an ASIC 44 (Application-Specific Integrated Circuit). For connecting the carrier device 12 to an external microcontroller (not shown), a plurality of electrical connections 46 are provided, which extend away from the carrier device 12 on a narrow side of the carrier device 12 in a uniform arc shape as a respective contact tongue. When the carrier device 12 is inserted into the lower part 18, the connections 46 engage resiliently in the comb section 28 of the lower part 18, thereby forming a flexible contact zone for contacting an electrical connector, in particular a flexible flat cable (not shown), inserted above the contact zone into a free space of the device 10 ( Fig. 2 ).

After the carrier device 12 has been inserted into the lower part 18, the first aperture element 14 is inserted into the receiving space 30 of the lower part 18 (not shown). In this case, a respective lateral projection 48 of the first aperture element 14 engages in a respective opening 32', 32" of the side parts 24', 24" ( Fig. 1 and Fig. 2 ). Furthermore, a widened area 50 of the first aperture element 14 engages in the receiving space 30 widened in the area of the comb section 28. In this way, the first aperture element 14 is not displaceable, in particular in the longitudinal direction of the device 10, and is secured in this regard to the lower part 18. The first aperture element 14 in Fig. 1 further comprises three differently formed aperture sections 52a, 52b and 52c, which are arranged one behind the other in the longitudinal direction on the first aperture element 14 and are formed by openings with a substantially frustoconical border.

Next, the lens element 16 is inserted into the receiving space 30 of the lower part 18, with a lateral projection 54', 54" engaging in a respective opening 32', 32" of the side parts 24', 24". Furthermore, a widened region 56 of the lens element 16 engages in the region of the receiving space 30 widened in the region of the comb section 28. In this way, the lens element 16 is fixed to the lower part 18 in the longitudinal and transverse directions in a plane parallel to the bottom section 22.

Finally, the upper part 20 of the holding device is fastened to the lower part 18 by means of a snap-in connection, wherein the upper part 20 has four downwardly projecting locking tabs 58 for this purpose, which each lock with one of the locking lugs 34 of the side parts 24', 24". The support device 12, the aperture element 14 and the lens element 16 are now completely captured between the upper part 20 and the lower part 18 and fixed to one another. The lower part 18 of the holding device, the support device 12, the aperture element 14, the lens element 16 and the upper part 20 of the holding device are thus arranged one behind the other along a vertical direction.

The device 10 assembled in this way is in Fig. 3 shown in perspective. The upper part 20 (second aperture element) has two aperture sections 52', 52" (cf. Fig. 1 and Fig. 3 ). Furthermore, it can be seen that the upper part 20 engages in a complementary engagement section 90 of the lens element 16 (cf. Fig. 1 ) so that the upper part 20 is flush with the lens element 16, forming a substantially smooth upper surface of the device 10. Furthermore, the lens element 16 is additionally fixed, and the size of the device 10 is kept small.

The three aperture sections 52a, 52b and 52c of the first aperture element 14 in combination with the two aperture sections 52', 52" of the second aperture element or upper part 20 determine the optical properties of the optoelectronic device 10 and suppress unwanted interference by geometrically limiting the respective cross-section of the emitted or received beams.

The device 10 has a slender, essentially cuboid-shaped base body, with the outer skin of the device being characterized by surfaces that are essentially flush with one another. In particular, the locking tabs 58 are flush with the outer side of the side parts 24', 24".

The substantially plate-shaped lens element 16 has an integrally formed, mechanical coding section 60 which extends longitudinally away from the otherwise plate-shaped lens element 16 ( Fig. 1 ). The annular coding section 60 has a hollow cylinder 64, which projects perpendicularly from a plane of extension of three lens sections 68 of the lens element 16 arranged one behind the other in the longitudinal direction. The lens sections 68 of the lens element 16 have beam-shaping properties and can comprise, for example, convex lenses, biconvex lenses, or Fresnel lenses.

Further details on the lens element 16 are in Fig. 4 in which the lens element 16 is shown in a plan view of the top side of the lens element 16. The Fig. 4 The lens element 16 shown has a first coding element 62 and a second coding element 63 on the coding section 60. The first coding element 62 is formed as a rectangular depression on the outer circumference of the hollow cylinder 64 of the coding section 60, wherein the first coding element 62 is parallel to the cylinder axis (in Fig. 4 perpendicular to the plane of the paper), so that a rectangular groove is formed in the cylinder jacket of the hollow cylinder 64. An annular disc 66 extends within the hollow cylinder 64 perpendicular to its longitudinal axis. On the inner circumference of the annular disc 66, the second coding element 63 is provided, which is designed as a substantially semicircular recess and extends parallel to the cylinder axis as a round groove.

The first coding element 62 is provided merely by way of example to identify the underlying device 10 with respect to a device type. A device type is characterized in particular by the respective design of the lens element 16, the upper part, and/or the first aperture element, as well as by the equipping of the carrier device 12 with optoelectronic transmitters 40 and receivers 42. In particular, the position and design of lens sections 68 of the lens elements 16 can differ. The second coding element 63 is provided to identify the device 10 with respect to a bus provided for connecting the carrier device 12 to a microcontroller.

This list is merely exemplary. In principle, the coding elements 62, 63 can identify the optoelectronic device 10 with respect to freely definable features. In addition to their shape, the coding elements 62, 63 are defined solely by their angular position around the longitudinal axis of the hollow cylinder 64, whereby the angular position of the respective coding element 62, 63 enables unambiguous identification of the device 10 with respect to the feature assigned to the respective coding element 62, 63.

In Fig. 5 Two perspective views of a mounting location for an optoelectronic device 10 are shown, which in connection with the invention is also referred to as the mounting environment of the optoelectronic device 10. In Fig. 5 (a) the mounting location is shown as such, i.e., without a corresponding device 10 being mounted. The mounting location is characterized by a section of a base plate 70 with a rectangular opening 72, on the inner longitudinal edges of which two opposing locking arms 74', 74" are provided. Adjacent to a narrow side of the opening 72, a cylinder 76 is formed, which extends perpendicular to the plane of the base plate 70 and is provided with a central opening 78. The opening 78 can have an internal thread for a screw, not shown.

The cylinder 76 has a first decoding element 80 and a second decoding element 81. The first decoding element 80 is T-shaped and spaced radially from the outer surface of the cylinder 76. The height of the decoding element 80 is less than the height of the cylinder 76. The second decoding element 81 is formed on the end face of the cylinder 76 and has a cylindrical shape in sections. The cylinder 76 and the decoding elements 80 and 81 together form a decoding section 83 for the coding section 60 of a device 10. The decoding section 83 is formed integrally with the base plate 70. The edges of the cylinder 76 and of the decoding elements 80 and 81 each have a chamfer, which facilitates the assembly of the device 10.

The one in Fig. 5 (a) The device 10 to be mounted at the mounting location shown is mounted with the top of the device 10 facing forward, so that the device 10 Fig. 5 (b) , in which the top side of the device 10 faces the opening 72 of the base plate 70. The decoding section 83 ensures that only that device 10 can be mounted which has a coding section 60 complementary to the decoding section 83, which clearly defines the mounting of the device 10 at the respective mounting location by means of a positive fit. In the mounted state, the first coding element 62 engages in the first decoding element 80. Furthermore, the second coding element 63 partially engages in the second decoding element 81. In addition, the locking arms 74', 74" are locked to the locking bars 36 of the lower part 18, so that the device 10 is securely fastened to the base plate 70.

In Fig. 6 another mounting location for a device 10 is shown, wherein the device 10, in contrast to the case of Fig. 5 (b) in Fig. 6 (b) is mounted upside down, ie the radiation-emitting or radiation-receiving upper side of the device 10 is facing away from the base plate 70. The device 10 can thus be flexibly mounted in different ways at a substantially identically designed mounting location, wherein only the positions of the coding elements 62, 63 and the positions of the decoding elements 80, 81 need to be coordinated with one another (cf. Fig. 5 (a) and Fig. 6 (a) ).

Preferably, the basic shape of the coding section 60 (in particular the hollow cylinder 64 with annular disk 66) is designed symmetrically with respect to a center plane of the optoelectronic device 10, which is perpendicular to the vertical direction. Furthermore, it is preferred if a fastening device for fastening the optoelectronic device 10 to a mounting environment (in particular the locking latches 36 of the holding device for the locking arms 74', 74" of the base plate 70) is designed symmetrically with respect to a center plane of the optoelectronic device 10, which is perpendicular to the vertical direction. As a result, the device 10 can be particularly easily fastened to the mounting environment in one of two different orientations of its upper side, as can be seen from the Figs. 5 and 6 was explained.

Further details of the carrier device 12 according to the invention are given below with reference to Fig. 7 to 9 explained. The Fig. 7 The carrier device 12 shown corresponds to that of Fig. 1 . The Fig. 8 The support device 12 shown in a top view differs from the one shown in Fig. 7 shown carrier device 12 essentially in that the carrier device 12 of Fig. 8 does not have ASIC 44.

The carrier device 12 basically has a plurality of electrically conductive contact tracks 92, which are formed on a segmented conductor strip 93. In the illustrated embodiments of the carrier device 12, five contact tracks 92 are provided, by way of example, which extend in the longitudinal direction on the upper side of the carrier device 12 through all of the five contact chambers 38 and are essentially parallel to one another. Thus, each contact track 92 can be electrically contacted in each contact chamber 38. It is understood that for this purpose, not every contact track 92 has to extend completely through a respective contact chamber 38. Thus, a respective contact track 92 can also run only partially through a contact chamber 38 or be only partially exposed, whereby, for example, an optoelectronic receiver 42 can still be installed in the respective contact chamber 38.

For the installation of (opto-)electronic components 40, 42, 44, a centrally arranged contact track 92' is provided, on which the components 40, 42, 44 are mounted in a variable configuration and which, in the context of the invention, is also referred to as an installation contact track. Additionally, the components 40, 42, 44 can be electrically connected to the central contact track 92' (for example, by direct contact on their underside), wherein the central contact track 92' can carry a predetermined electrical potential. Each of the components 40, 42, 44 is preferably electrically connected to at least one further contact track 92 (by means of a respective bonding wire 100). After a component 40, 42, 44 has been installed in a respective contact chamber 38, the respective contact chamber 38 can be individually filled with a potting material, in particular with an epoxy resin, a silicone, or the like (not shown). The durability of the carrier device and the reliability of the optoelectronic device can be improved, and optical properties can be adjusted (refractive index, spectral filtering).

The central contact track 92' is wider relative to the other adjacent contact tracks 92, so that components 40, 42, 44 of different sizes can be installed together on the central contact track 92'. Furthermore, the central contact track 92' has a locally widened area 96, so that the ASIC 44 can be conveniently installed in the area 96 ( Fig. 7 ). The remaining (non-central) contact tracks 92 are routed in sections directly or indirectly adjacent to the area 96 via another contact track 92 and can be contacted via a respective lateral electrical connection 98. Furthermore, all contact tracks 92, 92' can be contacted via a respective front-side electrical connection 98, wherein the front-side electrical connections 98 are located opposite the electrical connections 46, 46' (contact tongues) in the longitudinal direction.

The central contact track 92' is formed integrally with the electrical connection 46'. The other electrical connections 46, however, are separated from the contact tracks 92 and can only be contacted via a respective contact field 94 on the upper side of the carrier device 12, wherein the contact fields 94 are electrically insulated from the contact tracks 92. In addition, a contact field 94' is provided, which is connected to a lateral electrical connection 98'. The widened region 96 of the central contact track 92' is arranged in the longitudinal direction essentially between the contact fields 94 and the contact tracks 92. Thus, a respective contact track 92 can be electrically connected to a respective electrical connection 46 via the ASIC 44 with little wiring effort ( Fig. 7 ). Alternatively, a respective contact track 92 can also be connected directly to a respective contact field 94 or to the respective electrical connection 46 by means of bonding wire 100 ( Fig. 8 ).

The support device 12 has a frame section 102 with a plurality of transversely extending separating webs 104. The frame section 102 defines the contact chambers 38, whereby optical crosstalk between the contact chambers 38 is prevented in the horizontal direction, i.e., the frame section 102 is opaque.

In Fig. 9 The carrier device 12 is shown in a bottom view. Several essentially round contacting areas 106 are arranged on the underside for a respective electrical contact. One of the contacting areas 106 can serve, in particular, as a so-called fuse pad. The contacting area 106' can be electrically connected to the top-side contact field 94'.

A particular advantage of the carrier device 12 according to the Fig. 7 to 9 is that the contact chambers 38 can be equipped with (opto-)electronic components 40, 42, 44 in a variable configuration in terms of number and arrangement in order to be able to produce an optoelectronic device 10 adapted to an individual application, whereby other configurations are also possible than in the Fig. 7 and 8 shown.

List of reference symbols

10

optoelectronic device

12

Carrier facility

14

first aperture element

16

lens element

18

lower part

20

Upper part or second aperture element

22

floor section

24

side panel

26

Bar

28

Comb section

30

recording room

32

opening

34

locking lugs

36

locking bolt

38

Contact chamber

40

Sender

42

Recipient

44

ASIC

46

Connection

48

projection

50

Area

52

Aperture section

54

projection

56

Area

58

locking tab

60

Coding section

62

first coding element

63

second coding element

64

hollow cylinder

66

Ring disc

68

lens section

70

Base plate

72

opening

74

locking arm

76

cylinder

78

opening

80

first decoding element

81

second decoding element

83

Decoding section

90

Intervention section

92

Contact path

93

Conductor strips

94

Contact field

96

widespread area

98

electrical connection

100

Bonding wire

102

frame section

104

Divider

106

Contact area

Claims (15)

1. A carrier device (12) for an optoelectronic apparatus (10),

   wherein the carrier device (12) has a longitudinal extent and a transverse extent,

   characterized in that

   the carrier device (12) has a plurality of electrically conductive contact tracks (92) aligned in parallel with the longitudinal extent, and

   the carrier device (12) has a plurality of contact chambers (38) at an upper side which are aligned in parallel with the transverse extent and which are optically isolated from one another;

   wherein each of the plurality of contact tracks (92) is electrically contactable in each of the plurality of contact chambers (38) to be able to install at least one optoelectronic transmitter (40) and/or at least one optoelectronic receiver (42) in the respective contact chamber (38) in a variable mounting; wherein the carrier device (12) has three, four, five or six contact tracks (92);

   wherein the carrier device (12) has a lead frame which is overmolded with a plastic and which comprises a segmented lead strip (93) of metal, wherein the electrically conductive contact tracks (92) are formed at the segmented lead strip (93), wherein the segmented lead strip (93) is at least partly surrounded by a frame section (102) of the plastic;

   wherein the frame section (102) comprises partition webs (104) which extend in parallel with the transverse extent of the carrier device (12) and defines the plurality of contact chambers (38) at the upper side of the lead strip (93), wherein the contact chambers (39) are separated from one another by the partition webs (104);

   and wherein the frame section (102) is formed from a light-impermeable material or is covered at least sectionally by a light-impermeable layer.
2. A carrier device (12) in accordance with claim 1, wherein the carrier device (12) has three, four, five or six contact chambers (38).
3. A carrier device (12) in accordance with claim 1 or claim 2, wherein the number of contact tracks (92) corresponds to the number of contact chambers (38) or differs by at most the number one.
4. A carrier device (12) in accordance with at least one of the preceding claims, wherein the lead strip (93) forms at least one electrical connector (46, 98) for a respective contact track (92).
5. A carrier device (12) in accordance with claim 4, wherein the at least one electrical connector (46) forms an elastic contact tongue.
6. A carrier device (12) in accordance with claim 4 or claim 5, wherein the lead strip (93) forms a plurality of electrical connectors (46, 98).
7. A carrier device (12) in accordance with claim 6, wherein the plurality of electrical connectors (46) together form a contacting zone for an electrical plug-in connector.
8. A carrier device (12) in accordance with claim 6 or claim 7, wherein at least one of the plurality of electrical connectors (46) is electrically insulated from the plurality of contact tracks (92).
9. A carrier device (12) in accordance with at least one of the claims 6 to 8, wherein at least one of the plurality of electrical connectors (46) is formed integrally with one of the plurality of contact tracks (92).
10. A carrier device (12) in accordance with at least one of the preceding claims, wherein an installation contact track (92') of the plurality of contact tracks (92) is wider relative to the other ones of the plurality of contact tracks (92).
11. A carrier device (12) in accordance with claim 10, wherein the installation contact track (92') has an enlarged region (96) for receiving an application-specific integrated circuit (44).
12. A carrier device (12) in accordance with at least one of the preceding claims, wherein a lower side of the carrier device (12) has at least one contacting region (106) in which a respective one of the plurality of contact tracks (92) is exposed for an electrical contacting.
13. An optoelectronic apparatus (10) comprising a carrier device (12) in accordance with at least one of the preceding claims, wherein the optoelectronic apparatus (10) furthermore has a lens element (16) and a holding device; wherein the lens element (16) is provided above the carrier device (12) and has at least one lens section (68) for the at least one optoelectronic transmitter (40) and/or for the at least one optoelectronic receiver (42); and wherein the holding device holds the carrier device (12) and the lens element (16) relative to one another.
14. A system comprising a plurality of optoelectronic apparatus (10) in accordance with claim 13, wherein the contact chambers (38) of at least some of the plurality of optoelectronic apparatus (10) are equipped in different configurations with a respective at least one optoelectronic transmitter (40) and/or at least one optoelectronic receiver (42).
15. A system in accordance with claim 14, wherein each of the plurality of optoelectronic apparatus (10) has a lens element (16) which is provided above the carrier device (12) and which has at least one lens section (68) for the at least one optoelectronic transmitter (40) and/or for the at least one optoelectronic receiver (42), with the lens elements (16) of at least some of the plurality of optoelectronic apparatus (10) differing with respect to their respective shapes from the lens elements (16) of other ones of the plurality of optoelectronic apparatus (10).