HK1251801B - Electronic device and manufacturing method - Google Patents

Description

Electronic device and manufacturing method

Technical Field

The present invention relates to the field of electronic technology, and in particular to an electronic device and a manufacturing method.

Background Art

As mobile phones move towards full-screen displays, their screen-to-body ratios are increasing, placing higher demands on hardware and structural technology. Traditionally, existing phones have infrared sensors positioned above the screen. However, with less space available outside the screen, infrared sensors can no longer be placed in their original locations. Therefore, how to position infrared sensors within full-screen displays has become a pressing challenge.

Summary of the Invention

Embodiments of the present invention provide an electronic device and a manufacturing method.

An electronic device according to an embodiment of the present invention includes:

A light-transmitting display screen, the light-transmitting display screen comprising an upper surface and a lower surface opposite to the upper surface, the lower surface comprising a display area and a frame area surrounding the display area, the light-transmitting display screen being configured to emit light through the display area and display through the upper surface, the display area comprising a low-frequency changing pixel area for displaying low-frequency changing content; and

An infrared light sensor includes a transmitter arranged in the low-frequency change pixel area and a receiver arranged in the frame area, the transmitter is used to emit infrared rays through the upper surface, and the receiver is used to receive infrared rays through the frame area.

In some embodiments, the low-frequency changing pixel area is adjacent to the border area.

In some embodiments, the infrared light sensor includes a proximity sensor, which includes a signal transmitter and a signal receiver, wherein the signal transmitter is used to emit infrared light through the upper surface, and the signal receiver is used to receive infrared light emitted by an object through the frame area to detect the distance between the object and the electronic device.

In some embodiments, the transmitter and the receiver are separate structures.

In some embodiments, the transmitter and the receiver are an integral structure.

In some embodiments, the frame area includes a window area, the receiver is arranged opposite to the window area, and the receiver is used to receive infrared rays through the window area.

In certain embodiments, a coating layer is coated on the window area and covers the receiver, the coating layer is used to transmit infrared light and intercept visible light, and the receiver is used to receive infrared light through the coating layer and the window area.

In certain embodiments, the coating layer includes IR ink, the infrared transmittance of the IR ink is greater than 85%, the visible light transmittance of the IR ink is less than 6%, and the wavelength of infrared light that the IR ink can transmit is 850nm-940nm.

In certain embodiments, the light-transmitting display screen comprises an OLED display screen.

In some embodiments, the electronic device also includes a translucent touch panel and a translucent cover formed on the translucent touch panel, the translucent touch panel is arranged on the translucent display screen, the upper surface faces the translucent cover, and the visible light transmittance and infrared light transmittance of the translucent cover and the translucent touch panel are both greater than 90%.

In some embodiments, the ratio of the area of the display region to the area of the light-transmitting cover plate is greater than 90%.

In some embodiments, the electronic device further includes a buffer layer covering the lower surface.

In some embodiments, the electronic device further includes a metal sheet covering the buffer layer.

The manufacturing method according to the embodiment of the present invention comprises the steps of:

Providing a light-transmitting display screen, the light-transmitting display screen comprising an upper surface and a lower surface opposite to the upper surface, the lower surface comprising a display area and a frame area surrounding the display area, the display area comprising a low-frequency changing pixel area for displaying low-frequency changing content; and

An infrared light sensor is provided, which includes a transmitter arranged in the low-frequency change pixel area and a receiving end arranged in the frame area, the transmitter is used to emit infrared rays through the upper surface, and the receiver is used to receive infrared rays through the frame area.

In certain embodiments, the manufacturing method further comprises the steps of:

Arranging a light-transmitting touch panel on the light-transmitting display screen; and

A light-transmitting cover plate is provided on the light-transmitting touch panel.

In certain embodiments, the manufacturing method further comprises the steps of:

A window area is opened in the frame area, the receiver is arranged opposite to the window area, and the receiver is used to receive infrared rays through the window area.

In certain embodiments, the manufacturing method further comprises the steps of:

A coating layer is coated on the window area, the coating layer is used to transmit infrared light and intercept visible light, and the receiver is used to receive infrared light through the coating layer and the window area.

In certain embodiments, the manufacturing method further comprises the steps of:

A buffer layer is provided on the lower surface, and the buffer layer covers the lower surface.

In certain embodiments, the manufacturing method further comprises the steps of:

A metal sheet is provided, wherein the metal sheet covers the buffer layer.

In the electronic device and manufacturing method of the embodiments of the present invention, the electronic device utilizes a translucent display screen. Therefore, in the case of a full-screen display, an infrared light sensor can be positioned below the translucent display screen. The display area of the translucent display screen includes a low-frequency changing pixel region. The infrared light sensor's emitter can be integrated with the pixels in the low-frequency changing pixel region to prevent the emitted infrared light from affecting the operational stability of the TFTs in the display area. Furthermore, placing the infrared light sensor's receiver in the frame area near the low-frequency changing pixel region ensures stable reception of physically reflected infrared light, thereby ensuring stable operation of the infrared light sensor.

Additional aspects and advantages of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description which follows, or may be learned by practice of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments with reference to the following drawings, in which:

FIG1 is a perspective schematic diagram of an electronic device according to an embodiment of the present invention;

FIG2 is a schematic plan view of an electronic device according to an embodiment of the present invention;

FIG3 is a schematic cross-sectional view along line III-III of FIG2 ;

FIG4 is a perspective view of a light-transmitting display screen according to an embodiment of the present invention;

FIG5 is a schematic cross-sectional view of an electronic device according to certain embodiments;

6 to 10 are enlarged schematic views of position VI in FIG. 2 in certain embodiments;

FIG. 11 is a schematic flow chart of a method for manufacturing an electronic device according to the present invention.

12 to 15 are schematic flow charts of a method for manufacturing an electronic device according to certain embodiments of the present invention.

Explanation of the main component symbols: electronic device 100, transparent cover 11, transparent touch panel 12, transparent display screen 13, upper surface 131, lower surface 132, display area 1321, frame area 1322, low-frequency changing pixel area 1323, window area 1324, infrared light sensor 14, emitter 141, receiver 142, coating layer 15, buffer layer 16, metal sheet 17, shell 20.

DETAILED DESCRIPTION

The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and are not to be construed as limiting the present invention.

Electronic devices, such as mobile phones or tablets, typically use infrared sensors to detect the distance between the electronic device and the user. For example, a mobile phone has an infrared sensor installed in the upper area of the phone. When the user holds the phone close to their head while making a voice call or performing related operations, the infrared sensor feeds distance information back to the processor, which then executes corresponding instructions, such as turning off the lights on the display assembly. In related technologies, installing infrared sensors on electronic devices requires opening corresponding holes in the housing for transmitting and receiving infrared light signals. However, with the development of electronic devices, people have increasingly higher requirements for the appearance and operating experience of mobile phones. Mobile phones have been developing towards full-screen phones, and full-screen phones have formed an ultra-narrow bezel between the housing and the display assembly. Due to the small width of the ultra-narrow bezel, there may not be enough space to open a hole. Even if a hole is opened, the overall strength of the bezel will be reduced, thereby reducing the reliability of the electronic device.

Referring to Figures 1 through 4 , an electronic device 100 according to an embodiment of the present invention includes a light-transmitting display screen 13, an infrared light sensor 14, and a housing 20. The electronic device 100 may be a mobile phone, a tablet computer, or the like. While the electronic device 100 according to the embodiment of the present invention is described using a mobile phone as an example, the specific form of the electronic device 100 may also be other, and this is not intended to be limiting.

The light-transmitting display screen 13 includes an upper surface 131 and a lower surface 132, with the upper surface 131 and the lower surface 132 being disposed opposite each other. The lower surface 132 includes a display area 1321 and a frame area 1322, with the frame area 1322 surrounding the display area 1321. The light-transmitting display screen 13 is configured to emit light through the display area 1321 and display through the upper surface 131. The display area 1321 includes a low-frequency changing pixel area 1323, which is configured to display low-frequency changing content. The infrared light sensor 14 includes an emitter 141 and a receiver 142. The emitter 141 emits infrared light through the upper surface 131, and the receiver 142 receives infrared light through the frame area 1322.

The low-frequency changing pixel area 1323 is used to display content with a low frequency of change during use, such as the status bar, signal bar, battery display bar at the top of the mobile phone, and the virtual buttons at the bottom of the mobile phone. The low-frequency changing pixel area 1323 is generally set at the top or bottom of the display area 1321. In an embodiment of the present invention, the emitter 141 of the infrared light sensor 14 is integrated with the pixels of the low-frequency changing pixel area 1323 to avoid the emitted infrared rays from affecting the working stability of the TFT of the display area 1321. Specifically, in some examples, the emitter 141 can be designed to be integrated with the pixel points. When the emitter 141 is working, the corresponding pixel points do not emit light. The emitter 141 can emit infrared rays through the upper surface 131 of the translucent display screen 13. In other examples, the emitter 141 can be integrated in the middle of two adjacent pixels. When the emitter 141 is working, the pixel can emit light or not. It can be understood that the integrated arrangement of the emitter 141 of the infrared light sensor 14 and the pixel point can avoid affecting the display of the light-transmitting display screen 13 when the emitter 141 is working.

The infrared light sensor 14 includes a transmitter 141 and a receiver 142. The transmitter 141 is used to emit infrared light. When the emitted infrared light encounters an obstacle in the detection direction, a portion of the infrared light will be reflected back and received by the receiver 142. The processor calculates the time from the emission to the reflection of the infrared light, and the distance between the electronic device 100 and the obstacle can be determined and corresponding adjustments can be made. When the user is answering or making a call, the electronic device 100 is close to the head, the transmitter 141 emits infrared light, and the receiver 142 receives the reflected infrared light. The processor calculates the time from the emission to the reflection of the infrared light, and issues a corresponding instruction to control the screen to turn off. When the electronic device 100 is away from the head, the processor again calculates and issues an instruction based on the feedback data to re-light the screen. In this way, it not only prevents the user from operating it incorrectly, but also saves the battery of the mobile phone.

In some examples, the emitter 141 and receiver 142 of the infrared light sensor 14 are an integrated structure. Specifically, when the infrared light sensor 14 is an integrated structure, the emitter 141 and receiver 142 of the infrared light sensor 14 can be both set in the low-frequency change pixel area 1323. Of course, the emitter 141 can also be set in the low-frequency change pixel area 1323, and the receiver 142 can be set in the border area 1322. In addition, in other examples, the emitter 141 and receiver 142 of the infrared light sensor 14 can also be a split structure. Specifically, when the emitter 141 and receiver 142 are a split structure, the emitter 141 can be set in the low-frequency change pixel area 1323, and the receiver 142 can be set at any position in the border area 1322. It can be understood that no matter which of the above-mentioned settings is used, the emitter 141 of the infrared light sensor 14 is set in the low-frequency change pixel area 1323, and the infrared light emitted by it has little effect on the display area 1321, which can avoid the infrared light emitted by the emitter 141 affecting the working stability of the TFT in the display area 1321, so that the transparent display screen 13 and the infrared light sensor 14 can realize their respective functions without interfering with each other.

Housing 20 houses and protects components such as the translucent display screen 13 and infrared sensor 14, thereby preventing direct damage to these components from external factors. Housing 20 can be formed from aluminum alloy using a CNC machine, or can be injection molded from polycarbonate (PC) or a PC+ABS material.

In summary, the electronic device 100 according to the embodiment of the present invention utilizes a translucent display screen 13. Therefore, in the case of a full-screen display, the infrared light sensor 14 can be positioned below the translucent display screen 13. The display area 1321 of the translucent display screen 13 includes a low-frequency changing pixel area 1323. Placing the emitter 141 of the infrared light sensor 14 within the low-frequency changing pixel area 1323 prevents the emitted infrared light from affecting the operating stability of the TFTs in the display area 1321. Simultaneously, placing the receiver 142 of the infrared light sensor 14 within the border area 1322 near the low-frequency changing pixel area 1323 ensures stable reception of physically reflected infrared light, thereby ensuring stable operation of the infrared light sensor 14.

In some embodiments, the light-transmitting display screen 13 includes an OLED display screen.

Specifically, the organic light-emitting display (OLED display) has good light transmittance and can transmit visible light and infrared light. Therefore, when the OLED display is displaying the content effect, it does not affect the infrared light sensor 14 from emitting and receiving infrared light. The light-transmitting display 13 can also be a Micro LED display, which also has good light transmittance for visible light and infrared light. Of course, these displays are only exemplary, and the embodiments of the present invention are not limited thereto.

Referring to FIG3 , in some embodiments, the electronic device 100 further includes a transparent cover plate 11 and a transparent touch panel 12. The transparent cover plate 11 is formed on the transparent touch panel 12, which is disposed on a transparent display screen 13, with the upper surface 131 of the transparent display screen 13 facing the transparent touch panel 12. The transparent cover plate 11 and the transparent touch panel 12 both have a visible light transmittance and an infrared light transmittance greater than 90%.

Specifically, the translucent touch panel 12 is mainly used to receive the input signal generated when the user touches the translucent touch panel 12 and transmit it to the circuit board for data processing, so as to obtain the specific position where the user touches the translucent touch panel 12. Among them, the translucent touch panel 12 can be bonded to the translucent display screen 13 by using In-Cell or On-Cell bonding technology, which can effectively reduce the weight of the display screen and reduce the overall thickness of the display screen. In addition, the translucent cover plate 11 is arranged on the translucent touch panel 12, which can effectively protect the translucent touch panel 12 and its internal structure, and avoid damage to the translucent touch panel 12 and the translucent display screen 13 by external forces. The transmittance of the translucent cover plate 11 and the translucent touch panel 12 to visible light and infrared light is greater than 90%, which is not only beneficial for the translucent display screen 13 to better display the display content, but also beneficial for the infrared light sensor 14 arranged under the translucent display screen 13 to stably emit and receive infrared light, ensuring the normal operation of the infrared light sensor 14

In some embodiments, the ratio of the area of the display region 1321 to the area of the light-transmitting cover plate 11 is greater than 90%.

Specifically, by setting the ratio of the display area 1321 and the transparent cover 11, after the transparent display screen 13 is bonded to the transparent cover 11, the display area 1321 can display the content effect with a larger area, which not only improves the good user experience, but also effectively increases the screen-to-body ratio of the electronic device 100, achieving a full-screen effect.

Referring to Figures 2 and 3 , in some embodiments, the frame area 1322 includes a window area 1324, and the receiver 142 of the infrared light sensor 14 is disposed opposite the window area 1324. Furthermore, in some embodiments, the electronic device 100 further includes a coating layer 15, which is applied to the window area 1324 and covers the receiver 142. The coating layer 15 is configured to transmit infrared light and intercept visible light. The receiver 142 can receive infrared light through the coating layer 15 and the window area 1324.

Please further refer to Figures 2 and 3. In some embodiments, the coating layer 15 includes IR ink. The transmittance of the IR ink to infrared light is greater than 85%, and the transmittance to visible light is less than 6%. The wavelength of infrared light that the IR ink can transmit is 850nm-940nm.

Specifically, coating layer 15 is applied to window area 1324 and covers receiver 142. Because IR ink has low transmittance for visible light, receiver 142 disposed beneath coating layer 15 is not perceptible to the human eye when viewing electronic device 100 from the outside. At the same time, because IR ink also has high transmittance for infrared light, receiver 142 of infrared light sensor 14 can stably receive infrared light, ensuring proper operation of infrared light sensor 14. Furthermore, referring to FIG. 5 , in some examples, to shield other components and circuitry beneath the display screen, low-transmittance or opaque ink 18 may be applied to border area 1322, avoiding window area 1324, to ensure a consistent appearance for electronic device 100.

2 and 4 , in some embodiments, the low-frequency changing pixel region 1323 is adjacent to the frame region 1322. Thus, the transmitter 141 can be positioned in the low-frequency changing pixel region 1323 and the receiver 142 can be placed in the adjacent frame region 1322. This reduces the energy requirements of the transmitter 141 and prevents the receiver 142 from being unable to stably receive infrared rays due to energy attenuation during transmission.

In some embodiments, the infrared light sensor 14 includes a proximity sensor, which includes a signal transmitter and a signal receiver. The signal transmitter is used to emit infrared light through the upper surface, and the signal receiver is used to detect the distance between the object and the electronic device 100 by receiving infrared light reflected by the object.

Specifically, when the user is answering or making a call, the electronic device 100 is close to the head. The signal transmitter emits infrared light, and the signal receiver receives the reflected infrared light. The processor calculates the time from the infrared light emission to the reflection, and issues a corresponding instruction to control the screen to turn off. When the electronic device 100 is moved away from the head, the processor calculates the feedback data again and issues an instruction to turn the screen back on. This not only prevents user error, but also saves the phone's battery.

Referring to FIG. 6 , in some embodiments, the transmitter 141 and the receiver 142 are separate structures.

Specifically, when the infrared light sensor 14 has a split structure, the emitter 141 of the infrared light sensor 14 can be located in the low-frequency changing pixel region 1323, and the receiver 142 can be located in the border region 1322. It is understood that if the space in the low-frequency changing pixel region 1323 is sufficient to accommodate both the emitter 141 and the receiver 142, both the emitter 141 and the receiver 142 can be located in the low-frequency changing pixel region 1323. Furthermore, referring to FIG. 7 , in some examples, the emitter 141 of the infrared light sensor 14 can be located in the low-frequency changing pixel region 1323, and the receiver 142 can be located in the display region.

Referring to FIG. 8 , in some embodiments, the transmitter 141 and the receiver 142 are integrated into one structure.

Specifically, when the infrared light sensor 14 is an integrated structure, the emitter 141 and receiver 1421 of the infrared light sensor 14 can both be located in the low-frequency changing pixel region 1323. Furthermore, referring to FIG. 9 , in some examples, the emitter 141 can be located in the low-frequency changing pixel region 1323, and the receiver 142 can be located in the border region 1322. Furthermore, referring to FIG. 10 , in some examples, the emitter 141 can be located in the low-frequency changing pixel region 1323, and the receiver 142 can be located in the display region 1321.

Referring to FIG. 5 , in some embodiments, the electronic device 100 further includes a buffer layer 16 covering the lower surface 132 .

Specifically, the buffer layer 16 is used to mitigate impact and provide shock absorption to protect the translucent touch panel 12, the translucent display screen 13, and their internal structures, thereby preventing damage to the display screen due to external impact. The buffer layer 16 can be made of foam, foam plastic, rubber, or other soft materials. Of course, these buffer materials are merely exemplary, and the embodiments of the present invention are not limited thereto.

Further referring to FIG. 5 , in some embodiments, the electronic device 100 further includes a metal sheet 17 covering the buffer layer 16 .

Specifically, the metal sheet 17 is used to shield electromagnetic interference and ground, and has the function of diffusing temperature rise. The metal sheet 17 can be cut from metal materials such as copper foil and aluminum foil. Of course, these metal materials are only exemplary, and the embodiments of the present invention are not limited thereto.

Referring to Figure 11, an embodiment of the present invention provides a method for manufacturing an electronic device 100, comprising the following steps:

S301, providing a light-transmitting display screen 13, the light-transmitting display screen 13 including an upper surface 131 and a lower surface 132, the lower surface 132 being opposite to the upper surface 131. The lower surface 132 includes a display area 1321 and a frame area 1322, the frame area 1322 surrounding the display area 1321. The display area 1321 includes a low-frequency changing pixel area 1323; and

S302 , providing an infrared light sensor 14 , which includes an emitter 141 and a receiver 142 . The emitter 141 is disposed in the low-frequency changing pixel area 1323 , and the receiver 142 is disposed in the frame area 1322 . The emitter 141 emits infrared light through the upper surface 131 , and the receiver 142 receives infrared light through the frame area 1322 .

Specifically, the electronic device 100 uses a translucent display screen 13. Therefore, the infrared light sensor 14 can be positioned below the translucent display screen 13 in the case of a full-screen display. The display area 1321 of the translucent display screen 13 includes a low-frequency changing pixel area 1323. Placing the emitter 141 of the infrared light sensor 14 in the low-frequency changing pixel area 1323 prevents the emitted infrared light from affecting the stability of the TFTs in the display area 1321. Simultaneously, placing the receiver 142 of the infrared light sensor 14 in the border area 1322 near the low-frequency changing pixel area 1323 ensures stable reception of physically reflected infrared light, thereby ensuring stable operation of the infrared light sensor 14. The translucent display screen 13 can be an organic light-emitting display (OLED) display. OLED displays have excellent light transmittance and can pass both visible and infrared light. Therefore, while the OLED display screen displays content effectively, it does not affect the infrared light sensor 14's emission and reception of infrared light. The translucent display screen 13 can also be a Micro LED display screen, which also has excellent light transmittance for both visible and infrared light. Of course, these display screens are only exemplary, and the embodiments of the present invention are not limited thereto.

Referring to FIG. 12 , in some embodiments, the method for manufacturing the electronic device 100 further includes the following steps:

S303, arranging a translucent touch panel 12 on the translucent display screen 13; and

S304 , disposing a transparent cover plate 11 on the transparent touch panel 12 .

Specifically, the translucent touch panel 12 is primarily used to receive input signals generated when a user touches the translucent touch panel 12 and transmit them to the circuit board for data processing, thereby determining the specific location at which the user touched the translucent touch panel 12. In-Cell or on-Cell lamination technology can be used to laminate the translucent touch panel 12 to the translucent display screen 13, effectively reducing the weight and overall thickness of the display screen. Furthermore, the translucent cover plate 11 disposed on the translucent touch panel 12 protects the translucent touch panel 12 and its internal structure, preventing damage to the translucent touch panel 12 from external forces.

Referring to FIG. 13 , in some embodiments, the method for manufacturing the electronic device 100 further includes the following steps:

S305: A window area 1324 is formed in the frame area 1322. The receiver 142 is positioned opposite the window area 1324. The receiver 142 is configured to receive infrared light through the window area 1324. Furthermore, in some embodiments, this step further includes applying a coating layer 15 to the window area 1324. The coating layer 15 is configured to transmit infrared light and intercept visible light. The receiver 142 is configured to receive infrared light through the coating layer 15 and the window area 1324.

Specifically, coating layer 15 can be made of IR ink. Since IR ink has low transmittance for visible light, the human eye cannot perceive receiver 142 disposed under coating layer 15 when viewing electronic device 100 from the outside. Furthermore, since IR ink also has high transmittance for infrared light, receiver 142 can stably receive infrared light, ensuring the normal operation of infrared light sensor 14.

Referring to FIG. 14 , in some embodiments, the method for manufacturing the electronic device 100 further includes the following steps:

S306 , providing a buffer layer 16 on the lower surface 132 , wherein the buffer layer 16 covers the lower surface 132 .

Specifically, the buffer layer 16 is used to mitigate impact and provide shock absorption to protect the translucent touch panel 12, the translucent display screen 13, and their internal structures, thereby preventing damage to the display screen due to external impact. The buffer layer 16 can be made of foam, foam plastic, rubber, or other soft materials. Of course, these buffer materials are merely exemplary, and the embodiments of the present invention are not limited thereto.

Referring to FIG. 15 , in some embodiments, the method for manufacturing the electronic device 100 further includes the following steps:

S307 , disposing a metal sheet 17 under the buffer layer 16 , wherein the metal sheet 17 covers the buffer layer 16 .

Specifically, the metal sheet 17 is used to shield electromagnetic interference and ground, and has the function of diffusing temperature rise. The metal sheet 17 can be cut from metal materials such as copper foil and aluminum foil. Of course, these metal materials are only exemplary, and the embodiments of the present invention are not limited thereto.

In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Furthermore, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

The disclosure above provides many different embodiments or examples for realizing different structures of the present invention. In order to simplify the disclosure of the present invention, the components and settings of specific examples are described above. Of course, they are merely examples and are not intended to limit the present invention. In addition, the present invention may repeat reference numerals and/or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity and does not in itself indicate the relationship between the various embodiments and/or settings discussed. In addition, the present invention provides examples of various specific processes and materials, but those skilled in the art will recognize the application of other processes and/or the use of other materials.

In the description of the present invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended only to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features referred to. Thus, features specified as "first" or "second" may explicitly or implicitly include one or more of the aforementioned features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined. It should also be understood that the term "and/or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood broadly. For example, they may refer to fixed connections, removable connections, or integral connections. They may refer to mechanical connections or electrical connections. They may refer to direct connections or indirect connections through an intermediary, and they may refer to internal communication between two components or interactions between two components. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with an embodiment or example is included in at least one embodiment or example of the present invention. In this specification, illustrative descriptions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to the embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the claims and their equivalents.

Claims (19)

1. An electronic device, characterized in that it comprises: A light-transmitting display screen includes an upper surface and a lower surface opposite to the upper surface. The lower surface includes a display area and a border area surrounding the display area. The light-transmitting display screen is used to emit light through the display area and display content through the upper surface. The display area includes a low-frequency changing pixel area for displaying low-frequency changing content. An infrared light sensor includes an emitter disposed in the low-frequency changing pixel region and a receiver disposed in the border region. The emitter is integrated with the pixels in the low-frequency changing pixel region. The emitter is used to emit infrared light through the upper surface, and the receiver is used to receive infrared light through the border region. 2. The electronic device as claimed in claim 1, wherein the low-frequency variable pixel region is connected to the border region. 3. The electronic device as claimed in claim 1, wherein the infrared light sensor includes a proximity sensor, the proximity sensor including a signal transmitter and a signal receiver, the signal transmitter being used to emit infrared light through the upper surface, and the signal receiver being used to receive infrared light reflected by an object through the frame area to detect the distance between the object and the electronic device. 4. The electronic device as claimed in claim 1, wherein the transmitter and the receiver are separate components. 5. The electronic device as claimed in claim 1, wherein the transmitter and the receiver are an integral structure. 6. The electronic device as claimed in claim 1, wherein the frame region includes a window region, the receiver is disposed opposite to the window region, and the receiver is used to receive infrared light through the window region. 7. The electronic device as claimed in claim 6, wherein the electronic device further comprises: A coating layer is applied to the window area and covers the receiver. The coating layer is used to transmit infrared light and block visible light. The receiver is used to receive infrared light through the coating layer and the window area. 8. The electronic device as claimed in claim 7, wherein the coating layer comprises IR ink, the IR ink having an infrared transmittance greater than 85%, the IR ink having a visible light transmittance less than 6%, and the IR ink allowing infrared light to pass through to a wavelength of 850nm-940nm. 9. The electronic device as claimed in claim 1, wherein the light-transmitting display screen comprises an OLED display screen. 10. The electronic device as claimed in claim 1, wherein the electronic device further comprises a light-transmitting touch panel and a light-transmitting cover plate formed on the light-transmitting touch panel, the light-transmitting touch panel being disposed on the light-transmitting display screen, the upper surface facing the light-transmitting cover plate, and the visible light transmittance and infrared light transmittance of the light-transmitting cover plate and the light-transmitting touch panel are both greater than 90%. 11. The electronic device as claimed in claim 10, wherein the ratio of the area of the display area to the area of the light-transmitting cover is greater than 90%. 12. The electronic device of claim 1, wherein the electronic device further comprises a buffer layer covering the lower surface. 13. The electronic device of claim 12, wherein the electronic device further comprises a metal sheet covering the buffer layer. 14. A method for manufacturing an electronic device, characterized by comprising the steps of: A light-transmitting display screen is provided, the light-transmitting display screen including an upper surface and a lower surface opposite to the upper surface, the lower surface including a display area and a border area surrounding the display area, the display area including a low-frequency changing pixel area for displaying low-frequency changing content; and An infrared light sensor is provided, the infrared light sensor including an emitter disposed in the low-frequency changing pixel region and a receiver disposed in the border region, the emitter being integrated with the pixels in the low-frequency changing pixel region, the emitter being used to emit infrared light through the upper surface, and the receiver being used to receive infrared light through the border region. 15. The manufacturing method according to claim 14, characterized in that the manufacturing method further comprises the step of: A light-transmitting touch panel is provided on the light-transmitting display screen; and A light-transmitting cover is provided on the light-transmitting touch panel. 16. The manufacturing method according to claim 14, characterized in that the manufacturing method further comprises the step of: A window area is opened in the border area, and the receiver is disposed opposite to the window area. The receiver is used to receive infrared light through the window area. 17. The manufacturing method according to claim 16, characterized in that the manufacturing method further comprises the step of: A coating layer is applied to the window area, the coating layer being used to transmit infrared light and block visible light, and the receiver being used to receive infrared light through the coating layer and the window area. 18. The manufacturing method according to claim 16, characterized in that the manufacturing method further comprises the step of: A buffer layer is provided on the lower surface, and the buffer layer covers the lower surface. 19. The manufacturing method according to claim 18, characterized in that the manufacturing method further comprises the step of: A metal sheet is provided, which covers the buffer layer.