HK1243361B - Plasma treatment device and method of treating items - Google Patents
Plasma treatment device and method of treating itemsInfo
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- HK1243361B HK1243361B HK18102900.5A HK18102900A HK1243361B HK 1243361 B HK1243361 B HK 1243361B HK 18102900 A HK18102900 A HK 18102900A HK 1243361 B HK1243361 B HK 1243361B
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Description
相关申请的交叉引用CROSS-REFERENCE TO RELATED APPLICATIONS
本申请要求于2014年12月22日提交的美国临时申请序列号62/095,629和2015年3月6日提交的美国临时申请序列号62/129,533的优先权,其全部内容通过引用并入本文,包括任何数据、表格或附图。This application claims priority to U.S. Provisional Application Serial No. 62/095,629, filed December 22, 2014, and U.S. Provisional Application Serial No. 62/129,533, filed March 6, 2015, the entire contents of which are incorporated herein by reference, including any data, tables, or figures.
背景技术Background Art
表面消毒和气味消除是个人和专业环境所面临的共同挑战。很多气味是由于微生物及其产生的有机物的存在引起的。通过消除微生物及其副产物,通常可以控制或消除气味。有许多应用于此目的的方法、材料和技术。然而并非所有的物品都能采用相同的方式处理,而用于控制微生物或去除有机材料的一些目前使用的技术和物质可能会损坏处理物品或对处理物品产生其他不期望的影响。Surface disinfection and odor elimination are common challenges in both personal and professional environments. Many odors are caused by the presence of microorganisms and the organic matter they produce. By eliminating these microorganisms and their byproducts, odors can often be controlled or eliminated. Numerous methods, materials, and techniques are available for this purpose. However, not all items can be treated the same, and some currently used techniques and materials for controlling microorganisms or removing organic matter may damage or have other undesirable effects on the treated items.
等离子体和活性气体的电气产生涉及两个电极端子间的电势差大于所述两个端子间气体的介电强度、从而使电子在端子之间形成电弧的过程。电弧(电晕放电)和介质气体之间的相互作用将包括介质气体的分子激发至更高能态,从而产生高活性产物。The electrical generation of plasma and reactive gases involves a process in which the potential difference between the terminals of two electrodes is greater than the dielectric strength of the gas between the two terminals, causing electrons to form an arc between the terminals. The interaction between the arc (corona discharge) and the dielectric gas excites the molecules comprising the dielectric gas to higher energy states, thereby producing highly reactive products.
除了产生电晕,产生类似活性等离子体的其它方法在本领域中是已知的。高活性等离子体通过氧化作用有效破坏有机物质。由于这种现象,活性等离子体或气体,如臭氧,长期以来一直用于物品消毒和消除由烟雾到微生物的一系列来源引起的气味。等人在期刊文章“Cold Atmospheric Air Plasma Sterilization against Spores andOther Microorganisms of Clinical Interest”中报道,在环境空气中工作30秒的物理冷气氛表面微放电(SMD)等离子体对于不同类型的营养细胞非常有效并导致410到610CFU(菌落形成单位)的降低。In addition to generating a corona, other methods for generating similar reactive plasmas are known in the art. Highly reactive plasmas effectively destroy organic matter through oxidation. Due to this phenomenon, reactive plasmas or gases, such as ozone, have long been used to sterilize items and eliminate odors from a range of sources, from smoke to microorganisms. et al. reported in the journal article "Cold Atmospheric Air Plasma Sterilization against Spores and Other Microorganisms of Clinical Interest" that a physical cold atmosphere surface microdischarge (SMD) plasma operating in ambient air for 30 seconds was highly effective against different types of vegetative cells and resulted in a reduction of 4 10 to 6 10 CFU (colony forming units).
标准的等离子体消毒装置通常是无效的,并且由于某些等离子体的毒性而存在安全问题。根据EPA,呼吸臭氧可以引发各种健康问题,包括胸痛、咳嗽、咽喉刺激和充血。它也会恶化支气管炎、肺气肿和哮喘。Standard plasma disinfection devices are generally ineffective and pose safety concerns due to the toxicity of some plasmas. According to the EPA, breathing ozone can trigger a variety of health problems, including chest pain, coughing, throat irritation, and congestion. It can also worsen bronchitis, emphysema, and asthma.
由于等离子体通常是不稳定的,因此普通的等离子体消毒装置所产生的等离子体的数量远超过与待消毒物品上存在的实际数量污染物反应所需的数量。过量的等离子体导致前端等离子体产生过程和后端等离子体去除过程效率低下。本领域已知的许多装置可以移动或吹扫过量的等离子体通过待消毒物品,或者产生过量的等离子体,将物品浸入其中。吹扫和浸入式消毒装置效率低下,可能需要很长时间才能完成消毒任务。Because plasma is generally unstable, conventional plasma disinfection systems generate far more plasma than is necessary to react with the actual amount of contaminants present on the items being disinfected. This excess plasma leads to inefficiencies in both the front-end plasma generation process and the back-end plasma removal process. Many devices known in the art can move or purge excess plasma through the items being disinfected, or generate excess plasma and immerse the items in it. Purge and immersion disinfection systems are inefficient and can take a long time to complete the disinfection task.
还有其他设备应用溶解于液体(如水)中的臭氧,所述液体可以围绕待消毒物品流动。上述方式不仅面临同样的效率挑战,而且在处理液体本身时也产生了诸多问题,如不必要的重量、溢出、腐蚀、泄露等。此外,诸如皮鞋和皮包之类的许多物品将由于被暴露于液体中而损坏。Other devices use ozone dissolved in a liquid (such as water) that is flowed around the items to be sterilized. These approaches not only face the same efficiency challenges, but also create numerous problems when handling the liquid itself, such as unnecessary weight, spillage, corrosion, and leaks. In addition, many items, such as leather shoes and purses, will be damaged by exposure to liquid.
一些设备采用真空来辅助清洁过程;然而,这些设备中的真空室通常是刚性的,并且对于被清洁的物品不能适形或模制。换句话说,这些物品未被腔室的一个或多个壁物理挤压,使得该装置在去除存在于物品的小开口或孔中的不需要的空气时效率低下。在真空室中使用刚性壁也可能需要更大体积的等离子体以在负压反转时重新填充室。Some devices utilize vacuum to assist in the cleaning process; however, the vacuum chambers in these devices are typically rigid and do not conform or mold to the item being cleaned. In other words, the item is not physically compressed by the chamber's walls, making the device ineffective at removing unwanted air from small openings or pores within the item. The use of rigid walls within the vacuum chamber may also require a larger volume of plasma to refill the chamber upon reversal of negative pressure.
其他装置使用柔性室将等离子体流引导至诸如邮件或包裹的物品上,以减少物品上的生物负荷。通常,该方法在邮件上应用连续的“含氧”气流。尽管这样的装置可以限制容器中其他气体的量,但它们效率低并且经常仅在物品的表面上吹扫臭氧或其它等离子体。等离子体或其他气体不是机械地输入到物品的内部、小空间或孔中。此外,利用这些装置,气体一次通过等离子体发生器。因此,进入容器的活性“含氧”分子必须在首次通过发生器时产生。Other devices use flexible chambers to direct a plasma stream onto items such as mail or packages to reduce the bioburden on the items. Typically, this method applies a continuous stream of "oxygenated" gas to the mail. While such devices can limit the amount of other gases in the container, they are inefficient and often purge ozone or other plasma only over the surface of the item. The plasma or other gas is not mechanically introduced into the interior, small spaces, or pores of the item. Furthermore, with these devices, the gas passes through the plasma generator once. Therefore, the reactive "oxygenated" molecules entering the container must be generated during their first pass through the generator.
发明内容Summary of the Invention
根据本发明,通过减少物品周围和内部的空间和周围空气的量来解决产生物体消毒所需的最小量的高活性等离子体的问题。通过上述方式,由本发明的装置产生的等离子体指向待消毒的物体,而不是非目标区域。According to the present invention, the problem of generating the minimum amount of highly active plasma required for sterilizing an object is solved by reducing the amount of space and ambient air around and within the object. In this way, the plasma generated by the device of the present invention is directed toward the object to be sterilized, rather than non-target areas.
本发明的一个实施方式利用其中具有处理室的壳体,其中可以形成负压并且保持在待消毒物品周围。通过去除处理室中的过量环境空气以产生负压,消毒物品所需等离子体的量因而减少。从腔室中除去过量的环境空气的过程还可以促进等离子体在处理室内在物品的各个部分和物品周围的分散。壳体可以包括顶部51和基部52,顶部51可以附接到基部52。基部也可用作等离子体处理装置部件的存储区域。例如,泵、阀、管、流出室和其它部件可以存储在基部中。但其不是本发明所必须的,部件可以保持在等离子体处理装置的其他部分中,或者甚至远离等离子体处理装置。One embodiment of the present invention utilizes a housing having a treatment chamber therein, wherein a negative pressure can be formed and maintained around the article to be sterilized. By removing excess ambient air from the treatment chamber to generate the negative pressure, the amount of plasma required to sterilize the article is reduced. The process of removing excess ambient air from the chamber can also promote the dispersion of plasma in the treatment chamber on various parts of the article and around the article. The housing can include a top 51 and a base 52, and the top 51 can be attached to the base 52. The base can also be used as a storage area for plasma treatment device components. For example, pumps, valves, pipes, outflow chambers and other components can be stored in the base. However, this is not required for the present invention, and the components can be kept in other parts of the plasma treatment device, or even away from the plasma treatment device.
某些实施方式采用具有至少一个适形壁的处理室。适形壁可以是可变形、塌缩、模制或其它方式围绕或接近物品成形的材料,以便减少处理室中的空间或体积的量。适形壁所具备的对于待处理物品的基本适应或模制的能力以及减少物品周围的非目标空间的量的能力,能够进一步减少所需等离子体的总量。适形壁也可以使更柔软的物品变形,这可以进一步促进等离子体在物品周围和物品中的整个空间和孔中的分散。Certain embodiments utilize a processing chamber having at least one compliant wall. The compliant wall can be a material that can be deformed, collapsed, molded, or otherwise shaped around or near an article to reduce the amount of space or volume within the processing chamber. The ability of the compliant wall to substantially conform or mold to the article being processed and to reduce the amount of non-target space around the article can further reduce the total amount of plasma required. The compliant wall can also deform more flexible articles, which can further facilitate the dispersion of the plasma throughout the spaces and pores around and within the article.
其他实施方式使用柔性袋或弹性袋形式的处理室,物品可以放置在其中并将袋密封。利用该实施方式,当袋内达到负压时,整个袋子可以适应物品的形状。Other embodiments use a processing chamber in the form of a flexible or elastic bag in which the article can be placed and the bag sealed. With this embodiment, when negative pressure is reached inside the bag, the entire bag can adapt to the shape of the article.
另一个实施方式可以具有至少一个流出室。通过将处理室中多余的空气泵送到周围环境从而将其从处理室移除或将其封存于流出室中可以使处理室塌缩,从而使其基本适应处理室中物品的形状。因此,工作体积减少,从而减少了在处理循环期间必须去除的空气的体积。在这样的实施方式中,在处理循环期间,工作体积中的空气在处理室和第二流出室(通过等离子体发生器)之间来回传递。体积的减少使得泵送空气花费的时间更少,而用于处理物品的等离子体的浓度增加。Another embodiment can have at least one outflow chamber. The processing chamber can be collapsed by pumping excess air in the processing chamber to the surrounding environment to remove it from the processing chamber or sealing it in the outflow chamber, so that it can basically adapt to the shape of the article in the processing chamber. Therefore, the working volume is reduced, thereby reducing the volume of air that must be removed during the processing cycle. In such an embodiment, during the processing cycle, the air in the working volume is transferred back and forth between the processing chamber and the second outflow chamber (by the plasma generator). The reduction in volume makes it take less time to pump air, and the concentration of the plasma used to process the article increases.
此外,在一个实施方式中,本发明考虑使用至少一个过滤机构来去除任何多余的等离子体,以保护用户免受潜在的有害暴露。Furthermore, in one embodiment, the present invention contemplates the use of at least one filtering mechanism to remove any excess plasma to protect the user from potentially harmful exposure.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
为了能够获得对上述发明的更准确的理解,可以通过参照附图中示出的具体实施方式提供对上述简要描述的本发明的更具体的描述。本发明给出的附图可以不按比例绘制,并且对附图或以下描述中尺寸的任何参考对于所公开的实施方式是特定的。将允许本发明为了其预期目的起作用的这些尺寸的任何变化被认为包含在本发明的范围内。因此,需要理解的是,这些附图仅描绘了本发明的典型实施方式,因此不被认为是限制保护范围,通过使用附图,利用附加的特征和细节来描述和解释本发明,其中:In order to obtain a more accurate understanding of the above invention, a more specific description of the invention briefly described above can be provided by reference to the specific embodiments shown in the accompanying drawings. The drawings given in the present invention may not be drawn to scale, and any reference to dimensions in the drawings or the following description is specific to the disclosed embodiments. Any variation of these dimensions that will allow the present invention to function for its intended purpose is considered to be within the scope of the present invention. Therefore, it is to be understood that these drawings depict only typical embodiments of the present invention and are not to be considered as limiting the scope of protection. By using the drawings, the present invention will be described and explained with additional features and details, wherein:
图1示出本发明壳体的一个实施方式的外部结构。在该实施方式中,壳体包括基部和在基部上配合的顶部。Fig. 1 shows the external structure of an embodiment of the housing of the present invention. In this embodiment, the housing comprises a base and a top portion fitted on the base.
图2示出本发明的一个具体实施方式,其中壳体的顶部被移除以显示在处理过程中装置内腔室的膨胀和收缩过程。步骤1示出放置在处理室内的物品。为了简单起见,其余步骤中未示出该物品。在步骤2中,当装置关闭并且适形壁边缘抵靠刚性板密封时,形成处理室。刚性板中的至少一个孔允许至少一部分环境空气从处理室放出并隔离在一级流出室中。步骤2示出一级真空循环的结束,其中处理室匹配待处理物品的表面,并且处理室上方的一级流出室在填充有来自处理室的多余空气时膨胀。(或者,不使用一级流出室,则来自处理室的多余空气可以排放到周围环境中)。一旦处理室基本上匹配物品的形状,则开始二级真空循环。步骤3示出二级真空循环的结束,其中物品例如靴子被进一步压缩,并且在该压缩期间所移除的环境空气被引导到二级流出室中,其在一级流出室上方示出。步骤4示出当来自二级流出室的空气通过等离子体发生器并进入处理室时处理室的部分再填充。当环境空气在二级流出室和处理室之间来回传递时(通过等离子体发生器),发生处理循环。步骤5示出在计划次数的处理循环结束时,处理室(一级流出室中或者来自环境室的非等离子体空气)最终再填充,并且由于空气被传送到处理室,一级流出室收缩。Figure 2 shows a specific embodiment of the present invention, in which the top of the housing is removed to show the expansion and contraction process of the chamber within the device during the treatment process. Step 1 shows an item placed in the treatment chamber. For simplicity, the item is not shown in the remaining steps. In step 2, when the device is closed and the conformable wall edge is sealed against the rigid plate, a treatment chamber is formed. At least one hole in the rigid plate allows at least a portion of the ambient air to escape from the treatment chamber and be isolated in a primary outflow chamber. Step 2 shows the end of the primary vacuum cycle, in which the treatment chamber matches the surface of the item to be treated and the primary outflow chamber above the treatment chamber expands when filled with excess air from the treatment chamber. (Alternatively, if a primary outflow chamber is not used, the excess air from the treatment chamber can be discharged into the surrounding environment). Once the treatment chamber substantially matches the shape of the item, the secondary vacuum cycle begins. Step 3 shows the end of the secondary vacuum cycle, in which the item, such as a boot, is further compressed and the ambient air removed during this compression is directed into the secondary outflow chamber, which is shown above the primary outflow chamber. Step 4 shows the partial refilling of the process chamber as air from the secondary outflow chamber passes through the plasma generator and into the process chamber. A process cycle occurs as ambient air is transferred back and forth between the secondary outflow chamber and the process chamber (via the plasma generator). Step 5 shows that at the end of the planned number of process cycles, the process chamber (non-plasma air in the primary outflow chamber or from the ambient chamber) is finally refilled, and the primary outflow chamber collapses as air is transferred to the process chamber.
图3A和图3B是根据本发明的等离子体处理装置的不同结构的示意图。这些结构包括处理室、等离子体发生器、空气泵和用于控制气流的阀。在这些结构中,空气被移入周围环境和从周围环境移出。3A and 3B are schematic diagrams of different configurations of a plasma processing apparatus according to the present invention. These configurations include a processing chamber, a plasma generator, an air pump, and a valve for controlling airflow. In these configurations, air is moved into and out of the surrounding environment.
图4A-4D是根据本发明的等离子体处理装置的不同结构的示意图。这里所示的结构包括处理室、等离子体发生器、空气泵、过滤机构和用于控制气流的阀。在这些结构中,空气被移入周围环境和从周围环境移出。4A-4D are schematic diagrams of different configurations of a plasma processing apparatus according to the present invention. The configurations shown here include a processing chamber, a plasma generator, an air pump, a filter mechanism, and a valve for controlling air flow. In these configurations, air is moved into and out of the surrounding environment.
图5A-5D是根据本发明的等离子体处理装置的不同结构的示意图。这里所示的结构包括处理室、等离子体发生器、空气泵、过滤机构和用于控制气流的阀。在这些结构中,空气被移入周围环境和从周围环境移出。5A-5D are schematic diagrams of different configurations of a plasma processing apparatus according to the present invention. The configurations shown here include a processing chamber, a plasma generator, an air pump, a filtering mechanism, and a valve for controlling air flow. In these configurations, air is moved into and out of the surrounding environment.
图6A和图6B是根据本发明的等离子体处理装置的不同结构的示意图。这里所示的结构包括处理室、等离子体发生器、空气泵、过滤机构和用于控制气流的多向阀。在这些结构中,空气被移入周围环境和从周围环境移出。FIG6A and FIG6B are schematic diagrams of different configurations of a plasma processing apparatus according to the present invention. The configurations shown here include a processing chamber, a plasma generator, an air pump, a filtering mechanism, and a multi-way valve for controlling air flow. In these configurations, air is moved into and out of the surrounding environment.
图7A和图7B是根据本发明的等离子体处理装置的不同结构的示意图。这里所示的结构包括处理室、等离子体发生器、空气泵、过滤机构和用于控制气流的阀。在这些结构中,空气被移入周围环境和从周围环境移出。FIG7A and FIG7B are schematic diagrams of different configurations of a plasma processing apparatus according to the present invention. The configurations shown here include a processing chamber, a plasma generator, an air pump, a filter mechanism, and a valve for controlling air flow. In these configurations, air is moved into and out of the surrounding environment.
图8A-8D是根据本发明的等离子体处理装置的不同结构的示意图。这里所示的结构包括处理室、等离子体发生器、空气泵、气味盒和用于控制气流的阀。在这些结构中,空气被移入周围环境和从周围环境移出。8A-8D are schematic diagrams of different configurations of a plasma processing apparatus according to the present invention. The configurations shown here include a processing chamber, a plasma generator, an air pump, a scent box, and a valve for controlling airflow. In these configurations, air is moved into and out of the surrounding environment.
图9A-9H是根据本发明的等离子体处理装置的不同结构的示意图。图9A-9D所示的结构包括处理室、等离子体发生器、空气泵、至少一个一级流出室和用于控制气流的阀。图9E-9H所示的结构包括处理室、等离子体发生器、空气泵、过滤机构、至少一个一级流出室和用于控制气流的阀。9A-9H are schematic diagrams of different configurations of a plasma processing apparatus according to the present invention. The configuration shown in FIG9A-9D includes a processing chamber, a plasma generator, an air pump, at least one primary outflow chamber, and a valve for controlling airflow. The configuration shown in FIG9E-9H includes a processing chamber, a plasma generator, an air pump, a filtering mechanism, at least one primary outflow chamber, and a valve for controlling airflow.
图10A-10D是根据本发明的等离子体处理装置的不同结构的示意图。这里所示的结构包括处理室、等离子体发生器、空气泵、过滤机构、至少一个一级流出室和用于控制气流的阀。10A-10D are schematic diagrams of different structures of a plasma processing apparatus according to the present invention, wherein the structure shown here includes a processing chamber, a plasma generator, an air pump, a filtering mechanism, at least one primary outflow chamber, and a valve for controlling air flow.
图11A-11D是根据本发明的等离子体处理装置的不同结构的示意图。这里所示的结构可以包括处理室、等离子体发生器、空气泵、气味盒、至少一个一级流出室、至少一个二级流出室、以及一个或多个用于控制气流的阀或多向阀。11A-11D are schematic diagrams of different configurations of a plasma processing apparatus according to the present invention. The configurations shown here may include a processing chamber, a plasma generator, an air pump, an odor cartridge, at least one primary outflow chamber, at least one secondary outflow chamber, and one or more valves or multi-way valves for controlling airflow.
图12是示出了根据本发明的等离子体处理装置的一个实施方式的气动结构的示意图。FIG. 12 is a schematic diagram showing a pneumatic structure of an embodiment of a plasma processing apparatus according to the present invention.
图13是利用根据本发明的等离子体处理装置的一个实施方式的处理室抽空时空气流动的示意图。FIG. 13 is a schematic diagram illustrating air flow when a processing chamber using an embodiment of a plasma processing apparatus according to the present invention is evacuated.
图14是当物品经历处理周期时根据本发明的等离子体处理装置的一个实施方式的空气流动的示意图。14 is a schematic diagram of air flow for one embodiment of a plasma processing apparatus according to the present invention as an article undergoes a processing cycle.
图15是根据本发明的等离子体处理装置的一个实施方式的图示。从图中可以看出,适形的片材在物品被处理前围绕物品塌缩。Figure 15 is a diagram of one embodiment of a plasma processing apparatus according to the present invention. As can be seen in the figure, the conformable sheet is collapsed around the article before it is processed.
图16是根据本发明的等离子体处理装置的一个实施方式的壳体基部的分解图,其展示了工作部件如何能够完全包含在装置基部内。16 is an exploded view of the housing base of one embodiment of a plasma processing apparatus according to the present invention, illustrating how working components can be fully contained within the apparatus base.
图17-23示出了使用根据本发明的等离子体处理装置的一个实施方式来处理物品的方法。每幅图中包括一个示意图,其显示装置的结构和/或在不同处理步骤期间的空气流动。每幅图中还包括一个装置图示,其显示在每个步骤期间处理室的状况。图22B示出了采用雾化机构的替代气味输送装置。Figures 17-23 illustrate a method for treating an article using one embodiment of a plasma treatment apparatus according to the present invention. Each figure includes a schematic diagram showing the apparatus structure and/or air flow during various treatment steps. Each figure also includes a diagram of the apparatus showing the conditions in the treatment chamber during each step. Figure 22B illustrates an alternative scent delivery apparatus employing an atomization mechanism.
图24是气体导向部件的一个实施方式的图示。在该实施方式中,刚性板内的一个端口连接软管或管,该软管或管可以被引导到物品的特定区域以用于更直接或集中的消毒。Figure 24 is an illustration of one embodiment of a gas directing member. In this embodiment, a port in the rigid plate connects to a hose or tube that can be directed to a specific area of an item for more directed or focused sterilization.
图25A和图25B示出了气体导向部件的替代实施方式。该实施方式利用具有多个较小开口的覆盖层,其可以覆盖刚性板内的一个或多个端口,使得气体通过覆盖层朝着物品向上扩散。图25B是覆盖层的横截面,示出了如何将其放置在刚性板中的端口上。Figures 25A and 25B illustrate an alternative embodiment of a gas-directing member. This embodiment utilizes a cover layer having multiple smaller openings that can cover one or more ports in the rigid plate, allowing gas to diffuse upward through the cover layer toward the article. Figure 25B is a cross-section of the cover layer, illustrating how it is positioned over the ports in the rigid plate.
图26示出了可以与本发明的实施方式一起使用的真空储存系统的一个实施方式。FIG. 26 illustrates one embodiment of a vacuum storage system that may be used with embodiments of the present invention.
图27示出了使用用于处理室的适形袋的等离子体处理装置的一个实施方式。FIG. 27 illustrates one embodiment of a plasma processing apparatus utilizing a conformal bag for a processing chamber.
图28示出了图27中的等离子体处理装置,其中待清洁和/或待消毒物品放置在适形袋内,气体导向部件放置在其中用于更彻底的处理。28 illustrates the plasma treatment apparatus of FIG. 27 , wherein the items to be cleaned and/or sterilized are placed within a conformable bag and a gas guide member is positioned therein for more thorough treatment.
图29示出了图28中的等离子体处理装置,物品已被被密封在其中且流出室尚未填充处理室的环境空气。29 illustrates the plasma processing apparatus of FIG. 28 with an article sealed therein and the outflow chamber not yet filled with ambient air of the processing chamber.
具体实施方式DETAILED DESCRIPTION
本发明涉及用于物品消毒的装置和方法。更具体地,本发明提供了能够对放置在其中的物品进行消毒的等离子体处理室的实施方式。在具体实施方式中,处理室能够至少部分地匹配物品的形状,以便减少物品消毒所需的等离子体的体积。The present invention relates to apparatus and methods for sterilizing objects. More specifically, the present invention provides embodiments of a plasma treatment chamber capable of sterilizing an object placed therein. In particular embodiments, the treatment chamber can at least partially conform to the shape of the object to reduce the volume of plasma required to sterilize the object.
本发明尤其适用于消毒,特别是控制或消除家用或个人物品、特别是多孔物品或不规则形状物品的气味,其中标准曝气或消毒程序可能效果较差。The present invention is particularly useful for disinfecting, and in particular for controlling or eliminating odors from, household or personal items, particularly porous or irregularly shaped items, where standard aeration or disinfecting procedures may be less effective.
关于本发明使用的术语“等离子体”,仅仅是为了便于阅读。该术语指代由电流或电晕放电产生的高活性离子、原子和分子,而不管其物理状态。The term "plasma" is used in connection with the present invention for ease of reading only and refers to highly reactive ions, atoms, and molecules produced by an electric current or corona discharge, regardless of their physical state.
术语“空气”和“气体”在本文中可互换使用,以描述在操作期间在整个装置中移动的流体混合物。The terms "air" and "gas" are used interchangeably herein to describe the fluid mixture that moves throughout the device during operation.
在下列实施例中更具体地描述本发明,这些实施例仅是示例性的,因为其中的许多修改和变形对本领域技术人员而言是显而易见的。除非上下文另有明确规定,否则在说明书和权利要求中所使用的如“一个”和“所述”的单数包括复数指示物。The present invention is more particularly described in the following examples, which are intended to be illustrative only, as many modifications and variations therein will be apparent to those skilled in the art. As used in the specification and claims, singular forms such as "a," "an," and "the" include plural referents unless the context clearly dictates otherwise.
将参考附图,其中使用相同的附图标记表示相同或相似的部件。参考附图,其示出了本发明的某些实施方式,可以看出,在本发明的等离子体处理装置10的一些实施方式包括壳体50,壳体50包含具有尺寸可变性能的处理室100,其由在处理室中获得的负压量确定,所述负压使袋或可以形成处理室的适形壁102结构变形。还可以有至少一个流出室3。此外,可以存在至少一个一级流出室1和/或至少一个二级流出室2。其他实施方式使用其中可以放置用于处理的物品的适形袋。适形袋可以但不必须在壳体50内。Reference will be made to the accompanying drawings, wherein like reference numerals are used to designate like or similar components. Referring to the accompanying drawings, which illustrate certain embodiments of the present invention, it can be seen that some embodiments of the plasma processing apparatus 10 of the present invention include a housing 50 containing a process chamber 100 having scalable dimensions, determined by the amount of negative pressure achieved within the process chamber, which deforms a bag or conformable wall 102 structure that may form the process chamber. There may also be at least one outflow chamber 3. Furthermore, there may be at least one primary outflow chamber 1 and/or at least one secondary outflow chamber 2. Other embodiments utilize a conformable bag within which items for processing may be placed. The conformable bag may, but need not, be within the housing 50.
在一个实施方式中,等离子体发生器200用于形成等离子体,其可被泵入处理室以对物品进行消毒和/或清洁。或者,雾化机构可以与等离子体发生器一起使用或者替代等离子体发生器,以实现对物品的消毒和/或清洁。这些一般部件中的每一个可以具有一个或多个子部件,这将在下面详细讨论。In one embodiment, a plasma generator 200 is used to generate a plasma that can be pumped into a processing chamber to sterilize and/or clean items. Alternatively, an atomization mechanism can be used in conjunction with or in place of the plasma generator to sterilize and/or clean items. Each of these general components can have one or more subcomponents, which will be discussed in detail below.
这里的描述没有讨论或具体描述本领域已知的可用于操作或指导本发明的装置或部件的各种控制装置。本发明的电线也不详细讨论。然而,本领域普通技术人员知晓本文描述的各种组件例如如何彼此连接或与电源连接,并且各种类型的控制器或操作机构可以以这种方式与设备构造,使得本领域技术人员实现本发明的益处。在最简单的迭代中,控制器可以是致动器机构,其在等离子体处理装置上移动或改变诸如阀的部件,以实现处理过程的改变或推进处理过程。控制器可以可操作地连接到多个传感器800中的任何一个,传感器800能够检测状况并因此检测控制器的操作。以基本上如本文所述的方式提供相同的功能并具有基本上相同的期望结果的控制器的类型和本发明的组件的附接方式的变化在本发明的范围内。The description herein does not discuss or specifically describe the various control devices known in the art that can be used to operate or direct the apparatus or components of the present invention. The electrical wiring of the present invention is also not discussed in detail. However, one of ordinary skill in the art will know how the various components described herein are connected to each other or to a power source, for example, and that various types of controllers or operating mechanisms can be constructed with the apparatus in such a manner that one skilled in the art can realize the benefits of the present invention. In the simplest iteration, the controller can be an actuator mechanism that moves or changes a component such as a valve on the plasma processing apparatus to effect a change in the process or to advance the process. The controller can be operably connected to any one of a plurality of sensors 800 that are capable of detecting a condition and, therefore, the operation of the controller. Variations in the type of controller and manner of attachment of the components of the present invention that provide the same functionality in a manner substantially as described herein and with substantially the same desired results are within the scope of the present invention.
在一个实施方式中,等离子体处理装置10包括等离子体发生器200、处理室100和用于在等离子体发生器和处理室之间转移空气的装置。等离子体发生器可以包括但不限于电晕、电解或紫外等离子体产生。某些实施方式包括流动式发生器以便于与本发明的等离子体处理装置10中所用的空气泵300配合使用。在本发明的处理过程中使用的等离子体发生器形成的各种产品可以是气态或等离子体态。替代的实施方式在等离子体外还使用雾化消毒剂处理处理室中的物品,或使用雾化消毒剂代替等离子体处理处理室中的物品。为了本申请的目的,处理是指与生物或非生物的有机物质的反应,包括杀死微生物。处理可以包括减少或消除与这种有机物相关的气味。In one embodiment, the plasma treatment apparatus 10 includes a plasma generator 200, a treatment chamber 100, and a device for transferring air between the plasma generator and the treatment chamber. The plasma generator may include, but is not limited to, corona, electrolytic, or ultraviolet plasma generation. Certain embodiments include a flow generator for use with the air pump 300 used in the plasma treatment apparatus 10 of the present invention. The various products formed by the plasma generator used in the treatment process of the present invention may be in a gaseous or plasma state. Alternative embodiments use an atomized disinfectant in addition to the plasma to treat the items in the treatment chamber, or use an atomized disinfectant instead of a plasma to treat the items in the treatment chamber. For the purposes of this application, treatment refers to a reaction with biological or non-biological organic matter, including killing microorganisms. Treatment may include reducing or eliminating odors associated with such organic matter.
在一个实施方式中,处理室100具有至少一个适形壁102,其将形状改变以至少部分地围绕或匹配待处理物品的形状。可以使用衬垫103将适形壁密封到刚性板102,其中一个例子如图16所示。可用于适形壁的材料包括但不限于聚乙烯、聚丙烯、EPDM、氟化烃(例如PTFE)、PEEK或其任何组合,或任何其他足够不透气的材料,以便保持足够的压力差,并且足以承受暴露于本发明消毒过程中可能产生的各种等离子体和化学产品。In one embodiment, the processing chamber 100 has at least one conformable wall 102 that changes shape to at least partially surround or match the shape of the item to be processed. The conformable wall can be sealed to the rigid plate 102 using a gasket 103, an example of which is shown in Figure 16. Materials that can be used for the conformable wall include, but are not limited to, polyethylene, polypropylene, EPDM, fluorinated hydrocarbons (e.g., PTFE), PEEK, or any combination thereof, or any other material that is sufficiently impermeable to maintain a sufficient pressure differential and is sufficient to withstand exposure to various plasmas and chemical products that may be generated during the sterilization process of the present invention.
因为处理室100通过使用适形壁102可以调整为符合其中待处理物品的形状,所以处理室中在处理循环期间必须移动的空气的体积可以减少,从而使设备更加快捷高效。当在处理室中产生足够的负压时,处理室的适形性也允许等离子体处理装置10挤压或压缩其中的物品。这种挤压或压缩可以增强从物品中的空隙去除污染物和等离子体渗入物品中的空隙。如果本发明的实施方式利用雾化消毒剂,则负压也可以改善消毒剂在物品的材料中和材料周围的分布和渗透。这使得等离子体产生装置10能够实现多孔物品更快、更深入的处理。Because the treatment chamber 100 can be adjusted to conform to the shape of the article to be treated therein through the use of conformable walls 102, the volume of air that must be moved within the treatment chamber during a treatment cycle can be reduced, making the device faster and more efficient. The conformability of the treatment chamber also allows the plasma treatment apparatus 10 to squeeze or compress the article therein when a sufficient negative pressure is generated within the treatment chamber. This squeezing or compression can enhance the removal of contaminants from voids within the article and the penetration of plasma into voids within the article. If embodiments of the present invention utilize an atomized disinfectant, the negative pressure can also improve the distribution and penetration of the disinfectant into and around the material of the article. This enables the plasma generating apparatus 10 to achieve faster and deeper treatment of porous articles.
在一个实施方式中,处理室100可以在关闭等离子体处理装置10的壳体50时形成,使得壳体的顶部51遮蔽并可操作地附接到基部52。如图2所示,在步骤1中,刚性板101可以密封在适形片材102上,待处理物品在其间。利用该实施方式,装置10的一个或多个操作机构,例如泵、阀、管道、线和/或其他部件可以被存储或保持在基部52内。或者,各种部件可以保持在壳体的其他部分中,或者甚至远离壳体。In one embodiment, the processing chamber 100 can be formed by closing the housing 50 of the plasma processing apparatus 10, such that the top 51 of the housing is shielded from and operably attached to the base 52. As shown in FIG2 , in step 1, the rigid plate 101 can be sealed to the conformable sheet 102 with the item to be processed therebetween. Using this embodiment, one or more operating mechanisms of the apparatus 10, such as pumps, valves, pipes, lines, and/or other components, can be stored or retained within the base 52. Alternatively, the various components can be retained in other portions of the housing, or even remotely from the housing.
在其它实施方式中,处理室由适形袋125组成,其具有至少一个适形壁102,例如图27、图28和图29中所示。适形袋可以可操作地连接到泵300和任何必须的部件,以在其中形成负压并注入所需的处理材料(例如等离子体或消毒剂)。在一个实施方式中,适形袋连接到其中存储有泵和其它部件的基部,其中一个例子如图27、图28和图29所示。在适形袋内的负压的形成可导致至少一个适形壁朝向物品塌缩,使得其至少部分地符合物品的形状。In other embodiments, the treatment chamber is comprised of a conformable bag 125 having at least one conformable wall 102, such as shown in Figures 27, 28, and 29. The conformable bag can be operably connected to a pump 300 and any necessary components to create a negative pressure therein and inject the desired treatment material (e.g., plasma or sterilant). In one embodiment, the conformable bag is connected to a base in which the pump and other components are stored, an example of which is shown in Figures 27, 28, and 29. The creation of negative pressure within the conformable bag can cause the at least one conformable wall to collapse toward the article, causing it to at least partially conform to the shape of the article.
适形袋可以使用各种密封装置130和本领域已知的技术。在一个实施方式中,袋可以利用可重复使用的密封件,其允许袋被打开和关闭以重复使用。例如,可以使用滑动密封件或拉链密封件,例如通常用于家用存储袋的那些,或者单独的部件可以附接到袋子上以实现足够的密封。袋子也可以通过折叠和夹紧或能够形成气密密封的任何其它方式来密封。The conformable bag can utilize various sealing devices 130 and techniques known in the art. In one embodiment, the bag can utilize a reusable seal that allows the bag to be opened and closed for repeated use. For example, a slide seal or zipper seal, such as those commonly used for household storage bags, can be used, or a separate component can be attached to the bag to achieve an adequate seal. The bag can also be sealed by folding and clamping or any other means capable of forming an airtight seal.
在一个实施方式中,袋子可以被永久密封,使得放置在其中的物品与周围环境完全隔离。在该实施方式中,适形袋125可以是一次性的,使得在物品被清洁和/或消毒之后,袋子可以从泵300和等离子体处理装置的任何其它部件中移除。然后可以将新的或替换的袋子附着到等离子体处理装置,以实现另一个物品的处理。In one embodiment, the bag can be permanently sealed so that the item placed therein is completely isolated from the surrounding environment. In this embodiment, the conformable bag 125 can be disposable so that after the item is cleaned and/or sterilized, the bag can be removed from the pump 300 and any other components of the plasma treatment device. A new or replacement bag can then be attached to the plasma treatment device to enable treatment of another item.
或者,袋可以是可重复使用的,具有允许袋重复地打开和关闭以用于接收和隔离其中物品的密封件130。通过该实施方式,可以将适形袋永久地连接到泵和其它部件上。或者,袋子可以在等离子体处理装置上移除和更换。为了保护适形壁或适形袋的适形材料,实施方式可以包括设置在处理室内的在适配材料和待处理物品之间的抗穿刺衬里。本领域技术人员将能够确定可用于处理室并且密封本发明的实施方式的各种材料和密封件中的任何一种。Alternatively, the bag can be reusable, with a seal 130 that allows the bag to be repeatedly opened and closed for receiving and isolating the items therein. With this embodiment, the compliant bag can be permanently attached to the pump and other components. Alternatively, the bag can be removed and replaced on the plasma processing device. To protect the compliant wall or compliant material of the compliant bag, embodiments can include a puncture-resistant liner disposed within the processing chamber between the compliant material and the items to be processed. Those skilled in the art will be able to determine any of a variety of materials and seals that can be used in the processing chamber and to seal embodiments of the present invention.
处理室和等离子体发生器之间的环境空气的转移可以包括使用真空泵300和连接处理室100、等离子体发生器200和真空泵的气密管。适用于本发明的泵包括但不限于振动活塞式、活塞式、隔膜式、振荡柱塞式、振动隔膜式、蠕动式、正排量式、离心式、螺杆式、鼓风式和旋转叶片型泵。The transfer of ambient air between the process chamber and the plasma generator may include the use of a vacuum pump 300 and an airtight tube connecting the process chamber 100, the plasma generator 200, and the vacuum pump. Pumps suitable for use in the present invention include, but are not limited to, vibrating piston, piston, diaphragm, oscillating plunger, vibrating diaphragm, peristaltic, positive displacement, centrifugal, screw, blower, and rotary vane pumps.
等离子体处理装置的一个实施方式包含用于在装置的各种部件之间引导空气流动的阀机构500。适用于本发明的阀的类型包括流动换向阀和选择阀。可以使用的流动换向阀包括但不限于4/2、4/3、5/2或5/3阀。也可以设置多个电磁阀以允许系统中空气流动方向的反转。如果使用允许流动反向的泵送机构,则可以去除气流换向阀。选择阀可以是允许一个公共入口端口以选择多个出口端口的任何阀。应当理解,在组件之间流动的空气可以通过直接连接到一个或多个部件的管或歧管。One embodiment of a plasma processing apparatus includes a valve mechanism 500 for directing air flow between various components of the apparatus. Types of valves suitable for use with the present invention include flow reversing valves and selector valves. Useful flow reversing valves include, but are not limited to, 4/2, 4/3, 5/2, or 5/3 valves. Multiple solenoid valves may also be provided to allow reversal of the direction of air flow in the system. If a pumping mechanism that allows flow reversal is used, the air flow reversing valve may be eliminated. The selector valve may be any valve that allows a common inlet port to select multiple outlet ports. It should be understood that the air flowing between components may be through a pipe or manifold directly connected to one or more components.
虽然可以向周围环境15进行泵送和从周围环境15进行泵送(如图3A-8D所示),但是本发明的某些实施方式包括连接到处理室100(相对于气流)的一个或多个流出室3。这些流出室有利于存储等离子体和气味,直至它们可以被减缓,以及允许更有效地处处理物品。在一个实施方式中,流出室3由刚性材料形成,使得它们在空气被吸入时不会改变形状或可以最小化地改变形状。在替代实施方式中,流出室由柔性材料或适形材料形成,当空气被泵入或泵出流出室时允许膨胀和收缩。尽管在此提及一级和二级流出室,但是如本文所使用的,除非另有明确说明,否则这些参考仅用于指出用于特定目的的流出室的存在,其可以存在至少一个。因此,提到“第一”并不意味着必须有两个或更多。此外,二级流出室的提及并不意味着必须有第一个。这些参考并不旨在相对于特定特征赋予时间上的任何顺序、结构取向或片面性(例如,左或右,顶部或底部)。While pumping can be performed to and from the ambient environment 15 (as shown in Figures 3A-8D), certain embodiments of the present invention include one or more outflow chambers 3 connected to the processing chamber 100 (relative to the airflow). These outflow chambers are advantageous for storing plasma and odors until they can be slowed down, as well as allowing for more efficient treatment of the treated items. In one embodiment, the outflow chambers 3 are formed of a rigid material so that they do not change shape or change shape minimally when air is drawn in. In alternative embodiments, the outflow chambers are formed of a flexible or conformable material that allows expansion and contraction when air is pumped into or out of the outflow chambers. Although reference is made herein to primary and secondary outflow chambers, as used herein, unless otherwise expressly stated, these references are only used to indicate the presence of an outflow chamber for a particular purpose, of which there may be at least one. Thus, reference to "first" does not necessarily mean there must be two or more. Additionally, reference to a secondary outflow chamber does not necessarily mean there must be a first one. These references are not intended to confer any temporal order, structural orientation, or one-sidedness (e.g., left or right, top or bottom) with respect to a particular feature.
一个实施方式中包括两个流出室3,一个一级流出室1和一个二级流出室2。每个流出室(相对于气流)可以连接到处理室100,例如如图2和图9A-11D所示。在该实施方式中,来自处理室100的环境空气可以泵送到一级流出室1中,直到满足某些工艺条件。这样的工艺条件例如可以是用于泵送空气的预定时间限制,或者当例如压力传感器850的传感器800表示在处理室100中已达到预定压力时。在满足第一工艺条件之后残留在处理室中的空气可被泵送到二级流出室2中。In one embodiment, two outflow chambers 3 are included, a primary outflow chamber 1 and a secondary outflow chamber 2. Each outflow chamber (with respect to the airflow) can be connected to the process chamber 100, for example as shown in Figures 2 and 9A-11D. In this embodiment, ambient air from the process chamber 100 can be pumped into the primary outflow chamber 1 until certain process conditions are met. Such process conditions can be, for example, a predetermined time limit for pumping air, or when a sensor 800, such as a pressure sensor 850, indicates that a predetermined pressure has been reached in the process chamber 100. After the first process condition is met, the air remaining in the process chamber can be pumped into the secondary outflow chamber 2.
在一个实施方式中,控制器可以基于在处理室内实现特定的“绝对”压力(如针对大气测量)(如由一个或多个传感器800测量),从而将装置从一个阶段切换到另一个阶段(例如从一级到二级真空循环)。在该实施方式中,在一级真空循环期间将在处理室内测量压力。为了确定处理室壁何时基本符合物品,一级真空循环持续至处理室内的压力达到预定压力。该预定压力水平部分取决于处理室适形壁的刚性。例如,更厚或更刚性的适形壁材料会导致将材料与物品相符合所需的较低压力。通过向腔室施加真空并且在适形壁塌缩并且符合腔室内的物品时测量压力,本领域普通技术人员可以确定用于适形由特定材料制成的腔室的适当压力。为了确定一级真空循环的结束(处理室的适形材料基本上与腔室内的物品符合,而基本上不挤压或以其他方式使物品变形的时刻),压力传感器可以确定处理室内的压力比使适形壁材料变形所需的压力稍微更负。在一个实施方式中,足以指示适形壁102基本上符合物品75的负压水平可以在约0.00PSIV至约-14.7PSIV之间。在更具体的实施方式中,足以指示适形壁基本上符合该物品的负压水平可以在约-0.001PSIV至约-5PSIV之间。In one embodiment, the controller can switch the apparatus from one stage to another (e.g., from a primary to a secondary vacuum cycle) based on achieving a specific "absolute" pressure (e.g., measured against atmosphere) within the process chamber (e.g., as measured by one or more sensors 800). In this embodiment, pressure is measured within the process chamber during the primary vacuum cycle. To determine when the process chamber walls substantially conform to the article, the primary vacuum cycle continues until the pressure within the process chamber reaches a predetermined pressure. This predetermined pressure level depends in part on the rigidity of the process chamber's compliant walls. For example, thicker or more rigid compliant wall materials may result in lower pressures required to conform the material to the article. By applying a vacuum to the chamber and measuring the pressure as the compliant walls collapse and conform to the article within the chamber, one of ordinary skill in the art can determine the appropriate pressure for conforming a chamber made of a particular material. To determine the end of the primary vacuum cycle (the point at which the process chamber's compliant material substantially conforms to the article within the chamber without substantially squeezing or otherwise deforming the article), the pressure sensor can determine that the pressure within the process chamber is slightly more negative than the pressure required to deform the compliant wall material. In one embodiment, the negative pressure level sufficient to indicate that the compliant wall 102 substantially conforms to the article 75 may be between about 0.00 PSIV and about -14.7 PSIV. In a more specific embodiment, the negative pressure level sufficient to indicate that the compliant wall substantially conforms to the article may be between about -0.001 PSIV and about -5 PSIV.
在具体实施方式中,一旦传感器800已经例如通过压力测量确定处理室基本上符合物品75,则开始二级真空循环。二级真空循环可以通过增加处理室100内的真空来挤压物品,从而迫使适形壁压靠物品。在该实施方式中,二级真空循环将持续到下列三项中的至少一种发生:1)室内的压力达到预定值;2)压力达到真空泵可实现的最大真空;或3)ΔP/Δt(下面讨论)稳定或开始稳定。In a particular embodiment, once the sensor 800 has determined, for example through pressure measurement, that the processing chamber is substantially conforming to the article 75, a secondary vacuum cycle is initiated. The secondary vacuum cycle can compress the article by increasing the vacuum within the processing chamber 100, thereby forcing the conforming walls against the article. In this embodiment, the secondary vacuum cycle will continue until at least one of the following three occurs: 1) the pressure within the chamber reaches a predetermined value; 2) the pressure reaches the maximum vacuum achievable by the vacuum pump; or 3) ΔP/Δt (discussed below) stabilizes or begins to stabilize.
在一个实施方式中,可操作地连接到控制器的传感器800将基于在处理室中测量的压力变化率(ΔP/Δt)来确定一级或二级真空循环的结束。该方法受处理室中适形材料变化的影响较小,更多受到受处理物品的物理变形特性的影响。例如,当处理刚性物品75(例如,长曲棍球头盔)时,在一级真空循环结束时,其ΔP/Δt将比处理类似尺寸的较软或更柔软的物品时(例如,一个抱枕)大得多。在一个实施方式中,等离子体处理装置10基于处理物品的类型具有不同的设置选项,其将考虑用于触发处理顺序的不同ΔP/Δt值参数。例如,用于软物品的设置相比用于硬物品的设置可以使用更小的ΔP/Δt值。在一级真空循环期间,当从处理室中除去多余的空气时,处理室内的压力可以以相当恒定的速率降低,直到该室符合该物品。一旦阻止了适形壁102轻松塌陷(例如,因为它接触物品),则ΔP/Δt会快速增加。因此,测量压力并计算ΔP/Δt允许控制器预测处理室壁何时基本上符合该物品,此时该装置可以启动二级真空循环。In one embodiment, a sensor 800 operably connected to the controller determines the end of a primary or secondary vacuum cycle based on the rate of change of pressure (ΔP/Δt) measured within the process chamber. This method is less affected by variations in the conforming material within the process chamber and more influenced by the physical deformation characteristics of the article being processed. For example, when processing a rigid article 75 (e.g., a lacrosse helmet), its ΔP/Δt at the end of a primary vacuum cycle will be much greater than when processing a softer or more flexible article of similar size (e.g., a throw pillow). In one embodiment, the plasma processing apparatus 10 has different setup options based on the type of article being processed, which will consider different ΔP/Δt value parameters for triggering the processing sequence. For example, a setup for a soft article may use a smaller ΔP/Δt value than a setup for a hard article. During the primary vacuum cycle, as excess air is removed from the process chamber, the pressure within the process chamber may decrease at a relatively constant rate until the chamber conforms to the article. Once the conforming wall 102 is prevented from easily collapsing (e.g., because it contacts the article), the ΔP/Δt value may increase rapidly. Thus, measuring the pressure and calculating ΔP/Δt allows the controller to predict when the chamber walls substantially conform to the article, at which point the apparatus can initiate a secondary vacuum cycle.
在另一实施方式中,ΔP/Δt值可用于确定二级真空循环的结束。一旦一个或多个泵开始达到其最大真空容量,ΔP/Δt值将开始稳定,然后控制器可以将装置切换到下一阶段。再次,通过测量ΔP/Δt同时观察处理室的适形壁何时基本符合但未实际变形该物品,可以凭经验确定用于指示一级真空循环结束的适当的ΔP/Δt值。用于指示二级真空循环结束的ΔP/Δt值可通过ΔP/Δt值的稳定性来确定,此时泵接近其最大真空或物品的变形停止。In another embodiment, the ΔP/Δt value can be used to determine the end of the secondary vacuum cycle. Once one or more pumps begin to reach their maximum vacuum capacity, the ΔP/Δt value will begin to stabilize, and the controller can then switch the device to the next stage. Again, by measuring ΔP/Δt while observing when the compliant walls of the processing chamber substantially conform to, but do not actually deform, the article, an appropriate ΔP/Δt value for indicating the end of the primary vacuum cycle can be determined empirically. The ΔP/Δt value used to indicate the end of the secondary vacuum cycle can be determined by the stability of the ΔP/Δt value, as the pumps approach their maximum vacuum or deformation of the article ceases.
等离子体处理装置10的某些实施方式测量泵的负载变化率(电流(I)随时间(t)的变化的变化:ΔI/Δt)。基本上,相同的事件会触发更高的ΔI/Δt值(例如,符合物品并达到最大真空度),就像触发ΔP/Δt值的那些,该测量可类似的使用。Certain embodiments of the plasma processing apparatus 10 measure the rate of change of pump load (the change in current (I) over time (t): ΔI/Δt). Essentially, the same events that trigger higher ΔI/Δt values (e.g., object contact and reaching maximum vacuum) as those that trigger ΔP/Δt values can be used similarly.
一旦在处理室中达到了预定的压力水平,则可使用各种控制器中的任何一个来操作阀机构500,阀机构500停止从一级流出室1移除环境空气,并开始从处理室移除剩余空气,使得其进入二级流出室2而不是一级流出室1,并且可操作地连接到阀机构500的泵300将使处理室真空下降到更大的负压,从而使处理室100的适形壁102更进一步地坍塌并尽可能地挤压或压缩该物品。图11A-11D、图12和图13示出了等离子体处理装置10的非限制性实施例,其具有一级流出室1和二级流出室2。图13中,一级流出室由壳体50形成,二级流出室2在其中。Once a predetermined pressure level is reached in the process chamber, any of a variety of controllers can be used to operate the valve mechanism 500, which stops removing ambient air from the primary outflow chamber 1 and begins removing the remaining air from the process chamber, causing it to enter the secondary outflow chamber 2 instead of the primary outflow chamber 1. Furthermore, the pump 300 operably connected to the valve mechanism 500 will reduce the process chamber vacuum to a greater negative pressure, thereby causing the compliant wall 102 of the process chamber 100 to collapse further and squeeze or compress the article as much as possible. Figures 11A-11D, 12, and 13 illustrate a non-limiting embodiment of a plasma processing apparatus 10 having a primary outflow chamber 1 and a secondary outflow chamber 2. In Figure 13, the primary outflow chamber is formed by the housing 50, with the secondary outflow chamber 2 therein.
装置的一个实施方式包括真空储存系统900以减少处理时间。真空储存系统可以包括能够承受足够负压的真空容器920、能够承受负压并可操作地连接到真空容器的高流量阀940、以及也可操作地连接到真空容器的真空泵。在一个实施方式中,真空储存系统可操作地连接到处理室,使得当高流量阀打开时,环境空气可以从处理室进入真空容器。One embodiment of the apparatus includes a vacuum storage system 900 to reduce processing time. The vacuum storage system may include a vacuum reservoir 920 capable of withstanding sufficient negative pressure, a high-flow valve 940 capable of withstanding the negative pressure and operably connected to the vacuum reservoir, and a vacuum pump also operably connected to the vacuum reservoir. In one embodiment, the vacuum storage system is operably connected to the processing chamber so that when the high-flow valve is opened, ambient air can enter the vacuum reservoir from the processing chamber.
在另一个实施方式中,当装置通电并且高流量阀关闭时,真空泵可以在真空容器上拉动负压以产生负压室。In another embodiment, when the device is powered on and the high flow valve is closed, the vacuum pump can pull negative pressure on the vacuum reservoir to create a negative pressure chamber.
待处理的物品可被初始放置并密封在处理室内,使得当两个室之间的压力差达到平衡时,高流量阀可以打开,并且允许空气从处理室快速流动到真空容器。一旦达到处理室和真空容器间的压力平衡,则可以关闭高流量阀,并且激活真空泵以再次在真空容器上拉动压力。如果必须除去更多的空气以达到上述提到的指示一级真空循环结束的压力参数,则一级真空循环将持续至满足这样的参数为止。The object to be processed can be initially placed and sealed within the processing chamber, so that when the pressure differential between the two chambers reaches equilibrium, the high-flow valve can be opened, allowing air to quickly flow from the processing chamber to the vacuum reservoir. Once pressure equilibrium is achieved between the processing chamber and the vacuum reservoir, the high-flow valve can be closed, and the vacuum pump activated to reapply pressure to the vacuum reservoir. If more air must be removed to reach the pressure parameters noted above, indicating the end of the primary vacuum cycle, the primary vacuum cycle will continue until such parameters are met.
利用负压真空储存系统的这种技术允许从给定的室非常快速地除去空气,而不需要高流量泵。相反,泵可用于在处理过程中的空转阶段期间缓慢地建立负真空“储存器”,并且高流量阀可以用于保持负压直至需要。This technique, utilizing a negative pressure vacuum reservoir system, allows for very rapid removal of air from a given chamber without the need for a high-flow pump. Instead, a pump can be used to slowly build up a negative vacuum "reservoir" during idle phases in the process, and a high-flow valve can be used to maintain the negative pressure until needed.
在一个实施方式中,真空容器是设置在与装置的其他部件相同的隔室内的刚性容器。在一个实施方式中,真空容器是刚性圆柱形腔室。在另一个实施方式中,真空容器是刚性容器,其轮廓是为了填充储存室中的其它部件周围的空隙,并进一步帮助将其保持在适当的位置。In one embodiment, the vacuum container is a rigid container that is placed in the same compartment as the other components of the device. In one embodiment, the vacuum container is a rigid cylindrical chamber. In another embodiment, the vacuum container is a rigid container that is contoured to fill the gaps around the other components in the storage chamber and further help hold them in place.
在另一个实施方式中,输送到二级流出室2和来自二级流出室2的环境空气通过等离子体发生器200,因为它被泵送到二级流出室和处理室之间。这种设置有几个好处,包括:1)安全—可以转化为等离子体的气体的极限体积有助于防止装置产生潜在危险量的等离子体;2)效率—在处理室和二级流出室之间泵送较小体积的空气,缩短了循环时间,并且可以导致更高浓度的等离子体用于处理该物品(特别是当小体积在室之间移动多次通过发生器)。本发明进一步考虑使用过滤机构来允许周围环境15替代一级流出室1、二级处理室100或两者。In another embodiment, ambient air delivered to and from the secondary outflow chamber 2 passes through the plasma generator 200 as it is pumped between the secondary outflow chamber and the processing chamber. This arrangement has several benefits, including: 1) safety - limiting the volume of gas that can be converted to plasma helps prevent the device from generating potentially dangerous amounts of plasma; 2) efficiency - pumping a smaller volume of air between the processing chamber and the secondary outflow chamber reduces cycle time and can result in a higher concentration of plasma for treating the article (especially when a small volume is moved multiple times through the generator between chambers). The present invention further contemplates the use of a filtering mechanism to allow the ambient environment 15 to replace the primary outflow chamber 1, the secondary processing chamber 100, or both.
一旦等离子体已经被泵送到处理室中,它可以围绕并渗入物品75上的纤维、开口、孔、空间和接触表面。等离子体离子的反应性可以有效且快速地开始与处理室中和/或物品上的任何生物或其它有机材料进行反应。为了促进接触,在处理循环期间可以有暂停期250,以允许在该处理循环期间形成的等离子体可在处理室中保持预定的时间。图2示出了暂停期如何结合到处理循环的一个实施例。暂停期的长度取决于几个因素,其包括例如所使用的等离子体的类型、物品的尺寸或结构、物品上的有机或生物材料的量以及其它因素。Once the plasma has been pumped into the treatment chamber, it can surround and penetrate fibers, openings, pores, spaces, and contact surfaces on the article 75. The reactivity of the plasma ions can effectively and quickly begin to react with any biological or other organic material in the treatment chamber and/or on the article. To promote contact, there can be a pause period 250 during the treatment cycle to allow the plasma formed during the treatment cycle to remain in the treatment chamber for a predetermined time. Figure 2 shows one embodiment of how the pause period can be incorporated into the treatment cycle. The length of the pause period depends on several factors, including, for example, the type of plasma used, the size or structure of the article, the amount of organic or biological material on the article, and other factors.
在一个实施方式中,一级流出室1是密封抵靠在形成处理室100的适形片材102的外表面的刚性围绕物。在该实施方式中,一级流出室可以通过壳体的顶部51装配在基部52上形成,并且可以容纳二级流出室2和处理室100(当装置关闭时),其中一个实施例如图15所示。在另一个实施方式中,一级流出室1具有至少一个适形侧,或是一个适形袋。类似地,在某些实施方式中,二级流出室可以是刚性的,或具有至少一个适形侧。In one embodiment, the primary outflow chamber 1 is a rigid enclosure that seals against the outer surface of the conformable sheet 102 that forms the processing chamber 100. In this embodiment, the primary outflow chamber can be formed by the top 51 of the housing being assembled on the base 52 and can accommodate the secondary outflow chamber 2 and the processing chamber 100 (when the device is closed), one example of which is shown in Figure 15. In another embodiment, the primary outflow chamber 1 has at least one conformable side, or is a conformable bag. Similarly, in some embodiments, the secondary outflow chamber can be rigid or have at least one conformable side.
本发明的某些实施方式包括用于传送空气的一种以上的装置。例如,某些实施方式可以包括第一泵300以及第二泵300,第一泵300将过量空气从处理室快速移至一级流出室或周围环境15中,第二泵300具有足够的功率以产生或增加处理室内的负压,以便将空气从处理室移动到二级流出室并挤压该物品。Certain embodiments of the present invention include more than one means for moving air. For example, certain embodiments may include a first pump 300 that quickly moves excess air from the processing chamber to the primary outflow chamber or the surrounding environment 15, and a second pump 300 that has sufficient power to create or increase negative pressure within the processing chamber to move air from the processing chamber to the secondary outflow chamber and compress the article.
也可以使用串联或并联的多个真空泵,包括至少一个实施方式,其中两个或更多个泵可以在并联和串联配置之间切换。并联配置允许装置在给定的时间量内移动较大体积的空气,而串联配置可以增加处理室中拉动的负压。图4A-4D给出了这些泵配置的非限制性实施例。Multiple vacuum pumps may also be used in series or parallel, including at least one embodiment in which two or more pumps can be switched between parallel and series configurations. The parallel configuration allows the device to move a larger volume of air in a given amount of time, while the series configuration can increase the negative pressure drawn within the process chamber. Figures 4A-4D provide non-limiting examples of these pump configurations.
为了监测各种气道或腔室之间的压力差,所述压力差例如可以指示何时使控制器将阀门从将空气引导到一级流出室1重新配置到将空气引导到二级流出室2,本发明的某些实施方式还包括一个或多个传感器800。在一个实施方式中,传感器800是一种能够检测和/或响应处理室100内压力并触发各种已知控制机构中的任意一种以启动特定事件的压力传感器850。在另一个实施方式中,响应系统中别处压力的压力传感器850可用于触发这些相同的或其它事件。图13、图14和图17-23示出了利用压力传感器850的实施方式。用于各种目的和装置的压力传感器和其他类型的传感器在本领域中是众所周知的。本领域普通技术人员能够确定适当的传感器,无论压力传感器或用于本文所述的任何室内的其他传感器,或者可以连接到与正在测量压力的室连接的气体管线的传感器。在某些实施方式中也可以使用另外一个气体流量计,而不是压力传感器850。In order to monitor the pressure differential between various airways or chambers, which can, for example, indicate when to cause a controller to reconfigure a valve from directing air to the primary outflow chamber 1 to directing air to the secondary outflow chamber 2, certain embodiments of the present invention further include one or more sensors 800. In one embodiment, the sensor 800 is a pressure sensor 850 capable of detecting and/or responding to pressure within the processing chamber 100 and triggering any of a variety of known control mechanisms to initiate specific events. In another embodiment, a pressure sensor 850 that responds to pressure elsewhere in the system can be used to trigger these same or other events. Figures 13, 14, and 17-23 illustrate embodiments utilizing a pressure sensor 850. Pressure sensors and other types of sensors for various purposes and devices are well known in the art. One of ordinary skill in the art will be able to determine an appropriate sensor, whether a pressure sensor or other sensor for use within any chamber described herein, or a sensor that can be connected to a gas line connected to the chamber whose pressure is being measured. In certain embodiments, another gas flow meter can also be used instead of the pressure sensor 850.
本发明的另一个实施方式可以包括过滤机构400,以去除来自物品75本身的不愉快的气味,并且可与多余的等离子体发生反应。图13和图14示出了包括过滤器400的非限制性实施方式。在一个实施方式中,过滤机构将设置(相对于气流)在处理室100和一级流出室1、二级流出室2或周围环境15之间(取决于实施方式)。因为一些等离子体被认为对人体有害,所以过滤机构可以为本发明的实施方式提供另一种安全措施。过滤机构400可以包括催化电生成的等离子体以形成更稳定的产物的催化剂(例如二氧化锰),或者过滤机构400可以是包括反应物材料(例如碳或可氧化的金属,例如铁)的消耗性过滤器,其将与电产生的等离子体反应以形成更稳定的产物。过滤机构400还可以具有催化剂和消耗性过滤器的组合。使用消耗性过滤器的过滤机构400的一个实施方式可以是可替换的盒。Another embodiment of the present invention may include a filter mechanism 400 to remove unpleasant odors from the article 75 itself and to react with excess plasma. Figures 13 and 14 show a non-limiting embodiment comprising a filter 400. In one embodiment, the filter mechanism will be arranged (relative to the airflow) between the processing chamber 100 and the primary outflow chamber 1, the secondary outflow chamber 2 or the surrounding environment 15 (depending on the embodiment). Because some plasmas are considered harmful to the human body, the filter mechanism can provide another safety measure for embodiments of the present invention. The filter mechanism 400 may include a catalyst (such as manganese dioxide) that catalyzes electrically generated plasma to form a more stable product, or the filter mechanism 400 may be a consumable filter comprising a reactant material (such as carbon or an oxidizable metal, such as iron) that will react with the electrically generated plasma to form a more stable product. The filter mechanism 400 may also have a combination of a catalyst and a consumable filter. An embodiment of the filter mechanism 400 using a consumable filter may be a replaceable cartridge.
图17-23例示的一个实施方式利用至少一个气味过滤机构401,以在一级真空循环期间移除来自处理室100的空气的气味,以及至少一个其它等离子体过滤机构402,以在处理循环完成后从周围空气中去除过量的等离子体。为了额外的安全性,某些实施方式包括检测机构,用于在处理循环之后解锁处理室之前确定等离子体从处理室移除的水平。One embodiment illustrated in Figures 17-23 utilizes at least one odor filtering mechanism 401 to remove odors from the air in the process chamber 100 during the primary vacuum cycle, and at least one other plasma filtering mechanism 402 to remove excess plasma from the ambient air after the process cycle is complete. For additional safety, some embodiments include a detection mechanism for determining the level of plasma removed from the process chamber before unlocking the process chamber after the process cycle.
另一实施方式包括可操作地连接(相对于气流)到处理室的气味盒700,其中一个实施例如图16和图17-23所示。在该实施方式中,在计划数量的处理循环完成之后,空气可以被主动地(例如,泵送或强制通过)或被动地(例如通过释放在处理室中保持负压的阀,允许摄入周围的环境空气)通过气味盒700进入处理室100,以赋予被处理物品气味。在这样的实施方式中,气味盒700可以与等离子体发生器串联或并联设置(参考空气路径)。在另一个实施方式中,气味盒700可以与空气泵300串联或并联设置(相对于空气路径)。气味盒700还可以与阀串联设置并可操作地附接到处理室100。在这样的实施方式中,阀可以设置在气味盒700的处理室100一侧或者设置在与处理室100相对的气味盒700的一侧。在某些实施方式中,本发明还利用具有过滤机构的气味盒。在一个具体实施方式中,气味盒与过滤机构组合。Another embodiment includes a scent cartridge 700 operably connected (with respect to the airflow) to the treatment chamber, one example of which is shown in Figures 16 and 17-23. In this embodiment, after a planned number of treatment cycles are completed, air can be actively (e.g., pumped or forced through) or passively (e.g., by releasing a valve that maintains negative pressure in the treatment chamber, allowing the intake of ambient air) through the scent cartridge 700 into the treatment chamber 100 to impart a scent to the treated items. In such an embodiment, the scent cartridge 700 can be arranged in series or parallel with the plasma generator (with respect to the air path). In another embodiment, the scent cartridge 700 can be arranged in series or parallel with the air pump 300 (with respect to the air path). The scent cartridge 700 can also be arranged in series with a valve and operably attached to the treatment chamber 100. In such an embodiment, the valve can be located on the side of the scent cartridge 700 in the treatment chamber 100 or on the side of the scent cartridge 700 opposite the treatment chamber 100. In certain embodiments, the present invention also utilizes a scent cartridge with a filtering mechanism. In one specific embodiment, the scent cartridge is combined with the filtering mechanism.
其他装置和技术可以与本发明的实施方式相结合,以助于物品上活的微生物的有效减少。一个实施方式包括定位成将UV光发射到处理室中的物品上的UV光源150。UV灯装置已被用于杀死医院房间和其他环境中的微生物。本发明的实施方式利用UV光源可以具有增加的抗微生物效果。图2和图16示出了如何将UV光源与本发明的实施方式结合的非限制性示例。Other devices and techniques can be combined with embodiments of the present invention to aid in the effective reduction of viable microorganisms on articles. One embodiment includes a UV light source 150 positioned to emit UV light onto articles in a treatment chamber. UV lamp systems have been used to kill microorganisms in hospital rooms and other environments. Embodiments of the present invention can utilize UV light sources to provide increased antimicrobial effectiveness. Figures 2 and 16 illustrate non-limiting examples of how UV light sources can be combined with embodiments of the present invention.
某些物品可以在其上具有可能需要额外或更直接地施用含有处理材料(例如等离子体或消毒剂)的空气的区域、空间或结构,以达到杀死微生物并除去气味的期望效果。本发明实施方式的另外的特征可以是以使得某些物品的处理最大化的方式来引导处理空气的能力。本发明的一个实施方式具有通向处理室的多个端口750,其中一个实例在图24和图25B中示出。图27、图28和图29示出了适形袋。这些端口不仅可以以特定的模式设置以调节处理空气进出处理室的流量,而且还允许将气体引导部件755(例如软管、漏斗或扩散器)的特定布置附接到端口以加强对某些物品的处理。例如,为了处理拳击手套的内部,可能希望使处理气体直接进入手套内部并从手套的内部流出。Some articles may have thereon the area, space or structure that may need to apply the air containing treatment material (such as plasma or disinfectant) additionally or more directly, to reach the desired effect of killing microorganisms and removing odor.Another feature of an embodiment of the present invention may be to guide the ability of treatment air in a manner that maximizes the treatment of some articles.One embodiment of the present invention has a plurality of ports 750 leading to a treatment chamber, wherein one example is shown in Figure 24 and Figure 25B.Figure 27, Figure 28 and Figure 29 show conformable bags.These ports can not only be arranged with a specific pattern to regulate the flow rate of treatment air in and out of the treatment chamber, but also allow the specific arrangement of gas guiding component 755 (such as hose, funnel or diffuser) to be attached to port to strengthen the processing of some articles.For example, in order to process the inside of a boxing glove, it may be desirable to make treatment gas directly enter the glove interior and flow out from the inside of the glove.
一个实施方式包括附接到至少一个端口的柔性管形式的气体引导部件,其中一个实例如图24中所示,管的端部可插入物品(例如手套)的内部,以在处理循环期间将气体引入和移出物品的内部。或者,可能需要使气体更一般地扩散进入和离开处理室,例如,当处理毛巾时。在另一个实施方式中,可以使用处理室的壁中(例如在刚性板101中)的多个端口75。在另一个实施方式中,扩散附件可以附接在一个或多个端口上,例如图25A和图25B所示。One embodiment includes a gas directing member in the form of a flexible tube attached to at least one port, an example of which is shown in FIG. 24 , where the end of the tube can be inserted into the interior of an article (e.g., a glove) to introduce and remove gas from the interior of the article during a treatment cycle. Alternatively, it may be desirable to diffuse gas more generally into and out of the treatment chamber, for example, when treating a towel. In another embodiment, a plurality of ports 75 in the wall of the treatment chamber (e.g., in a rigid plate 101) can be used. In another embodiment, a diffusion attachment can be attached to one or more ports, such as shown in FIG. 25A and FIG. 25B .
本发明的等离子体处理装置10不限于处理特定尺寸物品75。可以处理的任何物品的尺寸仅受处理室100的尺寸和/或体积的限制。在一个实施方式中,等离子体处理装置可以是手提便携的并且适合家庭使用。例如,本发明的等离子体处理装置可以用于处理家用物品或衣物,可具有尺寸适于装配到便携式外壳50中的处理室。在另一实施方式中,便携式处理装置可以永久固定,或者是至少不是手提便携式,并且具有足以容纳较大物品尺寸的处理室或具有工业或商业用途。在一个实施方式中,处理室具有约50ml至约500升的体积。在更具体的实施方式中,处理室具有约200ml至50升的体积。The plasma treatment apparatus 10 of the present invention is not limited to treating items 75 of a particular size. The size of any item that can be treated is limited only by the size and/or volume of the treatment chamber 100. In one embodiment, the plasma treatment apparatus can be hand-portable and suitable for home use. For example, the plasma treatment apparatus of the present invention can be used to treat household items or clothing and can have a treatment chamber sized to fit into the portable housing 50. In another embodiment, the portable treatment apparatus can be permanently fixed, or at least not hand-portable, and have a treatment chamber sufficient to accommodate larger item sizes or have industrial or commercial uses. In one embodiment, the treatment chamber has a volume of about 50 ml to about 500 liters. In a more specific embodiment, the treatment chamber has a volume of about 200 ml to 50 liters.
本发明的装置可以通过采用包括真空阶段和再填充阶段的可重复过程用于处理物品。该过程的一个实施方式在图17-23中显示。在该过程的真空阶段,例如图18所示,将负压拉到具有适形壁102的处理室100上,进而使适形壁塌陷到物品上,并进一步挤压或压缩被处理物品,以便尽可能多的从处理室中移除环境空气。在该过程的再填充阶段期间,如图19所示,负压在处理室内反转或释放,直至获得中性或正压点。一个真空阶段之后跟随一个再填充阶段,构成一个处理循环。在一个具体的实施方式中,真空阶段和再填充阶段重复多次以执行多个处理循环。The apparatus of the present invention can be used to process articles by employing a repeatable process comprising a vacuum phase and a refill phase. One embodiment of the process is shown in Figures 17-23. During the vacuum phase of the process, such as shown in Figure 18, negative pressure is drawn onto a processing chamber 100 having conformable walls 102, thereby causing the conformable walls to collapse onto the article and further squeezing or compressing the article being processed so as to remove as much ambient air as possible from the processing chamber. During the refill phase of the process, such as shown in Figure 19, the negative pressure is reversed or released within the processing chamber until a neutral or positive pressure point is achieved. A vacuum phase is followed by a refill phase, constituting a processing cycle. In a specific embodiment, the vacuum phase and refill phase are repeated multiple times to perform multiple processing cycles.
在另一个实施方式中,在多个处理循环之后有一个最后循环。在最后循环中,空气进入处理室,直至处理室的压力恢复或大致恢复到中性压力,此时可以将物品从处理室移出,如图23所示。在一个具体的实施方式中,在最后循环期间,空气在进入处理室之前通过气味盒,进而赋予被处理物品气味,如图22和图23所示。In another embodiment, a final cycle is performed after multiple treatment cycles. During the final cycle, air is admitted to the treatment chamber until the pressure in the treatment chamber is restored or substantially returned to a neutral pressure, at which point the articles can be removed from the treatment chamber, as shown in FIG23. In one specific embodiment, during the final cycle, the air passes through a scent cartridge before entering the treatment chamber, thereby imparting a scent to the treated articles, as shown in FIG22 and FIG23.
该方法的具体实施方式在处理室内利用等离子体处理物品。在该实施方式中,在再填充阶段期间进入处理室的空气在进入处理室100之前通过等离子体发生器200。由于等离子体具有高活性,其能够攻击物品中的有机物质。在物品上的有机物质被破坏或可具有气味中和、除臭或抗微生物作用。This method utilizes plasma to treat articles within a treatment chamber. In this embodiment, air entering the treatment chamber during the refill phase passes through a plasma generator 200 before entering treatment chamber 100. Because plasma is highly reactive, it attacks organic matter within the articles. This organic matter on the articles is destroyed or may have an odor-neutralizing, deodorizing, or antimicrobial effect.
在替代的实施方式中,可以使用雾化消毒剂来处理物品,其作为等离子体的补充或用于替代等离子体。类似雾化消毒剂的实施例包括但不限于过氧化氢和醇。装置的一个实施方式包括雾化机构960,以当环境空气被移回处理室100时将雾化消毒剂用到物品75上。图22B示出了该实施方式的非限制性示例。在该实施方式中,消毒剂可以在每个处理循环期间或在最后一个再填充循环期间使用。在某些实施方式中,雾化机构包括用于容纳消毒剂的流体贮存器965和用于使流体消毒剂雾化的喷嘴970,使其进入环境空气通路。可以与本发明的实施方式一起使用的雾化喷嘴的实例包括但不限于文丘里或喷孔型喷嘴或本领域已知的任何可以从储存器产生足够小的液滴以使得它们可以通过环境空气流被运送到处理室的其它喷嘴。在另一个实施方式中,雾化机构优选地连接到通向处理室的环境空气的通路,并在环境空气进入处理室的同时可以激活雾化机构,使得雾化消毒剂在再填充阶段输送到处理室。在替代的实施方式中,雾化机构用于分散作为消毒流体的替代或补充的气味流体。In alternative embodiments, an aerosolized disinfectant can be used to treat the article, either in addition to or in place of the plasma. Examples of similar aerosolized disinfectants include, but are not limited to, hydrogen peroxide and alcohols. One embodiment of the apparatus includes an aerosolizing mechanism 960 for applying the aerosolized disinfectant to the article 75 as ambient air is moved back into the treatment chamber 100. FIG22B illustrates a non-limiting example of this embodiment. In this embodiment, the disinfectant can be applied during each treatment cycle or during the final refill cycle. In certain embodiments, the aerosolizing mechanism includes a fluid reservoir 965 for containing the disinfectant and a nozzle 970 for aerosolizing the fluid disinfectant into the ambient air passage. Examples of aerosolizing nozzles that can be used with embodiments of the present invention include, but are not limited to, venturi or orifice-type nozzles, or any other nozzle known in the art that can produce sufficiently small droplets from a reservoir so that they can be transported to the treatment chamber by the ambient air flow. In another embodiment, the aerosolizing mechanism is preferably connected to the ambient air passage leading to the treatment chamber and can be activated as ambient air enters the treatment chamber, causing aerosolized disinfectant to be delivered to the treatment chamber during the refill phase. In an alternative embodiment, an atomizing mechanism is used to disperse a scented fluid as an alternative to or in addition to the disinfecting fluid.
该过程的真空阶段可以包括一级和二级真空循环。在包括二级真空循环的实施方式中,一级真空循环首先从处理室100中移除环境空气,使得处理室的适形壁102开始适合该物品并在处理室内产生减小的工作体积的空气。在一级真空循环期间移除环境空气不必须但可以在处理室内产生负压。该过程中的这个步骤之后可以是二级真空循环,其可以在处理室上拉至少最小的负压并且移动所有或大部分剩余的减少的工作体积的环境空气。二级真空循环可以将剩余的环境空气直接或通过等离子体发生器移到流出室中。然后,在再填充阶段,来自该流出室的空气通过等离子体发生器返回到处理室中。随后的处理循环在流出室和处理室之间来回(通过等离子体发生器)移动减少的空气体积。减少工作体积降低了来回泵送空气所需要的时间量,并提高处理效率(如上述所述)。The vacuum stage of this process can include primary and secondary vacuum cycles. In an embodiment including a secondary vacuum cycle, the primary vacuum cycle first removes ambient air from the processing chamber 100 so that the compliant walls 102 of the processing chamber begin to fit the article and create a reduced working volume of air in the processing chamber. Removing ambient air during the primary vacuum cycle is not necessary but can create a negative pressure in the processing chamber. This step in the process can be followed by a secondary vacuum cycle, which can pull at least a minimum negative pressure on the processing chamber and move all or most of the remaining reduced working volume of ambient air. The secondary vacuum cycle can move the remaining ambient air directly or through a plasma generator into the outflow chamber. Then, in the refill phase, the air from the outflow chamber is returned to the processing chamber through the plasma generator. Subsequent processing cycles move the reduced air volume back and forth (through the plasma generator) between the outflow chamber and the processing chamber. Reducing the working volume reduces the amount of time required to pump air back and forth and improves processing efficiency (as described above).
如上述所述,等离子体处理装置的某些实施方式使用可密封130的具有至少一个适形壁102的适形袋125作为处理室100。适形袋可以利用本文中对于使用抵靠刚性板101密封的适形壁102的实施方式所述的任何方法和组件。在使用适形袋作为处理室的实施方式中,可以产生密封的入口和出口端口,以允许空气在循环期间流入和流出。端口还可以包括用于气体引导部件的附件。在这样的实施方式中,处理室可以被密封在壳体50中,或者在替代的实施方式中,处理室未封闭在壳体内。例如,当使用该装置来处理非常大的物品(例如,床垫)时,使处理室不被封闭是有利的。在这样的实施方式中,要处理的物品将被放置在一个适形袋中,袋子的开口被密封封闭。As described above, certain embodiments of the plasma treatment apparatus utilize a sealable 130 conformal bag 125 having at least one conformal wall 102 as the treatment chamber 100. The conformal bag can utilize any of the methods and components described herein for embodiments utilizing conformal walls 102 sealed against a rigid plate 101. In embodiments utilizing a conformal bag as the treatment chamber, sealed inlet and outlet ports can be created to allow air to flow in and out during circulation. The ports can also include attachments for gas directing components. In such embodiments, the treatment chamber can be sealed within the housing 50, or in alternative embodiments, the treatment chamber is not enclosed within the housing. For example, when the apparatus is used to treat very large items (e.g., mattresses), it is advantageous to leave the treatment chamber unenclosed. In such embodiments, the item to be treated would be placed in a conformal bag, the opening of which would be sealed closed.
使用本发明的等离子体处理装置10处理物品的方法可以在物品被放入处理室100并且处理室100关闭时开始。然后可以开始一级真空循环。在一个实施方式中,在一级真空循环期间,空气从处理室100中移出,并直接或通过过滤机构400进入周围环境15。一级真空循环可以继续,直至当满足一个或多个工艺条件时(例如,当达到限制时间或当压力传感器850指示在处理室100中达到预定压力时)控制器被激活。然后,控制器可以激活等离子体发生器200,并且可以启动再填充循环,其中空气从周围环境15转移(主动地-使用空气泵300驱动空气,或被动地-仅打开阀门以允许相对压力平衡)通过激活的产生等离子体的等离子体产生电极200。将等离子体输送入处理室100的空气的主动或被动转移可以继续进行,直到传感器850确定如上所述的一个或多个工艺条件得到满足并激活控制器850。在一个实施方式中,控制器开始预订数量时间的处理暂停,此时等离子体在处理室用于物品消毒。在处理暂停之后,控制器可以被激活以再次开始一级真空循环,并且再次通过过滤机构从处理室100泵送空气,并进入周围环境15,直至传感器确定一个或多个工艺条件得到满足。The method of treating an article using the plasma treatment apparatus 10 of the present invention may begin when the article is placed in the treatment chamber 100 and the treatment chamber 100 is closed. A primary vacuum cycle may then be initiated. In one embodiment, during the primary vacuum cycle, air is removed from the treatment chamber 100 and enters the ambient environment 15, either directly or through the filtration mechanism 400. The primary vacuum cycle may continue until the controller is activated when one or more process conditions are met (e.g., when a limit time is reached or when the pressure sensor 850 indicates that a predetermined pressure has been reached in the treatment chamber 100). The controller may then activate the plasma generator 200 and initiate a refill cycle, in which air is transferred from the ambient environment 15 (actively—using the air pump 300 to drive air, or passively—by simply opening a valve to allow relative pressures to equalize) through the activated plasma generation electrode 200, which is generating plasma. The active or passive transfer of air into the treatment chamber 100 may continue until the sensor 850 determines that one or more of the process conditions described above have been met and activates the controller 850. In one embodiment, the controller initiates a treatment pause of a predetermined amount of time, during which the plasma is used to sterilize the article in the treatment chamber. After a processing pause, the controller may be activated to restart the primary vacuum cycle and again pump air from the processing chamber 100 through the filtration mechanism and into the ambient environment 15 until the sensors determine that one or more process conditions are met.
在另一个实施方式中,控制器可以启动额外的处理循环(取决于规划的方案),其中控制器激活等离子体发生器200并切换空气流,使得其从周围环境15流过等离子体发生器200,等离子体进入处理室100。在最后处理循环之后,控制器可以启动最终的真空循环,其中来自处理室100的空气直接或通过过滤机构400被泵送回到周围环境15。在完成规划次数的处理循环和最终真空循环之后,控制器可以启动最终的流动循环,其中来自周围环境15的空气进入(主动或被动地)到处理室100,,直至传感器确定某些工艺条件得到满足(例如,时间限制,或者当压力传感器850指示处理室100内已达到预设定的压力)。在某些实施方式中,最终流动循环将来自周围环境15的空气直接传递到处理室100,或者在其它的实施方式中,通过气味盒700使物品变香。一旦传感器确定整个处理方案已经完成,则物品可以从处理室100中移出。In another embodiment, the controller can initiate additional treatment cycles (depending on the planned protocol), in which the controller activates the plasma generator 200 and switches the air flow so that it flows from the ambient environment 15 through the plasma generator 200 and into the processing chamber 100. After the final treatment cycle, the controller can initiate a final vacuum cycle in which air from the processing chamber 100 is pumped back into the ambient environment 15, either directly or through the filtration mechanism 400. After completing the planned number of treatment cycles and the final vacuum cycle, the controller can initiate a final flow cycle in which air from the ambient environment 15 is introduced (actively or passively) into the processing chamber 100 until sensors determine that certain process conditions have been met (e.g., a time limit, or when the pressure sensor 850 indicates that a predetermined pressure has been reached within the processing chamber 100). In some embodiments, the final flow cycle delivers air from the ambient environment 15 directly to the processing chamber 100, or, in other embodiments, scents the item via the scent cartridge 700. Once the sensors determine that the entire treatment protocol has been completed, the item can be removed from the processing chamber 100.
在一个实施方式中,在一级真空循环期间,将空气从处理室100移出并直接通过过滤机构400,或通过被激活的等离子体发生器200,进入一级流出室1。在这样的实施方式中,一级真空循环继续,直到可操作地连接到控制器的传感器800确定某些工艺条件得到满足(例如,时间限制,或者当压力传感器850指示处理室100内已达到预定的压力),指示一级真空循环结束。In one embodiment, during the primary vacuum cycle, air is removed from the processing chamber 100 and passed directly through the filtration mechanism 400, or through an activated plasma generator 200, into the primary outflow chamber 1. In such an embodiment, the primary vacuum cycle continues until a sensor 800 operably connected to the controller determines that certain process conditions have been met (e.g., a time limit, or when the pressure sensor 850 indicates that a predetermined pressure has been reached within the processing chamber 100), indicating the end of the primary vacuum cycle.
在等离子体发生器在一级真空循环开始时尚未被激活的实施方式中,一旦一级真空循环结束,控制器就可以激活等离子体发生器200,然后空气可以从一级流出室1被传递通过(主动的或被动的)激活的产生等离子体的等离子体产生电极,然后将等离子体传递到处理室100中,直到传感器在某些工艺条件得到满足时(例如,时间限制,或当压力传感器850指示已经在处理室100达到预设的压力)确定并激活控制器。In embodiments where the plasma generator is not activated at the start of the primary vacuum cycle, once the primary vacuum cycle is complete, the controller may activate the plasma generator 200, and air may then be passed from the primary outlet chamber 1 through the (actively or passively) activated plasma generating electrode to generate the plasma, and then into the processing chamber 100 until a sensor determines and activates the controller when certain process conditions are met (e.g., a time limit, or when the pressure sensor 850 indicates that a predetermined pressure has been reached in the processing chamber 100).
如果等离子体发生器200在一级真空循环开始时被激活,则在一级真空循环结束后发生器200可以保持激活,并且空气从一级流出室1通过发生器200然后进入处理室100。然后,控制器可以启动预定时间量的处理暂停,从而留出等离子体对物品进行消毒的时间。在处理暂停之后,控制器再次开始一级真空循环,并且再次通过过滤机构将空气从处理室100泵送到一级流出室1中。If the plasma generator 200 is activated at the beginning of the primary vacuum cycle, the generator 200 may remain activated after the primary vacuum cycle ends, and air flows from the primary outflow chamber 1 through the generator 200 and then into the processing chamber 100. The controller may then initiate a processing pause of a predetermined amount of time, thereby allowing time for the plasma to sterilize the items. After the processing pause, the controller restarts the primary vacuum cycle and again pumps air from the processing chamber 100 through the filtration mechanism into the primary outflow chamber 1.
在替代的实施方式中,将空气从处理室100直接泵送到一级流出室1而不通过过滤机构,直到传感器800确定某些工艺条件得到满足(例如,时间限制,或当压力传感器850指示在处理室100中已经达到预定的压力)并激活控制器。In an alternative embodiment, air is pumped from the process chamber 100 directly to the primary outflow chamber 1 without passing through a filtering mechanism until the sensor 800 determines that certain process conditions are met (e.g., a time limit, or when the pressure sensor 850 indicates that a predetermined pressure has been reached in the process chamber 100) and activates the controller.
在一个实施方式中,控制器启动额外的处理循环(次数取决于规划的方案),其中控制器激活等离子体发生器200并切换空气流,使得其从一级流出室1流过等离子体发生器200,等离子体进入处理室100。在最后处理循环之后,控制器启动最终的真空循环,其中来自处理室100的空气被泵送回到一级流出室1中。在完成这些规划数量的处理循环和最终真空循环之后,控制器启动最终流动循环,其中来自一级流出室1的空气被传递(主动或被动地)到处理室100中,直到确定满足所需的工艺条件的传感器激活控制器。在一个实施方式中,最终流动循环将来自一级流出室1的空气直接送入处理室100,或者在另一个实施方式中,通过气味盒700将一种气味赋予物品75。一旦整个处理方案完成,物品可以从处理室100中移出。In one embodiment, the controller initiates additional treatment cycles (the number of which depends on the planned protocol), in which the controller activates plasma generator 200 and switches the air flow so that it flows from primary outlet chamber 1 through plasma generator 200, and plasma enters process chamber 100. After the final treatment cycle, the controller initiates a final vacuum cycle in which air from process chamber 100 is pumped back into primary outlet chamber 1. After completing these planned number of treatment cycles and the final vacuum cycle, the controller initiates a final flow cycle in which air from primary outlet chamber 1 is transferred (actively or passively) into process chamber 100 until a sensor that determines that the desired process conditions are met activates the controller. In one embodiment, the final flow cycle delivers air from primary outlet chamber 1 directly into process chamber 100, or, in another embodiment, applies a scent to article 75 via scent cartridge 700. Once the entire treatment protocol is complete, the article can be removed from process chamber 100.
在一个实施方式中,当控制器启动一级真空循环时,空气从处理室100中移除,并直接或通过过滤机构400进入一级流出室1。在至少一个实施方式中,一级真空循环继续进行,直到确定满足工艺条件的传感器激活控制器,如上所述。控制器可以启动二级真空循环,其中来自处理室100的空气被泵送到二级流出室2中,二级流出室2也可以是适形的,以允许其膨胀或收缩。当工艺条件满足时,例如,当压力传感器850指示处理室100中已经达到预定压力时,例如,存在比处理室100内压力更低的压力时触发终止一级真空循环,控制器可以激活等离子体发生器200并切换空气流,使得其从二级流出室2流过等离子体发生器200并且等离子体进入处理室100。该方法的一个例子如图2所示。In one embodiment, when the controller initiates a primary vacuum cycle, air is removed from the process chamber 100 and enters the primary outlet chamber 1 directly or through the filtration mechanism 400. In at least one embodiment, the primary vacuum cycle continues until a sensor determines that a process condition has been met, as described above, activates the controller. The controller can initiate a secondary vacuum cycle, in which air from the process chamber 100 is pumped into the secondary outlet chamber 2, which can also be compliant to allow it to expand or contract. When the process condition is met, for example, when the pressure sensor 850 indicates that a predetermined pressure has been reached in the process chamber 100, for example, a pressure lower than the pressure within the process chamber 100, triggering the termination of the primary vacuum cycle, the controller can activate the plasma generator 200 and switch the air flow so that it flows from the secondary outlet chamber 2 through the plasma generator 200 and plasma enters the process chamber 100. An example of this method is shown in Figure 2.
在另一个实施方式中,当等离子体对物品进行消毒时,控制器可以启动预定时间量的处理暂停。控制器再次开始二级真空循环,然后来自处理室100的空气再次通过过滤机构,或者通过等离子体发生器,或直接泵送到二级流出室2中,直到确定了某些工艺条件得到满足。接下来,控制器可以启动额外的处理循环(数量取决于规划的方案),其中控制器激活等离子体发生器200并切换空气流,使得其从二级流出室2流过等离子体发生器200,等离子体进入处理室100。通过这种方法实现的几个优点之中,在二级流出室和处理室之间来回传递的空气体积较小,这使得装置能够更有效地处理物品。该方法也可以减少完成每个处理循环的时间。此外,在空气在从处理室到二级流出室的往返途径上通过等离子体发生器的实施方式中,转化为等离子体的空气量增加,进而增加用于处理物品的等离子体的浓度。In another embodiment, while the plasma is sterilizing the article, the controller can initiate a processing pause for a predetermined amount of time. The controller then restarts the secondary vacuum cycle, whereupon air from the processing chamber 100 is again passed through the filtration mechanism, either through the plasma generator, or directly pumped into the secondary outflow chamber 2, until it determines that certain process conditions are met. Next, the controller can initiate additional processing cycles (the number of which depends on the planned protocol), in which the controller activates the plasma generator 200 and switches the air flow so that it flows from the secondary outflow chamber 2 through the plasma generator 200, and plasma enters the processing chamber 100. Among the advantages achieved by this approach is that the volume of air transferred back and forth between the secondary outflow chamber and the processing chamber is smaller, which enables the device to process articles more efficiently. This approach can also reduce the time to complete each processing cycle. Furthermore, in embodiments where air passes through the plasma generator on its way from the processing chamber to the secondary outflow chamber and back, the amount of air converted to plasma is increased, thereby increasing the concentration of plasma used to treat the article.
在至少一个实施方式中,当控制器启动一级真空循环时,来自处理室100的空气被泵送到周围环境15(直接地或通过过滤机构400)。在至少一个实施方式中,一级真空循环持续运行直到控制器确定满足某些工艺条件。接下来,控制器启动二级真空循环,其中切换阀以允许空气从处理室100泵送到二级流出室2中。在一个实施方式中,二级流出室2是适形的以允许其膨胀或收缩。当传感器确定满足某些工艺条件时,控制器可激活等离子体发生器200并切换空气流,使其从二级流出室2流过等离子体发生器200,进而等离子体进入处理室100。然后,控制器在等离子体对物品进行消毒的同时启动预定时间量的处理暂停。在处理暂停之后,控制器再次开始二级真空循环,空气再次通过过滤机构或直接地从处理室100泵送到二级流出室2,直到传感器确定某些工艺条件得到满足。控制器可以启动额外的处理循环(取决于规划的方案),其中控制器激活等离子体发生器200并切换空气流,使其从二级流出室2流过等离子体发生器200,然后等离子体进入处理室100。In at least one embodiment, when the controller initiates a primary vacuum cycle, air from the processing chamber 100 is pumped to the ambient environment 15 (directly or through the filtration mechanism 400). In at least one embodiment, the primary vacuum cycle continues until the controller determines that certain process conditions have been met. Next, the controller initiates a secondary vacuum cycle, in which a valve is switched to allow air to be pumped from the processing chamber 100 into the secondary outlet chamber 2. In one embodiment, the secondary outlet chamber 2 is compliant to allow it to expand or contract. When the sensors determine that certain process conditions have been met, the controller may activate the plasma generator 200 and switch the air flow so that it flows from the secondary outlet chamber 2 through the plasma generator 200, and then the plasma enters the processing chamber 100. The controller then initiates a process pause for a predetermined amount of time while the plasma sterilizes the items. After the process pause, the controller restarts the secondary vacuum cycle, and air is again pumped from the processing chamber 100 to the secondary outlet chamber 2 through the filtration mechanism or directly, until the sensors determine that certain process conditions have been met. The controller may initiate additional processing cycles (depending on the planned protocol) in which the controller activates the plasma generator 200 and switches the air flow from the secondary outflow chamber 2 through the plasma generator 200 and then into the plasma in the processing chamber 100 .
在最后处理暂停之后,控制器可以启动最终流动循环,其中,来自处理室100的空气通过过滤机构泵送到周围环境15中,直到控制器确定满足某些工艺条件。切换阀以将来自周围环境15的空气直接或通过气味盒700泵送到处理室100中,直到控制器确定某些工艺条件得到满足。一旦控制器确定整个处理方案已经完成,则物品可以从处理室100中移出。After the last processing pause, the controller can initiate a final flow cycle in which air from the processing chamber 100 is pumped through a filtration mechanism into the ambient environment 15 until the controller determines that certain process conditions are met. A valve is switched to pump air from the ambient environment 15 into the processing chamber 100, either directly or through a scent cartridge 700, until the controller determines that certain process conditions are met. Once the controller determines that the entire processing protocol has been completed, the items can be removed from the processing chamber 100.
这里描述的实施例和实施方式仅用于说明性目的,并且就其进行的各种修改或变化可被建议给本领域技术人员并且应被包括在本发明的精神和范围内。The embodiments and implementations described herein are for illustrative purposes only, and various modifications or changes thereto may be suggested to those skilled in the art and are intended to be included within the spirit and scope of the present invention.
在本说明书中对于“一个实施方式”、“实施方式”、“示例性实施方式”、“另一种实施方式”、“替代的实施方式”等的提及是为了文字上的方便。这意味着结合实施方式描述的任意特定特征、结构或特性包括于本发明的至少一个实施方式中。这种短语在说明书中的不同地方的出现并不一定是指相同的实施方式。此外,本文公开的任何发明或其实施方式的任何元素或限制可以与本文公开的任何和/或所有其他元素或限制(单独地或以任何组合)或任何其它发明或其实施方式组合,并且所有这些组合涵盖在本发明的范围内而非对其进行限制。References in this specification to "one embodiment," "an embodiment," "an exemplary embodiment," "another embodiment," "an alternative embodiment," etc. are for convenience of description. This means that any specific feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. The appearance of such phrases in different places in the specification do not necessarily refer to the same embodiment. In addition, any element or limitation of any invention or embodiment thereof disclosed herein may be combined with any and/or all other elements or limitations disclosed herein (alone or in any combination) or any other invention or embodiment thereof, and all such combinations are within the scope of the invention and are not limitations thereon.
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| Application Number | Priority Date | Filing Date | Title |
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| US201462095629P | 2014-12-22 | 2014-12-22 | |
| US62/095,629 | 2014-12-22 | ||
| US201562129533P | 2015-03-06 | 2015-03-06 | |
| US62/129,533 | 2015-03-06 | ||
| PCT/US2015/067437 WO2016106344A1 (en) | 2014-12-22 | 2015-12-22 | Plasma treatment device and method of treating items |
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| HK1243361A1 HK1243361A1 (en) | 2018-07-13 |
| HK1243361B true HK1243361B (en) | 2022-02-18 |
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