HK1240715B - Power conversion device with integrated discrete inductor - Google Patents

Description

Power conversion device with integrated discrete inductor

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application No. 62/274,554, entitled “POWER CONVERSION DEVICE WITH INTEGRATED DISCRETE INDUCTOR,” filed on January 4, 2016, which is hereby incorporated by reference in its entirety.

Technical Field

The present disclosure generally relates to the technical field of semiconductor devices, and more particularly, to power conversion devices with integrated discrete inductors.

Background Art

Voltage regulators, such as DC-to-DC converters, are used to provide a stable voltage source for electronic systems. Efficient DC-to-DC converters are particularly desirable for low-power devices. One type of DC-to-DC converter is a switching voltage regulator. A switching voltage regulator generates an output voltage by alternately coupling and decoupling an input DC voltage source from a load. The coupling and decoupling actions can be performed by a switch, while a low-pass filter consisting of a capacitor and an inductor can be used to filter the output of the switch to provide a DC output voltage.

FIG1 illustrates an exemplary embodiment of a "buck" switching regulator capable of performing DC-to-DC step-down conversion. Referring to FIG1 , circuit 100 includes a voltage source 103, a switching regulator 102, and a load 113. Switching regulator 102 is coupled to voltage source 103 via input terminal 114. Switching regulator 102 is also coupled to load 113 via output terminal 112, which can be another electronic circuit that draws current. Switching regulator 102 includes switching circuit 116, which acts as a power switch for alternately coupling and decoupling input terminal 114 from intermediate terminal LX node 109. Switching circuit 116 includes a first transistor 107 and a second transistor 108. Typically, both transistors 107 and 108 can be implemented as metal oxide semiconductor field effect transistors (MOSFETs). Transistor 107 has a drain connected to input terminal 114, a source connected to intermediate terminal 109, and a gate connected to control line 105. Transistor 108 has a drain connected to an intermediate terminal LX node 109 , a source connected to a low voltage potential 115 (eg, ground), and a gate connected to a control line 106 .

Switching regulator 102 includes a controller 104 for controlling the operation of a switching circuit 116 via control lines 105 and 106. Switching regulator 102 also has an output filter 117 comprising an inductor 110 connected between an intermediate terminal 109 and an output terminal 112, and a capacitor 111 connected in parallel with a load 113. Controller 104 causes switching circuit 116 to alternate between a first on-cycle, during which first transistor 107 is enabled and second transistor 108 is disabled, to bring intermediate terminal 109 to a voltage substantially equal to the input voltage, and a second on-cycle, during which first transistor 107 is disabled and second transistor 108 is enabled, to bring intermediate terminal 109 to a voltage substantially equal to low voltage potential 115. This results in a rectangular waveform at LX node 109, which can function as an intermediate terminal, that switches substantially between the input voltage and a voltage equal to voltage potential 115. LX node 109 is coupled to output terminal 112 via output filter 117. The output filter 117 converts the rectangular waveform at the intermediate terminal 109 into a substantially DC voltage at the output terminal 112. The amplitude of the output DC voltage at the terminal 112 depends on the duty cycle of the rectangular waveform at the intermediate terminal 109.

With the widespread use of BCD (bipolar-CMOS-DMOS) technology, it is common to integrate controller 104, switching circuit 116, and high-precision feedback circuitry (not shown in FIG1 ) onto a single controller chip. This controller chip can have an output port corresponding to LX node 109. The controller chip can then be connected to a discrete inductor (e.g., inductor 110) at the output port corresponding to LX node 109 to form switching regulator 102. The external inductor can also be connected to other discrete components (e.g., capacitor 111) to form the output terminal (e.g., output terminal 112) of switching regulator 102.

FIG2 illustrates how a controller chip and discrete components are placed on a printed circuit board (PCB) to form the switching regulator 102 of FIG1 . As shown in FIG2 , system 200 includes a controller chip 202, which can include, for example, the controller 104 and switching circuit 116 of FIG1 . System 200 also includes capacitor 111 and inductor 110 of FIG1 . FIG2 also illustrates a plurality of board traces and pads arranged as the LX node 109, vout 112, vin 114, and ground 115 of FIG1 . System 200 also includes a capacitor 203 (not shown in FIG1 ) connected to vin 114 to act as a bypass capacitor, further reducing switching noise at that node. As shown in FIG2 , controller chip 202 is positioned adjacent to capacitors 111 and 203. Capacitors 111 and 203 are also positioned adjacent to inductor 110.

While the component arrangement in Figure 2 is simple to implement, it also presents several disadvantages. First, such an arrangement consumes a significant amount of board space, as each of the aforementioned components occupies a different area on the board surface. Second, relatively long board traces are required to connect between components, resulting in significant parasitic capacitance at some key nodes. For example, as shown in Figure 2, the length of LX node 109 is approximately 3 cm. Since LX node 109 is an intermediate node for charging and discharging inductor 110 and capacitor 111 by first transistor 107 and second transistor 108, reducing the length of LX node 109 and the associated parasitic capacitance can reduce switching losses and improve the efficiency of the power converter.

FIG3 illustrates a method for forming a component arrangement for the switching regulator 102 of FIG1 to reduce board space. As shown in FIG3 , the switching regulator 300 includes a controller chip 302, which can include, for example, the controller 104 and the switching circuit 116 of FIG1 . The switching regulator 300 also includes an inductor 110 housed within an inductor housing 304. The inductor housing 304 also houses internal wires 309a-b, with wire 309a soldered to the board 306 at pad 308a. The controller chip 302 also includes controller pads 307a and 307b, which provide electrical connections to the internal components of the controller chip 302 (e.g., the switching circuit 116 at the LX node 109). To reduce the space occupied by the switching regulator 300, the controller chip 302 is positioned on top of the inductor housing 304. Bond wire 310a is configured to provide an electrical connection between controller pad 307a and pad 308a, thereby providing an electrical connection between inductor 110 and controller chip 302 (e.g., LX node 109). Bond wire 310b is configured to provide an electrical connection between controller pad 307b and pad 308b on the board. Pad 308b enables controller chip 302 to be electrically connected to other components on board 306.

Although the arrangement shown in FIG. 3 reduces the board space required for placing the controller chip 202 and the inductor housing 304 , the bond wires 310 a and 310 b are still relatively long and can introduce a significant amount of parasitic capacitance and resistance.

FIG4 illustrates a method for arranging components to address the shortcomings of FIG3 . As shown in FIG4 , a switching regulator 400 includes a controller chip 402, which can include, for example, the controller 104 and the switching circuit 116 of FIG1 . The controller chip 402 can be a flip-chip device and include solder balls 408 a-b, which can be configured to serve as terminals that provide electrical connections to, for example, the controller 104 and the switching circuit 116 disposed within the controller chip 402. The switching regulator 400 also includes an inductor 110 housed within an inductor housing 404. The inductor housing 404 includes solder pads 410, which are configured to provide electrical connections to the inductor 110 via internal lines 409 a. As shown in FIG4 , the inductor 110 is electrically connected to the controller chip 402 via the solder balls 408 a and the solder pads 410. The inductor housing 404 is disposed on a board 406. To reduce the space occupied by the switching regulator 400 , the controller chip 402 is placed on top of the inductor housing 404 .

Utilizing the arrangement of FIG. 4 , in which the electrical connections between controller chip 402 and inductor housing 404 are provided by solder balls and solder pads, parasitic capacitance associated with those electrical connections (including those for LX node 109) can be reduced. However, the arrangement of FIG. 4 still has several disadvantages. First, while the solder pads and solder balls provide a good electrical connection between the inductor and the controller (e.g., LX node), they are exposed to the environment, and noise can be coupled into the electrical connection. This noise can affect the voltage output of switching regulator 400. Second, with controller 402 separated from board 406 by inductor housing 404, the arrangement of FIG. 4 can reduce other electrical connections for controller 402, such as VIN 114, GND 115, VOUT 112, etc. However, long bond wires may still be required to provide these electrical connections, which can introduce significant parasitic capacitance and resistance to these connections.

Thus, although the arrangement of FIG. 4 improves the electrical connection between the controller and the inductor, it may degrade the remaining electrical connections for the controller, and the performance of the switching regulator 400 can still be compromised.

Therefore, there is a need for a technique for arranging the components of a switching regulator that not only reduces the board area required but also provides good electrical connections and good insulation for all components so that the regulator can be made more compact and can be more easily assembled into miniaturized devices such as mobile phones.

Summary of the Invention

A switching regulator may include an inductor housing, a board, and one or more electrical components. The inductor housing may house an inductor and one or more wires. The board may include one or more board traces and one or more solder pads. The electrical components may include one or more chips, capacitors, voltage sources, and/or other electrical components. The inductor housing may be attached to the board to create a space between the inductor housing and the board. The space may be created below the inductor housing and above the board. One or more electrical components may be attached to the board. One or more electrical components may be disposed within the space.

In one aspect of the present disclosure, the switching regulator may include a chip. The chip may include a flip chip. The chip may include a first terminal. The chip may be attached to the board and disposed within the space. The inductor housing may accommodate a first wire electrically coupled to the inductor. The board may include a first board trace. The first board trace may electrically couple the first terminal to the first wire. In some embodiments, the inductor may be disposed on the chip. In some embodiments, the board may include a first solder pad and a second solder pad electrically coupled via the first board trace. The first solder pad may be soldered to the first wire, and the second solder pad may be soldered to the first terminal. In some embodiments, the board may include a recess having a surface. The chip and the inductor housing may be attached to the surface of the recess. In some embodiments, the inductor housing may be mounted on the chip using a non-conductive adhesive. The non-conductive adhesive may include a non-conductive die-attach film.

In some embodiments, the switching regulator may include a capacitor. The capacitor may include a second terminal. The capacitor may be attached to the board and disposed within the space. The inductor housing may accommodate a second wire electrically coupled to the inductor. The board may include a second board trace. The second board trace may electrically couple the second terminal to the second wire. In some embodiments, the board may include a third solder pad and a fourth solder pad electrically coupled via the second board trace. The third solder pad may be soldered to the second wire, and the fourth solder pad may be soldered to the second terminal. In some embodiments, the capacitor may be attached to the surface of the recess.

In another aspect of the present disclosure, the switching regulator may include a chip and a voltage source. The chip may include a flip chip. The chip may include a first terminal. The voltage source and the inductor housing may be attached to a first surface of the board. The voltage source may be disposed within the space. The chip may be attached to a second surface of the board. The chip may not be disposed within the space. The inductor housing may accommodate a first wire electrically coupled to the inductor. The board may include a first board trace. The first board trace may electrically couple the first terminal to the first wire. In some embodiments, the board may include a first solder pad and a second solder pad electrically coupled via the first board trace. The first solder pad may be soldered to the first wire, and the second solder pad may be soldered to the first terminal. In some embodiments, the board may include a recess having the second surface. In some embodiments, the inductor housing may be mounted to the voltage source using a non-conductive adhesive. The non-conductive adhesive may include a non-conductive die attach film.

In some embodiments, the switching regulator may include a capacitor. The capacitor may include a second terminal. The capacitor may be attached to the second surface of the board. The capacitor may not be disposed within the space. The inductor housing may accommodate a second wire electrically coupled to the inductor. The board may include a second board trace. The second board trace may electrically couple the second terminal to the second wire. In some embodiments, the board may include a third solder pad and a fourth solder pad electrically coupled via the second board trace. The third solder pad may be soldered to the second wire, and the fourth solder pad may be soldered to the second terminal.

In another aspect of the present disclosure, a switching regulator system may include an inductor housing and a board. The inductor housing may include an inductor, a first wire coupled to the inductor, and a second wire coupled to the inductor. The board may include a first board trace and a second board trace. The first board trace may be configured to couple to the first wire, and the second board trace may be configured to couple to the second wire. The inductor housing may be configured to attach to the board to create a space between the inductor housing and the board. One or more electrical components may be disposed within the space.

These and other objects, features, and characteristics of the systems and/or methods disclosed herein, as well as the functions and combinations of parts of the operating methods and related structural elements and the economies of manufacture, will become more apparent upon consideration of the following description and appended claims with reference to the accompanying drawings, all of which form a part hereof, wherein like reference numerals represent corresponding parts throughout the several figures. It should be expressly understood, however, that the drawings are for purposes of illustration and description only and are not intended as a definition of the limitations of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a block diagram of a step-down switching regulator;

FIG2 is a printed circuit board (PCB) layout showing the arrangement of components of a step-down switching regulator;

FIG3 is a schematic diagram showing another arrangement of components of a step-down switching regulator;

FIG4 is a schematic diagram showing another arrangement of components of a step-down switching regulator;

FIG5 is a schematic diagram illustrating an exemplary switching regulator according to an embodiment of the present disclosure;

FIG6 is a schematic diagram illustrating an exemplary switching regulator according to an embodiment of the present disclosure;

FIG7 is a schematic diagram illustrating an exemplary switching regulator according to an embodiment of the present disclosure; and

FIG8 is a schematic diagram illustrating an exemplary switching regulator according to an embodiment of the present disclosure; and

9 is a printed circuit board (PCB) layout illustrating the arrangement of components of an exemplary switching regulator according to an embodiment of the present disclosure.

DETAILED DESCRIPTION

FIG5 illustrates an exemplary switching regulator 500 according to an embodiment of the present disclosure. As shown in FIG5 , switching regulator 500 includes a controller chip 502, which can include, for example, controller 104 and switching circuit 116 of FIG1 . Switching regulator 500 also includes inductor 110, which is housed within an inductor housing 504 and raised above board 506, thereby creating a space 507 below the inductor. Controller 502 and other components of switching regulator 500 (e.g., capacitor 111) can be disposed within space 507 below inductor 110 and attached to board 506. In some embodiments, non-conductive die attach film (DAF) or any other non-conductive adhesive can be used to mount inductor housing 504 to controller chip 502 to further enhance the attachment of controller chip 502 to board 506.

As shown in FIG5 , inductor housing 504 also houses internal wires 509 a and 509 b, while board 506 also includes board traces 510 a-b and pads 512 a-d. Controller chip 502 can be a flip-chip device and include solder balls 508 a, which can be configured as terminals of controller chip 502 and can be soldered to pads 512 b. Controller chip 502 can also include solder balls 508 b (not shown in FIG5 ) configured to be soldered to other pads of board 506 (not shown in FIG5 ) to form other electrical connections (e.g., GND 115). Internal wire 509 a can also be soldered to pad 512 a. Using board trace 510 a providing an electrical connection between pads 512 a-b, an electrical connection can be formed between inductor 110 and controller chip 502 (e.g., LX node 109). Furthermore, an electrical connection (eg, vout 112 ) can also be made between inductor 110 and capacitor 111 with capacitor 111 soldered to pad 512c and inner wire 509b soldered to pad 512d , along with board trace 510b providing an electrical connection between pads 512c - d .

5 , inductor 110 and controller chip 502 can be stacked vertically rather than arranged side by side, requiring less board space to house these components. Furthermore, because inductor 110 and controller chip 502 are electrically isolated except at electrical contacts (e.g., pads 512b-c and solder balls 508a-b), and most electrical connections (e.g., internal wires 509a-b and board traces 510a-b) are also insulated from the environment, the amount of noise coupled into the electrical connection between inductor 110 and controller chip 502 can be reduced. Furthermore, both internal wires 509a-b and board traces 510a-b can be made very short, thereby providing a good electrical connection between inductor 110 and controller chip 502. This is because the length of internal wires 509a-b is primarily determined by the thickness of space 507, which is typically on the order of millimeters to accommodate the thickness of the controller chip or capacitor. If the solder balls 508a-b are a short distance from the inner lines 509a-b, that is, when the controller chip 502 and the capacitor 111 are arranged below the inductor 110, the board traces 510a-b can also be made very short. Finally, unlike the switching regulator 400 in which the controller chip is raised from the board, in the switching regulator 500, the controller chip is attached to the board and can have good electrical connections to other components (e.g., input power, ground, etc.) via other board traces embedded in the board 506 (not shown in Figure 5). Similarly, the inductor 110 can also be connected to other components via the board traces. Therefore, with the arrangement according to Figure 5, not only will the components take up less board space, but it is also possible to provide good electrical connections between the components via the board traces, as well as good insulation.

FIG6 illustrates an exemplary switching regulator 600 according to an embodiment of the present disclosure. As shown in FIG6 , the switching regulator 600 includes most of the components of the switching regulator 500, except for a board 606 on which the controller chip 502, the capacitor 111, and the inductor housing 504 are mounted, and includes a recess 608. The solder pads 512a-d can be disposed on a recess surface 620 of the recess 608, and the board traces 510a-b can also be disposed below the recess surface 620. The controller chip 502, the capacitor 111, and the inductor housing 504 can be mounted on the recess surface 620 and soldered to the solder pads 512a-d.

In addition to reducing board space requirements and providing good electrical connections and isolation between components, the arrangement shown in FIG6 also reduces the vertical height of switching regulator 600 compared to switching regulator 500. Consequently, switching regulator 600 can be made more compact than switching regulator 500.

FIG7 illustrates an exemplary switching regulator 700 according to an embodiment of the present disclosure. As shown in FIG7 , switching regulator 700 includes a controller chip 502, a capacitor 111, and an inductor 110, which is housed within an inductor housing 504 and raised above a board 706 to create a space 507 below the inductor. Space 507 can be used to accommodate, for example, voltage source 103 of FIG1 , which provides an input voltage to switching regulator 700. In this embodiment, inductor housing 504 is disposed on board surface 707a, while controller chip 502 and capacitor 111 are disposed on board surface 707b on the opposite side of board surface 707a. Board 706 also includes solder pads 712a and 712d on board surface 707a, and solder pads 712b and 712c on board surface 707b. Pads 712a and 712b are electrically connected via board trace 710a, and pads 712c and 712d are electrically connected via board trace 710b. Inner wires 509a and 509b can be soldered to pads 712a and 712d, while capacitor 111 and solder ball 508a of controller chip 502 can be soldered to pads 712b and 712c to form electrical connections for LX node 109 and vout 112.

7 , the inductor 110 and the controller chip 502 can be stacked vertically rather than arranged side by side, thereby requiring less board space to house these components. Furthermore, by distributing the components between two opposing sides of board 706, board space requirements can be further reduced, and the switching regulator 700 can be made more compact than the switching regulators 500 and 600 of FIGS. 5 and 6 , while maintaining the advantages provided by the switching regulators 500 and 600, including providing good insulation for the controller chip and for the inductor to reduce noise coupling, and providing good electrical connections between the components.

FIG8 illustrates an exemplary switching regulator 800 according to an embodiment of the present disclosure. As shown in FIG8 , switching regulator 800 includes most of the components of switching regulator 700, except for a plate 806 on which controller chip 502, capacitor 111, and inductor housing 504 are mounted, and includes a recess 808. Solder pads 712 b and 712 c can be disposed on a recess surface 820 of recess 808. Controller chip 502 and capacitor 111 can be mounted on recess surface 620 and soldered to solder pads 712 b and 712 c.

In addition to reducing board space requirements and providing good electrical connections between components, the arrangement shown in FIG8 also reduces the vertical height of switching regulator 800 compared to switching regulator 700. Therefore, switching regulator 800 can be made more compact than switching regulator 700.

FIG9 is a printed circuit board (PCB) layout 900 illustrating the arrangement of components of an exemplary switching regulator (e.g., switching regulator 500 of FIG5 ). As shown in FIG9 , controller chip 502 is positioned below inductor housing 504 (which houses inductor 110). Consequently, the connection between controller chip 502 and inductor 110 (e.g., LX node 109) can be made very short (less than 1 cm, compared to 3 cm as shown in FIG2 ) and can be provided by board traces embedded in the PCB, thereby providing good electrical connection and insulation. Furthermore, solder balls 508b of controller chip 502 can be soldered to board traces used for other electrical connections (e.g., GND 115), thereby providing good electrical connections for all nodes connected to controller chip 502. Because capacitor 111 (not shown in FIG9 ) can also be positioned below inductor housing 504 (and inductor 110), other electrical connections, such as VOUT 112, can be made very short.

References throughout this specification to “an embodiment,” “some embodiments,” “one embodiment,” “another example,” “an example,” “a specific example,” or “some examples” mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. Thus, phrases such as “in some embodiments,” “in one embodiment,” “in an embodiment,” “in another example,” “in an example,” “in a specific example,” or “in some examples” that appear throughout this specification are not necessarily referring to the same embodiment or example of the present disclosure. Furthermore, in one or more embodiments or examples, the particular features, structures, materials, or characteristics may be combined in any suitable manner.

The description of the embodiments is exemplary only and is not intended to be limiting. The embodiments described herein with reference to the accompanying drawings are explanatory, illustrative, and are used to understand the present disclosure as a whole. The embodiments should not be construed as limiting the present disclosure. Throughout the specification, the same reference numerals are used to represent the same or similar elements and elements with the same or similar functions. In this regard, directional terms such as "top", "bottom", "front", "rear", "head", "tail", etc. are described with reference to the orientation of the accompanying drawings described. Since the components of the embodiments of the present disclosure can be positioned in a plurality of different orientations, the directional terms are used for illustrative purposes and are by no means limiting.

Although exemplary embodiments have been shown and described, those skilled in the art will understand that the above embodiments should not be construed as limiting the present disclosure, and that changes, substitutions, and modifications can be made in the embodiments without departing from the spirit, principles, and scope of the present disclosure.

Claims (20)

1. An on/off regulator, comprising: An inductor housed in an inductor casing; A first wire electrically coupled to the inductor and housed in the inductor housing; Including the chip at the first terminal; and A board including a first board trace, the first board trace electrically coupling the first terminal to the first line; in: The chip and the inductor housing are attached to the board; The attachment of the inductor housing to the plate creates a space between the inductor housing and the plate; The first line is housed within the inductor housing such that the attachment of the inductor housing to the plate electrically couples the first plate trace to the first line; and The chip is disposed within the space. 2. The switching regulator according to claim 1, wherein the inductor is disposed on the chip. 3. The switching regulator of claim 1, wherein the board further includes a first pad and a second pad electrically coupled via the first board trace, the first pad being soldered to the first line housed in the inductor housing, and the second pad being soldered to the first terminal. 4. The switch-type regulator according to claim 1, wherein the plate further includes a groove having a surface; wherein the chip and the inductor housing are attached to the surface of the groove. 5. The on/off regulator according to claim 1, further comprising: A second wire is electrically coupled to the inductor and housed within the inductor housing; and Capacitor including the second terminal; in: The board also includes a second board trace that electrically couples the second terminal to the second line. The capacitor is attached to the plate; and The capacitor is disposed within the space. 6. The switching regulator of claim 5, wherein the board further includes a third pad and a fourth pad electrically coupled via the second board trace, the third pad being soldered to the second line housed in the inductor housing, and the fourth pad being soldered to the second terminal. 7. The switching regulator of claim 1, wherein the inductor housing is mounted on the chip using a non-conductive adhesive. 8. The on/off regulator according to claim 7, wherein the non-conductive adhesive comprises a non-conductive chip mounting film. 9. The on/off regulator according to claim 1, wherein the chip comprises a flip chip. 10. An on/off regulator, comprising: An inductor housed in an inductor casing; A first wire electrically coupled to the inductor and housed in the inductor housing; Including the chip at the first terminal; Voltage source; and A board including a first board trace, the first board trace electrically coupling the first terminal to the first line; in: The voltage source and the inductor housing are attached to the first surface of the plate; The chip is attached to the second surface of the board; The attachment of the inductor housing to the first surface of the plate creates a space between the inductor housing and the plate; and The voltage source is located within the space. 11. The switching regulator of claim 10, wherein the board further includes a first pad and a second pad electrically coupled via the first board trace, the first pad being soldered to the first line housed in the inductor housing, and the second pad being soldered to the first terminal. 12. The on/off regulator of claim 10, wherein the plate further includes a groove having the second surface. 13. The on/off regulator according to claim 10, further comprising: A second wire is electrically coupled to the inductor and housed within the inductor housing; and Capacitor including the second terminal; in: The board further includes a second board trace that electrically couples the second terminal to the second line; and The capacitor is attached to the second surface of the plate. 14. The switching regulator of claim 13, wherein the board further includes a third pad and a fourth pad electrically coupled via the second board trace, the third pad being soldered to the second line housed in the inductor housing, and the fourth pad being soldered to the second terminal. 15. The switching regulator of claim 10, wherein the inductor housing is mounted on the voltage source using a non-conductive adhesive. 16. The on/off regulator of claim 15, wherein the non-conductive adhesive comprises a non-conductive chip mounting film. 17. The on/off regulator of claim 10, wherein the chip comprises a flip chip. 18. A switch-type regulator system, comprising: An inductor housing, the inductor housing including an inductor, a first wire coupled to the inductor, and a second wire coupled to the inductor; and A board including a first board trace and a second board trace, wherein the first board trace is configured to be coupled to the first line, and the second board trace is configured to be coupled to the second line; The inductor housing is configured to be attached to the plate to create space between the inductor housing and the plate for one or more electrical components, and the first line and the second line are accommodated in the inductor housing such that the attachment of the inductor housing to the plate couples the first plate trace to the first line and the second plate trace to the second line. 19. The switching regulator system of claim 18, wherein the one or more electrical components comprise a chip and a capacitor. 20. The on/off regulator system of claim 18, wherein the one or more electrical components include a voltage source.