HK1139509B - Module for an electric energy storage assembly - Google Patents

Description

The present invention relates to the general technical field of electrical energy storage assemblies.

In particular, the invention relates to modules comprising at least two sets of electrical energy storage.

For the purposes of this invention, electrical energy storage device means either a capacitor (i.e. a passive system comprising two electrodes and an insulator), or a supercapacitor (i.e. a system comprising two electrodes, an electrolyte and a separator), or a lithium battery-type battery (i.e. a system comprising an anode, a cathode and an electrolyte solution between the anode and the cathode).

The first is the introduction of the concept of 'art'.

Modules as shown in Figure 1 are known, comprising a box 10 in which several electrical energy storage sets 20 are arranged and connected by means of connections 30.

These modules shall normally include an electronic management board 40 for the charge and discharge management of electrical energy storage assemblies 20.

As shown schematically in Figure 1, in a previous state-of-the-art module, the storage sets 20 are cylindrical and connected alternately in pairs at their upper 21 and lower 22 discs.

The electronic management card 40 is located in a central region 11 of box 10.

As shown above in Figure 2, in another embodiment, the module comprises a plurality of 40 electronic control boards glued to the 30 connection means in the lower part of the box 10.

In the two embodiments described above, the connection means 30, the energy storage assemblies 20 and the electronic management board (s) 40 produce heat.

The first is the use of a heat sink to heat the air.

US 2003/013009 describes a module comprising an electronic board and a battery pack electrically connected in series or in parallel. The batteries of the battery pack are in thermal contact with walls of a module housing via heat transfer plates. The electronic board is not in contact with any walls of the housing.

US 2006/0164812 describes a heat dissipation system which can be used in a module comprising a housing, storage assemblies inside the housing, and electronic boards outside the housing, the storage assemblies and electronic boards being in contact with the same walls of the housing.

US 2006/141348 describes a module comprising batteries and electronic circuits arranged inside a housing designed to dissipate heat generated inside the housing to the rear of the housing by means of heat plates.

US 2002/043959 describes a module comprising a housing in which heat transfer trays are arranged to receive a battery pack and an electronic card to charge and discharge the battery pack.The heat transfer trays allow the heat produced by the battery pack and the electronic card to be conveyed to the upper and lower walls of the housing.

US 2006/174092 (hereinafter D3) describes a lithium battery including a housing, a plurality of cells, and an electronic device for cell management.

However, the above solutions do not allow for sufficient thermal management.

The heat produced by energy storage units is not sufficiently discharged to the outside.

Temperature is an important factor in the ageing of energy storage systems.

The general aim of the invention is to propose a module which would overcome the disadvantage of existing modules.

The first two are:

For this purpose, a module comprising a housing containing at least two electrical energy storage units connected by means of connection and at least one electronic management board for energy management and diagnostics for the management of the charge and discharge of energy storage units is provided, in which different walls of the housing are in thermal contact while being electrically insulated respectively: for at least one wall with heat dissipation elements connected to electrical energy storage units,for at least one other wall with the electronic management board, to facilitate cooling of the module.

Thus, the combination (by means of heat dissipation elements) of the storage assemblies to a first wall of the enclosure and the electronic board to a second wall (different from the first wall) allows the heat produced inside the module to be discharged to the outside by the electronic management board (s), the connection means and the storage assemblies.

None of US 2003/013009, US 2006/0164812, US 2006/141348 and US 2002/043959 describes a module in which the electronic board and storage assemblies are in thermal contact while being electrically isolated with different walls of the module housing so that heat generated by these elements is dissipated by different walls of the housing. This feature of the invention allows for more efficient heat dissipation within the housing than with modules of the previous art.

Preferred but not limited aspects of the module according to the invention are: the housing shall comprise fins on at least one outer side of the housing: The term "flippers" here refers to any device which increases the surface area of a part for convective exchange. Wall hardeners, as well as radiator blades, may be considered to be fins within the meaning of this patent; this increases the contact area between the housing and the external environment in order to promote thermal exchange with the outside and thus improve the cooling of the interior of the module; the flippers are placed on the outer face of at least one wall of the housing in thermal contact with the heat dissipation elements linked to the storage assemblies: This allows for better cooling of the storage assemblies; the fins are placed on the outer face of at least one other wall of the enclosure in thermal contact with the electronic management board: This allows the electronic board to cool better; the housing can be made of aluminium,or of carbon composite material: This allows for improved thermal conduction between the inside and outside of the housing compared to plastic or steel housing with equivalent mechanical characteristics;the wall in contact with the heat dissipation elements is the lower and/or upper wall of the housing and the other wall in contact with the electronic management board is a side wall of the housing:this allows, for example in the case of cylindrical or parallel-epipedal storage assemblies arranged parallel to each other and parallel to the side walls of the housing, to improve the cooling of the storage elements, since axial cooling of the storage assemblies is more efficient than radial cooling by means of heat dissipation elements;or combined with, a stand in which a cooling device is installed: This improves the cooling of the storage assemblies; the cooling device may include a circulation circuit of a coolant: This allows for increased thermal exchange between the inside and outside of the module. The electronic management board consists of a layer of epoxy resin to which a copper printed circuit board is glued, the layer of epoxy resin being in contact with the inner face of the other wall of the housing: the epoxy resin layer allows thermal contact while providing electrical insulation of the copper printed circuit board with the housing; the electronic control panel includes an aluminium plate on the epoxy resin layer,the aluminium plate being in contact with the inner face of the other wall of the housing: The aluminium plate allows the heat produced by the copper printed circuit to be discharged towards the wall of the housing; two walls are in thermal contact while being electrically insulated with the heat dissipation elements connected to the energy storage assemblies: This allows the heat exchange area between the enclosure and the storage units to be increased and thus the cooling of the storage units to be improved;the two walls in thermal contact with the heat dissipation elements connected to the energy storage units are the upper and lower walls of the enclosure;the module includes at least one electronic management board,the electronic control panel shall be in contact with at least one side wall of the housing; the module shall comprise as many electronic control panels as the housing has side walls, each of these panels being in contact with a respective side wall of the housing: This allows the cooling of the electronic boards to be improved, the volume of the module to be optimized and the temperature to be homogenized within the module, the electronic boards thus acting as a heat buffer, avoiding the temperature difference between the core of the module and the peripheral elements, as compared to the state-of-the-art modules,where the temperature difference between the central and peripheral elements was accentuated by cards placed in the centre, above or below the module; this arrangement has a major impact on the overall lifetime of the module, which is itself strongly related to the temperature imbalances which the different components of the module may experience; advantageously, the connection cards can be in contact with the inner side of the side wall of the enclosure or with the outer side wall of the enclosure.The means of connection between two adjacent storage sets include two covers electrically connected by a bar,each lid comprising a connecting terminal intended to be in contact with a barrel-through winding; the means of connecting two adjacent storage assemblies comprising two electrically connected lids with a barrel, each lid being capable of being laser-welded, brazed or welded by diffusion to the barrel; the barrel-through winding has a high surface roughness to facilitate electrical contact with the connecting terminal; the contact surface between the barrel and a barrel is preferably at least one quarter of the cover surface and even more preferably at least half the cover surface; the barrel-through winding may also be of copper; This reduces the ohmic resistance of the connection means and thus minimises Joule losses and hence the heat produced by the connection means. This improves thermal conductivity between the storage units and the housing and reduces the mass of the connecting elements; copper (or aluminium) bars may have a surface protection gasket; two adjacent storage units are electrically connected by a longitudinal piece with the ends of the lids,above or below each of the adjacent storage units respectively in such a way as to electrically connect the adjacent storage units; This maximises the contact area between the energy storage elements and the walls of the enclosure to promote thermal diffusion to the enclosure, while the use of single-piece connecting devices reduces the internal resistance of the connecting devices (and thus the Joule heat production). Each end of the longitudinal part includes preferential zones of safety. Connecting devices between two adjacent storage assemblies may include two covers electrically connected by a transparent laser bar welding.The welding of the bar may be carried out through preferential thin areas;the means of connection between two adjacent storage assemblies may comprise two covers electrically connected by a brazed bar on the covers;the means of connection between two adjacent storage assemblies include two covers electrically connected by a bar by diffusion brazing of the bar on the covers;the contact area between the bar and a cover is preferably greater than or equal to one quarter of the surface of the cover, and even more preferably greater than or equal to half of the surface of the cover;the two adjacent storage assemblies may be electrically connected by a longitudinal piece whose ends are covered by the formitmitmitte,The thinner preferential zones may be perpendicular two to two and have an angle of 45° to the longitudinal axis B-B of the part; the thinner preferential zones may be perpendicular two to two, at least one area at each end extending the longitudinal axis B-B of the part; the means of connection may include, depending on the respective heat dissipation elements; the heat dissipation elements may include a layer of elastomer: The elastomer layer allows electrical insulation and thermal connection of the storage assemblies to the housing.

The following is a brief introduction to the figures.

Other features, purposes and advantages of the present invention are further described in the following description, which is purely illustrative and not limitative and should be read in conjunction with the attached drawings on which: Figure 1 illustrates one method of making a module of the previous state of the art,Figure 2 illustrates another method of making a module of the previous state of the art,Figures 3a to 3d illustrate a method of making a module of the invention,Figure 4 illustrates another method of making the module,Figure 5 illustrates fins of a method of making the module,Figures 6 to 9 illustrate examples of ways of connecting energy storage elements to each other inside the module,Figures 10 and 11 illustrate examples of an electronic module management card.

The invention is described in detail in the following table:

The different modes of implementation of the module according to the invention are described in Figures 3 to 11 and in these different figures the equivalent elements of the module have the same numerical references.

In reference to Figure 3a, a model of the module intended to be connected by voltage terminals 50 to an attachment (not shown) is shown.

The module comprises a housing 10 in which the electrical energy storage assemblies 20 are arranged and connected by means of connecting devices 30.

The module also includes an electronic management card 40 for energy management and energy storage assembly diagnostics 20.

Storage sets 20 are generally cylindrical in shape. Storage sets 20 are arranged side by side in the housing 10. In other words, the axes of revolution of storage sets 20 are parallel. In other variants not represented here, storage elements may be of parallel-epipedal, square, oval, hexagonal shape, without changing the general principles of the invention.

In the pattern shown in Figures 3a to 3d, the storage assemblies 20 are arranged so that their axes of revolution are perpendicular to the upper walls 12 and lower walls 13 of the housing 10.

The advantage is that different walls 12, 13, 14 of housing 10 are in thermal contact while being electrically insulated respectively: for at least one wall with heat dissipation elements connected to the electrical energy storage assemblies,for at least one other wall with the electronic management board.

This allows the module to cool down.

The thermal connection of the storage assemblies 20 to a first wall 12, 13 and the electronic management board 40 to a second wall 14 different from the first wall 12, 13 allows the maximum thermal dissipation of the heat emitted by the board 40 and the storage assemblies 20 to the outside of the module.

Heat dissipation elements may include connection means 30.

The dissipation elements 38 may also include an elastomer layer between the connecting means 30 and the wall of the enclosure in thermal contact with the storage assemblies 20.

The elastomer layer performs several functions simultaneously.

It allows: electrical insulation of the storage assemblies 20 from the housing 10 by means of a cutoff voltage of more than 1 kV,absorption of geometric dispersions of the storage assemblies 20 due to manufacturing tolerances,by means of its compression capacity,improvement of heat exchange between the storage assemblies 20 and the outside of the module.

In an advantageous embodiment, the wall in contact with the heat dissipation elements is the lower wall 13 of box 10, and the wall in contact with the electronic control panel 40 is a side wall 14 of box 10.

Storage sets 20 preferentially conduct heat along their axis of revolution (longitudinal axis), so that axial cooling of storage sets 20 is more efficient than radial cooling of storage sets 20.

Depending on the design, the storage assemblies 20 are thermal connected either to the upper wall 12 or to the lower wall 13 or to the upper and lower walls 12 and 13 of the housing 10.

In the method shown in Figure 4, the storage assemblies 20 are connected thermally to the upper and lower walls 12, 13.

Thermal contact of two-walled storage assemblies improves cooling of storage assemblies by increasing the heat exchange area between storage assemblies 20 and the outside of the module.

The box

The 10 enclosure allows the module to be handled, strengthens the electrical insulation and protects the module core and its electronics from potential external aggression.

This can be parallel-shaped, to be placed in the place currently used by a car battery, or cylindrical, for example to be housed in the space released by a spare wheel, or prismatic, defining in all cases the upper and lower faces, and side faces.

In one embodiment, the upper 12, lower 13 and side 14 walls of housing 10 are made of anodised aluminium to promote cooling of the module on the one hand, via better radiative dissipation, and to enhance the corrosion resistance of the module on the other.

Thus, the use of walls 12, 13, 14 of aluminium or carbonated composite material improves the thermal conductivity between the inside and outside of the housing compared to walls of plastic or steel material with identical mechanical characteristics.

In some embodiments of the invention, the box 10 includes fins 15 as shown in Figures 4 and 5.

These fins increase the contact surface between the housing 10 and the external environment to facilitate heat exchange with the outside, thus improving the cooling of the module.

The 15' stiffeners on the side walls are also fins within the meaning of this patent since they increase the surface area of the walls for convective exchange.

For example, in one embodiment, fins 15 are arranged on the outer side of the wall of the enclosure in thermal contact with storage sets 20 in order to improve cooling of these storage sets 20.

In the pattern shown in Figure 4, the 15 fins are arranged in a central region 11 of the outer face of the upper wall 12 of box 10.

This facilitates the heat transfer from sets 20 in the centre of box 10 (i.e. sets 20 furthest from the side walls 14) and for which heat transfer is more difficult than for sets 20 on the periphery of box 10 (i.e. sets 20 nearest to the side walls 14).

In another embodiment, the fins 15 are arranged on the outer side of the wall of the housing 10 in thermal contact with the electronic control panel 40 in order to improve the cooling of the electronic control panel 40.

The advantage in another embodiment is that the outer faces of the walls 12, 13, 14 in thermal contact with the storage assemblies 20 on the one hand and the electronic board (s) 40 on the other hand comprise fins 15.

In the case where several walls of the housing are in thermal contact with the storage assemblies and/or the electronic management board (s), all or only some of these walls in thermal contact may have fins on their outer face.

To further improve the heat dissipation of the storage assemblies 20, in a variant embodiment of the invention, the thermal wall in contact with the storage assemblies 20 includes or is associated with a base (not shown) in which a cooling device is placed (not shown).

The cooling device may include a circulation circuit of a coolant.

In the case of several walls of the enclosure in thermal contact with the storage assemblies, the module may include a cooling device in one or all walls in thermal contact with the assemblies 20.

This allows the cooling of the module to be improved by an external cooling system, for example, a vehicle using the module, such as a vehicle air conditioning circuit.

Electrical energy storage assembly

In the model shown in Figures 3a to 3d, the module comprises 20 electrical energy storage units.

The storage assemblies 20 are arranged in box 10 parallel to each other and parallel to the side walls of the box, i.e. the axes of revolution of the storage assemblies 20 are parallel to each other and parallel to each plane in which a respective side wall extends.

In the pattern shown in Figures 3a to 3d, the storage assemblies 20 are arranged so that their axes of revolution are perpendicular to the upper walls 12 and lower walls 13 of the housing 10.

Storage sets 20 are connected two by two by means of connections 30 which will be described in detail later in the description.

It should be noted that in the model shown in Figures 3a to 3d, the 20 electrical energy storage units 20 are connected in series.

These storage sets 20 are connected alternately by two at their upper and lower lids 32'. In other words, when referring to a storage set, it is connected by its upper lid to an adjacent first storage set, and by its lower lid to a second adjacent storage set different from the first storage set.

Of course, other configurations than the serial configuration can be adopted depending on the application. e.g. in a module with twenty storage sets 20, a pair of ten storage sets 20 can be connected in series, and then connected in parallel, etc.

Storage units shall be electrically isolated from walls 12, 13, 14 of box 10.

Electronic management card

In the embodiment shown in Figures 3a to 3d, the device also includes four electronic control boards 40.

The electronic management board 40 allows the charge and discharge management and diagnosis of energy storage assemblies 20.

In particular, the electronic card can satisfy two distinct needs: The module shall be equipped with a power supply for the purpose of balancing the end-load voltages of the module's storage assemblies 20.

The storage elements 20 have characteristics (capacity, strengths) which are dispersed due to manufacture, and/or ageing, etc.

These differences mean that when the module is charged, not all storage sets 20 have the same load voltage.

The balancing process therefore involves the homogenization of these voltages around a single voltage value defined according to the application.

The electronic management board shall be connected in parallel to the associated storage assemblies in series.

The electronic control panel 40 shall be electrically isolated from the walls of housing 10.

An electronic control panel 40 comprises a layer of epoxy resin 42 to which a copper printed circuit board 41 is glued.

The epoxy resin 42 layer allows thermal contact while providing electrical insulation of the copper printed circuit 41 with the box 10.

The electronic control panel 40 is arranged so that the epoxy resin layer 42 comes into contact with the inner face of wall 14 of housing 10.

It will be understood hereafter that when an element A is mentioned as being on an element B, it may be directly on element B, or may be located above element B and separated from element B by one or more other intermediate elements.

It will also be understood that when an element A is mentioned as being on an element B, it may cover the entire surface of element B, or a portion of element B.

In an embodiment shown in Figure 10, the electronic control panel 40 comprises an aluminium plate 43 on the epoxy resin layer 42 (so that the epoxy resin layer is located between the copper printed circuit board and the aluminium layer).

In this case, the aluminium plate is brought into contact with the inner face of wall 14 of box 10.

The presence of an aluminium 43 layer on the control panel 40 facilitates the discharge of heat from the copper printed circuit board 41 to the wall 14 of the housing 10 in contact with the control panel 40.

In the embodiment shown in Figures 3a to 3d, the module comprises four electronic control boards 40 thermal connected to the inner surfaces of the four side walls 14 of housing 10.

Of course, the electronic boards 40 can be arranged outside the housing and thus thermal connected to the external surfaces of the side walls of the housing.

The presence of four electronic boards on the four side walls of the module prevents the storage assemblies at the periphery of the housing from cooling more rapidly than the storage assemblies 20 at the centre of the housing.

The presence of these heat buffers on the side walls causes the storage sets 20 located near the side walls 14 to cool less rapidly so that all the storage sets 20 in the module will cool at the same rate.

As heat is the main cause of ageing of storage assemblies 20, the homogenization of temperature inside the module induces homogenization of ageing of storage assemblies 20 of the module.

Of course, the number of electronic boards will be optimized according to the thermal result to be obtained, without the number of boards necessarily having to be the same as the number of sidewalls of the housing, especially when the housing has a circular or complex shape related to the particular environment in which the module is operated.

Means of connection

In one embodiment shown in Figure 6, the means of connection 30 between two adjacent storage sets 20 comprise two 32' or 32' covers electrically connected by a bar 31.

Each 32, 32' cover is intended to cover a storage set 20.

Each 32' lid includes a connecting terminal 33 intended to be in contact with a through-hole (not represented) of the bar 31. To improve electrical conduction between the terminal 33 and the bar 31, the surface condition of the through-hole may be made rough to increase the contact surface.

In one embodiment, the rods 31 are copper, which reduces the ohmic resistance of the connecting means 30 and thus minimises Joule losses, thus reducing the heat production by the connecting means 30 inside the module.

In another embodiment, the 31 bars are made of aluminium, which improves the mass of the connecting means while maintaining an ohmic resistance between the storage assemblies and a satisfactory thermal conductivity between the storage assemblies 20 and the housing 10.

In one variant, the 31 bars may be coated with a nickel-plated or stamped surface treatment to protect them from corrosion and also to improve electrical contact.

For each storage device 20, the top lid 32 of the 20 shall be electrically connected to the top lid 32 of an adjacent device, while the bottom lid 32' of the same device shall be electrically connected to the bottom lid 32' of another adjacent device so that each storage device 20 can be connected to two adjacent storage devices 20, one at its top lid 32 and the other at its bottom lid 32'.

In the embodiment of Figure 7a, the energy storage assemblies have flat covers without a connection terminal. They are then welded or brazed in pairs with their neighbours by means of welded or brazed bars in the same arrangement as described in the previous paragraph.

The contact area between bar 31 and a lid 32 is preferably one quarter or more of the lid 32 surface, and even more preferably one half or more of the lid 32 surface or even the entire lid surface.

This configuration of the storage assemblies maximises the contact surface between bar 31 and lid 32, 32' and thus promotes thermal exchange between lid 32, 32' and the housing through bar 31.

In another embodiment illustrated in Figures 7, 8 and 9, the connecting means 30 comprise a longitudinal piece 34 , called a bi-cap, whose ends 35, 36 form the upper 32 or lower 32' caps of two adjacent storage sets 20 to connect them electrically.

The use of the longitudinal section 34 to electrically connect two adjacent storage assemblies increases the electrical and thermal performance of the modules.

In terms of electrical performance, the use of single-chamber connectors reduces the internal resistance of the connectors (and hence the Joule heat output) and in terms of thermal performance, the use of single-chamber connectors capable of forming the upper (or lower) covers of two storage sets increases the contact surface between the storage sets 20 and the walls of the module, which promotes thermal diffusion towards the housing 10.

In the case of bi-covers welded laser-transparently, each end 35, 36 of the bi-covering 34 includes preferential areas 37 thinned to form welding areas.

In the modes of implementation shown in Figures 8 and 9, the thinned preferential zones 37 are radial and perpendicular two to two.

In the pattern shown in Figure 8, a thinner preferential zone 37 of each end 35, 36 extends along the longitudinal axis B-B of the longitudinal part 34.

This reduces the internal resistance of the longitudinal part 34 (and hence the Joule heat production of the connection means 30). However, in this case, the current flows mainly through the rectilinear thin areas extending along the longitudinal axis B-B of the longitudinal part 34. This may cause local heating of the longitudinal part 34 at the rectilinear thin areas extending along the longitudinal axis B-B of the longitudinal part 34.

In the pattern shown in Figure 9, the radial rectilinear thinned areas 37 are perpendicular to each other and have an angle of 45° to the longitudinal axis of the workpiece, thus avoiding the risks of deterioration due to local heating mentioned above.

Other options

The reader will have understood that many changes can be made to the module described above.

For example, the number of storage sets in the module may be greater or less than 20. For example, the module may have two electrical energy storage sets, or more than two storage sets.

For example, energy storage elements can be connected by means of a combination of the above: Bottom double lids, and top-end lids (Figure 7),Bottom double lids, and top-end welded or brazed flat lids (Figure 7a),Bottom and top double lids (Figure 7b),Top and bottom welded barrel (Figure 7c),Top-end lids and bottom welded barrel (Figure 7d),Top and bottom-end lids (Figure 6), This is dependent on the constraints of assembly and the manufacturing needs.

Similarly, the number of electronic management cards may be greater or less than 4. For example, the module may contain a single management card.

In this case, the two storage units are connected thermally to a first wall and the control panel is connected to a second wall - different from the first wall - in order to increase the heat exchange with the outside, and thus to facilitate the escape of heat produced by the storage units, the connection means and the control panel.

In addition, in the various modes of implementation described above, the following have been presented: the storage assemblies as being thermally connected to either the lower wall of the housing, the upper wall of the housing, the upper and lower walls of the housing, and the electronic control panel as being connected to one, two, three or four of the side walls of the housing.

Similarly, the geometric arrangement of the storage elements is described above as a square grid, but can also be of any shape, such as triangular, parallelogram, hexagonal, octagonal, etc.

The reader will have understood that the thermal bonds of the storage assemblies and the electronic management cards can be reversed, i.e.: the storage assemblies may be connected to one or more side walls of the enclosure, e.g. if the energy storage elements are arranged flat so as to respect the axial heat dissipation of the outer walls of the enclosure. The electronic management boards may be connected to the upper wall, or to the lower wall, or to the upper and lower walls.

To simplify the description, we have described modules that extend vertically overall.

Also in this description, the storage assemblies and their orientation has been defined in relation to storage assemblies comprising a circular section.

Finally, the above descriptions have been proposed in connection with a module construction with a single layer of elements, but it is clear that they can also be applied to modules with several layers of elements, the heat exchanges with the housing being applied to the outer layers of the assembly.

Claims (29)

1. Module comprising a casing (10) in which at least two electric energy storage assemblies (20) are arranged and connected by connection means (30), and at least one electronic board (40) for energy management and diagnosis of the energy storage assemblies (20), characterized in that different walls (12, 13, 14) of the casing (10), are in thermal contact with, whilst being electrically insulated from, respectively:

   - regarding at least one wall (12, 13), with heat dissipation elements connected to the electric energy storage assemblies (20),

   - regarding at least one other wall (14), with the electronic management bard (40)

   so as to promote cooling of said module.
2. Module according to claim 1, characterized in that the casing (10) comprises fins (15, 15') on at least one outer face of the casing (10).
3. Module according to claim 2, characterized in that the fins (15) are arranged on the outer face of the wall (12, 13) of the casing (10) in thermal contact with the heat dissipation elements connected to the storage assemblies (20).
4. Module according to either of claims 2 or 3, characterized in that the fins (15') are arranged on the outer face of the other wall (14) of the casing (10) in thermal contact with the electronic management board (40).
5. Module according to any of claims 1 to 4, characterized in that the casing (10) is in aluminium.
6. Module according to any of claims 1 to 4, characterized in that the casing (10) is in carbon composite material.
7. Module according to any of claims 1 to 6, characterized in that the wall (12, 13) in contact with the heat dissipation elements is the lower wall (13) of the casing (10) and the other wall (14) in contact with the electronic management board (40) is a side wall of the casing (10).
8. Module according to any of claims 1 to 7, characterized in that the wall (13) in thermal contact with the heat dissipation elements comprises or is associated with a base in which a cooling device is arranged.
9. Module according to claim 8, characterized in that the cooling device comprises a circulation circuit for a cooling liquid.
10. Module according to any of claims 1 to 9, characterized in that the electronic management board (40) comprises a layer of epoxy resin (42) on which a copper printed circuit (41) is bonded.
11. Module according to claim 10, characterized in that the epoxy resin layer (42) is in contact with the inner face of the other wall (14) of the casing (10).
12. Module according to claim 10, characterized in that the electronic management board (40) comprises an aluminium plate (43) on the epoxy resin layer (42), the aluminium plate (43) being in contact with the inner face of the other wall (14) of the casing (10).
13. Module according to any of claims 1 to 12, characterized in that the two walls (12, 13) are in thermal contact with, whilst being electrically insulated from, the heat dissipation elements connected to the energy storage assemblies (20).
14. Module according to claim 13, characterized in that the two walls (12, 13) in thermal contact with the heat dissipation elements connected to the energy storage assemblies (20) are the upper (12) and lower (13) walls of the casing (10).
15. Module according to any of claims 1 to 14, characterized in that it comprises at least one electronic management board (40), said electronic management board (40) being in contact with at least one side wall (14) of the casing (10).
16. Module according to claim 15, characterized in that it comprises as many electronic management boards as the casing has side walls, each of said boards being in contact with a respective side wall (14) of the casing (10).
17. Module according to either of claims 15 or 16, characterized in that the management boards are in contact with the inner face of the side wall of the casing.
18. Module according to either of claims 15 or 16, characterized in that the management boards are in contact with the outer face of the side wall of the casing.
19. Module according to any of claims 1 to 18, characterized in that the connection means (30) between two adjacent storage assemblies (20) comprise two covers (32) electrically connected by a terminal strip (31), each cover (32) comprising a connection terminal (33) intended to be in contact with a through borehole of the terminal strip (31).
20. Module according to claim 18, characterized in that the terminal strips (31) in aluminium comprise tin-plating or nickel-plating as surface protection.
21. Module according to any of claims 1 to 18, characterized in that the connection means (30) between two adjacent storage assemblies (20) comprise two covers (32) electrically connected by a terminal strip (31') brazed onto the covers (32).
22. Module according to any of claims 19 to 21, characterized in that the contact surface between the terminal strip (31) and a cover (32) is equal to or more than one quarter of the surface of the cover (32).
23. Module according to claim 17, characterized in that the contact surface between the terminal strip (31) and a cover (32) is equal to or more than one half of the surface of the cover (32).
24. Module according to any of claims 1 to 19, characterized in that two adjacent storage assemblies (20) are electrically connected by a longitudinal part (34) whose ends (35, 36) form the respective upper (32) or lower (32') covers of each of the adjacent storage assemblies (20), so as electrically to connect said adjacent storage assemblies (20).
25. Module according to claim 24, characterized in that each end (35, 36) of the longitudinal part (34) comprises preferential radial thinned regions (37).
26. Module according to either of claims 24 or 25, characterized in that the preferential thinned regions (37) are perpendicular two by two and have an angle of 45° with the longitudinal axis (B-B) of part (34) .
27. Module according to either of claims 24 or 25, characterized in that the preferential thinned regions (37) are perpendicular two by two, at least one region (37) of each end (35, 36) extending along the longitudinal axis (B-B) of part (34).
28. Module according to any of claims 1 to 19, characterized in that the connection means (30) comprise the heat dissipation elements (38).
29. Module according to claim 28, characterized in that the heat dissipation elements (38) between the elements and the wall of the module comprise a layer of elastomer.