HK1131363B - Method and apparatus for filling liquid material - Google Patents

Description

Method and apparatus for filling liquid material

Technical Field

The present invention relates to a method, an apparatus, and a program for filling a gap between a substrate and a work placed thereon with a liquid material discharged from a discharge portion by utilizing a capillary phenomenon, and more particularly, to a method and an apparatus for correcting a discharge amount of a liquid material without calculating complicated parameters in an underfill (underfill) filling step of a semiconductor package.

The term "discharge" as used herein includes a discharge mode in which the liquid material contacts the workpiece before leaving the discharge portion, and a discharge mode in which the liquid material contacts the workpiece after leaving the discharge portion.

Background

In recent years, along with the miniaturization and high performance of electronic devices, a mounting technique called a flip-chip method has been attracting attention in response to the demand for high-density mounting and multi-pin mounting of semiconductor components. The flip-chip mounting is performed by forming a bump electrode (bump) on an electrode pad present on the surface of the semiconductor chip and directly bonding the bump electrode to an electrode pad on the opposite substrate. When the flip-chip method is used, the area required for mounting is approximately equal to the area of the semiconductor chip, and high-density mounting can be achieved. In addition, the electrode pad can be arranged on the whole surface of the semiconductor chip, so that the semiconductor chip is suitable for multi-pin connection. In other words, the connection wiring length is only the height of the bump electrode, the electrical characteristics are good, and the connection portion of the semiconductor chip is exposed on the opposite side, so that heat dissipation is easy.

In flip-chip packaging, stress generated due to a difference in thermal expansion coefficient between a semiconductor chip and a substrate concentrates on a connecting portion to break the connecting portion, and in order to prevent this, a resin is filled in a gap between the semiconductor chip and the substrate to reinforce the connecting portion. This step is called "underfill filling" (refer to fig. 1).

The underfill filling step is performed by applying a liquid resin along the outer periphery (for example, one side or both sides) of the semiconductor chip, filling the resin in the gap between the semiconductor chip and the substrate by capillary action, and then curing the resin by heating in an oven or the like.

In the underfill filling step, the viscosity change of the resin material with the passage of time must be taken into consideration. When the viscosity is high, the discharge amount of the material discharge port is reduced, and the capillary phenomenon is insufficient, so that there is a problem that an appropriate amount of the material cannot be filled in the gap. When the viscosity changes drastically, the discharge amount may decrease by 10% or more after 6 hours, for example. Therefore, it is necessary to correct a change in the discharge amount due to a change in viscosity with the passage of time.

However, in the underfill filling step, a dispenser (dispenser) is generally used to fill the resin material. Some of these dispensing apparatuses are of a jet type which ejects droplets of a liquid material from a nozzle at the time of discharge.

A method of performing the underfill filling step using a jet-type dispenser is disclosed, for example, in japanese patent application laid-open No. 2004-344883 (patent document 1). That is, patent document 1 discloses a method for discharging a viscous material on a substrate using a jet-type dispenser, the method including: preparing the total volume of the viscous material to be discharged and the discharge length of the viscous material of the total volume; coating a plurality of drops of viscous material on a weight; generating a feedback signal indicative of the weight of the plurality of droplets of viscous material applied to the scale; and calculating the maximum relative speed between the glue injector and the substrate in order to discharge the total volume of the viscous material in the whole length range.

Further, patent document 1 discloses a method further including: calculating the respective volumes of the drops of the multi-drop viscous material; obtaining the total number of droplets necessary to approximately equal the total volume; obtaining the distance required between the droplets when the droplets of the viscous material are distributed approximately uniformly along the length; and determining a maximum relative velocity between the dispenser and the substrate to substantially uniformly discharge the entirety of the droplets of viscous material along the length.

Patent document 1: japanese patent laid-open publication No. 2004-344883

Disclosure of Invention

(problems to be solved by the invention)

However, in the method described in patent document 1, in order to uniformly discharge the droplets along the entire length, a process for determining the number of droplets and the interval between the droplets is required, and since various parameters are calculated in this process, errors often occur in the calculation.

In addition, in order to achieve more accurate homogenization, it is necessary to make the sizes of the droplets uniform, and therefore, a special means is required.

Further, the maximum relative velocity between the nozzle (discharge portion) and the substrate tends to change in a direction in which the velocity becomes lower when the viscosity becomes higher. When the speed is lowered, the coating time becomes long, and there is a problem that the production is affected.

Accordingly, an object of the present invention is to solve the above-described problems, and to provide a method, an apparatus, and a program for filling a liquid material, which do not require complicated calculation parameters and do not affect the moving speed of a discharge portion.

(means for solving the problems)

It is considered that the correction in the state where the application speed is kept constant can keep the discharge amount from the discharge portion per unit time constant by controlling the pressurization amount, the movement amount of the plunger, the speed of the reciprocating operation of the valve, and the like. However, in the above-described method, since various parameters are calculated, there is a problem that many errors are generated in the calculation. Therefore, the inventors of the present invention have completed the present invention after a detailed study to simplify the calibration process.

That is, the 1 st aspect of the present invention is a method for filling a liquid material discharged from a discharge portion by utilizing a capillary phenomenon in a gap between a substrate and a work placed thereon; the method is characterized in that a coating pattern consisting of a coating area and a non-coating area is formed along the outer periphery of the workpiece, and the discharge amount of the liquid material is corrected by stretching and contracting the coating area and the non-coating area.

The invention of claim 2 is characterized in that, in the invention of claim 1, the coated region and the non-coated region are expanded and contracted without changing the entire length of the coating pattern.

The invention of claim 3 is characterized in that, in the invention of claim 1 or 2, the coating pattern includes a coating region and a non-coating region which are alternately continuous.

The invention of claim 4 is characterized in that, in any one of the inventions 1, 2, or 3, the overall length of the coating pattern is substantially the same as one side of the square workpiece, and the coating pattern is composed of one or more coating regions and a plurality of non-coating regions adjacent to the coating regions.

The invention of claim 5 is characterized in that, in any one of the inventions 1, 2 or 3, the coating pattern is composed of a coating region having substantially the same length as one side of the square workpiece and one or two non-coating regions adjacent to the coating region and set along the side adjacent to one side of the workpiece.

The 6 th invention is characterized in that, in any one of the 1 st, 2 nd, or 3 rd inventions, the coating pattern is composed of a coating region having substantially the same length as one side of the square workpiece and one or two non-coating regions disposed adjacent to and in parallel with the coating region.

The 7 th invention is characterized in that, in any one of the inventions 1 to 6, the moving speed (V) of the discharge portion is not changed before and after the correction of the discharge amount.

The 8 th invention is characterized in that, in any one of the 1 st to 7 th inventions, the discharge time (T) before correction is measured₁) Weight (W) of liquid material discharged from the discharge port₁) From the discharge time (T)₁) And weight (W)₁) Calculating a weight (W) for discharging an appropriate weight₂) Time (T)₂) From time (T)₂) And the moving speed (V) of the discharge part, and calculates the proper total length (L) of the coating region₂) The appropriate full length of the area to be coated (L)₂) And the total length (L) of the coating region before correction₁) The difference in (b) is the amount of expansion and contraction of the entire length of each of the coated region and the non-coated region.

The feature of the invention 9 resides in that, in any one of the inventions 1 to 7, it is measured that the discharged liquid material has reached an appropriate weight (W)₂) Time to (T)₂) From time (T)₂) And the moving speed (V) of the discharge part, and calculates the proper total length (L) of the coating region₂) The appropriate full length of the area to be coated (L)₂) And the total length (L) of the coating region before correction₁) The difference in (b) is the amount of expansion and contraction of the entire length of each of the coated region and the non-coated region.

The 10 th invention is characterized in that, in the 8 th or 9 th invention, the relationship between the discharge time or the discharge weight and the viscosity is stored in a memory, and in the step after the liquid material is replaced, the amount of expansion and contraction of the entire length of each of the application region and the non-application region is calculated based on the stored information in the memory.

The 11 th invention is characterized in that, in any one of the 8 th, 9 th or 10 th inventions, an allowable range for determining whether or not to perform correction is set, and when the measured value exceeds the allowable range, the amount of expansion and contraction of the entire length of each of the coated region and the non-coated region is corrected.

The 12 th invention is characterized in that, in any one of the 1 st to 11 th inventions, the discharge amount is corrected in accordance with a change in viscosity of the liquid material with time.

The 13 th invention is characterized in that, in any one of the inventions 1 to 12, the discharge amount of the liquid material is corrected based on the time information input by the user as the correction cycle, the number of pieces of the work, or the number of pieces of the substrate.

The 14 th aspect of the present invention is a coating apparatus including: a liquid material supply unit for supplying the discharged liquid material; a measuring section for measuring the discharged liquid material; a discharge section having a discharge port for discharging the liquid material; a driving part for making the discharge part move freely; and a control unit for controlling the operations of these units; the coating apparatus is characterized in that the control section has a program for executing the method of any one of claims 1 to 13.

The 15 th aspect of the present invention is a program including: in an application device comprising a liquid material supply section for supplying a liquid material to be discharged, a metering section for measuring the liquid material to be discharged, a discharge section having a discharge port for discharging the liquid material, a drive section for moving the discharge section freely, and a control section for controlling the operations of these sections, the control section is caused to carry out the method according to any one of claims 1 to 13.

(effect of the invention)

According to the present invention, since the discharge amount is corrected by the extension and contraction of the lengths of the application area and the non-application area, the application pattern can be freely formed without being restricted by the uniform application over the entire length of the application pattern.

In addition, compared with the case of correcting the liquid drops one by one, the process is simpler and more convenient, and errors caused by calculation are not easy to generate.

Further, since the moving speed of the discharge portion is not changed, the application time is not affected.

Drawings

Fig. 1 is a side view for explaining a primer filling step.

Fig. 2 is a schematic perspective view of the apparatus according to embodiment 1.

Fig. 3 is an explanatory view showing an example of the first coating pattern.

Fig. 4 is an explanatory view showing an example of the second coating pattern.

Fig. 5 is an explanatory view showing an example of the third coating pattern.

Fig. 6 is an explanatory view showing an example of the fourth application pattern.

Fig. 7 is a diagram for explaining a method of correcting the coating pattern.

Fig. 8 is a diagram for explaining correction based on weight change.

Fig. 9 is a diagram for explaining correction based on a temporal change.

Description of the symbols

1 substrate

2 chip

3 electrode pad

4 convex block (convex electrode)

5 liquid Material

6 glue injector

7XY driving means

8 weight meter

9 conveying means

10 flip chip mounting substrate

11 coating area

12 non-coated area

13 nozzle

Detailed Description

The best mode for carrying out the present invention will be described below.

(1) Making into a coating pattern

One or more coating patterns are formed, and one of the coating patterns is selected. For example, as shown in fig. 3, a coating pattern is formed along a line on one side of a chip 2, which is a square workpiece, and includes alternately continuous coating regions 11 and non-coating regions 12. However, the workpiece is not limited to a square shape, and may be a circular shape or a polygonal shape.

The total length of the coating pattern and the number of the coating regions 11 and the non-coating regions 12 are determined by the weight and volume of the liquid material 5 required to fill the gap between the chip 2 and the substrate 1. For example, as shown in fig. 3, when one side of the chip 2 is coated, a coating pattern may be formed by forming non-coating regions 12 on both sides of a coating region 11.

The application region 11 is not limited to a linear shape, but may be a dot shape, and for example, when the chip 2 is small or the yield is to be improved (when the defect due to the air bubble mixing is to be reduced), the coating may be discharged little by little near the center of the edge or may be discharged for a certain time by stopping the nozzle 13 as a discharge portion.

(2) Setting initial parameters

The relationship between the application pattern and the appropriate weight and/or the appropriate discharge time is calculated by a test in advance for the liquid material used for application, and is stored in the memory of the control unit. The variation in the discharge amount is also affected by the viscosity variation of the liquid material due to the temperature variation, clogging of the discharge portion, and a pressure difference (water difference), but by setting the above parameters, it is possible to apply to all variations in the discharge amount.

Further, it is preferable that a value calculated from the effective time specified by the manufacturer is stored in advance as the limit value of the use time of the liquid material.

When the correction amount is calculated in (4) described later, it is preferable that the "relationship between discharge time and viscosity" when the discharge weight is constant and the "relationship between discharge weight and viscosity" when the discharge time is constant be stored in advance in the memory of the control unit. Since the correction amount can be calculated from the data stored in the control unit in the second and subsequent operations if the liquid materials are the same type, the discharge and measurement operations for correction can be omitted.

(3) Setting a correction period

A correction period, i.e., a period for correcting the coating pattern, is set. As the correction cycle, for example, time information input by the user, the number of chips 2 or substrates 1, and the like can be set. When the predetermined time is set, the expected time from the start of the operation to the time when the discharge amount of the liquid material is changed to exceed the allowable range is set. When the number of pieces is set, the number of pieces to be processed is determined and set from the time of processing one chip 2 or the time of processing one substrate 1 (the time of carrying-in → coating → carrying-out) and the predetermined time.

When setting the calibration cycle, it is necessary to consider a change in viscosity of the liquid material due to a time lapse or a temperature change, and the following description is made on the premise that only a change in viscosity occurs with a time lapse.

It is needless to say that the conventional technique of controlling the viscosity of the liquid material by adjusting the temperature of the discharge portion can be used in the present invention.

(4) Calculating a correction amount

A correction amount corresponding to a change in the discharge amount due to a change in the viscosity of the liquid material is calculated in accordance with the set correction period.

First, the nozzle 13 is moved to above the weight scale 8 to discharge the liquid material at a fixed position. Then, the weight of the liquid material discharged to the measuring portion of the weight scale 8 is read and compared with the parameter stored in (2) to obtain a correction amount.

As a method of calculating the correction amount, (i) a method of measuring the weight at the time of discharge for a certain period of time and calculating the correction amount from the difference between the measured weight and the appropriate weight, and (ii) a method of measuring the discharge time required until the appropriate weight is reached and calculating the correction amount from the difference between the measured weight and the previous discharge time.

The methods (i) and (ii) will be specifically described with reference to an example of the application pattern in fig. 3.

First, an appropriate weight W required for filling the liquid material is calculated from the size of the chip 2 and the gap between the chip 2 and the substrate 1₂. Next, the total length L of the coating region 11 in the coating pattern is calculated from the size of the chip 2₁. Then, the appropriate weight W for discharge is calculated₂The time T required for the liquid material₁。

Time T₁There are various calculation methods, and two representative calculation methods of the injection type glue injector are disclosed herein. First, since the time for ejecting the liquid droplets from the nozzle 13 is constant, the appropriate weight W to be ejected is calculated based on the time and the weight of each droplet₂The method of the required time; alternatively, the actual discharge is carried out until the weight 8 reaches the proper weight W₂The time was measured.

Next, the case where the viscosity of the liquid material becomes high (P) will be described with reference to FIG. 7₁→P₂) And a specific correction amount algorithm. It is assumed that the moving speed V of the nozzle 13 is constant.

(i) In the case of a changed viscosity P₂With time T₁When the mixture was discharged for the same time, the measured value of the weight scale 8 was W₁. Here, from time T₁With weight W₁Calculating the viscosity P after change₂Spitting and proper weight W₂Time T required for the same weight₂. Will be at speed V and only at time T₂The length during the movement is set to an appropriate length L of the coating region 11₂. Therefore, the amount of expansion and contraction L of the application region 11₃Is L₂-L₁。

(ii) If measured as a modified viscosity P₂Spitting and proper weight W₂The time required for the same weight is T, the discharge time is₁Is changed into T₂. At a speed V and only at a time T₂The length during the movement is set to an appropriate length L of the coating region 11₂. Therefore, the amount of expansion and contraction L of the application region 11₃Is L₂-L₁。

Here, the amount of expansion and contraction L is preferably set₃The non-zero time is not corrected frequently, and the correction is performed only when a change in the measured discharge amount (measured value) or the calculated correction amount exceeds an allowable range (e.g., ± 10%). A preferable state of the correction in which the allowable range is set is disclosed in detail in, for example, japanese patent laid-open No. 2001-137756 relating to the applicant's patent application. That is, an allowable range for determining whether or not to correct is set, and the coating pattern is corrected only when the measurement value or the correction amount (time, weight, or amount of expansion and contraction) exceeds the allowable range.

(5) Correcting coating patterns

When it is determined in (4) that the discharge amount needs to be corrected, the length of the coated region 11 is extended or reduced, and the non-coated region 12 is reduced or extended by the same amount as the extended length.

Amount of expansion L₃Preferably equally divided in correspondence with the number of coated areas 11 and non-coated areas 12, respectively. In the case of the coating pattern of fig. 3, the amount of expansion and contraction of the coating region 11 and L₃Similarly, the amount of expansion and contraction of the non-coated region 12 is L₃/2。

As described above, the steps (4) and (5) are performed at the correction period set in (3), or when the type (size or shape) of the substrate 1 is changed, and therefore, an optimum coating pattern can always be formed regardless of the change in the viscosity of the liquid material with time.

The present invention will be described in detail with reference to examples, but the present invention is not limited to these examples.

(examples)

FIG. 2 is a schematic view showing an apparatus for carrying out the method of the present embodiment.

First, the flip chip substrate 10 as an object to be coated is conveyed by the conveying means 9 to a position below the nozzle 13 for discharging the liquid material.

The dispenser 6 having the nozzle 13 is attached to the XY driving means 7 and can move on the substrate 10 or the weight scale 8. The operation of applying the liquid material while moving in the XY direction over the substrate 10 can also be performed by the XY driving means 7.

The substrate 10 is transported under the nozzle 13, and the coating is started after the substrate 10 is positioned. A basic coating pattern as a coating operation locus of the nozzle 13 is stored in advance in a memory or the like in a control unit (not shown) for controlling operations of the XY drive means 7, the dispenser 6, and the like.

After the coating is completed, the substrate 10 is carried out of the apparatus by the carrying means 9. Then, the next substrate 10 is carried in, and the coating operation is repeated. That is, the carrying in, the coating, and the carrying out are a cycle, and the liquid material is repeatedly applied until the coating on the target number of substrates 10 is completed.

At the time of the set calibration cycle, the discharge amount is calibrated in accordance with the viscosity change of the liquid material.

The correction amount is calculated by moving the nozzle 13 onto the weight scale 8 by the XY driving means 7 and measuring the time required for discharge or the weight of the liquid material by the weight scale 8.

A preferable method of calculating the correction amount is exemplified below, but the calculation of the correction amount is not limited thereto. Here, it is assumed that the moving speed V of the nozzle 13 is constant.

(i) Corrected for weight change (fig. 8)

From the nozzle 13, only the time T required for forming the coating pattern with the previous substrate 10₁The liquid material is discharged for the same time (step 11). The weight W of the discharged liquid material was measured by a weight meter 8₁(step 12). Comparing the proper weight W calculated in advance for each coating pattern and stored in the control section₂And measuring the weight W₁(step 13) it is judged whether or not correction is necessary based on whether or not the weight difference exceeds the allowable range (step 14). When it is determined in step 14 that correction is necessary, the correction is performed for a time T₁And W₁Calculating a discharge proper weight W₂Required time T₂(step 15). From time T₂Calculating an appropriate length L which is a sum of lengths of the coating regions 11 in relation to the velocity V₂(step 16). From a suitable length L of the coated area₂The total length L of the coating area 11 and the previous coating area₁Calculating the amount of expansion L₃(L₁And L₂Difference) (step 17). The coating pattern is corrected by extending and contracting the coating region 11 and the non-coating region 12 (step 18). Will T₁The value is updated to T₂，L₁Is updated to L₂(step 19).

Note that, the process may be changed such that step 13 is omitted and step 14 is performed after the amount of expansion and contraction is calculated (after step 17).

(ii) Time-based correction (FIG. 9)

The liquid material is discharged from the nozzle 13 until the appropriate weight W calculated in advance for each application pattern and stored in the control unit₂Until then (step 21), the time T required for discharge is measured₂(step 22). Comparing the time T required for forming the coating pattern on the previous substrate 10₁And a measurement time T₂(step 23), based on the measurement time T₂And whether the allowable range is exceeded, to determine whether correction is necessary (step 24). When it is determined in step 24 that correction is necessary, the correction is performed for a time T₂Calculating the proper overall length L of the coating region 11 in relation to the velocity V₂(step 25). The total length L from the previous coating region 11₁And an appropriate length L of the coating region 11₂Calculating the amount of expansion L₃(L₁And L₂Difference) (step 26).The coating pattern is corrected by extending and contracting the coating region 11 and the non-coating region 12 (step 27). Will T₁Is updated to T₂，L₁Is updated to L₂(step 28).

In the correction of the coating pattern by the above procedure, the total length of the coating pattern obtained by adding the total length of the coating region 11 after the correction to the total length of the non-coating region 12 is the same length before and after the correction.

Here, when the start and/or end position of the application pattern is the non-application region 12, the operation of the XY driving means 7 may be controlled so that the nozzle 13 is operated only on the application region 11. In such a case, only the amount of expansion and contraction L₃Changes the moving time of the nozzle 13.

The correction of the coating pattern is automatically performed at a set correction period. When the liquid material reaches the limit value of the use time or until the liquid material is used up, the correction is performed at the set correction cycle, and the coating operation is continued. In the first coating after the liquid material is replaced, it is preferable to perform correction before the coating is performed in order to correct the unevenness in the quality of the liquid material. In this case, as described above, if the correction amount is calculated from the data stored in the control unit, the discharge and measurement operations for correction are not necessary.

Next, an example of forming a plurality of coating patterns will be described.

When the discharge amount is corrected in accordance with the viscosity change, the viscosity becomes high with the passage of time, and the discharge amount generally needs to be increased, and therefore, the case of increasing the discharge amount will be described below.

The length, the moving speed, and the like of the basic application pattern are determined by the weight of the liquid material required to fill the gap between the semiconductor chip 2 to be applied and the substrate 10, the size of the chip 2, and the like.

Fig. 3 to 6 are explanatory views showing examples of the coating pattern, which are views of the substrate 10 on which the chip 2 is mounted, viewed from the mounting surface side.

In fig. 3, when one side of the chip 2 is coated, two non-coating regions 12 are connected to both ends of a coating region 11 to form a coating pattern. The sum of the length of the coated region 11 and the length of the uncoated region 12 is equal to the length of one side of the chip 2. The amount of expansion and contraction corresponding to the determined correction amount is changed such that both ends or one end of the coated region 11 is extended toward the non-coated region 12, and the non-coated region 12 is contracted by the same amount as the amount of extension of the coated region 11. At this time, the coating pattern is stretched while maintaining the entire length thereof.

Here, in the case of the coating pattern of fig. 3, the nozzle 13 is not necessarily operated on the non-coating region 12. Therefore, the operation of the XY driving means 7 may be controlled so that the nozzle 13 is operated only on the coating region 11.

On the other hand, the operation of the XY driving means 7 may be controlled so that the nozzle 13 draws the entire length of the coating pattern. That is, the length obtained by adding the changed coating region 11 to the non-coating region 12 is set as the movement distance of the nozzle 13. By performing such control, the moving speed of the nozzle 13 does not need to be changed, and can be kept constant, so that the application time does not change between before and after the correction. Any one of fig. 4 to 6 described later can be applied.

In fig. 4, the coating region 11 is divided into three regions with respect to one side of the chip 2, and two non-coating regions 12 are connected therebetween to form a coating pattern. The sum of the length of the coated region 11 and the length of the uncoated region 12 is equal to the length of one side of the chip 2. In the case of this pattern, the coating can be concentrated on a place where a large filling amount is required. When the stretching amount is corrected, the end parts of the two coating areas 11 at the left and right ends close to the center side respectively extend to the center; extending at either or both ends of the central coating zone 11. The non-coated region 12 is contracted by the same amount as the elongation of the coated region 11. The coating pattern was stretched without changing its overall length, as described above.

In fig. 4, the coating regions 11 are drawn substantially equally, but it is needless to say that the coating regions 11 may have different lengths.

The coating pattern of fig. 5 needs to be filled in a larger amount than that of fig. 3 or 4. The non-application region 12 is curved toward both sides adjacent to the discharge side 11. When the amount of expansion and contraction is corrected, both ends or one end of the coated region 11 is extended toward the curved non-coated region 12. The non-coated region 12 is contracted by the same amount as the elongation of the coated region 11. The stretching is performed without changing the overall length of the coating pattern, as previously described. In fig. 3, similarly, the operation of the XY driving means 7 may be controlled so that the nozzle 13 is operated only on the coating region 11.

The coating pattern of fig. 6 is a case where the same filling amount as that of fig. 5 is required, but the coating space is not provided along the left and right sides of the chip 2. Which are patterns in which the non-coated regions 12 are respectively folded back from both ends of the coated region 11. When the amount of expansion and contraction is corrected, both ends or one end of the coated region 11 is extended toward the folded non-coated region 12. The non-coated region 12 is contracted by the same amount as the elongation of the coated region 11. The full length of the coating pattern is not changed to allow for stretching, as previously described. In the same manner as in fig. 3, the operation of the XY driving means 7 may be controlled so that the nozzle 13 is operated only on the application region 11.

In fig. 3 to 6, the case of applying the liquid material to one side of the chip 2 is described, but the present invention can also be applied to the case of applying the liquid material in an L-shape or a U-shape along two adjacent sides, or applying the liquid material along the entire outer periphery of the chip 2.

The dispenser according to the present embodiment is not limited to the jet type, and may be a pneumatic type in which a liquid material is discharged by compressed air. In the case of the pneumatic glue injector, it is preferable that a Z drive means is installed between the nozzle 13 and the XY drive means 7 so that the nozzle 13 can be moved vertically.

(availability in industry)

The present invention can be implemented in various apparatuses that discharge liquid materials.

Examples of the discharge method of the type in which the liquid material contacts the workpiece before leaving the discharge portion include: a pneumatic pressure type in which air under pressure is applied to a liquid material in a pneumatic cylinder having a nozzle at the tip thereof for a predetermined time, a tubular type having a flat tubular mechanism or a rotary tubular mechanism, a plunger type in which a plunger that is closely attached to and slidable on an inner surface of a storage container having a nozzle at the tip thereof is moved by a predetermined amount and discharged, a screw type in which a liquid material is discharged by rotation of a screw, a valve type in which discharge of a liquid material to which a predetermined pressure is applied is controlled by opening and closing a valve, and the like.

Further, as a discharge mode of a type in which the liquid material contacts the work after leaving the discharge portion, there can be exemplified: a jet type in which the valve body is collided with the valve seat to splash and discharge the liquid material from the nozzle tip, a plunger type in which a plunger is abruptly stopped after moving and similarly splashed and discharged from the nozzle tip, a continuous jet type, or a demand type ink jet type.

Claims (11)

1. A method of filling a liquid material discharged from a discharge portion into a gap between a substrate and a work placed thereon by capillary action, wherein a coating pattern comprising a coating region and a non-coating region is formed along the outer periphery of the work, and the coating pattern and an appropriate weight W are set₂And/or initial parameters relating to the appropriate discharge time, and a correction period including time information input by the user or the number of workpieces is set in consideration of the change in viscosity of the liquid material due to the passage of time or the change in temperatureAnd a liquid material filling method for calculating a correction amount corresponding to a discharge amount change caused by a viscosity change of the liquid material at a set correction cycle, and correcting the application pattern when it is determined that the correction of the discharge amount of the liquid material is necessary,

when it is determined that it is necessary to correct the discharge amount of the liquid material, the application pattern is corrected by expanding and contracting the application region and the non-application region without changing the moving speed V of the discharge portion, and

measuring the discharge time T before calibration₁Weight W of liquid material discharged from the inside₁From the discharge time T₁With weight W₁For discharging a proper weight W₂Time T of₂From time T₂Calculating the proper total length L of the coating region with the moving speed V of the discharge part₂To coat the appropriate full length L of the area₂And the total length L of the coating region before correction₁The difference of (A) is the amount of expansion and contraction of the entire length of each of the coating region and the non-coating region, or the amount of expansion and contraction of the discharged liquid material is measured to reach a suitable weight W₂Time to (T)₂From time T₂Calculating the proper total length L of the coating region with the moving speed V of the discharge part₂To coat the appropriate full length L of the area₂And the total length L of the coating region before correction₁The difference in (b) is the amount of expansion and contraction of the entire length of each of the coated region and the non-coated region.

2. The method of filling a liquid material according to claim 1, wherein the coated region and the non-coated region are extended without changing the entire length of the coating pattern.

3. The method for filling a liquid material according to claim 1 or 2, wherein the coating pattern is formed such that coating regions and non-coating regions are alternately continuous.

4. The method of filling a liquid material according to claim 1 or 2, wherein the overall length of the coating pattern is substantially the same as the length of one side of the square workpiece, and the coating pattern is composed of one or more coating regions and a plurality of non-coating regions adjacent to the coating regions.

5. The method for filling a liquid material according to claim 1 or 2, wherein the coating pattern is composed of a coating region having substantially the same length as one side of a square-shaped workpiece, and one or two non-coating regions adjacent to the coating region and set along the side adjacent to the one side of the workpiece.

6. The method for filling a liquid material according to claim 1 or 2, wherein the coating pattern is constituted by a coating region having substantially the same length as one side of the square workpiece and one or two non-coating regions disposed adjacent to and in parallel with the coating region.

7. The method of filling a liquid material according to claim 1 or 2, wherein the moving speed V of the discharge portion is not changed before and after the correction of the discharge amount.

8. The method of filling a liquid material according to claim 1 or 2, wherein the relationship between the discharge time or the discharge weight and the viscosity is stored in a memory, and in the step after the liquid material is replaced, the amount of expansion and contraction of the entire length of each of the application region and the non-application region is calculated based on the stored information in the memory.

9. The method for filling a liquid material according to claim 1 or 2, wherein an allowable range for determining whether or not the correction is performed is set, and when the measured value exceeds the allowable range, the amount of expansion and contraction of the entire length of each of the coated region and the non-coated region is corrected.

10. The method of filling a liquid material according to claim 1 or 2, wherein the correction of the discharge amount is performed in accordance with a change in viscosity of the liquid material with time.

11. The method of filling a liquid material according to claim 1 or 2, wherein the correction of the discharge amount of the liquid material is performed based on time information input by a user as a correction cycle, the number of pieces of work, or the number of pieces of substrate.