HK1122588A - Resin bonded sorbent - Google Patents

Description

Resin bonded sorbent

Technical Field

The present invention relates generally to articles protected with adsorbents, and more particularly to improved injection molding compositions, and articles produced therefrom, containing an adsorbent additive in a resinous matrix.

Background

The addition of adsorbents, such as desiccants, to resin matrices has been described in some literature. The formation of these resins into structural or functional forms by various methods has been described in certain applications. Similarly, fillers have been added to structural molding resins. Low cost mineral or other fillers have been added to resin-containing compositions to extend the resin and reduce cost while maintaining sufficient strength for the intended end use of the molded article. It is also often practiced to add reinforcing materials (e.g., glass fibers or beads) to enhance the mechanical properties of the molded resin, such as hardness, tensile displacement, and the like. By using reinforcing additives, just as with fillers, it has been found that there are ranges within which the desired effects of extending the resin or reinforcing the molded article can be achieved while maintaining satisfactory injection molding and mechanical properties.

However, moulding compositions comprising reinforcing additives are not fully satisfactory for a variety of end-use applications. For example, molding compositions having relatively high loading levels of reinforcing additives (e.g., glass fibers and glass beads) have the effect of limiting the loading factor of sorbent additives that may be incorporated into the molding composition for optimal sorption performance. However, as the loading of the enhancing additive is correspondingly reduced, and the loading of the sorbent additive is increased, the desired mechanical properties, such as hardness, tensile strength, and other mechanical properties may also be reduced.

Thus, existing resin/adsorbent matrices have some drawbacks. These materials are often brittle and do not adequately withstand standard drop tests. In addition, the particulate material may be released from the matrix, thereby degrading the performance of the component and/or the function of the device. Due to the structure of these matrices, water can be adsorbed or absorbed at a faster rate, which may in fact be too fast for typical production methods. In other words, because environmental conditions are not controlled in the production area, the ability of the component to adsorb water may be consumed prior to assembly in the apparatus. The production and use of existing resin/adsorbent matrices is often quite expensive due to the use of exotic resins, additional processing steps, and the use of a variety of resin materials having phase boundaries. In addition, existing resin/adsorbent matrices may suffer from compatibility issues, as the materials are often used as binders.

Accordingly, there is a need for an improved resinous molding composition, and more particularly, for an injection molding composition and articles produced therefrom, wherein such composition and articles produced therefrom maintain a high level of sorbent additive without affecting the desired mechanical properties of the resin.

Disclosure of Invention

It is therefore a principal object of the present invention to provide an improved multifunctional resinous molding composition having a high level of adsorptive properties and enhanced mechanical properties.

The present invention broadly comprises an article comprising a resin bonded sorbent material for at least one fluid, the article being bonded to a second article requiring protection from the at least one fluid, the resin bonded sorbent material comprising a blend of a resin and a sorbent for the at least one fluid, the at least one fluid being detrimental to the second article, wherein all of the resins are the same class of resin. The resin may be a thermoplastic resin and the adsorbent may be selected from: molecular sieves, silica gels, ion exchange resins, activated carbon, activated alumina, clays, particulate metals, salts containing carbon dioxide-releasing anions, and mixtures thereof. Alternatively, the adsorbent material may be a zeolite. The at least one fluid may be selected from the group consisting of corrosive fluids, organic solvent fluids, inorganic solvent fluids, group VI fluids, and group VII fluids.

In one embodiment, the adsorbent is a molecular sieve and the resin is selected from the group consisting of polyamides, polyolefins, styrenic polymers, polyesters, and mixtures thereof. In another embodiment, the resin is an ethylene-or propylene-containing homopolymer or copolymer. The resin-bonded sorbent material may be formed with the aid of a coupling or compatibilizing agent that is chemically compatible with the resin and improves adhesion or bonding with the sorbent for the purpose of uniformly dispersing the individual sorbent particles so that each particle is completely surrounded by the resin. In one embodiment, the coupling or compatibilizing agent is selected from the group consisting of reactive and non-reactive agents. In another embodiment, the compatibilizing agent is selected from the group consisting of metals, acrylates, stearates, block copolymers, maleates, epoxies, silanes, titanates, and mixtures thereof. In one embodiment, the resin bonded sorbent material comprises from about five percent (5%) to about fifty-five percent (55%) sorbent, and from about forty-five percent (45%) to about ninety-five percent (95%) resin. In another embodiment, the resin bonded sorbent material comprises from about twenty-five percent (25%) to about fifty-five percent (55%) sorbent, and from about forty-five percent (45%) to about seventy-five percent (75%) resin. In another embodiment, the resin bonded sorbent material comprises from about thirty-five percent (35%) to about forty-two percent (42%) sorbent, and from about fifty-eight percent (58%) to about sixty-five percent (65%) resin.

In another embodiment of the invention, the adsorbent comprises a particulate adsorbent formed by pressing, sintering or moulding, said adsorbent further comprising an at least partial over-moulding (overmold) of said resin. The article may further comprise means for mounting or coupling to the second article within the second article. The means for mounting or coupling may comprise at least one tab, while the moulding may comprise the use of heat and/or pressure. In another embodiment, the invention may include an electrically conductive material, while in another embodiment, the resin bonded sorbent material includes a single resin.

The invention also relates to an article comprising a resin bonded sorbent material for at least one fluid, the resin bonded sorbent material comprising a blend of a resin and a sorbent for the at least one fluid, the resin bonded sorbent material having a moisture permeability greater than the moisture permeability of water through high density polyvinylidene chloride and less than the moisture permeability of water through water swellable water insoluble hydroxycellulose.

Another aspect of the invention includes a method of protecting a first article from at least one fluid that damages the first article, the method comprising the steps of: i) forming a resin bonded sorbent material comprising a blend of a resin and a sorbent for at least one fluid; ii) forming a second article from the resin bonded sorbent material; and iii) bonding the second article to the first article.

It is another principal object of the present invention to provide an article, partially or wholly produced from a resin bonded sorbent composition as disclosed herein. The article of the invention may be selected from the group consisting of: lens, circuit board, housing, case, frame, support structure, mounting structure, holding structure, sealing material, solid-state surface-mount device, electronic chip package, communication terminal, communication switch, data storage, electronic equipment, electronic optical equipment, oscilloscope, sensor, transmitter, antenna, radar unit, optoelectronic device, radio frequency identification device, light-emitting diode, liquid crystal diode, semiconductor housing, imaging device, aiming device, mobile phone, target detection and guidance sensor, implantable electronic medical device, attached electronic medical device, mobile communication device, stationary communication device, automobile detection circuit, automobile control circuit, brake control system, hazardous chemical agent sensor, hazardous chemical agent controller, meter, electronic display, personal computer, programmable logic unit, medical diagnostic equipment, optical disk, light sensors, motion sensors, heat sensitive sensors, security cameras, flexible electronics, lighting fixtures, marine meters, navigation lights for marine use, external aircraft sensing devices, external aircraft monitoring devices, external aircraft measuring devices, power tool sensing devices, power tool aiming devices, power tool measuring devices, lasers, and combinations thereof.

The expression "resin bonded adsorbent" as appearing in the specification and claims for the present invention means that surface compatibility occurs between the adsorbent and the resin by loss of crystallinity of the resin, so that the adsorbent becomes wet and miscible with the resin due to a decrease in surface tension. The phrase "resin bonded sorbent" is intended to include bonding between the resin and the sorbent, which may be accomplished, for example, by heating the sorbent and the resin, or may be bonded by a suitable non-contaminating coupling agent, surfactant, or compatibilizing agent (discussed in more detail below). In addition, the term "resin" as used for the resin/adsorbent material blend refers to the resin in the matrix, while "adsorbent" refers to the material that actually adsorbs or absorbs impurities that may themselves be polymeric or resinous materials.

Drawings

The features of the invention believed to be novel and the elements characteristic of the invention are set forth with particularity in the appended claims. The drawings are for illustration purposes only and are not necessarily drawn to scale. The invention itself, however, both as to organization and method of operation, may best be understood by reference to the detailed description which follows taken in conjunction with the accompanying drawings in which:

FIG. 1 is an end view of the accumulator of the present invention;

fig. 2 is a side view, partly in section, of an accumulator according to the invention;

FIG. 3 is an exploded view of a filter/desiccant pouch/aluminum assembly of a prior art cooling system;

FIG. 4 is a side view of the assembly of FIG. 3;

FIG. 5 is an integral filter/fitting produced from a composition according to the present invention;

FIG. 6 is an illustration of the use of the device shown in FIG. 5 with a desiccant bag;

FIG. 7 shows a cross-sectional view of the embodiment of the component shown in FIG. 5 used atop a condenser;

FIG. 8 illustrates a flow-directing portion of a movable cooling accumulator of a cooling vapor/fluid separator produced in accordance with the present invention, such as for use in a receiver in an automotive air conditioning system;

FIG. 9 illustrates a cover portion for the separator of FIG. 8; and

figure 10 shows a cross-sectional view of one embodiment of the present invention.

Detailed Description

As understood by one of ordinary skill in the art, the term "fluid" is defined as an aggregate of matter in which molecules can flow through one another without restriction and without the formation of fracture planes. "fluid" may be used to describe, for example, liquids, gases, and vapors. Additionally, as used herein, a carbon dioxide releasing anion salt refers to any salt that releases carbon dioxide vapor upon contact with an acid stronger than carbonic acid (e.g., carbonate and sodium bicarbonate). Herein, the permeability of water vapor through high density polyvinylidene chloride is defined as impermeable, while the permeability of water vapor through water swellable water insoluble hydroxycellulose is defined as substantially permeable. Water swellable water insoluble hydroxycellulose as used herein refers to cellulose having sufficient hydroxyl substitution to be water swellable to the extent of fifteen percent (15%), but insufficient to impart water solubility. "moisture permeability" as used herein refers to the rate of permeability as described above, regardless of the actual permeability of any vapor or gas other than water through the high density polyvinylidene chloride or the water swellable water insoluble hydroxycellulose. When the terms "permeable" or "impermeable" are used herein, it refers to the transfer of fluids through a material or pores therein or at the molecular level.

For cost and throughput reasons, it is desirable to bind the adsorbent to a resin, particularly a resin suitable for injection molding, so that its adsorptive properties are retained and the moldability of the resin is maintained without degrading its mechanical properties. Surprisingly, the novel molding compositions of the invention and the parts produced therewith are multifunctional and advantageously combine structural, mechanical and adsorptive properties without the usual reinforcing additives. Thus, since no reinforcing additives are used, the novel molding compositions of the invention are further characterized by a higher moisture adsorption capacity due to a higher sorbent loading factor than previous sorbent-containing molding compositions.

It has been discovered, by chance, that as part of the present invention, the adsorbent of the "resin bonded adsorbent" molding composition has the beneficial effect of enhancing the molding composition of the present invention while retaining the moisture adsorbing capability without the need for the usual reinforcing additives, such as glass beads, glass fibers, and the like. This allows for a higher sorbent additive loading factor, maximizing the sorptive performance of the molding composition without significant change in the mechanical properties of the molding composition.

While the present invention is primarily directed to the discovery that the mechanical properties of molded resins containing sorbent additives can eliminate the need for reinforcing additives (e.g., glass beads and glass fibers) in general, in particular, the present invention is also directed to multifunctional sorbent-resin molding compositions containing a moisture sorption-mechanical property-enhancing amount of sorbent with reinforcing additives and resin, wherein a reduced amount of reinforcing additives can be used, below the amount typically required for enhancing mechanical properties. That is, the present invention also provides desiccant-containing molding compositions, but with reduced amounts of strength-enhancing additives, such as glass fibers and glass beads. This will improve the mechanical properties of the moulding composition without risking a reduction of the strength properties of the moulded article. More specifically, the proportions of sorbent, enhancing additive, and resin may range from about 5 wt% to about 50 wt% sorbent; from about 0 wt% to about 15 wt% of a reinforcing additive; and from about 45 wt% to about 95 wt% resin. In addition, it has been found that the resin/adsorbent matrix into which the blowing agent is incorporated maintains its structural integrity while at the same time the material density is reduced by about 30%.

It has also been found that, as part of the present invention, resins can, to a moderate degree, be processed and formed by several techniques, including modern high-speed injection molding processes, into fully functional component parts, including parts for various sealing systems and assemblies. In these latter applications, the structural and functional features of the concept of the present invention work to simultaneously adsorb ambient moisture and ingress moisture to protect sensitive materials or components of the system or assembly from degradation by moisture; such as hydrolysis or corrosion.

In light of the above, the present invention comprises a resin composition suitable for injection molding of reinforced structures having improved mechanical properties, satisfactory melt handling properties and significant moisture absorption properties. Most thermoplastic resins are suitable for use in the resin bonded sorbent compositions of the present invention and include homopolymers and copolymers comprising two or more monomers. Representative examples include polyamides, such as nylon 6; nylon 6, 6; nylon 610, and the like. Other representative examples include polyolefins such as high and low density polyethylene, polypropylene; ethylene-vinyl acetate copolymers; polystyrene; polyester (e.g., PET), to name but a few.

As previously discussed, according to one aspect of the invention, the composition of the invention may comprise from about 5 to about 55 wt% of the adsorbent and the balance resin, more specifically from about 25 to about 45 wt% of the adsorbent and the balance resin. More preferably, the composition may include from about 35% to about 42% by weight of an adsorbent, such as a molecular sieve, and the balance a resin. Most preferably, the resin bonded sorbent composition may comprise about 60% nylon molding resin, such as Zytel ® 101, commercially available from e.i.dupont, which is blended with 40% molecular sieve, such as w.r.grace 4A molecular sieve powder. The molecular sieve of the present invention may have a nominal pore size of 4 Å, and a particle size range of about 0.4 μ to about 32 μ. However, it is noted that other molecular sieve pore sizes may be used, such as 3 Å, 5 Å, or 10 Å.

Generally, the adsorbents useful and functional in the present invention are adsorbents that are mechanically bound to the resin without specific additives, such as molecular sieves, as previously discussed. In addition, according to the invention, the binding of the adsorbent to the resin can be brought about by using suitable additives, i.e. by means of coupling agents or compatibilizers. In addition to molecular sieves, other representative adsorbents useful in the compositions of the present invention include silica gel, activated carbon, activated alumina, clays, other natural zeolites, and combinations thereof. These adsorbents found to have coupling or compatibilizing agents include components such as activated carbon and alumina.

The additive as the compatibilizing agent falls into either one of two categories, i.e., an additive that binds to the resin or the adsorbent, and an additive that has affinity with the resin and the adsorbent, and the additive functions as a solid surfactant. Reactive coupling agents include such species as maleates, epoxies, and silanes. More specifically, the reactive coupling agent includes these representative examples, such as maleic anhydride grafted polymers, used in amounts ranging from about 2 wt% to about 5 wt%. In particular, reactive coupling agents may include these representative examples, such as maleic anhydride grafted to polypropylene or ABS resin, which may be used as a coupling agent with styrenic polymers. Similarly, silanes having various functional groups attached thereto may be used.

The present invention also contemplates the use of so-called non-reactive compatibilizers in the combination of the adsorbent and the resin. This includes these representative examples, such as metals (e.g., zinc or sodium), acrylates, stearates, and block copolymers, e.g., zinc stearate, sodium stearate, in the range of from about 0.01 wt% to about 0.02 wt% based on the adsorbent. The actual level is determined by the surface area, which in turn is proportional to the particle size. For a molecular sieve having an average particle size of 10 μ, 100ppm of aluminum stearate is the usual starting level for compatibility with polyamide resins. With reactive and non-reactive coupling/compatibilizing agents, their incorporation in the resin matrix does not form a phase boundary.

Resin bonded sorbent compositions can be prepared according to the present invention using plastic mixing techniques generally familiar to those of ordinary skill. By feeding the adsorbent and beads made of the selected resin in powder form to a plastic extruder with good mixing characteristics, the molecular sieve, i.e. the preferred adsorbent, can be incorporated into the resin, e.g. into polyamides, polyolefins, etc. Although a single screw extruder may be used to mix the resin and adsorbent, it is generally necessary to mix the blend of resin and adsorbent twice to produce a suitable resin bonded adsorbent material. Even after two times of mixing, phase separation sometimes still occurs. It has been found that resin-bonded sorbent materials mixed with a twin screw extrusion apparatus with extensive back mixing (extensive back mixing) are required to achieve nearly fully dispersed sorbent and to develop excellent mechanical and physical properties, which are the objectives of the present invention. In other words, the resin-bonded sorbent materials formed by the twin screw extruder exhibit little or no migration of the sorbent within the resin matrix, and therefore these resin-bonded sorbent materials maintain a uniform appearance. Thus, twin screw extruder compounding is typically used for forming the resin bonded sorbent material of the present invention as the resin is melted and the sorbent is mixed during. It is essential that the molten blend is heated above the melting point of the resin, as determined by DSC (differential scanning calorimetry). That is, in preparing the resin bonded sorbents of the invention, the temperature should be raised to a point where all crystallinity is lost to achieve complete miscibility of the sorbent in the resin melt. For example, Zytel ® 101 polyamide resin from Du Pont will be heated to above 262 ℃. The extruded resin is cooled and then cut or pulverized into pellets or granules. Because mixing occurs at high temperatures, the adsorbent tends not to adsorb moisture during this process, but rather retains its adsorptive capacity when molded into a component and installed in a working environment.

One other advantage obtained with the resin bonded sorbent system of the present invention, wherein the resin and the sorbent are intimately associated, is that it is more efficient in grams, i.e., adsorptive capacity per unit volume, than sorbent systems using bagged sorbents. According to earlier methods in which a bag was used to contain the adsorbent, for example, the adsorbent needed to be beaded to prevent it from entering the coolant stream. This requires that the adsorbent be bound within a binder resin, typically 15 wt% binder, for example in powder form. Thus, when 40 grams of commercially prepared sorbent was placed into the bag, only 34 grams of sorbent actually entered the cooling system (6 grams of binder). In contrast, the resin bonded sorbent of the present invention does not require additional binder resin because the sorbent is placed directly into the molding resin from which the component is fabricated. Advantageously, with the present invention, no intermediate binder resin is required, so that a higher sorbent loading factor can be obtained than that obtained with conventional bagged sorbents.

The blended resin blend of the present invention, as previously discussed, may then be extruded into a sheet or film, or injection molded into the form of a part. An exemplary component is a coolant vapor liquid separator, such as used in a receiver of an automotive air conditioning system. The strength of the silicate-reinforced resin produces a structurally sound molded part. Thus, such components are self-supporting and are suitable for fastening in the same way as metal or plastic cooling assemblies are currently fastened. Referring to, for example, figures 1 and 2, there are shown an end view and a partially sectioned side view, respectively, of a U-tube assembly 100. This embodiment comprises a U-shaped tube 120 within accumulator tank 130, wherein this embodiment uses the composition of the present invention to form a liner or sleeve 110 over the resin bonded sorbent of the present invention. This design provides a means of resisting drying of the exposed inner surface of the liner 110. This embodiment is an alternative to the "baffle" type accumulators (not shown) of the prior art.

Alternatively, instead of being melted and injection molded into a functional adsorbent member, a resin formed according to the present invention may be ground or otherwise formed or pelletized into a workpiece, which is then sintered into a member, such as by flow through a monolithic structure, or by flow through a desiccant member, such as an electronic filter structure for a hard disk drive. In this case, the part is not injection molded, but rather is molded from a mixed sorbent-loaded resin into a functional part having sufficient porosity for its intended application, such as a desiccant assembly for a receiver.

The components produced from the resin bonded sorbent of the invention are particularly suitable for use in place of the various components of the prior art. For example, in the past, a number of specific configurations have been developed for assembling and securing desiccant material (which is loose) into various components of a cooling system. Welded or sewn bags containing beaded or granular molecular sieve or alumina will be provided within the flow path. Additionally, and specifically with respect to stationary cooling applications, beads or granules of desiccant are combined with a suitable heat-curable resin or ceramic binder in a heated mold to create a rigid shape that will serve as a desiccant block or partial filter. Such a structure would constitute a housing. However, these solutions involve complex multiple components. However, the present invention combines the performance of the desiccant with the structural purpose of the components, such that the overall device serves two functions simultaneously.

For example, the present invention contemplates use with integrated receivers, water traps, condensers, such as those that are beginning to find application on an increasing number of vehicles. The movable refrigeration cycle components essentially combine a drying function with a condenser for a number of reasons. This reduces the number of system components, thus making better use of the space under the hood, and concomitantly reduces the number of fittings and connections, minimizing the likelihood of system leaks. It has some performance increase relative to cooling efficiency. Fig. 3 and 4 illustrate the current technology showing an aluminum threaded plug 300 with O-rings 305 and 306, an injection molded filter 310 and a desiccant bag 320. By converting this system into an integral injection molded plug/filter assembly, such as that shown in fig. 5, a one-piece plug 500 having an O-ring 510 may be used. In this case, the desiccant pouch 600 shown in FIG. 6 may be assembled with the plug 500. Fig. 7 illustrates a partial cross-section of the assembled device.

More specifically, FIG. 7 shows apparatus 700 disposed proximate condenser 710. The device 700 is comprised of a desiccant pouch 720 disposed within a receiver desiccant tube 730. On the end of the device 700 is a filter tube 740 that houses an integral threaded plug and a filter 750. O-ring 705 is also shown. The desiccant pouch 720 is connected to an integral threaded plug and filter 750 at an interface 760. This design would eliminate all of the separate assembly steps and produce a component with fewer separate pieces than the aluminum threaded plug described above.

Another embodiment of the invention is shown in fig. 8, and fig. 8 illustrates an upper portion 800 of a movable cooling accumulator of a refrigerant vapor/liquid separator, such as is used in a receiver of an automotive air conditioning system. As can be seen in fig. 8, accumulator upper section 800 includes a J-tube 810 secured within upper section 800. In this case, one or both of these pieces are molded from the resin bonded sorbent composition of the invention. Fig. 9 illustrates the placement of a cap 900 positioned in the upper portion 800 of the accumulator. In a preferred embodiment of the accumulator apparatus, both upper portion 800 and lid 900 are injection molded and then welded, or may be injection blow molded in two halves. The finished device is the lower portion (not shown) which may also be molded from the resin bonded sorbent composition of the invention.

To illustrate the benefits of the resin bonded sorbent of the present invention, the following experiments were conducted:

example 1

Test samples of resin bonded sorbents were prepared according to the claimed invention using the following protocol. The resin may be obtained from a supplier in the form of pellets, most commonly cylindrical (0.03-0.12 inch diameter by 0.06-0.25 inch long), or other contained tear drop-like forms (0.06-0.19 inch). The ratio of molecular sieve to resin is determined by weight of the components. The resin was pre-mixed by hand in a polyethylene film bag (5-15 minutes). The premix was poured in its entirety into the hopper of a Brabender single screw extruder. As the resin and molecular sieve pass through the extruder barrel, the action from the screw further mixes them and melts them. The resin bonded sorbent then exited through a single strand die (1 circular hole) forming a strand of molten material at the end of the extruder. The nylon-based resin is heated to above 262 ℃. The strand is then cooled with air. These strands are broken into pieces. The pieces are placed in the hopper of an injection molding machine and the part is molded. The parts were broken into pieces and reintroduced into the injection molding machine where tensile specimens (dogbone) were injection molded for testing. As described above, although a single screw extruder is used in the present embodiment, a twin screw extruder may be used for mixing the resin and the adsorbent, and such a modification is within the spirit and scope of the claimed invention.

The resin chosen is a known resin which is compatible with the coolants used in modern air conditioning systems, in particular R-134a and R-152 a. Such resins may also be compatible with compressor lubricant entrained in the coolant stream. Desiccants are the resins most commonly used in conventional systems, i.e., 3A or 4A molecular sieves.

For comparison, commonly used reinforcing glass beads were mixed at about the same loading. Glass beads are added to the polymer melt to control shrinkage and uniformly increase mechanical properties. Glass beads are effective in this application because they can be mechanically bonded to the resin so that an isotropic structure is obtained after molding.

The mechanical properties of the mixed resins were compared with those of the neat polymers and the glass reinforced polymers and the results are given in Table I.

Table I: enhancing the performance of nylon
					Performance:	materials:	pure nylon	Molecular sieve reinforced nylon	Glass bead reinforced nylon
Loading (%)		0	36.6	38.2
					hardness-Shore D (ASTM D2440)		81.4	93	86.6
Tensile modulus (psi) (ASTM D638)		203779	307252	361470
					Tensile Shift @ maximum load (in inches) (ASTM D638)		0.62	0.144	0.132
Tensile stress @ maximum load (psi) (ASTM D638)		10907	10519	10412
					Flexural modulus (psi) (ASTM D790)		336577	439087	506988
Bend shift @ yield (in inches) (ASTM D790)		0.531	0.142	0.156
					Flexural stress @ yield (psi) (ASTM D790)		17114	16662	15132
Heat deflection temperatureDegree (. degree.F.) (ASTM D648)		111.7	144.5	131.8

When the resin is reinforced, the hardness increases and the tensile shift and the bending shift are significantly reduced, and the material becomes more metal-like. Thus, the tensile and flexural moduli are significantly improved. Tensile and bending stresses can be substantially maintained using glass and sorbent-reinforced nylon (rather than glass-reinforced). An important feature and significance of this finding is that the performance of the adsorbent reinforced nylon is the same as that of glass reinforced nylon, differing both directionally and numerically from pure nylon. Further, the heat deflection temperature increases. Heat deflection temperature is a measure of heat resistance. As is known to those skilled in the art. It is an indicator of the ability of a material to undergo deformation over time with heating. A further meaning of an elevated heat deflection temperature is an elevated use temperature of the part molded from the sorbent-enhanced resin.

It has also been found that structures molded from sorbent-reinforced nylon resin (rather than glass-reinforced) are isotropic, as evidenced by the fact that the tensile and flexural moduli in one direction are substantially the same as in the other direction. As further evidence, the shrinkage of the mold was minimal and symmetrical.

Example 2

Further experiments were performed using a composition comprising polypropylene (i.e. Huntsman polypropylene 6106). This resin is also compatible with the coolant and also compatible with the compressor lubricant. It was mixed in a similar manner to the nylon in example 1, namely 60% of polypropylene resin and 40% of molecular sieve type 4A. The resin was heated to above 174 ℃. The mixed resin has similarly advantageous mechanical properties compared to the pure resin and is structurally close to the glass reinforced resin. The properties of this resin are summarized in table II. These values were determined by the same ASTM standards as provided in table 1.

Table II: enhancing the Properties of Polypropylene
						Performance:	materials:	pure PP	Molecular sieve reinforced polypropylene	Glass bead reinforced polypropylene	Glass fiber reinforced polypropylene
Loading two (%)		0	37.5	41.9	39.4
						Hardness one Shore D		66.8	74.6	65.6	75.4
Drawing dieVolume (psi)		131242	228023	159321	342977
						Tensile shift @ maximum load (in)		0.330	0.137	0.274	0.222
Tensile stress @ maximum load (psi)		3583	3169	2188	15996
						Flexural modulus (psi)		113251	219377	158136	737113
Bend shift @ yield (in)		0.597	0.356	0.468	0.176
						Bending stress @ yield (psi)		14.368	14.298	9.781	60.7
Heat deflection temperature (F)		121.3	145.1	128.8	n/a

The reinforcement of polypropylene results in increased stiffness and increased tensile and flexural modulus. For each property, the adsorbent alone showed even greater reinforcing effect than that of the glass beads. Therefore, as the material becomes harder, the tensile shift and bending shift are reduced. Furthermore, the effect of the adsorbent is directionally the same as, but greater than, the effect of the glass bead reinforcement. The use of sorbent reinforcement reduces only tensile and bending stresses. However, the reduction is greater than with glass reinforcement. Polypropylene reinforced with adsorbents generally works better than polypropylene reinforced with glass beads. The heat deflection temperature increases. This is a further meaning of an increase in heat deflection temperature is an increase in the use temperature of the part molded from the adsorbent-reinforced resin.

Similarly, it has also been found that the structure molded from the adsorbent-reinforced polypropylene resin is isotropic, as evidenced by the fact that the tensile and flexural moduli in one direction are substantially the same as in the other direction. As further evidence, the shrinkage of the mold was minimal and symmetrical.

Example 3

As shown in table III, the use of the sorbent reinforced nylon reduced melt flow compared to pure nylon (neat polymer) or glass bead reinforced nylon. However, it is in the usable range and higher than polypropylene. The melt flow of the sorbent-reinforced polypropylene is improved relative to pure polypropylene or glass fiber-reinforced polypropylene.

Table III: sorbent enhanced polymer melt flow properties
				Melt flow index (g/10 min) (ASTM D1238)	Pure (C)	Molecular sieve reinforced	Glass bead reinforced
Nylon	56.3	14.7	55.5
				Polypropylene	5.3	7.3	2.1

Example 4

Moisture absorption by weight percent is important. This is seen in table IV. In practice, the molecular sieve will absorb about 25% of its own weight. Then, it is reasonable to expect 40% of the loaded polymer to adsorb 10% of its own weight. However, in the case of nylon, the adsorption rate reaches 13% in an environment with a Relative Humidity (RH) of 90%, and the adsorption capacity approaches 10% in an environment with an RH of 80%. This is presumably a result of the adsorption of some water by nylon itself in combination with the action of the adsorbent. The fact that the bulk adsorbs more than 10% overall indicates that: the adsorbent, except for the reinforced nylon, functions entirely as an adsorbent, even if dispersed in a polymer. In fact, the adsorbent has a synergistic effect or a dual function. Table IV shows the adsorption results at 36-38% molecular sieve loading.

Table IV: the adsorbent enhances the adsorption properties of the polymer
					Moisture absorption @29 ℃, 90% r.h.	2 days	10 days	23 days	For 38 days
Molecular sieve reinforced nylon	5.4％	12.4％	13％	13％
					Molecular sieve reinforced polypropylene	1.1％	2.8％	4.4％	5.7％

Polypropylene is hydrophobic and therefore absorbs moisture much more slowly. However, when used entirely as a molding resin, it is used entirely as an adsorbent.

Other applications of the invention are numerous. Such applications include any resin-bonded component or structure for use in air conditioning or refrigeration systems. As discussed above, examples include J-tubes molded in half and welded, or possibly injection blow molded, sleeve liners, coatings for internal fittings or housings, co-injection molded composite structures, and insert molded filter-dryer assemblies. Diagnostic applications include test strip substrates, housings or holders for E-trans housings, containers for diagnostic products or components of containers. Pharmaceutical applications include components of a tablet container, such as a base, or a lid, or the body of the container itself, an insert within the tablet container, such as a bottom bracket or a neck insert, to aid dispensing, a thermoformed sheet, or one layer of a multi-layer thermoformed sheet, suitable for dispensing one dose at a time or two doses at a time from a blister or other compartmentalized package. Monolithic cylindrical canisters for pharmaceutical vials may also be formed of resin bonded sorbent, thereby providing a drop-in substitute for hollow canisters filled with particulate sorbent material. Applications for electronics and electro-optical devices include complete breathing filter bodies, inserts for night vision sensor units, or inserts for rear view camera bodies.

It will be appreciated that there are many other potential applications for adsorbent-loaded injection moldable resins in closed system and sealed packaging applications. It must also be understood that the adsorbent-loaded injection molding resin may also be extruded in the shape of a rod or channel having a uniform cross-section or any other shape, since extrusion requires fewer steps than injection molding.

The resin bonded sorbent described above and below overcomes the deficiencies of the prior art materials. In particular, the present invention is less brittle, e.g., parts formed from resin bonded sorbents are able to pass drop tests without part failure, parts adsorb fluid at a slower rate, thereby extending their useful life, and minimizing the impact of the manufacturing environment, they can be regenerated slowly, and by combining sorbent performance with structural characteristics, the number of parts in an assembly can be reduced, i.e., because one part serves two purposes, thereby reducing cost. The resin/adsorbent matrix of the present invention is less expensive to produce and use due to the use of conventional resins, the reduction of processing steps and the use of a variety of resin materials that do not form phase boundaries. Additionally, resin bonded sorbent housings can be used in place of the old metal housings, providing an effective barrier against the ingress of moisture or other fluids, providing much greater design flexibility, reducing weight and cost, as previously described.

When the circuit board is heated to melt and reflow the solder to ensure electrical connection, the circuit board may be damaged by moisture adsorbed within the circuit board material. Thus, in one embodiment, the resin bonded sorbent may be used to form a circuit board. The circuit board with the adsorbent entrained in the circuit board material will remain dry and damage during solder reflow is greatly reduced or eliminated. In a sealed electronic device housing having a circuit board formed from a resin bonded sorbent, other components within the sealed housing will be protected during the useful life of the device.

In another embodiment, the resin bonded sorbent may be used in a variety of forms to form an overmolded (overmolded) compression. First, the adsorbent is formed by pressing, sintering or molding a resin-bonded adsorbent material. Compression and molding can be accomplished with heat and/or pressure. Subsequently, a structural, protective resin is overmolded over the adsorbent, at least partially surrounding the adsorbent. The overmold may include tabs or other features suitable for mounting or coupling within the sealed electronic or data storage device. As with the examples described above, the adsorbent may be any desiccant or volatile adsorbent species selected to adsorb moisture or other fluids that may impair or limit the useful life of the protective device. In this embodiment, the overmold resin may be a suitable thermoplastic or thermoset resin having the desired properties and otherwise being compatible with the protected encapsulated electronic or data storage device.

In another embodiment, the resin bonded sorbents can be used to form structural elements of optical and electro-optical devices. For example, lenses, lens holders, lens retaining rings, diaphragms, housings, etc. may be formed from resin bonded sorbent materials and then incorporated into the assembly as the existing components are introduced. Thus, in this embodiment, the resin bonded sorbent will prevent condensation within the assembly, which typically causes the lens or other optical surface to be cloudy, thereby reducing image quality. Furthermore, if the sorbent material is of an indicating type, e.g., discolored above a certain moisture content, the condition of the component will be readily apparent as long as the component is capable of adsorbing. When using the indicated sorbent material, the device incorporating such material may include a window that allows, for example, a user to observe, for example, a color change that communicates to the user the need to change the component.

In another embodiment, resin bonded sorbents can be used to form elements that fill only the available space while providing sorbent performance. Thus, no additional enclosed space is required in the prior art assembly to include the adsorbent. For example, hard disk drives typically have little available space within their enclosures, yet still require adsorbent capabilities to provide a suitable environment for extending drive life. According to this embodiment, the multifunctional adsorbent may be incorporated into the inner driver element, or provided as an overmold in a variety of forms, as described above. As with other embodiments, the adsorbent may comprise a desiccant, a volatile organic adsorbent, a volatile acid adsorbent, or an oxygen adsorbent.

Some electronic devices may be used in extremely corrosive environments, such as aerospace and aeronautical applications. Electronic devices are used on a large scale for electronic devices and communication systems in aircraft and aerospace applications. Moisture and other volatiles can adversely affect the useful life of the device. Externally fixed devices such as sensors, transmitters, antennas, radar units, etc. are particularly at risk of moisture ingress due to temperature and pressure changes, resulting in evaporation and recondensation of moisture within the housing of the device. Also, the internal fixation devices are vulnerable to damage due to temperature changes as the conditions of use change. Thus, resin bonded sorbent articles are quite advantageous when included in such devices.

Similarly, automotive electronics are used in environments that may vary in type from desert to mountain to permafrost. These devices may include, for example, backup and night vision cameras and detection and control circuitry mounted on the exterior or under the hood of a car or truck. By forming the housing or the internal part using a resin-bonded adsorbent material, it is possible to prevent the intrusion of moisture or reduce the influence thereof. In addition, because these systems are subjected to extreme temperature conditions, electronically controlled brake systems may be protected from moisture intrusion. For example, brake fluid that is hygroscopic and that is in contact with several electronic control devices may change from a winter ambient temperature of zero degrees celsius (0 ℃) to three hundred fifty degrees celsius (350 ℃) in a very short time under high braking conditions (e.g., descending a hill). Preventing the intrusion of moisture into the brake fluid not only prolongs the service life of the electronic components, but also maintains a safer condition, i.e., when the water content in the brake fluid increases, its boiling point decreases, so that under normal operating conditions, the liquid becomes a vapor and braking force is essentially lost. In a similar manner, gauges and electronic displays for boats, RVs, ATVs and military rough terrain vehicles are also exposed to corrosive environments, wherein the introduction of the present invention is quite advantageous. In particular, marine and submarine applications expose electronic equipment to electrolyte solutions in which corrosion is accelerated. In a similar manner, automotive and marine devices benefit from the incorporation of resin bonded sorbent articles within the devices.

Monitoring and security devices such as light/motion/thermal sensors and security cameras must be able to operate reliably over a wide range of temperatures and humidities. For example, an external security camera mounted on the Buffalo levee, New York, USA, may experience temperatures as high as thirty-seven degrees Celsius (37℃.) and as low as negative twenty-three degrees Celsius (-23℃.), while experiencing relative humidity levels that drop from ninety-five percent (95%) to twenty percent (20%). Thus, the use of the resin bonded sorbents of the invention to form device housings or internal components is particularly advantageous for extending the useful life of such devices.

Another corrosive environment where electronic equipment is dominant is in the production and use of hazardous chemical products. In these environments, sensors, controllers and switching devices must be operated while protecting them from hazardous and/or corrosive vapors. Thus, the use of suitable adsorbents, such as desiccants, activated carbons, zeolites, clays, and organic adsorbents, in the resin bonded adsorbent housing or internal components of the device will extend the useful life of the device. Similarly, industrial Personal Computers (PCs) and Programmable Logic Controllers (PLCs) must operate in harsh industrial environments, such as high humidity. Thus, forming the housing or internal components of these devices from the resin bonded sorbent of the present invention will extend the useful life of these PCs and PLCs.

Another corrosive environment in which electronic equipment is becoming more and more dominant is inside the human body, i.e. implantable and/or attachable electronic medical devices. Such devices must function continuously and reliably in a humid saline environment, or in other words, in an environment where corrosive conditions are optimal. Suitable resin bonded sorbent housings or internal resin bonded sorbent components can keep these devices dry and improve the life and reliability of these devices. In addition to implantable and attachable medical devices, medical diagnostic equipment must also be maintained in reliable working conditions, i.e., dry electronics. Therefore, it is particularly advantageous to use the present invention to form the housing or the internal element.

Mobile and stationary communication devices are also exposed to hostile and corrosive environments. The termination and switchgear will have a longer service life and lower maintenance if the interior of the device housing is kept dry. Thus, the housing or internal components formed by the present invention will keep these devices dry, thereby minimizing electrical leakage and short circuits, inhibiting dendrite formation and electrolytic/chemical corrosion. In addition to moisture absorption, suitable adsorbents may be included to treat other volatiles within the housing.

Other electronic devices, such as solar panels or day/night sensors, present other problems to overcome. Commercial photovoltaic devices consist of flat, almost all-glass panels coated with moisture sensitive photosensitive substances. The panels are sealed to each other in the manner of a multiple-pane insulating glazing. A sealant may be used at the periphery or the panel may be mounted in a frame. In addition, apertures and openings in the panels for electrical connections must be sealed. The frame material or tab for electrical connection may be made of a resin bonded sorbent which may provide both mechanical strength and the adsorptive properties needed to contain and protect the moisture sensitive, fragile solar panel.

Radio Frequency Identification (RFID) devices are comprised of a semiconductor chip and associated circuitry. Circuit boards may be used, however, printed circuits are more common. RFID devices, especially organic RFID devices, are often used in hostile environments where the device may age due to moisture, oxygen, or volatile chemicals. Thus, by producing a support structure or housing made of a polymer resin with improved properties, the RFID device may be improved, wherein the properties of the polymer resin are improved by sorption additives (e.g. desiccants or oxygen sorbents) that can extend the service life of the RFID device.

Light Emitting Diodes (LEDs) and Liquid Crystal Diodes (LCDs) are made of materials that are moisture sensitive. In particular, organic LEDs and LCDs are very moisture sensitive. The sorbent is typically added to the display in the form of a film or sheet to enhance and extend its useful life. According to the present invention, the structural support or sealing material may be made of a resin bonded sorbent, thereby improving moisture resistance, i.e., extending service life, while also providing the structural, mounting or sealing function of the pre-existing components. In the same way, flexible electronic displays are also very moisture sensitive. The chromophores used in their structures are also moisture sensitive and, therefore, can be stabilized by incorporating resin bonded sorbents in such displays.

Even conventional lighting devices, such as household lighting and automotive lights, benefit from the inclusion of the present invention. Condensation on the lens can be prevented, thereby extending the useful life of the light bulbs of these devices while eliminating loss of reflected light.

Solid state surface mount electronic devices housed within plastic housings are considered to be unsealed due to the moisture permeability of the plastic. The fundamental problem is that during solder reflow cycles, changes in water vapor pressure cause damage, which can lead to delamination, cracking, leakage, and "popping" (popcorning). Currently, lower moisture susceptibility is achieved through selection of materials, packaging designs, and superior processing. The resin bonded sorbent enclosure will inhibit moisture ingress, effectively forming a hermetic seal until the sorbent becomes saturated. Examples of such devices include, but are not limited to, radio frequency devices, wireless devices, Local Area Network (LAN) devices and broadband devices, and electronic chip mounting and packaging.

As described above, the imaging apparatus has a problem different from the component deterioration. The presence of moisture associated with temperature changes can cause condensation to occur on the lens or window of the imaging device. Coagulation quickly degrades image quality and may render the imaging device inoperative. Such devices are known to require humidity control when the working environment is humid and there are temperature fluctuations. Thus, articles made from resin bonded sorbents, such as lens retaining rings, diaphragms, housings, and the like, can be incorporated into the assembly to provide adsorptive properties and structural support. Such optical devices may be used to aim and/or sense targets, such as target acquisition and guidance sensors and systems. In these systems, lasers and other sensing devices form critical components of the target acquisition and guidance system, and thus require peeking (peek) optical performance, i.e., no condensation on the optical surface.

In addition to sorbent properties, resin bonded sorbents can be blended with other materials, such as static dissipative (conductive) materials, to provide multifunctional properties, such as humidity control and antistatic properties. Thus, by adsorbing moisture while dissipating the static charge, these materials can be used in any of the electronic applications described above.

Fig. 10 shows a cross-sectional view of an apparatus 11 according to an embodiment of the invention. The device 11 includes a housing 12 and a shoulder 18, wherein the housing 12 includes first and second walls 14 and 16. As described above, the housing 12 may be formed of a resin bonded sorbent to slow or prevent fluid ingress. Shoulder 18 provides a seat for lens 20, while first wall 14 provides a mounting location for sorbent article 22 and second wall 16 provides a mounting location for bracket 24, where bracket 24 securely secures circuit board 26 to housing 12. The adsorbent article 22 includes an adsorbent 28 encased within an overmold resin 30. The overmold resin 30 includes tabs 32, the tabs 32 for retaining the sorbent articles 22 on the first wall 14 via fasteners 34. As described above, the circuit board 26 may also be formed of a resin-bonded adsorbent to provide adsorption performance within the housing 12. The device 11 also includes a gasket 36 and a retaining ring 38. The gasket 36 is disposed between the shoulder 18 and the lens 20, and the retaining ring 38 provides a positive force in the direction of the gasket 36, thereby compressing the gasket 36. The pressure against the gasket 36 seals the housing 12 and prevents fluid from entering therein. Additionally, the gasket 36, retaining ring 38, and/or lens 20 may be formed of a resin bonded sorbent, which would provide a greater degree of protection against fluid ingress. The apparatus 11 further includes an aperture 40 disposed between the lens 20 and the circuit board 26. The diaphragm 40 may also be formed of a resin bonded adsorbent to provide further adsorptive capacity. Although aperture 40 is shown as being formed of a resin bonded sorbent, one skilled in the art will recognize that other articles may be formed of such materials and incorporated into device 11, such as baffles, fasteners, or brackets. The surface mount device 42 is fixedly secured to the circuit board 26 via the contacts 44. The surface mount device 42 also includes a housing 46. Typically, the surface mount device 42 is not considered hermetic because the housing material is permeable to some fluids. Thus, the surface mount device 42 may be sealed by forming the housing 46 made of a resin bonded sorbent.

It will be appreciated by those of ordinary skill in the art that the device 11 and the components contained therein are not limited to the particular embodiment shown in fig. 10. For example, the housing 12 may be a completely sealed container without the lens 20 and/or without the aperture 40. Accordingly, it is within the spirit and scope of the present invention that the apparatus 11 include at least one article formed of a resin bonded absorbent material, wherein such article is selected from the group consisting of: lens, circuit board, housing, case, frame, support structure, mounting structure, holding structure, sealing material, solid state surface mount device, electronic chip package, communication terminal, communication switch, data storage device, electronic optical equipment, oscilloscope, sensor, transmitter, antenna, radar component, electro-optical device, radio frequency identification device, light emitting diode, liquid crystal diode, semiconductor housing, imaging device, aiming device, cellular telephone, target acquisition and guidance sensor, implantable electronic medical device, attached electronic medical device, mobile communication device, static communication device, automobile detection circuit, automobile control circuit, brake control system, hazardous chemical sensor, hazardous chemical controller, meter, electronic display, personal computer, programmable logic unit, medical diagnostic device, optical device, A light sensitive sensor, a motion sensor, a heat sensitive sensor, a security camera, flexible electronics, a lighting fixture, a marine meter, a marine navigation light, an external aircraft detection device, an external aircraft monitoring device, an external aircraft measurement device, a power tool sensing device, a power tool aiming device, a power tool measurement device, a laser, and combinations thereof.

While the present invention has been particularly described, in conjunction with a specific preferred embodiment, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art. It is therefore contemplated that the appended claims will embrace any such alternatives, modifications and variations as falling within the true scope and spirit of the present invention.

Claims (40)

1. An article comprising a resin bonded sorbent for at least one fluid, the article associated with a second article requiring protection from the at least one fluid, wherein the resin bonded sorbent comprises a blend of a resin and a sorbent for the at least one fluid, and the at least one fluid is detrimental to the second article, wherein all of the resins are the same class of resin.

2. The article of claim 1, wherein the resin is a thermoplastic resin and the adsorbent is selected from the group consisting of: molecular sieves, silica gels, ion exchange resins, activated carbon, activated alumina, clays, particulate metals, salts containing carbon dioxide-releasing anions, and mixtures thereof.

3. The article of claim 1, wherein the adsorbent comprises a zeolite.

4. The article of claim 1, wherein the adsorbent is a molecular sieve and the resin is selected from the group consisting of: polyamides, polyolefins, styrenic polymers, polyesters, and mixtures thereof.

5. The article of claim 1, wherein the resin is a homopolymer or copolymer comprising ethylene or containing propylene.

6. The article of claim 1, wherein the resin bonded sorbent is formed with the aid of a coupling or compatibilizing agent that is chemically compatible with the resin and improves the adhesion or coupling with the sorbent.

7. The article of claim 6, wherein the coupling or compatibilizing agent is selected from the group consisting of reactive and non-reactive agents.

8. The article of claim 7, wherein the compatibilizing agent is selected from the group consisting of: metals, acrylates, stearates, block copolymers, maleates, epoxies, silanes, titanates, and mixtures thereof.

9. The article of claim 1, wherein the resin bonded sorbent comprises from about five percent (5%) to about fifty-five percent (55%) sorbent and from about forty-five percent (45%) to about ninety-five percent (95%) resin.

10. The article of claim 1, wherein the resin bonded sorbent comprises from about twenty-five percent (25%) to about fifty-five percent (55%) sorbent and from about forty-five percent (45%) to about seventy-five percent (75%) resin.

11. The article of claim 1, wherein the resin bonded sorbent comprises from about thirty-five percent (35%) to about forty-two percent (42%) sorbent and from about fifty-eight percent (58%) to about sixty-five percent (65%) resin.

12. The article of claim 1, wherein the article is selected from the group consisting of: lens, circuit board, housing, case, frame, support structure, mounting structure, holding structure, sealing material, solid state surface mount device, electronic chip package, communication terminal, communication switch, data storage device, electronic optical equipment, oscilloscope, sensor, transmitter, antenna, radar component, electro-optical device, radio frequency identification device, light emitting diode, liquid crystal diode, semiconductor housing, imaging device, aiming device, cellular telephone, target acquisition and guidance sensor, implantable electronic medical device, attached electronic medical device, mobile communication device, static communication device, automobile detection circuit, automobile control circuit, brake control system, hazardous chemical sensor, hazardous chemical controller, meter, electronic display, personal computer, programmable logic unit, medical diagnostic device, optical device, A light sensitive sensor, a motion sensor, a heat sensitive sensor, a security camera, flexible electronics, a lighting fixture, a marine meter, a marine navigation light, an external aircraft detection device, an external aircraft monitoring device, an external aircraft measurement device, a power tool sensing device, a power tool aiming device, a power tool measurement device, a laser, and combinations thereof.

13. The article of claim 1, wherein the sorbent comprises a particulate sorbent formed by pressing, sintering, extruding or molding, and the sorbent further comprises the resin at least partially overmolded.

14. The article of claim 13, further comprising a means for mounting within or coupled to the second article.

15. The article of claim 14, wherein the means for mounting or coupling comprises at least one tab.

16. The article of claim 13, wherein the molding comprises the use of heat and/or pressure.

17. The article of claim 1, further comprising a conductive material.

18. The article of claim 1, wherein the resin bonded sorbent comprises a single resin.

19. The article of claim 1, wherein the at least one fluid is selected from the group consisting of: corrosive fluids, organic solvent fluids, inorganic solvent fluids, group VI fluids, and group VII fluids.

20. The article of claim 1 wherein said blend of said resin and adsorbent is formed by a twin screw extruder.

21. An article comprising a resin bonded sorbent for at least one fluid, the resin bonded sorbent comprising a blend of a resin and a sorbent for the at least one fluid, the resin bonded sorbent having a moisture permeability greater than the moisture permeability of water through high density polyvinylidene chloride and less than the moisture permeability of water through water swellable water insoluble hydroxycellulose.

22. The article of claim 21, wherein the article is selected from the group consisting of: lens, circuit board, housing, case, frame, support structure, mounting structure, holding structure, sealing material, solid state surface mount device, electronic chip package, communication terminal, communication switch, data storage device, electronic optical equipment, oscilloscope, sensor, transmitter, antenna, radar component, electro-optical device, radio frequency identification device, light emitting diode, liquid crystal diode, semiconductor housing, imaging device, aiming device, cellular telephone, target acquisition and guidance sensor, implantable electronic medical device, attached electronic medical device, mobile communication device, static communication device, automobile detection circuit, automobile control circuit, brake control system, hazardous chemical sensor, hazardous chemical controller, meter, electronic display, personal computer, programmable logic unit, medical diagnostic device, optical device, A light sensitive sensor, a motion sensor, a heat sensitive sensor, a security camera, flexible electronics, a lighting fixture, a marine meter, a marine navigation light, an external aircraft detection device, an external aircraft monitoring device, an external aircraft measurement device, a power tool sensing device, a power tool aiming device, a power tool measurement device, a laser, and combinations thereof.

23. The article of claim 21, wherein the adsorbent comprises a particulate adsorbent formed by pressing, sintering, extruding or molding, and the adsorbent further comprises the resin at least partially overmolded.

24. The article of claim 23, further comprising a tool for mounting inside or coupling to a structural component.

25. The article of claim 24, wherein the means for mounting or coupling comprises at least one tab.

26. The article of claim 23, wherein the molding comprises the use of heat and/or pressure.

27. The article of claim 21, further comprising a conductive material.

28. The article of claim 21, wherein the resin bonded sorbent comprises a single resin.

29. The article of claim 21, wherein the at least one fluid is selected from the group consisting of: corrosive fluids, organic solvent fluids, inorganic solvent fluids, group VI fluids, and group VII fluids.

30. The article of claim 21, wherein said blend of said resin and adsorbent is formed by a twin screw extruder.

31. A method of protecting a first article from at least one fluid that damages the first article, comprising the steps of:

i) forming a resin bonded sorbent comprising a blend of a resin and a sorbent for the at least one fluid;

ii) forming a second article from the resin bonded sorbent; and

iii) bonding the second article to the first article.

32. The method of claim 31, wherein the second article is selected from the group consisting of: lens, circuit board, housing, case, frame, support structure, mounting structure, holding structure, sealing material, solid state surface mount device, electronic chip package, communication terminal, communication switch, data storage device, electronic optical equipment, oscilloscope, sensor, transmitter, antenna, radar component, electro-optical device, radio frequency identification device, light emitting diode, liquid crystal diode, semiconductor accessory, imaging device, aiming device, cellular telephone, target acquisition and guidance sensor, implantable electronic medical device, attached electronic medical device, mobile communication device, static communication device, automobile detection circuit, automobile control circuit, brake control system, hazardous chemical sensor, hazardous chemical controller, meter, electronic display, personal computer, programmable logic unit, medical diagnostic device, optical, A light sensitive sensor, a motion sensor, a heat sensitive sensor, a security camera, flexible electronics, a lighting fixture, a marine meter, a marine navigation light, an external aircraft detection device, an external aircraft monitoring device, an external aircraft measurement device, a power tool sensing device, a power tool aiming device, a power tool measurement device, a laser, and combinations thereof.

33. The method of claim 31, wherein the adsorbent comprises a particulate adsorbent formed by pressing, sintering, extruding or molding, and the adsorbent comprises at least a partial overmold of the resin.

34. The method of claim 33, wherein the second article further comprises a tool for mounting inside or coupling to the first article.

35. The method of claim 34, wherein the means for mounting or coupling is at least one tab.

36. The method of claim 33, wherein the molding is performed under heat and/or pressure.

37. The method of claim 31, wherein the second article further comprises a conductive material.

38. The method of claim 31, wherein the resin bonded sorbent comprises a single resin.

39. The article of claim 31, wherein the at least one fluid is selected from the group consisting of: corrosive fluids, organic solvent fluids, inorganic solvent fluids, group VI fluids, and group VII fluids.

40. The article of claim 31, wherein said blend of said resin and adsorbent is formed by a twin screw extruder.