HK1121871B

HK1121871B - Wireless transceiver structure, communication device and communication method

Info

Publication number: HK1121871B
Application number: HK08113011.0A
Authority: HK
Inventors: 阿玛德雷兹．罗弗戈兰
Original assignee: Avago Technologies International Sales Pte. Limited
Priority date: 2006-12-30
Filing date: 2008-11-28
Publication date: 2012-06-29

Description

Wireless transceiver structure, communication device and communication method

Technical Field

The present invention relates to wireless communications, and more particularly, to circuitry for wireless communications.

Background

Communication systems are known to support wireless and wired communication between wireless and/or wired communication devices. These communication systems range from national and/or international cellular telephone systems to the internet, as well as point-to-point indoor wireless networks. Each communication system is constructed to operate in accordance with one or more communication standards. The one or more standards under which the wireless communication system operates include, but are not limited to: IEEE 802.11, bluetooth, Advanced Mobile Phone Service (AMPS), digital AMPS, global system for mobile communications (GSM), Code Division Multiple Access (CDMA), Local Multipoint Distribution System (LMDS), multi-way multipoint distribution system (MMDS), enhanced data rates for GSM evolution (EDGE), general packet radio service, and/or variations thereof.

Depending on the type of wireless communication system, the wireless communication device communicates directly or indirectly with another wireless communication device, which may be, for example, a cellular phone, a two-way wireless interphone, a Personal Digital Assistant (PDA), a Personal Computer (PC), a notebook computer, a home entertainment device, etc. For direct communication (i.e., well-known point-to-point communication), the participating devices tune their receivers and transmitters to the same channel (e.g., one of the multiple Radio Frequency (RF) carriers of the wireless communication system) and communicate over that channel. For indirect wireless communication, each wireless communication device communicates directly with an associated base station (e.g., cellular service) and/or an associated access point (e.g., for an indoor or in-building wireless network) via an assigned channel. To complete a communication connection between wireless communication devices, the associated base stations and/or associated access points communicate directly with each other via a system controller, a Public Switched Telephone Network (PSTN), the internet, and/or another wide area network.

Each wireless communication device participating in wireless communications includes a built-in wireless transceiver (i.e., a receiver and a transmitter) or is connected to an associated wireless transceiver (e.g., a station for an indoor and/or in-building wireless communication network, an RF modem, etc.). As known to those skilled in the art, the transmitter includes a data modulation stage, one or more intermediate frequency stages, and a power amplifier. The data modulation stage converts the raw data to a baseband signal in accordance with a particular wireless communication standard. One or more intermediate frequency stages mix the baseband signal with one or more local oscillations to generate an RF signal. The power amplifier amplifies the RF signal before transmission through the antenna.

Typically, the data modulation stage is implemented on a baseband processor chip, while the intermediate frequency stage and the power amplification stage are implemented on separate wireless processor chips. In the past, wireless integrated circuits have been designed using bipolar circuits, capable of withstanding large signal swings and allowing the action of linear transmitter components. Therefore, a number of older baseband processors employ analog interfaces for communicating analog signals with the wireless processor.

As integrated circuit die sizes continue to decrease and the number of circuit components continues to increase, chip placement becomes increasingly difficult and challenging. Among other known problems, the demand for output pins of a die is increasing despite the decreasing die size. Also, inside the die itself, it becomes very difficult to develop internal buses and traces to support high data rate communications. Thus, a need has arisen for a solution that can support high data rate communications while reducing the need for output pins and in-die circuit traces. In addition, communication between ICs that coexist in a common device or on a common printed circuit board requires advances to adequately support the upcoming improvements in IC manufacturing. Accordingly, there is a need for an integrated circuit antenna structure and wireless communication applications thereof.

Disclosure of Invention

The invention relates to an apparatus and a method of operation which will be further described in the following description of the drawings and detailed description, and in the claims.

According to one aspect of the present invention, there is provided a wireless transceiver structure comprising:

a substrate region for use as a waveguide for an ultra-high Radio Frequency (RF) signal, wherein said substrate region defines a bounded volume for conducting and substantially containing said ultra-high RF signal;

a first base transceiver communicatively coupled to the first base antenna;

a second base transceiver communicatively coupled to the second base antenna;

wherein the first and second substrate antennas are arranged to transmit and receive radio frequency communication signals via the substrate area.

Preferably, the substrate region comprises a substantially uniformly doped dielectric region (asubstantially uniform doped dielectric region).

Preferably, the first and second substrate antennas are sized for communicative coupling with the substrate area.

Preferably, at least one of the first and second substrate antennas is positioned adjacent to the substrate region and transmits the ultra high radio frequency signal via the substrate region.

Preferably, at least one of said first and second substrate antennas is formed to at least partially extend into said substrate region and is communicatively connected to transmit said vhf signal via said substrate region.

Preferably, the wireless transceiver structure further comprises a metal layer covering at least a portion of the surface of the substrate region.

Preferably, the structure is formed on a single die, and the waveguide is formed inside the single die.

Preferably, the structure comprises a plurality of wireless transceiver integrated circuits supported by a printed circuit board, wherein the waveguides are formed within the wireless transceiver integrated circuits or within the printed circuit board.

According to another aspect of the present invention, there is provided a communication apparatus comprising:

a supporting substrate (supporting substrate) provided with an electronic circuit device;

a guide structure having a prefabricated composition for guiding radio frequency electromagnetic waves, the guide structure being formed within the support substrate;

a first base transceiver communicatively coupled to the first base antenna;

a second base transceiver communicatively coupled to the second base antenna;

wherein the first and second substrate antennas are arranged to transmit and receive radio frequency communication signals via the guide structure of the support substrate.

Preferably, at least one of the first and second substrate antennas is positioned adjacent to and communicatively coupled to the guide structure of the support substrate to transmit signals via the guide structure of the support substrate.

Preferably, at least one of the first and second substrate antennas is formed to at least partially extend into the guide structure of the support substrate and is communicatively coupled to transmit signals via the guide structure of the support substrate.

Preferably, the communication device further comprises a metal layer covering at least a part of the surface of the guide structure of the support substrate.

Preferably, the guide structure of the support substrate comprises a semiconducting dielectric material.

Preferably, the guide structure of the support substrate is formed within a die of the integrated circuit.

Preferably, the guide structure of the support substrate is formed inside a support board for accommodating the integrated circuit.

Preferably, at least one of the first and second substrate transceivers is formed entirely within a dielectric (dielectric) substrate for transmitting and receiving ultra-high radio frequency signals via the substrate-supporting guide structure.

Preferably, the support substrate further comprises a plurality of integrated circuit modules, wherein at least two integrated circuit modules communicate through the substrate transceiver via the guide structure of the support substrate.

Preferably, the guide structure guides the ultrahigh radio frequency signals between the first base transceiver and the at least two second base transceivers in a hub-and-spoke (hub-and-spoke) configuration.

Preferably, a first guide structure that guides the very high radio frequency signals between the first pair of base transceivers partially overlaps a second guide structure that guides the radio frequency communication signals between the second pair of base transceivers.

According to one aspect of the invention, there is provided a method of communicating within a supporting substrate having a waveguide formed therein, the method comprising:

generating a high-frequency radio frequency signal;

transmitting the high frequency radio frequency signal via the waveguide.

Preferably, the method further comprises: transmitting the high frequency radio frequency signal from a first substrate antenna of a first substrate transceiver, wherein the first substrate antenna is communicatively connected to transmit the high frequency radio frequency signal via the waveguide.

Preferably, the method further comprises: a second substrate transceiver receives the high frequency radio frequency signal from a second substrate antenna communicatively coupled thereto to receive the high frequency radio frequency signal transmitted via the waveguide.

Preferably, the high frequency radio frequency signal is characterized by a frequency greater than or equal to 10 GHz.

Preferably, at least one of the first and second substrate antennas is characterized by an antenna length of less than or equal to 15 mm.

Preferably, the high frequency radio frequency signal is transmitted at a very low power level, wherein the very low power level is a power level that is less than the power level required for over-the-air transmission to the remote device.

Various advantages, aspects and novel features of the invention, as well as details of an illustrated embodiment thereof, will be more fully described with reference to the following description and drawings.

Drawings

The invention may be better understood by consideration of the following detailed description of preferred embodiments of the invention in conjunction with the accompanying drawings, in which:

FIG. 1 is a functional block diagram of a communication system including circuit devices and network components and its operation according to one embodiment of the present invention;

FIG. 2 is a schematic block diagram of a wireless communication device including a host and associated radios;

FIG. 3 is a functional block diagram of a substrate configured in accordance with one embodiment of the invention;

FIG. 4 is a functional block diagram of a substrate including a plurality of embedded substrate transceivers according to another embodiment of the present invention;

FIG. 5 is a functional block diagram of a substrate including a plurality of embedded substrate transceivers surrounded by integrated circuit modules and circuitry according to one embodiment of the present invention;

FIG. 6 is a functional block diagram of a substrate including a plurality of transceivers configured to communicate through waveguides formed within the substrate in accordance with one embodiment of the present invention;

FIG. 7 is a flow diagram of a method according to one embodiment of the invention;

FIG. 8 is a functional block diagram of a substrate showing a three-level transceiver in accordance with one embodiment of the present invention;

FIG. 9 is a functional block diagram of a multi-chip module formed in accordance with one embodiment of the present invention;

FIG. 10 is a flow diagram of a method of communicating according to one embodiment of the invention;

FIG. 11 is a schematic diagram of an in-substrate transceiver arrangement according to one embodiment of the invention;

FIG. 12 is a schematic view of another embodiment of a substrate;

FIG. 13 is a flow diagram of a method according to one embodiment of the invention;

FIG. 14 is a functional block diagram of an integrated circuit multi-chip device and associated communications in accordance with one embodiment of the present invention;

FIG. 15 is a functional block diagram of the operation of one embodiment of the present invention using frequency division multiple access;

FIG. 16 is a table of static allocations or fixed allocations of carrier frequencies for particular communications between local transceivers, base transceivers and other transceivers within a particular device;

FIG. 17 is a functional block diagram of an apparatus housing multiple transceivers and operating in accordance with an embodiment of the present invention;

fig. 18 is a flow diagram of a method of wireless transmission within an integrated circuit using frequency division multiple access in accordance with one embodiment of the present invention;

fig. 19 is a functional block diagram of an apparatus and corresponding method of wireless communication within the apparatus to avoid collisions and interference by coordinating communications using a collision avoidance mechanism in accordance with one embodiment of the present invention;

FIG. 20 is a functional block diagram of a substrate supporting multiple local transceivers according to an embodiment of the present invention;

fig. 21 is a flow diagram of a method of wireless local transmission within a device according to one embodiment of the invention;

FIG. 22 is a functional block diagram of a device containing a mesh network formed within a circuit board or integrated circuit according to one embodiment of the present invention;

FIG. 23 is a flow diagram of a method for routing and forwarding communications between local transceivers operating as nodes of a mesh network within a single device in accordance with one embodiment of the present invention;

FIG. 24 is a flow diagram of a method of communicating within a device, wherein communications are communicated over a mesh network within a single device, in accordance with one embodiment of the present invention;

FIG. 25 is a functional block diagram of a network operating according to one embodiment of the present invention;

FIG. 26 is a flow diagram of a method according to one embodiment of the invention.

Detailed Description

Fig. 1 is a functional block diagram of a communication system including circuit devices and network components and its operation according to one embodiment of the present invention. More specifically, a plurality of network service areas 04, 06, and 08 are part of network 10. The network 10 includes a plurality of base stations or Access Points (APs) 12-16, a plurality of wireless communication devices 18-32, and a network hardware component 34. The wireless communication devices 18-32 may be notebook computers 18 and 26, personal digital assistants 20 and 30, personal computers 24 and 32, and/or cellular telephones 22 and 28. Details of the wireless communication device will be described in detail in connection with fig. 2-10.

The base stations or APs 12-16 are connected to the network hardware 34 by Local Area Network (LAN) connections 36, 38, and 40. Network hardware 34, which may be a router, switch, bridge, modem, system controller, etc., provides Wide Area Network (WAN) connection 42 to external network components, such as WAN 44, for communication system 10. Each base station or access point 12-16 has an associated antenna or antenna array to communicate with wireless communication devices within its coverage area. In general, wireless communication devices 18-32 register with a particular base station or access point 12-16 to receive service from communication system 10. For direct communication (i.e., point-to-point communication), the wireless communication device communicates directly over the assigned channel.

Typically, base stations are used in cellular telephone systems and similar systems, and access points are used in indoor or in-building wireless networks. Regardless of the particular type of communication system, each wireless communication device includes built-in and/or interfaces with a wireless transceiver. For purposes of the present invention, each of the wireless communication devices of FIG. 1, including the host devices 18-32 and the base stations or access points 12-16, includes at least one associated wireless transceiver for wirelessly communicating with at least one other remote transceiver of the wireless communication device illustrated in FIG. 1. In general, reference to a telecommunication or long-range transceiver refers to a communication or transceiver that is external to a particular device or transceiver. Thus, each device and communication referred to in fig. 1 is a remote device or communication. Embodiments of the present invention include devices having multiple transceivers and capable of communicating with each other. Such transceivers and communications are referred to herein as local transceivers and communications.

Fig. 2 is a schematic block diagram of a wireless communication device including host devices 18-32 and an associated wireless transceiving means 60. For cellular phone hosts, the radio 60 is a built-in component. For pda, notebook, and/or pc hosts, the transceiver 60 may be a built-in or external component.

As shown, host devices 18-32 include a processing module 50, a memory 52, a wireless interface 54, an input interface 58, and an output interface 56. The processing module 50 and memory 52 execute corresponding instructions typically performed by a host device. For example, for a cellular telephone host device, the processing module 50 performs the corresponding communication functions according to a particular cellular telephone standard.

The wireless interface 54 allows data to be received from and transmitted to the wireless transceiving means 60. For data received from radio 60 (e.g., inbound data), radio interface 54 provides the data to processing module 50 for further processing and/or routing to output interface 56. Output interface 56 provides a connection to an output display device, such as a display, monitor, speaker, etc., that can render the received data. The wireless interface 54 also provides data from the processing module 50 to the wireless transceiver device 60. The processing module 50 may receive outbound data from an input device (e.g., keyboard, keypad, microphone, etc.) or generate data by itself via the input interface 58. For data received via input interface 58, processing module 50 may perform a corresponding host function on the data and/or route it to wireless transceiver device 60 via wireless interface 54.

The wireless transceiver device 60 includes a host interface 62, a baseband processing module 100, a memory 65, a plurality of Radio Frequency (RF) transmitters 106 and 110, a transmit/receive (T/R) module 114, a plurality of antennas 81-85, a plurality of RF receivers 118 and 122, and a local oscillation module 74. The baseband processing module 100, in conjunction with operational instructions stored in the memory 65, performs digital receiver functions and digital transmitter functions, respectively. Digital receiver functions include, but are not limited to, digital Intermediate Frequency (IF) to baseband conversion, demodulation, constellation demapping, decoding, deinterleaving, fast fourier transform, cyclic prefix removal, spatial and temporal decoding, and/or descrambling. Digital transmitter functions include, but are not limited to, scrambling, encoding, interleaving, constellation mapping, modulation, inverse fast fourier transform, cyclic prefix addition, spatial and temporal coding, and digital baseband to IF conversion. The baseband processing module 100 may be implemented using one or more processing devices. The processing device may be a microprocessor, microcontroller, digital signal processor, microcomputer, central processing unit, field programmable gate array, programmable logic device, state machine, logic circuitry, analog circuitry, digital circuitry, and/or any device capable of processing signals (analog and/or digital) based on operational instructions. The memory 65 may be a single memory device or a plurality of memory devices. The storage device may be a read-only memory, random access memory, volatile memory, non-volatile memory, static memory, dynamic memory, flash memory, and/or any device that may store digital information. It should be noted that when processing module 100 implements one or more functions via a state machine, analog circuitry, digital circuitry, and/or logic circuitry, the memory storing the corresponding instructions may be embedded within the circuitry comprising the state machine, analog circuitry, digital circuitry, and/or logic circuitry.

In operation, the radio 60 receives outbound data 94 from the host device via the host interface 62. The baseband processing module 100 receives the outbound data 94 and generates one or more outbound symbol streams 104 based on a mode selection signal 102. The mode select signal 102 will indicate a particular mode of operation that is appropriate for one or more particular modes of the various IEEE 802.11 standards. For example, the mode select signal 102 may indicate a frequency band of 2.4GHz, a channel bandwidth of 20 or 22MHz, and a maximum bit rate of 54 Mbps. In the general category, the mode selection signal will further represent a particular rate in the range from 1Mbps to 54 Mbps. Further, the mode selection signal may represent a particular modulation type including, but not limited to, Barker code modulation, BPSK, QPSK, CCK, 16QAM, and/or 64 QAM. The mode selection signal 102 may also include a coding rate, a number of coded bits per subcarrier (NBPSC), coded bits per OFDM symbol (NCBPS), and/or data bits per OFDM symbol (NDBPS). The mode selection signal 102 may also indicate the particular channelization of the corresponding mode, providing the number of channels and the corresponding center frequency. The mode select signal 102 may further represent a power spectral density mask value and the number of antennas that may be initially used for MIMO communications.

The baseband processing module 100 generates one or more outbound symbol streams 104 from the outbound data 94 based on a mode select signal 102. For example, if the mode selection signal 102 indicates that a single transmit antenna is being used for the particular mode selected, the baseband processing module 100 will produce a single outbound symbol stream 104. Alternatively, if the mode select signal 102 represents 2, 3, or 4 antennas, the baseband processing module 100 will produce 2, 3, or 4 outbound symbol streams 104 from the outbound data 94.

Depending on the number of outbound data streams 104 generated by the baseband processing module 100, a corresponding number of RF transmitters 106 and 110 will be activated to convert the outbound symbol streams 104 into outbound RF signals 112. Typically, each RF transmitter 106 and 110 includes a digital filter and up-sampling module, a digital-to-analog conversion module, an analog filter module, an up-conversion module, a power amplifier, and a radio frequency bandpass filter. The RF transmitter 106 and 110 provide outbound RF signals 112 to the transmit/receive module 114, which in turn provides each outbound RF signal to a corresponding antenna 81-85.

When the transceiver 60 is in the receive mode, the transmit/receive module 114 receives one or more inbound RF signals 116 via the antennas 81-85 and provides them to one or more RF receivers 118-122. The RF receiver 118-122 converts the inbound RF signal 116 into a corresponding number of inbound symbol streams 124. The number of inbound symbol streams 124 corresponds to a particular mode of data reception. The baseband processing module 100 converts the inbound symbol stream 124 into inbound data 92, which is then provided to the host devices 18-32 via the host interface 62.

Those of ordinary skill in the art will appreciate that the wireless communication device shown in fig. 2 may be implemented using one or more integrated circuits. For example, the host device may be implemented on one integrated circuit, while the baseband processing module 100 and memory 65 are implemented on a second integrated circuit, and the remaining components of the radio 60, except for the antennas 81-85, may be implemented on a third integrated circuit. Or, for another example, the radio 60 may be implemented on a single integrated circuit. As another example, the processing module 50 and the baseband processing module 100 of the host device may be a common processing means implemented on one integrated circuit. Furthermore, memory 52 and memory 65 may be implemented on one integrated circuit and/or on the same integrated circuit as the common processing module of processing module 50 and baseband processing module 100.

Fig. 2 shows a MIMO transceiver in general to facilitate understanding of the basic blocks of a general transceiver. It should be appreciated that any of the connections shown in fig. 2 may be implemented by physical traces or wireless communication links. The wireless communication link is supported by a local transceiver (not shown in fig. 2) that can transmit through space or through an electromagnetic waveguide, which can be formed within the substrate of a printed circuit board that houses the various die, including the MIMO transceiver, or within the substrate of the die (e.g., a dielectric substrate). The circuitry and substrate structures that support the above operations will be described in detail in subsequent sections with reference to the accompanying drawings.

It is known that there is an inverse relationship between frequency and signal wavelength. Since the antenna transmitting the radio frequency signal is a function of the wavelength of the signal, increasing the frequency will result in a reduction in wavelength, requiring a reduction in antenna length to support such communications. In future radio frequency transceivers, the carrier frequency will exceed or at least equal to 10GHz, thus requiring relatively small monopole or dipole antennas. The size of a monopole antenna is generally equal to one-half wavelength, while a dipole antenna is equal to one-quarter wavelength. For example, at 60GHz, the full wavelength is 5mm, so the monopole size is approximately equal to 2.5 mm and the dipole size is approximately equal to 1.25 mm. Such small-sized antennas can be implemented on packaged printed circuit boards and/or just on dies (die). Embodiments of the present invention include the use of the high frequency rf signals described above to incorporate such small antennas on a die or printed circuit board.

Printed circuit boards and dies typically have multiple different layers. For printed circuit boards, different layers have different thicknesses and different metallization layers. Dielectric regions (dielectrocareas) are provided in the layers as electromagnetic waveguides for high frequency radio frequency signals. The use of such a waveguide provides the additional benefit of isolating the signal from the exterior of the printed circuit board. Furthermore, transmission power requirements are reduced because the radio frequency signal is conducted through a dielectric (dielectric) within the waveguide, rather than through air. Embodiments of the present invention thus include uhf radio frequency circuits, such as 60GHz radio frequency circuits, mounted on a printed circuit board or on a die to facilitate corresponding communications.

FIG. 3 is a functional block diagram of a substrate configured in accordance with one embodiment of the invention. The substrate comprises a dielectric substrate that can be used as an electromagnetic waveguide. As can be seen in fig. 3, the substrate 150 includes a transceiver 154 that is arranged to communicate with a transceiver 158. Reference herein to a substrate generally refers to any supporting substrate, including in particular printed circuit boards and other boards supporting integrated circuits and other circuits. The substrates involved also include semiconductor substrates as part of the integrated circuits and dies that support the circuit elements and modules. Accordingly, unless a particular application is specifically defined in this specification, the term "substrate" should be understood to include all of the above-described applications having various circuit modules and devices. Thus, with respect to the substrate 150 in fig. 3, the substrate 150 may be a printed circuit board, where the transceiver is a separate integrated circuit or die disposed thereon. Alternatively, substrate 150 is an integrated circuit, wherein the transceiver is a transceiver module as part of the integrated circuit die circuit.

Transceiver 154 is communicatively coupled to antenna 166 and transceiver 158 is communicatively coupled to antenna 170, as described herein. The first and second substrate antennas 166 and 170 are respectively arranged to transmit and receive radio frequency communication signals through the substrate region 162, which substrate region 162 is a dielectric substrate region in this embodiment. As can be seen, the antenna 166 is disposed on the upper surface of the dielectric substrate 162, while the antenna 170 is disposed to extend into the interior of the dielectric substrate 162. Each of the above antenna configurations are examples of different embodiments of a substrate antenna for transmitting and receiving radio frequency signals through the dielectric substrate 162. As can also be seen in fig. 3, an optional metal layer 174 is disposed on both or either of the upper and lower surfaces of the dielectric substrate 162. The metal layer 174 may further isolate and shield electromagnetic waves emitted at high frequency radio frequencies through the dielectric substrate 162. The use of such a metal layer 174 is particularly suitable for embodiments where the substrate comprises a printed circuit board, but may include any structure having a metal layer disposed thereon.

In operation, the transceiver 154 is a very high frequency transceiver that generates electromagnetic signals having a frequency greater than or equal to 10 GHz. In a particular embodiment of the invention, the electromagnetic signal is characterized by a radio frequency of 60GHz (+/-5 GHz). One corresponding factor in using such high frequency electromagnetic signals is that short antennas small enough in size to be placed on or within a substrate, whether the substrate is a printed circuit board or a die, may be used. Thus, the transceiver 154 transmits through the dielectric region 162 via the antenna 166, while the base transceiver 158 receives through the antenna 170. These transceivers, particularly referred to herein as substrate transceivers, refer to transceivers designed to communicate over a dielectric substrate, such as the transceiver shown in fig. 3.

It is noted that, whether or not the metal layer 174 is included, the dielectric substrate 162 is defined by a bounded volume (bounded volume), equivalent to an electromagnetic waveguide, and is also referred to herein. In general, it is desirable for the dielectric substrate 162 to have as uniform a structure as possible to reduce interference within the dielectric substrate 162. For example, metal or other components within the dielectric substrate 162 will tend to create multipath interference and/or absorb electromagnetic signals, thereby reducing transmission efficiency. Then, using a dielectric substrate that is as uniform or consistent as possible, low power signal transmission can be used for short range communications.

Fig. 4 is a functional block diagram of a substrate including a plurality of embedded substrate transceivers in accordance with another embodiment of the present invention. As can be seen, the substrate 180 includes a dielectric substrate region 184 that includes embedded substrate transceivers 188 and 192 for communicating with each other. As shown, the base transceiver 188 includes a base antenna 196, and the base transceiver 192 includes a second base antenna 198.

The substrate transceivers 188 and 192 are disposed within the dielectric substrate 184, as are their respective antennas 196 and 198, for transmitting the uhf electromagnetic signals through the waveguide formed by the dielectric substrate 184. As described in connection with fig. 3, the metal layer is optional and not necessary.

Generally, although no metal layer is required on the upper or lower layers of the substrate, the metal layer helps to isolate the electromagnetic signals within the waveguide to reduce interference of these signals with external circuitry or signals from external circuitry with the electromagnetic signals transmitted through the waveguide. The boundaries of the dielectric substrate reflect the radio frequencies of the electromagnetic signals to keep the signals within the dielectric substrate 184 and thus minimize interference with external circuitry and devices on or within the dielectric. The substrate antenna is sized and positioned to transmit signals only through the dielectric substrate 184.

Figure 5 is a functional block diagram of a substrate including a plurality of embedded substrate transceivers surrounded by integrated circuit modules and circuitry according to one embodiment of the present invention. It can be seen that the substrate 200 includes an embedded substrate transceiver 204 for communicating with the substrate transceiver 208 via substrate antennas 212 and 216, respectively. The transceiver 204 is embedded within a dielectric substrate 220, while the transceiver 208 is disposed on a surface of the dielectric substrate 220.

Electromagnetic signals are transmitted from the transceivers 204 and 208 through the substrate antennas 212 and 216 for transmission through the dielectric substrate 220. In the embodiment shown in the figures, the dielectric substrate 220 is bounded by a metal layer 222, which metal layer 222 also shields electromagnetic signals transmitted through the waveguide formed by the dielectric substrate 220. As can be seen, the dielectric substrate 220 is surrounded by IC modules 224, 228 and 232. In the illustrated embodiment of substrate 200, one typical application is a printed circuit board, in which a dielectric substrate is formed inside the printed circuit board, followed by metal layer 222 and supporting ICs 224, 228 and 232. The metal layer 222 not only serves as a shield, but also serves to help the IC modules 224, 228, and 232 conduct signals. For example, the transceiver 208 is used to support communication for the IC module 224, and the transceiver 204 is used to support communication for the IC module 228.

Figure 6 is a functional block diagram of a substrate including a plurality of transceivers configured to communicate through waveguides formed within the substrate, in accordance with one embodiment of the present invention. As can be seen, the substrate 250 includes a plurality of transceivers 252, 254, 256, 258, 260, and 262. Each transceiver 252-262 has associated circuitry not shown in the figures, and the transceivers 252-262 may be disposed within or on top of a dielectric layer into which their associated antennas extend. As can be seen, the substrate 250 includes a plurality of waveguides formed therein for conducting particular communications between particular transceivers. For example, the waveguide 264 is configured to support communication between the transceivers 252 and 254, and the waveguide 266 supports communication between the transceivers 254, 256, 262, 260, and 258.

Some other noteworthy configurations are also proposed. For example, waveguide 268 supports transmission from transceiver 252 to transceivers 258 and 260. Alternatively, due to the shape of the waveguide 268, each of the transceivers 258 and 260 can only transmit to the transmitter 252 through the waveguide 268. Another configuration according to one embodiment of the present invention is waveguides 270 and 272. As can be seen, waveguide 270 overlaps waveguide 272, where waveguide 270 supports communication between transceivers 260 and 256, and waveguide 272 supports communication between transceivers 254 and 262. In at least this example, waveguides 270 and 272 overlap but are spaced apart from each other to prevent electromagnetic radiation therein from interfering with electromagnetic radiation of other waveguides.

In general, waveguides within substrate 250 support communication in multiple directions between associated transceivers. In the embodiment shown in fig. 6, the substrate may be a board, such as a printed circuit board, or may be an integrated circuit in which each transceiver is a transceiver module or module within the integrated circuit. In this embodiment, the waveguide is formed of a dielectric substrate material and has a boundary to contain and isolate electromagnetic signals transmitted therethrough. Furthermore, as in the previous embodiments, the frequency of the electromagnetic signal is an ultra high radio frequency on the order of 10 GHz. In one particular embodiment, the frequency is 60GHz (+/-5 GHz). It is a feature of this embodiment of the invention that the transceiver may communicate to a desired transceiver via another transceiver. For example, if the transceiver 252 wishes to transmit a communication to the transceiver 256, the transceiver 252 may choose to transmit the communication signal via the transceiver 254 over the waveguides 264 and 266 or the transceiver 260 over the waveguides 268 and 270.

FIG. 7 is a flow diagram of a method according to one embodiment of the invention. The method includes initially generating an ultra high radio frequency signal of at least 10GHz in step 280. In one embodiment of the invention, the ultra high radio frequency signal is a 60GHz (+/-5GHz) signal. Thereafter, the very high rf signal is transmitted at very low power from the base antenna connected to the base transceiver, step 284. Since the electromagnetic radiation of the signal is through the substrate rather than through space, less power is required. Furthermore, since the substrate acts as a waveguide with little or no interference, less power is required since no power is consumed to overcome the apparent interference. Thereafter, in step 288, the vhf signal is received at a second base antenna connected to a second base transceiver. Finally, in step 292, the signal received from the substrate antenna is sent to logic or a processor for further processing. In summary, the method of fig. 7 involves electromagnetic signal transmission through the substrate of a printed circuit board, a board housing an integrated circuit or die, or even an integrated circuit substrate material. In summary, the substrate is formed of a dielectric material and functions as a waveguide.

Fig. 8 is a functional block diagram of a substrate 300 showing a three-stage transceiver, in accordance with one embodiment of the present invention. As can be seen, the base transceiver 302 is disposed on a surface of a dielectric substrate to communicate with the base transceiver 304 through the dielectric substrate 308. The base transceiver 304 is also in communication with a base transceiver 312, which base transceiver 312 is also disposed on the surface of the dielectric substrate 308. The substrate transceiver 304 is embedded within a dielectric substrate 308. To reduce or eliminate interference between communication signals between the base transceivers 312 and 304, a dielectric substrate 316, separated by an isolation boundary 322, is used between the base transceivers 312 and 304 to convey communications as compared to communications between the base transceivers 302 and 304. In one embodiment of the invention, the isolation boundary is formed of metal.

In another embodiment, the isolation boundary is simply a different type of dielectric or other material, creating a boundary to reflect electromagnetic radiation away from the surface of the dielectric substrate containing the electromagnetic signal. In this case, the dielectric, here an isolation boundary within the dielectric substrate 308, is used to define a volume of the dielectric substrate 316 to create a waveguide between the substrate transceiver 304 and the substrate transceiver 312. In another embodiment, rather than creating spaced waveguides within the main dielectric substrate (here dielectric substrate 308), directional antennas are used to reduce or eliminate interference between signals directed to different substrate transceivers. For example, if each of the substrate transceivers shown in the figures uses directional antennas, interference may be substantially reduced by proper placement and arrangement of the substrate antennas, thereby avoiding the need to create isolated boundaries for multiple waveguides within the dielectric substrate.

Continuing with FIG. 8, a long-range communications transceiver 324 is provided for communicating with the base transceiver 302, and an in-system local transceiver 328 is provided for communicating with the base transceiver 312. In this embodiment, an intra-system or intra-device (intra-device) transceiver 328 is a local transceiver for short-range local wireless communication over the air with other local intra-device transceivers 328. Reference to "local" means that the wireless transmissions generated by the device are not sent to a transceiver external to the device housing the local transceiver.

In one embodiment, inefficient antennas may be used for communication between transceivers within the local device and between base transceivers. Because the transmission is to a local transceiver located on the same board, integrated circuit, or device, the required transmission distance is very small, allowing the use of locally inefficient antenna structures. Further, in one embodiment, the inefficient antenna structure has electromagnetic properties that support desired operation in high frequency bands by using very high radio frequencies of at least 10GHz and using frequency bands close to 55GHz to 65 GHz.

Remote communications transceiver 324, on the other hand, is used to communicate with remote transceivers external to the device housing substrate 300. Thus, for example, if the in-device transceiver 328 is to receive short-range wireless communications from another local in-device transceiver, the in-device transceiver 328 may conduct the received signal to the base transceiver 312, and the base transceiver 312 then transmits the signal to the base transceiver 304 through the dielectric base 316, and the base transceiver 304 then transmits the signal to the base transceiver 302 for transmission to the remote communications transceiver 324. The network/device transceiver 324 may then transmit the communication signal in the form of electromagnetic radiation to a remote wireless transceiver.

It should be understood that the above-described operation is one example of the block diagram corresponding to fig. 8. Alternatively, the communication signals may be relayed through more or fewer base transceivers to transmit the communication signals from one location to another. For example, in another embodiment, only base transceivers 312 and 302 are used for such communication to communicate signals from in-device transceiver 328 to long-range communication transceiver 324 or vice versa.

Generally, the block diagram shown in fig. 8 illustrates a three-stage transceiver. The primary substrate transceiver is used to transmit electromagnetic signals at very high radio frequencies through a dielectric substrate formed within a board housing an integrated circuit or die, within an integrated circuit board, or even within an integrated circuit substrate. The second level transceiver is an in-device local transceiver, such as in-device transceiver 328, for generating very short range wireless communication signals over the air to other local in-device transceivers. As previously mentioned, such local transceivers are used for local communication within a particular device. Finally, the third tier transceiver is a long range communications transceiver 324, which is a long range transceiver for wireless communications with a remote device external to the device housing the substrate 300.

Figure 9 is a functional block diagram of a multi-chip module formed in accordance with one embodiment of the present invention. As can be seen, multi-chip module 330 includes multiple dies, each die containing multiple substrate transceivers and at least one intra-device local transceiver. Further, at least one of the dies includes a remote communications transceiver for communicating with a remote device. While a multi-chip module may not require a telecommunication transceiver to communicate with other remote devices, the embodiment shown in fig. 9 incorporates such a telecommunication transceiver.

As can be seen, each die is separated from adjacent die by an isolator (spacer). Thus in the embodiment shown, there are four die, separated by three spacers. Each die includes two substrate transceivers for communicating through the dielectric substrate acting as a waveguide. In addition, at least one base transceiver is communicatively coupled to an in-device transceiver to transmit a wireless communication signal over the air to another in-device local transceiver within the multi-chip module in fig. 9.

In one embodiment of the invention, at least one in-device local transceiver is used to generate a transmission signal at a power level sufficient to reach another in-device transceiver within the device (rather than external to the multi-chip module). The antenna for the base transceiver is not shown in the figures for simplicity and clarity, but the base antenna may be formed as described elsewhere in this application.

In addition, each local transceiver within the device includes an illustrated antenna for local wireless transmission over the air. In this embodiment, wireless communication within the multi-chip module of FIG. 9 occurs at a frequency of at least 10GHz, and in one embodiment, at about 60 GHz. As shown, the remote transceiver may operate at about the same frequency or a different frequency depending on design preferences and depending on the remote device with which the multi-chip module of FIG. 9 is intended to communicate.

With continued reference to fig. 9, it should be understood that each of the embodiments described above for the base and base transceivers may be used within the multi-chip module of fig. 9. Thus, a particular substrate may have more than two substrate transceivers, either disposed on the upper portion of the substrate or within the substrate. Also, the antenna for the substrate transceiver, i.e., the substrate antenna, may be disposed on the substrate surface or at least partially extend into the substrate to transmit electromagnetic signals therein. In addition, a plurality of waveguides are formed within the substrate to conduct electromagnetic signals therein from one desired substrate transceiver antenna to another desired substrate transceiver antenna.

In operation, as an example, one substrate transceiver of a die uses the substrate to generate communication signals to another substrate transceiver for transmission to an in-device local transceiver for subsequent transmission over the air to another substrate, and more particularly to an in-device local transceiver disposed on another substrate. As will be described in detail later, a particular addressing scheme may be used to direct communications to a particular in-device local transceiver for further processing. For example, if the communication signal is intended for transmission to a remote device, such processing of the communication signal may cause the remote transceiver to receive the communication signal through one or more of the substrate, the substrate transceiver, and the local transceiver within the device.

Continuing with fig. 9, it is noted that in addition to transmitting signals at a lower power level through the substrate, the power level of wireless transmissions between local transceivers within the device may also be set at a relatively lower power level. Further, higher order modulation may be used based on the type of transmission. For example, for transmission through a waveguide within the substrate, the highest order modulation may be used. For example, the signal may be modulated as a 128QAM signal or a 256QAM signal. Alternatively, the modulation may still be high for local transceiver transmissions within the device, such as 64QAM or 128QAM, but not necessarily the highest order modulation. Finally, for transmissions from the remote transceiver to the remote device, a more general modulation level, such as QPSK or 8PSK, may be used depending on the expected interference conditions of the device.

In one embodiment of the invention, at least one die is a flash memory chip, located in the same device as the processor. The in-device transceiver is used to establish a high data rate communication channel to serve as a memory bus. As such, there is no longer a need to route from the flash die to the processor die using traces or cables. Thus, the leads shown in fig. 9 represent power supply lines for providing operating power to each die. Thus, at least some of the die use wireless data links to reduce the need for pin-out and trace routing. As shown further in fig. 9, other application specific devices may be included. For example, one die may include logic dedicated to other functions or purposes.

One feature of the embodiments shown in fig. 8 and 9 is that a remote device can access any particular circuit module within the device to communicate with the device by communicating via a remote communications transceiver, and in turn via an intra-device and/or substrate transceiver within the device or integrated circuit. Thus, in one embodiment, a remote tester is used to communicate through a remote communications transceiver of a device housing the substrate of FIG. 8 or the multi-chip module of FIG. 9, and then through a communicatively connected in-device transceiver to test any or all of the circuit modules therein. Alternatively, the remote device may use the remote transceiver or an intra-device and/or sub-local transceiver to access any resource within the device. For example, a remote device may access a memory device, a processor, or a particular application (e.g., a sensor) through a series of communication links. For a further explanation of these concepts, reference may also be made to fig. 25 and 26.

Fig. 10 is a flow diagram of a method of communicating according to one embodiment of the invention. The method includes generating a first radio frequency signal to be received by a local transceiver disposed within the same die in step 340. In step 344, a second radio frequency signal is generated for reception by a local transceiver disposed within the same device. Finally, in step 348, the method includes generating a third radio frequency signal for receipt by a remote transceiver external to the same device based on one of the first and second radio frequency signals.

In one embodiment of the invention, the first, second and third radio frequency signals are generated at different frequency ranges. For example, the first RF signal is generated at 60GHz, the second RF signal is generated at 30GHz, and the third RF signal is generated at 2.4 GHz. Alternatively, in one embodiment of the present invention, the first, second and third rf signals are generated at very high and substantially the same frequency. For example, each radio frequency signal is a 60GHz (+/-5GHz) signal. It should be understood that these frequencies refer to carrier frequencies and can be fine-tuned to define a particular communication channel using frequency division multiple access type techniques. More generally, then, at least the first and second radio frequency signals are generated at frequencies at least 10GHz high.

Figure 11 is a schematic diagram of an in-substrate transceiver arrangement according to one embodiment of the present invention. As can be seen, the substrate 350 includes a plurality of transceivers 354, 358, 362, 366, and 370, disposed at designated locations relative to one another to support the desired communication therebetween. More specifically, transceivers 354 and 370 are placed in the peak region and the null region depending on whether a communication link is desired between the respective transceivers. The white areas in the concentric circle regions show negative signal components for forming null signals, while the shaded areas show positive signal components for forming signal peaks.

More specifically, it can be seen that the transceiver 354 is located within its own transmitted peak region, which is shown generally at 374. In addition, there is a peak region at 378. The null signal regions are shown as 382 and 386. The peak regions 374 and 378 and the null signal regions 382 and 386 are associated with the transceiver 354. Of course, each transceiver has its own associated peak and null signal regions, formed around its own transmit antenna. One feature of fig. 11 is that the transceivers are positioned relative to each other in the peak region and the null region depending on whether a communication link is desired between the respective transceivers.

One feature of the embodiment of fig. 11 is that the device may change frequencies to obtain corresponding null signals and peak patterns for communication with a particular antenna. As such, if the transceiver 354 desires to communicate with the transceiver 366 (which is located in the null signal region for the frequencies used to generate the null signal and the peak pattern shown in fig. 11), the transceiver 354 changes to the new frequency, generating the peak pattern at the location of the transceiver 366. As such, if a dynamic frequency allocation scheme is used, the frequency may be predictably changed to support the desired communication.

Fig. 12 is a schematic diagram of another embodiment of a substrate 350 including the same circuit elements as shown in fig. 11, but also including a plurality of embedded waveguides between each transceiver for conducting specific communications therebetween. As can be seen, the transceiver 354 communicates with the transceiver 358 through the dedicated waveguide 402. Likewise, the transceiver 354 communicates with the transceiver 362 through the dedicated waveguide 406. As such, for the transceiver 362, the peak region 394 and the null region 398 are located within the isolated substrate waveguide 390.

Waveguide 390 connects communications between transceivers 362 and 370. While the corresponding multipath peaks and null signal areas in fig. 11 are copied to fig. 12 for the transceivers 354, it should be understood that electromagnetic signals are being transmitted between the transceivers via corresponding waveguides in one embodiment of the invention. Again, it should be seen that the actual peak and empty signal regions within the contained waveguides may be different from that of the common substrate 350, but correspond as shown without further detail. Those skilled in the art will recognize that the corresponding peak and null signal regions of the isolated waveguides 402,406, and 390 are for communication purposes that take advantage of the operating characteristics of these waveguides.

FIG. 13 is a flow diagram of a method according to one embodiment of the invention. The method includes initially generating a radio frequency signal for setting a first particular local transceiver within expected electromagnetic peaks of the generated radio frequency signal in step 400. The expected electromagnetic peak is the multipath peak in which the multipath signals add. The generated signal is then transmitted from an antenna formed in the substrate (provided for communication through the waveguide) in step 404. The substrate may be a board, such as a substrate of a printed circuit board, or a substrate of a die, such as an integrated circuit die.

The method also includes generating a wireless transmission to be transmitted to a second local transceiver via the same or different and isolated waveguide in step 408. Optionally, the method of fig. 13 includes transmitting a communication signal to the second local transceiver over the at least one trace in step 412. It will be seen that the transmission is not particularly limited to the radiation of electromagnetic signals through air or waveguides, but may more generally be through a substrate material such as a dielectric substrate.

Fig. 14 is a functional block diagram of an integrated circuit multi-chip device and associated communications in accordance with one embodiment of the present invention. As can be seen, the apparatus 450 includes a plurality of circuit boards 454, 458, 462, and 466, where each circuit board houses a plurality of die, which may be packaged or integrated thereon. The apparatus shown in fig. 14 represents an apparatus having multiple printed circuit boards, or a multi-chip module having multiple printed circuit dies separated by spacers. The circuit board 454 includes transceivers 470, 474, and 478 for communicating with each other through local transceivers. In one embodiment of the present invention, the local transceiver is a substrate transceiver, and the electromagnetic radiation is generated by a waveguide within the circuit board 454.

As previously described, circuit board 454 may be a board, such as a printed circuit board, that includes a dielectric substrate to function as a waveguide, or may be an integrated circuit that includes a dielectric waveguide to conduct electromagnetic radiation. Alternatively, transceivers 470, 474, and 478 may communicate through local transceivers within the devices, transmitting over the air but only for short distances. In one embodiment of the invention, the transceiver in the local device is a 60GHz transceiver with a very short wavelength and a very short range, especially when low power is used for transmission. In the illustrated embodiment, the selected power will be suitable for electromagnetic radiation to cover the desired distance, but need not extend beyond a very large distance.

As can be seen, the transceiver 470 may communicate with a transceiver 482 disposed on the board 458 and with a transceiver 486 disposed on the board 458. In this case, an in-device wireless transceiver for over-the-air transmissions is required because the transceivers 470 and 482 and 486 are located on different boards or integrated circuit dies. Likewise, the transceiver 478 communicates with a transceiver 490 disposed on the board 466. As previously described, transceiver 478 and transceiver 490 communicate using an in-local-device wireless transceiver. It can also be seen that the local in-device transceiver 494 on the board 462 communicates with a local in-device transceiver 498 which also includes an associated remote transceiver 502 for communicating with remote devices. As can be seen, remote transceiver 502 and local transceiver 498 are communicatively coupled. Thus, device 450 may communicate with an external remote device through transceiver 502.

In one embodiment of the invention, each board 454, 458, 462, and 466 is a completely leadless board that primarily provides structural support for the die and integrated circuit. In this embodiment, chip-to-chip communication is performed through waveguides disposed between the various integrated circuits or dies, or over the air via a local intra-wireless device transceiver. Or in another embodiment, if each board 454, 458, 462, and 466 represents an integrated circuit board, communications occurring through traces and leads on the printed circuit board may be augmented and supplemented, whether the wireless communications are through the substrate or through the air.

One feature of the device 450 shown in fig. 14 is interference that occurs between the various wireless transceivers. Although transmission through the waveguide via the dielectric substrate can be isolated from other wireless transmissions, there is still a significant amount of wireless transmission through the air that can interfere with all other wireless transmissions within device 450. Accordingly, it is an aspect of the present invention to provide an apparatus for reducing interference within device 450 using frequency division multiple access.

Fig. 15 is a functional block diagram of the operation of one embodiment of the present invention for communicating within a device using frequency division multiple access. As can be seen from the embodiment shown in FIG. 15, the device 500 includes an in-device local transceiver A, using f₁And f₂The carrier frequency communicates with in-device local transceivers B and C. Similarly, local transceivers B and C in the device use f₃The carrier frequency is used for communication. In-device local transceiver B also uses f₄And f₅The carrier frequency communicates with in-device local transceivers D and E. In-device local transceivers D and E use f₆The carrier frequency is used for communication. Because of spatial diversity (including differences in distance), some of the frequencies may be reused depending on the design. Due to the fact thatHere, it can be seen that f₁The carrier frequency may be used between local transceivers C and E, and between C and G, within the device, and f₇The carrier frequency may be used for communication between local transceivers C and F in the device, F₈The carrier frequency may be used for communication between local transceivers E and F and D and G within the device. Finally, the in-device local transceivers F and G use F₂Carrier frequency communication. It can be seen that, therefore, f₁、f₂And f₈The carrier frequency signal is reused in the frequency plan of the embodiment shown in fig. 15.

Another feature of the topology shown in fig. 15 is that, depending on the application, there is a substrate transceiver within each die or transceiver that also uses a designated carrier frequency for transmission through the dielectric substrate waveguide. In fig. 15, the carrier frequency is simply referred to as f_s. It should be understood that f_sBut may be another different carrier frequency f₉(not shown in the figure) or f₁To f₈Any one of them.

As previously described, the substrate transceiver transmits wireless transmission through the substrate in which the waveguide is formed to be connected to the circuit portion. In this case, as shown in fig. 15, for transmission to the in-device local transceiver D and thus to the remote transceiver H, a pair of local base transceivers are used to transmit communication signals received by the in-device local transceiver D to the remote transceiver H for propagation as electromagnetic signals over the air to the other remote transceiver.

Generally, in the frequency allocation plan for the embodiment shown in fig. 15, the transceivers are statically positioned relative to each other. Thus, roaming and other similar problems do not exist. Thus, in one embodiment, carrier frequencies are permanently or statically assigned to particular communications between designated transceivers. As such, fig. 16 illustrates a table that provides an example of a static or fixed allocation of carrier frequencies for particular communications between local transceivers, base transceivers and other transceivers within a device for a particular device. For example, f₁A carrier frequency is assigned to communications between transceivers a and B.

A carrier frequency is allocated for each communication link between a particular transceiver pair. As described in connection with fig. 15, in one embodiment of the invention, spatial diversity may specify which carrier frequencies may be reused, if desired. As can be seen from the figure, the embodiment of fig. 16 provides a specific and new carrier frequency for communication between specific base transceivers, e.g. between base transceiver M and base transceiver N, and between base transceiver M and base transceiver 0. This particular example is particularly advantageous where three or more substrate transceivers are within a single substrate, whether the substrate is an integrated circuit or a printed circuit board. Thus, frequency diversity may be used instead of isolated waveguides to reduce interference.

Also as shown in fig. 15, a plurality of dashed lines may be seen for connecting a plurality of in-device local transceivers. For example, a common set of dashed lines connects transceivers A, B and C. On the other hand, dashed lines are used to connect transceivers C and G, C and F and G and F. Each dashed line shown in fig. 15 represents a possible lead or trace for transmitting low bandwidth data and supporting signaling and power. Thus, wireless transmission can be used to augment and augment the communication that a physical trace has. This is particularly relevant for embodiments where multiple transceivers are provided on one or more printed circuit boards.

One feature of such system designs is that wireless transmissions can be used for higher bandwidth communications within the device. For example, for short-range wireless transmissions where interference is not an issue, higher order modulation techniques and types may be used. Thus, as shown in fig. 16, there is an exemplary frequency modulation type assignment for a particular communication. For example, for the wireless communication link between transceiver A, B, C, D, E, F and G, the frequency modulation type using 128QAM or 64QAM for the corresponding communication link is specified. However, for the communication link between local transceivers G and D within the device, 8QAM is specified as the frequency modulation type to reflect greater distance and possibly more interference within the signal path. On the other hand, for wireless communication links between substrate transceivers, the highest order modulation known, i.e., 256QAM, is assigned for use because the wireless transmission is through a substrate waveguide with little to no interference and is power efficient. It should be understood that the assigned modulation types for the various communication links are merely examples, which may be modified as tested in accordance with actual expected circuit conditions. However, a point to note in this embodiment is that alternatively, the frequency subcarriers and the frequency modulation type may be statically allocated for a particular wireless communication link.

Fig. 17 is a functional block diagram of a device 550 housing multiple transceivers and operating in accordance with an embodiment of the present invention. As shown in fig. 17, a pair of substrates 554 and 558 each include a plurality of substrates disposed thereon, with a plurality of transceivers further disposed thereon. More specifically, substrate 554 includes substrates 562, 566, and 570 disposed thereon. The substrate 562 includes transceivers 574 and 578 disposed thereon, and the substrate 566 includes transceivers 582 and 586 disposed thereon. Finally, substrate 570 includes transceivers 590 and 594 disposed thereon. Likewise, base 558 includes bases 606, 610, and 614.

Substrate 606 includes transceivers 618 and 622, and substrate 610 includes transceivers 626 and 630 disposed thereon. Finally, the substrate 614 includes transceivers 634 and 638 disposed thereon. Operationally, there are many notable aspects of the embodiment shown in FIG. 17. First, transceivers 574 and 578 communicate over substrate 562, or over the air using an assigned carrier frequency f₂Communication is performed. Although not specifically shown, the transceivers 574 and 578 may be stacked transceivers, as previously described, or may simply include multiple transceiver circuit assemblies supporting wireless communication over the air and wireless communication over the substrate 562. Likewise, base 566 includes base transceivers 582 and 586 for using carrier frequency f through base 566_sFor communication, and substrate 570 includes transceivers 590 and 594 for using carrier frequency f through substrate 570_sCommunication is performed.

As can be seen in the figure, the transceiver 590 of the substrate 570 and the transceiver 578 of the substrate 562 communicate by transmitting wireless communication links over the air (as opposed to through the substrate). On the other hand, the substrate 562 and the substrate 566 each include a substrate transceiver 598 and 602, respectively, for communicating through the substrate 554. In this way, layered-based communications can be seen in addition to wireless local communications over the air. As can also be seen, the transceiver 578 of the substrate 562 is in communication with the transceiver 634 of the substrate 614 disposed over the substrate 558. Likewise, transceiver 634 communicates with transceiver 622 disposed on substrate 606 by transmitting electromagnetic signals over the air. Transceivers 622 and 618 communicate through substrate 606, and transceivers 626 and 630 communicate through substrate 610. Finally, transceiver 634 communicates with transceiver 638 through substrate 614.

Although not shown, it will be appreciated that any of these transceivers may communicate with other transceivers, and may include or be replaced by a remote transceiver to communicate with other remote devices via a conventional wireless communication link. With respect to the frequency allocation plan, it can be seen that the frequency f₁Is allocated to the communication link between transceivers 578 and 634, and carrier frequency f₂Is allocated for transmission between transceivers 574 and 578. Carrier frequency f₃Is allocated for transmissions between transceivers 578 and 590, and between transceivers 622 and 634. Here, spatial diversity and a specified power level are used to guarantee the carrier frequency f₃Do not interfere with and conflict with each other.

Another feature of this embodiment of the invention is that the carrier frequencies may also be dynamically allocated. This dynamic allocation may be achieved by evaluating and detecting existing carrier frequencies and then allocating new unused carrier frequencies. Such methods include, for example, frequency detection reporting between individual transceivers so that logic associated with any transceiver can determine which frequency to assign for a pending communication. Relevant considerations needed to make such dynamic frequency allocations include the power level of the transmission, whether the transmission is made with a local in-device transceiver or a remote transceiver, whether the detected signal is from another local in-device transceiver or a remote transceiver.

Fig. 18 is a flow diagram of a method of wireless transmission within an integrated circuit using frequency division multiple access in accordance with one embodiment of the present invention. The method includes, in step 650, the first local transceiver generating and transmitting a communication signal to the second local transceiver using a first particular carrier frequency. In step 654, the method further includes transmitting, within the first local transceiver, a communication signal to a third local transceiver using a second specific carrier frequency, wherein the second local transceiver is disposed within the integrated circuit or within a device housing the integrated circuit.

The local transceiver is mainly a transceiver arranged in the same integrated circuit, a printed circuit board or equipment. As such, the communication signals that use frequency diversity are signals that are specific to the local transceiver and, in most embodiments, refer to low power, high frequency radio frequency signals. The typical frequency of these local communications is at least 10 GHz. In one embodiment, the signal is characterized by a 60GHz carrier frequency.

These high frequency wireless transmissions include electromagnetic radiation through the air or through a substrate, and more particularly, through a waveguide formed within a die of an integrated circuit or within a dielectric substrate in a board (including but not limited to an integrated circuit board). Thus, in step 658, the method further includes transmitting a communication signal from a fourth local transceiver connected to the first local transceiver to a fifth local transceiver disposed to communicate through the substrate, through a waveguide formed within the substrate.

In one embodiment of the invention, the fourth local transceiver uses a fixed allocated carrier frequency for transmission through the waveguide. In a different embodiment of the invention, the fourth local transceiver uses a determined carrier frequency for transmission through the waveguide, wherein the determined carrier frequency is selected to match the carrier frequency transmitted by the first local transceiver. The benefit of this approach is the reduction of the frequency conversion step.

With respect to the carrier used for electromagnetic radiation over the air to other local transceivers, in one embodiment, the first and second carrier frequencies are statically assigned, fixed. In another embodiment, the first and second carrier frequencies are dynamically assigned based on detected carrier frequencies. The benefit of using dynamically allocated carrier frequencies is that interference can be further reduced or eliminated by using frequency diversity to reduce the likelihood of collisions or interference. But has the disadvantage that more overhead is required because this embodiment incorporates logic for communicating the identified carrier frequency or channel between the local transceivers to coordinate the selection of the frequency.

Fig. 19 is a functional block diagram of an apparatus and corresponding method of wireless communication within the apparatus to avoid collisions and interference by coordinating communications using a collision avoidance mechanism in accordance with one embodiment of the present invention. More specifically, the figure shows a plurality of local transceivers for local communication and at least one remote transceiver for remote communication mounted on an integrated circuit or on a device board having a plurality of integrated circuit local transceivers.

Collision avoidance mechanisms for communications include very high radio frequency signals at frequencies greater than or equal to 10GHz for local transceiver communications between local transceivers disposed within the same device and even within the same support substrate. As shown in fig. 19, a plurality of local transceivers are shown, generating wireless communication signals to other local transceivers located on the same board or integrated circuit, or to local transceivers located on adjacent boards (not shown in fig. 19) within the same device.

In addition to the example shown in fig. 19, see also other schematic diagrams in the present application that may support this collision avoidance mechanism. For example, fig. 9, 14, 17 show a plurality of boards/integrated circuits (collectively "support substrates") each containing a local transceiver to communicate with other local wireless transceivers. In one embodiment, at least one support substrate (board, printed circuit board, or integrated circuit die) is used to support transceiver circuitry including one or more transceivers thereon. For embodiments of the present invention, at least three substrate transceivers are disposed on one or more supporting substrates, which may be boards that support and power only integrated circuits, printed circuit boards that support integrated circuits and other circuits, or integrated circuits that include wireless transceivers.

For purposes of illustration, the embodiment of fig. 19 includes first and second support substrates 700 and 704 for supporting circuitry including transceiver circuitry. The first wireless transceiver integrated circuit 708 is supported by the substrate 700, while the second, third and fourth wireless transceiver integrated circuit dies 712, 716 and 720, respectively, are disposed on and supported by the second support substrate 704.

At least one in-device local transceiver is formed on each of the first, second, third and fourth wireless transceiver integrated circuit die 708-.

The first and second intra-device local transceivers use a particular collision avoidance mechanism for wireless communication with the intra-device local transceivers. More specifically, in the embodiment of fig. 19, the collision avoidance mechanism comprises a carrier sense multiple access scheme in which the local transceivers in the first and second devices each transmit a request-to-send signal and do not begin transmitting until a clear-to-send response is received from the opposing receiver. Therefore, in the present embodiment, each local transceiver transmits a request-to-send signal to a specific local transceiver, which is a destination of a communication to be determined (a receiver of the communication), before starting data transmission or communication.

For example, the embodiment of fig. 19 shows a first local transceiver 724 transmitting a request-to-send signal 728 to a second local transceiver 732. In addition, each local transceiver also transmits a clear to send signal in response to receiving the request to send signal if there is no indication that the channel is in use. Thus, in the example of fig. 19, local transceiver 732 generates a clear to send signal 736 to local transceiver 724.

Another feature of the embodiment of fig. 19 is that each local transceiver that receives the clear to send signal 736 sets a timer to limit the progress of the transmission for a particular period of time. As such, each local transceiver that detects the clear to send signal 736 restricts further transmission or delays for a certain period of time despite the clear to send signal 736 being transmitted by local transceiver 732 to local transceiver 724.

In the example of fig. 19, local transceiver 732 also broadcasts the clear to send signal 736 to all local transceivers within its coverage area to reduce the likelihood of collisions. Thus, local transceiver 732 transmits a clear (via the associated base transceiver) to send signal 736 to local transceiver 740, also formed on die 712.

As can also be seen, local transceiver 744 can detect the clear to send signal 736 and can forward the clear to send signal 736 through the local transceiver to each local transceiver located on the same die 720. In the illustrated example, local transceiver 744 sends a clear to send signal 736 to transceiver 618 via a base transceiver within die 720.

In one embodiment, the request-to-send signal is generated only for packets exceeding a certain size. As another feature of an embodiment of the present invention, any one local transceiver that detects a clear to send signal response sets a timer to delay any transmission on the channel used to transmit the clear to send signal for a particular time period. In another embodiment of the invention, the local transceiver only listens for activity on a particular channel and transmits without detecting communication.

The collision avoidance mechanism in a different embodiment is a master/slave mechanism, similar to the master/slave mechanism used in personal area networks including the bluetooth protocol or standard devices. Thus, the local transceiver may control some communication as a master or act as a slave in participating master/slave protocol communications. Furthermore, the local transceiver may function as a master in one communication and a slave in another communication that is parallel and distinct.

Figure 20 is a functional block diagram of a substrate supporting multiple local transceivers according to an embodiment of the present invention. The support board 750 may support a plurality of integrated circuit wireless transceivers. In the described embodiment, the transceivers are in-device local transceivers that may communicate with each other using very high radio frequencies (at least 10 GHz). The support substrate may be any type of support board including a printed circuit board or even an integrated circuit containing (supporting) a plurality of local transceivers (in-device transceivers). In the illustrated embodiment, the primary collision avoidance mechanism is the master/slave implementation, controlling communications to avoid collisions and/or contention. As can be seen, for current operation, local transceiver 754 (an intra-device transceiver) may act as the master, controlling communication with transceivers 758, 762, 766 and 770. Transceiver 770 acts as a slave in communication with transceiver 754 or a master in communication with transceiver 774.

Although the collision avoidance mechanism employed in the embodiment shown in fig. 20 is a master/slave mechanism, it should be understood that the collision avoidance system described in connection with fig. 19, which includes a collision avoidance mechanism that transmits a request-to-send signal and a clear-to-send signal, may also be employed. In embodiments where the substrate is a board, such as a printed circuit board, the embodiment further comprises a plurality of transceivers within an integrated circuit supported by the board. For example, if integrated circuit 776 is an integrated circuit that includes in-device transceiver 766 and remote communications transceiver 778 and a plurality of base transceivers 782, 786, and 790, a collision avoidance mechanism will also be used for communications within integrated circuit 776, and any one of a similar or dissimilar collision avoidance mechanism may be employed.

For example, a master/slave mechanism may be used for an intra-device transceiver while a carrier sense mechanism is used to avoid collisions within integrated circuit 776. In addition, such mechanisms may also be assigned to other communications, including board-to-board (local transceiver on a first board to local in-device transceiver on a second board) communications. In addition, the remote communication transceiver 778 may also use any known collision avoidance mechanism for remote communication (communication with a remote device). For communications that are not separated by frequency diversity (FDMA transmission), space diversity (directional antenna), or code diversity, the use of carrier sensing and master/slave mechanisms is particularly advantageous to avoid collisions between local transceivers within a device if a Code Division Multiple Access (CDMA) scheme is used.

Fig. 21 is a flow diagram of a method of wireless local transmission within a device in accordance with one embodiment of the present invention. The method includes, in step 800, a first local transceiver transmitting a request-to-send signal to a second local transceiver. In step 804, the method includes the first local transceiver receiving a clear to send signal generated by the second local transceiver, the signal being in response to the request to send signal. At step 808, after receiving the clear to send signal, it is determined to transmit a data packet to a second local transceiver, where the second local transceiver may be disposed within the integrated circuit or a device housing the integrated circuit.

In one embodiment of the invention the step of transmitting a request-to-send signal only occurs if the data packet to be sent exceeds a certain size. Finally, in step 812, the method includes receiving a clear to send signal from the third local transceiver and determining to delay for a specified period of time before any other transmission. In general, the method described in connection with fig. 21 is a carrier sensing scheme. Along this line, various variations on the carrier sensing scheme may be implemented. For example, in another embodiment, the detection of a request-to-send type signal may trigger a timer within each local transceiver that detects the request-to-send type signal in order to delay transmissions to avoid collisions. In yet another embodiment, the local transceiver only initiates a communication if no other communication is detected on a particular communication channel.

Fig. 22 is a functional block diagram of a device having a mesh network formed within a board or integrated circuit according to one embodiment of the present invention. As shown in fig. 22, each local transceiver supported by the substrate 820 serves as a node within a board-level mesh network for routing communication signals at very high radio frequencies from one local transceiver to another transceiver that is out of range for very short range transmissions. More specifically, a network formed within a device that includes local transceivers A, B, C, D, E, F, G and H may relay communications like a node-based mesh network, defining multiple paths between any two local transceivers. In the illustrated embodiment, each local transceiver includes a very high frequency radio transceiver for communicating with all local in-device transceivers within the same device. In one embodiment, the UHF local transceiver transmits at a frequency equal to at least 10 GHz. In one particular embodiment, the very high radio frequency signal is a 60GHz signal. The described embodiment includes a local transceiver that can transmit electromagnetic signals at low power, thereby reducing interference with remote devices located outside the device housing the board or integrated circuit (collectively "substrate") of fig. 22.

The plurality of local transceivers in fig. 22 form a mesh network of nodes that can evaluate transceiver loading as well as communication link loading. Thus, each local transceiver A-H can transmit, receive, and process load information to other local transceivers within the same device. Further, each local transceiver may make the next relay (send to the next intermediate node or local transceiver for forwarding to the final destination node or local transceiver) and routing decisions based on load information associated with the destination information (e.g., the final destination of the communication).

Fig. 23 is a flow diagram of a method for routing and forwarding communications between local transceivers operating as nodes of a mesh network within a single device in accordance with one embodiment of the present invention. The method includes initially generating a wireless communication signal within a first local transceiver of the integrated circuit intended for a particular second local transceiver and inserting one of an address or an ID of the second local transceiver within the wireless communication signal (step 830). As part of sending the communication to the second transceiver, the method includes determining whether to send the wireless communication signal to a third local transceiver for direct forwarding to the second local transceiver or to a fourth local transceiver for further forwarding (step 834). A next step includes transmitting the communication to the third local transceiver over the wireless communication link (step 838). The third local transceiver may be provided (located) on a different board, on a different integrated circuit on the same board or on the same integrated circuit. If on the same integrated circuit or board, the method may choose to transmit the communication through a waveguide formed within the same integrated circuit or board or support substrate (step 842). The method also includes receiving load information for a load of at least one communication link or at least one local transceiver (step 846). As such, the method includes making routing and next relay decisions based on the received load information (step 850).

The local transceiver presented in fig. 22 may thus perform a combination of the steps shown in fig. 23, or sub-steps thereof, as well as other steps, to support operation as a node within a mesh network. More specifically, the first local transceiver may forward communications as nodes within a mesh network, each node in the mesh network forming a communication link with at least one other node to forward communications. Communications received by the first local transceiver from a second local transceiver located on the same substrate may be forwarded to a third local transceiver located on the same substrate. The first local transceiver may also establish a communication link with at least one local transceiver disposed on a separate substrate, whether the separate substrate is a different integrated circuit disposed on the same board or a different integrated circuit disposed on a different board.

For example, each local transceiver, i.e., the first transceiver and the second transceiver, may select a downstream local transceiver to receive communications based on load. The load is evaluated against at least one of the integrated circuit or the communication link. In addition to specifying the destination address of the next destination of the communication (next relay), each initiator local transceiver may also specify the final destination address of the communication and may make transmission decisions based on the final destination address. Finally, it should be noted that the mesh communication path may be statically or dynamically determined. Thus, in embodiments where load conditions are evaluated, the route is determined dynamically. However, in another embodiment, the communication route may be statically determined in a fixed manner.

Fig. 24 is a flow diagram of a method of communicating within a device, wherein the communication is communicated over a mesh network within a single device, in accordance with one embodiment of the present invention. The method includes evaluating load information for at least one local transceiver or communication link between two local transceivers (step 860) and determining a next relay destination node (step 864), which includes the local transceiver within the device. The method then includes sending a communication to the next relay destination node, the communication including the final destination address of the local transceiver (step 868). Generally, the determination of the next relay destination node is made based on the load information and the final destination of the communication. For a particular route of communication, communication links may be created between local transceivers disposed on the same substrate, between local transceivers disposed on different integrated circuits on the same board, and between local transceivers disposed on different integrated circuits on different substrates. A method may also optionally include the step of using at least one communication link between the local transceivers connected by a waveguide (formed within the substrate supporting the local transceivers) (step 872).

Figure 25 is a functional block diagram of a network operating according to one embodiment of the present invention. Network 900 includes a plurality of devices 904, 908, and 912, each of which communicates using a long-range communications transceiver 916. These communications may be made using any known communication protocol or standard, including 802.11, bluetooth, CDMA, GSM, TDMA, etc. The frequency used for such communication may also be a radio frequency used by any known specific communication protocol, specifically including 900MHz, 1800MHz, 2.4GHz, 60GHz, etc.

Within each device 904, 912, the local transceivers 920 within the devices communicate with each other at very high radio frequencies of at least 10GHz to provide access to specific circuitry within the devices. For example, the in-device local transceiver 920 may be used to provide access to the memory 924 or the processor 928 of the device 904, the processors 932, 936 of the device 908, or the processor 940 and the sensors 944 of the device 912. Further, access may also be provided through substrate communication using the substrate transceiver 948, whenever available. In the above embodiments, the substrate processor operates at an ultra high radio frequency of at least 10 GHz.

The frequencies used within each device may be statically or dynamically assigned as previously described. Further, the mesh network described herein may be used to route communications out of the device to provide access to particular circuit modules. In addition, the described collision avoidance mechanisms, including the use of a clear-to-send method or a master/slave method, may be used in order to reduce interference and collisions.

As an application of the various embodiments described above, the tester may use any combination of the long-range communications transceiver 916, the in-device local transceiver 920, or the base transceiver 948 to access any particular circuit module or component. As another application, inter-device and intra-device communication may be used for resource sharing. Thus, for example, a large memory device may be placed in one location, while a particular application device and computing device may be placed in another location. Such wireless communication may thus support remote access to the computing capabilities of the computing device, remote access to storage resources of the memory, or remote access to specific sensors of a particular application device. While fig. 25 shows different devices 904 and 912, it should be understood that some of these devices may also represent printed circuit boards or support boards housing a plurality of integrated circuit modules providing specific functions. For example, remote device 904 may communicate with two printed circuit boards 908 and 912 within the same device through a remote communications transceiver.

Fig. 26 is a flow diagram of a method of providing access to a particular circuit module using multiple wireless transceivers, according to one embodiment of the invention. The method includes establishing a first communication link between remote communication transceivers (step 950), establishing a second communication link between an intra-device communication transceiver or a base transceiver to establish a connection to a particular circuit module (step 954), and communicating with the particular circuit module to gain access to functionality provided by the particular circuit module (step 958). These steps include connecting the first and second communication links and, if necessary, translating the communication protocol from the first protocol to the second protocol and translating the frequency from the first frequency to the second frequency. As such, the remote device may access a particular circuit block to benefit from the functionality of that particular circuit block, or to obtain data, or to test one or more circuit blocks.

It will be understood by those within the art that the term "substantially" or "about," as may be used herein, provides an industry-accepted tolerance to the corresponding term. Such an industry-accepted tolerance ranges from less than 1% to 20% and corresponds to, but is not limited to, component values, integrated circuit process fluctuations, temperature fluctuations, rise and fall times, and/or thermal noise. It will be further understood by those within the art that the term "operably coupled", as may be used herein, includes direct coupling and indirect coupling via another component, element, circuit, or module where, for indirect coupling, the intervening component, element, circuit, or module does not modify the information of a signal but may adjust its current level, voltage level, and/or power level. As one of ordinary skill in the art will appreciate, inferred coupling (i.e., where one element is coupled to another element by inference) includes direct and indirect coupling between two elements in the same manner as "operably coupled".

The foregoing is a description of specific embodiments of the methods, systems, and components of the present invention. These examples are described for illustrative purposes only and are not intended to be limiting. Various other embodiments may be implemented and are within the scope of the invention. Implementation of other various embodiments will be apparent to those of ordinary skill in the art based on the description herein. Thus, the scope of the invention is not to be limited by any of the specific embodiments described above, but rather by the claims below. Moreover, the various embodiments shown in the figures may be combined in part to create embodiments not specifically mentioned but considered a part of the present invention. For example, a particular feature of any embodiment may be combined with another feature of another embodiment, or even combined with another embodiment as a whole, to form a new embodiment, which is also part of the scope of the invention. Also, the embodiments described in this application may be modified in any manner without departing from the scope of the invention.

Claims

1. A wireless transceiver structure, comprising:

a substrate region for use as a waveguide for an ultra-high radio frequency signal, wherein said substrate region defines a bounding volume for conducting and substantially containing said ultra-high radio frequency signal;

a first base transceiver communicatively coupled to the first base antenna;

a second base transceiver communicatively coupled to the second base antenna;

wherein the first and second base antennas are configured to transmit and receive radio frequency communication signals via the base region, and the base transceivers are arranged within the base such that the base transceivers are positioned in a peak region and a null region depending on whether a communication link is desired between the respective transceivers; wherein each transceiver has its own associated peak region and null signal region formed around its own transmit antenna.

2. The wireless transceiver structure of claim 1, wherein the base region comprises a substantially uniformly doped dielectric region.

3. The wireless transceiver structure of claim 1, wherein the first and second substrate antennas are sized for communicative coupling with the substrate area.

4. The wireless transceiver structure of claim 1, wherein at least one of the first and second base antennas is positioned adjacent to the base region and transmits the uhf signal via the base region.

5. The wireless transceiver structure of claim 1 wherein at least one of the first and second substrate antennas is formed to extend at least partially into the substrate region and communicatively couple to transmit the uhf signal through the substrate region.

6. A communications apparatus, comprising:

a support substrate provided with an electronic circuit device;

a guide structure having a preformed composition to guide radio frequency electromagnetic waves, the guide structure formed within the support substrate;

a first base transceiver communicatively coupled to the first base antenna;

a second base transceiver communicatively coupled to the second base antenna;

wherein the first and second substrate antennas are configured to transmit and receive radio frequency communication signals via the guide structure of the support substrate, the arrangement of the substrate transceivers within the substrate being such that the substrate transceivers are positioned in a peak region and a null region depending on whether a communication link is desired between the respective transceivers; wherein each transceiver has its own associated peak region and null signal region formed around its own transmit antenna.

7. The communications device of claim 6, wherein at least one of the first and second substrate antennas is positioned adjacent to and communicatively coupled to the guide structure of the support substrate to transmit signals via the guide structure of the support substrate.

8. The communications device of claim 6, wherein at least one of the first and second substrate antennas is formed to at least partially extend into the guide structure of the support substrate and is communicatively coupled to transmit signals via the guide structure of the support substrate.

9. A method of communicating within a support substrate having a waveguide formed therein, the method comprising:

generating a high-frequency radio frequency signal;

transmitting the high frequency radio frequency signal via the waveguide;

the placement of the base transceivers within the base is based on whether a communication link is desired between the respective transceivers, placing the base transceivers in a peak region and a null region; wherein each transceiver has its own associated peak region and null signal region formed around its own transmit antenna.

10. The method of claim 9, further comprising: transmitting the high frequency radio frequency signal from a first substrate antenna of a first substrate transceiver, wherein the first substrate antenna is communicatively connected to transmit the high frequency radio frequency signal via the waveguide.