HK1111127B - Processing method of fine structure and processing equipment for fine structure - Google Patents

Description

Method and apparatus for processing fine structure

Technical Field

The present invention relates to a method of processing a fine structure used for pattern formation of various devices integrated in the electronic field and the biological field, and a processing apparatus for the fine structure.

Background

Semiconductor integrated circuits, various recording media, biochips, and the like continue to be miniaturized and integrated, and mask patterns and the like employed for manufacturing the same are also being miniaturized and integrated. This trend has been further strengthened after the electronic pattern exposure means has partially replaced the optical means, and the importance of the processing method of the fine structure has been continuously increased. Following the increase in the aforementioned miniaturization and integration, the number of steps, time, and materials required to process the aforementioned fine structure are also increasing, resulting in a significant increase in cost.

In order to process the aforementioned fine structure, a step of pressing a stamper (mold) formed with a fine pattern on a resin (molding material) in a high-temperature state at a predetermined molding pressure and thereafter releasing the fine structure after the resin is cooled is inevitable. Shortening the cycle of heating and cooling the aforementioned resin is extremely effective for reducing the cost of processing the aforementioned fine structure. Therefore, in order to shorten the heating and cooling cycle, a printing apparatus has been proposed which obtains a heat insulating structure by reducing the cross-sectional area of a holding portion that holds the pressing surface of the stamper below the cross-sectional area of the pressing surface of the aforementioned stamper (japanese patent laid-open publication No.2004-288784 (patent document 1)). According to the foregoing printing apparatus, the heat capacity of the holding portion is reduced as compared with that of the previous printing press, thereby shortening the heating and cooling cycles.

Patent document 1: japanese laid-open patent publication No.2004-288784

Disclosure of Invention

Problems to be solved by the invention

In the foregoing printing apparatus, the holding portion of the pressing surface is heated and cooled together with the pressing surface. The molding pressure (pressing) is so high in the hot embossing and nano-imprinting that the aforementioned holding portion must have a hardness higher than a predetermined level to make the in-plane molding pressure uniform, and thus a predetermined mass and volume of a heat capacity of at least a predetermined value are required. Therefore, the time required for the heat cycle of the holding portion having a larger heat capacity than the molding material is dominant in the heat cycle, and the shortening of the cycle, i.e., the improvement of productivity is limited.

An object of the present invention is to provide a method of processing a fine structure capable of shortening the aforementioned heat cycle of heating and cooling, and a processing apparatus of a fine structure employed therefor.

Means for solving the problems

The processing method of a fine structure according to the present invention includes at least two opposed platens opposed to a mold for processing a molding material into a fine structure, and uses the at least two opposed platens when processing a single fine structure.

According to this method, the productivity can be improved by shortening the cycle of heating and cooling.

The processing apparatus of a fine structure according to the present invention includes a mold for processing a molding material into a fine structure, at least two opposed platens opposed to the mold, and a driving unit using the at least two opposed platens when processing a single fine structure.

According to another aspect, a processing apparatus according to the present invention is a processing apparatus of a fine structure, which processes a fine structure by sandwiching a molding material between a mold and a front surface of an opposed platen and pressing/molding the molding material, and the opposed platen has: a first block including a heating unit on a front surface; and a second block located on the rear surface to change a heat capacity of the opposing platen. The first block and the second block are provided so as to be relatively movable between a position where the first block and the second block are in contact with each other and other positions where the first block and the second block are separated from each other.

According to another aspect, a processing apparatus according to the present invention is a processing apparatus of a fine structure, which processes a fine structure by sandwiching a molding material between a mold and a front surface of an opposing platen and pressurizing/heating the molding material, the molding material is pressurized/heated/molded and a volume of the opposing platen when heated and a volume of the opposing platen when cooled are made different from each other.

According to still another aspect, a processing apparatus for a fine structure according to the present invention is a processing method for a fine structure, which processes a fine structure by sandwiching a molding material between a mold and an opposing platen and pressing/heating/molding the molding material, separates the opposing platen of the aforementioned portion upon heating of the aforementioned molding material, and then brings an exterior member into contact with the opposing platen when cooling the aforementioned molding material.

Further, the processing method or the processing apparatus based on the fine structure of the present invention includes a case of heating and cooling the mold and the molding material when finely processing the molding material.

Effects of the invention

According to the aforementioned method or the aforementioned apparatus, a fine structure can be processed with excellent productivity and excellent yield. In addition, the quality of the fine structure can be improved. The aforementioned drive unit may be in any form as long as it is a drive unit that enables the use of at least two opposing platens when a single fine structure is processed, and may be a unit that is capable of moving a platen, or a unit that moves a mold or moves a platen and a mold.

When the molding material is cooled, the total heat capacity of the opposed platen is reduced by reducing the volume of the opposed platen to physically release the heat stored in the opposed platen, so that the cooling rate of the opposed platen can be improved.

When the opposed platen is heated, the first block is heated, and when the opposed platen is cooled, the second block as an exterior member is in contact with the first block, thereby increasing the volume of the opposed platen at the time of cooling and transferring the heat provided in the first block to the second block, so that the cooling rate of the opposed platen can be improved.

In this way, by pressing/heating/molding the molding material so that the volume of the opposed platen at the time of heating and the volume of the opposed platen at the time of cooling are different from each other, the heating efficiency of the opposed platen and the cooling efficiency of the opposed platen are improved, which makes it possible to shorten the heat cycle of heating and cooling. Therefore, the productivity required for processing a fine structure can be improved.

After the second block of the opposed platen formed of the first block and the second block at the time of heating the molding material is separated at the time of cooling the molding material, the third block as an exterior member is brought into contact with the first block, whereby the total heat capacity of the opposed platen is reduced by reducing the volume of the opposed platen immediately after heating and the heat stored in the opposed platen is physically released, while the third block as an exterior member is brought into contact with the first block in cooling to transfer the heat supplied in the first block to the third block, so that the cooling rate of the opposed platen can be improved.

Drawings

Fig. 1 is a schematic diagram showing an outline of a processing apparatus of a fine structure according to a first embodiment of the present invention.

Fig. 2 is a sectional view showing a processing apparatus of a fine structure according to a second embodiment of the present invention.

Fig. 3 is a sectional view showing a processing apparatus of a fine structure according to a third embodiment of the present invention.

Fig. 4 is a sectional view showing a processing apparatus of a fine structure according to a fifth embodiment of the present invention.

Fig. 5 is a sectional view showing a processing apparatus of a fine structure according to a sixth embodiment of the present invention.

Fig. 6 is a sectional view showing an outline of a processing apparatus of a fine structure according to a seventh embodiment of the present invention.

Fig. 7 is a sectional view showing a first step of the outline of the processing method of a fine structure according to the seventh embodiment of the present invention.

Fig. 8 is a sectional view showing a second step of the outline of the processing method of a fine structure according to the seventh embodiment of the present invention.

Fig. 9 is a sectional view showing a first step of the outline of the processing method of a fine structure according to the eighth embodiment of the present invention.

Fig. 10 is a sectional view showing a second step of the outline of the processing method of a fine structure according to the eighth embodiment of the present invention.

Fig. 11 is a sectional view showing a third step of the outline of the processing method of a fine structure according to the eighth embodiment of the present invention.

Fig. 12 is a sectional view showing a first step of the outline of the processing method of a fine structure according to the ninth embodiment of the present invention.

Fig. 13 is a sectional view showing a second step of the outline of the processing method of a fine structure according to the ninth embodiment of the present invention.

Fig. 14 is a sectional view showing another outline of the step of the processing method of a fine structure according to the ninth embodiment of the present invention.

Fig. 15 is a longitudinal sectional view showing a schematic structure of a processing apparatus of a fine structure according to a tenth embodiment of the present invention.

Fig. 16 is a sectional view showing a first step of a processing method of a fine structure according to a tenth embodiment of the present invention.

Fig. 17 is a sectional view showing a second step of the processing method of a fine structure according to the tenth embodiment of the present invention.

Fig. 18 is a sectional view showing a first step of the outline of the processing method of a fine structure according to the eleventh embodiment of the present invention.

Fig. 19 is a sectional view showing a second step of the outline of the processing method of a fine structure according to the eleventh embodiment of the present invention.

Fig. 20 is a sectional view showing a third step of the outline of the processing method of a fine structure according to the eleventh embodiment of the present invention.

Fig. 21 is a sectional view showing a first step of the outline of the processing method of a fine structure according to the twelfth embodiment of the present invention.

Fig. 22 is a sectional view showing a second step of the outline of the processing method of a fine structure according to the twelfth embodiment of the present invention.

Fig. 23 is a sectional view showing another outline of the step of the processing method of a fine structure according to the twelfth embodiment of the present invention.

Description of the reference numerals

1 molding material (PC film), 1a fine structure (molded PC film), 5 molds, 5a molding part, 7 substrates, 11, 12, 111, 112 platens, 17 substrate support mechanism, 20 drive direction of drive unit, 25 movement direction of substrate support device, 31, 32 temperature setter, 41 preheater, 211, 311 opposing platens, 211a, 305a first block, 211b, 305b second block, 211c, 305c third block, 211h, 305 heating/cooling block

Detailed Description

Embodiments of the present invention are described below with reference to the drawings.

(first embodiment)

Fig. 1 is a plan view showing an outline of a processing apparatus of a fine structure according to a first embodiment of the present invention. Referring to fig. 1, two movable opposed platens (hereinafter, platens) 11 and 12 are disposed below a mold 5. In fig. 1, cooling platen 12 is in the molding/machining position immediately below mold 5, while heating platen 11 is in the retracted position. The platen 11 is located at the molding/processing position when molding/processing is performed by the pressing die, and is moved to the retracted position upon cooling after molding/processing. When the molded/processed resin or the like is cooled before demolding, the cooling platen 12 is in the molding/processing position, and is moved to the retracted position 12b while molding/processing is performed by pressing the mold 5 against the molding material 1 that is resin. Referring to fig. 1, reference numeral 20 denotes a moving direction of the platens 11 and 12 using a driving unit (illustration omitted) that moves the platens 11 and 12. The drive unit may be implemented with any means commonly used for drive units of this type.

Referring to fig. 1, temperature setters 31 and 32 set platens 11 and 12, respectively, to predetermined temperatures. These temperature setters 31 and 32 are formed of unillustrated temperature sensors, heaters, power sources, and the like and maintain the temperature of the platen at a constant level. The temperature setter is not limited to the aforementioned structure, but may be maintained at a predetermined temperature by being introduced into an oven maintained at a constant temperature.

Resin 1, which is a molding material, is introduced to a molding/processing position in which heated platen 11 is disposed from a direction not overlapping with the platen movement space so as to avoid the movement space of platens 11 and 12, resin 1 is heated to a molding temperature, and then processed by pressing mold 5 against resin 1. Thereafter, platen 11 is moved to the retreat position while maintaining the load in the aforementioned molding/processing, and platen 12 is instead moved to the molding/processing position to contact molded/processed resin 1a and cool resin 1 a. After that, the processed resin 1a which becomes a fine structure is demolded and carried onto an extension line in a direction in which the resin 1 is introduced before molding.

The resin 1 may be preheated by the preheater 41 before it is put on the molding/processing position. The preheater may be a furnace that is kept at a constant temperature, or may be a heating device such as a heater.

The interchangeable platens 11 and 12 that are linearly moved in fig. 1 are not limited to this movement pattern, but any movement pattern may be adopted as long as the platens are circularly moved so that at least two platens may be operated circularly, or may be moved while changing the vertical position, for example. Also, when the lead-in wires of the molding material 1 and the platen moving spaces overlap each other, there is no problem caused by the simple spatial overlapping unless these spatial positions overlap each other at the same time.

Although fig. 1 shows the case of two platens 11 and 12, at least three platens may be alternately arranged.

The basic elements in the aforementioned fine structure processing apparatus are composed of a mold for processing a molding material into a fine structure, at least two opposed platens opposed to the mold, and a driving unit using the at least two opposed platens when a single fine structure is processed. As described above, the drive unit that moves the platen may be composed of any known drive unit/mechanism. According to the foregoing first embodiment, the unit employing the moving platen uses two platens when processing a single fine structure. However, the unit may be a device that moves the mold while holding the two platens stationary or a device that moves the platens and the mold, as long as the two platens can be used when processing a single fine structure. The drive unit for moving the mold can also consist of any known apparatus, similar to the apparatus for moving the platen.

The basic element in the aforementioned method of processing a fine structure is constituted by including at least two opposed platens opposed to a mold for processing a molding material into a fine structure, and using at least two opposed platens when processing a single fine structure.

The aforementioned at least two opposed platens may not be set to the same temperature. The method is employed so that the molded material (resin, resin provided with a substrate, various films, various composite materials, etc.) can be heated efficiently and the molded fine structure can be released efficiently and smoothly. In addition, precise temperature control can be performed to facilitate improvement in yield and quality of fine structures.

The aforementioned platen driving unit can move at least two opposing platens between a retracted position where the opposing platens are not used and a used position where the opposing platens are used. According to this structure, at least two opposed platens can be effectively used differently. For example, the opposing platen that has been kept at the imprint temperature may be employed in the molding/processing process, and another opposing platen that has been kept at the mold release temperature may be employed when the fine structure is separated from the mold during the holding by pressing.

The aforementioned molding material can be preheated between the mold and the opposed platen before it is heated. According to this method, the resin has already been heated, so the heating time can be significantly shortened and the productivity can be further improved.

The aforementioned molding material may be in any form, and may be a resin, a resin provided with a substrate, various films, various composite materials, and the like. AS the resin or resin film, there can be used thermoplastic resins such AS polyethylene, polypropylene, polyvinyl alcohol, polyvinylidene chloride, polyethylene terephthalate, polyvinyl chloride, polystyrene, ABS resin, AS resin, acrylic resin, polyacetal, polybutylene terephthalate, glass-reinforced polyethylene terephthalate, polycarbonate, denatured phenylene ether (denatured polyphenylene ether), polyphenylene sulfide (polyphenylene sulfide), poly (ether ketone), liquid crystal polymer, fluororesin, polysulfone, poly (ether sulfone), polyamideimide (polyamideimide), polyetherimide or thermoplastic polyimide; thermosetting resins such as phenol resin, melamine-formaldehyde resin, urea resin, epoxy resin, unsaturated polyester resin, alkyd resin, silicone resin, hexadiene phthalate resin, polyamide bismaleimide resin, polybisamide triazole (polybisamide triazole), and the like, or materials prepared by mixing at least two of these materials with each other may be used.

The die and platen may be made of various steel materials. For example, steel discs or SS41 forgings may be used. Instead of the steel material, the mold may employ a heat-resistant resin. For machining the mold, any known machining method may be used, such as turning, milling, electric discharge machining, laser beam machining, electron beam machining, or etching.

(second embodiment)

Fig. 2 is a sectional view showing an outline of a processing apparatus of a fine structure according to a second embodiment of the present invention. Referring to fig. 2, platen 11 of high temperature is disposed immediately below die 5, i.e., in the molding/machining position, while cooled platen 12 is retracted to the retracted position. This embodiment is characterized in that: the base material 7 is disposed on the platen 11, and the film 1 as a molding material is disposed on the base material 7. Referring to fig. 2, when the film 1 is molded/processed with the mold section 5a of the mold 5, the mold section 5a is pressed against the film 1 supported by the base 7. During this forming/processing, the film 1 is heated by the platen 11 together with the substrate 7.

In order to continuously maintain the state where the film is pressed against the mold 5, and when the platen 11 is moved to the retracted position after molding/processing, the substrate 7 is supported by a substrate support mechanism (not shown). The maintenance of this state is very important in order to maintain a state in which the resin or the like constituting the film fluctuates and is thus sufficiently injected into the recesses and corners of the mold section 5 a. After the platen 11 is moved, the cooled platen 12 is moved to a molding/processing position in a state where the substrate 7 presses the film 1 against the mold 5 to support the substrate 7 from below and cool the film 1.

Needless to say, when the aforementioned platens 11 and 12 are arranged on and off the molding/processing positions, respectively, the movement in the direction intersecting the direction of reference numeral 20, that is, the movement that changes the distance between the platens and the molding material including the base material 7 or the fine structure is accompanied by the movement in the direction indicated by reference numeral 20. The foregoing movement is similarly performed in the remaining embodiments, although not specifically illustrated.

The base material 7 may be any substance as long as it has a predetermined hardness and thermal conductivity. For example, a metal plate, a heat-resistant resin plate, a composite layer of resin and ceramic, or a layer of a combination thereof may be used. Also, as the form of the substrate, a cut plate (cut plate), a batch sheet (batch sheet), a continuous sheet (continuous sheet), a continuous supply type or a form of a wrappable and wrappable curl may be adopted. The substrate arranger that arranges the aforementioned substrate between the opposed platen and the molding material may also include any device configuration as long as it is a device that arranges the substrate at the aforementioned position according to the aforementioned form of the substrate.

The essential element in the processing method of a fine structure according to this embodiment is the operation of performing fine structure processing by introducing a base material into the space between the molding material and the opposed platen. According to this structure, a sudden temperature change applied to the mold and the resulting load impact can be alleviated.

The aforementioned base material can be made to have higher hardness and greater thermal conductivity than the molded material. According to this method, the aforementioned temperature shock and load shock caused by the base material can be more reliably alleviated.

The elastic modulus of the aforementioned substrate may be set to at least 100 GPa. According to the method using the substrate, the substrate can withstand a sharp temperature change (load shock) caused by a molding pressure applied to the substrate itself and a small heat capacity resulting from a small substrate thickness. If the modulus of elasticity of the substrate is less than 100GPa, it is impossible to withstand the molding pressure and the operation of machining fine structures is hindered.

The thermal conductivity of the aforementioned base material can be set to at least 20W/(m.cndot.). According to the method using the base material, the temperature following time after the contact to the platen is shortened, and the productivity is improved. If the thermal conductivity of the base material is less than 20W/(m.cndot.), the rate of heat exchange between the opposed platen and the resin is insufficient, and shortening of the temperature follow-up time is restricted. In the foregoing second embodiment, the description was made on the premise of the system that uses two platens to move the platens when processing a single fine structure. However, a device that moves the mold while holding both platens stationary or a system that moves the platens and the mold may be employed as long as both platens can be used when processing a single fine structure. Needless to say, when the mold is moved in this case, the platen can also be moved together with the mold. At this time, the base material is moved while keeping the state in which the resin or film is pressed against the mold. The driving unit that moves the mold while pressing the resin or film against the mold and sandwiching the substrate may be constituted by any known apparatus of this type.

(third embodiment)

Fig. 3 is a partial sectional view of a processing apparatus of a fine structure according to a third embodiment of the present invention. Referring to fig. 3, the substrate 7 is supported by the substrate support mechanism 1 to arrange the platen 12 at the molding processing position while maintaining a state of pressing the film 1 against the mold 5 when the platen 11 is moved to the retracted position after molding/processing. The substrate support mechanism 17 is comprised of a column or slab that is reciprocable in the direction 25. A substrate support mechanism 17, which is in contact with the substrate 7 and the platens 11 and 12 together, is provided so as not to overlap with the platens 11 and 12 disposed at the molding/processing position.

With the substrate support mechanism 17 described above, the relative positions of the mold and the molding material can be maintained, and a precise fine structure can be processed.

The essential element of the processing apparatus of a fine structure according to the foregoing embodiment is that it includes a base material between the opposed platen and the molding material, and includes a base material supporting mechanism to press the molding material against the mold to hold the molding load, and sandwich the base material. According to the apparatus, respective positions of the mold and the molding material in molding/processing can be maintained, and the shape of a portion such as a corner of the mold, which is liable to cause a defect (chipping or the like), can be maintained to the cooling cycle. Therefore, a more precise fine structure can be obtained. In the foregoing third embodiment, the description was made on the premise of the system that moves the platen using two platens when processing a single fine structure. However, a device that moves the mold while holding the two platens stationary or a system that moves the platens and the mold may be employed as long as the two platens can be used when processing a single fine structure. In this case, the base material also moves along with the mold when the mold is moved, and the base material support mechanism maintains a state of pressing the resin or film against the mold and sandwiching the base material during this movement. The aforementioned drive unit and substrate support mechanism can be constituted by any known apparatus of this type.

Examples 1 and 2 implemented by processing a fine structure of a wiring pattern having a predetermined line width will now be described.

Example 1

Fine molding was carried out on a PC (polycarbonate) film (molding material) 200 μm thick using a mold (± 0.3 μm) with an L/S (line/space) of 50/50 μm. The PC film was preheated to 100 c with a ceramic heater constituting a part of the preheater. Then, the heated platen 11 heated to 180 ℃ and the PC film are brought into contact with each other, and the temperature is further raised. After 60 seconds from the contact between the platen and the PC film, pressing/molding was performed by the pressing die 5.

Thereafter, the heated platen 11 is removed, and a cooling platen 12 of 60 ℃ is pressed against the molded/processed fine structure (PC film) 1a to cool the fine structure. PC film 1a was released from mold 5 after 60 seconds from contact between cooling platen 12 and PC film 1 a. The time of one cycle from the placement of the aforementioned PC film at the molding position of the mold to the demolding was 5 minutes.

Example 2

Fine molding was performed on a PC film 100 μm thick using a mold (± 0.3 μm) with an L/S (line/space) of 50/50 μm. The PC film was preheated to 100 ℃ with a ceramic heater. Before placing the PC film 1 on the molding position of the mold, on the other hand, the platen 11 of 180 ℃ has been brought into contact with the AlN substrate (base material) 7 having a high heat capacity to heat the AlN substrate 7. The PC film 1 is placed on the AlN substrate 7 and heated. After 60 seconds from the operation of placing the PC film on the AlN substrate 7, pressing/molding was performed by the pressing mold 5.

Thereafter, the platen 11 was removed, and the platen 12 at 60 ℃ was pressed through the AlN substrate 7, thereby cooling was performed while pressing the AlN substrate 7. After 180 seconds from the operation of pressing the platen 12, the molded fine structure PC film 1a is released from the mold 5. The time of one cycle from the placement of the aforementioned PC film to the molding position of the mold to the demolding was 7 minutes. While conventional cycles cannot be fully addressed because the heat capacity varies significantly with the specifications of the equipment, 20 minutes to 30 minutes are necessary when the platen heating and cooling steps are rate-dependent.

(fourth embodiment)

A fourth embodiment of the present invention will now be described. The fourth embodiment is a modification of the foregoing second embodiment described with reference to fig. 2. While in the second embodiment the substrate 7 is heated by the platen 11 and cooled by the platen 12, in the fourth embodiment both platens 11 and 12 comprise the heating and cooling system of fig. 2, so that the respective systems are used in the steps of heating and cooling the substrate 7.

In this embodiment, the PC film 1 is heated by the substrate 7 with the first platen 11 in a high temperature state to mold the PC film 1 with the mold 5, and thereafter the platen 11 is cooled and the PC film is released from the mold 5 after reaching a predetermined temperature, as shown in fig. 2. In this cycle, the platen 12 waits in a high temperature state in order to heat the PC film 1 that is bonded down. Considering the time to proceed to the next molding step of PC film 1 after the demolding of a single PC film 1 is completed, platen 11 is exchanged with platen 12 in a high temperature state so that the heating, molding, cooling, and demolding steps similar to the above are repeated.

Example 3

Fine molding was carried out on a PC (polycarbonate) film (molding material) 200 μm thick using a mold (± 0.3 μm) with an L/S (line/space) of 50/50 μm. The PC film was preheated to 100 ℃ with a ceramic heater consisting of a part of the preheater. Then, the platen 11 heated to 180 ℃ and the PC film 1 were brought into contact with each other, and the temperature was further raised. After 60 seconds from the contact between the platen 11 and the PC film 1, pressing/molding was performed by the pressing die 5.

Thereafter, platen 11 is cooled and released from mold 5 after reaching 60 ℃. Thereafter, cooling platen 12 is pressed against molded/processed PC film 1a again to cool the PC film. PC film 1a was released from mold 5 after 60 seconds from the contact between cooling platen 12 and PC film 1 a. The time of one cycle from the placement of the aforementioned PC film to the molding position of the mold to the demolding was 6 minutes. In this process, platen 12 is heated to 180 ℃, and platens 11 and 12 are exchanged with PC membrane 1.

Table 1 shows the results obtained by measuring the line width in the fine structures (wiring patterns) processed in the foregoing examples 1 to 3 with a laser microscope, and the foregoing period. According to table 1, all examples 1 to 3 were completed with an average target line width, and the variation range was also within the allowable range (± 1.0 μm).

TABLE 1

	Example 1	Example 2	Example 3	Measuring method
					Line width (mum)	50.0±0.5	50.0±0.3	50.0±0.3	Laser microscope
Period (minutes)	5	7	6	-

(fifth embodiment)

A fifth embodiment of the present invention will now be described with reference to fig. 4. According to the fifth embodiment, a PC film as a molding material is molded by bringing the base material 107 into contact with the mold 5 and heating and cooling the mold 5 by the base material 107 with the platens 111 and 112. A member 131 as a temperature setter and an opposing platen is arranged at a position opposing the molding surface of the mold 5 and sandwiches the PC film 1 together with the mold 5. The platens 111 and 112 may be employed for only heating or only cooling, respectively, similarly to the second embodiment, or each of the platens 111 and 112 may be employed for both heating and cooling, similarly to the fourth embodiment.

Example 4

The following molding of the fine structure is carried out with the technique of the foregoing fifth embodiment. Fine molding was carried out on a PC film 1 of 100 μm thickness using a mold (± 0.3 μm) of 50/50 μm L/S. The PC film 1 was preheated to 100 ℃ with a ceramic heater. Before placing the PC film 1 on the molding position of the mold, on the other hand, a platen 111 of 180 ℃ has been brought into contact with an AlN substrate (base material) 107 having a high heat capacity to heat the AlN substrate 107. The back surface of the mold 5 is brought into contact with the surface of the AlN substrate 107 opposite to the PC film 1 to heat the mold 5. After 60 seconds from the operation of placing the mold 5 on the AlN substrate 107, pressing/molding is performed by pressing the mold 5.

Thereafter, the platen 111 was removed, and the platen 112 at 60 ℃ was pressed through the AlN substrate 107 for cooling when the AlN substrate 107 was pressed. After 120 seconds from the operation of pressing the platen 112, the molded fine structure PC film 1a was released from the mold 5. The time of one cycle from the placement of the aforementioned PC film to the molding position of the mold to the demolding was 6 minutes.

(sixth embodiment)

A sixth embodiment of the present invention will now be described with reference to fig. 5. According to the sixth embodiment, the PC film 1 as a molding material is similar to the foregoing fifth embodiment by bringing a base 107a into contact with the mold 5 and heating or cooling the mold 5 with platens 111a and 112a through this base 107 a. This embodiment differs from the fifth embodiment in that another base material 107b is brought into contact with the surface of the PC film 1 opposite to the side opposite to the mold 5 and the PC film 1 is heated and/or cooled by this base material 107b with platens 111b and 112 b.

Example 5

The following molding of the fine structure is carried out by the technique of the foregoing sixth embodiment. As shown in fig. 5, when a base material 107a composed of an AlN substrate is pressed against the back surface of the mold 5, the mold 5 is heated by the base material 107a with a platen 111a at 180 ℃. Meanwhile, the base material 107b composed of an AlN substrate was heated with a platen 111b of 180 ℃ by the base material 107b while being pressed against the back surface of the PC film 1. Thereafter, the platens 111a and 111b were removed in a state where the substrates 107a and 107b were pressed against the mold 5 and the PC film 1, and the platens 111a and 111b at 60 ℃ were pressed against the substrates 107a and 107b for 90 seconds to cool the mold 5 and the PC film 1 through the substrates 107a and 107b, respectively. According to this example, the time of one cycle from placing the PC film 1 to the molding position of the mold to demolding was 5.5 minutes.

Table 2 shows the results obtained from measuring the line widths of the fine structures (wiring patterns) processed in the foregoing examples 4 and 5 with a laser microscope and the foregoing periods. According to table 2, both examples 4 and 5 were also completed with the target line width averaged and the variation range was also within the allowable range (± 1.0 μm).

TABLE 2

	Example 4	Example 5	Measuring method
				Line width (mum)	50.0±0.3	50.0±0.3	Laser microscope
Period (minutes)	6	5.5	-

(seventh embodiment)

With a seventh embodiment of the present invention, a processing apparatus and a processing method of a fine structure according to the embodiment will now be described with reference to fig. 6 to 8. Fig. 6 is a schematic structural view in longitudinal section showing a processing apparatus of a fine structure according to the embodiment, and fig. 7 and 8 are sectional views showing first and second steps of a processing method of a fine structure according to the embodiment.

The processing apparatus of a fine structure according to this embodiment includes a mold 5, and an opposed platen 211 provided to be movable in a space between a molding/processing position and a retreat position is disposed below the mold 5. Mold sections 5a formed in a predetermined pattern are provided on the side of mold 5 close to opposed platen 211. Film 1 as a molding material is disposed between mold section 5a and opposed platen 211.

The mold 5 and the opposed platen 211 are provided so as to be relatively movable by a driving unit (illustration omitted) between a molding/processing position and a retreat position. The drive unit can be implemented with any means commonly used for drive units of this type.

The opposed platen 211 has a first block 211a on the front surface, including a heating device 211 h; and a second block 211b at the rear. The first block 211a and the second block 211b are provided to be relatively movable between a position where the first block 211a and the second block 211b contact each other and a position where the first block 211a and the second block 211b are separated from each other by a platen driving unit (illustration omitted). Although the platen driving unit can be implemented by any means of a driving unit of this type that is generally used, it is preferable to vacuum-adsorb the first block 211a and the second block 211b using vacuum adsorbers in view of reducing the thermal resistance of the contact portion between the two blocks and improving the heat transfer efficiency.

Also, in order to reduce the thermal resistance of the contact portion between the blocks and improve the heat transfer efficiency, the surface roughness (Ra) of the contact surface of each block is preferably 0.5 μm or less.

Although a well-known heating device can be embedded, the heating device 211h included in the first block 211a is preferably a ceramic heater prepared by forming a heating element on a ceramic member to generate heat by applying a voltage, in consideration of heat uniformity to the platen 211. It is preferable to use a material selected from the group consisting of aluminum oxide, aluminum nitride, silicon carbide, and boron nitride as the ceramic.

In order to effectively achieve heat transfer, the first and second blocks 211a and 211b preferably employ a material having a high heat capacity selected from the group consisting of aluminum, magnesium, copper, iron, stainless steel, alumina, aluminum nitride, silicon carbide, and boron nitride. To further improve the heat transfer efficiency, the heat capacity of the second block 211b is preferably at least 30% of the total heat capacity of the first and second blocks 211a and 211 b.

In the fine structure processing apparatus having the foregoing structure, opposed platen 211 is first heated to a molding temperature with heating apparatus 211h, and thereafter opposed platen 211 is moved from the retreat position to the molding/processing position to press film 1 against mold 5 and press/heat/mold/process film 1, as shown in fig. 7. Thereafter, the load in the molding/processing is maintained for a certain period of time. Upon cooling, the second block 211b is separated from the first block 211a, as shown in fig. 8.

Thus, second block 211b is thus separated from first block 211a at the time of cooling to reduce the total heat capacity of opposed platen 211 and physically release the heat stored in opposed platen 211 by reducing the volume of opposed platen 211 at the time of cooling, thus improving the cooling rate of opposed platen 211. Thus, the cooling efficiency of opposed platen 211 is improved, and the thermal cycle of opposed platen 211 is shortened.

The film 1 may be preheated with a preheater (not shown) before being placed in the forming/processing position. The preheater may be a furnace that is maintained at a constant temperature or a heating device such as a heater.

(eighth embodiment)

The processing apparatus and the processing method of a fine structure according to this embodiment will be described below with reference to fig. 9 to 11. Fig. 9 to 11 are schematic sectional views showing first to third steps of the processing method of a fine structure according to this embodiment. The portions identical or equivalent to those of the processing device of the fine structure in the foregoing embodiment are denoted by the same reference numerals, and redundant description will not be repeated.

In the foregoing embodiment, second block 211b is separated from first block 211a at the time of cooling, and therefore improvement in cooling efficiency of opposed platen 211 is obtained. According to this embodiment, further improvement in cooling efficiency of the opposed platen 211 is obtained, and high efficiency of heating is obtained in heating in the subsequent step. As shown in fig. 9, the processing device of a fine structure according to this embodiment has a third block 211c constituted by a structure substantially similar to that of the second block 211 b.

Second block 211b is heated in the heating step, and thus second block 211b and third block 211c are moved in the cooling step as shown in fig. 10 to bring third block 211c into contact with first block 211a as shown in fig. 11.

In this way, the total heat capacity of opposed platen 211 is reduced by reducing the volume of opposed platen 211 immediately after heating to physically release the heat stored in opposed platen 211, and third block 211c as an external member is brought into contact with first block 211a at the time of cooling, so that the heat provided in first block 211a is transferred to third block 211c in a cooled state at the time of cooling, thus obtaining an improvement in the cooling rate of opposed platen.

Second block 211b is in a state of having been heated to some extent, and thus improvement in heating efficiency to platen 211 can also be obtained by bringing second block 211b into contact with first block 211a in place of third block 211c in heating in the subsequent step.

(ninth embodiment)

A processing apparatus and a processing method according to this embodiment will now be described with reference to fig. 12 and 13. Fig. 12 and 13 are sectional views showing first and second steps of the processing method of a fine structure according to this embodiment. The portions identical or equivalent to the finely structured processing device in each of the foregoing embodiments are denoted by the same reference numerals, and redundant description will not be repeated.

In the foregoing embodiment, second block 211b is separated from first block 211a at the time of cooling, and thus improvement in cooling efficiency of opposed platen 211 is obtained. According to this embodiment, only the first block 211a is used in the heating step, and the second block 211b is first brought into contact with the first block 211a in the cooling step. First, the opposed platen is moved from the retreat position to the molding/processing position to press the film 1 against the mold 5 in a state where the second block 211b is separated from the first block 211 a. Thereafter, the load in the aforementioned molding/processing is maintained for a constant time.

In the cooling, the second block 211b in a cooled state is in contact with the first block 211a, as shown in fig. 13. Thus, the volume of opposed platen 211 increases and the heat provided in first block 211a is transferred to second block 211b at the time of cooling, so that the cooling rate of opposed platen 211 is improved.

Although the case where the second block 211b is brought into contact with the first block 211a by moving the second block 211b is described with reference to fig. 13, the second block 211b may be fixed to integrally move the mold 5, the film 1 and the first block 211a toward the second block 211b as shown in fig. 14.

The second block 211b and the third block 211c, which basically perform a reciprocating motion with respect to a linear motion of the first block 211a in each of the aforementioned embodiments, are not limited to this moving mode, and various moving modes may be employed as long as the second block 211b and the third block 211c are circularly moved, for example, so that the plurality of second blocks 211b and the plurality of third blocks 211c may be periodically circulated or may be moved while changing the vertical position.

Examples 6 and 7 implemented by processing a fine structure of a wiring pattern having a predetermined line width will now be described.

Example 6

Fine molding was carried out on a PC (polycarbonate) film (molding material) 100 μm thick using a mold (± 0.3 μm) with an L/S (line/space) of 50/50 μm. The PC film was preheated to 100 ℃ with a ceramic heater consisting of a part of the preheater. Then, the heated first block 211a heated to 170 ℃ and the PC film are brought into contact with each other, and the temperature is further increased. After 60 seconds from the contact between the first block 211a and the PC film, pressing/molding is performed by the pressing mold 5.

Thereafter, the second block 211b is separated from the first block 211a, and the PC film 1 is released from the mold 5 after the temperature of the first block 211a reaches 60 ℃. The time of one cycle from the placement of the aforementioned PC film 1 on the molding position of the mold to the release was 8 minutes.

Example 7

Fine molding was carried out on a PC (polycarbonate) film (molding material) 100 μm thick using a mold (± 0.3 μm) with an L/S (line/space) of 50/50 μm. The PC film was preheated to 100 ℃ with a ceramic heater consisting of a part of the preheater. Then, the heated first block 211a heated to 170 ℃ and the PC film are brought into contact with each other, and the temperature is further increased. After 60 seconds from the contact between the first block 211a and the PC film, pressing/molding is performed by the pressing mold 5.

Thereafter, the second block 211b is separated from the first block 211a, and the third block 211c is cooled to be in contact with the first block 211 a. After the temperature of the first block 211a reaches 60 ℃, the PC film 1 is released from the mold 5. The time of one cycle from the placement of the aforementioned PC film 1 to the molding position of the mold to the demolding was 5 minutes.

(tenth embodiment)

With respect to a tenth embodiment of the present invention, a processing apparatus and a processing method of a fine structure according to the embodiment will now be described with reference to fig. 15 to 17. Fig. 15 is a longitudinal sectional view showing a schematic structure of a processing apparatus of a fine structure according to the embodiment, and fig. 16 and 17 are sectional views showing first and second steps of a processing method of a fine structure according to the embodiment.

First, the processing apparatus of a fine structure according to this embodiment includes a mold 5, and an opposed platen 311 provided to be movable in a space between a molding/processing position and a retreat position is disposed above this mold 5. Mold sections 5a formed in a predetermined pattern are provided on the side of mold 5 close to opposed platen 311. Film 1 as a molding material is disposed between mold section 5a and opposed platen 311.

The mold 5 and the opposed platen 311 are provided to be relatively movable between the molding/processing position and the retreat position by a driving unit (illustration omitted). The drive unit can be implemented with any means commonly used for drive units of this type.

The mold 5 has a first block 305a, located on the upper side, comprising a heating device 305 h; and a second block 305b on the lower side on the side opposite to the PC film 1. The first block 305a and the second block 305b are provided so as to be relatively movable between a position where the first block 305a and the second block 305b contact each other and other positions where the first block 305a and the second block 305b are separated from each other by a platen driving unit (illustration omitted). Although the platen driving unit may be implemented by any means commonly used for this type of driving unit, it is preferable to employ vacuum adsorbers to vacuum-adsorb the first block 305a and the second block 305b in view of reducing the thermal resistance of the contact portion between the blocks and improving the heat transfer efficiency.

In order to further reduce the thermal resistance of the contact portion between the blocks and improve the heat transfer efficiency, the surface roughness (Ra) of the contact surface of each block is preferably 0.5 μm or less.

Although a well-known heating device may be embedded, the heating device 305h included in the first block 305a is preferably a ceramic heater prepared by forming a heating element on a ceramic member to generate heat by applying voltage in consideration of heat uniformity. It is preferable to use a material selected from the group consisting of aluminum oxide, aluminum nitride, silicon carbide, and boron nitride as the ceramic.

In order to effectively perform heat transfer, it is preferable to use a material of high thermal conductivity selected from the group consisting of aluminum, magnesium, copper, iron, stainless steel, alumina, aluminum nitride, silicon carbide, and boron nitride for the first block 305a and the second block 305 b. To further improve the heat transfer efficiency, the heat capacity of the second block 305b is preferably at least 30% of the total heat capacity of the first block 305a and the second block 305 b.

In the apparatus for processing a fine structure having the aforementioned structure, the heating/cooling block 305 formed of the first block 305a and the second block 305b is first heated to a molding temperature with the heating device 305h, and thereafter the mold 5 and the opposed platen 311 are moved from the retracted position to the molding/processing position as shown in fig. 16 to press the film 1 against the mold 5 and press/heat/mold/process it. Thereafter the load in the aforementioned pressing/heating/forming/processing is maintained for a certain time. Upon cooling, the second block 305b is separated from the first block 305a, as shown in fig. 17.

Thus, the second block 305b is thus separated from the first block 305a upon cooling to reduce the total heat capacity by reducing the volume of the block 305 upon cooling, and physically releases the heat stored in the block 305 thus improving the cooling rate of the block 305. In this way, the cooling efficiency of block 305 is improved such that the thermal cycle of block 305 is shortened.

The film 1 may be preheated by a preheater (not shown) before it is placed in the forming/processing position. The preheater may be a furnace that maintains a constant temperature, or a heating device such as a heater.

(eleventh embodiment)

A processing apparatus and a processing method of a fine structure according to an eleventh embodiment will now be described with reference to fig. 18 to 20. Fig. 18 to 20 are sectional views showing first to third steps of the processing method of a fine structure according to this embodiment. Parts identical or equivalent to those of the fine structure processing apparatus in the foregoing embodiment are denoted by the same reference numerals, and redundant description will not be repeated.

In the foregoing tenth embodiment, the second block 305b is separated from the first block 305a at the time of cooling, and therefore an improvement in the cooling efficiency of the block 305 is obtained. According to this embodiment, an improvement in the cooling efficiency of the block 305 is further obtained, while an improvement in the heating efficiency in the heating of the subsequent step is obtained. As shown in fig. 18, the processing device of a fine structure according to this embodiment has a third block 305c composed of a structure substantially similar to that of the second block 305 b.

Second block 305b is heated in the heating step, and thus second block 305b and third block 305c are moved in the cooling step as shown in fig. 19 to bring third block 305c into contact with first block 305a as shown in fig. 20.

In this way, the total heat capacity of block 305 is reduced by reducing the volume of block 305 immediately after heating to physically release the heat stored in block 305, and third block 305c as an external member is brought into contact with first block 305a at the time of cooling, so that the heat provided in first block 305a at the time of cooling is transferred to third block 305c which is in a cooled state, thus obtaining an improvement in the cooling efficiency for the counter platen.

The second block 305b is in a state of having been heated to some extent, and thus the improvement of the heating efficiency of the block 305 can also be obtained by bringing the second block 305b into contact with the first block 305a in place of the third block 305c in the heating of the subsequent step.

(twelfth embodiment)

A processing apparatus and a processing method of a fine structure according to a twelfth embodiment will now be described with reference to fig. 21 and 22. Fig. 21 and 22 are sectional views showing first and second steps of the processing method of a fine structure according to this embodiment. Parts identical or equivalent to those of the processing device of the fine structure in each of the foregoing embodiments are denoted by the same reference numerals, and redundant description will not be repeated.

In each of the foregoing tenth and eleventh embodiments, the second block 305b is separated from the first block 305a upon cooling, and therefore an improvement in the cooling efficiency of the block 305 is obtained. According to this embodiment, only the first block 305a is used in the heating step, and the second block 305b is first brought into contact with the first block 305a in the cooling step. First, the block 305 is moved from the retreat position to the molding/processing position to press the film 1 against the mold 5 in a state where the second block 305b is separated from the first block 305 a. Thereafter, the load in the molding/processing is maintained for a certain period of time.

Upon cooling, the second block 305b in a cooled state is in contact with the first block 305a, as shown in fig. 22. Thus, the volume of the block 305 increases upon cooling and the heat provided in the first block 305a is transferred to the second block 305b, so that the cooling efficiency of the block 305 is improved.

Although the case where the second block 305b is brought into contact with the first block 305a by moving the second block 305b is described with reference to fig. 22, the second block 305b may be fixed to move the mold 5, the film 1, and the first block 305a integrally toward the second block 305b as shown in fig. 23.

Second block 305b and third block 305c, which basically perform reciprocating movement with respect to linear movement of first block 305a in each of the foregoing embodiments, are not limited to such movement, and any movement pattern may be employed as long as second block 305b and third block 305c move cyclically, for example, so that a plurality of second blocks 305b and a plurality of third blocks 305c may cycle periodically or may move when vertical positions are changed.

Example 8 implemented by processing a fine structure of a wiring pattern having a predetermined line width is now described.

Example 8

Fine molding was performed on a PC film (molding material) 1 having a thickness of 100 μm using a mold (± 0.3 μm) having an L/S (line/space) of 50/50 μm. The PC film 1 was preheated to 100 ℃ with a ceramic heater consisting of a part of a preheater. Then, the heated first block 305a heated to 170 ℃ and the PC film 1 are brought into contact with each other as shown in fig. 15, and the temperature is further increased. After 60 seconds from the contact between the first block 305a and the mold 5, the opposed platen 311 is pressed to perform pressing/heating/molding as shown in fig. 16.

Thereafter, second block 305b is separated from first block 305a as shown in fig. 17, and cooled third block 305c is brought into contact with first block 305a as shown in fig. 18 to 20. After the temperature of the first block 305a reaches 60 ℃, the PC film 1 is released from the mold 5. The time of one cycle from the placement of the aforementioned PC film 1 to the molding position of the mold to the demolding was 7 minutes.

Table 3 shows the results obtained by measuring the line widths of the fine structures processed in the foregoing examples 6 to 8 with a laser microscope and the foregoing period. According to table 3, all examples 6 to 8 were also completed with the target line width averaged, and the variation range was also within the allowable range (± 1.0 μm).

TABLE 3

	Example 6	Example 7	Example 8	Measuring method
					Line width (mum)	50.0±0.3	50.0±0.3	50.0±0.3	Laser microscope
Circulation (minutes)	8	5	7	-

The presently disclosed embodiments and examples are to be considered in all respects as illustrative and not restrictive. The scope of the present invention is shown not by the above description but by the scope of the claims for patent, and is intended to include all modifications within the meaning and scope equivalent to the scope of the claims for patent.

INDUSTRIAL APPLICABILITY

According to the present invention, a high-quality fine structure can be processed with high efficiency and high yield by its original method and apparatus, and it is expected that the present invention will make a significant contribution in this field in the near future.

Claims (16)

1. A processing apparatus of a fine structure, which processes the fine structure by holding a molding material between a mold and an opposing platen and pressing/heating/molding the molding material, wherein

The opposed platen has:

a first block comprising heating means on a side opposite to the modeling material,

a second block on an opposite side of the side opposite the molding material, an

The first block and the second block are provided so as to be relatively movable between a position where the first block and the second block are in contact with each other and other positions where the first block and the second block are separated from each other, respectively; and

bringing the second block into contact with the first block while heating the first block with the heating device, and controlling the second block to be separated from the first block while cooling the first block.

2. A processing apparatus of a fine structure, which processes a fine structure by holding a molding material between a mold and an opposing platen and pressing/heating/molding the molding material,

further comprising a heating/cooling block for heating and cooling the mold from the back side thereof, wherein

The heating/cooling block includes:

a first block comprising heating means on a side opposite to the modeling material,

a second block on an opposite side of the side opposite the molding material, an

The first block and the second block are provided so as to be relatively movable between a position where the first block and the second block are in contact with each other and other positions where the first block and the second block are separated from each other, respectively; and

bringing the second block into contact with the first block while heating the first block with the heating device, and controlling the second block to be separated from the first block while cooling the first block.

3. Apparatus for working fine structures as claimed in claim 1 or 2, wherein

The second block has a heat capacity that is greater than 30% of a total heat capacity of the first block and the second block.

4. Apparatus for working fine structures as claimed in claim 1 or 2, wherein

A third block brought into contact with the first block to cool the first block.

5. The fine structure processing apparatus as claimed in claim 1 or 2, having a vacuum adsorber for bringing each of said blocks into contact with said first block by vacuum adsorption of said each block with said first block.

6. A processing apparatus for fine structure as claimed in claim 1 or 2, wherein

The roughness (Ra) of the contact surface of each block is 0.5 [ mu ] m or less in the contact between the first block and each block.

7. A processing apparatus for fine structure as claimed in claim 1 or 2, wherein

The heating device is a heater prepared by forming a heating element on a ceramic member to generate heat by applying a voltage.

8. A device for working fine structures as claimed in claim 7, wherein

The ceramic is a material selected from the group consisting of aluminum oxide, aluminum nitride, silicon carbide, and boron nitride.

9. Apparatus for working fine structures as claimed in claim 1 or 2, wherein

Each of the blocks is a material selected from the group consisting of aluminum, magnesium, copper, iron, stainless steel, alumina, aluminum nitride, silicon carbide, and boron nitride.

10. A processing apparatus for fine structures as claimed in claim 1 or 2, further comprising a preheater for preheating the molding material before heating/molding.

11. A method of processing a fine structure by holding a molding material between a mold and an opposed platen and pressing/heating/molding the molding material to process the fine structure,

the opposed platen has:

a first block comprising heating means on a side opposite to the modeling material,

a second block on an opposite side of the side opposite the molding material, an

Comprises the following steps

Performing pressurization/heating/molding of the molding material while changing the volume of the opposed platen in the case of heating and cooling; and

bringing the second block into contact with the first block while heating the first block with the heating device; and

controlling the second block to be separated from the first block when cooling the first block.

12. A method of processing a fine structure by holding a molding material between a mold and an opposed platen and pressing/heating/molding the molding material to process the fine structure,

comprising a heating/cooling block for heating/cooling the mold from the back side thereof, an

The heating/cooling block includes:

a first block comprising heating means on a side opposite to the modeling material,

a second block located on an opposite side of the side opposite the molding material, and including the steps of

Performing pressurization/heating/molding of the molding material while changing the volume of the heating/cooling block in the case of heating and cooling; and

bringing the second block into contact with the first block while heating the first block with the heating device; and

controlling the second block to be separated from the first block when cooling the first block.

13. The method of processing a fine structure of claim 12, further comprising heating and cooling another heating/cooling block of the mold from the back surface of the opposed platen,

the pressing/heating/molding of the molding material is performed while changing the volume of the other heating/cooling block in the case of heating and cooling.

14. A method of processing a fine structure by sandwiching a molding material between a mold and an opposed platen and pressing/heating/molding the molding material, wherein the fine structure is processed

The opposed platen includes:

a first block comprising heating means on a side opposite to the modeling material,

a second block on an opposite side of the side opposite the molding material, an

Said method is characterized by the following steps

When the first block is heated by the heating means, the second block is brought into contact with the first block, and

controlling the second block to be separated from the first block while cooling the first block,

after the second piece is separated, a third piece is brought into contact with the first piece.

15. A method of processing a fine structure by holding a molding material between a mold and an opposed platen and pressing/heating/molding the molding material to process the fine structure,

a heating/cooling block is included to heat and cool the mold from the back side of the mold, the heating/cooling block including:

a first block comprising heating means on a side opposite to the modeling material,

a second block on an opposite side of the side opposite the molding material, an

Characterized by the following steps

When the first block is heated by the heating means, the second block is brought into contact with the first block, and

controlling the second block to be separated from the first block while cooling the first block,

after the second piece is separated, a third piece is brought into contact with the first piece.

16. The method of processing a fine structure of claim 15 further comprising another heating/cooling block for heating and cooling said mold from the back side thereof, and

characterized by the following steps

While cooling the molding material, separating an opposite portion of a side opposite to the molding material from the other heating/cooling block when heating the molding material, an

Contacting another external member with the remaining another heating/cooling block after the partial separation.