HK1191761B - Wireless power transfer and near field communication enabled communication device - Google Patents
Wireless power transfer and near field communication enabled communication device Download PDFInfo
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- HK1191761B HK1191761B HK14104950.4A HK14104950A HK1191761B HK 1191761 B HK1191761 B HK 1191761B HK 14104950 A HK14104950 A HK 14104950A HK 1191761 B HK1191761 B HK 1191761B
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Abstract
The invention discloses a wireless power transfer and near field communication enabled communication device. Various configurations and arrangements of various communication devices are disclosed. Various integrated circuits that form these communication devices can be fabricated onto one or more semiconductor substrates, chips, and/or dies using a high voltage semiconductor process, a low voltage semiconductor process, or any combination thereof. Some of these high voltage and/or low voltage semiconductor process integrated circuits can be fabricated along with other high voltage and/or low voltage semiconductor process integrated circuits of other modules onto a single semiconductor substrate, chip, and/or die. This allows the low voltage semiconductor process integrated circuits and/or high voltage semiconductor process integrated circuits of one module to be combined with low voltage semiconductor process integrated circuits and/or high voltage semiconductor process integrated circuits of another module of the communication device.
Description
CROSS-REFERENCE TO RELATED APPLICATIONS
The present invention claims priority from U.S. patent application US13/595,020 filed on 8/27/2012, the entire contents of which are incorporated herein by reference.
Technical Field
The present invention relates generally to communication devices, and more particularly, to implementing Wireless Power Transfer (WPT) and Near Field Communication (NFC) within a communication device.
Background
Cellular phones have evolved from large devices capable of performing only analog voice communication to smaller devices capable of performing digital voice communication and digital data communication, such as Short Message Service (SMS) for text messaging, e-mail, packet exchange for accessing the internet, games, bluetooth, and Multimedia Messaging Service (MMS). In addition to these capabilities, today's cellular telephones have additional non-communication related capabilities, such as audio and/or video recording, and software applications such as calendars and phone books. Even with these capabilities in mind, manufacturers of cellular telephones will still place even more capabilities into cellular telephones and make these more powerful cellular telephones smaller. For example, manufacturers place Wireless Power Transfer (WPT) capabilities in cellular telephones, allowing these WPT enabled cellular telephones to wirelessly charge their internal batteries from a wireless power source without using a wired connection.
Disclosure of Invention
According to an embodiment of the present invention, there is provided a communication apparatus supporting Wireless Power Transfer (WPT), including: a plurality of modules configured to provide communication with a communication device according to a plurality of communication standards; a communication interface configured to communicatively couple the plurality of modules to one another, wherein a first module from the plurality of modules is configured to implement a standard from the plurality of communication standards, a first portion of the first module is fabricated using a high voltage semiconductor process, and a second portion of the first module is fabricated using a low voltage semiconductor process.
Further, the first portion of the first module is fabricated on a first semiconductor substrate using a high voltage semiconductor process, and wherein the second portion of the first module is fabricated on a second semiconductor substrate communicatively coupled to the first portion using a low voltage semiconductor process.
Further, the first module is configured to provide near field communication between the wireless power transfer enabled communication device and another near field communication enabled device according to a near field communication standard.
Further, the first module is further configured to inductively receive a magnetic field from another NFC-enabled device, and to recover information from the magnetic field and to derive the obtained power from the magnetic field.
Further, the plurality of modules includes a secure element configured to receive the obtained power.
Further, the first module is further configured to receive a power transfer signal from a wireless power transmitter.
Further, the first module is further configured to derive the obtained power from the power transfer signal and provide the obtained power to other modules from the plurality of modules.
Further, the other modules from the plurality of modules include a power management unit.
According to another embodiment of the present invention, there is provided a communication apparatus supporting Wireless Power Transfer (WPT), including: a plurality of modules configured to provide communication between the wireless power transfer enabled communication device and other standard enabled communication devices according to a plurality of communication standards, wherein a first module from the plurality of modules is configured to operate in cooperation with a second module from the plurality of modules to implement a first communication standard from the plurality of communication standards, wherein the first module is manufactured using a high voltage semiconductor process, and wherein the second module is manufactured using a low voltage semiconductor process.
Further, the first module operates in cooperation with the second module to provide near field communication between the wireless power transfer enabled communications device and another near field communication enabled device in accordance with a near field communication standard.
Further, the first module comprises: a front end module configured to provide an interface between the other near field communication enabled device and the wireless power transfer enabled communication device.
Further, the front end module is further configured to inductively receive a magnetic field from the other near field communication enabled device, recover information from the magnetic field, and derive the obtained power from the magnetic field.
Further, the second module comprises: a near field communication controller configured to receive the information and the obtained power from the first module.
Further, the front end module is further configured to receive a power transfer signal from a wireless power transmitter.
Further, the communication device supporting wireless power transmission further includes: a power management unit configured to receive the obtained power derived from the power transfer signal and provide a power signal based on the obtained power to other modules from the plurality of modules.
Further, the first module is configured to operate in cooperation with a third module from the plurality of modules to implement a second communication standard from the plurality of communication standards, wherein the third module is fabricated using a low voltage semiconductor process.
Further, the second communication standard is a cellular communication standard.
According to still another embodiment of the present invention, there is provided a front end module implemented as part of a communication device supporting Wireless Power Transfer (WPT), including: an antenna module configured to inductively receive a magnetic field from another near field communication enabled device and a power transfer signal from a wireless power transmitter; a first power harvesting module configured to derive a first harvested power from the magnetic field; and a second power harvesting module configured to harvest a second harvested power from the power transfer signal.
Further, the front-end module further comprises: a modulator configured to modulate transmission information according to a modulation technique to provide a modulated information signal; and a demodulator configured to demodulate the magnetic field to recover information from the magnetic field, wherein the antenna module is configured to apply the modulated information signal to the inductive coupling element to generate a magnetic field to provide a transmission communication signal.
Further, the antenna module includes a first inductive coupling element configured to receive the magnetic field from the other near field communication enabled device, and a second inductive coupling element configured to receive the power transfer signal from the wireless power transmitter.
Drawings
Embodiments of the present invention are described with reference to the accompanying drawings. In the drawings, like reference numbers indicate identical or functionally similar elements. Additionally, the left-most digit(s) of a reference number identifies the drawing in which the reference number first appears.
Fig. 1 illustrates a block diagram of a first exemplary Wireless Power Transfer (WPT) enabled communication device according to an exemplary embodiment of the present invention;
fig. 2 further illustrates a block diagram of a first exemplary WPT enabled communication device, according to an exemplary embodiment of the present invention;
figure 3 illustrates a block diagram of an exemplary front end module that may be implemented within a first exemplary WPT enabled communication device, according to an exemplary embodiment of the present invention;
fig. 4 shows a block diagram of a second exemplary WPT enabled communication device according to an exemplary embodiment of the present invention; and
fig. 5 further illustrates a block diagram of a second exemplary WPT enabled communication device according to an exemplary embodiment of the present invention.
The present invention will now be described with reference to the accompanying drawings. In the drawings, like reference numbers generally indicate identical, functionally similar, and/or structurally similar elements. The drawing in which an element first appears is indicated by the leftmost digit(s) in the reference number.
Detailed Description
The following detailed description refers to the accompanying drawings in order to illustrate exemplary embodiments consistent with this invention. References in the detailed description to "one exemplary embodiment", "one example exemplary embodiment", etc., indicate that the exemplary embodiment described may include a particular feature, structure, or characteristic, but every exemplary embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases are not necessarily referring to the same exemplary embodiment. Further, when a particular feature, structure, or characteristic is described in connection with an exemplary embodiment, it is submitted that it is within the knowledge of one skilled in the relevant art to effect such feature, structure, or characteristic in connection with other exemplary embodiments whether or not explicitly described.
The exemplary embodiments described herein are provided for illustration and are not limiting. Other exemplary embodiments are possible and modifications can be made within the spirit and scope of the invention. Therefore, the detailed description is not meant to limit the invention. Rather, the scope of the invention is defined only by the following claims and equivalents thereof.
Embodiments of the invention may be implemented in hardware, firmware, software, or any combination thereof. Embodiments of the invention may also be implemented as instructions stored on a machine-readable medium, which may be read and executed by one or more processors. A machine-readable medium may include any mechanism for storing or transmitting information in a form readable by a machine (e.g., a computing device). For example, a machine-readable medium may include a non-transitory machine-readable medium such as Read Only Memory (ROM); random Access Memory (RAM); a magnetic disk storage medium; an optical storage medium; a flash memory device; and other storage media. For example, a machine-readable medium may include a transitory machine-readable medium such as an electrical, optical, acoustical or other form of propagated signals (e.g., carrier waves, infrared signals, digital signals, etc.). Further, firmware, software, routing, instructions may be described herein as performing certain actions. However, it should be appreciated that such descriptions are merely for convenience and that such actions in fact result from computing devices, processors, controllers, or other devices executing the firmware, software, routines, instructions, etc.
The following detailed description of exemplary embodiments will so fully reveal the general nature of the invention that others can, by applying knowledge within the skill of the relevant art, readily modify and/or adapt for various applications such exemplary embodiments without undue experimentation, without departing from the spirit and scope of the present invention. Accordingly, such applications and modifications are intended to be within the meaning and equivalents of the exemplary embodiments based on the teaching and guidance presented herein. It is to be understood that the phraseology or terminology herein is for the purpose of description and not of limitation, such that the terminology or phraseology of the present specification is to be interpreted by the skilled artisan in light of the teachings herein.
For purposes of this discussion, the term "module" is understood to include at least one of software, firmware, and hardware (e.g., one or more circuits, microchips or devices, or any combination thereof), as well as any combination thereof. In addition, it is understood that each module may include one or more than one component within an actual device, and that each component that may form a portion of the described module may operate in cooperation with, or independently of, any other component that forms a portion of the module. Rather, the various modules described herein may represent a single component within an actual device. Further, the components within a module may be distributed in a single device, or among multiple devices in a wired or wireless manner.
SUMMARY
The following detailed description describes various configurations and arrangements of various Wireless Power Transfer (WPT) enabled communication devices. WPT enabled communication devices include a variety of integrated circuits that may be fabricated on one or more semiconductor substrates, chips, and/or dies using high voltage semiconductor processes, low voltage semiconductor processes, or any combination thereof. Some of these integrated circuits manufactured with high and low voltage semiconductor processes may be manufactured on a single semiconductor substrate, chip, and/or die along with other integrated circuits also manufactured with high and low voltage semiconductor processes. This allows the integrated circuit of one module to be combined with the integrated circuit of another module of the WPT enabled communication device.
First exemplary WPT-enabled communication device
Fig. 1 illustrates a block diagram of a first exemplary WPT enabled communication device according to an exemplary embodiment of the present invention. The WPT enabled communication device 100 communicates information via wired and/or wireless communication networks according to various communication standards. The WPT enabled communication device 100 may represent a mobile communication device such as a cellular telephone or smartphone, a mobile computing device such as a tablet computer or laptop computer, or any other electronic device capable of communicating information via a network as would be apparent to one of ordinary skill in the relevant art without departing from the spirit and scope of the present invention. The WPT enabled communication device 100 may include a Near Field Communication (NFC)/Wireless Power Transfer (WPT) module 102, a bluetooth module 104, a Global Positioning System (GPS) module 106, a cellular module 108, a secure element 110, a host processor 112, a Wireless Local Area Network (WLAN) module 114, or any combination thereof, communicatively coupled to one another via a communication interface 116. It should be noted that the WPT enabled communication device 100 need not include all of the NFC/WPT module 102, the bluetooth module 104, the GPS module 106, the cellular module 108, the secure element 110, the host processor 112, and/or the WLAN module 114. A person skilled in the relevant art will recognize that other configurations and arrangements of the WPT enabled communication device 100 are possible without departing from the spirit and scope of the present invention. Additionally, one skilled in the relevant art will also recognize that the NFC/WPT module 102, bluetooth module 104, GPS module 106, cellular module 108, secure element 110, host processor 112, and/or WLAN module 114 need not be communicatively coupled to one another via the communication interface 116. In these situations, the modules communicatively coupled to the communication interface 116 may communicate independently with other supporting communication devices without internal communication.
The NFC/WPT module 102 provides communication between the WPT enabled communication device 100 and another NFC enabled device according to various NFC standards. The NFC/WPT module 102 is configured to operate in a initiator or reader mode of operation to initiate communication with another NFC-enabled device or in a target or tag mode to receive communication from another NFC-enabled device. Additionally, when operating in the tag mode of operation, the NFC/WPT module 102 may derive or draw power from communications received from the other NFC-enabled device. Typically, the power taken or obtained from the received communication is sufficient to operate the NFC/WPT module 102 and/or the secure element 110.
Additionally, the NFC/WPT module 102 supports wireless power transfer, referred to as WPT, from a wireless power transmitter or another similar electronic device that transmits a magnetic field. The NFC/WPT module 102 may derive or acquire power from the received WPT signal, e.g., magnetic resonance provided by a wireless power transmitter. Typically, this power taken or derived from the received WPT signal is sufficient to operate the NFC/WPT module 102 and/or the secure element 110.
The bluetooth module 104 provides wireless communication between the WPT enabled communication device 100 and another bluetooth enabled device according to various bluetooth or Bluetooth Low Energy (BLE) standards. Bluetooth module 104 may be configured to operate in a master mode of operation to initiate communication with another bluetooth enabled device or configured to operate in a slave mode of operation to receive communication from another bluetooth enabled device.
The GPS module 106 receives various signals from various satellites to calculate the position of the WPT enabled communication device 100. The GPS module 106 is typically implemented using a Global Navigation Satellite System (GNSS) receiver that calculates the location of the WPT enabled communication device 100 using the GPS, GLONASS, galileo and/or beidou systems.
The cellular module 108 provides wireless communication between the WPT enabled communication device 100 and another cellular enabled device via a cellular network according to various cellular communication standards, such as the third generation partnership project (3 GPP) Long Term Evolution (LTE) communication standard, the fourth generation (4G) mobile communication standard, or the third generation (3G) mobile communication standard, to provide examples. The cellular module 108 may communicate with one or more transceivers within the cellular network, referred to as base stations or access points, to provide voice or data communication between the WPT enabled communication device 100 and another cellular enabled device. Often, the transceiver is connected to a cellular telephone switch that is connected to the public telephone network or another cellular telephone switch within the cellular network.
The secure element 110 securely stores applications and/or information, such as payment information, authentication information, ticketing information, and/or sales information, as examples, within the WPT enabled communication device 100 and provides an environment for secure execution of these applications. The secure element 110 may be implemented as a separate secure smart card chip in a Subscriber Identity Module (SIM)/Universal Integrated Circuit Card (UICC) or in a Secure Digital (SD) card that may be inserted into the WPT enabled communication device 100.
The host processor 112 controls the overall operation and/or configuration of the WPT enabled communication device 100. Host processor 12 may receive information from a user interface such as a touch screen display, alphanumeric keypad, microphone, mouse, speaker, and/or from other electronic or host devices coupled to WPT enabled communication device 100. Host processor 112 may provide this information to NFC/WPT module 102, bluetooth module 104, GPS module 106, cellular module 108, secure element 110, and/or WLAN module 114. Additionally, the host processor 112 may receive information from the NFC/WPT module 102, the bluetooth module 104, the Global Positioning System (GPS) module 106, the cellular module 108, the secure element 110, and/or the WLAN module 114. Host processor 112 may provide this information to a user interface, to other electronic devices or host devices, and/or to NFC/WPT module 102, bluetooth module 104, GPS module 106, cellular module 108, secure element 110, and/or WLAN module 114. Further, host processor 112 may execute one or more applications, such as a Short Message Service (SMS) for text messaging, email, and/or audio and/or video recording, and/or a software application for a calendar and/or phone book, as examples.
The WLAN module 114 provides wireless communication between the WPT enabled communication device 100 and another WLAN enabled device via wired and/or wireless communication networks according to various networking protocols, such as, by way of example, the Worldwide Interoperability for Microwave Access (WiMAX) communication standard or the Wi-Fi communication standard. The WLAN module 114 may operate as an access point to provide communication between other WLAN-enabled devices and a communication network, or as a client to communicate with another access point (e.g., a wireless router) to access a communication network.
The communication interface 116 routes various communications between the NFC/WPT module 102, the bluetooth module 104, the GPS module 106, the cellular module 108, the secure element 110, the host processor 112, and/or the WLAN module 114. These communications may include, for example, one or more commands and/or data, various digital signals, various analog signals, such as, for example, Direct Current (DC) current and/or voltage, or any combination thereof. The communication interface 116, and other communication interfaces discussed below, may be implemented as a series of wired and/or wireless interconnections between the NFC/WPT module 102, the bluetooth module 104, the GPS module 106, the cellular module 108, the secure element 110, the host processor 112, and/or the WLAN module 114. The interconnection of the communication interfaces 116 and the interconnection of the other communication interfaces discussed below may be arranged to form a parallel interface that uses multiple wires in parallel to perform communications between the various modules of the WPT enabled communication device 100, a serial interface that uses a single wire to perform communications between the various modules of the WPT enabled communication device 100, or any combination thereof.
Further description of a first exemplary WPT enabled communication device
In general, a WPT enabled communication device, such as WPT enabled communication device 100, includes one or more integrated circuits configured and arranged to form one or more modules, such as NFC/WPT module 102, bluetooth module 104, GPS module 106, cellular module 108, secure element 110, host processor 112, and/or WLAN module 114. These integrated circuits may be fabricated on one or more semiconductor substrates, chips, and/or dies using high voltage semiconductor processes, low voltage semiconductor processes, or any combination thereof, referred to as high voltage process semiconductor integrated circuits or low voltage process semiconductor integrated circuits. In an exemplary embodiment, the high voltage semiconductor process is a bipolar complementary metal oxide semiconductor (BiCMOS) process, and the low voltage semiconductor process is a 28nm or 40nm cmos process. However, it will be apparent to those skilled in the relevant art that other high voltage and/or low voltage semiconductor processes are possible without departing from the spirit and scope of the invention.
Generally, high voltage semiconductor process integrated circuits may be operated at higher power levels, e.g., at higher voltages and/or higher currents, when compared to low voltage process semiconductor integrated circuits. High voltage semiconductor process integrated circuits occupy a larger area, i.e. have a larger physical size, than low voltage process semiconductor integrated circuits. These larger physical dimensions allow high voltage semiconductor process integrated circuits to operate at higher power levels. However, these larger physical dimensions undesirably increase parasitic components, such as capacitance, inductance, and/or resistance, as examples, within high voltage semiconductor process integrated circuits. As a result, high voltage semiconductor process integrated circuits typically operate at lower speeds when compared to low voltage process semiconductor integrated circuits.
Fig. 2 further shows a block diagram of a first exemplary WPT enabled communication device according to an exemplary embodiment of the present invention. The WPT enabled communication device 200 includes one or more integrated circuits configured and arranged to form one or more modules for communicating information via wired and/or wireless communication networks according to various communication standards. Some of these modules, or portions thereof, operating at higher power levels may be manufactured using high voltage semiconductor processes and, if manufactured using low voltage semiconductor processes, may not be safely and reliably operated at these higher power levels. Other modules of the WPT enabled communication device 200, or portions thereof, operating at greater speeds are typically formed using low voltage semiconductor processes. These modules, or parts thereof, may not operate reliably at these greater speeds if manufactured using high voltage semiconductor processes. Other modules or portions thereof that are neither operating at a greater power level nor at a greater speed are typically formed using low voltage semiconductor processes, thereby reducing the area they occupy as compared to being formed using high voltage semiconductor processes.
The WPT enabled communication device 200 includes a NFC/WPT module 202, a cellular module 204, and a secure element 206 communicatively coupled to each other via a communication interface 208. The WPT enabled communication device 200 may represent an exemplary embodiment of the WPT enabled communication device 100. Likewise, NFC/WPT module 202, cellular module 204, secure element 206, and communication interface 208 may represent exemplary implementations of NFC/WPT module 102, cellular module 108, secure element 110, and communication interface 116, respectively. Additionally, the WPT enabled communication device 200 may further include a bluetooth module, a GPS module, a host processor, and/or a WLAN module, such as the bluetooth module 104, the GPS module 106, the host processor 112, and/or the WLAN module 114, respectively. The bluetooth module, GPS module, host processor, and/or WLAN module are communicatively coupled to the NFC/WPT module 202, cellular module 204, and/or secure element 206 via a communication interface 208.
The NFC/WPT module 202 provides a wireless connection between the WPT enabled communication device 200 and another NFC capable device and a WPT from a wireless power transmitter in a reader or tag mode of operation according to various NFC standards in a substantially similar manner as the NFC/WPT module 102. The NFC/WPT module 202 includes a front-end module 210 and an NFC controller 212.
The front-end module 210 provides an interface between the NFC/WPT module 202 and another NFC enabled device and/or a wireless power transmitter. The front end module 210 receives a received WPT signal 250 from a wireless power transmitter. The front-end module 210 derives or derives power from the received WPT signal 250 to provide the derived WPT power to the FEM-CI communication interface 252 for routing via the communication interface 208 to the NFC/WPT module 202, the cellular module 204, the secure element 206, and/or other modules within the WPT enabled communication device 200. In an exemplary embodiment, the communication interface 208 routes the obtained WPT power from the FEM-CI communication interface 252 to a Power Management Unit (PMU) 214 of the cellular module 204.
Additionally, when the NFC/WPT module 202 operates in the reader mode of operation, the front end module 210 generates a magnetic field referred to as a transmit NFC communication signal 256, which is then modulated with information by another NFC enabled device to form a received NFC communication signal 254. The front-end module 210 may also modulate the magnetic field with information, such as data and/or one or more commands, received from the FEM-CTRLR communication interface 258 to form a transmitted NFC communication signal 256 when the NFC/WPT module 202 operates in the reader mode of operation. Alternatively, when the NFC/WPT module 202 operates in the tag mode of operation, the front-end module 210 inductively receives a received NFC communication signal 254 representing a magnetic field generated by another NFC-enabled device that may be modulated with information. When the NFC/WPT module 202 operates in the tag mode of operation, the front-end module 210 may also modulate the magnetic field with information, such as data and/or one or more commands, received from the FEM-CTRLR communication interface 258 to form a transmitted NFC communication signal 256. Optionally, front-end module 210 derives or derives power from received NFC communication signal 254, providing the derived NFC power to NFC controller 212 via FEM-CTRLR communication interface 258.
When the NFC/WPT module 202 operates in the reader and tag mode of operation, the front-end module 210 recovers information from the received NFC communication signal 254 and then provides the information to the controller module 212 via the FEM-CTRLR communication interface 258. Specifically, the front-end module 210 converts its own magnetic field into a voltage and/or current when the NFC/WPT module 202 operates in the reader mode of operation, or the front-end module 210 converts a magnetic field generated by another NFC-enabled device into a voltage and/or current when the NFC/WPT module 202 operates in the tag mode of operation to recover information from the voltage and/or current.
The NFC controller 212 controls the overall operation and/or configuration of the NFC/WPT module 202. The NFC controller 212 receives information and/or obtains NFC power from the front-end module 210 via the FEM-CTRLR communication interface 258. Additionally, the NFC controller 212 may route information from the FEM-CTRLR communication interface 258 and/or the obtained NFC power to the CTRLR-CI communication interface 260 for routing to the NFC/WPT module 202, the cellular module 204, the secure element 206, and/or other modules within the WPT enabled communication device 200 via the communication interface 208. Further, the NFC controller 212 may receive information from the NFC/WPT module 202, the cellular module 204, the secure element 206, and/or other modules within the WPT enabled communication device 200 via the CTRLR-CI communication interface 260. The NFC controller 212 may route information received from the CTRLR-CI communication interface 260 to the front end module 210 via the FEM-CTRLR communication interface 258. Further, the NFC controller 212 may execute one or more commands provided by information from the FEM-CTRLR communication interface 258 and/or CTRLR-CI communication interface 260 to control overall operation and/or configuration of the NFC/WPT module 202.
Generally, the NFC/WPT module 202 is manufactured using a high voltage semiconductor process to form a first portion of the NFC/WPT module 202, i.e., the front end module 210, and the NFC/WPT module 202 is manufactured using a low voltage semiconductor process to form a second portion of the NFC/WPT module 202, i.e., the NFC controller 212. A high voltage semiconductor process may be used to form the high voltage semiconductor process integrated circuit of the front end module 210, and a low voltage semiconductor process may be used to form the low voltage semiconductor process integrated circuit of the NFC controller 212. The high voltage semiconductor process integrated circuit of the front end module 210 and the low voltage semiconductor process integrated circuit of the NFC controller 212 may be fabricated on a single semiconductor substrate. Alternatively, the high voltage semiconductor process integrated circuit of the front end module 210 and the low voltage semiconductor process integrated circuit of the NFC controller 212 may be fabricated on multiple semiconductor substrates, chips, and/or dies. In this alternative, the high voltage semiconductor process integrated circuit of the front end module 210 may be fabricated on a first semiconductor substrate from the plurality of semiconductor substrates, chips, and/or dies, and the low voltage semiconductor process integrated circuit of the NFC controller 212 may be fabricated on a second semiconductor substrate from the plurality of semiconductor substrates, chips, and/or dies.
Cellular module 204 provides wireless communication between WPT enabled communication device 200 and another cellular enabled communication device via a cellular network according to various cellular communication standards in a manner substantially similar to cellular module 108. The cellular module 204 includes a PMU214, a baseband module 216, and a radio frequency module 218.
The PMU214 is responsible for battery and power system management of the cellular module 204 and/or the WPT enabled communication device 200. The PMU receives various power signals from the NFC/WPT module 202, the cellular module 204, the secure element 206, and/or other modules within the WPT enabled communication device 200 from the communication interface 208 via the PMU-CI communication interface 262. In an exemplary embodiment, the PMU214 receives the derived WPT power from the NFC/WPT module 202 via the PMU-CI communication interface 262. In this example embodiment, the PMU214 may use the obtained WPT power to develop various power signals and route these various power signals to the PMU-CI communication interface 262 to power the NFC/WPT module 202, the secure element 206, and/or other modules within the WPT enabled communication device 200 via the communication interface 208. The PMU214 may monitor the power signals received from the PMU-CI communication interface 262 to monitor current, voltage, and/or temperature readings within the WPT enabled communication device 200. Additionally, the PMU214 may use the power signal received from the PMU-CI communication interface 262 to monitor the power connection and battery charge and/or to charge the battery when necessary. Further, the PMU214 may use the power signals received from the PMU-CI communication interface 262 to control and/or provide other power signals to the PMU-CI communication interface 262 to power the NFC/WPT module 202, the secure element 206, and/or other modules within the WPT enabled communication device 200 via the communication interface 208.
The baseband module 216 controls the operation of the cellular module 204. The baseband module 216 receives information from the radio frequency module 218 via the BB-RFM communication interface 264. Additionally, the baseband module 216 may provide information from the BB-RFM communication interface 264 to the BB-CI communication interface 266 for routing to the NFC/WPT module 202, the secure element 206, and/or other modules within the WPT enabled communication device 200 via the communication interface 208. Further, the baseband module 216 may receive information from the NFC/WPT module 202, the secure element 206, and/or other modules within the WPT enabled communication device 200 from the communication interface 208 via the BB-CI communication interface 266. The baseband module 216 may route information received from the BB-CI communication interface 266 to the radio frequency module 218 via the BB-RFM communication interface 264. Further, the baseband module 216 may execute one or more commands provided by information from the BB-RFM communication interface 264 and/or the BB-CI communication interface 266, thereby controlling the overall operation and/or configuration of the cellular module 204.
The radio frequency module 218 down-converts, demodulates and/or decodes the received cellular communication signal 272 to provide information to the baseband module 216 via the BB-RFM communication interface 264. The radio frequency module 218 may convert the received cellular communication signal 272 from an analog representation to a digital representation. The radio frequency module 218 upconverts, modulates, and/or decodes information received from the baseband module 216 via the BB-RFM communication interface 264, thereby providing a transmit cellular communication signal 270. The radio frequency module 218 may convert information received from the BB-RFM communication interface 264 from a digital representation to an analog representation.
In general, the cellular module 204 is manufactured by forming the PMU214 using a high voltage semiconductor process and forming the baseband module 216 and the RF module 218 using a low voltage semiconductor process. High voltage semiconductor processes may be used to form the high voltage semiconductor process integrated circuits of PMU214, while low voltage semiconductor processes may be used to form the low voltage semiconductor process integrated circuits of baseband module 216 and rf module 218. The high voltage semiconductor process integrated circuit of PMU214 and the low voltage semiconductor process integrated circuits of baseband module 216 and rf module 218 may be fabricated on a single semiconductor substrate. Alternatively, the high voltage semiconductor process integrated circuits of the PMU214 and the low voltage semiconductor process integrated circuits of the baseband module 216 and the RF module 218 may be fabricated on multiple semiconductor substrates, chips, and/or dies. In this alternative, the high voltage semiconductor process integrated circuits of the PMU214 may be fabricated on a first semiconductor substrate from the plurality of semiconductor substrates, chips, and/or dies, and the low voltage semiconductor process integrated circuits of the baseband module 216 and the radio frequency module 218 may be fabricated on a second semiconductor substrate from the plurality of semiconductor substrates, chips, and/or dies. In some cases, other modules of the WPT enabled communication device 200, such as the NFC controller 212, fabricated using low voltage semiconductor process integrated circuits may also be fabricated on a single semiconductor substrate and/or multiple semiconductor substrates, chips, and/or dies along with the baseband module 216 and the radio frequency module 218. In other cases, other modules of the WPT enabled communication device 200, such as the front end module 210, manufactured using high voltage semiconductor process integrated circuits may also be manufactured on a single semiconductor substrate and/or multiple semiconductor substrates, chips, and/or dies along with the PMUs 214.
The secure element 206 securely stores applications and/or information within the WPT enabled communication device 200 in a manner substantially similar to the secure element 110 and provides an environment for the secure execution of these applications. The secure element 206 may receive information from the NFC/WPT module 202, the cellular module 204, and/or other modules within the WPT enabled communication device 200 from the communication interface 208 via the SE-CI communication interface 268. The secure element 206 may provide this information and/or other information generated by the application to the SE-CI communication interface 268 for routing to the NFC/WPT module 202, the cellular module 204, and/or other modules within the WPT enabled communication device 200 via the communication interface 208.
Exemplary front end module that may be implemented within a first exemplary WPT enabled communication device
Fig. 3 illustrates a block diagram of an exemplary front end module that may be implemented within a first exemplary WPT enabled communication device, according to an exemplary embodiment of the present invention. The front-end module 300 provides an interface between a WPT enabled communication device, such as the WPT enabled communication device 100 or the WPT enabled communication device 200 as examples, and an NFC enabled device and/or a wireless power transmitter. The front-end module 300 inductively receives various signals from the NFC enabled device and/or the wireless power transmitter and recovers information and various power signals from the various signals. The front end module 300 includes an NFC modulator module 302, an antenna module 304, an NFC demodulator module 306, an NFC power harvesting module 308, and a WPT power harvesting module 310. The front end module 300 may represent an exemplary embodiment of the front end module 210.
When the WPT enabled communication device is operating in the reader mode of operation, the NFC modulator module 302 modulates the transmission information 350 onto a carrier wave, such as a radio frequency carrier wave having a frequency of about 13.56MHz, to provide the modulated information signal 352, using any suitable analog or digital modulation technique. Suitable analog or digital modulation techniques may include Amplitude Modulation (AM), Frequency Modulation (FM), Phase Modulation (PM), Phase Shift Keying (PSK), Frequency Shift Keying (FSK), Amplitude Shift Keying (ASK), Quadrature Amplitude Modulation (QAM), and/or any other suitable modulation technique apparent to one skilled in the relevant art. The transmission information 350 may be received from other modules of the WPT enabled communication device via a communication interface, such as the FEM-CTRLR communication interface 258 as an example. In some cases, NFC modulator module 302 may simply provide a carrier wave as modulated information signal 352. Additionally, when the WPT enabled communication device is operating in the tag mode of operation, the NFC modulator module 302 may modulate the transmission information 350 using a suitable analog or digital modulation technique to provide a modulated information signal 352.
The antenna module 304 inductively receives the received WPT signal 250 from the wireless power transmitter to provide a recovered WPT signal 360 and/or the received NFC communication signal 254 from another NFC capable device to provide a recovered NFC image signal 354. The antenna module 304 may include a first inductive coupling element (e.g., a first resonant tuning circuit, as an example) tuned to receive the received WPT signal 250 and a second inductive coupling element (e.g., a second resonant tuning circuit, as an example) tuned to receive the received NFC communication signal 254. For example, the first inductive coupling element may be tuned between about 100kHz and 250kHz to receive the received WPT signal 250, and the second inductive coupling element may be tuned to about 13.56MHz to receive the received NFC communication signal 254. Alternatively, the antenna module 304 may include a single inductive coupling element (e.g., a resonant tuning circuit) tuned to receive the received WPT signal 250 and the received NFC signal 254. In this alternative, a single inductive tuning circuit may resonate at a first frequency to receive the received WPT signal 250 and resonate at a second frequency to receive the received NFC communication signal 254. Alternatively, a single inductive coupling element may represent a broadband coupling element that may receive both received WPT signals 250 and received NFC communication signals 254.
In addition, the antenna module 304 provides a transmit NFC communication signal 256 based on the modulated information signal 352. When the WPT enabled communication device is operating in the reader mode of operation, the antenna module 304 applies the modulated information signal 352 to the second inductive coupling element or the single inductive coupling element, thereby generating a magnetic field representative of the transmitted NFC communication signal 256. Alternatively, the antenna module 304 may apply the modulated information signal 352 to a second inductive coupling element or a single inductive coupling element, thereby modulating the magnetic field inductively coupled to any of these inductive coupling elements with the modulated information signal 352 to provide the transmit communication signal 256.
The NFC demodulator module 306 demodulates the recovered NFC communication signal 354 using any suitable analog or digital demodulation technique to provide a recovered information signal 356. Suitable analog or digital modulation techniques may include Amplitude Modulation (AM), Frequency Modulation (FM), Phase Modulation (PM), Phase Shift Keying (PSK), Frequency Shift Keying (FSK), Amplitude Shift Keying (ASK), Quadrature Amplitude Modulation (QAM), and/or any other suitable modulation technique apparent to one skilled in the relevant art. The recovered information 356 may be provided to other modules of the WPT enabled communication device via a communication interface (e.g., the FEM-CTRLR communication interface 258).
The NFC power harvesting module 308 harvests or harvests power from the recovered NFC communication signal 354, providing harvested NFC power 358. In an exemplary embodiment, the NFC power harvesting module 308 includes a rectifier to rectify the recovered NFC communication signal 354 to provide rectified NFC power. In this exemplary embodiment, NFC power harvesting module 308 additionally includes a regulator to regulate the rectified NFC power to provide harvested NFC power 358. In some cases, the obtained NFC power 358 may be provided to other modules of the WPT enabled communication device via a communication interface, such as the FEM-CTRLR communication interface 258.
The WPT power harvesting module 310 derives or harvests power from the recovered WPT communication signal 360 to provide harvested WPT power 362. In an exemplary embodiment, the WPT power harvesting module 310 includes a rectifier to rectify the recovered WPT communication signal 360 to provide rectified WPT power. In this exemplary embodiment, the WPT power harvesting module 310 additionally includes a regulator to regulate the rectified WPT power to provide the harvested WPT power 362. In some cases, the obtained WPT power 362 may be provided to other modules of the WPT enabled communication device via a communication interface (e.g., the FEM-CI communication interface 252).
Second exemplary WPT-enabled communication device
Generally, a WPT enabled communication device, such as the WPT enabled communication device 100 or the WPT enabled communication device 200, may be fabricated on a plurality of semiconductor substrates, chips, and/or dies that are communicatively coupled to one another. Some of the plurality of semiconductor substrates, chips, and/or dies may be fabricated using a high voltage semiconductor process, while other semiconductor substrates, chips, and/or dies may be fabricated using a low voltage semiconductor process. This allows various combinations of modules of the WPT enabled communication device manufactured using high voltage semiconductors to be combined onto one or more first semiconductor substrates, chips and/or dies, while these modules of the WPT enabled communication device manufactured using low voltage semiconductors may be combined onto one or more second semiconductor substrates, chips and/or dies. As a result, an Original Equipment Manufacturer (OEM) may provision the WPT enabled communication device with multiple product lines having varying capabilities around one or more first semiconductor substrates, chips, and/or dies and/or a second set of one or more semiconductor packages and/or one or more second semiconductor substrates, chips, and/or dies. For example, the OEM may combine the front end module 210 and the PMU214 onto a single semiconductor substrate, chip and/or die that may be collectively coupled to various combinations of the NFC controller 212, the baseband module 216 and the radio frequency module 218.
Fig. 4 illustrates a block diagram of a second exemplary WPT enabled communication device according to an exemplary embodiment of the present invention. The WPT enabled communication device 400 includes one or more integrated circuits configured and arranged to form one or more modules for communicating information via wired and/or wireless communication networks according to various communication standards. Some of these modules, or portions thereof, operating at higher power levels may be fabricated using high voltage semiconductor processes, while other modules, which typically operate at greater speeds, are formed using low voltage semiconductor processes. Some of these modules fabricated using high voltage semiconductors may be combined onto one or more first semiconductor substrates, chips, and/or dies, while those fabricated using low voltage semiconductors may be combined onto one or more second semiconductor substrates, chips, and/or dies. The WPT enabled communication device 400 includes a secure element 110, a host processor 112, a combined front end/PMU module 402, a combined baseband/NFC controller module 404, and a combined RF/WLAN/bluetooth/GPS module 406.
The front end module (e.g., front end module 210 as an example) and the PMU (e.g., PMU214 as an example) may be manufactured using a high voltage semiconductor process. This allows the front end module and PMU to be fabricated on a single semiconductor substrate, chip, and/or die to form the combined front end/PMU module 402. The combined front end/PMU module 402 provides an interface between the combined front end/PMU module 402 and another NFC-enabled device and/or a wireless power transmitter in a manner substantially similar to the front end module 210. In addition, the combined front end/PMU module 402 is responsible for battery and power system management of the WPT enabled communication device 400 in a manner substantially similar to the PMU module 214.
The baseband module (e.g., baseband module 216, as an example) and the NFC controller module (e.g., NFC controller 212, as an example) may be fabricated using a low voltage semiconductor process. This allows the baseband module and the NFC controller module to be fabricated on a single semiconductor substrate, chip, and/or die to form the combined baseband/NFC controller module 404. The combined baseband/NFC controller module 404 controls cellular and NFC communications, respectively, of the WPT enabled communication device 400 in a manner substantially similar to the baseband module 216 and the NFC controller 212.
The radio frequency module (e.g., radio frequency module 218 as an example), the WLAN module (e.g., WLAN module 114 as an example), the bluetooth module (e.g., bluetooth module 104 as an example), the GPS module (e.g., GPS module 106 as an example) may be manufactured using a low voltage semiconductor process. This allows the RF module, WLAN module, bluetooth module, and GPS module to be fabricated on a single semiconductor substrate, chip, and/or die to form the combined RF/WLAN/bluetooth/GPS module 406. The combined RF/WLAN/Bluetooth/GPS module 406 provides cellular, wireless network, and Bluetooth communications, respectively, in a manner substantially similar to the radio frequency module 218, WLAN module 114, and Bluetooth module 104. Additionally, the combined RF/WLAN/bluetooth/GPS module 406 may calculate the location of the WPT enabled communication device 400 in a manner substantially similar to the GPS module 106.
The combined front end/PMU module 402, the combined baseband/NFC controller module 404, and/or the combined RF/WLAN/bluetooth/GPS module 406 effectively partition and separate the NFC and/or cellular communication capabilities of the WPT enabled communication device 400 across multiple modules. For example, the combined front end/PMU module 402 and the combined baseband/NFC controller module 404 operate in conjunction with each other to provide wireless communication between the WPT enabled communication device 400 and another NFC enabled device according to various NFC standards. As another example, the combined baseband/NFC controller module 404 and the combined RF/WLAN/bluetooth/GPS module 406 operate in conjunction with each other to provide wireless communication between the WPT enabled communication device 400 and another cellular enabled device via a cellular network according to various cellular communication standards. However, these examples are not limiting, and one skilled in the relevant art will recognize that the various modules of the WPT communication device 400 may be combined differently without departing from the spirit and scope of the present invention. For example, the secure element 110 and the host processor 112 may be fabricated on a single semiconductor substrate, chip, and/or die to form a combined processor/secure element module.
Further description of a second exemplary WPT enabled communication device
Fig. 5 further shows a block diagram of a second exemplary WPT enabled communication device according to an exemplary embodiment of the present invention. The WPT enabled communication device 500 includes one or more integrated circuits configured and arranged to form one or more modules for communicating information via wired and/or wireless communication networks according to various communication standards. Some of these modules or portions thereof manufactured using a high voltage semiconductor process may be manufactured on a semiconductor substrate, chip, and/or die along with other modules or portions thereof also manufactured using a high voltage semiconductor process. Some of these modules, or portions thereof, operating at higher power speeds may be fabricated using low voltage semiconductor processes. Some of these modules or portions thereof manufactured using low voltage semiconductor processes may be manufactured on a semiconductor substrate, chip, and/or die along with other modules or portions thereof also manufactured using low voltage semiconductor processes.
The WPT enabled communication device 500 includes a combined front end/PMU module 502, a combined baseband/NFC controller module 504, a combined RF/WLAN/bluetooth/GPS module 506, and a secure element 508 communicatively coupled to each other via a communication interface 510. The WPT enabled communication device 500 may represent an exemplary embodiment of the WPT enabled communication device 400. Likewise, the combined front end/PMU module 502, the combined baseband/NFC controller module 504, and the combined RF/WLAN/bluetooth/GPS module 506 may represent exemplary implementations of the combined front end/PMU module 402, the combined baseband/NFC controller module 404, and the combined RF/WLAN/bluetooth/GPS module 406, respectively. Additionally, the WPT enabled communication device 500 may further include a host processor such as host processor 112 as an example. The host processor 112 is communicatively coupled to the combined front end/PMU module 502, the combined baseband/NFC controller module 504, the combined RF/WLAN/bluetooth/GPS module 506, and the secure element 508 via the communication interface 510.
Combined front end/PMU module 502 provides an interface between combined front end/PMU module 502 and another NFC-enabled device and/or a wireless power transmitter in a manner similar to combined front end/PMU module 402. The combined front end/PMU module 502 includes a front end module 512 and a PMU 514.
The front end module 512 receives the received WPT signal 250 from the wireless power transmitter and derives or draws power from the received WPT signal 250 to provide the drawn WPT power to the FEM-PMU communication interface 550 for routing to the PMU 514. In an exemplary embodiment, the PMU214 routes the obtained WPT power from the FEM-PMU communication interface 550 to the combined baseband/NFC controller module 504, the combined RF/WLAN/bluetooth/GPS module 506, and/or other modules within the WPT enabled communication device 500 via the communication interface 510 in a manner similar to the front end module 210.
Additionally, when the WPT enabled communication device 500 operates in a reader and/or tag mode of operation, the front end module 512 receives the received NFC communication signal 254 from another NFC enabled device in a substantially similar manner as the front end module 210. The front-end module 512 recovers information and/or obtains NFC power from the received NFC communication signal 254 and then provides the information and/or obtains NFC power to the FEM-CI communication interface 552 in a substantially similar manner as the front-end module 210 for routing to the combined baseband/NFC controller module 504, the combined RF/WLAN/bluetooth/GPS module 506, and/or other modules within the WPT enabled communication device 500 via the communication interface 510. Optionally, the front-end module 510 derives or derives power from the received NFC communication signal 254 to provide the derived NFC power to the NFC controller 516 of the combined baseband/NFC controller module 504 via the FEM-CI communication interface 552 in a substantially similar manner as the front-end module 210.
Further, the front end module 512 may receive information from the combined baseband/NFC controller module 504, the combined RF/WLAN/bluetooth/GPS module 506, and/or other modules within the WPT enabled communication device 500 via the FEM-CI communication interface 552. The front-end module 512 may modulate its own magnetic field with information when the WPT enabled communication device 500 is operating in a reader mode of operation or modulate a magnetic field generated by another NFC enabled device when the WPT enabled communication device 500 is operating in a tag mode of operation in a substantially similar manner as the front-end module 210.
The PMU514 is responsible for battery and power system management of the combined baseband/NFC controller module 504 and/or the WPT enabled communication device 500 in a manner substantially similar to the PMU 214. The PMU514 receives various power signals from the FEM-PMU communication interface 550 and/or the communication interface 510 via the PMU-CI communication interface 554 from the front-end module 512, the combined baseband/NFC controller module 504, the combined RF/WLAN/bluetooth/GPS module 506, and/or other modules within the WPT enabled communication device 500. Additionally, the PMU214 may use power signals received from the FEM-PMU communication interface 550 and/or the PMU-CI communication interface 554 to monitor the power connection and battery charge and/or charge the battery when necessary. Further, the PMU214 may use power signals received from the FEM-PMU communication interface 550 and/or the PMU-CI communication interface 554 to control and/or provide other power signals from the FEM-PMU communication interface 550 and/or the PMU-CI communication interface 554 to power the front-end module 512, the combined baseband/NFC controller module 504, the combined RF/WLAN/bluetooth/GPS module 506, and/or other modules within the WPT enabled communication device 500 via the communication interface 510.
The combined baseband/NFC controller module 504 controls cellular and NFC communications of the WPT enabled communication device 500 in a manner substantially similar to the combined baseband/NFC controller module 404. The combined baseband/NFC controller module 504 includes an NFC controller 516 and a baseband module 518. The NFC controller 516 controls the overall operation and/or configuration of NFC communications of the WPT enabled communication device 500 in a substantially similar manner as the NFC controller 212. The NFC controller 516 receives information from the combined front end/PMU module 502, the baseband module 518, the combined RF/WLAN/bluetooth/GPS module 506, and/or other modules within the WPT enabled communication device 500 and/or obtains NFC power from the CI-CTRLR communication interface 556. Additionally, the NFC controller 212 may route information and/or obtain NFC power to the CI-CTRLR communication interface 556 for routing via the communication interface 510 to the combined front end/PMU module 502, the baseband module 518, the combined RF/WLAN/bluetooth/GPS module 506, and/or other modules within the WPT enabled communication device 500.
The baseband module 518 controls the overall operation and/or configuration of cellular communications for the WPT enabled communication device 500 in a manner substantially similar to the NFC controller 216. The baseband module 216 receives information from the NFC controller 516, the combined front end/PMU module 502, the combined RF/WLAN/bluetooth/GPS module 506, and/or other modules within the WPT enabled communication device 500 from the CI-BB communication interface 558. Additionally, the baseband module 216 may provide information to the CI-BB communication interface 558 for routing to the NFC controller 516, the combined front end/PMU module 502, the combined RF/WLAN/bluetooth/GPS module 506, and/or other modules within the WPT enabled communication device 500 via the communication interface 510.
The combined RF/WLAN/Bluetooth/GPS module 506 provides cellular, wireless network, and Bluetooth communications, respectively, in a manner substantially similar to the combined RF/WLAN/Bluetooth/GPS module 406. Additionally, the combined RF/WLAN/bluetooth/GPS module 506 may calculate the location of the WPT enabled communication device 500 in a manner substantially similar to the RF/WLAN/bluetooth/GPS module 406. The combined RF/WLAN/Bluetooth/GPS module 506 includes a radio frequency module 520, a WLAN module 522, a Bluetooth module 524, and a GPS module 526.
The radio frequency module 520 downconverts, demodulates, and/or decodes the received cellular communication signals in a manner substantially similar to the radio frequency module 218 to provide information to the RF-CI communication interface 558 for routing to the combined front end/PMU module 502, the combined baseband/NFC controller module 504, the WLAN module 522, the bluetooth module 524, the GPS module 526, and/or other modules within the WPT enabled communication device 500 via the communication interface 510. Additionally, the radio frequency module 218 upconverts, modulates, and/or decodes information received from the combined front end/PMU module 502, the combined baseband/NFC controller module 504, the WLAN module 522, the bluetooth module 524, the GPS module 526, and/or at the WPT enabled communication device 500 via the RF-CI communication interface 558 in a substantially similar manner as the radio frequency module 218 to provide the transmitted cellular communication signals.
The WLAN module 522 provides wireless communication between the WPT enabled communication device 500 and another WLAN enabled device via wired and/or wireless communication networks according to various networking protocols in a manner substantially similar to the WLAN module 114. The WLAN module 522 may receive information from the combined front end/PMU module 502, the combined baseband/NFC controller module 504, the radio frequency module 520, the bluetooth module 524, the GPS module 526, and/or other modules within the WPT enabled communication device 500 via the RF-CI communication interface 558. Additionally, the WLAN module 522 may provide information to the RF-CI communication interface 558 for routing to the combined front end/PMU module 502, the combined baseband/NFC controller module 504, the radio frequency module 520, the bluetooth module 524, the GPS module 526, and/or other modules within the WPT enabled communication device 500 via the communication interface 510.
The bluetooth module 524 provides wireless communication between the WPT enabled communication device 500 and another bluetooth enabled device according to various bluetooth or Bluetooth Low Energy (BLE) standards in a manner substantially similar to the bluetooth module 104. The bluetooth module 524 may receive information from the combined front end/PMU module 502, the combined baseband/NFC controller module 504, the radio frequency module 520, the WLAN module 522, the GPS module 526, and/or other modules within the WPT enabled communication device 500 via the RF-CI communication interface 558. Additionally, the bluetooth module 524 may provide information to the RF-CI communication interface 558 for routing to the combined front end/PMU module 502, the combined baseband/NFC controller module 504, the radio frequency module 520, the WLAN module 522, the GPS module 526, and/or other modules within the WPT enabled communication device 500 via the communication interface 510.
The GPS module 526 receives various signals from various satellites to calculate the location of the WPT enabled communication device 500 in a substantially similar manner as the GPS module 106. The GPS module 526 may receive information from the combined front end/PMU module 502, the combined baseband/NFC controller module 504, the radio frequency module 520, the WLAN module 522, the bluetooth module 524, and/or other modules within the WPT enabled communication device 500 via the RF-CI communication interface 558. Additionally, the GPS module 526 may provide information to the RF-CI communication interface 558 for routing via the communication interface 510 to the combined front end/PMU module 502, the combined baseband/NFC controller module 504, the radio frequency module 520, the WLAN module 522, the bluetooth module 524, and/or other modules within the WPT enabled communication device 500.
The secure element 508 securely stores applications and/or information within the WPT enabled communication device 500 in a manner similar to the secure element 110 and provides an environment to enable secure execution of these applications. The secure element 206 may receive information from the combined front end/PMU module 502, the combined baseband/NFC controller module 504, the combined RF/WLAN/bluetooth/GPS module 506, and/or other modules within the WPT enabled communication device 500 from the communication interface 510 via the SE-CI communication interface 560. The secure element 206 may provide this information and/or other information generated by the application to the SE-CI communication interface 560 for routing via the communication interface 510 to the combined front end/PMU module 502, the combined baseband/NFC controller module 504, the combined RF/WLAN/bluetooth/GPS module 506, and/or other modules within the WPT enabled communication device 500.
Conclusion
It should be appreciated that the detailed description section and not the abstract section are intended to be used to interpret the claims. The abstract section may set forth one or more, but not all exemplary embodiments of the invention, and is therefore not intended to limit the invention and the appended claims in any way.
The invention is described with the aid of functional building blocks illustrating the implementation of specific functions and relationships thereof. The boundaries of these functional building blocks have been arbitrarily defined herein for the convenience of the description. Alternative boundaries may be defined so long as the specified functions and relationships thereof are appropriately performed.
It will be apparent to persons skilled in the relevant art that various changes in form and detail can be made therein without departing from the spirit and scope of the invention. Accordingly, the present invention should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents.
Claims (17)
1. A communication device supporting wireless power transfer, comprising:
a plurality of modules configured to provide communication with a communication device according to a plurality of communication standards;
a communication interface configured to communicatively couple the plurality of modules to one another,
wherein a first module from the plurality of modules is configured to implement a standard from the plurality of communication standards, a first portion of the first module is fabricated using a high voltage semiconductor process, and a second portion of the first module is fabricated using a low voltage semiconductor process.
2. The communication device supporting wireless power transfer of claim 1, wherein the first portion of the first module is fabricated on a first semiconductor substrate using a high voltage semiconductor process, an
Wherein the second portion of the first module is fabricated using a low voltage semiconductor process on a second semiconductor substrate communicatively coupled to the first portion.
3. The wireless power transfer enabled communication device of claim 1, wherein the first module is configured to provide near field communication between the wireless power transfer enabled communication device and another near field communication enabled device according to a near field communication standard.
4. The wireless power transfer enabled communication device of claim 3, wherein the first module is further configured to inductively receive a magnetic field from another near field communication enabled device, and to recover information from the magnetic field and derive the obtained power from the magnetic field.
5. The wireless power transfer enabled communication device of claim 4, wherein the plurality of modules comprise a secure element configured to receive the obtained power.
6. The wireless power transfer enabled communication device of claim 2, wherein the first module is further configured to receive a power transfer signal from a wireless power transmitter.
7. The wireless power transfer enabled communication device of claim 5, wherein the first module is further configured to derive the obtained power from the power transfer signal and provide the obtained power to other modules from the plurality of modules.
8. The wireless power transfer enabled communication device of claim 7, wherein the other modules from the plurality of modules comprise a power management unit.
9. A communication device supporting wireless power transfer, comprising:
a plurality of modules configured to provide communication between the wireless power transfer enabled communication device and other standard enabled communication devices according to a plurality of communication standards,
wherein a first module from the plurality of modules is configured to operate cooperatively with a second module from the plurality of modules to implement a first communication standard from the plurality of communication standards,
wherein the first module is manufactured using a high voltage semiconductor process, an
Wherein the second module is manufactured using a low voltage semiconductor process.
10. The wireless power transfer enabled communication device of claim 9, wherein the first module operates in cooperation with the second module to provide near field communication between the wireless power transfer enabled communication device and another near field communication enabled device in accordance with a near field communication standard.
11. The wireless power transfer enabled communication device of claim 10, wherein the first module comprises:
a front end module configured to provide an interface between the other near field communication enabled device and the wireless power transfer enabled communication device.
12. The wireless power transfer enabled communication device of claim 11, wherein the front end module is further configured to inductively receive a magnetic field from the other near field communication enabled device, recover information from the magnetic field, and derive the obtained power from the magnetic field.
13. The wireless power transfer enabled communication device of claim 12, wherein the second module comprises:
a near field communication controller configured to receive the information and the obtained power from the first module.
14. The wireless power transfer enabled communication device of claim 11, wherein the front end module is further configured to receive a power transfer signal from a wireless power transmitter.
15. The wireless power transfer enabled communication device of claim 14, further comprising:
a power management unit configured to receive the obtained power derived from the power transfer signal and provide a power signal based on the obtained power to other modules from the plurality of modules.
16. The wireless power transfer enabled communication device of claim 9, wherein the first module is configured to operate cooperatively with a third module from the plurality of modules to implement a second communication standard from the plurality of communication standards,
wherein the third module is manufactured using a low voltage semiconductor process.
17. The wireless power transfer enabled communication device of claim 16, wherein the second communication standard is a cellular communication standard.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/595,020 | 2012-08-27 | ||
| US13/595,020 US9281871B2 (en) | 2012-08-27 | 2012-08-27 | Wireless power transfer—near field communication enabled communication device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| HK1191761A1 HK1191761A1 (en) | 2014-08-01 |
| HK1191761B true HK1191761B (en) | 2016-12-30 |
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