HK1186299A - Single loading mechanism to apply force to both cooling apparatus and integrated circuit package - Google Patents

Description

Single loading mechanism for applying force to both cooling device and integrated circuit package

The present application is a divisional application of a patent application having an application date of 27/6/2007, an application number of 200710142137.0, and an invention name of "a single loading mechanism for applying force to both a cooling device and an integrated circuit package".

Technical Field

The present invention relates generally to devices for computers, and more particularly to a mounting mechanism for mounting an integrated circuit package and a cooling device.

Background

Semiconductor devices, such as microprocessor chips, are typically mounted in packages and attached to a Printed Circuit Board (PCB), such as a motherboard, by a socket. The socket interfaces with wiring on the package to distribute power and signals from the package (and semiconductor device) to other equipment. There are several processes for forming connections between sockets and packages, including Pin Grid Array (PGA), Ball Grid Array (BGA), and Land Grid Array (LGA).

LGA sockets include spring-loaded contacts that interface with conductive pads on a packaged semiconductor device. The socket may be soldered onto the motherboard with BGA contacts (e.g., solder balls) under the socket. When the package is inserted into the socket and the package is forced, the spring-loaded contacts are pressed against the pads of the package. This pressure ensures a reliable electrical connection between the motherboard and the package.

The available area on the motherboard is limited, which is particularly evident in small form factor devices such as laptop computers and the like. A portion of this area is used for connecting a loading device for pressing the contacts of the package onto the socket. Another part of this area is used for connecting cooling equipment (solution) that prevents the semiconductor device from overheating. The cooling device may further have a second loading device that presses the cooling device onto the semiconductor device.

Disclosure of Invention

According to an aspect of the present invention, there is provided an apparatus for a computer, comprising:

a socket;

a loading mechanism including a loader frame, the loading mechanism hingedly connected to the receptacle;

a cooling device connected to the loader frame;

wherein the carrier frame is movable between a first open position and a second closed position via an arc of movement, the carrier frame being configured such that, in its second closed position, it extends substantially parallel to the socket and is adapted to simultaneously:

applying a force to an integrated circuit package disposed between the carrier frame and a socket to press the integrated circuit package against the socket; and

applying a force to the cooling device to press the cooling device onto the integrated circuit package.

According to another aspect of the present invention, there is provided an apparatus for a computer, comprising:

a printed circuit board;

a socket on the printed circuit board;

an integrated circuit connected to the socket;

a loading mechanism including a loader frame, the loading mechanism hingedly connected to the socket or the printed circuit board;

a cooling device connected to the loader frame;

wherein the carrier frame is movable between a first open position and a second closed position via an arc of movement, the carrier frame being configured such that, in its second closed position, it extends substantially parallel to the socket and is adapted to simultaneously:

applying a direct force to an integrated circuit package disposed between the carrier frame and a socket to press the integrated circuit package onto the socket; and

applying a direct force to the cooling device to press the cooling device onto the integrated circuit package.

Drawings

FIG. 1a is a cross-sectional side view illustrating one embodiment of an apparatus having a loading mechanism that applies a force to couple an integrated circuit to a socket and also to press a cooling device onto an integrated circuit package.

Fig. 1b is a top view further illustrating an embodiment of the apparatus described with respect to fig. 1 a.

FIG. 1c is a cross-sectional side view illustrating the embodiment of the apparatus described with respect to FIG. 1a when the carrier is in the open position.

Fig. 2 is a top view illustrating an embodiment in which the cooling device is connected to an additional cooling part.

FIG. 3 is a top view illustrating one embodiment of a carrier.

Fig. 4 is a top view illustrating another embodiment of a carrier.

Fig. 5 is a top view illustrating one embodiment of applying force to an integrated circuit package by a cooling device without a separate cooling device and carrier.

Fig. 6 is a cross-sectional side view illustrating another embodiment without a separate cooling device and carrier.

Detailed Description

In various embodiments, an apparatus for applying force to both a semiconductor device and a cooling apparatus using a single loading mechanism is described. In the following description, various embodiments will be described. One skilled in the relevant art will recognize, however, that the various embodiments may be practiced without one or more of the specific details, or with other alternative and/or additional methods, materials, or components. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of various embodiments of the invention. Also, for purposes of explanation, specific numbers, materials and configurations are set forth in order to provide a thorough understanding of the present invention. However, the invention may be practiced without these specific details. Furthermore, it is to be understood that the various embodiments shown in the figures are illustrative representations and are not necessarily drawn to scale.

Reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure, material, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention, but does not mean that they are present in every embodiment. Thus, the appearances of the phrase "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily referring to the same embodiment of the invention. Furthermore, the particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments. In other embodiments, various additional layers and/or structures may be included, and/or the described features may be omitted.

Figure 1a is a cross-sectional side view illustrating one embodiment of an apparatus having a loading mechanism 100 that applies a force to couple an integrated circuit package to a socket and also to press a cooling device onto the integrated circuit package. In the illustrated embodiment, the socket 104 is coupled to the motherboard 102, which may be in a personal computer (such as a laptop computer or desktop computer), for example. Although the socket 104 is described as being coupled to a "motherboard" 102, in other embodiments, the socket 104 may be coupled to any type of printed circuit board 102 or other suitable support structure.

In one embodiment, the socket 104 is a Land Grid Array (LGA) socket having spring-loaded contacts that interface with conductive pads on the integrated circuit package 106. In other embodiments, the socket 104 may be a different type of socket for which it is appropriate to apply a force that presses the integrated circuit package 106 to the socket 104. The socket 104 is the structure by which the integrated circuit package 106 is electrically or otherwise communicatively connected to other components of the device 100.

The integrated circuit package 106 may be any type of integrated circuit. In an embodiment, the integrated circuit package 106 may be a microprocessor chip. In other embodiments, other types of integrated circuit packages 106 may be used. A force suitable for pressing the integrated circuit package 106 onto the socket 104 may be applied in the direction 118 to help provide good contact between the integrated circuit package 106 and the socket 104.

A cooling device 112 may be included in the apparatus 100 to remove heat from the integrated circuit package 106 during operation. Any suitable cooling device 112 may be used, such as a heat pipe, heat sink, or other type of cooling device 112. A force suitable for pressing the cooling device 112 onto the integrated circuit package 106 may be applied in the direction 118 to help the cooling device 112 and the integrated circuit package 106 make good contact for thermal conduction therebetween.

In an embodiment, there is a single loading mechanism that provides the force 118 to press both the integrated circuit package 106 onto the socket 104 and the cooling device 112 onto the integrated circuit package 106. In the embodiment shown in fig. 1a, the single loading mechanism may be considered to be or include a load member 108 hingedly connected to the platter 102 by a hinge 110. When in the closed position, the loader 108 pushes down on the integrated circuit package 106 to press the integrated circuit package 106 onto the socket 104. In the illustrated embodiment, the cooling device 112 is attached to the carrier 108 such that the cooling device 112 is pressed onto the integrated circuit package 106 when the carrier 108 is in the closed position. In some embodiments, the cooling device 112 is connected to the carrier 108, rather than being independently connected to the motherboard 102.

In an embodiment, the cooling device 112 may be pressed onto the integrated circuit package 106 when the carrier 108 is in the closed position, and the cooling device 112 may transmit a force from the carrier 108 to the integrated circuit package 106 to press the integrated circuit package 106 onto the socket 104. Such embodiments may not have direct contact between the carrier 108 and the integrated circuit package 106. In such embodiments, other types of loading mechanisms than the illustrated loading member 108 may be used to apply such forces to the cooling device 112.

In the illustrated embodiment, there is a protrusion 114 connected to a shaft 116. The protrusion 114 rotates about the shaft 116 to force the carrier 108 downward and induce a force 118 on the cooling device 112 and the integrated circuit package 106. The tabs 114 also hold the carrier 108 in place. In other embodiments, other structures may be used to induce the force 118 on the cooling device 112 and the integrated circuit package 106.

FIG. 1b is a top view further illustrating an embodiment of the apparatus 100 described above with respect to FIG. 1 a. In the embodiment shown in FIG. 1b, the carrier 108 is a piece of metal or other rigid material suitable for applying a suitable force. The carrier 108 includes an outer frame and a central opening (not visible in fig. 1b due to the presence of the cooling device 112) through which the cooling device 112 may contact the integrated circuit package 106 so that heat may be conducted away from the integrated circuit package 106. In other embodiments, the loading member 108 may have other shapes.

In the illustrated embodiment, the loading member 108 is attached on one side to a hinge 110. On the other side, the protrusion 114 presses down on the carrier 108, causing the carrier 108 to apply a force to the integrated circuit package 106 and the cooling device 112. The projection 114 is connected to a shaft 116, which is connected to a rod 120. The lever 120 is used to rotate the tab 114 from the open position to the closed position to press down on the carrier 108. The lever 120 may also be locked in the closed position such that upon moving the protrusion 114 to the closed position, the force 118 is continually applied.

Because the tab 114 in the closed position presses down on the carrier 108 and the integrated circuit package 106 is between the carrier 108 and the socket 104, the carrier 108 presses the integrated circuit package 106 onto the socket 104. Since the cooling device 112 is connected to the carrier 108, the cooling device 112 is pressed onto the integrated circuit package 106 by the carrier 108. Thus, a single mechanism (the carrier 108) applies the force 118 to both the integrated circuit package 106 and the cooling device. In other embodiments, the loading mechanism may press the cooling device 112 onto the integrated circuit package 106 to press the integrated circuit package 106 onto the socket 104. In embodiments where there is no direct contact between the loaders 108 (between), a single mechanism may still apply the force 118 to both the integrated circuit package 106 and the cooling device.

FIG. 1c is a cross-sectional side view illustrating the embodiment of the apparatus 100 described above with respect to FIG. 1a when the carrier 108 is in the open position. As can be seen in the embodiment shown in fig. 1c, the cooling device 112 is connected to the carrier 108. The cooling device 112 may be coupled to the carrier 108 using any suitable method.

Both the loading section 108 and the rod 120 are capable of moving in an arc. As seen in fig. 1c, the carriage 108 has an arc of motion a whereby the carriage 108 may be moved between an open position (e.g., as seen in fig. 1 c) and a closed position (e.g., as seen in fig. 1a and 1 b). Likewise, the lever 120 has an arc of motion B whereby the carriage 108 may move between an open position (such as seen in fig. 1 c) and a closed position (such as seen in fig. 1a and 1B). As the carriage 108 approaches the closed position, the lever 120 may compress the carriage 108 as the lever 120 moves to its closed position. When the lever 120 is fully moved to its closed position, it may cause the protrusion 114 to exert a force on the carrier 108 to move the carrier 108 to its closed position where it exerts a force on the integrated circuit package 106 and the cooling device 112.

Fig. 2 is a top view illustrating an embodiment in which the cooling device 112 is connected to an additional cooling component. For example, the cooling device 112 may include one or more heat pipes 202 that transfer heat from the integrated circuit package 106 to a heat exchanger 204, such as a heat sink, that assists in transferring heat from the integrated circuit package 106 to the ambient environment. In embodiments where the carrier 108 is hingedly attached to the platter 102, one or more of the additional cooling features may move simultaneously with the cooling device 112 and the carrier 108. In other embodiments, there may be a flexible connection between the cooling device and other cooling components, or the cooling device 112 may not be connected to additional cooling components until the loading portion 108 is in the closed position. In other embodiments, other configurations may exist. The additional cooling component may be placed in any suitable location.

Fig. 3 is a top view illustrating an embodiment of the carrier 108. In this embodiment, the carrier 108 has an outer frame 304 with a central opening 302 through which the cooling device 112 may contact the integrated circuit package 106. Although the carrier 108 is illustrated as such, it may take other forms in other embodiments. For example, the carrier 108 may not have a continuous frame completely around its perimeter.

Fig. 4 is a top view illustrating another embodiment of the carrier 108. In this embodiment, the loader 108 includes an interface plate 402. In the closed position, the interface board 402 may contact or be in close proximity (e.g., separated by a thin layer of thermal interface material) to the integrated circuit package 106 to effectively transfer heat from the integrated circuit package 106 to the cooling device 112.

In some embodiments, the loading member 108 may be part of the cooling device 112 rather than a separate element. Thus, the interface board 402 can be part of the cooling device 112 that transfers heat from the integrated circuit package 106 to the cooling device 112, and the outer frame 304 can be a different part of the cooling device 112. Either or both of the external frame 304 and the interface board 402 may apply a force to the integrated circuit package 106.

Fig. 5 is a top view illustrating an embodiment where there is no separate cooling device 112 and carrier 108, but rather where the cooling device 112 applies a force 118 to the integrated circuit package 106. In such embodiments, the cooling device 112 may include stiffeners 502 that are not present in a similar cooling device 112 that does not apply force to the integrated circuit package 106 at the same time. In the embodiment shown in FIG. 5, the cooling device 112 includes a heat pipe 202. A loading mechanism (not shown) applies a force to the heat pipe 202, which in turn applies a force to the underlying integrated circuit package 106 (illustrating the positional profile 504 of the integrated circuit package 106).

The cooling device 112 includes stiffeners 502 that allow the cooling device 112 to apply force to all appropriate areas of the integrated circuit package 106. As shown, the stiffeners 502 are on the perimeter. In other embodiments, the stiffeners may be present in other locations instead of perimeter stiffeners 502 or as stiffeners in addition to perimeter stiffeners 502. For example, rather than bending (bending) and applying a significantly non-uniform force to the integrated circuit package 106, the stiffener 502 may be present in locations where a force is applied to the cooling device 112 to allow the cooling device 112 to distribute a relatively uniform force to the integrated circuit package 106.

Fig. 6 is a cross-sectional side view illustrating another embodiment without the stand-alone cooling device 112 and the frame-type carrier 108 as shown in fig. 1a-1 c. More specifically, the cooling device 112 is a loader and the loading mechanism 602 applies a force to the cooling device 112 to apply a force to the integrated circuit package 106 through the cooling device 112. For example, the cooling device 112 may be a heat sink with a fan, and the loading mechanism 602 may be a screw that connects the cooling device 112 to one or more of the motherboards 102. When tightened, the screws 602 may depress the cooling device 112, thereby generating a force 118 to press the cooling device 112 against the integrated circuit package 106 and the integrated circuit package 106 against the socket 104. Although screw 602 is mentioned as the loading mechanism, any other suitable type of loading mechanism may be used, such as spring-loaded clips or other mechanisms. The screw 602 or other loading mechanism 602 may also be considered a "loader" 108 because it may apply a force to both the cooling device 112 and the integrated circuit package 106.

As shown in fig. 6, some embodiments may lack a separate device to connect the cooling device 112 and the load member 108 to the motherboard 102. More specifically, no single device or group of devices (loading mechanism 602) is connected to and loads the cooling device 112 and the load 108 (which are the same item in the embodiment of FIG. 6). Such a configuration saves space on motherboard 102 relative to apparatus 100 in which separate connections are used (one for cooling device 112 and the other for separately loading integrated circuit package 106 onto carrier 108 on socket 104).

The foregoing descriptions of embodiments of the present invention have been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form disclosed. The description and claims that follow include terms such as left, right, top, bottom, over, under, below, first, second, etc. that are descriptive only and are not to be construed as limiting. For example, terms referring to relative vertical position refer to the situation where the device side (or active surface) of a substrate or integrated circuit is at the "top" surface of the substrate; with reference to a standard terrestrial frame, the substrate can be in virtually any orientation such that the "top" face of the substrate can be lower than the "bottom" face and still fall within the meaning of the term "top". Unless otherwise specified, the term "over" (included in the claims) is used herein to mean either that the first layer is "over" the second layer or is directly over and in direct contact with the second layer; between the first layer and the second layer above the first layer, there may be a third layer or other structure. Embodiments of an apparatus or article described herein may be manufactured, used, or shipped in a number of positions and orientations. Many modifications and variations of the present invention are possible in light of the above teachings, as will be apparent to those skilled in the relevant art. Those skilled in the art will recognize various equivalent combinations and substitutions for various components shown in the figures. It is therefore intended that the scope of the invention be limited not by this detailed description, but rather by the claims appended hereto.

Claims (14)

1. An apparatus for a computer, comprising:

a socket;

a loading mechanism including a loader frame, the loading mechanism hingedly connected to the receptacle;

a cooling device connected to the loader frame;

wherein the carrier frame is movable between a first open position and a second closed position via an arc of movement, the carrier frame being configured such that, in its second closed position, it extends substantially parallel to the socket and is adapted to simultaneously:

applying a force to an integrated circuit package disposed between the carrier frame and a socket to press the integrated circuit package against the socket; and

applying a force to the cooling device to press the cooling device onto the integrated circuit package.

2. The apparatus of claim 1, further comprising a lever having an arm with a hold-down tab and a shaft connecting the lever to a motherboard, the lever being movable via an arc of motion between a first open position and a second closed position, wherein the lever is configured such that, in its second closed position, when the carrier frame is in its second closed position, movement of the arm about the shaft causes the hold-down tab to hold down and apply a force to the carrier frame, which in turn applies a force to the integrated circuit package and the cooling device.

3. The apparatus of claim 2, wherein the carrier frame comprises an outer frame, the cooling device being located in a central region of the outer frame.

4. The apparatus of claim 1, wherein the cooling device is fixedly attached to the carrier frame.

5. The apparatus of claim 4, wherein the cooling device comprises a heat pipe.

6. An apparatus for a computer, comprising:

a printed circuit board;

a socket on the printed circuit board;

an integrated circuit connected to the socket;

a loading mechanism including a loader frame, the loading mechanism hingedly connected to the socket or the printed circuit board;

a cooling device connected to the loader frame;

wherein the carrier frame is movable between a first open position and a second closed position via an arc of movement, the carrier frame being configured such that, in its second closed position, it extends substantially parallel to the socket and is adapted to simultaneously:

applying a direct force to an integrated circuit package disposed between the carrier frame and a socket to press the integrated circuit package onto the socket; and

applying a direct force to the cooling device to press the cooling device onto the integrated circuit package.

7. The apparatus of claim 6, wherein the cooling apparatus comprises a thermally conductive material that conducts heat from the integrated circuit, and a heat dissipating portion connected to the thermally conductive material that dissipates heat received from the integrated circuit to the ambient environment.

8. The apparatus of claim 7, wherein the cooling means comprises a heat pipe that transfers heat from the integrated circuit.

9. The apparatus of claim 6, wherein the integrated circuit is a microprocessor.

10. The apparatus of claim 6, wherein the cooling device is connected to the carrier frame without being independently connected to the printed circuit board.

11. The apparatus of claim 6, wherein the cooling device comprises a heat pipe.

12. The apparatus of claim 6, wherein the cooling device comprises a heat sink.

13. The apparatus of claim 6, further comprising a lever having an arm with a hold-down tab and a shaft connecting the lever to the printed circuit board, the lever being movable between a first open position and a second closed position via an arc of motion, wherein the lever is configured such that, in its second closed position, when the carrier frame is in its second closed position, movement of the arm about the shaft causes the hold-down tab to hold down and apply a force to the carrier frame, which in turn applies a force to the integrated circuit package and the cooling device.

14. The apparatus of claim 6, wherein the loading mechanism comprises a screw.