HK1180171B - Two-shot knuckles for coupling electrically isolated sections of an electronic device and methods for making the same - Google Patents

Description

Dual injection molded joint coupling electrically isolated components of an electronic device and method of making same

Technical Field

Systems and methods for coupling components of an electronic device are disclosed. In particular, the components of the electronic device may be assembled from two or more parts, wherein the parts may be coupled together using a two-shot molded joint (two-shot joint).

Background

Portable electronic devices may be constructed using different methods. In some cases, an electronic device may be constructed by assembling several components together. These "components" can include external components that combine to form an equipment enclosure (e.g., an equipment "enclosure"), as well as internal components (e.g., the internal components can be microchips) that can be used to provide structural support or other functionality for the electronic equipment. The components may be formed of any suitable material, such as metal, plastic, or any other material, depending on the design of the electronic device.

In some cases, various components of an electronic device may be used as part of a circuit. For example, a particular component may act as a resistor or capacitor for another portion of the electronic device. As another example, a component may be part of an antenna arrangement of an electronic device. If the assembly is used in only a single circuit, the assembly may be constructed from a single piece of conductive material. However, if the same component is used in several different circuits, the component may need to be constructed from several different "parts" where the parts are made up of conductive elements. In this case, however, it may be necessary to separate the various conductive components with insulating or other non-conductive materials to ensure that each component functions properly in its respective circuit. In some cases, it may be desirable for the insulating material to both exhibit desirable cosmetic (cosmetic) characteristics and to fulfill its functional role of coupling the components together and electrically isolating the components.

Disclosure of Invention

A dual injection molded joint for coupling electrically isolated components of an electronic device and a method of manufacturing the same are provided. In some embodiments, the electronic device may be formed from several components, such as an outer perimeter component and/or other components. The outer perimeter component can provide a housing structure for the electronic device by surrounding the electronic device. In some cases, this outer perimeter component may be assembled from two or more "parts". The joint may then be used to couple these components together.

The shape and configuration of the joint may be based on various design considerations. The dual injection molded joint includes a first injection molded component and a second injection molded component.

Both of the injection molded components are composed of different dielectric materials, with the first injection molded component being composed of a relatively high strength structural material and the second injection molded component being composed of a decorative material. The first injection molded component may physically couple the two conductive components together by interfacing with a coupling structure of each component. The first mold assembly includes a second mold retention area and an outer trim area. A second injection molded component occupies the trim area and anchors itself to the first injection molded component using a second injection molded retention area. The second injection molded component may be only the portion of the dual injection molded joint that is visible to a user of the electronic device and may be exhibited in any desired color.

Drawings

The above and other features and characteristics and various advantages of the present invention will become more apparent upon consideration of the following detailed description, taken in conjunction with the accompanying drawings, in which:

FIG. 1 illustrates a schematic diagram of exemplary components of an electronic device according to some embodiments of the invention;

2A-2G illustrate several views of an exemplary stent according to some embodiments of the present invention;

2H-2N illustrate several views of another exemplary stent according to some embodiments of the present invention;

FIGS. 3A and 3B illustrate several exemplary views of a bracket welded to a component according to some embodiments of the invention;

FIG. 4 illustrates several exemplary views of another bracket welded to a component, according to some embodiments of the invention;

FIGS. 5A and 5B illustrate various views of a particular joint design according to an embodiment of the present invention;

FIGS. 6A-6C show various schematic views of another particular joint design in accordance with an embodiment of the present invention;

FIG. 7 illustrates a cross-sectional view of the joint shown in FIG. 6A according to one embodiment of the present invention;

FIGS. 8A-8C show various schematic views of yet another specific joint design in accordance with an embodiment of the present invention;

FIG. 9 illustrates a dual injection molded joint according to some embodiments of the present invention;

FIG. 10 illustrates a cross-sectional view along line A-A of the joint shown in FIG. 9, according to an embodiment of the present invention;

FIGS. 11A-11B, 12A-12B, 13A-13B, and 14A-14B illustrate exemplary views of a series of process steps for manufacturing a dual injection molded joint according to some embodiments of the present invention; and

FIG. 15 illustrates an exemplary process for mechanically coupling two conductive components together with a dual injection molded joint according to some embodiments of the invention.

Detailed Description

An electronic device may include several components that are assembled together to form internal and/or external features of the electronic device. For example, one or more internal components (e.g., circuitry and/or internal support structures) may be disposed within an external component (e.g., housing structure) to provide the electronic device with the desired functionality. As used herein, the term "component" refers to a distinct entity of an electronic device, such as a particular circuit (e.g., a microchip), a housing forming part of an electronic device (e.g., a backplate, an outer perimeter component, etc.), an internal support structure (e.g., a midplane), and so forth.

In some instances, an assembly may be manufactured by assembling and connecting together two or more different individual elements (e.g., "parts"), where the term "part" as used herein refers to a single portion of an assembly, where that assembly may be formed from multiple parts. The various components of the assembly may be coupled together with "joints". These joints may exhibit various shapes and configurations based on the intended function and design of the assembly and its components. For example, the joint may include a structural design that reinforces the joint in areas of high mechanical strain, that counteracts twisting motion in areas of high torsion, that interlocks two components together such that they are mechanically coupled together, that provides electrical isolation between the components, and so forth.

FIG. 1 illustrates a schematic diagram of exemplary components of an electronic device according to some embodiments of the invention. In particular, FIG. 1 shows an outer perimeter assembly 100 that may be constructed by connecting several components together, such as components 110, 120, 130, and 140. The outer perimeter assembly 100 can be configured to form an outer, perimeter surface for an electronic device. In particular, the outer perimeter assembly 100 may surround or wrap some or all of the internal components (e.g., circuitry, internal support structures, etc.) of the electronic device. In other words, the outer perimeter assembly 100 may define an interior volume in which the inner assembly may be placed.

The thickness, length, height, and cross-section of the outer perimeter assembly 100 may be selected according to any suitable criteria, such as according to structural requirements (e.g., stiffness or resistance to bending, compression, tension, or torsion in a particular direction). In some embodiments, the outer perimeter assembly 100 may be mounted to its structural assembly as a component of other electronic equipment. Some structural integrity of the outer perimeter assembly 100 may result from its defined closed shape (e.g., the outer perimeter assembly 100 forms a ring, thereby increasing structural integrity).

The outer perimeter assembly 100 can have any suitable cross-section. For example, the outer perimeter component 100 may have a substantially rectangular cross-section. Each corner of the substantially rectangular cross-section may be rounded in shape, thereby forming a "spline". As used herein, the term "spline" refers to a rounded corner portion of the outer perimeter component. In some embodiments, the outer perimeter assembly 100 can have a cross-section of any other suitable shape, including, for example, circular, elliptical, polygonal, or curved. In some embodiments, the shape or size of the cross-section of the outer perimeter assembly 100 may vary with the length or width of the electronic device (e.g., an hourglass-shaped cross-section).

The outer perimeter component 100 of the electronic device may be constructed using any suitable process. In some embodiments, the outer perimeter assembly 100 may be constructed by connecting the component 110 and the component 120 together at an interface 112, connecting the component 120 and the component 130 together at an interface 122, connecting the component 130 and the component 140 together at an interface 132, and connecting the component 140 and the component 110 together at an interface 142. Although the outer perimeter assembly 100 illustrated in FIG. 1 is constructed from 4 components, one skilled in the art will appreciate that the outer perimeter assembly 100 may alternatively be formed from any suitable number of two or more components and that the interfaces between the components may be located anywhere on the outer perimeter assembly 100.

Each of the components 110, 120, 130, and 140 may be constructed independently and then assembled to form the outer perimeter assembly 100. For example, each component may be independently constructed using one or more of stamping, polishing, working, casting, or any combination thereof. In some embodiments, the materials selected for components 110, 120, 130, and/or 140 may be electrically conductive, thereby allowing these components to provide electrical functionality to the electronic device. For example, the components 110, 120, 130, and/or 140 may be formed from an electrically conductive material such as stainless steel or aluminum. In some embodiments, each component may act as an antenna for the electronic device.

To mechanically couple the various components together, joints 114, 124, 134, and 144 may be located at interfaces 112, 122, 132, and 142, respectively. In some embodiments, each joint may be constructed from a material that starts in a first state and may subsequently change to a second state. As an example, a joint may be constructed from a plastic that begins in a first state, a liquid state, and then subsequently changes to a second state, a solid state. When in a liquid state, the plastic may be allowed to flow into the interfaces 112, 122, 132, and 142. After flowing into these interfaces, the plastic material may then be allowed to harden into the joints 114, 124, 134, and 144 (e.g., the plastic material may be allowed to change to a second state, i.e., a solid state). After changing to a solid state, the plastic material may then bond the components 110 and 120, 120 and 130, and 140 and 110, respectively, together, thereby forming a single new assembly (e.g., the outer perimeter assembly 100). In an embodiment, the knuckle 134 may be ornamental and not physically coupling the components 130 and 140 together. In this embodiment, the components 130 and 140 may be welded together such that they are physically and electrically coupled. In another embodiment, a joint may physically couple components 130 and 140 together in accordance with the principles of the present invention.

Joints 114, 124, and 144 not only physically couple components 110 and 120, 120 and 130, and 140 and 110, respectively, together, they also electrically isolate components 110 from components 120, 120 from components 130, and 140 from components 110. For purposes of discussion, it is assumed that the components 130 and 140 are electrically identical in that they are welded together and the knuckle 134 is ornamental. As will be described in greater detail below, the knuckles 114, 124, and 144 seal and/or are co-located with coupling structures that are affixed to or integrally formed as part of the components 110, 120, 130, and 140. That is, when the joint is in its first state (e.g., liquid), it flows into and/or around the coupling structure. A valve clip device (not shown) may be located at each interface to shape the joint as it transitions to its second state (e.g., solid state). As shown in FIG. 1, joints 114 and 124 are asymmetric in shape and joint 144 is symmetric in shape.

Coupling structures (not shown) are on the components 110, 120, 130, and 140. Some components (e.g., components 110 and 120) may have two coupling structures, while other components (e.g., components 130 and 140) have one coupling structure for interfacing with an articulation interface. In some embodiments, the coupling structure may be a bracket, such as that shown in fig. 2. The bracket may be affixed or welded to the inside surface of the component. In another embodiment, the coupling structure may be an integrally formed portion of the component that was originally part of the component. In fig. 1, knuckle 114 interfaces with and integrally forms a coupling structure with the brackets and knuckles 124 and 144 interface with both brackets.

Any suitable process may be used to place the joint material into the interfaces 112, 122, 132, and 142, and any suitable process may be used to change the joint material from the first state to the second state. In some embodiments, a "molding process" may be used in which the joint material is initially inserted in a liquid state and then subsequently hardened. For example, one or more of injection molding, compression molding, transfer molding, extrusion molding, blister molding, thermoplastic, vacuum forming, or rotomolding processes may be used. In this case, a "one shot injection molding" process may be used in which the joint material is inserted in a single step and then independently changed to its second state. In other words, the joint may be formed in a single step (e.g., in a "one shot injection mold") without the need for additional steps or manufacturing processes.

The joint material may be any material suitable for mechanically coupling two components together and electrically isolating the two components. The joint material may be a plastic, such as a thermoplastic. In one embodiment, the joint material may be glass-filled nylon.

Fig. 2A-G illustrate several views of an exemplary bracket 200 mountable to one of the components according to embodiments of the invention. Specifically, fig. 2A-G show rear, top, front, left, right, bottom, and isometric views, respectively, of the stent 200. The bracket 200 may include three legs 210, 220, and 230 that extend away from a plate assembly (planermember) 240. The legs 210 and 220 may each extend away from the plate assembly 240 at a right angle (e.g., 90 degrees), while the leg 230 may extend away from the plate assembly 240 at an angle between 1 and 90 degrees. The legs 230 may have grooves 232 to facilitate the flow of joint material when it is in its first state. In addition, the plate 240 may have through holes 242 or cutouts of any suitable shape to facilitate the flow of joint material when it is in its first state. The legs 210, 220, and 230 may have legs 214, 224, and 234, respectively, for welding to a surface of one of the components.

The bracket 200 may be constructed of any suitable material. In some embodiments, the stand 200 is constructed of an electrically conductive material such as a metal (e.g., steel or aluminum). In some embodiments, the bracket 200 is constructed of the same material as the component to which it is to be welded. For example, the bracket 200 and the component to which it is to be welded may both be constructed of stainless steel.

It will be appreciated that any suitable configuration of bracket may be used to connect the components. For example, fig. 2H-2N illustrate several views of a stent 250 constructed in accordance with an embodiment of the invention. Brace 250 is similar in many respects to brace 200 in that it includes legs and weld legs and cutouts for facilitating the flow of joint material.

Referring now to fig. 3A-3B, exemplary views of bracket 200 welded to component 300 are shown. Specifically, fig. 3A shows an exemplary cross-sectional view and fig. 3B shows an exemplary top view. The bracket 200 is shown positioned within a recess 310 of the component 300. The recess 310 may be machined from the component 300 during or after the component 300 is manufactured. The recess 310 may act as a receptacle to receive a portion of the joint when the joint portion changes from the first state to the second state. As shown, the feet 214, 224, and 234 are welded to the recess 310. This welding physically anchors the bracket 200 to the component 300 and electrically couples the bracket to the component 300.

The edges of the bracket 200 are aligned with the edges of the member 300. This alignment may be the result of a cutting operation that physically cuts away a portion of the stent 200 and member 300. The entire cross-sectional area of the aligned edges of the stent 200 and member 300 controls the capacitance of the joint coupling the two members together. A smaller cross section generally results in a smaller capacitance. In embodiments where the component acts as an antenna, the smaller capacitance enhances the performance of the antenna. The cross-sectional area may be varied, for example, by increasing the thickness of the stent 200 or using stents having different cross-sectional shapes. See fig. 4 for an example of another stent 400 having a different cross-sectional shape.

Fig. 5A illustrates an exemplary enlarged perspective view of components 110 and 140 (of fig. 1) having brackets 200 each welded thereto, according to an embodiment of the invention. Fig. 5A also shows contact assemblies 520 and 540 soldered to the top of the plate assembly of each bracket 200. The contact members 520 and 540 have cutouts that mimic the cutouts 242 of the bracket 200 and which promote the flow of joint material when it is in its first state. After the joint material seals the stent 200 and the components 520 and 540, a portion of the contact components 520 and 540 will remain and be exposed. The exposed portion may provide a pad for a connection conductor (e.g., an antenna conductor) to electrically couple to one of the components 120 or 140.

There is a gap 510 between the sidewalls of the members 110 and 140. The gap 510 may have a predetermined distance maintained between the sidewall and the bracket 200 when applying the articular material. When the material is applied, it can flow into and around the stent 200, components 520 and 540, and fill the recess in which the stent 200 resides. After the material cures, the resulting joint 144 is provided (fig. 5B).

Fig. 5B illustrates a perspective view of a joint 144 according to an embodiment of the present invention. As shown, joint 144 physically couples components 110 and 140 together, but the distance through gap 510 ensures that they are electrically isolated. Even if the joint 144 cures, a portion of the contact assemblies 520 and 540 are exposed. It is understood that contact assemblies 520 and 540 are optional and not necessary for each joint. For example, knuckle 124 may not seal any contact components.

Fig. 6A illustrates a perspective view of the joint 124 of fig. 1, according to an embodiment of the present invention. Knuckle 124 may seal two brackets (not shown) and mechanically couple components 120 and 130 together and electrically isolate them by gap 710. Fig. 6B and 6C show respective perspective and top views of brackets 200 and 250 mounted to components 120 and 130, respectively. Bracket 250 is slightly smaller in size than its opposing bracket 200 and thus may be better suited for mounting in curved portions, such as component 120.

Fig. 7 shows a cross-sectional view along line a-a of fig. 6A. The cross-sectional view shows the side wall 732 of the component 130, the knuckle 124, and the bracket 200. Also shown is a vertical center axis 701 that is aligned with the plate assembly 240. A horizontal central axis 702 is also shown bisecting the plate assembly 240. The knuckle 124 has the same thickness on both sides of the center axes 701 and 702. This ensures that the joints 124 are evenly distributed around the stent and provides optimal mechanical coupling strength.

Fig. 8A-C illustrate various exemplary views of the interface 112 according to embodiments of the invention. Fig. 8A shows bracket 250 mounted to component 120 and it also shows integrally coupled structure 850. Fig. 8B and 8C show knuckle 114 interfacing with bracket 250 and coupling structure 850.

Fig. 9 shows a dual injection molded joint according to an embodiment of the present invention. As shown, dual injection molded joint 910 mechanically couples components 920 and 930 together. Members 920 and 930 may be any suitable conductive members, each having a coupling structure (e.g., a bracket or integrally formed structure welded thereto). For example, components 920 and 930 may each have a bracket welded thereto. As another example, member 920 may have a bracket welded thereto and member 930 may have an integrally formed structure. In yet another example, both components 920 and 930 may have integrally formed structures.

Dual injection molded joint 910 includes a first injection molded component 912 and a second injection molded component 918. First injection molded assembly 912 physically couples components 920 and 930 together. That is, the first injection molded component 912 provides a mechanical coupling because the first injection molded component 912 seals two coupling structures similar to those discussed above in connection with fig. 5-8. Further, first injection molded assembly 912 is constructed from a material that is more suitable for coupling components 920 and 930 than second injection molded assembly 918. For example, the first molding material 912 may be composed of glass filled nylon and the second molding material may be composed of unfilled nylon. Both the first and second injection molded assemblies 912 and 918 electrically isolate the components 920 and 930 from each other.

A second injection molded component 918 resides in a second injection molded retention area 913 and within the void between components 920 and 930. Because the second injection molded component 918 resides within the void, it is the portion that is visible to the user when the electronic device that uses the joint 910 and the components 920 and 930 is fully assembled. As such, the second injection mold 918 functions as an exterior component and may be constructed of a material having any suitable color. For example, the second injection molded component 918 may be white, blue, purple, red, green, orange, yellow, or gray.

Figure 10 illustrates a cross-sectional view of the joint 910 taken along line a-a of figure 9, according to an embodiment of the present invention. Fig. 10 shows a first injection molded component 912 having a second injection molded retention area 913. The second injection mold retention area 913 may be a cavity formed in the component 912 during the first injection molding process. These cavities serve as coupling mechanisms that enable the second injection mold assembly 918 to anchor itself to the first injection mold assembly 912. In some embodiments, the second mold component 918 may be comprised of a material that cannot chemically bond to the first mold material 912 after it has cured. This may be because it is desirable not to weld any portion of the first injection mold assembly 912 after it has cured. As such, the second injection molded component 918 anchors itself to the first injection molded component 912 after it has cured by virtue of the second injection molded retention region 913.

Figures 11A-B through 14A-B illustrate a series of process steps for manufacturing a dual injection molded joint in accordance with an embodiment of the present invention. The figure ending with the letter a shows a top view and the figure ending with the letter B shows a cross-sectional view. The dual injection molded joint may be joint 910 in fig. 9, however, it is understood that any other suitable joint may be formed.

11A-B show the result after the first injection mold assembly 1112 has been applied and cured. The first injection molded component 1112 is shown abutting the inner surfaces of the parts 1120 and 1130 and protruding from the void 1150. Further, the first injection molded component 1112 is shown as a seal coupling structure 1140 (shown here as a bracket). Also shown is a second mold retention area 1113 that is part of the first mold assembly 1112. The retaining region 1113 may be formed by a metal insert that is held in place during the molding process. After the mold is cured, the metal insert is removed, leaving the retaining region 1113.

Fig. 12A-B illustrate the trim portion 1114 machined from the first injection mold assembly 1112. The formation of the trim portion 1114 also cuts the components 1120 and 1130 to a suitable size such that a void 1160 having a predetermined distance exists therebetween. Void 1160 may have a predetermined distance that is greater than the distance of void 1150. Fig. 12B shows the trim portion 1114 cutting the first molded part 1112 at an angle at an edge of the first molded part 1112. Fig. 12B also shows how the cutting tool 1170 removes the cosmetic portion 1114 by machining along path 1172. The angled cut provides a pocket into which material from the second injection molded component may flow during the molding of the second injection molded component.

Fig. 13A-B illustrate how the second injection mold assembly 1118 anchors itself to the first injection mold assembly 1112 using a second injection mold retaining region 1113. Fig. 13A-B also show second injection molded assembly 1118 extending through void 1160. Fig. 14A-B show knuckle 1110 after a finishing process (finishing process) is applied that removes any excess second injection mold 1118.

FIG. 15 illustrates an exemplary process for mechanically coupling two conductive components together using a dual injection molded joint, according to an embodiment of the invention. Beginning at step 1510, a first conductive member having a first coupling structure and a first sidewall is provided. At step 1515, a second conductive member having a second coupling structure and a second sidewall is provided. The first and second components are secured in place such that a first gap exists between the first and second sidewalls. The first coupling structure may be a bracket or a unitary structure. Similarly, the second coupling structure may be a bracket or a unitary structure.

At step 1520, a first injection molded component is molded into the first void, the first injection molded component interfacing with the first and second coupling structures to physically couple the first and second conductive components together and including a second injection molded retention area. For example, the first injection molded component may be injection molded.

At 1530, an cosmetic area is machined from the first injection molded component and the first and second electrically conductive components, the cosmetic area including a second void existing between the first and second sidewalls. Then, in step 1540, a second injection mold is molded into the trim region.

At step 1550, an exterior finishing process is applied to the components and joints.

This process may include modifying a portion of the joint and polishing the part to meet the desired aesthetics.

It should be understood that the above-described processes are exemplary only. Any steps may be removed, modified, or combined, and any steps may be added or performed in a different order, without departing from the scope of the invention.

According to one embodiment of the present disclosure, there is provided an external perimeter component of an electronic device, the external perimeter component including: a first conductive member; a second conductive member; and a third conductive member; a first bi-injection molded knuckle; a second dual injection molded knuckle; and a third dual-injection molded joint, and wherein: the first bi-injection molded joint couples the first conductive component to the second conductive component; the second overmold joint coupling the second conductive member to the third conductive member; the third dual-injection joint couples the third conductive member to the first conductive member; and wherein each of the first, second, and third double injection molded joints comprises a first injection mold mechanically coupling the respective components and a second injection mold providing an exterior finish.

According to one embodiment of the present disclosure, the first shot and the second shot are comprised of a dielectric material.

According to one embodiment of the present disclosure, the first injection mold is comprised of glass filled nylon.

According to one embodiment of the present disclosure, the second injection mold is comprised of unfilled nylon.

According to one embodiment of the present disclosure, the second injection mold is exterior and exhibits any one of a plurality of colors.

According to one embodiment of the present disclosure, the color of the second shot is white.

According to an embodiment of the present disclosure, there is provided an electronic apparatus including: a first conductive component having a first coupling structure and a sidewall; a second conductive component having a second coupling structure and a sidewall, wherein a first gap exists between the sidewall of the first conductive component and the sidewall of the second conductive component; and a first shot molded into the first void, the first shot interfacing with the first and second coupling structures to physically couple the first and second conductive strips together and including a second shot retaining area; an exterior trim region machined from the first injection mold and the first and second conductive strips, the exterior trim region including a second void existing between a sidewall of the first conductive strip and a sidewall of the second conductive strip; and a second injection mold molded into the trim region.

According to one embodiment of the present disclosure, the first shot includes a second shot retaining area created using a metal insert.

According to one embodiment of the present disclosure, the first injection mold is glass filled nylon and the second injection mold is unfilled nylon.

According to an embodiment of the present disclosure, the first injection mold includes a first injection mold formed by injection molding.

According to an embodiment of the present disclosure, the second injection mold includes a second injection mold formed by injection molding.

According to one embodiment of the present disclosure, a portion of the second injection mold is polished.

According to one embodiment of the present disclosure, the second shot anchors itself to the second shot retaining area of the first shot.

According to an embodiment of the present disclosure, there is provided an electronic device including the outer perimeter component as described above.

The described embodiments of the present invention have been presented for purposes of illustration and not limitation.

This patent Cooperation treaty patent application claims priority from U.S. provisional patent application No.61/529728 entitled "Two-shot Knucklesfielding Electronicdeviceand MethodssformtheSame" filed on 31/8/2011 and U.S. provisional patent application No.13/251,026 entitled "Two-shot Knucklesfielding Electronicdeviceand MethodssformngSame" filed on 30/9/2011, which are all incorporated herein by reference in their entirety.

Claims (30)

1. An electronic device, comprising:

a first conductive component having a first coupling structure and a first sidewall;

a second conductive component having a second coupling structure and a second sidewall; and

a dual-shot coupling part formed of a first shot and a second shot, wherein:

the first sidewall and the second sidewall are separated by a void;

the first shot defines a second shot retention area and at least partially seals the first and second coupling structures such that the first and second conductive components are physically coupled together; and

the second shot is molded into the second shot holding area and occupies the void.

2. The electronic device of claim 1, wherein the first shot and the second shot are comprised of a dielectric material.

3. The electronic device of claim 1, wherein the first injection mold is comprised of glass filled nylon.

4. The electronic device of claim 1, wherein the second injection mold is comprised of unfilled nylon.

5. The electronic device of claim 1, wherein the second injection mold is cosmetic and exhibits any one of a plurality of colors.

6. The electronic device defined in claim 1 wherein the second mold-retaining region comprises a cavity and wherein the second mold anchors itself to the cavity.

7. The electronic device of claim 1, wherein the second shot is not chemically bonded to the first shot.

8. The electronic device defined in claim 1 wherein the first coupling structure is a bracket that is welded to the first conductive component.

9. The electronic device defined in claim 1 wherein the second coupling structure is a bracket that is welded to the second conductive component or an integrally formed structure of the second conductive component.

10. A method of manufacturing a dual injection molded joint, comprising:

providing a first conductive component having a first coupling structure and a first sidewall;

providing a second conductive component having a second coupling structure and a second sidewall;

molding a first mold into a first void separating a first sidewall and a second sidewall, the first mold at least partially sealing the first coupling structure and the second coupling structure to physically couple the first conductive component and the second conductive component together and including a second mold retaining area;

machining an exterior finish area from the first injection mold and the first and second electrically conductive components, the exterior finish area including a second void existing between the first and second sidewalls; and

a second injection molding is performed into the outer trim region.

11. The method of manufacturing of claim 10, wherein molding the first shot includes using a metal insert to create the second shot holding area.

12. The method of manufacturing of claim 10, wherein the first injection mold is glass filled nylon and the second injection mold is unfilled nylon.

13. The method of manufacturing of claim 10, wherein molding the first injection mold comprises injection molding the first injection mold.

14. The method of manufacturing of claim 10, wherein molding the second injection mold comprises injection molding the second injection mold.

15. The method of manufacturing of claim 10, further comprising polishing a portion of the second shot.

16. The method of manufacturing of claim 10, wherein the second shot anchors itself to the second shot retaining area of the first shot.

17. An external perimeter assembly of an electronic device, the external perimeter assembly comprising:

a first conductive member;

a second conductive member; and

a dual injection molded coupling component formed from a first injection mold that mechanically couples the first conductive component and the second conductive component by at least partially sealing the coupling structure of the first conductive component and the second conductive component, and a second injection mold that provides an exterior finish.

18. The external perimeter assembly of claim 17, wherein said first shot and said second shot are comprised of a dielectric material.

19. The external perimeter assembly of claim 17, wherein said first injection mold is comprised of glass filled nylon.

20. The external perimeter assembly of claim 17, wherein said second injection mold is comprised of unfilled nylon.

21. The external perimeter assembly of claim 17, wherein said second injection mold is exterior and exhibits any one of a plurality of colors.

22. The external perimeter assembly of claim 17, wherein said second injection mold is white in color.

23. An electronic device, comprising:

a first conductive component having a first coupling structure and a first sidewall;

a second conductive component having a second coupling structure and a second sidewall;

a first injection mold molded into a first void between a first sidewall and a second sidewall, the first injection mold at least partially sealing the first coupling structure and the second coupling structure to physically couple the first conductive component and the second conductive component together and comprising a second injection mold retention area;

an exterior trim area machined from the first injection mold and the first and second electrically conductive components, the exterior trim area including a second void existing between the first and second sidewalls; and

a second injection mold molded into the trim region.

24. The electronic device defined in claim 23 wherein the first shot comprises a second shot retaining region created using a metal insert.

25. The electronic device of claim 23 wherein the first mold is glass filled nylon and the second mold is unfilled nylon.

26. The electronic device of claim 23, wherein the first injection mold is formed by injection molding.

27. The electronic device of claim 23, wherein the second injection mold is formed by injection molding.

28. The electronic device of claim 23, wherein a portion of the second injection mold is polished.

29. The electronic device of claim 24, wherein the second shot anchors itself to the second shot retaining region of the first shot.

30. An electronic device comprising the external perimeter assembly of any of claims 17-22.