HK1177321A - Anisotropic conductive film, bonded body and bonding method - Google Patents

Abstract

Provided is an anisotropic conductive film comprising at least a conductive layer and an insulating layer, wherein said insulating layer contains a binder, a monofunctional polymerizable monomer and a curing agent, said conductive layer contains Ni particles, metal-coated resin particles, a binder, a polymerizable monomer and a curing agent, and said metal-coated resin particles are resin particles formed by coating a resin core with at least Ni.

Description

Anisotropic conductive film, bonded body, and bonding method

Technical Field

The present invention relates to an anisotropic conductive film having high conduction reliability and high adhesion, and particularly suitable for connection to a COF and a PWB, a bonded body using the anisotropic conductive film, and a bonding method.

Background

When mounting a driver chip on a Liquid Crystal Display (LCD), a common method is to thermally bond a COF (chip on film) on which the driver chip is mounted on a Flexible Printed Circuit (FPC) to the LCD and a printed wiring board via an Anisotropic Conductive Film (ACF).

In this case, the LCD and the COF or the COF and the PWB are electrically connected to each other by ACF connection, and the adjacent electrodes can maintain insulation, and the LCD and the COF or the COF and the PWB are provided with a function of adhesion so as not to be peeled off by an external force.

In recent years, in order to reduce the cost of an LCD module, there has been an activity of reducing the number of components of a COF by increasing the output of one COF (i.e., increasing the pitch).

However, when the pin pitch is more densely packed as described above, the pattern position deviation accuracy in the ACF thermal pressing becomes strict. The difficulty of misalignment between the pattern on the LCD side and the pattern on the COF side, and the position of misalignment between the pattern on the COF side and the pattern on the PWB side, can be dealt with by correcting the pattern pitch of the COF in advance because the former has a fine pitch and the LCD side is glass, and the amount of thermal expansion is stable.

On the other hand, in the latter case, the thermal expansion amount is unstable due to the unstable quality of the glass and epoxy material of the PWB, and the degree of difficulty in the positional deviation is high. In addition, the glass transition temperature (Tg) of FR-4 standard for general PWB is 110 to 130 ℃, and if considering the reduction of warpage of PWB and damage of connection part of ACF, the temperature at the time of press bonding is preferably lower. Here, the connection of COFs to PWBs requires low temperature connections. In recent years, the demand for short-time connection has also become strong in order to improve productivity.

However, if the mechanical strength of the cured adhesive is increased to improve the conduction reliability by providing the ACF with low-temperature connectivity and short-time connectivity, the adhesion strength (90 ° Y-axis peel strength) of the bond between the COF and the PWB tends to decrease. This is considered to be the following reason: since the adhesive is immediately solidified in a low temperature region, the polyimide material on the COF side and the adhesive cannot be sufficiently wetted, chemical bonding is difficult to form, and since the cured adhesive is solidified, the amount of deformation of the cured adhesive itself at the connecting portion is small when the peel strength in the 90 ° Y axis direction is measured, and therefore, the absorption energy for deformation is small.

On the other hand, when the mechanical strength (i.e., elastic modulus) of the cured adhesive is designed to be low so that the amount of deformation of the cured adhesive per se of the connecting portion is increased when the peel strength in the 90 ° Y-axis direction is measured, the adhesion strength is improved, but the communication reliability is deteriorated.

It is an extremely difficult problem to balance the improvement of the adhesion strength to COF and the improvement of the communication reliability to TCP (thin film package) in this way.

Further, there is a problem that sufficient peel strength cannot be obtained depending on the kind of COF. There is also a method of optimizing the binder composition of the ACF in order to bond a COF that is difficult to bond (i.e., has a low peel strength) with high strength, but there is a problem that if one COF is optimized, it is difficult to bond another COF.

Generally, a COF is mounted to an LCD panel to complete an LCD module, and when the LCD module is assembled to a frame, temporary external stress is applied to ACF connections of the LCD panel and the COF, COF and PWB.

Empirically, it is known that if the peel strength between the LCD panel and the COF and between the COF and the PWB is not 4N/cm or more, the possibility of the COF and the ACF connection portion peeling off increases when the LCD module is assembled into a chassis and operated. In this case, the higher the peel strength between the LCD panel and the COF, and PWB, the more resistant the LCD panel can withstand external stress during assembly, and the usability of the assembly worker is improved.

As a method for imparting high adhesion to various COFs, although the adhesion margin to each adherend can be increased by lowering the glass transition temperature (Tg) and the elastic modulus of the adhesive of the ACF, there is a problem that the adhesive is easily softened in a high-temperature and high-humidity environment (85 ℃, 85% RH), and therefore the on-resistance increases.

Many studies have been made to solve the above problems. For example, patent documents 1 and 2 propose ACFs using nickel fine particles.

Further, patent documents 3, 4, and 5 propose conductive particles in which a resin core is nickel-plated and a shell thereof is gold-plated, and an ACF to which the conductive particles are applied.

Patent document 6 proposes an ACF in which a resin core is nickel-plated and a case thereof is silver-plated.

Patent document 7 proposes an ACF containing hard conductive particles and soft conductive particles. As the hard conductive particles, particles obtained by gold plating of nickel were used, and as the soft conductive particles, particles obtained by gold plating of crosslinked polystyrene resin particles were used.

However, in all of the prior art documents, an anisotropic conductive film having both high adhesion and excellent conduction reliability under a low temperature short time condition (130 ℃ and 3 seconds), a bonded body using the anisotropic conductive film, and a bonding method have not been obtained, and it is expected that the anisotropic conductive film is provided as soon as possible.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2007-211122

Patent document 2: japanese laid-open patent publication No. 2004-238738

Patent document 3: japanese Kokai publication Hei-2009-500804

Patent document 4: japanese laid-open patent publication No. 2008-159586

Patent document 5: japanese patent laid-open publication No. 2004-14409

Patent document 6: japanese patent laid-open publication No. 2007-242731

Patent document 7: japanese laid-open patent publication No. 11-339558

Disclosure of Invention

Problems to be solved by the invention

The present invention addresses the problems described above in the prior art and achieves the following objects. That is, an object of the present invention is to provide an anisotropic conductive film having both high adhesion and excellent conduction reliability under a low temperature short time condition, a bonded body using the anisotropic conductive film, and a bonding method.

Means for solving the problems

As a result of intensive and repeated studies to solve the above problems, the present invention has found that the anisotropic conductive film described below has high adhesiveness and excellent conduction reliability even under low-temperature short-time conditions. The anisotropic conductive film is composed of at least two layers, namely an insulating layer containing a monofunctional monomer for high adhesion and a conductive layer containing nickel particles for breaking through an oxide film on a PWB electrode to obtain low connection resistance and resin particles in which at least nickel is coated on a resin core for high conduction reliability.

The present invention is based on the above findings made by the inventors and as a means for solving the above problems, the following is shown. Namely:

<1> an anisotropic conductive film, characterized in that the anisotropic conductive film has at least a conductive layer and an insulating layer,

the insulating layer contains a binder, a monofunctional polymerizable monomer, and a curing agent,

the conductive layer contains nickel particles, metal-coated resin particles, a binder, a polymerizable monomer, and a curing agent,

the metal-coated resin particles are resin particles in which a resin core is coated with at least nickel.

<2> the anisotropic conductive film according to <1>, wherein the insulating layer contains at least a phenoxy resin, a monofunctional propylene (ene) monomer, and an organic peroxide.

<3> the anisotropic conductive film according to any one of <1> to <2>, wherein the conductive layer contains at least a phenoxy resin, a (propylene) monomer, and an organic peroxide.

<4> the anisotropic conductive film according to any one of <1> to <3>, wherein the metal-coated resin particles are resin particles in which a resin core is coated with nickel, or resin particles in which a resin core is coated with nickel and an outermost surface is coated with gold.

<5> the anisotropic conductive film according to any one of <1> to <4>, wherein the resin core is made of any one of styrene-divinylbenzene copolymer and benzoguanamine resin.

<6> the anisotropic conductive film according to any one of <1> to <5>, wherein an average particle diameter of the metal-coated resin particles is 5 μm or more.

<7> the anisotropic conductive film according to any one of <1> to <6>, wherein a total content of the nickel particles and the metal-coated resin particles in the conductive layer is 3.0 parts by mass to 20 parts by mass with respect to 100 parts by mass of a resin solid content of the conductive layer.

<8> a bonded body comprising a first circuit member, a second circuit member and the anisotropic conductive film of any one of <1> to <7>,

the first circuit member and the second circuit member are bonded via the anisotropic conductive film.

<9> the joined body according to <8>, wherein the first circuit member is a printed wiring board,

the second circuit part is a COF.

<10> a bonding method characterized in that, for a connecting method of a first circuit part and a second circuit part,

sandwiching the anisotropic conductive film of any one of <1> to <7> between the first circuit member and the second circuit member,

the anisotropic conductive film is cured by pressing the first and second circuit members while heating, thereby bonding the first and second circuit members together.

<11> the bonding method according to <10>, wherein the first circuit part is a printed wiring board,

the second circuit part is a COF.

<12> the bonding method according to <11>, wherein the anisotropic conductive film is disposed such that the conductive layer is on the printed wiring board side and the insulating layer is on the COF side.

Effects of the invention

The present invention can solve the above-described problems in the prior art to achieve the above-described object, and can provide an anisotropic conductive film having both high adhesion and excellent conduction reliability at low temperature in a short time, a bonded body using the anisotropic conductive film, and a bonding method.

Drawings

Fig. 1 is a schematic view showing an example of the anisotropic conductive film of the present invention.

FIG. 2 is a schematic view showing an example of a joined body of the present invention.

FIG. 3 is a schematic view showing a method of measuring peel strength in examples.

Fig. 4 is a schematic diagram showing a method of measuring the on-resistance in the embodiment.

Description of the reference numerals

10 PWB (first circuit component)

11 COF (second circuit part)

11a terminal

12 anisotropic conductive film

12a conductive particles (Nickel particles, resin particles coated with at least nickel)

20 Peel off substrate (separator)

21 conductive layer

22 insulating layer

100 joined body

Detailed Description

(Anisotropic conductive film)

The anisotropic conductive film of the present invention has at least a conductive layer and an insulating layer, and further has a release substrate and other layers as necessary.

Preferably, the anisotropic conductive film includes a release substrate (separator), an insulating layer formed on the release substrate (separator), and a conductive layer formed on the insulating layer. In the case where a release substrate is provided, the release substrate may be peeled and removed at the time of bonding.

< insulating layer >

The insulating layer contains a binder, a monofunctional polymerizable monomer, a curing agent, and a silane coupling agent and other components as required.

Conventionally, a monofunctional monomer has not been used as a reaction main component of an adhesive for an Anisotropic Conductive Film (ACF). This is because the monofunctional monomer is used for the purpose of imparting adhesiveness to a film and dissolving an adhesive, and if the reaction component is only the monofunctional monomer, the adhesive cured product becomes sticky and becomes an adhesive cured product with low heat resistance, and therefore, the monofunctional monomer is not applied to an anisotropic conductive film which requires high conduction reliability.

On the other hand, since the COF driver generates heat to about 40 to 60 ℃ during driving, the anisotropic conductive film has a suitable high glass transition temperature (Tg) exhibited by the binder, and since the mechanical strength can be improved by increasing the blending ratio of the binder even when a monofunctional monomer is used, the anisotropic conductive film of the present invention having a two-layer structure of a conductive layer and an insulating layer containing two kinds of conductive particles has no problem in the current carrying characteristics even when a monofunctional monomer is used for the insulating layer.

The hard nickel particles contained in the conductive layer of the anisotropic conductive film of the present invention have a structure in which the terminals are undercut, and a sufficient adhesive strength (peel strength) is required to maintain the undercut of the terminals. Further, if the peel strength at room temperature is high, the nickel particles can withstand external stress during assembly and the like, and can maintain the undercut of the terminal.

Therefore, in the anisotropic conductive film of the present invention, it is essential that the composition of the binder is such that the conductive layer contains two types of conductive particles (nickel particles and resin particles in which the resin core is at least coated with nickel) and the insulating layer contains a monofunctional monomer.

-binders-

The binder is not particularly limited and may be appropriately selected according to the purpose, and examples thereof include phenoxy resins, epoxy resins, unsaturated polyester resins, saturated polyester resins, polyurethane resins, butadiene resins, polyimide resins, polyamide resins, and polyolefin resins. These may be used alone or in combination of two or more. Among them, phenoxy resins are particularly preferable from the viewpoints of moldability, processability and adhesion reliability.

The phenoxy resin is a resin synthesized from bisphenol a and epichlorohydrin, and a suitably synthesized resin or a commercially available product may be used. Examples of the commercially available product include trade names: YP-50 (manufactured by Tokyo Kagaku K.K.), YP-70 (manufactured by Tokyo Kagaku K.K.), EP1256 (manufactured by Nippon epoxy resin Co., Ltd.), and the like.

The content of the binder in the insulating layer is not particularly limited and may be appropriately selected according to the purpose, and is, for example, preferably 20 to 70 mass%, and more preferably 35 to 55 mass%.

Monofunctional polymerizable monomers

The monofunctional polymerizable monomer is not particularly limited as long as it has one polymerizable group in the molecule, and may be appropriately selected according to the purpose, and examples thereof include monofunctional (propylene) monomers, styrene monomers, butadiene monomers, and other olefin monomers having a double bond. These may be used alone or in combination of two or more. Among these, monofunctional (sub) propylene monomers are particularly preferable in terms of adhesion strength and connection reliability.

The monofunctional (ene) monomer is not particularly limited and may be appropriately selected depending on the purpose, and examples thereof include acrylic acid, acrylic acid esters such as acrylic acid, methyl acrylate, ethyl acrylate, propyl acrylate, n-butyl acrylate, isobutyl acrylate, n-octyl acrylate, n-dodecyl acrylate, 2-ethylhexyl acrylate, stearyl acrylate, 2-chloroethyl acrylate, and phenyl acrylate, and esters thereof; methacrylic acid or its esters such as methacrylic acid, methyl methacrylate, ethyl methacrylate, propyl methacrylate, N-butyl methacrylate, isobutyl methacrylate, octyl methacrylate, N-dodecane methacrylate, 2-ethylhexyl methacrylate, stearyl methacrylate, phenyl methacrylate, N-diethylaminoethyl methacrylate, and the like. These may be used alone or in combination of two or more.

The content of the monofunctional polymerizable monomer in the insulating layer is not particularly limited and may be appropriately selected according to the purpose, and is preferably 2 to 30% by mass, and more preferably 5 to 20% by mass.

Curing agents

The curing agent is not particularly limited as long as it can cure the binder, and may be appropriately selected according to the purpose, and for example, organic peroxides and the like are preferable. Examples of the organic peroxide include lauroyl peroxide, butyl peroxide, benzyl peroxide, lauroyl peroxide, dibutyl peroxide, benzyl peroxide, peroxydicarbonate, and benzoyl peroxide. These may be used alone or in combination of two or more.

The content of the curing agent in the insulating layer is not particularly limited and may be appropriately selected according to the purpose, and is preferably 1 to 15 mass%, more preferably 3 to 10 mass%.

Silane coupling agent

The silane coupling agent is not particularly limited and may be appropriately selected according to the purpose, and examples thereof include an epoxy silane coupling agent, an acryl silane coupling agent, a thiol silane coupling agent, and an amino silane coupling agent.

The content of the silane coupling agent in the insulating layer is particularly limited and may be appropriately selected according to the purpose, and is preferably 0.5 to 10 mass%, more preferably 1 to 5 mass%.

Other ingredients-

The content of the other component in the insulating layer is not particularly limited and may be appropriately selected according to the purpose, and examples thereof include a filler, a softening agent, an accelerator, an antioxidant, a colorant (pigment, dye), an organic solvent, an ion scavenger, and the like. The amount of the other component added is not particularly limited and may be appropriately selected according to the purpose.

The insulating layer can be formed by preparing a coating liquid for an insulating layer containing a monofunctional polymerizable monomer, a curing agent, preferably a silane coupling agent, and if necessary, other components (such as an organic solvent), applying the coating liquid for an insulating layer on a release substrate (separation device), and drying the coating liquid for an insulating layer to remove the organic solvent.

The thickness of the insulating layer is not particularly limited and may be appropriately selected according to the purpose, and is preferably 10 to 25 μm, and more preferably 18 to 21 μm, for example. If the thickness is too small, the peel strength may be reduced, and if it is too large, the conduction reliability may be deteriorated.

< conductive layer >

The conductive layer contains nickel particles, metal-coated resin particles, a binder, a polymerizable monomer, a curing agent, and, if necessary, a silane coupling agent and other components.

Nickel particles-

The nickel particles are used to achieve low contact resistance. The nickel particles are not particularly limited and may be appropriately selected as needed, and the average particle diameter is preferably 1 to 5 μm. If the average particle size is less than 1 μm, the surface area is small, and therefore, the contact reliability is poor after the press-bonding, and if it exceeds 5 μm, short-circuiting between wirings may occur when the wiring pitches are dense, and a problem may occur.

Particles having metal protrusions on the surface of the nickel particles and particles having an insulating film formed on the surface of the nickel particles by an organic substance can also be used.

The average particle diameter of the nickel particles is a number average particle diameter, and can be measured, for example, by a particle size distribution measuring apparatus (macchian MT3100, manufactured by japan ltd.).

Preferably, the nickel particles have a hardness of, for example, 2000kgf/mm²～6000kgf/mm². The hardness of the nickel particles can be determined from a test force at which a load is applied to the nickel particles and the nickel particles are deformed by 10% in a micro-compressor test, for example.

As the nickel particles, appropriately synthesized nickel particles may be used, or commercially available ones may be used.

The content of the nickel particles in the conductive layer is not particularly limited and may be appropriately selected according to the purpose, and is preferably 2 to 10 parts by mass, more preferably 2 to 8 parts by mass, with respect to 100 parts by mass of the resin solid (total amount of the binder, the polymerizable monomer, and the curing agent). If the content is too small, the on-resistance becomes large, and if it is too large, the risk of short-circuiting may increase.

Metal-coated resin particles

In view of conduction reliability, the metal-coated resin particles are preferably resin particles in which the resin core is coated with at least nickel, and examples thereof include resin particles in which the resin core is coated with nickel, resin particles in which the resin core is coated with nickel and the outermost surface of the resin core is coated with gold, and the like.

The method of coating the resin core with nickel or gold is not particularly limited, and may be appropriately selected according to the purpose, and for example, an electroless plating method, a sputtering method, or the like may be mentioned.

The material of the resin core is not particularly limited and may be appropriately selected according to the purpose, and examples thereof include styrene-divinylbenzene copolymer, benzoguanamine resin, crosslinked polystyrene resin, acryl resin, styrene-silica composite resin, and the like. Among them, a styrene-divinylbenzene copolymer is particularly preferable from the viewpoint that the contact area of the soft particles is increased when compressed, and good conduction reliability can be secured.

Preferably, the hardness of the metal-coated resin particles is, for example, 50kgf/mm²～500kgf/mm². The hardness of the metal-coated resin particles can be determined from a test force when a load is applied to the nickel particles and the nickel particles are deformed by 10% in a micro-compressor test, for example.

The difference (A-B) between the hardness (A) of the nickel particles and the hardness (A) of the metal-coated resin particles and the hardness (B) of the metal-coated resin particles is preferably 1500kgf/mm²More preferably 2000kgf/mm²～5000kgf/mm². If the difference (A-B) in hardness is less than 1500kgf/mm²The hardness of the nickel particles is insufficient, and the nickel particles cannot break the metal oxide film on the electrode pattern, resulting in poor conduction.

As the metal-coated resin particles, appropriately synthesized metal-coated resin particles may be used, or commercially available products may be used.

The average particle diameter of the metal-coated resin particles is preferably 5 μm or more, and more preferably 9 to 11 μm. If the average particle diameter is less than 5 μm, the reaction force of the metal-coated resin particles at the time of press-fitting may be reduced, and a problem may occur in connection reliability.

The average particle diameter of the metal-coated resin particles represents a number average particle diameter, and can be measured, for example, by a particle size distribution measuring apparatus (macchian MT3100, manufactured by japan).

The content of the metal-coated resin particles in the conductive layer is not particularly limited and may be appropriately selected according to the purpose, and is preferably 2 to 10 parts by mass, more preferably 2 to 8 parts by mass, relative to 100 parts by mass of the resin solid (total amount of the binder, the polymerizable monomer, and the curing agent). If the content is too small, the on-resistance becomes large, and if it is too large, the risk of short-circuiting may increase.

The total content of the nickel particles and the metal-coated resin particles in the conductive layer is preferably 3 to 20 parts by mass, and more preferably 5 to 10 parts by mass, based on 100 parts by mass of the resin solid content. If the content is too small, the on-resistance becomes large, and if it is too large, the risk of short-circuiting may increase.

Polymerizable monomers

The polymerizable monomer is not particularly limited, and monofunctional or polyfunctional polymerizable monomers can be used, and examples thereof include monofunctional (propylene) monomers, bifunctional (propylene) monomers, and trifunctional (propylene) monomers. These may be used alone or in combination of two or more.

The content of the polymerizable monomer in the conductive layer is not particularly limited and may be appropriately selected according to the purpose, and is preferably 3 to 60 mass%, more preferably 5 to 50 mass%.

Binders, curing agents, silane coupling agents and other ingredients

As the binder, the curing agent, the silane coupling agent, and other components in the conductive layer, the same components as those of the binder, the curing agent, the silane coupling agent, and other components of the insulating layer may be used at the same content as that of the insulating layer.

The conductive layer can be formed by preparing a coating liquid for a conductive layer containing nickel particles, metal-coated resin particles, a binder, a polymerizable monomer, a curing agent, preferably a silane coupling agent, and if necessary, other components, and applying the coating liquid for a conductive layer on the insulating layer.

The thickness of the conductive layer is not particularly limited and may be appropriately selected according to the purpose, and is, for example, preferably 10 to 25 μm, and more preferably 15 to 20 μm. If the thickness is too small, conduction reliability may be deteriorated, and if it is too large, peel strength may be reduced.

The thickness of the anisotropic conductive film obtained by combining the insulating layer and the conductive layer is preferably 25 to 55 μm, and more preferably 30 to 50 μm. If the thickness is too small, the peel strength may be reduced due to insufficient filling, and if it is too large, poor conduction due to insufficient insertion may occur.

Stripping of substrates

The release substrate is not particularly limited in shape, structure, size, thickness, material (material), and the like, and may be appropriately selected according to the purpose, and is preferably a release substrate having good releasability and a release substrate having high heat resistance, and examples thereof include a transparent release PET (polyethylene terephthalate) sheet coated with a release agent such as silica gel, and a PTFE (polytetrafluoroethylene) sheet.

The thickness of the release substrate is not particularly limited and may be appropriately selected according to the purpose, and is, for example, preferably 10 to 100 μm, and more preferably 20 to 80 μm.

As shown in fig. 1, the anisotropic conductive film of the present invention includes a release substrate (separator) 20, an insulating layer 22 formed on the release substrate (separator) 20, and a conductive layer 21 formed on the insulating layer 22. Conductive particles 12a (nickel particles and nickel/gold plating resin particles) are dispersed in the conductive layer 21.

As shown in fig. 2, the conductive film 12 is attached so that the conductive layer 21 is located on the PWB10 side. Thereafter, the release substrate (separation device) 20 is peeled off and COF11 is pressed from the insulating layer 22 side to form the joined body 100.

(conjugant)

The bonded body of the present invention includes a first circuit member, a second circuit member, and the anisotropic conductive film of the present invention, and further includes other members as necessary.

The first circuit member and the second circuit member are bonded via the anisotropic conductive film.

A first circuit component

The first circuit member is not particularly limited and may be appropriately selected according to the purpose, and examples thereof include an FPC, a PWB, and the like. Among them, PWB is preferred.

A second circuit part

The second circuit member is not particularly limited and may be appropriately selected according to the purpose, and examples thereof include FPC, COF (Chip on film), TCP, PWB, IC substrate, distribution board, and the like. Among them, COF is preferable.

In the bonded body, the conductive layer of the anisotropic conductive film is bonded so as to be positioned on the printed wiring board side as the first circuit member, and the release substrate is peeled off from the anisotropic conductive film, and the insulating layer is disposed so as to be positioned on the COF side as the second circuit member.

(bonding method)

The bonding method of the invention is as follows: in the method of bonding the first circuit part and the second circuit part,

the anisotropic conductive film of the present invention is sandwiched between the first circuit member and the second circuit member,

the anisotropic conductive film is cured by pressing from the first circuit member and the second circuit member while heating, thereby bonding the first circuit member and the second circuit member.

At this time, preferably, the first circuit part is a printed wiring board, and the second circuit part is a COF.

The conductive layer of the anisotropic conductive film preferably constitutes a printed wiring board side, and the insulating layer of the anisotropic conductive film preferably constitutes a COF side, and is bonded by heating and pressing from the COF upper surface.

-lamination conditions-

The heating is determined by the total heat amount, and when the bonding is completed within a bonding time of 10 seconds or less, the heating is preferably performed at a heating temperature of 120 to 220 ℃.

The pressing may not be generally specified depending on the kind of the second circuit member, and for example, the pressing is preferably performed for 3 to 10 seconds each at a pressure of 2 to 6MPa in the case of a TAB tape, 20 to 120MPa in the case of an IC chip, and 2 to 6MPa in the case of a COF.

[ examples ] A method for producing a compound

The following examples are illustrative of the present invention, but the present invention is not limited to the following examples.

< measurement of average particle diameter of Nickel particles or resin particles >

The average particle size of the nickel particles or the resin particles was measured by a particle size distribution measuring apparatus (macchian MT3100, manufactured by japan electronics corporation) or the like.

Preparation example 1

Preparation of nickel particles

Nickel powder type T255 manufactured by freshwater valley corp is classified so that the average particle diameter thereof is 3 μm, thereby obtaining nickel particles.

(preparation example 2)

Preparation of gold-plated nickel particles

After classifying the nickel powder type T255 manufactured by sakeka corporation so that the average particle diameter thereof is 3 μm, gold was electroplated on the surface of the nickel particles by displacement plating, thereby obtaining gold-plated nickel particles.

Preparation example 3

Preparation of nickel-plated resin particles

The resin particles of styrene-divinylbenzene copolymer having an average particle diameter of 10 μm were subjected to electroless nickel plating on the surface of the particles to prepare nickel-plated resin particles.

Preparation example 4

Preparation of Ni/Au plated resin particles A-

With respect to the resin particles of styrene-divinylbenzene copolymer having an average particle diameter of 10 μm, nickel/gold-plated resin particles A were prepared by subjecting the particle surfaces to electroless nickel plating and subjecting the nickel-plated surfaces to gold plating by displacement plating.

Preparation example 5

Preparation of Ni/Au plated resin particles B

For the crosslinked polystyrene resin having an average particle diameter of 10 μm, nickel/gold-plated resin particles B were prepared by subjecting the particle surfaces to electroless nickel plating and subjecting the nickel-plated surfaces to gold plating by displacement plating.

Preparation example 6

Preparation of Ni/Au plated resin particles C

With respect to the benzoguanamine particles having an average particle diameter of 5 μm, nickel/gold plating was performed on the particle surface by electroless nickel plating and on the nickel-plated surface by displacement plating to prepare nickel/gold-plated resin particles C.

(example 1)

< production of Anisotropic conductive film 1>

Preparation of the insulating layer 1

A mixed solution of ethyl acetate and toluene was prepared so that the solid content was 50% by mass, and the mixed solution contained 45 parts by mass of a phenoxy resin (trade name: YP-50, manufactured by Tokyo chemical Co., Ltd.), 20 parts by mass of urethane acrylate (trade name: U-2PPA, manufactured by Ninghamu chemical Co., Ltd.), 10 parts by mass of a monofunctional propylene monomer (trade name: 4-HBA, manufactured by Osaka organic chemical Co., Ltd.), 2 parts by mass of a phosphate acrylate (trade name: PM-2, manufactured by Nippon chemical Co., Ltd.), 3 parts by mass of benzoyl peroxide (manufactured by Nichikuai oil Co., Ltd.) as an organic peroxide and 3 parts by mass of lauroyl peroxide (manufactured by Nichikuai oil Co., Ltd.) as an organic peroxide.

Then, after the mixed solution was coated on a polyethylene terephthalate (PET) film having a thickness of 50 μm, it was dried in an oven at 80 ℃ for 5 minutes and the PET film was peeled off, thereby preparing an insulating layer 1 having a thickness of 18 μm.

Preparation of the conductive layer 1

A mixed solution of ethyl acetate and toluene was prepared so as to have a solid content of 50% by mass, and the mixed solution contained 45 parts by mass of a phenoxy resin (trade name: YP-50, manufactured by Tokyo chemical Co., Ltd.), 20 parts by mass of urethane acrylate (trade name: U-2PPA, manufactured by Ninghamu chemical Co., Ltd.), 10 parts by mass of a monofunctional propylene monomer (trade name: 4-HBA, manufactured by Osaka organic chemical Co., Ltd.), 2 parts by mass of a phosphate acrylate (trade name: PM-2, manufactured by Nippon chemical Co., Ltd.), 3 parts by mass of benzoyl peroxide (manufactured by Nichikukoku Co., Ltd.) as an organic peroxide, 3 parts by mass of lauroyl peroxide (manufactured by Nichikukoku Co., Ltd.) as an organic peroxide, 2.8 parts by mass of nickel particles (average particle diameter 3 μm) of production example 1, and 2.8 parts by mass of nickel/gold plating resin particles C (average particle diameter 5 μm) of production example 6, resin core: benzoguanamine resin) 3.8 parts by mass.

Then, after the mixed solution was coated on a polyethylene terephthalate (PET) film having a thickness of 50 μm, it was dried in an oven at 80 ℃ for 5 minutes and the PET film was peeled off, thereby preparing a conductive layer 1 having a thickness of 17 μm.

Then, the prepared insulating layer 1 and conductive layer 1 were laminated by a roller to be bonded. An anisotropic conductive film 1 having a two-layer structure composed of an insulating layer 1 and a conductive layer 1 was prepared to have a total thickness of 35 μm.

Preparation of the adapter

The prepared anisotropic conductive film 1 was bonded to a COF (polyimide film 38 μm thick, copper 8 μm thick, P (pitch) 200 μm (line width: grating pitch 1: 1), tin-plated product) or TCP (polyimide film 75 μm thick, copper 18 μm thick, epoxy adhesive layer 12 μm, P (pitch) 200 μm (line width: grating pitch 1: 1), tin-plated product and PWB (glass epoxy resin substrate, copper 35 μm thick, P (pitch) 200 μm (line width: grating pitch 1: 1), gold flash-plated product) to prepare a bonded body 1.

The COF or TCP is bonded to the PWB under the following press conditions.

< pressing Condition >

ACF width: 2.0mm

Tool width: 2.0mm

Cushioning material: the thickness of the silica gel rubber is 0.2mm

P (foot distance) 0.2 mm-COF/PWB: 130 ℃/3MPa/3sec

P (foot distance) 0.2 mm-TCP/PWB: 140 ℃/3MPa/3sec

Then, the produced anisotropic conductive film 1 and the bonded body 1 were measured for peel strength and on-resistance as described below. The results are shown in FIG. 1.

< method for measuring peeling Strength >

As shown in FIG. 3, the peel strength in the 90 ℃ Y-axis direction of the prepared joined body was measured at a drawing speed of 50 mm/min. Since bonding to COF is more difficult than bonding to TC, only the peel strength to COF is measured and evaluated as follows. The results are expressed as the maximum value of peel strength (N/cm).

[ evaluation standards ]

O: peel strength of 8N/cm or more

X: peeling strength less than 8N/cm

< method for measuring on-resistance >

As shown in fig. 4, the produced joined body was measured for on-resistance (initial on-resistance (Ω)) and on-resistance (Ω) after an environmental test (1000 hours of standing at 85 ℃ and 85% RH) by a four-terminal method using a tester, and evaluated according to the following criteria. Since the on-reliability to TCP is more strict than COF, only the on-resistance to TCP is measured.

[ evaluation criteria for initial on-resistance ]

O: on-resistance of 0.060 omega or less

X: on-resistance exceeding 0.060 omega

[ evaluation criteria for on-resistance after environmental test (1000 hours of storage in 85 ℃ C. and 85% RH atmosphere) ]

O: (initial on-resistance/on-resistance after environmental test) less than 5

And (delta): (on-resistance after environmental test/initial on-resistance) of 5 to 11

X: (on-resistance after environmental test/initial on-resistance) of11 or more

(example 2)

< production and evaluation of Anisotropic conductive film 2>

An anisotropic conductive film 2 having a two-layer structure composed of an insulating layer 1 and a conductive layer 2 and a bonded body 2 having a total thickness of 35 μm were prepared in the same manner as in example 1, except that the conductive layer 1 was replaced with the conductive layer 2 described below in example 1.

The prepared anisotropic conductive film 2 and bonded body 2 were measured for peel strength and on-resistance in the same manner as in example 1. The results are shown in Table 1.

Preparation of the conductive layer 2

A mixed solution of ethyl acetate and toluene was prepared so that the solid content was 50% by mass, and the mixed solution contained 45 parts by mass of a phenoxy resin (trade name: YP-50, manufactured by Tokyo chemical Co., Ltd.), 20 parts by mass of urethane acrylate (trade name: U-2PPA, manufactured by Newzhongcun chemical Co., Ltd.), 20 parts by mass of a bifunctional propylene monomer (trade name: A-200, manufactured by Newzhongcun chemical Co., Ltd.), 10 parts by mass of a monofunctional propylene monomer (trade name: 4-HBA, manufactured by Osaka organic chemical industries, Ltd.), 2 parts by mass of a phosphate ester acrylate (trade name: PM-2, manufactured by Nippon chemical Co., Ltd.), 3 parts by mass of benzoyl peroxide (manufactured by Nippon oil Co., Ltd.) as an organic peroxide, 3 parts by mass of lauroyl peroxide (manufactured by Nippon oil Co., Ltd.) as an organic peroxide, 3 parts by mass of a phenoxy resin, a mixture of a phenoxy resin and a monomer, 2.8 parts by mass of the nickel particles (average particle diameter: 3 μm) of production example 1 and 3.8 parts by mass of the nickel/gold plating resin particles B (average particle diameter: 10 μm, resin core: crosslinked polystyrene) of production example 5.

Then, after the mixed solution was coated on a polyethylene terephthalate (PET) film having a thickness of 50 μm, it was dried in an oven at 80 ℃ for 5 minutes and the PET film was peeled off, thereby preparing a conductive layer 2 having a thickness of 17 μm.

(example 3)

< production of Anisotropic conductive film 3>

An anisotropic conductive film 3 having a two-layer structure composed of an insulating layer 1 and a conductive layer 3 and a joined body 3 having a total thickness of 35 μm were prepared in the same manner as in example 1, except that the conductive layer 1 was replaced with the conductive layer 3 described below in example 1.

The prepared anisotropic conductive film 3 and bonded body 3 were measured for peel strength and on-resistance in the same manner as in example 1. The results are shown in Table 1.

Preparation of the conductive layer 3

A mixed solution of ethyl acetate and toluene was prepared so that the solid content was 50% by mass, and the mixed solution contained 45 parts by mass of a phenoxy resin (trade name: YP-50, manufactured by Tokyo chemical Co., Ltd.), 20 parts by mass of urethane acrylate (trade name: U-2PPA, manufactured by Newzhongcun chemical Co., Ltd.), 20 parts by mass of a bifunctional propylene monomer (trade name: A-200, manufactured by Newzhongcun chemical Co., Ltd.), 10 parts by mass of a monofunctional propylene monomer (trade name: 4-HBA, manufactured by Osaka organic chemical industries, Ltd.), 2 parts by mass of a phosphate ester acrylate (trade name: PM-2, manufactured by Nippon chemical Co., Ltd.), 3 parts by mass of benzoyl peroxide (manufactured by Nippon oil Co., Ltd.) as an organic peroxide, 3 parts by mass of lauroyl peroxide (manufactured by Nippon oil Co., Ltd.) as an organic peroxide, 3 parts by mass of a phenoxy resin, a mixture of a phenoxy resin and a monomer, 2.8 parts by mass of the nickel particles (average particle diameter: 3 μm) of production example 1 and 3.8 parts by mass of the nickel/gold plating resin particles A (average particle diameter: 10 μm, resin core: styrene-divinylbenzene copolymer) of production example 4.

Then, after the mixed solution was coated on a polyethylene terephthalate (PET) film having a thickness of 50 μm, it was dried in an oven at 80 ℃ for 5 minutes and the PET film was peeled off, thereby preparing a conductive layer 3 having a thickness of 17 μm.

(example 4)

< production of Anisotropic conductive film 4>

An anisotropic conductive film 4 having a two-layer structure composed of an insulating layer 1 and a conductive layer 4 and a joined body 4 having a total thickness of 35 μm were prepared in the same manner as in example 1, except that the conductive layer 1 was replaced with the conductive layer 4 described below in example 1.

The prepared anisotropic conductive film 4 and bonded body 4 were measured for peel strength and on-resistance in the same manner as in example 1. The results are shown in Table 1.

Preparation of the conductive layer 4

A mixed solution of ethyl acetate and toluene was prepared so that the solid content was 50% by mass, and the mixed solution contained 45 parts by mass of a phenoxy resin (trade name: YP-50, manufactured by Tokyo chemical Co., Ltd.), 20 parts by mass of urethane acrylate (trade name: U-2PPA, manufactured by Newzhongcun chemical Co., Ltd.), 20 parts by mass of a bifunctional propylene monomer (trade name: A-200, manufactured by Newzhongcun chemical Co., Ltd.), 10 parts by mass of a monofunctional propylene monomer (trade name: 4-HBA, manufactured by Osaka organic chemical industries, Ltd.), 2 parts by mass of a phosphate ester acrylate (trade name: PM-2, manufactured by Nippon chemical Co., Ltd.), 3 parts by mass of benzoyl peroxide (manufactured by Nippon oil Co., Ltd.) as an organic peroxide, 3 parts by mass of lauroyl peroxide (manufactured by Nippon oil Co., Ltd.) as an organic peroxide, 3 parts by mass of a phenoxy resin, a mixture of a phenoxy resin and a monomer, 2.8 parts by mass of the nickel particles (average particle diameter: 3 μm) of production example 1 and 3.8 parts by mass of the nickel-plated resin particles (average particle diameter: 10 μm, resin core: styrene-divinylbenzene copolymer) of production example 3.

Then, after the mixed solution was coated on a polyethylene terephthalate (PET) film having a thickness of 50 μm, it was dried in an oven at 80 ℃ for 5 minutes and the PET film was peeled off, thereby preparing a conductive layer 3 having a thickness of 17 μm.

(example 5)

< production of Anisotropic conductive film 5>

An anisotropic conductive film 5 having a two-layer structure composed of an insulating layer 1 and a conductive layer 5 and a bonded body 5 having a total thickness of 35 μm were prepared in the same manner as in example 1, except that the conductive layer 1 was replaced with the conductive layer 5 described below in example 1.

The prepared anisotropic conductive film 5 and bonded body 5 were measured for peel strength and on-resistance in the same manner as in example 1. The results are shown in Table 1.

Preparation of the conductive layer 5

A mixed solution of ethyl acetate and toluene was prepared so that the solid content was 50% by mass, and the mixed solution contained 45 parts by mass of a phenoxy resin (trade name: YP-50, manufactured by Tokyo chemical Co., Ltd.), 20 parts by mass of urethane acrylate (trade name: U-2PPA, manufactured by Newzhongcun chemical Co., Ltd.), 20 parts by mass of a bifunctional propylene monomer (trade name: A-200, manufactured by Newzhongcun chemical Co., Ltd.), 10 parts by mass of a monofunctional propylene monomer (trade name: 4-HBA, manufactured by Osaka organic chemical industries, Ltd.), 2 parts by mass of a phosphate ester acrylate (trade name: PM-2, manufactured by Nippon chemical Co., Ltd.), 3 parts by mass of benzoyl peroxide (manufactured by Nippon oil Co., Ltd.) as an organic peroxide, 3 parts by mass of lauroyl peroxide (manufactured by Nippon oil Co., Ltd.) as an organic peroxide, 3 parts by mass of a phenoxy resin, a mixture of a phenoxy resin and a monomer, 1.9 parts by mass of the nickel particles (average particle diameter: 3 μm) of production example 1 and 1.1 parts by mass of the nickel/gold plating resin particles A (average particle diameter: 10 μm, resin core: styrene-divinylbenzene copolymer) of production example 4.

Then, after the mixed solution was coated on a polyethylene terephthalate (PET) film having a thickness of 50 μm, it was dried in an oven at 80 ℃ for 5 minutes and the PET film was peeled off, thereby preparing a conductive layer 3 having a thickness of 17 μm.

Comparative example 1

< production of Anisotropic conductive film 6>

An anisotropic conductive film 6 having a two-layer structure composed of an insulating layer 1 and a conductive layer 6 and a joined body 6 having a total thickness of 35 μm were prepared in the same manner as in example 1, except that the conductive layer 1 was replaced with the conductive layer 6 described below in example 1.

The prepared anisotropic conductive film 6 and bonded body 6 were measured for peel strength and on-resistance in the same manner as in example 1. The results are shown in Table 1.

Preparation of the conductive layer 6

A mixed solution of ethyl acetate and toluene was prepared so that the solid content was 50% by mass, and the mixed solution contained 45 parts by mass of a phenoxy resin (trade name: YP-50, manufactured by Tokyo chemical Co., Ltd.), 20 parts by mass of urethane acrylate (trade name: U-2PPA, manufactured by Newzhongcun chemical Co., Ltd.), 20 parts by mass of a bifunctional propylene monomer (trade name: A-200, manufactured by Newzhongcun chemical Co., Ltd.), and 10 parts by mass of a monofunctional propylene monomer (trade name: 4-HBA, manufactured by Osaka organic chemical industry Co., Ltd.), 2 parts by mass of a phosphate ester type acrylate (trade name: PM-2, manufactured by Nippon chemical Co., Ltd.), 3 parts by mass of benzoyl peroxide (manufactured by Nichikura Co., Ltd.) as an organic peroxide, 3 parts by mass of lauroyl peroxide (manufactured by Nichikura Co., Ltd.) as an organic peroxide, and 2.8 parts by mass of the nickel particles (average particle diameter: 3 μm) of production example 1.

Then, after the mixed solution was coated on a polyethylene terephthalate (PET) film having a thickness of 50 μm, it was dried in an oven at 80 ℃ for 5 minutes and the PET film was peeled off, thereby preparing a conductive layer 3 having a thickness of 17 μm.

Comparative example 2

< production of Anisotropic conductive film 7>

An anisotropic conductive film 7 having a two-layer structure composed of an insulating layer 1 and a conductive layer 7 and a joined body 7 having a total thickness of 35 μm were prepared in the same manner as in example 1, except that the conductive layer 1 was replaced with the conductive layer 7 described below in example 1.

The prepared anisotropic conductive film 7 and bonded body 7 were measured for peel strength and on-resistance in the same manner as in example 1. The results are shown in table 1.

Preparation of the conductive layer 7

A mixed solution of ethyl acetate and toluene was prepared so that the solid content was 50% by mass, and the mixed solution contained 45 parts by mass of a phenoxy resin (trade name: YP-50, manufactured by Tokyo chemical Co., Ltd.), 20 parts by mass of urethane acrylate (trade name: U-2PPA, manufactured by Newzhongcun chemical Co., Ltd.), 20 parts by mass of a bifunctional propylene monomer (trade name: A-200, manufactured by Newzhongcun chemical Co., Ltd.), 10 parts by mass of a monofunctional propylene monomer (trade name: 4-HBA, manufactured by Osaka organic chemical industries, Ltd.), 2 parts by mass of a phosphate ester acrylate (trade name: PM-2, manufactured by Nippon chemical Co., Ltd.), 3 parts by mass of benzoyl peroxide (manufactured by Nippon oil Co., Ltd.) as an organic peroxide, 3 parts by mass of lauroyl peroxide (manufactured by Nippon oil Co., Ltd.) as an organic peroxide, and the nickel/gold plating resin particles A (average particle diameter 10 μm) of preparation example 4 And resin core: styrene-divinylbenzene copolymer) 3.8 parts by mass.

Then, after the mixed solution was coated on a polyethylene terephthalate (PET) film having a thickness of 50 μm, it was dried in an oven at 80 ℃ for 5 minutes and the PET film was peeled off, thereby preparing a conductive layer 3 having a thickness of 17 μm.

(comparative example 3)

< production of Anisotropic conductive film 8>

An anisotropic conductive film 8 having a two-layer structure composed of the insulating layer 2 and the conductive layer 3 and a joined body 8 having a total thickness of 35 μm were prepared in the same manner as in example 3, except that the insulating layer 1 was replaced with the insulating layer 2 described below in example 3.

The prepared anisotropic conductive film 8 and bonded body 8 were measured for peel strength and on-resistance in the same manner as in example 1. The results are shown in table 1.

Preparation of the insulating layer 2

A mixed solution of ethyl acetate and toluene was prepared so that the solid content was 50% by mass, and the mixed solution contained 45 parts by mass of a phenoxy resin (trade name: YP-50, manufactured by Tokyo Kasei K.K.), 20 parts by mass of urethane acrylate (trade name: U-2PPA, manufactured by Newzhongcun chemical Co., Ltd.), and 20 parts by mass of a bifunctional propylene monomer (trade name: A-200, manufactured by Newzhongcun chemical Co., Ltd.), 10 parts by mass of a monofunctional propylene monomer (trade name: 4-HBA, manufactured by Osaka Ogaku Co., Ltd.), 2 parts by mass of a phosphate ester type acrylic acid ester (trade name: PM-2, manufactured by Nippon Kagaku K.K.), 3 parts by mass of benzoyl peroxide (manufactured by Nichiku Co., Ltd.) as an organic peroxide, and 3 parts by mass of lauroyl peroxide (manufactured by Nichiku Co., Ltd.) as an organic peroxide.

Then, after the mixed solution was coated on a polyethylene terephthalate (PET) film having a thickness of 50 μm, it was dried in an oven at 80 ℃ for 5 minutes and the PET film was peeled off, thereby preparing an insulating layer 2 having a thickness of 18 μm.

Comparative example 4

< production of Anisotropic conductive film 9>

A mixed solution of ethyl acetate and toluene was prepared so that the solid content was 50% by mass, and the mixed solution contained 45 parts by mass of a phenoxy resin (trade name: YP-50, manufactured by Tokyo chemical Co., Ltd.), 20 parts by mass of urethane acrylate (trade name: U-2PPA, manufactured by Newzhongcun chemical Co., Ltd.), 20 parts by mass of a bifunctional propylene monomer (trade name: A-200, manufactured by Newzhongcun chemical Co., Ltd.), 10 parts by mass of a monofunctional propylene monomer (trade name: 4-HBA, manufactured by Osaka organic chemical industries, Ltd.), 2 parts by mass of a phosphate ester acrylate (trade name: PM-2, manufactured by Nippon chemical Co., Ltd.), 3 parts by mass of benzoyl peroxide (manufactured by Nippon oil Co., Ltd.) as an organic peroxide, 3 parts by mass of lauroyl peroxide (manufactured by Nippon oil Co., Ltd.) as an organic peroxide, 3 parts by mass of a phenoxy resin, a mixture of a phenoxy resin and a monomer, 2.8 parts by mass of the nickel particles (average particle diameter: 3 μm) of production example 1 and 3.8 parts by mass of the nickel/gold plating resin particles A (average particle diameter: 10 μm, resin core: styrene-divinylbenzene copolymer) of production example 4.

Then, after the mixed solution was coated on a polyethylene terephthalate (PET) film having a thickness of 50 μm, the mixed solution was dried in an oven at 80 ℃ for 5 minutes and the PET film was peeled off, thereby preparing an anisotropic conductive film 9 composed of a conductive layer 3 having a thickness of 35 μm.

Using this anisotropic conductive film 9, a bonded body 9 was prepared in the same manner as in example 1, and the peel strength and the on-resistance were measured in the same manner as in example 1. The results are shown in Table 1.

Comparative example 5

< production of Anisotropic conductive film 10>

A mixed solution of ethyl acetate and toluene was prepared so as to have a solid content of 50% by mass, and the mixed solution contained 45 parts by mass of a phenoxy resin (trade name: YP-50, manufactured by Tokyo chemical Co., Ltd.), 20 parts by mass of urethane acrylate (trade name: U-2PPA, manufactured by Ninghamu chemical Co., Ltd.), 10 parts by mass of a monofunctional acrylic monomer (trade name: 4-HBA, manufactured by Osaka organic chemical Co., Ltd.), 2 parts by mass of a phosphate acrylate (trade name: PM-2, manufactured by Nippon chemical Co., Ltd.), 3 parts by mass of benzoyl peroxide (manufactured by Nichikukoku Co., Ltd.) as an organic peroxide, 3 parts by mass of lauroyl peroxide (manufactured by Nichikukoku Co., Ltd.) as an organic peroxide, 2.8 parts by mass of nickel-plated particles (average particle diameter 3 μm) of production example 2, and 2.8 parts by mass of nickel/gold-plated particles (average particle diameter 10 μm) of production example 5, resin core: crosslinked polystyrene) 3.8 parts by mass.

Then, after the mixed solution was coated on a polyethylene terephthalate (PET) film having a thickness of 50 μm, the mixed solution was dried in an oven at 80 ℃ for 5 minutes and the PET film was peeled off, thereby preparing an anisotropic conductive film 10 composed of a conductive layer 8 having a thickness of 35 μm.

Using this anisotropic conductive film 10, a joined body 10 was prepared in the same manner as in example 1, and the peel strength and the on-resistance were measured in the same manner as in example 1. The results are shown in Table 1.

TABLE 1-1

Tables 1 to 2

Tables 1 to 3

Tables 1 to 4

Tables 1 to 4

Tables 1 to 5

The results in Table 1 show that examples 1 to 5 and comparative examples 1, 2 and 5 all exhibited high peel strength and good adhesion even under the so-called low-temperature short-time conditions of 130 ℃, 3MPa and 3 sec.

In examples 1 to 5 and comparative examples 1, 4 and 5, the initial on-resistance was as low as 0.06 Ω or less, which was good.

In addition, the on-resistances after 1000 hours in the high-temperature and high-humidity environments (85 ℃ C., 85% RH) of examples 3 and 4 and comparative examples 3 and 4 were both low and good.

In example 1, the resin core of the metal-coated resin particle having an average particle diameter of 5 μm used for the benzoguanamine resin had good peel strength and initial on-resistance, and the resin core itself had a larger reaction force than the styrene-divinylbenzene copolymer, and the adhesive cured product was softened by the reaction force of the resin core in an environment of 85 ℃ and 85% RH, so that the on-resistance increased slightly after 1000 hours in a high-temperature and high-humidity environment (85 ℃ and 85% RH).

In example 2, crosslinked polystyrene was used as the resin core of the metal-coated resin particle of the conductive layer, and the peel strength and the initial on-resistance were good, while the resin core of crosslinked polystyrene itself had a larger reaction force than the styrene-divinylbenzene copolymer, and the cured binder pressing the particles was softened under the influence of the reaction force in an environment of 85 ℃ and 85% RH, and therefore, the on-resistance after 1000 hours was slightly increased.

Example 3 is the best mode of the present invention, in which the insulating layer contains a monofunctional propylene monomer, and the conductive layer contains Ni particles and nickel/gold plating resin particles a (resin core: styrene-divinylbenzene copolymer, average particle diameter 10 μm).

In example 4, since a soft styrene-divinylbenzene copolymer was used as the resin core of the metal-coated resin particle of the conductive layer, the reaction force was weak, the particle was crushed, and the contact area between the particle and the electrode was increased, and thus even though only nickel plating was performed, a low on-resistance value was obtained at a level which hardly changed from gold plating to nickel plating even after 1000 hours in a high-temperature and high-humidity environment (85 ℃ and 85% RH).

In example 5, the total amount of the nickel particles and the nickel/gold plating resin particles a was 2.9 parts by mass per 100 parts by mass of the resin solid content, and the on-resistance after 1000 hours in a high-temperature and high-humidity environment (85 ℃, 85% RH) was increased, because the on-resistance was half or less compared to the case where the total amount of the nickel particles and the nickel/gold plating resin particles a was 6.4 parts by mass per 100 parts by mass of the resin solid content in example 3.

In contrast, in comparative example 1, since only nickel particles were contained in the conductive layer, the peel strength and the initial on-resistance were good, but the on-resistance increased after 1000 hours in a high-temperature and high-humidity environment (85 ℃ C., 85% RH).

In addition, in comparative example 2, since nickel particles were not contained in the conductive layer and nickel/gold plating resin particles a were contained, the initial on-resistance was slightly higher than that of example 3 (best mode), and the on-resistance after 1000 hours in a high-temperature and high-humidity environment (85 ℃ c, 85% RH) was greatly increased. This is considered to be: since the oxide film formed on the surface of the PWB pattern could not be broken by only the nickel/gold plating resin particles a to obtain the conductive layer, the temperature was greatly increased after 1000 hours in a high-temperature and high-humidity environment (85 ℃, 85% RH).

In comparative example 3, since only the bifunctional propylene monomer was contained in the conductive layer 2, the on-resistance was good at the initial stage and after 1000 hours in a high-temperature and high-humidity environment (85 ℃ C., 85% RH), but the peel strength was reduced.

In addition, the conductive layer of comparative example 4 is a single layer, decreasing the peel strength.

In addition, in comparative example 5, since the conductive layer is a single layer and the curing reaction component is a monofunctional monomer, the glass transition temperature (Tg) of the cured adhesive is low (> 85 ℃) and the on-resistance after 1000 hours becomes OPEN because the reaction force of the hard particles of the resin core is negative in a high-temperature and high-humidity environment (85 ℃ and 85% RH), as in the example of japanese unexamined patent application publication No. 11-339558. Further, since the shell of the nickel particles is plated with soft gold, the terminal cannot be undercut, and it is difficult to break the oxide film. However, since the reaction component is only a monofunctional monomer and the glass transition temperature (Tg) is low, the peel strength shows a high value.

Industrial applicability of the invention

The anisotropic conductive film of the present invention has high adhesion and excellent conduction reliability at low temperatures in a short period of time, and is therefore suitable for use in the adhesion of circuit components, such as the adhesion of COFs to PWBs, the adhesion of TCPs to PWBs, the adhesion of COFs to glass substrates, the adhesion of COFs to COFs, the adhesion of IC substrates to glass substrates, and the adhesion of IC substrates to PWBs.

Claims (12)

1. An anisotropic conductive film comprising at least a conductive layer and an insulating layer,

the insulating layer contains a binder, a monofunctional polymerizable monomer and a curing agent,

the conductive layer contains nickel particles, metal-coated resin particles, a binder, a polymerizable monomer, and a curing agent,

the metal-coated resin particles are resin particles in which a resin core is coated with at least nickel.

2. The anisotropic conductive film of claim 1, wherein the insulating layer comprises at least a phenoxy resin, a monofunctional propylene (ene) monomer, and an organic peroxide.

3. The anisotropic conductive film according to claim 1 or 2, wherein the conductive layer contains at least a phenoxy resin, a (propylene) monomer, and an organic peroxide.

4. The anisotropic conductive film according to any of claims 1 to 3, wherein the metal-coated resin particles are any of resin particles in which a resin core is coated with nickel and an outermost surface is coated with gold.

5. The anisotropic conductive film according to any one of claims 1 to 4, wherein the material of the resin core is any one of styrene-divinylbenzene copolymer and benzoguanamine resin.

6. The anisotropic conductive film according to any of claims 1 to 5, wherein the average particle diameter of the metal-coated resin particles is 5 μm or more.

7. The anisotropic conductive film according to any one of claims 1 to 6, wherein a total content of the nickel particles and the metal-coated resin particles in the conductive layer is 3.0 to 20 parts by mass with respect to 100 parts by mass of a resin solid content of the conductive layer.

8. A bonded body comprising a first circuit member, a second circuit member, and the anisotropic conductive film according to any one of claims 1 to 7,

the first circuit member and the second circuit member are bonded via the anisotropic conductive film.

9. The junction body according to claim 8, wherein the first circuit member is a printed wiring board,

the second circuit part is a COF.

10. A method of bonding a first circuit member and a second circuit member,

the anisotropic conductive film of any of claims 1-7 sandwiched between the first and second circuit components,

the anisotropic conductive film is cured by pressing from the first circuit member and the second circuit member while heating, thereby bonding the first circuit member and the second circuit member.

11. The bonding method according to claim 10, wherein the first circuit part is a printed wiring board,

the second circuit part is a COF.

12. The bonding method according to claim 11, wherein the anisotropic conductive film is arranged such that the conductive layer is located on a printed wiring board side and the insulating layer is located on a COF side.