HK1176052B

HK1176052B - Process for producing laminate of light-transmitting hard plates and device for laminating light-transmitting hard plates

Info

Publication number: HK1176052B
Application number: HK13103028.5A
Authority: HK
Inventors: 栗村启之; 宫崎隼人; 中岛刚介
Original assignee: 电气化学工业株式会社
Priority date: 2010-01-21
Filing date: 2011-01-13
Publication date: 2015-09-25

Description

Method for manufacturing translucent rigid substrate laminate and apparatus for bonding translucent rigid substrates

Technical Field

The present invention relates to a method for manufacturing a translucent rigid substrate laminate and a translucent rigid substrate bonding apparatus, and more particularly to a method for manufacturing a substrate laminate for manufacturing a display element protective substrate and a glass plate bonding apparatus used in a process for manufacturing protective glass for a display element.

Background

Display elements such as Liquid Crystal Displays (LCDs), organic EL displays (OELDs), electroluminescent displays (ELDs), Field Emission Displays (FEDs), and Plasma Displays (PDPs) are used in display devices of various electronic apparatuses such as televisions, notebook Personal computers, car navigation systems, calculators, cellular phones, electronic organizers, and PDAs (Personal Digital assistants). In order to protect the display element, a protective glass plate product is generally provided so as to face the display element.

This glass plate product is a product obtained by processing a glass plate into a size and a shape suitable for each display device, but in order to meet the market-demanded price level, it is necessary to process a large number of glass plate products with high production efficiency.

Thus, a method for improving the production efficiency of glass plate products is proposed in japanese patent application laid-open No. 2009-256125 (patent document 1). Specifically, a method for processing a glass plate is provided, which is characterized in that a plurality of material glass plates (1) are laminated, and the material glass plates (1) are integrally fixed by a fixing material (2) which is capable of being peeled and is interposed between the material glass plates (1) to form a material glass block (A); dividing the material glass block (A) in the surface direction to form a small-area divided glass block (B); a product glass block (C) formed by processing at least the outer periphery of the divided glass block (B) to form a product shape in plan view; after the end faces of the product glass pieces (C) are finished, the product glass pieces (C) are separated from each other "(claim 1). This describes that "a plurality of glass plate products can be obtained in a small number of steps and productivity is high because the division, the outline processing, and the end face processing are performed in a state where a plurality of material glass plates are laminated" (paragraph 0007).

Patent document 1 describes that "the fixing material (2) interposed between the material glass plates (1) is a photocurable liquid fixing material that is cured when irradiated with ultraviolet light and softened in a cured state when heated" (claim 4). This describes that "when a photocurable liquid fixing agent is interposed between upper and lower glass plates and pressed in the vertical direction, the liquid fixing agent spreads in a film shape with a uniform thickness over the entire surface between the upper and lower glass plates, and when infrared rays are irradiated in this state, the liquid fixing agent spread in the film shape is cured to integrally fix the upper and lower glass plates. Therefore, a plurality of material glass plates can be quickly and accurately laminated and integrally fixed. After the final processing (end face processing), if the product glass block is stored in hot water or the like and heated, the fixing agent solidified between the glass plates is softened, and separated in a film shape. Therefore, the fixing agent can be easily recovered and disposed of without causing environmental pollution. "(paragraph 0007).

In the column entitled "embodiment" of patent document 1, it is described that 20 glass plates are laminated while a photocurable liquid fixing agent is interposed between the glass plates, and then ultraviolet rays (UV light) are irradiated from the upper surface of the laminated glass plates to cure the fixing agent, thereby forming glass plates (paragraphs 0010 to 0011) in which the upper and lower glass plates are integrally fixed.

Documents of the prior art

Patent document

Patent document 1: japanese laid-open patent publication No. 2009-256125

Disclosure of Invention

With the method for processing a glass plate described in patent document 1, a glass plate product having a predetermined shape can be produced with high production efficiency. However, electronic devices are sometimes required to form a desired printed pattern on a glass plate (for example, design of a display screen of a mobile phone), and in such a case, high positional accuracy (for example, an allowable error of about 10 to 30 μm) is required for the printed pattern.

In the method described in patent document 1, 20 glass plates are laminated while interposing a photocurable liquid fixing agent between the glass plates, and then ultraviolet rays (UV light) are irradiated from the upper surface of the laminated glass plates to cure the fixing agent, thereby forming glass blocks in which the upper and lower glass plates are integrally fixed. However, when the raw glass plates are laminated in such a step, the fixing agent is not cured, and the glass surfaces are likely to be slightly displaced from each other, and therefore, it is not suitable for highly accurate positioning. That is, it is difficult to obtain high positional accuracy by the method described in patent document 1.

Patent document 1 discloses an invention of a method for bonding glass, but does not describe an apparatus for realizing the method. For industrial mass production, it is desirable to provide a device capable of conforming to glass.

Accordingly, an object of the present invention is to provide a method for manufacturing a translucent rigid substrate laminate, which can improve positional accuracy. Another object of the present invention is to provide a method for producing a plate-like product using the method for producing a translucent rigid substrate laminate. Another object of the present invention is to provide a translucent rigid substrate bonding apparatus that contributes to improvement in positional accuracy while improving production efficiency of a plate-like product.

As a result of intensive studies to solve the above problems, the present inventors have found that when translucent rigid substrates are bonded to each other with a photocurable fixing agent interposed therebetween in a predetermined positional relationship, it is effective to cure only the outer peripheral portion of the fixing agent spread while being sandwiched between the two translucent rigid substrates so as to perform pre-fixing (pre-irradiation).

In the laminated body of the translucent rigid substrates which are preliminarily fixed, positional deviation is not easily generated even if the substrates are laminated. On the other hand, since the translucent rigid substrates are merely bonded to each other at the outer peripheral portions, the bonding position accuracy is checked after the pre-fixing, and the pre-fixing step is easily performed again after the defective product is once peeled off.

The time required for the preliminary fixing is about 1/5 of the irradiation energy per unit area, compared with the case where all the fixing agent spread on the surface of the translucent rigid substrate is cured. Therefore, if curing (main irradiation) of the fixing agent present near the center of the substrate surface is performed after laminating a plurality of translucent rigid substrates by pre-fixing, it is also possible to manufacture a translucent rigid substrate laminate with high positional accuracy and high production efficiency.

In one aspect of the present invention based on the above-described findings, there is provided a method for manufacturing a translucent rigid substrate laminate, including:

1) a step of preparing a first translucent rigid substrate,

2) a step of preparing a second translucent rigid substrate,

3) a step of applying a photocurable fixing agent to the first surface of the first translucent rigid substrate and/or the first surface of the second translucent rigid substrate,

4) a step of opposing the first surface of the first translucent rigid substrate and the first surface of the second translucent rigid substrate in a positional relationship in a predetermined plane direction so that both surfaces are parallel to each other,

5) a step of bonding the first translucent rigid substrates and the second translucent rigid substrate by applying a predetermined pressure to the first surface of the first translucent rigid substrate and the first surface of the second translucent rigid substrate while maintaining the positional relationship,

6) irradiating light for curing only the outer peripheral portion of the fixing agent spread while being sandwiched between the two translucent rigid substrates while maintaining the pressure to form a pre-fixed translucent rigid substrate laminate,

7) a main irradiation step of irradiating light for curing the uncured fixing agent present in the preliminarily fixed translucent rigid substrate laminate to form a main fixed translucent rigid substrate laminate,

8) repeating the steps 1) to 7 at least 1 time with the primary fixed translucent rigid substrate laminate as the first translucent rigid substrate, thereby forming a primary fixed translucent rigid substrate laminate to which at least 3 translucent rigid substrates are bonded.

Another aspect of the present invention is a method for manufacturing a translucent rigid substrate laminate, including:

1) a step of preparing a first translucent rigid substrate,

2) a step of preparing a second translucent rigid substrate,

7') repeating the steps 1) to 6) at least 1 time with the above-mentioned pre-fixed translucent rigid substrate laminate as a first translucent rigid substrate, thereby forming a pre-fixed translucent rigid substrate laminate to which at least 3 translucent rigid substrates are bonded,

8 ') a main irradiation step of irradiating light for curing the uncured fixing agent present in the preliminarily fixed translucent rigid substrate laminate obtained in the step 7') to form a main fixed translucent rigid substrate laminate.

In one embodiment of the method for manufacturing a translucent rigid substrate laminate according to the present invention, the method further includes:

8 ') repeating steps 1) through 6) at least 1 time with the primary fixed translucent rigid substrate laminate obtained in step 8') as the first translucent rigid substrate to form a composite translucent rigid substrate laminate, and

8 ') a main irradiation step of irradiating light for curing the uncured fixing agent present in the composite translucent rigid substrate laminate obtained in the step 8'), thereby forming a main fixed translucent rigid substrate laminate having an increased number of laminated pieces.

In another embodiment of the method for producing a translucent rigid substrate laminate according to the present invention, the outer peripheral portion is present in an edge region where a part of the plate-shaped product is not formed.

In still another embodiment of the method for producing a translucent rigid substrate laminate according to the present invention, the main irradiation step is performed while applying a predetermined pressure to the bonded translucent rigid substrate surfaces.

In still another embodiment of the method for producing a translucent rigid substrate laminate according to the present invention, the irradiation step is performed after the bubbles dispersed in the uncured fixing agent are moved to a position where the shape is not processed.

In still another embodiment of the method for manufacturing a translucent rigid substrate laminate according to the present invention, the mark for alignment is provided on the surface of each translucent rigid substrate, and the step 4) includes adjusting the position of the image while the image is captured by the image capturing device.

In still another embodiment of the method for producing a translucent rigid substrate laminate according to the present invention, a predetermined print pattern and/or plating pattern for exhibiting one of the functions of the translucent rigid substrate product is provided on the surface of each translucent rigid substrate.

In still another embodiment of the method for producing a translucent rigid substrate laminate according to the present invention, the fixing agent contains a particulate substance.

In still another embodiment of the method for producing a translucent rigid substrate laminate according to the present invention, the amount of light irradiation is 1mJ/cm as measured by an integrated illuminometer using a 365nm light receiver²～500mJ/cm²The range of (1).

In still another embodiment of the method for manufacturing a translucent rigid substrate laminate according to the present invention, the translucent rigid substrate is a glass plate.

In another aspect, the present invention is a method of manufacturing a plate-like article, comprising:

9) a step of dividing the translucent rigid substrate laminate obtained by the above method for producing a translucent rigid substrate laminate in the thickness direction to form a translucent rigid substrate laminate divided into a required number of parts,

10) a step of processing the divided translucent rigid substrate laminate into desired shapes,

11) and a step of forming a plurality of plate-like products by heating the shaped translucent rigid substrate laminate to peel off the bonded translucent rigid substrates from each other.

In one embodiment of the method for manufacturing a plate-like product according to the present invention, the method further includes, between step 9) and step 10), the steps of: the divided translucent rigid substrate laminate is brought into contact with a release agent under temperature and time conditions necessary for reducing the adhesive force of the exposed portion of the outer edge of the fixing agent sandwiched between the translucent rigid substrates.

In another embodiment of the method for producing a plate-like product according to the present invention, the releasing agent contains one or two or more selected from a solvent, an oxidizing agent, and a surfactant.

In still another embodiment of the method for producing a plate-like product according to the present invention, the releasing agent contains one or two or more selected from the group consisting of water, alcohols, oxidizing agents, and surfactants.

In still another embodiment of the method for producing a plate-like product according to the present invention, the release agent contains water, an alcohol and a surfactant in a mass ratio of 30 to 50:5 to 20.

In still another embodiment of the method for producing a plate-like product according to the present invention, the releasing agent contains benzyl alcohol.

In still another embodiment of the method for producing a plate-like article according to the present invention, the releasing agent contains an anionic surfactant.

In still another embodiment of the method for producing a plate-like article according to the present invention, the releasing agent contains a sulfonic acid type surfactant.

In still another embodiment of the method for producing a plate-like product according to the present invention, the liquid temperature of the release agent is 20 to 40 ℃, and the time of contact with the release agent is 1 to 20 minutes.

In still another aspect, the present invention is a translucent rigid substrate bonding apparatus including:

an upper stage for holding the upper translucent rigid substrate, having suction holes for vacuum-sucking the upper translucent rigid substrate,

a pressurizing unit capable of moving the upper stage along the Z-axis direction,

a suction unit for providing suction force to the suction holes,

a lower stage for holding the lower translucent rigid substrate,

a mechanism for moving the lower stage in the X-axis direction, the Y-axis direction and the theta-axis direction,

a mechanism for coating a photocurable fixing agent on either or both of the lower surface of the upper translucent rigid substrate and the upper surface of the lower translucent rigid substrate, and

and light irradiation units arranged at positions where light can be irradiated to the outer peripheral portions of the surfaces to be bonded to the translucent rigid substrates.

In one embodiment of the translucent rigid substrate bonding apparatus according to the present invention, the light irradiation section is arranged along the outer periphery of the held translucent rigid substrate on the lower surface of the upper stage, and irradiates light downward.

By arranging the light irradiation units in this manner, the fixing agent present at the outer peripheral portion of the translucent rigid substrate can be selectively irradiated with light. Since light is irradiated onto the upper translucent rigid substrate, the method is particularly effective when the upper translucent rigid substrates are stacked one by one on the lower translucent rigid substrate (one translucent rigid substrate, or a stack of two or more translucent rigid substrates).

In another embodiment of the translucent rigid substrate bonding apparatus according to the present invention, the light irradiation unit is arranged along the outer periphery of the held translucent rigid substrate on the upper surface of the lower stage, and irradiates light upward.

By arranging the light irradiation units in this manner, the fixing agent present in the outer peripheral portion of the translucent rigid substrate can be selectively irradiated with light in the same manner. Since light is irradiated onto the lower translucent rigid substrate, it is effective when the lower translucent rigid substrates are laminated one by one on the upper translucent rigid substrate (one translucent rigid substrate may be used, or a stack of two or more translucent rigid substrates). In this case, if the translucent rigid substrate laminate after bonding is held on the upper stage without taking out it, the translucent rigid substrates can be continuously laminated by feeding the translucent rigid substrates to be laminated next from the lower stage.

In still another embodiment of the translucent rigid substrate bonding apparatus according to the present invention, the light irradiation portions are arranged so as to surround outer peripheral side surfaces of the two translucent rigid substrates to be bonded, and irradiate light to the outer peripheral side surfaces.

In this case as well, the fixing agent present in the outer peripheral portion of the translucent rigid substrate can be selectively irradiated with light. Since energy of light irradiated to the outer peripheral side surface is absorbed by the adhesive, the light does not reach the vicinity of the center of the translucent rigid substrate. Further, since the light irradiation section can be moved in the Z-axis direction, the light irradiation section can be made to conform to the height of the bonding surface. Therefore, the present invention can be applied to both the case where the lower translucent rigid substrate is stacked one by one on the upper translucent rigid substrate and the case where the upper translucent rigid substrate is stacked one by one on the lower translucent rigid substrate. If the translucent rigid substrate laminate after bonding is held on the upper stage without taking out it, the translucent rigid substrates can be continuously laminated by supplying the translucent rigid substrates to be laminated next from the lower stage.

In still another embodiment of the translucent rigid substrate bonding apparatus according to the present invention, the apparatus further includes: an imaging unit for imaging alignment marks provided on the surfaces of the upper and lower translucent rigid substrates; an image processing unit that detects a degree of positional deviation of alignment marks provided on upper and lower side surfaces based on a result of photographing; and a control unit for controlling the lower stage moving mechanism based on the detected position deviation degree.

By finely adjusting the positional relationship between the translucent rigid substrates by the imaging means, the substrates can be stacked with higher positional accuracy. Therefore, the method can be applied also to a case where high positional accuracy is required for providing a print pattern, a plating pattern, or the like to the surface of the translucent rigid substrate.

In still another embodiment of the translucent rigid substrate bonding apparatus according to the present invention, the outer peripheral portion of the light irradiation section that irradiates light is an edge region where no part of the plate-shaped product is formed.

When the light is selectively irradiated to the edge area, the substrate constituting a part of the plate-like product is not irradiated with the light for preliminary fixing. Therefore, the light irradiation of the portion can be made uniform at the time of the main irradiation thereafter, with the advantage that the deformation of the substrate caused by the deformation of the fixing agent can be suppressed.

In still another embodiment of the translucent rigid substrate bonding apparatus according to the present invention, the translucent rigid substrate held by the upper stage and/or the lower stage is a laminate of 2 or more translucent rigid substrates.

The translucent rigid substrates bonded to each other in the present invention are formed into a laminate of 2 or more translucent rigid substrates, whereby a substrate laminate of 3 or more substrates can be produced.

In still another embodiment of the translucent rigid substrate bonding apparatus according to the present invention, the means for applying the fixing agent applies the fixing agent containing a particulate substance.

Since the fixing agent contains a particulate substance, the thickness of the fixing agent can be made constant, and thus the processing accuracy is improved. Further, due to the difference in linear expansion coefficient between the fixing agent component and the particulate matter, the releasability at the time of the subsequent release is also improved.

In still another embodiment of the translucent rigid substrate bonding apparatus according to the present invention, the translucent rigid substrate is a glass plate.

According to the present invention, the translucent rigid substrate laminate can be manufactured with high positional accuracy. Thus, a plate-like product can be industrially produced with high dimensional accuracy. The present invention can be advantageously used in, for example, a method for mass-producing a cover glass for a display element.

Drawings

Fig. 1 is a schematic diagram showing a first example of a translucent rigid substrate bonding apparatus that can be used to implement the present invention.

Fig. 2 is a schematic view showing an example of the lower surface of the upper stage.

Fig. 3 is a view showing a state where a first substrate is placed on the lower stage.

Fig. 4 is a view showing a state in which the first substrate placed on the lower stage is transported to a position directly below the upper stage.

Fig. 5 is a view showing a state where the upper stage is lowered to vacuum-adsorb the first substrate.

Fig. 6 is a diagram showing a state in which the upper stage is raised while holding the adsorbed first substrate.

Fig. 7 is a view showing a state where the second substrate is placed on the lower stage.

Fig. 8 is a view showing a state where the fixing agent is applied to the upper surface of the second substrate.

Fig. 9 is a view showing a state in which the second substrate placed on the lower stage is transported to a position directly below the upper stage, and alignment marks provided on the surfaces of both substrates are photographed by a camera.

Fig. 10 is a view showing a state in which the fixing agent is applied to the lower surface of the first substrate held by the upper stage.

Fig. 11 is a diagram showing a state in which two substrates are bonded by lowering the upper stage and UV is irradiated to the outer peripheral portion of the substrates.

Fig. 12 is a view showing a state where the upper stage is raised after UV irradiation.

Fig. 13 is a view showing a state where the bonded substrate is conveyed by the lower stage and returned to the original position.

Fig. 14 is a schematic view showing a second example of a substrate bonding apparatus that can be used for implementing the present invention.

Fig. 15 is a schematic view showing a third example of a substrate bonding apparatus that can be used for carrying out the present invention.

Fig. 16 is a schematic view showing a state in which the fixing agent is an obstacle and the substrate is not subjected to edge grinding when the substrate laminate is end-processed.

Fig. 17 is a schematic view showing a state in which each substrate is subjected to edge grinding by reducing the adhesive force of the fixing agent outer edge exposed portion when the substrate laminate is end-processed.

Detailed Description

< first embodiment >

In a first embodiment of the method for manufacturing a translucent rigid substrate laminate according to the present invention, the following steps are performed:

1) a step of preparing a first translucent rigid substrate,

2) a step of preparing a second translucent rigid substrate,

In the steps (1) and (2), a translucent rigid substrate to be processed is prepared. The translucent rigid substrate is not particularly limited, and examples thereof include a glass plate (e.g., a raw glass plate, a glass substrate with a transparent conductive film, a glass substrate on which electrodes or circuits are formed), a sapphire substrate, a quartz substrate, a plastic substrate, and a magnesium fluoride substrate. The glass may be a tempered glass. The size of the translucent rigid substrate is not particularly limited, but typically has 10000 to 250000mm²The left and right areas have a thickness of about 0.1 to 2 mm. The translucent rigid substrates are generally the same size. The surface of each translucent rigid substrate may be provided with a predetermined print pattern or plating pattern for exhibiting one of the functions of the plate-like product, without limitation. Examples of the print pattern include a design of a display screen of a mobile phone, and examples of the plating pattern include,a rotary encoder in which a chrome plating pattern is applied can be cited.

In the step (3), a photocurable fixing agent is applied to the first surface of the first translucent rigid substrate and/or the first surface of the second translucent rigid substrate. The photocurable fixing agent is a fixing agent that is cured by irradiation with light such as ultraviolet light and softened by heating at a high temperature, and various fixing agents are known. As the photocurable fixing agent used in the present invention, any known photocurable fixing agent can be used without particular limitation. The photocurable fixing agent may be applied to the bonding surface of any one of the translucent rigid substrates, but is preferably applied to the bonding surfaces of the two translucent rigid substrates from the viewpoint of improving the adhesiveness.

Examples of the photocurable fixing agent preferably used in the present invention include an adhesive composition containing (a) a polyfunctional (meth) acrylate, (B) a monofunctional (meth) acrylate, and (C) a photopolymerization initiator, as described in WO 2008/018252.

As the (a) polyfunctional (meth) acrylate, a polyfunctional (meth) acrylate oligomer/polymer in which the end or side chain of the oligomer/polymer is (meth) acryloylated by 2 or more, or a polyfunctional (meth) acrylate monomer having 2 or more (meth) acryloyl groups can be used. Examples of the polyfunctional (meth) acrylate oligomer/polymer include 1, 2-polybutadiene terminal urethane (meth) acrylate (e.g., "TE-2000" and "TEA-1000" manufactured by Nippon Caoda corporation), a hydride thereof (e.g., "TEAI-1000" manufactured by Nippon Caoda corporation), 1, 4-polybutadiene terminal urethane (meth) acrylate (e.g., "BAC-45" manufactured by Osaka organic chemical corporation), polyisoprene terminal (meth) acrylate, polyester urethane (meth) acrylate (e.g., "UV-2000B", "UV-3000B", "UV-7000B" manufactured by Nippon synthetic chemical corporation, "KHP-11" and "KHP-17" manufactured by Nippon Kogyo corporation), polyether urethane (meth) acrylate (e.g., "UV-3700B" and "UV-6100B" manufactured by Nippon synthetic chemical Co., Ltd.), bisphenol A type epoxy (meth) acrylate, and the like.

Examples of the 2-functional (meth) acrylate monomer include 1, 3-butanediol di (meth) acrylate, 1, 4-butanediol di (meth) acrylate, 1, 6-hexanediol di (meth) acrylate, 1, 9-nonanediol di (meth) acrylate, neopentyl glycol di (meth) acrylate, dicyclopentyl di (meth) acrylate, 2-ethyl-2-butyl-propylene glycol di (meth) acrylate, neopentyl glycol-modified trimethylolpropane di (meth) acrylate, stearic acid-modified pentaerythritol di (meth) acrylate, polypropylene glycol di (meth) acrylate, 2-bis (4- (meth) acryloyloxydiethoxyphenyl) propane, 2-bis (4- (meth) acryloyloxypropylphenyl) propane, propylene glycol di (meth) acrylate, Or 2, 2-bis (4- (meth) acryloyloxyethoxyphenyl) propane, and the like. Examples of the 3-functional (meth) acrylate monomer include trimethylolpropane tri (meth) acrylate and tris [ (meth) acryloyloxyethyl ] isocyanurate. Examples of the 4-or more-functional (meth) acrylate monomer include dimethylolpropane tetra (meth) acrylate, pentaerythritol ethoxytetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and the like.

Examples of the monofunctional (meth) acrylate monomer (B) include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, isooctyl (meth) acrylate, isodecyl (meth) acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, phenyl (meth) acrylate, cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclopentenyloxyethyl (meth) acrylate, isobornyl (meth) acrylate, methoxylated cyclododecatriene (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and the like, 4-hydroxybutyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, glycidyl (meth) acrylate, caprolactone-modified tetrahydrofurfuryl (meth) acrylate, 3-chloro-2-hydroxypropyl (meth) acrylate, N-dimethylaminoethyl (meth) acrylate, N-diethylaminoethyl (meth) acrylate, t-butylaminoethyl (meth) acrylate, ethoxycarbonylmethyl (meth) acrylate, phenoloxirane-modified (meth) acrylate, phenol (oxirane-2-mole-modified) (meth) acrylate, phenol (oxirane-4-mole-modified) (meth) acrylate, p-cumylphenol oxirane-modified (meth) acrylate, p-cumyl-phenol oxirane-modified (meth) acrylate, and mixtures thereof, Nonylphenol ethylene oxide-modified (meth) acrylate, nonylphenol (ethylene oxide 4 mol-modified) (meth) acrylate, nonylphenol (ethylene oxide 8 mol-modified) (meth) acrylate, nonylphenol (propylene oxide 2.5 mol-modified) (meth) acrylate, 2-ethylhexyl carbitol (meth) acrylate, ethylene oxide-modified phthalic acid (meth) acrylate, ethylene oxide-modified succinic acid (meth) acrylate, trifluoroethyl (meth) acrylate, acrylic acid, methacrylic acid, maleic acid, fumaric acid, ω -carboxy-polycaprolactone mono (meth) acrylate, monohydroxyethyl (meth) acrylate phthalate, (meth) acrylic acid dimer, β - (meth) acryloyloxyethylhydrosuccinate, n- (meth) acryloyloxyalkylhexahydrophthalimide, 2- (1, 2-cyclohexanedicarboximide) ethyl (meth) acrylate, ethoxydiglycol (meth) acrylate, benzyl (meth) acrylate, and the like.

The mixing ratio of the polyfunctional (meth) acrylate (a) and the monofunctional (meth) acrylate (B) is preferably 5:95 to 95:5 (parts by mass) of the polyfunctional (meth) acrylate (a) to the monofunctional (meth) acrylate (B). If the amount is 5 parts by mass or more, there is no possibility of the initial adhesiveness being lowered, and if the amount is 95 parts by mass or less, the peelability can be secured. The cured fixing agent is peeled into a film shape by immersion in warm water. (B) The content of the monofunctional (meth) acrylate is more preferably 40 to 80 parts by mass based on 100 parts by mass of the total amount of (A) and (B).

(C) The photopolymerization initiator is blended for sensitizing with active light rays such as visible light rays and ultraviolet light rays to promote photocuring of the resin composition, and various known photopolymerization initiators can be used. Specifically, benzophenone or a derivative thereof; benzil or a derivative thereof; anthraquinone or a derivative thereof; benzoin; benzoin derivatives such as benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isobutyl ether, benzoin dimethyl ether, and the like; acetophenone derivatives such as diethoxyacetophenone and 4-tert-butyltrichloroacetophenone; 2-dimethylaminoethylbenzoate; p-dimethylaminoethylbenzoate; diphenyl disulfide; thioxanthone or a derivative thereof; camphorquinone; camphorquinone derivatives such as 7, 7-dimethyl-2, 3-dioxobicyclo [ 2.2.1 ] heptane-1-carboxylic acid, 7-dimethyl-2, 3-dioxobicyclo [ 2.2.1 ] heptane-1-carboxy-2-bromoethyl ester, 7-dimethyl-2, 3-dioxobicyclo [ 2.2.1 ] heptane-1-carboxy-2-methyl ester, and 7, 7-dimethyl-2, 3-dioxobicyclo [ 2.2.1 ] heptane-1-carbonyl chloride; α -aminoalkylphenone derivatives such as 2-methyl-1- [ 4- (methylthio) phenyl ] -2-morpholinopropan-1-one and 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1; acylphosphine oxide derivatives such as benzoyldiphenylphosphine oxide, 2,4, 6-trimethylbenzoyldiphenylphosphine oxide, benzoyldiethoxyphosphine oxide, 2,4, 6-trimethylbenzoyldimethoxyphenylphosphine oxide, 2,4, 6-trimethylbenzoyldiethoxyphenylphosphine oxide, and the like, and 2- [ 2-oxo-2-phenyl-acetoxy-ethoxy ] -ethyl hydroxy-phenyl-acetate and/or 2- [ 2-hydroxy-ethoxy ] -ethyl hydroxy-phenyl-acetate, and the like. The photopolymerization initiator can be used in 1 type or in combination of 2 or more types. Among them, from the viewpoint of high effect, 1 or 2 or more selected from 1 benzoin dimethyl ether, hydroxy-phenyl-acetic acid 2- [ 2-oxo-2-phenyl-acetoxy-ethoxy ] -ethyl ester, and hydroxy-phenyl-acetic acid 2- [ 2-hydroxy-ethoxy ] -ethyl ester are preferable.

(C) The content of the photopolymerization initiator is preferably 0.1 to 20 parts by mass, more preferably 0.5 to 10 parts by mass, based on 100 parts by mass of the total of (A) and (B). If the amount is 0.1 parts by mass or more, the curing acceleration effect is reliably obtained, and if the amount is 20 parts by mass or less, a sufficient curing speed can be obtained. It is preferable to add 1 part by mass or more of the component (C) in view of preventing positional deviation during cutting and improving peelability because the addition of 1 part by mass or more of the component (C) can be cured without depending on the amount of light irradiation, and the degree of crosslinking of the cured product of the composition is high.

The photocurable fixing agent preferably contains a particulate substance (D) that is insoluble in the components (a), (B), and (C) of the fixing agent. This enables the cured composition to maintain a constant thickness, thereby improving the processing accuracy. Further, since the cured product of the adhesive composition and the particulate matter (D) have different linear expansion coefficients, the peelability is improved when the translucent rigid substrate is peeled off after being bonded with the adhesive composition.

As the material of the particulate matter (D), organic particles or inorganic particles generally used may be used. Specifically, examples of the organic particles include polyethylene particles, polypropylene particles, crosslinked polymethyl methacrylate particles, and crosslinked polystyrene particles. Examples of the inorganic particles include ceramic particles such as glass, silica, alumina, and titanium.

The granular material (D) is preferably spherical in view of improving processing accuracy, that is, controlling the thickness of the adhesive film. The average particle diameter of the particulate material (D) by the laser method is preferably in the range of 20 to 200 μm. If the average particle diameter of the particulate matter is less than 20 μm, the peelability is poor, and if it is 200 μm or more, the deviation is likely to occur when processing a member to be fixed in advance, and the dimensional accuracy is poor. From the viewpoint of peelability and dimensional accuracy, the average particle diameter (D50) is more preferably 35 to 150 μm, and still more preferably 50 to 120 μm. The particle size distribution was measured by a laser diffraction particle size distribution measuring apparatus.

The amount of the particulate material (D) is preferably 0.1 to 20 parts by mass, more preferably 0.2 to 10 parts by mass, and most preferably 0.2 to 6 parts by mass, based on 100 parts by mass of the total amount of (a) and (B), from the viewpoint of adhesiveness, processing accuracy, and peelability.

A polymerization inhibitor (E) for improving storage stability can be added to the photocurable fixing agent. Examples of the polymerization inhibitor include methylhydroquinone, hydroquinone, 2-methylene-bis (4-methyl-6-tert-butylphenol), catechol, hydroquinone monomethyl ether, mono-tert-butylhydroquinone, 2, 5-di-tert-butylhydroquinone, p-benzoquinone, 2, 5-diphenyl-p-benzoquinone, 2, 5-di-tert-butyl-p-benzoquinone, picric acid, citric acid, phenothiazine, tert-butylcatechol, 2-butyl-4-hydroxyanisole, and 2, 6-di-tert-butyl-p-cresol.

The amount of the polymerization inhibitor (E) is preferably 0.001 to 3 parts by mass, more preferably 0.01 to 2 parts by mass, based on 100 parts by mass of the total amount of (A) and (B). When the amount is 0.001 parts by mass or more, the storage stability can be secured, and when the amount is 3 parts by mass or less, good adhesiveness is obtained and no uncured state is caused.

In the step (4), the first surface of the first translucent rigid substrate and the first surface of the second translucent rigid substrate are opposed to each other so that both surfaces thereof are parallel to each other, using a positional relationship in a predetermined plane direction. In general, two translucent rigid substrates are opposed to each other in a planar direction so as to be closely overlapped with each other. As a mechanism for carrying out this, it is conceivable to use a guide rail or a frame for restricting the moving direction of the translucent rigid substrate and moving the translucent rigid substrate to a predetermined position. When positioning with higher accuracy is required, it is preferable to perform positioning using a bonding apparatus having a positioning mechanism. For high-precision positioning, it is more preferable to use a bonding apparatus in which a mark for alignment is added to the surface of each translucent rigid substrate and the position can be adjusted while taking an image by an imaging device. If the positional deviation is corrected after the bonding of the two translucent rigid substrates, the fixing agent may leak from the bonding surface or the surface of the substrate may be scratched, and therefore, the positional deviation correction is preferably performed before the bonding.

In step (5), the first surface of the first translucent rigid substrate and the first surface of the second translucent rigid substrate are bonded to each other so that the fixing agent spreads over the bonding surfaces by applying a predetermined pressure to the first surfaces of the first translucent rigid substrate and the second translucent rigid substrate while maintaining the positional relationship defined in step (4). From the viewpoint of lamination accuracy, the fixing agent preferably spreads over the entire bonding surface with a constant thickness.

If the amount of the applied fixing agent is too small, the fixing agent does not spread over the entire bonding surface and causes bubbles to be generated on the bonding surface. If the bubble is generated, the positional accuracy is lowered. If the amount of the applied fixing agent is too large, the fixing agent leaks out from the gap between the bonding surfaces. Even if the fixing agent leaks slightly, the fixing agent can be wiped off without any great problem, but the fixing agent is wasted when the amount of the fixing agent is large.

The pressure at the time of the fitting is also related to the spreading of the fixing agent. Therefore, it is preferable to appropriately adjust the bonding pressure in addition to the amount of the fixing agent. As a mechanism for realizing this, a method using a bonding apparatus having a function of controlling a pressure at the time of bonding the translucent rigid substrates to each other is considered. The pressure at the time of bonding may be appropriately set in consideration of the above, and may be, for example, 5g/cm²～50g/cm²Typically 10g/cm²～30g/cm²。

Furthermore, it is also considered to control the thickness of the fixing agent itself. As a method for controlling the thickness, a method using a bonding apparatus having a function of controlling the height of the translucent rigid substrates when bonding the translucent rigid substrates may be considered in addition to the method of mixing the particulate matter with the fixing agent described above.

In the step (6), the light for curing only the outer peripheral portion of the fixing agent spread while being sandwiched between the two translucent rigid substrates is irradiated while the pressure is maintained, thereby forming a pre-fixed translucent rigid substrate laminate. By irradiating the outer peripheral portion of the fixing agent with light, only the outer peripheral portion of the fixing agent is cured into a ring shape, and both translucent rigid substrates can be bonded with a relatively weak force, and a function of preventing positional deviation when the translucent rigid substrates are laminated can be exerted. If the translucent rigid substrate to be bonded is not likely to cause positional deviation, the outer peripheral portion should be a region having a certain degree of width, but if it is excessively irradiated to the inside, the purpose of pre-fixing to the extent that no positional deviation is caused is broken, and the irradiation time is also prolonged, so that the production efficiency is lowered. Typically, the outer periphery irradiated by the LED unit 16 has a width of 5 to 25mm, more typically 7 to 17mm or so. In addition, the outer peripheral portion of the irradiated light is preferably present in an edge region where a part of the plate-like product is not formed. In the main irradiation, the light irradiation of the portion where the plate-like product is formed can be made uniform, and deformation of the fixing agent can be suppressed. As a result, the deformation of the partial substrate can be suppressed.

The internal fixing agent is not cured and remains fluid, but the fixing agent in the outer peripheral portion is cured, so that the fixing agent does not leak out from the gap between the translucent rigid substrates. The wavelength of the irradiation light may be appropriately changed according to the characteristics of the fixing agent used, and for example, microwave, infrared ray, visible light, ultraviolet ray, X-ray, γ -ray, electron beam, or the like may be irradiated. Since the light source is easy to use and has relatively high energy, the irradiation light is generally ultraviolet light. As described above, in the present invention, light means not only visible light but also electromagnetic waves (energy rays) including a wide wavelength region.

The irradiation amount of the light to be irradiated may be an amount necessary for pre-fixing the translucent rigid substrate, and is measured by an integrating luminometer using a 365nm light receiver, and may be generally 1 to 500mJ/cm²Typically 50 to 450mJ/cm²More typically 200 to 400mJ/cm². The irradiation time is generally 1 to 120 seconds, typically about 2 to 60 seconds, and preferably about 15 to 45 seconds. By irradiating light while maintaining the pressure of the bonding, the thickness of the fixing agent can be controlled by suppressing the curing deformation, andhigh lamination precision of the translucent rigid substrate.

In the step (7), light for curing the uncured fixing agent present inside the preliminarily fixed translucent rigid substrate laminate is irradiated to form a main fixed translucent rigid substrate laminate. Since the lamination accuracy can be checked at the time of manufacturing the pre-fixed translucent rigid substrate laminate before the formation of the main fixed translucent rigid substrate laminate, there is an advantage that repair is easy when a defect occurs. In order to cure the uncured fixing agent present inside the preliminarily fixed translucent rigid substrate laminate, the entire bonding surface of the preliminarily fixed translucent rigid substrate may be irradiated with light. Since the fixing agent of the outer peripheral portion has already been cured, it is not necessary to irradiate the outer peripheral portion with light. However, in order to homogenize the cured state of the fixing agent, it is preferable that the irradiation of the whole fixing agent existing between the bonding surfaces is subjected to homogenization. For this reason, there is a method of selectively irradiating light to an internal region where light is not irradiated at the time of pre-fixing. It is also conceivable to cover the outer peripheral portion of the translucent rigid substrate with a material that does not transmit ultraviolet rays when light is irradiated. In order to improve the positional accuracy of bonding, it is preferable to perform bonding while applying a predetermined pressure to the surface of the translucent rigid substrate to be bonded. By applying pressure, it is possible to prevent the fixing agent from shrinking during curing, causing warpage in the Z-axis direction of the substrate, pattern misalignment, and failure of vacuum suction. The pressure to be applied may be appropriately set in consideration of the strength of the translucent rigid substrate, and may be, for example, 5g/cm²～50g/cm²Typically 10g/cm²～30g/cm²。

The dose of light irradiated in the step (7) is measured by an integrating illuminometer using a 365nm light receiver, and is generally 30 to 4000mJ/cm²Typically 100 to 3000mJ/cm²More typically 300 to 2500mJ/cm²Preferably 1000 to 2000mJ/cm². The irradiation time is generally 0.1 to 120 seconds, typically 1 to 30 seconds, and more typically about 10 to 20 seconds.

It is preferable that the air bubbles mixed in the uncured fixing agent are moved to a position where the shape is not processed before the step (7). This is because of the following reason. In the case of pre-fixing, air bubbles sometimes enter the fixing agent layer. When the main irradiation is performed in the state where the air bubbles are present, the fixing agent is cured, and the air bubbles are fixed at the positions. If the air bubbles exist at a position subjected to shape processing such as cutting processing, profile processing, and hole forming processing, in other words, at a place where a direct processing tool (a blade, a whetstone) is in contact with, chipping occurs. Thus, by moving the bubbles to a position where the shape is not processed before the main irradiation, chipping can be prevented from occurring. As a method of moving the bubble, there is a method of moving the bubble by pressing the substrate with a hand or a bar.

In the step (8), the primary fixed translucent rigid substrate laminate obtained in the step (7) is used as the first translucent rigid substrate, and the steps 1) to 7) are repeated at least 1 time. This formed a main fixed translucent rigid substrate laminate to which at least 3 translucent rigid substrates were bonded. From the viewpoint of improving the production efficiency of the plate-like product, it is preferable to produce a translucent rigid substrate laminate in which 10 or more translucent rigid substrates are laminated, and typically, it is preferable to produce a translucent rigid substrate laminate in which 10 to 30 translucent rigid substrates are laminated.

< second embodiment >

In a second embodiment of the method for manufacturing a translucent rigid substrate laminate according to the present invention, the following steps are performed:

1) a step of preparing a first translucent rigid substrate,

2) a step of preparing a second translucent rigid substrate,

The steps up to steps (1) to (6) are performed in the same manner as in the first embodiment.

After the step (6), in the present embodiment, a step (7') of repeating the steps 1 to 6 at least 1 time with the above-described pre-fixed translucent rigid substrate laminate as the first translucent rigid substrate is performed to form a pre-fixed translucent rigid substrate laminate to which at least 3 translucent rigid substrates are bonded. In the first embodiment, the main irradiation is performed immediately after the formation of the pre-fixed translucent rigid substrate laminate in which 2 translucent rigid substrates are laminated to form the main fixed translucent rigid substrate laminate. That is, the main irradiation is performed after each preliminary irradiation. In the second embodiment, the preliminary fixed laminate formed of a plurality of translucent rigid substrates is produced by repeating the steps (1) to (6) without performing the main irradiation immediately after the formation of the preliminary fixed translucent rigid substrate laminate.

Thereafter, in step (8'), light for curing the uncured fixing agent present inside the obtained pre-fixed translucent rigid substrate laminate is irradiated to form a main fixed translucent rigid substrate laminate. Since the preliminary fixed translucent rigid substrate laminate formed of the plurality of translucent rigid substrates is subjected to the primary main irradiation, the number of times of main irradiation necessary for manufacturing the main fixed translucent rigid substrate laminate formed of the plurality of translucent rigid substrates can be reduced, and the production efficiency can be improved. However, if a pre-fixed laminate composed of too many translucent rigid substrates is formed, ultraviolet rays do not reach the internal fixing agent during main irradiation, and curing of the fixing agent tends to be insufficient, and therefore, the pre-fixed laminate is preferably composed of 5 translucent rigid substrates at the maximum. In order to improve the positional accuracy of bonding, it is preferable that the step (8') is performed while applying a predetermined pressure to the surface of the translucent rigid substrate to be bonded, as in the step (7). For the same reason as described in the step (7), it is preferable that the air bubbles mixed in the uncured fixing agent are moved to a position where the shape is not processed before the step (8').

< third embodiment >

In a third embodiment of the method for manufacturing a translucent rigid substrate laminate according to the present invention, the steps up to steps (1) to (8') are performed in the same manner as in the second embodiment, and the method further includes:

In the present embodiment, a main fixed translucent rigid substrate laminate having an increased number of laminated pieces is produced by further laminating translucent rigid substrates on the main fixed translucent rigid substrate laminate. As described above, since there is a limit to the number of pieces of the translucent rigid substrates constituting the pre-fixed laminated body, the pre-fixed laminated body having a certain number of pieces needs to be subjected to main irradiation to form a main fixed translucent rigid substrate laminated body. However, by laminating the translucent rigid substrates in accordance with a step of repeating the bonding and the preliminary irradiation of the translucent rigid substrates with respect to the preliminary fixed translucent rigid substrate laminate and performing the main irradiation at a timing when the number of pieces reaches a certain level, it is possible to manufacture a main fixed translucent rigid substrate laminate composed of a plurality of translucent rigid substrates while reducing the number of times of the main irradiation. In order to improve the positional accuracy of bonding, the step (8') is also preferably performed while applying a predetermined pressure to the surface of the translucent rigid substrate to be bonded, similarly to the step (7). For the same reason as described in the step (7), it is preferable that the air bubbles mixed in the uncured fixing agent are moved to a position where the shape is not processed before the step (8').

< production of plate-like article >

A plate-shaped product can be produced from the translucent rigid substrate laminate obtained by the above-described method for producing a translucent rigid substrate laminate.

First, in step (9), the translucent rigid substrate laminate is divided in the thickness direction to form a desired number of divided translucent rigid substrate laminates. The dividing method is not particularly limited, and examples thereof include a method of dividing the rectangular parallelepiped shape into rectangular parallelepiped shapes having the same size by using a circular cutter (diamond disk, cemented carbide disk), fixed abrasive grain type or free abrasive grain type wire saw, laser beam, etching (for example, chemical etching using hydrofluoric acid, sulfuric acid, or the like, electrolytic etching), and red hot ribbon (nichrome wire), either individually or in combination. Etching can also be used for surface treatment of the cut sections that are divided.

Next, in step (10), the divided translucent rigid substrate laminate is subjected to a required shape processing. In this step, since each of the divided translucent rigid substrate laminates can be integrally processed into the shape of the intended translucent rigid substrate product, there is an advantage that the production speed of the translucent rigid substrate product is remarkably improved. The shape processing may be performed by any known mechanism, and examples thereof include grinding with a rotary grindstone, drilling with ultrasonic vibration, end face processing with a rotary brush, drilling with etching, end face processing with etching, outline processing with etching, and flame processing with a burner. The processing methods can be used each alone or in combination. Etching can also be used for surface treatment after shape processing.

In step (11), the shaped translucent rigid substrate laminate is heated to peel off the bonded translucent rigid substrates from each other, thereby forming a plurality of translucent rigid substrate products. The heating method is not particularly limited, but a method of immersing the shaped translucent rigid substrate laminate in warm water is preferable in order to soften the fixing agent into a film shape and to separate the fixing agent into the translucent rigid substrate products favorably. The preferred temperature of the warm water varies depending on the fixing agent used, but is usually about 60 to 95 ℃ and preferably 80 to 90 ℃.

Here, the end face of the translucent rigid substrate laminate divided in step (9) is formed into a flat surface by the translucent rigid substrate 31 and the fixing agent 32. If the end surfaces are processed with the rotary brush 33 or the like, the corners of the translucent rigid substrates are not edged but the central portions are rather shaved off (fig. 16), which hinders the fixing agent, and therefore, the impact strength of the translucent rigid substrates is insufficient. In this case, it is preferable to weaken the adhesive force of the outer edge of the fixing agent exposed on the end face of the divided translucent rigid substrate laminate in advance so that each translucent rigid substrate can be edged at the time of end face processing.

Specific examples of the method include the following methods: between the steps (9) and (10), the divided translucent rigid substrate laminate is brought into contact (for example, by dipping, spraying, coating, or the like) with a release agent under temperature and time conditions necessary for decreasing the adhesive force of the exposed portion of the outer edge of the fixing agent sandwiched between the translucent rigid substrates (fig. 17).

The adhesive strength must be reduced in an extremely small region of about 1mm or less from the outer edge to the inner side, and the temperature and time must be adjusted to such an extent that the adhesive strength of the entire bonding surface is not reduced. The liquid temperature is generally 50 ℃ or lower, typically 20 to 40 ℃, although it depends on the stripping agent used. The contact time is usually 30 minutes or less, typically 1 to 20 minutes. If the liquid temperature of the release agent is too high or the contact time is too long, the adhesive force tends to be lowered even inside the bonding surface, and therefore, attention should be paid.

The releasing agent is not particularly limited as long as it is a liquid capable of reducing the adhesive force of the fixing agent, and may be appropriately selected according to the characteristics of the fixing agent used, and generally contains one or more selected from a solvent, an oxidizing agent, and a surfactant.

When a solvent and/or a surfactant is used as the release agent, the fixing agent in contact with the release agent is swollen to deform at the interface with the substrate, and thus the adhesive force is lowered. The swollen fixing agent is preferably cut (fed to the cutting section) by a physical mechanism such as a cutter, and then dried. This causes the swollen fixing agent to shrink, and therefore, the end surface processing by a brush or the like becomes easier. When an oxidizing agent is used as the release agent, the fixing agent is carbonized and embrittled, whereby the adhesive force is reduced. Therefore, by further using an oxidizing agent in combination with a solvent and/or a surfactant, the adhesive force can be synergistically reduced.

Examples of the solvent include water, hydrofluoric acid, hydrochloric acid, alcohols (e.g., methanol, ethanol, n-propanol, isopropanol, butanol, and benzyl alcohol), esters (e.g., ethyl acetate, butyl acetate, n-propyl acetate, ethyl lactate, dimethyl phthalate, and dimethyl adipate), ketones (e.g., Methyl Ethyl Ketone (MEK), methyl isobutyl ketone (MIBK), and acetone), chlorine-based solvents (e.g., methylene chloride, trichloroethylene, and tetrachloroethylene), fluorine-based solvents (e.g., Hydrochlorofluorocarbon (HCFC), and Hydrofluorocarbon (HFC)), glycol ethers (e.g., ethylene glycol monomethyl ether (methyl cellosolve), ethylene glycol monoethyl ether (ethyl cellosolve), ethylene glycol monobutyl ether (butyl cellosolve), butyl carbitol (butyl carbitol), ethylene glycol tert-butyl Ether (ETB), Propylene Glycol Monomethyl Ether (PGME)), and the like, Propylene Glycol Monomethyl Ether Acetate (PGMEA), 3-methoxy-3-methyl-1-butanol (MMB)), amine-based solvents (e.g., N-methyl-2-pyrrolidone (NMP), Dimethylformamide (DMF), N-Dimethylacetamide (DMAC)), ethers (e.g., Ethyl Ethoxy Propionate (EEP), Tetrahydrofuran (THF)), dimethyl sulfoxide (DMSO).

Among the solvents, typically, alcohol may be used, and benzyl alcohol may be preferably used.

Examples of the oxidizing agent include sulfuric acid, nitric acid, hydrogen peroxide, ammonium persulfate, acyl peroxide, benzoyl peroxide, t-butyl peroxide, hydroperoxide, ozone water, perchloric acid, and hypochlorous acid.

The surfactant may be any of an anionic surfactant, a cationic surfactant, an amphoteric surfactant, and a nonionic surfactant.

Examples of the anionic surfactant include carboxylic acid type (for example, fatty acid salts, polyoxyethylene alkyl ether carboxylic acid salts, N-alicyclic sarcosinates, and N-acyl glutamates), sulfate type (for example, alkyl sulfate salts, polyoxyethylene alkyl ether sulfate salts, alcohol ethoxy sulfate salts, and fatty oil sulfate salts), sulfonic acid type (for example, alkylbenzene sulfonate, alkane sulfonate, α -olefin sulfonate, dialkyl sulfosuccinic acid, naphthalene sulfonate-formaldehyde condensate, alkylnaphthalene sulfonate, and N-methyl-N-acyl taurate), and phosphate type (for example, alkyl phosphate, polyoxyethylene alkyl ether phosphate, and polyoxyethylene alkylphenyl ether phosphate).

Examples of the cationic surfactant include amine salt type (for example, alkylamine acetate) and quaternary ammonium salt type (for example, monoalkylammonium salt, dialkylammonium salt, and ethoxylated ammonium salt).

Examples of the amphoteric surfactant include betaine type (e.g., alkyldimethylaminoacetic acid betaine, alkylamidopropyl betaine, alkylhydroxysulfobetaine), alkyldimethylamine oxide, and the like.

Examples of the nonionic surfactant include ester-type surfactants (e.g., glycerin fatty acid ester, propylene glycol fatty acid ester, sorbitan fatty acid ester, sucrose fatty acid ester), ether-type surfactants (e.g., polyoxyethylene alkyl ether, polyoxyethylene alkylphenyl ether, polyoxyethylene polyoxypropylene ether), ether-ester-type surfactants (e.g., polyoxyethylene sorbitan fatty acid ester, alkylglycerin ether), alkylalkanolamide-type surfactants (fatty acid alkanolamide, fatty acid amide alkylene oxide adduct), and alkylpolyglycoside.

Among the surfactants, an anionic surfactant can be typically used, and a sulfonic acid type anionic surfactant can be preferably used.

The release agent preferably contains one or two or more selected from water, alcohols, oxidizing agents, and surfactants from the viewpoint of safety and environmental aspects, and more preferably contains three kinds of water, alcohols, and surfactants from the viewpoint of safety. In this case, the stripping agent preferably contains water, an alcohol and a surfactant in a mass ratio of 30 to 50:5 to 20, for example, in a mass ratio of 30 to 40:40 to 50:10 to 20. The release agent may be composed of only these three types.

For example, a stripping agent is prepared by mixing water, benzyl alcohol, and a sulfonic acid type anionic surfactant at a mass ratio of 35:50: 15. As the fixing agent, the fixing agent (I) described in the examples described later was used, and a glass plate laminate formed of 20 glass plates was produced by the method of the present invention. The glass plate laminate was immersed in the stripping agent at 35 ℃ for 5 minutes, and then the end face was processed with a rotary brush. The machined end surfaces were observed by a microscope, and as a result, the corners of the respective glass plates were edged into a round shape. On the other hand, when the edge face processing is performed without immersing in the release agent, the corner of each glass plate is not edged.

A glass plate laminate formed of 12 glass plates was likewise produced using the method of the invention. The glass plate laminate was immersed in the stripping agent at 35 ℃ for 5 minutes, and then the end face was processed with a rotary brush. The machined end surfaces were observed by a microscope, and as a result, the corners of the respective glass plates were edged into a round shape. On the other hand, when the edge face processing is performed without immersing in the release agent, the corner of each glass plate is not edged.

< example of apparatus construction >

An example of the translucent rigid substrate bonding apparatus according to the present invention will be described. The translucent rigid substrate bonding apparatus of the present invention is used for manufacturing a pre-fixed translucent rigid substrate laminate in which only the outer peripheral portion of a substrate bonding surface is bonded with an adhesive. The uncured fixing agent sandwiched between the bonding surfaces of the substrates is cured in a subsequent step to completely bond the translucent rigid substrates, and a main fixed translucent rigid substrate laminate in which the entire bonding surfaces of the substrates are bonded by the adhesive can be manufactured.

The main fixed translucent rigid substrate laminate is divided in the thickness direction, and a translucent rigid substrate laminate divided into a required number can be formed. The divided translucent rigid substrate laminate is subjected to a desired shape processing, and the bonded translucent rigid substrates are peeled from each other by heating (for example, dipping in warm water) the shape-processed translucent rigid substrate laminate, thereby forming a plurality of plate-like products.

The translucent rigid substrates to be bonded may be 1 translucent rigid substrate or a laminate of 2 or more translucent rigid substrates. The laminated body of the translucent rigid substrates may be a preliminarily fixed translucent rigid substrate laminated body manufactured by the translucent rigid substrate bonding apparatus of the present invention, or may be a translucent rigid substrate laminated body which is mainly fixed later. Typically, it is desirable to manufacture a translucent rigid substrate laminate in which about 10 to 30 translucent rigid substrates are laminated by using the translucent rigid substrate bonding apparatus of the present invention.

Fig. 1 is a schematic view showing a first example of the translucent rigid substrate bonding apparatus according to the present invention. The translucent rigid substrate bonding apparatus 10 includes a stage 11, an upper stage 12, a pressurizing unit 13, a suction unit 14, a suction hole 15, an LED unit 16, a lower stage 17, a lower stage moving mechanism 18, a side clamp 19, a lower substrate coating unit 20, an upper substrate coating unit 21, an imaging unit 22, and an electric unit 23.

The mount 11 is a base portion on which the respective constituent devices of the translucent rigid substrate bonding apparatus 10 are mounted, and an electric unit 23 is disposed inside. The electrical unit 23 performs program control of each constituent device by a plc (programmable logic controller).

The upper stage 12 holds the upper translucent rigid substrate 25 by vacuum suction. Therefore, a plurality of suction holes 15 are formed in the lower surface of the upper stage 12, and the suction holes 15 are connected to the suction unit 14 through pipes. Fig. 2 is a schematic view of the lower surface of the upper stage 12, showing an example of arrangement of the suction holes 15. As the suction unit 14, a vacuum pump, a vacuum ejector, or the like can be used.

A pressing unit 13 for pressing the lower translucent rigid substrate 24 and bonding the upper translucent rigid substrate 25 thereto is connected to the upper portion of the upper stage 12. The pressurizing unit 13 has a lifting piston (not shown) capable of moving the upper stage 12 in the Z direction (vertical direction), and can control the pressurizing force, the moving speed, the pressurizing time, and the height by a servo motor.

A plurality of LED units 16 for irradiating the upper translucent rigid substrate 25 with ultraviolet light necessary for curing the fixing agent are embedded in the lower surface of the upper stage 12. The LED units 16 are arranged along the outer periphery of the upper translucent rigid substrate 25 attached to the upper stage 12. Fig. 2 shows an example of the arrangement state of the LED units 16. The LED units 16 can be arranged not only in one row but also in two or more rows to increase the width of the outer peripheral portion to be irradiated.

The irradiation time of the translucent rigid substrate by the LED can be controlled by turning ON/OFF the power supply. The amount of light to be irradiated may be an amount necessary for pre-fixing the translucent rigid substrate, and the measurement may be performed by an integrating illumination meter using a 365nm light receiver, or by an integrating illumination meter using a 365nm light receiver, and may be generally 1 to 500mJ/cm²Typically, the concentration of the water is 50 to 450mJ/cm²More typically, it may be 200 to 400mJ/cm². The irradiation time is generally 1 to 120 seconds, and typically about 2 to 60 seconds.

The lower stage 17 holds the lower translucent rigid substrate 24 and receives a pressure from the upper stage 12 at the time of pressurization. The lower stage 17 is made of an ultraviolet-transmitting material, and examples of the material include transparent plastics such as quartz glass, magnesium fluoride, calcium fluoride, and methacrylic resin. The lower stage 17 can be moved in the X-axis direction, the Y-axis direction, and the θ -axis direction by a lower stage moving mechanism 18. The lower stage moving mechanism 18 is constituted by a θ table that is rotatable in the horizontal direction, an X table and a Y table that are horizontally movable. These tables are driven by motors. A motor-driven side clamp 19 that can move in the X-axis direction and the Y-axis direction is provided on the upper surface of the lower stage 17 to position the translucent rigid substrate placed thereon. Instead of the side clamp 19, a positioning stopper for placing the translucent rigid substrate at a predetermined position may be provided on the upper surface of the lower stage 17. In this case, the translucent rigid substrate is manually placed at a position where the translucent rigid substrate is fixed by the stopper. In order to prevent the translucent rigid substrate from being positionally displaced, the lower translucent rigid substrate 24 may be held by vacuum suction in the same manner as the upper stage 12.

The lower substrate coating unit 20 includes a dispenser 20a for a photocurable fixing agent and a motor-driven robot 20b connected thereto and movable in the X-axis, Y-axis, and Z-axis directions, and can coat the fixing agent on the upper surface of the lower translucent rigid substrate 24 in an arbitrary pattern. The fixative is loaded into the syringe and automatically metered out. The coating amount was controlled by a digital pressure gauge and coating speed.

The upper substrate coating unit 21 automatically coats the lower surface of the upper translucent rigid substrate 25 with the photocurable fixing agent in a state where the upper translucent rigid substrate 25 is held on the upper stage 12. The coating amount is controlled by a pressure gauge and coating time. The upper substrate coating unit 21 includes a motor-driven robot 21b having a horizontally rotatable shaft on the side surfaces of the upper and lower stages, and a rotary nozzle 21a at the tip end thereof is disposed below the vicinity of the center of the upper stage 12 during coating, and a fixing agent is applied from the tip end of the nozzle 21 a. When the coating is completed, the transparent rigid substrates are accommodated on the side surfaces of the upper and lower stages so as not to be an obstacle to bonding of the transparent rigid substrates.

The imaging unit 22 images a common alignment mark at the position of each surface of the upper translucent rigid substrate 25 and the lower translucent rigid substrate 24 by the digital camera 22a attached to the upper and lower sides 2 of the arm tip portion. The electric unit 23 detects a relative misalignment state between the upper translucent rigid substrate 25 and the lower translucent rigid substrate 24 based on the captured image information. Based on the detection result, the position of the lower stage 17 is finely adjusted in the X-axis direction, the Y-axis direction, and the θ -axis direction by the lower stage moving mechanism 18, and the operation of correcting the positional deviation is performed. After the positional deviation is corrected, the two translucent rigid substrates are bonded to each other. As the camera, an analog camera can be used in addition to a digital camera using a CCD or a CMOS as an imaging element, but a digital camera is preferable from the viewpoint of high resolution.

The imaging unit 22 includes a moving mechanism 22b driven by motors in the X-axis and Y-axis directions, and the digital camera 22a moves to a predetermined position where the alignment mark enters the field of view during imaging. When the image pickup is completed, the digital camera 22a is moved so as not to be an obstacle to bonding the translucent rigid substrate.

The procedure of bonding a translucent rigid substrate using the apparatus 10 for bonding a translucent rigid substrate according to the first example will be described with reference to fig. 3 to 13.

First, the first translucent rigid substrate 26 is placed on the lower stage 17 and fixed at a predetermined position by the side clamp 19 (not shown) (fig. 3). The translucent rigid substrate 26 can be manually placed on the lower stage 17, but a plurality of translucent rigid substrates 26 may be stored in a dedicated cassette and automatically placed on the lower stage 17. The translucent rigid substrate 26 placed thereon is moved directly below the upper stage 12 by the lower stage moving mechanism 18 (not shown) (fig. 4). Subsequently, the upper stage 12 is lowered by the pressurizing unit 13. The translucent rigid substrate 26 is vacuum-sucked by suction force from the suction holes 15 (not shown) (fig. 5). The sucked translucent rigid substrate 26 is held and raised together with the upper stage 12 to wait for a second substrate (fig. 6).

Next, the second translucent rigid substrate 27 is placed on the lower stage 17 and fixed at a predetermined position by the side clamp 19 (not shown) (fig. 7). A fixing agent 28 is applied in a predetermined pattern to the upper surface of the second translucent rigid substrate 27 from the lower substrate application unit 20 (fig. 8). When the second translucent rigid substrate 27 mounted on the lower stage 17 after coating is completed is moved to a position directly below the upper stage 12, the alignment mark is imaged by a camera attached to the tip of the arm of the imaging unit 22, and the position of the lower stage 17 is finely adjusted based on the imaging result, thereby adjusting the positions of both translucent rigid substrates (26, 27) (fig. 9).

After the position adjustment, the nozzle 21a attached to the tip of the arm of the upper substrate coating unit 21 is moved to the vicinity of the center of the first substrate 26 held on the upper stage 12, and the fixing agent 29 is coated on the lower surface of the first translucent rigid substrate 26 by the nozzle 21a (fig. 10). After the fixing agents (28, 29) are coated on the upper and lower translucent rigid substrates (26, 27), the upper stage (12) is lowered by the pressurizing unit (13) to pressurize and adhere the two translucent rigid substrates (26, 27), and the fixing agents (28, 29) clamped between the upper and lower translucent rigid substrates are expanded to the whole face of the translucent rigid substrates by the pressurization. The outer peripheral portion of the translucent rigid substrate is irradiated with ultraviolet rays from the LED unit 16 while maintaining the pressurized state (fig. 11). Whereby only the fixing agent 31 located at the outer peripheral portion is cured. The internal fixing agent 30 does not solidify and remains fluid, but the fixing agent 31 on the outer peripheral portion solidifies and therefore does not leak out from the gap between the translucent rigid substrates.

After the irradiation with ultraviolet rays, the adsorption on the upper substrate 26 is released, and only the upper stage 12 is raised (fig. 12). The bonded translucent rigid substrate is transported by the lower stage 17 and returned to the initial position (fig. 13). The bonding of the translucent rigid substrate is completed through the above steps.

Fig. 14 is a schematic view showing a translucent rigid substrate bonding apparatus according to a second embodiment of the present invention. In the present embodiment, the LED units 16 are arranged on the upper surface of the lower stage 17 along the outer periphery of the lower translucent rigid substrate 24, and are irradiated with ultraviolet rays upward.

Fig. 15 is a schematic view showing a translucent rigid substrate bonding apparatus according to a third embodiment of the present invention. The LED units 16 are arranged so as to surround the outer peripheral side surfaces of the two translucent rigid substrates to be bonded, and the outer peripheral side surfaces are irradiated with ultraviolet rays. The LED unit 16 has a Z-axis direction moving mechanism and can be moved to an optimum height according to the height of the bonding surface.

Examples

As an example, according to the present invention, the steps (1) to (6) are performed under the following conditions using the translucent rigid substrate bonding apparatus shown in fig. 1 to produce a pre-fixed translucent rigid substrate laminate, and as a result, the lamination accuracy can be checked, and repair when a defect occurs is facilitated. After the production of the pre-fixed translucent rigid substrate laminate, the steps (7) to (8) are further performed under the following conditions to produce a main fixed translucent rigid substrate laminate, and then the processes of the steps (9) to (10) are performed. As a result of peeling the obtained translucent rigid substrate laminate in accordance with step (11), the fixing agent is softened into a film shape and well separated into the respective plate-like products.

The following glass plate was used as the translucent rigid substrate. As the glass plate, 1 piece of glass plate with plating pattern having a size of 530mm in width, 420mm in length and 0.7mm in thickness was used.

The following components (A) to (E) were mixed with the fixing agent (I) to prepare a photocurable fixing agent (I).

The polyfunctional (meth) acrylate (A) includes 20 parts by mass of "UV-3000B" (urethane acrylate, hereinafter abbreviated as "UV-3000B") manufactured by Nippon Synthesis Co., Ltd, and 15 parts by mass of dicyclopentyl diacrylate ("KAYARAD R-684", manufactured by Nippon chemical Co., Ltd., hereinafter abbreviated as "R-684"),

the monofunctional (meth) acrylate (B) was 50 parts by mass of 2- (1, 2-cyclohexadiimide) ethyl acrylate ("ARONIX M-140" manufactured by Toyo Seisaku-sho., hereinafter abbreviated to "M-140"), and 15 parts by mass of a modified 2-mol acrylate of phenol ethylene oxide ("ARONIX M-101A" manufactured by Toyo Seisaku-sho.),

8 parts by mass of benzoin dimethyl ether ("IRGACURE 651" manufactured by BASF, hereinafter abbreviated as "BDK") as a photopolymerization initiator (C),

as the particulate material (D), 1 part by mass of spherical crosslinked polystyrene particles having an average particle diameter of 100 μm ("GS-100S" manufactured by GANZ chemical Co., Ltd.),

as the polymerization inhibitor (E), 0.1 part by mass of 2, 2-methylene-bis (4-methyl-6-tert-butylphenol) (Sumilizer MDP-S manufactured by Sumitomo chemical Co., Ltd., hereinafter, abbreviated as "MDP") was used

In the step (3), 40g of the fixing agent (I) was applied to each of the two bonding surfaces of the glass plate.

In the step (5), the pressure at the time of bonding was 20g/cm²The outer peripheral portion irradiated with the LED unit 16 has a width of about 12 mm. In the step (6), the outer peripheral portion irradiated with the LED unit 16 has a width of about 12mm, and when the photocurable adhesive is cured, the UV irradiation amount is 300mJ/cm²(measurement by integrating illuminance using 365nm light receiver) and UV irradiation time was 30 seconds, and pre-fixing was performed. In the step (7), the pressure applied was 20g/cm²The quantity of light irradiation was measured by an integrated illuminance meter using a 365nm light receiver and was 2000mJ/cm²The irradiation time was 20 seconds, and main fixation was performed. In step (8), a glass plate laminate composed of 12 glass plates was produced using the fixing agent (I) and the method of the present invention. In step (9), the plate was cut into a rectangular parallelepiped shape (100 mm in width, 55mm in length, and 9.6mm in thickness) by using a disk cutter (diamond disk). In step (10), grinding with a rotary grindstone, drilling with an ultrasonic vibration drill, and end face machining with a rotary brush are performed in this order to perform shape machining. In step (11), the glass sheet laminate is peeled off by immersing it in hot water at 85 ℃.

While the embodiments of the present invention have been described above with reference to the drawings, the present invention is not limited to these embodiments, and various modifications are possible.

Description of the symbols

Claims

1. A method for manufacturing a translucent rigid substrate laminate, comprising:

1) a step of preparing a first translucent rigid substrate,

2) a step of preparing a second translucent rigid substrate,

4) a step of facing the first surface of the first translucent rigid substrate and the first surface of the second translucent rigid substrate in a predetermined positional relationship in the plane direction so that both surfaces are parallel to each other,

7) a main irradiation step of irradiating light for curing the uncured fixing agent present in the pre-fixed translucent rigid substrate laminate to form a main fixed translucent rigid substrate laminate,

2. A method for manufacturing a translucent rigid substrate laminate, comprising:

1) a step of preparing a first translucent rigid substrate,

2) a step of preparing a second translucent rigid substrate,

7') repeating the steps 1) to 6) at least 1 time with the pre-fixed translucent rigid substrate laminate as a first translucent rigid substrate to form a pre-fixed translucent rigid substrate laminate to which at least 3 translucent rigid substrates are bonded,

3. The method for manufacturing a translucent rigid substrate laminate according to claim 2, further comprising:

4. The method for manufacturing a translucent rigid substrate laminate according to any one of claims 1 to 3, wherein the outer peripheral portion is present in an edge region where no part of the plate-shaped product is formed.

5. The method for manufacturing a translucent rigid substrate laminate according to any one of claims 1 to 3, wherein the main irradiation step is performed while applying a predetermined pressure to the bonded translucent rigid substrate surface.

6. The method for producing a translucent rigid substrate laminate according to any one of claims 1 to 3, wherein the donor irradiation step is performed after moving bubbles dispersed in the uncured fixing agent to a position where shape processing is not performed.

7. The method of manufacturing a translucent rigid substrate laminate according to any one of claims 1 to 3, wherein a mark for alignment is provided on a surface of each translucent rigid substrate, and the step 4) includes adjusting the position of the image while the image is captured by an imaging device.

8. The method for producing a translucent rigid substrate laminate according to any one of claims 1 to 3, wherein a predetermined print pattern and/or plating pattern for performing one function of the plate-like product is attached to the surface of each translucent rigid substrate.

9. The method for manufacturing a translucent rigid substrate laminate according to any one of claims 1 to 3, wherein the fixing agent contains a particulate substance.

10. The method for producing a translucent rigid substrate laminate according to any one of claims 1 to 3, wherein the light irradiation amount in the step 6) is 1mJ/cm as measured by an integrated illuminance meter using a 365nm light receiver²～500mJ/cm²The range of (1).

11. The method for manufacturing a translucent rigid substrate laminate according to any one of claims 1 to 3, wherein the translucent rigid substrate is a glass plate.

12. A method of manufacturing a plate-like article comprising:

1) a step of dividing the translucent rigid substrate laminate obtained by the method according to any one of claims 1 to 11 in a thickness direction to form a desired number of divided translucent rigid substrate laminates,

2) a step of processing the divided translucent rigid substrate laminate into a desired shape,

3) and a step of heating the shaped translucent rigid substrate laminate to peel off the bonded translucent rigid substrates from each other, thereby forming a plurality of plate-like products.

13. The method for manufacturing a plate-like product according to claim 12, further comprising, between the step 1) and the step 2), the steps of: the divided translucent rigid substrate laminate is brought into contact with a release agent under temperature and time conditions necessary for reducing the adhesive strength of the exposed portion of the outer edge of the fixing agent sandwiched between the translucent rigid substrates.

14. The method for producing a plate-like product according to claim 13, wherein the release agent contains one or more selected from a solvent, an oxidizing agent, and a surfactant.

15. The method for producing a plate-like product according to claim 13, wherein the release agent contains one or more selected from the group consisting of water, alcohols, oxidizing agents, and surfactants.

16. The method for producing a plate-like product according to claim 15, wherein the release agent contains water, an alcohol and a surfactant in a mass ratio of 30 to 50:5 to 20.

17. The method for producing a plate-like article according to any one of claims 13 to 16, wherein the release agent contains benzyl alcohol.

18. The method for producing a plate-like article according to any one of claims 13 to 16, wherein the release agent contains an anionic surfactant.

19. The method for producing a plate-like article according to claim 18, wherein the release agent contains a sulfonic acid type surfactant.

20. The method for producing a plate-like article according to any one of claims 13 to 16, wherein the liquid temperature of the release agent is 20 ℃ to 40 ℃ and the time of contact with the release agent is 1 to 20 minutes.

21. A translucent rigid substrate bonding apparatus includes:

a suction unit providing suction force to the suction hole,

a lower stage for holding the lower translucent rigid substrate,

and light irradiation sections arranged at positions where light can be irradiated to the outer peripheral portions of the surfaces to be bonded to the translucent rigid substrates.

22. The translucent rigid substrate bonding apparatus according to claim 21, wherein the light irradiation section is arranged along the outer periphery of the held translucent rigid substrate on the lower surface of the upper stage, and irradiates light downward.

23. The translucent rigid substrate bonding apparatus according to claim 21, wherein the light irradiation sections are arranged along the outer periphery of the held translucent rigid substrate on the upper surface of the lower stage and irradiate light upward.

24. The translucent rigid substrate bonding apparatus according to claim 21, wherein the light irradiation sections are arranged so as to surround outer peripheral side surfaces of the two translucent rigid substrates to be bonded, and irradiate light to the outer peripheral side surfaces.

25. The translucent rigid substrate bonding apparatus according to any one of claims 21 to 24, further comprising: the apparatus includes an image pickup unit for picking up images of alignment marks provided on the upper and lower surfaces of the translucent rigid substrate, an image processing unit for detecting the degree of positional deviation of the alignment marks provided on the upper and lower surfaces based on the image pickup result, and a control unit for controlling the lower stage moving mechanism based on the detected degree of positional deviation.

26. The translucent rigid substrate bonding apparatus according to any one of claims 21 to 24, wherein the outer peripheral portion irradiated with light by the light irradiation section is an edge region where no part of the plate-shaped product is formed.

27. The translucent rigid substrate bonding apparatus according to any one of claims 21 to 24, wherein the translucent rigid substrates held by the upper stage and/or the lower stage are a laminate of 2 or more translucent rigid substrates.

28. The translucent rigid substrate bonding apparatus according to any one of claims 21 to 24, wherein the means for applying a fixing agent applies a fixing agent containing a particulate substance.

29. The translucent rigid substrate bonding apparatus according to any one of claims 21 to 24, wherein the translucent rigid substrate is a glass plate.