HK1174150B - Apparatus for forming protection film on chip-scale package and formation method thereof - Google Patents

Abstract

The invention discloses an apparatus for forming a protection film on a chip-scale package and a formation method thereof. The apparatus comprises: a housing element which comprises a housing, at least a guide rod and at least a pressure bar, wherein the pressure bar is engaged with the guide rod so as to facilitate sliding on the guide rod; a chip disc used for supporting a plurality of chips; and a substrate element used for supporting the chip disc and fixing the housing element, wherein the substrate element comprises a substrate, at least a clamp and a support plate, the substrate is used for supporting the support plate and the clamp, the clamp is used for clamping the housing, and the support plate has at least an elastic element for supporting the chip disc; and a transfer film used for supporting a plurality of protection film units so as to attach the plurality of protection film units on the plurality of chips.

Description

Device and method for forming protective film on chip scale package

Technical Field

The present invention relates to a chip scale package, and more particularly, to a method for forming a protection film on a chip scale package.

Background

In the field of semiconductor devices, the density of the devices continues to increase and the volume gradually decreases. There is an increasing demand for high-density device packaging or interconnection technology to meet the above-mentioned requirements. The functions of the die package include power distribution, signal distribution, heat dissipation, protection, and support. As semiconductor structures tend to be complicated, conventional technologies, such as lead frame package (lead frame package), flexible package (flex package), and rigid package (rigid package), have not been able to achieve the goal of producing a small die with high density devices on the die. Furthermore, as the die packaging technology is closely related to the development of integrated circuits, the packaging technology has higher and higher requirements for the size of electronic components. For the above reasons, the current packaging technologies are gradually adopting Ball Grid Array (BGA), flip chip ball grid array (FC-BGA), and Chip Scale Package (CSP) technologies.

Chip scale packages may have chip area and package area of about 1/3 for ball grid array packages, or 1/6 for miniaturized packaged memory chip area. Thus, under chip scale packaging, more integrated circuit chips can be configured for the same volume, thereby increasing unit capacity. In other words, chip scale packages in the same space can increase storage capacity by about three times as compared to ball array packages. The chip scale package has the advantage of small volume, and the package thickness is thinner, generally, the most effective heat dissipation path from the metal substrate to the heat sink is only 0.2mm or less, so that the reliability of the chip after long-time operation is greatly improved, the line impedance is remarkably reduced, and the operation speed of the element is greatly improved.

The package unit of the chip scale package is easily scratched, contaminated by static electricity or dust (particles) during the transportation process, and the scratch, static electricity or dust contamination may affect the image capturing quality and even the electrical failure, so a protection film is formed on the chip of the chip scale package to prevent the dust contamination. However, in the conventional method for forming the protective film on the chip of the chip scale package, the protective film is manually attached to the chip one by one (piece by piece). The method is not easy to accurately align a single protective film to a chip, the reject ratio of the protective film attaching process is easy to generate, and more time is needed for attaching the protective film of a large number of chips packaged at a chip level.

Therefore, in view of the above-mentioned disadvantages of the conventional method for forming a protective film on a chip of a chip scale package, the present invention provides a method for attaching a protective film to a chip of a chip scale package, which is superior to the known method for attaching a protective film on a chip of a chip scale package.

Disclosure of Invention

In view of the above, the present invention provides a device and a method for forming a protection film on a chip of a Chip Scale Package (CSP), which utilizes various jigs to improve the attaching efficiency and the assembling accuracy of the protection film.

Another object of the present invention is to provide a method for forming a protective film on a chip, which can easily attach the protective film on the chip, so that the protective film can be uniformly and accurately attached on the chip.

It is still another object of the present invention to provide a method for forming a passivation film on a chip, which can allow the passivation films to be arranged (disposed) in groups.

Another objective of the present invention is to provide a method for forming a protection film on a chip, which can assemble the protection film on the chip with lower cost, so as to save the cost of the product.

In summary, according to an aspect of the present invention, an apparatus for forming a protection film on a chip includes a housing element, which includes a housing, at least one guiding rod and at least one pressing rod, wherein the guiding rod is disposed at two sides of the housing, and the pressing rod is connected to the guiding rod to facilitate sliding on the guiding rod; a chip tray for carrying a plurality of chips, having a plurality of cavities thereon to facilitate embedding of the plurality of chips therein; a substrate element for supporting the chip tray and fixing the cover element, wherein the substrate element comprises a substrate, at least one clamp and a supporting plate, the substrate is used for bearing the supporting plate and the clamp, the clamp is arranged on two sides of the substrate to be beneficial to clamping the cover element, and the supporting plate is provided with at least one elastic element for supporting the chip tray; and the transfer film is used for bearing the protective film units so as to be beneficial to attaching the protective film units on the chips.

The device further comprises a guide rod bracket which is used for supporting the guide rods and is arranged at two sides of the outer cover together, and a soft cushion is arranged on the supporting plate to support the plurality of chips.

According to another aspect of the present invention, a method for forming a protective film on a chip is provided, which includes providing a supporting plate for supporting a chip tray to fix a position of the chip tray, wherein a plurality of chips are disposed on the chip tray; then, providing a transfer film, wherein a plurality of protective film units are attached to the bottom surface of the transfer film, and the transfer film is placed on an outer cover element; then, placing the outer cover element on the support plate, and aligning the protective film units on the transfer film with the chips on the chip tray; next, pressing the cover element downwards by using a clamp so that the protective film units are attached to the surfaces of the chips; then, a pressure bar is moved from the first end to the second end on the housing element by using a guide rod; pressing one end of the transfer film between the first pressure lever and the second pressure lever; separating the transfer film from the outer cover by using the movable transfer film; finally, the clamp is removed, and the outer cover element and the supporting plate are separated, so that the plurality of protective film units on the transfer film are arranged on the plurality of chips.

The method and the device for forming the protective film on the chip not only overcome the defects of the prior art, but also can effectively improve the efficiency and the reliability of the method for forming the protective film on the chip and greatly reduce the cost.

Drawings

The above elements, as well as other features and advantages of the present invention will become more apparent upon reading the following detailed description of the embodiments and the accompanying drawings in which:

fig. 1 is a schematic view of constituent parts of a protective tape assembling apparatus for chip scale packaging according to the present invention.

Fig. 2 is a schematic view of a support plate according to the present invention.

FIG. 3 is a schematic view of a chip tray according to the present invention.

Fig. 4 is a schematic view of a transfer membrane element according to the present invention.

Fig. 5 is a schematic view of a chip tray according to the present invention placed on a support plate.

Fig. 6 is a schematic view of a transfer film alignment cover according to the present invention.

Fig. 7 is a schematic view of a cover element according to the invention placed on a support plate.

FIG. 8 is a schematic view of a cover element being depressed against a toggle clamp in accordance with the present invention.

Fig. 9 is a schematic view of a push (shift) lever to the other end thereof according to the present invention.

Fig. 10a and 10b are schematic views illustrating the transfer film according to the present invention pressed between two pressing rods.

FIG. 11 is a schematic view of a separation transfer film and housing according to the present invention.

Fig. 12a and 12b are schematic views of the separation of the cover element and the support plate according to the invention.

[ description of main element symbols ]

Substrate 100

Supporting plate 101

Suspension pin 101a

Accommodating space 101b

Cushion 102

Convex part 102a

Toggle clamp 103

Chip tray 104

Pit 104a

Hole 104b

Chip 105

Guide rod bracket 106

Outer cover 107

Concave hole 107a

Plugs 107b, 107c

Guide rod 108

Pressure levers 109, 111

Strut opening 109a

Transfer film 110

Protective film unit 110a

Transfer film openings 110b, 110c

Plunger portion 111a

Detailed Description

The present invention will be described in detail below with reference to the preferred embodiments and the accompanying drawings. It should be understood that the preferred embodiments of the present invention are illustrative only and not limiting. Thus, the present invention is broadly applicable to other embodiments in addition to the preferred embodiments described herein. And the invention is not to be limited by any of the embodiments but by the appended claims and their equivalents.

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings. Further aspects and advantages of the novel concepts of the present invention will be set forth in part in the description which follows and in part will become apparent to those skilled in the art upon examination of the following or may be learned from practice of the novel concepts.

The present invention provides an apparatus and method for forming a protective film on a chip of a chip scale package, which can be applied to products such as a Chip Scale Package (CSP) chip, a through-silicon via (TSV) chip, a ceramic chip carrier with leads (CLCC), or a MiniPak switching diode.

As shown in fig. 1, there is shown a schematic view of constituent parts of a protective tape mount apparatus (protective tape mount apparatus) for chip scale packaging according to the present invention. The apparatus is only an embodiment of the present invention, and the apparatus includes a housing element (casing set), a substrate element (base set), a chip tray (chip tray)104, and a transfer film (transfer tape) 110. Wherein the cover element serves to make the chip position more precise and to tighten the positional tolerance of the chip in the plane (X, Y axes). In addition, another function of the cover element is to handle a protective film transfer process (taping process). The housing elements include a housing 107, guide rods 108 and guide rod holders 106, a press bar 109 and a press rod 111, wherein the housing 107 can be changed in its configuration for different products, the housing 107 has pins 107b and 107c to facilitate alignment, and a plurality of cavities 107a, the number of cavities 107a being based on the number of chips allowed to be placed on the chip tray. The guide bar bracket 106 is configured (fixed) to both sides of the housing 107 for supporting the guide bar 108, and the pressing bar 109 and the pressing bar 111 are coupled to the guide bar 108 to facilitate sliding on the guide bar 108. The design of the guide bar 108 and guide bar bracket 106 may resemble a slide rail (rail). The pressure bar 109 is used for pressing the transfer film 110, so that the protective film can be accurately attached to the surface of the chip; the pressing bar 111 is disposed on the pressing bar 109 before the transfer film 110 is removed, so as to limit the degree of freedom of the chip in the vertical direction (Z axis) during the removal of the transfer film 110, so that the chip is still maintained in the chip tray after the transfer film 110 is removed. Based on the design of the pressing rods 109 and 111, the protective film unit can be attached on the surface of the housing 107, and the transfer film 110 can be quickly removed. The substrate element serves to support a disk module (tray module), for example a chip disk 104 with chips 105 thereon, and to precisely fix the housing element. The base member comprises a base plate 100, at least a pair of toggle clamps 103, a support plate 101 and a cushion 102, wherein the support plate 101 is disposed on the base plate 100 (e.g. in the central region), and the toggle clamps 103 are disposed on both sides of the base plate 100, and the cover 107 can be clamped to the support plate 101 by the toggle clamps 103 during the transfer of the protective film unit. The soft pad 102, such as a rubber pad 102, is located on the supporting plate 101 (e.g., in the central (center) region thereof), and has a plurality of protrusions 102a thereon corresponding to the placement positions of the chips 104, so as to support the (tall) chips 104 during the protective film unit attaching process and restrict the chips 104 from moving in the vertical direction (Z axis). The base plate 100 is used to carry and mount the support plate 101 and the toggle clamps 103.

The structure, use and purpose of the above-described member (component) will be described together with the following assembling method.

As shown in fig. 2, which shows a schematic view of a support plate according to the present invention. The supporting plate 101 is used to limit the position of the chip tray 104 (see fig. 1) in the X and Y axes, and at least one suspension pin or elastic element 101a is designed in the supporting plate for supporting the chip tray 104, which is located at each corner of the supporting plate 101. The chip tray 104 will move smoothly upward and downward according to the operation of the enclosure board elements and based on the design of the suspension pins 101 a. It should be noted that the supporting board 101 of the present invention includes a receiving space 101b located in a central area, such as the supporting board cavity 101b, for bearing the rubber pad 102 and the chip tray 104 and fixing the position of the chip tray 104.

As shown in fig. 3, which shows a schematic design of a chip tray according to the present invention. The chip tray 104 is used for carrying chips 105 (see fig. 1), and includes a plurality of cavities 104a thereon to facilitate the insertion of the chips 105 therein, wherein the cavities 104a are, for example, grid-shaped cavities, and the depth of the cavities 104a is such that the chips 105 can penetrate therethrough. The cavities 104a of the chip tray 104 are disposed to receive (correspond to) the chips 105 one by one, and the holes 104b of the cavities 104a correspond to the bumps 102a of the cushion 102 (see fig. 1). The chip 105 is, for example, a chip-scale packaged chip, a through-silicon via (TSV) chip, a leaded ceramic chip carrier (CLCC), or a MiniPak switching diode. The chips 105 are arranged on the chip tray 104 in an array. When the chip tray 104 is pressed downward, the bumps 102a of the soft pad 102 can pass through the holes 104b in the cavity 104a of the chip tray 104 to lift the chips 105 located in the cavities 104 a. In other words, the cavity 104a of the chip tray 104 of the present invention includes at least one through hole 104b, and the protrusion 102a of the soft pad 102 can support the chip 105 through the at least one through hole 104b during the pressing process of the chip tray 104, so that the surface of the chip 105 is close to the upper surface of the cover 107 (see fig. 1).

As shown in fig. 4, which shows a schematic view of the structure of a transfer membrane element according to the present invention. In one embodiment, the transfer film element is composed of two material layers, the first layer is a polyimide layer (polyimide layer) as the transfer film 110 for carrying a plurality of protective film units (protective film) 110a, the second layer is a release film (liner)110d attached to the transfer film 110, wherein the plurality of protective film units 110a are adhered or attached between the transfer film 110 and the release film 110 d. The transfer film 110, such as a protective tape 110, has a plurality of protective film units 110a attached to a bottom surface thereof. In the structure of the transfer film 110, the upper and lower ends thereof include transfer film openings 110b and 110c for facilitating alignment and connection with the bolts 107b and 107c (see fig. 1) on the housing 107, respectively, as shown in fig. 6. The size of the transfer film 110 depends on the size of the chip matrix (or the size of the cavity 104 a) on the chip tray 104, please refer to fig. 1.

The method for forming the protective film on the chip will be described below. First, the chip tray 104 is placed on the elastic member 101a on the support plate 101, and the chip tray 104 having the chip 105 placed therein is referred to fig. 5. The chip tray 104 carrying the chip 105 is supported above the support plate 101 by an elastic element 101 a.

The next step is to take a piece of transfer film element, remove the release film 110d, so as to leave the transfer film 110 and the plurality of protection film units 110a attached thereon; then, the transfer film 110 is placed on the housing 107, the transfer film openings 110b and 110c (see fig. 4) of the transfer film 110 are aligned by the bolts 107b and 107c on the housing 107, so that the housing 107 and the transfer film 110 are joined to each other, and the transfer film 110 having a plurality of protective film units 110a attached to the bottom surface thereof is placed on the housing element (including the housing 107), as shown in fig. 6. At this time, the cavity 107a of the cover 107 is approximately aligned with the protection film unit 110a of the transfer film 110. For example, the size of the cavity 107a on the housing 107 is approximately equal to the size of the protection film unit 110a, and the plurality of cavities 107a are arranged in one-to-one correspondence with the plurality of protection film units 110 a.

Next, the cover member (including the cover 107) joined to the transfer film 110 is placed or fixed on the support plate 101, referring to fig. 7. The enclosure element will be supported by the chip tray 104 (see fig. 5). At this time, the protective film unit 110a on the transfer film 110 is slightly aligned with and attached to the chip 105 on the chip tray 104. The transfer film 110 is disposed below the pressure lever 109.

Thereafter, the cover member is pressed down to maintain a pressure approximately, and then at least one pair of toggle clamps 103 on the substrate member is pushed to press down the cover member so that the protective film unit 110a is attached to and covers the surfaces of the chips 105 on the chip tray 104, referring to fig. 8.

Then, the pressing rod 109 is pushed (moved) from one end on the housing 107 to the other end thereof along the guide rod 108, and the guide rod 108 reaches the other end on the housing 107, referring to fig. 9. The transfer film 110 is disposed below the pressing rod 109, so that the pressing rod 109 is pushed (moved) without contacting the protective film unit 110a (see fig. 8) below, thereby preventing the protective film unit 110a from being damaged.

Next, one end 110d of the rotating film 110 is lifted to contact the top of the pressing rod 109, referring to fig. 9 and 10 a. Then, the pressing rod 111 is placed above the pressing rod 109, and the pressing rod opening 109a of the pressing rod 109 is aligned by the pressing rod bolt portion 111a (see fig. 1) below the pressing rod 111, so that the pressing rod 111 and the pressing rod 109 are joined to each other, and at this time, one end of the transfer film 110 is located between the pressing rod 109 and the pressing rod 111, and the transfer film 110 is tightly pressed between the pressing rod 109 and the pressing rod 111, as shown in fig. 10 b.

The next step is to separate the transfer film 110 from the housing 107. The transfer film 110 is pulled to be pressed between the pressing rod 109 and the pressing rod 111, so that the pressing rod 109 and the pressing rod 111 move together with the pull of the transfer film 110 along the guiding rod 108 from the pressing position of the transfer film 110. When the pressing rod 109 and the pressing rod 111 move from the pressing position of the transfer film 110 to the other end, the transfer film 110 can be removed from the housing 107, referring to fig. 11.

Finally, the toggle clamp 103 is removed, as shown in FIG. 12 a. And the whole cover element is removed to separate the cover element from the supporting plate 101, and the clean protective film unit 110a on the chip 105 (see fig. 5) is adhered thereon to protect it from the dust particles, as shown in fig. 12 b.

It should be noted that the steps of moving, pushing, pressing, aligning, combining and separating the components of the present invention can be performed manually or automatically.

The conventional method for forming the protective film on the chip has many disadvantages, and the method for forming the protective film on the chip of the present invention is superior to the conventional method for forming the protective film on the chip, and has unexpected effects.

From the above, it can be seen that the device for forming a protection film on a chip and the method for forming the same of the present invention have the following features and advantages:

1. by using the combination of various jigs, the attaching efficiency and the assembling accuracy of the protective film can be improved.

2. By using the jig attachment method, the protective film can be easily attached to the chip, and the protective film can be uniformly and accurately attached to the chip.

3. It is possible to allow the protective films to be placed (configured) in a group rather than individually placing a single protective tape on a single chip as is conventional.

4. The protective film is attached to the chip at a lower cost, so that the cost of the product is saved.

Although the present invention has been described with reference to preferred embodiments, it will be understood by those skilled in the art that the present invention is not limited thereto. It is intended that all such modifications and similar arrangements be included within the spirit and scope of the invention as defined in the appended claims and that the scope of the invention be accorded the broadest interpretation so as to encompass all such modifications and similar structures.

Claims (9)

1. An apparatus for forming a protective film on a chip, comprising:

the outer cover element comprises an outer cover, at least one guide rod, a first pressure rod and a second pressure rod, wherein the guide rods are arranged on two sides of the outer cover, and the first pressure rod and the second pressure rod are jointed on the guide rods so as to be beneficial to sliding on the guide rods;

a chip tray for carrying a plurality of chips, having a plurality of cavities thereon to facilitate embedding of the plurality of chips therein;

a substrate element for supporting the chip tray and fixing the cover element, wherein the substrate element comprises a substrate, at least one clamp, a cushion and a supporting plate, the substrate is used for bearing the supporting plate and the clamp, the clamp is arranged on two sides of the substrate to be beneficial to clamping the cover, and the cushion is arranged on the supporting plate to support the chips; the concave hole of the chip tray comprises at least one perforation to facilitate the bulge of the soft pad to support the chip through the at least one perforation, so that the surface of the chip is close to the upper surface of the outer cover; and

the transfer film is used for bearing a plurality of protective film units so as to be beneficial to transferring the protective film units on the chips;

the first pressure lever and the second pressure lever are mutually jointed through the pressure lever bolt part below the first pressure lever to align the pressure lever opening of the second pressure lever, and one end of the transfer film is positioned between the first pressure lever and the second pressure lever and is tightly pressed between the first pressure lever and the second pressure lever.

2. The apparatus of claim 1, further comprising a guide bar support disposed on both sides of the cover for supporting the guide bar.

3. The apparatus for forming a passivation film on a chip as claimed in claim 1, wherein the supporting plate has at least one elastic member for supporting the chip tray.

4. A method of forming a protective film on a chip, comprising:

providing a supporting plate for bearing a chip disc to fix the position of the chip disc, wherein a plurality of chips can be arranged on the chip disc;

providing a transfer film, wherein a plurality of protective film units are attached to the bottom surface of the transfer film, and the transfer film is placed on an outer cover element;

placing the cover element on the support plate to make the protective film units on the transfer film align with the chips on the chip tray;

pressing the outer cover element with a clamp to attach the protective film units to the surfaces of the chips;

a guide rod is used for enabling a pressure rod to move from a first end to a second end on the outer cover element;

pressing one end of the transfer film between the first pressure lever and the second pressure lever;

separating the transfer film from the outer cover by moving the transfer film;

and removing the clamp, and separating the outer cover element from the support plate to finish the transfer printing of the protective film units on the transfer film on the chips.

5. The method as claimed in claim 4, further comprising providing a guide bar support for supporting the guide bar and disposed at two sides of the housing.

6. The method as claimed in claim 4, further comprising providing a pad on the supporting plate to support the plurality of chips.

7. The method as claimed in claim 4, wherein the cover element comprises a cover, at least one guiding rod disposed at two sides of the cover, and at least one first and second pressing rods coupled to the guiding rod for sliding on the guiding rod.

8. The method as claimed in claim 4, further comprising providing a substrate element for supporting the chip tray and fixing the cover element, the substrate element comprising a substrate, at least one clamp and a supporting plate, the substrate being used for carrying the supporting plate and the clamp, the clamp being disposed on two sides of the substrate to facilitate clamping the cover.

9. The method as claimed in claim 4, wherein the supporting plate has at least one elastic element for supporting the chip tray.