HK1173557B - A system and method using multiple component pane handlers configured to handle and transfer component panes - Google Patents

Description

System and method for using various component board handlers configured to process and transport component boards

Technical Field

Generally, the present invention relates to systems and methods for handling, transporting, and/or aligning a film frame and any components carried thereby. In particular, the present invention relates to systems and methods that use automated film frame handlers for extracting film frames and any components carried thereby from film frame loading stations and transporting the film frames and components carried thereby to other locations, stations, secondary stations, or system components, structures, or components. Thus, the membrane frame and any components carried thereby may be spatially aligned outside the membrane frame loading station, but carried by or coupled to the membrane frame handler.

Background

The use and demand for semiconductor devices or semiconductor-related devices has increased significantly over the past decades. This rapid increase in demand for semiconductor components can be attributed, in large part, to personal and commercial demands for computers and other electronic products, particularly for faster, higher quality, more reliable, and/or more advanced computers and electronic products.

The manufacture of semiconductor devices typically involves one or more inspection processes to determine and/or ascertain the quality of the manufactured semiconductor devices. Inspecting a semiconductor device (e.g., a film frame carrying whole, partial, or diced wafers) typically involves capturing images of the semiconductor device and processing the captured images to detect defects that may be present on the semiconductor device.

Generally, before capturing an image of the semiconductor device using an optical inspection apparatus, the semiconductor device needs to be transferred and placed on a displaceable table, such as a vacuum table or chuck (chuck). The vacuum table is typically positioned along a rectangular coordinate to allow the semiconductor device to be placed thereon to capture images of different portions or areas of the semiconductor device.

To ensure effectiveness and/or accuracy in the inspection process of semiconductor devices, the semiconductor devices are spatially aligned prior to inspection (e.g., image acquisition). Therefore, the semiconductor devices need to be spatially aligned when placed or disposed on the vacuum table.

There are several current methods, techniques, and/or apparatus that facilitate the spatial alignment of semiconductor devices when they are placed on a vacuum table. For example, sensors and/or alignment components may be carried by or coupled to the vacuum table to facilitate or effect alignment of semiconductor components (e.g., film frame and any components carried thereby) on the vacuum table. However, such sensors and alignment assemblies may increase the complexity and/or manufacturing cost of the vacuum table.

Many current semiconductor vacuum tables or chucks carry or include ejector pins(s) that are configured and/or positioned to move and extend above the plane or surface of the vacuum table. The ejector pins may extend a given distance above the surface of the vacuum table, receiving the film frame and any components carried thereby, for example, from a robotic handling member, arm, or similar transport mechanism. After receiving the semiconductor component, the ejector pins may be lowered to or just below the surface level of the vacuum table to place or park the semiconductor component on the surface of the vacuum table. The ejector pins may also be used for spatial alignment of the semiconductor component on the vacuum table, e.g., with respect to alignment marks or structures carried by the vacuum table. To allow or facilitate subsequent removal or pick-up of the semiconductor device from the vacuum table, the ejector pins may be extended to lift or elevate the semiconductor device a distance above the surface of the vacuum table so that the semiconductor device may be picked up by a robotic handler, arm, or similar transport mechanism.

Numerous efforts have been made (e.g., development efforts) to explore many ways, methods, and techniques to increase the throughput or efficiency of systems involved in inspecting semiconductor devices. For example, an increase in the speed or rate at which semiconductor devices are transferred to or from a vacuum table helps to increase overall semiconductor device inspection speed. However, many current methods and techniques for increasing the speed of transfer of semiconductor devices, such as transferring semiconductor devices to a vacuum table, also increase the complexity and/or manufacturing and/or operating costs of the systems related to the transfer and inspection of semiconductor devices.

The use of ejector pins and many conventional vacuum tables also has some limitations. The ejector pins typically need to be placed at different distances relative to each other to accommodate different sized semiconductor components (e.g., 6 inch film frames, 8 inch film frames, and 12 inch film frames). Thus, vacuum tables typically require multiple sets of ejector pins, i.e., a different set for each size of semiconductor component (e.g., film frame) that the vacuum table is designed to carry. This would increase the complexity and manufacturing costs associated with the vacuum table. In addition, the ejector pins typically introduce voids or openings in the vacuum table, thereby reducing the suction capacity and/or vacuum uniformity across one or more portions of the vacuum table. In addition, the ejector pins may cause detrimental damage or defects to the film frame and any components carried thereby when not properly (e.g., fully) retracted into the vacuum table.

Current systems, devices, and methods for handling and/or transporting membrane frames and any components carried thereby have associated limitations, disadvantages, and/or problems. While improvements have been made in the manufacture of semiconductor devices, there is a continuing need for simpler, more efficient, and more cost effective semiconductor device manufacturing (e.g., semiconductor device processing, transfer, alignment, and/or inspection) systems, methods, and techniques.

Disclosure of Invention

According to a first aspect of the invention, a system for processing component boards comprises:

at least one module board handler, wherein each module board handler includes an end effector configured to extract a module board from a module board storage station; said at least one component board handler being connected to a registration assembly provided on said end effector, said registration assembly provided on said end effector being configured to fit into a corresponding set of registration grooves on a component board carried by said end effector to effect alignment of said component boards; and

an alignment module disposed at a location outside the component board storage station,

wherein relative displacement between the end effector of each of said at least one component board handler and said alignment module towards each other causes at least part of the extremity of the component board carried by said end effector to contact the alignment module to effect application of an external force on the component board and thereby displace said component board such that said set of registration grooves on said component board engage with the registration members of said end effector.

Preferably, the at least one component plate handler includes at least one robotic arm.

Preferably, the system further comprises the vacuum table assembly, the vacuum table is free of nesting components, and the vacuum table is capable of receiving component plates having different sizes.

Preferably, the system further comprises a pick and place mechanism configured to retrieve the component plate and transfer or reverse transfer the component plate from the end effector and vacuum table assembly.

Preferably, the vacuum table assembly for receiving component boards may be translated for positioning component boards carried thereby relative to the inspection device for inspection.

Preferably, the pick and place mechanism comprises:

a plurality of displacement arms, each of the displacement arms including at least one attraction assembly along a length thereof, the at least one attraction assembly configured to capture an assembly plate; the plurality of displacement arms being displaceable between a plurality of sets of predetermined positions, each of the plurality of sets of predetermined positions corresponding to component plates having different shapes and/or sizes; and

a position control mechanism coupled to the plurality of displacement arms, the position control mechanism configured to control displacement of the plurality of displacement arms toward a predetermined position from among the plurality of sets of predetermined positions corresponding to a shape and/or size of a component plate during processing,

wherein the displacement of the plurality of displacement arms causes displacement of the at least one suction assembly towards the predetermined position to retrieve and process the assembly plate having the corresponding predetermined shape and/or size.

Preferably, each of said at least one suction assembly on each of the plurality of displacement arms of the pick and place mechanism effects the picking, transfer and displacement of said assembly plate between the end effector and said vacuum table, respectively, by applying, continuously applying or not applying vacuum suction to the panel surface.

Preferably, the at least one suction element is displaceable between a plurality of positions along the length of each of the displacement arms for picking up and processing panels having different shapes and/or sizes.

Preferably, the alignment module includes at least one alignment assembly configured to facilitate alignment of the assembly plate carried by the end effector.

Preferably, the alignment module is spatially located at a distance beyond the periphery of the component board carried by the component board handler, and the alignment module is located opposite the nest assembly of each of the at least one component board handler.

Preferably, the alignment module comprises at least two alignment elements at a distance from each other, the at least two alignment elements being arranged in a register assembly with respect to an end effector of each component board handler within said at least one component board handler, enabling application of external forces at least two locations along the periphery of a component board carried by said end effector during relative displacement of the component board and the alignment module.

Preferably, the at least two alignment assemblies are positioned such that the at least two positions are substantially relative to a mating position between the at least one registration groove of the assembly plate and the registration assembly of the end effector, wherein the at least two positions are where the at least two alignment assemblies are forced along the periphery of the assembly plate.

Preferably, the alignment modules are located around the pick and place mechanism.

Preferably, the pick and place mechanism comprises the alignment module and relative displacement between the pick and place mechanism and the end effector causes contact between the periphery of a component board carried by the end effector and the alignment module and thus alignment of the component board is achieved.

Preferably, the alignment module includes a spring loaded mechanism configured and positioned to contact a portion of the outer periphery of the component plate carried by the end effector of each of the at least one component plate handler to effect alignment of the component plate when the component plate is displaced toward the alignment module.

Preferably, the spring-loaded mechanism is configured to absorb at least a portion of an external force applied to the component plate when the outer periphery of the component plate is in contact with the alignment module.

Preferably, the assembly plate is a semiconductor film frame.

Preferably, the alignment module is provided at the periphery of the pick and place mechanism.

According to a second aspect of the invention, a method for handling and aligning a component plate, wherein the alignment component plate comprises:

activating at least one component board handler to extract a component board from a component board storage station, a periphery of the component board including a registration groove;

extracting component boards from the component board storage station;

displacing each of a plurality of end effectors in a controlled sequential manner relative to an alignment module located outside the component plate storage station, the displacement of each of the plurality of end effectors correspondingly displacing a component plate carried thereby relative to the alignment module; and

applying an external force by the alignment module to a component plate carried by each of the plurality of end effectors to effect engagement of the component plate to the nested assembly of the end effectors and thereby effect component plate alignment without further spatial alignment of the component plate relative to the vacuum table.

Preferably, the method further comprises: translating the assembly plate handler including an end effector towards the alignment module, thereby achieving alignment between the at least one registration groove of the assembly plate and the registration assembly of the end effector; wherein the end effector carries the assembly plate thereon.

Preferably, the method further comprises: translating a pick and place mechanism comprising an alignment module towards an end effector carrying said component plate, thereby achieving alignment between at least one registration groove of said component plate and a registration assembly of said end effector.

Preferably, the method further comprises: providing a relative displacement between the component plate including the end effector and the pick and place mechanism such that a component plate held by the end effector is placed so that it is picked up by the pick and place mechanism after alignment of the component plate.

Preferably, the plurality of suction assemblies of each of the plurality of displacing arms of the pick and place mechanism are realized by applying, continuously applying or not applying suction: picking up the component board, securing the component board on the pick and place mechanism, and displacing the component board from the vacuum table during transfer of the component board to and from the vacuum table.

Preferably, the method further comprises:

after the inspecting step is performed, positioning the pick and place mechanism with respect to the component board on the vacuum table, picking up the inspected component board using the pick and place mechanism;

providing relative displacement between an assembly plate including the end effector and the pick and place mechanism such that the pick and place mechanism is displaced and positioned to displace the inspected assembly plate onto the end effector; and

displacing the component board handler so that the inspected component board is moved back into the slot of the component board storage station.

Preferably, the displacement of each end effector relative to the pick and place mechanism is software programmed executed by computer means.

In accordance with a first embodiment of the present invention, a system for processing film frames is disclosed. The system includes a plurality of component board handlers; wherein each of the plurality of component board handlers is configured for retrieving a component board from a component board storage station. Each of the plurality of component plate handlers includes an end effector configured to carry the component plate. In addition, each component board handler of the plurality of component board handlers comprises a registration element adapted to engage with a component board carried by the end effector. The system also includes an alignment module located at a position outside of the component board storage station. The alignment module and each end effector carrying the component plate are displaceable relative to each other such that a distal portion of the component plate is brought into contact with the alignment module in a manner facilitating or enabling the application of an external force to the component plate carried by said end effector. Applying the external force to the component plate causes displacement of the component plate such that an end portion of the component plate engages a nesting component carried by the end effector.

In accordance with a second embodiment of the present invention, a system for processing a film frame is disclosed. The system includes a first film frame handler configured to retrieve a first film frame from a film frame storage station. The first film frame handler includes a first end effector configured to carry the first film frame and a first registration assembly adapted to engage with at least one registration groove of the first film frame carried by the first end effector. The system also includes a pick and place mechanism located outside the film frame storage station and configured to lift the first film frame from the first end effector and transfer the first film frame from the first end effector to a vacuum table assembly. The pick and place mechanism includes an alignment module displaceable relative to a first film frame carried by the first end effector. Relative displacement between the alignment module and the first membrane frame results in contact between the alignment module and the first membrane frame to effect or enhance engagement of the end portion of the first membrane frame with the first nest assembly to effect spatial alignment of the first membrane frame.

In accordance with a third embodiment of the present invention, a method for transporting a film frame is disclosed. The method includes extracting a first film frame from a film frame storage station by a first end effector. The first end effector is configured to carry the first membrane frame. The first end effector includes a first nest assembly adapted to engage a first membrane frame carried by the first end effector. The method also includes displacing the first end effector to displace a respective first film frame carried by the first end effector toward an alignment module located at a position outside of the film frame storage station. In addition, the method also includes effecting contact between a first film frame carried by the first end effector and the alignment module, and applying an external force to the first film frame due to the contact effected between the end portion of the first film frame and the alignment module. Applying an external force to the first membrane frame due to the contact achieved between the end portion of the first membrane frame and the alignment module, enabling or enhancing the engagement of the first membrane frame to the first nest assembly and thus enabling spatial alignment of the first membrane frame carried by the first end effector.

In accordance with a fourth embodiment of the present invention, a method for placing an alignment assembly plate is disclosed. The method comprises the following steps: a plurality of component plates are extracted from the component plate storage station using a plurality of end effectors. Each end effector of the plurality of end effectors comprises a nesting assembly adapted to mate with a module plate from which it is extracted. The method also includes displacing each of the plurality of end effectors in a controlled sequential manner relative to an alignment module located outside of the component plate storage station. The position of each end effector is translated to correspondingly shift the position of the component plate carried by each end effector relative to the alignment module. In addition, the method includes applying, by the alignment module, an external force to a component plate carried by each of the plurality of end effectors in a controlled sequential manner to effect or enhance the engagement of the component plate to the nested component of the end effector. The realization and enhancement of the interfitting between the component plate and the nesting component enables spatial alignment of the component plate, thus eliminating the need for further spatial alignment of the component plate.

Drawings

The following description of various embodiments of the invention is made with reference to the accompanying drawings, in which:

FIG. 1 is a schematic diagram of a system for handling, transporting, aligning, and inspecting component boards (e.g., film frames) in accordance with an embodiment of the present invention;

fig. 2A shows the placement of a first film frame handler and a second film frame handler (specifically, a first end effector and a second end effector) prior to the extraction of a film frame from a film frame storage station, in accordance with an embodiment of the present invention;

FIG. 2B shows the first end effector of FIG. 2A displaced to an extended position for retrieving a first film frame from the film frame storage station;

FIG. 2C shows the first film frame carried by the first end effector shown in FIG. 2B after the first film frame is extracted from the film frame storage station;

FIG. 2D shows the second end effector of FIG. 2A displaced to an extended position for retrieving a second film frame from the film frame storage station;

FIG. 2E shows the first and second film frames carried by the first and second end effectors, respectively, after being extracted from the film frame storage station;

FIG. 2F shows rotation of each of the first and second end effectors for displacing the first and second film frames to a destination or target position relative to the pick and place mechanism, in accordance with an embodiment of the present invention;

FIG. 2G shows the alignment of each of the first and second film frames relative to the alignment module carried by the pick and place mechanism shown in FIG. 2F;

FIG. 2H shows the displacement of the first end effector and the corresponding displacement of the first film frame carried thereby toward the alignment module to bring the first film frame into contact with the alignment assembly shown in FIG. 2F;

FIG. 2I shows the first end effector displacing the first film frame pickup mechanism carried thereby under the suction or vacuum assemblies of the pickup and placement mechanism in a manner that facilitates the gripping of the first film frame by the pickup and placement mechanism, in accordance with an embodiment of the present invention;

FIG. 2J shows the pick and place mechanism of FIG. 2I carrying the first film frame using the plurality of suction elements of the pick and place mechanism;

FIG. 2K shows the first film frame being transferred from the pick and place mechanism onto a vacuum table of a vacuum table assembly in accordance with an embodiment of the present invention;

FIGS. 2L and 2M illustrate translating the vacuum table relative to an optical inspection device to position a first film frame carried by the vacuum table for image capture by the optical inspection device;

FIG. 2N shows displacing the second end effector and correspondingly the second film frame toward the alignment module of the pick and place mechanism to bring the second film frame into contact with the alignment assembly;

FIG. 2O shows the first film frame being extracted from the vacuum table by the pick and place mechanism, in accordance with an embodiment of the present invention;

FIGS. 2P and 2Q illustrate displacing the first end effector with respect to the pick and place mechanism to facilitate transfer of the first film frame from the pick and place mechanism back to the first end effector, in accordance with embodiments of the present invention;

FIG. 2R shows the second end effector being displaced to place a second film frame carried thereby for pick-up by the pick-and-place mechanism after the first film frame is removed from the pick-and-place mechanism, in accordance with an embodiment of the present invention;

FIG. 2S shows translating the vacuum table to displace a second film frame carried by the vacuum table relative to the optical inspection apparatus;

FIGS. 2T, 2U and 2V illustrate rotating and displacing the first end effector to transfer a first film frame carried by the first end effector to the film frame storage station, in accordance with an embodiment of the present invention;

FIGS. 2W and 2X illustrate displacing the first end effector for extracting a third film frame from the film frame storage station, in accordance with embodiments of the present invention;

FIG. 2Y shows rotating the first end effector for placing the third film frame at a destination or target position relative to the pick and place mechanism of FIG. 2F;

fig. 3A and 3B are flow diagrams of methods or processes for processing, transporting, and aligning a component board (e.g., a film frame) and any components carried thereby, according to embodiments of the present invention.

[ description of main reference symbols ]

20 system 50 module plate, module frame, membrane frame

100 assembly plate storage station or module, film frame storage 150 assembly plate transfer module, film frame transfer

Storage station or module

160 module plate treating member, film frame treating member 160a first film frame treating member

160b second film frame processing member 170 end effector

170a first end acting member 170b second end acting member

180 registration assembly, membrane frame registration assembly, membrane 190 vacuum or suction module, vent, compartment

Frame sheathing module, mechanism, structural gap, opening

200 assembly plate alignment module, appliance, mechanism, 250 pick and place mechanism, arm, module

Assembly, membrane frame alignment module

260 suction assembly, pad, probe, or mold 300 vacuum table assembly

A block; a vacuum component, a cushion part, a detecting part,

Or module

310 translation device for vacuum table 320

350 component inspection device

Detailed Description

Embodiments of the present invention relate to systems, devices, apparatuses, devices, methods, processes, and/or techniques for handling, transporting, and/or aligning a component, a component carrier, a component board (component), or a component frame. In various embodiments according to the present invention, the term "component board" encompasses an appliance, device, structure, or object (e.g., a frame or base that can carry, support, hold, or at least partially surround, enclose, or define an edge relative to a surrounding portion of a component, such as a semiconductor wafer or similar type of substrate). The component board may provide or be enabled to provide one or more surfaces (e.g., flat or substantially flat surfaces) that may carry (e.g., by way of a tensioned sheet of material such as an adhesive film) a portion of a component, such as a semiconductor wafer. In an exemplary embodiment, the module board may be a film frame. In some embodiments, the term "device board" may also encompass the substrate itself, such as a wafer, a solar panel, or an electrical device (e.g., a printed circuit board).

For the sake of brevity and clarity, the following descriptions of the systems, apparatus, devices, methods, processes, and/or techniques of various embodiments of the present invention are provided with particular reference to membrane frames. It will be appreciated, however, that other components, component carriers, or component boards (e.g., packaged semiconductor components or devices, electronic components such as printed circuit boards and solar cells or modules, or solar panels shaped like wafers) may also be processed, transferred, and/or aligned by the systems, devices, methods, processes, and techniques of the various embodiments of the present invention.

The system includes a component board transport module (also referred to as a component frame transport module), such as a film frame transport module, that includes a plurality of component board handlers or component frame handlers (e.g., film frame handlers) configured to couple to, carry, process, and/or transport a component plane or component frame (e.g., a film frame and any components carried thereby). Each component board handler of the plurality of component board handlers may be a robotic arm configured to have one or more of x-axis, y-axis, z-axis, and theta-axis motion. In many embodiments, the component board transport module comprises at least two component board handlers configured to extract component boards from a component board storage station (or a component board loading and unloading module, a cassette, or a rack or film frame storage module) and transport the extracted component boards from the component board storage station to another location, system component, or tool (e.g., to a pick and place mechanism or arm). The use of multiple component board handlers to extract, process, and transport component boards may help increase the efficiency and/or throughput of the system associated with extracting, processing, and/or transporting component boards. The relative displacement (relative displacement), position, and/or operation of each component board processing element of the plurality of component board processing elements may be automatically controlled, for example, by computer program software executed by a computer device or system coupled to the component board transmission module. The relative displacement, position, and/or operation of each component board handler of the plurality of component board handlers may be synchronized to enhance the overall efficiency of the system.

The system also includes an alignment assembly, module, tool, or structure (e.g., a position alignment assembly, module, tool, or structure). The alignment module contains at least one alignment assembly, and in many embodiments, two or more alignment assemblies. The alignment module is configured to facilitate or effect positional alignment of the component board and any components carried thereby. The alignment module is placed or located outside of the component board storage station. In some embodiments, the alignment module is placed or positioned in the following manner: easy, convenient, unobstructed, and/or unrestricted access to component boards carried by, or coupled to, the component board handler is permitted, facilitated, or enabled.

The component board may be spatially aligned by the alignment module when the component board is being carried by or coupled with the component board handler. In most embodiments, the component board handlers comprise nested components, modules, or structures (hereinafter "nested components"). The nesting component is configured to mate with a particular portion of the component plate, more particularly an end or edge or side. The mating or enhanced mating (e.g., mating, fixing, or tight fitting) between the component board and the nest component may enable or correlate with spatial alignment of the component board.

In many embodiments, spatial alignment of the component plate may be achieved by displacing the component plate relative to the alignment module such that the alignment module applies an external force to a portion of the component plate (e.g., an end or edge or side of the component plate), or to a portion of the component plate, to achieve or enhance engagement between the component plate and the nested components of the component plate handler. The component plate may be displaced relative to the alignment module, more particularly, moved to or towards the alignment module to cause the alignment module to contact and/or push the component plate (more particularly, the edge, side, end, or periphery of the component plate) to effect or enhance the engagement between the component plate and the registered component of the component plate handler. When the component board is carried by the component board handler, the alignment or spatial alignment of the component board may eliminate or remove, or at least substantially eliminate or remove, the need to align the position of the component board after it is transferred to another location, station, secondary station, system component or structure, or appliance (e.g., after it is transferred to a pick and place mechanism or to a vacuum table of a vacuum table assembly).

Aligning or spatially aligning the component board and any components carried thereby (e.g., the film frame and any components carried thereby) prior to transferring the component board to the vacuum table assembly may eliminate the need to further align or substantially align the component board after the component board has been transferred to the vacuum table assembly. Such elimination of the need to further align or substantially align the component plate after it has been transferred to the vacuum table assembly may increase the efficiency, robustness, simplicity of design, and/or cost effectiveness of the systems, appliances, devices, methods, processes, and/or techniques of many embodiments of the present invention.

Representative examples of systems, apparatus, devices, processes, methods, and/or techniques for processing a component panel or component frame, such as a semiconductor-related component panel (e.g., a film frame), are described in detail below with reference to fig. 1-3B, in which similar or identical components or process portions are numbered with similar or identical reference numerals throughout fig. 1-3B. The recitation of a given reference number with respect to the descriptive material of the corresponding fig. 1-3B may indicate simultaneous consideration of the figures in which such reference number has been previously shown. The present invention provides embodiments that do not preclude a particular basic structure and/or principles of operation from being presented in the various embodiments described herein. The present invention also relates To And encompasses the entire contents of singapore patent application entitled "system And method for handling And calibrating Component boards Such As Film Frames And Wafers" (system And method for handling And Aligning Component boards And substrate As Film Frames And Wafers) (system And method for handling And Aligning Component boards And substrate As membrane Frames And Wafers attorney docket number STI-P012SG, singapore patent application No. 201103425-3) And the patent entitled "Component board Handler for handling Component boards of different Sizes" (a Component board Handler Configured To Handle multiple substrates attorney docket number STI-P013SG, singapore patent application No. 201103422-0), each of which was filed by applicant's joint technology Technologies, private Technologies, inc (Semiconductor Technologies And Instruments ptltd), 2011, 12. The entire contents of these patent applications are incorporated herein by reference.

Representative examples of System embodiments

Fig. 1 and 2A-2Y illustrate a system 20, or a particular example of such a system, in various stages, sequences, locations, configurations, or modes of operation according to embodiments of the present invention.

In most embodiments, the system 20 includes a component board storage station or module 100 (hereinafter referred to as a film frame storage station or module 100); an assembly board transfer module 150 (hereinafter, referred to as a film frame transfer module 150); an assembly plate alignment module, appliance, mechanism, or assembly 200 (hereinafter membrane frame alignment module 200); a pick and place mechanism, arm, or module 250; a vacuum table assembly 300; and a component inspection device 350.

The system 20 is configured to facilitate or enable transfer of component boards 50 or component frames 50 (more specifically, film frames 50) from the film frame storage station 100 to the vacuum table assembly 300 for inspection of the film frames 50 by the component inspection device 350. In many embodiments, the system 20 is configured to enhance, improve, or increase the efficiency of transferring the film frame 50 from the film frame storage station 100 to the vacuum table assembly 300. The system 20 is configured to achieve alignment (more specifically, spatial or positional alignment) of the film frame 50 after the film frame 50 is extracted or removed from the film frame storage station 100, but before the film frame 50 is transferred to the vacuum table assembly 300. In many embodiments, the spatial alignment of the film frame 50 occurs when the film frame 50 is carried by a component board handler 160 (hereinafter referred to as film frame handler 160) of the component board transport module 150 or is coupled with a component board handler 160 of the component board transport module 150.

Spatial alignment of the film frame 50 prior to transfer of the film frame 50 to the vacuum table assembly 300 may eliminate the need for positional alignment or substantial positional alignment of the film frame 50 at the vacuum table assembly 300. Accordingly, the vacuum table assembly 300 need not include any type of position alignment components, pins, mechanisms, modules, or tools to achieve positional alignment of the film frame 50. This can help reduce the complexity and/or manufacturing and maintenance costs of the system 20 of the present invention compared to current semiconductor film frame systems. In addition, eliminating the need for ejector pins, which is required by many conventional systems for aligning film frames at conventional vacuum table assemblies, may increase the speed and/or efficiency of film frame 50 transfer to the vacuum table assembly 300.

In addition, the system 20 includes a control unit (not shown) (e.g., a computer system or appliance such as a personal computer or computer workstation) configured to cooperatively control the operation of the system components or membrane frames by executing stored program instructions (or computer program software instructions that define at least one membrane frame processing, transport, alignment, and/or inspection sequence in accordance with embodiments of the present invention), as described in detail below.

Typical examples of component board storage stations (e.g., film frame storage stations)

The module board storage station 100 or module frame storage station 100 (more specifically, the film frame storage station 100) may store, support, or carry a plurality of film frames 50. In many embodiments, the film frame storage station 100 includes film frame load/unload interfaces or ports disposed at predetermined positions relative to other components or component boards of the system 20 and configured to carry film frame storage units or repositories (e.g., film frame cassettes or cassettes) in which film frames 50 may be stored in predetermined orientations (e.g., vertically stacked and offset) relative to one another. In several embodiments, the film frame storage station 100 is configured to support, store, or receive film frames 50 of the same size (e.g., 6 inch, 8 inch, or 12 inch film frames 50). In other embodiments, the film frame storage station 100 is configured to support, store, or receive a variety of different sizes of film frames 50 (e.g., at least two of 6 inch, 8 inch, and 12 inch film frames 50).

Typical examples of component board transfer modules (e.g., film frame transfer modules)

The component-board transport module 150 or the component-frame transport module 150 (more specifically, the film-frame transport module 150) contains or carries a plurality of component-board handlings 160 or component-frame handlings 160 (more specifically, the film-frame handlings 160).

In most embodiments (e.g., as shown in fig. 2A-2Y), the film frame transfer module 150 includes two film frame handlers 160, namely a first film frame handler 160a and a second film frame handler 160 b. However, systems 20 having different numbers of film frame handling members 160 (e.g., 3, 4, or more film frame handling members 160) are also within the scope of the present invention.

Typical examples of component plate processing members (e.g., film frame processing members)

The assembly plate handler 160 (e.g., the film frame handler 160) may be referred to as a robotic transport or robotic arm. The film frame handler 160 is configured to transport or transport the film frame 50 between particular locations, components, or portions of the system 20. The relative motion, movement, or operation of each of the film frame handlers 160 (e.g., the first film frame handler 160a and the second film frame handler 160 b) may be synchronized with respect to each other for the purpose of extracting, transporting, and/or releasing the film frames 50 according to portions of a programmatically defined film frame transfer and/or alignment sequence.

In most embodiments, each module plate handler 160 (e.g., film frame handler 160) includes an end effector 170. The end effector 170 is configured to couple, support, carry, or secure a component plate 50 (e.g., a membrane frame 50) during displacement and/or rotation of the end effector 170 to transfer the component plate 50 (more specifically, the membrane frame 50) between particular locations, components, or portions of the system 20.

Each end effector 170 may be movably coupled, fixed, or screwed into one of the first module plate handler 160a (e.g., first film frame handler 160 a) and the second module plate handler 160b (e.g., second film frame handler 160 b). The end effector 170 coupled to the first assembly plate handler 160a (e.g., the first film frame handler 160 a) may be referred to as a first end effector 170a, and the end effector 170 coupled to the second assembly plate handler 160b (e.g., the second film frame handler 160 b) may be referred to as a second end effector 170 b.

Each end effector 170 may be configured and shaped to carry, extract, or support a particular size (e.g., 6 inches, 8 inches, or 12 inches) of an assembly panel 50 (e.g., a membrane frame 50). In some embodiments, each of the first and second end effectors 170a and 170b is configured to couple to or carry the same size component plate 50 (e.g., the film frame 50). In other embodiments, each of the first and second end effectors 170a and 170b is configured to couple to or carry a different sized device board 50 (e.g., a film frame 50).

In several embodiments, each assembly plate handler 160 (more specifically, the film frame handler 160) along with its end effector 170 may move in each of the x-axis, y-axis, z-axis, and θ -axis. Each film frame handler 160, along with its end effector 170, may have both translational and rotational motion. Each film frame handler 160 (e.g., the first and second film frame handlers 160a and 160 b) along with its end effectors 170a and 170b may be coupled to an actuator (or actuation mechanism, implement, or tool) (not shown). The actuator is configured to facilitate or effect displacement of each film frame handler 160 (e.g., the first and second film frame handlers 160a and 160 b) along with its end effectors 170a and 170 b. For example, the actuator may comprise or use an air-filled, hydraulic, spring, gear-driven or electrical mechanism to facilitate or effect displacement of the end effector 170, e.g., to displace the end effector 170 from a retracted position to an extended position, or towards an extended position, to extract a film frame 50 from the film frame storage station 100.

In many embodiments, the movement of each film frame handler 160 (e.g., each of the first film frame handler 160a and the second film frame handler 160 b) and its end effector 170 (e.g., each of the first end effector 170a and the second end effector 170 b) may be controlled by executing a computer software program on a computer device (not shown) coupled to the film frame transport module 150. Each membrane frame handler 160 may be automatically moved (e.g., translated and/or rotated) according to a predetermined or pre-programmable computer software program.

In many embodiments, each of the first film frame handler 160a and the second film frame handler 160b may be displaced to extract a film frame 50 from the film frame storage station 100. More specifically, each of the first end effector 170a and the second end effector 170b may be extended (e.g., displaced from a retracted position or a first position to an extended position or a second position) to facilitate or enable extraction of a particular film frame 50 from the film frame storage station 100. The displacement of the particular end effector 170 (e.g., the end effector 170 extending from the retracted position to the extended position) may place or position the end effector 170 within or within the film frame storage station 100 to enable extraction of the film frame 50 from the film frame storage station 100.

Fig. 2A to 2C show that the first end effector 170a of the first film frame handling member 160a is displaced between the retracted position and the extended position to extract the first film frame 50a from the film frame storage station 100. Fig. 2D and 2E show the second end effector 170b of the second film frame handler 160b being displaced between the retracted position to the extended position to extract a second film frame 50b from the film frame storage station 100.

In most embodiments, each membrane frame handler 160 contains or carries a registration assembly or membrane frame registration assembly 180 (also referred to as a membrane frame registration module, mechanism, or structure). In various embodiments, the registration assembly 180 of each film frame handler 160 is coupled to the end effector 170 of the film frame handler 160 or carried by the end effector 170 of the film frame handler 160. The registration assembly 180 of each membrane frame handler 160 is shaped, configured, and/or adapted to mate with the membrane frame 50 carried by the membrane frame handler 160, or at least a portion of the membrane frame 50.

Generally, the membrane frame 50 includes at least one registration groove or mark formed, disposed, or located at a peripheral edge or side thereof. The registration groove 60 of each membrane frame 50 may be shaped and configured to mate or matingly secure with the registration member 180 of the membrane frame handling member 160. In various embodiments, the spatial alignment of the film frame 50 can be facilitated or achieved by the engagement between the registration assembly 180 of a particular film frame handler 160 (or the end effector 170 of the film frame handler 160) and the registration groove 60 of the film frame 50 carried by the film frame handler 160 (or the end effector 170 of the film frame handler 160).

As described above, the movement or translation of each film frame handler 160 (e.g., each of the first film frame handler 160a and the second film frame handler 160 b) and its end effector 170 (e.g., each of the first end effector 170a and the second end effector 170 b) may be controlled by a computer software program (e.g., computer program instructions) that may be stored on and executed by a computer device coupled to the film frame transport module. In some embodiments, the movement or translation of the film frame handler 160 and its end effector 170 may be controlled to facilitate and/or achieve alignment (e.g., spatial alignment) of the film frame 50 as or during the film frame storage station 100 extracts the film frame 50.

The movement and translation of the film frame handler 160 and its end effector 170 can be controlled to engage between a portion of the film frame 50 (e.g., the registration groove or marker 60 of the film frame 50) and the registration component 180 of the end effector 170 of a particular film frame handler 160, resulting in the film frame 50 being aligned (e.g., spatially aligned), and thus eliminating the need to further align the film frame 50 relative to the vacuum table assembly 300 (e.g., when the film frame 50 is at the vacuum table assembly 300 and/or carried by the vacuum table assembly 300). The motion characteristics (e.g., direction and/or speed of motion) of the film frame handling member 160 (more specifically, the end effector 170 of the film frame handling member 160) can be controlled (e.g., determined and/or adjusted) by the computer software program.

In several embodiments, the movement of the film frame handler 160 (more specifically, the end effector 170 of the film frame handler 160) within the film frame loading station 100 may be controlled to achieve alignment (e.g., spatial alignment) of the film frame 50 at the film frame loading station 100 (e.g., within the film frame loading station 100). For example, the end effector 170 may be moved (e.g., linearly translated) within the film frame loading station 100 in a manner that causes or achieves contact between a particular film frame 50 extracted and carried thereby and a surface (e.g., a wall) of the film frame loading station 100, thereby facilitating or achieving alignment (e.g., spatial alignment) of the film frame 50 in a manner that removes the need to further align the film frame 50 relative to the vacuum table assembly 300 (e.g., when the film frame 50 is located at the vacuum table assembly 300 and/or carried by the vacuum table assembly 300).

In some embodiments, for example, in the system 20 shown in fig. 1 and 2A-2Y, the registered component 180 includes or is a C-channel (C-channel) that is shaped, sized, and/or configured to mate or couple with a particular component panel 50 (e.g., the membrane frame 50). For example, the C-channel or a portion of the C-channel is configured to be secured (e.g., matingly secured) within the registration groove 60 of the membrane frame 50.

In some other embodiments, the nesting component 180 comprises or is an elongated C-channel that is shaped, sized, and/or configured to mate or couple with a particular component plate 50 (e.g., membrane frame 50). The elongated C-shaped channel may have a middle or main portion that is longer than the end portions or projections.

Where the system 20 is configured to process, transfer, and/or align a component or component board 50 instead of a film frame 50 (e.g., a packaged semiconductor component, an electronic component such as a PCB, and a solar cell or panel), the registration component 180 may alternatively be configured, designed, and/or adapted to matingly fit, and/or couple (e.g., fixedly couple) to a portion of the component or component board 50.

In various embodiments, the component plate 50 or the component frame 50 does not include any registration grooves. As such, the registration groove 60 need not always engage or couple (e.g., mate) with the component plate 50 to facilitate or achieve alignment (e.g., spatial or positional alignment) of the component plate 50.

Typical examples of pick and place mechanisms, arms, or modules

As shown in each of fig. 1 and 2A-2Y, the system 20 includes the pick and place mechanism or arm 250. The pick and place mechanism 250 is configured to transfer component plates 50 (e.g., film frames 50) between the component plate handlers 160 (e.g., between the first and second film frame handlers 160a, 160 b). More specifically, the pick and place mechanism 250 is configured to transfer component plates 50 (e.g., film frames 50) between the end effectors 170 (e.g., the first and second end effectors 170a, 170 b) of the component plate handler 160 (e.g., the first and second film frame handlers 160a, 160 b) and the vacuum table assembly 300.

In most embodiments, the pick-and-place mechanism 250 includes or carries at least one attraction assembly, pad, probe, or module 260 (also referred to as a vacuum assembly, pad, probe, or module), and, in many embodiments, the pick-and-place mechanism 250 includes or carries a plurality (e.g., two, three, four, or more) of attraction assemblies, pads, probes, or modules 260. The at least one suction assembly 260 is configured to apply a vacuum or suction. More specifically, the at least one suction assembly 260 is configured to apply or provide suction to or on the film frame 50 (e.g., on or to a surface of the film frame or assembly) to facilitate loading, coupling, or securing of the film frame 50 to the pick and place mechanism 250.

The at least one suction assembly 260 may be configured and displaceable to different predetermined positions to pick up different sized assembly plates 50 (e.g., membrane frames 50). Applying suction to the film surface of the film frame 50 by the at least one suction element 260 helps secure the film frame 50 to the pick and place mechanism 250 during the transfer of the film frame 50 from the film frame handler 160 to the vacuum table assembly 300 by the pick and place mechanism 250.

Although most embodiments of the present invention include and/or utilize a suction element 260 to apply suction to mount, couple, mount, or secure the component plate 50 (e.g., membrane frame 50) to the pick and place mechanism 250, it should be understood that alternative or additional methods, techniques, mechanisms, or implements may be used to load, couple, mount, or secure the component plate 50 (e.g., membrane frame 50) to the pick and place mechanism 250 within the scope of the present invention. For example, the pick and place mechanism 250 may alternatively or additionally include gripping claws and/or adhesive elements (not shown) to facilitate or enable loading, coupling, mounting, or securing of a component plate 50 (e.g., a film frame 50) to the pick and place mechanism 250.

In various embodiments, the application of suction or vacuum-applied external force (e.g., the component and/or duration of suction applied) by the at least one suction assembly 260 may be controlled and/or varied by, for example: depending on the operation or position of the pick and place mechanism 250, the speed of displacement of the pick and place mechanism 250, and/or the size of the film frame 50 being handled or transported by the pick and place mechanism 250. For example, the component of suction applied by the at least one suction element 260 may be adjusted (more specifically, increased) as the size of the component board 50 (e.g., film frame 50) being processed or transported by the pick and place mechanism 250 increases.

The suction force is applied by at least one suction assembly 260 of the pick and place mechanism 250 to extract or pick up the film frame 50 from the film frame handler 160 (e.g., the first film frame handler 160a or the second film frame handler 160 b). The suction force is maintained during the transfer of the film frame 50 from the film frame handler 160 to the vacuum table assembly 260. Maintaining the suction force will help secure the film frame 50 to the pick and place mechanism 250 during displacement of the pick and place mechanism 250 to transfer the film frame 50 from the film frame handler 160 to the vacuum table assembly 300. The suction applied by the at least one suction element 260 may be terminated, or substantially reduced, as the film frame 50 approaches the vacuum table assembly 300, and more specifically, the vacuum table 310 of the vacuum table assembly 300. The absence, termination, or substantial reduction of the suction force applied by the at least one suction assembly 260 may allow or enable the film frame 50 to be released and then placed on the vacuum table 310.

The use of an attractive or vacuum force to pick up, support, and release the film frame 50 allows the vacuum table 310 to eliminate, or omit the use of ejector pins. Current or conventional vacuum tables typically require ejector pins to receive and place the film frame and any components carried thereby on the conventional vacuum table, and then pick up the film frame and any components carried thereby from the conventional vacuum table.

In several embodiments of the present invention, the at least one attraction element 260 comprises a plurality (e.g., two, three, four, or more) of attraction elements 260. The attraction assemblies 260 may be displaced, positioned, and/or disposed at different locations relative to one another. In particular, the attraction assembly 260 is variably positionable to facilitate or enable the pick and place mechanism 250 to pick, and/or couple different sized (e.g., 6-inch, 8-inch, and 12-inch) membrane frames 50, or to the pick and place mechanism 250. It will be appreciated that the pick and place mechanism 250 may also pick or extract other sizes of film frames 50.

In some embodiments, the pick and place mechanism 250 includes a plurality of moving arms (not shown). In certain embodiments, each mobile arm can carry or be coupled to at least one suction assembly 260. Each mobile arm, or at least a portion of each mobile arm, can be displaced (e.g., rotated and/or translated) to displace at least one attraction assembly 260 carried thereby between different positions. Accordingly, displacement (e.g., rotation and/or translation) of the plurality of moving arms may facilitate or effectuate a change in the relative position of the attraction assembly 260, thereby enabling the pick and place mechanism 250 to pick, extract, or couple different sized assembly plates 50 (e.g., membrane frames 50).

In certain embodiments, the suction assembly 260 coupled or carried by each moving arm is displaceable relative to the moving arm of the pick and place mechanism 250 (e.g., along the length of the moving arm of the pick and place mechanism 250). Displaced along the moving arm, the attraction assembly 260 may change the relative position of the attraction assembly 260 such that the attraction assembly 260 of the pick and place mechanism 250 picks up, extracts, supports, and/or couples to different sized device plates 50 (e.g., membrane frames 50).

The ability of the pick and place mechanism or module 250 to pick, extract, process, support, or couple to different sized component boards 50 (e.g., membrane frames 50) allows the system 20 to process and/or transport different sized component boards 50 (e.g., membrane frames 50) without the need to change, replace, or modify particular components or assemblies of the system 20 (e.g., the pick and place mechanism 250). Thus, the ability of the pick and place mechanism 250 to pick, extract, process, support, or couple to component plates 50 (e.g., membrane frames 50) of different sizes results in a more robust and cost effective system 20 that may be easier, simpler, and/or less expensive to manufacture and/or assemble.

Examples of component plate alignment components, modules, or mechanisms (e.g., film frame alignment components, modules, or mechanisms)

As described above, in many embodiments, the component plate 50 (e.g., film frame 50) is spatially aligned before it is transferred from the component plate handler 160 (e.g., the first film frame handler 160a or the second film frame handler 160 b) to the pick and place mechanism 250.

In various embodiments, the film frame 50 is spatially aligned prior to the film frame 50 being transferred to the vacuum table assembly 300 (and more particularly, to the vacuum table 310 of the vacuum table assembly 300) to satisfy the alignment condition of the film frame 50 with respect to the vacuum table 310 for subsequent inspection or processing operations performed on the vacuum table 310.

Extracting or picking up the film frame 50 from the film frame handling member 160 (more specifically, from the surface of the end effector 170 of the film frame handling member 160) using suction; and coupling or holding the film frame 50 to the pick and place mechanism 250 during the transfer of the film frame 50 from the film frame handler 160 to the vacuum table assembly 300 may help preserve the spatial alignment or steering that the film frame 50 has established, completed, or substantially completed prior to transferring the film frame 50 to the pick and place mechanism 250.

The system 20 includes the module board alignment assembly, module, or mechanism 200 (e.g., the membrane frame alignment assembly, module, or mechanism 200). As shown in fig. 2G and 2H, in many embodiments of the present invention, the alignment module 200 is carried by the pick and place mechanism 250. The alignment module 200 may be coupled to the pick and place mechanism 250 at the pick and place mechanism 250 or near a peripheral edge or side of the pick and place mechanism 250 (i.e., along the perimeter of the pick and place mechanism 250), or carried by the pick and place mechanism 250.

In several embodiments, the alignment module 200 protrudes or extends a particular or predetermined distance from the peripheral edge or side of the pick and place mechanism 250. The protrusion or extension of the alignment module 200 at a distance from the peripheral edge or side of the pick and place mechanism 250 may help facilitate access of the alignment module 200 to the film frame 50. In other words, the alignment module 200 may be placed, positioned, or seated to allow easy, convenient, and/or unrestricted access by the alignment module 200 to the membrane frame 50.

Although in many embodiments the alignment module 200 is placed at or near the peripheral edge or side of the pick and place mechanism, it should be appreciated that alternative locations for the alignment module 200 outside of the film frame storage station 100 are also possible. For example, the alignment module 200 may be a stand-alone (standalone) system component, assembly, or structure; or may be coupled to or carried by another system component, element, or structure. In many embodiments, the alignment module 200 may be located at the periphery of the pick and place mechanism.

In particular embodiments, the alignment module 200 may include at least two alignment assemblies. Each of the at least two alignment assemblies may be arranged or placed at a distance from each other. In addition, each alignment element may be placed at a substantially diagonal line with respect to the registration groove 60 of a particular membrane frame 50 carried by the end effector 170 of the element frame handler 160.

In several embodiments, the end effector 170 can be displaced relative to the alignment assembly or module 200. The displacement of the end effector 170 relative to the alignment module 200 results in displacement of a component plate 50 (e.g., a membrane frame 50) carried by the end effector 170 relative to the alignment module 200.

The displacement of the end effector carrying the film frame 50 relative to (and more particularly, or towards) the alignment module 200 may facilitate or achieve spatial alignment of the film frame 50 in a manner that eliminates the need for further spatial alignment or substantial spatial alignment of the film frame 50. More specifically, the displacement of the end effector 170 may displace the film frame 50 it carries to the alignment module 200, or towards the alignment module 200, to bring the alignment module 200 into contact with the film frame 50 and/or to apply an external force to the film frame 50, or to the film frame 50 (more specifically, to the sides, edges, ends, or surroundings of the film frame 50).

In particular embodiments, wherein the alignment module 200 comprises two or more alignment assemblies, the displacement of the end effector 170 (and the film frame 50 carried thereby) to or toward the alignment module 200 may result in contact between the at least two alignment assemblies and at least two contact locations along the sides, edges, ends, or periphery of the film frame.

For example, the engagement of the membrane frame 50 (more specifically, the registration groove 60 of the membrane frame 50) to the registration member 180 of the end effector 170 may be achieved or enhanced by an external force applied to the membrane frame 50 (more specifically, to the sides, edges, ends, or periphery of the membrane frame 50) by the alignment module 200. More specifically, an external force applied to the membrane frame 50 (more specifically, to the sides, edges, ends, or periphery of the membrane frame 50) by the alignment module 200 may push the membrane frame 50 toward the registration assembly 180 carried by the end effector 170 to achieve or enhance the engagement between the registration groove 60 of the membrane frame 50 and the registration assembly 180 of the end effector. In various embodiments, the nesting groove 60 of the membrane frame 50 and the nesting component 180 of the end effector 170, or the nesting groove 60 of the membrane frame 50 and the nesting component 180 of the end effector 170 enhance the nesting to facilitate or achieve spatial alignment of the membrane frame 50 in a manner that eliminates the need for further spatial alignment or substantial spatial alignment of the membrane frame 50.

In various embodiments, the alignment assembly or module or position alignment assembly 200 contains or carries at least one spring loaded mechanism or element (not shown). The spring loaded mechanism or element may be referred to as a tensioned mechanism or element. The alignment module 200 containing the spring-loaded mechanism may be referred to as a spring-loaded position alignment assembly, module, or mechanism 200. The spring-loaded mechanism may be configured to enhance the spatial alignment of the film frame 50 achieved by the alignment module 200. In various embodiments, the alignment module 200 contains two or more spring-loaded mechanisms or elements.

In several embodiments, the spring-loaded mechanism of the alignment module 200 is configured to prevent, reduce, or limit deformation or damage of the membrane frame 50 during the positional alignment of the alignment module 200 to the membrane frame 50. In particular embodiments, the spring-loaded mechanism may be configured to absorb at least a portion of the external force applied to the membrane frame 50 when the membrane frame 50 is in contact with the alignment module 200. More specifically, the spring-loaded mechanism may be configured to absorb excessive or unnecessary external forces applied to the film frame 50 when the film frame 50 is in contact with the alignment module 200, thereby reducing, preventing, or eliminating deformation or damage of the film frame 50, for example, due to impact between the film frame 50 and the alignment module 200.

Although the spring-loaded mechanism described above is used to prevent, reduce, or limit deformation or damage of the membrane frame 50 during contact, and thus impact, of the membrane frame 5 with the alignment module 200, it should be appreciated that the spring-loaded mechanism may be replaced or supplemented by other mechanisms or modules, such as hydraulic piston mechanisms or modules. The hydraulic piston mechanism is configured to prevent, reduce, or limit deformation or damage of the membrane frame 50 during the positional alignment of the alignment module 200 to the membrane frame 50. The hydraulic piston mechanism may include a tube that supports or stores a volume of compressible fluid (e.g., liquid and/or gas) having a plurality of perforations sealed with a cover. When the membrane frame 50 is in contact with the hydraulic piston mechanism, part of the compressible fluid will flow out of the tube through the perforations and thus absorb, and thus reduce, external forces and impacts applied to the membrane frame 50.

In particular embodiments, the position alignment assembly or module, or alignment module 200, may include, carry, or be coupled to a sensor unit (not shown) configured to sense at least contact made between the film frame 50 and the alignment module 200, a component of an external force applied to the film frame 50 in response to contact made between the film frame 50 and the film frame position alignment assembly or alignment module 200, and an accuracy of a position and/or duration of contact made between the film frame 50 and the alignment module 200. Thus, the use of the sensor unit may aid in the implementation, monitoring, and/or enhanced positional alignment of the film frame 50 by the alignment module 200.

In certain embodiments of the present invention, the system 10 does not require the use of the membrane frame alignment module 200 for facilitating or achieving alignment (e.g., spatial alignment) of the membrane frame 50. In such embodiments, the movement or translation of the end effector 170 of a particular film frame handling member 160 as the film frame 50 is extracted from the film frame loading station 100 may be controlled in a manner that facilitates or effectuates alignment of the film frame 50. The movement of the end effector 170 can be controlled (e.g., by the computer software program) to facilitate or achieve alignment of the membrane frame 50 when, during, or after the registration grooves or marks 60 of the membrane frame 50 are engaged with the registration elements 180 of the end effector 170. Thus, in particular embodiments, the system 10 may omit the use of the film frame alignment module 200.

Examples of such vacuum Table Assembly 300

As described above, the spatial alignment of the component plate 50 (e.g., film frame 50) prior to transfer of the component plate 50 (e.g., film frame 50) to the vacuum table assembly 300 (and more particularly, to the vacuum table 310 of the vacuum table assembly 300) can eliminate the need for the vacuum table assembly 300 to contain and/or use any position alignment components, pins, structures, or mechanisms. The spatial alignment of the assembly plate 50 (e.g., film frame 50) prior to placing the assembly plate 50 (e.g., film frame 50) on the vacuum table 310 eliminates the need to additionally align the assembly plate 50 (e.g., film frame 50) relative to the vacuum table 310 after placing the assembly plate 50 (e.g., film frame 50) on the vacuum table 310. Accordingly, the vacuum table assembly 300 or the vacuum table 310 of the various embodiments of the present invention do not require, contain, or carry position alignment components, pins, structures, or mechanisms that are typically required by existing systems.

The vacuum table assembly 300 includes the vacuum table 310 and a translation device 320 coupled to the vacuum table 310. The translation device 320 may be configured or adapted to enable movement, or displacement of the vacuum table 310 in the X-axis, Y-axis, Z-axis, and/or theta-axis. The translation device 320 may be configured to control, determine, and/or effectuate the translation, displacement, and placement of the vacuum table relative to a particular portion of the inspection or processing station 350.

The vacuum table 310 comprises a planar or substantially planar surface configured to carry a film frame 50 and further configured to apply a vacuum force to the film frame 50 and its associated polymer film such that the film frame 50 (e.g., the film frame and its carried components) stays, holds, or maintains a fixed position or orientation during vacuum table translation and/or film frame inspection or processing operations.

In various embodiments, the vacuum table assembly 300 omits or eliminates registration components (e.g., component plate registration components (e.g., film frame registration components or alignment components) and other similar spatial alignment, steering, or positioning components or tools). In addition, in several embodiments, the vacuum table 310 omits or eliminates ejector pins. The vacuum table 310 may additionally omit or eliminate machined surface recesses, rings, or grooves (e.g., vacuum distribution rings). Eliminating the need to further align or steer the film frame 50 with respect to the space of the vacuum table 310, and thus the vacuum table assembly 300, and the need to carry nesting components (e.g., component board nesting components (e.g., film frame nesting components or alignment components) and other similar space alignment, steering, or positioning components or tools) as the film frame 50 is transferred to the vacuum table assembly 300, may increase the efficiency, robustness, simplicity of design, and/or cost effectiveness of the system 20 of the present invention.

As described above, the system 20 also includes the device inspection apparatus 350. The component inspection device 350 may be an optical inspection device or an image capture instrument configured to capture images of the component plate 50 (and more particularly, the membrane frame 50 or a particular portion thereof). The vacuum table 310, and thus the component plate 50 (e.g., film frame 50) carried by the vacuum table 310, may be displaced through a plurality of predetermined inspection positions (e.g., image capture positions) at which images of the component plate 50 (e.g., film frame 50) and portions thereof may be captured by the component inspection device 350 or an optical inspection device. The spatial alignment, steering, or position of the component plate 50 (e.g., the membrane frame 50) during inspection (e.g., image capture of the component plate 50 such as the membrane frame 50) is important for accurately determining the location of defects on the component plate 50 (e.g., the membrane frame 50).

After the film frame 50 is inspected by the component inspection device 350, the vacuum table 310 may be translated and placed to allow the pick and place mechanism 250 to extract, remove, or pick the film frame 50 from the vacuum table 310. An attractive or vacuum force is applied by at least one attractive element 260 of the pick and place mechanism 250 to extract, remove, or pick the film frame 50 from the vacuum table 310. The pick and place mechanism 250 then transfers the film frame 50 from the vacuum table 310 to the end effector 170 of the film frame handler 160.

In several embodiments of the present invention, the vacuum table 310 may also receive and carry a plurality of different sized (e.g., 6, 8, and/or 12 inch) components (more specifically, the film frame 50). The system 20 according to embodiments of the present invention facilitates or allows for the handling or inspection of a plurality of different sized film frames 50 without the need to change or modify the vacuum table 310. In various embodiments, the ability of the vacuum table 310 to carry membrane frames 50 of various sizes at least increases the robustness, cost effectiveness, and/or mechanical simplicity of the system 20, while eliminating the lack of efficiency associated with vacuum table or vacuum table assembly swapping (swap out) or modification when converting systems to handle different sized components (e.g., membrane frames 50).

Examples of typical Process or method embodiments

Fig. 3A and 3B illustrate a process 400 for handling, transporting, and aligning a component board 50 or a component frame 50, and more particularly a film frame 50, in accordance with certain embodiments of the present invention. The process 400 may be implemented, facilitated, implemented, and/or completed, in part, or in whole, using the system 20, or at least portions of the system 20.

In the first process portion 410, the first component board handler 160a (more specifically, the first film frame handler 160 a) is displaced to extract the first component board 50a (more specifically, the first film frame 50 a) from the component board storage station 100 (more specifically, the film frame storage station 100).

For example, the end effector 170a of the first module board handler 160a (more specifically, the first film frame handler 160 a) is displaced from a retracted, parked, or first position to an extended or second position to extract the first module board 50a (more specifically, the first film frame 50 a) from the module board storage station 100.

The first component board handler 160a (more specifically, the first end effector 170a of the first component board handler 160 a) may be aligned with a first component board 50a stored or carried by the component board storage station 100 (also referred to as the film frame storage station 100) (more specifically, aligned with a first component board 50a carried by the component board storage station 100 (e.g., by a component board storage unit or by a cassette carried by the component board storage station 100)) before shifting the first end effector 170a to extract the first component board 50a from the component board storage station 100.

Fig. 2A shows the first end effector 170a being aligned with the component board storage station 100 (more particularly, with the first component board 50a stored or carried by the component board storage station 100) prior to shifting the first end effector 170a to extract the first component board 50a from the component board storage station 100. Fig. 2B shows the displacement and positioning of the first end effector 170a in an extended position to extract the first component plate 50a from the component plate storage station 100. Fig. 2C shows the first component plate 50a carried by the first end effector 170a as the first component plate 50a is extracted from the component plate storage station 100.

In the second process portion 420, the second component plate handler 160b (more specifically, the end effector 170b of the second component plate handler 160 b) is displaced to extract the second component plate 50b from the component frame storage station 100. More specifically, for example, the second end effector 170b is displaced from a retracted, parked, or first position to an extended or second position to extract the second component plate 50b from the component plate storage station 100.

The second end effector 170b may align the component board storage station 100 (more particularly, a second component board 50b stored or carried by the component board storage station 100 (e.g., by a film frame storage unit of the film frame loading station 100) before shifting the second end effector 170b to extract the second component board 50b from the component board storage station 100.

The first and second component boards 50a, 50b are located or disposed at different vertical heights in the component board storage unit of the component board storage station 100 (e.g., stacked one on top of the other), and therefore, the first end effector 170a and the second end effector 170b must be located at different heights or elevations (elevations) to accurately extract the first and second component boards 50a, 50b, respectively, from the component board storage unit.

Fig. 2D shows the second end effector 170b displaced and placed into the extended position to extract the second component plate 50b from the component plate storage station 100. Fig. 2E shows a second component board 50b carried by the second end effector 170b when the second component board 50b is extracted from the component board storage station 100. As seen in fig. 2E, the first and second component plate handlers 160a and 160b (more specifically, the first end effector 170a carrying the component plate 50a and the second end effector 170b carrying the second component plate 50 b) are located at different elevations or heights relative to each other (i.e., the first end effector 170a carrying the component plate 50a is disposed above the second end effector 170b carrying the second component plate 50b as seen in fig. 2E).

The end effectors 170 (e.g., the first and second end effectors 170a, 170 b) of the first and second component plate handlers 160a, 160b may be displaced synchronously, or substantially synchronously, to increase the efficiency of extracting component plates 50 (e.g., first and second component plates 50a, 50b, or first and second membrane plates 50a, 50 b) from the component plate storage station 100 (more specifically, the membrane frame storage station 100). For example, the displacement of the first and second end effectors 170a, 170b may be accomplished in a controlled, sequential, and/or continuous manner. The relative displacement of the first and second end effectors 170a, 170b of the first and second component board handlers 160a, 160b may be determined or controlled by the computer software program (i.e., a set of program instructions) executed by a computer system or appliance coupled to the component board transfer module 150.

As described above, each of the first component plate handler 160a and the second component plate handler 160b may be coupled to an actuator that effects displacement of the first component plate handler 160a, the second component plate handler 160b, and the first and second end effectors 170a, 170b of the first and second component plate handlers 160a, 160 b.

In various embodiments, the end effector 170 includes at least one vacuum or suction module, vent, gap, or opening 190 to assist in extracting the component plate 50 from the component plate storage station 100 and/or securing the component plate 50 to the end effector 170 during displacement of the end effector 170. The at least one vacuum or suction module 190 may be located at or near the socket assembly 180 of the end effector 170. At least one vacuum or suction module 190 of a particular end effector 170 may be provided such that a vacuum or suction is applied at or near an edge or perimeter of the component plate 50 carried by the end effector 170. In various embodiments, the vacuum or suction applied to a particular component plate 50 (e.g., membrane frame 50) by the at least one vacuum or suction module 190 may be controlled and/or adjusted as desired, for example, depending on the size of the component plate 50 and/or the speed of displacement of the end effector 170.

In the third process portion 430, the first and second end effectors 170a, 170b of the first and second component plate handlers 160a, 160b are displaced (more specifically, rotated) to place the component plates 50a, 50b carried thereby in a desired or target position relative to the pick and place mechanism or arm 250. In many embodiments, the first and second end effectors 170a, 170b of the first and second component plate handlers 160a, 160b are displaced (more specifically, rotated) to place the component plates 50a, 50b carried thereby in a desired or target position relative to the alignment module 200. The alignment module 200 may be carried by the pick and place mechanism 250. However, in certain embodiments, the alignment module 200 is indirectly coupled to the pick and place mechanism 250 or disposed adjacent, proximate, or near the pick and place mechanism 250.

Fig. 2F and 2G show the position of the first and second component plates 50a, 50b relative to the alignment module 200 carried by the pick and place mechanism 250. In many embodiments, in the third process portion 430, the first and second end effectors 170a, 170b of the first and second component plate handlers 160a, 160b are displaced (more specifically, rotated) so that the component plates 50a, 50b carried thereby are accurately or properly positioned for spatial alignment by the alignment module 200.

In the fourth process portion 440, the first component plate handler 160a (more specifically, the end effector 170a of the first component plate handler 160 a) is displaced relative to the alignment module 200. The displacement of the end effector 170a relative to the alignment module 200 causes a corresponding displacement of the first component plate 50a to which it is coupled relative to the alignment module 200.

More specifically, the first end effector 170a is shifted to the alignment module 200 or toward the alignment module 200 in the fourth process portion 440. The first component plate 50a is displaced to the alignment module 200, or towards the alignment module 200, and contact between the first component plate 50a and the alignment module 200 is achieved. Contact between the first component board 50a and the alignment module 200 may cause the alignment module 200 to apply an external force (e.g., a contact, push, or small impact force) to a particular portion (e.g., one or more contact points) of the periphery, edge, side, or end of the first component frame 50 a.

In various embodiments, the first component plate 50a can be displaced relative to the alignment module 200 by applying a force to the first component plate 50a to urge the first component plate 50a against the nesting component 180 of the first end effector 170 a. More specifically, the first component plate 50a can apply an external force to a specific portion of the periphery, edge, side, or end of the first component plate 50a to achieve or enhance the engagement between the nesting groove 60 of the first component plate 50a and the nesting component 180 of the first end effector 170a, and to displace relative to the alignment module 200.

The engagement or enhanced engagement between the first component plate 50a (and more particularly, the registration groove 60 of the first component plate 50 a) and the registration component 180 of the first end effector 170a facilitates or achieves spatial alignment, or at least substantial spatial alignment, of the first component plate 50 a. In many embodiments, the engagement or enhanced engagement between the first component plate 50a and the nesting component 180 of the first end effector 170a achieves spatial alignment of the first component plate 50a in a manner that eliminates the need for further spatial alignment or substantial spatial alignment of the first component plate 50 a.

As described above, the alignment module 200 may include a spring loaded mechanism (or tensioned element). The spring-loaded mechanism is configured to absorb at least a portion of the external forces associated with contact between the membrane plate 50 (e.g., the first and second component plates 50a, 50 b) and the alignment module 200. In several embodiments, the spring-loaded mechanism is configured to reduce, prevent, or eliminate deformation or damage of the component plate 50 (e.g., the first and second component plates 50a, 50 b) due to the alignment module 200 applying excessive external forces (e.g., excessive, unwanted, or unexpected contact or pushing external forces) to the component plate 50. In many embodiments, the alignment module 200 may include two or more spring-loaded mechanisms or elements.

Fig. 2H shows the displacement of the first end effector 170a and the first component plate 50a carried thereby relative to the alignment module 200 carried by the pick and place mechanism 250 such that a particular portion of the peripheral edge, side, or end of the first component plate 50a makes contact with the alignment module 200.

The alignment module 200 can be pushed against the periphery, edge, side, or end of the first component plate 50a and effect or enhance the engagement between the first component plate 50a and the nest element 180 of the first end effector 170a to effect spatial alignment of the first component plate 50a in a manner that removes further spatial alignment of the first component plate 50a (i.e., in a manner that satisfies alignment requirements in subsequent processing or inspection processes).

Although in the fourth process portion 440 of many embodiments of the present invention, alignment of the film frame 50 is facilitated or achieved using the alignment module 200, it should be appreciated that in particular embodiments, alignment of the film frame 50 may be facilitated or achieved at, during, or after the end effector 170 extracts the film frame 50 (e.g., when the registration groove or mark 60 of the film frame 50 engages with the registration assembly 180 of the end effector 170 at the film frame loading station 100). As described above, the movement or translation of the end effector 170 may be controlled such that alignment of the film frame 50 is facilitated or achieved when, during, or after the end effector 170 extracts the film frame 50 (e.g., when the registration groove or mark 60 of the film frame 50 engages with the registration assembly 180 of the end effector 170 at the film frame loading station 100).

In the fifth process portion 450, the first component plate 50a is transferred from the first component plate handler 160a (more specifically, the first end effector 170 a) to the pick and place mechanism 250, as shown in fig. 2I and 2J.

In many embodiments, in the fifth process portion 450, the first end effector 170a is displaced to place the first component plate 50a carried thereby under the pick and place mechanism 250. More specifically, the end effector 170a is displaced to align the first component plate 50a relative to at least one suction component 260 of the pick and place mechanism 250. Aligning the first component plate 50a relative to the at least one suction component 260 of the pick and place mechanism 250 helps to ensure that the first component plate 50a is accurately transferred from the first end effector 170a to the pick and place mechanism 250.

Each end effector 170a, 170b and the pick and place mechanism 250 are configured to perform x-axis, y-axis, z-axis, and/or theta-axis movements or displacements. In several embodiments, the first end effector 170a and the pick and place mechanism 250 are displaced relative to each other along the z-axis (i.e., vertically) to facilitate the first component plate 50a being transferred from the first end effector 170a to the pick and place mechanism 250.

In some embodiments, the pick and place mechanism 250 is displaced (i.e., vertically displaced) along the z-axis toward the first end effector 170a (more specifically, the first component plate 50a carried by the first end effector 170 a) to facilitate or effect the picking or extraction of the first component plate 50a from the end effector 170 a. In other embodiments, the first end effector 170a is displaced along the z-axis toward the pick and place mechanism 250 to facilitate picking or extracting the first component plate 50a from the first end effector 170a by the pick and place mechanism 250.

As described above, the pick and place mechanism 250 includes the at least one suction element 260, the at least one suction element 260 configured to apply or provide a suction or vacuum force to facilitate or effectuate the picking of the component plate 50 (e.g., the first component plate 50a, and in typical implementations the first membrane frame 50 a) from the end effector 170. The assembly plate 50 is lifted from the surface of the end effector 170 during the time that the assembly plate 50 can be picked or extracted from the end effector 170 using an attractive or vacuum force to pick the assembly plate 50 from the end effector 170. The suction or vacuum force applied to the component plate 50 by the at least one suction element 260 may be controlled and/or adjusted, for example, depending on the size of the component plate 50 to be picked up by the pick and place mechanism 250 and/or the speed of displacement of the pick and place mechanism 250. The at least one suction assembly may be displaced to different predetermined positions so as to be able to pick up assembly plates 50 (e.g., membrane frames 50) of different sizes.

In several embodiments, the pick and place mechanism 250 includes a plurality (i.e., at least two) of attraction elements 260. The plurality of suction elements 260 may be displaced and placed at different positions relative to each other to pick up or extract different sized component plates 50 (e.g., film frames 50) from the end effectors 170 of the component frame handlers 160. As described above, in particular embodiments, the pick and place mechanism 250 can include at least one moving arm, each of which carries at least one suction assembly 260. Each mobile arm is displaceable to displace and position at least one suction assembly 260 carried thereby toward a target or destination location. Alternatively, or in addition, at least one suction element 260 carried by each mobile arm may be displaced along the mobile arm to place a target or destination of another suction element 260 carried by another mobile arm of the pick and place mechanism 250.

The ability of the attraction components 260 of the pick and place mechanism 250 to be displaced and placed at different positions relative to each other enables the attraction components 260, and thus the pick and place mechanism 250, to pick up or extract component frames 50 (e.g., film frames 50) of different sizes. The ability of the pick and place mechanism 250 to pick up or retrieve component plates 50 (e.g., film frames 50) of different sizes eliminates the need to replace the pick and place mechanism to process and/or transport component plates 50 (e.g., film frames) of different sizes (as is required with existing film frame processing and/or transport systems). Thus, the system 20 of various embodiments of the present invention is more versatile, convenient, and cost effective to operate.

In the sixth process portion 460, the first component plate 50a (e.g., first film frame 50 a) is transferred to the vacuum table assembly 300 (more specifically, to the vacuum table 310 of the vacuum table assembly 300) by the pick and place mechanism 250. Fig. 2K shows the first component board 50a being transported and placed on the vacuum table 310.

The pick and place mechanism 250 may be displaced (e.g., translatable) to place the first component plate 50a carried thereby in a desired or target position relative to the vacuum table 310. For example, the pick and place mechanism 250 may be displaced to place the first component plate 50a above the vacuum table 310.

Once the first component board 50a is placed above the vacuum table 310, the pick and place mechanism 250 may then be vertically displaced (e.g., vertically displaced downward) to displace the first component board 50a it carries toward the vacuum table 310. In various embodiments, the pick and place mechanism 250 may be vertically displaced to place the first component plate 50a on the vacuum table 310. The application of suction to the first component plate 50a by the set of suction elements 180 may be reduced, substantially reduced, not applied, or stopped to facilitate or effectuate the release of the first component plate 50a on the vacuum table 310.

In many embodiments, removal of a vacuum table conventionally requires the inclusion of ejector pins for receiving the component plate 50 (e.g., film frame 50) thereon by reducing, substantially reducing, or stopping the application of an attractive or vacuum force to the component plate 50 (e.g., film frame 50) to release the component plate 50 (e.g., film frame 50) on the vacuum table 310. Removing the vacuum table requires the use of ejector pins to receive or accept the component board 50 (e.g., film frame 50) thereon, helping to reduce the manufacturing cost of the vacuum table, and/or increasing the ease, efficiency, and safety of transferring the component board 50 (e.g., film frame 50) onto the vacuum table. Thimble

In the seventh process portion 470, the vacuum table 310 is translated to displace or translate the first component board 50a carried thereby to the inspection device 350 (e.g., a film frame inspection device or a component board inspection device), as shown in FIG. 2L.

Translation of the vacuum table 310 may be accomplished by a vacuum table translation mechanism 320 coupled to the vacuum table 310. The vacuum table translation mechanism 320 may be configured such that the vacuum table 310 may move or shift along one or more of the x-, y-, z-, and theta-axes.

An eighth process portion 480 involves the inspection device 350 inspecting the first component board 50a (e.g., the first film frame 50 a). The inspection device 350 may be an optical inspection device configured to capture images, or portions thereof, of the film frame 50 and any components carried thereby. The inspection device 350 may alternatively or additionally be configured to capture images of other component panels and component frames 50 (e.g., solar wafer panels), or portions thereof. The captured image or a portion of the image of the component board 50 may be transmitted to a computer system or appliance coupled to the optical inspection device. Captured images of the component board 50 (e.g., the membrane frame 50) and any components carried thereby and portions of the images may be stored and/or processed by the computer system. The captured images of the component plate 50 (e.g., the membrane frame 50) and any components carried thereby, and the processing of portions of the images, may facilitate the detection of any defects present on the surface of the component plate 50 (e.g., the membrane frame 50) and any components carried thereby.

After inspecting the first assembly plate 50a (e.g., first film frame 50 a) and any components carried thereby, then in a ninth process portion 490, the first assembly plate 50a (e.g., first film frame 50 a) and any components carried thereby are transferred from the vacuum table 310 to the assembly plate unloading interface (e.g., film frame unloading interface). The module board unloading interface (e.g., film frame unloading interface) may be part of the module board storage station 100 (e.g., film frame loading station 100). Alternatively, the module board unloading interface (e.g., film frame unloading interface) may be a separate system component, structure, or unit as compared to the module board storage station 100 or film frame loading station 100.

The transfer of the first module board 50a (e.g., first film frame 50 a) from the vacuum table 310 to the module board unloading interface (e.g., film frame unloading interface such as a film frame cassette or rack) is depicted in fig. 2P-2U.

In many embodiments, the ninth process portion 490 involves the pick and place mechanism 250 picking or extracting the first component plate 50a (e.g., the first film frame 50 a) from the vacuum table 310. Picking or extracting the first component panel 50a from the vacuum table 310 may be accomplished by applying suction by at least one suction component 260 of the pick and place mechanism 250.

Suction by the pick and place mechanism 250 is used to pick or extract component boards 50 from the vacuum table 310, eliminating or eliminating the conventional or current need to use ejector pins to eject or lift component boards or component frames (e.g., film frames or solar wafer panels) a distance from a conventional vacuum table, thereby allowing conventional component board handlers to pick or extract component boards or component frames from the conventional vacuum table. In addition, during the process of picking or extracting the component board 50 from the vacuum table 310, the external vacuum force applied to the surface of the component board 50 will be substantially reduced, not applied, or stopped to facilitate or effectuate the release of the component board 50 such that the pick and place mechanism 250 can easily pick up the component board 50 without substantially damaging the component board 50.

The system 20 of many embodiments of the present invention, and more particularly, the vacuum table 310 of the system 20, may omit pins, or similar pins, components, or mechanisms having similar functions. The system 20 of various embodiments of the present invention, without the ejector pin, reduces the complexity and/or manufacturing and/or operating costs of the system 20.

The ninth process portion 490 also involves transferring the first component plate 50a (e.g., first film frame 50 a) from the pick and place mechanism 250 to the first component plate handler 160a (and more specifically to the first end effector 170a of the first component plate handler 160 a). Suction may be continuously applied to the first component plate 50a to support, couple, or secure the first component plate 50a to the pick and place mechanism 250 during the transfer of the first component plate 50a from the vacuum table 310 to the first end effector 170a of the first component plate handler 160 a. To release the first component plate 50a on the first end effector 170a of the first component plate handler 160a, the suction applied to the first component plate 50a by the set of vacuum or suction elements 260 of the pick and place mechanism 25 may be reduced, substantially reduced, or stopped.

The first component board handler 160a can then be rotated and/or shifted to carry the first end effector 170a of the first component board 50a for transferring the first component board 50a to the component board unloading interface.

As described above, in most embodiments, the system 20 includes a plurality of module board handlers 160 (e.g., film frame handlers 160) to handle and/or transport module frames 50 (e.g., film frames 50). For example, the system 20 can include the first component plate handler 160a (e.g., first film frame handler 160 a) and the second component plate handler 160b (e.g., second film frame handler 160 b). Multiple component board handlers 160 may be used to handle and/or transport component boards 50, helping to increase the efficiency and/or throughput of the system 20. Conventional systems for processing component boards or component frames, and which only include one component board handler for processing and/or transporting component boards, are generally associated with lower throughput and efficiency.

In many embodiments, after the first component board 50a (e.g., first film frame 50 a) and any components carried thereby are inspected, the first component board 50a (e.g., first film frame 50 a) is transferred or removed from the pick and place mechanism 250 back to the first component board handler 160a or film frame handler 160a, and the second end effector 170b of the second component board 50b (e.g., second film frame 50 b) and the second component board handler 160b carried thereby may then be transferred to the pick and place mechanism 250 for transfer to the vacuum table assembly 300.

The transfer of the second component plate 50b from the second end effector 170b of the second component plate handler 160b to the pick and place mechanism 250 can occur immediately, or substantially immediately, after the first component plate 50a is removed from the pick and place mechanism 250. Thus, the operation and use of the pick and place mechanism 250 may be optimized. In other words, the length of downtime (or the time that the pick and place mechanism 250 is idle or not being used to process and/or transport component plates 50, such as membrane frames 50) may be reduced.

The use of multiple component plate handlers 160 (e.g., at least the first and second component plate handlers 160a, 160 b) may increase the speed or efficiency of the transfer of component plates 50 (e.g., film frames 50) to and from the pick and place mechanism 250. Thus, the use of multiple component plate handlers 160 may increase the efficiency and/or throughput of the system 20.

In many embodiments, the second component plate handler 160b and the second end effector 170b of the second component plate handler 160b are configured and/or operated similarly or substantially similarly to the first component plate handler 160a and the end effector 170a of the first component plate handler 160 a.

As with the first component board 50a, the second component board 50b may also be aligned prior to transferring the second component board 50b to the vacuum table assembly 300 (and more specifically, to the vacuum table 310 of the vacuum table assembly 300). Further, in many embodiments, the second component plate 50b, like the first component plate 50a, is spatially aligned prior to transferring the second component plate 50b from the second end effector 170b to the pick and place mechanism 250.

Spatial alignment of the second component plate 50b (e.g., the second film frame 50 b) carried by the second end effector 170b of the second component plate handler 160b may be achieved in the tenth process portion 500. The spatial alignment of the second component plate 50b may be achieved in a manner similar, or substantially similar, to the spatial alignment of the first component plate 50a in the fourth process portion 440.

In many embodiments, spatial alignment of the second component plate 50b (i.e., the tenth process portion 500) involves displacing an end effector 170b (also referred to as the second end effector 170 b) of the second component plate handler 160b and correspondingly displacing a corresponding second component plate 50b carried by the end effector 170b relative to the alignment module 200.

The second end effector 170b of the second component plate handler 160b can be aligned (e.g., vertically aligned along the same plane) with the alignment module or alignment component or position alignment module 200 prior to shifting the second end effector 170b relative to the alignment module 200. In other words, at least one second end effector 170b and the pick and place mechanism 250 can be displaced in the z-axis to vertically align (i.e., along the same plane) a second component plate 50b carried by the second end effector 170b with the position alignment module 200.

The displacement of the second end effector 170b to or toward the alignment module 200 and the corresponding displacement of the second component plate 50b to or toward the alignment module 200 may effect contact between the second component plate 50b and the alignment module 200. In several embodiments, the displacement of the second end effector 170b to or toward the alignment module 200 displaces the second component plate 50b to or toward the alignment module 200 in a manner that causes the alignment module 200 to apply an external force to a particular portion of the perimeter, side, edge, or end of the second component plate 50 b.

The engagement between the second component plate 50b (more specifically, the engagement groove 60 of the second component plate 50 b) and the engagement element 180 of the second end effector 170b can be achieved or enhanced by the alignment element 200 applying an external force to a specific portion of the periphery, side, edge, or end of the second component plate 50 b. Achieving or enhancing the engagement between the second component plate 50b (and more specifically, the registration groove 60 of the second component plate 50 b) and the registration component 180 of the second end effector 170b can eliminate the need for further spatial alignment of the second component plate 50b, facilitating or achieving spatial alignment of the second component plate 50 b.

In the eleventh process portion 510, the spatially aligned second component plate 50b (e.g., the second film frame 50 b) is transferred from the second end effector 170b of the second component plate handler 160b to the pick and place mechanism 250. In most embodiments, the transfer of the second assembly plate 50b from the end effector 170b to the pick and place mechanism 250 and the transfer of the first assembly plate 50a from the first end effector 170a to the pick and place mechanism 250 occur in a similar, or substantially similar, manner.

In the case where the first and second component plates 50a, 50b have the same dimensions, the at least one suction component 260 of the pick and place mechanism 250 need not be displaced between processing of the first and second component plates 50a, 50 b. It is to be appreciated that in the case of the first and second component plates 50a, 50b having the same dimensions, the at least one suction component 260 of the pick and place mechanism 250 need not change or adjust its position between processing of the first and second component plates 50a, 50 b. However, when the second component board 50b is of a different size than the first component board 50a, the at least one suction component 260 of the pick and place mechanism 250 may be displaced or placed at different predetermined locations, thereby allowing or enabling the picking or extraction of second component boards 50b of different sizes.

In the twelfth process portion 520, the second component plate 50b (e.g., second film frame 50 b) is transferred to the vacuum table assembly 300 (more specifically, to the vacuum table 310 of the vacuum table assembly 300) by the pick and place mechanism 250. The transfer of the second component board 50b from the pick and place mechanism 250 to the vacuum table 310 and the transfer of the first component board 50a from the pick and place mechanism 250 to the vacuum table 310 occur in a similar, or substantially similar, manner.

Vacuum is used to transfer the second assembly plate 50b to the vacuum table 310, removing the ejector pins required in conventional vacuum tables. In addition, the use of suction or vacuum pads 180 (whose position can be adjusted) allows for different sizes of component plates 50 (e.g., membrane frames 50) to be transferred onto the vacuum table. Conventional vacuum tables may require multiple sets of ejector pins, each set of ejector pins for receiving a particular size component plate (e.g., a film frame, and a film frame along with any components it carries) to receive multiple sizes of component plates (e.g., a film frame, and a film frame along with any components it carries) on the conventional vacuum table. Thus, the system 20 of various embodiments of the present invention is more versatile, cost effective, and efficient than many conventional systems for handling, transporting, and aligning component plates (e.g., membrane frames).

In a thirteenth process portion 530, the vacuum table 310 is translated (e.g., in at least one of x-axis, y-axis, z-axis, and theta-axis directions) to translate or displace the second component plate 50b or film frame 50b and any components carried thereby relative to (and more particularly, to or toward) the inspection apparatus 350 to facilitate inspection of the second component plate 50b or film frame 50b and any components carried thereby by the inspection apparatus 350. The vacuum table 310 may be translated or shifted through a predetermined plurality of predetermined inspection stations (e.g., image capture positions) at which the second component plate 50b or film frame 50b and any components carried thereby may be inspected (e.g., at which images of the second component plate 50b or film frame 50b and any components carried thereby may be captured).

2R-2Y illustrate the transfer of the second component plate 50b (e.g., second film frame 50 b) from the second end effector 170b to the pick and place mechanism 250; subsequently transferring the second assembly sheet 50b (e.g., second film frame 50 b) from the pick and place mechanism 250 to the vacuum table 310; and, translating or displacing the vacuum table 310, and thus the second assembly plate 50b (e.g., second film frame 50 b), to the inspection device 350, or toward the inspection device 350.

As shown in fig. 2R to 2Y, the second component board 50b (e.g., the second film frame 50 b) is picked up by the pick and place mechanism 250; transferring the second component plate 50b from the pick and place mechanism 250 to the vacuum table 310; and translating or displacing the vacuum table 310 and its carried second component plate 50b to the inspection apparatus 350 concurrently with a fourteenth process portion 540, the fourteenth process portion 540 including unloading the first component plate 50a from the first end effector 170a to the component plate unloading interface and retrieving the next (i.e., third) component plate 50c from the component plate storage station 100 (e.g., film frame storage station 100).

After inspecting the first component plate 50a, the second component plate handler 160b and the second end effector 170b are waiting to receive the second component plate 50b, the first component plate handler 160a and the first end effector 170a are working or operating (e.g., being displaced) to extract the next (i.e., third) component plate 50c (e.g., third film frame 50 c) from the component plate storage station 100 or the film frame loading station. In this manner, the third component plate 50c may be prepared for alignment using the alignment module 200; and immediately, or substantially immediately, to the pick and place mechanism 250 when the second component plate 50b is transferred from the pick and place mechanism 250 to the second end effector 170b or the second component plate 50b is removed from the pick and place mechanism 250. Simultaneously, or at least partially simultaneously, the transfer of the second component board 50b to the vacuum table assembly 300 for inspection by the inspection device 350, and the transfer or unloading of the first component board 50a to the component board unloading interface and the extraction of the next or third component board 50c from the component board storage station 100 (e.g., film frame storage station 100).

Those skilled in the art will appreciate from the foregoing disclosure that the use of a plurality of component plate handlers 160 or film frame handlers 160 (e.g., at least the first and second component plate handlers 160a, 160b or at least the first and second film frame handlers 160a, 160 b) and a corresponding plurality of end effectors 170 (e.g., at least the first and second end effectors 170a, 170 b) may increase the efficiency and/or throughput of the system 20. The use of multiple component frame handlers 160 and end effectors 170 allows a next or next component frame 50 (e.g., a membrane frame 50) (e.g., the second or third component frame 50b, 50 c) to be placed, immediately or substantially immediately aligned by the position alignment module 200 and/or immediately or substantially immediately picked by the pick and place mechanism 250 when a previous component frame 50 (e.g., the first or second component frame 50a, 50b, respectively) is removed from the pick and place mechanism 250.

Furthermore, in several embodiments, spatial alignment of the component plates (e.g., membrane frames) is easy, efficient, and/or simple by the alignment module 200. Carrying or coupling the alignment module 200 to the pick and place mechanism 250 eliminates the need for separate or independent system components or structures to achieve spatial alignment of component frames 50 (e.g., membrane frames 50), which can increase the complexity and manufacturing cost of the system 20. Further, in various embodiments, the alignment module 200 is located at or near a side, edge, or periphery of the pick and place mechanism 250, thereby facilitating easy, convenient, and/or unrestricted access to component boards 50 (e.g., film frames 50).

A simple relative displacement between a particular component plate 50 and the alignment module 200 may result in the application of an external force to or towards a particular portion of the periphery, side, edge, or end of the component plate 50 (e.g., the membrane frame 50), and thereby effect or enhance the engagement between the component plate 50 (or the registration groove 60 of the component plate 50) and the registration component 180 of the end effector 170 carrying the component plate 50, thereby effecting spatial alignment of the component plate 50. The implementation or enhancement between the assembly plate 50 (or the nesting grooves 60 of the assembly plate 50) and the end effector 170 carrying the nesting assemblies 180 of the assembly plate 50 may eliminate the need to further spatially align the assembly plate 50 relative to the vacuum table 310 to achieve spatial alignment of the assembly plate 50. Furthermore, in particular embodiments, the implementation or enhancement between the component plate 50 (or the nesting grooves 60 of the component plate 50) and the end effector 170 carrying the nesting components 180 of the component plate 50 may eliminate the need to implement spatial alignment of the component plate 50 by further spatially aligning the component plate 50 prior to fixedly holding the component plate 50 to the vacuum table 310 by applying a securing external force (e.g., vacuum or suction) to the component plate 50. In several embodiments, the configuration, shape, and/or design of the alignment module 200 is simple to facilitate construction and/or assembly of the alignment module 200.

Embodiments of the present invention relate to systems, apparatus, devices, methods, processes, or techniques for processing and/or transporting component boards or component frames (e.g., film frames). Although the description provided above of the various embodiments of the invention is related, or essentially related, to the film frame. It will be appreciated, however, that other types of components (e.g., other types of semiconductor-related components such as wafers, electrical components such as PCBs, and solar cells or modules or solar panels shaped like wafers) may also be processed, transferred, and/or aligned by the systems, apparatus, devices, methods, processes, or techniques of the various embodiments of the present invention.

The system of many embodiments comprises a plurality of component board handlers (e.g., film frame handlers) configured to extract component boards (e.g., film frames) from the component board load/unload station or the film frame storage station (e.g., film frame load/unload station) and transfer the component boards (e.g., film frames) between the component board load/unload station and the pick and place mechanism. The use of multiple component board handlers to transfer component boards between the component board loading/unloading station and the pick and place mechanism may help increase the efficiency of transferring component boards between the component board loading/unloading station and the pick and place mechanism.

The system of many embodiments includes the alignment assembly or module, which may be carried by or coupled to the pick and place mechanism. The alignment assembly is configured to align (e.g., spatially align) the component board prior to transferring the component frame to the vacuum table assembly (more specifically, to the vacuum table of the vacuum table assembly) or to the pick and place mechanism. In many embodiments, the alignment elements are positioned or configured to facilitate easy, convenient, unrestricted, or at least substantially unrestricted access to the component plates (e.g., the film frames carried by the end effectors). The components carried by the end effectors of the component plate handlers are displaceable relative to the alignment assembly. Displacing a particular component frame relative to the alignment component may result in contact between the component board and the alignment component, and application of an external force to the component board by the alignment component. The engagement between the component plate (more specifically, the nesting groove of the component plate) and the nesting component of the end effector can be achieved or enhanced by applying a force to the component plate (e.g., by applying a pushing force against the side or edge of the component plate). Achieving or enhancing the engagement between the component plates (and more particularly the nesting grooves of the component plates) and the nesting components of the end effectors may facilitate or achieve spatial alignment of the component plates.

Coupling the alignment assembly to the pick and place mechanism may contribute to a simplified design of the system, and the alignment assembly may be constructed, configured, and/or placed relative to other component boards of the system in a manner that reduces costs associated with manufacturing and/or operating the system. In addition, the alignment assembly may be configured (e.g., with at least one spring-loaded mechanism) to reduce contact impact between the alignment module and the assembly plate. This will reduce, prevent, or eliminate the possibility of deformation or damage to the component board upon such contact.

The system of many embodiments is configured so that component boards processed or transported by it can be properly spatially aligned before they are transported and placed on the vacuum table. This eliminates the need for the vacuum table to carry or contain alignment components, pins, mechanisms, or tools. This may help reduce the complexity of the system configuration, and more specifically, the complexity of the vacuum table assembly, and/or the costs associated with the manufacture and/or operation of the system (and more specifically, the vacuum table assembly).

The pick and place mechanism of many embodiments includes at least one suction element configured to apply a suction or vacuum force to the film frame to support, couple, or secure the component plate (e.g., film frame) to the pick and place mechanism. The pick and place mechanism may be configured to pick or extract component boards (e.g., from the component board handler or the vacuum table) by an attractive or vacuum force applied by at least one attractive component of the pick and place mechanism. Release of the component panel from the pick and place mechanism (e.g., from the vacuum table) is then achieved by discontinuing application of suction or vacuum force by at least one suction component of the pick and place mechanism. The use of an attractive or vacuum force to pick up a component panel (e.g., film frame) from the vacuum table eliminates the need for ejector pins to pick up the component panel from the vacuum table, as is typically required by many current vacuum tables. In addition, at least one of the suction elements of the pick and place mechanism may be variably displaced and placed at different locations to facilitate or enable coupling, supporting, and/or securing of component boards of different sizes to the pick and place mechanism.

Particular embodiments of the present invention have been described to address at least one of the problems previously posed. While features, functions, advantages, and alternatives associated with certain embodiments have been described within the scope of those embodiments, other embodiments may also exhibit similar advantages, and not all embodiments need necessarily be described in this disclosure to exhibit similar advantages. It will be appreciated that some of the above-disclosed structures, features, and functions, or alternatives thereof, may be desirably combined into other different devices, systems, or applications. The above-disclosed structures, features, and functions, or alternatives thereof, as well as various presently unforeseen or unanticipated alternatives, modifications, variations or improvements therein may be subsequently made by those skilled in the art, are also intended to be encompassed by the following claims.

Claims (26)

1. A system for processing component boards, comprising:

at least one module board handler, each module board handler including an end effector configured to extract a module board from the module board storage station; said at least one component plate handler being coupled to a registration assembly on said end effector, said registration assembly on said end effector being configured to fit into a corresponding set of registration grooves on a component plate carried by said end effector to effect alignment of said component plates; and

an alignment module disposed at a location outside the component board storage station,

wherein relative displacement between the end effector of each of the at least one component board handler and the alignment module towards each other causes at least part of the extremity of the component board carried by the end effector to contact the alignment module to effect application of an external force on the component board and thereby displace the component board such that the set of nesting grooves on the component board engage with the nesting components of the end effector.

2. The system of claim 1, wherein the at least one component plate handler comprises at least one robotic arm.

3. The system of claim 2, further comprising a vacuum table assembly, wherein the vacuum table assembly is free of nesting components, and wherein the vacuum table assembly is capable of receiving component boards having different dimensions.

4. The system of claim 3, further comprising a pick and place mechanism configured to retrieve the component plates and to retrieve the component plates from the end effector and transfer the component plates to the vacuum table assembly or to retrieve the component plates from the vacuum table assembly and transfer the component plates to the end effector.

5. The system as recited in claim 4, wherein the vacuum table assembly for receiving component boards is translatable for positioning component boards carried thereby relative to the inspection device for inspection.

6. The system as recited in claim 4, wherein said pick and place mechanism comprises:

a plurality of displacement arms, each of the displacement arms including at least one attraction assembly along a length thereof, the at least one attraction assembly configured to capture an assembly plate; the plurality of displacement arms are displaceable between a plurality of sets of predetermined positions, each of the plurality of sets of predetermined positions corresponding to component plates having different shapes and/or sizes; and

a position control mechanism coupled to the plurality of displacement arms, the position control mechanism configured to control displacement of the plurality of displacement arms toward a predetermined position from one of the plurality of predetermined positions corresponding to a shape and/or size of a component plate during processing,

wherein the displacement of the plurality of displacement arms causes displacement of the at least one suction assembly towards the set of predetermined positions to retrieve and process the assembly plate having the corresponding predetermined shape and/or size.

7. The system as claimed in claim 6, wherein each of said at least one suction assembly on each of the plurality of displacement arms of the pick and place mechanism effects the picking, transfer and displacement of said component plates between the end effector and said vacuum table assembly, respectively, by applying, continuously applying or not applying vacuum suction to the component plate surface.

8. The system of any one of claims 6 or 7, wherein the at least one suction assembly is displaceable between a plurality of positions along a length of each of the plurality of displacement arms to retrieve and process panels having different shapes and/or sizes.

9. The system of any one of claims 1-7, wherein the alignment module includes at least one alignment assembly configured to facilitate alignment of an assembly plate carried by the end effector.

10. The system of claim 9, wherein the alignment module space is located a distance beyond the periphery of a component board carried by the component board handler and opposite the nest assembly of each of the at least one component board handler.

11. The system of claim 9, wherein the alignment module comprises at least two alignment assemblies at a distance from each other, the at least two alignment assemblies being arranged in a nested assembly with respect to an end effector of each of the at least one component plate handler, enabling application of external forces at least two locations along a periphery of a component plate carried by the end effector during relative displacement of the component plate and the alignment module.

12. The system of claim 11, wherein the at least two alignment assemblies are positioned substantially opposite the engagement between the at least one registration groove of the assembly plate and the registration assembly of the end effector, wherein the at least two positions are where the at least two alignment assemblies are forced along the periphery of the assembly plate.

13. The system of any of claims 4-7, wherein the alignment modules are located at the periphery of the pick and place mechanism.

14. The system as claimed in claim 13, wherein said pick and place mechanism includes said alignment module, and relative displacement between said pick and place mechanism and said end effector causes contact between a periphery of a component board carried by said end effector and said alignment module and thereby achieves alignment of said component board.

15. The system of claim 13, wherein the alignment module includes a spring-loaded mechanism configured and positioned to contact a portion of the outer periphery of the component plate carried by the end effector of each of the at least one component plate handler to effect alignment of the component plate when the component plate is displaced toward the alignment module.

16. The system of claim 15, wherein the spring-loaded mechanism is configured to absorb at least a portion of an external force applied to the component plate when the outer periphery of the component plate is in contact with the alignment module.

17. The system of claim 1, wherein the component panel is a semiconductor film frame.

18. A method for handling and aligning component boards, wherein aligning the component boards comprises:

activating at least one component board handler to extract a component board from a component board storage station, a periphery of the component board including a registration groove;

extracting component boards from the component board storage station;

displacing each of a plurality of end effectors in a controlled sequential manner relative to an alignment module located outside the component plate storage station, the displacement of each of the plurality of end effectors effecting a corresponding displacement of a component plate carried thereby relative to the alignment module; and

applying an external force by the alignment module to a component plate carried by each of the plurality of end effectors to effect engagement of the component plate to the nested assembly of the end effectors and thereby effect component plate alignment without further spatial alignment of the component plate relative to the vacuum table.

19. The method as recited in claim 18, wherein said method further comprises: translating the assembly plate handler including an end effector towards the alignment module, thereby achieving alignment between the at least one registration groove of the assembly plate and the registration assembly of the end effector; wherein the end effector carries the assembly plate thereon.

20. The method as recited in claim 18, wherein said method further comprises: translating a pick and place mechanism comprising an alignment module towards an end effector carrying said component plate, thereby achieving alignment between at least one registration groove of said component plate and a registration assembly of said end effector.

21. The method as claimed in claim 19 or 20, wherein the method further comprises: providing relative displacement between the component plate including the end effector and a pick and place mechanism such that a component plate held by the end effector is positioned so that it is picked up by the pick and place mechanism after alignment of the component plate.

22. The method of claim 21, wherein the plurality of suction assemblies of each of the plurality of indexing arms of the pick and place mechanism are achieved by applying, continuously applying, or not applying suction: picking up the component board, securing the component board on the pick and place mechanism, and displacing the component board from the vacuum table during transfer of the component board to and from the vacuum table.

23. The method as recited in claim 22, wherein said method further comprises:

after the inspecting step, positioning the pick and place mechanism with respect to the component board on the vacuum table, picking up the inspected component board using the pick and place mechanism;

providing relative displacement between an assembly plate including the end effector and the pick and place mechanism such that the pick and place mechanism is displaced and positioned to displace the inspected assembly plate onto the end effector; and

displacing the component board handler such that the inspected component board is moved back into the slot of the component board storage station.

24. A method as claimed in claim 18, characterized in that the displacement of each end effector relative to the pick and place mechanism is software-programmed to be executed by computer means.

25. The system of claim 11, wherein the alignment module is disposed on an outer periphery of the pick and place mechanism.

26. The system of claim 12, wherein the alignment module is disposed on an outer periphery of the pick and place mechanism.