HK1171871B - Anisotropic conductive adhesive film, connection structure and method for manufacturing same - Google Patents
Anisotropic conductive adhesive film, connection structure and method for manufacturing same Download PDFInfo
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- HK1171871B HK1171871B HK12112615.6A HK12112615A HK1171871B HK 1171871 B HK1171871 B HK 1171871B HK 12112615 A HK12112615 A HK 12112615A HK 1171871 B HK1171871 B HK 1171871B
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Description
Technical Field
The present invention relates to an anisotropic conductive adhesive film for anisotropic conductive connection between a terminal of a flexible substrate and a terminal of a rigid substrate, a connection structure using the anisotropic conductive adhesive film for anisotropic conductive connection between a terminal of a flexible substrate and a terminal of a rigid substrate, and a method for manufacturing the same.
Background
The following methods are currently widely used: the conductive particles of the anisotropic conductive adhesive film in which the conductive particles are dispersed in the adhesive resin composition are particles which are formed by deforming the conductive particles themselves by pressure and heat treatment at the time of anisotropic conductive connection to increase the contact area with the terminal, thereby forming a nickel thin electroless plating film (metal halide) and a thin gold-plated thin electroless plating film (gold-plated 12501 ラッシュメッキ thin film) as needed on the surface of the resin core particles (patent document 1.
In order to confirm the connection state depending on the anisotropic conductive adhesive film, a connection structure obtained by anisotropically and electrically connecting the terminals of a flexible substrate and the terminals of a rigid substrate such as a glass substrate using the anisotropic conductive adhesive film containing such conductive particles is a method of observing indentations generated in the terminals of the flexible substrate by the conductive particles in the anisotropic conductive adhesive film from the flexible substrate side using a microscope or the like (patent document 2).
Prior art documents.
Patent literature.
Patent document 1: japanese patent laid-open No. 9-199206.
Patent document 2: japanese patent laid-open No. 2008-91843.
Disclosure of Invention
Problems to be solved by the invention
However, in the connection structure obtained by anisotropically and conductively connecting the terminals of the flexible substrate and the terminals of the rigid substrate using the anisotropic conductive adhesive film described in patent document 1, when the indentations of the terminals are observed from the flexible substrate side, there is a problem that the conductive particles are too soft, the conductive particles are not sufficiently embedded in the terminals of the flexible substrate, and no observable indentations are generated in the terminals, as described in patent document 2. Further, when stored in a high-temperature and high-humidity environment, there is a problem that the connection resistance increases and the connection reliability may decrease.
The present invention is intended to solve the problems of the prior art described above, and an object of the present invention is to provide a connection structure obtained by anisotropically and conductively connecting a terminal of a flexible substrate and a terminal of a rigid substrate using an anisotropic conductive adhesive film, in which indentations of the terminals can be observed from the flexible substrate side, and which can ensure good connection reliability even when stored in a high-temperature and high-humidity environment.
Means for solving the problems
The present inventors have found that the above object can be achieved by adjusting the size, compression hardness, and sphericity of conductive particles to predetermined ranges to allow the conductive particles of an anisotropic conductive adhesive film to be sufficiently embedded in terminals of a flexible substrate rather than terminals of a rigid substrate, and thus have completed the present invention.
That is, the present invention provides an anisotropic conductive adhesive film, the anisotropic conductive adhesive filmThe anisotropic conductive adhesive film is used for anisotropic conductive connection between a terminal of a flexible substrate and a terminal of a rigid substrate, and is characterized in that conductive particles have a particle diameter of 4 [ mu ] m or more and a particle diameter of 4500kgf/mm in the anisotropic conductive adhesive film in which the conductive particles are dispersed in an adhesive composition2The compression hardness is above, and when the maximum particle diameter of the conductive particles is a and the minimum particle diameter is B, the sphericity of the conductive particles expressed by a/B is 5 or less, so that when the particle diameter of the conductive particles after anisotropic conductive connection is A and the interval between the terminal of the flexible substrate and the terminal of the rigid substrate is B, the press-in ratio defined by 100 · (A-B)/A is 40% or more.
The present invention also provides a connection structure in which a terminal of a flexible substrate and a terminal of a rigid substrate are connected by anisotropic conduction via an anisotropic conductive adhesive film in which conductive particles are dispersed in an adhesive resin composition, wherein the conductive particles of the anisotropic conductive adhesive film to be sandwiched between the terminal of the flexible substrate and the terminal of the rigid substrate have a particle diameter of 4 μm or more and a particle diameter of 4500kgf/mm2The conductive particles have a sphericity of 5 or less, expressed as a/b, when the maximum particle diameter is a and the minimum particle diameter is b, and the conductive particles are embedded in the terminals of the flexible substrate in the following state: when the particle diameter of the conductive particles after anisotropic conductive connection is defined as A and the distance between the terminal of the flexible substrate and the terminal of the rigid substrate is defined as B, the press-in ratio defined as 100 · (A-B)/A is 40% or more.
In addition, the present invention provides a method for manufacturing the connection structure, wherein the anisotropic conductive adhesive film of the present invention is temporarily attached (reverse リ リ temporality bonding) to a terminal of a rigid substrate, and a flexible substrate is disposed so as to sandwich the anisotropic conductive adhesive film so that the terminal of the flexible substrate corresponds to the terminal of the rigid substrate; anisotropic conductive connection is performed by heating and pressing the anisotropic conductive adhesive film from the flexible substrate side with a heating bonder so that the pressing ratio defined by 100 · (a-B)/a is 40% or more, where a particle diameter of conductive particles after anisotropic conductive connection is a and a distance between a terminal of the flexible substrate and a terminal of the rigid substrate is B.
ADVANTAGEOUS EFFECTS OF INVENTION
In the anisotropic conductive adhesive film of the present invention, the particle diameter, compression hardness, and sphericity of the conductive particles are each limited to a specific range. Therefore, when the particle diameter of the conductive particles in the connection structure after anisotropic conductive connection is defined as A and the distance between the terminal of the flexible substrate and the terminal of the rigid substrate is defined as B, the press-fit ratio defined as 100 · (A-B)/A can be 40% or more. Thus, the indentation of the terminal can be observed from the flexible substrate side of the connection structure, and good connection reliability can be ensured even when the connection structure is stored in a high-temperature and high-humidity environment.
Brief description of the drawings.
FIG. 1 is a schematic view showing the pressing ratio of conductive particles.
Best mode for carrying out the invention.
The anisotropic conductive adhesive film of the present invention is used for anisotropic conductive connection between a terminal of a flexible substrate formed of copper wiring, aluminum wiring, or the like on a resin film such as polyimide, polyester, polyamide, polysulfone, or the like, and a terminal of a rigid substrate formed of ITO wiring, copper wiring, aluminum wiring, or the like on a rigid substrate such as a glass substrate, a ceramic substrate, a glass epoxy (ガラスエポキシ) printed wiring substrate, or the like, and is formed by dispersing conductive particles in an adhesive resin composition. Here, a glass substrate is a preferable rigid substrate in view of transparency. A semiconductor chip or the like may be mounted on the flexible substrate or the rigid substrate. In addition, if necessary, gold plating or the like may be applied to the terminals of the respective substrates in advance.
In the present invention, as shown in fig. 1, the particle diameter of the conductive particles 1 after anisotropic conductive connection is defined as a, and the press-in ratio defined as 100 · (a-B)/a is 40% or more, preferably 60% or more, where B is the distance between the terminal 3 of the rigid substrate 2 and the terminal 5 of the flexible substrate 4. This makes it possible to observe the indentation of the terminal from the flexible substrate side and to prevent the increase in the connection resistance of the anisotropic conductive connection portion formed by the anisotropic conductive adhesive film under the heat and humidity test. When the press-fit ratio is 0% (when a-B is 0), the conductive particles are not embedded in the terminals and crushed between the terminals. When the press-fit ratio is 100% (when B is 0), the conductive particles are completely pressed into the terminals of the flexible substrate.
If the particle diameter of the conductive particles constituting the anisotropic conductive adhesive film of the present invention is too small, it is difficult to form indentations on the terminals of the flexible substrate, and therefore, it is 4 μm or more, preferably 6 μm or more. The upper limit of the particle diameter may be determined as appropriate depending on the pitch, thickness variation, and the like of the terminals to be connected, but is preferably 15 μm or less. More preferably, the particle size is 6 to 10 μm.
If the compression hardness of the conductive particles used in the present invention is too low, it is difficult to form a dent on the terminal of the flexible substrate, so it is 4500kgf/mm2Above, preferably 6000kgf/mm2The above. On the other hand, if too high, the connection reliability tends to be lowered, so 7000kgf/mm is preferable2The following. Here, the compression hardness is synonymous with the compression strength at a compression displacement of 10%, and can be measured by using a general micro compression tester.
In addition, when the conductive particles used in the present invention are defined as a/b in the case where the maximum particle diameter of the particles observed with a metal microscope is a and the minimum particle diameter is b, the conductive particles exhibit a sphericity of 5 or less, preferably 3 or less. The reason for this is that: if the sphericity exceeds 5, the connection reliability tends to be lowered. It is preferable that the maximum particle diameter a is 4 to 15 μm, and more preferably 6 to 10 μm, because it is likely that the pressure mark is hard to appear when it is too small, and the anisotropic conductivity is likely to decrease when it is too large. On the other hand, the minimum particle diameter b is preferably 4 to 15 μm, more preferably 6 to 10 μm, because it tends to make it difficult for scratches to appear when it is too small, and tends to lower anisotropic conductivity when it is too large. In the present invention, the sphericity must theoretically be 1 or more.
As the conductive particles having the above-described properties, metal particles of nickel, cobalt, silver, copper, gold, palladium, tin, or the like can be used, and electroless plated particles such as electroless nickel plated films are formed on the surfaces of resin particles of divinylbenzene-based resins, benzoguanamine resins, or the like.
As the adhesive resin composition in which such conductive particles are dispersed, a known adhesive resin composition used for an anisotropic conductive adhesive film can be used. For example, the curable composition may be composed of a film-forming resin, a liquid epoxy compound (curing component) or an acrylic monomer (curing component), a curing agent, a silane coupling agent, and the like.
Examples of the film-forming resin include phenoxy resins, epoxy resins, unsaturated polyester resins, saturated polyester resins, polyurethane resins, butadiene resins, polyimide resins, polyamide resins, and polyolefin resins, and 2 or more of these resins can be used in combination. Among them, phenoxy resins are preferably used from the viewpoint of film-forming properties, processability, and connection reliability.
Examples of the liquid epoxy compound include bisphenol a type epoxy compounds, bisphenol F type epoxy compounds, phenol type epoxy compounds (ノボラック type エポキシ compounds), modified epoxy compounds thereof, alicyclic epoxy compounds, and the like, and 2 or more of them may be used in combination. In this case, examples of the curing agent include anionic curing agents such as polyamine and imidazole, cationic curing agents such as sulfonium salt, and latent curing agents such as phenol curing agents.
Examples of the acrylic monomer include methyl (meth) acrylate, ethyl (meth) acrylate, isopropyl (meth) acrylate, isobutyl (meth) acrylate, ethylene glycol di (meth) acrylate, diethylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, and tetramethylolmethane tetra (meth) acrylate. In this case, examples of the curing agent (radical polymerization initiator) include organic peroxides and azobisbutyronitrile.
Examples of the silane coupling agent include epoxy silane coupling agents and acrylic silane coupling agents. These silane coupling agents are mainly alkoxysilane derivatives.
The binder resin composition may contain, as necessary, fillers, softeners, catalysts, antioxidants, colorants (pigments and dyes), organic solvents, ion collectors, and the like.
The anisotropic conductive adhesive film according to the present invention has a decreased content of conductive particles in the film, which decreases the connection reliability when the content is too small, and decreases the anisotropic conductivity when the content is too large, and is preferably 0.3 to 30% by mass, and more preferably 5 to 10% by mass.
The thickness of the anisotropic conductive adhesive film of the present invention is not particularly limited, but is usually 10 to 45 μm.
The anisotropic conductive adhesive of the present invention can be prepared by the following method: the components constituting the binder resin composition and the conductive particles are put into a stirring vessel and mixed according to a conventional method.
Next, a connection structure of the present invention prepared by using the anisotropic conductive film of the present invention will be described.
The connection structure of the present invention is a connection structure in which the terminal of the flexible substrate and the terminal of the rigid substrate are anisotropically conductively connected through an anisotropic conductive adhesive film in which conductive particles are dispersed in an adhesive resin composition, as described above, and is characterized in that the anisotropic conductive film of the present invention is used as the anisotropic conductive adhesive film to be sandwiched between the terminal of the flexible substrate and the terminal of the rigid substrate. Since the anisotropic conductive film of the present invention is used for the connection structure, the connection structure has a structure in which conductive particles are embedded in the terminals of the flexible substrate in the following state: when the particle diameter of the conductive particles after anisotropic conductive connection is defined as A and the distance between the terminal of the flexible substrate and the terminal of the rigid substrate is defined as B, the press-in ratio defined as 100 · (A-B)/A is 40% or more, preferably 60% or more. In this case, in order to make it easy to observe the indentation of the conductive particles from the flexible substrate, it is preferable that the conductive particles are not embedded in the terminals of the rigid substrate.
Specific examples of such a connection structure of the present invention include a liquid crystal display device, an organic EL display device, a solar cell module, and an LED lighting device.
The connection structure of the present invention can be prepared as described below.
First, the anisotropic conductive cornea of the present invention is temporarily attached to the terminal of the rigid substrate according to a conventional method. Then, the flexible substrate is arranged to sandwich the anisotropic conductive adhesive film so that the terminals of the flexible substrate correspond to the terminals of the rigid substrate.
Next, anisotropic conductive connection is performed by heating and pressing the anisotropic conductive adhesive film from the flexible substrate side with a heating bonder. In this case, anisotropic conductive connection is performed while considering the blending composition of the adhesive resin composition, the material of the conductive particles, the surface state of the terminal, and the like, so that the press-in ratio defined as 100 · (a-B)/a is 40% or more, where a particle diameter of the conductive particles after anisotropic conductive connection is a and a distance between the terminal of the flexible substrate and the terminal of the rigid substrate is B. Thereby, the connection structure of the present invention can be obtained.
The press-fitting ratio can be controlled by adjusting the heating and pressing conditions in the anisotropic conductive connection. For example, the pressing rate can be increased by lowering the heating temperature or increasing the pressing pressure. Conversely, the pressing rate can be reduced by increasing the heating temperature or reducing the pressing pressure. Further, the adjustment can be performed by selecting materials such as a flexible substrate, a rigid substrate, terminals thereof, and conductive particles. Further, they may be adjusted in combination.
Examples
The present invention will be specifically described below with reference to examples.
Examples 1 to 13 and comparative examples 2 to 5
(preparation of conductive particles)
100g of nickel particles having an average particle diameter shown in Table 1 were stirred in 50mL/L of an aqueous hydrochloric acid solution for 5 minutes. The mixture was filtered, and the nickel particles washed with 1 repulping (リパルプ repulp) with water were added to a reaction vessel containing 1L of an aqueous solution (pH6, temperature 60 ℃) containing EDTA-4Na (10g/L) and citric acid-2 Na (10g/L) while stirring.
Subsequently, 300mL of a mixed aqueous solution (solution A) containing potassium gold cyanide (10g/L, 6.8g/L for Au), EDTA-4Na (10g/L) and citric acid-2 Na (10g/L) and 300mL of a mixed aqueous solution (solution B) containing potassium borohydride (30g/L) and sodium hydroxide (60g/L) were added simultaneously from different inlets to the mixed aqueous solution obtained from the reaction vessel over 20 minutes, and then, the mixture was stirred for 10 minutes to carry out electroless plating.
And after the gold plating is finished, filtering the mixed solution, repulping and washing the filtered substance for 3 times, and then drying the filtered substance by using hot air at 100 ℃ to obtain the conductive particles with the electroless gold plating thin film with the thickness of about 10-20 nm formed on the surface of the nickel powder. The average particle diameter of the conductive particles can be approximated to the average particle diameter of the raw material nickel ions because the electroless gold plating film is very thin.
The average particle diameter of the nickel particles was measured by a laser diffraction scattering method to obtain a particle size distribution (measuring apparatus: Micro Track (マイクロトラック) MT3100, Japan K.K.), and the cumulative mass thereof was 50% of the particle diameter.
The compression hardness of the obtained conductive particles was measured at a compression displacement of 10% using a micro compression tester (PCT-200, shimadzu corporation). The results obtained are shown in table 1.
Regarding the sphericity of the conductive particles, the conductive particles were photographed using a metal microscope (MX51, オリンパス, ltd.), the maximum particle diameter a and the minimum particle diameter b of the particles were obtained, and a/b was calculated as the sphericity. The results obtained are shown in table 1.
(preparation of Anisotropic conductive adhesive film)
To 5 parts by mass of conductive particles were mixed 22 parts by mass of phenoxy resin (YP-50, NSCC Epoxy Manufacturing co., ltd.), (new preparation エポキシ prepared by manufacturer (strain)), 5 parts by mass of dicyclopentadiene dimethacrylate (DCP, new kamura chemical industry (strain)), 10 parts by mass of urethane acrylate (M-1600, east asian synthesis (strain)), 5 parts by mass of acrylic rubber (SG-80H, Nagase ChemteX Corporation (ナガセケムテックス (strain)), 1 part by mass of phosphorus-containing methacrylate (PM2, japan chemicals (strain)), 2 parts by mass of diacylperoxide initiator (Nyper (ナイパー) BW, daily oil (strain)), and 50 parts by mass of toluene, the obtained mixture was applied to a release sheet, dried to a dry thickness of 35 μ M, and dried at 80 ℃ for 5 minutes, thereby obtaining an anisotropic conductive adhesive film.
Using the obtained anisotropic conductive adhesive film, a polyimide flexible substrate (polyimide having a thickness of 38 μm, a copper wiring pitch of 200 μm, and a wiring height of 8 μm) and a printed wiring substrate (FR-4 grade, Song corporation: a copper wiring pitch of 200 μm, and a wiring height of 35 μm) were anisotropically conductively connected under heating and pressing conditions of 170 ℃ and 4MPa for 5 seconds to prepare a connection structure.
The cross section of the obtained anisotropic conductive connection part of the connection structure was polished, and the particle diameter a and the interval B between the wirings (the interval between the terminals between which the conductive particles were sandwiched) were measured with a metal microscope to obtain the penetration ratio of the conductive particles (═ 100 · (a-B)/a). The results obtained are shown in table 1.
The connection resistance of the obtained connection structure was measured when it was stored for 500 hours in a high-temperature and high-humidity environment at 85 ℃ and 85% humidity, and the connection reliability was evaluated according to the following criteria. The results obtained are shown in table 1. In practical use, it is desirable that the evaluation result is A or B.
Rating criterion
A: connection resistance value less than 2.0 omega
B: the connection resistance value is more than 2.0 omega and less than 4.0 omega
C: the connection resistance value is 4.0 Ω or more.
Further, a device having the same composition as the measuring device described in fig. 1 to 3 of jp 2008-a 91843 is prepared, and indentation of the wiring (terminal) by the conductive particles is observed from the flexible substrate side with respect to the connection portion of the connection structure using this device, and the indentation state is evaluated according to the following criteria. The results obtained are shown in table 1. In terms of practicality, it is desirable that the evaluation result is A or B. The indentation is caused by the deformation of the flexible substrate.
Rating criterion
A: at least 8 points in the observation point at 10 of the connecting part, the indentation can be determined
B: 1-7 portions of the observation part at 10 positions of the connection part can determine the indentation
C: the impression was not confirmed in the observation site at 10 of the connecting portion.
Comparative example 1
The palladium catalyst was supported on divinylbenzene-based resin particles (5g) having an average particle diameter of 8 μm by an impregnation method. Then, this resin particle was subjected to electroless nickel plating using an electroless nickel plating solution (pH12, plating solution temperature 50 ℃) prepared from nickel sulfate hexahydrate, sodium hypophosphite, sodium citrate, triethanolamine and thallium nitrate to obtain a nickel-coated resin core particle having a nickel plating layer (10 to 20nm thick) formed on the surface as a conductive particle.
By subjecting the obtained nickel-coated resin core particles to electroless gold plating treatment as in example 1, Ni — Au-coated resin core particles were obtained as conductive particles.
The obtained conductive particles were measured for average particle diameter, compressive hardness, and sphericity as in example 1, and the obtained results are shown in table 1. An anisotropic conductive adhesive film was prepared in the same manner as in example 1, and the indentation state was evaluated by obtaining the indentation ratio of the conductive particles, evaluating the reliability, and further evaluating the indentation state. The results obtained are shown in table 1.
[ Table 1]
。
From table 1, in the case of the connection structures prepared using the anisotropic conductive adhesive films of examples 1 to 13, both the evaluation results of the connection reliability and the indentation state were a or B, and there was no problem in terms of practical applicability.
On the other hand, in the case of the connection structure prepared using the anisotropic conductive adhesive film of comparative example 1, since the compression hardness of the conductive particles used was particularly low at a compression displacement of 10%, 700kgf/mm2On the other hand, the indentation state was evaluated as C because the indentation ratio of the conductive particles was 12% which is also low.
In the case of the connection structure prepared using the anisotropic conductive adhesive film of comparative example 2, the average particle size of the conductive particles used was as small as 3 μm, and therefore the evaluation of the indentation state was C.
In the case of the connection structure prepared using the anisotropic conductive adhesive film of comparative example 3, since the sphericity was large and 5.3, the evaluation of the connection reliability was C.
In the case of the connection structure prepared using the anisotropic conductive adhesive film of comparative example 4, the average particle size of the conductive particles used was as small as 3 μm, and therefore the evaluation of the indentation state was C.
In the case of the connection structure produced using the anisotropic conductive adhesive film of comparative example 5, the indentation state was evaluated as C since the indentation rate of the conductive particles was low, 35%.
Industrial applicability
The anisotropic conductive adhesive film of the present invention has specific ranges of particle size, compression hardness, and sphericity of conductive particles to be used. Therefore, when the particle diameter of the conductive particles in the connection structure after anisotropic conductive connection is defined as A and the distance between the terminal of the flexible substrate and the terminal of the rigid substrate is defined as B, the press-fit ratio defined as 100 · (A-B)/A can be 40% or more. Therefore, the indentation of the terminal can be observed from the flexible substrate side of the connection structure, and good connection reliability can be ensured even when the connection structure is stored in a high-temperature and high-humidity environment. Therefore, the anisotropic conductive adhesive film of the present invention is useful for anisotropic conductive connection between a flexible substrate and a rigid substrate.
Description of the symbols
1 conductive particle
2 rigid substrate
3 terminals of rigid substrate
4 Flexible substrate
5 terminals of flexible substrate
A particle diameter of conductive particles
B terminal spacing.
Claims (4)
1. An anisotropic conductive adhesive film for connecting a terminal of a flexible substrate and a terminal of a rigid substrate by anisotropic conduction, characterized in that the anisotropic conductive adhesive film comprises conductive particles dispersed in an adhesive resin composition,
the conductive particles have a particle diameter of 4-15 μm and 4500kgf/mm2Above and 7000kgf/mm2The compression hardness is shown in the table of a/b when the maximum particle diameter of the conductive particles is a and the minimum particle diameter is bThe conductive particles shown have a sphericity of 5 or less, so that the press-fit ratio defined as 100 · (a-B)/a is 40% or more, where a particle diameter of the conductive particles after anisotropic conductive connection is a and a distance between a terminal of the flexible substrate and a terminal of the rigid substrate is B.
2. A connection structure in which a terminal of a flexible substrate and a terminal of a rigid substrate are anisotropically and conductively connected to each other via an anisotropic conductive adhesive film in which conductive particles are dispersed in an adhesive resin composition,
the conductive particles of the anisotropic conductive adhesive film sandwiched between the terminals of the flexible substrate and the rigid substrate have a particle diameter of 4-15 μm and a particle diameter of 4500kgf/mm2Above and 7000kgf/mm2A compression hardness of 5 or less, and a sphericity of the conductive particles expressed as a/b is 5 or less when the maximum particle diameter is a and the minimum particle diameter is b,
the conductive particles are embedded in the terminals of the flexible substrate in the following states: when the particle diameter of the conductive particles after anisotropic conductive connection is defined as A and the distance between the terminal of the flexible substrate and the terminal of the rigid substrate is defined as B, the press-in ratio defined as 100 · (A-B)/A is 40% or more.
3. The connection structure of claim 2, wherein the rigid substrate is a glass substrate.
4. A production method of the connection structure according to claim 2,
temporarily attaching the anisotropic conductive adhesive film according to claim 1 to a terminal of a rigid substrate, disposing a flexible substrate so as to sandwich the anisotropic conductive adhesive film so that the terminal of the flexible substrate corresponds to the terminal of the rigid substrate,
anisotropic conductive connection is performed by heating and pressing the anisotropic conductive adhesive film from the flexible substrate side with a heating bonder so that the pressing ratio defined by 100 · (a-B)/a is 40% or more, where a particle diameter of conductive particles after anisotropic conductive connection is a and a distance between a terminal of the flexible substrate and a terminal of the rigid substrate is B.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010-288005 | 2010-12-24 | ||
| JP2010288005A JP6061443B2 (en) | 2010-12-24 | 2010-12-24 | Anisotropic conductive adhesive film, connection structure and manufacturing method thereof |
| PCT/JP2011/071580 WO2012086278A1 (en) | 2010-12-24 | 2011-09-22 | Anisotropic conductive adhesive film, connection structure and method for manufacturing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| HK1171871A1 HK1171871A1 (en) | 2013-04-05 |
| HK1171871B true HK1171871B (en) | 2016-03-24 |
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