HK1169179B - Transporting method, transporting apparatus, exposure method, and exposure apparatus - Google Patents

Description

Transfer method, transfer apparatus, exposure method, and exposure apparatus

Background

The present invention relates to a transfer technique for transferring, for example, a flexible, elongated film-like member, and an exposure technique and a manufacturing technique using the transfer technique. The invention also relates to a device manufacturing technique using the exposure technique and the manufacturing technique.

Priority is claimed to us provisional application No. 61/213,424 filed on 5.6.2009 and us patent application No. 12/769,965 filed on 29.4.2010, the entire contents of which are incorporated by reference into the present application.

In an exposure apparatus for manufacturing a component such as a semiconductor component or a liquid crystal display component, a typical exposure object is conventionally a flat plate-like object having high rigidity such as a semiconductor wafer or a glass substrate coated with a photoresist. Recently, in order to efficiently manufacture a device having a large area, an elongated film-like member which is flexible and can be stored by being wound into a roll shape has been used as an exposure object. Note that in this specification, for exposure, in addition to a technique of exposing a subject to light through exposure via a mask pattern and a projection optical system, a technique of drawing a predetermined pattern onto a subject by a charged particle beam (such as an electron beam) may also be used.

In order to expose a predetermined pattern onto this elongated membrane-like member, conventionally, the membrane-like member between two fixed rollers is stretched, and the membrane-like member is continuously moved in a constant direction with respect to the exposure region between the rollers while keeping the tension of the membrane-like member constant (see, for example, japanese patent application laid-open No. 2006-098718 or corresponding U.S. patent publication No. 2006/0066715).

In the conventional apparatus that exposes the membrane-like member, since the two rollers that stretch the membrane-like member are fixed and the membrane-like member moves while sliding on top of the two rollers, there is a possibility that the positional accuracy of the membrane-like member (i.e., the positional accuracy with respect to the target position in time series) will be reduced due to vibration or the like. Due to this reduction in position accuracy, there is a possibility that the resolution of the pattern to be exposed will be reduced and that the overlay accuracy will also be reduced during overlay exposure.

Disclosure of Invention

Aspects of the present invention are conceived in view of the above-described situation, and an object thereof is to convey, for example, a flexible, elongated film-like member along a target path with a high level of accuracy.

A conveying method according to a first aspect of the invention is a conveying method for conveying a film-like member, the method including: moving the membrane-like member in a moving direction along the surface of the membrane-like member; supporting a plurality of surface positions of the membrane-like member by a plurality of rod-like members, longitudinal directions of which are aligned in a direction intersecting the moving direction, and which are aligned in the moving direction; and moving the plurality of rod-shaped members supporting the membrane-like member in synchronization in the moving direction.

An exposure method according to a second aspect of the invention is an exposure method for exposing a film-like member to light, the method comprising: using the transfer method according to the first aspect of the invention, the film-like member is moved in the moving direction; detecting an alignment mark formed on a portion to be exposed supported by the rod-like member from among the film-like members; and performing alignment of the portion to be exposed of the film-like member with the pattern of the exposure object based on the detection result of the alignment mark, and exposing the portion to be exposed supported by the rod-like member and moved in the moving direction.

A manufacturing method according to a third aspect of the invention is a manufacturing method for adhering a first film-like member and a second film-like member, the method comprising: using the transfer method according to the first aspect of the invention, the first film-like member is transferred; using the transfer method according to the first aspect of the invention, the second film-like member is transferred so as to face the first film-like member; detecting alignment marks formed on the first portion and the second portion supported by the rod-like members, respectively, from among the first and second film-like members; and performing alignment of the first portion and the second portion of the first and second film-like members based on a detection result of the alignment mark, and adhering the first portion and the second portion that are supported by the rod-like member and move in the moving direction.

A transfer apparatus according to a fourth aspect of the invention is a transfer apparatus that transfers a film-like member, the apparatus comprising: a plurality of rod-like members whose longitudinal direction is aligned in a direction intersecting with a moving direction along the surface of the membrane-like member, and which are aligned in the moving direction to support the membrane-like member; and a driving device that synchronously moves the plurality of rod-shaped members supporting the membrane-like member among the plurality of rod-shaped members in the moving direction.

An exposure apparatus according to a fifth aspect of the invention is an exposure apparatus that exposes a film-like member, the apparatus including: a transfer device according to a fourth aspect of the invention, which transfers a film-like member; a mark detection system that detects, from among the film-like members, alignment marks formed on the portions to be exposed supported by the rod-like members of the conveying device; and an exposure section that performs alignment of a portion to be exposed of the film-like member with a pattern of an exposure object based on a detection result of the mark detection system, and exposes the portion to be exposed that is supported by the rod-like member and that moves in the moving direction.

A manufacturing apparatus according to a sixth aspect of the invention is a manufacturing apparatus that adheres a first film-like member and a second film-like member, the apparatus comprising: a first transporting device according to a fourth aspect of the invention, which transports the first film-like member; a second transfer device according to a fourth aspect of the invention, which transfers the second film-like member so as to face the first film-like member; a mark detection system that detects, from among the first and second film-like members, alignment marks formed on the first portion and the second portion supported by the rod-like members, respectively; and an adhering portion that performs alignment of the first portion and the second portion of the first and second membrane-like members, and adheres the first portion and the second portion that are supported by the rod-like members and that move in the moving direction.

A device manufacturing method according to a seventh aspect of the present invention includes: exposing the film-shaped photosensitive substrate using the exposure method according to the second aspect of the invention or using the exposure apparatus according to the fifth aspect of the invention; and processing the film-like photosensitive substrate after the exposure.

Further, a device manufacturing method according to an eighth aspect of the present invention includes: the first and second film-like members are adhered using the production method according to the third aspect of the invention or using the production apparatus according to the sixth aspect of the invention.

According to the aspect of the invention, since the rod-shaped member supporting the membrane-like member is moved in the moving direction, and the membrane-like member is moved in the moving direction, it is possible to convey, for example, a flexible, elongated membrane-like member along the target path at a high level of accuracy.

Drawings

Fig. 1 is a perspective view showing the structure of an exposure apparatus according to a first embodiment.

Fig. 2A is a perspective view illustrating the stepped platform device of fig. 1.

Fig. 2B is a front view showing the stepped platform device.

Fig. 2C is a partially cut-away plan view showing the stepped platform assembly.

Fig. 3A is a sectional view showing a suction mechanism of the stepped platform device in fig. 2A.

Fig. 3B is a perspective view showing a state in which the rod and the common pipe (utility pipe) in fig. 3A are joined together.

Fig. 4A is a perspective view showing a state where a film-like substrate is transferred from a drum guide to a rod.

Fig. 4B is a perspective view showing a state where alignment of the pattern transfer region starts.

Fig. 4C is a perspective view showing a state where the alignment of the pattern transfer region is ended.

Fig. 5A is a plan view showing a film-like substrate during alignment of a pattern transfer region.

Fig. 5B is a plan view showing the film-like substrate during exposure of the pattern transfer area.

Fig. 6A is a plan view illustrating the mask stage during pattern exposure of the first mask.

Fig. 6B is a plan view showing the mask stage during the step movement of the mask.

Fig. 6C is a plan view showing the mask stage during pattern exposure of the second mask.

Fig. 7 is a flowchart showing an example of the exposure operation of the first embodiment.

Fig. 8 is a plan view showing a stepped platform device according to a modified example of the first embodiment.

Fig. 9 is a front view showing a schematic structure of a rolling member panel device according to a second embodiment.

Fig. 10 is a perspective view illustrating the structure of the stepped platform device shown in fig. 9.

Fig. 11 is a flowchart showing an example of a micro device manufacturing method.

Description of the reference numerals

EX: exposure device

MA, MB: mask and method for manufacturing the same

MST: mask stage

PL: projection optical system

PLA to PLD: partial projection optical system

P: film-like substrate

4: main control unit

6: substrate table control unit

20: supply roller

26. 26A: drum-shaped rolling guide

28. 28A: step type platform device

30A to 30L: rod

32A, 32B: chain

36A, 36B: driving motor

50: winding roller

52A, 52B: alignment system

EP: panel device for rolling member

Detailed Description

[ first embodiment ]

A first embodiment of the present invention will be described with reference to fig. 1 to 7.

Fig. 1 shows a schematic structure of an exposure apparatus (i.e., projection exposure apparatus) EX of the present embodiment. In fig. 1, an exposure apparatus EX includes: an exposure light source (not shown); an irradiation unit IU that irradiates a part of the pattern of the first mask MA or the second mask MB with irradiation light IL (i.e., exposure light) from an exposure light source; a mask stage MST that alternately scans the masks MA and MB, for example, in a predetermined direction; and a projection optical system PL that projects an image of a portion of the pattern of the mask MA or the mask MB onto the film-like substrate P. Note that, for simplification of explanation, in fig. 1, the film-like substrate P and the like are indicated by two-dot chain lines. The mask stage MST is movably mounted on a mask base (not shown), wherein an aperture (opening) for passing the illumination light IL is formed between the illumination unit IU and the projection optical system PL.

Further, the exposure apparatus EX includes: a substrate moving device PDV that continuously moves the film-like substrate P, for example, in a constant direction; and a main control unit 4 which is constituted by a computer and performs integrated control of the operation of the exposure apparatus EX.

The film-like substrate P of the present embodiment is an elongated sheet-like member (i.e., a belt-like member) made of synthetic resin, which is flexible and storable by winding into a roll shape, and is used, for example, for manufacturing a display element or the like. A photoresist (i.e., a photosensitive material) is coated on the surface of this film-like substrate P during exposure. The film-like substrate P is described as a sheet form means: the thickness thereof is sufficiently small (i.e., thin) compared to the width of the film-like substrate P so that the film-like substrate P is flexible.

In the following description, the positional relationship between the members will be described with reference to the XYZ rectangular coordinate system set in fig. 1. In the XYZ orthogonal coordinate system, the X axis and the Y axis are arranged on a horizontal plane, and the Z axis is arranged in a vertical direction. In the present embodiment, the pattern surfaces of the masks MA and MB are parallel to the XY plane, and the portion of the exposure surface of the film-like substrate P onto which the irradiation light IL is irradiated during exposure is also parallel to the XY plane. The exposure apparatus EX is a scanning exposure apparatus, and the moving direction (i.e., scanning direction) of the masks MA and MB during scanning exposure is parallel to the X axis (i.e., X direction), and the moving direction (i.e., scanning direction) of the film-like substrate P in the exposure region of the projection optical system PL is also the X direction.

First, an exposure light source (not shown) includes an ultra-high pressure mercury lamp, an elliptical mirror, and a wavelength selective element. The irradiation unit IU includes: a light transmission optical system including a light guide and the like; and a light splitting optical system that splits the incident illumination light IL into a plurality of light fluxes and then emits each light flux via an optical integrator, a relay optical system, a variable louver (i.e., a variable field stop), and a condenser lens. The irradiation light IL is light selected from a wavelength region including, for example, g-rays (having a wavelength of 436 nm), h-rays (having a wavelength of 405 nm), and i-rays (having a wavelength of 365 nm). The illumination light IL illuminates four illumination areas 18A to 18D of the pattern surface of the mask MA (or the mask MB) with a uniform illuminance distribution via the illumination unit IU, wherein the illumination areas 18A to 18D are independently opened and closed by the above-described variable louvers, respectively. The irradiation regions 18A to 18D have such shapes: is narrow and elongated in a non-scanning direction (i.e., Y direction) orthogonal (intersecting) the scanning direction.

The projection optical system PL is constituted by four partial projection optical systems PLA to PLD which form images of patterns within the four irradiation areas 18A to 18D on the exposure areas 18AP to 18DP (see fig. 5B) of the film-like substrate P, respectively. The projection magnification β of the partial projection optical systems PLA to PLD (and thus the projection optical system PL) from the masks MA and MB to the film-like substrate P is an enlargement magnification (where β > 1). The projection magnification β is, for example, about 2 times to 5 times. Part of the projection optical systems PLA to PLD of the present embodiment is supported on a frame structure (not shown). Further, the partial projection optical systems PLA to PLD form intermediate images, and form positive images of the patterns within the irradiation regions 18A to 18D on the film substrate P. Part of the projection optical systems PLA to PLD may form reverse images in the X direction and/or the Y direction. Further, for example, a refractive system (dioptric system) or a catadioptric system for a part of the projection optical systems PLA to PLD may be used.

Further, among the four partial projection optical systems PLA to PLD, two partial projection optical systems PLA and PLC are arranged in a line in the Y direction, and the other two partial projection optical systems PLB and PLD are arranged at positions diagonally offset from the partial projection optical systems PLA and PLC in the + X direction and the + Y direction.

Fig. 6A is a plan view showing the mask stage MST in fig. 1. In fig. 6A, four rows of partial pattern regions MA1 to MA4 are formed at predetermined intervals in the Y direction in the pattern region of the first mask MA, and four rows of partial pattern regions MB1 to MB4 are formed at predetermined intervals in the Y direction in the pattern region of the second mask MB. The pattern of one pattern transfer region to be transferred onto the film-like substrate P is reduced to 1/β (where β is a projection magnification), and partial patterns thereof divided into four parts in the Y direction are formed in the partial pattern regions MA1 to MA4 of the first mask MA and the partial pattern regions MB1 to MB4 of the second mask MB, respectively. For example, two-dimensional alignment marks (not shown) are formed near the ends in the X direction of the partial pattern regions MA1 to MA4 and MB1 to MB4 of the masks MA and MB, respectively. Alignment of masks MA and MB is performed by inspecting these alignment marks using a mask alignment system (not shown).

Further, during the exposure of the mask MA (or MB), images of the patterns of the partial pattern areas MA1 and MA3 (or MB1 and MB3) of the mask MA (or MB) are formed on the film-like substrate P by the partial projection optical systems PLA and PLC, and images of the patterns of the partial pattern areas MA2 and MA4 (or MB2 and MB4) of the mask MA (or MB) are formed on the film-like substrate P by the partial projection optical systems PLB and PLD. In this case, the positions of the two partial pattern regions MA1 and MA3 (or MB1 and MB3) and the two partial pattern regions MA2 and MA4 (or MB2 and MB4) are shifted from each other in the X direction, so that the images of the partial pattern regions MA1 to MA4 (or MB1 to MB4) of the mask MA (or MB) are formed at the same position in the X direction on the film-like substrate P.

Further, in order to reduce stitching errors (bonding errors), it is preferable that two exposures are performed in the boundary portions of the partial pattern regions MA1 to MA4 and MB1 to MB 4. Thereby, the irradiation regions 18A to 18D are formed in a trapezoidal shape whose both ends (or one end) are inclined.

In fig. 1, the mask stage MST includes: a first stage 10A which holds and moves the first mask MA; a second stage 10B that holds and moves the second mask MB; a rectangular frame 12 in which the stages 10A and 10B can move in parallel; a pair of linear motors 14a1 and 14a2 (in fig. 1, only rotors thereof are shown) that drive the stage 10A in the X direction with respect to the frame 12; a pair of linear motors 14B1 and 14B2 (in fig. 1, only rotors thereof are shown) that drive the stage 10B in the X direction with respect to the frame 12; and a pair of linear motors 16A and 16B (in fig. 1, only stators thereof are shown) that drive the frame 12 in the Y direction with respect to a mask base (not shown). In this case, by controlling the driving amounts of the linear motors 14a1 and 14a2 (or 14B1 and 14B2), it is also possible to rotate the mask MA (or MB) within a predetermined range (hereinafter, referred to as θ Z direction) about an axis parallel to the Z axis.

Further, position information including at least the positions of the stages 10A and 10B (i.e., the masks MA and MB) in the X direction and the Y direction and the rotation angle in the θ z direction, and position information of the frame 12 in the Y direction are measured by two sets of two-axis laser interferometers (not shown) for the X axis and by three-axis laser interferometers (not shown) for the Y axis, respectively. The measurement values are supplied to the main control unit 4 and the mask stage control unit 8. The mask stage control unit 8 drives the linear motors 16A, 16B, 14a1, 14a2, 14B1, and 14B2 based on the control information from the main control unit 4 and these measurement values to control the position of the frame 12 in the Y direction, and the positions and speeds of the stages 10A and 10B (i.e., the masks MA and MB) in the X direction and the Y direction, and also the rotation angle thereof in the θ z direction.

Further, the substrate moving apparatus PDV includes: a supply roller 20 that unwinds the film-shaped substrate P in the form of a sheet in the + X direction; a roller 22 that changes the direction of the film-like substrate P to the-Z direction; an air guide 24 that blows compressed air to the film-shaped substrate P to change the direction of the film-shaped substrate P to a diagonally (obliquely) upward direction without contact; a drum-like rolling guide 26 which is made of, for example, metal and formed into an axisymmetric shape such that both end portions thereof in a longitudinal direction (i.e., Y direction) are wider than a central portion, and which changes a direction of the film-like substrate P passing over it to substantially + X direction; a stepped stage device 28 using suction to hold (suction-hold) the film-like substrate P and continuously move it in the + X direction; and a winding roller 50 that winds the film-shaped substrate P around the winding roller 50. In this case, the supply roller 20, the roller 22, and the drum-like rolling guide 26 are rotatably supported on a predetermined substrate side frame (not shown). The air guide 24 is supported so that, for example, its position in the Z direction with respect to the substrate-side frame can be adjusted to keep the tension of the film-like substrate P substantially constant. Further, the winding roller 50 is driven to rotate by a drive motor (not shown), and this drive motor is controlled by the substrate table control unit 6.

The stepped platform assembly 28 includes: a first chain 32A forming an elliptical (oval) loop parallel to the XZ plane; a second chain 32B forming a loop as if the first chain 32A is formed by being moved in parallel in the Y direction by a predetermined interval (distance); a plurality of (12 is used here as an example) columnar bars 30A to 30L which are made of, for example, metal and are substantially parallel to the Y direction, respectively, and which link a first chain 32A and a second chain 32B in the Y direction; drive motors 36A and 36B (see fig. 2C) that synchronously drive the chains 32A and 32B in the same direction (i.e., the direction in which their tops move in the + X direction) at substantially the same speed; and a driving section 38A that drives the ends of the chains 32A and 32B collectively as a whole in the + X direction in the Y direction. The substrate stage control unit 6 controls the operations of the drive motors 36A and 36B and the drive section 38A based on control information from the main control unit 4.

Among the bars 30A to 30L, the interval (space) between the two bars 30A and 30B, the bars 30C and 30D, the bars 30E and 30F, the bars 30G and 30H, the bars 30I and 30J, and the bars 30K and 30L which are sequentially adjacent is the same as the length of one pattern transfer region on the film-like substrate P in the X direction. The interval between these two bars is the same as the length of a region (i.e., a vacant region) between two adjacent pattern transfer regions on the film-like substrate P (here, for example, between about half and a slightly smaller portion of the length of the pattern transfer region in the X direction). Further, in the film-like substrate P, a portion having a length in the X direction corresponding to two adjacent pattern transfer regions and an empty space therebetween is always supported substantially by any four of the bars 30A to 30L and conveyed in the + X direction.

Further, in the contact portion of each of the bars 30A to 30L that are in contact with the film-like substrate P, a plurality of suction holes 31 for vacuum suction are formed in a row extending in the Y direction. The suction holes 31 of the bars 30A to 30L are connected to a vacuum pump (not shown) via a tube (not shown) having flexibility and elasticity and a common pipe 40 disposed to cross the centers of the chains 32A and 32B. Note that instead of the plurality of suction holes 31, a narrow, elongated suction groove may also be formed in the Y direction.

Fig. 2A is a perspective view showing a schematic structure of the stepped platform assembly 28 shown in fig. 1. Fig. 2B is a front view showing the stepped platform assembly 28, and fig. 2C is a plan view showing the stepped platform assembly 28. As shown in fig. 2C, in the chain 32A, a large number of inner plates 32Ab and a large number of outer plates 32Aa corresponding to these inner plates are linked alternately by pins 32 Ac. The structure of chain 32B is the same as the structure of chain 32A. The levers 30A to 30L are provided to engage together, for example, a predetermined pin 32Ac of the chain 32A and a pin of the chain 32B facing the pin 32Ac in the + Y direction therefrom, and are also provided so as not to rotate. The diameters of both end portions of the rods 30A to 30L are formed smaller than the diameter of a portion through which the film-like substrate P passes. Note that, instead of the rods 30A to 30L, it is also possible to use non-axisymmetric members (members) having a semicircular cross section or the like, and the circular arc-shaped surfaces of the members are in contact with the film-like substrate P.

Further, the sprockets 34a1 and 34B1, which have identical shapes to each other and are rotatable about an axis parallel to the Y axis, mesh with the ends of the chains 32A and 32B in the + X direction. Further, the sprockets 34a2 and 34B2, which have identical shapes to each other and are rotatable about an axis parallel to the Y axis, mesh with the ends of the chains 32A and 32B in the-X direction. The rotational shafts of the sprockets 34a1 and 34B1 in the + X direction are supported by the U-shaped first base member 33A via bearings 35, respectively. Further, the rotation shafts of the sprockets 34a2 and 34B2 in the-X direction are supported by the U-shaped second base member 33B via bearings 35, respectively. The first base member 33A is supported on a base side frame (not shown) by a driving portion 38A and a biasing portion (exciting portion) 38B so that it can move in the Y direction within a predetermined range. The second base member 33B and the common duct 40 are supported on the base side frames.

Gears 37A and 37B for driving having the same shape are fixed to the rotation shafts of the sprockets 34a1 and 34B1 on the + X direction side. Gears of the drive motors 36A and 36B having the same shape are engaged with the gears 37A and 37B. Rotary encoders 37AR and 37BR (see fig. 3B) are mounted in the gears 37A and 37B. Based on the rotation angle information of the sprockets 34a1 and 34B1 detected by the rotary encoders 37AR and 37BR, the substrate stage control unit 6 controls the rotation angle and the rotation speed of the drive motors 36A and 36B. Further, a linear encoder 38AL (see fig. 3B) is mounted in the first base member 33A. Based on the position information of the first base member 33A in the Y direction detected by the linear encoder 38AL, the substrate stage control unit 6 controls the driving amount of the driving portion 38A.

According to this configuration, as a result of synchronously driving the drive motors 36A and 36B at the same rotational speed, the sprockets 34a1 and 34B1 rotate at the same rotational speed, and the rods (i.e., some of the rods 30A to 30L) that suction-hold the film-shaped substrate P and the chains 32A and 32B move at the same speed in the + direction. Further, by slightly changing the driving amount of the driving motors 36A and 36B, the relative position of the chains 32A and 32B in the X direction is changed, and the rotation angle of the film-like substrate P on the chains in the θ z direction can be controlled. Further, as a result of the sprockets 34a1 and 34B1 being displaced in the Y direction by the drive portion 38A via the first bottom member 33A, the position of the film-like substrate P between the sprockets 34a1 and 34B1 in the Y direction can be controlled.

The relationship between the rotation angles of the sprockets 34a1 and 34B1 detected by the rotary encoders 37AR and 37BR and the positions of each of the levers 30A to 30L held by the chains 32A and 32B is stored in the storage section of the substrate table control unit 6.

Further, as shown in fig. 2A, a guide member 70A supporting the chain 32A between the two sprockets 34a1 and 34a2 in the-Y direction and a guide member 70B supporting the chain 32B between the two sprockets 34B1 and 34B2 in the + Y direction are supported on the base side frame (not shown). As a result, the portions of the chains 32A and 32B (i.e., the rods 30A to 30L) extending from the sprockets 34a2 and 34B2 to the sprockets 34a1 and 34B1 are prevented from falling in the-Z direction, and the film-like substrate P supported by the rods 30A to 30L is moved in the + X direction along the XY plane.

Fig. 3A is a sectional view showing a state in which the suction holes 31 provided in the rods 30A to 30L shown in fig. 2A are engaged to the common duct 40. Fig. 3B is a perspective view illustrating a state in which one lever 30A shown in fig. 3A is coupled to the common pipe 40. As shown in fig. 3B, the common duct 40 has a cylindrical shape, and air holes 40a are formed in the end of the common duct 40 in the-Y direction. The air hole 40a is joined to a vacuum pump 43 via a pipe 42, and a portion around the air hole 40a in the end portion of the common piping 40 is made airtight by a sealing mechanism (not shown). Further, a large number of small air holes 40b communicating with the air holes 40a are formed in the surface of the end of the common duct 40 in the-Y direction.

Further, the first rotating member 41 rotatable around the outer surface (outside) of the common duct 40 is positioned to cover the large number of through holes 40b of the common duct 40. Portions between both ends of the first rotating member 41 in the Y direction and the outer surface of the common pipe 40 are sealed by, for example, magnetic fluid bearings. The position of the first rotating member 41 on the outer surface of the common duct 40 in the Y direction is fixed by two E-rings 45. The plurality of suction holes 31 in the surface of the rod 30A are joined to the discharge hole in the rod 30A, and the on-off valve 44V is partially provided along the discharge hole. The discharge hole is coupled to the air hole 41a in the outer surface of the first rotating member 41 via a tube 44 having flexibility and elasticity. The air hole 41a communicates with a vacuum pump 43 via air holes 40b and 40a in the common duct 40 and a pipe 42. The on-off valve 44V switches between a first state in which the suction hole 31 of the rod 30A is connected to the air hole 40b of the common duct 40, and a second state in which the suction hole 31 of the rod 30A is open to the atmosphere.

In the same manner, the plurality of suction holes 31 of the other rods 30B to 30L in fig. 3A are also communicated with the vacuum pump 43 via the tube 44 having flexibility and elasticity and provided with the on-off valve 44V, the air hole 41a of the first rotating member 41, the air holes 40B and 40a of the common duct 40, and the tube 42, respectively.

In fig. 3B, a positive electrode portion 46A and a negative electrode portion 46B are formed on the outer surface of the end portion of the common duct 40 in the + Y direction. The electrode portions 46A and 46B are connected to positive and negative electrodes of an external power supply 47 via inner leads in the common pipe 40. A second rotating member 48 rotatable around the outer surface of the common pipe 40 is disposed to cover the electrode portions 46A and 46B. The position of the second rotary member 48 on the outer surface of the common pipe 40 in the Y direction is also fixed by the two E rings 45. The first rotating member 41 and the second rotating member 48 are linked (connected) together by a linking (connecting) member (not shown), and rotate in conjunction with each other around the common pipe 40.

Further, the planar electrode plates 49A and 49B are fixed to semicircular cylindrical notch portions cut into the central portion of the second rotating member 48 to constantly slide on the electrode portions 46A and 46B, and the receiving portion 56 is fixed to the outer surface of the second rotating member 48. Power is constantly (continuously) supplied to the receiving portion 56 via the electrode plates 49A and 49B. The substrate stage control unit 6 issues commands regarding the respective timings to the sending section 39 to switch between the start (i.e., the first state) and the release (i.e., the second state) of the suction by the suction holes 31 of the levers 30A to 30L. Accordingly, the transmission section 39 wirelessly transmits a signal indicating the switching timing to the reception section 56 via radio waves, infrared rays, or the like. According to these signals, the receiving portion 56 sets the corresponding switch valve 44V to the first state (i.e., the state in which vacuum suction is performed by the suction hole 31) immediately before the rods 30A to 30L support the film-shaped substrate P, respectively, and sets the corresponding switch valve 44V to the second state (i.e., the state in which the inside of the suction hole 31 is open to atmospheric pressure) immediately before the rods 30A to 30L are removed (separated) from the film-shaped substrate P, respectively.

By providing the first rotating member 41 and the second rotating member 48 so that they can rotate around the outer surface of the utility pipe 40 in the above-described manner, the negative pressure from the vacuum pump 43 is supplied to the rods 30A to 30L that always rotate around the utility pipe 40 in a constant direction (here, clockwise direction), and also the power is supplied to the receiving portion 56.

In fig. 1, a resist coater 54 that coats a photoresist on a film-like substrate P is disposed above the film-like substrate P between the supply roll 20 and the roll 22. Further, the alignment systems 52A and 52B are located above the ends in the-X direction of the film-like substrate P supported on the stepped stage device 28 between the projection optical system PL and the drum-shaped rolling guide 26. The alignment systems 52A and 52B apply, for example, image processing, and detect the positions of alignment marks on the film-like substrate P at predetermined intervals in the Y direction. The detection results from the alignment systems 52A and 52B are supplied to an alignment control section within the main control unit 4. The positional relationship (i.e., baseline) between the centers of the alignment systems 52A and 52B and the centers of the images of the patterns on the masks MA and MB formed by the projection optical system PL can be measured, for example, by mounting reference members (not shown) that are elongated in the X direction and have, for example, a plurality of reference marks whose positional relationship is known, so that they extend from the detection areas of the alignment systems 52A and 52B toward the projection areas of the projection optical system PL. Information on these positional relationships may be stored in the alignment control section within the main control unit 4.

Fig. 5A is a plan view showing a portion of the film-like substrate P supported by the stepped platform device 28 shown in fig. 1. In fig. 5A, a large number of pattern transfer regions 60A, 60B, 60C are formed at predetermined intervals in the X direction on a film-like substrate P. Alignment marks PMA to PMD are formed in two positions in each of the pattern transfer regions 60A and the like at the same intervals as those of the alignment systems 52A and 52B in the Y direction, respectively. In this case, a region extending from the detection regions of the alignment systems 52A and 52B by substantially the same distance (length) as the length of the pattern transfer region in the + X direction forms the alignment region 58A. An area extending from the exposure area of the projection optical system PL in the + X direction by substantially the same distance as the length of the pattern transfer area forms the exposure area 58E. An intermediate region 58S is formed in a region between the alignment region 58A and the exposure region 58E. In the present embodiment, the portion of the film-like substrate P that substantially passes through the alignment area 58A, the intermediate area 58S, and the exposure area 58E is supported by some of the rods 30A to 30L of the stepped stage device 28 by suction, and continuously moves in the + X direction.

Hereinafter, an example of operations performed when a roll of film-like substrate P is exposed using the exposure apparatus EX of the present embodiment will be described with reference to the flowchart of fig. 7. This exposure operation is controlled by the main control unit 4. At this point, it is assumed that masks MA and MB are loaded onto tables 10A and 10B of first mask table MST in FIG. 1 and that alignment thereof has been completed.

First, at step 101 in fig. 7, a roll of film-like substrate P having a sheet form is attached to the supply roll 20 shown in fig. 1. At this stage, the photoresist is not coated on the film-like substrate P. Note that the alignment marks PMA to PMD have been formed on (attached to) the sequence of the pattern transfer region 60A and the like on the film-like substrate P, respectively, in the manufacturing process performed. The distal end portion of the film-like substrate P is transferred toward the winding roll 50 via the roller 22, the air guide 24, the drum-shaped rolling guide 26, and the top surface of the step-type stage device 28. At the next step 102, winding of the film-shaped substrate P in the + X direction by the winding roller 50 is started, and moving of the film-shaped substrate P in the + X direction by the step-type stage device 28 is started. Note that the moving speed of the film-like substrate P in the + X direction is adjusted by the step-type stage device 28. The winding speed of the winding roller 50 is set so that the drop of the film-like substrate P between the stepped stage device 28 and the winding roller 50 is contained within a predetermined range. At the next step 103, the coating of the photoresist on the film-like substrate P by the resist coater 54 is started.

The following operations are related to each fourth bar among the bars 30A to 30L, i.e., the bars 30A, 30E, and 30I of the step floor device 28, and the same type of operations may also be sequentially performed with respect to the other bars 30B to 30D, 30F to 30H, and 30J to 30L. That is, at the next step 104, as shown by an arrow a1 in fig. 4A, the rod 30A having released the suction by the suction hole 31 is lifted diagonally upward, and when it reaches a position B1 at the end of the top surface of the step platform device 28 in the-X direction, the film-like substrate P is transferred from the drum-like rolling guide 26 to the rod 30A. Substantially simultaneously with this, the on-off valve 44V of the tube 44 communicating with the suction hole 31 of the rod 30A is set to the first state by the substrate stage control unit 6, the sending section 39, and the receiving section 56 in fig. 3B, and suction of the film-shaped substrate P by the suction hole 31 in the rod 30A is started.

At this time, as shown in fig. 4A, since the central portion of the drum-like rolling guide 26 is narrow, the film-like substrate P is transferred to the rod 30A with its central position PC positioned lower in the-Z direction. As a result, the suction of the film-like substrate P by the rod 30A starts from the central portion PC and gradually moves toward both end portions thereof. Therefore, there is no distortion or the like of the film-like substrate P, and the film-like substrate P is stably sucked and held by the rods 30A with a high flatness maintained in the rods 30A. As a result, subsequent alignment and exposure can be performed at a high level of accuracy.

In the next step 105, the rod 30A holding the film-like substrate P is moved by the stage device 28 in the + X direction at a predetermined moving speed (i.e., scanning speed). Next, at step 106, as shown in fig. 4B, the positions of alignment marks PMA and PMB in pattern transfer region 60C on film-like substrate P shown in fig. 5A are detected by alignment systems 52A and 52B as rod 30A passes through the detection regions of alignment systems 52A and 52B. When the rod 30A is further moved in the + X direction, the next rod 30B reaches the position B1 and the rod 30B also supports the film-like substrate P by suction. Thereafter, when the bars 30A and 30B reach the positions shown in fig. 4C, the positions of the alignment marks PMC and PMD in the pattern transfer region 60C on the film-like substrate P are detected by the alignment systems 52A and 52B, and both ends of the pattern transfer region 60C are stably supported by the bars 30A and 30B. The detection results of the positions of the alignment marks PMA to PMD are supplied to an alignment control section in the main control unit 4. The alignment control section determines the amount of positional shift (Δ XC, Δ YC) in the X direction and the Y direction and the amount of rotational shift Δ θ zc in the θ z direction of the target position of the pattern transfer area 60C from these detection results, and supplies the amount of positional shift and the amount of rotational shift to the stage control section in the main control unit 4.

Based on the positional displacement amounts (Δ XC, Δ YC) and the rotation angle displacement amount Δ θ zc, the stage control section drives the mask stage MST and the ladder type stage device 28 via the mask stage control unit 8 and the substrate stage control unit 6, so that the pattern image of the mask MA is accurately registered and exposed onto the pattern transfer region 60C of the film-like substrate P. That is, at the next step 107, as shown in fig. 6A, the moving operations of the partial pattern areas MA1 to MA4 are performed in synchronization with the moving operations of the four partial areas of the pattern transfer area 60, so that the pattern image of the mask MA is scan-exposed onto the pattern transfer area 60C. In the moving operation of the partial pattern regions MA1 to MA4, the partial pattern regions MA1 to MA4 of the mask MA are moved at the speed VM in the + X direction indicated by the arrow a6 with respect to the irradiation regions 18A to 18D of the partial projection optical systems PLA to PLD of the projection optical system PL. In the moving operation of the four partial areas of the pattern transfer area 60, as shown in fig. 5B, with respect to the exposure areas 18AP to 18DP of the partial projection optical systems PLA to PLD, the four partial areas of the pattern transfer area 60 of the film-shaped substrate P are moved at a speed VM · β (where β is the projection magnification of the projection optical system PL) in the + X direction. At this time, for example, since the mask MA is moved so as to compensate for the above-described positional shift amount (Δ XC, Δ YC) and rotational angle shift amount Δ θ zc, the position and rotational angle of the mask MA are corrected.

Note that these positional displacement amounts and rotational angular displacement amounts on the pattern transfer region 60C side of the film-like substrate P can also be corrected by the moving speed of the levers 30A to 30L by the step-type stage device 28, by the balance of the moving speeds of the control chains 32A and 32B, and by the driving section 38A. Further, in fig. 6A, when the mask MA is moved in the + X direction via the first stage 10A, the mask MB is moved on the second stage 10B side in the-X direction as indicated by an arrow a 7.

During this scanning exposure, when the position of the rod 30A reaches the position B2 of the end of the exposure area 58E in the + X direction, at step 108, the on-off valve 44V of the tube 44 communicating with the suction hole 31 of the rod 30A is set to the second state, and the suction of the film-shaped substrate P by the suction hole 31 of the rod 30A is released. The rods 30A are then moved diagonally downward away from the film-like substrate P by the stepped platform arrangement 28. When the next lever 30B subsequently reaches position B2, the scanning exposure to pattern transfer area 60C ends.

At this time, as shown in fig. 6B, on the mask stage MST side, the entire frame 12 is moved in the-Y direction indicated by an arrow A8, and the mask MB on the second stage 10B is moved to the scanning start position of the irradiation region of the projection optical system PL. Next, as shown in fig. 6C, during the scanning exposure to the next pattern transfer region 60D of the film-like substrate P, the pattern image of the mask MB is exposed to the pattern transfer region 60D by moving part of the pattern regions MB1 to MB4 toward the irradiation regions 18A to 18D of the projection optical system PL in the + X direction indicated by an arrow a 9. At this time, since the mask MA is moved in the-X direction indicated by an arrow a10, by moving the frame 12 in the + Y direction indicated by an arrow a11, the pattern image on the mask MA can be subsequently exposed to the next pattern transfer area. In this way, by alternately exposing the pattern images of the masks MA and MB to adjacent pattern transfer regions on the film-shaped substrate P, exposure to the film-shaped substrate P can be efficiently performed while continuously moving the film-shaped substrate P in the same direction (i.e., + X direction) and also shortening the empty region between the adjacent pattern transfer regions.

Further, during the scanning exposure of the pattern transfer region 60C, the alignment of the next pattern transfer region 60D on the film-like substrate P supported by the bars 30C and 30D shown in fig. 5B is performed.

In the next step 109, determination is performed as to whether exposure of the film-like substrate P is finished. If the exposure has not ended, the operations of steps 104 to 108 are sequentially repeated for the bars 30E, 30I, and 30A, etc., and the alignment and scanning exposure is repeated for the next pattern transfer region 60E, etc., of the film-like substrate P.

If it is determined in step 109 that the exposure of the film-shaped substrate P has ended, the operation moves to step 110, and the operations of the resist coater 54 and the step-type stage device 28 are stopped by the main control unit 4, and the film-shaped substrate P is wound to the wind-up roll 50. The wound film-like substrate P is, for example, conveyed to a developing device (not shown) and developed.

In this way, according to the exposure apparatus EX of the present embodiment, it is possible to efficiently coat a photoresist and expose an image of a mask pattern onto a roll of film-like substrate P.

The operation and effect of the present embodiment are as follows.

(1) In the present embodiment, the substrate moving device PDV that transfers the film-shaped substrate P includes a stepped stage device 28 for supporting the film-shaped substrate P. Further, the step-type stage device 28 includes a plurality of rods 30A to 30L, and a driving mechanism that synchronously moves the plurality of rods supporting the film-like substrate P among the rods 30A to 30L in the + X direction. The plurality of rods 30A to 30L are arranged such that the longitudinal direction thereof extends in the Y direction orthogonal to (intersecting with) the + X direction (where the + X direction is the moving direction along the surface of the film-like substrate P), and such that they are aligned in parallel in the moving direction.

Further, the method for transferring the film-like substrate P by the substrate moving apparatus PDV includes: a step 102 in which the film-like substrate P is moved in the + X direction; a step 104 in which a plurality of surface positions of the film-like substrate P are supported by a plurality of rods among the plurality of rods 30A to 30L; and steps 105 and 106 in which the plurality of rods supporting the film-like substrate P are synchronously moved in the + X direction.

According to the present embodiment, the film-shaped substrate P is moved by moving a plurality of rods supporting the film-shaped substrate P among the rods 30A to 30L in the moving direction. Therefore, since there is substantially no relative movement between the film-like substrate P and the member supporting it, the flexible, elongated film-like substrate P can be horizontally conveyed along the target conveying path with high accuracy.

(2) Further, the substrate moving device PDV includes a winding roller 50 that moves the film-shaped substrate P in the + X direction. Further, the ladder platform assembly 28 includes a pair of chains 32A and 32B and drive motors 36A and 36B. The pair of chains 32A and 32B join the rods 30A to 30L together along an endless trajectory including a position B1 and a position B2, where at a position B1, the rods 30A to 30L support the film-like substrate P, and a position B2 is located downstream of the position B1 and is a position where the rods 30A to 30L are moved away (separated) from the film-like substrate P. The drive motors 36A and 36B move the rods 30A to 30L along an endless track via the chains 32A and 32B by rotating the sprockets 34a1 and 34a2 that drive the chains 32A and 32B.

By using the step-type stage device 28, the film-shaped substrate P can be stably moved in the moving direction by a simple structure of moving the rods 30A to 30L in a constant direction along the closed loop.

Therefore, even if the film-shaped substrate P is a flexible, elongated sheet-like photosensitive object (i.e., a belt-shaped member), exposure to a series of pattern forming areas on the film-shaped substrate P can be efficiently performed while continuously moving the film-shaped substrate P in a constant direction.

(3) Further, the substrate moving device PDV includes a rotatable drum rolling guide 26 whose longitudinal direction extends in the Y direction and whose both end portions are formed in a bar shape wider than a central portion thereof, and the rotatable drum rolling guide 26 is used to bend the conveying path of the film-shaped substrate P and transfer the film-shaped substrate P to the bar at the position B1 among the bars 30A to 30L. That is, the drum-like rolling guide 26 is arranged such that its longitudinal direction is parallel to the rods 30A to 30L.

Further, at step 104, the film-like substrate P is transferred to the bar at the position B1 among the bars 30A to 30L via the drum-like rolling guide 26. Therefore, since the film-like substrate P is supported on the rods initially at the central portions of the rods and then gradually outward toward both end portions of the rods, there is no twist in the film-like substrate P when transferring the film-like substrate P.

(4) When the film-like substrate P is supported by, for example, at least two rods 30A and 30B among the plurality of rods 30A to 30L, a spacing adjustment mechanism may be provided which adjusts the spacing in the X direction between the two rods 30A and 30B supporting the film-like substrate P.

For example, in fig. 2C, the interval adjustment mechanism is provided in the portion of the chains 32A and 32B of the support rod 30A, and may be constituted by a drive element (i.e., a piezoelectric element or the like) that moves the rod 30A in the ± X direction. There are the following cases: by widening the interval between the bars 30A and 30B using this interval adjustment mechanism, the portion of the film-shaped substrate P held by the bars 30A and 30B by suction can be prevented from falling downward.

Further, the stepped stage device 28 always supports the film-like substrate P using, for example, four rods among the rods 30A to 30L. However, a greater number of rods may be used to support the film-like substrate P. Further, it is also possible to support the film-like substrate P using only two of the rods 30A to 30L.

Note that the number of rods 30A to 30L of the stepped platform arrangement 28 is optional. For example, it is also possible to provide only three rods that move in a circular trajectory, and to use two of these rods to support the film-shaped substrate P and convey the film-shaped substrate P in the + X direction.

(5) Further, the step type stage device 28 includes a suction mechanism having the suction hole 31, a tube 44 equipped with a switching valve 44V, a common pipe 40, and a vacuum pump 43 so as to vacuum-suck the film-like substrate P onto each of the rods 30A to 30L during a period in which the rods 30A to 30L support the film-like substrate P. Therefore, the film-like substrate P can be stably supported by the rods 30A to 30L.

Note that the film-like substrate P may also be sucked onto the rods 30A to 30L using, for example, electrostatic suction.

(6) The exposure apparatus EX of the present embodiment is an exposure apparatus that exposes a film-like substrate P, and includes: a substrate moving device PDV for transferring the film-shaped substrate P; alignment systems 52A and 52B that detect alignment marks PMA to PMD formed on the pattern transfer region of the film-like substrate P supported by the bars 30A to 30L; and an exposure section including a projection optical system PL that aligns the position of the pattern transfer region of the film-like substrate P with the position of the pattern image of the mask MA (or MB) based on the detection results from the alignment systems 52A and 52B, and exposes the pattern transfer region supported by the bars 30A to 30L and moving in the + X direction.

Further, the exposure method performed by the exposure apparatus EX includes: a step 105 in which the film-like substrate P is moved in the + X direction using the transfer method performed by the substrate moving apparatus PDV; a step 106 in which alignment marks PMA to PMD formed on the pattern transfer region of the film-like substrate P supported by the bars 30A to 30L are detected; and a step 107 in which the positions of the pattern transfer area and the pattern image of the mask MA (or MB) are aligned based on the detection result of the alignment mark, and the pattern transfer area supported by the bars 30A to 30L and moved in the + X direction is exposed.

According to the exposure apparatus EX or the exposure method thereof, since the film-shaped substrate P can be moved horizontally with high accuracy along the target path, the pattern images of the masks MA and MB can be exposed onto each pattern transfer area on the film-shaped substrate P with high accuracy level as well as high overlay accuracy level.

Note that the following modifications are possible in the present embodiment.

(1) As shown in fig. 5A, in the above-described embodiment, the narrow intermediate region 58S is provided between the alignment region 58A and the exposure region 58E.

In contrast, as shown by the stepped stage device 28B including the lever 30A and the like shown in fig. 8, a spare area 58W having substantially the same length as the exposure area 58E may also be provided between the alignment area 58A (the end of which corresponds to the detection area of the alignment systems 52A and 52B) and the exposure area 58A (the end of which corresponds to the exposure area of the projection optical system PL). In this case, the length of the portion of the stepped stage device 28B supporting the film-like substrate P is longer than the stepped stage device 28. However, the positional deviation or the like may be corrected while the pattern transfer areas 60B and 60C or the like of the film-like substrate P to be exposed pass through the spare area 58W. Therefore, the intervals between the respective pattern transfer regions 60B and 60C and the like on the film-like substrate P can be narrowed.

(2) Next, the projection optical system PL is constituted by four partial projection optical systems PLA to PLD. However, the number and placement of the partial projection optical systems PLA to PLD are optional. Further, the projection optical system PL may also be constituted by a single projection optical system. The projection magnification of the projection optical system PL may also be an equivalent magnification or a reduction magnification.

Further, the projection optical system PL projects an image of the patterns of the masks MA and MB onto the film-like substrate P. However, instead of the masks MA and MB, an image of a variable pattern formed on a liquid crystal panel or a Digital Mirror Device (DMD) or the like may also be formed on the film-like substrate P by the projection optical system PL. In this case, the interval between two adjacent pattern transfer regions on the film-like substrate P can be reduced to the minimum possible.

Further, instead of the projection optical system PL, a pattern may also be drawn on the film-like substrate P using an electron beam drawing device.

(3) Further, in the above-described embodiment, the film-like substrate P is continuously moved in the + X direction. However, the film-like substrate P may be intermittently moved. In this case, for example, when the position of the alignment mark on the film-shaped substrate P is detected by the alignment systems 52A and 52B, the film-shaped substrate P is stopped, and at other times, the film-shaped substrate P is continuously moved in the + X direction.

(4) Further, the moving speed of the film-shaped substrate P is not absolutely necessary to be a constant speed, and the moving speed of the film-shaped substrate P during exposure may also be different from that at other times, for example.

The stepped platform assembly 28 joins the rods 30A-30L together by means of chains 32A and 32B. However, it is also possible to support the rods 30A to 30L and move the rods 30A to 30L in a constant direction by a track-type mechanism such as that used in construction machines and the like, for example.

Further, in the above-described embodiment, both end portions in the X direction of each pattern transfer region 60A and the like on the film-like substrate P are supported by the rods 30A to 30L. However, it is also possible to support a portion of the film-like substrate P including one or more pattern transfer regions by a large number of bars arranged at equal intervals in the X direction and move it in the X direction.

(6) In the substrate moving apparatus PDV shown in fig. 1, a rotatable cylindrical roller may be used instead of the drum-like rolling guide 26. Further, in this case, a mechanism may also be provided that deforms (i.e., bends) the central portion of the rod 30A or the like and protrudes outward toward the film-like substrate P, wherein the rod 30A or the like is the rod that reaches the position B1 (see fig. 4A), and the position B1 is the transfer position that transfers the film-like substrate P to the step-like stage device 28. Thereby, the film-like substrate P is initially sucked onto the rod 30A from the central portion of the rod 30A and then gradually outwardly toward both end portions in the same manner as when the drum-like rolling guide 26 is used, so that the film-like substrate P is transferred to the rod 30A without any distortion or the like.

(7) Further, it is also possible to dispose a developing device between the step-type stage device 28 and the winding roller 50 shown in fig. 1 and develop the photoresist on the film-shaped substrate P before winding the film-shaped substrate P to the winding roller 50.

[ second embodiment ]

Next, a second embodiment of the present invention will be described with reference to fig. 9 and 10. In the present embodiment, the present invention is applied to a rolling member paneling device EP that continuously adheres a sheet-like (belt-like) flexible color filter CF and a TFT substrate TP as a sheet-like flexible TFT (thin film transistor) substrate. In fig. 9 and 10, the same or similar reference numerals are used for portions corresponding to those in fig. 1 to 3B, and detailed description thereof is omitted.

Fig. 9 shows a rolling member paneling device EP of the present embodiment, and fig. 10 shows the structure of the stepped platform devices 28 and 28A shown in fig. 9. Note that the gap (interval) between the stepped land means 28 and 28A in the Z direction shown in fig. 10 is larger than the actual gap. Further, in fig. 9, the gap between the stepped platform devices 28 and 28A in the Z direction is set to be such a gap: the color filter CF and the TFT substrate TP located between the step-type stage devices 28 and 28A through the gap are almost in contact with each other.

In fig. 9, the rolling member paneling apparatus EP includes: a first moving means that continuously moves the color filter CF in the + X direction; a second moving device that continuously moves the TFT substrate TP in the + X direction so that it faces the color filter CF; an adhesive application device 64 that applies, for example, a thermosetting adhesive LQ to the color filter CF; alignment systems 52A and 52B that detect the positions of alignment marks (not shown) formed in the respective device regions of the color filter CF; alignment systems 52C and 52D that detect positions of alignment marks (not shown) formed in respective device regions of the TFT substrate TP; a heating device 71 that emits infrared rays or the like to cure the adhesive LQ; and a cutting device 68 and a support base 66 which cut (cut) a portion corresponding to one device region of the color filter CF and the TFT substrate TP attached to each other.

The first mobile device includes: a supply roller 20 that supplies the color filter CF; a roller 22 that changes the direction of the color filter CF; an air guide 24 that controls the tension of the color filter CF; a ladder type stage device 28 which holds the color filter CF by suction and moves it in the + X direction; and a drum-like rolling guide 26 that transfers color filters CF from air guide 24 to a stepped stage assembly 28. As shown in fig. 10, the structure of the ladder type stage device 28 is the same as that in the first embodiment (fig. 1), and the operation thereof is controlled by the first stage control unit 6A.

The second mobile device includes: a supply roller 20A which supplies the TFT substrate TP; a roller 22A which changes the direction of the TFT substrate TP; a step-shaped stage device 28A which holds the TFT substrate TP by suction and moves it in the + X direction; and a drum-shaped rolling guide 26A which transfers the TFT substrate TP from the roller 22A to the stepped stage substrate 28A. The drum-like rolling guide 26A has the same shape as the drum-like rolling guide 26. Note that there is a tendency for the TFT substrate TP to fall down in the-Z direction. However, since it is supported by the color filter CF, the sag therein is extremely small. To reduce this slack even further, an air guide or the like for tension adjustment may also be provided, for example, between the roller 22A and the drum-like rolling guide 26A.

As shown in fig. 10, in the same manner as the stepped stage device 28, in the stepped stage device 28A, a plurality of (here, 12) levers 62A to 62L (suction holes 31A are formed in each of the levers 62A to 62L) are engaged between the two chains 32C and 32D, and the chains 32C and 32D are rotated by driving motors 36C and 36D (36D not shown), the plurality of levers holding the TFT substrate TP by suction from the top surface side thereof among the levers 62A to 62L are moved in the + X direction. However, since the driving portion 38A for position adjustment in the Y direction is provided on the stepped stage device 28 side, it is not necessary to provide a position adjustment mechanism for the Y direction on the stepped stage device 28A side. The operation of the stepped stage device 28A is controlled by the second stage control unit 6B, and the stage control units 6A and 6B are controlled by the main control unit 4A.

In fig. 9, for example, the adhesive application device 64 is located on the portion between the drum roll guide 26 and the stepped platform device 28. Alignment systems 52A and 52B and alignment systems 52C and 52D are located within chains 32A and 32B and chains 32C and 32D, respectively. The heating devices 71 are located within the chains 32C and 32D and the cutting device 68 is located immediately after the ends of the stepped platform devices 28 and 28A in the + X direction. In this case, a region extending from the alignment systems 52A and 52B and the alignment systems 52C and 52D by substantially the length of one device region in the + X direction forms an alignment region 58A, and a region extending from the alignment systems 52A and 52B by substantially the length of one device region in the X direction forms an adhesion region 58L, the adhesion region 58L including a region to which infrared rays are radiated by the heating device 71.

In the rolling member paneling device EP of the present embodiment, in fig. 10, the color filters CF and the TFT substrates TP supplied from the supply rollers 20 and 20A are transferred from the central portions thereof to the levers 30A to 30L of the stepped platform devices 28 and 28A moving in the direction shown by the arrow a91 and the levers 62A to 62L moving in the direction shown by the arrow a92 via the drum-like rolling guides 26 and 26A, respectively. Therefore, no distortion or the like is generated in the color filter CF and the TFT substrate TP. Further, the adhesive LQ is applied by the adhesive application device 64 to a predetermined depth on the top surface of the color filter CF that has been transferred to the stepped stage device 28.

Thereafter, the position and rotation angle of the color filter CF are measured by the alignment systems 52A and 52B, and in parallel therewith, the position and rotation angle of the TFT substrate TP are measured by the alignment systems 52C and 52D. Based on the results of these detections, the alignment control section within the main control unit 4 shown in fig. 10 calculates the amount of positional shift and the amount of rotational shift between the device area of the color filter CF and the device area of the TFT substrate TP. Further, the stage control section within the main control unit 4 corrects, for example, the positions of the color filters CF on the side of the stepped stage device 28 in the X direction and the Y direction and the rotation angles in the θ z direction so that the positional displacement amounts and the rotation angle displacement amounts thereof are corrected.

Thereafter, the color filter CF and the TFT substrate TP in the device region are stuck together by radiating infrared rays from the heating device 71 to the device region of the color filter CF and the TFT substrate TP that have entered the sticking region 58L from the alignment region 58A. Thereafter, by cutting one device portion of the color filters CF and the TFT substrates TP, which have been transferred out by the ladder type stage devices 28 and 28A, using the cutting device 68, one device portion of the display element can be manufactured.

According to the present embodiment, since the sheet-shaped color filters CF and the TFT substrates TP are transferred using the stage devices 28 and 28A so as to face each other, the color filters CF and the TFT substrates TP can be transferred along the target path at a high level of accuracy. Therefore, the display element can be manufactured with high accuracy.

Further, by forming predetermined patterns (i.e., circuit patterns, electrode patterns, etc.) on a film-like substrate using the exposure apparatus EX of the above-described embodiment, a large number of liquid crystal display elements can be obtained as microdevices. Hereinafter, an example of this manufacturing method will be described with reference to a flowchart shown in fig. 11.

In step S401 (pattern forming process) in fig. 11, the following processes are performed: first is a coating process in which a photosensitive substrate is prepared by coating a photoresist to a film-like substrate (exposure object) to be exposed; an exposure process in which a pattern of a mask for a liquid crystal display element is transferred to a large number of pattern forming regions on the photosensitive substrate by exposure using the above-described exposure apparatus; and a developing process in which the photosensitive substrate is developed. By performing a photolithography process including these coating, exposing, and developing processes, a predetermined resist pattern is formed on the film-like substrate. After the photolithography process, an etching process using these resist patterns as a mask, a resist scrub process, and the like are performed. As a result, a predetermined pattern including a large number of electrodes and the like is formed on the film-like substrate. The photolithography process and the like may be performed a plurality of times depending on the number of layers on the film-like substrate.

In the next step S401 (color filter formation process), color filters are formed by arranging a large number of sets of three micro color filters corresponding to red (R), green (G), and blue (B) in a matrix pattern, or by arranging a plurality of color filter sets constituted by three red R, green G, and blue B bars in the horizontal scanning line direction. In the next step S403 (cell assembly process), liquid crystal is injected, for example, between the film-like substrate having the predetermined pattern obtained from step S401 and the color filter obtained from step S402, thereby manufacturing a liquid crystal panel (i.e., a liquid crystal display cell).

At next step S404 (module assembling process), components such as circuits and backlight for performing display operation are mounted on a large number of liquid crystal panels (i.e., liquid crystal display units) assembled in this manner, and the liquid crystal display elements are completed. The above-described manufacturing method of the liquid crystal display element includes a process of exposing the pattern of the mask to the photosensitive substrate using the exposure apparatus of the above-described embodiment, and a process of processing the photosensitive substrate exposed by the process by performing development or the like. Therefore, since exposure can be performed with a high level of accuracy and high efficiency, the throughput of the device manufacturing process is improved.

Further, in the above-described embodiments, a flexible, elongated sheet-like member is used as the film-like member to be exposed. However, as the film-like member, a rectangular plate-like glass plate having high rigidity for manufacturing a liquid crystal display element or the like, a ceramic substrate for manufacturing a thin film magnetic head, a circular semiconductor wafer for manufacturing a semiconductor element, or the like can also be used.

Note that, in the above-described embodiment, the discharge lamp is used as the exposure light source, and the desired g-ray light, h-ray light, or i-ray light is selected. However, the present invention is not limited thereto, and the present invention can be applied to the following cases: light from an ultraviolet LED, laser light from a KrF excimer laser (248nm) or an ArF excimer laser (193nm), or a higher harmonic of a solid-state laser such as a semiconductor laser (for example, a triple higher harmonic of a YAG laser (having a wavelength of 355 nm)) is used for the exposure light.

In this way, the present invention is not limited to the above-described embodiments, and various structures can be obtained as long as they do not depart from the spirit or scope of the present invention.

Claims (20)

1. A transfer method for transferring a flexible elongated film-like substrate, comprising:

a first step of moving the film-like substrate in a longitudinal direction of the film-like substrate along a predetermined transport path;

a second step of synchronously moving a plurality of rod-shaped members in a moving direction by a chain or track-type mechanism that supports the rod-shaped members at predetermined intervals in the moving direction, the rod-shaped members being capable of supporting a surface position of the film-shaped substrate in a suction manner across a width direction, wherein longitudinal directions of the rod-shaped members face a width direction intersecting an elongated direction of the film-shaped substrate;

a third step of causing each of the plurality of rod-like members moved in the second step to sequentially contact a plurality of surface positions of the film-shaped substrate moved in the first step, thereby causing the film-shaped substrate to be supported in a suction manner so as to be moved in the moving direction in a planar manner; and

and a fourth step of controlling the movement of the chain or the track-type mechanism so as to adjust the positional displacement of the film-shaped substrate in the width direction or the rotational displacement of the film-shaped substrate in a plane parallel to the surface of the film-shaped substrate during the third step.

2. The transmission method according to claim 1, wherein the third process includes:

sequentially moving first and second rod-shaped members among the plurality of rod-shaped members to a first position on the conveyance path of the film-like substrate; and

first and second surface positions sequentially transferred to the first position among the plurality of surface positions are supported in a sucking manner by the first and second rod-shaped members, respectively.

3. The transmission method of claim 2, comprising:

sequentially moving away the first and second rod-like members from the first and second surface positions, respectively, to a second position downstream of the first position on the conveying path.

4. The transmission method according to claim 2, wherein the first process includes:

bending the transport path of the film-like substrate via a guide member formed in a rod shape in which an end portion of the guide member is wider than a central portion thereof and a longitudinal direction of the guide member is aligned in a direction intersecting the moving direction; and

sequentially moving the first and second surface positions of the film-shaped substrate toward the first position with a central portion of the film-shaped substrate in the width direction being flexed toward the first and second rod-shaped members by passing through the guide member.

5. The method of delivery of claim 2, wherein

The fourth process includes: adjusting the spacing of the first and second rod-like members in relation to the direction of movement.

6. The method of delivery according to any one of claims 1 to 5, wherein

The third step includes: the surface position of the film-like substrate supported by the rod-like members is initially sucked from the central portion of the rod-like members and then gradually moved to both end portions thereof.

7. An exposure method for exposing a film-like substrate, comprising:

moving the film-like substrate in a moving direction using the transfer method according to any one of claims 1 to 6;

detecting an alignment mark formed on a portion to be exposed supported by the rod-like members from among the film-like substrates; and

performing alignment of the portion to be exposed of the film-shaped substrate with a pattern of an exposure object based on a detection result of the alignment mark, and exposing the portion to be exposed supported by the rod-like member and moved in the moving direction.

8. A manufacturing method for adhering a first film-like substrate and a second film-like substrate, comprising:

transferring the first film-like substrate using the transfer method according to any one of claims 1 to 6;

using the transfer method according to any one of claims 1 to 6, transferring the second film-like substrate so as to face the first film-like substrate;

detecting alignment marks formed on a first portion and a second portion supported by the rod-like members, respectively, from among the first and second film-like substrates; and

performing alignment of the first portion and the second portion of the first and second film-like substrates based on a detection result of the alignment mark, and adhering the first portion and the second portion that are supported by the rod-like members and move in the moving direction.

9. The manufacturing method according to claim 8, further comprising:

cutting a portion including the first portion and the second portion of the first and second film-like substrates after the first portion and the second portion have been adhered.

10. A device manufacturing method, comprising:

exposing a film-like photosensitive substrate using the exposure method according to claim 7; and

processing the film-like photosensitive substrate after the exposure.

11. A device manufacturing method, comprising:

using the manufacturing method according to claim 8 or claim 9, the first and second film-like substrates are adhered.

12. A transfer device that transfers a flexible, elongated film-like substrate, characterized by comprising:

a substrate moving device that moves the film-shaped substrate in a longitudinal direction of the film-shaped substrate along a predetermined conveyance path;

a stage device that synchronously moves a plurality of rod-shaped members in a moving direction by a chain or track-type mechanism that supports the rod-shaped members at predetermined intervals in the moving direction, wherein the rod-shaped members are capable of supporting a surface position of the film-shaped substrate in a suction manner across a width direction, wherein longitudinal directions of the rod-shaped members face a width direction that intersects an elongated direction of the film-shaped substrate; and

a driving device that controls movement of the chain or the track-type mechanism to adjust a positional displacement of the film-like substrate in a width direction or a rotational displacement of the film-like substrate in a plane parallel to a surface of the film-like substrate,

each of the plurality of rod-shaped members moved by the stage device sequentially contacts a plurality of surface positions of the film-shaped substrate moved by the substrate moving device to move the film-shaped substrate supported in a suction manner in a planar shape in the moving direction, and a positional shift or a rotational shift of the film-shaped substrate is adjusted by the driving device.

13. The transfer device of claim 12,

the chain or track-type mechanism of the stage device is an engagement mechanism that engages the plurality of rod-like members along an endless track including a first position at which the plurality of rod-like members support the film-like substrate in a suction manner and a second position that is downstream in the moving direction with respect to the first position and that is a position at which the plurality of rod-like members are moved away from the film-like substrate,

there is a drive motor that moves the plurality of rod-like members along the circular trajectory via the engagement mechanism.

14. The transfer device as set forth in claim 13,

the substrate moving apparatus includes a guide member,

the guide member is formed in a rod shape in which a longitudinal direction of the guide member is aligned in a direction intersecting the moving direction, and both end portions of the guide member are wider than a central portion thereof, and bends a conveyance path of the film-like substrate and transfers the film-like substrate to the rod-like member located at the first position among the plurality of rod-like members.

15. The transfer device of any one of claims 12 to 14,

the stage device includes a spacing adjustment mechanism that adjusts a spacing between at least two rod-shaped members that support the film-like substrate, the film-like substrate being supported by the at least two rod-shaped members that are separated by the spacing in the moving direction among the plurality of rod-shaped members.

16. An exposure apparatus that exposes a flexible elongated film-like substrate, comprising:

the transfer device according to any one of claims 12 to 15, which transfers the film-like substrate;

a mark detection system that detects, from among the film-like substrates, alignment marks formed on portions to be exposed supported by the rod-like members of the transfer device; and

an exposure section that performs alignment of the portion to be exposed of the film-like substrate with a pattern of an exposure object based on a detection result of the mark detection system, and exposes the portion to be exposed that is supported by the rod-like member and that moves in the moving direction.

17. A manufacturing apparatus that adheres a first film-like substrate and a second film-like substrate, comprising:

a first conveying device that conveys the first film-like substrate, the first conveying device being constituted by the conveying device according to any one of claims 12 to 15;

a second transfer device that transfers the second film-like substrate so as to face the first film-like substrate, the second transfer device being constituted by the transfer device according to any one of claims 12 to 15;

a mark detection system that detects, from among the first and second film-like substrates, alignment marks formed on a first portion and a second portion supported by the rod-like members, respectively; and

an adhering portion that performs alignment of the first portion and the second portion of the first and second film-like substrates, and adheres the first portion and the second portion that are supported by the rod-like members and that move in the moving direction.

18. The manufacturing apparatus of claim 17, further comprising:

a cutting mechanism that cuts a portion including the first portion and the second portion of the first and second film-like substrates adhered by the adhering portion.

19. A device manufacturing method, comprising:

exposing the film-like photosensitive substrate using the exposure apparatus according to claim 16; and

after the exposure, the film-like photosensitive substrate is processed.

20. A device manufacturing method, comprising:

using the manufacturing apparatus according to claim 17 or claim 18, the first and second film-like substrates are adhered.