HK1165771B - Cover tape for packaging electronic part and electronic part package - Google Patents

Description

Electronic component packaging upper tape and electronic component package

Technical Field

The present invention relates to a cover tape for electronic component packaging and an electronic component package.

Background

Electronic components for surface mounting (hereinafter referred to as "electronic components") such as transistors, diodes, capacitors, and piezoresistor elements are packaged in an electronic component package composed of a carrier tape (carrier tape) and an upper tape heat-sealed to the carrier tape, and the electronic component package is wound around a reel and then supplied to a site for surface mounting, as typified by an ic (integrated circuit). When the electronic component packaged in the electronic component package is surface-mounted on the electronic circuit board, the upper tape is peeled off from the electronic component package drawn from the reel, and the electronic component is taken out from the pocket of the carrier tape.

However, in the transportation of the electronic component packaged in the electronic component package, the upper tape is charged because static electricity is generated due to friction between the upper tape and the electronic component. In addition, static electricity is generated when the upper tape is peeled from the carrier tape, and the upper tape is charged. In recent years, with the miniaturization and high functionality of electronic devices, the miniaturization and weight reduction of electronic components mounted on the electronic devices have been rapidly advanced. These electronic components, which are small or light in weight, may adhere to the charged upper tape, and thus a process failure such as a pick-up (pick-up) failure may occur. In addition, the electronic component may be broken by ELECTROSTATIC DISCHARGE (ELECTROSTATIC DISCHARGE) of the charged upper belt.

In order to solve the problems caused by the electrification of the upper tape, for example, patent document 1 discloses an upper cover tape (corresponding to an upper tape) having a surface layer, an intermediate layer having an antistatic function, a heat-seal material layer, and an adhesive layer. The adhesive layer contains a conductive substance for preventing electrification and is used for bonding the surface layer and the intermediate layer. As the conductive material, a metal such as tin oxide, gold, silver, copper, iron, nickel, or zinc, or carbon such as ketjen black or acetylene black can be used.

Prior art documents:

patent document

Patent document 1 Japanese laid-open patent application No. 2000-142786

Disclosure of Invention

Problems to be solved by the invention

As described above, if metal or carbon is added to the adhesive layer, the conductivity of the upper cover tape is improved and the upper cover tape is not easily charged, but the transparency of the upper cover tape is reduced. Therefore, if metal or carbon is added to the adhesive layer, it is difficult for a user to visually confirm the electronic component packaged in the package through the upper cover tape.

The invention aims to provide an upper band for packaging an electronic component, which is not easily charged and has excellent transparency, and an electronic component package.

Means for solving the problems

（1）

An upper tape for electronic component packaging according to an aspect of the present invention is composed of a plurality of layers including at least a base material layer and a heat seal layer. At least any two of the plurality of layers are laminated via an adhesive layer. The adhesive layer contains an antistatic agent which accounts for 10 to 70 wt% of the adhesive layer. The main components of the antistatic agent are alkylene carbonate and surfactant.

As a result of intensive studies by the inventors of the present application, the following facts are clarified: the antistatic agent is added to the adhesive layer in an amount of 10 to 70 wt% based on the adhesive layer, whereby the electronic component packaging upper tape is less likely to be charged. Therefore, the electronic component packaging tape can suppress the pickup failure of the electronic component and can suppress the damage to the electronic component due to the electrostatic discharge.

Further, the antistatic agent contains alkylene carbonate and a surfactant as main components, and hardly or not at all contains a conductive substance such as metal or carbon which causes a decrease in transparency of the upper tape for packaging electronic parts. Therefore, the electronic component packaging upper tape has excellent transparency.

Therefore, the electronic component packaging upper tape is less likely to be charged and has excellent transparency.

（2）

In the electronic component packaging upper tape of the above (1), the adhesive layer contains an antistatic agent in an amount of 45 to 70 wt% based on the adhesive layer.

As a result of intensive studies by the inventors of the present application, the following facts are clarified: the antistatic agent is added to the adhesive layer in an amount of 45 to 70 wt% based on the adhesive layer, whereby the electronic component packaging upper tape is less likely to be charged. Therefore, the electronic component packaging upper tape can further suppress pickup failure of the electronic component and can further suppress damage to the electronic component due to electrostatic discharge.

（3）

The electronic component packaging upper tape according to the above (1) or (2), wherein the plurality of layers contain a buffer layer. The buffer layer is arranged between the base material layer and the heat sealing layer.

When the electronic component packaging upper tape is heat-sealed to the electronic component packaging carrier tape, the cushion layer exerts a cushioning effect to uniformly apply heat and pressure to the electronic component packaging upper tape and the electronic component packaging carrier tape. Thus, the electronic component packaging upper tape can be reliably heat-sealed to the electronic component packaging carrier tape.

（4）

In the electronic component packaging upper tape of (3), the base material layer and the buffer layer are laminated via the adhesive layer.

Since the adhesive layer can be easily provided between the base layer and the cushion layer, it is not necessary to newly provide an adhesive layer between the other layers. Therefore, the manufacturing cost of the upper tape for packaging electronic components can be reduced.

（5）

In the upper tape for packaging electronic parts according to any one of (1) to (4) above, the surfactant is an ionic surfactant.

The surfactant is an ionic surfactant and has excellent ionic conductivity. Therefore, the electronic component packaging upper tape is less likely to be electrically charged.

（6）

In the upper tape for packaging electronic parts according to the above (5), the ionic surfactant is a cationic surfactant.

Since the ionic surfactant is a cationic surfactant, it is easily dissolved in the alkylene carbonate. The alkylene carbonate solution of the cationic surfactant was transparent. Therefore, the electronic component packaging upper tape has excellent transparency. Further, the electronic component packaging upper tape is less likely to be electrically charged. Further, the use of an inexpensive cationic surfactant can reduce the production cost of the upper tape for packaging electronic components.

（7）

In the electronic component packaging upper tape of (6) above, the cationic surfactant is alkyl quaternary ammonium ethyl sulfate.

The cationic surfactant is alkyl quaternary ammonium salt ethyl sulfate. Therefore, the upper tape for packaging electronic parts is less likely to be charged.

（8）

In the upper tape for packaging electronic parts according to any one of the above (1) to (7), the alkylene carbonate is propylene carbonate.

As a result of intensive studies by the inventors of the present application, the following facts are clarified: by using propylene carbonate as the alkylene carbonate, the electronic component packaging tape is less likely to be electrically charged. Therefore, the electronic component packaging upper tape can further suppress pickup failure of the electronic component and can further suppress damage to the electronic component due to electrostatic discharge.

（9）

In the upper tape for packaging electronic parts according to any one of the above (1) to (8), the weight ratio of the alkylene carbonate to the surfactant (alkylene carbonate/surfactant) is from 10/90 to 40/60.

In the upper tape for packaging electronic parts, the weight ratio of the alkylene carbonate to the surfactant (alkylene carbonate/surfactant) is from 10/90 to 40/60. Therefore, the surfactant is present in a state of being dissolved in the alkylene carbonate. When the weight ratio of the alkylene carbonate to the surfactant is less than 10/90, the adhesive strength of the adhesive layer is insufficient. When the weight ratio of the alkylene carbonate to the surfactant exceeds 40/60, the surfactant serving as a medium for antistatic is insufficient, and therefore the antistatic effect of the antistatic tape for packaging electronic parts is reduced. Therefore, if the weight ratio of the alkylene carbonate to the surfactant (alkylene carbonate/surfactant) is within the above range, the adhesive layer has adhesiveness and is not easily charged.

（10）

In the electronic component packaging upper tape of any one of (1) to (9), the surface resistance value (measurement method: JIS K6911) of the adhesive layer having a humidity of 20% RH is 10⁸10 above omega¹²Omega is less than or equal to.

In the electronic component packaging upper tape, the surface resistance value of the adhesive layer is 10⁸10 above omega¹²Omega is less than or equal to. Therefore, the electronic component packaging upper tape has high conductivity at low humidity as compared with the conventional electronic component packaging upper tape. Therefore, the electronic component packaging upper tape is less likely to be electrically charged at low humidity.

（11）

In any of the electronic component packaging tapes of (1) to (10), when a voltage of 5kv is applied to the heat-sealed side surface in a state where both surfaces are not subjected to antistatic treatment, the decay time from charging until the charging voltage becomes 1% is 10 seconds or less.

The electronic component packaging tape can attenuate a charged voltage in a short time. This makes the electronic component packaging upper tape less likely to be electrically charged.

（12）

In any of the electronic component packaging tapes (1) to (11), when the heat-sealed side surface and the electronic component are rubbed at a speed of 300rpm for one minute with the surfaces on both sides thereof not subjected to the antistatic treatment, the absolute value of the charging voltage on the heat-sealed side surface of the electronic component packaging tape is 50V or less.

The electronic component packaging tape has a lower tape voltage generated when rubbed against an electronic component than conventional electronic component packaging tapes. Therefore, the electronic component packaging upper tape is less likely to be electrically charged.

（13）

Both surfaces or one surface of the upper tape for packaging electronic parts of any of the above (1) to (12) are subjected to antistatic treatment.

The electronic component packaging top tape is less likely to be charged because both or one of the surfaces is subjected to antistatic treatment.

（14）

In the upper tape for packaging electronic components according to any one of (1) to (13), the adhesive layer contains an adhesive resin. The antistatic agent is dissolved in the adhesive resin.

In general, when the antistatic agent is not dissolved and is dispensed, the adhesive force of the adhesive layer is reduced. However, in this electronic component packaging upper tape, the antistatic agent having no adhesive property exists in a state of being dissolved in the adhesive resin. Therefore, the adhesive layer has excellent adhesion.

（15）

The upper tape for packaging electronic components according to any one of (1) to (14) above, wherein the base material layer is formed of a film extending in one axis direction or two axis directions.

In the upper tape for packaging electronic components, the base layer is formed of a film extending in one or two axial directions. Therefore, the mechanical strength of the upper tape for packaging electronic components can be improved as compared with a substrate layer composed of an unstretched film.

（16）

In the upper tape for packaging electronic components according to any one of (1) to (15), the thickness of the base material layer is 12 μm or more and 30 μm or less.

In the upper tape for packaging electronic components, the thickness of the base material layer is 12 μm to 30 μm. Therefore, the electronic component packaging upper tape has appropriate rigidity. Therefore, when a torsional stress is applied to the heat-sealed electronic component packaging carrier tape, the electronic component packaging upper tape can be deformed in accordance with the electronic component packaging carrier tape, can be easily peeled from the electronic component packaging carrier tape, and can prevent the electronic component from falling off from the electronic component package.

Further, the electronic component packaging upper tape has appropriate mechanical strength. Therefore, the occurrence of breakage when the electronic component packaging upper tape is peeled from the electronic component packaging carrier tape at a high speed can be suppressed.

（17）

An electronic component package according to one aspect of the present invention includes the electronic component packaging upper tape according to any one of the above (1) to (16) and an electronic component packaging carrier tape, and the electronic component packaging upper tape is heat-sealed to the electronic component packaging carrier tape.

The electronic component package comprises the electronic component packaging upper tape. Therefore, the electronic component package can suppress a pickup failure of the electronic component and can suppress damage to the electronic component due to electrostatic discharge. Further, the electronic component package has excellent transparency.

（18）

In the electronic component package of (17), when the electronic component packaging upper tape is peeled from the electronic component packaging carrier tape at a peeling speed of 300mm/min (test conditions: according to JIS C0806-3) in a state where both surfaces of the electronic component packaging upper tape are not subjected to antistatic treatment, the absolute value of the charging voltage generated on the heat-sealed side surface of the electronic component packaging upper tape is 150V or less.

In the electronic component package, the tape voltage generated when the electronic component packaging upper tape is peeled from the electronic component packaging carrier tape is lower than that of the conventional electronic component package. Thus, the electronic component packaging upper tape is more antistatic.

（19）

The electronic component packaging upper tape according to one aspect of the present invention includes a plurality of layers and an adhesive layer. The multilayer comprises at least a substrate layer and a heat seal layer. The adhesive layer adheres at least any two of the multiple layers. The adhesive layer contains an antistatic agent in an amount of 10 to 70 wt% based on the adhesive layer. The main components of the antistatic agent are alkylene carbonate and surfactant.

As a result of intensive studies by the inventors of the present application, the following facts are clarified: the antistatic agent is added to the adhesive layer in an amount of 10 to 70 wt% based on the adhesive layer, whereby the electronic component packaging upper tape is less likely to be charged. Therefore, the electronic component packaging tape can suppress pickup failure of the electronic component and can suppress damage to the electronic component due to electrostatic discharge.

Further, the antistatic agent contains alkylene carbonate and a surfactant as main components, and hardly or completely contains a conductive material such as metal or carbon which causes a reduction in transparency of the upper tape for packaging electronic parts. Thus, the upper tape for packaging electronic components has excellent transparency.

Effects of the invention

The upper tape for electronic component packaging and the electronic component package of the present invention are less likely to be charged and have excellent transparency.

Drawings

Fig. 1 is a sectional view of an upper tape for electronic component packaging according to an embodiment of the present invention.

Fig. 2 is a perspective view of an electronic component package provided with an upper tape for packaging an electronic component.

Fig. 3 is a sectional view of the electronic component package shown in fig. 2 taken along line a-a.

Fig. 4 is a perspective view showing a state where the electronic component packaging upper tape is peeled off from the electronic component package.

Fig. 5 is an example of a polarization microscope image of the adhesive layer in a state in which the antistatic agent is dissolved.

Fig. 6 is an example of a polarizing microscope image of the adhesive layer in a state in which the antistatic agent is saturated and a part of the antistatic agent is not dissolved.

Reference numerals

100 upper belt (upper belt for electronic parts package)

110 base material layer

120 adhesive layer

121 antistatic agent

130 buffer layer

140 heat-seal layer

200 electronic component package

300 Carrier tape (electronic component carrier tape)

Detailed Description

The electronic component packaging upper tape 100 of the present embodiment (hereinafter referred to as "upper tape") is mainly formed by laminating a base material layer 110, an adhesive layer 120, a cushion layer 130, and a heat seal layer 140 in this order as shown in fig. 1. As shown in fig. 2 and 3, the upper tape 100 is heat-sealed to a carrier tape 300 for electronic component packaging (hereinafter referred to as "carrier tape") to constitute a part of an electronic component package 200. Hereinafter, each configuration of the upper belt 100 will be described.

(substrate layer)

As the base layer 110, if it is a film having mechanical strength capable of withstanding external force applied at the time of tape processing, heat sealing to the carrier tape 300, or the like, and heat resistance capable of withstanding heat sealing, films of various materials suitable for processing can be used depending on the application. Specifically, as a material of the base layer 110, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, nylon 6, nylon 66, polypropylene, polymethylpentene, polyvinyl chloride, polyacrylate, polymethacrylate, polyimide, polyetherimide, polyarylate, polysulfone, polyethersulfone, polyphenylene ether, polycarbonate, ABS resin, or the like can be used. In order to improve the mechanical strength of the base layer 110, polyethylene terephthalate, nylon 6, or nylon 66 is preferably used as the material of the base layer 110.

In order to improve the mechanical strength of the upper tape 100, a film extending in one or two axial directions is preferably used as the base layer 110. The thickness of the base layer 110 is preferably 12 μm to 30 μm, more preferably 16 μm to 28 μm, and particularly preferably 20 μm to 25 μm.

The rigidity of the upper tape 100 of the base material layer 110 having a thickness of less than 30 μm does not become excessively high. Thus, when a torsional stress is applied to the carrier tape 300 after heat sealing, the upper tape 100 deforms along with the deformation of the carrier tape 300. As a result, the upper tape 100 is not easily peeled off from the carrier tape 300.

The base material layer 110 having a thickness of more than 12 μm makes the upper tape 100 suitable in mechanical strength. Thus, when an electronic component for surface mounting (hereinafter referred to as "electronic component") 400 to be described later accommodated in the electronic component package 200 is taken out, the upper tape 100 is less likely to be broken when the upper tape 100 is peeled from the carrier tape 300 at a high speed.

(adhesive layer)

The adhesive layer 120 includes an adhesive resin and an antistatic agent. The main components of the antistatic agent are alkylene carbonate and a surfactant. The content of the antistatic agent in the adhesive layer 120 is preferably 10 wt% or more and 70 wt% or less, particularly preferably 20 wt% or more and 70 wt% or less, more preferably 30 wt% or more and 70 wt% or less, even more preferably 40 wt% or more and 70 wt% or less, and even more preferably 45 wt% or more and 70 wt% or less. The method for forming the adhesive layer 120 is not particularly limited, but a method for forming a coating layer is preferably used from the viewpoint of easy workability and cost reduction.

(1) Adhesive resin

As the adhesive resin, a known resin can be used as an adhesive for a film to be used for bonding an adherend such as a film. The adhesive resin is often treated with a solvent, and when used in a solvent, the adhesive resin needs to be a nonaqueous adhesive resin.

The adhesive layer 120 is interposed between the base layer 110 as a stretched film and the buffer layer 130. Thereby, the adhesive layer 120 is inserted as an adhesive resin for anchor coat (anchor coat). When the adhesive layer 120 is inserted between the stretched film and the stretched film, the adhesive layer 120 is inserted as an adhesive resin for dry lamination (dry laminate).

In the case of the 1-liquid type adhesive resin, specific examples of the material of the adhesive resin include esters and ethers, but in consideration of the transparency of the adhesive layer 120, an ester-based urethane-isocyanate (urethane-isocyanate) curable adhesive is preferable.

In the case of a 2-liquid type adhesive resin, esters or ethers may be mentioned as the main component of the adhesive resin, and esters are preferred. Examples of the curing agent for the adhesive resin include aromatic compounds and aliphatic compounds, and aliphatic compounds are preferably used from the viewpoint of not becoming yellow after curing. Specifically, as the main agent of the adhesive resin, there may be mentioned a combination of a polyester composition such as polyester polyol or polyether polyol and an isocyanate compound. When the binder resin is a mixture of the polyester composition and the isocyanate compound, the surfactant and the alkylene carbonate may be added after the polyester composition and the isocyanate compound are mixed, but it is preferable to add them to any one of the resins in advance in view of stability of the reaction conditions.

(2) Alkylene carbonate

Since alkylene carbonate has a high boiling point and a high dielectric constant, it does not volatilize even after the dry lamination step of heat curing, and remains in a liquid state dissolved in a surfactant. Since the remaining alkylene carbonate in a liquid state functions as an ionic electrolyte, the upper tape 100 can suppress electrification without requiring moisture in the air or the like. Therefore, the upper tape 100 can suppress charging in a low humidity environment. Specific examples of the alkylene carbonate include ethylene carbonate, propylene carbonate, butylene carbonate, and the like, and propylene carbonate is particularly preferable.

The weight ratio of the alkylene carbonate to the surfactant (alkylene carbonate/surfactant) is preferably from 10/90 to 40/60. When the weight ratio of the alkylene carbonate to the surfactant is less than 10/90, the adhesive force of the adhesive layer 120 is insufficient. When the weight ratio of the alkylene carbonate to the surfactant exceeds 40/60, the surfactant serving as a medium for antistatic is insufficient, and thus the antistatic effect of the upper tape 100 is reduced. If the weight ratio of the alkylene carbonate to the surfactant is within the above range, the adhesive layer 120 has adhesiveness and is less likely to be electrically charged.

(3) Surface active agent

The surfactant itself can find ionic conductivity by utilizing moisture or the like, thereby imparting antistatic property to the added material. Therefore, the surfactant improves the antistatic property of the adhesive layer 120. The surfactant improves antistatic properties of the base layer 110 and the buffer layer 130, which are adherends of the adhesive layer 120.

The surfactant may be a known surfactant, but is preferably a transparent surfactant dissolved in alkylene carbonate. As a material of the surfactant, a nonaqueous ionic electrolyte of a cationic antistatic agent is preferable from the viewpoints of transparency, antistatic property and cost, and particularly, from the viewpoint of antistatic property, alkyl quaternary ammonium ethyl sulfate is preferable.

The adhesive layer 120 mainly containing the alkylene carbonate and the surfactant preferably has a surface resistance value (measurement method: JIS K6911) of 10¹²Omega is less than or equal to. By setting the surface resistance value of the adhesive layer 120 to 10¹²And omega or less, the conductivity is sufficient. Accordingly, the adhesive layer 120 functions to prevent electrostatic induction, which will be described later, and the upper tape 100 is less likely to be charged. Therefore, the upper belt 100 can reduce failures such as electrostatic discharge and pickup failure.

In the production process environment in which the upper tape 100 is peeled off, the upper tape may be in a dry state in winter. The surface resistance of the adhesive layer 120 is kept at 10 by keeping it at a low humidity in a dry state⁸10 above omega¹²The upper belt 100 can reduce the occurrence of troubles due to static electricity.

However, electrostatic induction is a phenomenon in which when a charged object approaches an object, an opposite charge is generated on the surface of the object. When opposite charges are generated, electric lines of force are generated between the charged object and the object. The electric flux lines are one cause of static electricity. If a good dielectric is inserted between the charged object and the object, opposite lines of electric force are generated in the good dielectric. The electric flux lines in the good dielectric medium can eliminate electric flux lines between the charged object and the object, and suppress generation of static electricity.

However, the effect of preventing such electrostatic induction is proportional to the dielectric properties of the good dielectric medium, and if the dielectric properties of the good dielectric medium are low (surface resistance value is high), the effect of preventing electrostatic induction becomes weak, and the erasing time (decay time of charging) becomes long. In order to exhibit a high antistatic effect at the present time of high-speed mounting, when a voltage of 5Kv is applied to the surface of the heat seal layer 140 to charge it, it is necessary to set the decay time from the start of charging to when the charge voltage becomes 1% to 10 seconds or less. Therefore, the surface resistance value of the adhesive layer 120 is set to 10¹²The decay time can be set to 10 seconds or less.

(buffer layer)

The cushion layer 130 is composed of at least 1 layer, and functions as a cushion when the upper tape 100 is sealed to the carrier tape 300. The cushion layer 130 also functions as a peeling mechanism when the upper tape 100 is peeled from the carrier tape 300. For example, in the case of a transfer peeling mechanism, the cushion layer 130 includes a layer in consideration of compatibility with the adhesive layer 120. In the case of the cohesive failure peeling mechanism, the cushion layer 130 includes a layer for cohesive failure on a layer adjacent to the adhesive layer 120. In the case of the surface peeling mechanism, the cushion layer 130 may be a single layer, but a multilayer structure is also effective in order to impart slip properties to the upper tape 100.

In the case of the transfer/release mechanism, an olefin-based material can be used as the material of the cushion layer 130, so that transfer to the adhesive layer 120 is easy and cost is low. As a material of the cushion layer 130, a polyethylene-based material is preferable from the viewpoint of the cushion property, and low-density polyethylene is particularly preferable from the viewpoint of the low-temperature sealability.

In the case of the cohesive failure delamination mechanism, a polyethylene or olefin material is used because the material of the cushion layer 130 requires cushion properties. In order to easily break the upper tape 100, it is preferable to mix a subcomponent which is not easily compatible with polyethylene and olefin materials as a material of the cushion layer 130. As the incompatible subcomponents, styrene materials such as polystyrene and polypropylene styrene can be used.

In the case of the surface peeling mechanism, since cushion properties and adhesion between the cushion layer 130 and the adhesive layer 120 are required, a styrene-based material is used as a material of the cushion layer 130. The thickness of the buffer layer 130 is preferably 5 μm or more and 50 μm or less from the viewpoint of heat conduction at the time of heat sealing. As a method for forming the buffer layer 130, a dry lamination method, a coextrusion method (coextrusion), and an extrusion lamination method can be cited as a method which is inexpensive and easy to implement.

(Heat-sealing layer)

Heat seal layer 140 is disposed on the outermost layer of upper tape 100. The heat seal layer 140 is formed by adding an antistatic agent to an acryl-based resin or a polyester-based resin. The amount of the antistatic agent added was adjusted so that the surface resistance of the heat seal layer 140 under the conditions of 23 ℃ and 15% RH was 10⁴10 above omega¹⁰Omega is less than or equal to. The antistatic agent may be any one selected from metal fillers such as tin oxide, zinc oxide, titanium oxide, and carbon, and surfactants such as polyoxyethylene alkylamine, quaternary ammonium, and alkylsulfonate, or a mixture thereof, without departing from the spirit of the present invention. The carbon includes fillers having various shapes made of carbon, such as carbon black, white carbon, carbon fiber, and carbon tube. For blocking resistance (blocking), oxide particles whose main component is any of silicon, magnesium, and calcium, for example, silica, talc, or the like, or any of polyethylene particles, polyacrylate particles, and polystyrene particles, or an alloy of these may be added to the above mixture. A gravure coating (gravurecating) method is preferable as a method of forming the heat seal layer 140.

If the surface resistance of the heat-seal layer 140 is less than 10⁴Ω is a possibility that the resistance is too low when an electric charge is generated from the outside in the structure in which the upper tape 100 is sealed on the carrier tape 300, and thus a discharge phenomenon or the like may occur near the charged object. Conversely, if the surface resistance value exceeds 10¹⁰Ω is insufficient in electrostatic diffusion performance, and the purpose of the static elimination performance cannot be achieved, and charging is caused, which causes a failure.

(electronic parts packaging body)

As shown in fig. 2 and 3, the electronic component package 200 includes an upper tape 100 and a carrier tape 300. As shown in fig. 2 and 3, the electronic component package 200 stores the electronic component 400 therein, and stores and transports the electronic component 400 in a state of being wound on a reel 500. The electronic component 400 is, for example, a transistor typified by an ic (integrated circuit), a diode, a capacitor, a piezoresistance element, or the like. The electronic component 400 is stored in the electronic component package 200 and protected so as not to be damaged during storage and transportation.

When the electronic component 400 is packaged in the electronic component package 200 and transported, the electronic component 400 is electrically charged by friction between the electronic component 400 and the upper tape 100. However, by inserting adhesive layer 120 having an antistatic effect into upper tape 100, the phenomenon of electrostatic induction from charged electronic component 400 to upper tape 100 can be suppressed.

Examples

Next, examples 1 to 10 of the upper tape 100 of the present invention and comparative examples 1 to 7 will be described. In addition, the present invention is not limited by these examples.

(example 1)

An antistatic agent was prepared by dissolving a cationic surfactant (trade name: Elegan264-WAX, manufactured by Nichikoku K.K.) in propylene carbonate. The surfactant was added to the adhesive so as to account for 42 wt% of the adhesive layer 120, and the propylene carbonate was added to the adhesive so as to account for 28 wt% of the adhesive layer 120. An antistatic agent, a polyurethane composition (trade name: Takerak A-520, manufactured by Mitsui chemical Co., Ltd.) and an isocyanate composition (trade name: Takenate A-10, manufactured by Mitsui chemical Co., Ltd.) were mixed with a propeller mixer to prepare an adhesive. A polyurethane composition and an isocyanate composition as adhesive resins were added to the adhesive so as to account for 30 wt% of the adhesive layer 120.

As the base layer 110, a biaxially oriented polyester film (trade name: FE2021, manufactured by Futamura chemical Co., Ltd.) having a thickness of 25 μm was used. An adhesive layer 120 having a film thickness of 1 μm was provided by coating an adhesive on the base layer 110. On the adhesive layer 120, a low-density polyethylene (trade name: Sumikasen L705, manufactured by Sumitomo chemical Co., Ltd.) was molded into a film having a thickness of 25 μm by an extrusion lamination method (drying oven temperature 80 ℃ C.: line speed 150 m/min), thereby providing the cushion layer 130.

On the buffer layer 130, a propylene resin (trade name: Corponiel7980, manufactured by Nippon synthetic chemical industries Co., Ltd.) was molded into a film having a thickness of 1 μm by a gravure coating method, and a heat seal layer 140 was provided to adjust the coating thickness to 2.5g/m²Upper belt 100 (see fig. 1). In addition, in adhesive layer 120, an antistatic agent formed of a surfactant and propylene carbonate accounts for 70 wt% of adhesive layer 120. Further, the weight ratio of the alkylene carbonate and the surfactant (alkylene carbonate/surfactant) was 40/60.

(measurement of lamination Strength)

The upper tape 100 was peeled from the electronic component package 200, and the lamination strength of the upper tape 100 was measured. The laminate strength of 0.20N or more was acceptable, and the laminate strength of less than 0.20N was not acceptable.

(surface resistance)

The surface resistance value was measured at 23 ℃ using a surface resistance measuring apparatus manufactured by SIMCOAnd 20% RH, the surface resistance of the adhesive layer 120 of the upper tape 100 was measured. Surface resistance value 10⁸10 above omega¹²The product was not more than Ω but not more than Ω.

(decay time with Voltage)

When the heat seal layer 140 was charged by applying a voltage of 5Kv in a state where both surfaces were not subjected to antistatic treatment, the decay time from the start of charging to the charging voltage of the upper belt 100 was measured by using an electrostatic decay measuring instrument manufactured by ETS corporation as 1%. The decay time was measured under the measurement conditions of 23 ℃ and 20% RH and 23 ℃ and 50% RH, respectively. The decay time was acceptable when 10 seconds or less, and the decay time exceeded 10 seconds.

(stripping band voltage at rubbing)

In a state where the antistatic treatment was not performed on both sides of the upper tape 100, the tape was peeled from the carrier tape 300 at a peeling speed of 300mm/min (see FIG. 4, test conditions according to JIS C0806-3). Next, the charge voltage generated in the heat seal layer 140 of the upper belt 100 was measured using a surface electrometer manufactured by TREK corporation, with the distance between the sample and the probe (probe) set to 1 mm. Further, the charged voltage was measured under the measurement conditions of 23 ℃ and 20% RH and 23 ℃ and 50% RH, respectively. The absolute value of the charging voltage is not more than 50V, and the absolute value of the charging voltage is not more than 50V.

(dissolution of antistatic agent)

The adhesive layer 120 was observed with a polarizing microscope to confirm whether or not the antistatic agent was dissolved in the adhesive resin. Fig. 5 shows adhesive layer 120 in a state where the antistatic agent is dissolved, and fig. 6 shows adhesive layer 120 in a state where antistatic agent 121 is saturated and a part of it is not dissolved.

As a result, the laminate strength was 0.22N, and the surface resistance value was 1.0X 10⁹Omega, decay time of charged voltage (23 deg.C, 20% RH) 0.02 sec, decay time of charged voltage (23 deg.C, 50% RH) 0.02 sec, and peel-off at frictionThe release charging voltage (23 ℃, 20% RH) was 15V, the release charging voltage (23 ℃, 50% RH) during rubbing was 13V, and no undissolved antistatic agent was present (see table 1 below).

(example 2)

Except that the thickness of the coating layer was adjusted to 5.0g/m²Except for this, the upper tape 100 was obtained in the same manner as in example 1. In addition, the respective items of the upper tape 100 were measured and confirmed in the same manner as in example 1.

As a result, the laminate strength was 0.24N, and the surface resistance value was 8.0X 10⁸Ω, a charge voltage decay time (23 ℃, 20% RH) of 0.05 second, a charge voltage decay time (23 ℃, 50% RH) of 0.04 second, a peel charge voltage (23 ℃, 20% RH) of 10V at the time of rubbing, a peel charge voltage (23 ℃, 50% RH) of 8V at the time of rubbing, and no undissolved antistatic agent (see table 1 below).

(example 3)

A top tape 100 was obtained in the same manner as in example 1, except that the surfactant was 27 wt% of the adhesive layer 120, the propylene carbonate was 18 wt% of the adhesive layer 120, and the adhesive resin was 55 wt% of the adhesive layer 120. Further, adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate in an amount of 45 wt% of adhesive layer 120. In addition, the respective items of the upper tape 100 were measured and confirmed in the same manner as in example 1.

As a result, the laminate strength was 0.21N, and the surface resistance value was 8.2X 10⁹Ω, a charge voltage decay time (23 ℃ and 20% RH) of 0.12 second, a charge voltage decay time (23 ℃ and 50% RH) of 0.10 second, a peel charge voltage (23 ℃ and 20% RH) of 8V at the time of rubbing, a peel charge voltage (23 ℃ and 50% RH) of 9V at the time of rubbing, and no undissolved antistatic agent (see table 1 below).

(example 4)

A top tape 100 was obtained in the same manner as in example 1, except that the surfactant was 40 wt% of the adhesive layer 120, the propylene carbonate was 5 wt% of the adhesive layer 120, and the adhesive resin was 55 wt% of the adhesive layer 120. Further, adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate in an amount of 45 wt% of adhesive layer 120. Further, the weight ratio of the alkylene carbonate and the surfactant (alkylene carbonate/surfactant) was 11/89. In addition, the respective items of the upper tape 100 were measured and confirmed in the same manner as in example 1.

As a result, the laminate strength was 0.23N, and the surface resistance value was 5.3X 10⁹Ω, a charge voltage decay time (23 ℃ and 20% RH) of 0.10 second, a charge voltage decay time (23 ℃ and 50% RH) of 0.10 second, a peel charge voltage (23 ℃ and 20% RH) of 6V at the time of rubbing, a peel charge voltage (23 ℃ and 50% RH) of 6V at the time of rubbing, and no undissolved antistatic agent (see table 1 below).

(example 5)

An upper tape 100 was obtained in the same manner as in example 1, except that the surfactant was used in an amount of 63 wt% of the adhesive layer 120, the propylene carbonate was used in an amount of 7 wt% of the adhesive layer 120, and the adhesive resin was used in an amount of 30 wt% of the adhesive layer 120. Further, the weight ratio of the alkylene carbonate and the surfactant (alkylene carbonate/surfactant) was 10/90. In addition, the respective items of the upper tape 100 were measured and confirmed in the same manner as in example 1.

As a result, the laminate strength was 0.25N, and the surface resistance value was 5.5X 10⁸Ω, a charge voltage decay time (23 ℃ and 20% RH) of 0.09 seconds, a charge voltage decay time (23 ℃ and 50% RH) of 0.10 seconds, a peel charge voltage (23 ℃ and 20% RH) of 16V during rubbing, a peel charge voltage (23 ℃ and 50% RH) of 15V during rubbing, and no undissolved antistatic agent (see table 1 below).

(example 6)

A top tape 100 was obtained in the same manner as in example 1, except that the surfactant was used in an amount of 6 wt% of the adhesive layer 120, the propylene carbonate was used in an amount of 4 wt% of the adhesive layer 120, and the adhesive resin was used in an amount of 90 wt% of the adhesive layer 120. Further, adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate in an amount of 10 wt% of adhesive layer 120. In addition, the respective items of the upper tape 100 were measured and confirmed in the same manner as in example 1.

As a result, the laminate strength was 0.25N, and the surface resistance value was 8.1X 10¹⁰Ω, a charge voltage decay time (23 ℃ and 20% RH) of 0.82 seconds, a charge voltage decay time (23 ℃ and 50% RH) of 0.55 seconds, a peel charge voltage (23 ℃ and 20% RH) of 19V at the time of rubbing, a peel charge voltage (23 ℃ and 50% RH) of 18V at the time of rubbing, and no undissolved antistatic agent (see table 1 below).

(example 7)

A top tape 100 was obtained in the same manner as in example 1, except that the surfactant was used in an amount of 18 wt% of the adhesive layer 120, the propylene carbonate was used in an amount of 2 wt% of the adhesive layer 120, and the adhesive resin was used in an amount of 80 wt% of the adhesive layer 120. Further, adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate in an amount of 20 wt% of adhesive layer 120. Further, the weight ratio of the alkylene carbonate and the surfactant (alkylene carbonate/surfactant) was 10/90. The respective items of the upper tape 100 were measured and confirmed in the same manner as in example 1, except that the lamination strength was not measured.

As a result, the surface resistance value was 1.3X 10⁹Ω, a charge voltage decay time (23 ℃ and 20% RH) of 3.60 seconds, a charge voltage decay time (23 ℃ and 50% RH) of 0.33 seconds, a peel charge voltage (23 ℃ and 20% RH) of 15V during rubbing, a peel charge voltage (23 ℃ and 50% RH) of 13V during rubbing, and no undissolved antistatic agent (see table 1 below).

(example 8)

A top tape 100 was obtained in the same manner as in example 1, except that the surfactant was 8 wt% of the adhesive layer 120, the propylene carbonate was 2 wt% of the adhesive layer 120, and the adhesive resin was 90 wt% of the adhesive layer 120. Further, adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate in an amount of 10 wt% of adhesive layer 120. Further, the weight ratio of the alkylene carbonate and the surfactant (alkylene carbonate/surfactant) was 20/80. The respective items of the upper tape 100 were measured and confirmed in the same manner as in example 1, except that the lamination strength was not measured.

As a result, the surface resistance value was 2.2X 10⁹Ω, a charge voltage decay time (23 ℃ and 20% RH) of 4.50 seconds, a charge voltage decay time (23 ℃ and 50% RH) of 0.46 seconds, a peel charge voltage (23 ℃ and 20% RH) of 29V during rubbing, a peel charge voltage (23 ℃ and 50% RH) of 25V during rubbing, and no undissolved antistatic agent (see table 1 below).

(example 9)

A top tape 100 was obtained in the same manner as in example 1, except that the surfactant was 21 wt% of the adhesive layer 120, the propylene carbonate was 9 wt% of the adhesive layer 120, and the adhesive resin was 70 wt% of the adhesive layer 120. Further, adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate in an amount of 30 wt% of adhesive layer 120. Further, the weight ratio of the alkylene carbonate and the surfactant (alkylene carbonate/surfactant) was 30/70. The respective items of the upper tape 100 were confirmed in the same manner as in example 1, except that the lamination strength was not measured.

As a result, the surface resistance value was 1.1X 10⁹Ω, a charge voltage decay time (23 ℃ and 20% RH) of 3.50 seconds, a charge voltage decay time (23 ℃ and 50% RH) of 0.18 seconds, a peel charge voltage (23 ℃ and 20% RH) of 2V during rubbing, a peel charge voltage (23 ℃ and 50% RH) of 20V during rubbing, and no undissolved antistatic agent (see table 1 below).

(example 10)

A top tape 100 was obtained in the same manner as in example 1, except that the surfactant was 12 wt% of the adhesive layer 120, the propylene carbonate was 8 wt% of the adhesive layer 120, and the adhesive resin was 80 wt% of the adhesive layer 120. Further, adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate in an amount of 20 wt% of adhesive layer 120. The respective items of the upper tape 100 were measured and confirmed in the same manner as in example 1, except that the lamination strength was not measured.

As a result, the surface resistance value was 4.0X 10¹⁰Ω, a charge voltage decay time (23 ℃ and 20% RH) of 6.00 seconds, a charge voltage decay time (23 ℃ and 50% RH) of 0.12 seconds, a peel charge voltage (23 ℃ and 20% RH) of 35V during rubbing, a peel charge voltage (23 ℃ and 50% RH) of 20V during rubbing, and no undissolved antistatic agent (see table 1 below).

Comparative example 1

The adhesive resin was made to account for 100 wt% of the adhesive layer 120 and the coating thickness was adjusted to 1.5g/m without adding a surfactant and propylene carbonate²Except for this, an upper tape was obtained in the same manner as in example 1. Further, adhesive layer 120 does not include an antistatic agent composed of a surfactant and propylene carbonate. The obtained upper tape was measured and confirmed in the same manner as in example 1.

As a result, the laminate strength was 0.25N, and the surface resistance value was more than 1.0X 10¹²Ω, a charge voltage decay time (23 ℃, 20% RH) and a charge voltage decay time (23 ℃, 50% RH) were not measured because the charge voltage did not decay, the peel charge voltage (23 ℃, 20% RH) at the time of rubbing was 100V, the peel charge voltage (23 ℃, 50% RH) at the time of rubbing was 100V, and no undissolved antistatic agent was present (see table 2 below).

Comparative example 2

Except that the surfactant was used to account for 33 wt% of adhesive layer 120, propylene carbonate was not added, the adhesive resin was used to account for 67 wt% of adhesive layer 120, and the coating thickness was adjusted to 1.6g/m²Except for this, an upper tape was obtained in the same manner as in example 1. Further, the adhesive layer 120 contains an adhesive agent33.3 wt% of adhesive layer 120 of an antistatic agent consisting of a surfactant and propylene carbonate. The obtained upper tape was measured and confirmed in the same manner as in example 1.

As a result, the laminate strength was 0.20N, and the surface resistance value was more than 1.0X 10¹²Ω, a charge voltage decay time (23 ℃, 20% RH) and a charge voltage decay time (23 ℃, 50% RH) were not measured because the charge voltage did not decay, the peel charge voltage (23 ℃, 20% RH) at the time of rubbing was 80V, the peel charge voltage (23 ℃, 50% RH) at the time of rubbing was 83V, and no undissolved antistatic agent was present (see table 2 below).

Comparative example 3

The adhesive layer 120 was coated with propylene carbonate 33.3 wt% and the adhesive resin 67 wt% except that no surfactant was added, and the coating thickness was adjusted to 3.4g/m²Except for this, an upper tape was obtained in the same manner as in example 1. Further, adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate in an amount of 33.3 wt% of adhesive layer 120. The obtained upper tape was measured and confirmed in the same manner as in example 1.

As a result, the laminate strength was 0.15N, and the surface resistance value was more than 1.0X 10¹²Omega, the charge voltage decay time (23 ℃ 20% RH) and the charge voltage decay time (23 ℃ 50% RH) could not be measured because the charge voltage did not decay, the peel-off charge voltage (23 ℃ 20% RH) during rubbing was 85V, the peel-off charge voltage (23 ℃ 50% RH) during rubbing was 87V, and an undissolved antistatic agent was present (see Table 2 below).

Comparative example 4

Except that the surfactant was used in an amount of 80 wt% of adhesive layer 120, the propylene carbonate was used in an amount of 20 wt% of adhesive layer 120, the adhesive resin was not added, and the coating thickness was adjusted to 1.6g/m²Except for this, an upper tape was obtained in the same manner as in example 1. Further, adhesive layer 120 contains an antistatic agent in an amount of 100 wt% of adhesive layer 120The antistatic agent consists of a surfactant and propylene carbonate. Further, the weight ratio of the alkylene carbonate and the surfactant (alkylene carbonate/surfactant) was 20/80. The obtained upper tape was measured and confirmed in the same manner as in example 1.

As a result, the laminate strength, the decay time of the charged voltage (23 ℃ C., 20% RH), the decay time of the charged voltage (23 ℃ C., 50% RH), the peel-off charged voltage at the time of rubbing (23 ℃ C., 20% RH) and the peel-off charged voltage at the time of rubbing (23 ℃ C., 50% RH) were not measured because the upper tape did not adhere to the carrier tape, and the surface resistance value was more than 1.1X 10⁸Ω, no undissolved antistatic agent (see table 2 below).

Comparative example 5

Except that the surfactant was made to account for 0.5 wt% of adhesive layer 120, the propylene carbonate was made to account for 0.5 wt% of adhesive layer 120, the adhesive resin was made to account for 99 wt% of adhesive layer 120, and the coating thickness was adjusted to 2.5g/m²Except for this, an upper tape was obtained in the same manner as in example 1. Further, adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate in an amount of 1 wt% of adhesive layer 120. Further, the weight ratio of the alkylene carbonate and the surfactant (alkylene carbonate/surfactant) was 50/50. The obtained upper tape was measured and confirmed in the same manner as in example 1.

As a result, the laminate strength was 0.25N, and the surface resistance value was more than 1.0X 10¹²Ω, a charge voltage decay time (23 ℃, 20% RH) and a charge voltage decay time (23 ℃, 50% RH) were not measured because the charge voltage did not decay, the peel charge voltage (23 ℃, 20% RH) at the time of rubbing was 90V, the peel charge voltage (23 ℃, 50% RH) at the time of rubbing was 89V, and no undissolved antistatic agent was present (see table 2 below).

Comparative example 6

A top tape was obtained in the same manner as in example 1, except that the surfactant was used in an amount of 20 wt% of the adhesive layer 120, the propylene carbonate was not added, and the adhesive resin was used in an amount of 80 wt% of the adhesive layer 120. Further, adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate in an amount of 20 wt% of adhesive layer 120. The obtained upper tape was measured and confirmed in the same manner as in example 1.

As a result, the laminate strength was 0.25N, and the surface resistance value was more than 1.0X 10¹³Ω, a charge voltage decay time (23 ℃, 20% RH) and a charge voltage decay time (23 ℃, 50% RH) were not measured because the charge voltage did not decay, the peel charge voltage (23 ℃, 20% RH) at the time of rubbing was 70V, the peel charge voltage (23 ℃, 50% RH) at the time of rubbing was 65V, and no undissolved antistatic agent was present (see table 2 below).

Comparative example 7

A top tape 100 was obtained in the same manner as in example 1, except that the surfactant was used in an amount of 4 wt% of the adhesive layer 120, the propylene carbonate was used in an amount of 1 wt% of the adhesive layer 120, and the adhesive resin was used in an amount of 95 wt% of the adhesive layer 120. Further, adhesive layer 120 contains an antistatic agent composed of a surfactant and propylene carbonate in an amount of 5 wt% of adhesive layer 120. Further, the weight ratio of the alkylene carbonate to the surfactant (alkylene carbonate/surfactant) was 20/80. The obtained upper tape was measured and confirmed in the same manner as in example 1.

As a result, the laminate strength was 0.25N, and the surface resistance value was more than 1.0X 10¹¹Ω, a charge voltage decay time (23 ℃, 20% RH) and a charge voltage decay time (23 ℃, 50% RH) were not measured because the charge voltage did not decay, and the peel-off charge voltage (23 ℃, 20% RH) and 60V at the time of rubbing and the peel-off charge voltage (23 ℃, 50% RH) at the time of rubbing were 20V, and no undissolved antistatic agent was present (see table 2 below).

The following table 1 shows the evaluation results of the examples, and the following table 2 shows the evaluation results of the comparative examples.

(Table 1)

(Table 2)

As a result, any of the evaluation items of examples 1 to 10 was passed. In particular, in examples 1 to 5 containing the antistatic agent in an amount of 45 wt% to 70 wt% of adhesive layer 120, better results were obtained than in examples 6 to 10, and in examples 6 to 10, the content of the antistatic agent was less than 45 wt% of adhesive layer 120. In addition, for examples 1 to 10 and comparative examples 1 to 7, the transparency was visually compared, and examples 1 to 10 had higher transparency than comparative examples 1 to 7.

On the other hand, in comparative example 1 in which no antistatic agent was added to adhesive layer 120, comparative examples 2 and 6 in which no alkylene carbonate was added, comparative example 3 in which no surfactant was added, and comparative examples 5 and 7, the electrostatic damping effect was insufficient, and in comparative examples 5 and 7, the content of the antistatic agent was less than 10% by weight of adhesive layer 120. The static electricity damping effect and the lamination strength of comparative example 4 containing no adhesive resin were insufficient.

(Effect of the present embodiment)

As described above, in the upper band 100 of the present embodiment, as a result of intensive studies by the inventors of the present application, the following facts are clarified: the antistatic agent is added to adhesive layer 120 in an amount of 10 wt% to 70 wt% of adhesive layer 120, whereby upper tape 100 is less likely to be charged. Therefore, the upper tape 100 can suppress a pickup failure of the electronic component 400 and can suppress damage to the electronic component 400 due to electrostatic discharge.

Further, the main components of the antistatic agent are alkylene carbonate and a surfactant, and a conductive material such as metal or carbon, which causes the transparency of the upper tape 100 to be lowered, is hardly included or not included at all. Therefore, the upper tape 100 has excellent transparency.

Therefore, the upper tape 100 is less likely to be charged and has excellent transparency.

In addition, in the present embodiment, the following facts are clarified as a result of intensive studies by the inventors of the present application: the antistatic agent is added to adhesive layer 120 in an amount of 45 wt% to 70 wt% of adhesive layer 120, whereby upper tape 100 is less likely to be charged. Therefore, the upper tape 100 can further suppress the pickup failure of the electronic component 400 and can further suppress the damage to the electronic component 400 due to the electrostatic discharge.

In addition, in the present embodiment, when the upper tape 100 is heat-sealed to the carrier tape 300, the cushion layer exerts a cushion effect so that heat and pressure are uniformly applied to the upper tape 100 and the carrier tape 300. This enables the upper tape 100 to be reliably heat-sealed to the carrier tape 300.

In addition, in the present embodiment, since the adhesive layer 120 can be easily provided between the base layer 110 and the buffer layer, it is not necessary to newly provide the adhesive layer 120 between other layers. This reduces the manufacturing cost of the upper belt 100.

In addition, in the present embodiment, the surfactant is an ionic surfactant, and has excellent ionic conductivity. Therefore, the upper tape 100 is less likely to be charged.

In this embodiment, the ionic surfactant is a cationic surfactant and therefore easily dissolves in the alkylene carbonate. The alkylene carbonate solution of the cationic surfactant was transparent. Thereby, the upper tape 100 has excellent transparency. Moreover, the upper tape 100 is less likely to be charged. In addition, the use of an inexpensive cationic surfactant can reduce the production cost of the upper tape 100.

In this embodiment, the cationic surfactant is alkyl quaternary ammonium ethyl sulfate. Therefore, the upper tape 100 is less likely to be charged.

In addition, as a result of intensive studies by the inventors of the present invention, the following facts were confirmed: by making the alkylene carbonate propylene carbonate, the upper belt 100 is less likely to become charged. Therefore, the upper tape 100 can further suppress the pickup failure of the electronic component and further suppress the damage to the electronic component 400 due to the electrostatic discharge.

In the present embodiment, the weight ratio of the alkylene carbonate to the surfactant (alkylene carbonate/surfactant) is from 10/90 to 40/60. Therefore, the surfactant is present in a state of being dissolved in the alkylene carbonate. When the weight ratio of the alkylene carbonate to the surfactant is less than 10/90, the adhesive force of the adhesive layer 120 is insufficient. When the weight ratio of the alkylene carbonate to the surfactant exceeds 40/60, the surfactant serving as a medium for antistatic is insufficient, and thus the antistatic effect of the upper tape 100 is reduced. Therefore, if the weight ratio of the alkylene carbonate to the surfactant (alkylene carbonate/surfactant) is within the above range, the adhesive layer 120 has adhesiveness and is not easily charged.

In this embodiment, the surface resistance value of the adhesive layer 120 is 10⁸Ω-10¹²Omega. Therefore, the upper tape 100 has high conductivity at low humidity compared to the conventional upper tape 100. Therefore, the upper tape 100 is less likely to be charged at low humidity.

In addition, in the present embodiment, the upper belt 100 can attenuate the belt voltage in a short time. This makes the upper tape 100 less likely to be charged.

In this embodiment, the voltage generated when rubbing against electronic component 400 is lower than that of conventional upper tape 100. Therefore, the upper tape 100 is less likely to be charged.

In general, the antistatic agent does not dissolve and floats, and the adhesive force of the adhesive layer is reduced. However, in the present embodiment, the antistatic agent having no adhesive property exists in a state of being dissolved in the adhesive resin. Therefore, the adhesive layer 120 has excellent adhesion.

In this embodiment, the base layer 110 is formed of a film extending in one or two axial directions. Therefore, the base material layer 110 can improve the mechanical strength of the upper tape 100 as compared with the base material layer 110 formed of an unstretched film.

In this embodiment, the thickness of the base material layer 110 is 12 μm to 30 μm. Thus, the upper band 100 has appropriate rigidity. Therefore, when a torsional stress is applied to the carrier tape 300 after heat sealing, the upper tape 100 can be deformed in accordance with the deformation of the carrier tape 300, and peeling from the carrier tape 300 can be prevented.

Further, the upper belt 100 has appropriate mechanical strength. Therefore, the upper tape 100 can be prevented from being broken when peeled from the carrier tape 300 at a high speed.

In addition, the present embodiment includes the upper tape 100. Therefore, the electronic component package 200 can suppress the pickup failure of the electronic component and can suppress the damage to the electronic component 400 due to the electrostatic discharge.

In addition, the electronic component package 200 of the present embodiment can easily peel the upper tape 100 from the carrier tape 300 and prevent the electronic component 400 from falling off from the electronic component package 200, compared with the conventional electronic component package 200. This further prevents the charging of the upper belt 100 according to the present embodiment.

(modification example)

（A）

The antistatic treatment may be applied to both or one side of the upper tape 100. By this antistatic treatment, the upper tape 100 is less likely to be charged.

（B）

The base layer 110 may be a laminate of two or more layers. Further, the base layer 110 may be a non-stretched film.

（C）

The adhesive layer 120 may be provided between other layers, instead of the base layer 110 and the buffer layer 130.

（D）

In the heat seal layer 140, resins having different charging characteristics may be added in order to suppress the triboelectric charging characteristics of the upper tape 100 and the electronic component 400 depending on the type of the electronic component 400.

A preferred embodiment of the present invention is as described above, but the present invention is not limited thereto. It is to be understood that other embodiments may exist without departing from the spirit and scope of the present invention. Further, in the present embodiment, the operation and effect of the constitution of the present invention are described, but these operation and effect are only an example and do not limit the present invention.

Industrial applicability of the invention

The upper tape of the invention protects the electronic components from contamination together with the carrier tape during storage, transportation and mounting of the electronic components. In particular, the upper tape of the present invention is a structure in which static electricity generated at the time of peeling or after rubbing is taken into consideration, and therefore, it is suitably used as an upper tape used for packaging an electrostatic sensitive device on a carrier tape, and the electrostatic sensitive device tends to increase in recent years.

Claims (18)

1. An upper tape for packaging electronic components, which comprises a plurality of layers including at least a base material layer and a heat seal layer, and at least two of the plurality of layers are laminated via an adhesive layer,

the adhesive layer contains an antistatic agent which is contained in the adhesive layer in an amount of 10 to 70 wt% based on the weight of the adhesive layer, and the antistatic agent contains an alkylene carbonate and a surfactant as main components.

2. The upper tape for packaging electronic parts according to claim 1, wherein the adhesive layer contains the antistatic agent in an amount of 45 to 70 wt% based on the adhesive layer.

3. The upper tape for electronic component packaging of claim 1 or 2, wherein a buffer layer provided between the base material layer and the heat seal layer is included in the multilayer.

4. The upper tape for packaging electronic components according to claim 3, wherein the base layer and the cushion layer are laminated via the adhesive layer.

5. The upper tape for electronic part packaging as set forth in claim 1, wherein said surfactant is an ionic surfactant.

6. The electronic parts packaging upper tape of claim 5, wherein the ionic surfactant is a cationic surfactant.

7. The electronic part-packaging upper tape of claim 6, wherein the cationic surfactant is alkyl quaternary ammonium ethyl sulfate.

8. The upper tape for electronic parts packaging of claim 1, wherein the alkylene carbonate is propylene carbonate.

9. The upper tape for electronic part packaging of claim 1, wherein the weight ratio of the alkylene carbonate to the surfactant (alkylene carbonate/surfactant) is from 10/90 to 40/60.

10. The electronic component packaging upper tape according to claim 1, wherein the adhesive layer has a surface resistance value of 10 at a humidity of 20% RH⁸10 above omega¹²Omega. or less, JIS K6911 was used as a measuring method.

11. The electronic component packaging upper tape described in claim 1, wherein when a voltage of 5kv is applied to the heat-seal-side surface and the both surfaces are charged in a state where antistatic treatment is not performed, a decay time from charging to a point where a charging voltage becomes 1% is 10 seconds or less.

12. The electronic component packaging upper tape as claimed in claim 1, wherein an absolute value of a charging voltage of the heat-sealed side surface of the electronic component packaging upper tape is 50V or less when the heat-sealed side surface and the electronic component are rubbed at a speed of 300rpm for 1 minute in a state where both surfaces are not subjected to the antistatic treatment.

13. The upper tape for electronic component packaging as claimed in claim 1, wherein antistatic treatment is applied to both or one side.

14. The upper tape for electronic component packaging according to claim 1, wherein the adhesive layer contains an adhesive resin, and the antistatic agent is dissolved in the adhesive resin.

15. The upper tape for electronic component packaging of claim 1, wherein the base material layer is composed of a film extending in one axis direction or two axis directions.

16. The upper tape for packaging electronic components according to claim 1, wherein the thickness of the base material layer is 12 μm or more and 30 μm or less.

17. An electronic component package comprising the electronic component packaging upper tape according to any one of claims 1 to 16 and an electronic component packaging carrier tape, wherein the electronic component packaging upper tape is heat-sealed to the electronic component packaging carrier tape.

18. The electronic component package according to claim 17, wherein when the electronic component packaging upper tape is peeled from the electronic component packaging carrier tape at a peeling speed of 300mm/min in a state where both surfaces of the electronic component packaging upper tape are not subjected to the antistatic treatment, an absolute value of a charged voltage generated on a heat-sealed side of the electronic component packaging upper tape is 150V or less, and test conditions are based on JIS C0806-3.