HK1164543B - Substrate holding device, exposure apparatus having the same, device manufacturing method - Google Patents

Description

Substrate holding device, exposure apparatus and method having the same, and device manufacturing method

The present application is filed separately, and has an application number of 200580018933.2 as a primary claim, entitled substrate holding device, exposure apparatus and method, device manufacturing method, and liquid-repellent sheet, as filed on 8/6/2005.

Technical Field

The present invention relates to a substrate holding apparatus for holding a processing substrate, an exposure apparatus provided with the substrate holding apparatus, an exposure method, and a device manufacturing method.

Background

Semiconductor devices and liquid crystal display devices are manufactured by a so-called photolithography method in which a pattern formed on a mask is transferred onto a photosensitive substrate. The exposure apparatus used in this lithography step includes a mask stage that supports a mask and a substrate stage that supports a substrate, and transfers the pattern of the mask to the substrate through a projection optical system while sequentially moving the mask stage and the substrate stage. In recent years, a projection optical system is expected to have higher resolution in order to cope with higher integration of element patterns. The resolution of the projection optical system is improved as the exposure wavelength used is shorter or as the numerical aperture of the projection optical system is larger. Therefore, the exposure wavelength used by the exposure apparatus becomes shorter year by year, and the numerical aperture of the projection optical system gradually increases. Although the exposure wavelength of the mainstream of the laser is 248nm of KrF excimer laser, 193nm of ArF excimer laser having a shorter wavelength has been put into practical use. When performing exposure, depth of focus (DOF) is also as important as resolution. The resolution R and the depth of focus are expressed by the following formulas.

R＝k₁·λ/NA………(1)

＝±k₂·λ/NA²……(2)

Where λ is the exposure wavelength, NA is the numerical aperture of the projection optical system, k₁、k₂Is the processing coefficient. As is clear from the expressions (1) and (2), when the exposure wavelength λ is shortened and the numerical aperture NA is increased in order to increase the resolution R, the focal depth is narrowed.

When the depth of focus is too small, it is difficult to align the substrate surface with the image plane of the projection optical system, and there is a disadvantage that the focus margin is insufficient when performing the exposure operation. Therefore, as a method for substantially shortening the exposure wavelength and increasing the depth of focus, for example, a liquid immersion method disclosed in international publication No. 99/49504 has been proposed. In the liquid immersion method, a liquid immersion area is formed by filling a space between the lower surface of the projection optical system and the surface of the substrate with a liquid such as water or an organic solvent, and the wavelength of the exposure light in the liquid is 1/n times (n is a refractive index of the liquid, and is usually about 1.2 to 1.6) that in the air, thereby increasing the resolution and enlarging the depth of focus to about n times.

However, as shown in fig. 18, when the substrate P is subjected to the liquid immersion exposure, a liquid immersion area AR2 '(covering a part or the whole of a projection area AR 1' of the projection optical system) may be formed outside the substrate P. At this time, since the upper surface of the substrate stage PST 'around the substrate P comes into contact with the liquid, the member (or the coating film thereof) forming the upper surface of the substrate stage PST' is likely to be deteriorated or damaged. When such deterioration or damage occurs, maintenance work such as exchange or repair of the substrate stage PST' is required, and therefore the operating rate of the exposure apparatus is lowered.

When the edge region of the substrate P is exposed in a state where a part of the liquid immersion region AR 2' is formed outside the substrate P, the liquid may flow back to the back surface side of the substrate through a gap between the substrate and the substrate stage or the like, and may infiltrate between the substrate and the substrate stage (substrate holder). In this case, the substrate stage may not hold the substrate satisfactorily. For example, liquid that has penetrated between the back surface of the substrate and the substrate stage may act as foreign matter, which may deteriorate the flatness of the substrate supported thereby. Or, it is also conceivable that the penetrated liquid is vaporized to form a trace of adhesion (i.e., a water mark). Since the water mark also acts as a foreign substance, it may cause deterioration in the flatness of the substrate supported thereby. There is also a possibility that the substrate stage may be thermally deformed due to vaporization heat generated when the liquid penetrating between the substrate and the substrate stage is vaporized.

Disclosure of Invention

In view of the above circumstances, an object of the present invention is to provide a substrate holding apparatus, an exposure apparatus, and a device manufacturing method using the exposure apparatus, which can easily perform maintenance work. It is another object of the present invention to provide a liquid-repellent sheet suitable for use in an immersion exposure apparatus. Further, an object of the present invention is to provide a substrate holding apparatus, an exposure apparatus, and a device manufacturing method using the exposure apparatus, which can prevent liquid from penetrating into the back side of the substrate.

In order to solve the above problems, the present invention employs the following configuration shown in fig. 1 to 17 corresponding to the embodiment. However, the parenthesized reference attached to each element is only an example of the element and does not limit each element.

According to a1 st aspect of the present invention, there is provided a substrate holding apparatus (PH) for holding a processing substrate (P), comprising: a substrate (PHB); a1 st holding part (PH1) formed on the base material (PHB) for adsorbing and holding the processing substrate (P); and a2 nd holding part (PH2) formed on the base material (PHB) for holding the plate body (T) by suction in the vicinity of the processing substrate (P) held by suction by the 1 st holding part (PH 1).

According to the present invention, the plate body disposed in the vicinity of the processing substrate sucked and held by the 1 st holding portion can be easily attached to the 2 nd holding portion. This makes it possible to easily exchange only the plate body with a new plate body, for example, when the plate body is deteriorated or damaged. Since the plate body is sucked and held by the 2 nd holding portion, it is possible to prevent a local force from being applied to the plate body, the base material, or the like. Therefore, deformation of the plate body or the base material can be suppressed. The term "process substrate" in the present application refers to a substrate to which various processes including exposure processing are applied, and includes a semiconductor wafer for manufacturing a semiconductor device, a substrate for a Liquid Crystal Display (LCD), a ceramic wafer for a thin film magnetic head, and a substrate for which a photoresist of a photosensitive material is applied to various applications (a mask used in an exposure apparatus, a reticle original plate (synthetic quartz, silicon wafer), and the like).

According to a2 nd aspect of the present invention, there is provided an exposure apparatus (EX) for projecting a pattern image on a processing substrate (P) to expose the processing substrate (P), comprising: a1 st plate body (T1); a2 nd plate (T2); and a substrate holding device (PH) provided with: a1 st holding part (PH1) for holding the processing substrate (P) by suction; a2 nd holding part (PH2) for sucking and holding the 1 st plate (T1) near the processing substrate (P) sucked and held by the 1 st holding part (PH 1); and a3 rd holding part (PH3) for sucking and holding the 2 nd plate (T2) near the processing substrate (P) sucked and held by the 1 st holding part (PH 1).

According to the present invention, the 1 st and 2 nd plate bodies arranged in the vicinity of the processing substrate body sucked and held by the 1 st holding part can be easily attached to the 2 nd and 3 rd holding parts. Therefore, for example, when the 1 st and 2 nd plate bodies are damaged, the plate bodies can be easily exchanged with new plate bodies. Only one of the 1 st plate and the 2 nd plate may be exchanged, or only one of the plurality of plates may be exchanged. Since the 1 st and 2 nd plate bodies on the upper surface of the substrate holding device are sucked and held by the 2 nd and 3 rd holding parts, it is possible to prevent a local force from being applied to the 1 st and 2 nd plate bodies, the base material, and the like. Therefore, deformation of the 1 st and 2 nd plate bodies or the base material can be suppressed.

According to the present invention, there is provided a device manufacturing method using the exposure apparatus (EX). According to the present invention, since the exposure process and the measurement process can be performed well, an element having a desired performance can be provided.

According to the 3 rd aspect of the present invention, there is provided a liquid-repellent sheet (T, T1, T2) used in an exposure apparatus (EX) for exposing a processing substrate (P) held by a substrate holding device (PH) by irradiating Exposure Light (EL) onto the processing substrate (P) with a Liquid (LQ), characterized in that: the liquid repellent sheet is held by suction by a substrate holding device (PH), and flat portions (Ta, Td) having liquid repellent properties are formed on the surface thereof in the vicinity of a processing substrate (P) held by suction by the substrate holding device (PH).

According to the present invention, since the flat portion having liquid repellency on the surface can be formed in the vicinity of the processing substrate, the liquid immersion area can be satisfactorily maintained even when the edge area of the processing substrate is exposed. For example, when the liquid repellent property of the liquid repellent sheet is deteriorated, the liquid repellent performance formed on the surface of the flat portion in the vicinity of the processing substrate can be maintained only by exchanging the sheet with a new liquid repellent sheet. Therefore, the liquid can be prevented from remaining on the substrate holding device, and the liquid can be smoothly collected even if the liquid remains. Therefore, it is possible to prevent problems such as thermal deformation of the substrate or the substrate holding device due to changes in the environment (temperature and humidity) in which the substrate is placed, changes in the optical path of various measuring lights such as positional information of the substrate to be measured, and formation of liquid adhesion marks (i.e., water marks) caused by vaporization of the remaining liquid.

According to a4 th aspect of the present invention, there is provided a substrate holding apparatus (PH) for holding a processing substrate (P) to be irradiated with Exposure Light (EL) through a Liquid (LQ), the apparatus comprising: a substrate (PHB); a1 st holding part (PH1) formed on the base material (PHB) and holding the processing substrate (P); a2 nd holding part (PH2) formed on the base material (PHB) for holding the plate body (T) near the processing substrate (P) held by the 1 st holding part (PH 1); and a liquid recovery port (61, 161, 181) formed in the base material (PHB) and configured to recover Liquid (LQ) that has permeated through a gap (A) between the processing substrate (P) held in the 1 st holding part (PH1) and the plate body (T) held in the 2 nd holding part (PH 2).

According to the present invention, the plate body disposed in the vicinity of the processing substrate body held by the 1 st holding portion can be easily attached to the 2 nd holding portion. Therefore, for example, when the plate is deteriorated or broken, only the plate can be easily exchanged with a new plate. Since the liquid infiltrated from the gap between the processing substrate held in the 1 st holding part and the plate body held in the 2 nd holding part can be collected by the liquid collection port, the trouble that the liquid flows back to the back surface side of the substrate can be suppressed.

According to a 5 th aspect of the present invention, there is provided a substrate holding apparatus (PH) for holding a processing substrate (P) to be irradiated with Exposure Light (EL) through a Liquid (LQ), the substrate holding apparatus comprising: a substrate (PHB); a1 st holding part (PH1) formed on the base material (PHB) and holding the processing substrate (P); and a2 nd holding part (PH2) formed on the base material (PHB) for holding the plate body (T) in the vicinity of the processing substrate (P) held by the 1 st holding part (PH1), the plate body (T) held by the 2 nd holding part (PH2) comprising: a1 st surface (Ta) which is substantially flush with the surface (Pa) of the processing substrate (P); and a2 nd surface (Tj) facing the rear surface of the processing substrate (P) at the peripheral edge of the processing substrate (P) held by the 1 st holding part (PH 1).

According to the present invention, the plate body disposed in the vicinity of the processing substrate body held by the 1 st holding portion can be easily attached to the 2 nd holding portion. Therefore, for example, when the plate is deteriorated or broken, only the plate can be easily exchanged with a new plate. Since the plate body has the 1 st surface that is substantially flush with the surface of the processing substrate, the liquid immersion area can be maintained well even if the liquid immersion area formed on the processing substrate is partially disposed on the plate body. Further, since the plate body has the 2 nd surface facing the rear surface of the processing substrate at the peripheral edge portion of the processing substrate, it is possible to prevent a problem that the liquid permeating from the gap between the processing substrate held by the 1 st holding portion and the plate body held by the 2 nd holding portion flows back to the rear surface side of the substrate.

According to the present invention, there is provided an exposure apparatus (EX), characterized in that: the substrate processing apparatus is provided with the substrate holding device (PH), and the processing substrate (P) held by the substrate holding device (PH) is exposed by irradiating Exposure Light (EL) with a Liquid (LQ).

According to the present invention, the plate body disposed in the vicinity of the processing substrate body held by the 1 st holding portion can be easily attached to the 2 nd holding portion. Accordingly, for example, when the plate is deteriorated or damaged, the plate can be easily exchanged with a new plate. Since the liquid is prevented from penetrating into the back surface side of the substrate, exposure can be performed with good accuracy while the substrate is held well by the substrate holding device.

According to the present invention, there is provided a device manufacturing method characterized by: the exposure apparatus (EX) described above was used. According to the present invention, since the exposure process and the measurement process can be performed well, an element having desired performance can be provided.

According to a 6 th aspect of the present invention, there is provided a substrate stage (PST) that moves while holding a processing substrate (P) irradiated with exposure light, the PST comprising: a substrate (PHB); a1 st holding part (PH1) formed on the base material (PHB) and configured to detachably hold the processing substrate (P); and a2 nd holding part (PH2) formed on the base material (PHB) and configured to detachably hold the plate body (T) in the vicinity of the processing substrate held by the 1 st holding part. According to the present invention, since the plate body is detachably held by the 2 nd holding portion provided on the base material on the substrate stage, the plate body can be held in a good state, and the exchange work of the plate body is facilitated.

According to a 7 th aspect of the present invention, there is provided an exposure method for exposing a processing substrate (P) to light in a predetermined pattern, comprising: a step of disposing the processing substrate (P) on a substrate holder (PH) having a flat surface (Ta) with a predetermined gap (A) therebetween; a step of irradiating the processing substrate with exposure light through the Liquid (LQ) to expose the processing substrate; and a step of recovering the Liquid (LQ) infiltrated from the gap (A) after the exposure treatment of the exposed treatment substrate is finished. According to the exposure method of the present invention, it is possible to prevent the exposure operation from being affected by vibration or the like of the liquid recovery operation.

Drawings

FIG. 1 is a schematic configuration diagram showing an embodiment of an exposure apparatus of the present invention.

FIG. 2 is a side cross-sectional view showing one embodiment of a substrate holder.

FIG. 3 is a top view of one embodiment of a display substrate holder.

Fig. 4 is a plan view of the substrate stage.

Fig. 5 is an enlarged view of a main part of fig. 2.

Fig. 6 is a diagram showing a state where the substrate and the plate member are separated from the substrate holder.

FIG. 7 is a flowchart showing an example of the exposure step.

Fig. 8 is a schematic view showing a state where the polishing process is performed on the substrate holder.

Fig. 9 is a schematic view showing a state where liquid is recovered from the liquid recovery port of the substrate holder.

Fig. 10 is a diagram showing another embodiment (embodiment 2) of the substrate holder.

Fig. 11 is a diagram showing another embodiment (embodiment 3) of the substrate holder.

Fig. 12 is a diagram showing another embodiment (embodiment 4) of the substrate holder.

Fig. 13 is a diagram showing another embodiment (embodiment 5) of the substrate holder.

Fig. 14 is a plan view showing another embodiment (embodiment 6) of the substrate holder.

Fig. 15 is a side sectional view of the substrate holder of embodiment 6.

Fig. 16 is a schematic view showing another embodiment of the exposure apparatus.

Fig. 17 is a flowchart showing an example of a manufacturing process of the semiconductor device.

FIG. 18 is a schematic diagram for explaining a problem of the prior art.

Description of the symbols:

10 liquid supply mechanism

20 liquid recovery mechanism

31 st space

32 nd space 2

40 st vacuum system

42 1 st peripheral wall part (1 st outer wall part)

46 No. 1 support part

60 nd vacuum system

61 suction port 2 (liquid recovery port)

62 peripheral wall part 2 (outer wall part 2)

63 peripheral wall part 3 (outer wall part 3)

66 No. 2 support part

93 moving mirror (Reflector)

94 interferometer

160, 180 vacuum system for recovery

161, 181 liquid recovery port

182, 192 bevels

300 reference part

AR1 projection area

Liquid immersion area of AR2

Light for EL exposure

EX exposure device

LQ liquid

P substrate (processing substrate)

PH substrate holder (substrate holder)

PH 11 st holding part

PH2 No. 2 holding part

PH3 No. 3 holding part

PHB substrate

PL projection optical system

PST substrate carrying platform

T board component (Board, water board)

Ta surface (Flat, 1 st surface)

Tb back

Detailed Description

Hereinafter, the exposure apparatus of the present invention will be described with reference to the drawings, but the present invention is not limited thereto.

< example 1 >

FIG. 1 is a schematic configuration diagram showing an exposure apparatus 1 according to an embodiment of the present invention. In fig. 1, an exposure apparatus EX includes: a mask stage MST capable of supporting and moving a mask M; a substrate stage PST having a substrate holder (substrate holding device) PH for holding a substrate P, and capable of moving the substrate P held by the substrate holder PH; an illumination optical system IL for illuminating a mask M supported on a mask stage MST with exposure light EL; a projection optical system PL for projecting a pattern image of the mask M illuminated with the exposure light EL onto the substrate P supported on the substrate stage PST; and a control device CONT for controlling the overall operation of the exposure apparatus EX.

The exposure apparatus EX of the present embodiment is a liquid immersion exposure apparatus to which a liquid immersion method is applied, which substantially shortens an exposure wavelength to improve resolution and substantially enlarges a depth of focus, and includes: a liquid supply mechanism 10 that supplies the liquid LQ onto the substrate P, and a liquid recovery mechanism 20 that recovers the liquid LQ on the substrate P. In this embodiment, pure water is used for the liquid LQ. The exposure apparatus EX locally forms a liquid immersion area AR2 larger than the projection area AR1 and smaller than the substrate P on at least a part of the substrate P (the projection area AR1 including the projection optical system PL) by the liquid LQ supplied from the liquid supply mechanism 10 at least while the pattern image of the mask M is transferred onto the substrate P. Specifically, the exposure apparatus EX fills the space between the optical element 2 at the image plane side front end of the projection optical system PL and the surface (exposure surface) of the substrate P, and projects the pattern image of the mask M onto the substrate P held by the substrate holder PH by the liquid LQ and the projection optical system PL between the projection optical system PL and the substrate P, thereby exposing the substrate.

Here, in the present embodiment, a case where a scanning type exposure apparatus (i.e., a scanning stepper) is used as the exposure apparatus EX is described as an example, in which a pattern formed on the mask M is exposed to the substrate P while the mask M and the substrate P are moved in synchronization in mutually different directions (opposite directions) in the scanning direction. In the following description, a direction coincident with the optical axis AX of the projection optical system PL is referred to as a Z-axis direction, a direction (scanning direction) in which the mask M moves in synchronization with the substrate P in a plane perpendicular to the Z-axis direction is referred to as an X-axis direction, and a direction (non-scanning direction) perpendicular to the Z-axis direction and the X-axis direction is referred to as a Y-axis direction. The rotational (tilt) directions around the X, Y, and Z axes are referred to as the θ X, θ Y, and θ Z directions, respectively. Here, the "substrate" refers to a process substrate to which various processes including an exposure process are applied, and includes a photoresist on which a photosensitive material is applied on a semiconductor wafer. The "mask" includes a reticle for forming a device pattern to be reduced and projected on a substrate.

The illumination optical system IL illuminates a mask M supported on a mask stage MST with exposure light, and includes: an exposure light source that emits the exposure light EL, an optical integrator that uniformizes illuminance of the exposure light EL emitted from the exposure light source, a condenser lens that condenses the exposure light EL from the optical integrator, a relay lens system, a variable field grating that sets an illumination region on a mask M formed by the exposure light EL in a slit shape, and the like. The predetermined illumination area on the mask M is illuminated with the exposure light EL having a uniform illumination distribution by the illumination optical system IL. As the exposure light EL emitted from the illumination optical system IL, for example, far ultraviolet light (DUV light) such as bright light (g-line, h-line, i-line) and KrF excimer laser light (wavelength 248nm) emitted from a mercury lamp, or ArF excimer laser light (wavelength 193nm) and F excimer laser light are used₂Vacuum ultraviolet light (VUV light) such as laser light (wavelength 157nm), and the like. This example uses an ArF excimer laser. As described above, the liquid LQ of the present embodiment is pure water, and is transmissive to the exposure light EL even if it is ArF excimer laser light. Pure water also transmits far ultraviolet light (DUV light) such as bright lines (g-line, h-line, i-line) and KrF excimer laser (wavelength 248 nm).

The mask stage MST can hold and move the mask M, and fix the mask M by, for example, vacuum adsorption (or electrostatic adsorption). Mask stage MST is movable in 2 dimensions in a plane perpendicular to optical axis AX of projection optical system PL, that is, in the XY plane, and is slightly rotatable in the θ Z direction. Mask stage MST is driven by a mask stage driving device MSTD such as a linear motor. The mask stage driving device MSTD is controlled by the control device CONT.

On mask stage MST, a moving mirror 91 that moves together with mask stage MST is provided. A laser interferometer 92 is provided at a position facing the movable mirror 91. The movable mirror 91 is a mirror for the laser interferometer 92 for measuring the position of the mask stage MST. The 2-dimensional direction (XY direction) position of the mask M on the mask stage MST and the rotation angle in the θ Z direction (which may include the rotation angles in the θ X and θ Y directions depending on the case) are measured in real time by the laser interferometer 92. The measurement result of the laser interferometer 92 is output to the control device CONT. The controller CONT controls the position of the mask M supported on the mask stage MST by driving the mask stage driving device MSTD based on the measurement result of the laser interferometer 92.

The projection optical system PL projects and exposes the pattern of the mask M onto the substrate P at a predetermined projection magnification β. The projection optical system PL is configured by a plurality of optical elements (including an optical element 2 provided at the front end portion on the substrate P side), and these optical elements are supported by a lens barrel PK. In the present embodiment, the projection optical system PL is a reduction system having a projection magnification β of, for example, 1/4, 1/5, or 1/8. In addition, the projection optical system PL may be any of an equal magnification system and an amplification system. The projection optical system PL may include any one of a catadioptric system including a refractive element and a reflective element, a refractive system including no reflective element, and a reflective system including no refractive element. The optical element 2 at the tip of the projection optical system PL according to this embodiment is detachably mounted (exchanged) to the barrel PK, and the liquid LQ in the liquid immersion area AR2 is in contact with the optical element 2.

The substrate stage PST includes a substrate holder PH for holding the substrate P by suction and a plate member T held by the substrate holder PH, and is movable in the XY plane in 2 dimensions on a base BP and slightly rotatable in the θ Z direction. Further, the substrate stage PST can also move in the Z-axis direction, the θ X direction, and the θ Y direction. That is, the substrate P held by the substrate holder PH can move in the Z-axis direction, the θ X, the θ Y direction (tilt direction), the 2-dimensional direction (XY direction), and the θ Z direction.

The substrate stage PST is driven by a substrate stage driving device PSTD including a linear motor and the like. The substrate stage driving device PSTD is controlled by the control device CONT. In this way, the position (focal position) in the Z-axis direction, the position in the tilt direction, the position in the XY direction, and the position in the θ Z direction of the substrate P held by the substrate holder PH are controlled by the substrate stage driving device PSTD via the control device CONT. Further, a moving mechanism of the substrate stage PST is disclosed in, for example, Japanese patent laid-open Nos. 9-5463 and 59-101835.

The substrate holder PH is provided with a moving mirror 93 that moves together with the substrate holder PH relative to the projection optical system PL. A laser interferometer 94 is provided at a position facing the moving mirror 93. The moving mirror 93 is a mirror for the laser interferometer 94 for measuring the position of the substrate stage PST (substrate holder PH). The 2-dimensional direction position of the substrate stage PST and the rotation angle in the θ Z direction are measured in real time by the laser interferometer 94. By measuring the position of the substrate stage PST by the laser interferometer 94, the 2-dimensional direction position of the substrate P and the rotation angle in the θ Z direction are measured. Although not shown, the exposure apparatus EX includes a focus level detection system disclosed in, for example, japanese patent laid-open No. 8-37149, for detecting surface position information of the substrate P held by the substrate holder PH of the substrate stage PST. The focus level detection system detects the Z-axis position information of the surface of the substrate P and the tilt information of the substrate P in the theta X and theta Y directions.

The measurement result of the laser interferometer 94 is output to the control device CONT. The light reception result of the focus level detection system is also output to the control unit CONT. The control device CONT drives the substrate stage driving device PSTD based on the detection result of the focus level detection system to control the focus position and the tilt angle of the substrate P so that the surface of the substrate P coincides with the image plane of the projection optical system PL. The control device CONT controls the position of the substrate P in the X-axis direction and the Y-axis direction by driving the substrate stage PST by the substrate stage driving device PSTD within the 2-dimensional coordinate system defined by the laser interferometer 94 based on the measurement result of the laser interferometer 94.

A substrate alignment system 95 for detecting an alignment mark on the substrate P or a reference mark PFM described later provided on the substrate stage PST is provided near the front end of the projection optical system PL. The substrate Alignment system 95 of the present embodiment employs, for example, the FIA (Field Image Alignment) method disclosed in japanese patent application laid-open No. 4-65603 (corresponding to U.S. Pat. No. 5,493,403), which is configured to make the substrate stage PST still, irradiate the mark with illumination light such as white light from a halogen lamp, take an Image of the obtained mark in a predetermined photographing Field of view with an Image pickup device, and measure the mark position by Image processing.

A mask alignment system 96 for detecting a reference mark MFM, which will be described later, provided on the substrate holder PH via the mask M and the projection optical system PL is provided near the mask stage MST. The mask alignment system 96 of the present embodiment employs, for example, a VRA (Visual reticle alignment) system disclosed in japanese unexamined patent publication No. 7-176468, which irradiates a mark with light, and measures a mark position by image processing image data of the mark captured by a CCD camera.

The liquid supply mechanism 10 is for supplying a predetermined liquid LQ to the image plane side of the projection optical system PL, and includes a liquid supply unit 11 capable of sending out the liquid LQ, and a supply pipe 13 having one end connected to the liquid supply unit 11. The liquid supply unit 11 includes a tank for storing the liquid LQ, a pressure pump, a filter unit for removing foreign matter or bubbles contained in the liquid LQ, and the like. The liquid supply operation of the liquid supply unit 11 is controlled by the control unit CONT. When the liquid immersion area AR2 is formed on the substrate P, the liquid supply mechanism 10 supplies the liquid LQ onto the substrate P. Further, instead of providing at least a part of the tank, the pressure pump, the filter unit, and the like in the exposure apparatus EX, facilities in a factory provided with the exposure apparatus EX may be used instead.

The liquid recovery mechanism 20 is for recovering the liquid LQ on the image plane side of the projection optical system PL, and includes a liquid recovery unit 21 capable of recovering the liquid LQ, and a recovery tube 23 having one end connected to the liquid recovery unit 21. The liquid recovery unit 21 includes, for example: a vacuum system (suction device) such as a vacuum pump, a gas-liquid separator for separating the recovered liquid LQ from the gas, a tank for storing the recovered liquid LQ, and the like. Further, all of the vacuum system, the gas-liquid separator, the tank, and the like may not be provided in the exposure apparatus EX, and facilities in a factory in which the exposure apparatus EX is disposed may be used. The liquid recovery operation of the liquid recovery unit 21 is controlled by the control unit CONT. The liquid recovery mechanism 20 recovers a predetermined amount of the liquid LQ on the substrate P supplied by the liquid supply mechanism 10 in order to form the liquid immersion area AR2 on the substrate P.

Among the plurality of optical elements constituting the projection optical system PL, the nozzle member 70 is disposed in the vicinity of the optical element 2 that is in contact with the liquid LQ. The nozzle member 70 is an annular member provided above the substrate P (substrate stage PST) so as to surround the side surface of the optical element 2. A gap is provided between the nozzle member 70 and the optical element 2, and the nozzle member 70 is supported by a predetermined support mechanism so as to be vibrationally separable from the optical element 2. The liquid LQ is configured so that air bubbles are not mixed into the liquid LQ from the gap without penetrating the gap. The nozzle member 70 is formed of, for example, stainless steel.

The nozzle member 70 includes a supply port 12 provided above the substrate P (substrate stage PST) and arranged to face the surface of the substrate P. In the present embodiment, the nozzle member 70 has 2 supply ports 12A, 12B. The supply ports 12A, 12B are provided in the lower face 70A of the nozzle member 70.

The nozzle member 70 has a supply flow path formed therein so that the supplied liquid LQ flows to the substrate P, one end of the supply flow path of the nozzle member 70 being connected to the other end of the supply pipe 13, and the other end of the supply flow path being connected to the supply ports 12A and 12B, respectively. Here, the other end of the supply channel formed inside the nozzle member 70 is branched so as to be connectable to each of the plurality of (2) supply ports 12A, 12B.

The nozzle member 70 includes a recovery port 22 provided above the substrate P (substrate stage PST) and disposed to face the surface of the substrate P. In the present embodiment, the recovery port 22 is formed in a ring shape surrounding the optical element 2 (projection area AR1) and the supply port 12 of the projection optical system PL on the lower surface 70A of the nozzle member 70.

A recovery flow path through which the liquid LQ recovered by the recovery port 22 flows is formed inside the nozzle member 70. One end of the recovery flow path of the nozzle member 70 is connected to the other end of the recovery pipe 23, and the other end of the recovery flow path is connected to the recovery port 22. Here, the recovery flow path formed inside the nozzle member 70 includes an annular flow path corresponding to the recovery port 22 and a manifold flow path for collecting the liquid LQ flowing through the annular flow path.

In the present embodiment, the nozzle member 70 constitutes a part of each of the liquid supply mechanism 10 and the liquid recovery mechanism 20. The supply ports 12A, 12B constituting the liquid supply mechanism 10 are provided at both sides in the X-axis direction of the projection area AR1 with the projection optical system PL interposed therebetween. The recovery port 22 constituting the liquid recovery mechanism 20 is provided outside the liquid supply ports 12A, 12B of the liquid supply mechanism 10 with respect to the projection area AR1 of the projection optical system PL. That is, the recovery port 22 is provided at a position away from the liquid supply ports 12A and 12B with respect to the projection area AR 1. The projection area AR1 of the projection optical system PL of the present embodiment is set to be rectangular in a plan view with the Y-axis direction as the long side direction and the X-axis direction as the short side direction.

The operation of the liquid supply unit 11 is controlled by the control unit CONT. The control unit CONT can control the amount of liquid supplied per unit time by the liquid supply unit 11. When the liquid LQ is supplied to the substrate P, the controller CONT sends the liquid LQ from the liquid supply unit 11, and supplies the liquid LQ onto the substrate P from the supply ports 12A and 12B provided above the substrate P through the supply pipe 13 and the supply flow path formed inside the nozzle member 70. The liquid LQ is supplied from both sides of the projection area AR1 through the supply ports 12A, 12B.

The liquid recovery operation of the liquid recovery unit 21 is controlled by the control unit CONT. The control unit CONT can control the amount of liquid to be recovered per unit time by the liquid recovery unit 21. The liquid LQ above the substrate P collected from the collection port 22 provided above the substrate P is collected into the liquid collection unit 21 through the collection flow path formed inside the nozzle member 70 and the collection pipe 23.

The number, shape, arrangement, and the like of the supply ports 12A, 12B and the recovery ports 22 are not limited to those described above, and may be any structure as long as the optical path of the exposure light EL can be filled with the liquid LQ.

Under the optical element 2 of the projection optical system PLThe (liquid contact surface) 2A and the lower surface (liquid contact surface) 70A of the nozzle member 70 have lyophilic properties (hydrophilic properties). In the present embodiment, since the optical element 2 is formed of fluorite having a high affinity with pure water, the pure water can be brought into substantially close contact with the entire surface of the liquid contact surface 2A of the optical element 2. On the other hand, since the liquid supply mechanism 10 supplies pure water as the liquid LQ in the present embodiment, the adhesion between the liquid contact surface 2A of the optical element 2 and the liquid LQ can be improved, and the optical path between the optical element 2 and the substrate P can be reliably filled with the liquid LQ. The optical element 2 may be quartz having a high affinity for water. The liquid contact surface 2A of the optical element 2 and the liquid contact surface 70A of the nozzle member 70 may be subjected to hydrophilization (lyophilic) treatment to further improve the affinity with the liquid LQ. As the lyophilic treatment, MgF is exemplified₂、Al₂O₃、SiO₂And the like, to the liquid contact surface. Alternatively, since the liquid LQ of the present embodiment is water having a large polarity, a thin film may be formed by a molecular structure having a large polarity, such as alcohol, as a lyophilic treatment (hydrophilization treatment). The nozzle member 70 may be formed of titanium having high hydrophilicity with water.

Next, an embodiment of substrate stage PST (substrate holder PH) will be described with reference to fig. 2, 3, and 4. Fig. 2 is a side cross-sectional view of substrate holder PH that holds substrate P and plate member T (to be described later) by suction, fig. 3 is a plan view of substrate holder PH as viewed from above, and fig. 4 is a plan view of substrate stage PST as viewed from above.

In fig. 2, the substrate holder PH includes: a base material PHB formed on the base material PHB to adsorb and hold the substrate P, and a1 st holding part PH 1; and a2 nd holding part PH2 formed on the base PHB for sucking and holding the plate member T in the vicinity of the substrate P sucked and held by the 1 st holding part PH 1. The substrate holds a substrate PHB with PH that is mobile. The plate member T is a member different from the base material PHB, and is provided so as to be detachable from and replaceable with the base material PHB of the substrate holder PH. In this embodiment, the state where the plate member T is held by the absorption of the base material PHB is referred to as a substrate stage PST.

The plate member T is disposed on the substrate holder PH in the vicinity of the substrate P held in the 1 st holding part PH1, and the surface Ta of the plate member T held in the 2 nd holding part PH2 is disposed around the surface Pa of the substrate P held in the 1 st holding part PH 1. Each of the front surface Ta and the back surface Tb of the plate member T is a flat surface (flat portion). The plate member T is substantially the same thickness as the substrate P. The surface Ta (flat surface) of the plate member T held by the 2 nd holding portion PH2 is substantially flush with the surface Pa of the substrate P held by the 1 st holding portion PH 1. That is, the plate member T held in the 2 nd holding part PH2 forms a flat surface Ta around the substrate P held in the 1 st holding part PH1, which is substantially flush with the surface Pa of the substrate P. In the present embodiment, when the substrate P is held on the upper surface of the substrate stage PST, the flat surface Ta of the held plate member T and the surface Pa of the held substrate P are formed as a full flat surface (full flat surface) in substantially the entire area.

As shown in fig. 3 and 4, the base material PHB of the substrate holder PH is formed in a rectangular shape in a plan view, and moving mirrors 93 for a laser interferometer 94 for measuring the position of the base material PHB (substrate holder PH) are formed on both side surfaces of the substrate holder PH perpendicular to each other.

As shown in fig. 4, the plate member T is formed in a rectangular shape in plan view so as to follow the shape of the base material PHB, and has a substantially circular hole TH in the central portion thereof, in which the substrate P can be disposed. That is, the plate member T is a substantially annular member arranged to surround the substrate P held by the 1 st holding portion PH1 of the substrate holder PH. The surface Ta of the plate member T held by the 2 nd holding part PH2 is arranged around the substrate P held by the 1 st holding part PH1, and is formed to surround the substrate P.

In fig. 4, the outer shape of the panel member T is formed in a rectangular shape in plan view so as to substantially match the outer shape of the base material PHB, but the panel member T may be formed larger than the base material PHB. At this time, since the peripheral edge portion of the rectangular plate member T extends beyond the outer surface of the substrate PHB, the liquid can be prevented from adhering to the interferometer mirror surface (formed on the outer surface of the substrate PHB).

As shown in fig. 2 and 3, the 1 st holding portion PH1 of the substrate holder PH includes: a convex 1 st support part 46 formed on the base material PHB, a ring-shaped 1 st peripheral wall part 42 formed on the base material PHB so as to surround the periphery of the 1 st support part 46, and a1 st suction port 41 formed on the base material PHB inside the 1 st peripheral wall part 42. The 1 st supporting portion 46 is formed in plural and same shapes inside the 1 st peripheral wall portion 42. In this embodiment, the 1 st supporting part 46 includes a plurality of supporting pins. The 1 st suction port 41 is provided inside the 1 st peripheral wall portion 42 at a plurality of predetermined positions on the upper surface of the base material PHB other than the 1 st support portion 46, for suction-holding the substrate P. In this embodiment, the 1 st suction port 41 is disposed inside the 1 st peripheral wall portion 42 in plural and the same shape. The 1 st peripheral wall portion 42 is formed in a substantially annular shape corresponding to the shape of the substrate P. The upper surface 42A of the 1 st peripheral wall portion 42 is formed to face the edge region of the back surface Pb of the substrate P.

The 1 st suction port 41 is connected to the 1 st vacuum system 40 through a flow path 45. The 1 st vacuum system 40 is provided with a vacuum pump for making the 1 st space 31 surrounded by the base material PHB, the 1 st peripheral wall portion 42, and the back surface of the substrate P negative pressure. As described above, the 1 st supporting part 46 includes the supporting pin, and the 1 st holding part PH1 of the present embodiment constitutes a part of a so-called pin chuck mechanism. The 1 st peripheral wall portion 42 functions as an outer wall portion surrounding the 1 st space 31 (including the 1 st support portion 46), and the controller CONT drives the 1 st vacuum system 40 to suck the gas (air) in the 1 st space 31 surrounded by the base material PHB, the 1 st peripheral wall portion 42, and the substrate P, thereby making the 1 st space 31 negative in pressure, and to suck and hold the substrate P to the 1 st support portion 46.

The 2 nd holding part PH2 of the substrate holder PH includes: a2 nd peripheral wall portion 62 having a substantially annular shape and formed on the base material PHB so as to surround the 1 st peripheral wall portion 42 of the 1 st holding portion PH 1; an annular 3 rd peripheral wall portion 63 provided outside the 2 nd peripheral wall portion 62 and formed on the substrate PHB so as to surround the 2 nd peripheral wall portion 62; a convex-shaped second support part 66 formed on the base material PHB between the 2 nd peripheral wall part 62 and the 3 rd peripheral wall part 63; and a2 nd suction port 61 formed in the substrate PHB between the 2 nd peripheral wall portion 62 and the 3 rd peripheral wall portion 63. The 2 nd peripheral wall portion 62 is provided outside the 1 st peripheral wall portion 42 with respect to the 1 st space 31, and the 3 rd peripheral wall portion 63 is provided further outside the 2 nd peripheral wall portion 62. The 2 nd support part 66 is formed in a plurality of identical shapes between the 2 nd peripheral wall part 62 and the 3 rd peripheral wall part. In this embodiment, the 2 nd support part 66 includes a plurality of support pins. The 2 nd suction port 61 is provided between the 2 nd peripheral wall 62 and the 3 rd peripheral wall 63 at a plurality of predetermined positions other than the 2 nd support portion 66 on the upper surface of the base material PHB, for sucking and holding the plate member T. In the present embodiment, the 2 nd suction port 61 is disposed in plural and the same shape between the 2 nd peripheral wall portion 62 and the 3 rd peripheral wall portion 63. The 2 nd peripheral wall portion 62 is formed in a substantially annular shape corresponding to the hole portion TH of the plate member T. The 3 rd peripheral wall portion 63 is formed in a substantially rectangular annular shape corresponding to the outer shape of the plate member T. The upper surface 62A of the 2 nd peripheral wall portion 62 is formed in an inner edge region near the hole portion TH of the plate member T so as to face the rear surface Tb of the plate member T. The upper surface 63A of the 3 rd peripheral wall portion 63 is formed in the outer edge region of the plate member T so as to face the rear surface Tb of the plate member T.

In the figure, the upper surfaces of the 1 st peripheral wall portion 42, the 2 nd peripheral wall portion 62, and the 3 rd peripheral wall portion 63 have a wide width, but actually have a width of less than 2mm, for example, about 0.1 mm.

Each 2 nd suction port 61 is connected to the 2 nd vacuum system 60 through a flow path 65. The 2 nd vacuum system 60 is a system for making the 2 nd space 32 surrounded by the base material PHB, the 1 st and 2 nd peripheral wall portions 62 and 63, and the plate member T negative pressure, and includes a vacuum pump. As described above, the 2 nd support part 66 includes the support pin, and the 2 nd holding part PH2 of the present embodiment is a part constituting a so-called pin chuck mechanism. The 2 nd and 3 rd peripheral wall portions 62 and 63 have a function of an outer wall portion surrounding the 2 nd space 32 (including the 2 nd support portion 66), and the controller CONT drives the 2 nd vacuum system 60 to suck the gas (air) in the 2 nd space 32 surrounded by the base material PHB, the 2 nd and 3 rd peripheral wall portions 62 and 63, and the plate member T, thereby making the 2 nd space 32 negative pressure to suck and hold the plate member T to the 2 nd support portion 66.

In the present embodiment, the pin chuck mechanism is used for sucking and holding the substrate P, but other chuck mechanisms may be used. Similarly, although the pin chuck mechanism is used for holding the plate member T by suction, other chuck mechanisms may be used.

In the present embodiment, a vacuum suction mechanism is used for suction holding of the substrate P and the plate member T, but at least one of them may be held by another mechanism such as an electrostatic suction mechanism.

The 1 st vacuum system 40 for making the 1 st space 31 negative pressure and the 2 nd vacuum system 60 for making the 2 nd space 32 negative pressure are independent of each other. The controller CONT can individually control the operations of the 1 st vacuum system 40 and the 2 nd vacuum system 60, and can independently perform the suction operation of the 1 st vacuum system 40 to the 1 st space 31 and the suction operation of the 2 nd vacuum system 60 to the 2 nd space 32. For example, the substrate P can be replaced while the plate member T is held in the 2 nd holding part PH 2. The controller CONT can control the 1 st vacuum system 40 and the 2 nd vacuum system 60 so that the pressure in the 1 st space 31 and the pressure in the 2 nd space 32 are different from each other.

As shown in fig. 2 and 4, a gap a of about 0.1 to 1.0mm is formed between the edge portion of the outer side of the substrate P held by the 1 st holding portion PH1 and the edge portion of the inner side (hole TH side) of the plate member T provided around the substrate P. The gap a in this example is about 0.3 mm. By setting the gap a between the edge of the substrate P and the edge of the plate member T to be about 0.1 to 1.0mm, that is, by setting the inner diameter of the hole TH to be about 0.2 to 2.0mm larger than the outer diameter of the substrate P, even when the liquid immersion area AR2 of the liquid LQ is formed on the gap a, the liquid LQ hardly flows into the gap a due to the surface tension of the liquid LQ, and even when the edge area E of the substrate P is to be exposed, the liquid LQ can be held under the projection optical system PL by the plate member T.

As shown in fig. 4, the substrate P of the present embodiment has a notch NT for alignment. The shape of the plate member T is set according to the outer shape of the substrate P (the shape of the notch NT), and the gap between the substrate P and the plate member T at the notch NT is also set to about 0.1 to 1.0 mm. That is, a gap A of about 0.1 to 1.0mm is secured between the plate member T and the entire edge portion of the substrate P including the notch NT. Specifically, the plate member T is provided with a projection 150 projecting inward of the hole TH so as to correspond to the shape of the notch NT of the substrate P. The 2 nd peripheral wall portion 62 of the 2 nd holding portion PH2 and the upper surface 62A thereof are formed with a convex portion 62N corresponding to the shape of the protrusion 150 of the plate member T. The protrusion 150 functions as a gap adjuster for reducing a gap between the surface Pa of the notch NT of the substrate P held by the 1 st holding portion PH1 and the surface Ta of the plate member T. In addition, although the protrusion 150 is formed integrally as a part of the plate member T, the plate member T and the protrusion 150 may be separately provided, and the protrusion 150 may be replaced with the plate member T.

The 1 st peripheral wall portion 42 of the 1 st holding portion PH1 and the upper surface 42A thereof are formed with a concave portion 42N corresponding to the shape of the convex portion 62N of the 2 nd peripheral wall portion 62 and the notch NT of the substrate P. The recessed portion 42N of the 1 st peripheral wall portion 42 is provided at a position facing the projecting portion 62N of the 2 nd peripheral wall portion 62, and a predetermined gap is formed between the recessed portion 42N and the projecting portion 62N.

Although the notch portion NT is described as an example of the notch portion of the substrate P, each plate member T, the 1 st peripheral wall portion 42, and the 2 nd peripheral wall portion 62 may be formed in a shape corresponding to the outer shape of the substrate P to secure a predetermined gap between the substrate P and the plate members T around the substrate P if there is no notch portion or if an orientation flat portion (orientation flat portion) is formed as the notch portion.

When substrate P has no notch NT or when notch NT is very small, plate member may not be provided with protrusion 150. In this case, the concave portion 42N and the convex portion 62N may not be provided.

The 2 nd suction port 61 formed in the base material PHB functions as a liquid recovery port for recovering the liquid LQ that has permeated through the gap a between the substrate P held in the 1 st holding part PH1 and the plate member T held in the 2 nd holding part PH 2. As described above, the 2 nd holding portion PH2 holds the plate member T on the rear surface Tb side of the plate member T to form the 2 nd space 32, and the 2 nd suction port 61 is formed on the rear surface Tb side of the plate member T held by the 2 nd holding portion PH2, and also has a function of collecting the liquid LQ that has penetrated into the 2 nd space 32 on the rear surface Tb side of the plate member T from the gap a.

Fig. 5 is an enlarged cross-sectional view of a main part of the substrate holder PH holding the substrate P and the plate member T. In fig. 5, the gap a of about 0.1 to 1.0mm is secured between the side surface Pc of the substrate P and the side surface Tc of the plate member T facing the side surface Pc, as described above. The upper surface 42A of the 1 st peripheral wall portion 42 and the upper surface 62A of the 2 nd peripheral wall portion 62 are flat surfaces. Although not shown in fig. 5, the upper surface 63A of the 3 rd peripheral wall portion 63 is also a flat surface.

In the present embodiment, the 1 st supporting portion 46 of the 1 st holding portion PH1 is formed to have the same height as the 1 st peripheral wall portion 42 or to be slightly higher than the 1 st peripheral wall portion 42. That is, the position of the upper surface 46A of the 1 st supporting portion 46 in the Z-axis direction in the 1 st holding portion PH1 is the same as the position of the upper surface 42A of the 1 st peripheral wall portion 42 in the Z-axis direction, or slightly higher than the position of the upper surface 42A of the 1 st peripheral wall portion 42 in the Z-axis direction. Thus, when the 1 st space 31 is set to a negative pressure, the back surface Pb of the substrate P can be brought into close contact with the upper surface 42A of the 1 st peripheral wall portion 42. And the back surface Pb of the substrate P is supported on the upper surface 46A of the 1 st supporting portion 46. Since the back surface Pb of the substrate P and the upper surface 42A of the 1 st peripheral wall portion 42 are in close contact with each other, even if the liquid LQ penetrates from the gap a to the back surface Pb side of the substrate P, the liquid LQ is prevented from penetrating into the 1 st space 31 through a gap between the back surface Pb of the substrate P and the upper surface 42A of the 1 st peripheral wall portion 42.

In the 2 nd holding part PH2, the 2 nd supporting part 66 is formed slightly higher than the 2 nd peripheral wall part 62. In other words, the 2 nd peripheral wall portion 62 of the 2 nd holding portion PH2 is formed lower than the 2 nd supporting portion 66. That is, in the 2 nd holding portion PH2, the position of the upper surface 66A of the 2 nd supporting portion 66 in the Z axis direction is slightly higher than the position of the upper surface 62A of the 2 nd peripheral wall portion 62 in the Z axis direction, whereby a predetermined gap is formed between the rear surface Tb of the plate member T and the upper surface 62A of the 2 nd peripheral wall portion 62 even in a state where the 2 nd space 32 is brought into a negative pressure and the plate member T is sucked and held on the 2 nd supporting portion 66. The gap B is smaller than the gap A, less than 50 μm, for example, about several μm (e.g., 3 μm). Although not shown in fig. 5, the 3 rd peripheral wall 63 is formed to be slightly lower than the 2 nd support 66 or to be substantially the same height as the 2 nd support 66, and when the 2 nd space 32 is brought into a negative pressure, the upper surface 63A of the 3 rd peripheral wall 63 can be brought into close contact with the back surface Pb of the substrate P. Since the gap between the back surface Tb of the plate member T and the upper surface 62A of the 2 nd peripheral wall portion 62 is very small, the negative pressure in the 2 nd space 32 can be maintained.

The height of the 2 nd support portion 66 and the height of the 2 nd peripheral wall portion 62 may be determined so that the back surface Tb of the plate member T is in close contact with the upper surface 62A of the 2 nd peripheral wall portion 62. The height of the 2 nd support part 66 and the height of the 3 rd peripheral wall part 63 may be determined so that a very small gap is formed between the rear surface Tb of the plate member T and the upper surface 63A of the 3 rd peripheral wall part 63.

A gap C is formed between the 1 st peripheral wall portion 42 and the 2 nd peripheral wall portion 62. Here, the outer diameter of the annular 1 st peripheral wall portion 42 (the 1 st holding portion PH1) is formed smaller than the outer diameter of the substrate P. Thus, the peripheral edge of the substrate P is beyond the outer side of the 1 st peripheral wall 42 by about 0.5 to 1.5mm, for example, and the gap C is larger than the gap A by about 1.5 to 2.5mm, for example.

In fig. 5, the thickness Dp of the substrate P is substantially the same as the thickness Dt of the plate member T. The upper surface 42A of the 1 st peripheral wall portion 42, the upper surface 46A of the 1 st support portion 46, the upper surface 66A of the 2 nd support portion 66, the upper surface 62A of the 2 nd peripheral wall portion 62, and the upper surface 63A of the 3 rd peripheral wall portion 63 have a slight difference in height, but have substantially the same height, and the surface Pa of the substrate P held by the 1 st holding portion PH1 and the surface Ta of the plate member T held by the 2 nd holding portion PH2 are substantially flush with each other.

The plate member T of the present embodiment is formed of quartz (glass). As shown in fig. 4, a reference portion 300 having reference marks MFM for defining the position of the substrate P with respect to the pattern image of the mask M passing through the projection optical system PL is provided at a predetermined position on the surface Ta of the plate member T. These reference marks MFM and PFM are formed on a plate member T made of quartz at predetermined positions using a predetermined material such as chromium, for example. The fiducial marks PFM are detected by the substrate alignment system 95 and the fiducial marks MFM are detected by the mask alignment system 96. In addition, only one of the reference mark MFM and the reference mark PFM may be provided.

A reference plate 400 serving as a reference surface of the focus level detection system is provided at a predetermined position on the surface Ta of the plate member T. The upper surface of the reference portion 300 and the upper surface of the reference plate 400 are substantially flush with the surface Pa of the substrate P held by the 1 st holding portion PH 1.

The surface (flat portion) Ta, the back surface Tb, and the side surface Tc of the plate member T made of quartz are each coated with a liquid repellent material. The liquid repellent material is also coated on the reference portion 300 having the reference marks MFM and PFM and the reference plate 400, and the upper surface of the reference portion 300 and the upper surface of the reference plate 400 are also provided with liquid repellent. Examples of the liquid repellent material include fluorine-based resin materials such as polytetrafluoroethylene, acrylic resin materials, and the like. By applying such a liquid repellent material to the plate member T made of quartz, the front surface Ta, the back surface Tb, and the side surface Tc of the plate member T can be made liquid repellent to the liquid LQ. In the present embodiment, a plate member T made of quartz is coated with "satt cloth" (fluororesin, manufactured by asahi glass company, japan). In order to impart liquid repellency to the plate member T, a film made of the liquid-repellent material may be attached to the plate member T. A material that is insoluble in the liquid LQ may be used as the liquid-repellent material for imparting liquid repellency to the material. The plate member T itself may be formed of a liquid repellent material (fluorine series material, etc.). Alternatively, the plate member T may be formed of stainless steel or the like, and at least a part of the front surface Ta, the back surface Tb, and the side surface Tc may be subjected to liquid repellent treatment.

Further, an opening may be provided at a predetermined position of the plate member T, and the upper surface of the optical sensor may be exposed from the opening. Examples of such optical sensors include an illuminance unevenness sensor disclosed in Japanese patent application laid-open No. 57-117238, an aerial image measuring sensor disclosed in Japanese patent application laid-open No. 2002-14005 (corresponding to U.S. Pat. No. 2002/0041377), and an exposure sensor (illuminance sensor) disclosed in Japanese patent application laid-open No. 11-16816 (corresponding to U.S. Pat. No. 2002/0061469). When these optical sensors are provided, the upper surface of the optical sensor, the surface Ta of the plate member T, and the surface Pa of the substrate P are also made substantially flush with each other. The upper surface of the optical sensor is also coated with a liquid repellent material to make it liquid repellent.

A photoresist (photosensitive material) is applied to the surface Pa (exposed surface) of the substrate P. In this example, the photosensitive material was a photosensitive material for ArF excimer laser, and had liquid repellency (water repellency, contact angle 80 ° to 85 °). In this embodiment, the side surface Pc of the substrate P is subjected to a dehydration treatment (hydration treatment). Specifically, the side surface Pc of the substrate P is also coated with the aforementioned liquid-repellent photosensitive material. This makes it possible to more reliably prevent the liquid LQ from penetrating through the gap a between the liquid-repellent plate member T and the side surface Pc of the substrate P. Furthermore, the photosensitive material is coated on the back surface Pb of the substrate P for performing a stripping process. The material for imparting liquid repellency to the back surface Pb or the side surface Pc of the substrate P is not limited to the photosensitive material described above, and may be a predetermined liquid repellent material. For example, although there may be a case where a protective layer (a film for protecting the photosensitive material from a liquid) called an over coat layer is applied on the upper layer of the photosensitive material (applied on the exposed surface Pa of the substrate P), when the material for forming the over coat layer (for example, a fluorine-based resin material) has liquid repellency (water repellency), the material for forming the over coat layer may be applied on the side surface Pc or the back surface Pb of the substrate P. Of course, a material having liquid repellency other than the photosensitive material or the material for forming the upper layer may be applied.

The surface Pa of the substrate P is not necessarily liquid repellent, and a photoresist having a contact angle with the liquid LQ of about 60 to 80 ° may be used. The side Pc or the back Pb of the substrate P is not necessarily subjected to the pull-out process. That is, the front surface Pa, the back surface Pb, and the side surface Pc of the substrate P may have no liquid repellency, or at least one of these surfaces may be made liquid repellent as necessary.

At least a part of the surface of the substrate PHB having PH is also subjected to a liquid repellent treatment to impart liquid repellency thereto. In this embodiment, the upper surface 42A of the 1 st peripheral wall portion 42, the upper surface 46A of the 1 st supporting portion 46, and the side surface (the surface facing the 2 nd peripheral wall portion 62) 42B of the 1 st holding portion PH1 of the base material PHB of the substrate holder PH have liquid repellency. The upper surface 62A of the 2 nd peripheral wall portion 62, the upper surface 66A of the 2 nd supporting portion 66, and the side surface (surface facing the 1 st peripheral wall portion 42) 62B of the 2 nd holding portion PH2 have liquid repellency. The liquid repellent treatment of the substrate holder PH may be a treatment of applying a liquid repellent material such as the above-mentioned fluorine-based resin material or acrylic-based resin material, or attaching a film made of the liquid repellent material. The entire base PHB (including the 1 st and 2 nd peripheral walls 42 and 62 of the substrate holder PH) may be formed of a material having liquid repellency (e.g., a fluorine-based resin material). The photosensitive material or the coating layer forming material may be applied to the substrate to maintain the PH or to make the plate member T liquid repellent. Further, a material (such as a fluorine-based resin material or an acrylic-based resin material) used for the liquid discharge treatment of the substrate holder PH may be applied to the back surface Pb or the side surface Pc of the substrate P. If it is difficult to impart liquid repellency to the surface of the substrate PHB in terms of processing or precision, any surface region of the substrate PHB may not have liquid repellency.

The base material PHB is provided with a hole 56H for arranging a1 st elevation member 56 for elevating the substrate P relative to the base material PHB. The hole 56H is provided at 3 (see fig. 3) inside the 1 st peripheral wall 42 (i.e., inside the 1 st space 31). The controller CONT controls the elevation operation of the 1 st elevation member 56 by a driving device not shown.

A hole 57H is provided in the base material PHB, and a2 nd lifting member 57 for lifting the plate member T relative to the base material PHB is disposed. In the present embodiment, the hole 57H is provided at 4 (see fig. 3) between the 2 nd peripheral wall portion 62 and the 3 rd peripheral wall portion 63 (i.e., inside the 2 nd space 32). The controller CONT controls the elevation operation of the 2 nd elevation member 57 by a driving device not shown.

As shown in fig. 6, the 1 st elevation member 56 can be elevated while holding the back surface Pb of the substrate P. The substrate P can be separated from the 1 st holding part PH1 by the 1 st elevation member 56 holding the back surface Pb of the substrate P and elevating it. Similarly, the 2 nd elevation member 57 can be elevated while holding the rear surface Tb of the plate member T. As described above, since the plate member T is a member different from the base material PHB and is provided to be attachable to and detachable from the base material PHB of the board holder PH, the plate member T can be separated from the 2 nd holding portion PH2 by holding the rear surface Tb of the plate member T by the 2 nd lifting member 57 and lifting it.

When exchanging the plate members T, the controller CONT raises the 2 nd elevation member 57 after releasing the suction holding of the plate member T by the 2 nd holding part PH 2. The 2 nd elevation member 57 ascends in a state of holding the rear surface Tb of the plate member T. Next, the transport arm, not shown, enters between the plate member T lifted by the 2 nd lifting member 57 and the base material PHB of the substrate holder PH to support the rear surface Tb of the plate member T. Then, the transfer arm carries out the plate member T from the base material PHB (No. 2 holding part PH2) of the substrate holder PH.

On the other hand, when the new sheet member T is mounted on the base material PHB of the substrate holder PH, the controller CONT carries the new sheet member T into the base material PHB of the substrate holder PH by using the carrying arm. At this time, the 2 nd elevation member 57 has risen, and the transfer arm moves the plate member T to the 2 nd elevation member 57 that has risen. The 2 nd elevating member 57 holds the plate member T transferred by the transfer arm and descends. After the 2 nd elevating member 57 is lowered and the plate member T is set on the 2 nd holding part PH2, the controller CONT drives the 2 nd vacuum system 60 to make the 2 nd space 32 negative pressure. Thereby, the plate member T is sucked and held by the 2 nd holding part PH 2.

In addition, the positioning of the board member T with respect to the substrate PHB may be performed by providing a mechanical reference to at least one of the substrate PHB and the board member T and using the mechanical reference, or by providing a dedicated alignment sensor and using the sensor. For example, a mark is provided in advance on each of the substrate PHB and the panel member T, each mark is optically detected, and the relative position of the substrate PHB and the panel member T is adjusted based on the detection result, whereby the panel member T is held by suction at a predetermined position of the substrate PHB.

When the substrate P whose exposure processing has been completed is carried out, the control device CONT releases the suction holding of the substrate P by the 1 st holding portion PH1 and then raises the 1 st elevation member 56. The 1 st elevation member 56 is elevated while holding the back surface Pb of the substrate P. Next, the conveyance arm, not shown, enters between the substrate P lifted by the 1 st lifting member 56 and the base material PHB of the substrate holder PH, and holds the back surface Pb of the substrate P. Then, the substrate P is carried out (unloaded) from the base material PHB (1 st holding part PH1) of the substrate holder PH by the transfer arm.

On the other hand, when a new substrate P to be subjected to exposure processing is carried into the base material PHB of the substrate holder PH, the controller CONT carries (loads) the new substrate P onto the base material PHB of the substrate holder PH by using the transfer arm. At this time, the 1 st elevation member 56 has ascended, and the transfer arm moves the substrate P to the 1 st elevation member 56 that has ascended. The 1 st elevation member 56 holds the substrate P transferred by the transfer arm and descends. After the 1 st elevation member 56 is lowered and the substrate P is set in the 1 st holding part PH1, the controller CONT drives the 1 st vacuum system 40 to make the 1 st space 31 have a negative pressure. Thereby, the substrate P is sucked and held in the 1 st holding part PH 1.

As described above, since the suction operation of the 1 st vacuum system 40 and the suction operation of the 2 nd vacuum system 60 can be performed independently, the control device CONT can perform the suction holding and suction holding releasing operation of the 1 st holding part PH1 accompanying the carrying in and out of the substrate P and the suction holding and suction holding releasing operation of the 2 nd holding part PH2 accompanying the carrying in and out of the plate member T independently and at separate points in time.

In the present embodiment, since the 2 nd elevating member 57 is provided so that the plate member T can be attached to and detached from the base material PHB, the plate member T can be replaced (unloaded) smoothly.

In the present embodiment, the plate member T is configured to be automatically exchangeable using the 2 nd elevating member 57, but the 2 nd elevating member 57 may be omitted. At this time, the plate member T is exchanged by an operator or the like in a state where the suction of the plate member T is released.

Next, a method of exposing the substrate P using the exposure apparatus EX will be described with reference to the flowchart of fig. 7.

This presupposes that before the substrate P is exposed using the optical sensor on the substrate stage PST as described above, the imaging characteristics of the projection optical system PL passing through the liquid LQ are measured, and based on the measurement results, the imaging characteristics adjustment (calibration) process of the projection optical system PL is performed. The positional relationship (the amount of baseline) between the detection reference position of the substrate alignment system 95 and the projection position of the pattern image is measured using the substrate alignment system 95, the mask alignment system 96, and the like.

Here, in the exposure apparatus EX in the present embodiment, the pattern image of the mask M is projected and exposed onto the substrate P while moving the mask M and the substrate P in the X axis direction (scanning direction), and when performing the scanning exposure, a part of the pattern image of the mask M is projected into the projection area AR1 by the liquid LQ in the liquid immersion area AR2 and the projection optical system PL, and the substrate P is moved in the + X direction (or-X direction) with respect to the projection area AR1 at a speed β · V (β is a projection magnification) in synchronization with the movement of the mask M in the-X direction (or + X direction). As shown in fig. 4, a plurality of shot regions S1 to S24 are set in a matrix on a substrate P, and after exposure of 1 shot region is completed, the next shot region is moved to an acceleration start position by stepping movement of the substrate P, and then, scanning exposure processing is sequentially performed on the shot regions S1 to S24 while moving the substrate P in a step-and-scan manner.

After the substrate P is loaded on the substrate holder PH (the plate member T is suction-held in the 2 nd holding part PH2), the control device CONT sequentially detects the plurality of alignment marks AM formed on the substrate P without passing through the liquid by using the substrate alignment system 95 (step SA 1). The substrate alignment system 95 measures the position of the substrate stage PST (substrate holder PH) when detecting the alignment mark AM by the laser interferometer 94. This makes it possible to measure the position data of each alignment mark AM in the coordinate system defined by the laser interferometer 94. The detection result of the position data of the alignment mark AM detected by the substrate alignment system 95 and the laser interferometer 94 is output to the control unit CONT. The substrate alignment system 95 has a detection reference position in a coordinate system defined by the laser interferometer 94, and alignment mark AM position data is detected as a deviation from the detection reference position.

Next, the controller CONT obtains position data of the plurality of irradiation regions S1 to S24 on the substrate P by arithmetic processing (EGA processing) based on the detection result of the position data of the alignment mark AM (step SA 2). In this embodiment, the position data of the irradiation regions S1 to S24 are obtained by the so-called EGA (Enhanced Global Alignment) method disclosed in, for example, japanese patent application laid-open No. 61-44429.

After the above-described processing is completed, the controller CONT moves the substrate stage PST to move the liquid immersion area AR2 formed on the image plane side of the projection optical system PL onto the substrate P. Thereby, the liquid immersion area AR2 is formed between the projection optical system PL and the substrate P. Next, after the liquid immersion area AR2 is formed on the substrate P, a pattern image is sequentially projected onto each of the plurality of irradiation areas of the substrate P to perform liquid immersion exposure (step SA 3). More specifically, the liquid immersion exposure process is performed on each irradiation region while moving the substrate stage PST and aligning each irradiation region S1 to S24 on the substrate P with the pattern image, based on the positional data of each irradiation region S1 to S24 obtained in step SA2 and the positional relationship (base line amount) between the detection reference position of the substrate alignment system 95 and the projection position of the pattern image stored in the control device CONT.

After the scanning exposure of the irradiation regions S1 to S24 on the substrate P is completed, the control device CONT unloads the substrate P, for which the exposure process has been completed, from the substrate stage PST and loads the substrate before the process on the substrate stage PST, in a state where the liquid LQ is held on the image surface side of the projection optical system PL or after the liquid LQ on the image surface side of the projection optical system PL is collected (step SA 4).

When the liquid immersion exposure is performed on the irradiation regions S1, S4, S21, S24, and the like provided in the edge region E of the substrate P or when the reference mark MFM of the reference portion 300 is measured by the liquid LQ as described above, a part or the whole of the liquid immersion region AR2 of the liquid LQ is formed on the surface Ta of the plate member T. When the optical sensor is provided on the substrate holder PH, the liquid immersion area AR2 of the liquid LQ is partially or entirely formed on the surface Ta of the plate member T when the liquid LQ is measured by using the optical sensor. In this case, since the surface Ta of the plate member T has liquid repellency, the liquid LQ can be recovered satisfactorily by using the liquid recovery mechanism 20, and the occurrence of a problem that the liquid LQ remains on the plate member T can be suppressed. When the liquid LQ remains on the plate member T, the remaining liquid LQ vaporizes and causes a problem of deterioration in exposure accuracy, for example, deformation of the plate member T, or variation in optical paths of various measurement lights such as measurement substrate P position data due to variation in the environment (temperature and humidity) in which the substrate P is placed. After the remaining liquid is vaporized, there is a possibility that traces of adhesion of the liquid (i.e., water marks) may be generated on the plate member T, which may cause contamination of the reference portion 300 and the like. In the present embodiment, since the liquid LQ can be prevented from remaining on the plate member T, deterioration of the exposure accuracy and the measurement accuracy due to the remaining liquid LQ can be prevented.

When the irradiation region provided in the edge region E of the substrate P is exposed, a part of the liquid immersion region AR2 formed on the substrate P is formed on the plate member T, but since the surface Pa of the substrate P and the surface Ta of the plate member T are substantially flush with each other and there is almost no step between the edge of the substrate P and the surface Ta of the plate member T provided therearound, the shape of the liquid immersion region AR2 can be maintained satisfactorily, and problems such as the outflow of the liquid LQ in the liquid immersion region AR2 and the mixing of bubbles into the liquid LQ in the liquid immersion region AR2 can be prevented.

When the irradiation region provided in the edge region E of the substrate P is exposed to light, the liquid immersion region AR2 of the liquid LQ is formed on the gap a, but since the gap a is set to be lower than a predetermined value (set to about 0.1 to 1.0mm in the present embodiment), the surface Pa of the substrate P and the surface Ta of the plate member T have liquid repellency, and the side surfaces Pc of the substrate P and the side surfaces Tc of the plate member T forming the gap a also have liquid repellency, the liquid LQ in the liquid immersion region AR2 can be suppressed from penetrating into the back surface Pb side of the substrate P or the back surface Tb side of the plate member T through the gap a by the surface tension of the liquid LQ. In the present embodiment, since the gap between the substrate P and the plate member T is also secured at the notch portion (cut-out portion) NT of the substrate P, the liquid LQ can be prevented from penetrating from the vicinity of the notch portion NT.

Even if the liquid LQ passes through the gap a and penetrates the rear surface Pb of the substrate P or the rear surface Tb of the plate member T, the rear surface Tb of the plate member T is liquid-repellent, and the upper surface 62A of the 2 nd peripheral wall portion 62 facing the rear surface Tb is also liquid-repellent, so that the liquid LQ is prevented from penetrating into the 2 nd space 32 through the gap a. Accordingly, the liquid LQ can be prevented from penetrating into the 2 nd vacuum system 60 through the 2 nd suction port 61 located inside the 2 nd space 32. Since the back surface Pb of the substrate P is in close contact with the upper surface 42A of the 1 st peripheral wall portion 42 facing the back surface Pb, the liquid LQ is prevented from penetrating into the 1 st space 31. This prevents the liquid LQ from penetrating into the 1 st vacuum system 40 through the 1 st suction port 41 located inside the 1 st space 31.

When the irradiation region provided in the edge region E of the substrate P is to be exposed, there is a possibility that the projection region AR1 is projected outside the substrate P, and the exposure light EL is irradiated onto the surface Ta of the plate member T, and the liquid repellency of the surface Ta is deteriorated by the irradiation of the exposure light EL. In particular, when the liquid repellent material coated on the plate member T is a fluorine-based resin and the exposure light EL is ultraviolet light, the liquid repellent property of the plate member T is more likely to deteriorate (is likely to become lyophilic). In this embodiment, since the plate member T is provided so as to be attachable to and detachable from the 2 nd holding portion PH2 and replaceable, the control device CONT can replace the plate member T having the surface Ta with deteriorated liquid repellency with a new (sufficiently liquid-repellent) plate member T in accordance with the degree of deterioration of liquid repellency of the plate member T (surface Ta), thereby preventing the liquid LQ from penetrating from the gap between the plate member T and the substrate P and the liquid LQ from remaining in the plate member T.

The plate member T can be replaced at a predetermined time interval, for example, at a predetermined number of substrate processing sheets or at a predetermined time interval. Alternatively, the relationship between the irradiation amount (irradiation time, illuminance) of the exposure light EL and the level of liquid repellency of the plate member T may be determined in advance by experiments or simulations, and the time point for replacing the plate member T may be set based on the determined result. The time point of replacement of the plate member T is determined depending on the degree of deterioration of the liquid repellency of the surface of the plate member. The deterioration of liquid repellency can be evaluated, for example, by observing the surface with a microscope or by visual observation, by dropping a drop of liquid on the evaluation surface and observing the state of the liquid with a microscope or by visual observation, or by measuring the contact angle of the liquid. The above evaluation is stored in the control device CONT in advance in a relationship with the cumulative dose (cumulative number of pulses) of ultraviolet rays such as exposure light, whereby the control device CONT can determine the service life of the plate member T, that is, the replacement time (period) from this relationship.

Since the plate member T forming the upper surface of the substrate holder PH is configured to be held by suction in the 2 nd holding part PH2, it is possible to prevent a local force from being applied to the plate member T or the base material PHB, compared to a structure in which the plate member T and the base material PHB are coupled by bolts or the like, for example. This prevents deformation of the sheet member T or the base material PHB, and thus can maintain the flatness of the sheet member T or the substrate P satisfactorily.

As described above, in the substrate holder PH of the present embodiment, the upper surface 42A of the 1 st peripheral wall portion 42, the upper surface 46A of the 1 st supporting portion 46, the upper surface 66A of the 2 nd supporting portion 66, the upper surface 62A of the 2 nd peripheral wall portion 62, and the upper surface 63A of the 3 rd peripheral wall portion 63 have a slight difference in height, but are substantially the same height. The plate member T forming the upper surface of the substrate holder PH is detachably attached to the 2 nd holding portion PH 2. Accordingly, as shown in the schematic view of fig. 8, even when a predetermined process such as a polishing process is performed on the upper surfaces 42A, 46A, 62A, 63A, and 66A in manufacturing the substrate holder PH, the upper surfaces 42A, 46A, 62A, 63A, and 66A can be processed with good workability. For example, in the case where the 1 st retaining part PH1 is formed to be lower than the 2 nd retaining part PH2, the above-described polishing process can be smoothly performed on the upper surface of the 2 nd retaining part PH2, but since the 1 st retaining part PH1 is recessed with respect to the 2 nd retaining part PH2, it is difficult to perform the polishing process on the 1 st retaining part PH 1. In this embodiment, since the upper surfaces of the 1 st retaining part PH1 and the 2 nd retaining part PH2 are at substantially the same height, the above-described treatment can be smoothly performed on the upper surfaces of the 1 st retaining part PH1 and the 2 nd retaining part PH 2. When the polishing process is performed, the polishing process can be performed on the upper surface of the 1 st holding part PH1 and the upper surface of the 2 nd holding part PH2 substantially at the same time, and thus the process can be performed with good workability.

In the above embodiment, the liquid repellent material is coated to apply the liquid repellent treatment to the entire surfaces of the front surface Ta, the side surface Tc, and the back surface Tb of the plate member T, but the side surface Tc and the back surface Tb may be selectively provided with the liquid repellent property as needed. For example, the liquid repellent treatment may be performed only on the region where the gap a is formed (i.e., the side surface Tc of the plate member T) and the region where the gap B is formed (i.e., the region of the upper surface 62A of the rear surface Tb of the plate member T that faces the 2 nd peripheral wall portion 62). Alternatively, if the gap B is sufficiently small or the liquid repellency (contact angle) of the coating material for performing the liquid repellent treatment is sufficiently large, the possibility that the liquid LQ flows into the 2 nd space 32 through the gap a is further reduced, and therefore, the liquid repellent treatment may be performed only on the side surface Tc of the plate member T without applying the liquid repellent treatment to the back surface Tb of the plate member T forming the gap B.

In the present embodiment, as shown in fig. 9, the heights of the 2 nd peripheral wall portion 62 and the 2 nd supporting portion 66 of the 2 nd holding portion PH2 are set, and if the liquid LQ penetrates from the gap a between the substrate P held in the 1 st holding portion PH1 and the plate member T held in the 2 nd holding portion PH2, the liquid LQ penetrating from the gap a is sucked to the back surface Tb side of the plate member T. In other words, the gap between the upper surface 62A of the 2 nd peripheral wall portion 62 of the 2 nd holding portion PH2 and the back surface Tb of the plate member T sucked and held by the 2 nd supporting portion 66 is set so that the liquid LQ permeating through the gap a is sucked to the back surface Tb of the plate member T by the suction operation of the 2 nd suction port 61 formed on the back surface Tb of the plate member T. Further, the gap F between the rear surface Tb of the plate member T supported by the 2 nd support part 66 and the upper surface of the base material PHB on the rear surface Tb thereof is optimally set so that the liquid LQ permeating through the gap a is sucked to the rear surface Tb side of the plate member T by the suction operation of the 2 nd suction port 61 formed on the rear surface Tb side of the plate member T. In this embodiment, the gap F is about 50 μm. Since the back surface Pb of the substrate P is in close contact with the upper surface 42A of the 1 st peripheral wall portion 42, when the gas in the 2 nd space 32 is sucked through the 2 nd suction port 61, a gas flow from the outside of the 2 nd peripheral wall portion 62 to the 2 nd space 32 is generated in the gap between the back surface Tb of the plate member T and the upper surface 62A of the 2 nd peripheral wall portion 62. Accordingly, even if the liquid LQ in the liquid immersion area AR2 penetrates into the gap a, the penetrated liquid LQ flows into the 2 nd space 32 formed on the rear surface Tb side of the plate member T through the gap B without turning to the rear surface Pb side of the substrate P, and is collected from the 2 nd suction port 61 formed on the rear surface Tb side of the plate member T.

In this embodiment, the gap B is formed continuously along the edge of the substrate P outside the substrate P to surround the substrate P. Accordingly, even if the liquid LQ infiltrates from any position of the gap a (including the vicinity of the notch portion (cut portion) NT of the substrate P), the liquid LQ flows into the 2 nd space 32 outside the substrate P through the gap B, and can be smoothly collected from the 2 nd suction port 61.

Thus, even if the liquid LQ penetrates from the gap a, the penetrated liquid LQ is not diverted (does not flow) to the back surface Pb of the substrate P, but is sucked to the back surface Tb of the plate member T through the gap B, and therefore, it is possible to prevent a problem such as deterioration in the flatness of the substrate P due to diversion of the liquid LQ to the back surface Pb of the substrate P.

On the other hand, the plate member T is less frequently replaced than the substrate P and is less required to have high flatness than the substrate P, and therefore, even if the liquid LQ is diverted to the rear surface Tb side of the plate member T, there is no problem.

In this embodiment, the configuration is such that the 2 nd suction port 61 of the suction holding plate member T and the liquid recovery port for recovering the liquid LQ permeated from the gap a are used together, and the 2 nd holding portion PH2 is configured to suction hold the plate member T at least during exposure of the substrate P. Accordingly, the 2 nd suction port (liquid recovery port) 61 is configured to recover the liquid LQ that has penetrated through the gap a at least at any time during exposure of the substrate P. In this way, the liquid LQ that has penetrated through the gap a can be reliably prevented from turning to the back surface Pb of the substrate P. When the liquid LQ penetrates into the back surface Pb of the substrate P, although there is a possibility that the substrate P and the 1 st holding portion PH1 are adsorbed by the liquid and the substrate P cannot be smoothly raised by the 1 st elevation member 56, the liquid LQ is prevented from penetrating into the back surface Pb of the substrate P, thereby preventing the above-described problem.

In the present embodiment, as shown in fig. 9, a porous body 68 is disposed in the middle of the flow path 65 connected to the 2 nd suction port 61. The liquid LQ collected through the second suction port 61 and flowing through the flow path 65 can be captured by the porous body 68. In this way, a problem that the liquid LQ flows into the 2 nd vacuum system 60 can be prevented. The liquid LQ trapped by the porous body 68 can be vaporized in the flow path 65. Since the amount of the liquid LQ collected through the second suction port 61 is very small, the liquid LQ captured by the porous body 68 can be vaporized in the flow path 65. In addition, a mesh member may be disposed in the flow path 65 instead of the porous body 68. Alternatively, a gas-liquid separator for separating the gas from the liquid LQ recovered from the 2 nd suction port 61 may be provided in the middle of the flow path 65 connecting the 2 nd suction port 61 and the 2 nd vacuum system 60, whereby the liquid LQ is prevented from flowing into the 2 nd vacuum system 60. Alternatively, a buffer space larger than the other region may be provided in a predetermined region in the middle of the flow path 65, and the liquid LQ may be captured by the buffer space to prevent the liquid LQ from flowing into the 2 nd vacuum system 60.

In this embodiment, by bringing the back surface Pb of the substrate P into close contact with the upper surface 42A of the 1 st peripheral wall portion 42, that is, by making the gap D between the back surface Pb of the substrate P and the upper surface 42A of the 1 st peripheral wall portion 42 substantially zero, the liquid LQ penetrating from the gap a can be reliably prevented from penetrating into the 1 st space 31 side through the gap between the back surface Pb of the substrate P and the upper surface 42A of the 1 st peripheral wall portion 42. On the other hand, when the gap D is formed between the back surface Pb of the substrate P and the upper surface 42A of the 1 st peripheral wall portion 42, the gap B, the gap D, the negative pressure of the 1 st space 31, and the negative pressure of the 2 nd space 32 are set so that the liquid LQ suction force toward the gap B is larger than the liquid LQ suction force toward the gap D, whereby the liquid LQ infiltrated from the gap a can be smoothly sucked toward the back surface Tb of the plate member T, and the liquid LQ infiltrated from the gap a can be prevented from being diverted toward the back surface Pb of the substrate P.

In the above embodiment, the plurality of the 2 nd suction ports 61 are formed in substantially the same shape on the upper surface of the base material PHB (the surface facing the rear surface Tb of the plate member T) between the 2 nd and 3 rd peripheral wall portions 62, 63, but a plurality of slits may be formed in the 2 nd suction ports 61 in a part of the plurality of the 2 nd suction ports 61, for example, in the vicinity of the 2 nd peripheral wall portion 62 and along the 2 nd peripheral wall portion 62 in the upper surface of the base material PHB between the 2 nd and 3 rd peripheral wall portions 62, 63. In this way, the liquid LQ flowing into the 2 nd space 32 through the gap B can be collected more smoothly.

In the above embodiment, the 2 nd peripheral wall portion 62 is formed in an annular shape in plan view, and the gap B is continuously formed so as to surround the substrate P, but the gap B may be formed discontinuously by locally changing the height of the 2 nd peripheral wall portion 62.

In the above embodiment, the 2 nd space 32 for holding the plate member T by suction is formed by forming the 2 nd peripheral wall portion 62 and the 3 rd peripheral wall portion 63 on the substrate PHB, but the plate member T may be held by a plurality of convex members (pin-shaped members) arranged outside the annular peripheral wall portion by providing the annular peripheral wall portion (the 2 nd outer wall portion) at a plurality of positions outside the 1 st peripheral wall portion 42 and setting the space surrounded by the annular peripheral wall portion to a negative pressure. At this time, by providing the suction port for the liquid LQ outside the annular peripheral wall portion, the liquid LQ that has permeated through the gap a can be recovered from the suction port. In particular, by optimizing the gap F between the rear surface Tb of the plate member T and the upper surface of the base material PHB opposite to the rear surface Tb, the liquid LQ that has permeated through the gap a can be sucked and collected through the suction port provided on the rear surface Tb of the plate member T without being diverted toward the rear surface Pb of the substrate P.

In the above embodiment, the plate member T and the substrate holder PH are separable, but the plate member T and the substrate holder PH may be formed integrally. On the other hand, by forming the plate member T and the substrate holder PH as separate members and holding the plate member T by the 2 nd holding portion PH2, the gap B can be easily formed, and the treatment for imparting liquid repellency to the upper surface 62A of the 2 nd peripheral wall portion 62, the 2 nd supporting portion 66, and the like can be smoothly performed.

In the above embodiment, the thickness of the substrate P is substantially the same as that of the plate member T, and the Z-axis correlation positions of the gap B and the gap D are substantially the same, but they may be different positions. For example, the position of the gap B in the Z-axis may be higher than the position of the gap D. With this, the liquid LQ that has permeated through the gap a can be recovered from the 2 nd suction port 61 through the gap B before reaching the back surface (gap D) of the substrate P, and the liquid LQ can be more reliably prevented from permeating into the 1 st space 31 on the back surface Pb side of the substrate P.

In the above embodiment, the upper surface 62A of the 2 nd peripheral wall portion 62 and the rear surface Tb of the plate member T opposed to the upper surface 62A are substantially parallel (i.e., horizontal) to the XY plane, but the gap B may be inclined to the XY plane with the gap B secured. In the above embodiment, the entire area of the back surface Tb of the plate member T and the upper surface 62A of the 2 nd peripheral wall portion 62 is opposed to each other, but the diameter of the 2 nd peripheral wall portion 62 may be made slightly smaller than the hole TH of the plate member T, or the width of the upper surface 62A may be made larger so that a part of the upper surface 62A of the 2 nd peripheral wall portion 62 is opposed to the gap a (or the back surface Pb of the substrate P).

In the above embodiment, the gap C is formed by forming the recess between the 1 st peripheral wall portion 42 and the 2 nd peripheral wall portion 62, but the 1 st peripheral wall portion 42 and the 2 nd peripheral wall portion 62 may be continuous. That is, a wide peripheral wall portion may be provided instead of the 1 st peripheral wall portion 42 and the 2 nd peripheral wall portion 62. In this case, the negative pressure in the 2 nd space may be different from the negative pressure in the 1 st space to suck the liquid LQ infiltrated from the gap a into the gap B, or a step or inclination may be provided on the upper surface of the peripheral wall portion so that the gap B 'between the upper surface of the wide peripheral wall portion and the back surface Pb of the substrate P and the gap D' between the upper surface of the peripheral wall portion and the back surface Tb of the plate member T are different.

In the above-described embodiment, the case where the liquid immersion exposure apparatus (the pattern image of the mask M is projected onto the substrate P by the liquid LQ) is used has been described as an example, but the present invention can be applied to a general dry exposure apparatus (the pattern image of the mask M is projected onto the substrate P without the liquid LQ). Since the plate member T forming the upper surface of the substrate stage PST is sucked and held by the 2 nd holding portion PH2 and is detachable (replaceable) from and to the base PHB, it can be smoothly replaced with a new plate member when foreign matter (impurities) adheres to, contaminates, or is damaged, for example, on the plate member T or the reference portion 300.

< example 2 >

Next, embodiment 2 of the substrate stage PST (substrate holder PH) will be described. In the following description, the same or equivalent structural parts as those in embodiment 1 are given the same reference numerals, and the description thereof will be omitted or simplified. The description of the modified example common to embodiment 1 is also omitted.

In fig. 10, an intermediate peripheral wall portion 162 having a substantially annular shape in plan view and surrounding the 2 nd peripheral wall portion 62 is provided on the upper surface of the base material PHB between the 2 nd peripheral wall portion 62 and the 3 rd peripheral wall portion 63. The intermediate peripheral wall portion 162 is formed slightly lower than the 2 nd support portion 66 or formed at substantially the same height as the 2 nd support portion 66, and the upper surface 162A of the intermediate peripheral wall portion 162 is substantially in close contact with the rear surface Tb of the plate member T. The 2 nd space 32 is formed by the base material PHB, the intermediate peripheral wall portion 162, the 3 rd peripheral wall portion 63, and the plate member T. The second suction port 61 connected to the 2 nd vacuum system 60 through the flow path 65 is formed on the upper surface of the base material PHB corresponding to the 2 nd space 32 (the upper surface of the base material PHB between the intermediate peripheral wall 162 and the 3 rd peripheral wall 63). The 2 nd vacuum system 60 sucks the gas in the 2 nd space 32 from the 2 nd suction port 61 to make the 2 nd space 32 negative pressure, thereby sucking and holding the plate member T.

The space 167 different from the 2 nd space 32 is formed by the base material PHB, the 2 nd peripheral wall portion 62, the intermediate peripheral wall portion 162, and the plate member T. A liquid recovery port 161 for recovering the liquid LQ that has permeated through the gap a is provided in the upper surface of the substrate PHB between the 2 nd peripheral wall portion 62 and the intermediate peripheral wall portion 162. The liquid recovery port 161 is formed in the vicinity of the 2 nd peripheral wall portion 62 and along the 2 nd peripheral wall portion 62 in a plurality of slit shapes in the upper surface of the substrate PHB between the 2 nd peripheral wall portion 62 and the 3 rd peripheral wall portion 63. The liquid recovery port 161 is connected to the vacuum recovery system 160 through a flow path 165. The controller CONT can independently control the operations of the 1 st vacuum system 40, the 2 nd vacuum system 60, and the recovery vacuum system 160.

A2 nd support part 66 supporting a back surface Tb of the plate member T is provided between the 2 nd peripheral wall part 62 and the intermediate peripheral wall part 162. Further, the 2 nd support portion 66 between the 2 nd peripheral wall portion 62 and the intermediate peripheral wall portion 162 may not be provided. The upper surface 162A of the intermediate peripheral wall portion 162 may have liquid repellency in the same manner as the upper surface 62A of the 2 nd peripheral wall portion 62. A slight gap may be formed between the upper surface 162A of the intermediate peripheral wall 162 and the rear surface Tb of the plate member T.

In the embodiment shown in fig. 10, the controller CONT drives the 1 st and 2 nd vacuum systems 40 and 60 to set the 1 st and 2 nd spaces 31 and 32 to negative pressure during a predetermined period including the exposure of the substrate P, thereby sucking and holding the substrate P and the plate member T in the 1 st and 2 nd holding parts PH1 and PH 2. Here, during the exposure of the substrate P, the control apparatus CONT stops the driving of the vacuum system for collection 160.

By performing the liquid immersion exposure on the substrate P, there is a possibility that the liquid accumulates on or inside the gap a. The liquid LQ that has permeated through the gap a may also be accumulated in the space 168 between the 1 st peripheral wall portion 42 and the 2 nd peripheral wall portion 62. After the exposure of the substrate P is completed, the control apparatus CONT exchanges the exposed substrate P with a new substrate P as described with reference to fig. 6. Before detaching the substrate P from the 1 st holding part PH1, the control unit CONT starts driving the vacuum system for collection 160, and sucks and collects the liquid LQ accumulated in the space 168 and the like through the gap B and the liquid collection port 161 (this operation is continued to step SA3 in fig. 7). Although the driving of the vacuum system 160 for recovery may be continued during the replacement of the substrate P, it is preferable to stop the driving of the vacuum system 160 for recovery first in order to prevent the substrate P from being deviated due to vibration or the like when a new substrate P is loaded on the substrate holding part PH 1. Further, since the gas-liquid separator and the like are provided in the flow path 165 connecting the liquid recovery port 161 and the recovery vacuum system 160, even if the liquid LQ is recovered through the liquid recovery port 161, the liquid LQ can be prevented from flowing into the recovery vacuum system 160.

In this way, by providing the 2 nd suction port 61 (for making the 2 nd space 32 surrounded by the base material PHB, the intermediate peripheral wall portion 162, the 3 rd peripheral wall portion 63, and the plate member T negative pressure) and also providing the liquid recovery port 161 for recovering the liquid LQ that has permeated through the gap a on the base material PHB, the suction holding operation of the plate member T using the 2 nd suction port 61 and the liquid recovery operation using the liquid recovery port 161 can be independently performed. Accordingly, since the driving of the vacuum system for collection 160 can be stopped during the exposure of the substrate P, the influence of the vibration generated by the driving of the vacuum system for collection 160 on the exposure and the variation of the liquid immersion area AR2 during the exposure can be suppressed.

In the present embodiment described with reference to fig. 10, the vacuum system 160 for recovery may be driven during exposure of the substrate P if the influence of vibration generated by driving the vacuum system 160 for recovery on exposure or the fluctuation of the liquid immersion area AR2 during exposure is small. In this way, since the space 167 is also made negative by the vacuum system for collection 160 in conjunction with the vacuum system for collection 60 making the 2 nd space negative, the 2 nd holding part PH2 can more stably suck and hold the plate member T. By driving the recovery vacuum system 160 during the exposure of the substrate P, the liquid LQ that has penetrated through the gap a during the exposure of the substrate P can be recovered well through the gap B and the liquid recovery port 161, and therefore the liquid LQ can be more reliably prevented from penetrating into the 1 st space 31 on the back surface Pb side of the substrate P.

At this time, the amount of suction (suction force) of the liquid recovery port 161 during exposure of the substrate P may be set smaller than the amount of suction (suction force) of the liquid recovery port 161 after exposure of the substrate P, so as to prevent the influence of vibration caused by driving of the recovery vacuum system 160 on the exposure and the variation of the liquid immersion area AR2 during exposure.

In the above-described embodiments 1 and 2, the gap B formed between the upper surface 62A of the 2 nd peripheral wall portion 62 of the 2 nd holding portion PH2 and the rear surface Tb of the plate member T serves as a recovery port (recovery nozzle) when the liquid LQ infiltrated from the gap a is recovered through the suction ports 61 and 161 (formed inside the 2 nd peripheral wall portion 62), and therefore, the function of adjusting the liquid recovery amount of the suction ports 61 and 161 can be also exhibited. Accordingly, the size of the gap B is preferably set to a state in which the amount of the liquid LQ permeating through the gap a is increased without changing the liquid immersion area AR 2.

< example 3 >

Fig. 11 is a view showing embodiment 3. Note that the structure and modifications common to those of embodiments 1 and 2 are not described in detail. In fig. 11, the plate member T held in the 2 nd holding part PH2 includes: a surface (1 st surface) Ta substantially flush with the surface Pa of the substrate P held by the 1 st holding part PH 1; a side surface Tc opposed to the side surface Pc of the substrate P; a liquid receiving surface Tg disposed along the side surface Tc and substantially parallel to the surface Ta; and an opposing surface (2 nd surface) Tj opposing the rear surface Pb of the substrate P at the peripheral edge of the substrate P held by the 1 st holding portion PH 1. As in the above embodiment, the surface Ta of the plate member T is formed so as to surround the surface Pa of the substrate P. The opposing surface Tj of the plate member T is formed in an annular shape along the peripheral edge of the substrate P. That is, the plate member T held in the 2 nd holding portion PH2 is formed along the peripheral edge formation surface Ta and the facing surface Tj of the substrate P held in the 1 st holding portion PH 1. In this embodiment, a gap A is also formed between the edge of the surface Pa of the substrate P and the edge of the surface Ta of the plate member T, and the gap A is 0.1 to 1.0 mm.

The receiving surface Tg is provided below the gap A between the substrate P and the plate member T. The facing surface Tj is provided at a position higher than the receiving surface Tg in the Z-axis direction (+ Z-axis). Next, a concave portion 170 capable of holding the liquid LQ is formed by the side surface Tc, the receiving surface Tg, and the inner surface Th continuous to the facing surface Tj and facing the side surface Tc. The recess 170 can hold the liquid LQ that has permeated from the gap a. The liquid LQ that has permeated through the gap a between the edge of the surface Pa of the substrate P and the edge of the surface Ta of the plate member T is held in the space 173 formed by the side surface Pc of the substrate P, the side surface Tc of the plate member T, and the receiving surface Tg.

The back surface Pb of the substrate P held in the 1 st holding portion PH1 and the facing surface Tj of the plate member T held in the 2 nd holding portion PH2 are in a non-contact state, and a predetermined gap G is formed between the back surface Pb of the substrate P and the facing surface Tj of the plate member T. The gap G between the back surface Pb of the substrate P held in the 1 st holding portion PH1 and the facing surface Tj of the plate member T held in the 2 nd holding portion PH2 is set so that the liquid LQ cannot penetrate. In this embodiment, the gap G is set to about 50 μm. Thereby, even if the liquid LQ penetrates from the gap a, the liquid LQ is prevented from leaking out of the space 173 (the back surface Pb side of the substrate P) through the gap G.

As in the above embodiment, the front surface Ta, the back surface Tb, and the side surface Tc of the plate member T have liquid repellency. Further, the receiving surface Tg, the inner surface Th, and the facing surface Tj of the plate member T also have liquid repellency. The front surface Pa, the back surface Pb, and the side surface Pc of the substrate P also have liquid repellency. As described above, the gap G is set so that the liquid LQ cannot penetrate, but since both the back surface Pb of the substrate P and the opposing surface Tj of the plate member T forming the gap G have liquid repellency, the liquid LQ can be more reliably prevented from leaking to the outside of the plate member T through the gap G.

As described above, in order to prevent the liquid LQ from penetrating through the gap G, the opposing surface Tj of the plate member T is preferably liquid repellent, but the side surface Pc, the receiving surface Tg, and the inner surface Th may not necessarily be liquid repellent, and may be selectively liquid repellent as appropriate.

Similarly to the embodiment described with reference to fig. 10, the 2 nd holding portion PH2 that holds the plate member T has the intermediate peripheral wall portion 162 provided between the 2 nd peripheral wall portion 62 and the 3 rd peripheral wall portion 63. The 2 nd space 32 is formed by the base material PHB, the intermediate peripheral wall portion 162, the 3 rd peripheral wall portion 63, and the plate member T. The 2 nd suction port 61 is formed on the upper surface of the substrate PHB corresponding to the 2 nd space 32, and the 2 nd vacuum system 60 (not shown in FIG. 11) sucks the gas in the 2 nd space 32 from the 2 nd suction port 61 to make the 2 nd space 32 have a negative pressure, thereby sucking and holding the plate member T.

The space 167 is formed by the base material PHB, the 2 nd peripheral wall portion 62, the intermediate peripheral wall portion 162, and the plate member T. The liquid recovery port 161 connected to the vacuum system for recovery 160 through the channel 165 is formed on the upper surface of the substrate PHB corresponding to the space 167. The plate member T has a flow path 171 through which the liquid LQ can flow, formed at a position facing the liquid recovery port 161. The flow path 171 is a hole passing through the receiving surface Tg and the back surface Tb of the plate member T. The liquid LQ held in the space 173 flows into the space 167 through the flow path 171. The liquid LQ that has permeated through the gap a between the edge of the front surface Pa of the substrate P and the edge of the front surface Ta of the plate member T is recovered from the liquid recovery port 161 in the space 167 through the recovery port 172 (formed on the receiving surface Tg of the plate member T and connected to the upper end of the flow path 171).

In the embodiment shown in fig. 11, the controller CONT drives the 1 st and 2 nd vacuum systems 40 and 60 (not shown in fig. 11) to set the 1 st and 2 nd spaces 31 and 32 to negative pressures during a predetermined period including the exposure of the substrate P, thereby sucking and holding the substrate P and the plate member T in the 1 st and 2 nd holding parts PH1 and PH 2. Here, during the exposure of the substrate P, the control apparatus CONT stops the driving of the vacuum system for collection 160.

For example, when the liquid LQ permeates through the gap a during the liquid immersion exposure of the substrate P, the liquid is accumulated in the space 173. After the exposure of the substrate P is completed, the control apparatus CONT exchanges the exposed substrate P with a new substrate P as described with reference to fig. 6. Before the substrate P is removed from the 1 st support portion 46, the control unit CONT starts driving the vacuum system for recovery 160, and sucks the gas in the space 167 through the liquid recovery port 161 to make the space 167 negative in pressure. By making the space 167 negative, the liquid LQ stored in the space 173 can flow into the flow path 171 from the recovery port 172 of the plate member T and flow toward the space 167. Then, the liquid LQ flowing into the space 167 passes through the liquid recovery port 161 formed in the substrate PHB of the space 167, and is sucked and recovered.

In this way, the liquid LQ that has permeated from the gap a can be held by the plate member T. Next, the liquid LQ can be recovered through the liquid recovery port 172 formed in the plate member T at a predetermined time point such as replacement of the substrate P. Since the driving of the vacuum system for collection 160 is stopped during the exposure of the substrate P, the influence of the vibration generated by the driving of the vacuum system for collection 160 on the exposure and the variation of the liquid immersion area AR2 during the exposure can be prevented. Further, although the driving of the vacuum system 160 for recovery may be continued during replacement of the substrate P, it is preferable to stop the driving of the vacuum system 160 for recovery first in order to prevent the substrate P from being deviated due to vibration or the like when a new substrate P is loaded on the substrate holding portion PH 1. The vacuum system 160 for collection may be driven during exposure of the substrate P, but in this case, the negative pressure in the space 167 is preferably set to be low so as not to affect the exposure accuracy or so as not to change the immersion area AR 2.

< example 4 >

Fig. 12 is a view showing the 4 th embodiment. Note that the configuration and modification common to embodiment 1 and its modification are simplified or omitted. In fig. 12, a liquid recovery port 181 for recovering the liquid LQ that has permeated through the gap a (between the substrate P held by the 1 st holding part PH1 and the plate member T held by the 2 nd holding part PH2) is provided on the base material PHB and outside the 1 st space 31 and the 2 nd space 32. Specifically, the liquid recovery port 181 is provided on the upper surface of the base PHB between the 1 st peripheral wall portion 42 of the 1 st retaining portion PH1 and the 2 nd peripheral wall portion 62 of the 2 nd retaining portion PH2, and is provided at a position substantially facing the gap a. The liquid recovery port 181 is formed in a plurality of slit shapes along the 1 st peripheral wall portion 42 (the 2 nd peripheral wall portion 62) in a plan view. The liquid recovery port 181 formed in the PHB substrate is connected to a vacuum system 180 for recovery.

A slope 182 is formed on the upper surface of the base material PHB to collect the liquid LQ held between the substrate P held in the 1 st holding part PH1 and the plate member T held in the 2 nd holding part PH2 in the liquid recovery port 181. The inclined surface 182 includes a1 st inclined surface 182A inclined from the 1 st peripheral wall portion 42 to the liquid recovery port 181, and a2 nd inclined surface 182B inclined from the 2 nd peripheral wall portion 62 to the liquid recovery port 181. In the present embodiment, the upper surface 62A of the 2 nd peripheral wall portion 62 is substantially in close contact with the rear surface Tb of the plate member T.

In the embodiment shown in fig. 12, the controller CONT drives the 1 st and 2 nd vacuum systems 40 and 60 (not shown in fig. 12) to set the 1 st and 2 nd spaces 31 and 32 to negative pressures during a predetermined period including the exposure of the substrate P, thereby sucking and holding the substrate P and the plate member T in the 1 st and 2 nd holding parts PH1 and PH 2. Here, during the exposure of the substrate P, the control apparatus CONT stops the driving of the vacuum system for collection 180.

For example, even if the liquid LQ penetrates from the gap a during the liquid immersion exposure of the substrate P, the upper surface 42A of the 1 st peripheral wall portion 42 and the back surface Pb of the substrate P and the upper surface 62A of the 2 nd peripheral wall portion 62 are substantially in close contact with the back surface Tb of the plate member T, and the liquid repellent treatment is applied to each of the upper surface 42A of the 1 st peripheral wall portion 42 and the upper surface 62A of the 2 nd peripheral wall portion 62, so that the liquid LQ penetrating from the gap a does not penetrate into the 1 st space 31 on the back surface Pb side of the substrate P and the 2 nd space 32 on the back surface Tb side of the plate member T, and accumulates on the gap a, inside the gap a, or in the space between the 1 st peripheral wall portion 42 and the 2 nd peripheral wall portion 62. After the exposure of the substrate P is completed, the control apparatus CONT exchanges the exposed substrate P with a new substrate P as described with reference to fig. 6. Before detaching the substrate P from the 1 st support portion 46, the control device CONT starts driving the recovery vacuum system 180 to suck and recover the liquid LQ from the liquid recovery port 181. Since the substrate PHB is provided with the inclined surface 182 for collecting the liquid LQ in the liquid recovery port 181, the liquid LQ can be recovered well from the liquid recovery port 181.

Since the driving of the vacuum system for collection 180 is stopped during the exposure of the substrate P, the influence of the vibration generated by the driving of the vacuum system for collection 180 on the exposure and the fluctuation of the immersion area AR2 during the exposure can be suppressed.

Further, by making the gap C between the 1 st and 2 nd peripheral wall portions 42 and 62, that is, the width of the substrate P and the plate member T projecting from the peripheral wall portions 42 and 62 large with respect to the gap a between the side surface Pc of the substrate P and the side surface Tc of the plate member T, the liquid LQ can be reliably prevented from penetrating into the 1 st space on the back surface Pb side of the substrate P and the 2 nd space 32 on the back surface Tb side of the plate member T.

Although the driving of the vacuum system 180 for recovery may be continued during the replacement of the substrate P, it is preferable to stop the driving of the vacuum system 180 for recovery first in order to prevent the substrate P from being deviated due to vibration or the like when a new substrate P is loaded on the substrate holding part PH 1.

The vacuum system 180 for recovery may be driven during exposure of the substrate P, but in this case, the suction force of the vacuum system 180 for recovery is preferably set to be small in order to prevent deterioration of the exposure accuracy or variation of the liquid immersion area AR 2.

In the present embodiment, the upper surface 62A of the 2 nd peripheral wall portion 62 is substantially in close contact with the rear surface Tb of the plate member T, but a minute gap B may be formed. In this case, as described in embodiment 1 or embodiment 2, it is preferable to collect the liquid LQ that has penetrated into the 2 nd peripheral wall portion 62 in advance.

< example 5 >

Fig. 13 is a view showing embodiment 5 of the present invention. Embodiment 5 is a modification of embodiment 1, and the portions common to embodiment 1 are omitted or simplified in description. In fig. 13, the liquid recovery port for recovering the liquid LQ that has permeated through the gap a is also used as the 2 nd suction port 61 (formed inside the 2 nd space 32 for sucking and holding the plate member T) in the same manner as in the embodiment shown in fig. 9. A slope 192 inclined from the 1 st peripheral wall portion 42 (1 st space 31) to the 2 nd peripheral wall portion 62 (2 nd space 32) is formed on the upper surface of the substrate PHB outside the 1 st space 31 and the 2 nd space 32. The inclined surface 192 is provided at a position substantially facing the gap a, and has a function of collecting the liquid LQ that has permeated through the gap a toward the 2 nd peripheral wall portion 62.

For example, during exposure of the substrate P, the liquid LQ that has penetrated through the gap a flows into the 2 nd space 32 through the space between the 1 st peripheral wall portion 42 and the 2 nd peripheral wall portion 62 and the gap B, and is sucked and collected from the 2 nd suction port 61. Since the slope 192 is formed on the upper surface of the base PHB between the 1 st peripheral wall portion 42 and the 2 nd peripheral wall portion 62, the liquid LQ can be collected on the 2 nd peripheral wall portion 62 side, and therefore the liquid LQ infiltrated through the gap a can be sucked and collected satisfactorily from the 2 nd suction port 61.

In the embodiment of fig. 13, the intermediate peripheral wall 162 may be disposed as in the 2 nd embodiment, or a flow path for recovering the liquid LQ may be provided between the 1 st peripheral wall 42 and the 2 nd peripheral wall 62 as in the 4 th embodiment of fig. 12.

In the above embodiment, the upper surface and the side surface of the 2 nd peripheral wall portion 62 are made liquid repellent, but in the case where the liquid LQ is allowed to penetrate into the back surface side of the plate member T, the upper surface and the side surface of the 2 nd peripheral wall portion 62 do not need to be made liquid repellent, and conversely, the upper surface and the side surface of the 2 nd peripheral wall portion 62 may be made lyophilic. In this case, a recovery port for recovering the liquid LQ may be provided on the rear surface side of the plate member T.

In the above embodiment, the plate member T is formed as a single plate member, but a plurality of plate members T may be formed on the upper surface of the substrate stage PST. The function of adjusting the position (height) or inclination of the plate member T in the Z-axis direction may be added to the 2 nd holding portion PH2 so that the surface Ta of the plate member T and the surface Pa of the substrate P are substantially flush with each other.

< example 6 >

Next, another embodiment of the substrate stage PST (substrate holder PH) will be described, and particularly, a modification of embodiment 1 will be described. In the following description, the same or equivalent components as those in the above-described embodiments are given the same reference numerals, and the description thereof will be omitted or simplified.

Fig. 14 is a plan view of the substrate stage PST according to the present embodiment, and fig. 15 is a side sectional view of the substrate stage PST (substrate holder PH). In fig. 14 and 15, the substrate holder PH includes: a substrate PHB; a1 st holding part PH1 formed on the substrate PHB for adsorbing and holding the substrate P; a2 nd holding part PH2 formed on the base material PHB and holding the 1 st plate member T1 by suction in the vicinity of the substrate P held by suction in the 1 st holding part PH 1; and a3 rd holding part PH3 formed on the base material PHB, for holding the 2 nd plate member T2 by suction in the vicinity of the substrate P held by suction in the 1 st holding part PH 1. The 1 st plate member T1 and the 2 nd plate member T2 are members different from the base material PHB, and are provided so as to be attachable to and detachable from the base material PHB of the board holder PH and replaceable.

The 1 st plate member T1 is disposed near the substrate P held by the 1 st holding part PH 1. Near the surface Pa of the substrate P held by the 1 st holding portion PH1, the surface Ta of the 1 st plate member T1 held by the 2 nd holding portion PH2 is arranged. The front surface Ta and the rear surface Tb of the 1 st plate member T1 are flat surfaces (flat portions). The front surface Td and the rear surface Te of the 2 nd plate member T2 are also flat surfaces (flat portions).

As shown in fig. 14, the 1 st plate member T1 is a substantially annular member and is arranged to surround the substrate P held in the 1 st holding part PH 1. The surface Ta of the 1 st plate member T1 held by the 2 nd holding portion PH2 is arranged around the substrate P held by the 1 st holding portion PH1 so as to surround the substrate P. That is, the 1 st plate member T1 forms a flat surface Ta around the substrate P held by the 1 st holding part PH 1.

As shown in fig. 14, the outer shape of the 2 nd plate member T2 is formed in a rectangular shape in plan view so as to follow the shape of the base material PHB, and has a substantially circular hole TH2 in the central portion thereof, in which the substrate P and the 1 st plate member T1 can be disposed. That is, the 2 nd plate member T2 is a substantially ring-shaped member, and is disposed around the substrate P held by the 1 st holding part PH1 and the 1 st plate member T1 held by the 2 nd holding part PH2 so as to surround the substrate P and the 1 st plate member T1. The 2 nd plate member T2 held by the 3 rd holding part PH3 forms a flat surface Td on the outer side of the 1 st plate member T1 with respect to the substrate P held by the 1 st holding part PH 1.

The 1 st plate member T1 and the 2 nd plate member T2 are substantially the same thickness as the substrate P. The surface (flat surface) Ta of the 1 st plate member T1 held by the 2 nd holding portion PH2, the surface (flat surface) Td of the 2 nd plate member T2 held by the 3 rd holding portion PH3, and the surface Pa of the substrate P held by the 1 st holding portion PH1 are substantially the same height. That is, the surface of the 1 st plate member T1 and the surface of the 2 nd plate member T2 are formed as flat portions around the substrate P, which are substantially flush with the surface of the substrate P.

The surface Ta of the 1 st plate member T1 and the surface Td of the 2 nd plate member T2 have liquid repellency to the liquid LQ. Further, the back surface Tb of the 1 st plate member T1 and the back surface Te of the 2 nd plate member T2 also have liquid repellency to the liquid LQ.

The base material PHB of the substrate holder PH is formed in a rectangular shape in a plan view, and moving mirrors 93 for a laser interferometer 94 for measuring the position of the base material PHB (substrate holder PH) are formed on both side surfaces of the substrate holder PH perpendicular to each other. That is, in the present embodiment, when the substrate P is held on the upper surface of the substrate stage PST, the upper surface is also formed as a fully flat surface (full flat surface) over substantially the entire area including the surface Pa of the held substrate P.

As shown in fig. 15, the 1 st holding portion PH1 of the substrate holder PH includes: a convex 1 st support part 46 formed on the base material PHB, a ring-shaped 1 st peripheral wall part 42 formed on the base material PHB so as to surround the periphery of the 1 st support part 46, and a1 st suction port 41 formed on the base material PHB inside the 1 st peripheral wall part 42. The 1 st supporting portion 46 and the 1 st suction port are arranged in plural and in the same shape inside the 1 st peripheral wall portion 42. The upper surface 42A of the 1 st peripheral wall portion 42 faces the back surface Pb of the substrate P. The 1 st suction port 41 is connected to the 1 st vacuum system 40 through a flow path 45. The controller CONT drives the 1 st vacuum system 40 to suck the gas (air) in the 1 st space 31 surrounded by the base material PHB, the 1 st peripheral wall 42, and the substrate P, and to make the 1 st space 31 negative in pressure, thereby sucking and holding the substrate P by the 1 st support part 46.

The 2 nd holding part PH2 of the substrate holder PH includes: a2 nd peripheral wall part 62 formed in a substantially annular shape on the base material PHB so as to surround the 1 st peripheral wall part 42 of the 1 st holding part PH1, an annular 3 rd peripheral wall part 63 provided outside the 2 nd peripheral wall part 62 and formed on the base material PHB so as to surround the 2 nd peripheral wall part 62, a convex 2 nd support part 66 formed on the base material PHB between the 2 nd peripheral wall part 62 and the 3 rd peripheral wall part 63, and a2 nd suction port 61 formed on the base material PHB between the 2 nd peripheral wall part 62 and the 3 rd peripheral wall part 63. The 2 nd peripheral wall part 62 is provided outside the 1 st peripheral wall part 42 with respect to the 1 st space 31, and the 3 rd peripheral wall part 63 is provided further outside the 2 nd peripheral wall part 62. The 2 nd support part 66 and the 2 nd suction port 61 are formed in plural and the same shape between the 2 nd peripheral wall part 62 and the 3 rd peripheral wall part 63. The upper surface 62A of the 2 nd peripheral wall portion 62 and the upper surface 63A of the 3 rd peripheral wall portion 63 face the rear surface Tb of the 1 st plate member T1. The 2 nd suction port 61 is connected to the 2 nd vacuum system 60 through a flow path 65. The controller CONT drives the 2 nd vacuum system 60 to suck the gas (air) in the 2 nd space 32 surrounded by the base material PHB, the 2 nd and 3 rd peripheral wall parts 62 and 63, and the 1 st plate member T1, and to make the 2 nd space 32 negative pressure, thereby sucking and holding the 1 st plate member T1 to the 2 nd support part 66.

The 3 rd holding portion PH3 of the substrate holder PH includes: a4 peripheral wall 82 formed in a substantially annular shape on the base material PHB so as to surround the 3 peripheral wall 63 of the 2 nd holding part PH2, a 5 peripheral wall 83 provided outside the 4 peripheral wall 82 and formed on the base material PHB so as to surround the 4 peripheral wall 82, a convex 3 rd support part 86 formed on the base material PHB between the 4 peripheral wall 82 and the 5 peripheral wall 83, and a3 rd suction port 81 formed on the base material PHB between the 4 peripheral wall 82 and the 5 peripheral wall 83. The 4 th peripheral wall 82 is provided outside the 3 rd peripheral wall 63 with respect to the 2 nd space 32, and the 5 th peripheral wall 83 is provided further outside the 4 th peripheral wall 82. The 3 rd support portion 86 and the 3 rd suction port 81 are formed in plural and identical shapes between the 4 th peripheral wall portion 82 and the 5 th peripheral wall portion 83. The upper surface 82A of the 4 th peripheral wall portion 82 and the upper surface 83A of the 5 th peripheral wall portion 83 face the rear surface Te of the 2 nd plate member T2. The 3 rd suction ports 81 are connected to the 3 rd vacuum system 80 through flow paths 85. The 3 rd vacuum system 80 is configured to make the 3 rd space surrounded by the base material PHB, the 4 th and 5 th peripheral wall parts 82 and 83, and the 2 nd panel member T2 negative pressure. The 4 th and 5 th peripheral wall parts 82 and 83 function as outer wall parts surrounding the outside of the 3 rd space 33 (including the 3 rd supporting part 86), and the controller CONT drives the 3 rd vacuum system 80 to suck the gas (air) in the 3 rd space 33 surrounded by the base material PHB, the 4 th and 5 th peripheral wall parts 82 and 83, and the 2 nd plate member T2, to make the 3 rd space 33 negative pressure, thereby sucking and holding the 2 nd plate member T2 to the 3 rd supporting part 86.

The 1 st vacuum system 40 for making the 1 st space 31 negative, the 2 nd vacuum system 60 for making the 2 nd space 32 negative, and the 3 rd vacuum system 80 for making the 3 rd space 33 negative are independent of each other. The controller CONT can individually control the operations of the 1 st vacuum system 40, the 2 nd vacuum system 60, and the 3 rd vacuum system 80, and can independently perform the suction operation of the 1 st vacuum system 40 to the 1 st space 31, the suction operation of the 2 nd vacuum system 60 to the 2 nd space 32, and the suction operation of the 3 rd vacuum system 80 to the 3 rd space 33. For example, the controller CONT can control the 1 st vacuum system 40, the 2 nd vacuum system 60, and the 3 rd vacuum system 80 so that the pressures in the 1 st space 31, the 2 nd space 32, and the 3 rd space 33 are different from each other.

In this embodiment, a gap of about 0.1 to 1.0mm, for example, is formed between the edge portion of the outer side of the substrate P held by the 1 st holding portion PH1 and the edge portion of the inner side of the 1 st plate member T1 provided around the substrate P. A gap of about 0.1 to 1.0mm, for example, is formed between the edge of the 1 st plate member T1 held by the 2 nd holding part PH2 and the edge of the 2 nd plate member T2 provided around the 1 st plate member T1.

As in the above embodiment, the 1 st plate member T1 disposed around the substrate P is formed with a protrusion 150 corresponding to the notch NT (or the oriented flat surface portion) formed in the substrate P. The 1 st or 2 nd peripheral wall portion 42 or 62 also has a shape corresponding to the notch NT of the substrate P.

Similarly to the above embodiment, the upper surface 42A of the 1 st peripheral wall portion 42, the upper surface 62A of the 2 nd peripheral wall portion 62, and the upper surface 63A of the 3 rd peripheral wall portion 63 are flat surfaces. Further, the upper surface 82A of the 4 th peripheral wall 82 and the upper surface 83A of the 5 th peripheral wall 83 are also flat surfaces.

In the 1 st holding portion PH1, the 1 st supporting portion 46 is formed to have the same height as the 1 st peripheral wall portion 42 or to be slightly higher than the 1 st peripheral wall portion 42, and when the 1 st space 31 is brought into a negative pressure, the back surface Pb of the substrate P can be brought into close contact with the upper surface 42A of the 1 st peripheral wall portion 42. In the 2 nd holding part PH2, the 2 nd supporting part 66 is formed slightly higher than the 2 nd peripheral wall part 62, and even if the 2 nd space 32 is made to be a negative pressure, a predetermined gap B is formed between the back surface Tb of the 1 st plate member T1 and the upper surface 62A of the 2 nd peripheral wall part 62. The 3 rd peripheral wall portion 63 is formed to be slightly lower than the 2 nd supporting portion 66 or to be substantially the same height as the 2 nd supporting portion 66, and the upper surface 63A of the 3 rd peripheral wall portion 63 is brought into close contact with the rear surface Tb of the 1 st plate member T1.

The height of the 2 nd support portion 66 and the height of the 2 nd peripheral wall portion 62 can be determined so that the back surface Tb of the 1 st plate member T1 and the upper surface 62A of the 2 nd peripheral wall portion 62 are in close contact with each other. The height of the 2 nd supporting portion 66 and the height of the 3 rd peripheral wall portion 63 can be determined so that a small gap is formed between the back surface Tb of the 1 st plate member T1 and the upper surface 63A of the 3 rd peripheral wall portion 63.

In the 3 rd holding portion PH3, the 4 th supporting portion 86 is formed to be slightly higher than the 4 th and 5 th peripheral wall portions 82 and 83 or to be substantially the same height as the 4 th and 5 th peripheral wall portions 82 and 83, and the upper surface 82A of the 4 th peripheral wall portion 82 and the upper surface 83A of the 5 th peripheral wall portion 83 are brought into close contact with the rear surface Te of the 2 nd plate member T2. Further, a predetermined gap may be formed between the upper surface 82A of the 4 th peripheral wall portion 82 and the upper surface 83A of the 5 th peripheral wall portion 83 and the back surface Te of the 2 nd plate member T2.

In the present embodiment, the 1 st plate member T1 and the 2 nd plate member T2 are formed of different materials, and the liquid repellency durability of the surface Ta of the 1 st plate member T1 is higher than that of the surface Td of the 2 nd plate member T2.

In the present embodiment, the 1 st plate member T1 disposed around the substrate P is formed of a fluorine-based resin material such as PTFE (polytetrafluoroethylene). On the other hand, the 2 nd plate member T2 is made of quartz (glass), and the liquid repellent material is coated on the front surface Td, the rear surface Te, and the side surfaces Tf (the surface facing the 1 st plate member T1). The liquid repellent material may be a fluorine-based resin material such as polytetrafluoroethylene tetrafluoride or an acrylic resin material. By applying (coating) the liquid repellent material on the plate member T made of quartz, the front surface Td, the rear surface Te, and the side surface Tf of the 2 nd plate member T2 can be made liquid repellent to the liquid LQ.

Next, as shown in fig. 14, a reference portion 300 having a reference mark MFM for defining a pattern position of the substrate P on the mask M passing through the projection optical system PL on a predetermined position on the surface Td of the 2 nd plate member T2 and a reference plate 400 serving as a reference surface of the focus level detection system is provided on a predetermined position on the surface Td of the 2 nd plate member T2. The upper surface of the reference portion 300 and the upper surface of the reference plate 400 are substantially flush with the surface Pa of the substrate P held by the 1 st holding portion PH 1. The liquid repellent material is also coated on the reference part 300 having the reference marks MFM and PFM and the reference plate 400, and the upper surface of the reference part 300 and the upper surface of the reference plate 400 are also provided with liquid repellent.

The width Ht of the surface Ta formed in the annular shape in the 1 st plate member T1 is formed to be larger than at least the projection area AR 1. Thus, when the edge region E of the substrate P is exposed, the exposure light EL is not irradiated to the 2 nd plate member T2. This can suppress deterioration of the liquid repellency of the surface Td of the 2 nd plate member T2. Since the material itself of the 1 st plate member T1 irradiated with the exposure light EL is a liquid repellent material (e.g., PTFE), the liquid repellent durability of the surface Ta of the 1 st plate member T1 is higher than that of the surface Td of the 2 nd plate member T2. Accordingly, even if the exposure light EL is irradiated, the liquid repellency is not excessively deteriorated, and the liquid repellency can be maintained for a long period of time. It is also conceivable to form the 2 nd plate member T2 not of quartz but of PTFE, for example, but to form the reference marks MFM, PFM on the 2 nd plate member T2, quartz is preferably used as the material for forming the 2 nd plate member T2. By forming the reference marks MFM and PFM on the surface Td of the 2 nd plate member T2, the upper surface of the substrate stage PST can be made to be a completely flat surface. Therefore, in the present embodiment, the liquid repellent material is coated on the 2 nd plate member T2 on which the reference marks MFM and PFM are formed by forming the 2 nd plate member T2 of the area not irradiated with the exposure light EL with quartz and forming the reference marks MFM and PFM on the surface Td thereof, thereby forming a completely flat surface having liquid repellent property. In addition, only one of the reference mark MFM and the reference mark PFM may be formed as the 2 nd plate member.

Further, the width Ht of the surface Ta of the 1 st plate member T1 is preferably formed to be larger than the liquid immersion area AR2 formed on the image plane side of the projection optical system PL. Accordingly, when the edge region E of the substrate P is subjected to the liquid immersion exposure, the liquid immersion region AR2 is disposed on the surface Ta of the 1 st plate member T1, but not on the 2 nd plate member T2, and therefore, the liquid LQ in the liquid immersion region AR2 can be prevented from penetrating into the gap between the 1 st plate member T1 and the 2 nd plate member T2.

Similarly to the above embodiment, when the 1 st plate member T1 is to be replaced, the 1 st plate member T1 is moved up and down by using the 2 nd lifting member 57 provided under the 1 st plate member T1. Although not shown, a lifting member is provided under the 2 nd plate member T2, and when the 2 nd plate member T2 is to be replaced, the 2 nd plate member T2 is lifted by the lifting member. Since the 2 nd vacuum system 40 for suction-holding the 1 st plate member T1 and the 3 rd vacuum system 60 for suction-holding the 2 nd plate member T2 are independent of each other, the suction-holding and suction-holding releasing operation of the 1 st plate member T1 and the suction-holding and suction-holding releasing operation of the 2 nd plate member T2 can be performed independently of each other. Accordingly, for example, the controller CONT can perform the replacement of the 1 st plate member T1 and the replacement of the 2 nd plate member T2 at different times according to the degree of deterioration of the liquid repellency of each of the 1 st plate member T1 and the 2 nd plate member T2.

In the present embodiment, the upper surface 42A of the 1 st peripheral wall portion 42, the upper surface 46A of the 1 st supporting portion 46, the upper surface 66A of the 2 nd supporting portion 66, the upper surface 62A of the 2 nd peripheral wall portion 62, the upper surface 63A of the 3 rd peripheral wall portion 63, the upper surface 86A of the 3 rd supporting portion 86, the upper surface 82A of the 4 th peripheral wall portion 82, and the upper surface 83A of the 5 th peripheral wall portion 83 are substantially the same height, although slightly different in height. This also provides excellent workability in the polishing process of the upper surface.

In the present embodiment, the 1 st plate member T1 made of PTFE or the like is formed in an annular shape and arranged so as to surround the periphery of the substrate P. Although the 2 nd plate member T2 made of quartz is formed in a ring shape and arranged so as to surround the 1 st plate member T1 outside the 1 st plate member T1, only a small region (including the reference portion 300 having the reference marks MFM, PFM) may be formed in part of the 2 nd plate member T2 made of quartz, and the other large region may be formed in part of the 1 st plate member T1 made of PTFE or the like. It is preferable that the region of the upper surface irradiated with the exposure light is formed of a plate member made of PTFE or the like, and the region including the reference portion 300 is formed of a plate member made of quartz.

In addition, although the case where the liquid immersion exposure apparatus (which projects the pattern image of the mask M onto the substrate P by the liquid LQ) is used has been described here as an example, this embodiment can also be applied to a normal dry exposure apparatus (which projects the pattern image of the mask M onto the substrate P without the liquid LQ). Since the 1 st and 2 nd plate members T1, T2 forming the upper surface of substrate stage PST are held by the 2 nd and 3 rd holding portions PH2, PH3 so as to be attachable to and detachable from the base PHB (replaceable), for example, when a plate member is replaced by adhering foreign matter (impurities), contamination, or the like, it can be replaced with a new plate member.

The structure using the 1 st plate and the 2 nd plate as in embodiment 6 can be applied to embodiments 2 to 5. In embodiment 6 described with reference to fig. 14, the substrate holder PH has a configuration of 2 plate members, i.e., the 1 st plate member and the 2 nd plate member, but may have a configuration of any number of plate members, i.e., 3 or more, and in this case, the base PHB is provided with suction holding portions corresponding to the number of plate members. In the configuration in which the plurality of plate members are sucked and held on the substrate PHB, only a predetermined plate member that needs to be replaced among the plurality of plate members may be replaced.

The material of each plate is not limited to the above, and the most suitable material may be determined in consideration of the presence or absence of the reference portion, the durability of the liquid repellent performance, and the like.

In the above embodiment, the upper surface and the side surface of the 2 nd peripheral wall portion 62 are made liquid repellent, but if the liquid LQ is allowed to penetrate into the back surface side of the plate member T (T1, T2), the upper surface and the side surface of the 2 nd peripheral wall portion 62 are not required to be made liquid repellent, and the upper surface or the side surface of the 2 nd peripheral wall portion 62 may be made lyophilic. In this case, a recovery port or the like for recovering the liquid LQ may be provided on the back surface side of the plate member T (T1, T2).

In embodiment 6, the 2 nd to 5 th peripheral wall portions are formed in a ring shape surrounding the 1 st peripheral wall portion 42, but the 2 nd to 5 th peripheral wall portions may be in various positions or shapes as long as the plate member T (T1, T2) can be sucked and held. The peripheral wall portion may be formed so that a closed space (negative pressure space) for sucking and holding the panel member T (T1, T2) can be formed between the base material PHB and the back surface of the panel member T (T1, T2), and may be provided so that a plurality of closed spaces (negative pressure spaces) are formed between one panel member T (T1, T2) and the base material PHB, for example.

In the above embodiment, the thickness of the plate member T (T1, T2) is substantially the same as the thickness of the substrate P, but may be different from the thickness of the substrate P. In this case, it is preferable that the height of the support portions 46 of the substrate P or the height of the support portions 66 and 86 of the plate members T (T1, T2) be set so that the surface of the substrate P sucked and held by the substrate holder PH is substantially flush with the surface of the plate member T (T1, T2).

In the above-described embodiments, the plate members T, T1, and T2 are held on the substrate PHB by vacuum suction, but other holding mechanisms such as an electrostatic chuck mechanism, an electromagnetic chuck mechanism, and a magnetic chuck mechanism may be used.

In the above-described embodiment, the exposure apparatus EX has a configuration including 1 substrate stage PST, but the present invention is also applicable to an exposure apparatus including 2 substrate stages PST. This point will be described with reference to fig. 16.

The exposure apparatus EX shown in fig. 16 includes: a substrate stage PST1 having a substrate holder PH for holding the substrate P and movable in a state where the substrate P is held; and a measurement stage PST2 provided at a position parallel to the substrate stage PST1, and including the reference unit 300. The board member T is held by suction by a board holder PH on the board stage PST 1. On the other hand, the measurement stage PST2 is a stage dedicated to measurement and does not hold the substrate P, and a holding portion that holds the plate member T' having the reference portion 300 by suction is provided on the measurement stage PST 2. The plate member T' having the reference portion 300 is suction-held by the holding portion on the measurement stage PST. Although not shown, an optical sensor including the illuminance unevenness sensor described above is provided on measurement stage PST 2. The substrate stage PST1 and the measurement stage PST2 are capable of 2-dimensional movement independently of each other in the XY plane by a stage driving device including a linear motor or the like. The XY direction positions of the substrate stage PST1 and the measurement stage PST2 are measured by a laser interferometer.

In the embodiment shown in fig. 16, since the liquid immersion area AR2 of the liquid LQ is formed on both the substrate stage PST1 and the measurement stage PST2, foreign substances may adhere to the upper surface of the plate member T on each substrate stage PST1 and the upper surface of the plate member T' on the measurement stage PST2, or traces of adhesion (water marks) of the liquid LQ may be formed. However, in the embodiment shown in fig. 16, the plate members T, T' of the substrate stage PST1 and the measurement stage PST2 may be replaced.

The present invention is also applicable to a dual stage type exposure apparatus including two substrate stages for holding substrates. The structure and exposure operation of the double stage type exposure apparatus are disclosed in, for example, Japanese patent laid-open Nos. Hei 10-163099 and Hei 10-214783 (corresponding to U.S. Pat. Nos. 6,341,007, 6,400,441, 6,549,269 and 6,590,634), Japanese patent application No. 2000-505958 (corresponding to U.S. Pat. No. 5,969,441) or U.S. Pat. No. 6,208,407, and the disclosures of these documents are incorporated herein by reference to the extent permitted by the national statutes of specification or selection of the present international application.

The mechanism for forming the liquid immersion area AR2 on the image plane side of the projection optical system PL is not limited to the above-described embodiment, and various types of mechanisms can be used. For example, a mechanism disclosed in the publication of European application publication EP1420298(A2) can be used.

As described above, pure water is used for the liquid LQ of the present embodiment. Pure water has an advantage that it can be easily obtained in a large amount in a semiconductor manufacturing factory or the like, and does not adversely affect a photoresist, an optical element (lens), or the like on the substrate P. Pure water is expected to have a cleaning action of optical components (provided on the surface of the substrate P and the front end surface of the projection optical system PL) because the content of impurities is extremely small, in addition to having no adverse effect on the environment. Further, when the purity of pure water supplied from a factory or the like is low, the exposure apparatus may be provided with an ultrapure water generator.

The refractive index n of pure water (water) for the exposure light EL having a wavelength of about 193nm is approximately 1.44, and when ArF excimer laser light (having a wavelength of 193nm) is used as the light source for the exposure light EL, the wavelength on the substrate P is shortened to about 1/n, that is, about 134nm, and high resolution can be obtained. Further, since the depth of focus is about n times, that is, about 1.44 times, larger than that in air, if the depth of focus is secured to the same extent as that in air, the numerical aperture of the projection optical system PL can be increased, and the resolution can be improved.

In addition, as described above, when the liquid immersion method is used, the numerical aperture NA of the projection optical system PL may be 0.9 to 1.3. As described above, when the numerical aperture NA of the projection optical system PL is large, it is known that arbitrary polarized light used as exposure light may deteriorate the imaging performance due to a difference in polarization effect, and therefore, it is preferable to use polarized illumination. In this case, it is preferable to perform linear polarization illumination in accordance with the line and space (line and space) pattern of the mask (reticle) in the longitudinal direction of the line pattern, and to emit diffracted light having a large amount of S polarization component (TE polarization component), that is, a polarization direction component in the longitudinal direction of the line pattern, from the pattern of the mask (reticle). When the space between the projection optical system PL and the photoresist applied to the surface of the substrate P is filled with the liquid, the transmittance of the photoresist surface of the diffracted light of the S-polarization component (TE-polarization component) contributing to the improvement of the contrast becomes higher as compared with the case where the space between the projection optical system PL and the photoresist applied to the surface of the substrate P is filled with the air (gas), and therefore, even when the numerical aperture NA of the projection optical system exceeds 1.0, high image forming performance can be obtained. It is more effective to appropriately combine a phase shift mask with an oblique incidence illumination method (especially, dipole (dipole) illumination method) in the longitudinal direction of the line pattern as disclosed in Japanese patent laid-open No. 6-188169. In particular, the combination of the linearly polarized illumination method and the dipole illumination method is effective when the periodic direction of the line/space pattern is limited to a predetermined direction or when the hole patterns are densely formed in a predetermined direction. For example, when a half-tone (half-tone) type phase shift mask (pattern with a half pitch of about 45 nm) having a transmittance of 6% is illuminated by a linearly polarized illumination method and a dipole illumination method in combination, if the illumination σ defined by the circumscribed circle of the two light fluxes forming a dipole in the pupil plane of the illumination system is 0.95, the respective beam radii of the pupil plane are 0.125 σ, and the numerical aperture of the projection optical system PL is NA 1.2, the depth of focus (DOF) can be increased by about 150nm as compared with the case of using an arbitrary polarized light.

For example, when a fine line/space pattern (for example, a line/space of about 25 to 50 nm) is exposed on a substrate P using an ArF excimer laser as exposure light using a projection optical system PL of about 1/4 with a reduction magnification, depending on the structure of the mask M (for example, the fineness of the pattern or the thickness of chromium), the mask M functions as a polarizing plate by a waveguide effect (Wave guide), and diffracted light of an S-polarized component (TE-polarized component) is emitted from the mask M more than diffracted light of a P-polarized component (TM-polarized component) that decreases the contrast. In this case, although the above-mentioned linearly polarized illumination is preferably used, even when the mask M is illuminated with arbitrary polarized light and the numerical aperture NA of the projection optical system PL is as large as 0.9 to 1.3, high resolution performance can be obtained.

When exposing the extremely fine line/space pattern on the mask M to the substrate P, although it is possible to make the P polarization component (TM polarization component) larger than the S polarization component (TE polarization component) by the wire grid effect, for example, when exposing a line/space pattern larger than 25nm using ArF excimer laser as the exposure light and using the projection optical system PL of a reduction magnification of about 1/4, since diffracted light of the S polarization component (TE polarization component) is emitted from the mask M more than that of the P polarization component (TM polarization component), high resolution performance can be obtained even when the numerical aperture NA of the projection optical system PL is as large as 0.9 to 1.3.

Further, in addition to the linearly polarized illumination (S polarized illumination) in accordance with the longitudinal direction of the line pattern of the mask (reticle), as disclosed in japanese patent application laid-open No. 6-53120, a polarized illumination method in which linearly polarized light is applied in the circular line (circumferential) direction about the optical axis and an oblique incidence illumination method are combined. In particular, in the case where, in addition to the line pattern in which the pattern of the mask (reticle) extends in a predetermined direction, line patterns extending in a plurality of different directions are mixed (line/space pattern mixture in which the periodic directions are different), similarly as disclosed in japanese patent application laid-open No. 6-53120, by using a polarization illumination method (linearly polarizing in the line direction of a circle centered on the optical axis) and a belt illumination method in combination, even when the numerical aperture NA of the projection optical system PL is large, high imaging performance can be obtained. For example, when a half-transmissive phase shift mask (a pattern with a half pitch of about 63 nm) having a transmittance of 6% is illuminated by a polarized light illumination method (linearly polarized light in a line direction of a circle centered on an optical axis) and a belt illumination method (belt ratio 3/4) in combination, when the illumination σ is 0.95 and the numerical aperture of the projection optical system PL is NA of about 1.00, the depth of focus (DOF) can be increased by about 250nm compared to the case of using any polarized light, and when the half pitch is a pattern with a half pitch of about 55nm and the numerical aperture of the projection optical system PL is NA of about 1.2, the depth of focus can be increased by about 100 nm.

In the present embodiment, the optical element 2 is attached to the tip of the projection optical system PL, and the optical characteristics of the projection optical system PL, such as aberrations (spherical aberration, coma aberration, and the like), can be adjusted by this lens. Further, as the optical element attached to the tip of the projection optical system PL, an optical plate for adjusting the optical characteristics of the projection optical system PL may be used. Or may be a parallel plane plate which can transmit the exposure light EL.

Further, when the pressure between the substrate P and the optical element at the tip of the projection optical system PL caused by the flow of the liquid LQ is large, the optical element may be firmly fixed so as not to move due to the pressure without making the optical element replaceable.

In the present embodiment, the space between the projection optical system PL and the substrate P is filled with the liquid LQ, but for example, a cover glass composed of a parallel plate may be filled with the liquid LQ in a state where the cover glass is mounted on the surface of the substrate P. At this time, the cover glass may also cover a portion of the plate surface.

The liquid LQ in the present embodiment is water, but may be a liquid other than water. For example, the light source for exposure light is F₂When using laser, due to this F₂The laser cannot transmit water, so that F can be used₂The laser-transmissive liquid is used as the liquid LQ, and a fluorine-based fluid such as perfluoropolyether (PFPE) or fluorine-based oil is also applicable. In this case, for example, a thin film is formed of a low-polarity molecular structure substance containing fluorine, and thereby a portion in contact with the liquid LQ is subjected to lyophilic treatment. As the liquid LQ, a liquid (e.g., cedar oil) that is transmissive to the exposure light EL, has a refractive index as high as possible, and is stable against the photoresist applied to the projection optical system PL and the surface of the substrate P may be used. At this time, the surface treatment is also performed according to the polarity of the liquid LQ used. Instead of pure water as the liquid LQ1, LQ2, various fluids having desired refractive indices, such as supercritical fluids or high refractive index gases, can also be used.

The substrate P of each of the above embodiments can be applied to, in addition to a semiconductor wafer for manufacturing a semiconductor device, a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, a mask used in an exposure apparatus, a reticle original plate (synthetic quartz, silicon wafer), or the like.

The exposure apparatus EX is applicable to not only a step-and-scan type exposure apparatus (scanning stepper) that performs scanning exposure of the pattern of the mask M by moving the mask M and the substrate P in synchronization with each other, but also a step-and-repeat type projection exposure apparatus (stepper) that sequentially moves the substrate P by exposing the pattern of the mask M once while keeping the mask M and the substrate P stationary.

As the exposure apparatus EX, the following exposure apparatuses can be applied: an exposure apparatus of a system in which a1 st pattern reduced image is exposed to a substrate P at one time by using a projection optical system (for example, a refractive projection optical system having a reduction magnification of 1/8 and not including a reflection element) in a state in which the 1 st pattern and the substrate P are substantially stationary. In this case, the present invention can be applied to a bonding type exposure apparatus that exposes the substrate P at one time by partially overlapping the reduced image of the 2 nd pattern with the 1 st pattern using the projection optical system in a state where the 2 nd pattern and the substrate P are substantially stationary. As the exposure apparatus of the bonding method, an exposure apparatus of a step bonding method can be also applied, which transfers at least 2 pattern portions on the substrate P by overlapping them and sequentially moves the substrate P.

The type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor device for exposing a semiconductor device pattern to a substrate P, but is also widely applicable to an exposure apparatus for manufacturing a liquid crystal display device or a display, an exposure apparatus for manufacturing a thin film magnetic head, a photographic device (CCD), a reticle, a mask, and the like.

In the above-described embodiments, a light transmissive mask (reticle) in which a predetermined light shielding pattern (or phase pattern, or dimming pattern) is formed on a substrate having light transmissivity is used, but instead of this reticle, an electronic mask disclosed in, for example, U.S. Pat. No. 6,778,257, in which a transmission pattern, a reflection pattern, or a light emission pattern is formed based on electronic data of a pattern to be exposed, may be used.

The present invention is also applicable to an exposure apparatus (lithography system) that forms a line/space pattern on a wafer W by forming interference fringes on the wafer W as disclosed in international publication No. 2001/035168.

When a linear motor is used for the substrate stage PST or the mask stage MST, either an air floating type using an air bearing or a magnetic floating type using a Lorentz (Lorentz) force or a reactance may be used. Each of the stages PST and MST may be of a type that moves along a guide, or may be of a type without a guide. Examples of linear motors for use in the stage are disclosed in U.S. Pat. Nos. 5,623,853 and 5,528,118, the contents of which are incorporated herein by reference to the extent permitted by the national statutes assigned or selected in the actual application.

A planar motor may be used as a driving mechanism for each stage PST, MST, in which a magnet unit having a magnet arranged two-dimensionally and an armature unit having a coil arranged two-dimensionally are opposed to each other, and each stage PST, MST is driven by electromagnetic force. In this case, either one of the magnet unit and the armature unit may be connected to the stages PST and MST, and the other of the magnet unit and the armature unit may be provided on the moving side of the stages PST and MST.

The reaction force generated by the movement of the substrate stage PST may also be mechanically released to the ground (grounded) using the frame member so as not to be transmitted to the projection optical system PL. The details of the method of dealing with this reaction force are disclosed in U.S. Pat. No. 5,528,118 (Japanese patent application laid-open No. 8-166475), for example, and the contents of the publication are incorporated herein by reference to the extent allowed by the national statutes specified or selected in the international application.

The reaction force generated by the movement of substrate stage MST may also be mechanically released to the ground (grounded) using the frame member so as not to be transmitted to projection optical system PL. The method of processing this reaction force is disclosed in detail in, for example, U.S. Pat. No. 5,874,820 (Japanese patent application laid-open No. 8-330224), and the disclosure of this document is incorporated herein by reference to the extent allowed by the national statutes assigned or selected in the international application.

The exposure apparatus EX according to the embodiment of the present application is manufactured by assembling various subsystems (including the components listed in the application range) so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. To ensure these various accuracies, before and after assembly, adjustment for achieving optical accuracy is performed on various optical systems, adjustment for achieving mechanical accuracy is performed on various mechanical systems, and adjustment for achieving electrical accuracy is performed on various electrical systems. The assembly process from various subsystems to the exposure apparatus includes mechanical connection, wiring connection of circuits, piping connection of pneumatic circuits, and the like. Of course, there is a separate assembly process for each subsystem before the assembly process from each subsystem to the exposure apparatus. When the assembling process from various subsystems to the exposure device is finished, the comprehensive adjustment is performed to ensure various accuracies of the whole exposure device. Further, it is preferable that the exposure apparatus is manufactured in a clean room in which temperature, cleanliness, and the like are controlled.

As shown in fig. 17, the micro device of the semiconductor device is manufactured by the following steps: a step 201 of designing the functions and performances of the microdevice, a step 202 of fabricating a mask (reticle) based on the designing step, a step 203 of fabricating a substrate constituting a base material of the device, an exposure processing step 204 of exposing the substrate with a mask pattern by the exposure apparatus EX of the above embodiment, a step 205 of assembling the device (including a dicing step, a bonding step, a packaging step), an inspection step 206, and the like are performed.

According to the present invention, maintenance work of the substrate holding device, the substrate stage, and the exposure apparatus can be easily performed. And the productivity of the device can be improved because the decrease of the operation rate of the exposure device can be prevented. According to the present invention, maintenance work of the liquid immersion exposure apparatus can be easily performed. Further, the substrate can be favorably exposed in a state where the penetration of the liquid is prevented.

Claims (7)

1. A substrate holding apparatus capable of moving a substrate while holding the substrate with respect to exposure light irradiated through a projection optical system and a liquid immersion area formed by a liquid supplied to an image plane side of the projection optical system, the substrate holding apparatus comprising:

a holding section for holding the substrate;

a flat portion provided to surround the holding portion; and

and a slope portion for collecting the liquid that has permeated from a gap formed between the substrate held by the holding portion and the flat portion at a predetermined portion.

2. The substrate holding apparatus according to claim 1, wherein the slope portion is provided at a position substantially opposed to the gap.

3. The substrate holding apparatus according to claim 1, comprising a recovery port for recovering the liquid infiltrated from the gap;

the inclined surface part is formed to collect the liquid permeating from the gap to the recovery port.

4. The substrate holding apparatus according to claim 1, comprising a peripheral wall portion provided below the flat portion and formed to surround the holding portion;

the inclined surface portion is formed to collect the liquid that has penetrated through the gap on the side of the peripheral wall portion.

5. The substrate holding apparatus according to claim 1, wherein the slope portion comprises a slope descending from the holding portion side to an outer side of the holding portion.

6. An exposure apparatus characterized in that:

a substrate holding apparatus according to any one of claims 1 to 5.

7. A method of manufacturing a component, comprising:

the exposure apparatus according to claim 6 is used.