HK1160338B - Electronic subassemblies for electronic devices - Google Patents

Description

Electronic subassembly for an electronic device

This application claims priority from U.S. provisional patent application No.61/325,741 filed on day 19, 4/2010, U.S. patent application 12/794,599 filed on day 4, 6/2010, and U.S. patent application 12/794,601 filed on day 4, 6/2010.

Since apple iPhone 4 prototype, an engineer, of apple Inc. at 25.3.2010 was stolen (as known by apple Inc.), the invention to be disclosed and claimed in this application was prematurely disclosed to the public and was not authorized by apple Inc. The U.S. priority application on which this application is based is filed after a theft event known to apple inc.

Technical Field

The present invention relates generally to electronic devices and components of electronic devices.

Background

Electronic devices such as cellular telephones include a number of electronic and mechanical components. It is desirable that these parts be durable, attractive in appearance, and exhibit good performance. Often compromises must be made. For example, it is difficult to design robust mechanical parts that are attractive in appearance. The design of attractive and compact parts and components that perform well in different operating environments also presents challenges.

Accordingly, it is desirable to provide improved electronic devices and parts of electronic devices.

Disclosure of Invention

An electronic device comprising mechanical and electronic components may be provided. These components may include mechanical structures, such as mounting structures, and electronic components, such as integrated circuits, printed circuit boards, and electronic devices mounted on printed circuit boards. Optical components, connectors, antennas, buttons, and other structures may be included within the electronic device.

The electronic device may have a housing. The electronic components and mechanical structures may be formed within the housing. To ensure that the electronic device is attractive, attractive materials (such as metals and plastics) may be used to form the components of the electronic device. Compact size can be achieved by using a compact internal mounting structure. Good electrical performance can be achieved by designing the electronic device to handle different thermal and electrical loads.

Connectors may be used to interconnect the printed circuit and devices mounted to the printed circuit. The printed circuit may include a rigid printed circuit board and a flexible printed circuit board. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Decorative structures, such as covers, may be used in order to improve the aesthetics of the device. Structures may also be provided in the electronic device to detect humidity.

Drawings

FIG. 1 is a schematic diagram of an illustrative electronic device in accordance with an embodiment of the present invention;

fig. 2A is a front perspective view of an illustrative electronic device that may be provided with a connector mounting structure in accordance with an embodiment of the present invention;

fig. 2B is a rear perspective view of an illustrative electronic device that may be provided with a connector mounting structure in accordance with an embodiment of the present invention;

FIG. 3 is a cross-sectional side view of an illustrative electronic device that may be provided with a connector mounting structure in accordance with an embodiment of the present invention;

FIG. 4 is a cross-sectional side view of a conventional connector support structure in a cellular telephone;

FIG. 5 is a cross-sectional side view of an illustrative connector and surrounding portion of an electronic device showing how a cover may be used to secure the connector within the electronic device beneath a glass panel or other housing structure in accordance with an embodiment of the present invention;

fig. 6 is a perspective view of an interior portion of an electronic device showing how a flexible printed circuit board may be connected to different locations on a rigid printed circuit board using respective printed circuit board connectors and showing how a cover may be mounted over the printed circuit board connectors to help retain the printed circuit board connectors on the rigid printed circuit board in accordance with an embodiment of the present invention;

FIG. 7 is a perspective view of an illustrative cover structure showing how a recess may be formed on a bottom side portion of the cover, in accordance with an embodiment of the present invention;

fig. 8 is a partially exploded perspective view of an illustrative printed circuit board to which several flexible printed circuits are attached with printed circuit board connectors showing how the printed circuit board connectors may be secured using a shroud, in accordance with an embodiment of the invention;

FIG. 9 is a perspective view of an illustrative connector of the type that may be provided with a plastic insert and a moisture indicator in accordance with an embodiment of the present invention;

fig. 10 is an exploded perspective view of a portion of a metal connector shell and a corresponding portion of a plastic insert showing how mating engagement features, such as tabs and recesses, may be provided to the metal shell and plastic insert in accordance with an embodiment of the present invention;

FIG. 11 is a cross-sectional side view of an illustrative connector having a plastic insert in accordance with an embodiment of the present invention;

fig. 12 is a perspective view of an illustrative metal ground plate structure that may be used to ensure that a connector having a plastic insert is properly grounded to a mating plug, in accordance with an embodiment of the present invention;

FIG. 13 is a perspective view of a portion of an illustrative plastic connector insert showing how the insert may be provided with openings for receiving metal pads of the type shown in FIG. 12, in accordance with an embodiment of the present invention;

FIG. 14 is a front view of an illustrative connector showing how an opening for a moisture indicator (such as a dye-based water spot) may be provided to a rear wall of a connector housing in accordance with an embodiment of the present invention;

FIG. 15 is a cross-sectional side view of a connector having a plastic insert showing how an opening covered by a moisture indicator may be provided to a rear wall of the connector in accordance with an embodiment of the present invention;

FIG. 16 is a cross-sectional side view of a connector having a metal shell and no plastic insert, showing how the rear wall of the connector may be provided with an opening covered with a moisture indicator, in accordance with an embodiment of the present invention;

FIG. 17 is a cross-sectional side view of an illustrative moisture indicator of the type that may be used to cover a rear wall opening in a connector of the type shown in FIGS. 14, 15 and 16 in accordance with an embodiment of the present invention;

FIG. 18 is a cross-sectional side view of a printed circuit board that may be provided with a threaded fastener according to an embodiment of the present invention;

FIG. 19 is a cross-sectional side view of the printed circuit board of FIG. 18 after via formation according to an embodiment of the present invention;

fig. 20 is a cross-sectional side view of the printed circuit board of fig. 19 after a via plating operation to form a conductive via lining structure in accordance with an embodiment of the present invention;

FIG. 21 is a cross-sectional side view of the printed circuit board of FIG. 20 after removal of the protruding portions of the conductive via structures on the rear surface of the printed circuit board, in accordance with an embodiment of the present invention;

FIG. 22 is a cross-sectional side view of the printed circuit board of FIG. 21 showing how fasteners may be soldered into the through-holes and conductive back surface traces may be formed underneath the fasteners in accordance with an embodiment of the present invention;

FIG. 23 is a cross-sectional side view of a printed circuit board in which fastener mounting holes have been formed in accordance with an embodiment of the present invention;

FIG. 24 is a cross-sectional side view of the printed circuit board of FIG. 23 showing how fastener mounting holes may be filled with metal in accordance with an embodiment of the present invention;

FIG. 25 is a cross-sectional side view of the printed circuit board of FIG. 24 after removing a central portion of the metal to form a solder pad ring in accordance with an embodiment of the present invention;

FIG. 26 is a cross-sectional side view of the printed circuit board of FIG. 25 showing how a fastener (such as a threaded nut) may be soldered to the solder pad ring of FIG. 25 in accordance with an embodiment of the present invention;

FIG. 27 is a cross-sectional side view of a printed circuit board formed from a first board layer having holes and a second board layer without holes in accordance with an embodiment of the present invention;

FIG. 28 is a cross-sectional side view of a printed circuit board of the type shown in FIG. 27 showing how a fastener (such as a threaded nut) may be soldered to a ring of solder pads formed around the periphery of the hole of FIG. 27 in accordance with an embodiment of the present invention;

FIG. 29 is a cross-sectional side view of a printed circuit board with a fastener (such as a threaded nut) soldered therein showing how the nut may be provided with a bevel to prevent the nut from hitting a beveled sidewall portion of an aperture in the printed circuit board in accordance with an embodiment of the present invention;

FIG. 30 is a perspective view of a threaded fastener mounted on a printed circuit board according to an embodiment of the present invention;

FIG. 31 is a perspective view of an illustrative knurled fastener that may be mounted on a printed circuit board according to embodiments of the present invention;

FIG. 32 is a cross-sectional side view of an illustrative fastener having partially plated solder-philic sidewalls in accordance with an embodiment of the invention;

FIG. 33 is a cross-sectional side view of an illustrative fastener of the type shown in FIG. 32 showing how a portion of the solder-receptive sidewalls of the fastener may be used to inhibit excessive upward solder flow when attaching the fastener to a printed circuit board in accordance with an embodiment of the present invention;

FIG. 34 is a cross-sectional side view of an illustrative fastener having selectively solder-receptive sidewalls and engagement features (such as annular protrusions) in accordance with an embodiment of the invention;

FIG. 35 is a perspective view of an illustrative fastener having a mounting foot engagement feature and a partial coating of a solder-philic material in accordance with an embodiment of the invention;

FIG. 36 is a cross-sectional side view of an illustrative fastener with mounting foot engagement features and a partial coating of a solder-philic material mounted to a printed circuit board in accordance with an embodiment of the invention;

figure 37 is a perspective view of a radio frequency shield box mounted on a substrate such as a printed circuit board in accordance with an embodiment of the present invention;

fig. 38 is a side view of a radio frequency shielding box of the type shown in fig. 37, showing how the box may be provided with a frame and cover and attached to studs or other threaded fasteners mounted within a printed circuit board, in accordance with an embodiment of the present invention;

fig. 39 is a perspective view of a portion of a frame for a radio frequency shielding cage showing how the frame may have vertical legs that mate with corresponding solder pads on a printed circuit board and may have a portion with a U-shaped opening to facilitate mounting the frame on the printed circuit board in accordance with an embodiment of the present invention;

FIG. 40 is a cross-sectional side view of a threaded fastener mounted on a printed circuit board according to an embodiment of the present invention;

FIG. 41 is an exploded perspective view of an illustrative radio frequency shield box structure, printed circuit board, and associated circuitry that may be shielded using the radio frequency shield box, in accordance with an embodiment of the present invention;

figure 42 is an exploded perspective view of a portion of a radio frequency shield box and overlapping components mounted on a printed circuit board with a common threaded fastener in accordance with an embodiment of the present invention;

fig. 43 is a side view of a portion of a radio frequency shield box and a component, such as a speaker, mounted on a printed circuit board using a common mounting structure, such as mating male and female threaded fasteners, in accordance with an embodiment of the present invention;

fig. 44 is a cross-sectional view of a battery electrode assembly for a battery according to an embodiment of the invention;

fig. 45 is a perspective view of a wound electrode structure for a battery according to an embodiment of the present invention;

fig. 46 is a perspective view showing how a rolled electrode structure may be wrapped within a battery pouch in a conventional battery;

fig. 47 is an end view of a conventional battery of the type shown in fig. 46 after the battery pouch has been sealed and before the edges of the battery pouch have been folded and secured;

fig. 48 is a cross-sectional end view of a conventional battery pack in which the edges of the battery cells have been folded and secured to the battery cells using strips of polyimide tape;

fig. 49 is a side view of an illustrative tool that may be used to manufacture a battery pouch material for a battery pack in accordance with an embodiment of the invention;

fig. 50 is a perspective view of a battery pack according to an embodiment of the present invention before a graphic is printed on the surface of a battery cell and before the edges of the battery cell have been folded and fixed;

fig. 51 is a perspective view of a battery pack of the type shown in fig. 50 after information has been printed on the battery cells and before the edges of the battery cells have been folded and secured, according to an embodiment of the invention;

fig. 52 is an illustrative layout that may be used for a polymer layer having rectangular window openings that may be used to secure folded cell pouch edges within a battery pack in accordance with an embodiment of the present invention;

fig. 53 is a sectional perspective view of a battery pack according to an embodiment of the present invention;

FIG. 54 is a flowchart of illustrative steps involved in forming a battery pack (such as the battery pack of FIG. 53) in accordance with an embodiment of the present invention;

FIG. 55 is a perspective view of a rigid printed circuit board material motherboard from which a plurality of printed circuit boards are produced in accordance with an embodiment of the present invention;

FIG. 56 is a top view of a printed circuit board temporarily secured within a motherboard of printed circuit board material using a break out tab in accordance with an embodiment of the present invention;

FIG. 57 is a perspective view of a portion of a printed circuit board in the vicinity of a rupture disk according to an embodiment of the present invention;

FIG. 58 is a cross-sectional side view of a conventional printed circuit board and flex circuit arrangement showing how the flex circuit bend radius is difficult to control and how the flex circuit may be brought into contact with rough printed circuit board edges;

FIG. 59 is an exploded perspective view of a portion of a printed circuit board and associated components (such as a resilient bumper member that may be mounted on an edge of the printed circuit board) in accordance with an embodiment of the present invention;

FIG. 60 is a cross-sectional side view of an electronic device containing electronic components interconnected in a flexible circuit and having a printed circuit board covered with a bumper edge in accordance with an embodiment of the present invention;

FIG. 61 is a flow chart of illustrative steps involved in forming an electronic device having a printed circuit board with a buffer and a flexible circuit of the type shown in FIG. 60 in accordance with an embodiment of the present invention;

FIG. 62 is a cross-sectional side view of an illustrative trim structure to which a camera module and flash unit are mounted, according to an embodiment of the invention;

FIG. 63 is a top view of a trim structure of the type shown in FIG. 62, in accordance with an embodiment of the present invention;

FIG. 64 is a cross-sectional side view of an illustrative trim structure, camera module, and flash unit mounted within an electronic device under a display cover glass and lens in accordance with an embodiment of the present invention;

FIG. 65 is a cross-sectional side view of an illustrative electronic device that may contain shielding circuitry in accordance with an embodiment of the invention;

FIG. 66 is a cross-sectional side view of a conventional radio frequency shield box that may contain thermally conductive foam to aid in dissipating heat from electronic components in accordance with an embodiment of the present invention;

FIG. 67 is a cross-sectional side view of an illustrative radio frequency shielding structure including a conformal thermally conductive structure formed from multiple materials and including an optional thermally conductive grease layer to help dissipate heat from electronic components within the shielding structure, in accordance with an embodiment of the present invention;

figure 68 is a cross-sectional side view of an illustrative radio frequency shielding structure containing a relatively soft thin conformal thermally conductive material under additional conformal thermally conductive material and dissipating heat from electronic components within the shielding structure, in accordance with an embodiment of the present invention;

FIG. 69 is a cross-sectional side view of an illustrative radio frequency shielding structure or other package in a partially assembled state showing how electronic components may be mounted on a printed circuit board that will form a portion of the completed radio frequency shielding package using a printed circuit board mounting tool in accordance with an embodiment of the present invention;

FIG. 70 is a cross-sectional side view of an illustrative radio frequency shielding structure of the type shown in FIG. 69, or other type of package, as the thermally conductive material is introduced into the radio frequency shielding structure using a filler dispensing tool in accordance with an embodiment of the present invention;

FIG. 71 is a cross-sectional side view of an illustrative radio frequency shielding structure of the type shown in FIGS. 69 and 70, or other type of package, when heated and molded tooling is used to form a finished structure, in accordance with an embodiment of the present invention; and

figure 72 is a flow diagram of illustrative steps involved in forming an rf shield structure with a conformal layer of thermally conductive material in accordance with an embodiment of the present invention.

Detailed Description

The electronic device may be provided with mechanical and electrical components such as optical components, camera mounting structures, covers and other decorative components, printed circuits and support structures, thermal management structures, buttons, vibrators, and other mechanical and electrical structures.

Electronic devices that may be provided with these components include desktop computers, computer monitors including embedded computers, wireless computer cards, wireless adapters, televisions, set-top boxes, gaming consoles, routers, portable electronic devices such as laptop computers, tablet computers, and handheld devices such as cellular telephones and media players, and small devices such as wrist-watch devices, pendant devices, ear-bud and ear-bud devices, and other wearable and miniature devices. Portable devices such as cellular telephones, media players, and other handheld electronic devices are sometimes described herein as examples.

Printed circuit boards, such as flexible printed circuits, may be connected to rigid printed circuit boards using printed circuit board connectors. Rigid printed circuit boards may be fitted with a shroud structure to overlap one or more printed circuit board connectors.

The electronic device may have a connector such as a 30-pin connector with a rectangular opening. The connector may have a metal shell. A metal ground plate may be welded to the inner surface of the metal shell. A decorative dielectric insert may line the metal shell.

The printed circuit board may be provided with fasteners such as threaded nuts. A solder pad structure may be provided for solder used to attach the fasteners.

To block radio frequency signals that may cause interference, integrated circuits and other components may be enclosed within a radio frequency shielding structure, such as a radio frequency shielding box.

The battery may be provided with positive and negative electrode layers and a spacer layer for forming an electrode structure of the wound battery. The coiled electrode structure may be encased in a cell pouch having a regular pattern (regular array).

In manufacture, a plurality of printed circuit boards may be formed from a common motherboard of printed circuit board material. The break-away piece may be used in manufacturing to hold the printed circuit board within the motherboard of printed circuit board material. The flexible circuit may be routed over the resilient bumper member, which is mounted on the edge of the printed circuit board.

A camera and flash trim arrangement may be provided to align the camera module and flash component with one another when the camera module and flash component are installed in an electronic device. The trim structure may be formed from a heat sink material, allowing the trim structure to function as an integrated heat sink.

To ensure adequate heat dissipation, a conformal coating of a thermally conductive filler (such as silicone) filled with thermally conductive particles may be deposited on the electronic components within the radio frequency shielded box.

Fig. 1 shows an illustrative electronic device that may be provided with mechanical and electrical features that improve performance, aesthetics, robustness, and size. As shown in fig. 1, device 10 may include storage and processing circuitry 12. The storage and processing circuitry 12 may include one or more different types of storage devices, such as hard disk drive storage devices, non-volatile memory (e.g., flash memory or other electrically programmable read-only memory), volatile memory (e.g., static or dynamic random access memory), and so forth. Storage and processing circuitry 12 may be used to control the operation of device 10. The processing circuitry in circuit 12 may be based on a processor, such as a microprocessor, microcontroller, digital signal processor, application specific processing circuitry, power management circuitry, audio and video chips, and other suitable integrated circuits.

With one suitable arrangement, the storage and processing circuitry 12 may be used to run software on the device 10, such as an internet browsing application, a Voice Over Internet Protocol (VOIP) call application, an email application, a media playback application, operating system functions, antenna and wireless circuitry control functions, and so forth. Storage and processing circuitry 12 may be usedIn executing the appropriate communication protocol. Communication protocols that may be implemented using storage and processing circuitry 12 include Internet protocols, wireless local area network protocols (e.g., IEEE802.11 protocols-sometimes referred to as Wi-Fi) Protocols for other short-range wireless communication links, such as BluetoothProtocols, protocols for handheld cellular telephone communication services, and the like.

Input-output devices 14 may be used to allow data to be provided to device 10 and to allow data to be provided from device 10 to external devices. Examples of input-output devices 14 that may be used with device 10 include display screens such as touch screens (e.g., liquid crystal displays or organic light emitting diode displays), buttons, joysticks, click wheels, scroll wheels, touch pads, keypads, keyboards, microphones, speakers and other devices for creating sound, cameras, sensors, and the like. A user may control the operation of device 10 by providing commands to device 10 through device 14 or by providing commands to device 10 through an accessory that communicates with device 10 through a wireless or wired communication link. Device 14 or an accessory that communicates with device 10 via a wireless or wired connection may be used to convey visual or audio information to a user of device 10. Device 10 may include a connector for forming a data port (e.g., for attaching external equipment such as a computer, accessory, etc.).

Electronic devices, such as cellular telephones, typically use internal connectors. For example, flexible and rigid printed circuit boards may be interconnected using printed circuit board connectors. Printed circuit board connectors have the risk of disconnection without the user noticing dropping the electronic device. To help reduce the risk of moving the printed circuit board connector, foam plastic securing board connectors are used in certain electronic devices. For example, in a typical electronic device having a plastic housing wall, a layer of compressed foam may be placed between the plastic housing wall and the printed circuit board connector. The compressed foam helps to hold the printed circuit board connector in place.

While conventional connector mounting arrangements such as these may be satisfactory in some circumstances, their tolerances may not be good. For example, if the connector is manufactured or assembled with an undesired tilt, a corresponding tilt may be formed in the foam. In the event of a drop, this arrangement may not be sufficiently secure. As a result, the connector may be disconnected.

Accordingly, it is desirable to provide electronic devices and connectors having improved connector mounting arrangements.

Electronic components in electronic devices may include integrated circuits and other devices, and are mounted on printed circuit boards. The printed circuit board on which the electronic components are mounted may be a rigid printed circuit board.

Printed circuit boards, such as flexible printed circuits, may be connected to rigid printed circuit boards using printed circuit board connectors. The printed circuit board connector may have a mating first portion and second portion. The first portion may be mounted on a flexible printed circuit board. The second portion may be connected to a flexible circuit. The mating pins within the first and second portions may form an electrical connection between the first and second portions of the connector.

Rigid printed circuit boards may be fitted with a shroud structure to overlap one or more printed circuit board connectors. A compressive member (such as a layer of foam) may be inserted between the shroud structure and the printed circuit board connector to help hold the first and second portions of the printed circuit board connector together.

The electronic device may have a housing wall such as a flat housing member. The flat shell member may have a glass layer and a metal layer. The metal layer may be placed on a flat surface of the cap structure.

According to one embodiment, there is provided an apparatus comprising a first printed circuit board, a second printed circuit board, a printed circuit board connector having mating first and second portions, and a cover disposed over the printed circuit board connector that helps hold the first and second portions of the printed circuit board connector together, wherein the first portion is connected to the first printed circuit board, and wherein the second portion is connected to the second printed circuit board.

According to another embodiment, an apparatus is provided wherein the cover comprises a metal.

In accordance with another embodiment, an apparatus is provided wherein the second printed circuit board includes a flexible circuit.

According to another embodiment, an apparatus is provided that further comprises compressed foam between the shroud and the printed circuit board connector.

According to another embodiment, there is provided an apparatus further comprising a foam on the printed circuit board connector, wherein the cover has a base portion connected to the first printed circuit board, vertical sidewall portions and a flat upper portion, and wherein the flat upper portion compresses the foam toward the printed circuit board connector.

According to another embodiment, an apparatus is provided that further comprises a stiffener interposed between the foam and the printed circuit board connector, wherein the second printed circuit board comprises a flexible circuit.

According to another embodiment, an apparatus is provided that further includes an electrical circuit electrically connected to the cover, wherein the cover is formed of metal and has a recess that receives at least a portion of the foam.

According to another embodiment, there is provided an electronic apparatus including a printed circuit board, a circuit board connector connected to the printed circuit board, a cover having a first portion connected to the printed circuit board and a second portion covering the circuit board connector, and a compression member interposed between the second portion of the cover and the circuit board connector and generating a restoring force that holds the circuit board connector together.

According to another embodiment, an electronic device is provided wherein the compression member comprises a foam.

In accordance with another embodiment, an electronic device is provided wherein the second portion of the cover comprises a flat cover portion.

In accordance with another embodiment, an electronic device is provided that further includes a flat rear housing member having an inner surface, wherein the flat cover portion has an outer surface that rests against the inner surface of the flat rear housing member.

According to another embodiment, an electronic device is provided, wherein the cover comprises metal, and wherein the circuit board connector comprises a printed circuit board connector having mating first and second printed circuit board connector portions.

According to another embodiment, there is provided an electronic device, wherein the printed circuit board connector is one of a plurality of printed circuit board connectors on a printed circuit board, each printed circuit board connector connecting a respective flexible circuit to the printed circuit board, and wherein the compression member comprises one of a plurality of compression members, each compression member interposed between the second portion of the shroud and a respective one of the plurality of printed circuit board connectors so as to hold the printed circuit board connectors together.

According to another embodiment, an electronic device is provided that further includes a flat back case member having a glass layer and having an inner surface, wherein the flat cover portion has an outer surface, and the inner surface of the flat back case member rests on the outer surface of the flat cover portion.

In accordance with another embodiment, an electronic device is provided wherein the planar rear housing member includes a metal layer attached to the glass layer, wherein the inner surface is formed by one surface of the metal layer.

According to another embodiment, an electronic device is provided that further includes a flexible circuit connected to the printed circuit board with a circuit board connector.

According to one embodiment, there is provided an apparatus comprising a printed circuit board connector having a mating first portion and second portion, a flexible circuit connected to the first portion of the printed circuit board connector, a rigid printed circuit board connected to the second portion of the printed circuit board connector, a bracket mounted to the rigid printed circuit board, and a compression member between the printed circuit board connector and the bracket, wherein the compression member holds the mating first and second portions together.

According to another embodiment, there is provided an apparatus wherein the compression member comprises a foam, and wherein the carrier comprises a metal.

According to another embodiment, an apparatus is provided that further includes an integrated circuit mounted on the rigid printed circuit board.

According to another embodiment, an apparatus is provided that further comprises a rear housing member having a glass layer and a metal layer, wherein the rear housing member rests on the bracket.

According to these embodiments, the electronic device typically contains a large number of electronic components. For example, an electronic device (such as a cellular telephone) may contain a touch screen display, camera, microprocessor, battery, audio integrated circuit, connectors, switches, radio frequency transceiver circuitry and processors, capacitors, resistors, and other discrete components and integrated circuits. To ensure proper operation of the electronic device, these electronic components must be reliably mounted within the electronic device and must be electrically interconnected.

The electronic components may be mounted on a rigid printed circuit board. For example, a rigid printed circuit board may be formed from a dielectric substrate (such as a substrate of glass-filled epoxy). The printed circuit board substrate may contain one or more conductive trace layers. Connectors, integrated circuits and other components may be soldered to contact pads on the substrate surface of a printed circuit board.

Some printed circuit boards are flexible. For example, some printed circuit boards are formed from flexible polymer sheets (such as flexible polyimide sheets). This type of printed circuit board is sometimes referred to as a "flex circuit". Other printed circuit boards (so-called "flex-rigid circuits") contain both rigid and flexible portions.

The electronic components may be soldered and otherwise connected to conductive traces and associated contact pads on a printed circuit board within the electronic device. In order to provide the desired level of functionality, it may be desirable to use multiple printed circuit boards within the device. Flexible circuit cables, wires, bundles of wires, coaxial cables, traces on printed circuit boards, and other suitable conductive paths may be used to connect electronic components on different printed circuit boards to one another. Printed circuit board connectors have been developed to facilitate reliable assembly and to ensure that a large number of electronic components can be reliably formed.

Printed circuit board connectors of various form factors are available. For example, certain board-to-board connectors may be well suited for forming connections between corresponding pairs of parallel rigid printed circuit boards. As another example, some printed circuit board connectors may be well suited for forming a connection between a flexible printed circuit and a rigid printed circuit board. Other printed circuit board connectors may be used to connect the flexible circuit to the flexible circuit, or to connect certain types of components to a rigid printed circuit board or flexible circuit. Connectors such as these may be implemented using Low Insertion Force (LIF) and Zero Insertion Force (ZIF) configurations. A minimum size is often advantageous so that the connector can be implemented using microneedles (contacts), small housings, and other structures that ensure that the connector does not consume too much volume within the product. These different types of printed circuit board connectors are sometimes referred to herein as printed circuit board connectors or board connectors.

Electronic devices are sometimes subjected to impacts during use. For example, a user of a handheld electronic device (such as a cellular telephone) may inadvertently drop the device. During a drop event or other shock-inducing event, the printed circuit board connector is stressed. If the stress is too great, the printed circuit board connector may be dislodged. A disconnected connector may cause the electronic device to stop working properly, whereby care should be taken to ensure that the connector is well secured.

With one suitable arrangement, described herein as an example, a connector securing structure (such as a shroud) may be used to help hold the connector in place on the printed circuit board. The cover may be formed of a material such as metal, for example. The metal cover may extend over a connector mounted on the printed circuit board. Foam and other structures may also be interposed between the cover and the printed circuit board. Mounting the printed circuit board connector in this manner may help ensure that the connector does not come out of position during a drop event and may help improve manufacturing tolerances by reducing or eliminating reliance on accurate positioning of the housing walls relative to the internal connector structure.

The shroud-based printed circuit board connector mounting arrangement may be used for cellular telephones, music players and other media players, portable computers, tablet computers, ultra-portable computers, desktop computers, consumer electronics devices, or other suitable fixed and portable electronic equipment. Fig. 2 shows an illustrative electronic device that may use this type of connector mounting arrangement.

The illustrative electronic device 10 of FIG. 2 may be, for example, a cellular telephone, a media player, a handheld device, a portable computer, or the like. As shown in fig. 2, the device 10 may have a housing 16. The housing 16, which is sometimes referred to as a cabinet, may be formed from any suitable material, including plastic, glass, ceramic, metal, and other suitable materials, or combinations of these materials. In some cases, housing 16 or a portion of housing 16 may be formed from a dielectric or other low conductivity material. The housing 16 or a portion of the housing 16 may also be formed from an electrically conductive material such as a metal.

The housing protects the internal components and may help to retain the internal components in their assembled position within the device 10. The housing 16 may also help form a portion of the external peripheral appearance, i.e., a decorative appearance, of the device 10. The housing can vary greatly. For example, the housing may include various exterior components using various different materials.

With one suitable arrangement, described herein as an example, the side walls 2012 of the housing 16 may be formed from a material such as plastic or metal (e.g., a metal bezel or metal band around the periphery of the device 10), while the front panel 2016 and rear panel 2028 of the device 10 are formed from a flat transparent structure. In some cases, the front and/or back panels may include an exterior transparent layer (e.g., cover glass). The front panel 2016 of the device 10 may be, for example, a flat cover glass layer, or other glass structure associated with a display, such as a touch screen display. The front panel 2016 may cover some or substantially the entire front of the device 10. The back panel 2028 may be, for example, a flat decorative glass layer, a glass layer through which visual indicators such as status light emitting diodes or backlit icons may be displayed, a touch screen glass layer forming part of a rear-facing touch screen, other display structures, and the like. The back panel 2028 may cover a flat back surface of some or substantially all of the apparatus 10. In one embodiment, panels 2016 and 2028 may be removable. For example, the rear panel 2028 may be detached from the rest of the housing in order to provide internal access to the electronic device. In one example, the back panel is formed to slide relative to the remainder of the housing between a closed position closing the device and an open position providing an opening.

Fig. 2A shows an illustrative configuration of a display mounted on the front panel 2016 of the device 10. The display 2016 may be a Liquid Crystal Display (LCD), an Organic Light Emitting Diode (OLED) display, an electronic ink display, a plasma display, or any other suitable display. The outermost surface of the display 2016 may be formed from a layer of glass (sometimes referred to as the cover glass of the display). Display 2016 may also have internal layers (e.g., a capacitive touch sensor array to provide touch sensing capability to display 2016, a thin-film transistor layer to control image pixels within the display).

The display 2016 may have a central active area such as active area 2017 and an inactive end area such as area 2021. To hide and thus hide from view the interior portions of the device 10, the underside of the display 2016 (e.g., the display's cover glass) within the inactive region 2021 may be coated with an opaque substance such as black ink (as an example). The inner surface of the rear surface glass layer may also be coated with an opaque substance such as black ink.

An opening may be formed in one of the areas 2021 of the display cover glass to accommodate the button 2019. An opening such as opening 2023 may also be formed in one of the regions 2021 (e.g., to form a speaker port). The end portions of the housing 2012A (i.e., the peripheral metal straps or other housing sidewall structures) may be provided with openings such as openings 2022 and 2024 for microphone and speaker ports, and opening 2020 for an input and output data port. An opening for the forward facing camera 26 may be formed in one of the regions 2021.

Fig. 2B is a rear view of the device 10. The device 10 may have a rear facing camera 28. The device 10 may have a camera flash (camera light), such as a camera flash 30.

Fig. 3 shows an exploded cross-sectional side view of one illustrative configuration that may be used for apparatus 10. As shown in fig. 3, device 10 may have a belt-shaped peripheral housing sidewall portion 2012. The strap 2012 may be, for example, a rectangular loop formed from a material such as plastic or metal. A mounting structure such as a printed circuit board 2036 may be mounted within the apparatus 10. The component 2038 may be mounted on one or both sides of the printed circuit board 2036. If desired, multiple printed circuit boards 2036 may be included in the device 10.

Components, such as component 2038, may include integrated circuits, discrete components, switches, printed circuit board connectors, data port connectors, batteries, antennas, displays, microphones, speakers, and so forth. The front member 2016 may be attached to a front side 2026 of the device 10. The rear member 2028 may be attached to the front side 2040 of the device 10. The front 2016 and back 2028 members may be formed of plastic, metal, glass, ceramic, composite, other suitable materials, or a combination of these materials.

With one suitable arrangement, described herein as an example, the front member 2016 may be formed from one or more glass layers. For example, front member 2016 may include a touch screen display having a cover glass layer mounted to housing portion 2012. The back member 2028 may also be formed from one or more layers of glass. For example, the back member 2028 may be formed from a rectangular glass layer that fits within a recess in the housing portion 2012. When attached to housing 2012, members 2016 and 2028 may be considered to form a portion of housing 2012.

Members 2016 and 2028 may be attached to housing 2012 using adhesives, screws, snaps, other fasteners, and the like. During assembly, it may be desirable to use a sliding action when attaching the rear member 2028. For example, it may be desirable to move the rear member along the path 2030. Initially, member 2028 may be moved in direction 2034. After moving member 2028 in direction 2034, member 2028 is slid along direction 2032. This type of compound pressing and sliding action may be used to attach member 2028 to device 10, or other suitable attachment techniques may be used to attach member 2028.

Fig. 4 is a cross-sectional end view of a conventional mounting arrangement for a printed circuit board connector within a cellular telephone. The cellular telephone 2042 of fig. 4 includes a printed circuit board 2046. The printed circuit board 2058 is soldered to the printed circuit board 2046. A printed circuit board connector 2060 is also mounted on the printed circuit board 2046. The printed circuit board connector 2060 has two portions. The connector portion 2048 is soldered to the printed circuit board 2046. The connector portion 2050 is connected to a flexible printed circuit 2052. Connector portions 2048 and 2050 have mating needles. When these portions of the connector 2060 are held together as shown in fig. 4, the connector 2060 forms an electrical connection between conductive traces on the flexible printed circuit 2052 and conductive traces on the printed circuit board 2046 and the integrated circuit 2058.

A stiffener 2054 may be attached to the flexible printed circuit 2052 to help equalize the load on the flexible printed circuit 2052 and avoid solder joint damage. To help hold the connector portions 2048 and 2050 together, a foam 2056 is inserted between the plastic cellular telephone housing wall 2044 and the stiffener 2054. When device 2042 is installed in this manner, foam 2056 is compressed and exerts a downward force on connector portion 2050. This downward force holds connector 2050 to connector 2048 to effectively prevent connector 2060 from disconnecting.

While satisfactory in some circumstances, the conventional arrangement of fig. 4 places strict requirements on the tolerances of connector 2060. If connector 2060 is slightly angled, for example, foam 2056 will become angled and may no longer bear uniformly against housing wall 2044. This can result in the connectors becoming separated in the event of a drop. It is generally difficult to properly compress foam 2056 without tightly controlling the distance between housing wall 2044 and stiffener 2054. The size, shape and position of housing wall 2044 may fluctuate due to manufacturing variations, and thus such distance may not always be strictly controllable in practice.

To address concerns such as these, a shroud structure may be used when installing the printed circuit board connector within the apparatus 10 of fig. 2. Fig. 5 shows an illustrative hood-based printed circuit board connector mounting arrangement that may be used with apparatus 10. As shown in fig. 5, electronic components 2088 (such as integrated circuits) may be mounted on a printed circuit board 2074. The printed circuit board 2074 may be, for example, a rigid printed circuit board, such as a printed circuit board formed from a fiberglass-filled epoxy.

A printed circuit board connector, such as printed circuit board connector 2076, may be mounted on the printed circuit board 2074. The printed circuit board connectors 2076 may be, for example, low or zero insertion force type flex circuit connectors. The connector 2076 may have a lower portion, such as a lower portion 2078 mounted to the printed circuit board 2074 using solder or conductive adhesive, and an upper portion, such as an upper portion 2080 connected to the flexible circuit 2082 (e.g., using pins or other contacts, springs, conductive adhesive, solder, etc.). The lower portion 2078 and the mating upper portion 2080 may have mating pins that make contact when the connector portions 2078 and 2089 are connected together to form the connector 2076. When connected in this manner, connector portion 2080 may be used to connect flexible circuit 2082 to connector portion 2078 and board 2074.

A stiffener (such as stiffener 2084) may be attached to the flexible circuit 2082 (e.g., using a pressure sensitive adhesive). The stiffener 2084 may be formed from plastic, metal, glass, ceramic, other suitable materials, or a combination of these materials. The stiffener 2084, when attached to the flexible circuit 2082, may help prevent electrical connections (e.g., solder joints) associated with the connector 2076 from being damaged.

A cover 2072 may be used to hold the connector 2076 together. The cover 2072 may be formed from metal, plastic, glass, ceramic, composites, other suitable materials, or a combination of these materials. In a typical configuration, the cover 2072 may be formed of metal. The casing 2072 may have a flange base portion 2066, vertical sidewalls (such as sidewall 2070), and a flat top portion 2068 at a surface parallel to the printed circuit board 2074. The cover 2072 may form a bracket, a box (e.g., an enclosed bracket with 4 vertical walls 2070), or may have other suitable shapes.

As shown in the illustrative configuration of fig. 5, the cover 2072 may be attached to the printed circuit board 2074 using a bond 2096. Bond 2096 may be formed from an adhesive (e.g., a pressure sensitive adhesive, an epoxy, or other suitable adhesive material), a solder joint, a weld, a press-fit connection, a fastener, or other suitable attachment mechanism. The thickness of the base portion 2066 and other portions of the cap 2072 may be, for example, less than 1mm, less than 0.5mm, less than 0.4mm, 0.4mm to 0.2mm, etc.

When the cover 2072 is attached to the printed circuit board 2074 as shown in fig. 5, the planar structure 2068 of the cover 2072 may press the foam 2086 inward in direction 2034. Once compressed, foam 2086 exhibits a restoring force in direction 2034 that presses connector portion 2080 against connector portion 2078 in direction 2034. As a result, the two portions of the connector 2076 are held together, reducing the likelihood that the connector 2076 will be completely or partially disconnected due to shock (e.g., due to a drop event). The presence of the shroud 2072 and the forces generated from the compressed foam 2086 may improve the robustness of the device 10 by ensuring that the portions of the connector 2076 do not become dislodged from the drop event. Foam 2086 may be formed from a piece of polymer foam, a piece of solid flexible elastomer (such as silicone), or any other flexible and compressible material that, when compressed, creates a restoring force that holds connector 2076 together. Connector 2076 may be used to connect components to a printed circuit board, may be used to connect a battery to a printed circuit board, may be part of a battery, may be a board-to-board connector, may be a low insertion force connector, may be a zero insertion force connector, or may be any other suitable connector or electronic component.

As shown in fig. 5, a flat rear member 2028 (or other suitable front or rear portion of the shell 2012) may be placed on the cover 2072. The flat back member 2028 may be formed from a layer of glass, such as a glass layer 2060. Some or all of the inner surface of the glass layer 2060 may be provided with a metal layer, such as a flat metal layer 2064. The metal layer 2064 may help provide additional strength to the glass layer 2060 (e.g., in the area covering the cap 2072). The metal layer 2064 may be attached to the glass layer 2060 (as an example) using an adhesive, such as adhesive 2062.

With an arrangement of the type shown in fig. 5, the inner surface 2092 of the metal layer 2064 may be disposed parallel to the outer surface 2094 of the flat portion 2068 of the cover 2072. This allows the cover to be placed over the glass 2060 and the member 2028. During assembly, rear member 2028 may be moved in direction 2032. When layers 2064 and 2068 are implemented as flat members formed of a suitable material (e.g., metal, rigid plastic, etc.), surfaces 2092 and 2094 do not stick to each other during movement of member 2028 in direction 2032. Additionally, because foam 2086 is prevented from contacting inner surface 2092 of member 2028, movement of member 2028 in direction 2032 does not disrupt the proper positioning of foam 2086.

Multiple covers may be placed on a single printed circuit board if desired. Fig. 6 shows an arrangement of this type. As shown in fig. 6, flexible circuits 2082A and 2082B may be physically and electrically connected to printed circuit board 2074 using printed circuit board connectors 2076. Dashed lines 2072 illustrate where a bracket-shaped cover and foam may be provided to help secure the connector 2076. As described in connection with fig. 5, the cover may be connected to the printed circuit board 2074 using a bond 2096 formed from an adhesive (e.g., a pressure sensitive adhesive, an epoxy, or other suitable adhesive material), a solder joint, a weld, a press-fit connection, a fastener, or other suitable attachment mechanism.

In some electronic devices, a radio frequency circuit or other circuit (shown as circuit 2090 in fig. 6) may be electrically coupled to the cover 2072. Thus, the shroud 2072 may serve as a mechanical support for the printed circuit board connector 2076, as well as a ground plane, antenna resonating elements, radio frequency shielding, or other electronic structure within the device 10.

To help align and secure structures within the cover 2072, the cover 2072 may be provided with recesses, such as the recess 2096 of fig. 7. The recess 2096 may be provided in the form of a cut, a groove, a rectangular or any other suitably shaped opening surrounded on four sides by the non-recessed portions of the flat portions 2068. The recess 2096 may have any suitable depth. For example, recess 2096 may have a depth only sufficient to receive an upper portion of foam 2086. The recess 2096 may be larger (e.g., large enough to accommodate all of the foam 2086 and some or all of the stiffener 2084, flex circuit 2082, and connector 2076).

Fig. 8 shows an illustrative arrangement in which a cover 2072 is used to secure a printed circuit board connector 2076 associated with 3 different flexible circuits. In the example of FIG. 8, flexible circuits 2082-1, 2082-2, and 2082-3 are connected to a printed circuit board 2074 using a connector 2076. The cover 2072 may be formed in the shape of a rectangular bracket. When mounted on printed circuit board 2074, cap 2072 helps hold flexible circuits 2082-1, 2082-2 and 2082-3 in place and secure connector 2076 under compressed foam 2086.

Electronic devices, such as handheld electronic devices, typically include a connector. For example, some cellular telephones include a 30-pin connector. Connectors such as these may be used as input-output data connectors and may accommodate mating plugs.

To ensure that the electronic device is not inadvertently subjected to an electrostatic discharge event or electromagnetic interference, the 30-pin connector has a metal grounding shell. These metal shells surround and provide structural support to the connector. When the plug is inserted into the connector, the outer metal portion of the plug is electrically grounded to the corresponding inner metal portion of the connector. While satisfactory for grounding of the header, connectors with metal shells may be less than attractive because the metal is shiny and conspicuous.

Conventional connectors are sometimes provided with a dye-based moisture indicator. This type of moisture indicator changes color when exposed to water. Thus, by examining the color of the moisture indicator, it can be determined whether the electronic device is exposed to an excessive amount of moisture. However, checking the moisture indicator status can be challenging because the moisture indicator is typically mounted on a connector housing at a sidewall location that is difficult to view from outside the device.

Accordingly, it is desirable to provide an improved connector for electronic devices.

According to one embodiment, a connector, such as a 30-pin connector having a rectangular opening, may be provided for an electronic device. The connector may have a metal shell. The decorative dielectric insert may line the metal shell. A contact housing structure may be used to support the contact wires within the connector. There may be 30 contacts in the connector if desired.

Each of the metal shell and the insert may have a flat top sidewall, a bottom sidewall, a left sidewall, and a right sidewall. The top and bottom sidewalls may be parallel to each other. The left and right side walls may be parallel to each other. The top and bottom sidewalls may be perpendicular to the right and left sidewalls such that the outermost edges of the sidewalls define the rectangular shape of the connector opening.

The metal ground plate may be welded to the inner surface of the metal shell. Corresponding openings may be provided in the dielectric insert. The opening may receive a metal ground plate. Since the metallic ground plate at least partially protrudes through the opening of the insert, the inner surface of the connector acts as a grounding structure even though the insert covers substantially the entire interior of the metal shell. Thus, the metal shell can be hidden from view by the decorative insert while maintaining the grounding function. When the plug is received within the connector, a grounding structure within the plug is electrically connected to the metallic ground plate in order to reduce the adverse effects of electrostatic discharge events and electromagnetic interference.

The rear wall of the connector may be formed by a flat member, such as a portion of a card or a portion of a contact housing structure. The opening in the rear wall of the connector may be covered with a moisture indicator. The moisture indicator may include an absorbing layer (wrapping layer) and a dye layer. The moisture barrier layer may surround the intake layer and the dye layer. A layer of adhesive may be used to mount the moisture indicator behind the opening in the rear wall. The status of the moisture indicator may be determined by viewing through the rectangular opening of the connector and the opening in the rear wall.

According to one embodiment, a connector is provided that further includes a metal shell having a plurality of shell walls with interior surfaces and a dielectric insert having a plurality of insert sidewalls that hide the interior surfaces of the shell sidewalls from view.

According to another embodiment, a connector is provided wherein the dielectric insert comprises a plastic insert.

In accordance with another embodiment, a connector is provided wherein the plurality of shell side walls includes a top shell side wall, a bottom shell side wall, a right shell side wall, and a left shell side wall, and wherein the plurality of insert side walls includes a top insert side wall at least partially covering the top shell side wall, a bottom insert side wall at least partially covering the bottom shell side wall, a right insert side wall at least partially covering the right shell side wall, and a left insert side wall at least partially covering the left shell side wall.

According to another embodiment, a connector is provided that further includes a back wall having a back wall opening, and a moisture indicator covering the back wall opening.

According to another embodiment, a connector is provided, wherein the connector has a connector opening defined by a plurality of insert side walls, wherein the back wall has a visible surface visible through the connector opening and has a hidden surface not visible through the connector opening, and wherein a moisture indicator is attached to the hidden surface and covers the back wall opening.

According to another embodiment, a connector is provided wherein the moisture indicator comprises an intake layer, a dye layer and at least one moisture barrier layer.

According to another embodiment, a connector is provided, wherein the dielectric insert has a recess, and wherein the metal shell has a protrusion that protrudes into and engages with the recess.

According to another embodiment, a connector is provided wherein the dielectric insert includes at least one opening, the connector further comprising a metal structure electrically shorted to the metal shell and protruding the at least one opening of the dielectric insert.

According to another embodiment, a connector is provided that further comprises a solder joint attaching the metal structure to the metal shell.

In accordance with another embodiment, a connector is provided wherein the metal structure includes a ground plate adapted to connect to a ground structure within a mating plug.

According to another embodiment, a connector is provided that includes a metal shell having a rectangular opening for receiving a plug, wherein the metal shell has a top sidewall, a bottom sidewall, a right sidewall, and a left sidewall with an inner surface, and a plastic insert within the metal shell, wherein the plastic insert has a rectangular opening for receiving the plug, wherein the plastic insert includes a top sidewall, a bottom sidewall, a right sidewall, and a left sidewall that cover at least some of the inner surface.

According to another embodiment, a connector is provided that includes a contact housing structure surrounded by the metal shell and plastic insert, a plurality of contacts mounted within the contact housing structure, a plurality of metal ground plates electrically connected to the inner surface, and a plurality of openings within the plastic insert, wherein each opening receives a respective one of the metal ground plates such that when a plug is received within the rectangular opening, the metal ground plates are shorted to the plug.

According to another embodiment, a connector is provided that includes a plurality of side walls and a rear wall having an opening, and a moisture indicator mounted on the rear wall covering the opening.

According to another embodiment, a connector is provided that further includes a metal shell having at least 4 flat members, and a plastic insert within the metal shell.

According to another embodiment, a connector is provided wherein the plastic insert has at least 4 flat members that fit within 4 flat members of the metal shell.

According to another embodiment, a connector is provided wherein the plastic insert has another flat member that forms a rear wall of the connector.

In accordance with another embodiment, a connector is provided that further includes a contact housing structure surrounded by the plurality of sidewalls, and a plurality of contacts supported by the contact housing structure.

According to another embodiment, a connector is provided, wherein the moisture indicator comprises an intake layer and a dye layer, and wherein the moisture indicator has an adhesive with which the moisture indicator is mounted to the rear wall covering the opening.

According to another embodiment, a connector is provided wherein the plurality of contacts includes at least 30 contacts.

According to another embodiment, a connector is provided wherein the plurality of side walls comprise parallel top and bottom flat shell members, and parallel right and left flat shell members, wherein the top and bottom flat shell members are perpendicular to the right and left flat shell members, and wherein the back wall is perpendicular to the right and left flat shell members and to the top and bottom flat shell members.

According to these embodiments, electrical connectors may be used in electronic devices to provide ports into which a user may insert cables, accessories, and other external devices. The input output data connector may be provided with several electrical contacts (pins). For example, an input output data connector may be provided with 30-pin assemblies that may mate with corresponding 30-pin plugs on a cable or other external device. Other types of connectors may have fewer than 30 pins, or may have more than 30 pins. The use of a 30-pin connector is sometimes described herein as an example. However, this is merely illustrative. In general, an electronic device may be provided with a connector having any suitable number of contacts.

Electronic devices that may be provided with input-output connectors may include desktop computers, televisions, and other consumer electronic devices. Electronic devices that may be provided with connectors may also include portable electronic devices such as laptop computers and tablet computers. Smaller electronic devices that may be provided with connectors include wrist watch devices, pendant devices, earphone and earpiece devices, and other wearable and miniature devices. With one suitable arrangement, connectors may be provided within handheld devices, such as cellular telephones and media players.

There may be one or more connectors in a given device. For example, a handheld electronic device (such as a cellular telephone) may be provided with a single input-output data port implemented using a 30-pin connector. Larger devices, such as tablet devices, may be provided with one, two, or more than two input-output data ports, each of which may be implemented using a respective 30-pin connector (as an example).

Fig. 2A and 2B show illustrative types of electronic devices that may have input and output data ports, such as 30-pin connectors. The device 10 of fig. 2A and 2B may be, for example, a tablet computer or a handheld electronic device, such as a cellular telephone, having circuitry to run email and other communication applications, web browsing applications, media playback applications, games, and the like.

Device 10 may also include one or more connectors, such as connector 2020. Connector 2020 may be a 30-pin data connector or other suitable connector (e.g., a universal serial bus connector, an ethernet connector, etc.) that forms an input-output port of device 10. The connector 2020 may have fewer than 30 pins or more than 30 pins. The connector 2020 may have a rectangular shape (i.e., a box-like shape having a rectangular opening for receiving a plug having a rectangular cross section), a square shape, a shape having curved sides and a curved opening, a shape having a combination of curved and flat sidewall surfaces, or the like. A rectangular shape is sometimes described herein as an example for connector 2020.

The connector 2020 may have a body that is mounted within the housing 2012 using screws or other fasteners, adhesives, welding, or other mounting mechanisms. Brackets, frame structures, screw bosses, recesses, and other mounting members may be provided within the housing 2012 to accommodate the mounting of the connector 2020.

Fig. 9 shows a perspective view of an illustrative embodiment of a connector. As shown in fig. 9, the connector 2426 can have a connector body 2430, the connector body 2430 having an opening such as opening 2428. The opening 2428 may have a rectangular shape. The main body 2430 may have 5 flat wall structures (flat wall members) including a right wall 2430R, a left wall 2430L, a top wall 2430T, a bottom wall 2430B, and a rear wall 2430 RR. The main body 2430 can be rectangular in shape such that the right wall 2430R is parallel to the left wall 2430L, and such that the top wall 2430T is parallel to the bottom wall 2430B. The right and left walls 2430R, 2430L can be perpendicular to the top and bottom walls 2430T, 2430B. The rear wall 2430RR can be perpendicular to the walls 2430R, 2430L, 2430T, and 2430B.

The contacts 2434 (which are sometimes referred to as pins or contact wires) may be formed of metal and may be supported using a contact housing member 2432 or other suitable contact support structure. The contact housing 2432 can be formed, for example, from plastic.

The main body 2430 can include an outer metal shell member (such as metal shell 2436) and a cosmetic insert member (such as insert 2438). The insert 2438 may be formed from a dielectric material, such as plastic.

The housing 2436 may be formed of a metal, such as stainless steel, that exhibits good strength and durability and is sufficiently conductive to serve as a ground structure for the connector 2426. The stainless steel tends to be shiny, which may cause undesirable attention to the presence of the connector 2426. Accordingly, it may be desirable to cover at least some of the exposed inner surface of shell 2436 with a non-glossy material. In the embodiment of fig. 9, the inner surface of the shell 2436 is at least partially covered by the insert 2438. With this configuration, the inner surfaces of the flat top, bottom, right and left side walls of the housing 2436 are hidden by the respective top, bottom, right and left side walls of the insert 2438, such that the insert 2438 substantially hides the housing 2436 from view. The rear of connector 2426 is also covered by a portion of insert 2438, or may be formed by a portion of insert 2438 (e.g., a flat rear wall portion).

To enhance the aesthetics of the device, it may be desirable to form the insert 2438 (and, if desired, the contact housing 2432) from a black material, such as black plastic or other cosmetically attractive material. The insert 2438 and contact housing 2432 can be formed using a plastic such as acrylonitrile butadiene styrene (ABS plastic, sometimes), a PC/ABS blend, or other suitable polymer. Other types of decorative materials may also be used to form the insert 2438 (i.e., other dielectrics, such as ceramics, glass, composites such as carbon fiber composites, etc.). The insert 2438 and the contact housing 2432 can be formed as distinct components that are joined together (e.g., using an adhesive or other suitable fastening mechanism), or can be formed as part of a unitary structure.

When it is desired to use connector 2426, a user can insert a mating plug into opening 2428. The plug may contain contacts that mate with respective contacts 2434 within connector 2426. For example, the plug may have 30 contacts that mate with 30 corresponding contacts 2434 on the contact housing 2432. The plug inserted into opening 2428 may have a rectangular cross-section corresponding to the rectangular shape of opening 2434. The plug may be part of a dock, part of an electronic device, part of a cable, or part of other suitable electronic means.

The insert 2438 can be formed using a molding process (e.g., insert molding), or can be formed as a separate part, such as an injection molded part that is crimped within the housing 2436 to form the body 2430. To ensure that the shell 2436 and the insert 2438 remain securely attached to one another, the shell 2436 and the insert 2438 can be provided with mating engagement features (e.g., tabs or other protrusions, mating slots or other recesses, grooves, etc.). As shown in fig. 9, for example, the shell 2436 can be provided with a curved metal tab 2440, the tab 2440 being received within a mating recess 2442 in the insert 2438, thereby holding the insert 2438 and the shell 2436 together.

To ensure proper grounding of a plug inserted into opening 2428 and thereby engaged with connector 2426, insert 2438 may be provided with an opening through which a metal plate structure may protrude. The metal structure may be shorted to housing 2436 and may have a surface exposed on an inner surface of connector 2426. When a plug is inserted into opening 2428, the outer surface of the plug contacts the metal structures and is electrically connected to the metal structures and housing 2436. The housing 2436 may be grounded within the device 10 so that the inclusion of holes in the insert 2438 and the metal structures extending out of the holes will ensure satisfactory grounding of the inserted plug. This may help reduce the adverse effects of electrostatic discharge events and electromagnetic interference during use of the device 10.

Fig. 10 is an exploded perspective view of the housing 2436 and its tabs 2440 and corresponding recesses 2442 in the plastic insert 2438. The use of tabs and mating recesses to retain housing 2436 to insert 2438 is merely illustrative. Any suitable engagement feature may be used if desired. In the example shown in fig. 9, only a single tab and mating insert recess are shown, but the connector 2426 can generally have one pair of mating engagement features, two pairs of mating engagement features, or more than two pairs of mating engagement features that secure the insert 2438 within the housing 2436. Screws, adhesives, or other suitable fastening mechanisms may also be used to secure the insert 2438 to the housing 2436.

Fig. 11 shows a cross-sectional side view of a connector, such as connector 2426 of fig. 9. As shown in fig. 11, connector 2426 can receive plug 2448 within opening 2428. Plug 2448 may have pins 2452 that mate with pins 2434 within connector 2426. The plug 2448 may also have an external rectangular ground sleeve such as sleeve 2454 (i.e., a box-like housing member that surrounds the pin 2452 without being electrically shorted to the pin 2452). A protrusion, such as protrusion 2450, on the flat outer surface of pocket 2454 can facilitate forming an electrical connection between pocket 2454 and a ground structure within the connector. The grounding sleeve 2454 and its protrusion 2450 mate with the inner surface of a conventional metal shell within a conventional 30-pin connector. In a connector of the type shown in fig. 11, the plug ground structures 2454 and 2450 are mated with a metal member 2444 that is shorted to a housing 2436.

The metal member 2444 can be a flat structure (e.g., a rectangular flat structure, such as a rectangular metal plate). The metal member 2444 may be formed of stainless steel or other metal of the housing 2436 that may be electrically connected. Soldering, welding, or other suitable electrical interconnection techniques may be used to short the metal member 2444 to the housing 2436. As shown in the cross-sectional view of fig. 11, the metal member 2444 can be shorted to the housing 2436, for example, using a weld 2446. A weld 2446 (as an example) may be formed from the exterior of connector 2426 using laser welding.

The insert 2438 has flat side walls that fit within corresponding flat side walls in the housing 2436. For example, the insert 2438 has an upper wall (upper wall 2438T) adjacent to the upper wall 2436T of the housing 2436. The insert 2438 has a lower wall 2438B adjacent to the lower wall 2436B of the housing 2436. To allow the metal ground structure 2444 to be mounted on the inner surface of the housing 2436, the insert upper wall 2438T and the insert lower wall 2438B have an opening 2348P through which the structure 2444 can protrude.

The rear wall 2438RR of the insert 2438 can be used to form the rear wall 2430RR of the connector body 2430. The rear wall 2438RR and the contact housing 2432 can be formed as part of a common plastic member, or can be formed from separate structures. If desired, the rear wall 2430RR may be formed partially or entirely of a metal shell member that is part of the housing 2436, so long as sufficient clearance is provided to allow the contact structure 2434 to pass through the rear wall 2430RR of the connector body 2430 without shorting.

The insert 2438 preferably has 4 flat side walls (right, left, top, bottom), each of which is nested within one of the 4 flat side walls (right, left, top, bottom) of the housing 2436. The rear wall 2438RR can form the 5 th wall (i.e., the flat rear wall) of the insert 2438. An optional lip structure 2456 on insert 2438 can help hide the outermost edge of housing 2436 from view by a user in direction 2458.

Fig. 12 illustrates a perspective view of the inner surface of the housing 2436, showing how the metal structure 2444 can be mounted to the housing 2436. As shown in fig. 12, the metal structure 2444 can be formed from a rectangular sheet of metal that is welded to the inner surface of the housing 2436. The metal structure 2444 has the effect of expanding the grounding function of the housing 2436, and thus may sometimes be referred to as a ground expansion or ground plate. The metal structure 2444 may, for example, have a lateral dimension a of about 1.0 to 2.0mm, a lateral dimension B of about 2.0 to 4.0mm, and a thickness C of about 0.2 to 0.4mm (as an example). The metal shell 2436 may have a thickness D of about 0.2 to 0.3mm (as an example).

As shown in fig. 13, the opening 2438P in the insert 2438 can have a size and shape, such as a rectangular shape, that accommodates the ground plate 2444 of fig. 12. There may be any suitable number of openings 2438P in the insert 2438. For example, there may be 4 openings 2438P in the insert 2438 that receive 4 corresponding ground plates 2444. Two ground plates 2444 may be mounted on the inner surface of the top wall of housing 2436 (i.e., wall 36T of fig. 11) in the positions shown by dashed lines 2444 in fig. 9. Two corresponding ground plates 2444 can be similarly mounted on the inner surface of the bottom wall of the housing 2436 (i.e., wall 2436B of fig. 11).

It may be desirable to determine whether moisture has entered the device 10. A moisture indicator may be provided on the interior of the device 10 that is visible through the opening 2428. To ensure that the moisture indicator can be easily seen, the moisture indicator can be positioned such that the moisture indicator covers an opening in the rear wall of the connector 2426 (i.e., the rear wall 2430RR of the connector body 2430). The wall on which the moisture indicator is located may be the rear wall 2438RR of the insert 2438 (see, e.g., fig. 11).

Fig. 14 illustrates a front view of connector 2428 showing how rear wall 2438RR of connector 2426 can have an opening, such as opening 2460. The opening 2460 can be rectangular, circular, oval, square, can have other shapes with square edges, can have other shapes with curved edges, can have a combination of curved and square edges, or can have other suitable shapes. The use of a rectangular shape for opening 2460 in fig. 14 is merely illustrative.

The opening 2460 can be covered by a moisture indicator. The moisture indicator may have an intake layer and a dye layer. When exposed to moisture, the dye imbibes into the intake layer. This changes the appearance of the moisture indicator. For example, the intake layer may be formed from a white material such as a layer of white paper. The dye may have a color, such as red. In this type of moisture indicator configuration, exposure to moisture will cause the red dye to wick into the white paper and change its color from white to red. A user (e.g., a service person associated with the manufacturer of device 10 or other appropriate party) may view through openings 2468 and 2460 to see the appearance of the red color.

FIG. 15 illustrates a cross-sectional view of a connector having a rear wall opening covered with a moisture indicator, where the cross-sectional view is taken along line 2462 and viewed from direction 2464. As shown in fig. 15, the rear wall 2438RR of the plastic insert 2438 can be provided with an opening, such as opening 2460 leading from an exposed wall surface 2466 to a hidden wall surface 2468. The moisture indicator 2470 can be mounted on the concealed wall surface 2468 such that the moisture indicator covers the opening 2460. The state of the moisture indicator 2470 may be viewed through opening 2428 and opening 2460 in direction 2458.

If desired, the moisture indicator 2470 can be mounted on an opening in the rear wall of a connector that does not include the plastic insert 2438. Fig. 16 shows an arrangement of this type. As shown in fig. 16, a rear wall 2430RR within the body 2430 of the connector 2426 can be formed using a contact housing 2432. The housing 2436 within the connector 2426 of fig. 16 does not include an insert, such as the insert 2438 of fig. 15. As a result, the inner surface of shell 2436 (i.e., surfaces 2472 and 2474) can be seen. The plastic member 2432 may be formed from a single structure, or may be formed from multiple members that are joined together using an adhesive or other suitable fastening mechanism.

FIG. 17 shows a cross-sectional side view of an illustrative moisture indicator. As shown in fig. 17, the moisture indicator 2470 can include moisture barriers such as moisture barriers 2478 and 2488. The moisture indicator 2470 may be attached to a surface 2490 of the connector back wall 2430RR (i.e., a portion of the insert back wall or other back wall structure of the connector 2428) using a layer of adhesive, such as adhesive 2476. The adhesive layer may be thin and transparent to allow the status of the moisture indicator 2470 to be viewed in direction 2458. If desired, opening 2460 may not be covered with adhesive 2476 (i.e., adhesive 2476 may have the same size as opening 2460).

Layers 2478 and 2488 may be formed from a relatively moisture impermeable material such as a polymer (e.g., polyethylene terephthalate). With this type of configuration, the sensitivity of the moisture indicator 2470 is reduced because moisture enters the moisture indicator 2470 primarily through the edges of the moisture indicator 2470. Other types of moisture indicator arrangements (e.g., not edge activated moisture indicators) may be used if desired. The example of using the edge activated moisture indicator arrangement in fig. 17 is illustrative only.

The moisture indicator 2470 may have an intake layer (such as layer 2480) and a dye layer (such as dye layer 2484). The intake layer 2480 may be formed of a white substance such as white paper or a fiber that is permeable to moisture. The dye layer 2484 may be formed of a colored substance such as a red dye that can penetrate into the intake layer 2480. When the moisture indicator 2470 is exposed to water or other moisture, moisture can enter the intake layer 2480 in the direction 2482. When moisture penetrates the intake layer 2480, the dye 2484 becomes wet and penetrates into the intake layer 2480 as indicated by arrows 2486. This changes the appearance of the intake layer 2480. For example, if the intake layer 2480 is initially white, the presence of the red dye 2486 will turn the intake layer 2480 red.

The color of the intake layer 2480, and thus the status of the moisture indicator 2470, may be determined by looking through the opening 2460 in the direction 2458. Because the opening 2460 is formed in the rear wall 2430RR, the layer 2480 can be viewed straight (i.e., without a tilt angle relative to the longitudinal axis), thereby facilitating accurate inspection of the moisture indicator 2470.

Electronic devices such as computers, cellular telephones, and other devices often contain printed circuit boards. Electronic components such as integrated circuits, switches, buttons, input-output port connectors, resistors, capacitors, inductors, and other discrete components may be mounted on the printed circuit board. Contact pads may be formed on the surface of the printed circuit board. Soldering may be used to connect the electronic component to the contact pad. The electronic components may be electrically interconnected using conductive traces within the printed circuit board.

It is sometimes desirable to provide the printed circuit board with a threaded fastener such as a threaded nut. The presence of a threaded nut on the printed circuit board makes it possible to attach the component to the printed circuit board using screws.

In conventional arrangements, threaded nuts are sometimes connected to printed circuit boards using connections that are not robust enough or consume an undesirable amount of board area.

Accordingly, it is desirable to provide an improved fastener mounting arrangement for a printed circuit board.

The electronic device 10 (see, e.g., fig. 1, 2A, and 2B) may be provided with a fastener, such as a threaded nut, mounted on a printed circuit board. Fasteners may be used to assist in mounting the components. For example, a screw or other threaded member may mate with a threaded hole in the fastener. Screws may be used to securely attach the components to the printed circuit board.

Soldering may be used to attach the fastener to a solder pad structure on the printed circuit board. Protrusions within the fastener and textured fastener surfaces may be provided to help hold the fastener in place during welding.

Holes may be formed in the printed circuit board. The hole may extend only partially within the printed circuit board or may be a through hole that passes completely through the printed circuit board. The bond pad structure may include a sidewall portion within the aperture to which the fastener is bonded. These side wall portions may have a vertically extending cylindrical shape lining the cylindrical surface of the bore.

The solder pad structure may further include portions on the front side of the printed circuit board to which the horizontal protruding portions of the fastener body are soldered. These front-side solder pad structures may, for example, have the shape of a ring extending around the periphery of the hole on the front surface of the printed circuit board.

The fastener body may define a footprint. The portion of the rear surface of the printed circuit board that is located within the footprint may be left unmetallized by the structure of the solder pads to allow for the formation of patterned interconnect traces beneath the fasteners.

According to one embodiment, an apparatus is provided that includes a fastener body and a solder-receptive coating partially covering the fastener body.

According to another embodiment, an apparatus is provided that further includes a threaded bore in the fastener body.

According to another embodiment, a device is provided that further includes texturing on the sidewall of the fastener body.

According to another embodiment, an apparatus is provided that further includes a printed circuit board and solder by which the fastener body is mounted on the printed circuit board.

According to another embodiment, an apparatus is provided that further includes a through-hole extending completely through the printed circuit board, wherein the fastener body is at least partially inserted into the through-hole.

In accordance with another embodiment, an apparatus is provided that further includes a solder pad structure on the printed circuit board, wherein solder is interposed between the solder pad structure and the fastener.

In accordance with another embodiment, an apparatus is provided wherein the printed circuit board has first and second opposing surfaces, and wherein the via has a sidewall, and wherein the solder pad structure includes a planar solder pad structure portion on the first surface and a vertical solder pad structure portion on the sidewall.

According to another embodiment, an apparatus is provided wherein the fastener body has an associated footprint, and wherein the apparatus further comprises patterned interconnect traces on a second surface of the printed circuit board within the footprint.

According to another embodiment, an apparatus is provided wherein the fastener body has a plurality of radially extending projections.

According to another embodiment, an apparatus is provided that includes a printed circuit board having first and second sides, wherein the printed circuit board has a portion defining an aperture in the first side, and a fastener mounted within the aperture, wherein the aperture only partially passes through the printed circuit board and does not penetrate the second side.

According to another embodiment, an apparatus is provided wherein the fastener comprises a threaded nut.

In accordance with another embodiment, an apparatus is provided that further includes a solder pad structure with which a fastener is mounted within the aperture.

In accordance with another embodiment, an apparatus is provided wherein the solder pad structure includes a portion on the first surface and a portion lining a sidewall of the hole within the hole.

In accordance with another embodiment, an apparatus is provided that further includes solder interposed between the fastener and the solder pad structure.

According to another embodiment, an apparatus is provided wherein the fastener has an associated footprint, and wherein the apparatus further comprises patterned interconnect traces on a second surface of the printed circuit board within the footprint.

According to another embodiment, an apparatus is provided that further includes a solder-philic coating covering only selected portions of the fastener.

According to another embodiment, an apparatus is provided wherein the printed circuit board comprises a first layer and a second layer, the hole being formed in the first layer, the second layer not comprising any portion of the hole, wherein the first layer is laminated to the second layer.

According to another embodiment, an apparatus is provided wherein the fastener has a beveled edge within the hole.

According to another embodiment, an apparatus is provided wherein the fastener includes a textured surface at least partially covered with solder.

According to another embodiment, an apparatus is provided that includes a printed circuit board having a through hole passing between first and second opposing surfaces of the printed circuit board; a fastener mounted on the printed circuit board such that a portion of the fastener is located within the through-hole, wherein the fastener defines a footprint on the second surface; and interconnect traces within the footprint on a second surface.

In accordance with another embodiment, an apparatus is provided that further includes a solder pad structure having an annular portion on a first surface surrounding the hole and having a vertical sidewall portion lining the through hole, and solder interposed between the solder pad structure and the fastener.

According to these embodiments, structures such as studs, fasteners, and threaded nuts may be mounted on the printed circuit board. These structures, sometimes referred to generically herein as fasteners, may be formed from materials such as metals. Threads may be provided in the fastener to accommodate mating screws. Non-threaded fasteners may also be mounted on the printed circuit board.

Once the fastener is installed on the printed circuit board, the fastener may be used to attach the component to the printed circuit board. For example, data port connectors, additional printed circuit boards, electronic components, mechanical components, and other structures may be attached to the printed circuit board using fasteners. By way of example, a screw threaded into a mating thread in a threaded fastener on a printed circuit board may be used to screw the components into place.

With one suitable arrangement, sometimes described herein as an example, solder may be used to mount the fastener to the printed circuit board. Adhesives, springs, snaps, positive engagement features, and other attachment mechanisms may also be used to mount the fastener to the printed circuit board, if desired.

Solder attachment structures may be formed on the printed circuit board with which solder connections are formed. These structures, sometimes referred to herein as solder pads, may be formed of metal (e.g., copper) or other material to which solder is attached. For example, the solder pads may be formed from elemental copper or an alloy of copper. In some configurations, all or a portion of the solder pad may be formed by a patterned planar structure on the surface of the printed circuit board. This type of solder pad may be based on a square pad structure, a ring design, etc. In other configurations, certain portions of the solder pad may be formed from non-planar structures (e.g., structures that partially or fully penetrate into recesses within a printed circuit board). The recess into which the solder pad layer penetrates may be, for example, a hole partially penetrating the printed circuit board or may be a through-hole. Through holes, sometimes referred to as vias, extend from one side of the printed circuit board to the other.

Part or all of the body of the fastener may be mounted within a printed circuit board hole. The fasteners may then be attached to the solder pad structure using solder. For example, molten solder may be introduced in the gap between the fastener and the solder pad structure. Surface tension generally causes solder to be drawn into the gap.

To avoid consuming excessive printed circuit board area, the extent of the distribution of the solder pad structures on the rear surface of the printed circuit board may be limited by removing the rear surface solder pad structures or by forming recesses that only partially penetrate the printed circuit board.

By way of example, consider the illustrative fastener attachment scheme shown in fig. 18, 19, 20, 21, and 22 that may be used with an electronic device (e.g., device 10 of fig. 1).

Fig. 18 is a cross-sectional side view of the printed circuit board prior to forming the fastener attachment recess. The printed circuit board 3010 may be a rigid printed circuit board, such as a glass-filled epoxy board or other suitable printed circuit board.

As shown in fig. 19, a via hole, such as via hole 3012, may be formed in printed circuit board 3010. Any suitable number of vias (e.g., 1, 2, 3 more than 3, tens, hundreds, etc.) may be formed on a given printed circuit board. In the illustrative arrangement of fig. 19, a single via is shown to avoid overcomplicating the drawing.

As shown in fig. 20, the via 3012 may be plated or coated with a solder pad material. One or more processing steps may be used to form solder pad structure 3014. Solder pad deposition techniques that may be used to form solder pad structure 3014 include electrochemical deposition, physical vapor deposition, screen printing, pad printing, chemical vapor deposition, ink jet printing, spraying, and the like. Solder pad structure 3014 can be formed, for example, by introducing a sensitizing layer within holes 3014 and performing one or more subsequent metal plating operations. As shown in fig. 20, the plating operation may produce a solder pad structure 3014 including vertical sidewalls 3020. Vertical sidewall 3020 may have a cylindrical shape that conforms to and lines the cylindrical shape of hole 3012. The plating operation may also result in the formation of planar surface structures, such as a front solder pad ring 3016 and a back solder pad ring 3018. Rings 3016 and 3018 may be planar metal structures that are formed as an integral part of solder pad structure 3014 and are thus connected to vertical sidewalls 3020.

To avoid consuming too much surface on the printed circuit board, some or all of the solder pad ring structure may be removed. For example, as shown in fig. 21, the back solder pad ring 3018 may be removed from the solder pad structure 3014. The post-solder pad ring 3018 can be removed using etching techniques, polishing techniques, drilling (milling) techniques, and the like. For example, by using a drill to drill out solder pad ring 3018 from the printed circuit board back surface, back solder pad ring 3018 can be removed without removing vertical sidewall portions 3020 of the solder pad structure. Generally, either the upper or lower solder pad ring may be removed in this way. In the orientation of fig. 21, the ring of solder pads on the lower (back) surface of the printed circuit board 3010 is removed as an example.

By removing the back ring 3018, an unmetallized region 3022 is formed that lies vertically below the front surface solder pad ring 3016. The unmetallized (uncovered) region 3022 may have a donut shape. As shown in fig. 22, since metal 3018 of fig. 20 has been removed from region 3022, region 3022 can be used to form a pattern of conductive traces. For example, interconnect trace 3024 may have a portion, such as portion 3026, located within unmetallized region 3022. If metal layer 3018 of FIG. 20 were not removed, region 3022 would be occupied by a conductor and would not be available for forming patterned interconnect traces. Region 3022 is located directly below (in the orientation of fig. 22) the horizontal ledge portion 3023 of the fastener 3030 and is therefore said to be located within the "footprint" of the fastener 3030. The size and shape of the footprint defined by the fastener 3030, when viewed from the vertical (top) direction 3025, depends on the size and shape of the main body of the fastener 3030.

The fastener 3030 of fig. 22 may be installed in the through-hole 3012. For example, a narrow portion of the body of the fastener 3030 may be inserted into the hole 3012. Once fastener 3030 has been inserted into hole 3012, molten solder 3028 may be introduced into the thin gap between fastener 3030 and solder pad structure 3014. Solder 3028 may fill the gap by suction associated with the molten solder and thereby become interposed between fastener 3030 and solder pad structure 3014. The fastener 3030 may be attached using solder to both the annular flat solder pad portion 3016 and the vertical sidewall solder pad portion 3020 of the solder pad structure 3014. As shown in the example of fig. 22 as a threaded bore, the fastener 3030 may be provided with threads to receive a screw.

If desired, the fasteners may be attached to holes that only partially pass through the printed circuit board 3010. This type of arrangement is shown in the cross-sectional side views of fig. 23, 24, 25 and 26.

As shown in fig. 23, a recess (hole) 3012 may be formed to a depth D that is less than the thickness T of the printed circuit board 3010. The holes 3012 may be formed by mechanical drilling, by laser drilling, by punching holes in a portion of the printed circuit board, and laminating the portion of the printed circuit board to additional printed circuit board layers, and the like.

As shown in fig. 24, holes 3012 may be filled with metal or other suitable material for solder pad structure 3014.

To accommodate the fastener 3030, a central portion of the metal of fig. 24 may be drilled or otherwise removed, leaving the hole 3012 and the peripheral (annular) solder pad structure 3014 of fig. 25.

As shown in fig. 26, a fastener 3030 may be soldered to the solder pad structure 3014 using solder 3028. If desired, the vertical sidewall portions of the metal deposited as shown in FIG. 24 may be left in place (e.g., by drilling out a central portion of the metal using a drill bit having a diameter smaller than the drill bit used to form the hole 3012). Solder 3078 can then be used to form connections to the vertical sidewall portions. In the example of fig. 26, all sidewall portions of the solder pad structure 3014 are removed prior to inserting the fastener 3030 into the hole 3012.

To help ensure that fastener 3030 fits into hole 3012 even if hole 3012 has a sloped lower surface (e.g., due to the use of a bur with a rounded head), fastener 3030 may be provided with one or more ramps, such as ramp 3034 or other angled surfaces. The beveled surface 3034 may extend around the entire periphery of the lower surface 3036 of the fastener 3030. The angle of the bevel 3034 relative to the flat surface of the printed circuit board 3010 may be, for example, 45 °, less than 60 °, and so on.

Because the holes 3012 only partially pass through the printed circuit board 3010, the surface of the printed circuit board 3010 underlying the fastener 3030 (i.e., the footprint of the fastener 3030) remains unmetallized and may be used to accommodate patterned interconnect traces, such as the illustrative traces 3024 of fig. 26.

The printed circuit board 3010 may be formed of laminated layers, if desired. Fig. 27 shows an arrangement of this type. As shown in fig. 27, a printed circuit board 3010 may be formed from an upper layer 3010A and a lower layer 3010B. Each layer 3010A and 3010B may contain multiple layers of printed circuit board dielectric and multiple layers of patterned interconnect traces. For example, layer 3010A may contain 3 printed circuit board layers and layer 3010B may contain 7 printed circuit board layers (as an example).

If desired, the holes 3012 can be formed in the upper layer 3010A before the upper and lower layers 3010A and 3010B are laminated together (e.g., using an adhesive or the like). For example, hole 3012 may be removed from hole 3012 using a punch, or hole 3012 may be formed using a drill tool. After forming holes 3012, layer 3010A may be attached to layer 10B to form printed circuit board 3010.

As shown in fig. 28, a solder pad structure 3014 may be formed on the surface of the printed circuit board 3010 around the periphery of the hole 3012. The fastener 3030 may be attached to the solder pad structure 3014 using solder 3028.

If desired, a hole 3012 can be formed in the upper layer 3010A using a drill, as shown in FIG. 29, resulting in a sloped sidewall 3038. A chamfer 3034 may be provided on fastener 3030 to help ensure that fastener 3030 can be inserted completely into hole 3012 without being blocked by the edges of hole 3012. When properly inserted, as shown in fig. 29, the flange portion of the fastener 3030 may rest against the solder pad structure 3014. Solder 3028 may be used to form the solder joint between the fastener 3030 and the solder pad structure 3014.

Fig. 30 is a perspective view of an illustrative printed circuit board fastener. The threaded hole 3032 may be used to receive a screw or other threaded structure. The bore 3032 may extend fully or partially within the fastener 3030. The upper portion 3030A of the fastener 3030 may have a wider diameter than the lower portion 3030B. This allows lower portion 3030B of fastener 3030 to be inserted into a printed circuit board hole and allows lower surface 3040 of portion 3030A to rest against solder pad structure 3014. A chamfer 3034 or other curved or angled surface may be formed on the lower portion 3030B to help avoid contact with an angled bore sidewall, such as the sidewall 3038 of fig. 29.

As shown in fig. 31, the fastener 3030 may have a disk-like or other suitable shape with a knurled sidewall 3042. The sidewall 3042 may include texturing such as raised ridges and recessed grooves. These structures may engage the solder when solder 3028 extends up to the sidewall 3042.

It may be desirable to control the amount of solder 3028 that is drawn into the side walls of the fastener 3030. For example, excessive sidewall suction may cause solder to cover a portion of the top surface of the fastener 3030. To prevent this type of solder 3028 intrusion, the fastener 3030 may be provided with solder phobic and solder philic regions. By way of example, the fastener 3030 may be formed of a metal that repels solder, or may be coated with a layer of solder-phobic material (e.g., an oxide layer). The fastener 3030 may then be covered with a solder-receptive coating such as a silver or gold layer.

By way of example, consider the fastener 3030 of fig. 32 and 33. In this example, the fastener 3030 is formed from a material that does not exhibit affinity for high solders (i.e., a solder-phobic metal, or a metal coated with a solder-phobic coating such as an oxide layer). This results in the upper side wall portion 3030A being solder-phobic, as shown in fig. 32. The lower sidewall portion 3030B may be coated with a solder-receptive coating 3046. When the fastener 3030 is mounted to the printed circuit board 3010 using solder 3028 (e.g., by soldering the fastener 3030 to the solder pad structure 3014 as shown in fig. 32), the solder 3028 adheres only to the lower sidewall portion 3030B of the fastener 3030. The upper side wall portion 3030A remains uncovered.

Fig. 34 shows how the fastener 3030 may be provided with protrusions that form a boss 3048. Bosses 3048 or other generally horizontal surfaces formed on the sidewalls of the fastener 3030 may be used to engage the solder 3028. This helps to retain the fastener 3030 on the printed circuit board 3010. As shown in fig. 34, a solder-receptive coating 3046 may be formed on the lower portion of the fastener 3030 to prevent solder 3028 from adhering to the upper portion near the top surface 3048.

In the example of fig. 35, the fastener 3030 is provided with radially extending projections, such as feet 3050. As shown in fig. 36, the feet 3050 can engage the solder 3028 and thereby help to hold the fastener 3030 in place when the fastener 3030 is soldered to the printed circuit board 3010. The fastener 3030 can have any suitable number of protrusions thereon (e.g., 1 foot, two feet, three evenly spaced feet, or 4 or more feet). In addition, it is not necessary to form the projections in the shape of feet. For example, a rotationally symmetric protrusion, such as an annular protrusion, may be formed.

The fastener 3030 may have a combination of features described in connection with fig. 18-34, if desired. For example, a fastener having radially extending legs may be provided with a narrow lower cylindrical portion, such as portion 3030B of fastener 3030 in the example of fig. 30. The fastener 3030 of fig. 30 and other fasteners may be provided with selective solder-philic and solder-phobic regions. The textured surface 3044 of the fastener 3030 of FIG. 31 can be provided on other shaped fasteners as shown in FIGS. 18-34. The fastener 3030 may be mounted on a surface of the printed circuit board or may be mounted within a hole formed partially through or completely through the printed circuit board 3010. As shown in the examples of fig. 18-34, the fastener may have a generally cylindrical body, or may have a body of other shapes (e.g., cubic, etc.). A narrow fastener body portion (such as portion 3030B of fig. 30) may be provided on any of the fasteners of fig. 18-34 to allow insertion of the narrow portion of the fastener into a printed circuit board aperture.

Electronic devices such as computers, cellular telephones, and other devices often contain printed circuit boards. Electronic components such as integrated circuits, switches, buttons, input-output port connections, resistors, capacitors, inductors, and other discrete components may be mounted on the printed circuit board.

Some of the circuitry on the printed circuit board is used to process radio frequency signals. Examples of circuitry for processing a radio frequency signal include a radio frequency transmitter, a radio frequency receiver, a low noise amplifier for receiving an incoming radio frequency signal from an antenna, and a power amplifier for increasing the signal strength of the radio frequency signal before it is transmitted via the antenna.

It is sometimes desirable to enclose the circuitry on the printed circuit board within a radio frequency shielded box. Radio frequency shielding may be used to help prevent radio frequency signals generated by the circuit from escaping and causing interference. Radio frequency shielding may also be used to prevent external radio frequency signals from interfering with the operation of the circuitry shielded within the shielded enclosure.

The space consumed by the rf shield box and other components is a concern in a dense printed circuit board environment. If left unattended, the area consumed by the radio frequency shield box and components on the printed circuit board may be excessive, resulting in inefficient arrangements and excessive board size.

Accordingly, it is desirable to provide improved techniques for mounting radio frequency shielding boxes and other components on printed circuit boards.

According to one embodiment, an electronic device may be provided with a printed circuit board on which integrated circuits and other circuitry are mounted. To block potentially interfering radio frequency signals, the integrated circuits and other components may be enclosed within a radio frequency shielding structure, such as a radio frequency shielding box.

The radio frequency shield can have a frame and a cover. The frame may have feet mounted on the printed circuit board. The feet may be configured such that at electromagnetic frequencies of interest, there is less than a quarter wavelength separation between the circuit board attachment points.

The frame may have corners where the radio frequency shield box may be attached to the printed circuit board using mounting structures. Additional components such as speakers or other electronic components may overlap the radio frequency shielding cage at one of the corners. The mounting structure may include mating fasteners. One of the fasteners may be a screw having a threaded shaft. The other fastener may be a threaded stud having a threaded bore that receives a threaded rod. The stud may be soldered to the printed circuit board within an opening that does not completely pass through the printed circuit board.

According to one embodiment, an apparatus is provided that includes a radio frequency shield box having a first opening, an electronic component having a second opening overlapping the first opening, a mounting structure housed within both the first opening and the second opening, and a substrate on which the mounting structure mounts the radio frequency shield box and the electronic component.

According to another embodiment, an apparatus is provided wherein the mounting structure includes mating fasteners.

According to another embodiment, an apparatus is provided wherein the mating fasteners include a male fastener and a female fastener.

In accordance with another embodiment, an apparatus is provided wherein the male fastener has a threaded shank and wherein the female fastener has a threaded bore.

According to another embodiment, an apparatus is provided wherein the female fastener is mounted on a substrate.

In accordance with another embodiment, an apparatus is provided wherein the radio frequency shield box may have a frame and a cover, and wherein the first opening is formed in the frame.

According to another embodiment, an apparatus is provided wherein the electronic component comprises a speaker.

In accordance with another embodiment, an apparatus is provided wherein the mounting structure includes first and second mating fasteners, wherein the second fastener is welded to the substrate, and wherein the first fastener is tightened within the second fastener.

In accordance with another embodiment, an apparatus is provided wherein the substrate comprises a printed circuit board having a solder pad, and wherein the second fastener is soldered to the substrate at the solder pad.

In accordance with another embodiment, an apparatus is provided wherein the solder pad comprises an annular metal structure, and wherein the printed circuit board comprises a plurality of layers of annular metal below the solder pad.

According to another embodiment, an apparatus is provided wherein the radio frequency shielding box may block radio frequency signals of a wavelength associated with operational circuitry within the radio frequency shielding box, wherein mounting structures and other portions of the radio frequency shielding box may be attached to the substrate at a plurality of respective attachment points, and wherein no two adjacent ones of the attachment points are spaced more than one quarter of the wavelength apart.

According to another embodiment, an apparatus is provided, wherein the substrate comprises a printed circuit board having a thickness, wherein the mounting structure comprises a first fastener and a second fastener, and wherein the second fastener is soldered to the printed circuit board without penetrating the thickness of the printed circuit board.

According to another embodiment, there is provided an electronic device including a housing, a printed circuit board within the housing, a radio frequency shielding box having four corners, an electronic component overlapping a given one of the four corners, and a first fastener mounted to the printed circuit board, and a second fastener that mates with the first fastener at the given one of the four corners and attaches both the radio frequency shielding box and the electronic component to the printed circuit board at the given one of the four corners.

In accordance with another embodiment, an electronic device is provided wherein the second fastener comprises a screw, and wherein the first fastener has a threaded hole that receives the screw.

According to another embodiment, an electronic device is provided that includes a speaker.

According to another embodiment, there is provided an electronic device, wherein the radio frequency shield box has a first U-shaped opening, wherein the electronic component has a second U-shaped opening, and wherein the screw passes through the first and second U-shaped openings at the given one of the four corners.

In accordance with another embodiment, an apparatus is provided that includes a radio frequency shielding box having a first opening, an electronic component having a second opening overlapping the first opening, a printed circuit board, a first fastener mounted to the printed circuit board, and a second fastener passing through the first and second openings and mating with the first fastener to attach the radio frequency shielding box and the electronic component to the printed circuit board.

In accordance with another embodiment, an apparatus is provided wherein the second fastener comprises a screw, the first fastener comprises a threaded hole that receives the screw, the printed circuit board comprises a solder pad structure, and the first fastener is soldered to the solder pad structure.

In accordance with another embodiment, an apparatus is provided wherein the radio frequency shielding box has four corners, and wherein the first opening is located at a given one of the four corners.

In accordance with another embodiment, an apparatus is provided wherein the radio frequency shield box includes a frame and a cover attached to the frame, and wherein the first opening comprises a U-shaped opening in the frame.

According to these embodiments, radio frequency interference may be blocked using a radio frequency shielding package ("box"). As shown in fig. 37, the radio frequency shield case 3810 may be mounted on a substrate, such as a printed circuit board 3812. Printed circuit boards, such as printed circuit board 3812 of fig. 37, may be installed inside cellular phones, computers, and other electronic devices. As shown in fig. 37 as component 3814, components susceptible to radio frequency interference, such as radio frequency transceivers and other circuitry, may be enclosed with a casing 3810. Enclosing the component 3814 within the case 3810 may prevent radio frequency interference from disrupting the operation of the component 3814.

The box 3810 may be formed of a conductive material such as metal. The presence of metal in the box 3810 helps block radio frequency electromagnetic signals. The box 3810 may have walls formed from solid metal, perforated metal, a laminate structure with one or more conductive layers, or the like. In some configurations, the case 3810 may be formed from a single structure, such as a piece of stamped sheet metal. In other configurations, the case 3810 may be formed of a multi-part structure. By way of example, the case 3810 may have a frame and a cover.

In a radio frequency shield having a frame and a cover, the frame may be mounted on a printed circuit board using a mounting structure. For example, a male threaded fastener (such as a screw) may be mated with a corresponding female threaded fastener (such as a stud or nut). With this type of arrangement, screws can be used to secure the frame to the printed circuit board. The cover of the radio frequency shielding box may be press fit onto the frame. Adhesives, welding, and other attachment mechanisms may also be used to attach the rf shield box cover to the rf shield box frame, if desired. For clarity, the use of a radio frequency shielding arrangement with a frame and a cover is sometimes described herein as an example. This is however merely illustrative. The radio frequency shielding package may be formed from a one-piece structure, a two-piece structure, from a structure having three or more pieces, and the like.

Fig. 38 shows a side view of an illustrative radio frequency shielding box that may be mounted on a printed circuit board. As shown in fig. 38, the radio frequency shield 3810 may include a frame, such as the frame 3818. A cover (such as cover 3816) may be mounted on the frame 3818. The cover 3816 may be, for example, a rectangular cover having a horizontal flat top and four vertical flat sidewalls (as an example). The cover 3816 may be press fit onto the frame 3818, or may be attached to the frame 3818 using fasteners, welding, adhesives, or the like.

The frame 3818 may have one or more vertical projections, such as feet 3820. Each foot is attached to a printed circuit board 3812. As shown in fig. 38, for example, the printed circuit board 3812 may have metal pads (such as pads 3834) with the feet 3820 attached to the pads 3834 using solder or other suitable attachment mechanisms.

Fasteners, such as male fasteners 3822 and mating female fasteners 3824, may be used to attach the radio frequency shielding cage 3810 to the printed circuit board 3812. Fasteners (such as fastener 3822 and fastener 3824) may include engagement features, such as holes, prongs, and the like. These engagement features may allow the fastener 3822 to mate with the fastener 3824. With one illustrative arrangement, sometimes described herein as an example, the fasteners 3824 may be studs or other fastening structures attached to the printed circuit board 3812, and the structures 3822 may be screws or other threaded fastening structures. The fastening structure 3824 may have a threaded hole, such as a threaded hole 3826, and the screw 3822 may be screwed into the threaded hole 3826. Screws 3822 may pass through openings in the frame 3816. When the screws 3822 are tightened, the screws 3822 may press against the upper surface of the frame 3816, holding the frame 3816 and the feet (such as the feet 3820) against the upper surface of the printed circuit board 3812.

The fasteners 3824 may be attached to the printed circuit board 3812 using soldering, using a through hole mounting arrangement with fastening nuts or other backside attachment structures, using adhesives, and the like. With the illustrative arrangement shown in fig. 38, a printed circuit board 3812 is provided with a solder pad structure 3828. Horizontal protruding head portions 3832 of the fasteners 3824 are attached to the solder pad structure 3828 using solder 3830.

Traces such as the conductive interconnect traces of fig. 38 may be formed on the rear (lower) surface of the printed circuit board 3812, if desired. The size and shape of the fastener 3824 may define a profile (e.g., a circle) when viewed from the vertical direction 3842. The profile of the fastener 3824 may, in turn, define a footprint (e.g., a circular projected area), such as the footprint 3836 on the back side of the printed circuit board 3812. In configurations of the type shown in fig. 38 where the fasteners 3824 do not extend the entire thickness of the printed circuit board 3812, the entire surface area within the footprint 3836 may be used for interconnect traces and component mounting. For example, the interconnect traces 3840 may have portions, such as portions 3838, that are located within the footprint 3836.

Fig. 39 shows a perspective view of the radio frequency shield case 3810 of fig. 38 without the cover 3816. As shown in fig. 39, the frame 3818 may have an opening (such as opening 3844) within which the fastener 3822 may be received. The openings 3844 may be round holes, square holes, U-shaped openings or other open-ended slots (as shown in fig. 39), or any other suitably shaped openings that allow the fasteners 2822 to retain the frame 3818 to the fasteners 3824. An advantage of using a U-shaped slot of the type shown in FIG. 39 is that this type of opening can accommodate variations in the position of the fastener 3822, thereby enhancing manufacturing tolerances. The fastener 3824 may have a generally cylindrical shape (as shown in fig. 39), or other shapes (e.g., rectangular, hexagonal, etc.) may be used for the fastener 3828. The fasteners 3822 and 3824 may be formed of metal (as an example).

To enhance grounding and thermal conductivity in the area near the fasteners 3824, a ground layer, such as layer 3828' of fig. 40, may be formed under the solder pads 3828. Vias may be used to short layer 3828 to layer 3828'. Layers 3828 and 3828' may be grounded using conductive traces within board 3812. The printed circuit board 3812 may include one, two, three, four or more layers, and the like. Each printed circuit board layer may include a layer of patterned conductor (e.g., copper traces). The conductor layer may be patterned using via interconnects. By way of example, the solder pad 3828 may have a circular ring shape with a central hole that receives the protruding portion 3846 of the fastener 3824. As shown in fig. 40, the layer 3828' may have substantially the same size and shape as the solder pad 3828 (as an example). Layer 3828' may have other shapes and sizes, if desired. The arrangement of fig. 40 is merely illustrative, where there are two or more layers 3828 ', and each layer 3828' has substantially the same size and shape as layers 3828.

As shown in fig. 41, the frame 3818 may have two or more legs. For example, the frame 3818 may have a rectangular ring shape with four sides, such as sides 3818A. There may be two or more feet on each of the four sides, such as feet 3820A and 3820B. Each leg may be soldered to a respective solder pad on the printed circuit board 3812. For example, the legs 3820A may be soldered on the solder pads 3834A, and the legs 3820B may be soldered on the solder pads 3834B. Solder pads 3834A and 3834B may be grounded. The feet and fasteners used at the corners of the radio frequency shield box may form attachment points to the printed circuit board. In this type of arrangement, it may be desirable for the spacing D between adjacent attachment points (e.g., adjacent feet and/or fasteners) to be less than a quarter of a wavelength of the electromagnetic frequency of interest (e.g., less than a quarter of a wavelength λ, where λ is the wavelength of the radio frequency signals associated with the operation of a radio frequency transceiver, radio frequency amplifier, or other circuitry enclosed within the shielded box). For example, if it is desired to block radio frequency signals having wavelengths of λ or longer, the distance D may be less than λ/4. In accordance with this approach, the spacing between the fastener 3822 at each corner of the frame 3818 and its nearest foot should also be less than λ/4. By ensuring that the maximum lateral separation between any two attachment points to the printed circuit board is less than λ/4, the radio frequency blocking performance at the operating frequency of interest can be enhanced.

To efficiently use space on the printed circuit board 3812, and thereby minimize the volume consumed by the electronic components and the board 3812 when the board 3812 is mounted within an electronic device housing, the radio frequency shield case 3810 and other components may share a common mounting structure. For example, the male fastener 3822 and the mating female fastener 3824 may be located at a given one of four corners of the radio frequency shielding box 3810. The additional component may have an angle that overlaps a given angle of the cassette. Common mounting structures (such as male fasteners 3822 and mating female fasteners) may be used at the overlapping corners to secure both the radio frequency shield box and the additional components. The additional components may be speakers, microphones, switches, connectors such as input-output data port connectors, other types of electronic components, and the like.

Figure 42 shows an arrangement in which the radio frequency shield box and the further component share a common mounting arrangement and have overlapping corners. As shown in fig. 42, the radio frequency shield case 3810 may have a frame (such as the frame 3818) and a shield cover (such as the cover 3816). The frame 3818 may have feet such as feet 3820. Frame feet such as feet 3820 may be soldered or otherwise connected to solder pads such as solder pads 3834 on the surface of printed circuit board 3812. Cover 3816 may also have feet such as feet 3850. The cover feet 3850 may be soldered to solder pads, such as solder pads 3834 adjacent to the feet (such as the frame feet 3820), if desired.

The frame 3818 may have fastener openings, such as U-shaped fastener openings 3844. Overlapping portion 3814 may also have fastener openings, such as U-shaped fastener openings 3852. The fastener openings 3844 and the fastener openings 3852 can overlap the vertical fastener attachment axis 3848. The component 3814 may be mounted on the frame 3818, or the frame 3818 may be mounted on the component 3854, if desired.

During assembly, the fastener 3822 may be threaded into the fastener 3824 along the attachment path such that the threads on the shank portion 3846 of the fastener 3822 mate with the threads within the threaded bore 3826 of the fastener 3824 on the printed circuit board 3812. As the fastener 3822 is threaded into the fastener 3824, a downward force may be applied to the head portion 3830 of the fastener 3822 along the axis 3848 toward the printed circuit board 3812. This compresses the component 3814 and the radio frequency shielding frame 3818 between the fasteners 3822 and 3824 and holds the component 3814 and the frame 3818 in place on the printed circuit board 3810. By mounting both the radio frequency shield box 3810 and the components 3854 to the printed circuit board 3812 using a common attachment point, board area is used efficiently and the number of fasteners mounted on the board 3812 is minimized.

Fig. 43 illustrates a side view of an interior portion of an electronic device that includes a radio frequency shielding box and at least one overlapping member. As shown in fig. 43, electronic device 3856 may have a housing, such as housing 3858. The housing 3858 may be formed from plastic, metal, ceramic, glass, composites, other suitable materials, and combinations of these materials. The housing 3858 may include sidewalls and internal support structures, or may be formed using a monolithic configuration (as an example).

The printed circuit board 3812 may be mounted within a housing 3858. One or more radio frequency transceivers, radio frequency amplifiers, and other components that generate radio frequency signals and/or are adversely affected by radio frequency interference may be enclosed within a radio frequency shielded enclosure, such as radio frequency shielded enclosure 3810. A cassette, such as cassette 3810, may have any suitable shape. The box 3810 may be rectangular when viewed from above, and may have four corners. The component 3814 may be an electronic component such as a speaker, microphone, switch, connector, or other component, and may have one or more corners or other portions that overlap the radio frequency shielded box 3810.

As described in connection with fig. 42, space may be saved by attaching both the component 3814 and the radio frequency shield case 3810 to the printed circuit board 3812 using a single male fastener (such as the fastener 3822) and a single female fastener (such as the female fastener 3824) or other common mounting structure.

Electronic devices typically contain a battery. For example, cellular telephones, media players, and portable computers often contain batteries.

The battery may have a positive electrode layer and a negative electrode layer separated by an insulating layer. The electrode layer may be rolled into a cylindrical shape to form a rolled electrode structure. Positive and negative battery terminals may be connected to the positive and negative electrodes. The wound electrode structure and battery terminals may then be wound within a battery pouch formed from a metallized insulator layer. After wrapping the electrode structure within the cell pouch, the edges of the pouch are folded inwardly onto the pouch. These edges are held in place using a strip of polyimide tape. The cell pouch with the edges taped together form a complete battery. In some cases, the battery pack is directly mounted within the electronic device. In other cases, the battery is wrapped within an adhesive label.

Conventional batteries such as these are not always satisfactory. For example, adhesive labels may be used to provide the required regulatory information to the battery, but add undesirable thickness to the battery pack. The strip of polyimide tape used to hold the edges of the cell pouch in place is sometimes prone to peeling. Conventional labels and polyimide tapes may also be unsightly when the device housing is opened for replacement or repair of the battery.

Accordingly, it is desirable to provide improved batteries for electronic devices.

According to one embodiment, a battery having an electrode structure may be provided to an electronic device. The electrode structure may be formed of positive and negative electrode layers laminated to opposite sides of a spacer layer. A wound battery electrode structure may be formed using positive and negative electrode layers and a spacer layer.

The battery cell may be formed from a sheet of metallized polymer. The metallized polymer may include one or more of a clear polymer layer, an ink layer, and a metal layer. The battery cell flaps may be folded along one edge and sealed along the remaining edge. A coiled electrode structure may be incorporated into the cell pouch.

A regular pattern can be printed directly on the metallized polymer of the battery pouch sheet. The regular pattern may be formed from one or more ink layers. For example, a black background ink layer may be printed on top of the cell pouch sheet, and a bright patterned foreground ink layer may be printed on the background ink layer on the cell pouch sheet. The patterned foreground ink may include text, marks, icons, and other information.

A single piece of adhesive backed polymer may be used to secure the edges of the cell pouch. The adhesive-backed polymer sheet may have a window, such as a rectangular window. The window may be aligned with the printed regular layout so that the regular layout is visible through the window.

According to one embodiment, a battery is provided that includes a battery electrode structure, a battery pouch formed from a polymer sheet, and a patterned ink layer on the polymer sheet.

In accordance with another embodiment, a battery is provided wherein the polymer sheet comprises a metallized polymer sheet having a metal layer and a polymer layer.

In accordance with another embodiment, a battery is provided wherein the metallized polymer sheet includes an ink layer.

According to another embodiment, a battery is provided, wherein the polymer sheet comprises a metal layer and a polymer layer, and wherein the battery further comprises a background ink layer on the polymer layer below the pattern ink layer.

According to another embodiment, a battery is provided wherein the background ink layer comprises a substantially rectangular printed black ink layer, and wherein the pattern ink layer comprises white ink.

According to another embodiment, there is provided a battery, wherein the background ink has one color, and wherein the patterned ink layer includes text and is formed of a material having a color that contrasts with the color of the background ink.

According to another embodiment, a battery is provided that further includes an adhesive coated polymer sheet with a window opening, the polymer sheet being wrapped around the battery cell such that the patterned ink layer is visible through the window opening.

According to another embodiment, a battery is provided that further includes an adhesive coated polymer sheet with a window opening, the polymer sheet being wrapped around the battery cell such that the patterned ink layer is visible through the window opening.

In accordance with another embodiment, a battery is provided wherein the polymer sheet includes a polyimide layer.

In accordance with another embodiment, a battery is provided wherein the polymer sheets forming the battery cells comprise a nylon layer and an aluminum layer and have a generally rectangular window opening.

In accordance with another embodiment, a battery is provided wherein the battery electrode structure comprises a wound electrode structure.

According to another embodiment, a method for forming a battery pack includes forming a battery electrode structure, enclosing the battery electrode structure within a battery pouch having a folded back edge and left, right, and front edges, and securing the front, left, and right edges of the battery pouch using a single polymer sheet having a window opening.

According to another embodiment, a method is provided that further includes printing rule information on the battery pouch with a patterned ink.

According to another embodiment, a method is provided wherein securing the front, left, and right edges of the battery cell includes aligning the window opening so that the patterned ink is visible through the window opening.

According to another embodiment, a method is provided wherein securing the front, left, and right edges of the battery cell comprises wrapping portions of a single polymer sheet around the battery cell and attaching the polymer sheet to the battery cell using an adhesive.

According to another embodiment, a method is provided that further comprises printing a background ink layer on the battery capsule, wherein the patterned ink is printed on the background ink layer.

In accordance with another embodiment, a battery is provided that includes a wound battery electrode structure, a battery pouch formed from a metallized polymer battery pouch sheet surrounding the wound battery electrode structure, and a patterned ink on the metallized polymer battery pouch sheet.

According to another embodiment, a battery is provided that further includes a polymer sheet with adhesive on the back that secures the folded edges of the battery pouch and has a rectangular window through which the patterned ink is visible.

According to another embodiment, a battery is provided, wherein the battery pouch includes an ink layer.

In accordance with another embodiment, a battery is provided that further includes a background ink layer having a first color printed on the metallized polymer battery cell pouch sheet, wherein the graphic ink has a second color that contrasts with the first color, wherein the graphic ink includes text printed on the background ink layer.

According to these embodiments, a battery is used in an electronic device. For example, batteries may be used within portable electronic devices such as cellular telephones, handheld computers, media players, portable computers, and other electronic devices.

The battery has a positive electrode and a negative electrode. For example, in a lithium ion battery, it is sometimes referred to as a cathodeThe positive electrode of (a) includes lithium, while the negative electrode, sometimes referred to as the anode, contains carbon. In the lithium polymer batteries sometimes described herein as examples, the positive and negative electrodes are laminated on opposite sides of a polymer separator sheet. For example, a lithium polymer battery may have a battery cell made of LiCoO₂Or LiMnO₄A positive electrode layer formed, a spacer layer formed of a polymer such as polyoxyethylene, and a negative electrode layer containing lithium or a mixture of lithium and carbon (as examples). Other types of electrodes and spacers may be used. These are merely illustrative examples.

Fig. 44 shows a side view of an illustrative set of battery electrodes and associated spacer layers. As shown in fig. 44, electrode structure 4210 may include electrodes 4212 and 4216 and spacer 4214. The positive electrode layer 4212 may be attached to an upper surface of the spacer layer 4214, and the negative electrode layer 4216 may be attached to a lower surface of the spacer layer 4214. The layers of the electrode structure 4210 are typically thin (e.g., a fraction of a millimeter).

To ensure that the cell formed by electrode structure 4210 has sufficient capacity, the area of the electrode structure may be several square centimeters in size (as an example). It may therefore be desirable to fold the electrode structure into a more compact shape. For example, it may be desirable to wind the electrode structure into a shape of the type shown in FIG. 45. This type of electrode configuration, sometimes referred to as a coiled shape, reduces the footprint of the battery and provides the battery with a size and shape that is compatible with typical device form factors.

As shown in fig. 45, positive and negative battery terminals, such as terminals 4218 and 4220, may be provided to rolled electrode structure 4210. Positive battery terminal 4218 may be electrically connected to positive electrode 4212. The negative battery terminal 4220 may be electrically connected to the negative electrode 4216.

The rolled electrode structure 4210 of fig. 45 may be sealed within a battery cell prior to being used in an electronic device. For example, the battery cell may be formed of a polymer lined in a metal (such as aluminum).

Fig. 46 shows a conventional battery cell in a partially assembled state. As shown in fig. 46, a battery cell can be formed around the coiled electrode structure 4228 using battery cell tabs 4224. When assembly is complete, terminals 4230 may form battery terminals of the battery pack.

The cell pouch 4224 has an outer insulating layer 4224 and an inner conductive layer 4226. The outer layer 4224 may be formed from nylon or nylon coated with a polypropylene or polyester layer. The inner layer 4222 may be formed of aluminum.

During assembly, as shown in fig. 46, battery bladder 4222 may be folded over onto itself along its rear edge. The remaining edges of cell pouch 4222 may then be sealed to form cell pouch 4232. Fig. 47 shows an end view of the conventional battery cell 4232 after the edges of the cell have been sealed.

After forming the conventional battery cell of fig. 47, a conventional battery pack may be formed by folding the edges of the battery cell and fixing the folded edges with a strip of polyimide tape. Fig. 48 shows a cross-sectional end view of conventional battery cell 4232 of fig. 47 after edges 4234 and 4236 have been folded over the sides of cell 4232 and secured with strips of polyimide tape. As shown in fig. 48, left side 4236 of battery cell 4232 may be folded over the left side of battery cell 4232 and may be secured with left side polyimide tape 4242. Right side polyimide tape 4238 may be used to secure right side 4234 of battery cell 4232.

In some conventional battery packs, an adhesive printed label, such as label 4240 of fig. 48, may be wrapped around the exterior of the battery pouch. Label 4240 may contain printed information for compliance with labeling regulations, but the presence of label 4240 tends to add approximately 0.2mm to the battery pack. Label 4240 and tapes 4238 and 4242 are also prone to peeling and may be unsightly.

To help minimize battery pack thickness and improve battery pack appearance, the labeling information may be printed directly on the battery pouch. For example, a first ink layer may be printed on part or the whole of the battery capsule in order to form a background. Such background ink may be black, for example, or may have other suitable dark or light colors. Contrasting foreground inks may be printed over the background layer in patterns that form text, indicia, icons, graphics, and other suitable labeling information. For example, if the background ink is black, or has another dark color, the foreground ink may be white, or may have another light color. If the background is light, the foreground ink may be dark. A contrasting color pair (e.g., orange and blue) may be used for the background and foreground ink layers. The ink may be formed from dyes, pigments, paints, colored adhesives, colored polymers, or other suitable materials.

The ink layer may be deposited on the cell pouch using any suitable technique. For example, the ink layer may be deposited by pad printing, using a paint brush, screen printing, dropping, spraying, ink jet printing, and the like.

In addition to forming printed information directly on the battery cell, the battery cell may be formed from attractive materials, such as a cell patch (layer) containing a layer of black ink or other colored ink. Figure 49 illustrates how a strip of flexible material dispensed from a set of rollers can be used to form a battery pouch.

As shown in fig. 49, a first roller, such as roller 4244, may rotate in direction 4248 about rotational axis 4246 and may dispense a first sheet 4250. The sheet 4250 may be, for example, a sheet of aluminum or other metal or conductive material. A second roller, such as roller 4252, may rotate in direction 4256 about rotational axis 4254 and may dispense a second tab 4258. The sheet 4258 may be, for example, a nylon or other insulator layer. If desired, a third roller, such as roller 4260, may rotate in direction 4264 about rotational axis 4262 and may dispense a third tab 4266. Sheet 4266 may be, for example, a layer of polypropylene, polyester, or other suitable insulating material (as examples).

Pressure rollers 4268 and 4274 may press sheets 4250, 4258 and 4266 together to form a single cell pouch sheet at area 4286. Specifically, pressure roller 4268 may rotate about rotational axis 4270 in direction 4272, and may press down on the sheets in direction 4280. Pressure roller 4274 may rotate about axis of rotation 4276 in direction 4278 and may press upward on the sheets in direction 4282. The opposing force from the pressure rollers squeezes the battery bladder together in region 4284 such that sheets 4250, 4258 and 4266 form the various layers of a single battery bladder in region 4286. The battery cell tabs may be dispensed from the device of fig. 49 in direction 4288.

The insulating layers of the cell pouch (such as layers 4258 and 4266) may be colored (e.g., with a black dye or other colored material) or may be clear. A colored coating of ink or other coloring material may be incorporated into the cell pouch if desired. The presence of the colored layer can help improve the aesthetics of the battery when the insulating layer of the battery pouch is formed from a clear material.

With one suitable arrangement, layer 4266 may be formed from a clear polypropylene or polyester layer, and layer 4258 may be formed from a clear nylon layer. The transparent insulating sheets may be made opaque (as an example) by applying black ink to one or both of the sheets. As shown in fig. 49, an ink wet distribution roller 4290 may be used to coat the layer 4258 with a black ink layer 42100. The roller 4290 may be rotated about an axis of rotation 94 in a direction 4292 to coat the layer 4258 with an ink layer 42100 or a layer of other suitable opaque substance. The black ink layer may provide a matte black appearance to the cell pouch. If desired, a heat source (such as heater 4296) may be used to heat ink 42100 within area 4298 and thereby help cure the ink before reaching pressure rollers 4268 and 4274. Other types of curing schemes (e.g., ultraviolet light curing, etc.) may be used if desired. The ink used to form the opaque ink layer within the battery cell (e.g., matte black ink) may be formed from any suitable substance (e.g., dyes, pigments, paints, colored binders, carbon or other colored particles, polymeric resins, etc.).

Fig. 50 illustrates how a battery pouch, such as battery pouch 42102, may be formed with battery pouch tab 86 of fig. 49. As shown in fig. 50, battery bladder tab 86 may be folded to form battery bladder 42102. Battery electrodes (such as the coiled electrode structure 4210 of fig. 45) may be encapsulated within the pouch 42102 such that the battery electrodes 4218 and 4220 extend beyond the battery pouch front edge 42120. If desired, battery protection circuitry such as battery protection circuitry 42104 may be electrically connected to electrodes 4218 and 4220.

Battery bladder 4286 may be folded over itself along battery bladder rear edge 42108. If the rolled electrode structure has a relatively flat shape, the folding process will form a substantially flat upper surface 42106 on cell pouch 42102. Electrode structures having different shapes tend to result in different cell pouch shapes.

In the example of fig. 50, the upper and lower layers of folded tabs 4286 extending along cell left edge 42112, cell right edge 42110, cell front edge 42120 may be sealed to form an environmentally sealed enclosure of the cell electrode structure. The seal may be formed using adhesive, heat, pressure, crimping, or the like.

After the edges of the battery cell 42102 are sealed, the edges may be folded inward, as shown in fig. 51. Specifically, right edge 42110 of battery bladder 42102 may be folded upward over the right side of battery bladder 42102. In doing so, the edge 42110 may move in a direction 42114 about a fold axis 42116. By folding edge 42112 in direction 42118 about fold axis 42122, left edge 42112 of battery bladder 42102 may be folded upward on the left side of battery bladder 42102. Front edge 42120 may be folded about fold axis 42124 in direction 42126 on the front side of battery bladder 42102.

To provide a thin and attractive label for cell 42102, one or more layers of ink (or other suitable material) may be deposited on the surface of cell 42102. As described in connection with fig. 49, the battery cell 42102 may be formed from a matte black sheet of battery cell material. Accordingly, it may be desirable to print label information on the battery cell 42102 using a contrasting color (such as white ink). If desired, a background ink layer may be deposited on the surface of the battery cell 42102 to form a contrast layer that facilitates the user's viewing of text, logos, icons, and other printed information of the foreground ink layer. Fig. 51 shows an arrangement of this type.

As shown in the example of fig. 51, a background layer 42128 of black ink (or a different color ink) is formed on the front surface of the cell pouch 42102 within the area 42106. The layer 42128 may, for example, be approximately 20 microns thick, less than 10 microns thick, or the like. The shape of the layer 42128 may be, for example, rectangular. The foreground ink layer 42130 may be formed on top of some or all of the background layer 42128. The ink layer 42130 may, for example, be approximately 20 microns thick, less than 10 microns thick, and the like. The foreground ink layer 42130 may be formed from ink having a color that contrasts with the background layer 42128. For example, if the background ink layer 42128 is matte black, the foreground layer 42130 may be white, or may have another bright color. The layer 42130 may be patterned to form text (e.g., rule text), icons (e.g., rule icons), other information required to comply with the rules, information about the type and capacity of the battery, manufacturing information, and the like. The background ink layer 42128 and the foreground ink layer 42130 may be formed using silk screening, pad printing, brush, inkjet printing, dropping, spraying, or the like.

Polyimide tape or other suitable adhesive backed strips of material may be used to secure the edges of the battery cells 42102. To enhance cell aesthetics and improve manufacturing tolerances, it may be desirable to form the cell's edge-securing polymer structure from a single unitary polymer, such as polyimide with adhesive backside. Fig. 52 shows an example of an illustrative pattern that may be used to form a patterned polymer sheet of this type. Other patterns may be used. The pattern shown in fig. 52 is merely an example.

As shown in the example of fig. 52, the tabs 42132 may have a generally rectangular shape with an extension portion (such as tab 42134). The sheet 42132 may be formed from polyimide, polyimide coated with a layer of Pressure Sensitive Adhesive (PSA) or other adhesive, a polymer other than polyimide, or other suitable material. An opaque material such as black ink may be printed on the sheet 42132 (e.g., to match the color of the battery cell ink).

A window, such as window 42136, may be formed by cutting an opening in the center of the tab 42132. The opening may be rectangular, oval or may have other suitable shapes. Rectangular window openings in the sheet 42132 may be used to match a corresponding rectangular layer of background ink, such as the background ink layer 42128 of fig. 51. The size of the window 42136 may be, for example, slightly smaller than the size of the background ink layer 42128, such that the inner edge of the window 42136 overlaps the outer peripheral edge of the background ink layer 42128.

During assembly, the edges of the polymer sheet 42132 may be wrapped over the folded edges of the battery cell 42102. Fig. 53 shows a cross-sectional perspective view of the battery cell 42102 after fixing the folded edges of the battery cell using the polymer sheets 42132 and thus completing the formation of a battery pack. As shown in fig. 53, the edges of the folded battery pack, such as edges 42110 and 42112, can be secured using polymer sheets 42132 by wrapping tabs 42134 on the edges (e.g., front, back, left and right edges) of the battery pouch. This type of arrangement may help ensure good protection of the sides of the battery pack and its seal while providing good dimensional control and protection of the battery protection circuit 42104.

A layer of opaque material (such as a matte black ink layer 42140) may be formed on the polymer sheet 42132 to hide the edges of the cell pouch from view. A layer of adhesive, such as adhesive 42142, may be used to secure the polymer sheet 42132 to the battery bladder 4286. The window 42136 may be aligned so that the background ink layer 42128 and the foreground pattern ink layer 42130 may be framed into the window 42136 (as shown in fig. 53), or so that the inner edge of the window 42136 slightly overlaps the periphery of the background ink layer 42128. The size of the window 42136 is preferably large enough to avoid obscuring the foreground ink 42130. This allows viewing of the regular layout on the front surface of the battery through the window.

Fig. 54 shows a flow chart of illustrative steps involved in forming a battery pack, such as the battery pack of fig. 53. At step 42144, a battery electrode structure may be formed. For example, as shown in fig. 44, the positive and negative electrodes may be laminated on opposite sides of the separator layer. Then, as described in connection with fig. 45, a rolled electrode structure may be formed by folding the electrode.

At step 42146, a metallized polymer battery tab can be formed. As described in connection with fig. 49, the cell pouch can include a metal layer, such as aluminum or other conductive material, formed on one or more polymer layers (e.g., transparent polymer layers). At least one of the material layers within the metallized polymer cell pouch can be coated with a black ink layer to provide the metallized polymer cell pouch with a desired appearance (e.g., a matte black finish).

At step 42148, a battery pouch, such as battery pouch 42102 of fig. 50, may be formed by printing background and foreground ink layers on the battery pouch sheet, by folding the battery pouch sheet over itself along the back edge, and by folding the edges of the battery pouch, as described in connection with fig. 51.

At step 42150, a polymer sheet having a window, such as sheet 42132 of fig. 52, may be formed. For example, a polymer sheet can be coated with black ink and adhesive, and a rectangular opening can be cut to form a rectangular window, such as window 42136 of fig. 52.

At step 42152, the window in the polymer sheet may be aligned with the printed ink layer on the surface of the battery pouch while the edges of the polymer sheet (e.g., tabs 42134 of fig. 52) are wrapped around the edges of the battery pouch (e.g., the front, back, left and right edges of the battery pouch). This results in a complete battery pack of the type shown in figure 53.

Electronic devices such as computers, cellular telephones, and other devices often contain printed circuit boards. Electronic components such as integrated circuits, switches, buttons, input-output port connectors, resistors, capacitors, and other discrete components may be mounted on the printed circuit board.

The rigid printed circuit board may be formed from a material such as a fiberglass-filled epoxy. In a typical manufacturing environment, printed circuit boards are cut from a large motherboard of printed circuit board material. The plates may be secured during processing using a break-away tab. After the process is complete, the tabs can be broken to detach the boards from the motherboard. The panel portion at the sheet break typically exhibits rough edges.

Many modern electronic devices use flexible printed circuits ("flex circuits"). The circuit components may be mounted on a flexible circuit. The flexible circuit may also contain traces for forming a signal bus. Because flexible circuits are thin and flexible, buses formed from flexible circuits are commonly used to transfer signals between different parts of a compact electronic device.

In some applications, it is desirable to route the flexible circuit near the broken tabs of the printed circuit board. In this type of environment, the flexible circuit may be exposed to rough edges of the printed circuit board. If not noticed, the rough edges of the board can damage the flex circuit. It may also be difficult to accurately control the bend radius of the flexible circuit.

Accordingly, it is desirable to provide improved methods of mounting flexible circuits within electronic devices that include printed circuit boards.

This may be accomplished by providing an electronic device (e.g., device 10 of fig. 1) with a printed circuit board on which integrated circuits and other components are mounted, as described in connection with fig. 55-60. During the manufacturing process, a plurality of printed circuit boards may be formed from a common motherboard of printed circuit board material. Milling machines and other tools may be used to cut printed circuit boards from a motherboard.

The snap tabs may be used to hold the printed circuit board within the motherboard of printed circuit board material during the manufacturing process. These broken pieces can be broken when it is desired to remove the printed circuit board from the motherboard. The broken tabs may have serrated edges.

Flexible circuits may be used to interconnect display and other components and circuits mounted on the printed circuit board. A bumper, such as a bumper formed from a resilient bumper member, may be mounted on an edge of the printed circuit board. The flexible circuit may be routed over the bumper member. The bumper member may protect the flexible circuit from roughness associated with broken rupture discs and may help define a bend radius within the flexible circuit.

According to one embodiment, a printed circuit board bumper is provided that includes a member having a first portion defining a recess for receiving an edge of a printed circuit board and a second portion defining a curved outer surface opposite the recess.

According to another embodiment, a printed circuit board bumper is provided wherein the member comprises an elastomeric substance.

According to another embodiment, a printed circuit board bumper is provided, wherein the member comprises silicone.

In accordance with another embodiment, a printed circuit board bumper is provided wherein the member comprises a resilient member, wherein the recess has opposing first and second parallel side walls and a vertical flat back wall.

In accordance with another embodiment, a printed circuit board bumper is provided wherein the second portion is configured to form a semi-cylindrical curved outer surface.

In accordance with another embodiment, an apparatus is provided that includes a printed circuit board having an edge, a bumper mounted on the edge, and a flexible circuit, wherein the bumper has an outer surface and at least a portion of the flexible circuit is located on the outer surface of the bumper.

According to another embodiment, an apparatus is provided wherein the bumper includes a groove that receives the rim.

According to another embodiment, an apparatus is provided wherein the bumper comprises a resilient bumper member.

According to another embodiment, there is provided an apparatus wherein the bumper comprises a resilient member with a groove to receive the rim, and wherein the outer surface comprises a curved surface.

According to another embodiment, there is provided an apparatus wherein at least a portion of the edge of the printed circuit board includes a broken break tab, and wherein the bumper is mounted on the edge of the broken break tab.

According to another embodiment, there is provided an apparatus wherein the bumper comprises a resilient member having a recess that receives an edge portion comprising a broken piece, and wherein the outer surface comprises a curved surface.

According to another embodiment, there is provided an apparatus wherein at least a portion of the edge of the printed circuit board includes a recess and a broken break tab within the recess, and wherein the bumper is to be mounted on the edge of the broken break tab within the recess of the edge of the printed circuit board.

According to another embodiment, an apparatus is provided wherein the bumper comprises a resilient bumper member.

According to another embodiment, an apparatus is provided that further includes a first component and a second component, wherein the second component is mounted on a printed circuit board, wherein the flexible circuit has at least a first end connected to the first component, wherein the flexible circuit has at least a second end connected to the printed circuit board and electrically connected to the second component, and wherein a portion of the flexible circuit located on an outer surface of the bumper includes an intermediate portion between the first end and the second end.

According to another embodiment, an apparatus is provided wherein the first component comprises a display and wherein the second component comprises an integrated circuit mounted on a printed circuit board.

According to another embodiment, an electronic device is provided that includes a component, a rigid printed circuit board having an edge, a resilient member mounted on the edge, and a flexible circuit connected to the component and the rigid printed circuit board and having a portion on the resilient member.

In accordance with another embodiment, an electronic device is provided wherein the flexible circuit comprises a polymer sheet having conductive traces and wherein the component comprises a display.

According to another embodiment, an electronic device is provided, wherein the rigid printed circuit board has a broken tab portion along the edge, and wherein the resilient member covers the broken tab portion.

According to another embodiment, an electronic device is provided wherein the resilient member has a recess that receives the broken off tab portion.

In accordance with another embodiment, an electronic device is provided wherein the component comprises a display, wherein the resilient member comprises a curved surface, and wherein the flexible circuit portion on the resilient member comprises a curved flexible circuit portion on the curved surface.

Electronic devices such as cellular telephones, computers, media players, and other devices often contain printed circuit boards. Some printed circuit boards, such as those formed from a substrate of epoxy or fiberglass-filled epoxy, are rigid. Flexible printed circuit boards ("flex circuits") may be formed from flexible polymer sheets, such as polyimide sheets. Printed circuit boards that include both rigid printed circuit board portions and flexible portions (i.e., flexible circuit "tails") are sometimes referred to as flex-rigid circuits.

In an electronic device, components such as integrated circuits, discrete components such as resistors, capacitors, and inductors, Surface Mount Technology (SMT) components, switches, input-output port connectors, and other electrical components are mounted on a printed circuit board. These components may be mounted using welding (as an example).

It is often desirable to electrically interconnect components within an electronic device that are mounted on different printed circuit boards or located in different areas. Buses and other interconnect paths may be formed using conductive traces on a printed circuit board. In a typical arrangement, the flexible circuit may contain a plurality of parallel conductive traces that form a parallel or serial bus. Different portions of the flexible circuit (e.g., opposite ends of the bus) may be attached to components within the electronic device. The flexible circuit may be bent to accommodate assembly requirements. This method can be used for the flexible circuit portion of a rigid-flex structure.

To meet the requirements of high volume manufacturing, multiple identical printed circuit boards may be produced in parallel. With one suitable arrangement, sometimes described herein as an example, a plurality of rigid printed circuit boards may be formed from a single rigid printed circuit board motherboard material. As shown in fig. 55, for example, the printed circuit board 4614 may be formed from a larger motherboard of printed circuit board material, such as a motherboard of printed circuit board 4612. The printed circuit board 4614 may be rectangular, may have curved sides, may have a polygonal shape with more than 4 sides, may have a combination of curved and straight sides, or may have other shapes. The illustrative shape of the printed circuit board 4614 in fig. 55 is illustrative only.

The printed circuit board 4614 may be separated from the motherboard 4612 using a cutting tool. Cutting techniques that may be used include scribing (scribing), milling, drilling, and sawing (as examples).

With one suitable arrangement, the groove is cut around almost the entire periphery of the printed circuit board. To ensure that the printed circuit board does not prematurely detach from the motherboard, a break-away tab is used to temporarily hold the printed circuit board in place.

Fig. 56 shows an arrangement of this type. As shown in fig. 56, a recess, such as recess 4616, may be formed in the printed circuit board motherboard 4612 around the periphery of the printed circuit board 4614. A snap-off tab 4618 may be provided along a portion or the entire edge of the printed circuit board 4614 to hold the printed circuit board 4614 in place within the motherboard 4612 until the printed circuit board processing is complete. Once the desired patterning and assembly operations are completed, the tabs 4618 may be broken to remove the plate 4614 from the motherboard 4612.

As shown in fig. 57, the process of breaking the tab 4618 may leave a rough edge on the printed circuit board 4614. Certain edges of the printed circuit board 4614, such as the edges 4620, may be relatively smooth (e.g., due to the use of milling to form the grooves 4616). However, the portions of the printed circuit board 4614 associated with the tabs 4618 may have a roughened surface because the portions of the board 4614 are formed by breaking the break-off tabs 4618. During assembly of the electronic device, care should be taken to avoid damage to the flexible circuit and other structures that may come into contact with the edges of the serrated printed circuit board.

In conventional arrangements, the flexible circuit may be damaged by the presence of the serrated edges of the printed circuit board. Consider, as an example, the case of fig. 58. As shown in fig. 58, the printed circuit board 4622 has a rough edge 4628 formed when the tab is broken to remove the printed circuit board 4622 from the motherboard of printed circuit board material. Due to layout constraints, it may be necessary to bend flexible circuit 4624 around edge 4628. This allows the flexible circuit 4624 to abut the rough surface of the broken break-off sheet printed circuit board edge 4628 and carries the risk of damage to the flexible circuit 4624. Conventional arrangements of the type shown in fig. 58 also make it difficult to properly control the positioning of flexible circuit 4624. The edges 4628 of the plates 4622 are perpendicular to the front and rear surfaces of the plates 4622, which creates a steep edge profile. Because the electrical circuit 4624 does not conform to the steep edge profile of the plate 4622, the shape of the flexible circuit may be affected by variations in the tension of the flexible circuit that may be caused by manufacturing variations. This makes it difficult to control the positioning of flexible circuit 4624.

As shown in fig. 59, a potentially rough edge of the printed circuit board 4614 may be covered using a covering member, such as member 4630. Member 4630 may be formed from plastic, epoxy, flexible polymer, metal, ceramic, glass, composite, other materials, or a combination of these materials. The member 4630 may be formed of a single piece structure, or may be formed of multiple structures attached together. With one suitable arrangement, sometimes described herein as an example, the member 4630 may be formed of a resilient material, such as silicone or other pliable substance. The member 4630 may have a curved outer surface of a predetermined size and shape, such as the surface 4632. The surface 4632 may have a semi-cylindrical shape, may have an approximately semi-cylindrical shape with varying radii, or may have other suitable shapes. When member 4630 is used within an electronic device, the shape of member 4630, and thus outer surface 4632, may help define the bend radius of the flexible circuit located on surface 4632.

Because the member 4630 may cover a rough edge (such as a serrated edge associated with the broken tab portion 4618 of the edge 4636), the member 4630 may sometimes be referred to as a bumper or protective structure. As shown in the example of fig. 59, the broken tab portion 4618 may be located in a recess along one edge of the printed circuit board 4614. The bumper member 4630 may have a groove, such as groove 4634, that allows the bumper member 4630 to be mounted on the edge of the printed circuit board 4614.

The recess 4634 and the curved outer surface 4632 may be formed by portions of the bumper 4630 that are located on opposite surfaces of the bumper member. For example, as shown in fig. 59, the recess 4634 may face the edge 4618 and the surface 4632 may be located on an opposite side of the bumper 4630, facing away from the edge 4618. The grooves 4634 may have a rectangular open-ended cross section (i.e., the grooves 4634 may have first and second opposing parallel planar sidewalls and a vertical planar back wall). Other shapes may be used for the grooves 4634 if desired.

In the exploded configuration of fig. 59, the buffer 4630 is not attached to the printed circuit board 4614. Fig. 60 shows an illustrative configuration of an electronic device in which a buffer 4630 has been mounted on one edge of a printed circuit board 4614.

As shown in fig. 60, the buffer 4630 may be mounted on the printed circuit board 4614 using an adhesive 4638. The adhesive 4638 may be omitted if desired (e.g., when the buffer 4630 is formed in an elastomeric substance, such as silicone with a tacky surface). When the bumper 4630 is mounted on the printed circuit board 4614 as shown in fig. 60, the bumper 4630 covers the serrated edge portion 4618 of the plate 4614 and creates a surface (surface 4632) that defines the location of a structure, such as a flexible cable.

In the example of fig. 60, the printed circuit board 4614 is mounted within a housing 4660 of an electronic device 4658. The housing 4660 may be formed using a unitary construction or may be formed from multiple structures that are coupled together. Materials that may be used to form the sidewalls and other portions of the housing 4660 include plastics, metals, composites, glass, ceramics, and the like.

The electronic device 4658 may include a plurality of printed circuit boards and a plurality of electronic components. In the example of fig. 60, the components 4662 have been mounted on a printed circuit board 4614. Components such as component 4662 may include integrated circuits, discrete components, switches, speakers, microphones, input-output port connectors, and the like. A given printed circuit board within the device 4658 has mounted thereon a number of components such as the component 4662. Component 4648 in the example of fig. 60 may be a printed circuit board on which integrated circuits and other devices have been mounted, or may be a display module (e.g., a touch screen display, a liquid crystal display, a plasma display, an electronic ink display, an organic light emitting diode display, etc.).

A flexible circuit (such as flexible circuit 4640) may be used to transfer information between components of device 4658. For example, the flexible circuit 4640 may be used to communicate information between the components 4662 and 4648 on the printed circuit board 4614. Flex circuit 4640 may contain metal traces that form a signal bus. The metal traces on the flexible circuit 4640 may be connected to corresponding metal traces on the printed circuit board 4614 using a connector 4644. A connector 4644 may be used to interconnect traces on flexible circuit 4640 to traces on component 4648 and other circuitry.

It may be desirable to flex the flexible circuit 4640 when mounting the components 4648 and printed circuit board 4614 within the device housing 4660. For example, flexible circuit 4640 may be sufficiently flexible to form a 180 ° bend of the type illustrated in fig. 60. When bent in this manner, flexible circuit 4640 conforms to surface 4632 of buffer 4630. As a result, the bend radius of flexible circuit 4640 within region 4642 is well defined and manufacturing constraints may be satisfied. The presence of the bumper 4630 also prevents the flexible circuit 4640 from riding up potentially rough edges of the printed circuit board 4614, thereby preventing damage to the traces on the flexible circuit 4640.

Fig. 61 shows illustrative steps involved in forming an electronic device, such as device 4658 of fig. 60, including a printed circuit board with a buffer.

At step 4650, a buffer, such as buffer 4630 of fig. 59 and 60, may be processed. For example, the bumper may be formed using an injection molding tool or a compression molding tool. The bumper has a recess or other opening that allows it to mount the bumper thereon along the edge of the printed circuit board. The outer surface of each bumper (i.e., the surface that is exposed when the bumper is mounted on a printed circuit board) may have a defined shape and bend radius to accommodate flexible circuit cables and other components within the electronic device.

The bumper 4630 may be formed of a plastic such as Polycarbonate (PC), Acrylonitrile Butadiene Styrene (ABS), PC/ABS blends, nylon, polyimide, epoxy, flexible polymers, glass, metal, foam, ceramic, composites (e.g., materials such as glass fiber and carbon fiber composites including fibers bonded together with a resin binder), other materials, and combinations of these materials. With one suitable arrangement, the bumper 4630 is formed from an elastomeric material, such as silicone. Elastomeric substances such as silicone may exhibit a tacky surface that facilitates attachment of the bumper to a printed circuit board, and may be flexible so as to minimize wear of overlying flex circuits and other cables during use. The bumper 4630 may have a slot having a shape that mates with an edge of the printed circuit board.

At step 4652, the printed circuit board may be processed. For example, the printed circuit board may be separated from the motherboard material of the printed circuit board material. The printed circuit board motherboard may be, for example, a rigid printed circuit board motherboard formed from a fiberglass-filled epoxy or other suitable printed circuit board motherboard substrate material. A milling cutter, saw, mechanical drill, laser drill, or other device may be used to form a groove, such as groove 4616 of fig. 56, around the periphery of the printed circuit board. Snap tabs (such as snap tabs 4618 of figure 56) may be formed at several locations around the periphery of the printed circuit board to temporarily hold the printed circuit board in place within the motherboard when the recess 4616 is formed. The break-away piece may be broken off when it is desired to remove the printed circuit board from the motherboard (in this type of arrangement). Other techniques may be used to remove the printed circuit board 4614 from the motherboard 4612 (e.g., scribing, stamping, etc.), if desired.

At step 4654, one or more buffers formed at step 4650, such as buffers 4630, may be attached to the printed circuit board. For example, as shown in fig. 59, the bumper 4630 may be secured to the printed circuit board 4614 by placing the recess 4634 of the bumper 4630 over the snapped tab portion 4618 of the printed circuit board edge 4636. The resilient nature and slightly tacky inner surface of the grooves 4634 may help hold the bumpers 4630 in place on the printed circuit board 4614, or other fastening mechanisms may be used to mount the bumpers 4630 (e.g., adhesives, screws, retention features on the board 4614, springs, snaps, or other separate retention features, etc.). If desired, multiple bumpers 4630 may be attached to a single printed circuit board 4612 (e.g., so as to cover part or all of its break sheet edge 4618).

At step 4654, the printed circuit board and its associated buffers may be assembled within an electronic device, such as device 4658 of fig. 60. The device 4658 may be, for example, a cellular telephone, a media player, a tablet or handheld computer, or the like. Within device 4658, structural interconnection elements such as flexible circuit cable 4640 may be used. For example, a pair of printed circuit boards may be interconnected using a flexible circuit cable, or a display may be connected to a printed circuit board and an integrated circuit on the printed circuit board using a flexible circuit cable. In the area of the device 4658 where the cable direction must be changed, the cable may be bent around the outer surface of the buffer. For example, as shown in fig. 60, the cable 4640 may be bent around the bumper outer surface 4632 of the bumper 4630 within the bend region 4642 of the cable 4640. The presence of the buffer 4630 may protect the cable from exposure to rough portions of the edge of the printed circuit board. The known shape of surface 4632 may help define the bend radius of the cable, and thus ensure that the cable length and location meet design criteria even when the stresses on the cable fluctuate due to manufacturing variations.

In a device such as the device 10 of fig. 1, challenges arise with respect to mounting a camera module and flash unit while dissipating heat and ensuring that the resulting device is aesthetically pleasing.

It is desirable to provide improved structures for mounting electronic components, such as camera and flash components, within electronic devices.

According to one embodiment, a camera and flash trim structure may be provided that helps align a camera module and a flash component with one another when the camera module and flash component are installed within an electronic device (e.g., device 10 of FIG. 1). The trim structure may be formed from a heat dissipating material, allowing the trim structure to act as an integrated heat sink.

According to one embodiment, an apparatus is provided that includes a heat sink structure, a camera module mounted on the heat sink structure, and a flash unit mounted on the heat sink structure.

According to another embodiment, an apparatus is provided wherein the heat sink structure comprises a first hole for light from the camera module to pass through and a second hole for light from the flash unit to pass through.

According to another embodiment, there is provided an apparatus further comprising a cover glass having a black ink layer with an opening through which light from the flash unit passes.

In accordance with another embodiment, an apparatus is provided wherein the flash unit includes a light emitting diode attached to a heat sink structure with an adhesive.

According to these embodiments, an electronic device, such as device 10 of FIG. 1, may be provided with a camera and flash. The camera may comprise a camera module. The camera module may include an image sensor chip containing an array of image pixels, a lens to focus an image on the image sensor, and a housing within which components such as the image sensor and lens are mounted. The flash unit may be based on light emitting diodes or other light sources.

The camera module and the flash unit may be mounted within a housing of the electronic device. An opening may be formed to allow light for the camera to enter the device and to allow light from the flash to exit the device. The camera module opening may sometimes be referred to as a camera window. The flash unit opening may sometimes be referred to as a flash window.

If desired, the display within the electronic device may have a cover glass layer formed from flat glass, plastic, or other suitable transparent member layer. A black ink layer or other opaque coating may be provided on the bottom surface of the cover glass in the inactive peripheral region of the display. This helps to shield the internal components of the electronic device from the user, thereby improving the aesthetics of the device. In the active part of the display (the area of the display containing the image pixels of the display), the cover glass is not covered with black ink. This allows the user to view the image on the display through the cover glass. For example, the cover glass may have a rectangular opening in the center that is aligned with a corresponding rectangular array of image pixels within the liquid crystal display. The camera window and flash window may be formed by openings in the black ink layer on the inner surface of the cover glass, or may be formed in the housing wall or other suitable portion of the electronic device.

The flash units of the camera modules may be mounted on a common trim (support) structure. The trim structure may be formed from a metal part or a part formed from other materials. These parts may be joined using welding or other fastening techniques to form a unitary trim structure. The trim structure may be formed, for example, of a metal sheet in which a trim opening for a camera is formed and a metal member in which a trim opening for a strobe unit is formed. By mounting and covering the camera module and the flash unit using the same trim structure, the relative spacing between the camera module and the flash unit can be well controlled. When the trim structure is installed in an electronic device, the trim opening for the camera may be aligned with the camera opening in the black ink on the cover glass and the trim opening for the flash unit may be aligned with the flash window in the black ink. In arrangements where the trim structure is formed of metal, the trim structure may act as an integrated heat sink that helps dissipate heat generated by the flash unit during operation.

Fig. 62 shows a cross-sectional side view of the trim structure to which the camera module and the flash unit have been mounted.

As shown in fig. 62, the trim structure 4820 may have a camera trim opening (such as opening 4840) and a flash unit trim opening (such as opening 4824). Camera module 4836 may be mounted on trim structure 4820 using adhesive 4838 or other suitable attachment mechanisms. When mounted, lens 4837 of camera module 4836 can be aligned with opening 4840 in trim structure 4820. In operation, image light 4842 enters the camera module through an opening 4840 in the trim structure 4820 and lens 4837.

The flash unit 4826 may be based on light emitting diodes or other electronic components that generate light 4844. The flash unit 4826 may be mounted on the trim structure 4820 using adhesives, screws, snaps, springs, or other fastening mechanisms. When mounted on the trim structure 4820, the flash unit 4826 may be aligned with the opening 4824 such that light 4844 passes through the opening 4824 (i.e., illuminates a photographic subject photographed using the camera module 4836).

The flexible circuit 4832 may contain conductive traces that form electrical interconnections for the flash unit 4826 and the camera module 4836.

Fig. 63 illustrates a top view of the trim structure 4820 of fig. 62. As shown in fig. 63, the openings 4840 and 4824 can have a circular shape if desired. The trim structure 4820 may be mounted within a recess or other alignment structure within the inner housing structure 4846 to help align the trim structure 4820, camera module 4836, and flash unit 4826 relative to the electronic device in which the trim structure 4820 is mounted, and thereby help align the camera module and flash relative to the camera and flash window within the cover glass.

Fig. 64 shows a cross-sectional side view of a portion of an electronic device with a trim structure 4820 mounted therein. As shown in fig. 64, trim structure 4820 may include a thin metal sheet such as sheet 4834 (which contains opening 4840 of fig. 65) and a thicker metal heat spreader structure such as structure 4822. Structure 4834 can be, for example, a flat stainless steel member having a thickness of about 0.1mm to 0.2 mm. The heat sink structure 4822 may be formed of a metal such as stainless steel. Heat sink structure 4822 may be connected to metal sheet 4834 using solder 4823 or other suitable attachment mechanism. Heat sink structure 4822 of trim 4820 may have an opening (trim opening 4824) aligned with lens 4818. The light emitted from the flash unit 4826 may be collimated using a lens 4818. The lens 4818 may be aligned with an opening 4825 in the black ink layer 4814 on the cover glass 4812. The lens 4818 may be attached to the cover glass 4812 using an optical adhesive 4816.

The flash unit 4826 may be mounted within a recessed portion of the heat sink structure 4822. The flash unit 4826 may be attached to the heat sink structure 4822 using an adhesive 4828 or other suitable attachment mechanism. The electrical energy for operating the flash unit 4826 can be delivered to the flash unit 4826 using traces on the flexible printed circuit 4832 that are coupled to power terminals 4830 on the flash unit 4826.

During operation of the flash unit 4826, heat may be generated, particularly when the flash unit 4826 is operated in a continuous ("torch") mode. The generated heat is dissipated through the heat sink structure 4822 and other metal structures of the trim structure 4840. The relatively large surface area of the metal sheet 4834 can help dissipate heat into the air surrounding the heat sink structure 4822. Since both portion 4834 and portion 4822 contribute to the heat dissipation quality of trim structure 4820, portions 4834 and 4822 are sometimes collectively referred to as a "heat sink" or "heat sink structure".

Integrated circuits and other electronic components are typically enclosed within a radio frequency shielded box. During operation, the electronic component generates heat. To ensure that the components do not overheat, a thermally conductive foam pad and thermally conductive grease may be placed between the upper surface of the electronic component and the inner surface of the shield can. A thermally conductive foam pad is compressed between the electronic component and the case. Heat generated within the component can flow through the compression pad and can be dissipated through the cartridge.

Conventional shielding arrangements such as these are sometimes acceptable when manufacturing tolerances are relatively loose. Where tolerances are tight and good thermal conductivity properties are required, an enhanced shielding structure may be required.

Accordingly, it would be desirable to provide improved techniques for packaging electronic components within a structure such as a radio frequency shielding box while providing satisfactory heat dissipation capabilities.

According to one embodiment, electronic components, such as radio frequency power amplifiers and other radio frequency integrated circuits, may be provided that are mounted on a substrate, such as a printed circuit board of an electronic device (e.g., device 10 of fig. 1). For example, the electronic components may be soldered to a rigid or flexible printed circuit board. The frame structure, which may also serve as an attachment point for subsequent radio frequency shield mounting, may also be soldered to the printed circuit board substrate.

The electronic components may have different shapes and sizes. As a result, the surfaces of electronic components and printed circuit boards may produce irregular surfaces due to components of various heights.

To ensure adequate heat dissipation, a conformal coating of thermally conductive filler (such as silicone filled with thermally conductive particles) may be deposited. The conformal coating can cover all exposed electronic components and can smoothly conform to irregular surfaces of the components.

A radio frequency shield (such as a metal radio frequency shield box) may be mounted on the electronic components to shield these components and prevent radio frequency interference. The radio frequency shield may be formed by attaching a radio frequency box cover to a frame structure mounted on the substrate.

The thermally conductive filler may be formed from one or more materials. For example, a given set of electronic components may be covered with a first material injection, and the remaining electronic components and the first injection may be covered with a second material injection. The thermally conductive filler may be dispensed in a liquid state and cured using heat or light. Once cured, the thermally conductive filler may solidify. The solidified filler may be elastic (e.g., an elastomeric material with a mixture of ceramic particles or other materials), or may be rigid. Since the filler completely fills the shield cavity, heat is rapidly dissipated from the electronic component to the shield cover. In the event rework or repair is required, the filler may be removed from the cavity. Battery-powered electronic devices may use shielding circuitry that includes a conformal thermally conductive filler.

This relates generally to packaging of electronic components and, more particularly, to packaging electronic components within a package, such as a radio frequency box, using thermally conductive materials.

According to one embodiment, a shielding circuit is provided that includes a substrate, a plurality of electronic components mounted on the substrate, a radio frequency shield attached to the substrate covering the plurality of electronic components, and a thermally conductive filler substantially filling the cavity, wherein the cavity is formed between an inner surface of the radio frequency shield and the electronic components and portions of the substrate.

According to another embodiment, a shielding circuit is provided, wherein the electronic components have surfaces of different heights on said substrate, which surfaces form surface irregularities, and wherein the thermally conductive filler conforms to said surface irregularities.

According to another embodiment, a shielding circuit is provided, wherein the substrate comprises a printed circuit board.

According to another embodiment, a shielding circuit is provided, wherein the electronic component comprises an integrated circuit.

In accordance with another embodiment, a shielding circuit is provided, wherein the electronic component comprises a radio frequency integrated circuit.

According to another embodiment, a shielding circuit is provided, wherein the electronic components comprise at least one radio frequency power amplifier.

According to another embodiment, a shielding circuit is provided, wherein the thermally conductive filler comprises silicone.

According to another embodiment, a shielding circuit is provided, wherein the thermally conductive filler comprises an elastomeric material containing ceramic particles.

According to another embodiment, a shielding circuit is provided, wherein the thermally conductive filler comprises an elastomeric material containing material particles.

In accordance with another embodiment, a shielding circuit is provided, wherein the radio frequency shield includes a metallic radio frequency shield box cover.

According to one embodiment, a method of forming a shielded circuit is provided that includes mounting a plurality of electronic components on an area of a substrate, conformally covering all of the electronic components and the area of the substrate with a thermally conductive filler, and surrounding the filler and conformally covered electronic components with a radio frequency shielding structure.

According to another embodiment, a method is provided wherein the radio frequency shielding structure comprises a lid, wherein a cavity area is defined between the lid and the electronic component and the area of the substrate, and wherein the thermally conductive filler substantially fills the entire cavity area.

According to another embodiment, a method is provided wherein surrounding the filler and conformally covering the electronic component includes dispensing the filler in liquid form.

According to another embodiment, a method is provided wherein surrounding the filler and conformally covering the electronic components includes solidifying the filler in liquid form that has been dispensed to produce a solid thermally conductive filler.

According to another embodiment, a method is provided wherein solidifying the filler includes solidifying at least two different types of thermally conductive material so as to form a solid thermally conductive filler.

According to one embodiment, an electronic device is provided that includes a housing having an interior, a battery in the interior, a plurality of radio frequency integrated circuits mounted on a substrate powered with the battery, a radio frequency shield mounted on the substrate and defining a cavity area, and a thermally conductive filler filling substantially the entire cavity area, the thermally conductive filler covering at least a portion of the substrate and conformally covering the radio frequency integrated circuits.

In accordance with another embodiment, an electronic device is provided wherein the radio frequency integrated circuit includes at least one radio frequency power amplifier.

According to another embodiment, an electronic device is provided, wherein the thermally conductive filler comprises silicone.

According to another embodiment, an electronic device is provided, wherein the thermally conductive filler comprises an elastic material.

According to another embodiment, an electronic device is provided, further comprising ceramic particles within the elastomeric material.

According to these embodiments, many electronic components may be provided to electronic devices such as computers, cellular telephones, media players, and other apparatuses. Electronic components used within electronic devices include integrated circuits (such as radio frequency power amplifiers, radio frequency transceivers, processors, audio and video circuits, memory chips, hard disk drives), discrete components (such as resistors, capacitors and inductors, communication circuits), and so forth. These electronic components are typically electrically and mechanically interconnected using printed circuit boards. Rigid printed circuit boards, such as those formed from fiberglass-filled epoxy and other rigid substrates, and flexible printed circuit boards ("flex circuits") formed from flexible polymer substrates, such as polyimide sheets, may be used.

In devices where radio frequency interference is a concern, radio frequency shielding is sometimes used to surround electronic components. For example, a conductive radio frequency shield box may cover components that are sensitive to external radio frequency signals or that emit radio frequency signals that may interfere with other components mounted on the printed circuit board.

The presence of the shielding box may help mitigate radio frequency interference, but may trap air. The trapped air may in turn act as a thermal insulator. This may make it difficult to properly remove heat from the electronic components within the shielded box. Thermally conductive foams are sometimes used in conventional shielding boxes to aid in heat dissipation. However, such methods may not meet the conditions of tight mechanical and thermal tolerances.

To enhance thermal performance, particularly within a component package that may contain radio frequency shielding, one or more layers of conformal thermally conductive material may be formed over electrical components within the package. Such methods may be used for radio frequency shielding structures within electronic equipment such as computers, cellular telephones, media players, and other electronic devices.

Fig. 65 shows a cross-sectional side view of an illustrative electronic device that may incorporate a radio frequency shielding structure with a conformal layer of thermally conductive material. The electronic device of FIG. 65 may be, for example, a cellular telephone, a portable or desktop computer, a gaming device, a navigation device, a tablet computer, a wrist watch or pendant, a media player, an embedded appliance in a home or other environment, or any other suitable electronic appliance. As shown in fig. 65, the electronic device 10 may have a housing such as the housing 5012. The housing 5012 can be formed of one or more different materials, such as plastic, metal, ceramic, glass, and the like. For example, the housing 5012 can be formed from metal and plastic internal frame members that are covered with a plastic or metal shell having relatively thin housing walls. As another example, the housing 5012 can be formed from one or more relatively large pieces of material (e.g., one or two mating machined metal housing structures, one or two molded or machined plastic structures, etc.). Combinations of these arrangements may also be used.

A display, such as a touch screen display (e.g., display 5024), may be mounted on one surface of the housing 5012 (e.g., below an opening in an upper planar surface of the housing 5012). The device 10 may also contain buttons, microphone and speaker ports, input and output connectors for data ports and other signals, and other user interfaces and input-output circuitry. The processing and storage circuitry within device 10 may be based on memory chips, hard drives, volatile and non-volatile memory, microcontrollers, microprocessors, custom processors, application specific integrated circuits, etc. In the example of fig. 65, electronic components such as these are shown as components 5014, 5020, and 5024.

Components 5014, 5020, and 5024 can include integrated circuits, discrete components (e.g., resistors, capacitors, inductors, separate transistors, separate switches and buttons), antennas, batteries, components packaged using Surface Mount Technology (SMT) packaging, and the like. These components may be interconnected using printed circuit board traces, coaxial cables and other transmission lines, wires, flex circuit busses, and other conductive paths (as shown by path 5023 in fig. 65). During operation, an external power source or an internal battery (e.g., a battery within one of the components 5014) can be used to power the electrical components 5014, 5020, and 5024.

Active components tend to generate heat. For example, radio frequency components such as power amplifiers and other integrated circuits may be hot to the touch. Unless noted, excessive heat may adversely affect performance.

Certain components of the radio frequency shielding isolation device 10 may be used. In the example of fig. 65, the radio frequency shield structure 5016 may be formed by placing a radio frequency shield (metal box 5022) over the component 5020 on the printed circuit board 5018. The printed circuit board 5018 can include a conductive ground plate on its rear surface that acts as a radio frequency shield for the bottom surface of the structure 5016. The metal box 5022 can act as a radio frequency shield for the top surface of the structure 5016.

The components 5020 may include, for example, radio frequency components such as radio frequency transceiver circuitry, radio frequency power amplifiers, or other circuitry that generates and/or is sensitive to radio frequency shielding. The radio frequency shielding structure 5016 (e.g., the metal box 5022) helps prevent radio frequency signals within the structure 5016 from adversely affecting the electronic components within the device 10 and helps prevent radio frequency interference from adversely affecting the operation of the components 5020 within the radio frequency shielding structure 5016.

To remove excess heat from the component 5020, the component 5020 can be covered with one or more layers of conformal thermally conductive material. The thermally conductive material can substantially fill the entire interior portion (i.e., the entire area 5025 in fig. 65) of the structure 5016. Conformal thermally conductive materials may remove heat more efficiently and may be more suitable for manufacturing with tight tolerances than conventional radio frequency shielding boxes.

Figure 66 shows a cross-sectional side view of a conventional radio frequency shield arrangement. As shown in fig. 66, a radio frequency shielding structure 5035 comprises a rigid printed circuit board substrate 5030 on which electronic components such as an integrated circuit 5032 and other electronic components 5034 are mounted. The electronic components 5032 may be covered with a thermally conductive foam 5036. Thermally conductive grease may also be used. The foam 5036 is compressed between the inner surface 5039 of the metal rf cassette 5026 and the upper surface 5041 of the corresponding component when the cassette 5026 is mounted on the frame 5028. In this configuration, heat generated by the component 5032 can be transferred through the foam 5036 to the radio frequency shield can 5026. The remainder of the interior of the structure 5035, such as the region 5038, is typically filled with air. Air has insulative properties such that the presence of air within the structure 5035 slows heat removal. Filling the gap between the component 5032 and the box inner surface 5039 with multiple foam pads 5036 may also have thickness tolerance requirements for the foam pads 5036 that are difficult to meet in a production environment.

A cross-sectional side view of an illustrative radio frequency shielding structure of the type that may be used as the structure 5016 of fig. 65 is shown in fig. 67. As shown in fig. 67, the radio frequency shielding structure 5016 can include a radio frequency shield, such as a radio frequency shield can 5022, or other radio frequency shielding or packaging structure. The component 5020 can be mounted on a substrate 5018. The components 5020 on the substrate 5018 can be encapsulated within the structure 5016 using the structure 5022.

The arrangement where the structure 5022 is a radio frequency shielding box (or a cover for such a box) is sometimes described herein as an example. The substrate 5018 and the component 5020 can be encapsulated within other shielding or encapsulation structures, if desired. For example, the radio frequency shield may be formed from mating upper and lower shield structures that are attached together to form a box. The radio frequency signals may also be blocked by one or more metal flooring layers within the substrate 5018. An illustrative arrangement that includes a single cartridge, such as cartridge 5022, and uses a ground structure within the substrate 5018 to provide under-surface shielding is sometimes described herein as an example. In general, any suitable radio frequency shielding structure or other packaging structure may be used to package the components 5020. The arrangement of fig. 68 is merely an example.

The substrate 5018 can be formed of a rigid printed circuit material such as a glass-filled epoxy, a flexible printed circuit ("flex circuit") material such as polyimide or other thin polymer sheet, glass, plastic, ceramic, or other suitable substrate material. Conductive traces or other signal interconnect lines can be formed within the substrate 5018 and on the substrate 5018. The component 5020 can be mounted on the substrate 5018 using solder (e.g., solder bumps in a flip-chip mounting structure), snaps, springs, connectors, or other suitable attachment mechanisms.

Structures 5040 may be attached to a surface of the substrate 5018 to facilitate the mounting of the shield cartridge 5022. The structure 5040 may be, for example, a metal frame structure having a detent or other engagement feature such as a detent 5044 into which a mating protrusion (such as protrusion 5042) of a radio frequency shield cartridge 5022 or other radio frequency shielding structure may be fitted. The structure 5040 may be attached to the substrate 5046 using solder (e.g., solder 5056 of fig. 68), adhesive, screws, or other fasteners or other suitable mounting arrangements.

An optional layer of thermally conductive grease, such as thermally conductive grease 5050, may be used to cover the surface of substrate 5018, as well as electronic components, such as components 5020 and 5048, mounted on substrate 5018.

One or more layers of thermally conductive material may be formed on the components 5020 and 5048. Such thermally conductive material may substantially fill the entire interior of the rf shield cartridge 5022 (i.e., the interior of the rf shield structure 5016). Good thermal conductivity can be maintained by using a moldable material that is at least initially soft and sufficiently compliant to smoothly conform to the uneven contours of the upper and sidewall surfaces of the components 5020 and 5048. The use of thermally conductive materials that conform to the non-uniform height and shape of the components 5020 and 5048 may also facilitate meeting tight tolerances in the manufacturing process. For example, with conventional arrangements of the type shown in fig. 66, differences in the properties of the foam 5036 can result in non-uniformities within the structure 5035. This source of non-uniformity within the radio frequency shield may be reduced or eliminated by using one or more layers of thermally conductive material that conforms to the shape of the components 5020 and 5048.

Any suitable number of layers of thermally conductive material can be used to cover components 5020 and 5048. For example, a single layer of material may be used. If desired, two layers of material having different properties may be used, or three or more layers of different materials may be used, so as to substantially fill the entire cavity under the shield cartridge 5022. In the example of fig. 67, two different thermally conductive materials are present in the cavity below the cartridge 5022, in addition to the optional thermally conductive grease layer 5050. The thermally conductive structure 5054 may be formed from a first thermally conductive material. The thermally conductive structures 5052 may be formed from a second material that is different from the material of the structures 5054.

The materials used for layer 5050, structure 5054, and structure 5052 may help form a thermal conduction path between components 5020 and 5048 and the radio frequency shield can 5022. The cartridge 5022 can be surrounded by air or other suitable medium and can dissipate heat into the environment. By ensuring good heat conduction within the interior of structure 5016, components 5020 and 5048 can be satisfactorily cooled.

Structures such as 5054 of structure 5052 may be formed from materials that are sufficiently malleable so as to conform to the surface shape of components 5020 and 5048. The thermally conductive material used to fill the cavity under the shield 5022 may sometimes be referred to herein as a filler or a thermally conductive filler. One or more different materials may be used as conformal filler. With one suitable arrangement, the filler may be formed from a material that is initially in a fluid state and solidifies after curing. In its fluid state, the filling may be a flowable liquid, or may be more viscous. For example, the filler may be implemented using a thick paste, or may be implemented using a material having a medium viscosity. Curing may be performed by heating, by waiting a sufficient amount of time at room temperature (chemical curing), by applying ultraviolet or other light, or using other suitable curing techniques. Once solidified, the filler may transition from a relatively soft or flowing fluid state to a more viscous fluid or soft or hard solid.

The filler may comprise one or more materials that act as dielectrics (insulators). For example, a layer of dielectric can be included as a primer layer (e.g., on a layer of thermally conductive grease) to ensure that the input-output pins on components 5020 and 5048, as well as the exposed traces on substrate 5018, are not electrically shorted. Subsequent layers may be conductive or may be insulating. For example, subsequent layers may contain a mixture of dielectric and conductive particles with limited conductivity or insulation.

In order to ensure sufficient thermal conductivity, in particular when the filler is insulating (or at least exhibits low electrical conductivity), the filler may be formed from a mixture of materials. For example, the filler may be formed of a dielectric binder material in which particles having high thermal conductivity are embedded. The particles may be formed of metal, nanostructures, fibers, or other suitable structures or materials. The binder may be a resin, an elastic polymer, or the like.

Examples of materials that can be used as fillers include epoxies (e.g., uv-cured epoxies, two-part epoxies, thermal cured epoxies, etc.), elastomeric (rubber-like) polymers (such as silicones), thermoplastics, ceramics, glass, metal compounds, polyimidesAmines, and the like. By way of example, the filler may be formed from silicone that incorporates metal particles, alumina silicate or other ceramic particles, or other materials to enhance thermal conductivity. The thermal conductivity of the filler may be, for example, greater than 10³W/m²℃、10⁴W/m²℃、10⁵W/m²DEG C and the like.

To facilitate rework, it may be desirable to select a filler material that may be removed from the components 5020 and 5048 without damaging the components 5020 and 5048. For example, consider forming a conformal thermally conductive structure on components 5020 and 5048 using metal-filled or ceramic-filled silicone. Initially, a layer of fluid silicone may be disposed on the components 5020 and 5048. After curing, the silicone forms a solid elastomeric layer on the components 5020 and 5048. If rework or repair is needed, the technician may peel the silicone layer from the surfaces of components 5020 and 5048. The use of a layer of thermally conductive grease (such as grease 5050) may facilitate the removal of silicone structures from the surfaces of components 5020 and 5048. The thermally conductive grease 5050 may be formed from ceramic-based materials, metal-based materials, or mixtures based on carbon powder or carbon fibers, or other suitable materials, the thermally conductive grease 5050 also sometimes being referred to as a thermally conductive paste or heat dissipating compound.

Where more or less thermal conductivity is required for a particular portion, it may be desirable to form the thermally conductive structure from different types of materials. For example, if component 5048 of fig. 67 generates a relatively large amount of heat, structure 5054 may be formed from a material having a higher thermal conductivity than material 5052 in order to facilitate heat dissipation.

The thermally conductive structures may also be formed from materials having different physical properties (e.g., different elasticity, different stiffness, etc.). As an example, if components 5020 have complex or delicate surface features, it may be desirable to cover these components with a softer and more resilient material (e.g., material 5052) than other filler materials (e.g., material 5054).

Fig. 68 shows an illustrative arrangement that may be used for the radio frequency shielding structure 5016, in which the components 5020 and 5048 are covered using a thermally conductive base layer (layer 5058). The base layer may then be covered with a cover layer, such as layer 5052. Layer 5058 may be formed from a material having one set of properties (i.e., sufficient elasticity to be satisfactorily removed from components 5020 and 5048 during rework while exhibiting average or sub-average thermal conductivity and excellent electrical insulation), while layer 5052 may be formed from a material having a different set of properties (i.e., excellent thermal conductivity). Three or more layers of material may also be used to form a conformal thermally conductive structure (e.g., three or more "shots" of silicone or other polymer or material).

Illustrative tools and techniques for forming a radio frequency shielding structure with conformal thermally conductive filler are shown in fig. 69, 70, and 71.

In fig. 69, a structure 5016 in an early stage of processing is shown. A component mounting tool, such as a printed circuit board mounting tool 5060, is used to mount a component 5020 on the printed circuit board 5018. The component mounting tool 5060 of fig. 69 may have an actuator that moves the mounting head 5062 in the lateral directions 5060 and 5064 and the vertical direction 5068. The mounting tool 5060 can use solder, conductive adhesive, fasteners, connectors, or other suitable arrangements to electrically and mechanically connect the electrical component 5020 to the surface of the printed circuit board 5018. As shown in fig. 69, the tool 5060 may also mount a structure such as structure 5042 (e.g., as a frame that houses a mating structure such as a radio frequency shield cartridge 5022) on the printed circuit board 5018.

After the component 5020 has been mounted on the printed circuit board 5018, as shown in fig. 70, a filler covering component 5020 and the printed circuit board 5018 may be used. One or more filler materials may be dispensed using a filler dispensing tool 5070. Tool 5070 may dispense filler material on printed circuit board 5018 using injection molding techniques, sputtering, drop casting, dipping, or other suitable techniques. As shown in fig. 70, substantially the entire surface of the plate 5018 and the components on the plate 5018 are covered with a filler 5052. The filler may be dispensed using one or more different materials (e.g., in one or more injections).

Optional thermal and photo-curing operations may be performed after each different material is deposited or after two or more materials are deposited. For example, a thermal curing operation may be performed after each deposition of the filler material (as an example). One or more layers of thermally conductive grease may also be deposited.

As shown in fig. 71, a heat curing operation may be performed using a heating and molding tool, such as tool 5072. In particular, the filler may be heated using a heating element in the tool 5072 thereby thermally curing the filler. A tool 5072 may also be used to attach the radio frequency shield cap 5022 to the frame member 5042 (e.g., by press fitting the cap 5022 onto the frame member 5042). For example, the tool 5072 may have an upper portion and a lower portion. When the upper portion is moved in direction 5074 and the lower portion is moved in direction 5076, the radio frequency shield 5022 can be pressed against the frame structure 5042. The filler may also be compressed within a cavity formed within the radio frequency shielding structure under the shielding cap (cassette) 5022. This compression of the filler can help remove air pockets, thereby ensuring that the filler conforms to the components 5020 within the shield 5022 and the entire exposed surface of the printed circuit board 5018. If desired, the use of a compression molding tool (such as tool 507) may be concurrent with the filler dispensing tool 5070 of FIG. 70 (e.g., compressing the filler as it is being injected into the shielded cavity or just after it is injected).

Fig. 72 shows illustrative steps involved in forming a radio frequency shielding structure, such as structure 5016, including a thermally conductive conformal filler.

At step 5080, electronic components, such as integrated circuits and discrete components, may be mounted on the substrate. The substrate may be, for example, a printed circuit board substrate. A frame member or other mounting structure may also be mounted on the substrate to facilitate subsequent attachment of the rf shield can.

At step 5082, one or more fillers may be formed on the substrate. The filler may be formed of a thermally conductive dielectric and other materials that conduct heat. If desired, at least one of the filler layers may be electrically insulating (e.g., the lowermost layer, such as layer 5058 of fig. 68) to help prevent inadvertent shorting between electrical conductors within the completed package. An optional curing operation may be performed by exposing the workpiece to light and/or heat as each different filler material is deposited.

At step 5084, a radio frequency shield 5022 (e.g., a metal box cover) can be attached to the frame 5042 (fig. 71) or other suitable radio frequency shielding structures (e.g., a two-piece shield) can be formed around the substrate 5018 and the components and filler.

At step 5086, optional heating and compression may be applied to the workpiece to ensure that the filler conforms to substantially all exposed surfaces of the interior of the shield and to ensure that the filler cures and solidifies.

At step 5088, an optional rework or repair operation may be performed by removing the filler. For example, when the filler is formed from an elastomeric material, a technician may strip off all of the cured elastomeric filler to expose the underlying electronic components and circuit board for repair. Once the repair is complete, as shown by line 5090, the operation may return to step 5082.

The foregoing is merely illustrative of the principles of this invention and various modifications can be made by those skilled in the art without departing from the scope and spirit of the invention.

Claims (5)

1. An electronic device, comprising:

a first printed circuit board;

a second printed circuit board;

a printed circuit board connector having mating first and second portions, wherein the first portion is connected to the first printed circuit board, and wherein the second portion is connected to the second printed circuit board; and

a shroud disposed on the printed circuit board connector that helps to hold the first and second portions of the printed circuit board connector together.

2. The electronic device defined in claim 1 wherein the second printed circuit board comprises a flexible circuit.

3. The electronic device of claim 1, further comprising:

a foam interposed between the cover and a printed circuit board connector, wherein the cover has a base portion connected to the first printed circuit board, vertical sidewall portions, and a flat upper portion, and wherein the flat upper portion compresses the foam toward the printed circuit board connector.

4. The electronic device defined in claim 3 further comprising a stiffener between the foam and the printed circuit board connector, wherein the second printed circuit board comprises a flexible circuit.

5. The electronic device defined in claim 3 further comprising circuitry that is electrically connected to the cover, wherein the cover is formed of metal and has a recess that receives at least a portion of the foam.