HK1142455A - An integrate circuit - Google Patents

Description

Integrated circuit

Technical Field

The invention relates to the field of wireless communication, in particular to an integrated circuit supporting wireless communication.

Background

Communication systems are known to support wireless communication systems and wired communication systems between wireless and/or wired communication devices. Such communication systems range in coverage from national and/or international cellular telephone systems, to the internet, to point-to-point indoor wireless networks, to Radio Frequency Identification (RFID) systems. Each type of communication system is constructed and operates in accordance with an associated one or more communication standards, including, for example and without limitation: radio Frequency Identification (RFID), IEEE802.11, Bluetooth (Bluetooth), Advanced Mobile Phone Service (AMPS), digital AMPS, global system for mobile communications (GSM), Code Division Multiple Access (CDMA), local multipoint transmission system (LMDS), multi-channel multipoint distribution system (MMDS), and/or improvements to the above standards. Depending on the type of wireless communication system, wireless communication devices such as cellular phones, walkie talkies, Personal Digital Assistants (PDAs), Personal Computers (PCs), notebook computers, home entertainment devices, RFID readers, RFID tags, and the like, communicate directly or indirectly with other wireless communication devices. In the case of direct wireless communication (also known as point-to-point communication), the communicating wireless devices tune their receivers and transmitters to the same channel or channels (e.g., one of multiple radio frequency carriers in a wireless communication system) and communicate on the same channel(s). For indirect wireless communication, each wireless communication device may communicate directly with an associated base station (e.g., for cellular communication) and/or an associated access point (e.g., for an indoor or in-building wireless network) over an assigned channel. To establish a communication connection between wireless communication devices, the associated base stations and/or associated access points communicate directly through a system controller, the public switched telephone network, the internet, and/or some other wide area network.

Each wireless communication device participating in wireless communication consists of a built-in wireless transceiver (e.g., receiver and transmitter) or an externally associated wireless transceiver (e.g., a base station or RF modem for an indoor and/or in-building wireless communication network). As is well known, the receiver is connected to an antenna and comprises a low noise amplifier, one or more intermediate frequency stages, a filtering stage and a data recovery stage. The low noise amplifier receives an inbound radio frequency signal through the antenna and then amplifies it. One or more intermediate frequency stages mix the amplified RF signal into one or more local oscillations and convert the amplified radio frequency signal to a baseband signal or to an Intermediate Frequency (IF) signal. The filtering stage filters the baseband signal or the IF signal to attenuate spurious signals in the baseband signal and generate a filtered signal. The data recovery stage recovers the original data from the filtered signal in accordance with a particular wireless communication standard.

As is well known, a transmitter includes a data modulation stage, one or more intermediate frequency stages and a power amplifier. The data modulation stage converts the raw data to a baseband signal according to a particular wireless communication standard. One or more intermediate frequency stages mix the baseband signal into one or more local oscillations to generate an RF signal. The power amplifier amplifies the radio frequency signal and then transmits the radio frequency signal through the antenna.

Currently, wireless communications are conducted over licensed and unlicensed spectrum (licensed and unlicensed spectrum). For example, Wireless Local Area Networks (WLANs) occur in the Industrial Scientific Medical (ISM) spectrum with the frequency spectrums 900MHz, 2.4GHz, and 5GHz, however, the ISM spectrum, while unlicensed, has limitations on power, modulation techniques, and antennas. Another example of an unlicensed spectrum is the vband with a spectrum of 55-64 GHz.

Since the wireless part of wireless communication starts and ends at the antenna, designing an appropriate antenna structure is an important component in the wireless communication device. As is well known, antenna structures are designed to have a desired impedance at the operating frequency (e.g., 50Ohm), a desired bandwidth centered at the desired operating frequency, and a desired length (e.g., 1/4 wavelengths at the monopole operating frequency). Further known antenna configurations may include monopole or dipole antennas, diversity antenna configurations, co-polarized antennas, hetero-polarized antennas, and/or other numbers of electromagnetic properties.

One common antenna structure used in RF transceivers is a three-dimensional in-air helix antenna (three-dimensional) that is similar to a spring in tension. The aerial helical antenna provides a magnetic omni-directional (monopole) antenna. Other kinds of three-dimensional antennas include aperture antennas in the shape of a rectangle, a horn, etc., three-dimensional dipole antennas in the shape of a cone, a cylinder, an ellipse, etc., and reflector antennas in the shape of a plane radiator, a horn radiator, or a paraboloid radiator. However, there is a problem in that they cannot be sufficiently implemented in a two-dimensional space of an Integrated Circuit (IC) and/or a Printed Circuit Board (PCB) supporting the IC.

Two-dimensional antennas include meander patterns (microstrip configurations). For the antenna to operate effectively, the length of the monopole antenna should be 1/4 wavelengths and the length of the dipole antenna should be 1/2 wavelengths, where the wavelength (λ) is c/f, where c is the speed of light and f is the frequency. For example, an 1/4 wavelength antenna has a total length of about 8.3 centimeters (i.e., 0.25 x (3 x 10) at 900MHz⁸m/s)/(900*10⁶c/s) ═ 0.25 × 33cm, where m/s is meters per second and c/s is the period per second). As another example, an 1/4 wave antenna may have a total length of about 3.1 cm (e.g., 0.25 x (3 x 10) at 2400MHz⁸m/s)/(2.4*10⁹c/s) ═ 0.25 × 12.5cm), it is not possible to integrate it on a chip due to the antenna size, since then a relatively complex IC with millions of transistors will have dimensions of 2 to 20 mm by 2 to 20 mm.

As IC fabrication technology continues to advance, ICs are provided with an increasing number of transistors, but are becoming smaller and smaller in size. While this development has allowed electronic devices to reduce their size, design challenges arise that involve providing signals, data, clock signals, operating instructions, etc. to or from multiple ICs of the device. This is currently addressed by the development of IC packages and multi-layer PCBs, for example, which may include a ball grid array (ball grid array) with 100-200 pins over a small space (e.g., (2-20) mm x (2-20) mm), including a trace portion (trace) for each pin of the IC to route it to at least one other component on the PCB. Clearly, the development of inter-IC communication requires improvements that adequately support the advent of IC manufacturing. Accordingly, there is a need for an integrated circuit antenna structure and wireless communication applications thereof.

Disclosure of Invention

An apparatus and method of operation substantially as shown in and/or described in connection with at least one of the figures, as set forth more completely in the claims.

According to one aspect, an integrated circuit comprises:

a circuit module;

a millimeter wave (MMW) front end; and

a connection module coupled to the circuit module and the MMW front end, the connection module comprising:

a first frequency-dependent impedance module;

a second frequency-dependent impedance module;

a first trace portion (trace section) coupled between the first and second frequency-dependent impedance blocks, wherein the first trace portion is to provide an antenna segment for an MMW front end; and

a second trace section coupled between the second frequency-dependent impedance module and the circuit module, wherein a series combination between the first and second frequency-dependent impedance modules and the first and second trace sections provides a connection to the circuit module.

Preferably, the integrated circuit further comprises:

the chip, wherein, circuit module, MMW front end, connection module are realized on the chip.

Preferably, the integrated circuit further comprises:

a chip, wherein a circuit module and an MMW front end are implemented on the chip; and a package substrate for supporting the chip, wherein a portion of the connection module is implemented on the package substrate and the remaining portion thereof is implemented on the chip.

Preferably, the integrated circuit further comprises:

a second circuit module, wherein the connection module couples the circuit module to the second circuit module.

Preferably, the circuit module may receive or transmit a data signal through the connection module.

Preferably, the circuit module is connected with a power supply or a power supply loop through the connection module.

Preferably, the integrated circuit further comprises:

a third frequency variable impedance module; and

a third trace portion coupled between the first and third frequency variable impedance modules, wherein the third trace portion is to provide a second antenna segment for the MMW front end, wherein the antenna segment and the second antenna segment form a dipole antenna.

Preferably, the first and second frequency-dependent impedance modules comprise at least one of:

an inductance;

an inductor and a capacitor;

an inductor and an inductor-capacitor tank circuit; and

an inductor and a low pass filter.

Preferably, the integrated circuit further comprises:

a ground plane proximate the first trace portion such that the first trace portion provides a monopole antenna for the MMW.

According to another aspect of the invention, the Integrated Circuit (IC) comprises:

a circuit module;

a millimeter wave (MMW) front end;

a first connection module comprising:

a first frequency-dependent impedance module;

a second frequency-dependent impedance module;

a first trace portion coupled between a first frequency-dependent impedance module and a second frequency-dependent impedance module, wherein the first trace portion provides an antenna segment for an MMW front end; and

a second trace portion coupled between the second frequency-dependent impedance module and the circuit module, wherein a series combination between the first and second frequency-dependent impedance modules and the first and second trace portions provides a first connection to the circuit module; and

a second connection module comprising:

a third frequency variable impedance module;

a fourth frequency-dependent impedance module;

a third trace portion coupled between the third frequency-varying impedance module and the fourth frequency-varying impedance module, the third trace portion to provide a second antenna segment for the MMW front end; and

coupling a fourth trace portion between a fourth frequency-dependent impedance module and a circuit module, wherein a series combination between the third and fourth frequency-dependent impedance modules and the third and fourth trace portions provides a second connection to the circuit module; and

a high frequency connection module coupled to the first trace portion and the third trace portion such that the first antenna segment and the second antenna segment are operatively connected together in a frequency range corresponding to an operating frequency range of the MMW front end.

。

Preferably, the high frequency connection module comprises a series inductor-capacitor tank circuit.

Preferably, the integrated circuit further comprises: a third connection module, the third connection module comprising:

a fifth frequency conversion impedance module;

a sixth frequency-variable impedance module;

a fifth trace portion coupled between the fifth frequency-dependent impedance module and a sixth frequency-dependent impedance module, the fifth trace portion to provide a third antenna segment for the MMW front end; and

a sixth trace portion coupled between the sixth frequency-dependent impedance module and a circuit module, wherein a series combination between the fifth and sixth frequency-dependent impedance modules and the fifth and sixth trace portions provides a third connection to the circuit module; and

a high frequency connection module coupled to the third and fifth trace portions such that the first, second and third antenna sections are operatively connected together in a frequency range corresponding to an operating frequency range of the MMW front end.

Preferably, the integrated circuit further comprises:

an antenna coupling circuit, comprising:

a transmission line coupling the first and third antenna segments; and

a transformer coupled to the transmission line.

Preferably, the antenna connection circuit further includes:

an impedance matching circuit coupled to the transformer.

According to a third aspect of the invention, an integrated circuit comprises:

a plurality of frequency-dependent impedance modules; and

a plurality of trace portions, wherein a first trace portion of the plurality of trace portions is coupled between a first frequency-dependent impedance block and a second frequency-dependent impedance block of the plurality of frequency-dependent impedance blocks, wherein the first trace portion provides an antenna segment; and is

Wherein a second trace portion of the plurality of trace portions is coupled to a second frequency-dependent impedance module connection, wherein the series combination of the first and second frequency-dependent impedance modules and the first and second trace portions provide the connection.

Preferably, the integrated circuit further comprises:

a third trace portion of the plurality of trace portions is coupled between a second frequency-dependent impedance module and a third frequency-dependent impedance module of the plurality of frequency-dependent impedance modules, wherein the third trace portion provides a second antenna segment; and

a fourth trace portion of the plurality of trace portions is coupled to a third variable impedance module, wherein the first, second, and third variable impedance modules and the series combination between the first, second, third, and fourth trace portions provide the connection.

Preferably, the integrated circuit further comprises:

a third trace portion of the plurality of trace portions is coupled between a third frequency-variable impedance block and a fourth frequency-variable impedance block of the plurality of frequency-variable impedance blocks, the third trace portion providing a second antenna segment; and

a fourth trace portion of the plurality of trace portions connects a fourth frequency-dependent impedance module, wherein a series combination between the third and fourth frequency-dependent impedance modules and the third and fourth trace portions provides a second connection.

Preferably, the integrated circuit further comprises:

a high frequency connection module coupling the antenna segment to the second antenna segment.

Various advantages, aspects and novel features of the invention, as well as details of an illustrated embodiment thereof, will be more fully described with reference to the following description and drawings.

Drawings

The invention will be further described with reference to the accompanying drawings and examples, in which:

FIG. 1 is a block diagram of an embodiment of an integrated circuit according to the present invention;

FIG. 2 is a block diagram of another embodiment of an integrated circuit according to the present invention;

FIG. 3 is a block diagram of another embodiment of an integrated circuit according to the present invention;

FIG. 4 is a block diagram of another embodiment of an integrated circuit according to the present invention;

FIG. 5 is a block diagram of another embodiment of an integrated circuit according to the present invention;

FIG. 6 is a block diagram of an embodiment of a connection module and an embodiment of an MMW front end in accordance with the present invention;

FIG. 7 is a block diagram of another embodiment of a connection module and another embodiment of an MMW front end in accordance with the present invention;

FIG. 8 is a block diagram of another embodiment of a connection module connected to a MMW front end and a circuit module in accordance with the present invention;

FIG. 9 is a block diagram of another embodiment of a connection module connecting an MMW front end and two circuit modules in accordance with the present invention;

FIG. 10 is a block diagram of another embodiment of a connection module connecting an MMW front end and two circuit modules in accordance with the present invention;

FIG. 11 is a block diagram of another embodiment of a connection module connecting an MMW front end and a circuit module in accordance with the present invention;

FIG. 12 is a block diagram of another embodiment of an integrated circuit according to the present invention;

FIG. 13 is a block diagram of another embodiment of an integrated circuit according to the present invention;

FIG. 14 is a block diagram of another embodiment of an integrated circuit according to the present invention;

FIG. 15 is a block diagram of an embodiment of two connection modules and an embodiment of a high frequency connection module according to the present invention;

FIG. 16 is a block diagram of an embodiment of a connection module connecting the MMW front end in accordance with the present invention;

FIG. 17 is a block diagram of another embodiment of a connection module connecting the MMW front end in accordance with the present invention;

FIG. 18 is a block diagram of another embodiment of a connection module connecting the MMW front end in accordance with the present invention.

Detailed Description

Fig. 1 is a block diagram of an embodiment of an Integrated Circuit (IC)10 including a circuit module 12, a microwave-wave (MMW) front-end 14, and a connection module 15. The connection module 15 includes a first frequency dependent impedance module 16, a second frequency dependent impedance module 18, a first trace portion 20 and a second trace portion 22, and the integrated circuit 10 may be fabricated using a variety of IC fabrication techniques with many metal layers including, but not limited to, CMOS (complementary metal oxide semiconductor), bi-CMOS, gallium arsenide, silicon germanium, and the like.

In this embodiment, the first trace portion 20 (e.g., metal traces on one or more metal layers of the IC 10) provides an antenna segment (antenna segment) for the MMW front end 14, and in addition, the series combination between the first and second frequency-dependent impedance blocks 16, 18 and the first and second trace portions 20, 22 allows them to be connected to the circuit block 12. To achieve this, the first and second frequency-dependent impedance modules 16, 18 contain high frequency signals (e.g., MMW (3GHz-300GHz) frequency inbound and/or outbound signals received and/or transmitted by the MMW front-end 14) therebetween and may be made nearly unattenuated by passing low frequency signals (e.g., data signals transmitted or received by the circuit module 12 or power lines).

As shown with reference to the embodiment of the frequency table shown in FIG. 1, it is assumed that the circuit block 12 is a memory block, digital circuit, analog circuit, logic circuit, processing block, or any other type of circuit capable of receiving and/or transmitting signals through the connection block 15. it is further assumed that the signals have a frequency between 100KHz and 1GHz and that the MMW front-end 14 transmits and/or receives signals in the 60GHz band.

As another example, assume that connection module 15 provides power supply and/or power return connections for circuit module 12. In the frequency table shown in fig. 1, the power supply frequency is lower than the data frequency, so that the impedance values of the first and second frequency-dependent impedance modules 16, 18 are low and have almost no effect on the power supply of the circuit module 12, and the MMW front-end can also be provided with an IC antenna section. It should be noted that the antenna segments may be implemented as a meander antenna, monopole antenna, whip antenna, and/or other types of microwave antennas at 1/2 wavelengths or 1/4 wavelengths. Further to note are: the antenna segments may be used to connect other antenna segments to form new antennas (e.g., dipole antennas, helical antennas, etc.) and/or used with other antenna segments to form antenna arrays.

Fig. 2 is a block diagram of a second embodiment of the integrated circuit 10, the integrated circuit 10 including a chip 24 and a package substrate 26. In this embodiment, the chip 24 is used to support the circuit module 12, the MMW front end 14, the first and second frequency-dependent impedance modules 16, 18, and the first and second trace portions 20, 22. The package substrate 26 is used to support the chip 24. In one example, the chip may be fabricated using Complementary Metal Oxide Semiconductor (CMOS) technology and the package substrate may be a Printed Circuit Board (PCB). In another example, the chip 24 may be fabricated using gallium arsenide technology, silicon germanium technology, bipolar technology, bi-CMOS technology, and/or other types of IC fabrication technology, and the package substrate may be a Printed Circuit Board (PCB), a fiberglass board, a plastic board, and/or some other sheet of non-conductive material. It is noted that the package substrate may support the structure of the chip 24 and does not include trace portions.

Fig. 3 is a block diagram of another embodiment of integrated circuit 10, integrated circuit 10 including a chip 24 and a package substrate 26. In this embodiment, the chip 24 is used to support the circuit module 12, the MMW front end 14, and the second trace portion 22. The package substrate 26 is used to support the chip 24, the first and second frequency-dependent impedance modules 16, 18, and the first trace portion 20.

Fig. 4 is a block diagram of another embodiment of an integrated circuit 10, the integrated circuit 10 including a circuit module 12, an MMW front end 14, a connection module 15, and a second circuit module 30. The connection module 15 includes first and second frequency-dependent impedance modules 16, 18 and first, second and third trace portions 20, 22 and 32.

In this embodiment, the first trace portion 20 (e.g., a metal trace on one or more metal layers of the IC 10) provides an antenna segment for the MMW front end 14. Additionally, the series combination between the first and second frequency-dependent impedance modules 16, 18 and the first, second and third trace portions 20, 22, 32 provides a connection for the circuit module 12 and a second circuit module 30 (which may be a memory module, a digital circuit, an analog circuit, a logic circuit, a processing module, or any other type of circuit capable of receiving and/or transmitting signals). To achieve this, the first and second frequency-dependent impedance modules 16, 18 contain high frequency signals (e.g., MMW frequency inbound and/or outbound signals received and/or transmitted by the MMW front-end 14) between each other and may be made nearly unattenuated by passing low frequency signals (e.g., data signals transmitted or received by the circuit module 12 and the second circuit module 30).

Fig. 5 is a block diagram of another embodiment of an integrated circuit 10, the integrated circuit 10 including a circuit module 12, an MMW front end 14, and a connection module 15. The connection module 15 includes first, second and third variable impedance modules 16, 18, 34 and first, second and third trace portions 20, 22, 36.

In this embodiment, the first 20 and third 36 trace portions provide an antenna segment for the MMW front end, the antenna segments may operate as dipole antennas, separate transmit and separate receive antennas, diversity antennas, or an antenna array, in addition, the series combination between the first, second and third frequency variable impedance modules 16, 18, 34 and the first, second and third trace portions 20, 22, 36 establishes a connection with the circuit module 12 to achieve this, the first and second frequency variable impedance modules 16, 18 contain high frequency signals between each other (e.g., MMW frequency inbound and/or outbound signals received and/or transmitted by the MMW front end 14), the first and third impedance modules 16, 34 contain high frequency signals between each other, and the first, second, and third impedance blocks 16, 18, 34 may be configured to pass low frequency signals (e.g., data signals transmitted or received by the circuit block 12) substantially unattenuated.

Fig. 6 is a block diagram of an embodiment of the connection module 15 and an embodiment of the MMW front-end 14. As shown, MMW front end 14 may include a transmit end (TX), a receive end (RX), and a transmit/receive switch (TRSW). The transmit end TX may include an up-conversion module for frequency converting an outbound baseband signal into an outbound MMW signal and a power amplification module (e.g., one or more parallel and/or series coupled power amplification drivers and one or more parallel and/or series coupled power amplifiers). The receiving end (RX) may include a low noise amplification module (one or more low noise amplifiers coupled in series and/or parallel) and a frequency down module for converting the amplified inbound MMW signal to an inbound baseband signal. The IC10 may further include a baseband processing module that converts outbound data to outbound baseband signals and inbound baseband signals to inbound data according to one or more wireless communication protocols and/or standards.

The first and second frequency-dependent impedance modules 16, 18 may be implemented as inductors, each inductor 16 and 18 having an inductive reactance such that it has a lower impedance at the frequency of the signal transmitted through the connection module 15 and a lower impedance at the frequency M through the connection moduleThe impedance is higher at the frequencies at which MW front end 14 transmits and/or receives signals. Wherein the lower impedance is much smaller than the higher impedance (e.g., a scaling factor of 20dB or more). The particular value of the inductive reactance depends on the signal frequency and the input-output impedance of the circuit module 12. For example, the inductive reactance value (L) of the inductors 16 and 18 may depend on the operating frequency (e.g., F) of the MMW front-end 14_MMW) Frequency of input/output signals of circuit block 12 (e.g., F)_SIG) And the input impedance (R) of the circuit module 12_CB). If, at MMW frequency, F_SIGWith 100dB of attenuation, then 2R_L＝100000*R_CB. Given (inductive impedance) R_L2 pi F L, equation F_SIGAt 0Hz (e.g., dc power line), L ═ R (50000 ═ R) can be obtained_CB)/2πF_MMW。

In this embodiment, the first trace portion 20 provides an antenna segment for the MMW front end 14. In addition, the series combination between the first and second frequency-dependent impedance blocks 16, 18 and the first and second trace portions 20, 22 provides a power (VDD) line connection for the circuit block 12. As shown, the transmit/receive switch (TR SW) of the MMW front end 14 is connected to one end of the trace section 20. FIGS. 16-18 illustrate various embodiments in which the MMW front end is coupled with trace portions to form antenna segments.

Fig. 7 is a block diagram of another embodiment of a connection module 15 and another embodiment of the MMW front end 14. As shown, the MMW front end 14 can include a transmit end (TX) and a receive end (RX), and the connection module includes two similar components (e.g., one on the power line V)_DDThe other is a power supply line V_SSIn (1). The transmitting end TX may include an up-conversion module for frequency converting the outbound baseband signal into an outbound MMW signal and a power amplification module. The receiving end RX may include a low noise amplification module and a frequency down-conversion module for converting the amplified inbound MMW signal to an inbound baseband signal. IC10 may further include a baseband processing module that converts outbound data to outbound baseband signals and inbound baseband signals to inbound data according to one or more wireless communication protocols and/or standards.

The first and second frequency-dependent impedance modules 16, 18 of each connection module may be implemented as inductors, with each inductor 16 and 18 having an inductive reactance such that it has a lower impedance at frequencies of signals transmitted through the connection module 15 and a higher impedance at frequencies of signals transmitted and/or received through the MMW front-end 14. Wherein the lower impedance is much smaller than the higher impedance (e.g., a scaling factor of 20dB or more). In this embodiment, the first trace portion 20 in each connection module 15 provides an antenna segment for the MMW front end 14. In addition, the series combination between the first and second frequency-dependent impedance blocks 16, 18 and the first and second trace portions 20, 22 in each connection block provides a power supply (VDD) line and power return VSS connection for the circuit block 12.

Fig. 8 is a block diagram of another embodiment of the connection module 15 connecting the MMW front-end 14 and the circuit module 12 the connection module 15 provides a power supply connection VDD and comprises three frequency-dependent impedance modules 16, 18, 34 whose function is performed by an inductance and three trace sections 36, 20, 22, in this embodiment the trace sections 36, 20 provide an antenna section for the MMW front-end, wherein the antenna section constitutes a dipole antenna.

Fig. 9 is a block diagram of another embodiment of the connection module 15 connecting the MMW front end 14 and the two circuit modules 12, 30. The connection module 15 includes first and second frequency-dependent impedance modules 16, 18 and first and second trace portions 20, 22. Each frequency-dependent impedance module includes an inductor and a capacitor. The inductance has an inductive reactance value that provides a high impedance for MMW signals sent and/or received through the MMW front end and a low impedance for signals communicated between the circuit modules 12, 30. The capacitor may be sized to further attenuate high frequency signals transmitted or received by the MMW front end with little or no attenuation of signals transmitted between the two circuit modules.

Fig. 10 is a block diagram of another embodiment of a connection module connecting the MMW front end 14 and two circuit modules 12, 30. The connection module includes first and second frequency-dependent impedance modules 16, 18 and first and second trace portions 20, 22. Each frequency-dependent impedance block includes an inductor and a Low Pass Filter (LPF). The inductance has an inductive reactance value that provides a high impedance for MMW signals sent and/or received through the MMW front end and a low impedance for signals communicated between the circuit modules 12, 30. The low pass filter has a corner frequency (corner frequency) that further attenuates high frequency signals transmitted or received by the MMW front end with little attenuation of the transmitted signals between the two circuit blocks.

FIG. 11 is a block diagram of another embodiment of a connection module connecting the MMW front end 14 and two circuit modules 12, 30. The connection module includes first and second frequency-dependent impedance modules 16, 18 and first and second trace portions 20, 22. Each frequency-dependent impedance module comprises an inductor and a parallel inductor-capacitor tank circuit. The inductance has an inductive reactance value that provides a high impedance for MMW signals sent and/or received through the MMW front end and a low impedance for signals communicated between the circuit modules 12, 30. The parallel inductance-capacitance energy storage circuit has a resonance frequency, high-frequency signals transmitted or received by the MMW front end can be further attenuated at the resonance frequency, and the transmission signals between the two circuit modules are not attenuated.

Figure 11 further includes an illustration of the impedance of the inductor and the parallel inductor-capacitor tank circuit. In some instances, the inductive reactance value provided by the inductor may not provide a desired impedance level, particularly for high impedance inputs of the circuit module. To further attenuate, the parallel inductor-capacitor (LC) tank circuit has a resonant frequency corresponding to the MMW frequency of the MMW front-end. Thus, in the MMW frequency range, the desired value of the impedance can be achieved by increasing the impedance.

Fig. 12 is a block diagram of another embodiment of the integrated circuit 10 including a chip 24 and a package substrate 26, the chip 24 in this embodiment supporting the circuit module 12, the MMW front end 14, the first and second frequency-dependent impedance modules 16, 18, the first and second trace portions 20, 22, and the ground plane 40, the trace portion 20 in this embodiment providing a monopole antenna for the MMW front end with the ground plane.

Fig. 13 is a block diagram of another embodiment of an integrated circuit 10 that includes a circuit module 12, an MMW front end 14, a first connection module 15, a second connection module 50, and a high frequency connection module 60. The first connection module 15 includes first and second frequency-dependent impedance modules 16, 18 and first and second trace portions 20, 22. The second connection module 50 includes third and fourth frequency-dependent impedance modules 52, 54 and third and fourth trace portions 56, 58. The second connection module 50 is substantially similar in elements to the first connection module 15.

In this implementation, the first trace portion 20 provides a first antenna segment for the MMW front end and the third trace portion 56 provides a second antenna segment for the MMW front end. The series combination between the first and second frequency-dependent impedance modules 16, 18 and the first and second trace portions 20, 22 establishes a first connection with the circuit module 12. Additionally, the series combination between the third and fourth frequency-dependent impedance modules 52, 54 and the third and fourth trace portions 56, 58 establish a second connection with the circuit module 12. The first connection and the second connection may be power and/or power return connections and/or signal connections.

The high frequency connection module 60 couples the first trace section 20 to the third trace section 56 to provide an antenna for the MMW front end the series combination between the first and third trace sections 20, 56 and the high frequency connection module 60 may be tuned such that their common impedance (collective impedance) provides a desired impedance for the antenna primarily in the frequency range of signals received and/or transmitted by the MMW front end 14. . Further, the high frequency connection module 60 has a lower impedance at the frequencies of signals received and/or transmitted by the MMW front end and a higher impedance at the frequencies of signals received or transmitted by the circuit module 12. Therefore, the high frequency connection module 60 does not attenuate these signals.

Fig. 14 is a block diagram of another embodiment of an integrated circuit 10, the integrated circuit 10 including a circuit block 12, an MMW front end 14, a first connection block 15, a second connection block 50, a third connection block 70, a high frequency connection block 60, and a second high frequency connection block 80, the first connection block 15 including first and second frequency-varying impedance blocks 16, 18 and first and second trace portions 20, 22. The second connection module 50 includes third and fourth frequency-dependent impedance modules 52, 54 and third and fourth trace portions 56, 58. The third connection block 70 includes fifth and sixth frequency-dependent impedance blocks 72, 74 and fifth and sixth trace portions 76, 78. The fifth connection module 70 is similar in elements to the first connection module 16.

In this implementation, the first 20, third 56 and fifth 56 trace portions provide antenna segments for the MMW front end, and additionally, the series combination between the fifth 72, sixth 74 frequency-dependent impedance blocks and the fifth 76, 78 trace portions establishes a third connection with the circuit block 12.

The high frequency connection module 60 couples the first trace portion 20 to the third trace portion 56 and the second high frequency connection module 80 couples the third trace portion 56 to the fifth trace portion 76 to provide an antenna for the MMW front end. The series combination between the first, third, and fifth trace sections 20, 56, and 76 and the high frequency connection block 60 and the second high frequency connection block 80 may be tuned such that their common impedance (collective impedance) provides the desired impedance for the antenna primarily in the frequency range of signals received and/or transmitted by the MMW front end 14. Further, each of the high frequency connection modules 60, 80 has a lower impedance at the frequencies of signals received and/or transmitted by the MMW front end, and a higher impedance at the frequencies of signals received or transmitted by the circuit module 12. Therefore, the high-frequency connection modules 60, 80 do not generate attenuation.

Fig. 15 is a block diagram of an embodiment of two connection modules 15, 50 and an embodiment of a high frequency connection module 60. The first, second, third and fourth frequency-dependent impedance modules 16, 18, 52 and 54 may be implemented by using inductors, and in this embodiment, the high-frequency connection module 60 may be implemented by using a series inductor-capacitor (LC) tank circuit with equivalent impedance (equivalent impedance) as shown in the figure. And the LC tank circuit resonates at the frequency of the MMW front end transmit and/or receive signal to provide a low impedance path between the two trace portions 20, 56. In another embodiment, the high frequency connection module 60 may be implemented using capacitors.

Fig. 16 is a block diagram of an embodiment of coupling a connection module 50 to the MMW front end 14 through a transformer 90 and transmission line 92. As shown, the connection module 50 includes inductors that are frequency-dependent impedance modules 52, 54, and trace portions 56 that function as antennas for the MMW front-end 14. In particular, the antenna has a desired value of impedance (e.g., 50Ohms) within a desired operating range (e.g., 60GHz band). Therefore, the impedance of the transmission line 92 and the output impedance of the transformer 90 should be approximately equal to the antenna impedance.

Fig. 17 is a schematic diagram of another embodiment of coupling the connection module 50 to a MMW front end (not shown) via a transformer 90 and a transmission line 96. In the present embodiment, the connection module, not shown, comprises four trace sections and three inductors 34, 16, 18. The middle two trace sections couple the transmission lines to provide a dipole antenna for the MMW front end. The transformer adopts a differential single-ended transformer balun (differential single end transformer balun) with a microstrip structure. For example, its differential end includes three taps: two are connected with differential input, and the middle one is connected with DC ground or AC ground. The two differential inputs of the transformer balun are connected to the MMW front-end 14.

Further, the diameter of the inductors 16, 18, 34 may vary with the length of the trace portion, depending on the desired inductance value, and again, the length of the middle trace portion may be approximately equal to 1/4 times the wavelength of the MMW front end transmit and receive signals, e.g., if the MMW front end transmits and/or receives signals in the 60GHz frequency range, then a quarter wavelength may be 1.25mm (e.g., 0.25C/60 × 10) if the MMW front end transmits and/or receives signals in the 60GHz frequency range⁹Where C is the speed of light).

In this figure, the transformer balun 94, the transmission line 96 and the connection module are all implemented in one metal layer of the IC 10. It will be appreciated that the embodiment of fig. 17 may also be implemented on one or more metal layers of IC 10.

Fig. 18 is a schematic block diagram of another embodiment of coupling a connection module 50 to a MMW front-end through a transformer 90, an impedance matching circuit 100, and a transmission line 92. as shown, the connection module 50 includes an inductor as frequency-varying impedance modules 52, 54, and a trace portion 56 as an antenna of the MMW front-end 14. In particular, the antenna has a desired value of impedance (e.g., 50Ohms) within a desired operating range (e.g., 60GHz band). Therefore, the impedance of the transmission line 92, the impedance of the impedance matching circuit 100, and the output impedance of the transformer 90 should be substantially equal to the antenna impedance.

In this embodiment, the impedance matching circuit 100 includes a series inductance coupling the transformer 90 to the transmission line 92. In another embodiment, the impedance matching circuit 100 includes a series inductance and capacitance coupled in parallel with the input of the transmission line 92.

Although different embodiments of the connection module and the high frequency connection module are provided, other embodiments are also conceivable. For example, a module of a desired frequency characteristic may be implemented using complex circuitry. For example, a low pass filter, a band pass filter, a high pass filter, and/or a notch filter may be used to isolate high frequency and pass low frequency signals.

As used herein, the term "substantially" or "approximately" provides an industry-accepted tolerance to the corresponding term and/or relationship between the terms. Such an industry-accepted tolerance ranges from less than 1% to 50% and corresponds to, but is not limited to, component values, integrated circuit process fluctuations, temperature fluctuations, rise and fall times, and/or thermal noise. These relationships between terms range from a few percent difference to a very large difference. As may be used herein, the term "operably coupled" includes both direct and indirect connections (terms including, but not limited to, components, elements, circuits, and/or modules) between which the intervening term(s) does not alter the information of a signal but may adjust its current level, voltage level, and/or power level. As further used herein, inferred coupling (i.e., where one element is coupled to another element by inference) includes direct and indirect coupling between two elements in the same manner as "coupled". As further used herein, the term "available to" is meant to include one or more power connections, inputs, outputs, etc. to perform one or more corresponding functions, as well as to include inferred connections to one or more other terms. As further used herein, the term "associated with …" includes terms that are directly or indirectly connected separately and/or that one term is embedded within another. As further used herein, the term "compares favorably", indicates that a comparison between two or more elements, items, signals, etc., provides a desired relationship. For example, when the desired relationship is that signal 1 has a greater amplitude than signal 2, favorable comparison results may be obtained when the amplitude of signal 1 is greater than the amplitude of signal 2 or the amplitude of signal 2 is less than the amplitude of signal 1.

The invention has been described above with the aid of method steps illustrating the execution of specific functions and relationships thereof. The boundaries of these functional building blocks and method steps have been defined herein specifically for the convenience of the description. Selective boundaries and sequences may also be appropriately implemented so long as the specific functions and relationships are appropriately performed. Any such selective boundaries and sequences are within the scope and spirit of the present invention.

The present invention has been described above with the aid of functional blocks illustrating some important functions, for convenience of description, the boundaries of these functions constituting modules are herein expressly defined, so long as the essential functions are appropriately implemented, similarly, flow diagram blocks may be specifically defined herein to illustrate certain significant functions, and for the purposes of general application, the boundaries and sequence of flow diagram blocks may be otherwise defined so long as the significant functions are still achieved. As illustrated or combined, by discrete components, special function integrated circuits, processors with appropriate software, and the like.

Claims (10)

1. An integrated circuit, comprising:

a circuit module;

an MMW front end; and

a connection module coupled to the circuit module and the MMW front end, the connection module comprising:

a first frequency-dependent impedance module;

a second frequency-dependent impedance module;

a first trace portion coupled between the first frequency-dependent impedance block and a second frequency-dependent impedance block, wherein the first trace portion is to provide an antenna segment for an MMW front end; and

a second trace section coupled between the second frequency-dependent impedance module and the circuit module, wherein a series combination between the first and second frequency-dependent impedance modules and the first and second trace sections provides a connection to the circuit module.

2. The integrated circuit of claim 1, further comprising:

and the circuit module, the MMW front end and the connecting module are realized on the chip of the crystal grain.

3. The integrated circuit of claim 1, further comprising:

a chip, wherein a circuit module and an MMW front end are implemented on the chip; and a package substrate for supporting the chip, wherein a portion of the connection module is implemented on the package substrate and the remaining portion thereof is implemented on the chip.

4. The integrated circuit of claim 1, further comprising:

a second circuit module, wherein the connection module couples the circuit module to the second circuit module.

5. The integrated circuit of claim 1, wherein the circuit module receives or transmits data signals through a connection module.

6. An integrated circuit, comprising:

a circuit module;

a millimeter wave front;

a first connection module comprising:

a first frequency-dependent impedance module;

a second frequency-dependent impedance module;

a first trace portion coupled between a first frequency-dependent impedance module and a second frequency-dependent impedance module, wherein the first trace portion provides an antenna segment for an MMW front end; and

a second trace portion coupled between the second frequency-dependent impedance module and the circuit module, wherein a series combination between the first and second frequency-dependent impedance modules and the first and second trace portions provides a first connection to the circuit module; and

a second connection module comprising:

a third frequency variable impedance module;

a fourth frequency-dependent impedance module;

a third trace portion coupled between the third frequency-varying impedance module and the fourth frequency-varying impedance module, the third trace portion to provide a second antenna segment for the MMW front end; and

coupling a fourth trace portion between a fourth frequency-dependent impedance module and a circuit module, wherein a series combination between the third and fourth frequency-dependent impedance modules and the third and fourth trace portions provides a second connection to the circuit module; and

a high frequency connection module coupled to the first trace portion and the third trace portion such that the first antenna segment and the second antenna segment are operatively connected together in a frequency range corresponding to an operating frequency range of the MMW front end.

7. The integrated circuit of claim 6, wherein the high frequency connection module comprises a series inductor-capacitor tank circuit.

8. The integrated circuit of claim 6, further comprising:

a third connection module, the third connection module comprising:

a fifth frequency conversion impedance module;

a sixth frequency-variable impedance module;

a fifth trace portion coupled between the fifth frequency-dependent impedance module and a sixth frequency-dependent impedance module, the fifth trace portion to provide a third antenna segment for the MMW front end; and

a sixth trace portion coupled between the sixth frequency-dependent impedance module and a circuit module, wherein a series combination between the fifth and sixth frequency-dependent impedance modules and the fifth and sixth trace portions provides a third connection to the circuit module; and

a high frequency connection module coupled to the third and fifth trace portions such that the first, second and third antenna sections are operatively connected together in a frequency range corresponding to an operating frequency range of the MMW front end.

9. An integrated circuit, comprising:

a plurality of frequency-dependent impedance modules; and

a plurality of trace portions, wherein a first trace portion of the plurality of trace portions is coupled between a first frequency-dependent impedance block and a second frequency-dependent impedance block of the plurality of frequency-dependent impedance blocks, wherein the first trace portion provides an antenna segment; and is

Wherein a second trace portion of the plurality of trace portions is coupled to a second frequency-dependent impedance module connection, wherein the series combination of the first and second frequency-dependent impedance modules and the first and second trace portions provide the connection.

10. The integrated circuit of claim 9, further comprising:

a third trace portion of the plurality of trace portions is coupled between a second frequency-dependent impedance module and a third frequency-dependent impedance module of the plurality of frequency-dependent impedance modules, wherein the third trace portion provides a second antenna segment; and

a fourth trace portion of the plurality of trace portions is coupled to a third variable impedance module, wherein the first, second, and third variable impedance modules and the series combination between the first, second, third, and fourth trace portions provide the connection.