HK1020208B - Rivet - Google Patents

Description

Rivet

The application is a divisional application with the name of 'adhesive assembly, connecting method and rivet' with the application number of 95107673.6, and the application date of 22.6.1995.

The invention relates to a rivet, in particular a rivet with a device for temporarily fixing in an insertion hole.

Fig. 46 is an exploded perspective view showing ｃA general structure for assembling ｃA console, such as the console disclosed in japanese patent JP- ｃA-113503/1986. In the figure, reference numeral 11 denotes a top plate, 12 denotes side plates, 13 denotes a bottom plate, 14 denotes a through hole provided at the time of processing the plate for attaching a fixing member, and 5 denotes a connecting surface to be cleaned. Fig. 47(a) to (d) show a joining method of bonding with one fastener. In fig. 47(a), numerals 1 and 2 are plates to be bonded. To make the connection as shown in fig. (b), an adhesive is applied on the board 2. Then, as shown in fig. (c), a fastener 9 is inserted into a through hole 14 and pressed by a fastening rivet driver not shown in the drawings to form a deformation as shown at 10 in fig. (d), thereby joining the plates together. The above work is performed without curing the adhesive 3.

The conventional bonded assembly and the method of attaching the same as described above are used for a case such as that shown in fig. 46, and the base plate of the case is about one meter long and wide and not less than two meters high, and even a slight misalignment may skew or deform the finished case, so that the bonded plates must be aligned with each other. However, if an adhesive is applied to each plate, it becomes difficult to align the plates, i.e., the plates are first placed adjacent to their attachment locations and then moved and adjusted to each correct position to align them. Thus, the adhesive sticks to unwanted locations, which can soil the board and eventually require excess adhesive to be wiped or wiped off. In addition, the adhesive coating is too thin around the portion where the fastener 10 is attached, which causes many problems in the portion where the adhesive is lacking, such as insufficient strength of the adhesive, too low water tightness, and thus it is impossible to obtain a highly reliable bonded assembly.

The present invention has been made to solve the above problems. The object of the present invention is to provide a rivet facilitating the joining of panels, which ensures easy and accurate alignment of the panels to be bonded, ensures a desired thickness of an adhesive coating, prevents the adhesive from sticking to an undesired portion and increases the strength of a bonded assembly.

According to the invention, the above object is solved by the following measures.

The first invention relates to an adhesive bonded assembly comprising a plate provided with a convex portion on its joining surface and a plate having a concave portion or a through hole on its joining surface for engaging with said convex portion.

The second invention relates to an adhesive assembly in which a convex portion is provided on at least a joining surface of one board when a plurality of boards are joined by an adhesive.

The third invention relates to an adhesive assembly in which, when a plurality of boards are connected by an adhesive, at least one board is provided with a through-hole on an adhesive-coated surface thereof.

A fourth invention relates to a bonded assembly in which a plurality of plates are joined by an adhesive or a combination of an adhesive and a fastener such as a rivet or a screw in one of the first to third inventions.

A fifth invention relates to a method of joining bonded assemblies, wherein, when a board provided with a convex portion on a joining surface thereof and a board provided with a concave portion on a joining surface thereof for engaging with the convex portion are joined by an adhesive, the adhesive is applied to a portion other than the convex portion of the board so that the thickness of the adhesive applied is smaller than the height of the convex portion, and the boards are joined after being aligned.

A sixth invention relates to a rivet having a device temporarily fixed in an insertion through-hole.

A seventh invention relates to a method of connecting bonded assemblies, comprising: inserting, fitting and fixing a rivet having a device temporarily fixed in the insertion through hole into the insertion through hole of one plate; applying an adhesive on an adhesive surface of the plate having the temporarily fixed rivet or another plate having the rivet insertion through-hole; inserting a rivet fixed to one plate into a through-hole of the other plate and fastening the rivet.

The adhesive assembly of the first invention ensures easy alignment by engaging the convex portion on the joining surface of one board with the concave portion or through hole on the joining surface of the other board.

According to the first invention, the convex portion, the concave portion, or the through hole is tapered. It is preferable to have the male portion sit on the female portion or through hole at the tapered portion, which ensures more accurate alignment.

According to the first invention, it is preferable to make the height of the convex portion larger than the depth of the concave portion, so that it is possible to secure a desired adhesive application thickness and increase the reliability of adhesion.

According to the first invention, the height of the convex portion is made smaller than the depth of the concave portion, thereby securing a desired thickness of the adhesive coating of the engaging portion and increasing the reliability of adhesion.

According to the first invention, it is preferable that the top of the convex portion is recessed so as to retain the adhesive therein, which can both hold the adhesive at the engagement portion and increase the reliability of the adhesion.

According to the first invention, it is preferable that the convex portion is formed in a cylindrical shape and the concave portion or the through hole is formed in a polygonal prism shape, so that the adhesive can easily flow into the gap between the circular shape and the polygonal shape at the bonding portion and the reliability of the bonding can be increased.

According to the first invention, it is preferable that the convex portion is formed in the same polygonal or elliptical shape as the concave portion or the through hole, thereby preventing the rotation of the board at the connecting portion.

According to the first invention, it is preferable that at least one of the plates is a thin plate and the thin plate itself is varied in its thickness direction to form convex and concave portions of the same shape on the thin plate. Such convex and concave portions can be obtained by stamping and are easy to handle as thin plates.

The bonding assembly according to the second invention ensures a desired thickness of the adhesive coating and increases the reliability of bonding because a convex portion is provided on the joining surface of at least one board when a plurality of boards are joined.

The bonding assembly of the third invention can easily see where the adhesive is applied and can check the application of the adhesive coating, that is, whether the adhesive flows out from the through-holes at a glance after the boards are attached, because the through-holes are provided on the bonding surface of at least one of the plurality of boards.

The adhesive assembly of the fourth invention is an adhesive assembly for connecting a plurality of boards by using an adhesive and a fastening member in combination in any of the above inventions, which can secure a temporary fixation until the adhesive is cured and increase the strength of the adhesive assembly.

According to the fourth invention, the board can be easily attached with rivets or screws as fasteners.

According to the fourth invention, at least one of the plates is a thin plate which is deformed in its thickness direction to form convex and concave portions of the same shape on both sides of the thin plate, the convex portion formed on the thin plate is engaged with the concave portion on the other plate, the plates are connected to each other by a fastening member passing through holes of the engaging portions on the thin plate and the plates, preferably, the depth of the concave portion provided on the back of the convex portion of the thin plate is larger than the height of the convex portion of the fastening member, which will prevent the fastening member from protruding beyond the surface of the back of the connecting surface of the thin plate.

In the method of connecting adhesive assemblies according to the fifth invention, when a board having a convex portion on its connecting surface and a board having a concave portion on its connecting surface for engaging with the convex portion are connected by an adhesive, the adhesive is applied to a portion other than the convex portion of the board so that the adhesive is applied to a thickness smaller than the height of the convex portion, and the boards are connected after being aligned, thereby preventing the adhesive from being applied to an unnecessary portion at the time of connection.

The rivet of the sixth invention has a means for temporary fixing in the insertion through hole, which can prevent the rivet from falling out in the time until fixing in the insertion through hole and make the bonding work easier.

According to the sixth invention, the means for temporarily fixing in the insertion through hole is an elastic member or a projection provided at the mounting portion of the rivet to allow the fixing means to be easily deformed.

According to the sixth invention, the means for temporarily fixing in the insertion through-hole is a thin-walled portion of the rivet which expands in its diametrical direction under pressure, thereby ensuring that the rivet is temporarily fixed firmly in the insertion through-hole.

The joining method of the bonded assembly of the seventh invention comprises inserting, fitting and fixing the rivet of the sixth invention in the rivet insertion through-hole of one plate, applying an adhesive on the bonding surface of the plate with the rivet provisionally fixed or on the other plate with the rivet insertion through-hole; inserting the rivet inserted and fixed to the plate into the rivet insertion through-hole of the other plate; and (5) fastening the rivet. This method is easier to secure alignment and to facilitate the joining work than a method of inserting a set rivet after applying an adhesive, since the rivet does not fall off even if it is set from below.

The joining method and the rivet for joining of the present invention can secure easy alignment of the plates and can improve alignment accuracy, secure a desired thickness of the adhesive layer, prevent the adhesive from sticking to an unnecessary place, and increase the strength of the bonded assembly. The invention will be further described with reference to the figures and examples, but the invention is not limited thereto.

FIG. 1 is a sectional view of a main part of a bonding assembly according to embodiment 1 of the present invention;

FIG. 2 is a cross-sectional view of a main part of a bonding assembly according to embodiment 2 of the present invention;

FIG. 3 is a sectional view of a main part of a bonding assembly according to embodiment 3 of the present invention;

FIG. 4 is a sectional view of a main portion of a bonding assembly according to embodiment 4 of the present invention;

FIG. 5 is a sectional view of a main part of a bonding assembly according to embodiment 5 of the present invention;

FIG. 6 is a cross-sectional view of a main portion of a bonding assembly according to embodiment 6 of the present invention;

FIG. 7 is a sectional view of a main portion of a bonding assembly according to embodiment 7 of the present invention;

FIG. 8 is a sectional view of a main portion of a bonding assembly according to embodiment 8 of the present invention;

FIG. 9 is a sectional view of a main portion of a bonding assembly according to embodiment 9 of the present invention;

FIG. 10 is a sectional view of a main portion of a bonding assembly according to embodiment 10 of the present invention;

FIG. 11 is a sectional view of a main portion of a bonding assembly according to embodiment 10 of the present invention;

FIG. 12 is a sectional view of a main part of a bonding assembly according to embodiment 11 of the present invention;

FIG. 13 is a sectional view of a main portion of a bonding assembly according to embodiment 12 of the present invention;

FIG. 14 is a sectional view of a main part of a bonding assembly according to embodiment 13 of the present invention;

FIG. 15 is a sectional view of a main part of a bonding assembly according to embodiment 14 of the present invention;

FIG. 16 is a sectional view of a main part of a bonding assembly according to embodiment 15 of the present invention;

FIG. 17 is a sectional view of a main part of a bonding assembly according to embodiment 16 of the invention;

FIG. 18 is a sectional view of a main part of a bonding assembly according to the 17 th embodiment of the present invention;

FIG. 19 is a sectional view of a main part of a bonding assembly according to the 18 th embodiment of the present invention;

FIG. 20 is a sectional view of a main part of a bonding assembly according to embodiment 19 of the present invention;

FIG. 21 is a sectional view of a main portion of a bonding assembly according to the 19 th embodiment of the present invention and shows the section A-A in FIG. 20;

FIG. 22 is a sectional view of a main portion of a bonding assembly according to the 19 th embodiment of the present invention and shows the section A-A in FIG. 20;

FIG. 23 is a sectional view of a main part of a bonding assembly according to embodiment 20 of the present invention;

FIG. 24 is a sectional view of a main portion of a bonding assembly according to embodiment 20 of the present invention and shows section A-A in FIG. 23;

FIG. 25 is a sectional view of a main portion of a bonding assembly according to embodiment 20 of the present invention and shows section A-A in FIG. 23;

FIG. 26 is a sectional view of a main part of a bonding assembly according to embodiment 21 of the invention;

FIG. 27 is a sectional view of a main part of a bonding assembly according to embodiment 22 of the present invention;

FIG. 28 is a sectional view of a main part of a bonding assembly according to embodiment 22 of the present invention;

FIG. 29 is a sectional view of a main part of a bonding assembly according to embodiment 22 of the present invention;

FIG. 30 is a sectional view of a main part of a bonding assembly according to embodiment 23 of the invention;

fig. 31 is a sectional view of a bonding method of a bonding assembly according to embodiment 24 of the invention;

FIG. 32 is a sectional view of a method of joining a bonded assembly according to embodiment 24 of the invention;

FIG. 33 is a sectional view of a joining method of the adhesive assembly according to the 25 th embodiment of the present invention;

FIG. 34 is a sectional view of a joining method of the adhesive assembly according to the 26 th embodiment of the present invention;

FIG. 35 is a sectional view showing a method of attaching the adhesive assembly according to embodiment 27 of the present invention;

FIG. 36 is a sectional view of a joining method of the adhesive assembly according to the embodiment 28 of the present invention;

FIG. 37 is a cross-sectional view of a rivet according to embodiment 29 of the invention;

FIG. 38 is a sectional view showing a method of attaching the adhesive assembly according to the 29 th embodiment of the present invention;

FIG. 39 is a cross-sectional view of a rivet according to embodiment 30 of the present invention, FIG. 39(a) being a longitudinal cross-sectional view, and FIG. 39(b) being a cross-sectional view taken along line A-A of FIG. 39 (a);

FIG. 40 is a cross-sectional view of the attachment method of the tack assembly utilizing the rivet shown in FIG. 39 and relating to embodiment 30 of the present invention;

FIG. 41 relates to a 31 st embodiment of the invention and is a cross-sectional view of a method of joining a bonded assembly using the rivet shown in FIG. 41;

FIG. 42 is a cross-sectional view of a rivet according to embodiment 32 of the invention;

FIG. 43 is a top plan view of a rivet according to embodiment 32 of the invention;

FIG. 44 is a perspective view of a rivet according to embodiment 33 of the invention;

FIG. 45 is a cross-sectional view A-A of FIG. 44 showing a bonded assembly according to embodiment 33 of the invention;

FIG. 46 is an exploded perspective view of a bonding assembly of a conventional console;

fig. 47 is a sectional view showing a general connection method.

Fig. 1 is a sectional view of a main part of a bonding assembly according to embodiment 1 of the present invention. In fig. 1, 1a is a convex portion provided on the connection surface of the board 1; 2a are concave portions provided on the joining surface of the board 2 and engaged with the convex portions 1 a.

The convex portion 1a has a shape of a ridge or an island, and the concave portion 2a has a groove shape or a pool shape corresponding to the shape of the convex portion 1 a. In the following examples, the above meanings are given unless otherwise specified.

The material of the plates 1 and 2 may be metal, plastic and the like. The adhesive may be a modified acrylic adhesive, an epoxy adhesive or the like. In the following examples, the above meanings are given unless otherwise specified.

Fig. 2 is a sectional view of a main part of a bonding assembly according to embodiment 2 of the present invention. In fig. 2, 2b is a through hole provided on the connecting surface of the board 2 to engage with the projecting portion 1 a.

The processing of the through-hole 2b is easier than the concave-convex section 2a in example 1.

Fig. 3 is a sectional view of a main part of a bonding assembly according to embodiment 3 of the present invention. In this embodiment, in order to increase the accuracy of alignment, the dimension (L1) of the convex portion 1a is substantially the same as the dimension (M1) of the concave portion 2a to be engaged therewith.

Fig. 4 is a sectional view of a main portion of a bonding assembly according to embodiment 4 of the present invention. In fig. 4, in order to increase the accuracy of alignment, 2c is a tapered concave portion and the convex portion 1a is seated on the tapered portion.

This embodiment shows the case where the concave portion is tapered, the convex portion may of course be tapered, and both may be tapered. Furthermore, the through-hole may also be tapered.

Fig. 5 is a sectional view of a main portion of a bonding assembly according to embodiment 5 of the present invention. In fig. 5, 1b is a projection provided on the joining surface of the board 1 to secure the thickness of the adhesive layer. By adjusting the height of the projecting portion 1b, a desired thickness of the adhesive layer can be obtained.

Fig. 6 is a sectional view of a main portion of a bonding assembly according to embodiment 6 of the present invention. This embodiment shows another example of the convex portion 1b of embodiment 5 in which the projection 1y is provided. The projections 1y can be easily obtained by sandblasting, liquid honing, electric discharge (electroconcharge), grinding, drawing, pressing, knurling, etching, pickling, die casting, and the like.

Fig. 7 is a sectional view of a main portion of a bonding assembly according to embodiment 7 of the present invention. In fig. 7, reference numeral 4 denotes a rivet, and 1d and 2d denote rivet insertion through holes of the convex portion 1a and the concave portion 2a provided on the plates 1 and 2, respectively. The use of the adhesive 3 together with the fastener (rivet 4 in this embodiment) can secure the temporary fixation until the adhesive 3 is cured, and can increase the strength of the connection assembly.

Fig. 8 is a sectional view of a main portion of a bonding assembly according to embodiment 8 of the present invention. In which a screw 5a and a nut 5b are used as fasteners instead of the rivet 4 in fig. 7. The same effect as in embodiment 7 can be obtained in embodiment 8.

Fig. 9 is a sectional view of a main portion of a bonding assembly according to embodiment 9 of the present invention. In this embodiment, in order to increase the accuracy of alignment, the dimensions (L1) and (M1) of the convex portion 1a and the concave portion 2a are made close in the same manner as shown in fig. 3 so that the convex portion 1a fits into the concave portion 2a, and the rivet 4 is also used, so that the board can be temporarily fixed until the adhesive 3 is cured, while the strength of the adhesive assembly can be increased.

Fig. 10 and 11 are sectional views of main portions of the adhesive assembly according to embodiment 10 of the present invention, mainly showing an example of deformation of the fastener. As shown in fig. 10, the convex portion 1a is larger than the depth of the through-hole 2b, and a concave portion is provided on the top of the convex portion 1 a. The plates 1 and 2 are secured by punching the fastener with a punch 16 and expanding it outwardly as shown in figure 11.

Fig. 12 is a sectional view of a main part of a bonding assembly according to embodiment 11 of the present invention. In this embodiment, the projections are tapered to ensure accurate alignment and to ensure the desired thickness of the adhesive layer. The dimension of the cone base (L3) is greater than the dimension of the concave portion (M1) and the dimension of the cone tip (L2) is less than (M1), so that the convex portion 1a is seated on the concave portion 2a at the tapered portion.

Fig. 13 is a sectional view of a main portion of a bonding assembly according to embodiment 12 of the present invention. In this embodiment, the recessed portion is tapered to ensure accurate alignment of the plates and the required thickness of the adhesive layer. The dimension (M2) of the top of the tapered portion 2c is larger than the dimension (L1) of the male portion, and the dimension (M3) of the bottom of the tapered portion 2c is the same as the diameter of the rivet, so that the male portion 1a is seated on the female portion at the tapered portion.

Fig. 14 is a sectional view of a main portion of a bonding assembly according to embodiment 13 of the present invention. In this embodiment, in order to secure the thickness (H3) of the adhesive layer, the height (H1) of the convex portion 1a is made larger than the depth (H2) of the concave portion by the thickness (H3) of the adhesive layer.

Fig. 15 is a sectional view of a main part of a bonding assembly according to embodiment 14 of the present invention. In this embodiment, a concave portion 1e in which the adhesive is held is provided on top of the convex portion 1a of the board 1 as shown in fig. 14 so as to fix the thickness of the adhesive layer (H4).

Fig. 16 is a sectional view of a main part of a bonding assembly according to embodiment 15 of the present invention. In this embodiment, the height (H1) of the convex portion 1a is smaller than the depth of the concave portion 2a by the adhesive layer thickness (H4), thereby securing the adhesive layer thickness (H4) at the engagement site.

Fig. 17 is a sectional view of a main part of a bonding assembly according to embodiment 16 of the present invention. In this embodiment, through holes 1d and 2d for fixing rivets 4 are provided on the concave portion on the joining surface of the plate 2 and the convex portion 1a on the joining surface of the plate 1 of the adhesive joint assembly shown in fig. 14, and the rivets 4 are fastened in order to play a role of temporary fixing before the adhesive is cured and to increase the strength and reliability of the joint assembly.

Fig. 18 is a sectional view of a main part of a bonding assembly according to embodiment 17 of the present invention. In this embodiment, through holes 1d and 2d for fixing rivets 4 are provided on the concave portion on the joining surface of the plate 2 and the convex portion 1a on the joining surface of the plate 1 of the adhesive joint assembly as shown in fig. 15, and the rivets 4 are fastened in order to play a role of temporary fixing before the adhesive is cured and to increase the strength and reliability of the joint assembly.

Fig. 19 is a sectional view of a main part of a bonding assembly according to embodiment 18 of the present invention. Through holes 1d and 2d for fixing rivets 4 are provided on concave portions 2a and convex portions 1a on the joining surfaces of the plates 1 and 2 of the bonded assembly as shown in fig. 16, and the plates are joined by the rivets 4 for temporary fixing before the adhesive is cured and for increasing the strength and reliability of the bonded assembly. The dimensions of the convex portion 1a are substantially the same as those of the concave portion 2a in order to improve the accuracy of alignment when the convex portion 1a is fitted into the concave portion 2 a.

Fig. 20 is a sectional view of a main part of a bonding assembly according to the 19 th embodiment of the present invention, and fig. 21 and 22 are sectional views a-a of fig. 20. In this embodiment, as shown in fig. 21 and 22, a section of the convex portion 1a is a circle, i.e., the convex portion is cylindrical; and a section of the concave portion 2a has a polygonal shape such as a square or an octagon, that is, the portion has a polygonal column, so that the adhesive can be easily flowed into the gap between the circle and the polygonal row when the boards 1 and 2 are bonded.

This embodiment shows a case where the shapes of the convex portion 1a and the concave portion 2a of the bonded assembly shown in fig. 7 are a special variation, but the present invention is not limited to this case. These changes in shape can also be applied to the convex portion 1a and the concave portion 2a of the bonded assembly shown in fig. 1, 3, 4, 8, 9 and 12 to 19.

Fig. 23 is a sectional view of a main part of a bonding assembly according to embodiment 20 of the present invention, and fig. 24 and 25 are sectional views a-a of fig. 23. The segments of the projecting portions 1a and 2a are a polygonal shape such as a rectangular shape, an oval shape and the like, thereby preventing the rotation of the plate at the engaging portion.

Although these embodiments show the case where the shapes of the convex portion 1a and the concave portion 2a of the bonded assembly shown in fig. 7 are specially changed, the present invention is not limited thereto. These changes in shape can also be used for the male portion 1a and the female portion 2a of the adhesive assembly shown in fig. 1, 3, 4, 8, 9 and 12 to 19, and for engaging the male portion 1a with the through-hole 2b shown in fig. 2.

Fig. 26 is a sectional view of a main part of a bonding assembly according to embodiment 21 of the invention. In this embodiment, 1 and 2 to be bonded are thin plates. The convex portion 1f is formed on the bonding surface of the thin plate 1 by pressing, and the concave portion 2f is formed on the mating surface of the thin plate 2 by pressing, so that the concave portion 2f is engaged with the convex portion 1 f. Accurate alignment can be obtained simply by seating the convex portion 1f on the concave portion 2 f. The convex portion 1f and the concave portion 2f can be easily formed by pressing.

Concave portions and convex portions are formed on the back surfaces of the convex portions 1f and the concave portions 2f, respectively. That is, each thin plate itself is deformed to form the same shape of convex and concave portions on the same thin plate.

Fig. 27 to 29 are sectional views of main portions of a connecting assembly according to embodiment 22 of the present invention. This embodiment shows that a plurality of protrusions are formed on at least one bonding surface of the board of the bonding module as shown in fig. 26, thereby securing the thickness of the bonding layer. In fig. 27, a projection 1y is provided on a thin plate 1; in fig. 28, a projection 2y is provided on a thin plate 2; in fig. 29, projections 1y and 2y are provided on the thin plates 1 and 2.

The protrusions 1y and 2y can be easily manufactured by the above-described processing methods of sand blasting, liquid honing, electric discharge (electric discharge), grinding, drawing, pressing, knurling, etching, pickling, die casting, and the like.

Fig. 30 is a sectional view of a main part of a bonding assembly according to embodiment 23 of the present invention. In this embodiment, in order to secure the thickness of the adhesive layer of the adhesive assembly shown in fig. 26, the convex portion 1f and the concave portion 2f are tapered, and the maximum dimension (M4) of the concave portion 2f is made smaller than the maximum dimension (L5) of the convex portion and larger than the minimum dimension (L4) of the convex portion so that the concave portion 2f is seated in the middle of the tapered portion of the convex portion 1f, thereby securing the adhesive layer more accurately in alignment and in the engaging portion between the convex and concave portions and other portions.

The above examples 21 to 23 show the case where both the sheets 1 and 2 to be bonded are thin sheets, but at least one of them may be a thin sheet.

Fig. 31 and 32 are sectional views showing a method of attaching the adhesive module according to embodiment 24 of the present invention. In this embodiment, the adhesive 3 is applied to the bonding surface instead of the convex portion 1f of the sheet 1 so that the coating thickness (H6) is smaller than the height (H5) of the convex portion 1f, and then the sheet 1 is bonded to the sheet having the concave portion 2f after alignment. Therefore, the adhesive 3 applied until the plates 1 and 2 are engaged and stuck does not stick to the engaging surface of the other sheet 2, which prevents the adhesive 3 from sticking to an unnecessary portion and soiling the sheet 2.

This embodiment shows the case of bonding the sheets 1 and 2, but the present invention is not limited thereto. It is also possible to glue the sheet to the plate or both plates. Instead of the recessed portion, a through hole may be used.

Fig. 33 is a sectional view of a joining method of a bonding assembly according to embodiment 25 of the present invention. This embodiment shows the use of rivets 4 to engage the adhesive at the engagement locations for joining the adhesive assembly of fig. 26, which will ensure temporary fixing of the panels before the adhesive cures and increase the strength of the adhesive assembly.

Fig. 34 is a sectional view showing a joining method of a bonded assembly according to embodiment 26 of the present invention, in which a screw 5a and a nut 5b are used instead of the rivet 4 in fig. 33.

The 25 th and 26 th embodiments show the case of using a fixing member at the engaging portion of the adhesive member shown in fig. 26. Such fasteners may also be used on other adhesive assemblies as shown in fig. 27-30.

Fig. 35 is a sectional view of a bonding assembly attachment method according to embodiment 27 of the present invention. In such a bonding assembly using fasteners at the engaging portions as shown in fig. 33, in order to prevent the fastener from protruding out of the back surface of the sheet, the depth (H8) of the concave portion made on the back surface of the convex portion 1f of the sheet 1 is made larger than the height of the protruding portion of the fastener, or the height (H7) of the head 4a of the rivet 4 of the present embodiment.

This embodiment shows the relationship between the height of the protruding portion (H7) and the depth of the recessed portion (H8) of the fastener in the adhesive assembly as shown in fig. 33. This relationship can also be used in the case of fasteners used with adhesives on adhesive assemblies such as those shown in fig. 27 to 30.

Fig. 36 is a sectional view of a joining method of a bonded assembly according to embodiment 28 of the present invention. In this embodiment, a projecting portion 1g is provided on one plate 1, and a through hole 2g which engages with the projecting portion 1g is provided on the other plate 2. Through holes 1d and 2d are also provided on a portion other than the engaging portion of the projecting portion 1g which is fitted with the through hole 2g, so as to fix the rivet. The thickness of the adhesive layer is ensured by making the diameter (M5) of the through-hole 2g smaller than the width (L5) of the projecting portion 1 g.

According to this adhesive assembly, the dimensions of the projecting portion 1g and the through hole 2g can be smaller than in the case of fixing a rivet in the engaging portion, thereby making handling of the board easier.

This embodiment shows the case where the convex portion 1g is engaged with the through hole 2g, but a concave portion may be used instead of the through hole.

Fig. 37 is a sectional view of a rivet according to embodiment 29 of the present invention, and fig. 38 is a sectional view showing a method of connecting an adhesive assembly using the rivet of fig. 37. The rivet 4 has means for temporary fixing in the insertion through hole. In this embodiment, the shank is covered with an elastic element 6 under the rivet head. Rubber, coatings, adhesives, plastics or the like which are easily formable may be used as the resilient member.

The connection method of the present invention will be described below. As shown in fig. 38(a), the rivet 4 is pushed into the rivet insertion through hole 1d of the plate 1. At this time, the rivet 4 is temporarily fixed in the hole 1d of the plate 1 by the elastic member 6 in such a manner as not to fall out of the through hole. An adhesive is applied to the bonding surface of the plate 1 with the rivet 4 temporarily fixed thereto or to another plate 2 having a through hole 2d into which the rivet is inserted. The rivet 4 inserted and fixed in the plate 1 is inserted into the through hole 2d of the other plate 2, and the thus obtained bonded assembly is fixed as shown in fig. 38 (b).

This embodiment is easier to align than the case of inserting and fixing the rivet after applying the adhesive 3, and as shown in fig. 38, the rivet 4 does not fall out even if inserted from below, which produces an effect such as easier attachment work.

For easier understanding, fig. 38 shows an example of fixing a rivet on the plane of the plate, but this connection method can also be used in the case where the male and female portions are engaged with a rivet. This is the same in the following embodiments.

Fig. 39 is a sectional view of a rivet according to embodiment 30 of the present invention, fig. 39(a) is a longitudinal sectional view, and fig. 39(b) is a sectional view taken along line a-a of fig. 39 (a). FIG. 40 relates to embodiment 30 of the invention and is a cross-sectional view of a method of joining a bonded assembly using the rivet shown in FIG. 39. The rivet 4 has means for temporary fixing in the insertion through hole. In the present exemplary embodiment, a hollow section 4d is provided at the mounting location 4c below the head of the rivet, which section has a smaller wall thickness near the head of the rivet than at the tail of the rivet. The portion 4c is expanded as shown in fig. 40(a) by pulling up slightly the one mandrel 4b, so that the rivet can be temporarily fixed to the rivet insertion through hole 1d, thereby firmly temporarily fixing the rivet to the through hole.

The method of attaching the adhesive assembly will be described below. As shown in fig. 39(a), the rivet 4 is inserted into the rivet insertion through hole 1d of the plate 1, and as shown in fig. 40(a), the mandrel 4b is pulled slightly upward to expand the hollow portion 4 c. So that the rivet 4 can be temporarily fixed to the rivet insertion through-hole without being easily pulled out. Then, the adhesive 3 is applied to the bonding surface of the plate 1 to which the rivet 4 is temporarily fixed or to the other plate 2 having the rivet insertion through-hole 2d, and then the rivet 4 fixed to the plate 1 is inserted into the rivet insertion through-hole 2d of the other plate 2. Thereafter, the mandrel 4b is further pulled to set the rivet and thereby obtain a bonded assembly as shown in fig. 40 (b).

Fig. 41 shows a rivet according to embodiment 31 of the present invention, fig. 41(a) is a front view of the rivet, and fig. 41(b) is a sectional view taken along line a-a of fig. 41 (a). In this embodiment, a slit 4f is provided instead of the annular hollow portion 4d in the embodiment 30, also for forming a thin-walled portion which expands in its thickness direction upon pressing.

The above-described rivet 4 can be used for joining the bonded assembly in the same square shape as in embodiments 29 and 30, and the same effects can be obtained.

Fig. 42 and 43 are front and top views, respectively, of a rivet according to embodiment 32 of the invention. In this embodiment, wedge-shaped projections 4g are provided on the rivet instead of the elastic member 6 of the rivet in embodiment 29, and the like which can give the same effect.

The number of the projections 4g required is at least one.

Instead of the projections 4g, a rough surface may be formed by knurling.

FIG. 44 is a perspective view of a rivet of embodiment 33 of the invention, and FIG. 45 is a section A-A of FIG. 44 showing a bonded assembly of embodiment 33 of the invention. In this embodiment, at least one small through-hole 1h is provided at least at one application position of the two plates 1 and 2 to be adhered by the adhesive 3, in order to make it easy to see the application position of the adhesive 3 and to confirm that the adhesive 3 has been applied to the application position. The through-holes 1h serve as a sign of coating, and the coating condition of the adhesive can be determined by the condition under which the adhesive 3 flows out from the through-holes 1h after the boards are bonded.

This embodiment can be implemented alone or in combination with embodiments 1 to 30.

Claims (1)

1. A rivet having means for temporary fixing in an insertion through hole, characterized in that said temporary fixing means is a temporary fixing portion having a thin wall portion which is provided at an annular groove portion and is pressed so as to expand in a diameter direction of the rivet.