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HK1004032A1 - Metal base board and electronic equipment using the same - Google Patents

Metal base board and electronic equipment using the same Download PDF

Info

Publication number
HK1004032A1
HK1004032A1 HK98103183A HK98103183A HK1004032A1 HK 1004032 A1 HK1004032 A1 HK 1004032A1 HK 98103183 A HK98103183 A HK 98103183A HK 98103183 A HK98103183 A HK 98103183A HK 1004032 A1 HK1004032 A1 HK 1004032A1
Authority
HK
Hong Kong
Prior art keywords
base board
metal base
same
electronic equipment
insulating layer
Prior art date
Application number
HK98103183A
Other languages
English (en)
Chinese (zh)
Other versions
HK1004032B (en
Inventor
Hayashi Satoru
Original Assignee
三菱电机株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱电机株式会社 filed Critical 三菱电机株式会社
Publication of HK1004032B publication Critical patent/HK1004032B/xx
Publication of HK1004032A1 publication Critical patent/HK1004032A1/xx

Links

Classifications

    • H10W70/6875—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H10W40/251—
    • H10W40/255—
    • H10W40/257—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H10W72/073—
    • H10W72/322—
    • H10W72/325—
    • H10W72/351—
    • H10W72/353—
    • H10W72/354—
    • H10W90/736—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12986—Adjacent functionally defined components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24132—Structurally defined web or sheet [e.g., overall dimension, etc.] including grain, strips, or filamentary elements in different layers or components parallel
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24926—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including ceramic, glass, porcelain or quartz layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/251—Mica
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/252—Glass or ceramic [i.e., fired or glazed clay, cement, etc.] [porcelain, quartz, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/256—Heavy metal or aluminum or compound thereof
    • Y10T428/257—Iron oxide or aluminum oxide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2911—Mica flake
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2913—Rod, strand, filament or fiber
    • Y10T428/2933—Coated or with bond, impregnation or core
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Laminated Bodies (AREA)
HK98103183A 1993-08-06 1998-04-16 Metal base board and electronic equipment using the same HK1004032A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP05196398 1993-08-06
JP19639893A JP2756075B2 (ja) 1993-08-06 1993-08-06 金属ベース基板およびそれを用いた電子機器

Publications (2)

Publication Number Publication Date
HK1004032B HK1004032B (en) 1998-11-13
HK1004032A1 true HK1004032A1 (en) 1998-11-13

Family

ID=16357209

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98103183A HK1004032A1 (en) 1993-08-06 1998-04-16 Metal base board and electronic equipment using the same

Country Status (6)

Country Link
US (9) US5527604A (ja)
JP (1) JP2756075B2 (ja)
CN (1) CN1038465C (ja)
DE (1) DE4427994C2 (ja)
GB (1) GB2280782B (ja)
HK (1) HK1004032A1 (ja)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2756075B2 (ja) * 1993-08-06 1998-05-25 三菱電機株式会社 金属ベース基板およびそれを用いた電子機器
US6175084B1 (en) 1995-04-12 2001-01-16 Denki Kagaku Kogyo Kabushiki Kaisha Metal-base multilayer circuit substrate having a heat conductive adhesive layer
US5837356A (en) * 1995-09-22 1998-11-17 Kyocera Corporation Wiring board and method for manufacturing the same
US6034331A (en) * 1996-07-23 2000-03-07 Hitachi Chemical Company, Ltd. Connection sheet and electrode connection structure for electrically interconnecting electrodes facing each other, and method using the connection sheet
DE19646441A1 (de) * 1996-11-11 1998-05-14 Heusler Isabellenhuette Elektrischer Widerstand und Verfahren zu seiner Herstellung
JP3169121B2 (ja) * 1996-11-11 2001-05-21 ティーディーケイ株式会社 テープカセット
US6432497B2 (en) * 1997-07-28 2002-08-13 Parker-Hannifin Corporation Double-side thermally conductive adhesive tape for plastic-packaged electronic components
JP4085536B2 (ja) * 1998-11-09 2008-05-14 株式会社日本自動車部品総合研究所 電気機器およびその製造方法並びに圧接型半導体装置
US6233817B1 (en) * 1999-01-17 2001-05-22 Delphi Technologies, Inc. Method of forming thick-film hybrid circuit on a metal circuit board
US6926796B1 (en) * 1999-01-29 2005-08-09 Matsushita Electric Industrial Co., Ltd. Electronic parts mounting method and device therefor
US6570099B1 (en) * 1999-11-09 2003-05-27 Matsushita Electric Industrial Co., Ltd. Thermal conductive substrate and the method for manufacturing the same
WO2001096458A1 (de) * 2000-06-16 2001-12-20 Siemens Aktiengesellschaft Füllstoff für wärmeleitende kunststoffe, wärmeleitender kunststoff und herstellungsverfahren dazu
US6958535B2 (en) * 2000-09-22 2005-10-25 Matsushita Electric Industrial Co., Ltd. Thermal conductive substrate and semiconductor module using the same
US6475594B2 (en) * 2001-01-05 2002-11-05 Sorbent Products Co., Inc. Sorbent mat assembly
US7226806B2 (en) * 2001-02-16 2007-06-05 Dai Nippon Printing Co., Ltd. Wet etched insulator and electronic circuit component
JP2004200346A (ja) * 2002-12-18 2004-07-15 Sumitomo Electric Ind Ltd 半導体素子収納用パッケージ、その製造方法及び半導体装置
JP3934565B2 (ja) * 2003-02-21 2007-06-20 富士通株式会社 半導体装置
US7232957B2 (en) * 2003-09-25 2007-06-19 Sanyo Electric Co., Ltd. Hybrid integrated circuit device and method of manufacturing the same
US20070072425A1 (en) * 2003-10-07 2007-03-29 Neomax Materials Co., Ltd. Substrate and method for producing same
JP4089636B2 (ja) * 2004-02-19 2008-05-28 三菱電機株式会社 熱伝導性樹脂シートの製造方法およびパワーモジュールの製造方法
DE102004058335A1 (de) * 2004-11-29 2006-06-14 Schulz-Harder, Jürgen, Dr.-Ing. Substrat
US7473853B2 (en) * 2005-02-28 2009-01-06 Sanyo Electric Co., Ltd. Circuit device
JP4878862B2 (ja) * 2005-02-28 2012-02-15 三洋電機株式会社 回路装置
JP4632858B2 (ja) * 2005-05-18 2011-02-16 三菱電機株式会社 電気機器
WO2009055554A2 (en) * 2007-10-26 2009-04-30 E. I. Du Pont De Nemours And Company Multi-layer chip carrier and process for making
WO2009055539A2 (en) * 2007-10-26 2009-04-30 E. I. Du Pont De Nemours And Company Asymmetric dielectric films
US8107229B2 (en) * 2008-03-14 2012-01-31 Sony Ericsson Mobile Communications Ab Portable communication device having a printed circuit board slider hinge assembly
JP5506170B2 (ja) * 2008-08-08 2014-05-28 パナソニック株式会社 実装構造体および電子機器
CA2923361C (en) 2008-08-11 2018-10-09 Greenhill Antiballistics Corporation Composite material
JP5158040B2 (ja) * 2008-09-26 2013-03-06 Ｔｄｋ株式会社 ガラスセラミックス基板
JP5116855B2 (ja) * 2008-11-25 2013-01-09 京セラ株式会社 ウエハ加熱装置、静電チャック
JP2010186789A (ja) * 2009-02-10 2010-08-26 Hitachi Ltd 絶縁回路基板、インバータ装置、及びパワー半導体装置
DE102010019721A1 (de) * 2010-05-07 2011-11-10 Siemens Aktiengesellschaft Elektrisches Isoliermaterial, Isolationspapier und Isolationsband für eine Hochspannungsrotationsmaschine
JP5532419B2 (ja) * 2010-06-17 2014-06-25 富士電機株式会社 絶縁材、金属ベース基板および半導体モジュール並びにこれらの製造方法
WO2012054472A2 (en) 2010-10-18 2012-04-26 Greenhill Antiballistics Corporation Gradient nanoparticle-carbon allotrope-polymer composite material
EP2505931B2 (de) * 2011-03-30 2022-01-12 Eberspächer catem GmbH & Co. KG Elektrische Heizvorrichtung mit einem Leiterbahnen aufweisenenden Plattenelement und Verfahren zur Herstellung eines solchen Plattenelementes
US9807874B2 (en) * 2011-09-30 2017-10-31 Kyocera Corporation Wiring substrate, component embedded substrate, and package structure
JP6212482B2 (ja) * 2012-04-13 2017-10-11 日本発條株式会社 銅ベース回路基板
CN103515815B (zh) * 2012-06-28 2016-03-02 联想(北京)有限公司 基于柔性电路板的mhl连接装置、连接器、转换器和系统
WO2014021186A1 (ja) * 2012-08-01 2014-02-06 京セラ株式会社 配線基板、それを備えた実装構造体および配線基板の製造方法
JP6239510B2 (ja) * 2012-08-02 2017-11-29 学校法人早稲田大学 金属ベースプリント配線板
JP2014175485A (ja) * 2013-03-08 2014-09-22 Ibiden Co Ltd 配線板及びその製造方法
JP6214930B2 (ja) * 2013-05-31 2017-10-18 スナップトラック・インコーポレーテッド 多層配線基板
WO2016152345A1 (ja) * 2015-03-24 2016-09-29 住友大阪セメント株式会社 静電チャック装置
US12191228B2 (en) 2016-04-06 2025-01-07 Sanctioned Risk Solutions, Inc. Heat dissipation using nanoscale materials
KR102213604B1 (ko) * 2017-02-15 2021-02-05 매그나칩 반도체 유한회사 반도체 패키지 장치
JP6450504B1 (ja) * 2017-05-10 2019-01-09 積水化学工業株式会社 絶縁性シート及び積層体
JP6475896B1 (ja) * 2017-05-10 2019-02-27 積水化学工業株式会社 絶縁性シート及び積層体
WO2018207821A1 (ja) * 2017-05-10 2018-11-15 積水化学工業株式会社 絶縁性シート及び積層体
JP6844066B2 (ja) 2018-04-17 2021-03-17 積水化学工業株式会社 絶縁シート、積層体、及び基板
CN113257759A (zh) * 2020-02-10 2021-08-13 华为技术有限公司 散热器、单板、电子设备及制造方法

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2129143A1 (de) * 1971-06-11 1972-12-21 Wesch, Ludwig, Prof Dr , 6900 Heidelberg Kunstbetonlaminat
US3785837A (en) * 1972-06-14 1974-01-15 Du Pont Partially crystallizable glasses for producing low-k crossover dielectrics
US4141055A (en) * 1977-04-27 1979-02-20 Bell Telephone Laboratories, Incorporated Crossover structure for microelectronic circuits
JPS5635494A (en) * 1979-08-30 1981-04-08 Showa Denko Kk High heat transfer electric insulating substrate
US4286010A (en) * 1979-10-05 1981-08-25 Essex Group, Inc. Insulating mica paper and tapes thereof
US4364100A (en) * 1980-04-24 1982-12-14 International Business Machines Corporation Multi-layered metallized silicon matrix substrate
US4403107A (en) * 1980-12-15 1983-09-06 Amp Incorporated Stamped circuit board
US4492730A (en) * 1982-03-26 1985-01-08 Showa Denko Kabushiki Kaisha Substrate of printed circuit
JPS59181687A (ja) * 1983-03-31 1984-10-16 松下電器産業株式会社 集積回路基板
US4944964A (en) * 1984-10-31 1990-07-31 Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V. Lacquer, and process for producing anti-corrosion coatings
JPS6298253A (ja) * 1985-10-25 1987-05-07 Hitachi Ltd 液体クロマトグラフ
JPH0537492Y2 (ja) * 1985-12-11 1993-09-22
US4781968A (en) * 1986-02-28 1988-11-01 Digital Equipment Corporation Micro-electronics devices and methods of manufacturing same
US4865875A (en) * 1986-02-28 1989-09-12 Digital Equipment Corporation Micro-electronics devices and methods of manufacturing same
JPH0611301B2 (ja) * 1986-09-16 1994-02-16 ライオン株式会社 ゲル状芳香剤組成物
JPS6373966U (ja) * 1986-10-31 1988-05-17
JPS63270133A (ja) * 1987-04-30 1988-11-08 Mitsubishi Cable Ind Ltd 回路用基板
JPS63290729A (ja) * 1987-05-22 1988-11-28 Ube Ind Ltd 金属表面を有する芳香族ポリイミドフィルムおよびその製造法
JPH0659003B2 (ja) * 1987-07-24 1994-08-03 三菱電機株式会社 マイクロ波の電力分配器
JPH0442171Y2 (ja) * 1987-08-17 1992-10-05
JPH0729857B2 (ja) * 1987-08-26 1995-04-05 日立金属株式会社 セラミック・金属接合体及びその製造法
JPH01232795A (ja) * 1988-03-11 1989-09-18 Mitsubishi Cable Ind Ltd 金属ベース基板の製造方法
JP2607906B2 (ja) * 1988-03-11 1997-05-07 三菱電線工業株式会社 回路基板
JPH0227786A (ja) * 1988-07-15 1990-01-30 Sanyo Electric Co Ltd 低熱抵抗回路基板
US4908258A (en) * 1988-08-01 1990-03-13 Rogers Corporation High dielectric constant flexible sheet material
US4996097A (en) * 1989-03-16 1991-02-26 W. L. Gore & Associates, Inc. High capacitance laminates
US5057903A (en) * 1989-07-17 1991-10-15 Microelectronics And Computer Technology Corporation Thermal heat sink encapsulated integrated circuit
JPH03106775U (ja) * 1990-02-15 1991-11-05
JPH03244180A (ja) * 1990-02-22 1991-10-30 Matsushita Electric Works Ltd 金属ベース積層板
JPH03279488A (ja) * 1990-03-26 1991-12-10 Mitsubishi Electric Corp セラミックスペーパの製造方法
KR960000980B1 (ko) * 1990-03-27 1996-01-15 가부시기가이샤 히다찌 세이사꾸쇼 무전해도금용 기재 접착제, 이 접착제를 사용한 프린트 회로판 및 이의 용도
JP2864270B2 (ja) * 1990-03-30 1999-03-03 雅文 宮崎 多層配線基板及びその製造方法
US5060114A (en) * 1990-06-06 1991-10-22 Zenith Electronics Corporation Conformable pad with thermally conductive additive for heat dissipation
JP2906282B2 (ja) * 1990-09-20 1999-06-14 富士通株式会社 ガラスセラミック・グリーンシートと多層基板、及び、その製造方法
JP2756075B2 (ja) * 1993-08-06 1998-05-25 三菱電機株式会社 金属ベース基板およびそれを用いた電子機器
EP0645950B1 (en) * 1993-09-21 1998-09-02 Matsushita Electric Industrial Co., Ltd. Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same

Also Published As

Publication number Publication date
DE4427994A1 (de) 1995-02-09
GB2280782A (en) 1995-02-08
GB2280782B (en) 1995-10-11
DE4427994C2 (de) 2000-10-26
JPH0750460A (ja) 1995-02-21
US5648156A (en) 1997-07-15
US5820972A (en) 1998-10-13
JP2756075B2 (ja) 1998-05-25
CN1106606A (zh) 1995-08-09
CN1038465C (zh) 1998-05-20
US5578366A (en) 1996-11-26
GB9415823D0 (en) 1994-09-28
US5578367A (en) 1996-11-26
US5648157A (en) 1997-07-15
US5834101A (en) 1998-11-10
US5670241A (en) 1997-09-23
US5567917A (en) 1996-10-22
US5527604A (en) 1996-06-18

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