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HK1001605B - Cooling apparatus and assembling method thereof - Google Patents

Cooling apparatus and assembling method thereof Download PDF

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Publication number
HK1001605B
HK1001605B HK98100281.1A HK98100281A HK1001605B HK 1001605 B HK1001605 B HK 1001605B HK 98100281 A HK98100281 A HK 98100281A HK 1001605 B HK1001605 B HK 1001605B
Authority
HK
Hong Kong
Prior art keywords
cooling apparatus
assembling method
assembling
cooling
Prior art date
Application number
HK98100281.1A
Other languages
Chinese (zh)
Other versions
HK1001605A1 (en
Inventor
Ito Eiji
Original Assignee
三菱电机株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5196403A external-priority patent/JPH0750494A/en
Application filed by 三菱电机株式会社 filed Critical 三菱电机株式会社
Publication of HK1001605B publication Critical patent/HK1001605B/en
Publication of HK1001605A1 publication Critical patent/HK1001605A1/en

Links

HK98100281A 1993-08-06 1998-01-13 Cooling apparatus and assembling method thereof HK1001605A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP05196403 1993-08-06
JP5196403A JPH0750494A (en) 1993-08-06 1993-08-06 Cooling system

Publications (2)

Publication Number Publication Date
HK1001605B true HK1001605B (en) 1998-06-26
HK1001605A1 HK1001605A1 (en) 1998-06-26

Family

ID=16357287

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98100281A HK1001605A1 (en) 1993-08-06 1998-01-13 Cooling apparatus and assembling method thereof

Country Status (6)

Country Link
US (2) US5558155A (en)
JP (1) JPH0750494A (en)
CN (1) CN1076946C (en)
DE (1) DE4427854C2 (en)
GB (1) GB2282269B (en)
HK (1) HK1001605A1 (en)

Families Citing this family (153)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2300974B (en) * 1995-05-16 1999-12-29 Redpoint Thermalloy Ltd A heatsink and a method of forming the same
CA2180050A1 (en) * 1996-04-04 1997-10-05 Matthew K. Harris Indented fins for an automotive heat exchanger
GB2313073B (en) * 1996-05-16 1999-05-26 Redpoint Thermalloy Ltd A method and an apparatus for manufacturing heatsink devices
US5957194A (en) 1996-06-27 1999-09-28 Advanced Thermal Solutions, Inc. Plate fin heat exchanger having fluid control means
DE19628548A1 (en) * 1996-07-16 1998-01-22 Abb Patent Gmbh Heat sink profile for air cooling device for semiconductor components
JPH10126076A (en) * 1996-10-15 1998-05-15 Fujikura Ltd Coupling fins
DE29811666U1 (en) * 1997-07-03 1998-10-29 Lajupek Oy, Hyvinkää Cell matrix of a cooling element for semiconductors
JP3240408B2 (en) * 1998-04-09 2001-12-17 雅多有限公司 heatsink
JP3858484B2 (en) * 1998-11-24 2006-12-13 松下電器産業株式会社 Laminate heat exchanger
IL124723A (en) * 1998-06-02 2004-01-04 Pessach Seidel Method of forming a heat exchanger stack
US5947192A (en) * 1998-08-13 1999-09-07 Chaun-Choung Industrial Corp. Stack-fin radiator
US6308771B1 (en) 1998-10-29 2001-10-30 Advanced Thermal Solutions, Inc. High performance fan tail heat exchanger
US6301779B1 (en) * 1998-10-29 2001-10-16 Advanced Thermal Solutions, Inc. Method for fabricating a heat sink having nested extended surfaces
TW556074B (en) * 1998-12-15 2003-10-01 Foxconn Prec Components Co Ltd Heat sink and the manufacturing method thereof
GB2347206A (en) * 1998-12-18 2000-08-30 Alstom Uk Ltd Heatsink assembly
US6141958A (en) * 1998-12-31 2000-11-07 Voss; Randy E. Exhaust cooling system for vehicles
TW407753U (en) * 1999-03-02 2000-10-01 West Victory Ind Co Ltd Improvement of heat dissipating structure for CPU
ES2195464T3 (en) * 1999-04-13 2003-12-01 West Victory Ind Co Ltd IMPROVED STRUCTURE OF A HEAT SINK OF A CENTRAL PROCESS UNIT OF A COMPUTER.
US6269003B1 (en) * 1999-12-27 2001-07-31 Wei Wen-Chen Heat dissipater structure
US6371182B1 (en) * 2000-02-24 2002-04-16 The Goodyear Tire & Rubber Company Runflat tire with dual-modulus underlay
US6478082B1 (en) * 2000-05-22 2002-11-12 Jia Hao Li Heat dissipating apparatus with nest wind duct
DE60138594D1 (en) * 2000-07-10 2009-06-18 Thermal Form & Function Inc Arched matrix heat sink for cooling electronic components
US6370774B1 (en) * 2000-07-21 2002-04-16 Ling-Po Sheu Radiator with thin fins and method for producing the same
US6310771B1 (en) * 2000-11-14 2001-10-30 Chuan-Fu Chien CPU heat sink
JP4913285B2 (en) * 2001-02-20 2012-04-11 古河電気工業株式会社 Heat dissipation fins and heat sinks
JP2002252486A (en) * 2001-02-23 2002-09-06 Fujikura Ltd heatsink
WO2002070977A1 (en) * 2001-03-01 2002-09-12 Norsk Hydro Asa Heat exchanger having fins
CN2478253Y (en) * 2001-04-23 2002-02-20 超众科技股份有限公司 Flow channel fin structure
US6340056B1 (en) * 2001-04-24 2002-01-22 Chaun-Choung Technology Corp. Flow channel type heat dissipating fin set
US6404632B1 (en) * 2001-05-04 2002-06-11 Hewlett-Packard Co. Mechanical configuration for retaining inboard mounting hardware on finned heat dissipating devices
US6449160B1 (en) * 2001-07-25 2002-09-10 Tzu Mien Tsai Radiation fin assembly for heat sink or the like
US7128131B2 (en) * 2001-07-31 2006-10-31 The Furukawa Electric Co., Ltd. Heat sink for electronic devices and heat dissipating method
US6401810B1 (en) * 2001-08-16 2002-06-11 Chaun-Choung Technology Corp. Retaining structure of heat-radiating fins
US6637109B2 (en) * 2001-09-27 2003-10-28 Emerson Energy Systems Ab Method for manufacturing a heat sink
US6742581B2 (en) * 2001-11-21 2004-06-01 Fujikura Ltd. Heat sink and fin module
US6474407B1 (en) * 2001-12-12 2002-11-05 Delta Electronics Inc. Composite heat sink with high density fins and assembling method for the same
TW543833U (en) * 2001-12-20 2003-07-21 Datech Technology Co Ltd Improvement of heat dissipation body structure
EP1328019A1 (en) * 2002-01-10 2003-07-16 Wen-Chen Wei Leaf piece structure for heat dissipater
JP2003243581A (en) * 2002-02-15 2003-08-29 Fujikura Ltd heatsink
JP2003249611A (en) * 2002-02-26 2003-09-05 Fujikura Ltd Finned heat sink
JP2003258169A (en) * 2002-03-05 2003-09-12 Fujikura Ltd heatsink
US6619381B1 (en) * 2002-03-21 2003-09-16 Chien-Te Lee Modular heat dissipating device
JP2003318578A (en) * 2002-04-26 2003-11-07 Showa Denko Kk Heat sink fin, heat sink and method for manufacturing heat sink
JP3928099B2 (en) * 2002-06-04 2007-06-13 昭和電工株式会社 Heat sink and manufacturing method thereof
US6729387B2 (en) 2002-06-12 2004-05-04 Avava Technology Corp. Double sided heat exchanger core
US6672379B1 (en) * 2002-07-29 2004-01-06 Waffer Technology Corp. Positioning and buckling structure for use in a radiator
US6607028B1 (en) * 2002-07-29 2003-08-19 Waffer Technology Corp. Positioning structure for heat dissipating fins
USD496006S1 (en) 2002-08-16 2004-09-14 Datech Technology Co., Ltd. Heat sink
TW577557U (en) * 2002-08-27 2004-02-21 Datech Technology Co Ltd Improved fixing structure of heat sink
US6732785B2 (en) * 2002-09-20 2004-05-11 Matthew P. Mitchell Tab joint in etched foil regenerator
JP3854920B2 (en) * 2002-10-10 2006-12-06 株式会社ソニー・コンピュータエンタテインメント Heat dissipation structure of electronic equipment
US6639802B1 (en) * 2002-11-05 2003-10-28 Hon Hai Precision Ind. Co., Ltd. Heat sink with interlocked fins
US6644386B1 (en) * 2002-12-03 2003-11-11 A-Chu Chang Engaging mechanism for heat-dissipating member
US6657865B1 (en) * 2002-12-12 2003-12-02 Wuh Chuong Indutrial Co., Ltd. Heat dissipating structure
JP4065191B2 (en) * 2002-12-17 2008-03-19 株式会社 サンコー Fins and fin assemblies
TW557117U (en) * 2003-01-21 2003-10-01 Delta Electronics Inc Fin structure and assembly thereof
JP3851875B2 (en) 2003-01-27 2006-11-29 株式会社東芝 Cooling device and electronic equipment
US20040150955A1 (en) * 2003-01-31 2004-08-05 You-Tien Lin Connecting apparatus of one single radiation plate
US6880621B2 (en) * 2003-02-14 2005-04-19 Dung-Mau Wang Radiator
US6772828B1 (en) * 2003-02-28 2004-08-10 Li-Chuan Chen Cooling fin assembly
US6901993B2 (en) * 2003-03-05 2005-06-07 Hon Hai Precision Ind. Co., Ltd. Heat sink assembly having combined fins
US6754079B1 (en) * 2003-04-18 2004-06-22 Hung-Chun Chang KD heat sink fins
TW570497U (en) * 2003-05-09 2004-01-01 Hon Hai Prec Ind Co Ltd Heat sink having combined fins
TW200428923A (en) * 2003-06-05 2004-12-16 Delta Electronics Inc Cooling fin structure and fin assembly
CN100345288C (en) * 2003-06-16 2007-10-24 台达电子工业股份有限公司 Heat sink fins and fin components
TWM242985U (en) * 2003-07-15 2004-09-01 Jeng-Tung Chen Improved joint structure for heat sink fin
JP2005051127A (en) * 2003-07-30 2005-02-24 Toshiba Home Technology Corp Cooling module and laminated structure of heat radiator
US20050051297A1 (en) * 2003-09-05 2005-03-10 Jui-Chen Kuo Heat sink
JP3799477B2 (en) * 2003-12-12 2006-07-19 ソニー株式会社 Radiation fin, cooling device, electronic device, and manufacturing method of cooling device
TW200528966A (en) * 2004-02-27 2005-09-01 Quanta Comp Inc Heat-dissipating module and structure thereof
JP2005308311A (en) * 2004-04-22 2005-11-04 Toshiba Corp Fin tube
TW200538023A (en) * 2004-05-13 2005-11-16 Mitac Technology Corp Heat dissipation module having cooling fin structure for smoothing and introducing air flow
TWI259754B (en) * 2004-05-18 2006-08-01 Quanta Comp Inc Extended fin array
US20050269059A1 (en) * 2004-06-03 2005-12-08 Makuhari Corporation Heat sink and its assembly
US7079396B2 (en) * 2004-06-14 2006-07-18 Sun Microsystems, Inc. Memory module cooling
JP4411147B2 (en) * 2004-06-24 2010-02-10 株式会社日立製作所 Heat sink with fan
CN2720628Y (en) * 2004-08-10 2005-08-24 鸿富锦精密工业(深圳)有限公司 Radiator fin combination structure
TWI255986B (en) * 2004-12-14 2006-06-01 Quanta Comp Inc Power saving device of portable personal computer
US20060144560A1 (en) * 2005-01-04 2006-07-06 Ruei-An Lo Clip assembly structure for heat dissipating fins
US20060157222A1 (en) * 2005-01-19 2006-07-20 Yuh-Cheng Chemical Ltd. Heat sink
JP2006286767A (en) * 2005-03-31 2006-10-19 Hitachi Ltd Cooling jacket
CN2800719Y (en) * 2005-06-01 2006-07-26 鸿富锦精密工业(深圳)有限公司 Heat radiator
US7304851B2 (en) * 2005-06-21 2007-12-04 Yuh-Cheng Chemical Ltd. Heat sink and its fabrication method
DE102005029671A1 (en) * 2005-06-22 2006-12-28 Arnold & Richter Cine Technik Gmbh & Co. Betriebs Kg Cooling system e.g., for projector or spotlight, has cooling device partly surrounding light source for generating convection flow
JP4739347B2 (en) * 2005-10-13 2011-08-03 株式会社ソニー・コンピュータエンタテインメント Electronic device and heat sink
US7104311B1 (en) * 2005-10-17 2006-09-12 Kwo Ger Metal Technology, Inc. Heat sink assembly
ITMI20050405U1 (en) * 2005-11-24 2007-05-25 Peltech Srl HEAT SINK IN PARTICULAR FOR A THERMOELECTRIC MODULE
US20070133177A1 (en) * 2005-12-14 2007-06-14 International Business Machines Corporation Flexing chip heatsink
JP4011598B2 (en) * 2005-12-28 2007-11-21 シャープ株式会社 Heat sink and electronics
US7461686B2 (en) * 2006-03-14 2008-12-09 Li Yo Precision Industrial Co., Ltd. Heat dissipating device
US7350561B2 (en) * 2006-03-15 2008-04-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat sink with combined fins
USD568260S1 (en) * 2006-04-20 2008-05-06 Lian-Li Industrial Co., Ltd. Notebook computer heat sink
JP4814777B2 (en) * 2006-12-19 2011-11-16 株式会社ソニー・コンピュータエンタテインメント Laminated heat sink
US20080149314A1 (en) * 2006-12-20 2008-06-26 Cheng Home Electronics Co., Ltd. Structure of a heat dissipating module
DE102007015146B4 (en) * 2007-03-29 2009-12-10 Benteler Automobiltechnik Gmbh Aluminum system radiator
TW200847909A (en) * 2007-05-28 2008-12-01 Delta Electronics Inc Heat sink and manufacture method thereof
US20120240401A1 (en) * 2007-05-28 2012-09-27 Delta Electronics, Inc. Manufacturing method of a heat sink
US20090183863A1 (en) * 2008-01-20 2009-07-23 Cheng-Kun Shu Connecting Structure for Connecting Heat Radiation Fins
CN101610659B (en) * 2008-06-20 2011-12-28 富准精密工业(深圳)有限公司 heat sink
TWM354319U (en) * 2008-06-30 2009-04-01 Asia Vital Components Co Ltd Structural improvement of heat dissipation fin and its heat dissipation module
TWM358337U (en) * 2008-11-18 2009-06-01 Asia Vital Components Co Ltd Structure of heat sink fin assembly and its radiator and cooling module
TWM358336U (en) 2008-11-18 2009-06-01 Asia Vital Components Co Ltd Structure of heat sink fin assembly and its radiator and cooling module
DE102009004467B4 (en) * 2009-01-14 2014-10-23 Modine Manufacturing Co. Soldered product and process for its preparation
US20100186933A1 (en) * 2009-01-28 2010-07-29 Kun-Jung Chang Heat dispersing module
IT1393015B1 (en) * 2009-02-11 2012-04-11 Elenos S R L HEAT SINK FOR ELECTRONIC POWER COMPONENTS
CN101839654B (en) * 2009-03-19 2013-06-05 富准精密工业(深圳)有限公司 Heat sink
EP2259310B1 (en) * 2009-06-05 2020-04-08 Siemens Gamesa Renewable Energy A/S Integrated heat exchanger
US20110000641A1 (en) * 2009-07-06 2011-01-06 Xiaozhen Zeng Radiating fin structure and heat sink thereof
JP5400690B2 (en) * 2010-04-15 2014-01-29 古河電気工業株式会社 heatsink
JP5599235B2 (en) * 2010-06-14 2014-10-01 下西技研工業株式会社 Heat sink
CN102548342B (en) * 2010-12-24 2016-01-13 富准精密工业(深圳)有限公司 Radiator and its preparation method
TWI555463B (en) * 2010-12-27 2016-10-21 鴻準精密工業股份有限公司 Heat sink and manufacturing method thereof
TW201235824A (en) * 2011-02-25 2012-09-01 Asia Vital Components Co Ltd Heat dissipating module and its manufacturing method
TW201245942A (en) * 2011-05-06 2012-11-16 Foxconn Tech Co Ltd Heat sink
CN102770003B (en) * 2011-05-06 2016-09-07 富瑞精密组件(昆山)有限公司 Heat abstractor
EP3093604B1 (en) * 2011-07-28 2018-08-29 Nestec S.A. Methods and devices for heating or cooling viscous materials
TWI470182B (en) * 2011-09-28 2015-01-21 緯創資通股份有限公司 Heat sink fins and heat sink fin sets
CN103683634A (en) 2012-09-12 2014-03-26 庄嘉明 Base with cooling fins, molding method, and motor with the base
KR101304434B1 (en) * 2012-11-23 2013-09-05 동부라이텍 주식회사 Heat sink apparatus
PL223710B1 (en) * 2012-12-12 2016-10-31 Aic Spółka Z Ograniczoną Odpowiedzialnością Soldering element
CN103874394B (en) * 2012-12-18 2017-01-04 国网山东省电力公司德州供电公司 Electronic installation and radiator module thereof
JP6443939B2 (en) * 2013-12-11 2018-12-26 Necライティング株式会社 lighting equipment
US9476655B2 (en) * 2013-12-11 2016-10-25 Asia Vital Components Co., Ltd. Thermal module
GB2524093B (en) 2014-03-14 2016-11-16 Dyson Technology Ltd Light fixture
USD745421S1 (en) 2014-09-08 2015-12-15 Apple Inc. Wearable device
US10085523B2 (en) 2014-08-11 2018-10-02 Apple Inc. Attachment system for an electronic device
USD731346S1 (en) 2014-08-11 2015-06-09 Apple Inc. Band
US10139172B2 (en) * 2014-08-28 2018-11-27 Mahle International Gmbh Heat exchanger fin retention feature
CN104588822A (en) * 2014-12-19 2015-05-06 贵阳高新金达电子科技有限公司 Tin soldering tool with long-strip-shaped heat dissipating holes and heat conducting holes
CN104588828A (en) * 2014-12-19 2015-05-06 贵阳高新金达电子科技有限公司 Tin soldering tool with heat dissipating hole and heat conducting holes
CN104625302A (en) * 2014-12-19 2015-05-20 贵阳高新金达电子科技有限公司 Soldering tin tool using wave-shaped heat dissipating hole and heat conducting holes for heat dissipation
CN104625304A (en) * 2014-12-19 2015-05-20 贵阳高新金达电子科技有限公司 Tin soldering tool with round heat radiation holes
CN104625300A (en) * 2014-12-19 2015-05-20 贵阳高新金达电子科技有限公司 Tin soldering tool with strip-shaped heat radiation holes and heat conduction holes
CN104588827A (en) * 2014-12-19 2015-05-06 贵阳高新金达电子科技有限公司 Tin soldering tool with long-strip-shaped heat dissipating holes and heat conducting holes
CN104607752A (en) * 2014-12-19 2015-05-13 贵阳高新金达电子科技有限公司 Soldering tool
CN104625303A (en) * 2014-12-19 2015-05-20 贵阳高新金达电子科技有限公司 Soldering tool for inductor automatic soldering system
EP3391719A4 (en) * 2015-12-14 2019-07-24 A.K. Stamping Company, Inc. ALUMINUM RF / EMI SHIELD WITH FINS
USD781853S1 (en) 2016-03-07 2017-03-21 Apple Inc. Wearable device
JP6548193B2 (en) * 2016-07-01 2019-07-24 有限会社和氣製作所 Fin member, temperature control device and method of manufacturing the same
DE112017004255T5 (en) * 2016-08-26 2019-05-16 Dana Canada Corporation Positioning mechanism for a heat exchanger assembly
JPWO2018061193A1 (en) * 2016-09-30 2018-09-27 三菱電機株式会社 Heat sink and power converter
US10541155B2 (en) * 2017-01-18 2020-01-21 Asia Vital Components Co., Ltd. Nested finned heat sink with heat pipe
US20180328285A1 (en) * 2017-05-11 2018-11-15 Unison Industries, Llc Heat exchanger
CN108281831B (en) * 2018-01-23 2020-05-12 泰科电子(上海)有限公司 Socket assemblies and heat transfer assemblies
US20190307018A1 (en) * 2018-03-27 2019-10-03 International Business Machines Corporation High density interlocking fins for heatsink or cold plate
CN109780902A (en) * 2018-12-18 2019-05-21 深圳兴奇宏科技有限公司 Heat-sink unit integrated structure
JP2020148410A (en) * 2019-03-14 2020-09-17 セイコーエプソン株式会社 Cooler and projector
US11278978B2 (en) 2019-06-21 2022-03-22 International Business Machines Corporation Pattern bonded finned cold plate
JP6830686B1 (en) * 2019-09-20 2021-02-17 株式会社セルシステム heat sink
US10842043B1 (en) 2019-11-11 2020-11-17 International Business Machines Corporation Fabricating coolant-cooled heat sinks with internal thermally-conductive fins
EP3832245B1 (en) * 2019-12-05 2022-02-23 ABB Schweiz AG Heat exchanger and cooled electrical assembly
US11156409B2 (en) 2020-01-20 2021-10-26 International Business Machines Corporation Coolant-cooled heat sinks with internal thermally-conductive fins joined to the cover
CN114585222B (en) * 2022-01-05 2025-05-09 祥博传热科技股份有限公司 Fin heat sink and manufacturing method thereof

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1025898A (en) * 1912-03-08 1912-05-07 Briscoe Mfg Company Process of assembling radiators.
US2434676A (en) * 1944-03-11 1948-01-20 Scovill Manufacturing Co Cooling unit
US2419234A (en) * 1944-03-11 1947-04-22 Scovill Manufacturing Co Cooling unit
US2419233A (en) * 1944-03-11 1947-04-22 Scovill Manufacturing Co Cooling unit
US3158122A (en) * 1960-09-15 1964-11-24 Eitel Mc Cullough Inc Method of brazing electron tube cooling fins
US3334399A (en) * 1962-12-31 1967-08-08 Stewart Warner Corp Brazed laminated construction and method of fabrication thereof
US4009752A (en) * 1975-02-24 1977-03-01 Honeywell Information Systems Inc. Warp-resistant heat sink
FR2418695A1 (en) * 1978-03-02 1979-09-28 Chausson Usines Sa PROCESS FOR THE MANUFACTURING OF RADIATOR BEAMS WITH WAVEL TUBES AND DISSIPATORS AND DEVICE FOR ITS IMPLEMENTATION
JPS5716792A (en) * 1980-07-04 1982-01-28 Hitachi Ltd Heat radiator
NL8005301A (en) * 1980-09-23 1982-04-16 Winterswijksche Steen Kalk METHOD AND APPARATUS FOR DRYING AND SEPARATING A POWDER OR GRANULAR RAW MATERIAL FOR THE PREPARATION OF A POWDER OR GRANULAR SUBSTANCE
JPS5771984A (en) * 1980-10-21 1982-05-06 Taisei Corp Blind apparatus
JPS5771984U (en) * 1980-10-21 1982-05-01
JPS57188855A (en) * 1981-04-21 1982-11-19 Kobe Steel Ltd Radiator for semiconductor element
DE3415554A1 (en) * 1983-04-30 1984-10-31 Barmag Barmer Maschinenfabrik Ag, 5630 Remscheid Heat sink for power electronic components
JPS60190047A (en) * 1984-03-11 1985-09-27 Mitsubishi Electric Corp Central monitoring device
JPS6225893A (en) * 1985-07-26 1987-02-03 Matsushita Electric Ind Co Ltd Synchronous motor control device
JPH0236149Y2 (en) * 1985-07-31 1990-10-02
JPS6337877A (en) * 1986-07-30 1988-02-18 Toshiba Corp Magnetic card reader
JPH02146451A (en) * 1988-11-29 1990-06-05 Matsushita Seiko Co Ltd Personal air conditioner
JPH0318468A (en) * 1989-03-14 1991-01-28 Mitsubishi Electric Corp Method for joining heat sink
US5038858A (en) * 1990-03-13 1991-08-13 Thermalloy Incorporated Finned heat sink and method of manufacture
US5056590A (en) * 1990-03-30 1991-10-15 The Cherry-Burrell Corporation Plate heat exchanger
JP3122173B2 (en) * 1990-11-09 2001-01-09 株式会社東芝 Heatsink, heatsink, and method of manufacturing heatsink

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