HK1069273A - Horizontal component retention socket - Google Patents

Description

Horizontal element retaining sleeve

Technical Field

The invention relates to a device and a method for connecting an element to a substrate. In particular, the invention relates to a horizontal sleeve for connecting an electronic component to a substrate.

Background

In the manufacture of electronic devices, a variety of electronic components may be used. Many such electronic components may be mounted on substrates used in the manufacture of electronic devices. Some such electronic components are "through-hole mount" (THM) components, in which pins of the electronic component pass through and are connected to a substrate. These electronic components may be active or passive and may include, but are not limited to, crystals, oscillators, capacitors, diodes, resistors, and inductors. In this application, the term "substrate" is defined to include motherboards, peripheral cards, die pads (cartridges), multi-chip assembly substrates, non-printed circuit board products, and similar structures, as will be apparent to those skilled in the art.

Fig. 13 illustrates an electronic component 202 having a component body 204 and a pair of pins 206 extending from the body. Typically, as shown in fig. 14, such electronic components 202 are connected to the substrate 208 by forming metallized vias 212, known in the art, through the substrate 208, wherein the metallized vias 212 are connected to traces (not shown) that are in contact with other electronic components (not shown). Pins 206 of electronic component 202 are inserted into metallized vias 212 so that they pass through substrate 208. The component pins 206 are bent so that the component bodies 204 rest against the substrate 208. The element pins 206 may be bent before or after insertion into the metallized vias 212. The component pins 206 are connected to the metallized vias 212 using solder 214 applied by a wave soldering process, as is well known in the art. The element body 204 may be secondarily attached to the substrate with an adhesive (not shown) and/or a wire 218 that surrounds the element body 204 and passes through the substrate 208. Wave soldering of the component pins 206 also secures the wires 218. Of course, it should be understood that the secondary connection is only optional.

Another variation (not shown) known in the art is to shape the component pins such that a portion of each component pin is in contact with the substrate when the electronic component is surface mounted to the substrate. However, as is well known to those skilled in the art, these components are difficult to attach to the substrate due to the asymmetric configuration of the components that require placement offsets, due to the fragility of the component pins, and/or due to the rounded corner encapsulation structure that may require special vacuum tips on the "pick and place" assembly equipment.

Regardless of the structure, however, the process of bending the element pins 206 will induce considerable stress on the seal (not shown) through which the element pins 206 pass into the element body 204. These stresses can lead to cracking of the seal, which can lead to moisture infiltration, which can affect performance, damage or even destroy the electronic component 202. In addition, improper mounting of the electronic component 202 may result in crossed component pins 206, which may render the electronic component 202 inoperable. Also, flex component pins 206 require additional manufacturing steps and costs for this process.

It is also known in the art that electronic components may be placed in the housing 222 to protect the electronic components, as shown in fig. 15. These electronics housings 222 may include a chamber 224 for receiving electronics and a channel 226 for receiving electronics pins 228. Such an electronics housing 222 is available from Chicago Miniature Lamp (Lamp) limited, hankensak, new jersey, usa.

Accordingly, it would be beneficial to develop an apparatus and method for efficiently mounting electronic components onto a substrate that reduces or eliminates the problems discussed above.

Drawings

While the specification concludes with claims particularly pointing out and distinctly claiming that which is regarded as the present invention, the advantages of this invention may be more readily ascertained from the following description of the invention when read in conjunction with the accompanying drawings, in which:

FIG. 1 is a side cross-sectional view of an embodiment of a horizontal element retaining sleeve in an open position, according to the present invention;

FIG. 2 is a side cross-sectional view of the horizontal member retaining sleeve of FIG. 1 in a closed position, according to the present invention;

FIG. 3 is a side plan view of the horizontal element retaining sleeve taken along line 3-3 of FIG. 1, in accordance with the present invention;

FIG. 4 is a side plan view of the horizontal element retaining sleeve taken along line 4-4 of FIG. 1, in accordance with the present invention;

FIG. 5 is a bottom plan view of the horizontal element retaining sleeve taken along line 5-5 of FIG. 1, in accordance with the present invention;

FIG. 6 is a side cross-sectional view of the horizontal component holding sleeve of FIG. 1 in an open position and with an electronic component placed therein, in accordance with the present invention;

FIG. 7 is a side cross-sectional view of the horizontal member retaining sleeve of FIG. 1 in a partially closed position and with an electronic component disposed therein, in accordance with the present invention;

FIG. 8 is a side cross-sectional view of the horizontal member retaining sleeve of FIG. 1 in a closed position and with an electronic component disposed therein, in accordance with the present invention;

FIG. 9 is a side cross-sectional view of another embodiment of a horizontal member retaining sleeve in an open position according to the present invention;

FIG. 10 is a side cross-sectional view of another embodiment of a horizontal member retaining sleeve in an open position according to the present invention;

FIG. 11 is a side cross-sectional view of the horizontal member retaining sleeve of FIG. 10 in a closed position, according to the present invention;

FIG. 12A is a top plan view of the slidable coupling mechanism taken along line 12A-12A of FIG. 11, in accordance with the present invention;

FIG. 12B is a top plan view of another slidable mounting mechanism, according to the present invention;

FIG. 13 is an oblique view of an electronic component as is known in the art;

FIG. 14 is an oblique view of an electronic component mounted to a substrate as is known in the art;

fig. 15 is a cross-sectional view of an electronics housing as is known in the art.

Detailed Description

In the following detailed description, reference is made to the accompanying drawings that show, by way of illustration, specific embodiments in which the invention may be practiced. These embodiments are described in sufficient detail to enable those skilled in the art to practice the invention. It is to be understood that the various embodiments of the invention, although different, are not necessarily mutually exclusive. For example, a particular feature, structure, or characteristic described herein in connection with one embodiment may be implemented within other embodiments without departing from the spirit and scope of the invention. In addition, it is to be understood that the location or arrangement of individual elements within each disclosed embodiment may be modified without departing from the spirit and scope of the invention. The following detailed description is, therefore, not to be taken in a limiting sense, and the scope of the present invention is defined only by the appended claims, appropriately interpreted, along with the full range of equivalents to which the claims are entitled. In the drawings, like numerals refer to the same or similar functionality throughout the several views.

The present invention includes a component retention pocket that allows Through Hole Mount (THM) electronic components to be connected to a substrate, such as a motherboard, in a stable horizontal orientation without the need for pin preparation (trimming, forming, etc.). The present invention may be used in any product or design environment (i.e., routers, switches, handheld devices, mobile computer platforms, etc.) where height limitations preclude the use of vertically oriented components. Furthermore, the present invention greatly reduces the risk of handling-related component damage during the entire assembly process or post-assembly. The element retaining sleeve protects the elements from damage due to shock and vibration and/or incidental contact.

Fig. 1-8 illustrate a component retention sleeve 100 of the present invention comprising a housing 102 and a recess 104 formed therein. The sleeve recess 104 may include an element chamber 106 and a beveled guide portion 112 extending from a first surface 114 of the sleeve body 102 to the element chamber 106. The cartridge pocket 104 also includes at least one pin guide channel 116 (shown as two pin guide channels 116 and 116' in fig. 3 and 4) extending from the component chamber 106 to a second surface 118 of the cartridge housing 102. The pin guide channels 116 and 116 'include angled walls 124 and 124' that extend from the component chamber 106. The angled walls 124 and 124' are preferably angled to about one quarter to one third of the distance from the element chamber 106 to the housing second surface 118.

The component holding sleeve 100 further includes a cover 130 movably coupled to the sleeve housing 102 proximate the upper surface 126 of the sleeve housing 102 by any method known in the art such that the cover 130 is movable between an open position shown in fig. 1 and a closed position shown in fig. 2. Each pin guide channel 116 includes a horizontal portion 132 and a vertical portion 134. The pin guide channel horizontal portion 132 is preferably substantially perpendicular to the pin guide channel vertical portion 134. Preferably, the pin guide channel vertical portion 134 is formed with approximately one-half of a channel 136 (also channels 136 'in fig. 4 and 5) in the sleeve housing 102 and approximately one-half of a corresponding channel 138 (also channels 138' in fig. 4 and 5) in the cover 132. Thus, when the cover 130 is in the closed position shown in FIG. 2, the vertical portion 134 of the pin guide channel is formed. The lid 130 may include at least one attachment mechanism 140 (shown as components 140 and 140 '), such attachment mechanism 140 being secured to at least one attachment mechanism 142 (shown as components 142 and 142') on the sleeve body 102 when the lid 130 is in the closed position, as shown in fig. 2.

The jacket housing 102 should be constructed of a non-conductive material including polycarbonate material, plastic, epoxy, nylon, and the like. The material used to construct the housing 102 should be sufficiently rigid so that the component pins 164 (see fig. 6) do not penetrate the housing 102 during insertion of the electronic component 162 (see fig. 6). The component retaining sleeve 100 may be manufactured using an injection molding process, milling, or other such manufacturing processes as will be apparent to those skilled in the art. Further, the element holding pocket 100 may be formed as a single unit, but the present invention is not limited thereto. The exterior of the sleeve housing 102 should be shaped such that it can be easily and securely held by a human hand during assembly onto a substrate, as will be discussed below, but may also be shaped to be suitable for placement or handling with a tool or for other such implementations.

When there is more than one pin guide channel 116, at least one pin spacer 144 may be placed between each pin guide channel 116 (shown placed between pin guide channels 116 and 116'). The pin spacers 144 separate the pins of the components to be inserted (see fig. 6) into the respective guide channels 116 and 116', which prevents short circuits due to the pins contacting each other.

The component holding pocket 100 can include at least one substrate attachment mechanism 148 (shown as elements 148 and 148') extending from an attachment surface 152. The substrate attachment mechanisms 148 and 148' are illustrated as hook and clamp mechanisms. Of course, the substrate attachment mechanisms 148, 148' may be any mechanism known in the art, including but not limited to, solderable posts, split pegs (split pegs), bolts and nuts, and adhesive layer and surface mounting. The substrate attachment mechanisms 148, 148' may be integral parts of the casing 102 (formed when the casing 102 is molded). The substrate attachment mechanisms 148, 148' are preferably designed to pass through the substrate to which the component holding pocket 100 is attached to provide a secure attachment to the substrate. In addition, they preferably should be of sufficient thickness and durability to resist shearing (i.e., separation from the casing body), breaking or deformation due to impact, vibration and/or incidental contact. The substrate attachment mechanisms 148, 148' preferably allow the component holding sleeve 100 to be removed from the substrate with a reasonable amount of force and without rendering the component holding sleeve 100 unusable.

Fig. 6 illustrates the component holding pocket 100 of fig. 1 with the electronic component 162 oriented horizontally therein. Electronic component 162 may be active or passive and may include, but is not limited to, a crystal, an oscillator, a capacitor, a diode, a resistor, and an inductor. At least one pin 164 extends from a first surface 166 of electronic component 162 through pin guide channel 116.

Preferably, the component chamber 106 is designed to closely conform to the length, width, height, and/or diameter of the electronic components 162. The dimensions should allow for easy insertion of the electronic component 162, but limit movement of the electronic component 162 within the component chamber 106 to as little as possible.

The ramped guide portion 112 tapers into the component chamber 106 (i.e., is wider proximate the cartridge housing first surface 114 than proximate the component chamber 106) to facilitate insertion of the electronic component 162. The ramped guide portion 112 preferably terminates no more than about one third of the length of the electronic component from the housing first surface 114. The ramp guide portion 112 should preferably provide sufficient clearance to allow access by a tool, such as forceps, to grasp and remove the electronic component 162. Angled walls 124 and 124' and/or pin divider 144 provide a stop point for component insertion such that second surface 168 of electronic component 162 is generally, but not necessarily, "flush" with housing first surface 114.

As shown in fig. 6, the pin(s) 164 extend through the pin guide channel horizontal portion 132 and through the holster housing second surface 118. When the cover 130 is moved from the open position toward the closed position as shown in fig. 7, the pins 164 contact the cover channels 138 and bend to conform to the rounded corners of the structures 170 in the pin guide channels 116. In the closed position as shown in FIG. 8, a portion of the pin 164 conforms to the pin guide channel vertical portion 134 and extends perpendicularly from the housing attachment surface 152. The pin(s) 164 are thus positioned for insertion into through holes (not shown) in a substrate (not shown) and connection thereto with solder. The holster housing attachment surface 152 is preferably substantially planar and preferably occupies a minimum substrate surface area necessary to provide securement from placement until the pin(s) 164 are soldered in place.

The spacing of the centers of the vertical portions 134 of the pin guide channels is preferably spaced to avoid solder bridging during manufacture. The pin guide channels 116, 116 'preferably maintain uniform dimensions from the terminal ends of the angled walls 124, 124' through the pin guide channel horizontal portion 132. In addition, the pin guide channels 116, 116 'should be sized to prevent electronic component pins 164 and 164' (not shown) from getting stuck during insertion, but not too large to allow insertion of more than one pin.

The present design allows for bending of the pin(s) 164 without imparting any significant stress to the electronic component 162 and greatly reduces the likelihood of pin breakage due to the sufficiently rounded corners of the structure 170. This allows bending of the component pin(s) 164 without additional tools, while virtually eliminating assembly-induced defects. In addition, it is a simpler (i.e., fewer manufacturing operations) and more repeatable manufacturing process through the substrate by controlling the component pins 164. Moreover, component holding sleeve 100 reduces the susceptibility of electronic component 162 to damage due to shock, vibration, or incidental contact during and after assembly.

As shown in fig. 9, the cover 130 is optional. If pins 164 are sufficiently compliant, pins 164 may simply bend to conform to pin guide channel horizontal portions 132 and pin guide channel vertical portions 134 during insertion of electronic component 162 into component holding pocket 100.

Further, as shown in fig. 10 and 11, cover 180 may be configured as a slidable device such that cover 180 is retained in a slide along slide connection structure 182. In this way, the cover 180 is movable between an open position (see fig. 10) and a closed position (see fig. 11). The sliding connection 182 may be a tongue and groove engagement type mechanism as shown in fig. 12A and 12B. Of course, the sliding connection structure 182 may be any structure as understood by those skilled in the art.

Having thus described in detail embodiments of the present invention, it is to be understood that the invention defined by the appended claims is not to be limited by particular details set forth in the above description as many apparent variations thereof are possible without departing from the spirit or scope thereof.

Claims (29)

1. A component holding pocket, comprising:

a housing having a first surface, a second surface, and a connecting surface;

a recess defined within the housing, wherein the recess includes an element chamber extending from the housing first surface to at least one pin guide channel horizontal portion, the at least one pin guide channel extending from the element chamber to the housing second surface; and

a cover movably coupled to the housing, the cover adapted to move from an open position to a closed position abutting the second surface of the housing.

2. The component holding pocket of claim 1, wherein said at least one pin guide channel comprises a vertical portion adjacent said second surface extending from a horizontal portion of said at least one pin guide channel to said housing connection surface.

3. The component holding pocket of claim 2, wherein said at least one pin guide channel vertical portion comprises a partial channel in said housing second surface and a corresponding partial channel in said cover, said two partial channels together forming said pin guide channel vertical portion when said cover is in said closed position.

4. The component holding pocket of claim 2, further comprising a structure formed as a rounded curved portion between the at least one pin guide channel horizontal portion and the at least one pin guide channel vertical portion.

5. The component holding pocket of claim 1, wherein said at least one pin guide channel comprises at least one angled wall extending from said component chamber.

6. The component holding sleeve of claim 1, further comprising at least one substrate attachment structure proximate to said housing attachment surface.

7. The component holding sleeve according to claim 1, further comprising a ramp guide portion proximate the housing first surface and tapering into the component chamber.

8. The component holding pocket of claim 1, wherein said at least one pin guide channel further comprises a plurality of pin guide channels, and further comprising a pin divider between each of said pin guide channels.

9. A component holding pocket, comprising:

a housing having a first surface, a second surface, and a connecting surface; and

a recess defined within the housing, wherein the recess includes an element chamber extending from the housing first surface to at least one pin guide channel horizontal portion extending from the element chamber to a vertical portion of the pin guide channel, the vertical portion of the pin guide channel extending to the housing connection surface.

10. The component holding pocket of claim 9, further comprising a structure formed as a rounded curved portion between the at least one pin guide channel horizontal portion and the at least one pin guide channel vertical portion.

11. The component holding pocket of claim 9, wherein said at least one pin guide channel comprises at least one angled wall extending from said component chamber.

12. The component holding sleeve of claim 9, further comprising at least one substrate attachment structure proximate said housing attachment surface.

13. The component holding sleeve according to claim 9, further comprising a ramp guide portion proximate the housing first surface and tapering into the component chamber.

14. The component holding pocket of claim 9, wherein said at least one pin guide channel further comprises a plurality of pin guide channels, and further comprising a pin divider between each of said pin guide channels.

15. A method of manufacturing a component holding sleeve, comprising:

providing a housing having a first surface, a second surface, and a connecting surface;

forming a horizontal portion of at least one pin guide channel extending from the housing second surface within the housing;

forming a recess in the housing, including forming a component chamber extending from the housing first surface to the at least one pin guide channel horizontal portion; and

a cover is provided movably connected to the housing and adapted to move from an open position to a closed position abutting the second surface of the housing.

16. The method of claim 15, further comprising forming the at least one pin guide channel vertical portion adjacent the second surface extending from the at least one pin guide channel horizontal portion to the housing connection surface.

17. The method of claim 16, wherein forming the at least one pin guide channel vertical portion comprises forming a partial channel in the housing second surface and a corresponding partial channel in the cover, the two partial channels together comprising the pin guide channel vertical portion when the cover is in the closed position.

18. The method of claim 16, further comprising forming a structure as a radiused curved portion between the at least one pin guide channel horizontal portion and the at least one pin guide channel vertical portion.

19. The method of claim 15, wherein forming the at least one pin guide channel horizontal portion comprises forming at least one angled wall extending from the component chamber.

20. The method of claim 15, further comprising forming at least one substrate attachment structure proximate the housing attachment surface.

21. The method of claim 15, further comprising forming a ramped guide portion proximate the housing first surface and tapering into the component chamber.

22. A method of manufacturing a component holding sleeve, comprising:

providing a housing having a first surface, a second surface, and a connecting surface;

a horizontal portion forming at least one pin guide channel within the housing;

forming a vertical portion of the at least one pin guide channel extending from the at least one pin guide channel horizontal portion to the housing connection surface; and

forming a recess in the housing, including forming a component chamber extending from the housing first surface to the at least one pin guide channel horizontal portion.

23. The method of claim 22, further comprising forming a structure as a rounded bend between said at least one pin guide channel horizontal portion and said at least one pin guide channel vertical portion.

24. The method of claim 22, wherein forming the at least one pin guide channel horizontal portion comprises forming at least one angled wall extending from the component chamber.

25. The method of claim 22, further comprising forming at least one substrate attachment structure proximate the housing attachment surface.

26. The method of claim 22, further comprising forming a ramped guide portion proximate the housing first surface and tapering into the component chamber.

27. A method, comprising:

providing an electronic component having a body and at least one pin;

providing a housing having a first surface, a second surface, an upper surface, and a connecting surface; the housing has: a horizontal portion of at least one pin guide channel extending into the housing from the housing second surface, a component chamber extending into the housing from the housing first surface to the at least one pin guide channel horizontal portion, a vertical portion of the at least one pin guide channel extending from the at least one pin guide channel horizontal portion to the housing connection surface adjacent the second surface, and a cover movably connected to the housing upper surface adapted to move from an open position to a closed position abutting the housing second surface;

inserting the electronic component body into the component chamber such that the at least one electronic component pin passes through the at least one pin guide channel horizontal portion; and

closing the cover to connect to the housing second surface such that the at least one electronic component pin is bent to conform to the vertical portion of the at least one pin guide channel.

28. The method of claim 27, wherein providing the housing comprises providing the housing with a vertical portion of the at least one pin guide channel comprising a channel in the housing second surface and a corresponding channel in the cover.

29. The method of claim 27, wherein providing the housing comprises providing the housing with a structure forming a radiused curved portion between the at least one pin guide channel horizontal portion and the at least one pin guide channel vertical portion.