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GEP201606512B - Planar magnetron sputter - Google Patents

Planar magnetron sputter

Info

Publication number
GEP201606512B
GEP201606512B GEAP201513835A GEAP2015013835A GEP201606512B GE P201606512 B GEP201606512 B GE P201606512B GE AP201513835 A GEAP201513835 A GE AP201513835A GE AP2015013835 A GEAP2015013835 A GE AP2015013835A GE P201606512 B GEP201606512 B GE P201606512B
Authority
GE
Georgia
Prior art keywords
disk
disposed
magnetic system
contour
group
Prior art date
Application number
GEAP201513835A
Inventor
Zaur Berishvili
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to GEAP201513835A priority Critical patent/GEP201606512B/en
Priority to PCT/GE2016/000005 priority patent/WO2016189337A1/en
Publication of GEP201606512B publication Critical patent/GEP201606512B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A device includes vacuum chamber, wherein the anode and cathode having target disk are disposed. Magnetic system is fixed in cathode assembly on the disk made of magnetical soft material. The disk is fixed on disk holder having the blades, and is executed rotable under cool liquid stream influence. Magnetic system includes permanent magnet groups placed on the disk. Like poles of each group are disposed in accordance with the contour consisted of symmetrical evolvents having circle specified radius. At that, magnets of one group are disposed outside of said contour, and the others – inside thereof. Poles having opposite polarity relative to another group of magnets are disposed opposite relative to first magnetic group disposed longwise of said contour. At that, magnetic groups create enclosed contour. Cathode assembly includes magnetic system rotation frequence control mechanism. The device is executed workable in both conditions: magnetic system rotation, and stationary regime. Magnetic system is executed to control distance, within 3-10 mm, between magnets. Frequence control mechanism addi¬tio¬nally includes a programmer.
GEAP201513835A 2015-05-28 2015-05-28 Planar magnetron sputter GEP201606512B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GEAP201513835A GEP201606512B (en) 2015-05-28 2015-05-28 Planar magnetron sputter
PCT/GE2016/000005 WO2016189337A1 (en) 2015-05-28 2016-04-26 Planar magnetron sputtering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GEAP201513835A GEP201606512B (en) 2015-05-28 2015-05-28 Planar magnetron sputter

Publications (1)

Publication Number Publication Date
GEP201606512B true GEP201606512B (en) 2016-07-11

Family

ID=57082996

Family Applications (1)

Application Number Title Priority Date Filing Date
GEAP201513835A GEP201606512B (en) 2015-05-28 2015-05-28 Planar magnetron sputter

Country Status (2)

Country Link
GE (1) GEP201606512B (en)
WO (1) WO2016189337A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019224564A1 (en) 2018-05-22 2019-11-28 Zaur Berishvili Method for production of nanomaterial in vacuum and magnetron spattering device for its embodiment

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2242821C2 (en) * 2002-10-17 2004-12-20 Институт сильноточной электроники СО РАН Magnetron spraying system
EP1580298A1 (en) * 2004-03-22 2005-09-28 Materia Nova A.S.B.L Process and apparatus for pulsed magnetron sputtering
DE102011018363A1 (en) * 2011-04-20 2012-10-25 Oerlikon Trading Ag, Trübbach Hochleistungszerstäubungsquelle
RU134932U1 (en) * 2013-05-14 2013-11-27 Федеральное государственное бюджетное учреждение науки Институт проблем сверхпластичности металлов Российской академии наук (ИПСМ РАН) MAGNETRON SPRAYING SYSTEM

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019224564A1 (en) 2018-05-22 2019-11-28 Zaur Berishvili Method for production of nanomaterial in vacuum and magnetron spattering device for its embodiment

Also Published As

Publication number Publication date
WO2016189337A1 (en) 2016-12-01

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