[go: up one dir, main page]

GB8718006D0 - Producing pattern in material - Google Patents

Producing pattern in material

Info

Publication number
GB8718006D0
GB8718006D0 GB878718006A GB8718006A GB8718006D0 GB 8718006 D0 GB8718006 D0 GB 8718006D0 GB 878718006 A GB878718006 A GB 878718006A GB 8718006 A GB8718006 A GB 8718006A GB 8718006 D0 GB8718006 D0 GB 8718006D0
Authority
GB
United Kingdom
Prior art keywords
producing pattern
pattern
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB878718006A
Other versions
GB2207395A (en
GB2207395B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Company PLC
Original Assignee
General Electric Company PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Company PLC filed Critical General Electric Company PLC
Priority to GB8718006A priority Critical patent/GB2207395B/en
Publication of GB8718006D0 publication Critical patent/GB8718006D0/en
Publication of GB2207395A publication Critical patent/GB2207395A/en
Application granted granted Critical
Publication of GB2207395B publication Critical patent/GB2207395B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/062—Etching masks consisting of metals or alloys or metallic inorganic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
GB8718006A 1987-07-29 1987-07-29 A method for producing a pattern in a material Expired - Lifetime GB2207395B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8718006A GB2207395B (en) 1987-07-29 1987-07-29 A method for producing a pattern in a material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8718006A GB2207395B (en) 1987-07-29 1987-07-29 A method for producing a pattern in a material

Publications (3)

Publication Number Publication Date
GB8718006D0 true GB8718006D0 (en) 1987-09-03
GB2207395A GB2207395A (en) 1989-02-01
GB2207395B GB2207395B (en) 1991-07-17

Family

ID=10621502

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8718006A Expired - Lifetime GB2207395B (en) 1987-07-29 1987-07-29 A method for producing a pattern in a material

Country Status (1)

Country Link
GB (1) GB2207395B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10341186A1 (en) 2003-09-06 2005-03-31 Martin Michalk Method and device for contacting semiconductor chips
DE102009015604A1 (en) * 2009-04-02 2010-10-07 Siemens Aktiengesellschaft Method for structuring a multi-layered layer on a substrate
JP7461437B1 (en) 2022-10-21 2024-04-03 旭東 陳 Subtractive method for manufacturing circuit boards with fine interconnections
DE102023116529A1 (en) 2023-06-23 2024-12-24 Gebr. Schmid Gmbh process for printed circuit board production

Also Published As

Publication number Publication date
GB2207395A (en) 1989-02-01
GB2207395B (en) 1991-07-17

Similar Documents

Publication Publication Date Title
DE3574418D1 (en) Pattern-forming material and its production and use
EP0315954A3 (en) Pattern-forming material and pattern formation method
YU28489A (en) Substituted pyrols and process for producing thereof
EP0287325A3 (en) Superconducting material and process for producing the same
GB8723574D0 (en) Fabric production
YU190888A (en) Process for producing laminate material
GB8720599D0 (en) Producing porous material
YU45490A (en) Process for preparing glicozated insulines and their mixtures
HU903853D0 (en) Process for producing pyrrholo-pyrimidines and their intermediaires
GB8724897D0 (en) Material
GB8718006D0 (en) Producing pattern in material
EP0334358A3 (en) Novel d-amidase and process for producing d-alpha-alanine and/or l-alpha-alanineamide
GB8720598D0 (en) Producing porous material
GB8713696D0 (en) Producing magnetic material
GB8823339D0 (en) Warp-knitting machine in particular switch-bonding machine
EP0315833A3 (en) Colour-photographic material
GB8721428D0 (en) Producing neck-in-can
GB8814340D0 (en) Process
GB8704665D0 (en) Forming template
GB8802484D0 (en) Process
GB8702003D0 (en) Producing filter material
GB2204108B (en) Structural material
GB2209528B (en) Mould material
GB8800312D0 (en) Process
GB8713508D0 (en) Built in former

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee