GB864120A - Improvements in or relating to semi-conductor devices - Google Patents
Improvements in or relating to semi-conductor devicesInfo
- Publication number
- GB864120A GB864120A GB13293/57A GB1329357A GB864120A GB 864120 A GB864120 A GB 864120A GB 13293/57 A GB13293/57 A GB 13293/57A GB 1329357 A GB1329357 A GB 1329357A GB 864120 A GB864120 A GB 864120A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrode
- wafer
- semi
- edge
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H10W20/40—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D99/00—Subject matter not provided for in other groups of this subclass
-
- H10P95/00—
Landscapes
- Die Bonding (AREA)
- Bipolar Transistors (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
864,120. Semi-conductor devices. SIEMENSSCHUCKERTWERKE A.G. April 25, 1957 [April 26, 1956], No. 13293/57. Class 37. In a semi-conductor device comprising a monocrystalline semi-conductor wafer with a first electrode and an associated PN junction extending over one face, and an electrode arrangement on the opposite face, the shortest distance of the edge of the first electrode from the outermost edge of said electrode arrangement being more than ten times larger than the wafer thickness. In one embodiment a PN junction device is made by assembling in superposed relationship a molybdenum or tungsten base-plate 5, a foil 4 of gold doped with 1% antimony, a wafer 2 of monocrystalline P-type silicon, and an aluminium foil 3, embedding the assembly in an inert material such as powdered graphite or magnesium and heating to fuse the parts together to form the device illustrated in the left-hand half of Fig. 1. On account of the geometry of the arrangement any short-circuit across the exposed edge of the PN junction (shown as a dotted line) is in series with a highresistance path to the edge of the ohmic electrode 3. This resistance may be further increased by reducing the thickness of the wafer beyond electrode 3 by grinding or corrosion and by making the wafer of high resistivity material. In a modification the gold electrode extends over the edges of the wafer to form a thin peripheral ring on the upper surface thereof. The device may be cooled by forming plate 5 with cooling fins or with ducts for fluid coolants, or by fixing the plate to a copper block of high heat capacity. A further embodiment consists of a transistor (Fig. 3) in which the junctionforming electrode 4 serves as collector. The emitter electrode 6 is in the form of an annulus which is disposed between and concentric with a circular electrode 3a and annular electrode 3b which are connected together to form the base electrode. Specification 864,121 is referred to.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES48482A DE1046782B (en) | 1956-04-26 | 1956-04-26 | Semiconductor arrangement with a disk-shaped, essentially monocrystalline semiconductor base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB864120A true GB864120A (en) | 1961-03-29 |
Family
ID=7486876
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB13293/57A Expired GB864120A (en) | 1956-04-26 | 1957-04-25 | Improvements in or relating to semi-conductor devices |
| GB36782/60A Expired GB864121A (en) | 1956-04-26 | 1957-04-25 | Improvements in or relating to semi-conductor devices |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB36782/60A Expired GB864121A (en) | 1956-04-26 | 1957-04-25 | Improvements in or relating to semi-conductor devices |
Country Status (6)
| Country | Link |
|---|---|
| CH (1) | CH352410A (en) |
| DE (1) | DE1046782B (en) |
| FR (1) | FR1173654A (en) |
| GB (2) | GB864120A (en) |
| NL (2) | NL6401835A (en) |
| SE (1) | SE308930B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1105522B (en) * | 1958-11-12 | 1961-04-27 | Licentia Gmbh | Transistor with a disk-shaped semiconductor body |
| US3063879A (en) * | 1959-02-26 | 1962-11-13 | Westinghouse Electric Corp | Configuration for semiconductor devices |
| DE2412924C3 (en) * | 1974-03-18 | 1981-09-17 | Kausov, Sergej Fedorovič, Moskva | Method of manufacturing a semiconductor diode |
| JPH0215652A (en) * | 1988-07-01 | 1990-01-19 | Mitsubishi Electric Corp | Semiconductor device and manufacture thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE24537E (en) * | 1952-07-29 | 1958-09-23 | Unsymmetrical conductor arrangements |
-
0
- NL NL216645D patent/NL216645A/xx unknown
-
1956
- 1956-04-26 DE DES48482A patent/DE1046782B/en active Pending
-
1957
- 1957-04-24 CH CH352410D patent/CH352410A/en unknown
- 1957-04-25 GB GB13293/57A patent/GB864120A/en not_active Expired
- 1957-04-25 GB GB36782/60A patent/GB864121A/en not_active Expired
- 1957-04-25 FR FR1173654D patent/FR1173654A/en not_active Expired
-
1964
- 1964-02-26 NL NL6401835A patent/NL6401835A/xx unknown
-
1965
- 1965-07-12 SE SE9188/65A patent/SE308930B/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE1046782B (en) | 1958-12-18 |
| CH352410A (en) | 1961-02-28 |
| GB864121A (en) | 1961-03-29 |
| NL6401835A (en) | 1966-09-26 |
| SE308930B (en) | 1969-03-03 |
| FR1173654A (en) | 1959-02-27 |
| NL216645A (en) |
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