GB802053A - Improvements in or relating to the deposition of nickel on dielectric surfaces - Google Patents
Improvements in or relating to the deposition of nickel on dielectric surfacesInfo
- Publication number
- GB802053A GB802053A GB1631156A GB1631156A GB802053A GB 802053 A GB802053 A GB 802053A GB 1631156 A GB1631156 A GB 1631156A GB 1631156 A GB1631156 A GB 1631156A GB 802053 A GB802053 A GB 802053A
- Authority
- GB
- United Kingdom
- Prior art keywords
- nickel
- dielectric
- deposition
- silver
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title abstract 8
- 229910052759 nickel Inorganic materials 0.000 title abstract 4
- 230000008021 deposition Effects 0.000 title abstract 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract 4
- 238000000151 deposition Methods 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- 239000003990 capacitor Substances 0.000 abstract 2
- 239000003054 catalyst Substances 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 2
- 238000000576 coating method Methods 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 229910052742 iron Inorganic materials 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 2
- FBMUYWXYWIZLNE-UHFFFAOYSA-N nickel phosphide Chemical compound [Ni]=P#[Ni] FBMUYWXYWIZLNE-UHFFFAOYSA-N 0.000 abstract 2
- 230000001235 sensitizing effect Effects 0.000 abstract 2
- 239000004332 silver Substances 0.000 abstract 2
- 229910052709 silver Inorganic materials 0.000 abstract 2
- 238000007738 vacuum evaporation Methods 0.000 abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 239000004411 aluminium Substances 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 239000007864 aqueous solution Substances 0.000 abstract 1
- 238000005234 chemical deposition Methods 0.000 abstract 1
- 238000004140 cleaning Methods 0.000 abstract 1
- 239000003989 dielectric material Substances 0.000 abstract 1
- 239000011888 foil Substances 0.000 abstract 1
- 150000002815 nickel Chemical class 0.000 abstract 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
A method of applying a coating of nickel containing nickel phosphide to a surface of a dielectric material comprises first sensitizing the surface by depositing thereon by vacuum evaporation a thin layer of a metal, and then chemical depositing on the sensitized surface a coating of nickel/nickel phosphide from a hot bath containing an aqueous solution of a nickel salt and a hypo-phosphite, the vacuum evaporated metal being one which serves as a catalyst in the chemical deposition process. Aluminium, copper, silver, iron and nickel are suitable catalysts: in the case of copper or silver, it may be necessary to touch the sensitized surface with e.g. an iron rod to initiate the deposition. The vacuum evaporation may be preceded by a surface cleaning as by ionic or electronic bombardment under vacuum. Specifically disclosed are the production of (i) electrodes on ceramic-type capacitors, (ii) electrodes on P.T.F.E. foil dielectric capacitors, and (iii) printed circuits; in the production of these articles, the dielectric surface may be appropriately masked during the sensitizing stage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1631156A GB802053A (en) | 1956-05-25 | 1956-05-25 | Improvements in or relating to the deposition of nickel on dielectric surfaces |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1631156A GB802053A (en) | 1956-05-25 | 1956-05-25 | Improvements in or relating to the deposition of nickel on dielectric surfaces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB802053A true GB802053A (en) | 1958-09-24 |
Family
ID=10075017
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1631156A Expired GB802053A (en) | 1956-05-25 | 1956-05-25 | Improvements in or relating to the deposition of nickel on dielectric surfaces |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB802053A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3207127A (en) * | 1962-05-31 | 1965-09-21 | Xerox Corp | Apparatus for forming coatings on printed circuit boards |
| DE1239766B (en) * | 1962-07-12 | 1967-05-03 | Telefunken Patent | Method for applying a firmly adhering nickel layer to a glossy carbon resistance layer applied to a ceramic carrier |
| CN102747345A (en) * | 2012-07-19 | 2012-10-24 | 哈尔滨工业大学 | Method for chemically plating nickel on surface of copper circuit of PCB (printed circuit board) by dipping and activating nickel |
-
1956
- 1956-05-25 GB GB1631156A patent/GB802053A/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3207127A (en) * | 1962-05-31 | 1965-09-21 | Xerox Corp | Apparatus for forming coatings on printed circuit boards |
| DE1239766B (en) * | 1962-07-12 | 1967-05-03 | Telefunken Patent | Method for applying a firmly adhering nickel layer to a glossy carbon resistance layer applied to a ceramic carrier |
| CN102747345A (en) * | 2012-07-19 | 2012-10-24 | 哈尔滨工业大学 | Method for chemically plating nickel on surface of copper circuit of PCB (printed circuit board) by dipping and activating nickel |
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