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GB459051A - Improvements in or relating to absorption type refrigerating apparatus - Google Patents

Improvements in or relating to absorption type refrigerating apparatus

Info

Publication number
GB459051A
GB459051A GB1821635A GB1821635A GB459051A GB 459051 A GB459051 A GB 459051A GB 1821635 A GB1821635 A GB 1821635A GB 1821635 A GB1821635 A GB 1821635A GB 459051 A GB459051 A GB 459051A
Authority
GB
United Kingdom
Prior art keywords
relating
absorption type
refrigerating apparatus
type refrigerating
ewart
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB1821635A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ewart & Son Ltd
Original Assignee
Ewart & Son Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ewart & Son Ltd filed Critical Ewart & Son Ltd
Publication of GB459051A publication Critical patent/GB459051A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B15/00—Sorption machines, plants or systems, operating continuously, e.g. absorption type
    • F25B15/10—Sorption machines, plants or systems, operating continuously, e.g. absorption type with inert gas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Sorption Type Refrigeration Machines (AREA)

Abstract

459,051. Refrigerating. EWART, J. H., HAWES, W. B., and EWART & SON, Ltd., 346, Euston Road, London. June 25, 1935, Nos. 18216 and 31553. [Class 29] Absorption systems.-The descriptive matter is substantially the same as that described in Specification 458,841, but the claims are directed to the features that the lift tube 16 is heated at a rate automatically proportional to that of the generator tubes 5, and that the vapour from the separator 17 is condensed in the tube 19, and returned to the sump 13 of the separator 10. Specification 458,836 also is referred to.
GB1821635A 1961-01-05 1935-06-25 Improvements in or relating to absorption type refrigerating apparatus Expired GB459051A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US8088761A 1961-01-05 1961-01-05

Publications (1)

Publication Number Publication Date
GB459051A true GB459051A (en) 1936-12-28

Family

ID=22160269

Family Applications (2)

Application Number Title Priority Date Filing Date
GB1821635A Expired GB459051A (en) 1961-01-05 1935-06-25 Improvements in or relating to absorption type refrigerating apparatus
GB4528961A Expired GB959051A (en) 1961-01-05 1961-12-18 Improvements in or relating to a printed circuit board and method of producing same

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB4528961A Expired GB959051A (en) 1961-01-05 1961-12-18 Improvements in or relating to a printed circuit board and method of producing same

Country Status (2)

Country Link
DE (1) DE1259989B (en)
GB (2) GB459051A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2494978A (en) * 1947-04-04 1950-01-17 Servel Inc Refrigeration
DE1135500B (en) * 1958-08-25 1962-08-30 Howa Sangyo Kabushiki Cooking device of an absorption refrigeration unit operating with inert auxiliary gas

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1200367A (en) * 1966-09-13 1970-07-29 Chase Brass & Copper Co Metal laminate and method of producing the same
CN106824982A (en) * 2017-01-06 2017-06-13 韶关市金鼎盛再生资源有限公司 The production technology of resin section bar

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2494978A (en) * 1947-04-04 1950-01-17 Servel Inc Refrigeration
DE1135500B (en) * 1958-08-25 1962-08-30 Howa Sangyo Kabushiki Cooking device of an absorption refrigeration unit operating with inert auxiliary gas

Also Published As

Publication number Publication date
GB959051A (en) 1964-05-27
DE1259989B (en) 1968-02-01

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